JP2013518498A - Dielectric loading antenna and wireless communication device - Google Patents

Abstract

A backfire dielectric loaded antenna (1) includes an electrically insulating dielectric core (12) made of a solid material having a relative dielectric constant greater than 5, and a side portion of the core or on a side portion of the core A three-dimensional antenna element structure including at least one pair of elongated conductive antenna elements (10A-10D) provided adjacent to the core and a passage in the core from the core distal surface portion (12D) to the core proximal surface In the plane of the laminate substrate in the form of a feed structure in the form of an elongated laminate substrate (14) extending in the axial direction extending through the portion (12P) and a proximal extension integrally formed in the transmission line site. An antenna connection part (14C) whose width is made larger than the width of the passage and an impedance matching part for coupling the antenna element to the feed line are included.
[Selection] Figure 1B

Description

  The present invention relates to a dielectric loaded antenna having an electrically insulating dielectric core made of a solid material for operation at a frequency exceeding 200 MHz, and a radio communication apparatus incorporating the dielectric loaded antenna.

  Helical antennas typified by compact antennas for portable (portable) wireless communication devices such as mobile phones, satellite phones, handheld (handheld) positioning units, and mobile (movable) positioning units, for operation at UHF frequencies It is known to load dielectrically. The present invention is applicable in these fields as well as fields such as WiFi devices or wireless local area network devices, MIMO systems or multi-input / multi-output systems, and other transmit / receive wireless systems.

  Such antennas typically include a cylindrical ceramic core having a relative dielectric constant of at least 5 and the outer surface of the core encloses an antenna element structure in the form of a conductive spiral track. In the case of a so-called “backfire” antenna, an axial feeder is received in a hole extending through the core from the proximal transverse outer surface portion to the distal transverse outer surface portion of the core, and the conductor of the feeder is the core conductor. Coupled to the helical track through a conductive surface connection element on the distal transverse surface portion. Such antennas are disclosed in UK patent applications GB 2292638, GB 2309592, GB 2399948, GB 241566, GB 2445478, international application WO 2006/136809, and US application publication US 2008-0174512A1. These publications disclose antennas having one, two, three, or four pairs or groups of helical antenna elements. Each of WO 2006/136809, GB 2441566, GB 2445478, and US 2008-0174512A1 discloses an antenna with an impedance matching network including a printed circuit laminate substrate secured to a distal outer surface portion of a core, the matching circuit The net forms part of the coupling between the feeder and the helical antenna element. In each case, the feeder is a coaxial transmission line, its outer shield conductor has a connection tab that extends parallel to the axis through the vias of the laminated substrate, and its inner conductor likewise passes through each via. Extend. The antenna is assembled as follows. First, in order to construct an integral feeder structure, the distal end portion of the coaxial feeder is inserted into a via in the laminated substrate. The feeder with the laminated substrate is then inserted into the passage in the core from the distal end of the passage so that the feeder emerges from the proximal end of the passage and the laminated substrate abuts the distal outer surface portion of the core. insert. Next, a solder coated washer or ferrule is placed on the proximal end portion of the feeder to form an annular bridge between the outer conductor of the feeder and the conductive coating on the proximal outer surface portion of the core. Arrange around. This assembly is then passed through an oven where the solder paste pre-applied in place on the proximal and distal surfaces of the laminated substrate and the solder applied to the washer or ferrule as described above. (A) a connection between the feeder and the matching network, (b) a connection between the matching network and a surface connection element on the distal outer surface portion of the core, and (c) a feeder And a conductive layer on the proximal outer surface portion of the core. The assembly and fixing of the core feeder structure is therefore a three-step process: insertion, washer or ferrule placement, and heating. It is an object of the present invention to provide an antenna that is simpler to assemble.

According to a first aspect of the invention, there is provided a dielectric loaded antenna for operation at frequencies above 200 MHz,
Between a reverse distal surface portion and a proximal surface portion extending in a direction transverse to the axis of the antenna and a surface portion extending in the transverse direction, made of a solid material having a relative dielectric constant greater than 5 An electrically insulative dielectric core having an outer surface that includes an extending side portion, wherein the outer surface of the core defines an interior volume that is largely occupied by the solid material of the core; ,
A three-dimensional antenna element structure comprising at least a pair of elongated conductive antenna elements provided on or adjacent to a side portion of the core and extending from the core distal surface portion toward the core proximal surface portion When,
A feed structure in the form of an elongated laminated substrate extending in an axial direction, wherein the laminated substrate functions as a feed line that penetrates a passage in the core from the core distal surface portion to the core proximal surface portion. Including two transmission line parts and an antenna connection part in the form of a proximal extension integrally formed with the transmission line part, the width of which is larger than the width of the passage in the plane of the laminated substrate, A feed structure,
An impedance matching portion for coupling the antenna element to the feed line;
An antenna is provided. The use of an elongated laminated substrate extending in the axial direction as a feed structure has the advantage that it is relatively rigid compared to a coaxial feeder having a rigid metallic outer conductor. The increased width at the proximal extension of the transmission line site provides additional area for various connecting elements, as will be described later herein. Specifically, if necessary, a dedicated miniature connector assembly can be omitted. A preferred laminated substrate has at least first, second, and third conductive layers, and the second layer is an intermediate layer between the first layer and the third layer. In this way, the feed line has an elongated inner conductor formed by the second layer and an outer shield conductor formed by the first and third layers and overlapping the inner conductor from above and below, respectively. It is possible to build on. The shield conductors can then be connected to each other by interconnects located along lines parallel to the inner conductor on both sides of the inner conductor. These interconnects are preferably formed by a row of conductive vias between the first layer and the third layer. This has the effect of surrounding the inner conductor, and the transmission line section thereby has the characteristics of a coaxial line.

  In some embodiments of the present invention, the axially extending laminate substrate carries active circuit elements on the proximal extension. Thus, an RF front-end circuit such as a low noise amplifier may be mounted on the laminated substrate, for example using surface mounting, and the input conductor of the element is coupled to the conductor of the feed line. Alternatively, when the antenna is used for transmission, the substrate can be equipped with an RF power amplifier, or when used in a transceiver, it can be equipped with both a power amplifier and a switch. It is also possible to incorporate further active circuit elements, such as GPS receiver chips or other RF receiver chips (and thus to circuits with low frequency (eg less than 30 MHz) or digital output) or transceiver chips. Particularly in such embodiments, the laminated substrate may have an additional conductive layer. This allows the antenna to be connected to the host device without the use of a dedicated connector that can handle radio frequency signals. The dimensional limitations imposed by the RF connection are also avoided in this case. The laminated substrate is thus a single unit for any circuit element such as one or more active circuit elements or matching components described above that form part of the antenna assembly provided as a finished product. Can serve as a carrier.

In one embodiment of the invention, however, the impedance matching site is mounted on the second laminated substrate and its conductor is coupled to the feed line. In this embodiment, the second laminated substrate is oriented perpendicular to the axially extending laminated substrate and has an opening therein for receiving a distal end portion of the axially extending laminated substrate. The impedance matching site preferably includes at least one reactive matching element in the form of a shunt capacitor connected between the inner conductor of the feed line and the shield conductor at the distal end of the feed line. A series inductance may be coupled between one of the feedline conductors and at least one of the elongated antenna elements. While the capacitance is preferably a surface mounted discrete capacitor, the inductance is formed as a conductive track between the capacitor and one of each elongated antenna element pair.

  A preferred antenna can be used as a dual service antenna. Thus, in the case of a quadrifilar (4-wire) helical antenna according to the present invention, the antenna is not only a quadrifilar resonance that generates an antenna radiation pattern for circularly polarized radiation, but also a quasi-monopolar resonance for linearly polarized signals. It is common to have also. Quadrifilar resonance produces a cardioid (heart-shaped) radiation pattern around the antenna axis and is therefore suitable for transmitting or receiving satellite signals, whereas quasi-monopolar resonance is A symmetrical toroidal (doughnut) radiation pattern is generated across the antenna axis and is therefore suitable for transmission and reception of terrestrial linearly polarized signals. One preferred antenna with these characteristics has a quadrifilar resonance in the first frequency band associated with the GNSS signal (eg, GPS-L1 frequency 1575 MHz) and is used by Bluetooth and WiFi systems. Has a quasi-monopolar resonance in the 2.45 GHz ISM (industrial, scientific, medical).

  When dual service operation is considered, the impedance matching site includes a series combination of two inductances between the first conductor of the feed line and one of each conductive antenna element pair, and the first And a second shunt capacitance. The first shunt capacitance is connected as described above, i.e., between the first conductor of the feed line and the second conductor of the feed line. The second shunt capacitance is one between the second conductor of the feed line and one or more elongated conductive antenna elements, and the other is a first inductance and a second inductance. Connected between links, as a divide between.

  In the antenna described below, using an elongated laminated substrate for the feeder includes one or more that determines the frequency of the quasi-monopolar resonance when dual service operation of the antenna is required. There is a particular advantage that the outer shield conductor forms part of the conductive loop. Specifically, the electrical length of the shield conductor of the feed line depends, among other parameters, on the width of the shield conductor. This means that the quasi-monopolar resonant frequency can be selected, if necessary, substantially independently of the parameter that provides the circularly polarized resonant frequency. Circularly polarized light can be provided by a quadrifiller, as shown in the figure, or by any other multifiller. In fact, the antenna is adaptable to a manufacturing process in which an elongated laminated substrate with shield conductors of varying widths is provided, which process for each antenna is a shield conductor of a specific width according to the intended use of the antenna. Selecting an elongated laminated substrate with The same selection process can be used to reduce resonant frequency variations that occur due to related dielectric constant variations among different antenna core populations made from different lots of ceramic material.

  The elongated laminated substrates are preferably arranged symmetrically in a passage that penetrates the antenna core. Therefore, in the case of a passage having a circular cross section, the laminated substrate is preferably positioned on the diameter. This aids the symmetrical behavior of the shield conductor in the quasi-monopolar resonant mode. It should be noted that the passage through the core of the preferred antenna is not plated. Further, the inner conductor of the transmission line portion is preferably positioned in the center between the shield conductors in order to avoid asymmetric field concentration in the feed line. It is also preferable that the multilayer substrate and the conductor region thereon are symmetrical in the lateral direction (that is, symmetrical in the plane of the multilayer substrate conductive layer).

According to a second aspect of the invention, a dielectric loaded antenna for operation at frequencies above 200 MHz is
Between a reverse distal surface portion and a proximal surface portion extending in a direction transverse to the axis of the antenna and a surface portion extending in the transverse direction, made of a solid material having a relative dielectric constant greater than 5 An electrically insulative dielectric core having an outer surface including a side portion extending into the core, wherein the outer surface of the core defines an internal volume that is largely occupied by the solid material of the core Body core,
A three-dimensional antenna element structure comprising at least a pair of elongated conductive antenna elements provided on or adjacent to a side portion of the core and extending from the core distal surface portion toward the core proximal surface portion When,
An axially laminated substrate housed in a passage extending through the core from a core distal surface portion to a core proximal surface portion, comprising first, second and third conductive layers. The second layer is sandwiched between the first layer and the third layer, and the laminated substrate has a transmission line portion functioning as a feed line and an integrated remote connecting the feed line to the antenna element. A laminated substrate including a position side impedance matching portion;
And the second layer forms an elongated inner conductor of the feed line, the first layer and the third layer form an elongated shield conductor, the shield conductors being wider than the inner conductor. , Interconnected along their elongated edge portions. Preferably, the antenna includes a trap element that connects at least some proximal ends of the elongated conductive element and is coupled to the feed line in the region of the proximal surface portion of the core. In the quasi-monopolar resonant mode, a current is formed between the feedline conductors by at least one of the elongated antenna elements, the trap element, and one or more outer surfaces of the feedline shield conductors. Flowing through the conductive loop. In this case, the quasi-unipolar resonance mode is a fundamental frequency at a resonance frequency higher than the frequency of the quadrifilar resonance.

  A preferred elongate laminated substrate has a substantially constant width transmission line portion, i.e. formed as a constant width strip, and the passage through the core has a strip edge by the wall of the passage or in the passage. It has a circular cross section with a diameter that is at least approximately equal to the width of the strip so that it is supported in a longitudinally opposed longitudinal groove.

According to a third aspect of the present invention, there is provided a wireless communication device comprising an antenna and wireless communication circuit means connected to the antenna and operable in at least two radio frequency bands above 200 MHz,
The antenna is
Between a reverse distal surface portion and a proximal surface portion extending in a direction transverse to the axis of the antenna and a surface portion extending in the transverse direction, made of a solid material having a relative dielectric constant greater than 5 An electrically insulative dielectric core having an outer surface that includes an extending side portion;
A feeder structure that penetrates substantially through the core from the distal surface portion to the proximal surface portion and is positioned on or adjacent to the outer surface of the core;
A plurality of elongated conductive antenna elements coupled to a feed connection of the feeder structure in the region of the core distal surface portion and a conductive trap element having a ground connection to the feeder structure in the region of the core proximal surface portion. A combination of series,
Including
The wireless communication circuit means has two parts each operable in the first and second radio frequency bands, and each part is between the common signal line of the antenna feeder structure and each circuit means part. Associated with each signal line to convey the flowing signal,
The antenna resonates in the first circular polarization resonance mode in the first frequency band and in the second linear polarization resonance mode in the second frequency band, and the second frequency band is higher than the first frequency band. A device is provided in which the first and second resonance modes are the fundamental resonance modes. The wireless communication circuit means may be operable in further circular and linear polarization resonance modes of the antenna.

  The first and second frequency bands have respective center frequencies, and the center frequency of the second frequency band is higher than the first center frequency but lower than twice the first center frequency. preferable.

According to a fourth aspect of the present invention, there is an antenna for operation at a frequency exceeding 200 MHz,
Between a reverse distal surface portion and a proximal surface portion extending in a direction transverse to the axis of the antenna and a surface portion extending in the transverse direction, made of a solid material having a relative dielectric constant greater than 5 An electrically insulative dielectric core having an outer surface that includes an extending side portion, wherein the outer surface of the core defines an interior volume that is largely occupied by the solid material of the core; ,
A three-dimensional antenna element structure comprising at least a pair of elongated conductive antenna elements provided on or adjacent to a side portion of the core and extending from the core distal surface portion toward the core proximal surface portion When,
An axially laminated substrate housed in a passage extending through a core from a core distal surface portion to a core proximal surface portion, having at least a first layer and functioning as a feedline A laminated substrate including a transmission line portion including at least first and second feed line conductors, and a feed connection element for coupling the feed line to the antenna element;
And the multilayer substrate further includes a transmission line having an active circuit element coupled to the feed line conductor on one side and a ground plane electrically connected to one of the feed line conductors on the other side. An antenna is provided that includes a proximal extension of the site.

According to a fifth aspect of the invention, a dielectric loaded antenna for operation at frequencies above 500 MHz is
Between a reverse distal surface portion and a proximal surface portion extending in a direction transverse to the axis of the antenna and a surface portion extending in the transverse direction, made of a solid material having a relative dielectric constant greater than 5 An electrically insulative dielectric core having an outer surface that includes an extending side portion, wherein the outer surface of the core defines an interior volume that is largely occupied by the solid material of the core; ,
A three-dimensional antenna element structure comprising at least a pair of elongated conductive antenna elements provided on or adjacent to a side portion of the core and extending from the core distal surface portion toward the core proximal surface portion When,
A feed structure in the form of an axially elongated laminate substrate including at least one transmission line portion that functions as a feed line that penetrates a passage in the core from the core distal surface portion to the core proximal surface portion;
A plurality of spring contacts positioned proximal to the antenna core, electrically connected to the feed line, and when the device stacked circuit board is positioned in a preselected position adjacent to the antenna; A plurality of spring contacts constructed and arranged to elastically lean against a contact area formed as one or two conductive layers;
Is provided. The spring contact is preferably a metal leaf spring shaped to elastically deform in response to a compressive force directed in the axial direction of the antenna. Such elastic deformation can occur when the antenna is brought to a position where it is juxtaposed on a device circuit board having a surface perpendicular to the antenna axis. Base plating on the proximal surface portion of the preferred antenna core provides a metal fixed base for spring contact, for example by soldering.

  Alternatively, the metal leaf spring contact responds to a compressive force directed in the transverse direction of the antenna axis, for example when the antenna is brought in a position juxtaposed to an equipment circuit board having a plane parallel to the antenna axis. And can be shaped to deform.

  The spring contact is connected to the feedline conductor when soldered to the base conductor of the elongated laminated substrate. Such a spring contact has an intermediate contact connected to the inner conductor of the feed line and a first and third contact connected to the shield conductor of the feed line, It is preferable that three are arranged in parallel on the top.

  Each spring contact is shaped to have a fixing leg for fixing to the conductive base on the laminated substrate and a contact leg for engaging a contact area on the device circuit board to which the antenna is connected. It is preferably in the form of a folded metal spring element. The elasticity of the material of the spring element allows for elastic deformation due to the relative proximity of the two legs of the spring element in response to the application of a force that urges the contact leg toward the fixed leg.

  The present invention also provides a wireless communication unit including an equipment circuit board, an antenna as described above, and a circuit board and a housing for the antenna. When the antenna and the circuit board are mounted in the housing, the unit is configured so that the spring contact is elastically leaning against the contact area formed as one or more conductive layers of the equipment circuit board. Arranged to connect to the circuit board. The housing is preferably two-part and has an antenna entry shaped to position the antenna at least axially.

  In accordance with another aspect of the present invention, a method for assembling the above wireless communication unit is provided, the apparatus further comprising a two-part housing for the antenna and the equipment circuit board, the housing receiving the antenna. The antenna is shaped to position the antenna in a preselected position with respect to the circuit board, in which the spring contacts are aligned with the respective contact areas on the equipment circuit board to contact them. Leaning on the area, the method includes securing the circuit board in the housing, installing the antenna in the yard, and combining the two parts of the housing into an assembled state. The act of merging the two parts urges the spring contact towards the respective contact area on the equipment circuit board, thereby compressing the spring contact. To deform. The two parts of the housing are preferably snapped together.

According to yet another embodiment of the present invention, a wireless communication device is
(A) a backfire dielectric loaded antenna for operation at frequencies above 200 MHz,
Between a reverse distal surface portion and a proximal surface portion extending in a direction transverse to the axis of the antenna and a surface portion extending in the transverse direction, made of a solid material having a relative dielectric constant greater than 5 An electrically insulative dielectric core having an outer surface that includes an extending side portion, wherein the outer surface of the core defines an interior volume that is largely occupied by the solid material of the core; ,
A three-dimensional antenna element structure comprising at least a pair of elongated conductive antenna elements provided on or adjacent to a side portion of the core and extending from the core distal surface portion toward the core proximal surface portion When,
A feed structure in the form of an axially elongated, laminated substrate including at least one transmission line portion that functions as a feed line that penetrates a passage in the core from a core distal surface portion to a core proximal surface portion. The antenna has an exposed contact area on or adjacent to the core proximal surface portion;
Including an antenna,
(B) a wireless communication circuit means, comprising a device laminated circuit board with at least one conductive layer, wherein the one or more conductive layers have a plurality of contact terminal support regions; Each of the support areas is electrically connected to a respective spring contact positioned so as to resiliently lean against each of the exposed contact areas of the antenna; and wireless communication circuit means;
Is provided. In one embodiment, the exposed contact area of the antenna is parallel to the plane of the device laminate circuit board, and each spring contact is shaped to exert an engaging force that acts perpendicular to the plane of the equipment circuit board. In another embodiment, the exposed contact area of the antenna is perpendicular to the antenna axis. In this case, the spring contact is a compressive force oriented generally in the axial direction of the antenna, whether the antenna is turret-mounted or edge-mounted to the equipment circuit board. It can be shaped to elastically deform in response to

  One option for connecting the antenna to the equipment circuit board using elastic spring contact is to leave an isolated conductor land, i.e. part of the trap or balun, on the proximal end surface portion of the antenna core. Providing a conductor layer patterned so as to provide a land of conductors isolated from the portion of the conductor. This land, and the rest of the conductive layer, serves as a conductor base for attaching the respective folded elastic contacts or as a base for conductive plates that form contact areas that engage spring contacts on the equipment circuit board. Each can be used. If the spring contact is fixed to the proximal conductive layer of the antenna, such contact is to the contact area on the elongated laminate substrate, especially to the contact areas on both sides of the proximal extension of the transmission line site. In addition, an elastic connection without soldering can be provided. This is due to the soldering connection between the laminated board and the equipment circuit board in the case of mounting the antenna turret or in other connection configurations where the spring contact exerts a contact strength acting in the axial direction of the antenna. Eliminate the need for

  Similar to when spring contacts are implemented on the antenna, such spring contacts engage three correspondingly spaced contact regions on one side of the proximal extension of the elongated antenna laminate. Therefore, it is preferable that three are mounted in parallel on the device circuit board.

According to another aspect, the present invention is a backfire dielectric loaded antenna for operation at frequencies above 200 MHz, comprising:
Between a reverse distal surface portion and a proximal surface portion extending in a direction transverse to the axis of the antenna and a surface portion extending in the transverse direction, made of a solid material having a relative dielectric constant greater than 5 An electrically insulative dielectric core having an outer surface that includes an extending side portion, wherein the outer surface of the core defines an interior volume that is largely occupied by the solid material of the core; ,
A three-dimensional antenna element structure comprising at least a pair of elongated conductive antenna elements provided on or adjacent to a side portion of the core and extending from the core distal surface portion toward the core proximal surface portion When,
A feed structure including first and second feed conductors extending axially through a passage in the core from the core distal surface portion to the core proximal surface portion;
The core proximal surface portion has a conductive coating patterned to form at least two conductive regions electrically isolated from each other, and the antenna is further proximal to the passage At the ends, it includes electrical connections between each feed conductor and each of the conductive regions on the core proximal surface portion, such an arrangement thereby causing the antenna axis to be perpendicular to the host equipment substrate. An antenna is provided that provides at least one pair of planar contact surfaces on the core proximal surface portion for mounting the antenna to a host equipment substrate.

According to a further aspect of the method, the present invention provides a method of assembling a wireless communication device according to any preceding claim. The apparatus further includes a two-part housing for the antenna and the equipment circuit board, the housing having a receptacle shaped to receive the antenna and position the antenna in a preselected position relative to the circuit board. In its preselected position, the spring contacts are aligned with the respective contact areas of the antenna and lean against those contact areas, and the method includes securing the circuit board in the housing and placing the antenna in place. The act of merging the two parts urges the spring contact towards the respective contact area on the antenna, including installing the two parts of the housing into an assembled state. , Thereby compressing and deforming the spring contact.

  The invention will now be described by way of example with reference to the drawings.

It is an assembly perspective view of the 1st antenna. It is a disassembled perspective view of a 1st antenna. 1B is a circuit diagram of a unipolar matching network for the antenna of FIGS. 1A and 1B. FIG. 1B is a circuit diagram of a bipolar matching network for the antenna of FIGS. 1A and 1B. FIG. 1B is a perspective view of a part of a wireless communication unit including the antenna of FIGS. 1A and 1B. FIG. FIG. 3 is a perspective view illustrating a series of assembly steps of the wireless communication unit of FIG. 2. FIG. 3 is a perspective view illustrating a series of assembly steps of the wireless communication unit of FIG. 2. FIG. 3 is a perspective view illustrating a series of assembly steps of the wireless communication unit of FIG. 2. FIG. 3 is a perspective view illustrating a series of assembly steps of the wireless communication unit of FIG. 2. FIG. 3 is a perspective view illustrating a series of assembly steps of the wireless communication unit of FIG. 2. FIG. 3 is a perspective view illustrating a series of assembly steps of the wireless communication unit of FIG. 2. It is an assembly perspective view of the 2nd antenna. It is a disassembled perspective view of a 2nd antenna. It is an assembly perspective view of the 1st antenna assembly. It is a disassembled perspective view of a 1st antenna assembly. It is an assembly perspective view of the 2nd antenna assembly. It is a disassembled perspective view of a 2nd antenna assembly. It is an assembly perspective view of the 3rd antenna. It is a disassembled perspective view of a 3rd antenna. It is an assembly perspective view of the 4th antenna. It is a disassembled perspective view of a 4th antenna. It is various figures which showed the 5th antenna and its parts. It is various figures which showed the 5th antenna and its parts. It is various figures which showed the 5th antenna and its parts. It is various figures which showed the 5th antenna and its parts. It is various figures which showed the 5th antenna and its parts. It is various figures which showed the 5th antenna and its parts. It is an assembly perspective view of the 6th antenna. It is a disassembled perspective view of a 6th antenna. It is a one part perspective view of the radio | wireless communication unit containing a 6th antenna. FIG. 10 is a perspective view of an alternative wireless communication unit including a sixth antenna. It is an assembly perspective view of the 7th antenna. It is a disassembled perspective view of a 7th antenna. FIG. 6 is an assembled perspective view of a further antenna. It is a disassembled perspective view of the further antenna. It is the figure which looked at the surface of the head connector of the 3rd layered substrate from the proximal side. It is a perspective view of a plug type head connector. It is a perspective view of a plug type head connector. FIG. 6 illustrates various stages of a manufacturing process according to an embodiment of the present invention. FIG. 6 illustrates various stages of a manufacturing process according to an embodiment of the present invention. FIG. 6 illustrates various stages of a manufacturing process according to an embodiment of the present invention. FIG. 6 illustrates various stages of a manufacturing process according to an embodiment of the present invention. FIG. 6 illustrates various stages of a manufacturing process according to an embodiment of the present invention. 5 is a flowchart according to an embodiment of the present invention. It is a perspective view of a multilayer substrate feed structure.

  Referring to FIGS. 1A and 1B, an antenna according to a first aspect of the present invention has four shafts plated or otherwise metallized on the cylindrical outer surface of a cylindrical ceramic core 12. It has an antenna element structure with spiral trajectories 10A, 10B, 10C, 10D having the same extent in the direction. The dielectric constant of the core ceramic material is typically greater than 20. A material based on barium samarium titanate having a relative dielectric constant of 80 is particularly suitable.

  The core 12 has an axial passage in the form of a hole 12B through the core from the distal end surface portion 12D to the proximal end surface portion 12P. These surface portions are both flat surfaces extending in a direction perpendicular to the central axis 13 of the core. These are reversed in the sense that one faces the distal side and the other faces the proximal side. Housed in the hole 12B are a transmission line portion 14A, a matching network connection portion 14B, and an antenna connection portion in the form of an extension formed integrally on the distal and proximal sides of the transmission line portion. 14C is a feeder structure in the form of an elongated laminated substrate 14 having 14C.

  The laminated substrate 14 has three conductive layers, and only one of them is visible in FIG. 1B. The first conductive layer is exposed on the upper surface 14U of the substrate 14. Similarly, the third conductive layer is exposed at the lower surface 14L of the laminated substrate 14, and the second intermediate conductive layer is intermediate between the first conductive layer and the third conductive layer. It is embedded in the insulating material of the laminated substrate 14. In the transmission line portion 14A of the multilayer substrate 14, the second intermediate conductive layer forms an inner feed conductor (not shown) in the form of a narrow and narrow track running in the center along the transmission line portion 14A. The upper and lower layers of the inner conductor are wider and narrower conductive tracks formed by the first and third conductive layers, respectively. These wider tracks form upper shield conductor 16U and lower shield conductor 16L to shield the inner conductor.

  The shield conductors 16U and 16L are connected to each other by plating vias 17 positioned along a line parallel to the inner conductor on both sides of the inner conductor. These vias are spaced from their longitudinal edges of the inner conductor so that they are separated from the longitudinal edges of the inner conductor by the insulating material of the laminated substrate 14. It is understood that the combination of the elongated track formed in the transmission line portion 14A by the three conductive layers and the interconnecting via 17 forms a coaxial feedline having an inner conductor and an outer shield, The outer shield is constituted by an upper conductive track 16U and a lower conductive track 16L, and a via 17. In general, the characteristic impedance of this coaxial feedline is 50 ohms.

  In the distal extension 14B of the laminated substrate 14, the inner conductor (not shown) is coupled to the exposed upper conductor 18U by an inner conductor distal via 18V. Similarly, there is an exposed connecting conductor 18L (not shown in FIG. 1B) that is an extension of the lower shield conductor 16L on the lower surface of the distal extension 14B.

In the proximal side extension 14 </ b> C of the multilayer substrate 14, the inner conductor (not shown) is connected to the exposed central contact region 18 </ b> W on the upper surface 14 </ b> U of the multilayer substrate 14. This contact area 18W is connected to the inner conductor by a proximal via 18X. In the same upper laminated substrate layer 14U, there are two exposed outer contact areas 16V, 16W disposed on both sides of the central contact area 18W. These three contact areas in parallel jointly constitute a contact set for connecting the assembled antenna to a spring contact on the device motherboard, for example, as described below.

  The antenna connection portion 14C of the multilayer substrate 14 has a rectangular shape, and the width of the rectangle is such that the multilayer substrate 14 is inserted into the core 12 from the proximal end of the core 12 of the antenna 1 during assembly. The connecting portion 14C is larger than the transmission line portion 14A having parallel sides so that the antenna connecting portion is exposed on the proximal side by contacting the proximal end surface portion 12P of the antenna core 12.

  The length of the laminated substrate 14 is such that when the antenna connection portion abuts the proximal end surface portion 12P, the matching network connection portion 14B protrudes from the hole 12B by a short distance at the distal end of the hole 12B. . The width of the transmission line site generally corresponds to the diameter of the hole 12B (circular in cross section) so that the outer shield conductors 16U, 16L are separated from the ceramic material of the core 12. (Note that the holes 12B are not plated.) Therefore, the dielectric loading of the shield conductors 16U, 16L with the ceramic material of the core 12 is minimal. In this embodiment, the dielectric constant of the insulating material of the laminated substrate is about 4.5.

  The positioning of the laminated substrate 14 in the angular direction is assisted by a longitudinal groove 12BG in the hole 12B, as shown in FIG. 1B.

  Plated on the core proximal end surface portion 12P is a surface connecting element formed as a radial track 10AR, 10BR, 10CR, 10DR. Each surface connecting element extends from the distal end of the respective spiral track 10A-10D to a location adjacent to the end of the hole 12B. It can be seen that the radial trajectories 10AR-10DR are interconnected by arcuate conductive links such that the four helical trajectories 10A-10D are interconnected in pairs at their distal ends. .

  The proximal ends of the antenna elements 10 </ b> A to 10 </ b> D are connected to a common virtual ground conductor that takes the form of a plating sleeve 20 that surrounds the proximal end portion of the core 12. The sleeve 20 extends to a conductive coating (not shown) on the proximal end surface portion 12P of the core.

  Overlying the distal end surface portion 12D of the core 12 is a second laminated substrate 30 in the form of a generally square tile positioned centrally with respect to the axis 13. Its cross-sectional extent is such that it overlaps the inner ends of the radial tracks 10AR, 10BR, 10CR, 10DR and their corresponding arcuate interconnections. The second laminated substrate 30 has one conductive layer on the back side thereof, that is, on the side facing the distal end surface portion 12D of the core. This conductive layer performs feed connection and antenna element connection for coupling the conductive layers 16U, 16L, and 18 of the transmission line portion 14A to the antenna elements 10A to 10D through the conductive surface connection elements 10AR to 10DR in the core surface portion 12D. provide. The laminated substrate conductive layer is also an impedance matching circuit for matching the impedance indicated by the antenna element structure with the characteristic impedance (50 ohms) of the transmission line portion 14A in cooperation with the surface mount capacitor on the back side (not shown). Configure the net.

A circuit diagram of the impedance matching network is shown in FIG. 1C. As shown in FIG. 1C, the impedance matching network includes a shunt capacitance C connected to the feedline conductors 16, 18, and one of the feedline conductors 18 and the radial shape of the antenna represented by the load or source 36. Having a series inductance between the elements 10A-10D, another one of the feedline conductors 16 is connected directly to the other side of the load / source 36. In this regard, the interconnection between the feed line and the antenna elements 10A-10B is electrically the same as that disclosed in WO 2006/136809, the contents of which are incorporated herein by reference. The connection between the second laminated substrate 30 and the conductor in the proximal end surface portion 12D of the core is the UK patent application serial number of the present application which is also a continuation application of this application, the contents of which are also incorporated herein by reference. It is made up of a ball grid array 32 as described in 0914440.3.

  As shown in FIG. 1A, the second laminated substrate 30 has a central slot 34 for receiving the protruding matching network connection portion 14B of the elongated laminated substrate 14, and the upper conductive region 18U and the second conductive region 18U in the laminated substrate 14 are provided. Solder connection is made between conductive regions including conductors of a conductive layer (not shown) on the back side of the multilayer substrate 30.

  In the assembled antenna, the proximal extension 14C of the laminated substrate 14 abuts the plated proximal end surface portion 12P of the core, and during assembly of the antenna, the first and third exposed contact regions 16V, 16W ( Is electrically connected to the plating surface portion 12P.

  The above-described components and their interconnections produce a dielectric loaded quadrifilar helical antenna that is electrically similar to the quadrifilar antenna disclosed in the above prior patent publication. Therefore, the plating layer (not shown) on the conductive sleeve 20 and the proximal end surface portion 12P of the core 12 is connected to the antenna connection destination at the time of mounting in cooperation with the feed line shield formed by the shield conductors 16U and 16L. A quarter-wave balun that provides common mode isolation of the antenna element structures 10A-10D from the device to be formed. The metallized conductor elements formed by antenna elements 10A-10D, and other metallized layers on the core, define a front volume that is largely occupied by the core dielectric material.

  In this case, the antenna has a circularly polarized resonance mode at 1575 MHz, which is the GPS L1 frequency.

  In this circularly polarized resonance mode, the ¼ wavelength balun is in the core so that the antenna element, the rim 20U of the sleeve 20 and the radial trajectories 10AR-10DR form a conductive loop that defines the resonant frequency. It functions as a trap for preventing a current flow from the antenna elements 10A to 10D to the shield conductors 16U and 16L in the proximal end surface portion 12P. Thus, in the circular polarization resonant mode, current flows from one of the feedline conductors, for example, through the first helical antenna element 10A, around the rim 20U of the sleeve 20, and oppositely located helical antenna element 10C. To return to another feedline conductor.

  The antenna also exhibits a linearly polarized resonant mode. In this mode, current flows through different conductive loops that interconnect the feedline conductors. More specifically, in this case, there are four conductive loops, each in turn, one of the radial tracks 10AR-10DR, the associated helical antenna elements 10A-10D, and the sleeve 20 (axis 13 ), The plating on the proximal end surface portion 12P, and the outer surface of the feedline shield formed by the shield conductors 16U, 16L and their interconnect vias 17. (Note that the current flowing through the feed line formed by the transmission line portion 14A flows inside the shield formed by the shield conductors 16U and 16L). The length of the feed line, and therefore the length of the shield conductors, their width, and their proximity to the ceramic material of the core 12 determine the frequency of this linear polarization resonance.

Since the dielectric loading of the shield conductors 16U, 16L by the ceramic material of the core 12 is relatively small, the electrical length of the conductive loop in this case is the average of the conductive loops that are active in the circular polarization resonant mode. Shorter than the typical electrical length. Therefore, the linear polarization resonance mode is centered on a higher frequency than the circular polarization resonance mode. The linear polarization resonance mode is
A toroidal radiation pattern, ie a radiation pattern about the antenna axis 13, has been associated. This is therefore particularly suitable for receiving terrestrial vertical polarization signals when the antenna is in a direction with its axis 13 substantially vertical.

  Adjustment of the resonance frequency of the linear polarization mode can be achieved substantially independently of the resonance frequency of the circular polarization mode by changing the width of the shield conductor tracks 16U and 16L. In this example, the resonance frequency of the linear polarization mode is 2.45 GHz (that is, in the ISM band).

  When dual frequency operation is required, the matching network is preferably a bipolar network, as shown in FIG. 1D.

  Building the feeder structure as an elongated laminated substrate makes the connection of the antenna to the host equipment particularly economical. Referring to FIG. 2, when the antenna 1 is connected to a circuit element on the circuit board 40 of the device, a direct connection between the antenna feed line and the circuit board 40 whose surface is oriented parallel to the antenna axis. Electrical connection is achieved by placing the metal spring contacts 42 in parallel with the circuit board edge 40E in parallel and at intervals of the contact areas 16V, 18W, 16W (FIG. 1B) at the antenna connection site 14C of the elongated antenna laminate board 14. Therefore, it can be achieved by conductive mounting so as to be spaced apart. The spring contact 42 is positioned according to the position of the antenna connection portion 14 </ b> C when the antenna is mounted at a required position with respect to the circuit board 40.

  Each spring contact includes a fixed leg 42L fixed to a respective conductor (not shown) on the circuit board 40 and a fixed leg 42L so as to approach the fixed leg 42L when a force perpendicular to the surface of the board 40 is applied. A metal leaf spring having a folded configuration with a contact leg 42U extending upward from but away from the fixed leg 42L. Accordingly, as shown in the figure, when the antenna 1 is brought into a position where it is juxtaposed to the circuit board 40 with the contact regions 16V, 18W, 16W (FIG. 1B) being combined with the contact spring 42, the spring contact Is elastically deformed and leans against their respective contact areas 16V, 18W, 16W, making an electrical connection between the antenna 1 and the circuit elements of the circuit board 40.

  It is noted that there is no separate connector device between the antenna and the circuit configuration of the circuit board 40. Rather, each spring contact 42 is individually and separately attached to the circuit board 40 in a manner similar to surface mount components.

  This configuration is adaptable to a simple device assembly process, as shown in FIGS. Referring to FIGS. 3A-3F, a typical assembly process first involves placing the circuit board 40 in the first equipment housing part 50A (FIGS. 3A and 3B). Next, the antenna 1 is introduced into a molded antenna entry 52 in the housing part 50A (FIGS. 3C and 3C), and as shown in detail in FIG. It leans against the spring contact 42 on the circuit board 40. Next, a second housing part 50B having an inner surface that is also shaped to engage the antenna 1 is mated with the housing part 50A initially mentioned. This urges the antenna 1 into the entry 52 in the housing part 50A, and the spring contact 42 is deformed in this process of closing the housing (FIG. 3E). The two housing parts 50A, 50B have snap features so that the final closing movement involves a snap-fit of the two housing parts.

The support and positioning of the antenna 1 by the two housing parts 50A, 50B is shown in the cross section of FIG. 3D. The entry 52 and, if necessary, the opposite entry in the housing cover part 50B are shaped to position the antenna in the axial direction as well as in the direction transverse to the antenna axis. Also, the configuration of the interconnection between the antenna and the circuit board provides a simple and inexpensive assembly process, as well as between the antenna and the circuit board 40 without breaking the connection made by the spring contact 42. It is noted that it allows axial movement at. This is because even if the device is subjected to a strong impact (for example, when a handheld wireless communication unit is dropped), the lack of rigid coupling between the antenna 1 and the circuit board 40, for example, Solder joint between the elongated laminated substrate 14 and the second laminated substrate 30 (FIGS. 1 and 2) on which the matching circuit network is mounted, the laminated substrate 30 mounted in the transverse direction, and the distance from the antenna core. This has the advantage of avoiding distortions exerted on the solder joint, such as a solder joint with the plated conductor on the upper end surface portion 12D.

  4A and 4B, a second antenna according to the present invention has a spring contact 42 mounted on an antenna connection portion 14C protruding to the proximal side of the elongated laminated substrate 14. Similar to the system described above with reference to FIG. 2, the spring contacts are metal leaf springs, each with a fixed leg and a contact leg. In this case, the fixed legs are individually and separately soldered to the respective contact areas 16V, 18W, 16W of the antenna connection portion 14C. The circuit board (not shown) of the device is provided with a correspondingly spaced contact area so that the spring contact 42 is compressed when the antenna 1 is pushed into its required position with respect to the circuit board. This configuration provides the same advantages as outlined above for the unit of FIG.

  Referring to FIGS. 5A and 5B, the construction of the feedline laminate substrate also provides the possibility of integral support for active circuit elements such as the RF front end low noise amplifier 60. In this case, the laminated substrate 14 has a larger proximal extension 14 </ b> C, and the feed line conductor (not shown) of the transmission line portion 14 </ b> A is directly connected to the input of the low noise amplifier 60. The output of the amplifier is coupled directly to the exposed contact area 62, as shown in FIGS. 5A and 5B, for connection to the circuit board of the instrument using spring contacts, as described above with reference to FIG. can do. Positioning of the laminated substrate 14 in the hole 12B (see FIG. 5B) of the antenna core 12 is assisted by the spring biasing elements 64 on both sides of the laminated substrate 14. These lean against the wall of the hole 12B to help center the substrate 14 relative to the shaft 13. In this case, the direct connection of the feedline conductor of the feedline to the radial track on the proximal end surface portion 12P (not shown) is in contact with the distal contact area on the distal extension 14B of the laminated substrate 14. It can be realized by a planar conductive ear, ie a contact plate 66, which is in contact and soldered to the radial track.

  Further expansion of the laminated substrate 14 as shown in FIGS. 6A and 6B is that the antenna assembly in which the feed line feeds directly to the low noise amplifier 60, in turn, is also a proximal extension of the laminated substrate 14. It is possible to supply the receiver chip 68 mounted on the part 14B. This economical assembly has a connection between the laminate substrate 14 and the circuit board of the device, such as a separate connector 70 as shown in FIGS. 6A and 6B, or a flexible printed circuit laminate, or FIG. Which has the potential advantage of eliminating high frequency currents in such a connection, whether made by any of the spring contact configurations described above with reference to FIG. Also, the fact that all the circuit configurations are on a common continuous ground plane on the multilayer substrate 14 means that common mode noise coupling from the noise radiation circuit configuration on the circuit board of the device to the circuit configuration on the multilayer substrate 14 is achieved. Reduce.

An alternative to the conductive ear 66 as described above with reference to FIG. 5B as a means of connecting the feedline conductor to the radial track on the distal end surface 12P of the core is shown in FIGS. 7A and 7B. As such, spring contact may be used. Each of these spring contacts includes a planar connection base for soldering to a conductive layer on the distal end face 12D, and a hole 12B on both sides of the elongated laminated substrate 14 and the distal side of the transmission line portion 14A. And a drooping curved spring portion that contacts a distal contact region on the extension 14B. This allows an impact resistant interconnection between the feed line 14 and the antenna elements 10A-10B.

  The distal connection of the feedline to the distal surface portion conductive track using the ear 66 is shown in FIGS. 8A and 8B.

  The connection between the plated proximal end surface portion 12P of the core 12 and the proximal end portions of the feedline shield conductors 16U, 16L is soldered as shown in FIGS. 9A, 9B, 9C, and 9D. Can be achieved by means of a coated washer 76, the connection being such that the solder of the ring 76 melts and flows onto the plating on the proximal surface and onto the outer conductive layer of the elongated laminated substrate 14. Is done when it is passed through the oven.

  Intimate contact between the inner edge of the solder coated washer 76 is achieved by providing a slotted opening, as shown in FIG. 9E. In this case, as shown in FIG. 9B, the distal extension 14B of the laminated substrate 14 is more than the transmission line portion 14A so that the alignment component can be accommodated on the elongated laminated substrate 14 more easily. Is also wide.

  Next, the construction of the laminated substrate 14 of the antenna shown in FIGS. 9A to 9D will be described in more detail with reference to FIG. 9F. The substrate has three conductive layers: an upper conductive layer 14-1, an intermediate conductive layer 14-2, and a lower outer conductive layer (shown by extra fine lines in FIG. 9F) 14-3. The inner layer forms a narrow and elongated feedline conductor 18. The outer layer forms shield conductors 16U, 16L as previously described herein. As previously described herein, there are two rows of plated vias 17 between shield conductors 16U and 16L that jointly form a shield surrounding inner conductor 18 with shield conductors 16U and 16L. The proximal extension 14C of the transmission line portion 14A has contact areas 16V, 18W, 16W connected to the feedline conductors as described above with reference to FIG. 1B.

  In this example, the enlarged distal extension 14B constructs an alignment site that replaces the second laminated substrate 30 of the first antenna described above with reference to FIGS. 1A and 1B. The matching site has a shunt capacitance provided by a separate surface mount capacitor 80, which is formed in the outer conductor layer 14-1 to the inner conductor 18 through the via 18V and to the feedline shield conductor 16U. It is mounted on a pad connected to each of the expansion portions 81. In the intermediate layer 14-2, a series inductance is formed by the transverse elements and the vias associated therewith.

  The matching network connection on the distal extension 14B of the laminated substrate 14 was patterned on the outer conductive layer in the side protruding portion of the distal extension 14B and on the distal end surface portion of the core. This is accomplished by a solder joint between the conductor provided by the conductive layer.

The connection between the antenna feed line and the equipment circuit board needs to be made by a contact area extending in a plane parallel to the antenna axis. Referring to FIGS. 10A and 10B, the proximal end surface portion 12P of the core 12 may be provided with a contact area oriented perpendicular to the antenna axis. In this case, the plating of the proximal end surface portion 12P can be patterned to provide an isolated “land” 88A that is isolated from the plating 88B formed as an extension of the conductive sleeve 20. Such patterning of the proximal conductive layers 88A, 88B in the core 12 thus makes the inner end the contact area (eg, conductive pad 18W) in the proximal extension 14C of the transmission line portion 14A. Such regions provide a conductive base region for mounting fan-shaped conductive support elements 90 shaped to be connected to (on both sides of the laminated substrate 14). The support element 90 has a respective conductive layer portion 88A, 88B to form a firm wear-resistant contact area oriented perpendicular to the antenna axis and to receive abutting spring contact as shown in FIG. To be joined.

  Referring to FIG. 11, the instrument circuit board 40 is in this case fixed in a hole (not shown) adjacent to the edge of the circuit board 40 and joined to the proximal end surface portion 12P of the antenna core 12. It has an upstanding metal spring contact 42 with a fixed leg 42F spaced apart to mate with the sagging support element 90. Each spring contact has a contact leg 42U that resiliently leans against the support element 90 in a direction parallel to the antenna axis.

  The same support element in the vertical orientation can also be used to mount the antenna on the surface of the equipment circuit board 40, so-called “turret”, as shown in FIG. In this case, the spring contact 42 is surface-mounted on the substrate 40 as shown in FIG. When assembling the antenna to a device of which the circuit board 40 is a part, the antenna 1 is positioned above the circuit board 40 with a predetermined distance between the proximal end surface portion 12P and the opposing surface of the circuit board 40. When urged to the position, a movement occurs in which the contact leg of the spring contact 42 elastically approaches the direction of the fixed leg in the same manner as described above with reference to FIG.

  An alternative means of connecting the antenna to the equipment circuit board in the form of a turret mounting configuration is shown in FIGS. 13A and 13B. In this case, the conductive layer plated on the proximal end surface portion 12P of the antenna core 12 is patterned as described above with reference to FIGS. 10A and 10B. In this case, however, the connection of the elongated laminated substrate 14 to the feed line is a pair of springs mounted diametrically relative to the land conductor region 88A and the conductive region 88B connected to the sleeve. Made by the contact element 42. In each case, the fixed leg 42L is oriented such that the contact leg 42U leans against a contact area on an equipment circuit board (not shown) extending parallel to the antenna core proximal end surface portion 12P and perpendicular to the antenna axis 13. So that the antenna is located at a predetermined distance set according to the required compression of the spring contact 42. Further, these spring contacts are contacted on the proximal extension 14B of the transmission line portion 14A of the laminated substrate 14 so that the elastic interconnection between the fixed leg and the contact leg is as shown in FIGS. 13A and 13B. In each case, the orientation is such that it faces inward toward the axis and is spaced from the axis so as to lean against the region.

  14A and 14B show a further embodiment of the invention in which the connection between the conductors of the laminated substrate 14 and the radial track in the proximal face of the core is made by the third laminated substrate 100. FIG. ing. Similar to that shown in FIG. 1B, what is plated on the proximal end surface portion 12P of the core is a surface connection element formed as a radial track 10AR, 10BR, 10CR, 10DR. Each surface connecting element extends from the distal end of the respective spiral track 10A-10D to a location adjacent to the end of the hole 12B. It can be seen that the radial trajectories 10AR-10DR are interconnected by arcuate conductive links such that the four helical trajectories 10A-10D are interconnected in pairs at their distal ends. .

  The third laminated substrate 100 overlaps the distal end surface portion 12D of the core 12. The third laminated substrate 30 takes the form of a circular tile positioned centrally with respect to the axis 13. Its cross-sectional extent is such that it overlaps the inner ends of the radial tracks 10AR, 10BR, 10CR, 10DR and their corresponding arcuate interconnections. The third laminated substrate 100 has two fan-shaped conductive copper layers (not shown in FIGS. 14A and 14B) on the back side thereof, that is, the side facing the distal end surface portion 12D of the core. These conductive layers provide electrical connection between the arcuate conductive links and the conductive layers 18U, 18L of the transmission line portion 14A.

  A matching network is provided in the elongated laminated substrate 14. This is illustrated in FIG. 14B. The matching network includes two surface mount capacitors 102A and 102B. Further details regarding this configuration will be provided later in connection with FIG. The circuit diagram of the impedance matching network is the same as that shown in FIG. 1D. As shown in FIG. 1D, the impedance matching network is represented by two shunt capacitances C 1 and C 2 connected to the feed line conductors 16, 18 and one of the feed line conductors 18 and a load or source 36. The antenna has two series inductances between the radial elements 10 </ b> A to 10 </ b> D, and another one of the feed line conductors 16 is directly connected to the other side of the load / source 36.

  The connection between the third laminated substrate 100 and the conductor on the proximal end surface portion 12D of the core is made by a solder paste applied to the back side of the third laminated substrate. The method for manufacturing this antenna will be described in more detail below.

  As shown in FIG. 14A, the third laminated substrate 100 has a central slot 104 that receives the protruding distal extension 14B of the elongated laminated substrate 14, and includes an upper conductive region 18U and a third conductive region 18U in the laminated substrate 14. Solder connection is made between conductive regions including conductors of a conductive layer (not shown) on the back side of the multilayer substrate 100.

  In the assembled antenna, the proximal extension 14C of the laminated substrate 14 abuts the plated proximal end surface portion 12P of the core, and during assembly of the antenna, the first and third exposed contact areas 16V, 16W are , Electrically connected to the plating surface portion 12P.

  FIG. 15 shows a more detailed view of the back side of the third laminated substrate 100, that is, the side facing the proximal end of the antenna core 12 after assembly. The back side includes two fan-shaped copper layers 114A and 114B. FIG. 15 also shows a solder paste mask. In manufacturing, a solder paste is applied to the portions 116A to 116L. This allows an electrical connection to be made between the arcuate portions connecting the radial tracks and the conductors of the laminated substrate 14.

  In a further embodiment, the connection between the conductor of the laminated substrate 14 and the radial track on the distal face of the core 12 is made by a plug 106. The plug is shown in FIGS. 16A and 16B. Plug 106 includes a collar-like portion 108 and a tubular portion 110. The collar portion 108 and the tubular portion 110 are formed of a single molded plastic such as a liquid crystal polymer. A passage 112 passes through the central axis of the plug 106. The passage 112 has a rectangular cross section and is sized to receive the portion 14B of the laminated substrate 14. The diameter of the collar portion 108 is the same as the diameter of the third laminated substrate 100. The diameter of the tubular portion 1110 is such that it can be fitted into the distal end of the hole 12B and is large enough to ensure that it fits snugly into the hole.

  The back side of the brim 108, ie, the side facing the proximal end of the core 12, overlaps the distal end surface portion 12D of the core. As noted above, the cross-sectional extent is such that it overlaps the inner ends of the radial tracks 10AR, 10BR, 10CR, 10DR and their corresponding arcuate interconnects. Plug 106 has two conductive layers plated on its surface. Both of these layers are conductive surfaces extending from the inside of the passage 112 through the outside of the tubular portion 110 to the back side of the collar-like portion 108. These conductive layers provide feed connections and antenna element connections for coupling the conductive layers 18U, 16 of the transmission line portion 14A to the antenna elements 10A-10D through the conductive surface connection elements 10AR-10DR in the core surface portion 12D. To do.

  The connection between the plug 106 and the conductor on the proximal end surface portion 12D of the core is made by solder paste applied to the back side of the flange portion 108. The method for manufacturing this antenna will be described in more detail below.

  As described above, the plug 106 has a passage 112 that receives the distal extension 14B of the elongate laminated substrate 14 and has an upper conductive region 18U on the laminated substrate 14 and a conductive layer (not-on-back) behind the flange portion 108. A solder connection is made between the conductive regions including the conductor (shown).

  Plug 106 has two diametrically opposed conductive portions 120A and 120B that each overlap a portion of the surface of plug 106. Each conductive portion overlaps a wedge-shaped stroke that is approximately one quarter of the circular extent of the flange portion 108. The conductive portion extends from the distally facing surface of the flange portion 108 through the cylindrical outer surface and over the proximal surface portion. The conductive layer then covers a portion of the surface that covers the cylindrical outer surface of the tubular portion 110 and again represents approximately one quarter of the cylindrical extent of the tubular portion 110. Finally, the conductive layer enters the passage 112 and extends along one of the major surfaces of its rectangular cross section to join the conductive portion on the distal surface of the flange portion 108. Thus, the conductive portions 120A and 120B form two continuous conductive surfaces that extend around the plug 104 and through the passage 112.

  Accordingly, the conductive portion 120A provides an electrical connection between the upper conductor 18U of the laminated substrate 18 and the radial tracks 10AR and 10BR. The conductive portion 120B provides an electrical connection between the lower conductor (not shown) of the laminated substrate 18 and the radial tracks 10CR and 10DR. During the manufacturing process, the conductors 18U and 18L as well as the flange sites to allow electrical connections to be made between the conductive portion of the plug 104, the radial track, and the conductors 18U and 18L. A solder paste is applied to the proximally facing surface of 106.

  Next, a method for manufacturing the antenna shown in FIGS. 14A and 14B using the third laminated substrate 100 as a head connector will be described. 17A-17E show the various stages of the manufacturing process. The process is described in connection with FIG.

  The manufacturing apparatus includes a base plate 200. The base plate 200 includes a plurality of circular holes 202A, 202B, 202C, 202D, 202E. Each hole has a tapered edge such that the diameter of the cross-section of the hole in the upper surface of the base plate 200 is larger than the diameter of the hole in the lower surface of the base plate. The diameter of the hole in the lower surface is smaller than the diameter of the third laminated substrate 100. The diameter of the hole in the upper surface is larger than the diameter of the third laminated substrate. This is illustrated in FIG. 17A. The first step in the manufacturing process is a step for a component placement machine (not shown) to place the third laminated substrate 100 in each of the holes 202A, 202B, 202C, 202D (step 301).

The manufacturing apparatus also includes a ceramic locator plate 204. The ceramic locator plate includes a plurality of holes 206A, 206B, 206C, 206D, 202E. These holes are arranged such that the axis of each hole is aligned with the axis of each hole in the base plate when the locator plate 204 is positioned over the base plate 200. These positioning plates included a series of pins to allow each other to be guided relative to each other. Each hole 206A, 206B, 206C, 206D, 202E of the locator plate 204 has a diameter that is slightly larger than the diameter of the antenna core 12. These holes are wide enough to easily receive the core 12, but narrow enough to hold the core in a state of little or no movement. The next stage in the process is the process for positioning the locator plate on the base plate 200 so that the axis of each hole is aligned with the hole in the respective plate (step 302). This is illustrated in FIG. 17B.

  The next step in the process is for a component placement machine (not shown) to place the ceramic core 12 into each hole 206A, 206B, 206C, 206D, 202E with its distal end facing down. (Step 304). This is illustrated in FIG. 17C. Therefore, the third laminated substrate 100 and the core 12 are positioned in their final assembled arrangement. A further component placement machine (not shown) then inserts the elongated laminated substrate 14 into each hole 12B from its distal end (step 306). This is illustrated in FIG. 17D. In putting the elongated laminated substrate 14 into the hole 12B, the distal extension 14D passes through the opening 12 of the third laminated substrate 100 through the hole 12B. The laminated substrate 14 is aligned with the second laminated substrate 100 by the respective openings of the self and third laminated substrates 100. The core 12 can be appropriately aligned by a component placement machine for installing the core 12. Alternatively, a “notch” is provided on the circumference of the opening of the hole 12B at the proximal end of the core, and a protrusion corresponding to the “notch” is formed at a position where the portions 14A and 14C of the laminated substrate 14 intersect. Can be provided. Therefore, the core 12 is forcibly aligned with the laminated substrate when the laminated substrate 14 is inserted into the core 13.

  The antenna component is then assembled into its final configuration. As shown in FIG. 12E, solder preforms 206A, 206B, 206C, 206D, 206E are attached to the proximal end of the core 12. These preforms are for connecting the conductive layer at the proximal end of the laminated substrate 14 to the conductive plating on the core 12. The parts are passed through a reflow soldering process to merge them (step 308). The finished antenna is then pushed out of the base plate using a pushback machine (not shown). The advantage of this mechanism is that the antenna can be assembled quickly and accurately. The alignment tolerance is such that the antenna can be assembled in the manner described above and still be able to operate within the required parameters.

  Prior to the above process, a solder paste is applied to the third laminated substrate using a mask. The mask is as shown in FIG. 16A. Further, the capacitors 102A and 102B are reflow soldered to the multilayer substrate 14 prior to insertion into the core.

  Next, the construction of the laminated substrate 14 of the antenna shown in FIGS. 14A and 14B will be described in more detail with reference to FIG. The substrate has three conductive layers: an upper conductive layer 14-1, an intermediate conductive layer 14-2, and a lower outer conductive layer (shown by extra fine lines in FIG. 9F) 14-3. The inner layer forms a narrow and elongated feedline conductor 18. The outer layer forms shield conductors 16U, 16L as previously described herein. As previously described herein, there are two rows of plated vias 17 between shield conductors 16U and 16L that jointly form a shield surrounding inner conductor 18 with shield conductors 16U and 16L.

In this example, the distal end portion 14B of the laminated substrate 14 constitutes an alignment site that replaces the second laminated substrate 30 of the first antenna described above with reference to FIGS. 1A and 1B. The matching site has two shunt capacitors 102A and 102B provided by separate surface mount capacitors 80. Capacitor 102A is equivalent to capacitor C1 in FIG. 1D, and capacitor 102B is equivalent to capacitor C2 in FIG. 1D. An inductance L1 and an inductance L1 are also plated on the upper surface of the multilayer substrate. Capacitor 102A is connected between shield conductor 16U and inductor L1. Around the connection point between the inductance L1 and the capacitor 102A, there is a plated via 18V that couples the inductance L1 to the inner feed line. The upper layer also includes an inductance L2. L2 is connected to L1, and the capacitor 102B is connected between the contact point between L1 and L2 and the shield conductor 16U. The matching circuit has the electrical layout shown in FIG. 1D.

Claims (39)

A backfire dielectric loaded antenna for operation at frequencies above 200 MHz,
Between a reverse distal surface portion and a proximal surface portion extending in a direction transverse to the axis of the antenna, and a surface portion extending in the transverse direction, made of a solid material having a relative dielectric constant greater than 5 An electrically insulative dielectric core having an outer surface including a side portion extending into the core, wherein the outer surface of the core defines an internal volume that is largely occupied by the solid material of the core A dielectric dielectric core;
At least one pair of elongated conductive antenna elements provided on or adjacent to the side portion of the core and extending from the core distal surface portion toward the core proximal surface portion; Including a three-dimensional antenna element structure,
A feed structure in the form of an elongated laminated substrate extending in an axial direction, wherein the laminated substrate serves as a feed line that penetrates a passage in the core from the core distal surface portion to the core proximal surface portion. An antenna having a form of at least one functioning transmission line part and a proximal extension formed integrally with the transmission line part, the width of which is larger than the width of the passage in the plane of the laminated substrate A feed structure including a connection site;
An impedance matching portion for coupling the antenna element to the feed line;
With antenna. The antenna according to claim 1,
The laminated substrate includes first, second, and third conductive layers, and the second layer is an intermediate layer between the first layer and the third layer, and the feed The line includes an elongated inner conductor formed by the second layer, and an outer shield conductor formed by the first layer and the third layer and overlapping the inner conductor from above and below, respectively. . The antenna according to claim 2, wherein
The shield conductors are interconnected by interconnects located along lines parallel to the inner conductor on both sides of the inner conductor, the interconnect preferably being the first layer and the third layer. Formed by a row of conductive vias between the antenna. The antenna according to any one of claims 1 to 3,
An antenna comprising at least one active circuit element in the proximal extension of the transmission line section, wherein the active circuit element is coupled to the conductor of the feed line. The antenna according to claim 4, wherein
The antenna, wherein the active circuit element is a radio frequency receiver front end circuit that is provided with a low frequency output or a digital output on a device connection terminal of the proximal extension. The antenna according to any one of claims 1 to 5, further comprising:
An antenna comprising a connection member arranged to couple the transmission line to the antenna element. The antenna according to claim 6, wherein
The antenna has an opening therein for receiving a distal end portion of the axially extending laminated substrate. The antenna according to claim 7, wherein
The antenna has a proximal facing surface having a conductive portion for coupling the feedline to the antenna element structure. The antenna according to any one of claims 6 to 8,
The connection member is an antenna, which is a second laminated substrate. The antenna according to claim 9, wherein
The antenna, wherein the second laminated substrate is oriented perpendicular to the laminated substrate extending in the axial direction. The antenna according to any one of claims 6 to 8,
The connection member includes a collar portion and a tubular portion, and the tubular portion is arranged to position the connection member in the hole of the antenna core, and the collar portion is formed on the antenna. An antenna having a back side for contact with the distal end. The antenna according to claim 9 or 10,
The antenna, wherein the impedance matching portion is on the second laminated substrate, and a conductor thereof is coupled to the feed line. The antenna according to any one of claims 1 to 12,
The antenna, wherein the impedance matching part is disposed along a surface of the elongated laminated substrate. The antenna according to any one of claims 1 to 13,
The impedance matching part is an antenna that is a bipolar matching part. The antenna according to claim 14,
The matching site includes a series combination of two inductances between the first conductor of the feed line and at least one of the elongated conductive antenna elements, the second conductor of the feed line, and the elongated conductor. A link between another one of the conductive antenna elements, a first shunt capacitance between the first conductor of the feed line and the second conductor of the feed line, and the link; An antenna including a second shunt capacitance between a first inductance and a coupling point of the second inductance. A backfire dielectric loaded antenna for operation at frequencies above 200 MHz,
Between a reverse distal surface portion and a proximal surface portion extending in a direction transverse to the axis of the antenna, and a surface portion extending in the transverse direction, made of a solid material having a relative dielectric constant greater than 5 An electrically insulative dielectric core having an outer surface including a side portion extending into the core, wherein the outer surface of the core defines an internal volume that is largely occupied by the solid material of the core A dielectric dielectric core;
At least one pair of elongated conductive antenna elements provided on or adjacent to the side portion of the core and extending from the core distal surface portion toward the core proximal surface portion; Including a three-dimensional antenna element structure,
An axially extending laminated substrate housed in a passage through the core from the core distal surface portion to the core proximal surface portion, the first, second and third conductive substrates The second layer is sandwiched between the first layer and the third layer, the laminated substrate includes a transmission line portion functioning as a feed line, and the feed line A laminated substrate comprising an integral distal impedance matching site coupled to the antenna element;
The second layer forms an elongated inner conductor of the feed line, the first layer and the third layer form an elongated shield conductor, and the shield conductor is more than the inner conductor. Antennas that are also wide and interconnected along their elongated edge portions. The antenna according to claim 16, wherein
The antenna wherein the impedance matching portion includes at least one reactive matching element in the form of a shunt capacitor. An antenna according to claim 17,
A series inductance coupled between one of the conductors of the feed line and at least one of the elongated antenna elements, wherein the capacitance is a separate capacitor mounted on the multilayer substrate; Is an antenna formed as a conductive track between the capacitor and the at least one elongated antenna element. The antenna according to any one of claims 1 and 16 to 18, comprising:
A conductive trap element coupled to at least some proximal ends of the elongated conductive element and coupled to the feed line in the region of the proximal surface portion of the core; A circular polarization resonance mode and a second linear polarization resonance mode, wherein the first resonance mode is at least one first formed between the conductors of the feed line by at least the elongated antenna element pair and the trap element; The second resonance mode is associated with at least one of the elongated antenna elements, the trap element, and one or more outer surfaces of the shield conductors of the feed line. An antenna associated with a second conductive loop formed between the conductors of the feedline. The antenna according to claim 19,
The antenna, wherein the linear polarization resonance mode is a fundamental frequency at a resonance frequency higher than the frequency of the circular polarization resonance mode. The antenna of claim 20, wherein
The resonance frequency of the circular polarization resonance mode is 1.575 GHz, and the resonance frequency of the linear polarization mode is 2.45 GHz. The antenna according to any one of claims 19 to 21,
The impedance matching part is an antenna that is a bipolar reactive matching network. An antenna according to claim 22,
The matching site includes a series combination of two inductances between the first conductor of the feed line and at least one of the elongated conductive antenna elements, the second conductor of the feed line, and the elongated conductor. A link between another one of the conductive antenna elements, a first shunt capacitance between the first conductor of the feed line and the second conductor of the feed line, and the link; An antenna including a second shunt capacitance between a first inductance and a coupling point of the second inductance. An antenna according to any one of claims 16 to 23,
The antenna, wherein the feed line outer conductor is separated from a wall of the passage formed in the solid material of the core. 25. The antenna of claim 24, wherein
The transmission line portion of the elongated laminated substrate is formed as a strip, and the passage through the core has a width of the strip such that an edge of the strip is supported by the wall of the passage. An antenna having a circular cross section of at least approximately equal diameter. A backfire dielectric loaded antenna for operation at frequencies above 200 MHz,
Between a reverse distal surface portion and a proximal surface portion extending in a direction transverse to the axis of the antenna, and a surface portion extending in the transverse direction, made of a solid material having a relative dielectric constant greater than 5 An electrically insulative dielectric core having an outer surface including a side portion extending into the core, wherein the outer surface of the core defines an internal volume that is largely occupied by the solid material of the core A dielectric dielectric core;
At least one pair of elongated conductive antenna elements provided on or adjacent to the side portion of the core and extending from the core distal surface portion toward the core proximal surface portion; Including a three-dimensional antenna element structure,
An axially laminated substrate housed in a passage extending through the core from the core distal surface portion to the core proximal surface portion, having at least a first layer and having a feed line A laminated substrate comprising: a transmission line portion including at least first and second feed line conductors, and a feed connection element for coupling the feed line to the antenna element;
The laminated substrate further includes an active circuit element coupled to the feed line conductor on one surface and a ground surface electrically connected to one of the feed line conductors on the other surface. An antenna including a proximal extension of the transmission line section. The antenna of claim 26, wherein
The laminated substrate has at least two conductive layers, the first feed line conductor is formed by one of the layers, and the second feed line conductor is in contact with the proximal extension. An antenna that takes the form of the ground. The antenna of claim 26, wherein
The laminated substrate has first, second, and third conductive layers, and the second layer is sandwiched between the first layer and the third layer, and the transmission line portion The second layer forms an inner conductor of the feed line, the first layer and the third layer form a shield conductor that overlaps the inner conductor, and the third layer includes: An antenna that is integral, continuous, and coplanar with the ground plane of the proximal extension. An antenna according to any one of claims 26 to 28, wherein
The active circuit element includes an antenna including a low noise amplifier. An antenna according to any one of claims 26 to 29, wherein
The laminated substrate includes an integral distal impedance matching site. A method of manufacturing a backfired dielectric loaded antenna according to any one of claims 1 to 30, comprising
Installing each of the plurality of second laminated substrates in a respective substrate locator portion of the base plate;
Positioning a locator plate having a plurality of respective core locator portions each aligned with the substrate locator portion of the base plate on the base plate;
Installing each of a plurality of antenna cores in a respective core locator portion such that the core rests on the second laminated substrate;
Placing each of a plurality of elongate laminated substrates in respective holes in the antenna core such that a wide proximal extension of the elongate substrate abuts the proximal end surface of the antenna core;
Performing a reflow soldering process to unite the respective parts;
A method comprising: 32. The method of claim 31, further comprising:
Providing at least one matching network on the elongated substrate prior to insertion into the core. 32. The method of claim 31, comprising:
The method wherein the second laminated substrate includes an opening for receiving a distal end of the elongated laminated substrate and thereby providing alignment with the substrate. A method of manufacturing a backfired dielectric loaded antenna according to any one of claims 1 to 30, comprising
Positioning each of the second laminated substrate, the antenna core, and the elongated laminated substrate in an assembly machine, wherein the second laminated substrate and the elongated laminated substrate are automatically aligned with each other; Method. A wireless communication device comprising an antenna and wireless communication circuit means connected to the antenna and operable in at least two radio frequency bands above 200 MHz,
The antenna is
Between a reverse distal surface portion and a proximal surface portion extending in a direction transverse to the axis of the antenna, and a surface portion extending in the transverse direction, made of a solid material having a relative dielectric constant greater than 5 An electrically insulating dielectric core having an outer surface including a side portion extending into
A feeder structure that penetrates substantially through the core from the distal surface portion to the proximal surface portion and is positioned on or adjacent to the outer surface of the core;
A plurality of elongated conductive antenna elements coupled to a feed connection of the feeder structure in a region of the core distal surface portion and a conductive having a ground connection to the feeder structure in the region of the core proximal surface portion; A series combination with a trap element;
Including
The wireless communication circuit means has two parts each operable in the first and second radio frequency bands, each of the parts being a common signal line of the antenna feeder structure and the respective circuit means. Associated with each signal line to convey the signal flowing between the parts,
The antenna resonates in the first circular polarization resonance mode in the first frequency band and in the second linear polarization resonance mode in the second frequency band, and the second frequency band is the first frequency band. An apparatus that is above a frequency band and wherein the first and second resonance modes are fundamental resonance modes. 36. The apparatus of claim 35,
The first frequency band is centered on a first center frequency, the second frequency band is centered on a second center frequency, and the second center frequency is higher than the first center frequency. An apparatus that is high but lower than twice the first center frequency. An apparatus according to claim 35 or 36,
The apparatus, wherein the first center frequency is a frequency of a signal transmitted by a Global Navigation Satellite System (GNSS) and the second center frequency is in the ISM band. A dielectric loaded antenna substantially constructed and arranged as described herein and shown in the drawings.   A wireless communication device substantially constructed and arranged as described herein and shown in the drawings.

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