JP2013222663A - Bulb type light source device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bulb type light source device capable of efficiently suppressing temperature rise of a light source and a circuit or the like.SOLUTION: A bulb type light source device is provided with a light source unit, a circuit board, a base, and a casing. The circuit board is mounted with a prescribed circuit. The base is used for supplying power to the light source unit and the circuit. The casing includes a translucent cover and a heat radiating base casing and houses the light source unit and the circuit board. The translucent cover covers the light source unit. The heat radiating base casing includes a connection part connected to the base and an insertion hole which is formed at the connection part in order to connect thermally the connection part and the circuit and into which at least a part of the circuit board is inserted, and is connected thermally to the light source unit.

Description

  The present technology relates to a light bulb type light source device.

  Patent Document 1 discloses an LED bulb that covers an LED (Light Emitting Diode) with an incandescent bulb-shaped globe and emits radiated light from the LED to the outside. In this LED bulb, an LED module on which an LED is mounted is attached to the upper surface of a heat radiating part having heat radiating fins. A base is attached to the lower part of the heat dissipation part via an insulating part, and a lighting circuit for lighting the LED is built in the base. As a result, the distance between the LED module and the lighting circuit is increased, and the heat dissipating part and the base are isolated by the insulating part. As a result, the temperature of the lighting circuit is prevented from rising due to the heat generated from the LED module (see paragraphs [0033] and [0042] and FIG. 1 in the specification).

JP 2010-056059 A

  As described above, the LED bulb is required to efficiently suppress the temperature rise of the LED, the circuit, and the like.

  In view of the circumstances as described above, an object of the present technology is to provide a light bulb type light source device capable of efficiently suppressing a temperature rise of a light source, a circuit, or the like.

In order to achieve the above object, a light bulb type light source device according to an embodiment of the present technology includes a light source unit, a circuit board, a base, and a housing.
A predetermined circuit is mounted on the circuit board.
The base is used to supply power to the light source unit and the circuit.
The housing includes a light-transmitting cover and a heat-radiating base housing, and houses the light source unit and the circuit board.
The translucent cover covers the light source unit.
The heat dissipating base casing is formed on the connection portion for thermal connection between the connection portion and the circuit, the connection portion being connected to the base via an insulator, and at least the circuit board. An insertion hole into which a part is inserted, and is thermally connected to the light source unit.

  In this bulb-type light source device, a light source unit and a predetermined circuit board are accommodated in a casing having a translucent cover and a base casing. The base casing is thermally connected to the light source unit, whereby the heat of the light source unit is dissipated. The base housing has a connection part connected to the base via an insulator, and an insertion hole formed in the connection part. At least a part of the circuit board is inserted into the insertion hole, whereby the connection portion and the circuit board are thermally connected. Therefore, the heat of the circuit mounted on the circuit board is transmitted to the connecting portion and is radiated. As a result, the temperature rise of the light source unit and the circuit can be efficiently suppressed.

The circuit board may include a conductive layer that guides heat of the circuit to the connection portion.
Thereby, the temperature rise of a circuit can be suppressed efficiently.

The conductive layer may be formed as an intermediate layer on the circuit board.
Thereby, a conductive layer can be formed easily.

In the circuit board, a portion inserted into the insertion hole may be fixed to the connection portion with an adhesive.
Thereby, the thermal connection between the circuit and the connecting portion can be made sufficient.

The circuit board may have an insertion portion formed as a portion to be inserted into the insertion hole.
Thus, an insertion part may be formed in a circuit board as a part inserted in an insertion hole. Thereby, the thermal connection between the circuit and the connecting portion can be made sufficient.

The bulb-type light source device may further include a speaker. In this case, the predetermined circuit may include a speaker drive circuit that drives the speaker.
Thereby, in the light bulb-type light source device including the speaker, the temperature rise of the speaker driving circuit can be efficiently suppressed.

The predetermined circuit may include a light source driving circuit that drives the light source unit.
Thereby, the temperature rise of a light source drive circuit can be suppressed efficiently.

The light bulb type light source device may further include an antenna for wireless communication. In this case, the predetermined circuit may include a control circuit that receives a radio signal via the antenna.
Thereby, in the light bulb-type light source device including the antenna, it is possible to efficiently suppress the temperature rise of the control circuit that receives the wireless communication.

The bulb-type light source device may further include a sensor that outputs a predetermined signal. In this case, the predetermined circuit may include a sensor drive circuit that drives the sensor.
Thereby, in the light bulb type light source device including the sensor, the temperature rise of the sensor driving circuit can be efficiently suppressed.

The bulb-type light source device may further include a power supply board having a gap region and mounting a power supply circuit connected to an external power supply. In this case, the circuit board may be disposed in a gap region of the power supply board so as to intersect perpendicularly with the power supply board.
Thereby, a circuit board can be easily inserted in an insertion hole. Further, the arrangement density of the power supply board and the circuit board can be increased, and the miniaturization of the light bulb type light source device can be realized.

The power supply circuit may include a primary circuit connected to the external power supply, and a secondary circuit coupled to the primary circuit in an insulated state and supplying power to the circuit. In this case, the circuit may be electrically connected to the base casing through the connection portion so that the base casing serves as a ground of the secondary circuit.
In this bulb-type light source device, the circuit and the base casing are electrically connected via the connecting portion so that the base casing becomes the ground of the secondary circuit. As a result, radiation and intrusion of electromagnetic waves can be suppressed, and EMC (Electro Magnetic Compatibility) measures can be taken.

The predetermined circuit may include a power supply circuit connected to an external power supply.
Thereby, the temperature rise of a power supply circuit can be suppressed efficiently.

The base casing may have a container shape having the connection portion as a bottom portion.
This stabilizes the thermal connection between the circuit and the connecting portion.

The insertion hole may have a slit shape.
For example, an insertion hole having a slit shape may be formed in accordance with the number or position of circuit boards to be inserted.

  The base casing may be made of a metal material having a relatively high thermal conductivity.

  The light source unit may include an LED (Light Emitting Diode) or an EL (Electro Luminescence) element as a light source element.

  As described above, according to the present technology, it is possible to efficiently suppress the temperature rise of the light source, the circuit, and the like.

FIG. 1 is a perspective view illustrating a light bulb-type light source device according to an embodiment of the present technology. FIG. 2 is a schematic cross-sectional view of the bulb-type light source device shown in FIG. FIG. 3 is a cross-sectional view illustrating a speaker according to an embodiment. FIG. 4 is a perspective view showing a holding member in the support unit. FIG. 5 is a perspective view of the substrate housing box of the support unit as viewed from below. FIG. 6 is a perspective view showing the base casing. FIG. 7 is an enlarged view showing an end portion of the drive substrate. FIG. 8 is a diagram illustrating a positional relationship between the base casing and the drive substrate. FIG. 9 is a schematic cross-sectional view enlarging the insertion portion of the drive circuit inserted into the insertion hole in the bottom portion. FIG. 10 is a diagram showing the positional relationship between the power supply substrate and other substrates (drive substrate and control substrate). FIG. 11 is a block diagram showing an electrical configuration of the light source device. FIG. 12 is an enlarged view showing another example of the insertion portion formed on the circuit board. FIG. 13 is a perspective view showing another example of the insertion hole formed in the bottom surface portion. FIG. 14 is a perspective view illustrating another example of the through hole formed in the substrate storage box. FIG. 15 is a perspective view showing another example of the insertion hole formed in the bottom surface portion. FIG. 16 is a perspective view showing another example of the through hole formed in the substrate storage box. FIG. 17 is a perspective view showing another example of the insertion hole formed in the bottom surface portion. FIG. 18 is a schematic cross-sectional view illustrating another example of a method for fixing the bottom surface portion of the base housing and the circuit board inserted into the bottom surface portion.

  Hereinafter, embodiments of the present technology will be described with reference to the drawings.

(Overall configuration of light bulb type light source device)
FIG. 1 is a perspective view illustrating a light bulb-type light source device according to an embodiment of the present technology. FIG. 2 is a schematic cross-sectional view of the light bulb type light source device 100 shown in FIG. In the following description, the light bulb type light source device is simply referred to as a light source device.

  The light source device 100 includes a housing 10, a light source unit 40 disposed in the housing 10, a speaker 30 provided at one end of the housing 10, and an insulating ring 16 that is an electrical insulator. And a base 15 connected to the other end of the housing 10 (the side opposite to the position of the speaker 30).

  For convenience of explanation, the following description will be made with the direction along the z-axis in FIGS. 1 and 2 as the front-rear direction of the light source device 100, specifically, the speaker 30 side as the front and the base 15 side as the rear.

  The housing 10 includes, for example, a base housing 12 and a translucent cover 11 attached to the base housing 12. The translucent cover 11 is disposed so as to cover the light source unit 40. As shown in FIG. 2, the translucent cover 11 includes a first opening 11 a provided at the front end portion and a second opening 11 b located on the opposite side along the z-axis direction. And are formed. The speaker 30 is attached to the translucent cover 11 so that the speaker 30 closes the first opening 11a. A base housing 12 is provided on the second opening 11 b side of the translucent cover 11. The translucent cover 11 is formed of, for example, glass, acrylic, polycarbonate, or the like.

  The light source device 100 includes a support unit 20 that supports the speaker 30. The support unit 20 integrally supports the light source unit 40, the speaker 30, and the base 15 so that the speaker 30 and the light source unit 40 are spaced apart and the light source unit 40 is disposed between the speaker 30 and the base 15. To do. As shown in FIG. 2, typically, the support unit 20 includes a heat sink 23, a holding member 21 that is fixed to the heat sink 23 and holds the speaker 30, and a substrate that is disposed so as to face the holding member 21. Box 22.

  The heat sink 23 of the support unit 20 functions as a chassis of the light source device 100. The heat sink 23 is arranged around a central axis C (see FIG. 2) that is an axis passing through the center of the speaker 30 along the vibration direction (z-axis direction) of the diaphragm 35 (see FIG. 3) included in the speaker 30. Has been. The term "around the axis" includes the concept of both the entire circumference of the axis or a part thereof. Typically, the heat sink 23 has a plate shape and is formed in the entire circumference of the central axis C, that is, in a ring shape.

  Similarly to the heat sink 23, the light source unit 40 is also disposed around the central axis C, typically provided in a ring shape, and disposed on the heat sink 23. For example, the light source unit 40 includes a ring-shaped mounting substrate 46 and a plurality of LED (Light Emitting Diode) elements 45 arranged in a ring shape on the mounting substrate 46. As one LED element 45, an element that generates white light is used, but an element that generates light of a single color or a plurality of colors other than white may be used.

  The heat sink 23 is mainly formed of aluminum, for example, but other metal materials such as copper may be used as long as the material has a relatively high thermal conductivity. Alternatively, the material of the heat sink 23 may be a highly heat-dissipating resin having conductivity or a ceramic having conductivity.

  The base 15 is configured to be attachable to a general incandescent light bulb socket. The base 15 is a member that supplies power to a circuit board on which a predetermined circuit is mounted, the light source unit 40, and the speaker 30 via a power circuit 55 described later.

  The length of the light source device 100 in the z-axis direction is 100 to 120 mm, typically about 110 mm. The diameter of the light source device 100 viewed in the z-axis direction is 50 to 70 mm, typically about 60 mm.

(Specific configuration of speaker)
FIG. 3 is a cross-sectional view illustrating the speaker 30 according to an embodiment. The speaker 30 is a dynamic damperless speaker. The speaker 30 includes a frame 31, a permanent magnet 32, a plate 33, a yoke 34, a diaphragm 35, an edge 36, a coil bobbin 37, a magnetic fluid 38, and a mounting bottom 39.

  In the magnetic gap between the yoke 34 and the upper plate 33, a magnetic fluid 38 is disposed in place of the conventional damper. A voice coil (not shown) is disposed in the magnetic gap. A screw hole 39 a is formed in the attachment bottom 39. As will be described later, the speaker 30 is attached to the holding member 21 of the support unit 20 with the screw S3 (see FIG. 2) through the screw hole 39a.

  As will be described later, in the present embodiment, the speaker 30 and the light source unit 40 are spaced apart from each other, so that the speaker 30 is not easily affected by the heat of the light source unit 40. Therefore, as the permanent magnet 32 used for the speaker 30, a permanent magnet having a relatively low heat resistance, that is, a relatively low demagnetizing temperature can be used. For example, a permanent magnet having a demagnetization temperature of 60 ° C. to 100 ° C. can be used. An example of a permanent magnet having a demagnetization temperature of 100 ° C. or less is neodymium.

  The magnetic force of neodymium magnets is higher than that of ferrite core magnets, but neodymium demagnetization temperature is about 80 ° C., which is lower than that of ferrite. When applying the ferrite core magnet to the speaker 30 of the light source device 100 according to the present embodiment, the size of the ferrite core magnet must be increased in order to obtain a magnetic force equivalent to that of the neodymium magnet. Not suitable for miniaturization. Although it is conceivable to reduce the heat generation amount of the light source unit 40 so that the permanent magnet is not demagnetized, this means that the input power to the light source device 100 is suppressed, and this reduces the amount of light flux.

  Therefore, in this embodiment, although the heat resistance is lower than that of ferrite, the above problem is solved by using neodymium having a large magnetic force and disposing the speaker 30 and the light source unit 40 apart from each other.

  For example, at least a part of the frame 31 of the speaker 30 and at least a part of the edge 36 may be formed of a translucent material. As the translucent material, known materials such as acrylic, polyvinyl, and polyimide resin materials are used. Thereby, since the light emitted from the light source unit 40 passes through a part of the speaker 30, the light distribution characteristic near the center of the light source device 100 can be improved.

(Specific configuration of support unit)
FIG. 4 is a perspective view showing the holding member 21 in the support unit 20. The holding member 21 includes a cylindrical portion 211 to which the speaker 30 is attached, and a flange portion 212 provided at an end portion on the rear side of the cylindrical portion 211. The holding member 21 is placed in the housing 10 so that the cylindrical portion 211 passes through the central hole of the heat sink 23 and the light source unit 40, and the longitudinal direction of the cylindrical portion 211 is along the z-axis direction. Has been placed.

  A screw hole 215 is provided in the front end face of the cylindrical portion 211, and a screw S3 (see FIG. 2) is screwed into the screw hole 215 and the screw hole 39a formed in the speaker 30. Thereby, the speaker 30 is held by the holding member 21. The means for attaching the speaker 30 to the holding member 21 is not limited to screwing, but may be adhesion by an adhesive or engagement by an uneven member.

  As shown in FIG. 2, the holding member 21 is attached to the heat sink 23 with screws S1. Specifically, a mounting portion 213 for screwing is formed on the flange portion 212 of the holding member 21 so as to protrude rearward. The heat sink 23 is placed on the flange portion 212, and the holding member 21 is attached to the heat sink 23 via the attachment portion 213 from the back side (rear side) of the heat sink 23.

  According to such a configuration of the holding member 21 and the heat sink 23, as described above, the light source unit 40 is arranged to be separated from the speaker 30 on the rear side, and therefore, the thermal influence from the light source unit 40 on the speaker 30. Can be suppressed. Thereby, the function of the speaker 30 can be maintained favorably. For example, when the thermal effect on the speaker 30 is large, there is a concern that the permanent magnet 32 provided in the speaker 30 may be demagnetized, but the light source device 100 according to the present embodiment eliminates such a concern. be able to.

  In addition, the speaker 30 is disposed on the light emission side of the light source unit 40, that is, a position that blocks the emitted light. However, the light distribution angle is increased by providing the light source unit 40 in a ring shape. Further, the light source unit 40 can emit light with a uniform amount of light with respect to the central axis C.

  In the present embodiment, the holding member 21 that holds the speaker 30 is disposed so as to be surrounded by the light source unit 40. Therefore, the arrangement space of the holding member 21 and the light source unit 40 in the light source device 100 can be reduced, that is, the arrangement density of these members can be increased, so that the light source can be secured while ensuring a desired light distribution angle. Miniaturization of the device 100 can be realized.

  The cylindrical portion 211 of the holding member 21 may be provided with a reflecting portion that reflects the light emitted from the light source unit 40. The reflection portion is, for example, a mirror surface or a portion made of a color material having a high light reflectance. The color having a high reflectance is, for example, white, milky white, or a color close to these. Of course, the holding member 21 itself may be formed of a white or milky white resin material. As the resin material, ABS (acrylonitrile butadiene styrene), PBT (polybutylene terephthalate), or the like is used, but other materials may be used.

  In addition, when the reflecting portion is formed of a material made of white or milky white, the reflecting portion can diffusely reflect (scatter) light. Alternatively, even if the reflecting portion is a blasted reflecting surface, the reflecting surface can diffusely reflect light.

  As described above, the provision of the reflective portion can increase the light distribution angle of the light emitted from the light source unit 40, can effectively use the light from the light source unit 40, and can increase the illuminance. it can.

  FIG. 5 is a perspective view of the substrate housing box 22 of the support unit 20 as viewed from below. The substrate storage box 22 includes a main body 221, a contact plate 222 provided so as to protrude from the main body 221 in a direction perpendicular to the z-axis, and a protrusion provided so as to protrude from the main body 221 along the z-axis direction. Part 223. Although a plurality of contact plates 222 having different shapes are provided in FIG. 5, only one contact plate 222 may be provided.

  The main body 221 is formed with a connection hole 224 to which a not-shown conductive connector is connected. A plurality of connection holes 224 may be provided. In the present embodiment, a through hole 226 is formed in the bottom surface 225 of the main body 221. As will be described later, at least a part of the drive substrate 61 is inserted into the through hole 226.

  As shown in FIG. 2, the main body 221 is provided so as to stand up along the z-axis direction, and the holding member 21 and the contact plate 222 are in contact with the flange portion 212 of the holding member 21. The substrate housing box 22 is disposed in the housing 10 so as to face each other. The circuit board is arranged in the region formed in the holding member 21 and the substrate housing box 22 arranged in this way, that is, in the region in the cylindrical portion 211 and the main body 221.

  A plurality of, for example, two such circuit boards are provided (drive board 61 and control board 62). As will be described later, the drive substrate 61 is provided as a common substrate on which an LED drive circuit 616 and an audio AMP (Amplifier) 615 (see FIG. 11) described later are mounted.

  As shown in FIG. 2, in this embodiment, at least a part of the drive substrate 61 is disposed inside the base 15. A part of the drive substrate 61 is inserted into the through hole 226 shown in FIG. In the present embodiment, the drive board 61 corresponds to a circuit board on which a predetermined circuit is mounted. Hereinafter, a predetermined circuit mounted on the drive substrate 61 is referred to as a drive circuit. The LED driving circuit 616 and the audio AMP 615 described above are included in the driving circuit. Hereinafter, the arrangement of the drive substrate 61 will be described in detail.

  FIG. 6 is a perspective view showing the base casing 12 of the present embodiment. FIG. 7 is an enlarged view showing an end portion of the drive substrate 61. FIG. 8 is a diagram illustrating a positional relationship between the base housing 12 and the drive substrate 61.

  The base housing 12 is made of a material having a relatively high thermal conductivity, for example, mainly aluminum. As the material of the base housing 12, other metal materials such as copper may be used as long as they have a relatively high thermal conductivity. Here, the material having a relatively high thermal conductivity is, for example, higher than 100 W / (mK), such as aluminum 236 W / (mK), copper 398 W / (mK), or several tens W / A material with thermal conductivity such as (m · K). Alternatively, the material of the base housing 12 may be a highly heat-dissipating resin having conductivity or a ceramic having conductivity. Thus, in this embodiment, the base housing | casing 12 which has heat dissipation is used.

  The base housing 12 is thermally connected to the heat sink 23. As shown in FIG. 2, for example, the opening end 121 provided in the base housing 12 and the side surface of the heat sink 23 are in direct contact with each other through a heat conductive sheet or the like, so that the heat between those members can be reduced. Conduction takes place. Thereby, the heat generated from the light source unit 40 is efficiently released to the outside through the heat sink 23 and the base casing 12.

  The main materials of the heat sink 23 and the base housing 12 may be different from each other.

  The base housing 12 has the opening end portion 121 and a bottom surface portion 122 provided on the rear side of the base housing 12. The opening end portion 121 and the bottom surface portion 122 are disposed to face each other in the z-axis direction. Therefore, the base housing 12 of the present embodiment has a container shape having the bottom surface portion 122.

  The open end 121 of the base housing 12 is connected to the translucent cover 11. The bottom portion 122 is connected to the base 15. Therefore, in the present embodiment, the bottom surface portion 122 corresponds to a connection portion connected to the base 15. The base 15 and the bottom surface portion 122 are connected via the insulating ring 16.

  As shown in FIG. 6, the bottom surface portion 122 has an opening 123 into which the protruding portion 223 of the substrate storage box 22 is inserted. As shown in FIG. 2, the protrusion 223 is disposed inside the base 15 by being inserted into the opening 123. The projecting portion 223 is formed in a cylindrical shape, and a lead wire (not shown) that connects a terminal at the top of the base 15 and a power supply substrate 50 described later passes through the projecting portion 223. .

  Further, the bottom surface portion 122 has an insertion hole 124 into which at least a part of the drive substrate 61 is inserted. As shown in FIG. 7, an insertion portion 612 is formed as a portion to be inserted into the insertion hole 124 at the end 611 disposed on the rear side of the drive substrate 61. In the present embodiment, two insertion portions 612 are formed along the two long sides 613 extending in the longitudinal direction of the drive substrate 61. A notch 614 is formed between the two insertion portions 612. Two insertion portions 612 are inserted into the insertion holes 124 of the bottom surface portion 122 through the through holes 226 of the substrate accommodation box 22.

  The insertion hole 124 is formed for thermal connection between the bottom surface portion 122 of the base housing 12 and the drive circuit (including the LED drive circuit 616 and the audio AMP 615) of the drive board 61. That is, by inserting the insertion portion 612 of the drive substrate 61 into the insertion hole 124, the bottom surface portion 122 and the drive circuit are thermally connected. Thereby, the heat of the drive circuit mounted on the drive substrate 61 is transmitted to the bottom surface portion 122 and is radiated. As a result, it is possible to efficiently suppress the upper temperature layer of the drive circuit.

  As shown in FIG. 8, in this embodiment, the insertion portion 612 is inserted into the insertion hole 124 so as to penetrate the bottom surface portion 122. Thereby, the thermal connection between the drive circuit of the drive substrate 61 and the bottom surface portion 122 can be made sufficient. The insertion portion 612 is not limited to the configuration that penetrates the bottom surface portion 122. For example, the insertion portion 612 may be inserted to a position within the insertion hole 124, and the drive circuit and the bottom surface portion 122 may be thermally connected.

  In FIG. 8, illustration of the substrate housing box 22, the opening 123, and the like is omitted.

  FIG. 9 is an enlarged schematic cross-sectional view of the insertion portion 612 of the drive circuit 61 inserted into the insertion hole 124 of the bottom surface portion 122. As shown in FIG. 9, in this embodiment, the drive substrate 61 has a multilayer structure. The drive circuit 61 includes a circuit formation layer 71 in which the drive circuit is formed, and a conductive layer 72 that guides the heat of the drive circuit to the bottom surface portion 122.

  In the circuit forming layer 71, various electronic components and wirings constituting the drive circuit are formed (not shown). In the present embodiment, both surfaces of the drive substrate 61 are the circuit formation layers 71, and electronic components and the like are mounted on both surfaces of the drive substrate 61. However, only one side of the drive substrate 61 may be the circuit formation layer 71.

  The conductive layer 72 capable of conducting heat is formed on the drive substrate 61 as an intermediate layer. As shown in FIG. 9, the conductive layer 72 is formed between the two circuit forming layers 71. The conductive layer 72 is made of a material having a relatively high thermal conductivity, and is typically made of a metal material such as aluminum or copper. However, other materials with high heat dissipation may be used. By forming the conductive layer 72 on the drive substrate 61, heat of the drive circuit is guided to the bottom surface portion 122 through the drive substrate 61. As a result, the temperature rise of the drive circuit can be efficiently suppressed.

  A conductive layer 72 is formed on the drive substrate 61 as an intermediate layer. Thereby, for example, the conductive layer 72 can be easily formed by providing copper or the like on the entire inner surface of any one of the circuit forming layers 71 by vapor deposition or the like. The method for forming the conductive layer 72 is not limited. Further, the number of layers constituting the driving substrate 61 is not limited.

  As shown in FIG. 9, a plurality of through holes 73 and a heat radiating portion 74 are formed in a portion corresponding to the insertion portion 612 of the circuit forming layer 71. The heat radiating portion 74 is made of a material having a relatively high thermal conductivity, and is formed together with a drive circuit formed on the circuit forming layer 71, for example. Alternatively, a part of the drive circuit formed in the circuit formation layer 71 may be used as the heat dissipation unit 74.

  The heat radiating portion 74 is thermally connected to the conductive layer 72 through the through hole 73. Therefore, copper or the like may be provided on the entire inside or the inner surface of the through hole 73. Copper or the like may not be provided, and thermal connection may be made via air. The heat radiation part 74 thermally connected to the conductive layer 72 is formed on the surface of the circuit forming layer 71, so that the heat radiation from the drive circuit to the bottom surface part 122 is improved.

  As shown in FIG. 9, in the drive substrate 61, the insertion portion 612 inserted into the insertion hole 124 is fixed to the bottom surface portion 122 by the adhesive 75. Thereby, the thermal connection between the driving circuit and the bottom surface portion 122 can be made sufficient. As the adhesive 75, for example, a heat-dissipating resin is used, and a thermosetting type such as an acrylic resin or an epoxy resin, or a room temperature curing type can be used. By using the heat dissipating adhesive, the heat of the drive circuit can be sufficiently dissipated. In the present embodiment, an insulating adhesive is used for the purpose of insulating the drive circuit and the base 15. The material of the adhesive 75 is not limited.

  A silicon-based or acrylic-based heat dissipation sheet may be provided in a gap between the insertion hole 124 and the drive substrate 61. Thereby, the heat dissipation from the drive circuit to the bottom surface portion 122 is improved.

  As described above, in the light source device 100 according to the present embodiment, the light source unit 40 and the drive substrate 61 are accommodated in the casing 10 having the translucent cover 11 and the base casing 12. The base housing 12 is thermally connected to the light source unit 40 via the heat sink 23, whereby the heat of the light source unit 40 is radiated. The base housing 12 has a bottom surface portion 122 connected to the base 15 and an insertion hole 124 formed in the bottom surface portion 122. An insertion portion 612 that is at least a part of the drive substrate 61 is inserted into the insertion hole 124, and thereby the bottom surface portion 122 and the drive substrate 61 are thermally connected. Accordingly, the heat of the drive circuits such as the LED drive circuit 616 and the audio AMP 615 mounted on the drive board 61 is transmitted to the bottom surface portion 122 and radiated. As a result, the temperature rise of the light source unit 40, the LED drive circuit 616, and the audio AMP 615 can be efficiently suppressed.

  In recent years, LED bulbs have become popular as an alternative to incandescent bulbs. Although LEDs are power-saving, self-heating is present, so for example, in order to ensure reliability in use, how to dissipate the heat generated by the LEDs themselves is a problem. For example, the housing that houses the LED is formed of a metal housing such as aluminum, and the heat of the LED is radiated to the outside air through the housing.

  Regarding the heat treatment of the LED bulb, it is necessary to consider not only the junction temperature of the LED itself but also the temperature of the LED drive circuit for lighting the LED. That is, since the electronic components used in the LED drive circuit are also exposed to a high temperature state, the temperature rise of these electronic components must be suppressed.

  For example, when the heat of the LED is radiated through a metallic casing, it is conceivable that the temperature of the LED drive circuit rises due to the heat transmitted to the casing. That is, the LED heat may be conducted to the LED drive circuit. In this case, the LED drive circuit may be defective due to heat. Therefore, it is necessary to appropriately suppress both the LED temperature rise and the LED drive circuit temperature rise. Further, when other devices such as a speaker are mounted, it is necessary to suppress the temperature rise of a circuit for driving them.

  For example, as a method of reducing the heat of the LED drive circuit, a method of thermally connecting the LED circuit and the housing by disposing the LED circuit in a hollow portion in the housing and impregnating the hollow portion with a silicon adhesive. There is. In this case, the heat conduction is improved as compared with a state where the silicon adhesive is not impregnated, that is, a state where air is interposed. However, the thickness of the silicon adhesive impregnated in the hollow portion is increased, and good heat conduction is often not expected.

  In addition, if the circuit is completely impregnated with silicon adhesive, the heat effect of parts with high heat generation temperature may be received by parts with low temperature that does not generate much heat. It is not suitable as a method for lowering only the temperature of electronic components. Since electronic parts have different rated temperatures as described above, averaging the temperature of electronic circuit parts by impregnating silicon adhesive may be a disadvantage.

  It is also conceivable to increase the temperature of the circuit accommodated inside by increasing the volume of the hollow portion. In this case, the entire light source device is enlarged, and the product value is lost as an alternative to the incandescent bulb.

  On the other hand, in the light source device 100 according to the present embodiment, as described above, the drive substrate 61 on which a drive circuit such as the LED drive circuit 616 is mounted is inserted into the bottom surface portion 122 of the base housing 12. Regarding the temperature distribution inside a conventional LED bulb or bulb-type fluorescent lamp, the tip portion of the translucent cover and the vicinity of the base on the opposite side are known as the low temperature region. Also in the light source device 100 of the present embodiment, the tip portion where the speaker 30 is disposed and the inside 151 of the base 15 are regions where the temperature is low. Therefore, the temperature rise of the drive circuit can be efficiently suppressed by efficiently transferring the heat of the drive circuit to the bottom surface portion 122 connected to the base 15 to dissipate the heat. As a result, it is possible to realize the light source device 100 with high reliability regarding the circuit temperature. Further, the light source device can be reduced in size.

  Since the insertion portion 612 of the drive substrate 61 is inserted into the insertion hole 124 formed in the bottom surface portion 122 of the base housing 12, the thickness of the adhesive 75 used there is very small. As a result, heat dissipation is improved. Further, heat from the LED drive circuit or the like is transmitted to the bottom surface portion 122 through the drive substrate 61 and dissipated, so that temperatures of various electronic components mounted on the drive substrate 61 are not averaged.

  Further, the pattern shape and formation position of the conductive layer 72 formed on the drive substrate 61, the arrangement position of the electronic component based on the distance from the bottom surface portion 122, and the like are appropriately set. As a result, the heat dissipation effect can be selectively exerted on the electronic components mounted on the drive substrate 61. For example, by disposing an electronic component having a high heat generation temperature at a position on the bottom surface portion 122, it is possible to enhance the heat dissipation effect of the electronic component.

  Further, since the base housing 12 has a container shape having the bottom surface portion 122, the driving substrate 61 can be stably inserted into the bottom surface portion 122.

  Similar to the holding member 21, the substrate housing box 22 is formed of a non-conductive material, for example, mainly a resin material of ABS. As described above, the holding member 21 and the substrate housing box 22 are made of materials suitable as electrical insulating materials and flame retardant materials.

  In the present embodiment, the entire control board 62 and a portion other than the insertion portion 612 of the drive board 61 are covered with the non-conductive board accommodation box 22. Further, the drive substrate 61 and the bottom surface portion 122 are covered with an insulating adhesive 75. Thereby, electrical insulation with the base 15 side, especially the circuit of the primary side of a power supply circuit can be maintained reliably. In that sense, a non-conductive sheet may be used instead of the substrate storage box 22.

  A plurality of openings 214 are formed in the cylindrical portion 211 of the holding member 21. Thereby, in the housing 10, the region outside the cylindrical portion 211 of the holding member 21 communicates with the region in the cylindrical portion 211 and the substrate storage box 22 through the opening 214. According to such a configuration, not only the area outside the cylindrical part 211 but also the area inside the cylindrical part 211 and the substrate housing box 22 can be used as the enclosure of the speaker 30 in the housing 10. it can. Thereby, the volume of the enclosure is increased and the sound quality of the speaker 30 is improved. Note that only one opening 214 may be formed in the cylindrical portion 211.

  Referring to FIG. 2, the translucent cover 11 is a base so that the opening surface of the opening end 121 of the base housing 12 faces the opening surface of the second opening 11 b of the translucent cover 11. It is arranged with respect to the housing 12. The support unit 20 supports the speaker 30 so as to press the translucent cover 11 against the heat sink 23 by the speaker 30, and sandwiches the translucent cover 11 between the speaker 30 and itself (support unit 20).

  The heat sink 23 mainly forms the base 29 of the support unit 20. The base portion 29 of the support unit 20 also includes a flange portion 212 of the holding member 21. Further, the base 29 of the support unit 20 may include the base housing 12.

  As described above, the speaker 30 supported by the support unit 20 plays a role of holding the translucent cover 11 between the heat sink 23 and pressing the translucent cover 11 against the heat sink 23 to support it. Therefore, it is not necessary to directly fix the translucent cover 11 to the heat sink 23 and the speaker 30. For this reason, even if the translucent cover 11 having a thermal expansion coefficient different from the thermal expansion coefficients of the heat sink 23 and the speaker 30 (the frame 31) is thermally expanded due to the temperature change of the light source unit 40, the heat sink 23 and the speaker It is possible to allow deformation due to thermal expansion in each of the openings 11a and 11b respectively facing 30 and to release thermal expansion stress. Therefore, a situation in which mechanical stress is generated in the translucent cover 11 and the translucent cover 11 is deteriorated can be suppressed.

(Configuration of various circuit boards)
As shown in FIG. 2, a power supply board 50 on which a power supply circuit 55 is mounted is accommodated in the base casing 12. The power supply board 50 is attached to the holding member 21 with screws S2. In addition, the power supply substrate 50 is also attached to the heat sink 23 by the above-described screw S <b> 1 connecting the holding member 21 and the heat sink 23.

  Here, it is generally desirable to reduce the size of an LED bulb as close as possible to an incandescent bulb shape from the viewpoint of suitability of the LED bulb to a lighting fixture. When the product size of the LED bulb is significantly increased, the product value is lowered. If the power supply board and the LED drive circuit board are arranged on the same plane or arranged along parallel planes, not only the product size increases, but also the housing near the base The outer size of the will also be thicker. Since it is ideal to realize an LED bulb in which the outer peripheral size of the casing near the base is close to an incandescent bulb from the viewpoint of compatibility with the lighting fixture, also from this point of view, the power supply board and other A product in which a circuit board is arranged on the same plane causes a reduction in product value. Therefore, in the present technology, each circuit board is arranged as follows.

  FIG. 10 is a diagram showing the positional relationship between the power supply board 50 and other boards (the above-described drive board 61 and control board 62). The power supply board 50 has a gap area 50a, and a part of each of the drive board 61 and the control board 62 is disposed in the gap area 50a.

  Typically, the void region 50a is formed by a through hole, that is, the power supply substrate 50 is formed in a ring shape. Specifically, as shown in FIG. 2, the main body 221 of the substrate housing box 22 is inserted into the gap region 50a. Thereby, the drive board 61 and the control board 62 arranged in the board housing box 22 and the holding member 21 are arranged so as to intersect the power board 50 vertically through the through holes of the power board 50. Is done.

  As described above, since the drive board 61 and the control board 62 are arranged so as to be inserted into the through holes of the power supply board 50, it is possible to efficiently arrange components in a small accommodation space in the housing 10. The light source device 100 can be downsized. Further, since the drive substrate 61 is arranged vertically, the insertion portion 612 of the drive substrate 61 can be easily inserted into the insertion hole 124 of the bottom surface portion 122.

  Specifically, the envelope shape of each of the substrates arranged in this way approximates a shape in which two substantially triangular shapes are arranged opposite to each other along the z-axis direction. This shape approximates the external shape of the housing 10 including the base housing 12 and the translucent cover 11 when the light source device 100 is viewed from the side. That is, with the arrangement of the substrates 50, 61, and 62, the density of components in the housing 10 can be increased, and the light source device 100 can be downsized.

  Moreover, since each board | substrate 50, 61, and 62 can be arrange | positioned in the housing | casing 10 with high density, the volume as the enclosure of the speaker 30 can fully be ensured. Therefore, the sound quality of the speaker 30 can be improved.

  As shown in FIG. 10, a receiving unit (or light receiving unit) 628, an antenna 626, and a network control circuit 627 are mounted on the control board 62.

  The receiving unit 628 receives an infrared signal transmitted from a remote controller (not shown) that can be used by the user. The position of the control board 62 is such that the receiving unit 628 is located in the housing 10 at a position where the infrared signal can be received, that is, in an area in the translucent cover 11 (an area in front of the light source unit 40). And the posture is set. For example, the receiving unit 628 is mounted on the front end of the control board 62. A remote controller (not shown) is a device that generates signals such as lighting, extinguishing, dimming, and toning of the light source unit 40, for example.

  The antenna 626 is typically an antenna for near field communication such as Bluetooth. The network control circuit 627 is configured to correspond to the communication standard. The position of the control board 62 is such that the antenna 626 is located in the housing 10 at a position where the radio signal can be received, that is, in an area within the translucent cover 11 (an area in front of the light source unit 40). And the posture is set. For example, an AV (Audio Video) device that is a target device operated by the user transmits a wireless signal, and the antenna 626 receives the wireless signal. The signal transmitted by the AV device is, for example, a signal for sound volume from the speaker 30, playback and stop thereof. The AV device may be a portable device.

  Note that the antenna 626 and the network control circuit 627 may correspond to a communication standard for configuring a WiFi (Wireless Fidelity), ZigBee, or a wireless LAN (Local Area Network) other than Bluetooth.

  The power supply substrate 50 has a first surface 51 that faces the base 15 side and a second surface 52 that faces the light source unit 40 side. The power supply circuit 55 mounted on the power supply board 50 includes a transformer 56T (see FIG. 2) including a primary side coil and a secondary side coil, and primary side electrons electrically connected to the primary side coil. And a component 56. The transformer 56 </ b> T and the primary side electronic component 56 are mounted on the first surface 51 of the power supply substrate 50.

  As described above, the transformer 56T and the primary-side electronic component 56 having a relatively large size are arranged on the base 15 side of the power supply substrate 50, so that the power source is placed in the space on the front side from the second surface 52 side. Parts different from the circuit 55, for example, a part of the light source unit 40 and the support unit 20 can be arranged. Thereby, the narrow space in the housing | casing 10 (or base housing | casing 12) can be used effectively.

[Electric configuration of light source device]
FIG. 11 is a block diagram illustrating an electrical configuration of the light source device 100.

  The light source device 100 includes a filter 53, a rectifying / smoothing circuit 54, an insulated DC / DC converter 57, an LED driving circuit 616, an audio AMP 615, a network control circuit 627, and an antenna 626. The commercial power supply 150 supplies power to the power supply circuit 55 via the base 15 of the light source device 100. Thus, in this embodiment, the commercial power supply 150 is used as an external power supply. Other external power sources may be used.

  The filter 53, the rectifying / smoothing circuit 54, and the insulated DC / DC converter 57 are the power supply circuit 55, and are mounted on the power supply substrate 50 as described above. The insulated DC / DC converter 57 includes the transformer 56T described above. An isolated DC / DC converter 57 is used for the power supply circuit 55, and the primary side circuit and the secondary side circuit are coupled in an electrically insulated state.

  The LED drive circuit 616 and the audio AMP 615 are mounted on the drive board 61 as described above. The LED drive circuit 616 controls the light source unit 40 to be turned on / off, dimmed, and toned. The audio AMP 615 is a drive circuit for the speaker 30 and controls the volume, reproduction, and stop of the sound from the speaker 30. In the present embodiment, the LED drive circuit 616 and the audio AMP 615 function as an optical drive circuit and a speaker drive circuit, respectively.

  As described above, the network control circuit 627 and the antenna 626 are part of the control circuit 625 and are mounted on the control board 62. The network control circuit 627 outputs the content information of the received signal to the LED driving circuit 616 and the audio AMP 615 based on the signal received via the receiving unit 628 and the antenna 626.

  As shown in FIG. 11, necessary predetermined power is supplied from the secondary side circuit of the power supply circuit 55 to the LED drive circuit 616, the audio AMP 615, and the network control circuit 627. Each power is supplied based on the power from the primary side circuit. Therefore, in the present embodiment, the power for driving the light source unit 40, the power for driving the speaker 30, and the power for driving the antenna 626 are output by the secondary side circuit of the power supply circuit 55, respectively.

(Configuration of ground connection of power supply circuit)
As shown in FIG. 2, a secondary-side ground connection pattern 59 is formed on the first surface 51 of the power supply substrate 50. The ground connection pattern 59 is electrically connected to the heat sink 23 and the base housing 12 via the screw S1. That is, the heat sink 23 and the base housing 12 serve as an electrical ground for the power supply circuit 55.

  As described above, in this embodiment, an insulating power supply circuit is used, and the secondary circuit is grounded. Therefore, EMI (Electro Magnetic Interference) or the like is not generated, proper EMS (Electro Magnetic Susceptibility) can be obtained, and EMC (Electro Magnetic Compatibility) conditions can be satisfied. That is, the present technology can suppress leakage of electromagnetic waves and high-frequency noise from the drive substrate 61, the antenna 626, the network control circuit 627, and the like, and can also suppress leakage of radiation (radiation) noise from the speaker 30. Of course, the entry of external noise into the base housing 12 can also be suppressed.

  Conventionally, an LED bulb using a non-insulated circuit is known. In such an LED bulb, an insulating configuration is mechanically realized using an insulating film or the like. That is, the circuit-like insulation configuration as in this embodiment is not taken. In such a situation, when an additional function such as a voice transmission function (speaker) or a wireless reception function (antenna) is given to the LED bulb, a noise problem with respect to EMC becomes a concern. That is, there is a high possibility that the EMC countermeasure is not sufficient in the mechanical insulation configuration.

  Here, an additional function given to a light source device such as an LED bulb will be described.

  The spread of LED bulbs is increasing due to the current power situation and power saving trend. However, there are still few products that can be dimmed individually. The background is as follows.

  That is, a dimming volume incorporated in a wall switch or the like for dimming a conventional light bulb is controlled to provide a section in which a voltage is cut by phase-controlling a sine wave of a commercial power source. When a general LED bulb or a bulb-type fluorescent lamp is used for such a dimmer, an inrush current flows every cycle of the sine wave, and it is damaged early. In order to solve this, for example, a circuit configuration such as an active filter system or a charge pump system for increasing the power factor can be considered. However, when such a circuit configuration is adopted, the circuit becomes large and it becomes difficult to reduce the size of the product.

  Therefore, a method of performing dimming control with an external signal, rather than dimming with an existing light bulb dimmer, can be considered. LED bulbs that perform dimming control with an infrared remote controller have already been released, but in this case, a remote controller is essential.

  Considering home appliance control such as a so-called smart house, utilities cannot be improved if a separate remote control is required. For this reason, it is expected that there will be an increasing need for dimming control from devices such as personal computers, smartphones, and tablets using radio signals. That is, there is a high possibility that a light source device to which a wireless reception function is added is required.

  In addition, the needs of speakers using a network are increasing due to the needs of housewives who want to listen to TV audio in the kitchen. However, adding a new outlet connection device to a water place such as a kitchen becomes an introduction barrier and a space such as a storage place becomes a problem. Therefore, there is a high possibility that a light source device to which a voice transmission function is added is required.

  In this way, there is a need for a light bulb to have a new additional function, and it is also an EMC problem including radiation noise that becomes a problem. That is, a light source device capable of exhibiting sufficient EMC countermeasures is required.

  As described above, in the light source device 100 according to the present embodiment, the insulating power supply circuit 55 is used. A heat radiating base casing 12 is provided in the casing 10 that houses the light source unit 40 and the power supply circuit 55. When the base casing 12 and the light source unit 40 are thermally connected, heat from the light source unit 40 is released to the outside of the casing 10. The base housing 12 is electrically connected to the secondary circuit included in the power supply circuit 55. As a result, radiation or intrusion of electromagnetic waves can be suppressed. As a result, it is possible to take EMC countermeasures while suppressing the influence of heat from the light source unit 40. This EMC countermeasure functions sufficiently even when an additional function such as a voice transmission function is provided. This makes it possible to provide a high-quality light source device including a speaker, a wireless communication antenna, and the like.

  Further, by taking the above EMC countermeasure, the light source device 100 can be applied to a so-called smart house.

  In the present embodiment, the members that form the ground potential are the heat sink 23 and the base casing 12 that function as heat dissipation members. That is, since the heat sink 23 and the base casing 12 have both functions of forming a ground potential and radiating heat, it is not necessary to provide a separate ground member, which contributes to downsizing of the light source device 100.

  In addition to the above-described screwing, solder connection, wrapping, connector connection, or the like may be used. That is, the ground of the secondary circuit and the base housing 12 may be electrically connected by any one of screwing, solder connection, lapping, and connector connection. Thereby, a secondary side circuit and the base housing | casing 12 can fully be conducted. For these conduction methods, a ground pattern, a ground terminal, and the like may be appropriately formed. Further, the ground of the secondary circuit and the base housing 12 may be conducted without using the heat sink 23. In addition, any method may be used as a conduction method between the secondary circuit and the base housing 12.

(Other embodiments)
The present technology is not limited to the embodiments described above, and other various embodiments can be realized.

  In the above, the insertion portion 612 is formed on the drive substrate 61 on which a drive circuit including the LED drive circuit 616 and the audio AMP 615 is mounted as a predetermined circuit. Then, the insertion portion 612 is inserted into the insertion hole 124 of the bottom surface portion 122 of the base housing 12. Thereby, in the light source device 100 provided with the speaker, the temperature rise of the audio AMP 615 as the speaker driving circuit can be efficiently suppressed. Moreover, the temperature rise of the LED drive circuit 616 as a light source drive circuit can be suppressed efficiently.

  Instead of the drive substrate 61, a part of the control substrate 62 may be inserted into the insertion hole 124 of the bottom surface portion 122. Thereby, the control board 62 and the bottom face part 122 are thermally connected. As a result, the temperature rise of the control circuit 625 including the network control circuit 627 and the antenna 626 can be efficiently suppressed. Note that the network control circuit 627 corresponds to a control circuit that receives a wireless signal via the antenna 626.

  The number of substrates inserted into the bottom portion is not limited. For example, in the above embodiment, both the drive board 61 and the control board 62 may be inserted into the bottom surface portion 122. In this case, the insertion hole 124 into which each substrate is inserted may be appropriately formed in the bottom surface portion 122.

  In addition, the light source device 100 may be provided with another device that exhibits an additional function. Examples of other devices include an image sensor, an optical sensor, an ultrasonic sensor, a radiation sensor, and a temperature sensor. A sensor that outputs a predetermined signal like these may be provided. A part of the substrate on which the sensor driving circuit for driving the sensor is mounted may be inserted into the insertion hole 124 of the bottom surface portion 122 of the base housing 12. Thereby, in a light source device including another device such as a sensor, a temperature rise of a drive circuit that drives the device can be efficiently suppressed.

  In a light source device equipped with a device such as a speaker, an antenna, or a sensor, processing of heat generated from the light source, other devices, circuits for driving these, and the like is an important matter. As described above, according to the present technology, in the light source device provided with the additional function, it is possible to efficiently suppress the temperature rise of the light source, other devices, circuits for driving these, and the like. This also contributes to miniaturization of the light source device.

  On the other hand, as the light source device according to the present embodiment, a device in which only the light source unit is mounted may be used. Also in this light source device, the temperature rise of the light source unit and the light source driving circuit for driving the light source unit can be efficiently suppressed. Further, a power supply board on which the power supply circuit is mounted may be disposed, for example, along the front-rear direction (z-axis direction) of the light source device, and a part of the power supply board may be inserted into the insertion hole in the bottom surface portion. Thereby, the temperature rise of a power supply circuit can be suppressed efficiently.

  12-16 is a figure for demonstrating the modification about the insertion hole formed in the bottom face part of a base housing | casing, and the insertion part of the circuit board inserted in a bottom face part. As shown in FIGS. 12 to 16, the shape and number of insertion holes formed in the bottom surface portion are not limited, and may be set as appropriate.

  For example, as shown in FIG. 12, an insertion portion 812 may be formed at the approximate center of the end portion 811 of the circuit board 861 so as to protrude along the length direction of the circuit board 861. As shown in FIG. 13, one insertion hole 824 is formed in the bottom surface portion 822 of the base housing 820 at a position corresponding to the insertion portion 812 of the circuit board 861.

  In this case, as shown in FIG. 14, a through hole 826 is also formed in the substrate storage box 850 at a position corresponding to the insertion portion 812. In this manner, the shape, position, number, and the like of the insertion portion 812 and the insertion hole 824 may be set as appropriate. By forming the insertion portion 812 as a portion to be inserted into the insertion hole 824 in the circuit board 861, the thermal connection between the circuit mounted on the circuit board 861 and the bottom surface portion 822 can be made sufficient. it can.

  The insertion portion may not be formed on the circuit board inserted into the bottom portion. For example, as shown in FIG. 15, an insertion hole 854 having a size capable of inserting the entire end portion of the circuit board is formed in the bottom surface portion 852 of the base casing 851. As shown in FIG. 16, a through hole 865 having a size capable of inserting the entire end into the circuit board is formed in the board housing box 860. By forming such an insertion hole 854 and the like, the entire end portion of the circuit board may be inserted into the insertion hole 854 of the bottom surface portion 852 through the through hole 865.

  About the shape of the insertion hole formed in a bottom face part, the insertion hole which has slit shape was formed in said embodiment and FIG.13 and FIG.15. Thus, for example, an insertion hole having a slit shape may be formed in accordance with the number or position of circuit boards to be inserted. However, as shown in FIG. 17, an insertion hole 903 having a semicircular shape may be formed in the bottom surface portion 902 of the base casing 901. For example, the insertion hole may be formed in any shape as long as the insertion portion of the circuit board or the entire end portion of the circuit board can be inserted. Since the inside of the base is relatively low in temperature, the temperature in the vicinity of the bottom surface can be lowered by increasing the insertion hole. Thereby, the heat of a predetermined circuit can be efficiently radiated. For example, the size and shape of the insertion hole may be appropriately set based on the temperature condition of the bottom surface portion, the rigidity of the bottom surface portion, and the like. The insertion hole may be formed so as not to penetrate the bottom surface.

  The conductive layer may not be formed on the circuit board into which the bottom portion is inserted. Even in this case, heat can be conducted to the bottom portion through the base material of the substrate, a circuit pattern formed on the substrate, or the like to dissipate heat.

  FIG. 18 is a schematic cross-sectional view showing another embodiment of a method for fixing a bottom surface portion of a base casing and a circuit board inserted into the bottom surface portion. In this modification, the circuit mounted on the circuit board 912 and the base casing 910 are electrically connected via the bottom surface portion 911 so that the base casing 910 serves as the ground of the secondary circuit of the power supply circuit.

  In the circuit board 912, the heat radiating portion 915 formed in the portion corresponding to the insertion portion 914 of the circuit forming layer 913 also functions as a ground connection pattern. This ground connection pattern is electrically connected to the bottom surface portion 911 through the screw S4. As shown in FIG. 18, the bottom surface portion 911 is provided with a mounting portion 916 that protrudes in the z-axis direction, and the mounting portion 916 and the heat radiating portion 915 that is a ground connection pattern are electrically connected. As a result, the base casing 910 serves as an electrical ground for the secondary circuit of the power supply circuit. The ground connection pattern may be formed separately from the heat radiating portion 915.

  As in this modification, the ground potential may be formed by the base casing 910 by conducting the ground connection pattern formed on the circuit board 912 and the bottom surface portion 911. As a result, radiation and intrusion of electromagnetic waves and the like can be suppressed, and EMC measures can be taken.

  In addition to the above-described screwing, solder connection, wrapping, connector connection, or the like may be used. That is, the ground of the circuit board 912 and the bottom surface portion 911 may be electrically connected by any one of screwing, solder connection, lapping, and connector connection. Thereby, the secondary side circuit and the base casing 910 can be sufficiently conducted. For these conduction methods, a ground pattern, a ground terminal, and the like may be appropriately formed. Any other method may be used as a conduction method between the ground pattern and the bottom surface portion 911.

  In the said embodiment, the light source unit 40 which mounted the LED element 45 which has a point light emission function was mentioned as an example as the light source unit 40. FIG. The light source unit is not limited to this, and may be, for example, an organic or inorganic EL (Electro Luminescence) element, that is, a light source unit having a surface light emission function, or a CCFL (Cold Cathode Fluorescent Lighting (3) having a three-dimensional light emission function. Lamp)) or the like.

  Further, although the light source unit 40 has a ring shape, it may have a polygonal shape of a triangle or more, or a linear shape (formed in one or more linear shapes). The power supply board 50 may have another shape for the same purpose.

  In the above embodiment, a damperless speaker is exemplified as the speaker 30, but a general type speaker 30 that does not use the magnetic fluid 38 may be used.

  The gap region 50a of the power supply substrate 50 may be a notch instead of the through hole. Or the space | gap area | region 50a may be formed of both the through-hole and the notch. In this case, the power supply substrate 50 is formed in a C shape. Alternatively, the power supply substrate 50 may be formed in a semi-ring shape.

  In the embodiment described above, the infrared signal receiver 628 is mounted on the control board 62, but may be mounted on the drive board 61. Alternatively, the infrared signal receiving unit 628 from the remote controller is not necessarily provided.

  The insulating ring 16 provided between the base 15 and the bottom surface portion 122 shown in FIG. 2 may be formed of a material with high heat dissipation. Thereby, the heat dissipation of the bottom surface portion 122 is improved.

  It is also possible to combine at least two feature portions among the feature portions of each embodiment described above.

In addition, this technique can also take the following structures.
(1) a light source unit;
A circuit board on which a predetermined circuit is mounted;
A base used to supply power to the light source unit and the circuit;
A translucent cover covering the light source unit;
A connecting portion connected to the base via an insulator, and an insertion hole formed in the connecting portion for thermal connection between the connecting portion and the circuit, into which at least a part of the circuit board is inserted. And a heat-radiating base casing thermally connected to the light source unit. A bulb-type light source device comprising: a casing that houses the light source unit and the circuit board.
(2) The light bulb type light source device according to (1),
The circuit board has a conductive layer that guides heat of the circuit to the connection portion.
(3) The light bulb type light source device according to (2),
The conductive layer is formed on the circuit board as an intermediate layer.
(4) The bulb-type light source device according to any one of (1) to (3),
The circuit board is a light bulb type light source device in which a portion inserted into the insertion hole is fixed to the connection portion by an adhesive.
(5) The light bulb type light source device according to any one of (1) to (4),
The circuit board has an insertion portion formed as a portion to be inserted into the insertion hole.
(6) The light bulb type light source device according to any one of (1) to (5),
A speaker,
The predetermined circuit includes a speaker driving circuit that drives the speaker.
(7) The bulb-type light source device according to any one of (1) to (6),
The predetermined circuit includes a light source driving circuit that drives the light source unit.
(8) The bulb-type light source device according to any one of (1) to (7),
It further comprises an antenna for wireless communication,
The predetermined circuit includes a control circuit that receives a radio signal via the antenna.
(9) The light bulb type light source device according to any one of (1) to (8),
A sensor for outputting a predetermined signal;
The predetermined circuit includes a sensor driving circuit that drives the sensor.
(10) The bulb-type light source device according to any one of (1) to (9),
A power supply board having a void area and mounted with a power supply circuit connected to an external power supply;
The circuit board is disposed in a gap region of the power supply board so as to intersect perpendicularly with the power supply board.
(11) The light bulb type light source device according to (10),
The power supply circuit includes a primary circuit connected to the external power supply, and a secondary circuit that is coupled to the primary circuit in an insulated state and supplies power to the circuit.
The light bulb type light source device, wherein the circuit is electrically connected to the base casing through the connection portion so that the base casing serves as a ground of the secondary circuit.
(12) The bulb-type light source device according to any one of (1) to (9),
The predetermined circuit includes a power supply circuit connected to an external power supply.
(13) The bulb-type light source device according to any one of (1) to (12),
The said base housing | casing has a container shape which used the said connection part as the bottom face part.
(14) The bulb-type light source device according to any one of (1) to (13),
The insertion hole has a slit shape.
(15) The bulb-type light source device according to any one of (1) to (14),
The base casing is a light bulb type light source device made of a metal material having a relatively high thermal conductivity.
(16) The bulb-type light source device according to any one of (1) to (15),
The light source unit includes a light emitting diode (LED) or an EL (Electro Luminescence) element as a light source element.

DESCRIPTION OF SYMBOLS 10 ... Housing 11 ... Translucent cover 12, 820, 851, 901, 910 ... Base housing 15 ... Base 30 ... Speaker 40 ... Light source unit 50 ... Power supply board 50a ... Air gap area 55 ... Power supply circuit 61 ... Drive board 61 ... Drive circuit 62 ... Control board 72 ... Conductive layer 75 ... Adhesive 100 ... Light bulb type light source device 122, 822, 852, 902, 911 ... Bottom part 124, 824, 903 ... Insertion hole 150 ... Commercial power supply 612, 812, 854 914: Insertion unit 615: Audio AMP
616: LED drive circuit 625 ... control circuit 626 ... antenna 627 ... network control circuit 861, 912 ... circuit board

Claims (16)

A light source unit;
A circuit board on which a predetermined circuit is mounted;
A base used to supply power to the light source unit and the circuit;
A translucent cover covering the light source unit;
A connecting portion connected to the base via an insulator, and an insertion hole formed in the connecting portion for thermal connection between the connecting portion and the circuit, into which at least a part of the circuit board is inserted. And a heat-radiating base casing thermally connected to the light source unit. A bulb-type light source device comprising: a casing that houses the light source unit and the circuit board. The light bulb type light source device according to claim 1,
The circuit board has a conductive layer that guides heat of the circuit to the connection portion. The light bulb type light source device according to claim 2,
The conductive layer is formed on the circuit board as an intermediate layer. The light bulb type light source device according to claim 1,
The circuit board is a light bulb type light source device in which a portion inserted into the insertion hole is fixed to the connection portion by an adhesive. The light bulb type light source device according to claim 1,
The circuit board has an insertion portion formed as a portion to be inserted into the insertion hole. The light bulb type light source device according to claim 1,
A speaker,
The predetermined circuit includes a speaker driving circuit that drives the speaker. The light bulb type light source device according to claim 1,
The predetermined circuit includes a light source driving circuit that drives the light source unit. The light bulb type light source device according to claim 1,
It further comprises an antenna for wireless communication,
The predetermined circuit includes a control circuit that receives a radio signal via the antenna. The light bulb type light source device according to claim 1,
A sensor for outputting a predetermined signal;
The predetermined circuit includes a sensor driving circuit that drives the sensor. The light bulb type light source device according to claim 1,
A power supply board having a void area and mounted with a power supply circuit connected to an external power supply;
The circuit board is disposed in a gap region of the power supply board so as to intersect perpendicularly with the power supply board. The light bulb type light source device according to claim 10,
The power supply circuit includes a primary circuit connected to the external power supply, and a secondary circuit that is coupled to the primary circuit in an insulated state and supplies power to the circuit.
The light bulb type light source device, wherein the circuit is electrically connected to the base casing through the connection portion so that the base casing serves as a ground of the secondary circuit. The light bulb type light source device according to claim 1,
The predetermined circuit includes a power supply circuit connected to an external power supply. The light bulb type light source device according to claim 1,
The said base housing | casing has a container shape which used the said connection part as the bottom face part. The light bulb type light source device according to claim 1,
The insertion hole has a slit shape. The light bulb type light source device according to claim 1,
The base casing is a light bulb type light source device made of a metal material having a relatively high thermal conductivity. The light bulb type light source device according to claim 1,
The light source unit includes a light emitting diode (LED) or an EL (Electro Luminescence) element as a light source element.

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