JP2013504152A5 - - Google Patents
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- JP2013504152A5 JP2013504152A5 JP2012527305A JP2012527305A JP2013504152A5 JP 2013504152 A5 JP2013504152 A5 JP 2013504152A5 JP 2012527305 A JP2012527305 A JP 2012527305A JP 2012527305 A JP2012527305 A JP 2012527305A JP 2013504152 A5 JP2013504152 A5 JP 2013504152A5
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- JP
- Japan
- Prior art keywords
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- composition
- organometallic compound
- metal
- Prior art date
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- 239000000203 mixture Substances 0.000 claims 20
- 239000002245 particle Substances 0.000 claims 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 5
- 239000011521 glass Substances 0.000 claims 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 150000002902 organometallic compounds Chemical class 0.000 claims 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N glycerol group Chemical group OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims 3
- 239000006096 absorbing agent Substances 0.000 claims 2
- 239000000654 additive Substances 0.000 claims 2
- 230000000996 additive Effects 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 2
- 229910052797 bismuth Inorganic materials 0.000 claims 2
- 229910052799 carbon Inorganic materials 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052742 iron Inorganic materials 0.000 claims 2
- 239000011159 matrix material Substances 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052763 palladium Inorganic materials 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 239000011135 tin Substances 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 2
- 229910052720 vanadium Inorganic materials 0.000 claims 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium(0) Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 2
- 229910052725 zinc Inorganic materials 0.000 claims 2
- 239000011701 zinc Substances 0.000 claims 2
- WMWLMWRWZQELOS-UHFFFAOYSA-N Bismuth(III) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 claims 1
- IBDHMAYMLSYGAK-UHFFFAOYSA-N Lanthanum boride Chemical compound [La].B12B3[B-]41B1B4[B-]312 IBDHMAYMLSYGAK-UHFFFAOYSA-N 0.000 claims 1
- 229920002873 Polyethylenimine Polymers 0.000 claims 1
- LAJZODKXOMJMPK-UHFFFAOYSA-N Tellurium dioxide Chemical compound O=[Te]=O LAJZODKXOMJMPK-UHFFFAOYSA-N 0.000 claims 1
- 150000004703 alkoxides Chemical class 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 claims 1
- 239000002518 antifoaming agent Substances 0.000 claims 1
- 229910000416 bismuth oxide Inorganic materials 0.000 claims 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims 1
- 229910052793 cadmium Inorganic materials 0.000 claims 1
- 239000006229 carbon black Substances 0.000 claims 1
- 239000002041 carbon nanotube Substances 0.000 claims 1
- 229910021393 carbon nanotube Inorganic materials 0.000 claims 1
- 150000007942 carboxylates Chemical class 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- 229910052803 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- 239000008139 complexing agent Substances 0.000 claims 1
- 229920001940 conductive polymer Polymers 0.000 claims 1
- 150000004696 coordination complex Chemical class 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000003431 cross linking reagent Substances 0.000 claims 1
- 239000002274 desiccant Substances 0.000 claims 1
- 239000002270 dispersing agent Substances 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- -1 gerium Chemical compound 0.000 claims 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 1
- 229910021389 graphene Inorganic materials 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims 1
- 239000001023 inorganic pigment Substances 0.000 claims 1
- PWHULOQIROXLJO-UHFFFAOYSA-N manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims 1
- 229910052748 manganese Inorganic materials 0.000 claims 1
- 239000011572 manganese Substances 0.000 claims 1
- SECXISVLQFMRJM-UHFFFAOYSA-N n-methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims 1
- 239000002105 nanoparticle Substances 0.000 claims 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 claims 1
- 239000004014 plasticizer Substances 0.000 claims 1
- 239000010695 polyglycol Substances 0.000 claims 1
- 229920000151 polyglycol Polymers 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 229910001930 tungsten oxide Inorganic materials 0.000 claims 1
- 239000000080 wetting agent Substances 0.000 claims 1
Claims (14)
それぞれ組成物の合計質量に対して、50〜90質量%の導電性粒子、0〜7質量%のガラスフリット、0.1〜5質量%の、レーザー照射のための少なくとも1種の吸収剤、0〜8質量%の少なくとも1種のマトリクス材料、0〜8質量%の少なくとも1種の有機金属化合物、3〜50質量%の、溶媒としての水、0〜65質量%の少なくとも1種の歩留まり向上剤、及び0〜5質量%の少なくとも1種の添加剤を含み、及び
前記歩留まり向上剤は、水の蒸発を遅らせるための遅延剤であり、及び
前記添加剤として、分散剤、チキソトロープ剤、可塑剤、湿潤剤、消泡剤、乾燥剤、架橋剤、錯化剤、及び/又は伝導性ポリマー粒子が使用される、組成物。 A composition for printing an electrode on a substrate,
50 to 90% by weight of conductive particles, 0 to 7% by weight of glass frit, 0.1 to 5% by weight of at least one absorber for laser irradiation, each based on the total weight of the composition, 0-8% by weight of at least one matrix material, 0-8% by weight of at least one organometallic compound, 3-50% by weight of water as solvent, 0-65% by weight of at least one yield. An improver, and 0 to 5% by weight of at least one additive, and the yield improver is a retarder for delaying water evaporation, and as the additive, a dispersant, a thixotropic agent, A composition in which plasticizers, wetting agents, antifoaming agents, drying agents, crosslinking agents, complexing agents and / or conductive polymer particles are used.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09169548 | 2009-09-04 | ||
EP09169548.6 | 2009-09-04 | ||
PCT/EP2010/062775 WO2011026852A1 (en) | 2009-09-04 | 2010-09-01 | Composition for printing electrodes |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013504152A JP2013504152A (en) | 2013-02-04 |
JP2013504152A5 true JP2013504152A5 (en) | 2013-09-26 |
JP5984671B2 JP5984671B2 (en) | 2016-09-06 |
Family
ID=43466380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012527305A Expired - Fee Related JP5984671B2 (en) | 2009-09-04 | 2010-09-01 | Composition for printing electrodes |
Country Status (10)
Country | Link |
---|---|
US (1) | US9396833B2 (en) |
EP (1) | EP2474004B1 (en) |
JP (1) | JP5984671B2 (en) |
KR (1) | KR101874125B1 (en) |
CN (1) | CN102576575B (en) |
ES (1) | ES2536696T3 (en) |
MY (1) | MY158807A (en) |
SG (1) | SG178931A1 (en) |
TW (1) | TWI553663B (en) |
WO (1) | WO2011026852A1 (en) |
Families Citing this family (30)
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EP2537188A4 (en) | 2010-02-17 | 2016-04-13 | Basf Se | Process for producing electrically conductive bonds between solar cells |
KR101428131B1 (en) * | 2010-10-28 | 2014-08-07 | 엘지이노텍 주식회사 | Conductive paste composite |
US9466738B2 (en) * | 2010-10-28 | 2016-10-11 | Heracus Precious Metals North America Conshohocken LLC | Solar cell metallizations containing metal additive |
US8512463B2 (en) | 2011-04-05 | 2013-08-20 | E I Du Pont De Nemours And Company | Thick film paste containing bismuth-tellurium-oxide and its use in the manufacture of semiconductor devices |
EP2607327A1 (en) * | 2011-12-23 | 2013-06-26 | Heraeus Precious Metals GmbH & Co. KG | Thick-film composition containing antimony oxides and their use in the manufacture of semi-conductor devices |
KR20140114881A (en) * | 2012-01-18 | 2014-09-29 | 헤레우스 프레셔스 메탈즈 노스 아메리카 콘쇼호켄 엘엘씨 | Solar cell metallizations containing organozinc compound |
JP5975447B2 (en) * | 2012-03-16 | 2016-08-23 | パナソニックIpマネジメント株式会社 | Solar cell module |
US8845932B2 (en) | 2012-04-26 | 2014-09-30 | E I Du Pont De Nemours And Company | Thick film paste containing bismuth-tellurium-oxide and its use in the manufacture of semiconductor devices |
KR101683412B1 (en) * | 2012-12-27 | 2016-12-06 | 어플라이드 캐비테이션 아이엔씨. | Cavitation apparatus and method of using same |
KR101587683B1 (en) * | 2013-02-15 | 2016-01-21 | 제일모직주식회사 | The composition for forming solar cell electrode comprising the same, and electrode prepared using the same |
JP6077892B2 (en) * | 2013-03-08 | 2017-02-08 | 兵庫県 | Conductor forming paste |
KR101596548B1 (en) * | 2013-03-27 | 2016-02-22 | 제일모직주식회사 | Composition for forming solar cell electrode and electrode prepared using the same |
KR101590227B1 (en) * | 2013-06-05 | 2016-01-29 | 제일모직주식회사 | Composition for forming solar cell electrode and electrode prepared using the same |
DE102013107693B4 (en) * | 2013-07-18 | 2021-05-06 | Pictiva Displays International Limited | Method for forming a conductor track structure on an electrode surface of an electronic component |
CN103745763B (en) * | 2014-01-21 | 2016-04-27 | 江苏欧耐尔新型材料有限公司 | Rear surface of solar cell electrode slurry and preparation method thereof |
EP3172738A4 (en) * | 2014-07-21 | 2018-03-07 | Sun Chemical Corporation | A silver paste containing organobismuth compounds and its use in solar cells |
TWI521548B (en) * | 2014-12-08 | 2016-02-11 | 碩禾電子材料股份有限公司 | A conductive paste containing lead-free glass frit |
TWI563517B (en) * | 2015-05-22 | 2016-12-21 | Chuan Hsi Res Co Ltd | Conductive paste composition, conductive structure and method of producing the same |
CN104979035B (en) * | 2015-06-26 | 2017-05-03 | 武汉优乐光电科技有限公司 | Lead-free composite glass adhesive solar battery positive silver paste |
CN106531818B (en) * | 2015-09-15 | 2017-12-01 | 比亚迪股份有限公司 | Solar cell positive pole grid line and solar cell and preparation method thereof |
EP3419028B1 (en) * | 2016-02-17 | 2021-01-06 | Namics Corporation | Conductive paste |
CN106057277A (en) * | 2016-06-03 | 2016-10-26 | 常州聚和新材料股份有限公司 | Silver paste for forming back silver electrode of back passivation solar battery |
CN106653148A (en) * | 2016-12-16 | 2017-05-10 | 杭州杭硕新材料科技有限公司 | Back electrode silver paste for crystalline silicon solar cell and preparation method of back electrode silver paste |
CN107634012B (en) * | 2017-09-13 | 2021-05-07 | 京东方科技集团股份有限公司 | Packaging substrate, preparation method thereof, display panel and display device |
US10851257B2 (en) * | 2017-11-08 | 2020-12-01 | Eastman Kodak Company | Silver and copper nanoparticle composites |
DE102018111132A1 (en) * | 2018-05-09 | 2019-11-14 | Lpkf Laser & Electronics Aktiengesellschaft | Use of a component in a composition, composition for laser transfer printing and laser transfer printing method |
CN109493993B (en) * | 2018-12-07 | 2020-11-27 | 浙江中希电子科技有限公司 | Silver paste for front electrode of crystalline silicon solar cell and preparation method thereof |
JP7263771B2 (en) * | 2018-12-28 | 2023-04-25 | 凸版印刷株式会社 | Coating agents, ejected materials and coating equipment |
FR3104600B1 (en) * | 2019-12-11 | 2022-04-22 | Genesink Sa | Ink based on silver nanoparticles |
US20220320357A1 (en) * | 2019-12-12 | 2022-10-06 | Bert Thin Films, Llc | Pastes for solar cells, solar cells, and methods of making same |
Family Cites Families (26)
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DE10210146A1 (en) | 2002-03-07 | 2003-09-25 | Aurentum Innovationstechnologi | Quality printing process and printing machine, as well as a print audit for this |
US20040055635A1 (en) * | 2002-09-19 | 2004-03-25 | Hiroshi Nagakubo | Conductive paste, method for manufacturing solar battery, and solar battery |
WO2006011180A1 (en) * | 2004-06-23 | 2006-02-02 | Harima Chemicals, Inc. | Conductive metal paste |
JP4393938B2 (en) | 2004-07-16 | 2010-01-06 | 信越化学工業株式会社 | Electrode material, solar cell, and method for manufacturing solar cell |
US20060231802A1 (en) * | 2005-04-14 | 2006-10-19 | Takuya Konno | Electroconductive thick film composition, electrode, and solar cell formed therefrom |
US7494607B2 (en) * | 2005-04-14 | 2009-02-24 | E.I. Du Pont De Nemours And Company | Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom |
US7326367B2 (en) * | 2005-04-25 | 2008-02-05 | E.I. Du Pont De Nemours And Company | Thick film conductor paste compositions for LTCC tape in microwave applications |
JP4844805B2 (en) * | 2005-05-20 | 2011-12-28 | 住友電気工業株式会社 | Method for forming metal coating |
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JP5422878B2 (en) * | 2006-10-24 | 2014-02-19 | 東レ株式会社 | Adhesive composition for semiconductor, semiconductor device using the same, and method for manufacturing semiconductor device |
JP5151230B2 (en) * | 2007-02-23 | 2013-02-27 | 三菱マテリアル株式会社 | Composition for forming electrode of solar cell, method for forming the electrode, and method for producing solar cell using the electrode obtained by the forming method |
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CN101970720B (en) | 2008-03-13 | 2014-10-15 | 巴斯夫欧洲公司 | Method and dispersion for applying a metal layer to a substrate and metallizable thermoplastic molding compound |
TWI470041B (en) | 2008-06-09 | 2015-01-21 | Basf Se | Dispersion for the application of a metal layer |
MY155485A (en) | 2008-06-18 | 2015-10-30 | Basf Se | Process for producing electrodes for solar cells |
EP2342296B1 (en) | 2008-10-02 | 2013-08-28 | Basf Se | Method for printing substrates |
WO2010069902A1 (en) | 2008-12-17 | 2010-06-24 | Basf Se | Method and printing press for printing a substrate |
PH12011501221A1 (en) | 2008-12-17 | 2010-06-24 | Basf Se | Method and printing press for printing a substrate |
JP2012512065A (en) | 2008-12-17 | 2012-05-31 | ビーエーエスエフ ソシエタス・ヨーロピア | Printing machine and printing method for printing substrate |
ES2456491T3 (en) | 2008-12-17 | 2014-04-22 | Basf Se | Procedure for printing on a substrate |
-
2010
- 2010-09-01 MY MYPI2012000952A patent/MY158807A/en unknown
- 2010-09-01 JP JP2012527305A patent/JP5984671B2/en not_active Expired - Fee Related
- 2010-09-01 SG SG2012014429A patent/SG178931A1/en unknown
- 2010-09-01 CN CN201080042425.9A patent/CN102576575B/en not_active Expired - Fee Related
- 2010-09-01 EP EP10747636.8A patent/EP2474004B1/en not_active Not-in-force
- 2010-09-01 TW TW099129532A patent/TWI553663B/en not_active IP Right Cessation
- 2010-09-01 ES ES10747636.8T patent/ES2536696T3/en active Active
- 2010-09-01 KR KR1020127008776A patent/KR101874125B1/en active IP Right Grant
- 2010-09-01 US US13/394,011 patent/US9396833B2/en active Active
- 2010-09-01 WO PCT/EP2010/062775 patent/WO2011026852A1/en active Application Filing
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