JP2013232537A - Method of manufacturing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component that can solve problems that occur when an aggregate substrate made by aggregating slave substrates such as module substrates is divided into the slave substrates.SOLUTION: The method of manufacturing the electronic component includes a preparing process for an aggregate substrate 10 having a slave substrate forming part 12 made by aggregating a plurality of slave substrates 12a and a frame-shaped peripheral part 14 formed around the slave substrate forming part 12. Dividing slots 16 for dividing the aggregate substrate 10 into the slave substrates 12a are formed in grids around the respective slave substrates 12a of the slave substrate forming part 12 on a back side of the aggregate substrate 10. A passage groove 18 that prevents air from being accumulated between a back surface of the aggregate substrate 10 and a dicing sheet 20 attached to the back surface of the aggregate substrate 10 is formed on the peripheral part 14 on the back side of the aggregate substrate 10.

Description

  The present invention relates to a method of manufacturing an electronic component, and more particularly, to a method of manufacturing an electronic component for manufacturing an electronic component having a sub board, for example, a module such as Bluetooth (registered trademark) or wireless LAN (WLAN). The present invention relates to a method of manufacturing an electronic component including a step of dividing a collective substrate in which a plurality of sub substrates are assembled into each sub substrate.

  An example of a conventional method of manufacturing a circuit module as the background of the present invention is described in Japanese Patent Application Laid-Open No. 2004-14871. In the manufacturing method described in this publication, a collective circuit board in which a plurality of circuit modules (child boards) are gathered is manufactured, and finally the collective circuit board is divided for each slave board using a dicing apparatus. In the dividing step, a dicing adhesive tape may be applied to the back surface (main surface opposite to the component mounting surface) of the collective circuit board, and it may be adsorbed and fixed on the table of the dicing apparatus. Since the collective circuit board is fixed with the adhesive tape, even if it is divided for each sub board at the time of dicing, there is no problem that all the sub boards are scattered apart (see Patent Document 1).

JP 2004-14871 A

However, in the manufacturing method as described in Patent Document 1, the back surface side of the collective circuit board is formed in a substantially flat state, although mounting electrodes and the like are formed, so that an adhesive tape is applied to the back surface. When pasting, air may remain between the back surface of the collective circuit board and the adhesive tape, and a sub-board may be generated in which the entire back surface cannot be completely fixed to the adhesive tape. When a collective circuit board in such a state is divided by a dicing apparatus, a problem arises in that a child board that remains air and has a low fixing strength is peeled off from the adhesive tape due to pressure applied to the child board during dicing. .
In addition, the cooling water used during dicing enters the gap between the collective circuit board and the adhesive tape, causing discoloration of the electrodes on the back side of the sub board and foreign matter adhering to the back side, resulting in poor appearance of electronic components. Sometimes.
Further, as shown in FIG. 7, the collective circuit board 1 in which the split grooves 3 by the splitting laser are formed in a lattice pattern around the child board 2 on the back surface side is manufactured, and the collective circuit board 1 is half-cut from the front side. There is a case where a method of dividing the sub-board 2 by cutting or the like is used.
However, when the dividing grooves are formed in this way, the dividing grooves are formed only around the sub board, so when the back side of the collective circuit board is attached to the adhesive tape, the gap between the dividing grooves and the adhesive tape is There was no escape from the remaining air, and eventually air remained on the back surface of the child board, causing the above problems.

  SUMMARY OF THE INVENTION Therefore, a main object of the present invention is to provide a method for manufacturing an electronic component, which can solve a problem that occurs particularly when a collective board in which sub boards such as module boards are assembled is divided into sub boards. That is.

The method of manufacturing an electronic component according to the present invention is a method of manufacturing an electronic component for manufacturing an electronic component having a sub board, and includes a sub board forming portion in which a plurality of sub boards are assembled and around the sub board forming portion. A step of preparing a collective substrate having a formed frame-shaped peripheral portion, and dividing the collective substrate into a plurality of sub-substrates around each of the plurality of sub-substrates of the sub-substrate formation portion on the back side of the collective substrate A step of forming a split recess for forming a passage recess in the peripheral portion on the back surface side of the collective substrate, a step of attaching a sheet to the back surface of the collective substrate, and a plurality of the collective substrate along the split recess A method of manufacturing an electronic component including a step of dividing the substrate into sub-substrates.
In the method of manufacturing an electronic component according to the present invention, the step of forming the split concave portion includes, for example, a step of forming a split groove along the periphery of each of the plurality of sub-substrates in the sub-substrate forming portion on the back surface side of the collective substrate. The step of forming the passage recess includes, for example, a step of forming a passage groove that communicates with the dividing groove in the peripheral portion on the back surface side of the collective substrate.
In this case, the passage groove is preferably formed so as to communicate with the end portion of the collective substrate.
In this case, the passage groove is preferably formed shallower than the dividing groove.
Further, in this case, the passage groove is preferably formed narrower than the division groove.
Furthermore, in this case, it is preferable that the passage groove is formed at a position different from the extension line obtained by extending the dividing groove.
In the method of manufacturing an electronic component according to the present invention, the step of forming the divided recesses penetrates to the front surface side of the collective substrate around each of the plurality of sub substrates in the sub substrate forming portion on the back surface side of the collective substrate, for example. The step of forming the passage recess including the step of forming the divided holes includes, for example, the step of forming a passage hole penetrating the front surface side of the collective substrate in the peripheral portion on the back surface side of the collective substrate.

In the method for manufacturing an electronic component according to the present invention, the split concave portion and the passage concave portion are formed on the back surface side of the collective substrate. Therefore, when the sheet is attached to the back surface of the collective substrate, the air between the collective substrate and the sheet Since it tends to spread in the passage recess, it is difficult to remain between the collective substrate and the sheet.
Therefore, when the aggregate substrate is divided into a plurality of sub-substrates, it is possible to prevent the sub-substrates from peeling off and scattering from the sheet.
In addition, even when cooling water is used when dividing the assembly board into sub boards, the adhesion between the sub board and the sheet is improved, so that the cooling water does not easily enter between the assembly board and the sheet, resulting in poor appearance of electronic components. Can be prevented.
In the method of manufacturing an electronic component according to the present invention, if the dividing groove is formed as the dividing recess and the passage groove leading to the dividing groove is formed as the passage recess, the air between the collective substrate and the sheet easily spreads into the dividing recess and the passage recess. Therefore, it is difficult to remain between the collective substrate and the sheet.
In this case, if the passage groove is formed so as to communicate with the end of the collective substrate, the air between the collective substrate and the sheet is pushed out of the collective substrate through the divided concave portion and the passage concave portion. It is hard to remain.
In this case, if the passage groove is formed shallower than the dividing groove, is formed narrower than the dividing groove, or is formed at a position different from the extension line obtained by extending the dividing groove, for example, the collective substrate is evacuated. For this reason, a differential pressure is likely to be generated between the pressure in the jig for this purpose and the air pressure between the collective substrate and the sheet, so that it is difficult for air to remain between the collective substrate and the sheet.
Further, in the method of manufacturing an electronic component according to the present invention, if the divided hole is formed as the divided concave portion and the passage hole is formed as the passage concave portion, the air between the collective substrate and the sheet passes through the divided hole and the passage hole. It is difficult to remain between the collective substrate and the sheet because it is pushed out to the outside.

  According to the present invention, it is possible to solve a problem that occurs when a collective board in which sub boards such as module boards are assembled is divided into sub boards.

  The above-described object, other objects, features, and advantages of the present invention will become more apparent from the following description of embodiments for carrying out the invention with reference to the drawings.

It is a back view which shows an example of the aggregate substrate used for the manufacturing method of the electronic component concerning this invention. It is a back view which shows the other example of the aggregate substrate used for the manufacturing method of the electronic component concerning this invention. FIG. 2 is an illustrative sectional view showing a relationship between the collective substrate shown in FIG. 1 and a dicing sheet attached thereto. FIG. 3 is an illustrative sectional view showing a relationship between the collective substrate shown in FIG. 2 and a dicing sheet attached thereto. It is a reverse view which shows the further another example of the aggregate substrate used for the manufacturing method of the electronic component concerning this invention. It is a reverse view which shows the further another example of the aggregate substrate used for the manufacturing method of the electronic component concerning this invention. It is a back view which shows an example of the collective circuit board used for the manufacturing method of the conventional electronic component used as the background of this invention.

Example 1
In the first embodiment, a method for manufacturing a resin package component such as a communication module as an electronic component will be described.

  In order to manufacture the resin package component, first, for example, a rectangular plate-like collective substrate 10 shown in FIG. 1 is prepared.

  FIG. 1 is a back view showing an example of an aggregate substrate used in the method for manufacturing an electronic component according to the present invention. As the collective substrate 10 shown in FIG. 1, for example, a single-layer or multi-layer substrate such as a printed substrate, a ceramic substrate, or a substrate using resin is used.

  A collective substrate 10 shown in FIG. 1 includes a rectangular plate-shaped child substrate forming portion 12 in the center. The sub-substrate forming portion 12 is a portion in which a plurality of, for example, 64 rectangular sub-substrates 12a are arranged in a flat plate shape with, for example, eight vertical plates and eight horizontal plates. Each resin package component to be manufactured has each child substrate 12a.

  For example, a rectangular frame-shaped peripheral edge portion 14 is formed around the child substrate forming portion 12.

  Next, on the back surface side of the collective substrate 10, the division grooves 16 are formed in a lattice shape as division concave portions along the periphery of each of the plurality of sub substrates 12 a of the sub substrate formation portion 12. The division grooves 16 are grooves for dividing the collective substrate 10 into a plurality of sub-substrates 12a. The dividing groove 16 can be formed by, for example, a dicing apparatus.

  Further, on the back surface side of the collective substrate 10, a passage groove 18 that communicates with the dividing groove 16 as a passage recess is formed in the peripheral portion 14. In this case, the passage groove 18 is formed so as to communicate with the end portion of the collective substrate 10. In this case, the passage groove 18 is formed on the extension line of the dividing groove 16 so as to have the same depth and the same width as the dividing groove 16. The passage groove 18 is a groove for preventing air from accumulating between the back surface of the collective substrate 10 and the dicing sheet attached to the back surface of the collective substrate 10 when the dicing sheet is attached to the back surface of the collective substrate 10. . The passage groove 18 can also be formed by, for example, a dicing apparatus.

  Then, on the surface of the collective substrate 10, a component element packaged with a mold resin such as an epoxy resin for a resin package component is mounted on a portion that becomes each child substrate 12 a, and a mold resin is applied thereon.

  Then, a dicing sheet is attached to the back surface of the collective substrate 10 before the mold resin applied to the collective substrate 10 is dried and cured. In this case, since pressure cannot be applied to the side of the collective substrate 10 where the mold resin is applied, the collective substrate 10 and the dicing sheet are merely bonded to the extent that they come into contact with each other. Thus, as a dicing sheet affixed on the back surface of the collective substrate 10, for example, a resin tape coated with an adhesive substance on one side or the adhesiveness on one side is lowered by irradiating UV (ultraviolet) light, and the child substrate Resin tape that makes it easy to peel off is used.

  Then, in order to remove air (bubbles) in the mold resin, the collective substrate 10 is evacuated. At this time, in order to evacuate the collective substrate 10 with the dicing sheet attached thereto, deaeration is performed to remove air in the mold resin, and the back surface of the collective substrate 10 and the dicing sheet are bonded.

Here, a method of evacuating when the dicing sheet is attached to the collective substrate 10 will be described in detail.
First, the collective substrate 10 is placed on a jig for evacuating the collective substrate 10 with the back surface of the collective substrate 10 facing upward.
Furthermore, a dicing sheet is mounted on the cover on the cover side of the jig.
Then, the back surface of the collective substrate 10 and the dicing sheet are brought into contact with each other by closing the cover on the cover side of the jig.
Then, in a state where the back surface of the collective substrate 10 and the dicing sheet are in contact with each other, evacuation is performed, for example, at a vacuum pressure of −50 kPa to −100 kPa for 20 seconds or more.
As a result, since the air between the back surface of the collective substrate 10 and the dicing sheet is vacuum-sucked through the dividing grooves 16 and the passage grooves 18, the back surface of the collective substrate 10 and the dicing sheet are adhered and adhered.

  Then, when the collective substrate 10 to which the dicing sheet is affixed is taken out of the jig, the atmosphere is released from the vacuum. At that time, there is a differential pressure between the pressure in the jig and the air pressure between the collective substrate 10 and the dicing sheet. Since it occurs, the two are sufficiently adhered by the differential pressure.

Then, the collective substrate 10 is divided into a plurality of sub-substrates 12a (resin package parts) along the dividing grooves 16.
The peripheral portion 14 of the collective substrate 10 is formed with a portion without mold resin, and a mark for division is arranged on the portion of the collective substrate 10 corresponding to the portion, and the collective substrate 10 is used as a sub-substrate using the mark. It is divided into 12a.

In the manufacturing method of Example 1, since the dicing sheet can be attached simultaneously with evacuation of the mold resin, the process can be shortened compared to the case where they are separated.
If vacuuming is performed when the dicing sheet is attached, the depth and width of the dividing groove 16 and the passage groove 18 need not be considered much.

  Further, in the manufacturing method of Example 1, when the dicing sheet is attached to the back surface of the collective substrate 10, the air between the collective substrate 10 and the dicing sheet is exposed to the outside of the collective substrate 10 via the dividing grooves 16 and the passage grooves 18. Since it is extruded, it hardly remains between the collective substrate 10 and the dicing sheet. Therefore, when dividing the collective substrate 10 into a plurality of sub-substrates 12a, it is possible to prevent the sub-substrate 12a from being peeled off and scattered from the dicing sheet, and to reduce the scattering amount of the sub-substrate 12a. In particular, in the manufacturing method of the first embodiment, the passage groove 18 is formed so as to communicate with the end portion of the collective substrate 10, so that the passage groove 18 is formed so as not to communicate with the end portion of the collective substrate 10. It is possible to further prevent the child substrate 12a from being peeled off and scattered from the dicing sheet, and to further reduce the amount of scattering of the child substrate 12a.

  Furthermore, in the manufacturing method of Example 1, even when the cooling water is used when dividing the collective substrate 10 into the sub-substrate 12a, the cooling water hardly enters between the collective substrate 10 and the dicing sheet, and the back surface of the sub-substrate 12a. It is possible to reduce the discoloration of the electrode and the adhesion of foreign matters to the back surface thereof, and the occurrence of poor appearance of the electronic component can be prevented.

  Further, in the manufacturing method of the first embodiment, the passage groove 18 is formed on the extension line of the dividing groove 16 so as to have the same depth and the same width as the dividing groove 16, so that it is easy to manufacture together with the dividing groove 16.

(Example 2)
In the second embodiment, compared to the first embodiment, in order to manufacture a resin package component, first, for example, a rectangular plate-shaped collective substrate 10 shown in FIG. 2 is prepared instead of the collective substrate 10 shown in FIG.

  FIG. 2 is a back view showing another example of the collective substrate used in the method of manufacturing an electronic component according to the present invention. The aggregate substrate 10 shown in FIG. 2 has a channel groove 18 formed in the peripheral portion 14 on the back surface of the aggregate substrate 10 compared to the aggregate substrate 10 shown in FIG. It is shallower and narrower than 16.

Here, each dimension related to the collective substrate 10 used in the second embodiment will be described.
The thickness of the collective substrate 10 is preferably in the range of 0.1 mm to 1.0 mm, for example.
The depth of the dividing groove 16 formed in the sub-substrate forming portion 12 of the collective substrate 10 is preferably in a range larger than 0.02 mm and smaller than 0.2 mm, for example.
The width of the dividing groove 16 formed in the child substrate forming portion 12 of the collective substrate 10 is preferably in the range of 0.2 mm to 1.0 mm, for example.
The depth of the passage groove 18 formed in the peripheral portion 14 of the collective substrate 10 is preferably in the range of, for example, 0.02 mm or more and 0.1 mm or less. However, the depth of the passage groove 18 is shallower than the depth of the dividing groove 16 formed in the daughter board forming portion 12.
The width of the passage groove 18 formed in the peripheral portion 14 of the collective substrate 10 is preferably in the range of 0.05 mm to 0.6 mm, for example. However, the width of the passage groove 18 is narrower than the width of the dividing groove 16 formed in the daughter board forming portion 12.
In addition, each dimension related to the collective substrate 10 used in the above-described second embodiment is similarly used for each dimension related to other than the passage groove 18 in the collective substrate 10 used in the above-described first embodiment.

  In the manufacturing method of the second embodiment, not only the effects of the manufacturing method of the first embodiment are exhibited, but also when the dicing sheet is pasted using a differential pressure during vacuum, the passage groove is compared with the manufacturing method of the first embodiment. Since the depth of the groove 18 is shallow and the width of the passage groove 18 is narrow, for example, a differential pressure between the pressure in the jig for evacuating the collective substrate 10 and the air pressure between the collective substrate 10 and the dicing sheet. The air between the back surface of the collective substrate 10 and the dicing sheet is easily removed, and the dicing sheet can be easily attached to the back surface of the collective substrate 10.

Here, in the second embodiment, the differential pressure is more likely to be generated between the pressure in the jig for evacuating the collective substrate 10 and the air pressure between the collective substrate 10 and the dicing sheet than in the first embodiment. explain.
FIG. 3 is an illustrative sectional view showing a relationship between the collective substrate and the dicing sheet shown in FIG.
FIG. 4 is an illustrative sectional view showing a relationship between the collective substrate and the dicing sheet shown in FIG.
As in the first embodiment, in the collective substrate 10 shown in FIG. 1, when the passage groove 18 is deep as shown in FIG. 3 or when the passage groove 18 is wide, a differential pressure hardly occurs.
On the other hand, in the collective substrate 10 shown in FIG. 2 as in the second embodiment, when the depth of the passage groove 18 is shallow as shown in FIG. 4 or when the width of the passage groove 18 is narrow, the differential pressure is increased. Likely to happen.
Note that if at least one of the dividing groove 16 and the passage groove 18 on the back surface side of the collective substrate 10 is deep or wide, the differential pressure decreases, so that the air accumulated in the dividing groove 16 and the passage groove 18 does not escape completely. In addition, there are cases where the two do not adhere sufficiently. For this reason, it is preferable that at least one of the dividing groove 16 and the passage groove 18 is shallower or narrower for the close contact therebetween. In particular, when the passage groove 18 is shallow or narrow, the dicing sheet can be reliably attached to the collective substrate 10 at the periphery of the collective substrate 10 when the dicing sheet is attached to the back surface of the collective substrate 10. Thereby, it is possible to prevent the entry of air from the outside to the back side of the child substrate 12a due to the dicing sheet floating at the peripheral edge of the collective substrate 10.

(Example 3)
In the third embodiment, in order to manufacture a resin package component as compared with the second embodiment, first, for example, a rectangular plate-shaped collective substrate 10 shown in FIG. 5 is prepared instead of the collective substrate 10 shown in FIG.

  FIG. 5 is a back view showing still another example of the collective substrate used in the method of manufacturing an electronic component according to the present invention. The collective substrate 10 shown in FIG. 5 is divided into grooves on the back surface of the collective substrate 10 in which the passage grooves 18 formed in the peripheral portion 14 are formed in the child substrate forming portion 12 in the same manner as the collective substrate 10 shown in FIG. The passage groove 18 is formed at a position different from the extended line obtained by extending the dividing groove 16 as compared with the collective substrate 10 shown in FIG. That is, in the collective substrate 10 shown in FIG. 5, the passage groove 18 formed in the peripheral portion 14 has a structure that is narrower and shallower than the dividing groove 16 formed in the child substrate forming portion 12, and In this structure, the dividing groove 16 formed in the sub-substrate forming portion 12 and the passage groove 18 formed in the peripheral portion 14 are not connected on the same straight line.

  In the manufacturing method of the third embodiment, not only the effects of the manufacturing method of the second embodiment are obtained, but also the passage grooves 18 are formed shallower than the dividing grooves 16 as compared with the manufacturing methods of the first and second embodiments. Since it is formed narrower than the dividing groove 16 and is formed at a position different from the extension line extending the dividing groove 16, for example, the pressure in the jig for evacuating the collective substrate 10, the collective substrate 10 and the dicing sheet Since a differential pressure is likely to occur between the air pressure and the air between them, air hardly remains between the collective substrate 10 and the dicing sheet.

  Further, in the manufacturing method of the third embodiment, in particular, for example, a substrate recognition mark or the like should not be divided into the peripheral portion 14 on the extension line of the dividing groove 16 formed in the child substrate forming portion 12 on the back surface of the collective substrate 10. When there is a mark or the like, the risk of dividing the mark or the like by the passage groove 18 is reduced. Such a substrate recognition mark may be formed of a plurality of numbers or a two-dimensional barcode (QR code (registered trademark)).

Example 4
In the fourth embodiment, in order to manufacture a resin package component as compared with the first embodiment, first, for example, a rectangular plate-like collective substrate 10 shown in FIG. 6 is prepared instead of the collective substrate 10 shown in FIG.

  FIG. 6 is a back view showing still another example of the collective substrate used in the method of manufacturing an electronic component according to the present invention.

  FIG. 6 is a back view showing still another example of the collective substrate used in the method of manufacturing an electronic component according to the present invention. In the collective substrate 10 shown in FIG. 6, as compared with the collective substrate 10 shown in FIG. 1, a plurality of divided holes 17 are fixed in place of the divided grooves 16 around the portions to be the child substrates 12 a of the child substrate forming portion 12. Are formed with an interval of. Each of the divided holes 17 penetrates the back surface from the front surface of the collective substrate 10. The divided holes 17 can be formed by laser irradiation.

  Furthermore, in the collective substrate 10 shown in FIG. 6, a plurality of passage holes 19 are formed at regular intervals in place of the passage grooves 18 in the peripheral portion 14 as compared with the collective substrate 10 shown in FIG. 1. These passage holes 19 also penetrate the back surface from the front surface of the collective substrate 10. The passage hole 19 can also be formed by laser irradiation.

  In the manufacturing method of Example 4, when a dicing sheet is attached to the back surface of the collective substrate 10, the air between the collective substrate 10 and the dicing sheet is pushed out of the collective substrate 10 through the divided holes 17 and the passage holes 19. Therefore, it is difficult to remain between the collective substrate 10 and the dicing sheet. Therefore, when dividing the collective substrate 10 into a plurality of sub-substrates 12a, it is possible to prevent the sub-substrate 12a from being peeled off and scattered from the dicing sheet, and to reduce the scattering amount of the sub-substrate 12a.

  Furthermore, in the manufacturing method of Example 4, even when cooling water is used when dividing the collective substrate 10 into the sub-substrate 12a, the cooling water hardly enters between the collective substrate 10 and the dicing sheet, and the back surface of the sub-substrate 12a. It is possible to reduce the discoloration of the electrode and the adhesion of foreign matters to the back surface thereof, and the occurrence of poor appearance of the electronic component can be prevented.

  The structure of an electronic component such as a module to which the present invention is applied is not limited to a structure in which a component element is mounted on the surface of a daughter board and the component element is covered with a mold resin such as an epoxy resin. There are a structure in which component elements are mounted on the surface and the mounting surface is covered with a metal cap, or a structure in which only electrodes are formed on the surface of the sub board.

  Further, in each of the manufacturing methods of the first embodiment, the second embodiment, and the third embodiment described above, the passage groove 18 formed in the collective substrate 10 communicates with the dividing groove 16 but does not communicate with the end portion of the collective substrate 10. You may form in. Even in this case, air between the collective substrate 10 and the dicing sheet is likely to spread into the dividing grooves 16 and the passage grooves 18, so that it hardly remains between the collective substrate 10 and the dicing sheet.

  Further, in each of the manufacturing methods of the first embodiment, the second embodiment, and the third embodiment described above, no groove is provided on the surface side of the collective substrate 10, but the collective substrate is formed around the child substrate 12a on the front surface side of the collective substrate 10. Half-cut grooves shallower than the thickness of 10 may be provided, or a plurality of divided holes penetrating the back surface from the front surface of the collective substrate 10 may be provided around the sub-substrate 12a in the collective substrate 10.

  The method of manufacturing an electronic component according to the present invention is particularly preferably used for manufacturing an electronic component having a sub-board, for example, a module such as Bluetooth (registered trademark) or wireless LAN (WLAN).

DESCRIPTION OF SYMBOLS 10 Collective substrate 12 Sub-substrate forming portion 12a Sub-substrate 14 Peripheral portion 16 Dividing groove 17 Dividing hole 18 Passing groove 19 Passing hole 20 Dicing sheet

Claims (7)

An electronic component manufacturing method for manufacturing an electronic component having a sub-board,
Preparing a collective substrate having a sub-substrate forming portion in which a plurality of sub-substrates are assembled and a frame-shaped peripheral portion formed around the sub-substrate forming portion;
Forming a dividing recess for dividing the collective substrate into the plurality of sub-substrates around each of the plurality of sub-substrates in the sub-substrate forming portion on the back surface side of the collective substrate;
Forming a passage recess in the peripheral portion on the back side of the collective substrate;
A method for manufacturing an electronic component, comprising: attaching a sheet to a back surface of the collective substrate; and dividing the collective substrate into the plurality of sub-substrates along the divided recesses. The step of forming the split concave portion includes a step of forming a split groove along the periphery of each of the plurality of sub-substrates of the sub-substrate forming portion on the back surface side of the collective substrate,
2. The method of manufacturing an electronic component according to claim 1, wherein the step of forming the passage recess includes a step of forming a passage groove that communicates with the dividing groove in the peripheral portion on a back surface side of the collective substrate.   The method of manufacturing an electronic component according to claim 2, wherein the passage groove is formed to communicate with an end portion of the collective substrate.   The method of manufacturing an electronic component according to claim 2, wherein the passage groove is formed shallower than the division groove.   The method for manufacturing an electronic component according to claim 2, wherein the passage groove is formed narrower than the division groove.   The method for manufacturing an electronic component according to claim 2, wherein the passage groove is formed at a position different from an extension line obtained by extending the division groove. The step of forming the divided concave portion includes a step of forming a divided hole penetrating to the front surface side of the collective substrate around each of the plurality of sub substrates of the sub substrate forming portion on the back surface side of the collective substrate,
2. The method of manufacturing an electronic component according to claim 1, wherein the step of forming the passage recess includes a step of forming a passage hole penetrating the front surface side of the collective substrate in the peripheral portion on the back surface side of the collective substrate.

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