JP2014006980A - Cordless wiring board device and method for manufacturing the same - Google Patents

Cordless wiring board device and method for manufacturing the same Download PDF

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Publication number
JP2014006980A
JP2014006980A JP2012140071A JP2012140071A JP2014006980A JP 2014006980 A JP2014006980 A JP 2014006980A JP 2012140071 A JP2012140071 A JP 2012140071A JP 2012140071 A JP2012140071 A JP 2012140071A JP 2014006980 A JP2014006980 A JP 2014006980A
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wiring
cordless
board device
single wire
substrate member
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Noriyasu Tokihisa
典安 時久
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NIPPON LOCK KK
Nippon Lock Co Ltd
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NIPPON LOCK KK
Nippon Lock Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a cordless wiring board device capable of forming a required number of wiring single wires in a predetermined wiring state, connecting connectors respectively to both ends of the wiring single wires, inserting the wiring single wires into a synthetic resin substrate member and forming the substrate member in accordance with the wiring state of the wiring single wires.SOLUTION: Since it is not necessary to conventionally bundle a plurality of harnesses or form the bundled harnesses in accordance with a wiring state, a specified wiring structure is easily manufactured, and as a result, working efficiency can be easily improved. Further, since the board device is a synthetic resin molded product, it can be assembled into a vehicle etc., by one-touch, and efficiency of assembling work can also be improved.

Description

この発明はコードレス配線基板装置及びその製造方法に関し、特に、特定化した専用の配線基板、例えば、車両におけるトランスミッションの制御装置の配線基板及びその製造方法として使用される。     The present invention relates to a cordless wiring board device and a manufacturing method thereof, and in particular, is used as a specified dedicated wiring board, for example, a wiring board of a transmission control device in a vehicle and a manufacturing method thereof.

この発明の従来例として「車両のトランスミッションの制御装置の配線構造」を採り上げ、図5に基づいて説明する。     A “wiring structure of a control device for a vehicle transmission” will be described as a conventional example of the present invention and will be described with reference to FIG.

この配線構造においては、主コネクタ1と所要数の従コネクタ2,2,…とを各々ハーネス3,3,…で接続し、これらのハーネス3,3,…を束ね、取付板4に沿って締付けバンド5,5,…によって締め付け固定されていた。そして、車両本体等に組み付ける際は、前記取付板4をボルト等によって締付け固定していた。     In this wiring structure, the main connector 1 and the required number of sub-connectors 2, 2,... Are connected by the harnesses 3, 3,. It was fastened and fixed by fastening bands 5, 5,. And when attaching to a vehicle main body etc., the said mounting plate 4 was fastened and fixed with the volt | bolt etc.

特開2001−118622号公報JP 2001-118622 A

しかしながら、かかる従来の配線構造にあっては、各々のハーネス3,3,…が弾力性を有しているため、束ねにくいとともに束ねたものを取付板4にそって成形しにくく、この結果、配線構造を製造するにあたって手間がかかり、作業効率を向上させにくいという不都合を有した。     However, in such a conventional wiring structure, each harness 3, 3,... Has elasticity, so that it is difficult to bundle and bundled ones along the mounting plate 4, and as a result, The manufacturing of the wiring structure takes time and has the disadvantage that it is difficult to improve the working efficiency.

これらの不都合を解消することがこの発明の課題である。     It is an object of the present invention to eliminate these disadvantages.

前記課題を達成するために、この発明に係るコードレス配線基板装置においては、所要数の配線用単線を所定の配線状態に形成するとともにこれらの配線用単線の両端に各々コネクタを接続し、前記配線用単線を合成樹脂製基板部材にインサートするとともに前記基板部材を前記配線用単線の配線状態に合わせて成形したものである。     In order to achieve the above object, in the cordless wiring board device according to the present invention, a required number of single wires for wiring are formed in a predetermined wiring state, and connectors are respectively connected to both ends of the single wires for wiring. A single wire for use is inserted into a synthetic resin substrate member and the substrate member is molded in accordance with the wiring state of the single wire for wiring.

この場合、前記配線用単線の端部を延設して前記コネクタ用端子を形成することもできる。   In this case, the connector terminal can be formed by extending the end of the wiring single wire.

また、前記コネクタを前記基板部材にインサートすることもできる。 Further, the connector can be inserted into the board member.

また、前記コネクタを前記基板部材と一体成形することもできる。 In addition, the connector can be integrally formed with the board member.

また、前記配線用単線にアース金具を接続し、前記配線用単線とともに前記アース金具の根幹部を前記基板部材にインサートすることもできる。 Also, a grounding metal can be connected to the single wire for wiring, and a root portion of the grounding metal can be inserted into the substrate member together with the single wire for wiring.

また、前記基板部材に取付部材を一体成形することもできる。 Further, the mounting member can be integrally formed with the substrate member.

さらに、前記課題を達成するために、この発明に係るコードレス配線基板装置の製造方法においては、配線用単線を所定の配線状態に形成するとともにこの配線用単線の両端にコネクタを接続した状態で、形成前記配線用単線を合成樹脂製基板部材にインサートするものである。 Furthermore, in order to achieve the above-mentioned problem, in the method of manufacturing the cordless wiring board device according to the present invention, the wiring single wire is formed in a predetermined wiring state and the connector is connected to both ends of the wiring single wire. Formation The single wire for wiring is inserted into a synthetic resin substrate member.

この発明に係るコードレス配線基板装置は上記のように構成されているため、即ち、所要数の配線用単線を所定の配線状態に形成するとともにこれらの配線用単線の両端に各々コネクタを接続し、前記配線用単線を合成樹脂製基板部材にインサートするとともに前記基板部材を前記配線用単線の配線状態に合わせて成形したため、所定の配線状態に合わせた基板装置を合成樹脂成形品として製造することができる。     Since the cordless wiring board device according to the present invention is configured as described above, that is, a required number of wiring single wires are formed in a predetermined wiring state, and connectors are respectively connected to both ends of these wiring single wires, Since the single wire for wiring is inserted into a synthetic resin substrate member and the substrate member is molded in accordance with the wiring state of the single wire for wiring, a substrate device that matches a predetermined wiring state can be manufactured as a synthetic resin molded product. it can.

よって、このコードレス配線基板装置を使用すれば、従来のように複数のハーネスを束ねたり、束ねたものを配線状態に沿って成形する必要はないため、特定の配線構造を製造しやすく、ひいては、作業効率を向上させやすいものである。その上、基板装置が合成樹脂成形品であるため、ワンタッチで車両等に組み付けることができ、組み付け作業の効率化を向上させることもできる。 Therefore, if this cordless wiring board device is used, it is not necessary to bundle a plurality of harnesses as in the prior art, and it is not necessary to form a bundled thing along the wiring state, so that it is easy to manufacture a specific wiring structure. It is easy to improve work efficiency. In addition, since the substrate device is a synthetic resin molded product, it can be assembled to a vehicle or the like with a single touch, and the efficiency of the assembly work can be improved.

この場合、前記配線用単線の端部を延設して前記コネクタ用端子を形成すれば、前記配線用単線に前記コネクタ用端子を接続する必要がないためコネクタとの連設が容易になる。 In this case, if the connector terminal is formed by extending the end of the wiring single wire, it is not necessary to connect the connector terminal to the single wiring wire, so that the connection with the connector is facilitated.

また、前記コネクタを前記基板部材にインサートすれば、コネクタが合成樹脂成形品と一体になるため取扱いが容易になる。 Further, if the connector is inserted into the board member, the connector is integrated with the synthetic resin molded product, so that the handling becomes easy.

また、前記コネクタを前記基板部材と一体成形しても、コネクタが合成樹脂成形品と一体になるため取扱いが容易になる。 Further, even if the connector is integrally formed with the substrate member, the connector is integrated with the synthetic resin molded product, so that the handling becomes easy.

また、前記配線用単線にアース金具を接続し、前記配線用単線とともに前記アース金具の根幹部を前記基板部材にインサートすれば、アース金具も配線状態に合わせて設置することができるものである。 Further, if a grounding metal is connected to the single wire for wiring, and the root part of the grounding metal is inserted into the substrate member together with the single wire for wiring, the grounding metal can also be installed according to the wiring state.

また、前記基板部材に取付部材を一体成形すれば、別途に取付部材を設置する必要がないため、基板装置の取付作業が容易にできる。 Further, if the mounting member is integrally formed with the substrate member, it is not necessary to separately install the mounting member, so that the mounting operation of the substrate device can be facilitated.

さらに、この発明に係るコードレス配線基板装置の製造方法は上記のように構成されているため、即ち、配線用単線を所定の配線状態に形成するとともにこの配線用単線の両端にコネクタを接続した状態で、形成前記配線用単線を合成樹脂製基板部材にインサートするため、前記コードレス配線基板装置を所定の配線状態に合わせて合成樹脂成形しやすいものである。 Furthermore, since the manufacturing method of the cordless wiring board device according to the present invention is configured as described above, that is, a state in which a single wire for wiring is formed in a predetermined wiring state and connectors are connected to both ends of the single wire for wiring. Thus, since the formed single wire for wiring is inserted into the synthetic resin substrate member, the cordless wiring substrate device is easily molded into a synthetic resin in accordance with a predetermined wiring state.

この発明に係るコードレス配線基板装置は実施するにあたって下記の構成に最も主要な特徴を有する。     The cordless wiring board device according to the present invention has the most main features in the following configuration when implemented.

「基板部材」を成形する合成樹脂としては、ポリアミド系樹脂等が適している。 As the synthetic resin for molding the “substrate member”, a polyamide-based resin or the like is suitable.

「配線用単線」は横断面が真円の裸銅線が適している。「配線用単線」のコネクタ用端子を形成する部分は横断面が四角状に形成されている。 For the “single wire for wiring”, a bare copper wire having a perfect circular cross section is suitable. The portion of the “wiring single wire” forming the connector terminal has a square cross section.

「配線用単線」を基板部材にインサートする場合には、モールド内に所要数の「配線用単線」を互いに離れた状態で位置決めし(スペーサ等によって)、基板部材を樹脂成形する。この場合、モールドの成形空間は配線用単線の配線状態に合わせて形成されている。 When inserting “wiring single wires” into the substrate member, the required number of “wiring single wires” are positioned in the mold in a state of being separated from each other (by a spacer or the like), and the substrate member is resin-molded. In this case, the molding space of the mold is formed in accordance with the wiring state of the single wire for wiring.

「コネクタ」は基板部材を成形する際にインサートすることもできるし、基板部材と一体成形することもできる。 The “connector” can be inserted when the substrate member is formed, or can be integrally formed with the substrate member.

「アース金具」も基板部材にインサートすることができる。この場合、「アース金具」は配線用単線に接続されている。 “Earth metal fittings” can also be inserted into the board member. In this case, the “grounding metal fitting” is connected to the single wire for wiring.

「コードレス配線基板装置」を製造する際は、配線用単線を所定の配線状態に形成し、この配線用単線にコネクタ、アース金具を接続した状態で合成樹脂製基板部材にインサートするものである。 When the “cordless wiring board device” is manufactured, a single wire for wiring is formed in a predetermined wiring state, and a connector and a grounding fitting are connected to the single wire for wiring and inserted into the synthetic resin substrate member.

以下、この発明の実施例を図面に基づいて説明する。     Embodiments of the present invention will be described below with reference to the drawings.

図1はこの発明に係るコードレス配線基板装置の斜視図、図2は同平面図、図3は図2におけるIII-III線断面図、図4はソレノドを接続した状態の図1に相当する図、図5は従来例の斜視図である。     1 is a perspective view of a cordless wiring board device according to the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a sectional view taken along line III-III in FIG. 2, and FIG. 4 is a view corresponding to FIG. FIG. 5 is a perspective view of a conventional example.

図1〜図4において、Aはコードレス配線基板装置であり、「車両のトランスミッションの制御装置の配線構造」として使用される。10は基板部材であり、ポリアミド系樹脂等の合成樹脂によってモールド成形されている。この基板部材10の幹部11と所要数の枝部12,12,…とから構成され、後記配線用単線20の配線状態に合わせた形状をしている。     1 to 4, A is a cordless wiring board device, and is used as “a wiring structure of a control device for a vehicle transmission”. Reference numeral 10 denotes a substrate member, which is molded by a synthetic resin such as a polyamide-based resin. It is comprised from the trunk | drum 11 of this board | substrate member 10, and the required number of branch parts 12, 12, ..., and has a shape according to the wiring state of the single wire 20 for wiring mentioned later.

20,20,…は配線用単線であり、互いに絶縁された状態で前記基板部材10にインサートされている。これらの配線用単線20,20,…は横断面が真円の裸銅線であり、所定の配線状態に形成され、その両端部は前記基板部材10の端面から突出している。     20, 20,... Are single wires for wiring, and are inserted into the substrate member 10 while being insulated from each other. These single wires 20, 20,... For wiring are bare copper wires having a perfect cross section, are formed in a predetermined wiring state, and both end portions thereof protrude from the end face of the substrate member 10.

30は主コネクタ(この発明の「コネクタ」に相当する)であり、前記基板部材10における幹部11の根幹部に設置されている。この主コネクタ30を介して電源に接続される。 Reference numeral 30 denotes a main connector (corresponding to the “connector” of the present invention), which is installed at the root of the trunk 11 of the board member 10. The main connector 30 is connected to a power source.

31,31,…は端子であり、前記主コネクタ30のケーシング32内に突出している。これらの端子31,31,…は、前記配線用単線20,20,…の一端部が延設したものであり、その横断面が四角状に形成されている。なお、この状態で、前記主コネクタ30を前記基板部材10にインサートすることもできるし、前記主コネクタ30と前記基板部材10とを一体成形することもできる。 Reference numerals 31, 31,... Are terminals that protrude into the casing 32 of the main connector 30. These terminals 31, 31,... Are formed by extending one end portions of the wiring single wires 20, 20,..., And have a rectangular cross section. In this state, the main connector 30 can be inserted into the board member 10, or the main connector 30 and the board member 10 can be integrally formed.

50,50,…は従コネクタであり、前記基板部材10における枝部12,12,…の先端部に設置されている。これらの従コネクタ50,50,…は図4に示すようにソレノドS,S,…に接続される。51はこの従コネクタ50のケーシング、52は同端子である。この端子52には前記配線用単線20,20,…の他端部がカシメられている。なお、この状態で、前記従コネクタ50を前記基板部材10にインサートすることもできるし、前記従コネクタ50と前記基板部材10とを一体成形することもできる。 .. Are sub-connectors, which are installed at the tips of the branch portions 12, 12,. These sub-connectors 50, 50,... Are connected to solenoids S, S,. 51 is a casing of the slave connector 50, and 52 is the same terminal. The other end of the wiring single wires 20, 20,... In this state, the slave connector 50 can be inserted into the board member 10, or the slave connector 50 and the board member 10 can be integrally formed.

60はアース金具であり、前記基板部材10の幹部11に突設されている。このアース金具60は前記配線用単線10に接続され、その接続部とともにその根幹部が前記基板部材10にインサートされている。 Reference numeral 60 denotes a ground metal fitting, which protrudes from the trunk portion 11 of the substrate member 10. The ground metal fitting 60 is connected to the wiring single wire 10, and the base portion thereof is inserted into the substrate member 10 together with the connecting portion.

なお、70,70は取付部材であり、前記基板部材10の幹部11に一体成形されている。この取付部材70,70は貫通孔71,71を介してボルト締めすることにより、前記コードレス配線基板装置Aを車体等に組み付けるためものである。 Reference numerals 70 and 70 denote attachment members, which are integrally formed with the trunk portion 11 of the substrate member 10. The attachment members 70 are for assembling the cordless wiring board device A to a vehicle body or the like by bolting through the through holes 71 71.

前記コードレス配線基板装置Aを製造する際は、前記配線用単線20,20,…を所定の配線状態に形成し、この配線用単線20,20,…の一端を主コネクタ30の端子31,31,…に形成した状態で主コネクタ30を接続し、この配線用単線20,20,…の他端に従コネクタ50,50,…の端子52,52,…にカシメた状態で従コネクタ50,50,…を接続し、更に、前記配線用単線20,20,…に前記アース金具60を接続した状態で、配線状態に合わせて成形空間を形成したモールドにスペーサを介して配置し、合成樹脂を注入することによって前記基板部材10成形する。基板部材10の成形とともに前配線用単線20,20,…及び前記アース金具60はインサートされる。 When the cordless wiring board device A is manufactured, the wiring single wires 20, 20,... Are formed in a predetermined wiring state, and one end of the wiring single wires 20, 20,. ,... Are connected to the main connector 30, and the other ends of the wiring single wires 20, 20,... Are connected to the terminals 52, 52,. Are connected to the single wire for wiring 20, 20,..., And the ground metal fitting 60 is connected to a mold in which a molding space is formed in accordance with the wiring state via a spacer. The substrate member 10 is formed by injecting. As the substrate member 10 is formed, the front wiring single wires 20, 20,... And the ground metal fitting 60 are inserted.

この発明に係るコードレス配線基板装置は、従来のように複数のハーネスを束ねたり、束ねたものを配線状態に沿って成形する必要はないため、特定の配線構造を製造しやすく、ひいては、作業効率を向上させやすいものである。その上、基板装置が合成樹脂成形品であるため、ワンタッチで車両等に組み付けることができ、組み付け作業の効率化を向上させることもできる。産業上の利用可能性は高いものである。
The cordless wiring board device according to the present invention does not require bundling a plurality of harnesses as in the prior art, and it is not necessary to form the bundling along the wiring state. Therefore, it is easy to manufacture a specific wiring structure, and as a result, work efficiency It is easy to improve. In addition, since the substrate device is a synthetic resin molded product, it can be assembled to a vehicle or the like with a single touch, and the efficiency of the assembly work can be improved. Industrial applicability is high.

図1はこの発明に係るコードレス配線基板装置の斜視図である。FIG. 1 is a perspective view of a cordless wiring board device according to the present invention. 図2は同平面図である。FIG. 2 is a plan view of the same. 図3は図2におけるIII-III線断面図である。3 is a cross-sectional view taken along line III-III in FIG. 図4はソレノドを接続した状態の図1に相当する図である。FIG. 4 is a view corresponding to FIG. 1 in a state where the solenoid is connected. 図5は従来例の斜視図である。FIG. 5 is a perspective view of a conventional example.

1 … 主コネクタ
2 … 従コネクタ
3 … ハーネス
4 … 取付板
5 … 締付けバンド
A … コードレス配線基板装置
10 … 基板部材
11 … 幹部
12 … 枝部
20 … 配線用単線
30 … 主コネクタ(この発明の「コネクタ」に相当する)
31 … 端子
32 … ケーシング
50 … 従コネクタ
S … ソレノド
51 … ケーシング
52 … 端子
60 … アース金具
70 … 取付部材
71 … 貫通孔
















DESCRIPTION OF SYMBOLS 1 ... Main connector 2 ... Slave connector 3 ... Harness 4 ... Mounting plate 5 ... Fastening band A ... Cordless wiring board apparatus 10 ... Board member 11 ... Trunk part 12 ... Branch part 20 ... Single wire 30 for wiring ... Main connector (" Corresponds to “connector”)
31 ... Terminal 32 ... Casing 50 ... Secondary connector S ... Solenoid 51 ... Casing 52 ... Terminal 60 ... Earth metal fitting 70 ... Mounting member 71 ... Through-hole
















Claims (7)

所要数の配線用単線を所定の配線状態に形成するとともにこれらの配線用単線の両端に各々コネクタを接続し、前記配線用単線を合成樹脂製基板部材にインサートするとともに前記基板部材を前記配線用単線の配線状態に合わせて成形したことを特徴とするコードレス配線基板装置。 A required number of single wires for wiring are formed in a predetermined wiring state, connectors are connected to both ends of the single wires for wiring, the single wires for wiring are inserted into a synthetic resin substrate member, and the substrate member is used for the wiring A cordless wiring board device formed according to a wiring state of a single wire. 前記配線用単線の端部を延設して前記コネクタ用端子を形成したことを特徴とする請求項1のコードレス配線基板装置。 2. The cordless wiring board device according to claim 1, wherein the connector terminal is formed by extending an end of the wiring single wire. 前記コネクタを前記基板部材にインサートしたことを特徴とする請求項1又は請求項2のコードレス配線基板装置。 The cordless wiring board device according to claim 1 or 2, wherein the connector is inserted into the board member. 前記コネクタを前記基板部材と一体成形したことを特徴とする請求項1又は請求項2のコードレス配線基板装置。 The cordless wiring board device according to claim 1 or 2, wherein the connector is formed integrally with the board member. 前記配線用単線にアース金具を接続し、前記配線用単線とともに前記アース金具の根幹部を前記基板部材にインサートしたことを特徴とする請求項1,請求項2、請求項3又は請求項4のコードレス配線基板装置。 The ground metal fitting is connected to the single wire for wiring, and a root portion of the ground metal fitting is inserted into the substrate member together with the single wire for wiring. Cordless wiring board device. 前記基板部材に取付部材を一体成形したことを特徴とする請求項1,請求項2、請求項3,請求項4又は請求項5のコードレス配線基板装置。 6. The cordless wiring board device according to claim 1, wherein the mounting member is integrally formed with the board member. 配線用単線を所定の配線状態に形成するとともにこの配線用単線の両端にコネクタを接続した状態で、形成前記配線用単線を合成樹脂製基板部材にインサートすることを特徴とするコードレス配線基板装置の製造方法。
A cordless wiring board device comprising: forming a wiring single wire in a predetermined wiring state and inserting the wiring single wire into a synthetic resin substrate member in a state where connectors are connected to both ends of the wiring single wire. Production method.
JP2012140071A 2012-06-21 2012-06-21 Cordless wiring board device and method for manufacturing the same Pending JP2014006980A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6414812A (en) * 1987-07-09 1989-01-19 Toa Gosei Chem Ind Manufacture of sheet-shaped wire harness
JPH09509782A (en) * 1994-03-01 1997-09-30 イーテーテー キャノン ゲゼルシャフト ミット ベシュレンクテル ハフツング How to attach a cable to a plug and the cable plug used for it
JP2000322944A (en) * 1999-05-17 2000-11-24 Yazaki Corp Protector fitted with connector wire and its manufacture
JP2011244587A (en) * 2010-05-18 2011-12-01 Alps Electric Co Ltd Assembly of detecting component
JP2012094384A (en) * 2010-10-27 2012-05-17 Asahi Electric Works Ltd Watertight coating bond wire, and coating device and coating method of watertight coating bond wire

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6414812A (en) * 1987-07-09 1989-01-19 Toa Gosei Chem Ind Manufacture of sheet-shaped wire harness
JPH09509782A (en) * 1994-03-01 1997-09-30 イーテーテー キャノン ゲゼルシャフト ミット ベシュレンクテル ハフツング How to attach a cable to a plug and the cable plug used for it
JP2000322944A (en) * 1999-05-17 2000-11-24 Yazaki Corp Protector fitted with connector wire and its manufacture
JP2011244587A (en) * 2010-05-18 2011-12-01 Alps Electric Co Ltd Assembly of detecting component
JP2012094384A (en) * 2010-10-27 2012-05-17 Asahi Electric Works Ltd Watertight coating bond wire, and coating device and coating method of watertight coating bond wire

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