JP2013223016A - Imaging apparatus, vibration control apparatus, and vibration control method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To more effectively remove dust.SOLUTION: An imaging apparatus comprises: a support member for supporting a moving device; vibration means for vibrating an optical member installed on the front surface of the imaging device; and control means for controlling the vibration by the vibration means. The control means controls the vibration means to vibrate the optical member and the support member with two types of frequencies deviated from a first frequency near the characteristic frequency of the optical member by a portion of a second frequency near the characteristic frequency of the support member.

Description

  The present invention relates to an imaging device, a vibration control device, and a vibration control method.

  In recent years, imaging devices such as digital still cameras and video cameras have become widespread and commonly used. Such an image pickup apparatus is capable of providing a higher quality image with an increase in the number of pixels of, for example, a CCD (Charge Coupled Device) which is an image pickup element. In general, such an imaging apparatus is configured so that a single-lens reflex finder apparatus can be detachably provided to the imaging apparatus body, and a user selects a desired optical system (lens) according to shooting. be able to.

  In such a digital camera capable of exchanging lenses, when the lens is detached from the imaging apparatus main body, dust or the like floating in the air may enter the imaging apparatus main body. Further, a mechanism that operates mechanically, such as a shutter and a diaphragm mechanism, is provided inside the imaging apparatus main body, and dust or the like may be generated by the operation of these mechanisms. When such dust or the like adheres to the filter surface of the image sensor, there arises a problem that the dust is reflected in the captured image.

  In order to solve such a problem, in such an interchangeable lens digital camera, a vibration member is disposed between the image pickup device and the optical system to prevent dust from being picked up by the image pickup device and the filter, and adhere to the dustproof member. A system that removes dust and the like by vibration has been developed (see, for example, Patent Document 1). Patent Document 2 below describes the configuration of an electronic imaging apparatus including dust removing means that vibrates an optical element at at least two types of resonance frequencies and removes dust adhering to the surface of the optical element. Yes.

JP 2009-135910 A JP 2007-74758 A

  In a conventional dust removal method for an interchangeable lens digital camera, the removal drive is performed by driving the frequency of the voltage applied to the piezoelectric element at the resonance frequency of the vibration member. For example, in the invention disclosed in Patent Document 1 described above, the resonance frequency of the vibrating member is vibrated sequentially in time. By driving at resonance frequencies of different orders in time, the nodes having low removal ability (small vibration) generated during standing wave driving are removed so as to cancel out. However, control such as changing the order over time leads to a complicated circuit configuration. In addition, a step-up transformer used in a drive circuit for a piezoelectric element is difficult to drive in a wide frequency range because there is a physical restriction in a band in which a desired step-up rate can be obtained.

  Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to excite vibrations in a wide range of natural frequencies including a low frequency range with a simpler circuit. It is another object of the present invention to provide a new and improved imaging device, vibration control device, and vibration control method.

  In order to solve the above-described problems, according to an aspect of the present invention, a support member that supports an imaging element, an excitation unit that vibrates an optical member installed on the front surface of the imaging element, and the excitation unit Control means for controlling vibration, wherein the control means is shifted from the first frequency near the natural frequency of the optical member by a second frequency near the natural frequency of the support member at two types of frequencies. An imaging device is provided that controls the excitation means to vibrate the optical member and the support member.

  With this configuration, it is possible to excite a composite vibration using a set of first and second frequencies, and excite vibration in a wide range of natural frequencies including a low frequency range with a simpler circuit. Will be able to. As a result, it is possible to give natural vibration to the optical member and the support member, and it is possible to more effectively shake off the foreign matter attached to the surface of the optical member.

  The first frequency may be greater than the second frequency. When the optical member is made of a hard member such as glass and the support member is made of a soft member such as resin, such a structure can effectively excite both members. It becomes possible.

  The control means includes the optical member and the first driving frequency obtained by subtracting the second frequency from the first frequency, and the second driving frequency obtained by adding the second frequency to the first frequency. The structure which controls the said excitation means so that a supporting member may be vibrated may be sufficient. With such a configuration, the composite vibration obtained by combining the vibration at the first frequency and the vibration at the second frequency is effectively excited, and foreign substances attached to the surface of the optical member can be effectively removed.

  Further, the vibration means may include a plurality of vibration elements. For example, by using a vibration element driven at the first drive frequency and a vibration element driven at the second drive frequency, a complex vibration using the first and second frequencies is excited with a simple circuit configuration. It becomes possible to do.

  Further, the control means may be configured to sweep the first drive frequency and the second drive frequency. With this configuration, the portion corresponding to the vibration node is moved, and the deposits can be effectively removed from the entire surface of the optical member.

  The support member may be formed of a material softer than the optical member. For example, the optical member may be formed of glass and the support member may be formed of resin or the like. Moreover, the structure of the part in which a support member supports an optical member or an image pick-up element may be formed in the structure where it is easier to bend than the flat plate of the same resin as a support member. In this case, by adjusting the second frequency in the vicinity of the natural frequency of the supporting portion, the entire unit including the optical member can be vibrated slowly and greatly at a low frequency.

  In order to solve the above-described problem, according to another aspect of the present invention, the vibration of the excitation unit that vibrates the support member that supports the imaging element and the optical member that is installed on the front surface of the imaging element. Control means for controlling the optical member and the optical member at two types of frequencies shifted from a first frequency near the natural frequency of the optical member by a second frequency near the natural frequency of the support member. A vibration control device is provided that controls the excitation means to vibrate the support member.

  With this configuration, it is possible to excite a composite vibration using a set of first and second frequencies, and excite vibration in a wide range of natural frequencies including a low frequency range with a simpler circuit. Will be able to. As a result, it becomes possible to give a natural vibration to the optical member and the support member, and it is possible to more effectively shake off the foreign matter adhering to the surface of the optical member.

  In order to solve the above-described problem, according to another aspect of the present invention, the vibration of the excitation unit that vibrates the support member that supports the imaging element and the optical member that is installed on the front surface of the imaging element. A control step of controlling, in the control step, the optical member and the optical member at two types of frequencies shifted from a first frequency near the natural frequency of the optical member by a second frequency near the natural frequency of the support member. A vibration control method is provided in which the excitation means is controlled to vibrate the support member.

  With this configuration, it is possible to excite a composite vibration using a set of first and second frequencies, and excite vibration in a wide range of natural frequencies including a low frequency range with a simpler circuit. Will be able to. As a result, it becomes possible to give a natural vibration to the optical member and the support member, and it is possible to more effectively shake off the foreign matter adhering to the surface of the optical member.

  As described above, according to the present invention, vibration can be excited in a wide range of natural frequencies including a low frequency range with a simpler circuit.

It is explanatory drawing which showed the structural example of the imaging device which concerns on one Embodiment of this invention. It is explanatory drawing which showed the structural example of the element unit which concerns on the same embodiment. It is explanatory drawing which showed the control method of the foreign material removal system which concerns on the same embodiment. It is explanatory drawing which showed the structural example of the control apparatus which controls the foreign material removal system which concerns on the embodiment. It is explanatory drawing for demonstrating the operation example (sweep operation | movement) of the control apparatus which controls the foreign material removal system which concerns on the embodiment. It is explanatory drawing for demonstrating the operation example (sweep operation | movement) of the control apparatus which controls the foreign material removal system which concerns on the embodiment.

  Exemplary embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In addition, in this specification and drawing, about the component which has the substantially same function structure, duplication description is abbreviate | omitted by attaching | subjecting the same code | symbol.

[About the flow of explanation]
Here, the flow of explanation regarding the embodiment of the present invention described below will be briefly described. First, the configuration of the imaging apparatus 10 according to the present embodiment will be described with reference to FIG. Next, the configuration of the element unit 180 and the foreign matter removal method according to the present embodiment will be described with reference to FIGS. 2 and 3. Next, the configuration and operation of the dust removing unit 134 that controls the vibration of the element unit 180 according to the present embodiment will be described with reference to FIGS. 4 to 6.

<1: Configuration of Imaging Device 10>
First, the configuration of the imaging apparatus 10 according to the present embodiment will be described with reference to FIG. FIG. 1 is an explanatory diagram illustrating a configuration example of an imaging apparatus 10 according to the present embodiment.

  As shown in FIG. 1, the imaging device 10 is mainly configured by a main body unit 100 and a lens unit 200. Hereinafter, the configuration of each unit will be described in detail.

(About the main body 100)
The main body 100 mainly includes a shutter 102, a CMOS image sensor 104, an image input controller 106, a nonvolatile memory 108, a DSP / CPU 110, a compression processing circuit 112, an LCD driver 114, and a display unit 116. , VRAM 118, memory 120, media controller 122, recording medium 124, operation unit 126, driver 128, motor 130, battery 132, and dust removal unit 134.

  The lens unit 200 mainly includes a zoom lens 202, a diaphragm 204, a focus lens 206, an A / D converter 208, a lens CPU 210, a ROM 212, a RAM 214, drivers 216 and 218, and a motor 220. , 222.

  First, each part of the main body 100 will be described. The shutter 102 is for adjusting the incident time of incident light incident from the lens unit 200. In this embodiment, the shutter 102 controls the incident light by using an electronic shutter and adjusts the time for taking out an electric signal. However, the shutter 102 controls the incident light by using a mechanical shutter to convert the electric signal. The time taken out may be adjusted.

  The CMOS image sensor 104 is an element for converting light incident from the lens unit 200 into an electrical signal. The CMOS image sensor 104 includes a CDS circuit 142 and an A / D converter 144. The CDS circuit 142 is a circuit in which a CDS circuit, which is a kind of sampling circuit that removes noise from the electrical signal output from the CMOS image sensor 104, and an amplifier that amplifies the electrical signal after removing noise. . In the present embodiment, the imaging apparatus 10 is configured using a circuit in which a CDS circuit and an amplifier are integrated, but the CDS circuit and the amplifier may be configured as separate circuits. The A / D converter 144 converts the electrical signal generated by the CMOS image sensor 104 into a digital signal, and generates raw image data.

  The image input controller 106 controls input of raw image data generated by the A / D converter 144. The nonvolatile memory 108 records an execution program for controlling the imaging device 10 and management information necessary for controlling the imaging device 10. In the present embodiment, as will be described later, lens identification information for identifying the lens unit 200 and scene mode information that can be selected by the imaging apparatus 10 when the lens unit 200 is mounted on the main body unit 100 are recorded in association with each other. To do.

  The DSP / CPU 110 issues a signal-related command to the CMOS image sensor 104, the CDS circuit 142, or the like, or issues an operation-related command to the operation of the operation unit 126. In the present embodiment, the DSP / CPU 110 is shown as an integrated unit in FIG. 1, but the signal-related command and the operation-related command are executed by separate control units (for example, the CPU and the DSP are separated). You may do it.

  The compression processing circuit 112 compresses an image that has undergone light amount gain correction and white balance adjustment into image data in an appropriate format. The image compression format may be a reversible format or an irreversible format. Examples of suitable formats include, for example, JPEG (Joint Photographic Experts Group) format.

  The display unit 116 displays a live view display before photographing operation, various setting screens of the imaging apparatus 10, and captured images. Display of image data and various types of information of the imaging apparatus 10 on the display unit 116 is performed via the LCD driver 114.

  The VRAM 118 holds contents to be displayed on the display unit 116. Further, the resolution and the maximum number of colors of the display unit 116 depend on the capacity of the VRAM 118.

  The memory 120 temporarily stores captured images. The memory 120 has a storage capacity sufficient to store a plurality of images. Reading and writing of images to and from the memory 120 is controlled by the image input controller 106. As the memory 120, for example, a semiconductor memory such as SDRAM (Synchronous Dynamic Random Access Memory) is used.

  The recording medium 124 records an image taken by the imaging device 10. Input / output to / from the recording medium 124 is controlled by the media controller 122. As the recording medium 124, a memory card that is a card-type storage device that records data in a flash memory can be used. Instead of the recording medium 124, a communication device capable of transferring data to an external recording unit may be installed.

  The operation unit 126 is provided with members for operating the imaging apparatus 10 and performing various settings at the time of shooting. The members arranged in the operation unit 126 may include a power button, a cross key and a selection button for selecting a shooting mode, a shutter button for starting a shooting operation of the subject, and the like.

  The driver 128 drives and controls a motor 130 that operates the shutter 102. The battery 132 stores predetermined power and supplies power to the main body unit 100 and the lens unit 200.

(About the lens unit 200)
Next, each part of the lens unit 200 will be described. The zoom lens 202 is a lens whose focal length continuously changes by moving back and forth in the optical axis direction. Therefore, it is possible to change the size of the subject and take a picture. The diaphragm 204 adjusts the amount of light entering the CMOS image sensor 104 of the main body 100 by the motor 220 when taking an image. The focus lens 206 adjusts the focus of the subject by being moved back and forth in the optical axis direction by the motor 222.

  In the example of FIG. 1, one zoom lens 202 and one focus lens 206 are shown, but the number of zoom lenses 202 may be two or more, and the number of focus lenses 206 is two or more. There may be.

  The A / D converter 208 converts position information of the zoom lens 202 and the focus lens 206 into digital information. The A / D converter 208 sends the position information of the zoom lens 202 and the focus lens 206 converted into digital information to the lens CPU 210.

  The lens CPU 210 controls the internal operation of the lens unit 200 and information communication with the main body unit 100. For example, the lens CPU 210 receives and analyzes the positional information of the zoom lens 202 and the focus lens 206 converted into digital information by the A / D converter 208, thereby grasping the positions of the zoom lens 202 and the focus lens 206. The position information is transmitted to the main body unit 100. When the lens CPU 210 receives a command for specifying the positions and values of the zoom lens 202, the diaphragm 204, and the focus lens 206 from the main body 100, the lens CPU 210 specifies the positions and values of the zoom lens 202, the diaphragm 204, and the focus lens 206. To do.

  The lens CPU 210 includes an SIO 211, and the SIO 211 communicates with an SIO (not shown) included in the DSP / CPU 110 of the main body 100, so that the lens CPU 210 communicates with the lens unit 200. Communication takes place.

  The ROM 212 stores a computer program for controlling the operation of the lens unit 200 by reading and sequentially executing the lens CPU 210, and various settings of the lens unit 200 (for example, the model number and serial number of the lens). is there. The RAM 214 stores rewritable information for the operation of the lens unit 200.

  The drivers 216 and 218 control the driving of motors 220 and 222 that operate the diaphragm 204 and the focus lens 206, respectively. By operating the diaphragm 204 and the focus lens 206 via the drivers 216 and 218, the size of the subject, the amount of light, and the focus can be adjusted.

  The functional configuration of the imaging device 10 has been described above.

<2: Configuration of element unit 180>
Next, the configuration of the element unit 180 that is the object of dust removal and the foreign matter removal method will be described with reference to FIGS. FIG. 2 is an explanatory view showing a configuration example of the element unit 180. FIG. 3 is an explanatory diagram for explaining a foreign matter removing method in the element unit 180.

  As shown in FIG. 2, the element unit 180 mainly includes a resin substrate 181 (including support members 181A and 181B), an image sensor 182 (corresponding to the CMOS 104 described above), an optical member 183, and a piezoelectric element 171A. , 171B (corresponding to a piezoelectric element 171 described later).

  The resin substrate 181 illustrated in FIG. 2 includes a central region on which the imaging element 182 is placed, and two arm regions on which the piezoelectric elements 171A and 171B are placed, and the central region and the two arm regions. Are connected by support members 181A and 181B, respectively. The resin substrate 181 is formed of a resin material and has a natural frequency lower than the natural frequency of the optical member 183. In particular, the natural frequency of the resin substrate 181 can be lowered by forming the widths of the support members 181A and 181B narrower than other regions or by partially pulling out the support members 181A and 181B.

  On the other hand, the optical member 183 is formed of a material harder than the resin substrate 181. For example, the optical member 183 is formed of glass or a high-hardness resin member having high light transmittance. Therefore, the natural frequency of the optical member 183 is higher than the natural frequency of the resin substrate 181. Therefore, it is necessary to devise to excite the element unit 180 at a frequency near the natural vibration of the resin substrate 181 while exciting the element unit 180 at a frequency near the natural vibration of the optical member 183.

  In particular, when the frequency of a piezoelectric element is controlled by using a step-up transformer, it is necessary to consider the characteristics of the step-up transformer in which a responsive band is determined by factors such as winding, material, and load. Actually, it is difficult to realize the above-described two types of natural frequencies by varying the drive cycle of the step-up transformer unless a special circuit configuration is constructed because of the limitation of the drive band of the step-up transformer.

  Accordingly, the present inventor has conducted intensive studies and appropriately driving the two piezoelectric elements 171A and 171B without using a special circuit configuration, so that the optical member 183 and the resin substrate 181 having natural frequencies greatly separated from each other are obtained. We have devised a method that can excite and simultaneously. When this method is applied, the above-described excitation drive can be performed using a step-up transformer that is inexpensive and requires a small circuit scale, which contributes to a reduction in manufacturing cost and a reduction in size of the image sensor 10. This will be described in more detail below.

  First, consider the vibration characteristics.

For example, the angular frequency of the alternating voltage supplied to the piezoelectric element 171A and omega _1, the angular frequency of the alternating voltage supplied to the piezoelectric elements 171B and omega _2. However, the n-th natural frequency (angular frequency display) of the optical member 183 is ω _n , and the k- _th natural frequency (angular frequency display) of the resin substrate 181 is ω _k (ω _k <ω _n ). Angular frequencies ω ₁ and ω ₂ are defined as in the following formulas (1) and (2). When the piezoelectric elements 171A and 171B are driven under this condition, theoretically, a composite vibration such as the following expression (3) is induced in the element unit 180.

That is, n-th order natural vibration and k-th order natural vibration are simultaneously induced in the element unit 180. Here, for the sake of simplicity, the vibration amplitudes of the piezoelectric elements 171A and 171B are the same (A), but similar composite vibrations can be obtained even if they have different amplitudes. For reference, two sine wave waveforms that include an angular frequency expressed by the following formulas (1) and (2) in the phase and a vibration waveform expressed by the formula (3) obtained by synthesizing the two sine wave waveforms. Is shown in FIG. As shown in FIG. 3, a high frequency component corresponding to the angular frequency ω _n and a low frequency component corresponding to the angular frequency ω _k are expressed by the above method.

  The configuration of the element unit 180 and the foreign matter removal method have been described above. As described above, the drive control of the voltage applied to each of the piezoelectric elements 171A and 171B is simple. However, the composite member induced in the element unit 180 can effectively vibrate the optical member 183 and the resin substrate 181 having a large natural frequency.

<3: Configuration of the dust removing unit 134>
Next, the configuration and operation of the dust removing unit 134 that controls the vibration of the element unit 180 will be described in more detail.

[3-1: Functional configuration]
First, the functional configuration of the dust removing unit 134 will be described with reference to FIG. FIG. 4 is an explanatory diagram showing a functional configuration of the dust removing unit 134.

  As shown in FIG. 4, the dust removing unit 134 includes a control circuit 150. The control circuit 150 includes a logic circuit 151, an FET 152, and a transformer 153.

  The DSP / CPU 110 also includes a clock generator 111. The clock generator 111 generates a PWM signal and outputs it to the logic circuit 151 of the control circuit 150. When the logic circuit 151 receives the PWM signal generated by the clock generation unit 111, the logic circuit 151 outputs the PWM signal to the FET 152. The FET 152 is connected to the primary side of the transformer 153. When the FET 152 receives the PWM signal from the logic circuit 151, the transformer 153 generates a secondary-side signal having a predetermined periodicity by the switching operation of the FET 152.

Electric power is supplied from the battery 132 to the transformer 153 via the power supply circuit 160. The transformer 153 receives power supply from the battery 132 and applies a voltage having periodicity to the piezoelectric element 171. For example, a voltage having periodicity corresponding to the above-described frequency ω ₁ or ω ₂ is applied to the piezoelectric element 171. As shown in FIG. 2, when the voltages ω ₁ and ω ₂ are applied to the _two piezoelectric elements 171A and 171B, the element unit 180 is excited at the frequencies ω ₁ and ω ₂ and is A complex vibration is induced.

  The functional configuration of the dust removing unit 134 has been described in detail above.

[3-2: Operation]
Next, the operation of the dust removing unit 134 will be described. However, since the basic vibration control method has already been described with reference to FIG. 3, the operation related to the frequency sweep in consideration of the temperature environment and manufacturing deviation will be described here.

In the case of a vibrating object including two members having significantly different natural frequencies, such as the element unit 180 described above, peaks are obtained at two resonance points (resonance point # 1, resonance point # 2) as shown in FIG. A vibration characteristic having However, in FIG. 5, the resonance frequency of the optical member 183 in a reference state (for example, a room temperature state) is denoted as ω _n0 , and the resonance frequency of the resin substrate 181 is denoted as ω _k0 . Further, ω _kr and ω _nr shown in FIG. 5 indicate sweep bands based on the resonance points # 1 and # 2, respectively. That is, the dust removing unit 134 varies the frequency in the sweep band as shown in FIG.

Here, for the sake of simplicity, assuming that the frequency of the resonance point is ω ₀ , the sweep band from the resonance point is ω _r , and the amount of frequency change per unit control time is Δω _p , the dust removing unit 134 represents the following equation ( According to 4), the frequency is varied as shown in FIG.

When sweeping is performed for the resonance point # 1 and the resonance point # 2, respectively, when ω _n is changed by Δω _np and ω _k is changed by Δω _kp per unit time, the composite vibration induced in the element unit 180 is Is expressed as the following equation (5). However, the angular frequencies ω ₁ and ω ₂ of the voltages applied to the piezoelectric elements 171A and 171B are expressed by the following equations (6) and (7). That is, in a practical situation in consideration of the temperature environment and manufacturing deviation, the dust removing unit 134 vibrates the piezoelectric elements 171A and 171B according to the following formula (5). Such a configuration makes it possible to obtain a desired composite vibration.

  The operation of the dust removing unit 134 has been described above.

<4: Effect>
By performing the vibration control as described above, the optical member 183 having a high natural frequency and the resin substrate 181 having a low natural frequency can be simultaneously brought into a resonance state. In particular, the resin substrate 181 (particularly, the support members 181A and 181B) that forms the holding mechanism of the optical member 183 resonates, whereby removal vibration without uneven acceleration can be applied to the optical member 183. As a result, it is possible to effectively realize the foreign matter removal processing of the optical member 183. In addition, since a step-up transformer can be used for the drive circuits of the piezoelectric elements 171A and 171B, it contributes to a reduction in manufacturing cost and a reduction in size of the imaging device 10.

  In summary, the effects of the present embodiment are as follows.

(Effect 1: Efficient vibration state)
Resonant vibration can be applied to the optical member arranged in front of the image sensor, and resonance vibration can be applied to the resin substrate that is the base of the optical member, thereby improving the dust removal capability compared to conventional methods. Is possible. In addition, since the entire base can be vibrated, it is possible to realize an excitation state that is not constrained by vibration antinodes and nodes related to the natural vibration of the optical member. Further, the optical member can be used as a package of an image pickup element, which contributes to a reduction in thickness of the vibration unit (corresponding to the element unit 180 described above).

(Effect 2: Use of general circuit)
The drive circuit of the piezoelectric element is premised on a high voltage drive by a step-up transformer. Since the step-up transformer is used in a transient state, there is a physical restriction on a band in which a desired step-up ratio can be obtained. When the resonance frequency of the base member of the optical member is significantly lower than the resonance frequency of the optical member, if it is attempted to drive only the base resonantly, the transformer will be in a steady state and a desired drive voltage cannot be obtained. It is done. However, since the technology of this embodiment uses a frequency band near the resonance frequency of the optical member, both members having significantly different resonance frequencies can be vibrated at a desired frequency without using a special transformer. It becomes possible to make it.

  As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the claims, and these are naturally within the technical scope of the present invention. Understood.

  For example, in the above description, a configuration using two piezoelectric elements is shown. However, if one piezoelectric element is driven at two different frequencies, a configuration having only one piezoelectric element may be used. It becomes possible to apply the technique of this embodiment. Such a modification naturally belongs to the technical scope of the present embodiment.

DESCRIPTION OF SYMBOLS 10 Imaging device 100 Main body part 102 Shutter 104 CMOS image sensor 106 Image input controller 108 Non-volatile memory 110 DSP / CPU
111 Clock generator 112 Compression processing circuit 114 LCD driver 116 Display 118 VRAM
DESCRIPTION OF SYMBOLS 120 Memory 122 Media controller 124 Recording medium 126 Operation part 128 Driver 130 Motor 132 Battery 134 Dust removal part 142 CDS circuit 144 A / D converter 160 Power supply circuit 171, 171A, 171B Piezoelectric element 172 Vibration member 180 Element unit 181 Resin substrate 181A , 181B Support member 182 Imaging element 183 Optical member 200 Lens unit 202 Zoom lens 204 Aperture 206 Focus lens 208 A / D converter 210 Lens CPU
211 SIO
212 ROM
214 RAM
216, 218 Driver 220, 222 Motor

Claims (8)

A support member for supporting the image sensor;
Vibration means for vibrating an optical member installed in front of the image sensor;
Control means for controlling vibration by the vibration means;
With
The control means vibrates the optical member and the support member at two types of frequencies shifted from a first frequency near the natural frequency of the optical member by a second frequency near the natural frequency of the support member. The imaging apparatus characterized by controlling the said excitation means. The imaging apparatus according to claim 1, wherein the first frequency is higher than the second frequency. The control means includes the optical member and the support member at a first driving frequency obtained by subtracting the second frequency from the first frequency and a second driving frequency obtained by adding the second frequency to the first frequency. The imaging apparatus according to claim 2, wherein the excitation unit is controlled so as to vibrate. The imaging apparatus according to claim 1, wherein the vibration unit includes a plurality of vibration elements. The imaging device according to claim 1, wherein the control unit sweeps the first drive frequency and the second drive frequency. The imaging apparatus according to claim 1, wherein the support member is made of a softer material than the optical member. A control member for controlling the vibration of a vibrating member that vibrates a support member that supports the image sensor and an optical member that is installed in front of the image sensor;
The control means vibrates the optical member and the support member at two types of frequencies shifted from a first frequency near the natural frequency of the optical member by a second frequency near the natural frequency of the support member. The vibration control apparatus characterized by controlling the said vibration means. Including a control step of controlling the vibration of a vibrating member that vibrates a support member that supports the image sensor and an optical member that is installed in front of the image sensor,
In the control step, the optical member and the support member are vibrated at two types of frequencies shifted from a first frequency near the natural frequency of the optical member by a second frequency near the natural frequency of the support member. The vibration control method, wherein the vibration means is controlled.

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