JP2014003055A5 - - Google Patents

Claims (2)

Polyethylene polymer (a1) having a crystal melting peak temperature of 115 to 120 ° C. measured at a heating rate of 10 ° C./min in differential scanning calorimetry, and an ethylene-olefin random copolymer having the same crystal melting peak temperature of 50 to 80 ° C. A core layer comprising the ethylene resin composition (c1) containing the coalescence (b1) and having a heat of crystal fusion of 50 to 85 J / g measured at a heating rate of 10 ° C./min in differential scanning calorimetry;
The polyethylene-based polymer (a2) having the same crystal melting peak temperature of 121 to 127 ° C. and the ethylene-olefin random copolymer (b2) having the same crystal melting peak temperature of 50 to 79 ° C. A surface layer made of an ethylene resin composition (c2) of 85 J / g and laminated on one or both sides of the core layer ,
When the surface layer is laminated on one side of the core layer, the ratio of the layer thickness of the surface layer to the core layer is 1: 3 to 1:20, and the surface layer is laminated on both sides of the core layer. The ratio of the layer thickness of the surface layer to the core layer is in the range of 1: 3 to 1:20, and the ratio of the layer thicknesses of both surface layers is 1: 3 to 3: 1. A solar cell encapsulant. The ethylene-based resin composition (c2) is a copolymer of an alkoxysilane having a polymerizable functional group and at least one selected from the polyethylene-based polymer (a2) and the ethylene-olefin random copolymer (b2). The solar cell encapsulant according to claim 1 , comprising a silane-modified resin obtained by polymerization and substantially free of a radical generator.