JP2013256572A - Resin composition, and cured product thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide: a resin composition useful for applications whose qualities are managed by AOI, and excellent in UV absorption property; and a cured product thereof.SOLUTION: A resin composition and a cured product thereof include (A) a substituted phenol glyoxal resin obtained by reacting cresols and/or xylenols with glyoxal in the presence of an acid catalyst, (B) biphenyltetracarboxylic acids, and (C) an epoxy resin.

Description

  The present invention relates to a resin composition excellent in ultraviolet (UV) absorption characteristics and a cured product thereof.

  Phenol glyoxal resin obtained from phenols and glyoxal (dialdehyde) has UV absorption characteristics, so insulating materials such as highly reliable semiconductor sealing materials, laminated boards (printed wiring boards), carbon fiber reinforced plastics (CFRP) and other various electric / electronic materials, molding materials, casting materials, laminate materials, paints, adhesives, resists, blended components of epoxy resin compositions used in a wide range of applications such as optical materials, or epoxy-modified materials Useful as. In particular, the phenol glyoxal resin is useful as a constituent material of a laminated body such as a mounted printed circuit board whose quality is controlled by automatic optical inspection (AOI) based on recent optical characteristics.

  For example, as an example of an epoxy resin composition applicable to AOI, there is a composition containing a phenol glyoxal resin (fluorescent phenol-glyoxal condensation product) produced under specific conditions, an epoxy resin having a specific epoxy value, and a curing agent thereof. It is disclosed. Here, examples of the curing agent include aromatic amine, polyamidoamine, polyamide, dicyandiamide, phenol novolac resin, and melamine-formaldehyde resin (see Patent Document 1).

Special Table 2002-542389

The AOI generally measures fluorescence at a wavelength of about 450 nm to about 650 nm (especially an excitation wavelength of about 442 nm) and / or UV absorbance at a wavelength of about 350 nm to about 365 nm. As for AOI applicability, a conventionally well-known epoxy composition is required to have further excellent UV absorption characteristics.
The present invention as described below is provided as a solution to such a problem.

In the present invention,
(A) a substituted phenol glyoxal resin obtained by reacting cresols and / or xylenols with glyoxal in the presence of an acid catalyst,
(B) Provided is a resin composition comprising at least one selected from the group consisting of biphenyltetracarboxylic acid and acid anhydrides thereof, and (C) an epoxy resin.

The at least one (B) is preferably selected from the group consisting of compounds (1) to (4) shown below.

  The resin composition according to the present invention usually contains 0.5 to 30% by mass of (A), 0.5 to 30% by mass of (B), and 98 to 40% by mass of (C).

  The resin composition according to the present invention preferably further contains (D) 0.5 to 50% by mass of an epoxy resin curing agent.

  In this application, the hardened | cured material of the above resin compositions is also provided.

  The cured product of the resin composition according to the present invention exhibits high UV absorption intensity and high fluorescence intensity. Such a resin composition of the present invention and a product obtained from the cured product thereof can improve the accuracy and shorten the inspection time in AOI. For this reason, particularly for applications such as substrates that are quality controlled by AOI. Useful.

Hereinafter, the present invention will be described in more detail.
The (A) substituted phenol glyoxal resin according to the present invention is obtained by reacting cresols and / or xylenols (hereinafter sometimes referred to as substituted phenols) and glyoxal in the presence of an acid catalyst.
Examples of cresols include p-cresol, m-cresol and o-cresol. Examples of xylenols include 2,6-xylenol, 3,5-xylenol, 2,3-xylenol, 2,5-xylenol, 2 , 4-xylenol, 3,4-xylenol and the like.
In the present invention, as the substituted phenol, at least one selected from these can be used, and one or more cresols, one or two or more xylenols, and an appropriate mixture thereof can be used. it can.
Among these, p-cresol, a mixture of p-cresol and other cresols, or a mixture of xylenols can be suitably used because of excellent UV absorption characteristics.

  Glyoxal (dialdehyde) can be used in various forms, for example, relatively high-purity monomer glyoxal, polymerized glyoxal, an aqueous solution of glyoxal, and the like. Among these, an aqueous solution of about 40% glyoxal is preferable because it is easily available.

  Examples of the acid catalyst usually include sulfuric acid, p-toluenesulfonic acid, oxalic acid, and the like. Among them, p-toluenesulfonic acid is preferable because of excellent reactivity.

  The reaction between the substituted phenol and glyoxal carried out in the presence of the acid catalyst can be carried out, for example, by mixing a molar excess of substituted phenol with glyoxal in the presence or absence of a solvent, and usually under heating. . More specifically, it can be heated usually at a temperature of 40 ° C. to 250 ° C., preferably 60 ° C. to 200 ° C., for example, for 1 hour to 12 hours, preferably 3 hours to 9 hours.

  After completion of the reaction, the catalyst is neutralized. The alkaline compound used for neutralization is not particularly limited, but sodium hydroxide, potassium hydroxide, and sodium hydrogen carbonate can usually be used, and sodium hydroxide and sodium hydrogen carbonate are particularly preferable. The alkaline compound can also be used in an aqueous solution.

Next, the obtained reaction product is dissolved in, for example, acetone and separated by filtration. Here, the substituted phenol glyoxal resin is recovered as a soluble matter (filtrate). The insoluble material is crystalline tetrakisphenols (monomer).
Excess substituted phenol and the solvent used are removed by atmospheric distillation, vacuum distillation, steam distillation or the like to obtain a substituted phenol glyoxal resin.

The (B) biphenyltetracarboxylic acid and acid anhydrides thereof (hereinafter also referred to as biphenyltetracarboxylic acids) contained in the resin composition of the present invention may be those having a biphenyltetracarboxylic acid skeleton, Usually, an embodiment having an adjacent dicarboxylic acid on one phenyl ring, that is, capable of forming an acid anhydride is preferred. In this case, three isomers exist with four carboxylic acids, ie, 2,3,2 ′, 3′-form, 2,3,3 ′, 4 with respect to biphenyl bond position 1,1′-. '-Body and 3,4,3', 4'-body. Moreover, you may have substituents, such as an alkyl, an alkoxy, a halogen, on the ring. Such biphenyltetracarboxylic acids are available as commercial products, and can also be produced according to the production method disclosed in, for example, JP-A-2006-290836.
Biphenyltetracarboxylic acids may be any of these isomers or a combination of two or more.

Among the above, the compound represented by the above chemical formula, ie, 3,3 ′, 4,4′-biphenyltetracarboxylic acid shown as compound (1) and its acid anhydride shown as compound (3), compound (2) 2,3,3 ′, 4′-biphenyltetracarboxylic acid shown as above and its acid anhydride shown as compound (4), mixtures thereof, and those having the above substituents can be preferably used.
Among these, biphenyltetracarboxylic anhydrides (compound (3) and compound (4)) that have good reactivity with the epoxy resin and have a fast curing rate are particularly preferable.

The (C) epoxy resin used in the present invention may be any one as long as it is a normal thermosetting epoxy resin. Specifically, glycidyl ether of bisphenol A, glycidyl ether of phenol novolac resin, glycidyl ether of cresol novolac resin, glycidyl ether of bisphenol F, glycidyl ether of dicyclopentadiene / phenol condensate, glycidyl of phenol / salicylaldehyde condensate Ether, 3,4-epoxycyclohexanecarboxylic acid 3,4-epoxycyclohexylmethyl, and glycidyl ethers of these brominated compounds can be preferably used.
Among these, glycidyl ether of bisphenol A, glycidyl ether of phenol novolac resin, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate, and the like are preferably used.

The resin composition according to the present invention preferably contains (D) an epoxy resin curing agent. (D) Any curing agent can be used as long as it is a curing agent used for ordinary epoxy resins. Examples include aliphatic amine compounds, aromatic amine compounds, phenol novolac resins, imidazole compounds, and acid anhydride compounds other than (B).
Specifically, examples of the aliphatic amine compound include diethylenetriamine and triethylenetetramine, examples of the aromatic amine compound include metaphenylenediamine and diaminodiphenylmethane, and examples of the imidazole compound include 2-methylimidazole. Examples of the acid anhydride compound include phthalic anhydride, 4-methylcyclohexane-1,2-dicarboxylic acid anhydride, and the compounds exemplified here can be preferably used.

Although the compounding quantity of each component in this invention is not specifically limited, Preferably, it is 0.5-30 mass% of (A) substituted phenol glyoxal resin, and if it is such a range, the hardened | cured material of a resin composition is intensity | strength. Although it does not decrease and can exhibit excellent UV absorption intensity, it is more preferably 1 to 15% by mass, and further preferably 3 to 15% by mass.
The blending amount of (B) biphenyltetracarboxylic acid is preferably 0.5 to 30% by mass, and within such a range, there is no decrease in the strength of the cured product, but more preferably 1 to 15% by mass, Preferably it is 5-15 mass%.
(C) If the compounding amount of the epoxy resin is too large, the UV absorption property is lowered, and if it is too little, the strength of the cured product is lowered, so that it is preferably 98 to 40% by mass, more preferably 97 to 70% by mass. More preferably, it is 91-70 mass%.

  Further, the blending ratio of each component is not particularly limited as long as it is within the above range, but preferably (C) the epoxy equivalent of the epoxy resin and the acid value, amine value, and hydroxyl equivalent of the curing agent are equal (D). An epoxy resin hardening | curing agent can be normally mix | blended in the quantity of 0.5-50 mass%, More preferably, it can be mix | blended in the quantity of 1-50 mass%, More preferably, it is 3-15 mass%.

  Various additives can be added to the resin composition of the present invention as long as the characteristics are not impaired. Examples of these additives include flame retardants, curing accelerators, antioxidants, plasticizers, and inorganic compounds. As the flame retardant, bromine compounds such as brominated biphenyl, phosphorus compounds, antimony compounds such as antimony trioxide, and the like can be preferably used. As the curing accelerator, phosphorus compounds such as triphenylphosphine, phenol compounds, imidazoles such as methylimidazole and phenylimidazole, amide compounds, and the like can be preferably used. Moreover, a hindered phenol type compound, a phosphorus type compound, etc. are used suitably for antioxidant.

  The method for producing the resin composition of the present invention is not particularly limited. For example, (A) a substituted phenol glyoxal resin, (B) biphenyltetracarboxylic acid, (C) an epoxy resin, and (D) an epoxy resin curing agent, if necessary, premixed beforehand, and then 50 ° C to 150 ° C, preferably A method of melting by heating at 70 ° C. to 120 ° C. and melt blending, a method of dissolving each raw material in a solvent such as acetone, and distilling off the solvent can be suitably applied. Among these methods, a method of pre-mixing and then melt blending is simple and preferable.

As for the resin composition of this invention, hardened | cured material is obtained by thermosetting. The temperature during curing and the curing time are not particularly limited, but are preferably 120 to 250 ° C, more preferably 135 to 170 ° C, and the curing time is 1 to 60 minutes, preferably 5 to 30 minutes. Minutes.
This cured product has excellent performance as an electronic member, and exhibits excellent UV absorption characteristics in AOI inspection, and therefore can improve accuracy in quality inspection of substrates and shorten inspection time.

Hereinafter, although the more concrete Example of this invention is shown, the Example shown below is for demonstrating this application, Comprising: The scope of the present invention is not limited to these Examples.
Example 1
<Synthesis of substituted phenol glyoxal resin>
In a 1-liter separable flask equipped with a thermometer and a condenser, p-cresol 216 g (manufactured by Wako Pure Chemical Industries, Ltd.), 40% glyoxal aqueous solution (manufactured by Wako Pure Chemical Industries, Ltd.) 36.3 g, p -1 g of toluene sulfonic acid (manufactured by Wako Pure Chemical Industries, Ltd.) was added, and the temperature was raised to 100 ° C. under a nitrogen stream and reacted for 2 hours. Thereafter, the water was distilled off, and the temperature was further raised to 200 ° C. to react for 3 hours.
After completion of the reaction, the reaction solution was cooled, the catalyst was neutralized with an aqueous sodium hydroxide solution, 200 ml of acetone was added and filtered. Further, acetone was removed from the filtrate by an evaporator to obtain 188.1 g of a solid resinous product (substituted phenol glyoxal resin).

<Curing>
15 g of this resinous product, 15 g of biphenyltetracarboxylic anhydride of the formula (3) (manufactured by JFE Chemical Co., Ltd.), 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate (Wako Pure Chemical Industries, Ltd.) )) 63 g, 4-methylcyclohexane-1,2-dicarboxylic anhydride (Wako Pure Chemical Industries, Ltd.) 84 g, and triphenylphosphine (Wako Pure Chemical Industries, Ltd.) 0.2 g were blended. Then, it was heated on a hot plate at 140 ° C. for 5 minutes, and melt blended to obtain a cured product.

<Measurement>
0.5 g of the cured product obtained above was dissolved in 99.5 g of tetrahydrofuran, and UV spectrum and fluorescence spectrum were measured. The results are shown in Table 1.
The UV absorption intensity was determined by measuring the absorbance at wavelengths of 350 nm and 365 nm using a UV1650PC manufactured by Shimadzu.
For the fluorescence intensity, the maximum count at an excitation wavelength of 442 nm was measured using an RF5300PC manufactured by Shimadzu.

(Example 2)
A cured product was obtained in the same manner as in <Curing> in Example 1 except that the amount of the resinous product used was changed to 5 g and the amount of the biphenyltetracarboxylic anhydride used was changed to 5 g.
Table 1 shows the UV absorption intensity and fluorescence intensity measured for this cured product in the same manner as in Example 1.

(Example 3)
A cured product was obtained in the same manner as in <Curing> in Example 1 except that the amount of resinous product used was changed to 20 g and the amount of biphenyltetracarboxylic anhydride used was changed to 20 g.
Table 1 shows the UV absorption intensity and fluorescence intensity measured for this cured product in the same manner as in Example 1.

Example 4
A resinous product was synthesized in the same manner as in <Synthesis of substituted phenol glyoxal resin> in Example 1, except that o-cresol (manufactured by Wako Pure Chemical Industries, Ltd.) was used instead of p-cresol. A cured product was obtained in the same manner as in Example 1.
Table 1 shows the UV absorption intensity and fluorescence intensity measured for this cured product in the same manner as in Example 1.

(Example 5)
A cured product was obtained in the same manner as in <Curing> in Example 1 except that the biphenyltetracarboxylic anhydride was replaced with the biphenyltetracarboxylic anhydride of formula (4) (manufactured by JFE Chemical Co., Ltd.).
Table 1 shows the UV absorption intensity and fluorescence intensity measured for this cured product in the same manner as in Example 1.

(Example 6)
A cured product was obtained in the same manner as in <Curing> in Example 1 except that biphenyltetracarboxylic acid anhydride was replaced with biphenyltetracarboxylic acid of formula (1) (manufactured by JFE Chemical Co., Ltd.).
Table 1 shows the UV absorption intensity and fluorescence intensity measured for this cured product in the same manner as in Example 1.

(Example 7)
A cured product was obtained in the same manner as in <Curing> in Example 1 except that biphenyltetracarboxylic acid anhydride was replaced with biphenyltetracarboxylic acid of formula (2) (manufactured by JFE Chemical Co., Ltd.).
Table 1 shows the UV absorption intensity and fluorescence intensity measured for this cured product in the same manner as in Example 1.

(Comparative Example 1)
A resinous product was synthesized in the same manner as in <Synthesis of substituted phenol glyoxal resin> in Example 1 except that phenol was used instead of p-cresol, and then a cured product was obtained in the same manner as in Example 1. .
Table 1 shows the UV absorption intensity and fluorescence intensity measured for this cured product in the same manner as in Example 1.

(Comparative Example 2)
A cured product was obtained in the same manner as in <Curing> in Example 1 except that biphenyltetracarboxylic anhydride was not used.
Table 1 shows the UV absorption intensity and fluorescence intensity measured for this cured product in the same manner as in Example 1.

(Comparative Example 3)
A cured product was obtained in the same manner as in Example 1 except that the resinous product and the biphenyltetracarboxylic anhydride were not used.
Table 1 shows the UV absorption intensity and fluorescence intensity measured for this cured product in the same manner as in Example 1.

(Comparative Example 4)
A cured product was obtained in the same manner as in <Curing> in Example 1 except that a novolak type phenol resin (manufactured by Gunei Chemical Co., Ltd.) was used instead of biphenyltetracarboxylic anhydride.
Table 1 shows the UV absorption intensity and fluorescence intensity measured for this cured product in the same manner as in Example 1.

  As described above, the cured product obtained in the examples of the present invention was superior in both UV absorption intensity and fluorescence intensity as compared with the cured product of the comparative example. Such a resin composition of the present invention is particularly useful for applications such as a substrate whose quality is controlled by AOI, and can improve accuracy and shorten inspection time in the quality inspection.

Claims (5)

(A) a substituted phenol glyoxal resin obtained by reacting cresols and / or xylenols with glyoxal in the presence of an acid catalyst,
(B) A resin composition comprising at least one selected from the group consisting of biphenyltetracarboxylic acid and acid anhydrides thereof, and (C) an epoxy resin. The resin composition according to claim 1, wherein the at least one (B) is selected from the group consisting of compounds (1) to (4) shown below.
  The resin composition according to claim 1 or 2, comprising 0.5 to 30% by mass of (A), 0.5 to 30% by mass of (B), and 98 to 40% by mass of (C).   Furthermore, (D) The resin composition in any one of Claims 1-3 which contains 0.5-50 mass% of epoxy resin hardening | curing agents.   Hardened | cured material of the resin composition in any one of Claims 1-4.