JP2013245992A - Strain sensor and strain sensor system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a strain sensor in which a maximum strain amount of an object to be measured can be measured in arbitrary timing without requiring a measuring instrument for monitoring the object to be measured at all the time, and a strain sensor system.SOLUTION: A strain sensor comprises an outer frame part 16, a pressing part 17, beam parts 16a-16c of which both end portions are supported to the outer frame part 16 and which are arrayed at predetermined intervals in one direction with respect to the pressing part 17, main electrode parts 18a-18c formed on the beam parts 16a-16c, and a plurality of terminal parts 18d-18g formed on the outer frame part 16 and electrically connected with both end portions of the main electrode parts 18a-18c, respectively. When a strain amount of an object to be measured reaches a value specified by the predetermined intervals of the beam parts 16a-16c, the beam parts 16a-16c and the corresponding main electrode parts 18a-18c are destroyed successively from the side closer to the pressing part 17 in an irreversible manner by the pressing part 17.

Description

  The present invention relates to a strain sensor and a strain sensor system for measuring strain generated in a measurement object.

  In order to diagnose the safety of structures such as buildings and bridges (including roads and railway overpasses), it is widely performed to measure strain and stress of these structures. Examples of sensors for measuring strain include an FBG (Fiber Bragg Grating) type optical fiber sensor (for example, see Patent Document 1), a semiconductor strain gauge using a semiconductor piezoresistor (for example, see Patent Document 2), and the like. It is done.

  The FBG sensor is a grating in which the refractive index of the core portion of the optical fiber is periodically changed in the light traveling direction. The grating part of the FBG sensor reflects light of a specific wavelength (referred to as Bragg wavelength) out of incident light and transmits light of other wavelengths as it is. The Bragg wavelength changes linearly with respect to axial strain (compression, expansion) and temperature change that the grating section receives. Therefore, if the amount of change in the Bragg wavelength is detected after fixing the grating portion of the FBG sensor to the measurement object, the distortion amount of the measurement object can be measured.

  The semiconductor strain gauge has a semiconductor portion such as silicon doped with impurities, and is used in a state of being fixed to a measured object in the same manner as the FBG sensor. By using this gauge, it is possible to measure the amount of strain of the measured object from the resistance change when the semiconductor portion is deformed due to strain.

Japanese Patent No. 4868593 Japanese Patent No. 4566227

  In diagnosing the safety of a structure, it is important to know the maximum value (maximum strain amount) of the amount of strain applied to the structure. In the conventional strain sensors disclosed in Patent Document 1 and Patent Document 2, the Bragg wavelength and the value of electrical resistance change according to the amount of strain of the measured object, and these changes are reversible. Therefore, a measurement system that measures the amount of strain using a conventional strain sensor must constantly monitor the object to be measured in order to obtain the maximum amount of strain, and measures each structure where the strain sensor is installed. It was essential to install a vessel, and there was a problem that it was expensive.

  In addition, when a measurement system using a conventional strain sensor is normal, even if the strain sensor itself is normal, if the measurement device fails and no measurement is performed, the maximum strain during the period in which the measurement device has failed is measured. There was also a problem that the amount became unknown.

  The present invention has been made in order to solve such a conventional problem, and does not require a measuring instrument for constantly monitoring the measured object, so that the maximum distortion amount of the measured object can be set at an arbitrary timing. An object of the present invention is to provide a strain sensor and a strain sensor system that can be measured by the above method.

  In order to solve the above problems, the strain sensor according to claim 1 of the present invention has a mounting portion for fixing to the surface of the measured object, and the opposing distance is short according to the amount of strain of the measured object. A base plate having a first facing portion and a second facing portion, a maximum strain amount holding portion at least partially fixed on the first facing portion, and at least a portion facing the second facing A sensor part having a pressing part fixed on the part, and the maximum strain amount holding part is supported by the outer frame part and both end parts in one direction with respect to the pressing part. At least one beam portion arranged at a predetermined interval, a main electrode portion formed on each of the beam portions, and both ends of each main electrode portion formed on the outer frame portion, respectively. A plurality of terminal portions connected to each other, the beam portion and the corresponding main electrode portion, When the strain amount of the measuring body reaches a value defined by the predetermined interval of the beam portion, the pressing portion is sequentially and irreversibly destroyed from the side close to the pressing portion. Have.

  With this configuration, the strain sensor according to the first aspect of the present invention has a maximum strain amount holding unit that irreversibly holds the maximum strain amount applied to the measured object, thereby constantly monitoring the measured object. It is possible to measure the maximum strain amount of the object to be measured at an arbitrary timing without using the measuring instrument.

  Further, in the strain sensor according to claim 2 of the present invention, the sensor unit connects and supports the pressing portion to the outer frame portion in an initial state, and the strain amount of the measured object reaches a predetermined value. You may have the structure characterized by further having a support part broken sometimes irreversibly.

  The strain sensor according to a third aspect of the present invention has a configuration in which the sensor portion is integrally formed by a MEMS technique.

  With this configuration, the strain sensor according to claim 3 of the present invention can accurately configure the distance between each beam portion and the tip of the pressing portion, and can arbitrarily set the distance according to the maximum strain amount to be acquired. Is possible.

  The strain sensor system according to claim 4 of the present invention is electrically connected to the above-described strain sensor and each of the terminal portions in the maximum strain amount holding portion, and based on the electrical resistance of each of the main electrode portions. And a maximum strain amount detection unit for detecting the maximum strain amount of the measurement object.

  With this configuration, the strain sensor system according to claim 4 of the present invention includes a strain sensor that irreversibly holds the maximum amount of strain applied to the measured object, thereby performing measurement for constantly monitoring the measured object. The maximum distortion amount can be measured at an arbitrary timing without using an instrument.

  The present invention irreversibly holds the maximum strain applied to the measured object, so that a measuring instrument for constantly monitoring the measured object is not required, and the maximum strain of the measured object can be set to an arbitrary value. A strain sensor and a strain sensor system that can be measured at timing are provided.

The top view which shows the structure of the distortion sensor which concerns on 1st Embodiment. The top view which shows the structure of the principal part of the strain sensor which concerns on 1st Embodiment. AA sectional view of the strain sensor shown in FIG. The top view which shows the structure of the base board in the strain sensor which concerns on 1st Embodiment. 1 is a configuration diagram of a strain sensor system (part 1) including a strain sensor according to a first embodiment. Configuration diagram of a strain sensor system (part 2) including the strain sensor according to the first embodiment The top view which shows the structure of the distortion sensor which concerns on 2nd Embodiment. Explanatory drawing which shows the attachment location of the attachment screw in the strain sensor which concerns on 2nd Embodiment. The top view which shows the structure of the strain sensor which concerns on 3rd Embodiment. The top view which shows the structure of the base plate in the strain sensor which concerns on 3rd Embodiment.

  Hereinafter, embodiments of a strain sensor and a strain sensor system according to the present invention will be described with reference to the drawings. In addition, the dimensional ratio of each structure on each drawing does not necessarily correspond with the actual dimensional ratio.

(First embodiment)
First, the configuration of the strain sensor 1 according to the first embodiment will be described. As shown in FIGS. 1 to 4, the strain sensor 1 mainly includes a metal base plate 11 and a sensor unit 12 installed on the base plate 11.

  The base plate 11 is attached to the surface of the measured object 10 so as to be deformed according to the external force of the measured object 10 or the strain due to temperature. Examples of the object to be measured 10 include structures such as buildings, various levee bodies such as river embankments, ground slopes, bedrocks, bridges (including road and railroad overpasses, etc.). As shown in FIGS. 3 and 4, the base plate 11 includes an attachment surface 1 a for attaching the strain sensor 1 to the surface of the measurement object 10, a plurality of attachment holes 13 a and 13 b, and an initial state (the measurement object 10 The first facing portion 14 and the second facing portion 15 that face each other at a predetermined distance in the X direction and whose facing distance is shortened according to the amount of compressive strain of the object 10 to be measured. Have.

  Here, the attachment surface 1a and the attachment holes 13a and 13b constitute an attachment portion. The mounting hole 13a is formed on the first facing portion 14 side, while the mounting hole 13b is formed on the second facing portion 15 side. FIG. 3 is a cross-sectional view taken along the line AA of FIG. 1, and shows a state in which the mounting screws 20a and 20b are screwed into the measurement object 10 through the mounting holes 13a and 13b.

  Here, the first and second facing portions 14 and 15 have projecting portions 14a and 15a that project in the longitudinal direction (X direction) of the base plate 11, respectively, and are bonded onto these projecting portions 14a and 15a. The sensor unit 12 is bonded by the agent. The length D in the X direction of the base plate 11 is, for example, 100 mm.

  The sensor unit 12 is integrally formed from a silicon (Si) substrate by MEMS technology. As shown in FIGS. 2 and 4, the sensor unit 12 is formed in a substantially U-shape, and at least a part thereof is bonded and fixed on the protruding portion 14 a of the base plate 11, and at least a part thereof. A pressing portion 17 that is bonded and fixed onto the protruding portion 15a of the base plate 11, beam portions 16a, 16b, and 16c formed in a ladder shape with both ends supported by the outer frame portion 16, and the pressing portion 17 in an initial state. And supporting portions 17a, 17b, 17c, and 17d that are irreversibly destroyed when the amount of strain of the measured object 10 reaches a predetermined value.

The beam portions 16 a to 16 c are arranged in this order from the side closer to the pressing portion 17 with a predetermined interval in the longitudinal direction (X direction) of the base plate 11. Here, _{d 1} the distance from the tip of the pressing portion 17 to the center of the beam portion 16a, the distance between the centers of the beam portion 16a and the beam section 16b _{d 2,} the distance between the centers of the beam portion 16b and the beam portion 16c _{d 3} It is said. Each of the distances d _{1 to} d ₃ has a length of about 100 μm, for example. The distances d _{1 to} d ₃ do not have to be the same, and may be increased or decreased logarithmically from the pressing portion 17 side, for example. Further, the number of beam portions is not limited to three as shown in FIG. 2 and the like, and may be one or four or more.

  That is, the pressing portion 17 is configured to move in the X direction toward the beam portions 16a to 16c by destroying the support portions 17a to 17d in accordance with the amount of compressive strain of the measured object 10. The pressing portion 17 comes into contact with the beam portion 16a when the amount of compressive strain of the DUT 10 reaches a predetermined value, and finally the beam portions 16a to 16c are irreversibly sequentially broken when the amount of compressive strain further increases. It has become.

  An electrode 18 is formed on the outer frame portion 16 and the beam portions 16a to 16c. The electrode 18 is formed by vapor-depositing gold on each beam portion 16 a to 16 c, and extends on the main electrode portions 18 a, 18 b and 18 c extending in the Y direction perpendicular to the longitudinal direction of the base plate 11, and on the outer frame portion 16. And terminal portions 18d, 18e, 18f, and 18g that are electrically connected to both ends of the main electrode portions 18a to 18c, respectively. Here, the outer frame portion 16, the beam portions 16a to 16c, and the electrode 18 constitute a maximum strain amount holding portion.

  In the example shown in FIG. 2, the terminal portions 18d, 18e, 18f corresponding to the main electrode portions 18a, 18b, 18c are formed on one side of the opposite sides of the U-shaped outer frame portion 16, and the other A terminal portion 18g as a common electrode of the main electrode portions 18a to 18c is formed on the side. The main electrode portions 18a to 18c and the terminal portions 18d to 18g may be integrally formed by vapor deposition or may be formed separately.

In the strain sensor 1 configured as described above, when the beam portions 16a to 16c and the corresponding main electrode portions 18a to 18c are destroyed, the amount of compressive strain of the measured object 10 is pressed against each beam portion 16a to 16c. It is possible to detect whether or not the compression strain amounts St _{1 to} St ₃ defined by the distances (d ₁ , d ₁ + d ₂ , d ₁ + d ₂ + d ₃ ) from the tip of the portion 17 have been reached.

  Next, a procedure for attaching the strain sensor 1 to the measured object 10 will be described. First, the outer frame portion 16 (see FIG. 2) of the strain sensor 1 is bonded and fixed to the protruding portion 14a (see FIG. 4) of the base plate 11 with an adhesive such as an epoxy resin. This work should be performed on a factory work table. Next, the base plate 11 to which the outer frame portion 16 is bonded and fixed is bonded to the surface of the measurement object 10. At this time, it is desirable that the longitudinal direction (X direction) of the base plate 11 coincides with the direction in which the amount of compressive strain of the DUT 10 is to be measured. Next, the base plate 11 is fixed to the DUT 10 by screwing the mounting screws 20a and 20b (see FIG. 3) into the mounting holes 13a and 13b. Finally, the pressing portion 17 is bonded and fixed on the protruding portion 15 a of the base plate 11.

  The procedure for attaching the strain sensor 1 to the measured object 10 is not limited to the above. For example, after the pressing portion 17 is bonded and fixed on the projecting portion 15a on a work table in a factory, the base plate 11 to which the pressing portion 17 is bonded and fixed is bonded to the surface of the measured object 10, and finally on the protruding portion 14a. The outer frame portion 16 may be bonded and fixed.

  Next, a method for measuring the amount of compressive strain of the measurement object 10 using the strain sensor 1 of the present embodiment will be described with reference to FIGS. This measurement method uses strain sensor systems 40 and 50 each including the strain sensor 1.

As shown in FIG. 5, the strain sensor system 40 includes external terminals T ₁ , T _{3 connected} to the terminal portions 18 d to 18 g (see FIG. 2) of the strain sensor 1 via resistors R ₁ , R ₂ , R ₃ , respectively. ₂ , T ₃ , and T _g are electrically connected.

The upper part of FIG. 5 shows an initial state where the base plate 11 is not strained. At this time, the main electric resistance of the electrode portions 18a~18c are all zero, the external terminal T _g and measuring means of the digital multimeter or the like electrical resistance between each external terminal T ₁ through T ₃ (not shown) The measurement result becomes a predetermined value corresponding to the electrical resistance value of each of the resistors R _{1 to} R ₃ . Here, the measuring means (not shown), the resistors R _{1 to} R _3, and the external terminals T _{1 to} T ₃ , T _g constitute a maximum strain amount detection unit.

On the other hand, in the lower part of FIG. 5, the base plate 11 contracts in the X direction by a predetermined length ε due to the compressive strain of the DUT 10, and the first beam portion 16 a (see FIG. 2) closest to the pressing portion 17. It shows a state of being irreversibly destroyed. At this time, the electrical resistance between the external terminal T _g and the external terminal T _2, T ₃ becomes the predetermined value, the electric resistance (or main electrodes between the external terminal T _g and the external terminal T ₁ The electrical resistance of the portion 18a becomes infinite, and it can be seen that the beam portion 16a is broken and the main electrode portion 18a is broken.

Thus, the maximum compressive strain amount by measuring the electrical resistance, which joined the object to be measured 10 between the external terminal T _g and the external terminal T ₁ through T ₃ are, each beam portion 16a~16c Observing at an arbitrary timing whether or not the compression strain amount St _{1 to} St ₃ defined by the distance (d ₁ , d ₁ + d ₂ , d ₁ + d ₂ + d ₃ ) with the tip of the pressing portion 17 has been reached. Is possible.

6, in place of the external terminal _T 1 _~T 3, _{T g} shown in FIG. 5, an LED for displaying the breakdown status of the beam portion 16a~16c and the corresponding main electrode portion 18a~18c display lamp L ₁ shows a configuration of a strain sensor system 50 including ₁ , L ₂ , L ₃ and a battery 19 for supplying power to the display lamps L _{1 to} L ₃ . Here, the resistors R _{1 to} R ₃ , the display lamps L _{1 to} L _3, and the battery 19 constitute a maximum strain amount detection unit.

According to this configuration, when none of the beam portions 16a to 16c and the corresponding main electrode portions 18a to 18c are destroyed, the electric resistances of the main electrode portions 18a to 18c are all zero. ₁ anode potential and cathode potential of ~L ₃ are all become the ground potential, none of the indicator lamps L ₁ ~L ₃ does not light. However, once one of the beam portion 16a~16c and the corresponding main electrode portion 18a~18c is broken, since a potential difference is generated on the anode side and the cathode side of the corresponding display lamp _L 1 ~L _3, corresponding display Lamps L _{1 to} L ₃ are lit.

For example, when the first and second beam portions 16a and 16b (see FIG. 2) are broken from the side close to the pressing portion 17 and the main electrode portions 18a and 18b are disconnected, the display lamps L ₁ , display lamp L ₁ L ₂ to the light emission threshold current or more current is _applied, L ₂ is turned on.

  As described above, the strain sensor system 50 has an advantage that the maximum amount of compressive strain of the DUT 10 can be easily confirmed visually. In the configuration shown in FIG. 6, the display lamp corresponding to the broken beam portion is turned on. Conversely, the display lamp corresponding to the unbroken beam portion is always turned on and the broken beam portion is turned on. Only the display lamps corresponding to can be turned off.

  As described above, the strain sensor according to the present embodiment is installed in a building such as a bridge. For example, the maximum amount of compressive strain applied to the building when an earthquake occurs depends on the configuration of the sensor unit 12. It is possible to irreversibly hold information indicating whether or not the amount of compression strain is greater than the prescribed amount. Therefore, if the strain sensor and the strain sensor system according to the present embodiment are used, it is possible to acquire information on the maximum amount of compressive strain applied to the measured object 10 at a later date after the earthquake has stopped.

  That is, if the strain sensor and strain sensor system according to the present embodiment are used, it is not necessary to constantly monitor the measured object 10. For example, the strain sensors according to the present embodiment are attached to a plurality of bridges, and a measurer brings a simple measuring instrument such as a digital multimeter to each bridge and measures it on the spot, thereby applying to each bridge. It is possible to measure the maximum compression distortion amount. In this way, since only one measuring instrument is required for observing the amount of distortion, the cost of the entire system is greatly reduced.

  In the strain sensor according to the present embodiment, since the sensor unit 12 is integrally formed by the MEMS technology, the distance between each beam unit 16a to 16c and the tip of the pressing unit 17 can be configured with high accuracy, and the maximum strain to be acquired is obtained. These distances can be arbitrarily set according to the amount.

  In the present embodiment, the sensor unit 12 is integrally formed by the MEMS technique. However, the outer frame unit 16, the pressing unit 17, the beam units 16a to 16c, and the support units 17a to 17d of the sensor unit 12 are separately provided. It may be formed. The support portions 17 a to 17 d may be omitted, and the pressing portion 17 may be separated from the outer frame portion 16.

  Further, if the pressing portion 17 is formed to be sufficiently thicker than the beam portions 16a to 16c, even if the pressing portion 17 and the beam portions 16a to 16c are distorted in opposite directions in the Z direction, the pressing portion 17 is preferable because it hardly affects the destruction of the beam portions 16a to 16c due to 17.

  Moreover, the main electrode part extended | stretched to a Y direction and the terminal part arrange | positioned on the outer frame part 16 may be formed also on the press part 17 and the support parts 17a and 17c (refer FIG. 2). In this case, it is possible to detect a small amount of compressive strain that does not lead to destruction of the beam portion 16a.

  In the example shown in FIG. 2 and the like, the beam portions 16a to 16c have a stripe shape in which the width in the X direction is constant. However, the beam portions 16a to 16c have an appropriate width so as to be easily broken. It may be provided with a portion where becomes narrower.

(Second Embodiment)
A second embodiment of the strain sensor according to the present invention will be described with reference to the drawings. Note that the description of the same configuration and operation as in the first embodiment will be omitted as appropriate. In the first embodiment, the base plate 11 has two mounting holes 13a and 13b arranged so that the center positions are aligned in the Y direction.

  On the other hand, as shown in FIG. 7, the base plate 21 in the strain sensor 2 of the present embodiment has two mounting holes whose center positions are aligned in the X direction as a set, and a plurality of sets are arranged in the X direction. It has a configuration. In the example shown in FIG. 7, a set of mounting holes 23a and 23e and a set of mounting holes 23b and 23f are formed on the first facing portion 14 side, while a set of mounting holes 23c and 23g and a mounting A set of holes 23d and 23h is formed on the second facing portion 15 side.

Center distance _{D 1} of the the hole 23c (23 g) mounting the mounting hole 23b (23f) is 50mm for example, center distance _{D 2} of the hole 23d (23h) Installation and mounting holes 23a (23e) in 100mm example is there.

  As shown in FIG. 8A, when the mounting screws 24a, 24d, 24e, and 24h are screwed into the outer mounting holes 23a, 23d, 23e, and 23h to fix the strain sensor 2 to the measured object 10, for example, When a compressive strain amount of 1000 με is applied to the base plate 21, the first beam portion 16a (see FIG. 2) closest to the pressing portion 17 is broken.

  On the other hand, as shown in FIG. 8B, when the mounting screws 24b, 24c, 24f, and 24g are screwed into the inner mounting holes 23b, 23c, 23f, and 23g, and the strain sensor 2 is fixed to the measured object 10. When a larger amount of compressive strain, for example, 2000 με, is applied to the base plate 21 than when a mounting screw is screwed outside, the first beam portion 16a (see FIG. 2) closest to the pressing portion 17 is destroyed.

Therefore, by adjusting the distances D ₁ and D ₂ between the centers and the mounting locations of the mounting screws 24a to 24h, it becomes possible to arbitrarily adjust the detection sensitivity of the strain amount of the measured object 10. In addition, the position and number of attachment holes, and the attachment location of attachment screws are not limited to the examples shown in FIGS.

(Third embodiment)
A third embodiment of the strain sensor according to the present invention will be described with reference to the drawings. Note that description of the configuration and operation similar to those of the first and second embodiments will be omitted as appropriate. In the first and second embodiments, the configuration for detecting the amount of compressive strain of the measured object 10 has been described as an example. A configuration that can be detected will be described.

  As shown in FIGS. 9 and 10, the base plate 31 in the strain sensor 3 of the present embodiment is configured to detect the amount of compressive strain comprising the first and second facing portions 14 and 15 to which the sensor portion 12 is bonded and fixed. In addition, the first facing portion 34 and the second facing portion 35 that face each other at a predetermined distance in the X direction in the initial state and whose facing distance becomes shorter according to the amount of elongation strain of the measured object 10 are provided. Have.

  Here, the 1st and 2nd opposing parts 34 and 35 have a substantially U-shaped site | part, respectively, and are arrange | positioned alternately. Further, the first and second facing portions 34 and 35 have projecting portions 34 a and 35 a that project in the longitudinal direction (X direction) of the base plate 11, respectively. The outer frame portion 16 of the sensor portion 12 (see FIG. 2) is bonded and fixed on the protruding portion 34a, while the pressing portion 17 of the sensor portion 12 is bonded and fixed on the protruding portion 35a.

  That is, the pressing portion 17 bonded and fixed on the protruding portion 35a breaks the support portions 17a to 17d in accordance with the amount of elongation strain of the measurement target 10, and moves in the X direction toward the beam portions 16a to 16c. It is like that. The pressing portion 17 bonded and fixed on the protruding portion 35a comes into contact with the beam portion 16a when the amount of elongation strain of the measured object 10 reaches a predetermined value, and finally when the amount of elongation strain increases, the beam portions 16a to 16a. 16c is irreversibly and sequentially destroyed.

  The configuration and function of the sensor unit 12 are the same as those of the first and second embodiments already described. Therefore, the strain sensor 3 according to the present embodiment can detect not only the amount of compressive strain of the measured object but also the amount of extension strain.

1, 2, 3 Strain sensor 1a Mounting surface (mounting part)
10 to-be-measured object 11, 21, 31 base board 12 sensor part 13a, 13b, 23a-23h attachment hole (attachment part)
14, 34 1st opposing part 14a, 15a, 34a, 35a Protruding part 15, 35 2nd opposing part 16 Outer frame part (maximum distortion amount holding | maintenance part)
16a, 16b, 16c Beam part (maximum strain amount holding part)
17 Press part 17a, 17b, 17c, 17d Support part 18 Electrode 18a, 18b, 18c Main electrode part (maximum strain amount holding part)
18d, 18e, 18f, 18g Terminal part (maximum strain amount holding part)
19 Battery (Maximum strain detector)
20a, 20b, 24a through 24h mounting screws 40 and 50 the strain sensor system _{T 1, T 2, T 3} , T g external terminals (maximum distortion amount detecting unit)
R ₁ , R ₂ , R ₃ resistors (maximum strain detector)
L ₁ , L ₂ , L ₃ indicator lamps (maximum strain detector)

Claims (4)

Attaching portions (1a, 13a, 13b, 23a to 23h) for fixing to the surface of the measured object (10), and a first facing where the facing distance is shortened according to the strain amount of the measured object A base plate (11) having a portion (14, 34) and a second facing portion (15, 35);
Maximum strain amount holding part (16, 16a to 16c, 18a to 18g) at least partly fixed on the first facing part, and pressing at least partly fixed on the second facing part A sensor part (12) having a part (17),
The maximum strain amount holding portion includes an outer frame portion (16) and at least one beam portion that is supported at both ends by the outer frame portion and arranged at a predetermined interval in one direction with respect to the pressing portion. (16a to 16c), main electrode portions (18a to 18c) formed on the respective beam portions, and formed on the outer frame portion, and electrically connected to both end portions of the main electrode portions, respectively. A plurality of terminal portions (18d to 18g),
When the amount of strain of the measured object reaches a value defined by the predetermined interval of the beam portion, the beam portion and the corresponding main electrode portion are closer to the pressing portion by the pressing portion. A strain sensor characterized by being irreversibly destroyed sequentially.   In the initial state, the sensor unit supports the pressing unit by connecting to the outer frame unit, and irreversibly breaks when the amount of strain of the measured object reaches a predetermined value (17a to 17a). The strain sensor according to claim 1, further comprising 17d).   The strain sensor according to claim 2, wherein the sensor unit is integrally formed by MEMS technology. The strain sensor (1-3) according to any one of claims 1 to 3,
A maximum strain amount detection unit (T _{1 to} T) that is electrically connected to each of the terminal portions in the maximum strain amount holding unit and detects the maximum strain amount of the object to be measured based on the electric resistance of each of the main electrode portions. ₃ , T _g , R _{1 to} R ₃ , L _{1 to} L ₃ , 19).