JP2013230117A - Heating and cooling device and heating and cooling method using same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide: a heating and cooling device that can be operated at low cost, high speed, and low power consumption regardless of the accuracy of the thermal contact surface; and a heating and cooling method using the same.SOLUTION: A heating and cooling device 20 is provided with a support 2 for placing an object to be treated 1, a hot air flow source 9 for blowing a hot air flow on the surface of the object to be treated 1 placed on the support 2, and a low-temperature air flow source 14 for blowing a low-temperature air flow on the surface of the object to be treated 1 placed on the support 2.

Description

  The present invention relates to a heating / cooling apparatus and a heating / cooling method using the same.

  There is known a method of giving a predetermined heat history by alternately performing heating and cooling on a processing object and observing a change in characteristics of the processing object. As a heating / cooling test using such a method, for example, there is a heating / cooling test of a microchip for medical examination containing a trace amount of liquid.

  FIG. 1 shows a schematic diagram of a conventional heating / cooling device for a medical examination microchip used in the heating / cooling test. The conventional heating / cooling device is configured so that high temperature water and low temperature water are alternately switched from a constant temperature container containing high temperature water and a constant temperature container containing low temperature water to a temperature cycle stage on which a microchip containing a small amount of reaction liquid of about several μL is placed. The heat history is given by supplying. Such a technique is disclosed in Patent Document 1, for example.

JP 2011-250800 A

However, with such a configuration, it is difficult to shorten the time for switching between high-temperature water and low-temperature water, and it takes time to reach the target heating temperature and target cooling temperature, making it difficult to shorten the temperature cycle time as a whole. ing. Here, in the conventional heating and cooling apparatus as shown in FIG. 1, the heating time and the cooling time are each about 10 seconds, and the total time required for repeated heating is a minimum of 4 minutes in total.
Furthermore, in order to uniformly heat and cool the surface of the object to be processed, it is necessary to ensure thermal contact between the temperature cycle stage and the object to be processed, and the contact surface between the temperature cycle stage and the object to be processed is accurate. Since it needs to be processed well, it is a barrier to cost reduction during mass production.

  In addition, when heating is performed with an electric heater, it is necessary to control the current gradually to be reduced in the vicinity of the specified temperature in order to eliminate the temperature overshoot, which requires much time. Moreover, relatively large electric power is required for heating and cooling, and an external power source or a large-capacity livestock battery is required. Furthermore, it takes time and effort to design a mechanism including a program. For example, the thermal cycle mechanism alone costs several hundred thousand yen or more.

  Therefore, an object of the present invention is to provide a heating / cooling apparatus and a heating / cooling method using the same that can be implemented at low cost, high speed, and low power consumption regardless of the accuracy of the thermal contact surface.

  In order to achieve the above object, the present inventors have conducted extensive research. Instead of using high-temperature water and low-temperature water for heating and cooling, the high-temperature airflow from the high-temperature airflow source and the low-temperature airflow from the low-temperature airflow source are alternately used. It has been found that a complicated mechanism design is not required by switching to, and heating and cooling of the object to be processed can be performed at high speed and with low power consumption.

  The present invention completed on the basis of the above knowledge is, in one aspect, a heating and cooling device that alternately heats and cools a processing object, and a support unit for providing the processing object, and the support Heating and cooling provided with a high-temperature air flow source that blows a high-temperature air flow onto the surface of the processing object provided on the part and a low-temperature air source that blows a low-temperature air current onto the surface of the processing object provided on the support part Device.

  In one embodiment, the heating and cooling device according to the present invention is a steam generator in which the high-temperature air flow source that blows the high-temperature air stream blows steam.

  In another embodiment of the heating and cooling device according to the present invention, the low temperature air flow source for blowing the low temperature air flow is a blower for blowing air.

  In still another embodiment, the heating / cooling device according to the present invention alternately switches the blowing of the high temperature airflow from the high temperature airflow source and the blowing of the low temperature airflow from the low temperature airflow source at a predetermined time interval. A control unit is provided.

  In still another embodiment of the heating / cooling device according to the present invention, when the high-temperature airflow and the low-temperature airflow are switched between the support portion and the high-temperature airflow source and the cold-airflow air source, the high-temperature airflow and the low-temperature airflow are processed. A shutter is provided for blocking the spraying on the object.

  In still another embodiment of the heating / cooling device according to the present invention, the object to be processed is a small chip containing medical trace liquid.

  In another aspect of the present invention, a support portion provided with a processing object is prepared, and a high temperature airflow from a high temperature airflow source and a low temperature airflow from a low temperature airflow source are alternately applied to the processing object on the support portion. This is a heating / cooling method of switching and spraying.

  In one embodiment of the heating and cooling method according to the present invention, the high-temperature air flow source that blows the high-temperature air flow is a steam generator that blows steam.

  In another embodiment of the heating and cooling method according to the present invention, the low-temperature air flow source that blows the low-temperature air flow is a blower that blows air.

  In still another embodiment of the heating and cooling method according to the present invention, the support portion is provided horizontally, and a high-temperature airflow from the high-temperature airflow source and a low-temperature airflow from the low-temperature airflow source are blown onto the surface of the support portion.

  In still another embodiment of the heating and cooling method according to the present invention, the support portion is provided vertically, and a high-temperature airflow from the high-temperature airflow source and a low-temperature airflow from the low-temperature airflow source are blown onto the surface of the support portion.

  In still another embodiment of the heating and cooling method according to the present invention, a shutter is provided between the support portion and the high temperature air flow source and the cold air flow source, and when the high temperature air flow and the low temperature air flow are switched by the shutter, Block the blowing of high-temperature and low-temperature airflow onto the object to be processed.

  In still another embodiment of the heating and cooling method according to the present invention, the object to be processed is a small chip containing a medical trace amount liquid.

  According to the present invention, it is possible to provide a heating / cooling apparatus and a heating / cooling method using the same that can be implemented at low cost, high speed, and low power consumption regardless of the accuracy of the thermal contact surface.

It is a schematic diagram of the conventional heating and cooling apparatus. It is a mimetic diagram of a heating cooling device concerning an embodiment of the present invention. It is an example of the heat history of the heating-cooling method of this embodiment. It is a graph which shows the transient change of chip | tip back surface temperature (center part) at the time of applying the saturated water vapor | steam of Example 1 to a quartz chip | tip for about 15 seconds. It is the graph which expanded the time width at the time of the heating start of FIG. It is the graph which expanded the time width at the time of cooling of FIG. It is a graph which shows the time change of chip back surface temperature at the time of repeating heating (saturated steam) and cooling (fan) of Example 1 at intervals of 1 second. It is a graph which shows the time change of chip back surface temperature at the time of repeating heating (saturated steam) and cooling (fan) of Example 1 at intervals of 3 seconds. It is a graph which shows the time change of chip back surface temperature at the time of repeating heating (saturated steam) and cooling (fan) of Example 1 at intervals of 5 seconds. It is a graph which shows the time change (distance 10mm from a nozzle) of the temperature distribution of a chip | tip radial direction at the time of spraying a vapor | steam horizontally from the nozzle of Example 2, and spraying it on the microchip surface. It is a graph which shows the time change (distance 20mm from a nozzle) of the temperature distribution of a chip | tip radial direction at the time of spraying a vapor | steam horizontally from the nozzle of Example 2, and spraying it on the microchip surface. It is a graph which shows the time change (distance 30mm from a nozzle) of the temperature distribution of a chip | tip radial direction at the time of spraying a vapor | steam horizontally from the nozzle of Example 2, and spraying it on the microchip surface. It is a graph which shows the time change (distance 10mm from a nozzle) of the temperature distribution of the radial direction which passes along the chip | tip center when vapor | steam is jetted upward from the nozzle of Example 2 and it sprayed on the microchip surface. It is a graph which shows the time change (distance 20mm from a nozzle) of the temperature distribution of the radial direction which passes along the chip | tip center when vapor | steam is jetted upward from the nozzle of Example 2 and it sprayed on the microchip surface. It is a graph which shows the time change (distance 30mm from a nozzle) of the temperature distribution of the radial direction which passes along the chip | tip center when vapor | steam is jetted upward from the nozzle of Example 2 and it sprayed on the microchip surface.

(Configuration of heating and cooling device)
In FIG. 2, the schematic diagram of the heating-cooling apparatus 20 which concerns on embodiment of this invention is shown. The heating / cooling device 20 is a device that alternately performs heating and cooling on the processing object, and is not particularly limited as the processing object. In the present embodiment, a small chip (microchip 1) containing a trace amount liquid for medical examination is employed as the processing object. The microchip 1 is preferably made of quartz because it does not react with a liquid for medical examination and has good thermal conductivity. Further, the shape is not particularly limited. In this embodiment, the microchip 1 is formed in a disk shape having a diameter of about 10 mm and a thickness of about 0.3 mm, and a plurality of microchannels having a cross section of 100 μm square are formed. By adopting such a shape, the heat capacity is greatly reduced by setting the volume of the test solution to several microliters in total for the plurality of flow paths.

  The heating / cooling device 20 includes a support plate 2 (support portion) for providing the microchip 1, and a steam generator 9 that blows a steam flow 8 (high-temperature airflow) onto the surface of the microchip 1 provided on the support plate 2. (A high-temperature air flow source) and a blower 14 (a low-temperature air flow source) that blows an air flow 13 (low-temperature air flow) onto the surface of the microchip 1 provided on the support plate 2. The heating / cooling device 20 includes a water supply container (not shown) that supplies water for the steam flow 8 to the steam generator 9. The steam generator 9 is provided with a steam nozzle 3 through which the steam flow 8 is blown out so as to face the support plate 2. An air nozzle 4 through which an air flow 13 is blown out is provided in the blower 14 so as to face the support plate 2. The steam nozzle 3 and the air nozzle 4 are provided at positions separated from the support plate 2 by about 10 to 30 mm (distance X1, distance X2), for example. In the present embodiment, a steam flow is used as the high-temperature air flow and air (air) dried as the low-temperature air flow is used. However, the air flow is not particularly limited as long as it is a predetermined high-temperature and low-temperature air flow. In the present invention, “high temperature” and “low temperature” mean temperatures that are relative to each other, and depend on the thermal history desired to be given to the object to be processed, but typically “high temperature” is 85 to 96. "Cold" indicates 57-65 ° C. In the embodiment of the present invention, saturated steam at 100 ° C. is used as the vapor flow 8, and air at normal temperature is used as the air flow 13.

  The heating / cooling device 20 includes a control panel 10 (control unit) that alternately switches the blowing of the steam flow 8 from the steam generator 9 and the blowing of the air flow 13 from the blower 14 at predetermined time intervals. Yes. The control panel 10 is supplied with power from a power source 12 such as a dry battery, a portable live battery, or an AC external power source. The steam generator 9 and the blower 14 are connected to the control panel 10 by electric wires and communication lines 11 and 11 ′, respectively, so that electric power is supplied and controlled.

  The heating / cooling device 20 is configured so that the steam flow 8 and the air flow 13 are switched between the support plate 2 and the steam nozzle 3 provided in the steam generator 9 and the air nozzle 4 provided in the blower 14. And shutters 5, 5 ′ for blocking the air flow 13 from being blown onto the microchip 1. The shutter 5 is provided between the support plate 2 and the steam nozzle 3 provided in the steam generator 9 and blocks the spraying of the steam flow 8 to the microchip 1. The shutter 5 ′ is provided between the support plate 2 and the air nozzle 4 provided in the blower 14 and blocks the blowing of the air flow 13 to the microchip 1. The shutters 5, 5 ′ are connected to the control panel 10 by electric wires and communication lines (not shown), so that electric power is supplied and controlled. By opening and closing the shutters 5 and 5 ′, the blowing of the vapor flow 8 and the air flow 13 to the microchip 1 can be started or blocked instantaneously. In particular, when the blower 14 is stopped, it is preferable to use the shutters 5 and 5 ′ when the air flow 13 does not stop instantaneously due to a “dull” state. The material for forming the shutters 5 and 5 ′ is not particularly limited, but for example, a low thermal conductivity material is preferable, and it can be formed with a Teflon (registered trademark) plate or the like.

  A short pipe-shaped hood 6 is provided on the support plate 2 so as to surround the microchip 1, and a thermocouple 7 is attached to the inside of the hood 6. When the thermocouple 7 is directly attached to the microchip 1, the temperature at the attachment location is lowered and accurate temperature measurement becomes difficult. Thus, as in the inside of the hood 6, the position separated from the microchip 1. It is preferable to attach to.

  As shown in FIG. 2, the heating / cooling device 20 is provided with the support plate 2 vertically, and the steam flow 8 from the steam generator 9 and the air flow 13 from the blower 14 are provided on the surface of the microchip 1 on the support plate 2. However, the present invention is not limited to this. That is, the support plate 2 may be provided horizontally, and the steam flow 8 from the steam generator 9 and the air flow 13 from the blower 14 may be sprayed onto the surface of the microchip 1 on the support plate 2. At this time, the vapor flow 8 and the air flow 13 may be blown from the upper side to the surface of the microchip 1 on the support plate 2 or may be blown from the lower side. According to such a configuration, the temperature of the microchip 1 drops even when the distances between the vapor flow 8 and the air flow 13 and the support plate 2 are larger than when the support plate 2 is provided vertically. It is preferable because it becomes difficult.

(Heating / cooling method)
Next, a method for heating and cooling a small chip (microchip 1) containing a trace amount liquid for medical examination using the heating and cooling apparatus 20 according to the embodiment of the present invention will be described. FIG. 3 shows an example of the heat history of the heating and cooling method of the present embodiment.

(1) First, the microchip 1 is installed in a portion of the support plate 2 surrounded by the hood 6. Further, the shutter 5 provided between the vapor nozzle 3 and the microchip 1 is closed, and the shutter 5 ′ provided between the air nozzle 4 and the microchip 1 is opened.
(2) Next, the steam generator 9 is started, the shutter 5 ′ is closed, the shutter 5 is opened, and the steam flow 8 is sprayed onto the microchip 1 for a predetermined time (t1). The steam flow temperature (T2) at this time is measured with the thermocouple 7.
(3) After a predetermined time (t1) has elapsed, the shutter 5 is closed, the shutter 5 ′ is opened, and the air flow 13 is blown onto the microchip 1 for a predetermined time (t2). The microchip temperature (T1) at this time is measured with the thermocouple 7. Here, since the microchip has a small heat capacity, when the temperature is directly measured by the thermocouple 7, heat escapes and accurate temperature measurement becomes difficult. For this reason, a black body spray or the like is applied thinly on the back surface of the microchip, and the back surface temperature when heated by spraying steam on the surface is measured in a non-contact manner using infrared thermography or the like, and correlated with the temperature of the thermocouple 7. The obtained value is defined as the microchip temperature (T1).
(4) After repeating this pulse-like operation N times, the microchip 1 is replaced. At this time, it may be exchanged by a microchip exchange device.
These operations (1) to (4) are sequentially performed on each microchip 1 in order.

  When the vapor flow 8 reaches the surface of the microchip 1, it immediately condenses and becomes fine water droplets, and the microchip 1 having a small heat capacity is rapidly heated to the temperature T2 and maintained. If the microchip 1 is provided at a position separated from the steam generator 9 by the distance X1, it can be heated by the accompanying flow 15 at an arbitrary steam temperature of 100 ° C. or less, and a large amount of fine droplets can be blown as humid air. it can.

  When a dry air stream 13 is sprayed after a predetermined time (t1), the condensed fine water droplets evaporate to cool and maintain the microchip 1 to the temperature T1. In the cooling process with dry air, fine droplets on the surface of the microchip 1 can be rapidly evaporated, so that the liquid can be instantaneously cooled and adjusted to an arbitrary target temperature by adjusting the distance X2 and the cooling time t2. it can. Moreover, it can cool to arbitrary target temperature also by heating dry air according to the temperature which should be cooled. Thus, the heating and cooling conditions can be arbitrarily adjusted by adjusting the times t1 and t2 and the distances X1 and X2 in advance with respect to the temperatures T1 and T2. For example, by adjusting the distance X1, the amount of the accompanying flow 15 changes, and the temperature T2 of the vapor flow 8 reaching the microchip 1 can be changed. Further, by adjusting the distance X2, the flow velocity of the air flow 13 can be changed, and thereby the temperature T1 can be changed. The cooling time t2 may be changed in order to change the cooling temperature T1.

  The blower 14 and the steam generator 9 can be ejected and stopped in a short time, but the shutters 5 and 5 'are effective as means for starting and stopping heating and cooling instantaneously at a determined timing.

  The control panel 10 controls the set temperature and the set time. By controlling the times t1 and t2 by feeding back the temperature of the thermocouple 7, it is possible to prevent the patterns of the temperatures T1 and T2 from collapsing.

  When the cooling temperature T1 is considerably lower than the heating temperature T2, it is effective to reduce the humidity of the air flow 13, so that the desiccant can be attached to the air suction side of the blower 14.

  If the microchip 1, the steam nozzle 3, and the air nozzle 4 are configured to be contained in a closed space, dry air can be introduced from the outside by the blower 14 to keep the closed space at a low humidity. For this reason, since the reduction of the effect of the accompanying flow 15 which cools the steam flow 8 is suppressed, it is preferable.

  Conventional heating and cooling devices require a large amount of power and are generally connected to an external power source. However, according to the present invention, the heating time is shortened, and a dry battery or a portable live battery can be used as the power source 12. it can. Thereby, the apparatus can be made portable and can be used outside the test room or particularly outdoors. Such an effect is further enhanced when the heat capacity is reduced by using a quartz microchip as the object to be processed as in this embodiment. Further, according to the present invention, the configuration of the heating / cooling device is simplified, and it is small and inexpensive.

(Example of final product specifications)
Although it is not limited, one specification example in the final product of the heating / cooling device 20 and the heating / cooling method using the same according to the present invention is shown below.
(A) A mechanism for applying a thermal cycle to a disk-shaped quartz microchip having a thickness of 0.3 mm and a diameter of 10.4 mm.
(B) The thermal cycle is a cycle of 94 ° C. × 1 second and 65 ° C. × 1 second, and the cooling time from 94 ° C. to 65 ° C. and the heating time from 65 ° C. to 94 ° C. are each within 1 second. To do.
(C) The thermal cycle is performed 35 times without overshooting, and the entire cycle is completed within 140 seconds.
(D) The temperature accuracy and temperature distribution in the microchip during the thermal cycle are both controlled within 0.5 ° C.
(E) The thermal cycle mechanism can be driven by a 1.5V battery.
(F) The manufacturing cost of the thermal cycle mechanism is set to be 5000 yen or less as of 2012.

  Next, examples according to the present invention will be described below, but the present invention is not limited thereto.

Example 1
A heating / cooling test of a disk-shaped quartz chip (thickness 0.3 mm, diameter 10.4 mm) was performed using the heating / cooling apparatus having the configuration shown in FIG. 2, and the following items were evaluated.
(A) Transient change of chip back surface temperature when saturated vapor is applied to quartz chip at room temperature (B) Transient change of chip back surface temperature in natural air cooling when heating is stopped (C) Heating surface is changed simultaneously with stopping heating Transient change of chip back surface temperature when cooled by fan (blower) (D) Transient change of temperature when heating and cooling (with fan) are repeated at intervals of 1 second, 3 seconds and 5 seconds

Black body spray (emissivity 0.94) is thinly applied to the back of the quartz chip to a thickness of 0.057 mm, and the back surface temperature when heated by spraying steam on the surface is infrared thermography (FLIR T250, frame Time: 9 Hz).
The edge of the quartz chip is sandwiched between two 1 mm thick Teflon (registered trademark) sheets with a 9.8 mm diameter hole in the center, fixed vertically, and the steam generator nozzle (15 mm away from the chip) A quartz chip was heated by spraying steam in the horizontal direction with an inner diameter of 4 mm.
Since this steam generator tends to generate superheated steam even if the amount of heating is suppressed, when saturating steam, the gauze containing water is wound around the nozzle, the outlet temperature is lowered, and the diameter is reduced. Using a 0.1 mm ultrafine thermocouple, the test was conducted after confirming that the steam flowing out from the nozzle outlet was at the saturation temperature.
When heating with steam and cooling with air from the fan are repeated alternately, the air outlet is directed in a different direction from the quartz chip for heating, and a Teflon (registered trademark) plate (80 mm in front of the steam nozzle for cooling). X50 mm x 10 mm) was provided as a shutter, and cooled by blowing air from a position 50 mm away from the quartz chip while preventing vapor from hitting the quartz chip.

FIG. 4 shows a transient change in the chip back surface temperature (center part) when saturated water vapor is applied to the quartz chip for about 15 seconds. FIG. 5 is a graph in which the time width at the start of heating is enlarged. FIG. 6 is a graph in which the time width during cooling is enlarged.
The temperature of the back of the chip is raised to 80 ° C or higher in about 0.3 seconds after the start of heating (after steam ejection), keeps 90-92 ° C (with fan) during heating, and reaches about 65 ° C after stopping heating. You can see that it descends in 2 seconds. Rapid temperature rise is considered to be due to heating by condensation of steam, and rapid temperature drop is due to evaporation of condensed droplets. The reason why the temperature during heating is about 10 ° C. lower than the saturation temperature is considered to be due to heat radiation from the chip back surface.

FIG. 7 shows the test results of the time change of the chip back surface temperature when heating (saturated steam) and cooling (fan) are repeated at intervals of 1 second, FIG. 8 is repeated at intervals of 3 seconds, and FIG. 9 is repeated at intervals of 5 seconds.
It can be seen that both of them are repeated up and down at a temperature range of about 40 ° C. The test results show that there are few stable times in the high-temperature part and the low-temperature part respectively, but this can be adjusted by appropriately blowing high-temperature and low-temperature steam or air for a predetermined time, adjusting the blowing speed, etc. It is.

(Example 2)
It is expected that the distance from the nozzle to the quartz chip and the jet direction of the vapor from the nozzle will affect the temperature uniformity in the chip surface when the vapor is applied. Therefore, a heating / cooling test of a disk-shaped quartz chip (thickness 0.3 mm, diameter 10.4 mm) was performed using the heating / cooling apparatus having the configuration shown in FIG. 2, and the following items were applied to a radiation thermometer (thermography). Was used to evaluate.
(E) Temporal change in chip back surface temperature distribution when steam is sprayed horizontally from nozzle and the distance to the chip is changed (F) Chip when steam is sprayed upward from nozzle and the distance to the chip is changed Temporal change of back surface temperature distribution

(When steam is sprayed horizontally from the nozzle and sprayed onto the surface of the microchip)
A heating / cooling device having a configuration in which nozzles are provided on the side rather than in the vertical direction with respect to the microchip was prepared. In this case, saturated steam is ejected horizontally from the nozzle and sprayed onto the microchip surface.
Using a steam generator, saturated steam is ejected horizontally from the nozzle (inner diameter 3.5 mm) (heating amount 200 W), the distance from the nozzle to the tip is 10 mm, 20 mm, and 30 mm, and perpendicular to the tip surface (diameter 10 mm). FIGS. 10 to 12 show temporal changes in the temperature distribution in the radial direction of the chip (measurement interval Δt = about 0.165 seconds (6 Hz)), respectively. Here, x represents coordinates taken downward from the upper end of the chip through the center. Moreover, in each figure, the several curve which shows a temperature change represents the change about every 0.165 second in an order from the lower side to the upper side, respectively.
From FIG. 10, it can be seen that at a distance of 10 mm, the chip temperature approaches the final temperature in about 0.5 seconds after the start of heating, and the temperature reached is relatively uniform within a radius of 4 mm. Note that the unevenness of temperature near x = 5 mm is considered to be due to a through hole in the center of the chip (diameter of about 0.3 mm, no blackbody spray paint adhered), and the end of the chip (x <1 mm and x > 9 mm), the temperature is remarkably decreased because the heat escapes to the Teflon (registered trademark) plate for fixing chips (a jig for fixing the entire circumference). It can be seen that the temperature asymmetry above (x <5 mm) and below (x> 5 mm) the chip is relatively small at the ultimate temperature. 11 and 12, as the distance from the nozzle is increased to 20 mm and 30 mm, both the rate of temperature rise and the final temperature decrease remarkably, and the temperature drop at the peripheral part becomes remarkable, resulting in a large temperature distribution in the chip surface. occured. The reason why the temperature at the lower end of the chip is lower than that at the upper end is considered to be that the vapor flow tends to rise by buoyancy before colliding with the chip.

(When steam is blown upward from the nozzle and sprayed onto the surface of the microchip)
A heating / cooling device having a nozzle provided below the microchip was prepared. In this case, saturated vapor is ejected upward from the nozzle and sprayed onto the microchip surface.
When the saturated steam is ejected upward from the nozzle (heating amount 200 W), and the steam collides with the chip surface horizontally fixed at a position of 10 mm, 20 mm, and 30 mm from the nozzle, the temperature distribution in the radial direction passing through the center of the chip Changes with time (measurement interval Δt = about 0.165 seconds (6 Hz)) are shown in FIGS. Moreover, in each figure, the several curve which shows a temperature change represents the change about every 0.165 second in an order from the lower side to the upper side, respectively. When the steam was jetted vertically upward and applied to the tip, the temperature did not drop easily even when the distance from the nozzle was larger compared to the horizontal jet. Note that the temperature drop at the end is significant, but this is also because the center axis of the nozzle and the tip is misaligned, or the flow after the collision of the steam deviates from the axis target due to a slight tilt of the tip. Is considered. Also, steam (air mixture with air) collides with the lower surface of the chip surrounded by the Teflon (registered trademark) jig, and the air remaining after the condensation of the steam accumulates, preventing fresh steam from hitting the chip. May also have an effect.

DESCRIPTION OF SYMBOLS 1 Microchip 2 Support plate 3 Steam nozzle 4 Air nozzle 5, 5 'Shutter 6 Hood 7 Thermocouple 8 Steam flow 9 Steam generator 10 Control board 11, 11' Electric wire and communication line 12 Power supply 13 Air flow 14 Blower 15 Associated flow

Claims (13)

A heating and cooling device that alternately performs heating and cooling on a processing object,
A support for providing a processing object;
A high-temperature air flow source that blows a high-temperature air flow on the surface of the processing object provided on the support;
A low-temperature air source that blows a low-temperature air stream on the surface of the object to be processed provided on the support;
Heating and cooling device with   The heating and cooling device according to claim 1, wherein the high-temperature air flow source for blowing the high-temperature air flow is a steam generator for blowing steam.   The heating / cooling device according to claim 1 or 2, wherein the low-temperature air flow source for blowing the low-temperature air flow is a blower for blowing air.   The control part according to any one of claims 1 to 3, further comprising: a control unit that alternately switches the blowing of the high temperature airflow from the high temperature airflow source and the blowing of the low temperature airflow from the low temperature airflow source at a predetermined time interval. Heating and cooling device.   A shutter for blocking blowing of the high-temperature airflow and the low-temperature airflow onto the object to be processed when switching between the high-temperature airflow and the low-temperature airflow between the support portion and the high-temperature airflow source and the cold-airflow air source. Item 5. The heating / cooling device according to any one of Items 1 to 4.   The heating / cooling device according to any one of claims 1 to 5, wherein the object to be treated is a small chip containing a medical trace amount liquid.   A heating / cooling method in which a support portion provided with a processing object is prepared, and a high-temperature airflow from a high-temperature airflow source and a low-temperature airflow from a low-temperature airflow source are alternately switched and sprayed onto the processing object on the support portion.   The heating and cooling method according to claim 7, wherein the high-temperature air flow source that blows the high-temperature air flow is a steam generator that blows steam.   The heating and cooling method according to claim 7 or 8, wherein the low-temperature air flow source that blows the low-temperature air flow is a blower that blows air.   The heating and cooling method according to any one of claims 7 to 9, wherein the support portion is provided horizontally, and a high-temperature airflow from the high-temperature airflow source and a low-temperature airflow from a low-temperature airflow source are blown onto the surface of the support portion.   The heating and cooling method according to any one of claims 7 to 9, wherein the support portion is provided vertically, and a high-temperature airflow from the high-temperature airflow source and a low-temperature airflow from a low-temperature airflow source are blown onto the surface of the support portion.   A shutter is provided between the support portion and the high temperature air flow source and the cold air flow source, and the shutter blocks the blowing of the high temperature air flow and the low temperature air flow to the processing object when switching between the high temperature air flow and the low temperature air flow. The heating and cooling method according to claim 7.   The heating and cooling method according to any one of claims 7 to 12, wherein the object to be processed is a small chip containing a medical trace amount liquid.