JP2013219291A - Electronic module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic module which is provided with a shield structure while achieving low costs and thickness reduction.SOLUTION: An electronic module includes: a first insulation plate member; a conductive pattern and a wiring pattern which are respectively provided on first and second surfaces of the first insulation plate member; an interlayer connection conductor establishing electric continuity between the conductive pattern and the wiring pattern and formed in a thickness direction of the first insulation plate member; an electronic component mounted on the second surface of the first insulation plate member through the wiring pattern; a second insulation plate member positioned on the second surface of the first insulation plate member in a lamination manner so as to bury the electronic component; a metal shield layer member provided on a surface of the second insulation plate member that is opposite to the surface where the first insulation plate member is positioned; and a protection film formed so as to cover the surface of the second insulation plate member which is opposite to the surface where the first insulation plate member is positioned and includes the metal shield layer member. The protection film is formed covering the second insulation plate member so as not to provide a component mounting land region to the metal shield layer member.

Description

  The present invention relates to an electronic module which is a component obtained by modularizing an electronic circuit, and more particularly to an electronic module having a shield structure.

  An electronic module, which is a component obtained by modularizing an electronic circuit, includes a wiring board and an electronic component mounted on the surface of the wiring substrate. In recent years, in addition to this, a configuration in which electronic components are embedded in a wiring board is also used. A small and highly functional electronic module is realized by multilayering the wiring board itself and embedding electronic components in the wiring board.

  On the other hand, there are many cases where a shield structure is required for use of an electronic module. In order to make a shield structure in an electronic module, for example, a metal shield case is generally provided so as to cover a surface-mounted electronic component group. In this case, it is considered that a situation in which the cost increases due to an increase in the number of steps and a situation in which the thickness of the electronic module increases to hinder downsizing are unavoidable.

JP 2003-197849 A

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic module that is a component obtained by modularizing an electronic circuit and can be provided with a shield structure while suppressing an increase in cost and reducing the thickness.

  In order to solve the above-described problems, an electronic module according to one embodiment of the present invention includes a first insulating plate member having a first surface and a second surface facing the first surface; A conductive pattern provided on the first surface of the insulating plate member, a wiring pattern provided on the second surface of the first insulating plate member, and the conductive pattern and the wiring pattern. Interlayer connection conductors formed in the thickness direction of the first insulating plate member for electrical conduction, and electronic components mounted on the second surface of the first insulating plate member via the wiring pattern A second insulating plate member positioned in a stacked manner on the second surface of the first insulating plate member so as to embed the electronic component; and the first insulating plate of the second insulating plate member A metal shield layer member provided on the side opposite to the side where the member is located; A protective film formed so as to cover the side of the second insulating plate member including the shield layer member made of the metal, on the side opposite to the side where the first insulating plate member is located, The protective film includes the metal shield layer member so as not to provide a component mounting land region on the side of the second insulating plate member opposite to the side where the first insulating plate member is located. The second insulating plate member covers the side opposite to the side on which the first insulating plate member is located.

  This electronic module is formed in the thickness direction of the first insulating plate member that electrically connects the first insulating plate member, the conductive pattern and the wiring pattern provided on both surfaces thereof, and the conductive pattern and the wiring pattern, respectively. A configuration as a normal (= no shield structure) electronic module is realized by the interlayer connection conductor and the electronic component mounted on the surface of the first insulating plate member via the wiring pattern. And the second insulating plate member positioned in a stacked manner on the surface of the first insulating plate member so as to embed the electronic component, and the side on which the first insulating plate member of the second insulating plate member is positioned A shield structure is constituted by a metal shield layer member provided on the opposite side.

  The second insulating plate member and the metal shield layer member for obtaining the shield structure can be provided on the first insulating plate member by diverting a process for realizing a component built-in (embedded) structure. Therefore, it is possible to suppress an increase in cost such as providing a metal shield case. In addition, it is possible to reduce the thickness of the electronic module as a whole, due to the fact that mounting of electronic components is limited to mounting on the wiring pattern on the first insulating plate member.

  ADVANTAGE OF THE INVENTION According to this invention, in the electronic module which is a component which modularized the electronic circuit, a shield structure can be provided, suppressing a cost increase and achieving thickness reduction.

1 is a cross-sectional view schematically showing a configuration of an electronic module that is an embodiment of the present invention. Process drawing which shows a part of process of manufacturing the electronic module shown in FIG. 1 with a typical cross section. Sectional drawing which shows the structure of the electronic module which is another embodiment typically. Furthermore, sectional drawing which shows typically the structure of the electronic module which is another embodiment. Process drawing which shows a part of process in which the electronic module shown in FIG. 4 is manufactured with a typical cross section. Sectional drawing which shows typically the structure of the electronic module which is another (4th) embodiment. Process drawing which shows a part of process of manufacturing the electronic module shown in FIG. 6 with a typical cross section.

  As an embodiment of the present invention, it is possible to further include a second wiring pattern provided in a layer form in the middle of the thickness direction of the first insulating plate member. If the first insulating plate member has a multilayer wiring structure as described above, an electronic module having a more complicated circuit configuration can be provided.

  Further, as an embodiment, the interlayer connection conductor is adjacent to or adjacent to the surface of the conductive pattern and the surface of the second wiring pattern adjacent to the conductive pattern in the second wiring pattern. A dense structure between the surfaces of the second wiring pattern or between the surface of the wiring pattern and the surface of the second wiring pattern adjacent to the wiring pattern in the second wiring pattern. It can be said that it is a conductor formed in the shape of a column. Since such an interlayer connection conductor can be positioned so as to overlap in the thickness direction of the first insulating plate member, it is disposed at a higher density than the interlayer connection conductor (so-called through hole) on the inner wall surface of the through hole. Is possible.

  As an embodiment, the interlayer connection conductor can be formed of a conductive composition. The use of a conductive composition to form a dense interlayer connection conductor is an easy-to-use option along with the use of bumps formed by plating.

  As an embodiment, the interlayer connection conductor may have a columnar shape whose diameter changes in the axial direction. Such an interlayer connection conductor can be obtained, for example, from a bump obtained by screen printing a conductive composition initially prepared in a paste form. By using screen printing, it is possible to efficiently form a fine and densely arranged interlayer connection conductor.

  As an embodiment, the interlayer connection conductor may have a shape that does not change in diameter in the columnar axial direction. Such an interlayer connection body can be obtained, for example, by filling a through-hole formed in the first insulating plate member with a conductive composition initially prepared in a paste form. Forming the through hole in the first insulating plate member is a process that is also used when forming a so-called through hole, and is a process that is not particularly difficult.

  As an embodiment, the electronic component can be mounted on the second surface of the first insulating plate member using solder containing tin via the wiring pattern. In order to mount an electronic component with solder containing tin, for example, a normal surface mounting technique may be applied to the electronic component. If a normal surface mounting technique is used on the first insulating plate member, efficient mounting is realized.

  As an embodiment, the conductive pattern may have an external connection terminal region. In this way, the electronic module can be surface-mounted as a surface mounting component on, for example, another wiring board. Thereby, the use as an electronic module spreads.

  As an embodiment, the second insulating plate member may include a reinforcing material in a region avoiding the region of the electronic component. The second insulating plate member can be regarded as a spacer for providing a metal shield layer member apart from the electronic component. Therefore, if a reinforcing material is contained in the second insulating plate member, which is a functional product as a spacer, there is an advantage that a structure having high mechanical strength can be obtained as an electronic module.

  As an embodiment, the second insulating plate member is a plate member having first, second, and third layers from the first insulating plate member side, and the first insulating plate member The first sub-plate member closest to the third sub-plate member and the third sub-plate member farthest from the second insulating plate member do not have an opening that avoids the area of the electronic component, whereas the first sub-plate The second sub-plate member positioned between the member and the second sub-plate member is formed with an opening so as to be separated from the electronic component, so that no gap is generated around the electronic component. In addition, the first sub-plate member or the third sub-plate member may be deformed and in close contact with the electronic component.

  Such a structure of the second insulating plate member has the following effects. That is, by arbitrarily changing the thickness of the second sub plate member, it is easy to match the thickness of the entire second insulating plate member to the size in the height direction of the electronic component. Therefore, it becomes easy to respond to the thickness of the electronic component, and the thickness of the electronic module can be easily controlled.

  Further, as an embodiment, a second conductive pattern provided in a layered manner in the middle of the thickness direction of the second insulating plate member, avoiding the area of the electronic component, and the second conductive pattern And further comprising a second interlayer connection conductor formed in the thickness direction of the second insulating plate member for electrically connecting the wiring pattern and the metal shield layer member. In this way, the metal shield layer member is electrically fixed (potential is set via the conductive pattern, the interlayer connection conductor, and the wiring pattern, and further via the second conductive pattern and the second interlayer connection conductor. The internal structure to be fixed is easily obtained.

  Based on the above, embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view schematically showing a configuration of an electronic module according to an embodiment of the present invention. As shown in the figure, the electronic module includes insulating layers 11 and 12 (first insulating plate member 11 and 12), an insulating layer 13 with reinforcing material (second insulating plate member), a conductive pattern 21, and wiring. Patterns 22 and 23, interlayer connection conductors 31 and 32, surface mount type passive element parts 41, 42 and 43, semiconductor element parts 49 (electronic parts), connection members 51, 52, 53 and 54 (solder), metal shield layers A member 61 and solder resists 71 and 72 (protective film) are provided.

  A conductive pattern 21 is provided on the lower surface side of the electronic module, and a region of the external connection terminal 21a (a region where the solder resist 71 is not formed) is secured in the conductive pattern 21. The external connection terminal 21a is a surface mounting terminal, and is used when the electronic module is surface mounted on another wiring board using, for example, solder. By providing the surface mounting terminals, the electronic module can be handled in the same manner as the surface mounting components.

  In terms of electrical meaning, a portion excluding the insulating layer 13 with a reinforcing material, the metal shield layer member 61, and the solder resist 72, that is, the surface mount type passive element components 41, 42, 43, and the semiconductor element component 49 below. This part is a constituent part of a normal electronic module, and the insulating layer 13 with reinforcing material and the metal shield layer member 61 are constituents for adding a shield structure to the normal part. It can be said that the insulating layer 13 with the reinforcing material functions as a spacer for providing the metal shield layer member 61.

  The insulating layer 13 with the reinforcing material contains a reinforcing material 13a (for example, glass cloth) in a region that avoids the regions of the surface-mounted passive element components 41, 42, and 43 and the semiconductor element component 49. Thus, if the reinforcing material 13a is contained in the insulating layer 13 which is originally a spacer, it can contribute to obtaining a structure having higher mechanical strength as an electronic module. In particular, the insulating layers 11 and 12 (first insulating plate member) may be very thin as a result of the specifications required for circuit formation. The inclusion of the reinforcing material 13a is very convenient because it can complement the function. Although not shown, it goes without saying that a reinforcing material can be contained in the insulating layers 11 and 12 as in the case of a normal insulating plate member.

  Further, a metal shield layer member 61 (for example, made of Cu) is provided on the upper surface side as the electronic module. On the metal shield layer member 61, a reinforcing material-containing insulating layer 13 (second insulating plate member). ) A solder resist 72 is formed so as to cover the top. This prevents the metal shield layer member 61 from being exposed to the air and corroding and deteriorating over the long term. For this reason, as shown in the figure, the layer of the solder resist 72 is formed so as to cover the end face of the metallic shield layer member 61.

  The solder resist 72 is formed so as to cover the metal shield layer member 61 so as not to give a component mounting land area to the metal shield layer member 61 in relation to the metal shield layer member 61. Further, the solder resist 72 further covers the reinforcing material-containing insulating layer 13 including the metal shield layer member 61 so as not to give a component mounting land region to other regions on the reinforcing material-containing insulating layer 13. Covering. Although the metal shield layer member 61 is conductive, this electronic module does not function as a pattern for wiring. In other words, all necessary components are positioned so as to be embedded in the insulating layer 13 with the reinforcing material, thereby realizing a very thin electronic module having a shield structure.

  A material thicker than the wiring patterns 22 and 23 may be used for the metal shield layer member 61 (for example, a thickness of 35 μm or 70 μm). If it does in this way, it will function also as a stiffener, and can contribute to making mechanical strength higher still as an electronic module. Furthermore, it can contribute to the reduction of warpage as an electronic module.

  Although not shown in the figure, the metal shield layer member 61 is electrically fixed (potential fixed), but it is conceivable to provide a region for connecting a conductor or a conductive member in a part of the layer member 61. It is done. Since the layer of the solder resist 72 is naturally not formed in the part of the region thus provided, for example, a Ni / Au plating layer is formed on the exposed surface in order to prevent corrosion.

  For the insulating layers 11 and 12, a rigid organic material such as an epoxy resin can be used (thickness is 60 μm, for example). As already mentioned, glass cloth may be included for mechanical strengthening. Similarly, a rigid organic material such as glass epoxy resin can be used for the insulating layer 13 with a reinforcing material. The total thickness (thickness including the components 41 to 43, 49) is thicker than that in consideration of the maximum thickness required for mounting the components 41 to 43, 49, for example, about 0.5 mm. it can.

  The insulating layer 13 with the reinforcing material is positioned on the insulating layer 12 so as to embed the components 41 to 43 and 49. The insulating layer 13 with the reinforcing material is interposed between the components 41 to 43 and 49. It is a layer formed by deforming from its original shape so that no voids are formed in it. This is due to diversion of the process for realizing the component built-in (embedded) structure for manufacturing the component built-in wiring board. Details will be described later (FIG. 2).

  The conductive pattern 21 and the wiring patterns 22 and 23 can be obtained by using a copper foil having a thickness of 18 μm, for example, as a material and patterning the same using a known photolithography process. Since the metal shield layer member 61 is also made of copper in this electronic module, it can also be obtained by patterning that removes unnecessary portions (periphery) using a well-known photolithography process. Of course, a material other than copper (for example, a metal containing iron) can be used as the metal shield layer member 61. Even in that case, patterning can be performed in a predetermined manner by using an etchant corresponding to the metal species.

  The interlayer connection conductors 31 and 32 can be obtained from bumps formed by screen-printing a conductive composition (for example, a paste-like composition called silver paste). Since it is well known, the details will be broken. However, generally speaking, bumps obtained by screen printing on a metal foil (or on a patterned wiring (conductive) pattern) and screen printing are dried and cured, and the insulating layer 11 (or 12). The prepreg layer in a semi-cured state which is a precursor of) is penetrated under pressure, and the prepreg layer is thermally cured in that state. Thereby, the interlayer connection conductor 31 (or 32) in a state of penetrating the insulating layer 11 (or 12) is obtained.

  The interlayer connection conductors 31 and 32 are derived from the initial bump shape, and have a columnar dense structure as shown in the figure and have a shape whose diameter changes in the axial direction. Since it is formed using screen printing, the interlayer connection conductors 31 and 32 having fine and high-density arrangement can be efficiently formed.

  In this embodiment, the wiring pattern 22 is provided in the middle in the thickness direction of the insulating layers 11 and 12 that are the first insulating plate members to be multilayered. Therefore, an electronic module having a more complicated circuit configuration can be configured. As for the interlayer connection structure, an interlayer connection conductor 31 is provided between the surface of the conductive pattern 21 and the surface of the adjacent wiring pattern 22, and the surface of the wiring pattern 22 and the surface of the adjacent wiring pattern 23 are connected. An interlayer connection conductor 32 is provided therebetween.

  Since the interlayer connection conductors 31 and 32 are conductors formed in a columnar shape between the surfaces of the wiring pattern (conductive pattern), the interlayer connection conductors 31 and 32 can be positioned in the thickness direction of the insulating layers 11 and 12 as the first insulating plate members. It is. Thereby, it can arrange | position more densely than the interlayer connection conductor (what is called a through hole) on the inner wall surface of a through hole. The first insulating plate member can be further formed into a multilayer wiring, and in this case, the same interlayer connection conductor can be provided between the surfaces of the wiring patterns of the adjacent intermediate layers.

  The use of a conductive composition to form the dense interlayer connection conductors 31 and 32 is an easy-to-use option along with the use of bumps formed by plating.

  The surface mounted passive element components 41 to 43 are components such as a chip capacitor, a chip resistor, and a chip inductor, for example. It has a substantially rectangular parallelepiped shape, and a part of upper and lower surfaces (including a part of both side surfaces in some cases) including the end surface thereof are both terminal electrodes. And it mounts using the connection members 51, 52, and 54 on the surface of the insulating layer 12 in the attitude | position which the lower surface of both terminal electrodes opposes the component mounting land which the wiring pattern 23 has.

  The semiconductor element component 49 is an electronic component including a semiconductor chip having, for example, surface mounting terminals arranged on the surface thereof in a grid shape, for example. By having a surface mounting terminal, it can be mounted on the wiring pattern 23 by the connection member 53 by the surface mounting technology similar to the surface mounting type passive element components 41 to 43, and its manufacturing efficiency and cost are other flip connection. This is far more advantageous than the structure.

  Here, solder is employed for the connection members 51 to 54 that electrically and mechanically connect the components 41 to 43 and 49 to the wiring pattern 23. As the solder, for example, various solders including lead-free solder containing tin can be used. If solder is used, the surface mounting production efficiency is very high due to the reflow process. It is also possible to employ a conductive adhesive instead of solder. Of course, the solder 53 on which the semiconductor element component 49 is mounted can be replaced with another known flip connection structure.

  FIG. 2 is a process diagram schematically showing a part of a process of manufacturing the electronic module shown in FIG. In FIG. 2, the same or equivalent parts as shown in FIG. This process is one process (= stacking process) close to the final process for providing the shield structure.

  The lower member shown in FIG. 2 can be viewed as a configuration of a normal electronic module. However, at this stage, a metal foil (copper foil) 21 </ b> A before patterning is provided on the conductive pattern 21. The solder resist 71 is not yet formed. Since the insulating layer 13 with the reinforcing material is in close contact with the side on which the wiring pattern 23 is provided, the solder resist layer may not be provided.

  The upper member shown in FIG. 2 is a member for providing a shield structure to the lower member. As the structure, a prepreg layer 131A, 132A, 133A, 134A containing a reinforcing material is laminated from below, and a copper foil (or copper plate; hereinafter the same) to be the metal shield layer member 61 on the prepreg layer 134A. 61A is laminated. In the prepreg layers 131A, 132A, and 133A among the four prepreg layers, component openings 13o1 and 13o2 are formed corresponding to the positions of the components 41 to 43 and 49, respectively.

  The component openings 13o1 and 13o2 are formed by, for example, processing the reinforcing prepreg layers 131A, 132A, and 133A laminated as three layers before the openings are formed. Here, the component openings 13o1 and 13o2 may be formed so as to be common to the plurality of components 41, 42, and 49 in a region where the component arrangement density is high as illustrated. Thereafter, a laminate of the reinforcing material-containing prepreg layer 134A and the copper foil 61A can be laminated on the processed laminate to form a member on the upper side in the figure. It should be noted that the thicknesses of the reinforcing material-containing prepreg layers 131A, 132A, 133A, and 134A and the number of stacked layers can be appropriately determined according to the mounting height of the components 41 to 43 and 49.

  When the lamination process under heating and pressurization is performed in the arrangement as shown in FIG. 2, the prepreg layers 131A, 132A, 133A, and 134A are deformed by obtaining fluidity by heat, and voids are generated around the parts 41 to 43 and 49. It is thermoset while being in close contact with these components 41 to 43, 49 so as not to exist. Thereby, as shown in FIG. 1, the insulating layer 13 with a reinforcing material which functions as a spacer is formed.

  After the lamination process shown in FIG. 2, the metal foil 21A and the copper foil 61A are patterned in a predetermined manner, and further, the solder resists 71 and 72 are formed, whereby the electronic module as shown in FIG. 1 is obtained.

  As described above, this electronic module includes the first insulating plate member (insulating layers 11 and 12), the conductive pattern 21 and the wiring pattern 23 provided on both surfaces thereof, the conductive pattern 21 and the wiring pattern 23, respectively. Between the interlayer connecting conductors 31 and 32 formed in the thickness direction of the first insulating plate member and an electronic component (semiconductor) mounted on the surface of the first insulating plate member via the wiring pattern 23 A configuration as a normal (= no shield structure) electronic module is realized with the element parts 49) and the like. Then, a second insulating plate member (insulating layer 13 with a reinforcing material) positioned in a stacked manner on the surface of the first insulating plate member so as to embed the electronic component, and the first insulation of the second insulating plate member The shield structure is configured by the metal shield layer member 61 provided on the side opposite to the side on which the plate member is located.

  In order to obtain the shield structure, the second insulating plate member (insulating layer 13 with reinforcing material) and the metal shield layer member 61 use the first insulating plate member by diverting the process of realizing the component built-in (embedded) structure. It can be provided on. Therefore, it is possible to suppress an increase in cost such as providing a metal shield case. In addition, the mounting of electronic components is limited to mounting on the wiring pattern 23 on the first insulating plate member, so that the entire electronic module can be made extremely thin. Further, this shield structure is a robust shield structure because the space between the metal shield layer member 61 and the shielded parts 41 to 43, 49 is filled with the insulating layer 13 instead of the space.

  Next, FIG. 3 is a cross-sectional view schematically showing a configuration of an electronic module according to another embodiment. In the figure, the same or equivalent parts as those shown in FIG. The description of the portion is omitted unless there is an additional description.

  In this embodiment, instead of the interlayer connection conductors 31 and 32 derived from bumps formed by screen printing the conductive composition, an interlayer connection conductor 31A formed by filling the through holes of the conductive composition, 32A is adopted. The other points are the same as those shown in FIG.

  Similar to the interlayer connection conductors 31 and 32, the interlayer connection conductors 31A and 32A are also conductors formed in a dense columnar shape between the surfaces of the wiring patterns 22 and 23 and the conductive pattern 21. Therefore, since it can be positioned in the thickness direction, it can be arranged at a higher density than the interlayer connection conductor (so-called through hole) on the inner wall surface of the through hole.

  The interlayer connection conductors 31A and 32A have a shape in which the diameter does not change in the columnar axial direction depending on the formation process. That is, such interlayer connection bodies 31A and 32A are filled with through-holes formed in the prepreg layers to be the insulating layers 11 and 12, for example, with the conductive composition initially prepared in a paste form. Can be obtained. Forming the through hole in the prepreg layer is a process that is also used when forming a so-called through hole, and is a process that is not particularly difficult.

  Next, FIG. 4 is a cross-sectional view schematically showing a configuration of an electronic module which is still another embodiment. In the figure, the same or equivalent parts as those shown in the already described figures are denoted by the same reference numerals. The description of the portion is omitted unless there is an additional description.

  This embodiment is different from the one shown in FIG. 1 in that an insulating layer 13r configured without including a reinforcing material is used instead of the insulating layer 13 containing a reinforcing material. Other points are the same as those shown in FIG. Naturally, such a configuration can be obtained by using a prepreg layer without a reinforcing material in place of the prepreg layers 131A, 132A, 133A, and 134A containing the reinforcing material in the embodiment shown in FIGS. be able to.

  However, in addition to such a manufacturing method, it can also be obtained by the following manufacturing process. This will be described with reference to FIG. FIG. 5 is a process diagram schematically showing a part of the process of manufacturing the electronic module shown in FIG. 4 in a cross section, and shows a stacking stage corresponding to the stage shown in FIG. In FIG. 5, the same or equivalent parts as those shown in FIG.

  As shown in the drawing, in this stacking stage, a prepreg layer 13rA that is not formed with any openings and is to be used as the insulating layer 13r is used. When the lamination process under heating and pressurization is performed in the arrangement as shown in FIG. 5, the prepreg layer 13rA is deformed by obtaining fluidity by heat, so that no voids are generated around the parts 41 to 43, 49. It thermosets in close contact with 41-43, 49. Thereby, as shown in FIG. 4, the insulating layer 13r functioning as a spacer is formed.

  In this embodiment, the reinforcing material such as glass cloth is not included in the prepreg layer 13rA to be the insulating layer 13r, and the reinforcing material and the components 41 to 42, 49 even if the lamination process as shown in FIG. Does not interfere with each other. Therefore, it can use for a lamination process, without providing an opening part as mentioned above. As an intermediate position between the configuration shown in FIG. 1 and the configuration shown in FIG. 4, the prepreg layer 134A containing the reinforcing material is left, and there is no opening and no reinforcing material below the reinforcing prepreg layer 134A. It is also conceivable to use a laminate of the prepreg layer 13rA instead of the prepreg layer. Only the prepreg layer 134A containing a reinforcing material relies on the fact that no opening is originally formed, and therefore there is no region where the reinforcing material is removed.

  Next, still another embodiment will be described with reference to FIG. FIG. 6 is a cross-sectional view schematically showing a configuration of an electronic module which is still another (fourth) embodiment. In the figure, the same or equivalent parts as those shown in the already described figures are denoted by the same reference numerals. The description of the portion is omitted unless there is an additional description.

  This embodiment is different from that shown in FIG. 1 and the like in that an internal structure for fixing the potential of the metallic shield layer member 61 is further provided. For this purpose, conductive patterns 24, 25, 26, and 27 and interlayer connection conductors 33, 34, 35, 36, and 37 are additionally provided. In addition, in order to provide the conductive patterns 24 to 27 and the interlayer connection conductors 33 to 37, laminated insulating layers 14, 15, 16, 17, and 18 are provided in place of the insulating layer 13. Although not shown, each of the insulating layers 14 to 18 may contain a reinforcing material.

  With the configuration shown in FIG. 6, the metal is connected via the conductive pattern 21, the interlayer connection conductors 31 and 32, and the wiring patterns 22 and 23, and further via the conductive patterns 24 to 27 and the interlayer connection conductors 33 to 37. An internal structure for electrically fixing the shield layer member 61 (fixing the potential) can be easily obtained. Hereinafter, for convenience of explanation, the insulating layer 14 is referred to as a first sub-plate member, the insulating layers 15, 16, and 17 are referred to as a second sub-plate member, and the insulating layer 18 is referred to as a third sub-plate member.

  Similarly to the conductive pattern 21 and the wiring patterns 22 and 23, the conductive patterns 24 to 27 can be obtained by, for example, using 18 μm copper foil as a material and patterning the same using a known photolithography process. Similar to the interlayer connection conductors 31 and 32, the interlayer connection conductors 33 to 37 can be obtained from bumps formed by screen printing the conductive composition.

  FIG. 7 is a process view schematically showing a part of the process of manufacturing the electronic module shown in FIG. 6 in a cross section, and shows a stacking stage corresponding to the stage shown in FIGS. In FIG. 7, the same or equivalent parts as those shown in FIG.

  The member shown on the lowermost side in FIG. 7 has substantially the same configuration as that shown on the lower side in FIG. 2, and can be viewed as a configuration of an ordinary electronic module. The member shown in the middle of FIG. 7 is the insulating layer 14 (first sub-plate member) below the laminated insulating layers 15, 16, 17 (second sub-plate member) that have already been heat-cured. A prepreg layer 14A to be formed is laminated. In the insulating layers 15 to 17 and the prepreg layer 14A, component openings 13o1 and 13o2 are formed corresponding to the positions of the components 42, 43, and 49. The formation of the conductive patterns 24 to 27 and the interlayer connection conductors 33 to 37 is well known as the conductive pattern 21, the wiring patterns 22 and 23, and the interlayer connection conductors 31 and 32.

  The uppermost member in FIG. 7 is obtained by laminating a copper foil 61A to be a metal shield layer member 61 on a prepreg layer 18A to be an insulating layer 18 (third sub-plate member). . Further, an interlayer connection conductor 37 is formed through the prepreg layer 18A. The formation of the interlayer connection conductor 37 is well known in the same manner as the interlayer connection conductors 31 and 32, and the details will be omitted.

  When the lamination process under heating and pressurization is performed in the arrangement as shown in FIG. 7, the prepreg layers 14A and 18A are deformed by obtaining fluidity by heat, so that no voids are generated around the parts 42, 43, and 49 ( That is, it is thermally cured while closely contacting these components 42, 43, 49 (so as to enter the openings of the insulating layers 16-17). As a result, as shown in FIG. 6, stacked insulating layers 14, 15, 16, 17, and 18 that function as spacers are formed. The laminated insulating layers 14 to 18 simultaneously support the conductive patterns 24 to 27 and the interlayer connection conductors 33 to 37 for fixing the potential of the metal shield layer member 61.

  After the laminating step shown in FIG. 7, the metal foil 21A and the copper foil 61A are patterned in a predetermined manner, and the solder resists 71 and 72 are further formed, whereby the electronic module as shown in FIG. 6 is obtained.

  In this embodiment, the following effects are obtained by the structure of the insulating layers 14 to 18 (second insulating plate member). That is, it is easy to match the thickness of the entire second insulating plate member to the size in the height direction of the electronic component 49 and the like by arbitrarily changing the thickness of the insulating layers 15 to 17 (second sub-plate member). It is. Therefore, the thickness of the electronic component 49 or the like can be easily accommodated, and the thickness setting of the electronic module can be easily controlled.

  11, 12, 14, 15, 16, 17, 18 ... insulating layer, 13 ... insulating layer with reinforcing material, 13a ... reinforcing material, 13o1, 13o2 ... opening for parts, 13r ... insulating layer (without reinforcing material), 13rA ... Prepreg layer (without reinforcing material), 14A ... Prepreg layer, 18A ... Prepreg layer, 21, 24, 25, 26, 27 ... Conductive pattern, 21a ... External connection terminal, 21A ... Metal foil (copper foil), 22, 23 ... Wiring pattern, 31, 32, 33, 34, 35, 36, 37 ... Interlayer connection conductor (derived from bumps formed by screen printing of conductive composition), 31A, 32A ... Interlayer connection conductor (conductive , 41, 42, 43... Surface mounted passive element parts, 49... Semiconductor element parts (electronic parts; attached to surface mounting terminals), 51, 52, 53, 54. Connection (Solder-containing solder), 61 ... Metal shield layer member (copper), 61A ... Copper foil (or copper plate), 71, 72 ... Solder resist (protective film), 131A, 132A, 133A, 134A ... Prepreg with reinforcing material layer.

Claims (8)

A first insulating plate member having a first surface and a second surface opposite to the first surface;
A conductive pattern provided on the first surface of the first insulating plate member;
A wiring pattern provided on the second surface of the first insulating plate member;
An interlayer connection conductor formed in the thickness direction of the first insulating plate member, which electrically connects the conductive pattern and the wiring pattern;
An electronic component mounted on the second surface of the first insulating plate member via the wiring pattern;
A second insulating plate member positioned in a stacked manner on the second surface of the first insulating plate member so as to embed the electronic component;
A metal shield layer member provided on the side of the second insulating plate member opposite to the side on which the first insulating plate member is located;
A protective film formed so as to cover the side of the second insulating plate member including the metal shield layer member on the side opposite to the side on which the first insulating plate member is located. ,
The protective film includes the metal shield layer member so as not to provide a component mounting land region on the side of the second insulating plate member opposite to the side where the first insulating plate member is located. The electronic module is characterized in that it covers the side of the second insulating plate member opposite to the side on which the first insulating plate member is located.   2. The electronic module according to claim 1, further comprising a second wiring pattern provided in a layer form in the middle of the thickness direction of the first insulating plate member.   The second wiring pattern in which the interlayer connection conductor is between or adjacent to the surface of the conductive pattern and the surface of the second wiring pattern adjacent to the conductive pattern in the second wiring pattern. Or between the surfaces of the wiring patterns or between the surface of the wiring pattern and the surface of the second wiring pattern adjacent to the wiring pattern of the second wiring patterns. The electronic module according to claim 2, wherein the electronic module is a conductor.   2. The electronic module according to claim 1, wherein the electronic component is mounted on the second surface of the first insulating plate member using solder containing tin via the wiring pattern.   The electronic module according to claim 1, wherein the conductive pattern has an external connection terminal region.   2. The electronic module according to claim 1, wherein the second insulating plate member contains a reinforcing material in a region avoiding the region of the electronic component. The second insulating plate member is a plate member having first, second, and third three layers from the side of the first insulating plate member, and a first member closest to the first insulating plate member. The third sub-plate member farthest from the sub-plate member and the first insulating plate member does not have an opening that avoids the area of the electronic component, while the first sub-plate member and the third sub-plate member The second sub plate member positioned between the sub plate members is formed with an opening so as to be separated from the electronic component,
The first sub-plate member or the third sub-plate member is deformed and is in close contact with the electronic component so that no gap is generated around the electronic component. Electronic module. A second conductive pattern provided in one or more layers in the middle of the thickness direction of the second insulating plate member avoiding the area of the electronic component;
A second interlayer connection conductor formed in the thickness direction of the second insulating plate member, which electrically connects the wiring pattern and the metal shield layer member via the second conductive pattern. The electronic module according to claim 1.

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