JP2014017038A - Substrate for suspension, suspension, suspension with head and hard disk drive - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for suspension and a suspension capable of reliably oscillating a head slider by an actuator element connected via a conductive adhesive and preventing damage of the actuator element.SOLUTION: A suspension 41 comprises: a load beam 43 having a base end part 43a and a tip end part 43b connected to the base end part 43a via a pocket 45 so as to be oscillated; and a substrate 1 for suspension having a base body 2 provided with a head part 2a and arranged on the load beam 43 and an element connection part 16 connected to the base body 2. A piezoelectric element 44 connected to the element connection part 16 of the substrate 1 for suspension is stored in the pocket 45. The force from the piezoelectric element 44 is transmitted to the load beam 43 and thereby can oscillate the tip end part 43b with respect to the base end part 43a of the load beam 43.

Description

  The present invention relates to a suspension substrate, a suspension, a suspension with a head, and a hard disk drive, and in particular, a magnetic head slider can be reliably swung by an actuator element connected to the suspension substrate via a conductive adhesive. The present invention relates to a suspension board, a suspension, a suspension with a head, and a hard disk drive.

  In general, a hard disk drive (HDD) includes a suspension board on which a magnetic head slider for writing and reading data to and from a disk storing data is mounted. The suspension substrate is formed to extend from a head region on which the magnetic head slider is mounted to a tail region connected to an FPC substrate (flexible printed circuit board), and a metal support layer and an insulating layer on the metal support layer And a wiring layer having a plurality of wirings stacked via each other, and by writing an electric signal through each wiring, data is written to or read from the disk.

  In such a hard disk drive, in order to move the magnetic head slider to a desired data track on the disk, a VCM actuator (voice coil motor) that rotates an actuator arm that supports the magnetic head slider is controlled by a servo control system. doing.

  In recent years, there has been an increasing demand for an increase in disk capacity. In order to meet this demand, the density of the disk is increased and the width of the track is reduced. For this reason, it may be difficult to accurately align the magnetic head slider to a desired track by the VCM actuator.

  In order to cope with this, a dual actuator type suspension is known in which a VCM actuator and a PZT microactuator (Dual Stage Actuator: DSA) cooperate to move a magnetic head slider to a desired track (for example, , See Patent Document 1). This PZT microactuator is constituted by a piezoelectric element such as a piezoelectric element made of PZT (lead zirconate titanate), and expands and contracts when a voltage is applied to move the magnetic head slider minutely. In such a dual actuator type suspension, the VCM actuator roughly adjusts the position of the magnetic head slider, and the PZT microactuator finely adjusts the position of the magnetic head slider. In this way, the magnetic head slider is aligned with a desired track quickly and accurately.

  In the suspension substrate shown in Patent Document 1, the piezoelectric element is disposed in the vicinity of the magnetic head slider in the suspension substrate so that the magnetic head slider can be reliably swung.

JP 2010-146631 A

  In the suspension substrate as shown in Patent Document 1, the piezo element is mounted on the suspension substrate, and the force from the piezo element is transmitted to the metal support layer of the suspension substrate.

  However, in the structure in which the force from the piezo element is transmitted to the metal support layer of the suspension substrate, the force from the piezo element cannot be reliably transmitted to the metal support layer, and the piezo element may be warped and damaged.

  The present invention has been made in consideration of the above points, and the head slider can be reliably swung by the actuator element connected to the suspension substrate via the conductive adhesive, and the actuator element. It is an object of the present invention to provide a suspension substrate, a suspension, a suspension with a head, and a hard disk drive that can prevent damage to the disk.

  The present invention relates to a load beam having a base end portion and a tip end portion that is swingably connected to the base end portion through a pocket, and a substrate body that is mounted on the load beam and includes a slide head mounting area. A suspension substrate having an element connection portion connected to the substrate body, and an actuator element connected to the element connection portion of the suspension substrate is accommodated in the pocket, and a load beam is generated by a force from the actuator element. The suspension is characterized in that the distal end portion of the suspension is swung with respect to the proximal end portion.

  According to the present invention, the load beam pocket is located between a load bending portion of the load beam and a region corresponding to the slide head mounting region.

  According to the present invention, the load beam pocket includes a pair of elongated pocket portions extending along the longitudinal direction and adjacent to each other.

  The present invention is the suspension characterized in that notches are formed on both outer side edges of the load beam toward the respective elongated pocket portions.

  The present invention is a suspension characterized in that each notch communicates with an elongated pocket portion.

  The present invention is a suspension characterized in that a slit is formed outside a load beam pocket via a linear rib.

  In the present invention, the suspension substrate has a metal support layer, an insulating layer, and a wiring layer, the actuator element in the pocket is supported by the metal support layer of the suspension substrate, and the element connecting portion is a wiring of the suspension substrate. The suspension is characterized in that it is connected to the layers.

  In the present invention, the suspension substrate has a metal support layer, an insulating layer, and a wiring layer, the actuator element in the pocket is supported by the insulating layer of the suspension substrate, and the element connecting portion is the wiring layer of the suspension substrate. It is the suspension characterized by being connected to.

  The present invention is the suspension characterized in that the part of the insulating layer supporting the actuator element in the pocket is formed thinner on the actuator element side than the other part of the insulating layer.

  The present invention is a suspension with a head comprising the suspension described above and a head slider mounted on the suspension.

  The present invention is a hard disk drive comprising the suspension with a head described above.

  According to the present invention, the head slider can be reliably swung by the actuator element connected to the suspension board via the conductive adhesive, and damage to the actuator element can be prevented.

1A is a plan view showing an example of a suspension according to the present invention, FIG. 1B is a plan view showing a load beam, FIG. 1C is a plan view showing a suspension substrate, and FIG. FIG. 1E is a plan view showing the metal support layer and the insulating layer of the suspension substrate, and FIG. 1E is a view showing the metal support layer of the suspension substrate. FIG. 2A is a rear view showing a suspension including a piezoelectric element, and FIG. 2B is a rear view showing the suspension excluding the piezoelectric element. FIGS. 3A, 3B, and 3C are cross-sectional views of the element connection portion of the suspension substrate. 4 (a) and 4 (b) are diagrams showing the action of the suspension. FIG. 5 is a diagram showing the arrangement positions of the pockets provided in the load beam. FIGS. 6A and 6B are views similar to FIGS. 2A and 2B showing another example of the suspension of the present invention. FIGS. 7A, 7B and 7C are views showing a cross section of the element connecting portion of the suspension substrate in the modification of the present invention. 8A and 8B are plan views showing a load beam in a modification of the present invention. FIG. 9 is a plan view showing a load beam in a modification of the present invention. FIG. 10 is a plan view showing a load beam in a modification of the present invention. FIG. 11 is a plan view showing a load beam in a modification of the present invention. FIG. 12 is a plan view showing a load beam in a modification of the present invention. FIG. 13 is a perspective view showing an example of a hard disk drive in the present invention.

(First embodiment)
The suspension substrate, suspension, suspension with head, and hard disk drive according to the embodiment of the present invention will be described with reference to FIGS. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual product.

  First, the suspension 41 according to the present embodiment will be described with reference to FIGS. 1 (a) to 1 (e) and FIGS. 2 (a) and 2 (b). The suspension 41 shown in FIGS. 1A to 1E and FIGS. 2A and 2B is attached to the base plate 42 and the base plate 42, and holds the metal support layer 11 of the suspension substrate 1 described later. A load beam 43 having a base end portion 43a and a tip end portion 43b swingably connected to the base end portion 43a via a pocket 45; a suspension substrate 1 provided on the load beam 43; And a piezo element 44 housed in a pocket 45 of the beam 43. Among these, the pocket 45 of the load beam 43 includes a pair of elongated pocket portions 45a extending along the longitudinal direction and adjacent to each other, and the piezo element 44 is disposed in each pocket portion 45a. A protrusion 43t is formed at the tip of the load beam 43.

  The suspension substrate 1 has a base body 2 including a slide head mounting area (head portion) 2a and a tail portion 2b, and a pair of element connection portions 16 provided on the base body 2, and has a pocket 45a. The piezo element 44 is connected to each element connecting portion 16.

  Here, FIG. 1A is a plan view showing a suspension, FIG. 1B is a back view showing a load beam, and FIGS. 1C to 1E are views showing a suspension substrate.

  FIG. 2A is a back view showing a suspension including a piezoelectric element, and FIG. 2B is a back view showing the suspension excluding the piezoelectric element for convenience. Here, a view from the suspension substrate side is a plan view, and a view from the load beam side is a back view.

  Of the above components, the base plate 42 and the load beam 43 are both made of stainless steel.

  Next, the suspension substrate will be described with reference to FIGS. 1A to 1E, FIGS. 2A and 2B, and FIGS. 3A, 3B and 3C. The suspension substrate 1 is a substrate body 2 and a pair of element connection portions 16 connected to the substrate body 2, and is connected to the piezo element 44 via a conductive adhesive (for example, silver paste) 48. The element connecting portion 16 is provided. Among these, the board body 2 has the head part 2a on which the head slider 52 is mounted as described above, and the tail part 2b to which the FPC board 71 is connected. The head part 2a is provided with a plurality of head terminals 5 connected to the head slider 52, and the tail part 2b is provided with a plurality of tail terminals (external connection board terminals) 6 connected to the FPC board 71. The head terminal 5 and the tail terminal 6 are connected to each other via a plurality of signal wires 13 to be described later.

  As shown in FIG. 3A, the suspension substrate 1 includes an insulating layer 10, a metal support layer 11 provided on the surface of the insulating layer 10 on the piezoelectric element 44 side, and a piezoelectric element 44 of the insulating layer 10. And a wiring layer 12 provided on a surface opposite to the side. A protective layer 20 that covers the wiring layer 12 is preferably provided on the insulating layer 10. More specifically, the substrate body 2 of the suspension substrate 1 in the present embodiment has a layer configuration in which a metal support layer 11, an insulating layer 10, a wiring layer 12, and a protective layer 20 are laminated.

  As shown in FIGS. 1A to 1E, the wiring layer 12 is connected to a plurality of wirings, that is, a signal wiring 13 including a pair of reading wirings and a pair of writing wirings, and a piezo element 44. And a pair of element wires 14. Among these, the signal wiring 13 connects the head terminal 5 and the tail terminal 6, and when an electric signal flows through the signal wiring 13, data is written to or read from the disk 63 (see FIG. 13). Is supposed to do. The element wiring 14 applies a voltage to the piezo element 44 via the element connecting portion 16.

  Each of the pair of element connecting portions 16 shown in FIG. 3A is formed in a substantially circular shape in plan view. Each element connection portion 16 forms a part of the metal support layer 11 and has a circular element connection terminal 16 a that is electrically connected to the piezo element 44 via a conductive adhesive 48. Each element connection terminal 16 a is connected to the element wiring 14 of the wiring layer 12 through a through hole 10 a that penetrates the insulating layer 10. The element connection terminal 16 a is made of the same material as the metal support layer 11 and has substantially the same thickness as the metal support layer 11.

  The pocket 45 is filled with a non-conductive adhesive 46 in order to fix the piezo element 44 in the pocket 45. In addition, a conductive adhesive 48 that covers the non-conductive adhesive 46 and makes the load beam 43 and the piezo element 44 conductive is provided. In this case, the load beam 43 functions as a ground wiring for the piezo element 44.

  By the way, as shown in FIG. 3A, a through-hole 10a is formed at a position corresponding to the piezo element 44 in the insulating layer 10, and a ring-shaped part that forms a part of the metal support layer 11 around the through-hole 10a. An element connection terminal 16a is provided. A plating layer 15 is formed on the wiring layer 12 in the through hole 10a. The ring-shaped element connection terminal 16 a is filled with a conductive adhesive 48 that electrically connects the plating layer 15 and the piezoelectric element 44.

  In this case, the ring-shaped element connection terminal 16a is separated and independent from other parts of the metal support layer 11 through the through hole 11a.

  Note that the above-described plating layer 15 is formed on the wiring layer 12 in the through hole 10a by sequentially performing nickel (Ni) plating and gold (Au) plating. This prevents the exposed surface on the wiring layer 12 from being corroded. In addition, it is preferable that the thickness of this plating layer 15 is 0.1 micrometer-4.0 micrometers.

  In FIG. 3A, the piezo element 44 is accommodated in the pocket 45 of the load beam 43, and the piezo element 44 is supported on the metal support layer 11 of the suspension substrate 1.

  In addition, the pair of element connection portions 16 includes a ring-shaped element connection terminal 16a made of the metal support layer 11 as shown in FIG. However, the present invention is not limited to this, and the pair of element connection portions 16 may be constituted by solid element connection terminals 16b made of the metal support layer 11 as shown in FIG.

  In FIG. 3B, the piezo element 44 is accommodated in the pocket 45 of the load beam 43 and supported by the metal support layer 11. In addition, a through hole 10a, a through hole 12a, and a through hole 20a are provided at positions corresponding to the piezo element 44 in the insulating layer 10, the wiring layer 12, and the moisturizing layer 20, and are solid on the through holes 10a, 12a, and 20a. The element connection terminal 16b is formed.

  A plating layer 15 is formed on the element connection terminal 16b, and a conductive adhesive 48 is interposed between the plating layer 15 on the element connection terminal 16b and the piezo element 44, and in the through holes 10a, 12a, and 20a. Is filled with a conductive adhesive 48 for conducting the wiring layer 12 and the element connection terminal 16b. A non-conductive adhesive 46 is filled in the pocket 45 in order to fix the piezo element 44 in the pocket 45. In addition, a conductive adhesive 48 that covers the non-conductive adhesive 46 and makes the load beam 43 and the piezo element 44 conductive is provided. In this case, the load beam 43 functions as a ground wiring for the piezo element 44.

  In FIG. 3B, the element connection terminal 16b is separated and independent from other portions of the metal support layer 11 through the through hole 11a.

  Alternatively, as shown in FIG. 3 (c), each element connecting portion 16 is made of a ring-shaped element connecting terminal 16a made of the metal support layer 11 and similarly made of the metal support layer 11, and is arranged in the ring-shaped element connecting terminal 16a. Further, it may have a solid element connection terminal 16b.

  In FIG. 3C, the piezo element 44 is accommodated in the pocket 45 of the load beam 43 and supported by the metal support layer 11. In addition, a through hole 10a, a through hole 12a, and a through hole 20a are provided at positions corresponding to the piezoelectric element 44 in the insulating layer 10, the wiring layer 12, and the insulating layer 20, and the through holes 10a, 12a, and 20a are provided on the through holes 10a, 12a, and 20a. A solid element connection terminal 16b is formed. A ring-shaped element connection terminal 16a is formed surrounding the solid element connection terminal 16b. A plating layer 15 is formed on the solid element connection terminal 16b.

  Further, the ring-shaped element connection terminal 16 a is filled with a conductive adhesive 48 that electrically connects the ring-shaped element connection terminal 16 a and the solid-state element connection terminal 16 b and the piezo element 44.

  Further, the through holes 10a, 12a, and 20a are filled with a conductive adhesive 48 that electrically connects the wiring layer 12 and the solid element connection terminal 16b.

  The pocket 45 is filled with a non-conductive adhesive 46 in order to fix the piezo element 44 in the pocket 45. In addition, a conductive adhesive 48 that covers the non-conductive adhesive 46 and makes the load beam 43 and the piezo element 44 conductive is provided. In this case, the load beam 43 functions as a ground wiring for the piezo element 44.

  In FIG. 3C, the ring-shaped element connection terminal 16a and the solid-state element connection terminal 16b are both separated and independent from other parts of the metal support layer 11 through the through holes 11a.

  Further, as shown in FIGS. 1A to 1E, the substrate main body 2 of the suspension substrate 1 is aligned with the load beam 43 when the suspension substrate 1 is attached to the load beam 43. Two jig holes 25 for performing are provided. Each jig hole 25 is disposed on the longitudinal axis (X). That is, the longitudinal axis (X) passes through each jig hole 25.

  Next, materials constituting each layer of the suspension substrate 1 will be described in detail.

  The material of the insulating layer 10 is not particularly limited as long as it is a material having a desired insulating property. For example, it is preferable to use polyimide (PI). Note that the material of the insulating layer 10 can be a photosensitive material or a non-photosensitive material. The thickness of the insulating layer 10 is preferably 5 μm to 30 μm, particularly 8 μm to 10 μm. As a result, the insulation performance between the metal support layer 11 and the wirings 13 and 14 constituting the wiring layer 12 can be secured, and the loss of the rigidity of the suspension substrate 1 as a whole can be prevented. .

  Each wiring 13 and 14 is configured as a conductor for transmitting an electrical signal, and the material of each wiring 13 and 14 is not particularly limited as long as it is a material having a desired conductivity. It is preferable to use copper (Cu). In addition to copper, any material having electrical characteristics similar to pure copper can be used. Here, it is preferable that the thickness of each wiring 13 and 14 is 1 micrometer-18 micrometers, especially 9 micrometers-12 micrometers, for example. As a result, it is possible to ensure the transmission characteristics of the wirings 13 and 14 and to prevent the flexibility of the suspension substrate 1 as a whole from being lost. The head terminal 5, tail terminal 6 and element connection terminal 16 are made of the same material and the same thickness as the wirings 13 and 14.

  The material of the metal support layer 11 is not particularly limited as long as it has desired conductivity, elasticity, and strength. For example, stainless steel, aluminum, beryllium copper, or other copper alloys are used. It is preferable to use stainless steel. The thickness of the metal support layer 11 is preferably 10 μm to 30 μm, more preferably 15 μm to 20 μm. As a result, the conductivity, rigidity, and elasticity of the metal support layer 11 can be ensured.

  As a material of the protective layer 20, it is preferable to use a resin material such as polyimide. The material of the protective layer 20 can be a photosensitive material or a non-photosensitive material. The thickness of the protective layer 20 is preferably 2 μm to 30 μm, particularly 2 to 6 μm.

  As shown in FIGS. 1A and 1B, the load beam 43 is provided with beam jig holes (not shown) corresponding to the jig holes 25 of the suspension substrate 1, When the load beam 43 is attached to the suspension substrate 1, the suspension substrate 1 and the load beam 43 can be aligned. The jig hole of the load beam 43 is disposed on the longitudinal axis (X). The load beam 43 and the suspension substrate 1 are fixed by welding.

  The piezoelectric element 44 is configured as a piezoelectric element that expands and contracts in the direction of arrow P in FIG. 2A when a voltage is applied, and moves the head slider 52 in the sway direction (swing direction, FIG. 2A). (In the direction of arrow Q). As shown in FIGS. 3A to 3C, each piezo element 44 is interposed between at least a pair of electrodes 44a facing each other and a pair of electrodes 44a. For example, PZT (lead zirconate titanate) is used. And a piezoelectric material portion 44b made of piezoelectric ceramics. The piezoelectric material portions 44b of the pair of piezo elements 44 are formed to have polarization directions different from each other by 180 °. When a predetermined voltage is applied, one piezo element 44 contracts and the other piezo element 44 44 extends. Such a piezo element 44 is accommodated in a pair of elongated pocket portions 45a arranged along the longitudinal axis (X) of the load beam 43 as shown in FIG. The direction is parallel to the longitudinal axis (X). The pair of elongated pocket portions 45a and the piezoelectric elements 44 housed in the pocket portions 45a are arranged symmetrically with respect to the longitudinal axis (X), and the expansion and contraction of each piezoelectric element 44 is caused by the head slider. 52 evenly.

  2A and 2B, the piezo element 44 is accommodated in an elongated pocket portion 45a and supported by the metal support layer 11 of the suspension substrate 1 at both ends in the longitudinal direction. .

  However, the piezo element 44 can be accommodated in the elongated pocket portion 45a, and the piezo element 44 can be supported by the metal support layer 11 over the entire periphery in the pocket portion 45a (FIG. 6A). b)).

  That is, the pair of elongated pocket portions 45a provided in the load beam 43 is formed in a region L between the load bending portion 49 and the region 43A corresponding to the head portion 2a of the suspension substrate 1 in the load beam 43. (FIGS. 1 and 5). Here, FIG. 5 shows a base plate 42 and a load beam 43. The load boom 43 is provided with a load bending portion 49 which bends downward from the base plate 42 side toward the head slider 52 side on the base plate 42 side. In a region L between the bent portion 49 and the region 43A corresponding to the head portion 2a, a pair of elongated pocket portions 45a and the piezoelectric element 44 housed in each elongated pocket portion 45a are arranged. In this manner, by arranging the piezo element 44 in the vicinity of the head slider 52 in the load beam 43, the force from the piezo element 44 can be directly transmitted to the load beam 43 side in the vicinity of the head slider 52. As a result, the tip end portion 43b can be swung with respect to the base end portion 43a of the load beam 43, and the head slider 52 can be swung accurately.

  As shown in FIGS. 1A to 1E and FIGS. 2A and 2B, the suspension substrate 1 and the load beam 43 are welded and joined to each other at a welded portion 55. The load beam 43 is provided with dimples 56 that abut against the suspension substrate 1 and press the suspension substrate 1 toward the head slider 52 side.

  Next, the suspension with head 51 in the present embodiment will be described with reference to FIGS. A suspension 51 with a head shown in FIGS. 1A to 1E has the above-described suspension 41 and a head slider 52 connected to the head terminal 5 of the suspension substrate 1.

  Next, the hard disk drive 61 in the present embodiment will be described with reference to FIG. A hard disk drive 61 shown in FIG. 13 is provided with a case 62, a disk 63 that is rotatably attached to the case 62, stores data, a spindle motor 64 that rotates the disk 63, and a desired flying height on the disk 63. And a suspension 51 with a head including a head slider 52 that writes and reads data to and from the disk 63. Among them, the suspension with head 51 is attached to the case 62 so as to be movable, and the voice coil motor 65 for moving the head slider 52 of the suspension with head 51 along the disk 63 is attached to the case 62. Yes. The suspension 51 with a head is attached to the voice coil motor 65 via an arm 66 and is connected to an FPC board 71 (see FIG. 1) connected to a control unit (not shown) that controls the hard disk drive 61. ing. In this way, an electrical signal is transmitted between the control unit and the head slider 52 via the suspension board 1 and the FPC board 71.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, a method for manufacturing the suspension substrate 1 according to the present embodiment will be described with reference to FIG.

  First, a laminated body (not shown) having an insulating layer 10, a metal support layer 11 provided on one surface of the insulating layer 10, and a wiring layer 12 provided on the other surface of the insulating layer 10 is formed. prepare. Subsequently, the wiring layer 12 is etched into a desired shape to form the wirings 13 and 14, the head terminal 5, and the tail terminal 6. Next, a protective layer 20 that covers each wiring 13 is formed on the insulating layer 10. Subsequently, the insulating layer 10 is etched into a desired shape to form a through hole 10a. Thereafter, a plating layer 15 is formed on the wiring layer 12 in the through hole 10 a of the insulating layer 10. Next, the metal support layer 11 is etched to form the ring-shaped element connection terminals 16a. Thus, the suspension substrate 1 in the present embodiment is obtained.

  Next, a method for manufacturing the suspension 41 in the present embodiment will be described with reference to FIG.

  First, as shown in FIG. 1, the suspension substrate 1 is attached to the base plate 42 via a load beam 43 by welding. In this case, first, the load beam 43 is fixed to the base plate 42 by welding, then, a beam jig hole (not shown) provided in the load beam 43 and a jig hole 25 provided in the suspension substrate 1. As a result, the alignment of the load beam 43 and the suspension substrate 1 is performed. Thereafter, the metal support layer 11 of the suspension substrate 1 is welded, and the load beam 43 and the suspension substrate 1 are joined and fixed to each other.

  Subsequently, the piezo element 44 is disposed in the pair of elongated pocket portions 45 a of the load beam 43, and the piezo element 44 is supported by the metal support layer 11 of the suspension substrate 1. In this case, the ring-shaped element connection terminal 16a is filled with the conductive adhesive 48 in advance, and the elongate pocket portion 45a is filled with the non-conductive adhesive 46.

  As a result, the wiring layer 12 and the electrode 44a of the piezo element 44 are electrically connected via the conductive adhesive 48 in the ring-shaped element connection terminal 16a. Further, the piezo element 44 can be fixed in the elongated pocket portion 45a by the non-conductive adhesive 46. Next, a conductive adhesive 48 is further provided so as to cover the nonconductive adhesive 46, whereby the electrode 44a of the piezo element 44 and the load beam 43 are brought into conduction, and the piezo element 44 is grounded.

  In this way, the suspension 41 shown in FIGS. 1A to 1E on which the piezo element 44 is mounted is obtained. That is, the element connecting portion 16 and the piezo element 44 can be electrically connected using the conductive adhesive 48, and the mounting process of the piezo element 44 is suppressed from being complicated, and the piezo element 44 is mounted. The suspension 41 shown in FIGS. 1A to 1E can be easily manufactured.

  1A to 1E and FIG. 2, the elongated pocket portions 45 a of the load beam 43 and the piezo elements 44 are arranged in parallel along the longitudinal axis X of the load beam 43.

  A head slider 52 is connected to the head terminal 5 of the suspension 41 to obtain a suspension 51 with a head. Further, the suspension 51 with the head is attached to the case 62 of the hard disk drive 61, and the hard disk drive 61 shown in FIG. 13 is obtained.

  When data is written and read in the hard disk drive 61 shown in FIG. 13, the head slider 52 of the suspension 51 with the head is moved along the disk 63 by the voice coil motor 65, and the disk 63 rotated by the spindle motor 64 is rotated. Keep close to the desired flying height. As a result, data is exchanged between the head slider 52 and the disk 63. During this time, an electrical signal is transmitted between the control unit (not shown) connected to the FPC board 71 and the head slider 52 via the suspension board 1 and the FPC board 71. Such an electric signal is transmitted between the head terminal 5 and the tail terminal 6 through the signal wirings 13 in the suspension board 1.

  When moving the head slider 52, the voice coil motor 65 roughly adjusts the position of the head slider 52, and the piezo element 44 finely adjusts the position of the head slider 52. That is, by applying a predetermined voltage to the electrode 44a of the piezo element 44 on the element connecting portion 3 side of the suspension substrate 1 via the element wiring 14 and the element connecting portion 16, the longitudinal axis (X) is applied. One piezo element 44 contracts and the other piezo element 44 expands in the direction (arrow P direction in FIG. 2A). In this case, the tip end portion 43b swings with respect to the base end portion 43a of the load beam 43, and the head slider 52 positioned on the tip end portion 43b side of the load beam 43 moves in the sway direction (the turning direction Q in FIG. 2A). Can be moved to. In this way, the head slider 52 can be quickly and accurately aligned with a desired track of the disk 63.

  In this case, as shown in FIG. 1, the distal end portion 43b is swingable with respect to the proximal end portion 43a of the load beam 43 via a pocket 45 formed of a pair of elongated pocket portions 45a. Since the elongated pocket portion 45a and the piezo element 44 in the pocket portion 45a are located in the vicinity of the head slider 52, the force from the piezo element 44 can be transmitted to the load beam 43 side in the vicinity of the head slider. For this reason, the tip end portion 43b can be reliably transmitted to the base end portion 43a, and the head slider 52 can be swung with high accuracy.

  Here, a state in which the force from the piezo element 44 is transmitted to the load beam 43 side will be described with reference to FIGS. As shown in FIG. 4A, according to the present invention, the piezoelectric element 44 having a thickness of, for example, 100 to 150 μm is accommodated in the elongated pocket portion 45a of the load beam 43 having a thickness of, for example, 30 to 50 μm. In this case, the force from the piezo element 44 can be reliably transmitted to the load beam 43 side.

  On the other hand, when the piezo element 44 is mounted in the metal support layer 11 having a thickness of 15 to 20 μm in the suspension substrate 1 regardless of the pocket portion 45 a of the load beam 43, the piezo element 44 having a thickness of 100 to 150 μm. Can not be transmitted to the metal support layer 11 sufficiently, and the piezo element 44 may be warped and damaged (FIG. 4B).

In contrast, according to the present invention, since the piezoelectric element 44 having a thickness of 100 to 150 μm is accommodated in the elongated pocket portion 45 a of the load beam 43 having a thickness of 30 to 50 μm, the force from the piezoelectric element 44 is Can be reliably transmitted to the load beam 43 side without warping of the piezo element 44, thereby preventing warpage or breakage of the piezo element 44. (Modification 1)
Next, a first modification of the present invention will be described. In the above embodiment, as shown in FIGS. 3A to 3C, the piezo element 44 is accommodated in the pocket 45 of the load beam 43, and the piezo element 44 is the metal support layer of the suspension substrate 1. 11 is supported.

  However, the present invention is not limited thereto, and the piezo element 44 may be housed in the pocket 45 of the load beam 43 and supported by the insulating layer 10 as shown in FIG. In FIG. 7A, a through hole 10a is formed in the insulating layer 10, and a plating layer 15 is formed on the wiring layer 12 in the through hole 10a. A through hole 11 a is formed in the metal support layer 11 corresponding to the pocket 45.

  In this case, the piezo element 44 is accommodated in the pocket 45 of the load beam 43, the non-conductive adhesive 46 is filled in the pocket 45 to fix the piezo element 44 in the pocket 45, and the non-conductive adhesive. 46 is provided with a conductive adhesive 48. In addition, a conductive adhesive 48 that covers the non-conductive adhesive 46 and makes the load beam 43 and the piezo element 44 conductive is provided. In this case, the load beam 43 functions as a ground wiring for the piezo element 44.

  In addition, a conductive adhesive 48 is filled in the through hole 10 a of the insulating layer 10 in order to establish conduction between the plating layer 15 on the wiring layer 12 and the piezoelectric element 44.

  In FIG. 7A, the element connection terminal 16a of the element connection portion 16 is constituted by the wiring layer 12 corresponding to the through hole 10a.

  Further, as shown in FIG. 7B, the piezo element 44 may be accommodated in the pocket 45 of the load beam 43 and supported by the insulating layer 10.

  In FIG. 7B, a through hole 10 a is formed in the insulating layer 10, a through hole 12 a is formed in the wiring layer 12, and a through hole 20 a is also formed in the protective layer 20. These through holes 10a, 12a, and 20a are filled with a conductive adhesive 48 that electrically connects the wiring layer 12 and the piezoelectric element 44. The metal support layer 11 has through holes 11 a corresponding to the pockets 45.

  In FIG. 7B, the element connection terminal 16a of the element connection portion 16 is constituted by the wiring layer 12 around the through hole 12a.

  In FIG. 7B, the pocket 45 is filled with a non-conductive adhesive 46 for fixing the piezo element 44 in the pocket 45, and the conductive adhesive 48 covers the non-conductive adhesive 46. Is provided. In addition, a conductive adhesive 48 that covers the non-conductive adhesive 46 and makes the load beam 43 and the piezo element 44 conductive is provided. In this case, the load beam 43 functions as a ground wiring for the piezo element 44.

  Further, as shown in FIG. 7C, the piezo element 44 may be accommodated in the pocket 45 of the load beam 43 and supported by the insulating layer 10.

  In FIG. 7C, a through hole 10a is formed in the insulating layer 10, and a thin step portion 12b is formed on the insulating layer 10 around the through hole 10a. A plating layer 15 is provided on the wiring layer 12 in the through hole 10 a, and a conductive adhesive 48 for electrically connecting the wiring layer 12 and the piezoelectric element 44 is filled in the through hole 10 a of the insulating layer 10.

  In FIG.7 (c), the element connection terminal 16a of the element connection part 16 is comprised by the wiring layer 12 corresponding to the through-hole 10a.

  In FIG. 7C, the pocket 45 is filled with a non-conductive adhesive 46 for fixing the piezo element 44 in the pocket 45, and further covers the non-conductive adhesive 46 so as to cover the non-conductive adhesive 48. Is provided. In addition, a conductive adhesive 48 that covers the non-conductive adhesive 46 and makes the load beam 43 and the piezo element 44 conductive is provided. In this case, the load beam 43 functions as a ground wiring for the piezo element 44.

  In FIG. 7C, the piezo element 44 can be placed on the thin step portion 10 b of the insulating layer 10, so that the piezo element 44 can be pulled inward from the outer shape of the load beam 43.

(Modification 2)
Next, modification 2 of the present invention will be described with reference to FIGS.

  As shown in FIGS. 8A and 8B, the load beam 43 has a proximal end portion 43a and a distal end coupled to the proximal end portion 43a in a swingable manner through a pocket 45 including a pair of elongated pocket portions 45a. And a projecting piece 43t is provided at the tip of the load beam 43.

  At both outer side edges of the load beam 43, reinforcing side edge ribs 43c rising from the surface of the load beam 43 are provided. The side edge rib 43 c reinforces the load beam 43, but also serves as a resistance to the swinging motion of the load beam 43.

  Therefore, notches 45b extending toward the elongated pockets 45a are provided on both outer side edges of the load beam 43. Thus, by providing a pair of notches 45b on both outer side edges of the load beam 43, the swinging motion of the load beam 43 can be performed smoothly.

(Modification 3)
Next, a third modification of the present invention will be described with reference to FIGS.

  As shown in FIG. 9, the load beam 43 has a proximal end portion 43a and a distal end portion 43b that is swingably connected to the proximal end portion 43a via a pocket 45 including a pair of elongated pocket portions 45a. A protruding piece 43 t is provided at the tip of the load beam 43. In FIG. 9, each of the elongated pocket portions 45 a is inclined toward the protruding piece 43 t with respect to the longitudinal axis X of the load beam 43.

  At both outer side edges of the load beam 43, reinforcing side edge ribs 43c rising from the surface of the load beam 43 are provided. The side edge rib 43 c reinforces the load beam 43, but also serves as a resistance to the swinging motion of the load beam 43.

  Therefore, notches 45c extending toward the respective elongated pockets 45a are provided at both outer side edges of the load beam 43, and the notches 45c communicate with the respective elongated pockets 45a. Thus, by providing a pair of notches 45c on both outer side edges of the load beam 43, the swinging motion of the load beam 43 can be performed more smoothly.

  In FIG. 9, reference numeral 25 denotes a jig provided on the load beam 43.

  As shown in FIG. 10, the load beam 43 has a base end part 43a and a base end part 43a and a tip end part 43b that is swingably connected via a pocket 45 including a pair of elongated pocket parts 45a. A protruding piece 43 t is provided at the tip of the load beam 43. In FIG. 10, each of the elongated pocket portions 45 a is inclined toward the projecting piece 43 t with respect to the longitudinal axis X of the load beam 43.

  At both outer side edges of the load beam 43, reinforcing side edge ribs 43c rising from the surface of the load beam 43 are provided. The side edge rib 43 c reinforces the load beam 43, but also serves as a resistance to the swinging motion of the load beam 43.

  Therefore, a slit 45e is formed on the outside of each elongated pocket portion 45a of the load beam 43 via a linear rib 45d. In this way, by providing the slits 45e outside the respective elongated pocket portions 45a of the load beam 43, the swinging motion of the load beam 43 can be performed smoothly. Further, since the outside of each elongated pocket portion 45a is defined by the linear rib 45d, the piezoelectric element 44 in the pocket 45a can be protected from a force from the outside by the linear rib 45d.

  In FIG. 10, reference numeral 25 denotes a jig provided on the load beam 43.

(Modification 4)
Next, a fourth modification of the present invention will be described with reference to FIGS.

  As shown in FIG. 11, the load beam 43 has a proximal end portion 43a and a distal end portion 43b that is swingably connected to the proximal end portion 43a via a pocket 45 including a pair of elongated pocket portions 45a. A protruding piece 43 t is provided at the tip of the load beam 43. In FIG. 11, each of the elongated pocket portions 45 a is inclined toward the protruding piece 43 t with respect to the longitudinal axis X of the load beam 43.

  At both outer side edges of the load beam 43, reinforcing side edge ribs 43c rising from the surface of the load beam 43 are provided. The side edge rib 43 c reinforces the load beam 43, but also serves as a resistance to the swinging motion of the load beam 43.

  Therefore, a notch 45b extending toward the lower side of each elongated pocket 45a is provided on both outer side edges of the load beam 43. Thus, by providing a pair of notches 45b on both outer side edges of the load beam 43, the swinging motion of the load beam 43 can be performed more smoothly.

  In FIG. 11, reference numeral 25 denotes a jig provided on the load beam 43. On the load beam 43, a gold plating 43p is applied in the vicinity of the pocket portion 45a so as to be electrically connected to the conductive adhesive 48 connected to the piezo element 44.

  As shown in FIG. 12, the load beam 43 has a proximal end portion 43a and a distal end portion 43b that is swingably connected to the proximal end portion 43a via a pocket 45 including a pair of elongated pocket portions 45a. A protruding piece 43 t is provided at the tip of the load beam 43. In FIG. 12, each of the elongated pocket portions 45 a is inclined toward the protruding piece 43 t with respect to the longitudinal axis X of the load beam 43.

  At both outer side edges of the load beam 43, reinforcing side edge ribs 43c rising from the surface of the load beam 43 are provided. The side edge rib 43 c reinforces the load beam 43, but also serves as a resistance to the swinging motion of the load beam 43.

  Therefore, notches 45b extending toward the elongated pockets 45a are provided on both outer side edges of the load beam 43. Thus, by providing the pair of notches 45b on both outer side edges of the load beam 43, the sliding motion of the load beam 43 can be performed more smoothly.

  In FIG. 12, reference numeral 25 denotes a jig provided on the load beam 43. On the load beam 43, a gold plating 43p is applied in the vicinity of the pocket portion 45a so as to be electrically connected to the conductive adhesive 48 connected to the piezo element 44.

  As described above, the embodiments of the present invention have been described in detail. However, the suspension substrate, the suspension, the suspension with a head, and the hard disk drive according to the present invention are not limited to the above-described embodiments, and the gist of the present invention. Various modifications can be made without departing from the scope.

DESCRIPTION OF SYMBOLS 1 Suspension board | substrate 2 Board | substrate body 2a Head part 2b Tail part 5 Head terminal 6 Tail terminal 10 Insulating layer 10a Through-hole 11 Metal support layer 11a Through-hole 12 Wiring layer 12a Through-hole 13 Signal wiring 14 Element wiring 15 Plating layer 16 Element connection Part 16a Element connection terminal 20 Protective layer 20a Through hole 25 Jig hole 41 Suspension 42 Base plate 43 Load beam 43a Base end part 43b Front end part 43c Side edge rib 43t Projection piece 44 Piezo element 44a Electrode 44b Piezoelectric material part 45 Pocket 45a Elongated Pocket part 45b Notch 45c Notch 45d Linear rib 45e Slit 46 Non-conductive adhesive part 48 Conductive adhesive part 51 Suspension with head 52 Head slider 61 Hard disk drive 62 Case 63 Disk 64 Spindle motor 65 Voice coil Motor 66 arm 71 FPC board

Claims (11)

A load beam having a proximal end portion and a distal end portion that is swingably coupled to the proximal end portion via a pocket;
A substrate body mounted on the load beam and including a slide head mounting region, and a suspension substrate having an element connecting portion connected to the substrate body,
The actuator element connected to the element connection portion of the suspension substrate is stored in this pocket,
A suspension characterized in that the tip of the load beam is swung with respect to the base end by the force from the actuator element.   The suspension according to claim 1, wherein the load beam pocket is located between a load bending portion of the load beam and a region corresponding to the slide head mounting region.   The suspension according to claim 2, wherein the pocket of the load beam includes a pair of elongated pocket portions extending along the longitudinal direction and adjacent to each other.   4. The suspension according to claim 3, wherein notches are formed on both outer side edges of the load beam toward the elongated pocket portions.   The suspension according to claim 4, wherein each notch communicates with the elongated pocket portion.   The suspension according to claim 1, wherein a slit is formed outside the load beam pocket via a linear rib. The suspension substrate has a metal support layer, an insulating layer, and a wiring layer.
The actuator element in the pocket is supported by the metal support layer of the suspension substrate,
The suspension according to claim 1, wherein the element connection portion is connected to a wiring layer of the suspension substrate. The suspension substrate has a metal support layer, an insulating layer, and a wiring layer.
The actuator element in the pocket is supported by the insulating layer of the suspension substrate,
The suspension according to claim 1, wherein the element connection portion is connected to a wiring layer of the suspension substrate.   9. The suspension according to claim 8, wherein the portion of the insulating layer that supports the actuator element in the pocket is formed thinner on the actuator element side than the other portion of the insulating layer. The suspension according to any one of claims 1 to 9,
A suspension with a head, comprising: a head slider mounted on the suspension.   A hard disk drive comprising the suspension with a head according to claim 10.

Images