JP2013536995A - Slurry supply device for semiconductor provided with piping clogging prevention means - Google Patents

Abstract

  The present invention relates to a semiconductor slurry provided with piping clogging prevention means for preventing clogging of an orifice region and an exhaust pipe of the vacuum generation means due to the slurry flowing into and fixing in the vacuum generation means of the semiconductor slurry supply apparatus. A supply device is disclosed. The present invention relates to a semiconductor slurry supply apparatus for supplying a slurry in a polishing process at the time of manufacturing a semiconductor device, the storage tank storing the slurry, and the supply of the slurry from the storage tank respectively connected to the storage tank A plurality of pressure vessels that are discharged to the outside, vacuum generating means connected to the pressure vessels and generating a vacuum pressure on the pressure vessels, and a connecting line between the pressure vessels and the vacuum generation means. And a centrifugal separation means for separating foreign substances contained in the compressed air that is introduced from the compressed air by centrifugal force.

Description

  The present invention relates to a semiconductor slurry supply apparatus provided with piping clogging prevention means, and more specifically, a vacuum is obtained by injecting and fixing slurry liquid into a vacuum generator of a semiconductor slurry supply apparatus. The present invention relates to a semiconductor slurry supply apparatus provided with piping clogging prevention means for preventing clogging of an orifice region and an exhaust pipe of a generator.

  In general, a process technology for manufacturing a semiconductor element requires high integration and high density of the semiconductor element. For this purpose, a fine pattern forming technique must be applied.

  On the other hand, when a multilayered structure of wiring is required, the surface structure of the semiconductor element is further complicated, and the step of the interlayer film tends to become more severe. The step in the interlayer film generated in this way causes a process failure and must be removed.

  In order to solve this problem, conventionally, as a wafer flattening technique, SOG (SOG), etch back (Etch back), BPSG (Boron Phosphorus Silicate Glass), reflow (Reflow) process, and chemical / mechanical polishing are used. A process (hereinafter referred to as a CMP process) has been applied. Of these, the CMP process has been frequently used recently, and this CMP process includes a chemical polishing process and a mechanical polishing process in order to flatten the widened surface of the wafer by increasing the diameter of the wafer. Are combined into one process. This is a method of flattening a wafer by injecting an abrasive between the wafer and the polishing pad after the surface of the wafer having a step formed thereon is in close contact with the polishing pad. Suitable for planarization process.

  A solution containing abrasive particles and a chemical additive is used as an abrasive in such a CMP process, which is called a slurry. A chemical / mechanical planarization process is performed on the semiconductor wafer using the liquid slurry. At this time, among the slurry liquid applied for mechanical polishing, solid fine particles present in a suspended state must be selected within a certain range and supplied to the CMP equipment. This is because if a large particle (for example, 1 μm or more in the case of oxide slurry) is used in the CMP process, it will cause fine pattern damage on the semiconductor wafer, leading to a defect in the semiconductor wafer. It is.

  Further, in order to use the slurry in the CMP process equipment, a separate slurry supply device is provided so as to select and supply particles that match the characteristics of each process. Such a slurry supply apparatus supplies the CMP apparatus with a slurry mixture used in the CMP process or a quantitative mixed liquid in which additives are mixed and diluted so as to suit the characteristics of each process.

  Generally, in this case, the transfer to the POU (Point of User) side uses a pressurized vessel (Pressure Vessel) to maintain a more static state and to prevent the slurry from solidifying. Transport while.

  For this purpose, there are provided a pressurized vessel, a vacuum generator for sucking slurry into the pressurized vessel, and N2 gas providing means for generating and transferring pressure. Here, the Bernoulli principle is applied as the principle of filling the pressurized vessel with the slurry. Specifically, when a negative pressure is generated by a vacuum generator (aspirator), a negative pressure (vacuum pressure) is generated inside the pressurized vessel due to the negative pressure of the vacuum generator, and the slurry flows into the pressurized vessel, A certain amount of slurry is filled in the pressurized vessel.

  At this time, a phenomenon occurs in which the slurry filled in the pressurized vessel is sucked into the vacuum generator in the form of droplets at the top of the suction. This is a phenomenon in which a very small drop of slurry jumps out of a pressurized vessel and is sucked into a vacuum generator. The sucked slurry is accumulated as the process proceeds and dried in this state. Then, it adheres in the state of a slurry solid. At this time, the slurry solids have the result of blocking the orifice of the vacuum generator, resulting in a loss of process because the vacuum generation is interrupted and the operation of the equipment is stopped.

  In addition, when the slurry liquid is accumulated beyond the exhaust side of the vacuum generator, a further loss is caused in the equipment itself.

  The present invention has been made to solve the above-described problems, and the slurry flows into the vacuum generating means of the semiconductor slurry supply device and is fixed, whereby the orifice region and the exhaust pipe of the vacuum generating means. It is an object of the present invention to provide a semiconductor slurry supply device provided with a pipe clogging prevention means for preventing clogging.

  According to one embodiment of the present invention for achieving the above object, in a semiconductor slurry supply apparatus for supplying a slurry in a polishing process when manufacturing a semiconductor element, a storage tank in which the slurry is stored; A plurality of pressure vessels connected to the storage tanks, receiving slurry supplied from the storage tank and discharging to the outside, and a vacuum generating means connected to the pressure vessels and generating a vacuum pressure on the pressure vessels. And a clogging preventing means provided in a connecting line between the pressurized vessel and the vacuum generating means, and separating the foreign substance contained in the compressed air flowing in from the compressed air by centrifugal force. A slurry supply apparatus for semiconductor provided with

  The centrifugal separating means comprises a columnar cylinder having a suction port connected to the pressure vessel formed on a side surface and an exhaust port formed at a position perpendicular to the suction port, and is introduced into the suction port. It is preferable that the compressed air is swirled in the cylindrical body, and the heavy slurry is separated from the compressed air by centrifugal force.

  The cylinder is formed to have a diameter that is shorter from the upper part toward the lower part, and a slurry storage box for storing the centrifuged slurry is provided at the lower part of the cylinder.

  According to the present invention, the semiconductor slurry supply device and the vacuum generating means are provided with a centrifuge to centrifuge the slurry contained in the compressed air that is introduced, and only pure compressed air is introduced into the vacuum generating means. By doing so, it is possible to prevent the clogging phenomenon due to the inflow of the slurry liquid and to prevent the occurrence of equipment loss and process loss.

It is a block diagram which shows the slurry supply apparatus for semiconductors provided with the piping clogging prevention means by one Example of this invention. It is an illustration showing a configuration of a vacuum generator of a semiconductor slurry supply apparatus provided with a pipe clogging prevention means according to an embodiment of the present invention. It is a top view which shows the structure of the centrifugation means of the slurry supply apparatus for semiconductors provided with the piping clogging prevention means by one Example of this invention. It is a side view which shows the structure of the centrifugation means of the slurry supply apparatus for semiconductors provided with the piping clogging prevention means by one Example of this invention.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a block diagram showing a semiconductor slurry supply apparatus provided with piping clogging prevention means according to an embodiment of the present invention, and FIG. 2 is a diagram for a semiconductor equipped with piping clogging prevention means according to an embodiment of the present invention. It is an illustration figure which shows the structure of the vacuum generator of a slurry supply apparatus.

  As shown in FIG. 1, the semiconductor slurry supply apparatus provided with the pipe clogging prevention means of the present invention comprises a storage tank 10, pressurized vessels 21 and 22, a vacuum generation means 30, and a centrifugal separation means 40. The

  The pressurization vessels 21 and 22 are a plurality of, and are connected in parallel to the storage tank 10 to receive a slurry and discharge it to a POU (Point of User).

  At this time, the slurry is supplied to the pressure vessels 21 and 22 by the vacuum pressure (negative pressure) provided from the vacuum generating means 30. That is, the vacuum generating means 30 is connected to the pressure vessels 21 and 22 through the pipes so that a vacuum pressure is applied to the inside of the pressure vessels 21 and 22. As a result, the slurry in the storage tank 10 connected to the pressurized vessels 21 and 22 by piping flows into the pressurized vessels 21 and 22 by vacuum pressure. At this time, N 2 gas or natural gas is applied to the compressed gas (vacuum pressure forming gas) applied to the vacuum generating means 30.

  As shown in FIG. 2, the vacuum generating means 30 is provided with a structure in which a nozzle 32 and a diffuser 33 are coupled to both sides of a vacuum port 31. At this time, an orifice 36 is formed between the nozzle 32 and the diffuser 33, and when N 2 gas is supplied via the supply path 35, the gas is exhausted via the discharge path 34 of the diffuser 33, but the vacuum port 31. A gas flow (generated by a pressure difference between the orifice area and the outlet side of the discharge path; a Venturi effect) is formed in the vacuum port 31 by the orifice 36 to generate a negative pressure in the vacuum port 31. . Thereby, a vacuum pressure can be generated in the pressure vessels 21 and 22 communicated with the inflow passage 37.

  On the other hand, when a vacuum pressure is generated in the pressure vessels 21 and 22, a phenomenon that the slurry liquid flows into the vacuum port 31 sometimes occurs in the process of supplying the slurry to the pressure vessels 21 and 22. In order to prevent the slurry particles from flowing in through the vacuum port 31 and sticking to the orifice 36 or the discharge path 34 as in the conventional problem described above, the present invention further provides a centrifuge 40.

  FIG. 3 is a plan view showing a configuration of a centrifugal separator of a semiconductor slurry supply apparatus provided with a pipe clogging prevention means according to an embodiment of the present invention, and FIG. 4 is a pipe clogging prevention means according to an embodiment of the present invention. It is a side view which shows the structure of the centrifugation means of the slurry supply apparatus for semiconductors with which was provided.

  As shown in FIGS. 3 and 4, the centrifugal separator 40 is provided in a structure in which a slurry storage box 42 is provided on a cylindrical tube 46. At this time, a suction port 43 is formed on the side surface of the cylindrical body 46, and a discharge port 44 is formed in the upper part of the cylindrical body 46 perpendicular to the suction port 43. The suction port 43 is connected to the pressure vessels 21 and 22, and the discharge port 44 is connected to the vacuum generating means 30.

  Further, the cylindrical body 46 is configured to become narrower toward the lower end 41 and is configured such that an inclined surface 45 is formed on the inner peripheral surface. Thereby, since the width | variety of the cylinder 46 becomes narrow toward the lower part, a rotational acceleration is increased along the inclined surface 45 at the time of a vortex generation | occurrence | production. Of course, it is also possible to form the cylindrical body 46 into a cylindrical shape having the same vertical diameter.

  Further, a slurry storage box 42 is connected to the lower end 41 of the cylindrical body 46, and the slurry separated by centrifugal force is finally stored by being lowered by gravity. At this time, the slurry storage box 42 can be detached from the cylindrical body 46, and the stored slurry can be easily processed.

  The operation of the centrifugal separator 40 having such a structure is as follows. First, when slurry is introduced together with compressed air through the suction port 43, a spiral (cyclonic phenomenon) is caused along the inner peripheral surface of the cylindrical body 46. Compressed air escapes through the outlet 44. As shown in FIG. 3, the suction port 43 is provided on the side edge of the cylindrical body 46, and the suction port 43 and the discharge port 44 are arranged perpendicular to each other, so that The sucked compressed air is accelerated along the inner peripheral surface of the cylindrical body 46 and has a flow that is exhausted through the discharge port 44 while causing a vortex (vortex).

  Thus, when the compressed air that has flowed into the cylinder 46 swirls, a relatively heavy slurry is pushed outward by centrifugal force. At this time, the slurry rotates along the inclined surface 45 of the cylindrical body 46, but the slurry settles (lowers) while rotating further toward the lower end 41 side by weight, and is eventually stored in the slurry storage device 42.

  On the other hand, pure compressed air (compressed air from which the slurry is separated) is concentrated on the center side of the cylindrical body 46 and flows into the vacuum generating means 30 through the discharge port 44. At this time, since the compressed air discharged through the discharge port 44 is discharged as pure compressed air containing no slurry, the clogging phenomenon that occurs when the slurry flows into and adheres to the vacuum generating means 30. Can be prevented in advance.

  Although the present invention has been illustrated and described with respect to specific embodiments, the present invention is not limited to the embodiments described above, and any person having ordinary knowledge in the technical field to which the present invention pertains will be claimed. The present invention can be implemented with various modifications without departing from the spirit of the technical idea of the present invention described in the above.

Claims (3)

In a semiconductor slurry supply apparatus for supplying a slurry in a polishing process at the time of manufacturing a semiconductor element,
A storage tank in which the slurry is stored;
A plurality of pressurized vessels each connected to the storage tank and receiving slurry supplied from the storage tank and discharged to the outside;
A vacuum generating means connected to the pressure vessel and generating a vacuum pressure on the pressure vessel;
Piping comprising: a centrifuge that is provided in a connecting line between the pressurized vessel and the vacuum generating means and separates foreign substances contained in the compressed air that is introduced from the compressed air by centrifugal force. A semiconductor slurry supply apparatus provided with clogging prevention means. The centrifuge means includes
A suction port connected to the pressurization vessel is formed on a side surface, and is formed of a cylindrical tube body in which an exhaust port is formed at a position perpendicular to the suction port.
2. The piping clogging prevention means according to claim 1, wherein the compressed air that has flowed into the suction port forms a spiral in the cylindrical body, and a heavy slurry is separated from the compressed air by centrifugal force. The semiconductor slurry supply apparatus. The cylinder is
It is formed so that the diameter becomes shorter toward the bottom,
The slurry supply apparatus for a semiconductor provided with pipe clogging prevention means according to claim 2, wherein a slurry storage box for storing the centrifuged slurry is provided at a lower portion of the cylindrical body.

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