JP2013210327A - Contact internal thermometer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To set the amplitude of the heat flux passing through a plurality of sets of a first temperature sensor and a second temperature sensor disposed sandwiching a heat insulating material to be different easily in a contact internal thermometer.SOLUTION: A contact internal thermometer 100 comprises: a measuring surface 20 for contacting with a surface to be measured of a measuring object to calculate an internal temperature of the measuring object; a temperature sensor laminate 31 in which a measuring surface side temperature sensor is disposed on the measurement surface side of a heat resistor and a rear surface side temperature sensor is disposed on the rear surface side; and a controller for calculating the internal temperature of the measuring object based on the measurement results of the measuring surface side temperature sensor and the rear surface side temperature sensor, wherein a shape of at least one surface of the surfaces exposed to the outside air of the rear surface side temperature sensor is a heat dissipation structure having ruggedness.

Description

  The present invention relates to a contact-type internal thermometer.

  In various situations, there is a demand for measuring the internal temperature, not the surface temperature of an object to be measured, quickly, accurately, and simply (that is, non-invasively). A typical example of such a requirement is measurement of body temperature of a living body including a human body. However, it is usually difficult to measure the internal temperature of the living body (sometimes referred to as deep body temperature), that is, the temperature inside the living body that is considered to be maintained at a constant temperature by the blood flow. When the measurement target is a human body, generally hold the thermometer in a place where heat is difficult to escape to the outside, such as under the tongue or under the arm, and read the thermometer after the thermometer and human body are in thermal equilibrium. However, it takes a long time of about 5 to 10 minutes until the thermal equilibrium state is obtained, and the obtained body temperature does not always match the internal temperature. For this reason, this method may be difficult to apply to subjects that are difficult to measure body temperature for a long time, such as infants and certain injuries and patients, and a highly accurate body temperature is required to perform precise body temperature management. Hard to get.

  Therefore, as a thermometer for measuring the internal temperature of the human body quickly and accurately, a first temperature sensor that is in contact with the body surface and a second temperature that is disposed with a heat insulating material interposed between the first temperature sensor and the first temperature sensor. There has been proposed a method for obtaining an internal temperature from a temperature measurement result of each temperature sensor using a set of sensors.

  For example, Patent Document 1 describes a high-speed accurate temperature measurement device that predicts the internal temperature of an object to be measured by mathematically solving a heat transfer equation in an unsteady state using a set of sensors. ing.

  Further, in Patent Document 2, two sets of sensors are used, a heat insulating material is further disposed between the second temperature sensor (intermediate sensor) and the outside air, and the value of the heat flux passing through each set of sensors. A thermometer is disclosed which is different. In the thermometer described in this document, the internal temperature of the measurement object is calculated from the output of each sensor in a steady state.

Japanese Patent No. 3863192 Japanese Patent No. 4600170

  In the method of predicting the internal temperature in a non-steady state using a set of sensors as in the above-mentioned Patent Document 1, in order to increase the accuracy of the predicted internal temperature, the first temperature sensor and the first temperature sensor The difference in temperature detected by the two temperature sensors must be increased. However, in order to increase the temperature difference between the first temperature sensor and the second temperature sensor, if the heat insulation performance of the heat insulating material is given, the temperature change of the second temperature sensor is small, and the measurement accuracy is improved as expected. Or it takes time to measure.

  Moreover, in the method of calculating the internal temperature in a steady state as in Patent Document 2, in order to increase the accuracy of the calculated internal temperature, the size of the heat flux passing through the two sets of sensors is changed as much as possible. Must do so. As a device for that purpose, the thermal resistance value of the heat insulating material sandwiched between the first temperature sensor and the second temperature sensor is different depending on the pair, or the second temperature sensor and the outside air as in Patent Document 2 described above. It is conceivable to provide a heat insulating material or the like having a different material between them, but any of these devices causes an increase in manufacturing effort and cost.

  This invention is made | formed in view of this situation, The subject which it is going to solve is a contact-type internal thermometer, between the 1st temperature sensor arrange | positioned on both sides of a heat insulating material, and a 2nd temperature sensor. The temperature difference is simply increased or the size of the heat flux is simply changed.

  In addition, although the description so far mainly demonstrated the thermometer which measures the internal temperature of a human body as a typical example of a contact-type internal thermometer, the contact-type internal thermometer which this invention makes object is limited to this. It can be applied to any measurement object that needs to measure its internal temperature non-invasively regardless of whether it is living or inanimate.

  The invention disclosed in the present application in order to solve the above problems has various aspects, and the outline of typical aspects of the aspects is as follows.

  (1) In order to calculate the internal temperature of the measurement object, a measurement surface that is brought into contact with the surface to be measured of the measurement object, a measurement surface side temperature sensor is disposed on the measurement surface side of the thermal resistor, A temperature sensor stack in which a temperature sensor is disposed, and a controller that calculates an internal temperature of the measurement object based on measurement results of the measurement surface side temperature sensor and the back surface temperature sensor, and the back surface side A contact-type internal thermometer having a heat dissipation structure in which at least one of the surfaces exposed to the outside of the temperature sensor has irregularities.

  (2) In (1), the controller is based on a time change of temperature measurement values of the measurement surface side temperature sensor and the back surface temperature sensor when the temperature sensor laminate is thermally unsteady. A contact-type internal thermometer for calculating the internal temperature.

  (3) In (1), a second temperature at which a second measurement surface side temperature sensor is further disposed on the measurement surface side of the second thermal resistor and a second back surface temperature sensor is disposed on the back surface side. The controller includes a sensor stack, and the controller includes the measurement surface side temperature sensor, the back surface temperature sensor, the first temperature sensor when the temperature sensor stack and the second temperature sensor stack are in a thermally steady state. A contact-type internal thermometer that calculates the internal temperature based on temperature measurement values of two measurement surface side temperature sensors and the second back surface temperature sensor.

  (4) The contact type internal thermometer according to any one of (1) to (3), having a cooling mechanism for cooling at least the temperature sensor stack after the internal temperature is calculated by the controller.

  (5) A temperature sensor manufacturing method for manufacturing a back surface temperature sensor used in the contact-type internal thermometer according to any one of (1) to (4), comprising a step of preparing a plurality of green sheets A step of obtaining a laminate by laminating the green sheets, a step of providing the heat dissipation structure on the surface of the laminate, a step of obtaining an individual temperature sensor body by cutting the laminate, and the temperature sensor body. And a step of firing and providing a terminal electrode.

  (6) A temperature sensor manufacturing method for manufacturing a back surface temperature sensor used in the contact-type internal thermometer according to any one of (1) to (4), comprising a step of preparing a plurality of green sheets A step of providing openings in at least one of the green sheets, a step of stacking the green sheets to obtain a laminate, a step of cutting the laminate to obtain individual temperature sensor bodies, and the temperature sensor body And a step of providing a terminal electrode by baking the temperature sensor.

  According to the above aspect (1), in the contact-type internal thermometer, the temperature difference between the first temperature sensor and the second temperature sensor arranged with the heat insulating material interposed therebetween is simply increased, or the heat flux is increased. The thickness can be easily changed.

  According to the above aspect (2), in the contact-type internal thermometer that calculates the internal temperature in the unsteady state, the temperature difference between the first temperature sensor and the second temperature sensor is simply increased and the calculated internal temperature is calculated. The accuracy of temperature can be increased.

  According to the aspect of (3) above, in the contact-type internal thermometer that calculates the internal temperature in an unsteady state, the magnitude of the heat flow rate that passes through the temperature sensor stack and the heat flow rate that passes through the second temperature sensor stack are The size can be easily changed, and the accuracy of the calculated internal temperature can be increased.

  According to the above aspect (4), it is possible to accurately measure the internal temperature of the measurement object even when performing continuous measurement.

  According to the side surfaces of the above (5) and (6), it is possible to manufacture a temperature sensor in which the shape of at least one of the surfaces exposed to the outside air is a heat dissipation structure having irregularities.

It is the external view which looked at the contact-type internal thermometer which concerns on the 1st Embodiment of this invention from the back side. It is the external view which looked at the contact-type internal thermometer which concerns on the 1st Embodiment of this invention from the measurement surface side. It is a schematic sectional drawing of the contact-type internal thermometer by the III-III line of FIG. FIG. 4 is an enlarged cross-sectional view in the vicinity of the measurement head in FIG. 3. This is an example in which the heat dissipation structure is a plate-type fin. This is an example in which the heat dissipation structure is a partial plate-type fin. This is an example in which the heat dissipation structure is a pin-type fin. This is an example in which the heat dissipation structure is a lattice fin. It is a flowchart which shows the measurement algorithm of the internal temperature by the contact-type internal thermometer which concerns on the 1st Embodiment of this invention. It is the external view which looked at the contact-type internal thermometer which concerns on the 2nd Embodiment of this invention from the measurement surface side. It is an expanded sectional view of the vicinity of the measurement head of the contact-type internal thermometer according to the second embodiment of the present invention. It is a figure which shows the equivalent thermal circuit of the measurement part provided in the measurement head of the contact-type internal thermometer which concerns on the 2nd Embodiment of this invention. It is a figure which shows the manufacturing method of the back side temperature sensor which has the plate type fin shown in FIG. 5A as a thermal radiation structure. It is a figure which shows the manufacturing method of the back side temperature sensor which has the plate type fin shown in FIG. 5A as a thermal radiation structure. It is a figure which shows the manufacturing method of the back side temperature sensor which has the plate type fin shown in FIG. 5A as a thermal radiation structure. It is a figure which shows the manufacturing method of the back side temperature sensor which has the plate type fin shown in FIG. 5A as a thermal radiation structure. It is a figure which shows the manufacturing method of the back side temperature sensor which has the partial plate type fin shown in FIG. 5B as a thermal radiation structure. It is a figure which shows the manufacturing method of the back side temperature sensor which has the partial plate type fin shown in FIG. 5B as a thermal radiation structure. It is a figure which shows the manufacturing method of the back side temperature sensor which has the partial plate type fin shown in FIG. 5B as a thermal radiation structure. It is a figure which shows the manufacturing method of the back side temperature sensor which has the partial plate type fin shown in FIG. 5B as a thermal radiation structure.

  Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is an external view of a contact type internal thermometer 100 according to an embodiment of the present invention as viewed from the back side, and FIG. 2 is an external view of the contact type internal thermometer 100 according to the embodiment as viewed from a measurement surface side. is there. In the present specification, the contact-type internal thermometer is a thermometer, and means a thermometer that measures the internal temperature by bringing it into contact with the surface to be measured. In addition, the internal temperature means not the surface temperature of the measurement target but the temperature inside the region that is considered to be a substantially constant temperature heat source. Here, it is considered that the heat source is substantially constant temperature when the heat capacity inside the measurement target is large, or when heat is constantly supplied to the measurement target, the measurement with the contact-type internal thermometer is practically applied to that temperature. It means that it is considered that there is no influence. For example, when the measurement target is a living body, heat is always supplied from the trunk by the blood flow, which corresponds to the latter.

  A contact-type internal thermometer 100 shown in the present embodiment is portable as shown in the figure, and a measurement head 2 is attached to the tip of a case 1. The measuring head 2 is provided so as to protrude from the case 1, and the tip thereof is a substantially flat measuring surface 20. And the internal temperature is measured by making this measurement surface 20 contact the to-be-measured surface of a measuring object, for example, skin. On the surface of the measurement surface 20, a substantially circular probe 30 is disposed at the center. The arrangement of the probe 30 is arbitrary, and it is not always necessary to arrange the probe 30 at the center of the measurement surface 20.

  A lamp 11, a display unit 12, and a buzzer 13 are provided on the back surface 10 that is the surface opposite to the measurement surface 20 of the case 1. Hereinafter, in this specification, the direction in which the measurement surface 20 faces is referred to as the measurement surface side, and the direction in which the back surface, which is the opposite direction, faces, is referred to as the back surface side. Further, the case 1 has a long and rounded shape, and forms a grip 14 that the user has in his hand. As shown in FIG. 2, a battery lid 15 is provided on the measurement surface side of the grip 14 of the case 1, and a battery serving as a power source for the contact type internal thermometer 100 is accommodated therein. In addition, an intake hole 16 is provided at an appropriate position of the case 1, here the position shown in FIG. 2, and an exhaust hole 21 is provided on the side surface of the measurement head 2, so that each internal space communicates with the outside air. . Case 1 and measuring head 2 are connected by a support ring 5.

  In addition, the design of the contact-type internal thermometer 100 shown in FIGS. 1 and 2 is an example. Such a design may be appropriately changed in consideration of its main use and marketability. Further, the arrangement of each component may be arbitrarily selected within a range that does not impair its function.

  FIG. 3 is a schematic cross-sectional view of the contact-type internal thermometer 100 taken along line III-III in FIG. The case 1 is preferably a hollow molded product made of any synthetic resin such as ABS resin, and various parts constituting the contact-type internal thermometer 100 are integrally accommodated therein. A battery 6 and a circuit board 17 are accommodated in the grip 14. Various electronic components such as a controller (not shown) are mounted on the circuit board 17 and receive power from the battery 6 to supply power to all components that require power. In addition, the operation is controlled. The battery 6 shown in the figure is a commercially available AAA type (referred to as AAA in the United States) dry battery, but the type thereof may be arbitrary, such as a button type or a square type, or a primary type. The battery and secondary battery may be optional. Note that wiring for electrically connecting each component and the circuit board 17 is omitted because it is complicated to illustrate.

  The lamp 11 is preferably a light emitting diode capable of emitting multiple colors, and is lit to notify the user of the state of the contact-type internal thermometer 100. The display unit 12 is a liquid crystal display device in the present embodiment, and is used to notify the user of the measurement result of the contact-type internal thermometer 100 in a manner as shown in FIG. Of course, any other information such as the remaining amount of the battery 6 may be displayed on the display unit 12. Alternatively, the state of the contact type internal thermometer 100 may be displayed together and the lamp 11 may be omitted. The buzzer 13 is a general electronic buzzer in this embodiment, and is for notifying the user of the state of the contact-type internal thermometer 100 by a beep sound. The form of the buzzer 13 is also arbitrary, and a speaker may be provided to notify by voice or melody. Alternatively, the buzzer 13 may be omitted only for notification by the lamp 11 and / or the display unit 12.

  A partition wall 18 is provided inside the case 1 and partitions the inside of the case 1 into a grip space 19a and a head space 19b. The partition wall 18 is provided with an opening, and the blower 7 is attached so as to close the opening. The function of the blower 7 will be described later.

  A measuring head 2 is attached to the tip of the case 1 via a support ring 5. The support ring 5 is preferably made of a material having elasticity such as silicon rubber or its foam and having excellent heat insulation properties, and allows slight movement of the measuring head 2 with respect to the case 1, and from the measuring head 2 to the case. The heat transfer to 1 is cut off. This is because when the measurement surface 20 is brought into contact with the measurement object, the measurement surface 20 is surely brought into close contact with the measurement object, and the measurement error is caused by heat flowing from the measurement head 2 to the case 1. This is to prevent the occurrence of the above. However, the support ring 5 is not an essential configuration, there is no problem in the close contact between the measurement surface 20 and the measurement object, and the measurement head 2 is a material having a sufficiently low thermal conductivity, and there is no practical problem. This may be omitted, and the measurement head 2 may be directly fixed to the case 1 or both may be integrally formed. Further, the shape of the support ring 5 is not limited to a ring shape, and an arbitrary shape may be used.

  The measurement head 2 is preferably formed of a material having a stable shape, low thermal conductivity, and low specific heat. For example, rigid foam urethane or rigid foam vinyl chloride is preferably used. However, the material is not particularly limited in this respect as long as there is no practical problem, and any material may be used.

  An opening is provided in the measurement surface 20 of the measurement head 2 at a position corresponding to the probe 30, and the probe 30 is attached so as to slightly protrude from the measurement surface 20. The probe 30 is preferably made of a material having high thermal conductivity, and is made of metal in this embodiment. In addition, it is preferable that the material of the probe 30 has corrosion resistance, and aluminum and stainless steel are suitable for the metal material. As described above, the measuring head 2 itself is made of a material having low thermal conductivity.

  A temperature sensor stack 31 is provided on the back side of the probe 30 and both are thermally coupled to each other. Details of the temperature sensor laminate 31 will be described later.

  FIG. 4 is an enlarged cross-sectional view of the vicinity of the measuring head 2 in FIG. Here, illustration of members located on the back side of the support ring 5 in FIG. 3 is omitted.

  As shown in detail in the figure, the temperature sensor laminate 31 is disposed on the measurement surface 20 side, and contacts the probe 30 and thermally couples with the measurement surface side temperature sensor 31a, and the back surface disposed on the back surface side. A side temperature sensor 31b and a thermal resistor 31c, which is a flexible printed circuit board that is disposed between the side temperature sensor 31b and the measurement surface side temperature sensor 31a and the rear surface temperature sensor 31b, are stacked. Here, the thermal resistor 31c functions as a thermal resistor that forms a heat flow path from the measurement surface side temperature sensor 31a to the back surface temperature sensor 31b. The thermal resistor 31c does not necessarily have to be a flexible printed board, and an appropriate heat insulating material made of another material may be used, but a flexible printed board on which the measurement surface side temperature sensor 31a and the back surface temperature sensor 31b are mounted. The thermal resistor 31c is preferable because the structure is simple.

  Therefore, when the measurement surface 20 is brought into contact with the measurement object, heat is transmitted from the measurement object to the probe 30, and the heat is measured on the measurement surface side temperature sensor 31 a, the thermal resistor 13 c, and the back surface temperature sensor of the temperature sensor laminate 31. It will pass through 31b in order and will be diffused to the atmosphere.

  Any temperature sensor may be used, but in the present embodiment, it is a thermistor. Each temperature sensor is connected to the circuit board 17 (see FIG. 3) by a wiring (not shown) so that the temperature in each temperature sensor can be detected.

  Here, at least one surface of the back surface side temperature sensor 31b exposed to the outside air, here, the shape of the back surface is the heat dissipation structure 31d having unevenness. Here, the heat dissipation structure refers to a structure in which the surface area is larger than that of a plane having the same occupation area due to the unevenness. The important point is that the heat radiating structure 31d is formed by the shape of the back surface temperature sensor 31b itself, and no additional components such as a so-called heat sink are added. The heat dissipation structure 31d increases the amount of heat dissipated from the exhaust heat side temperature sensor 31b to the outside air, and the size of the heat flux passing through the temperature sensor stack 31 is changed to a temperature sensor that does not have a heat dissipation structure. It increases compared with the case where it is used as 31b. As a result, the temperature difference between the measurement surface side temperature sensor 31a and the back surface temperature sensor 31b can be easily increased.

  The shape of the heat dissipation structure 31d is not particularly limited, and may be various. 5A to 5D are perspective views illustrating various shapes of the back surface side temperature sensor 31b.

  FIG. 5A is an example in which the heat dissipation structure 31d is a plate-type fin. In the figure, reference numeral 32 denotes a semiconductor ceramic layer forming the main body of the back side temperature sensor 31b which is a thermistor, and reference numeral 33 denotes a terminal electrode. The surface of the semiconductor ceramic layer 32 may be covered with an appropriate protective layer. 5B shows an example in which the heat dissipation structure 31d is a partial plate type fin, FIG. 5C shows an example in which the heat dissipation structure 31d is a pin type fin, and FIG. 5D shows an example in which the heat dissipation structure 31d is a lattice type fin. Of course, the heat dissipation structure 31d may have a shape other than that shown here. The surface on which the heat dissipation structure 31d is provided is not limited to the surface on the back surface side of the back surface temperature sensor 31b, and may be another surface. Further, the overall shape of the back surface side temperature sensor 31b is not limited to the rectangular parallelepiped shape.

  Here, the measurement principle of the internal temperature by the contact-type internal thermometer 100 of this embodiment will be described.

As described in the above-mentioned Patent Document 1, the internal temperature to be measured is T _b , the temperature at the measurement surface side temperature sensor 31 a is T ₁ , the temperature at the back surface temperature sensor 31 b is T ₂ , and the thermal resistor 31 c. When the temperature at the internal time t is T (t), the following equation is approximately established.

ここで、未知数はＴ_ｂ、ω_１及びω_２の３つであるが、数１の左辺が時間差における温度であることから異なる時刻ｔにおいて少なくとも４回温度測定を行うことにより、これら未知数の値を決定することができ、Ｔ_ｂの値を求めることができる。

Here, there are three unknowns, T _b , ω _1, and ω _{2. Since} the left side of Equation 1 is the temperature in the time difference, the values of these unknowns are obtained by performing temperature measurement at least four times at different times t. can be determined, it is possible to determine the value of T _b.

Since the security of measurement accuracy, once sought after T _b, further obtains a new T _b to continue the measurement, if the difference between them is below a predetermined threshold, i.e., T _b of calculation result converged the finally obtained value may be adopted as a T _b when.

FIG. 6 is a flowchart illustrating an internal temperature measurement algorithm by the contact-type internal thermometer 100 of the present embodiment. The control shown in the figure is performed by a controller mounted on the circuit board 17 of the contact-type internal thermometer 100. The controller is a suitable processing device such as a microcontroller, for calculating the internal temperature T _b of the measurement object based on the measurement result of the measurement surface side temperature sensor 31a and the rear-side temperature sensor 31b.

First, when measurement is started, the controller substitutes 1 for a variable n in step S1, and measures T _1n and T _2n at time t _n , respectively. Here, the subscript n of time t indicates that the time has elapsed as the value increases. Further, the subscript n, labeled for temperature T, indicating that one whose temperature T is obtained at time t _n.

In subsequent step S2, n is incremented by one. As a result, the time advances from t ₁ to t ₂ . In step S3, T _1n and T _2n are measured again. At this time, T ₁ and T ₂ obtained in the previous step S1 are T _1n-1 and T _2n-1 , respectively.

In the subsequent step S4, it is determined by the value of n whether the temperature measurement has been performed a predetermined number of times, that is, four times or more. If the number of temperature measurement has not reached the 4 times, can not be determined from the number 1 T _b, it returns to step S2. When the temperature measurement has been performed more than the predetermined number of times, the process proceeds to step S5, and T _bn is obtained from _{equation (} 1).

In the subsequent step S6, it is determined based on the value of n whether T _bn is obtained twice or more. This is because it is necessary to obtain T _bn at least twice in order to determine whether or not T _bn has converged in the next step S7. If T _bn is not obtained twice or more, the process returns to step S2.

In step S7, it is determined whether the absolute value of T _bn −T _bn−1 is equal to or less than a predetermined threshold value. This determination is to examine the magnitude of the change in T _bn when the time changes from t _n-1 to t _n . If the magnitude of this change is equal to or less than a predetermined value, T _bn has converged. It is considered that the correct _Tb was obtained. T _bn returns to step S2 if it has _converged, the _{T bn} adopted as _{T b} at step S8 if the _{T bn} converges, the measurement is completed.

As described above, the controller in the present embodiment is based on the time change of the temperature measurement values of the measurement surface side temperature sensor 31a and the back surface temperature sensor 31b when the temperature sensor stacked body 31 is in a thermally unsteady state. The internal temperature _Tb is calculated.

  Next, a procedure for measuring the internal temperature using the contact-type internal thermometer 100 according to the present embodiment, that is, a procedure for the temperature measurement operation will be described with reference to FIGS.

  Procedure 1: The measurement surface 20 of the contact-type internal thermometer 100 is brought into contact with the measurement object.

  Procedure 2: A temperature measurement operation is started by the controller mounted on the circuit board 17. The temperature measurement operation may be automatically started by detecting an increase in temperature measured by the measurement surface side temperature sensor 31a, or a user operates a switch such as a push button (not shown). It may be done by. At this time, the controller notifies the user that the measurement is started by a beep sound by the buzzer 13. At the same time, the lamp 11 is lit in an arbitrary color, for example, red, and prompts the user to keep the measurement surface 20 in contact with the measurement object.

  Procedure 3: The controller calculates the internal temperature of the measurement object according to the algorithm shown in FIG. 6, and displays it on the display unit 12 as shown in FIG. Further, the user is notified that the measurement is completed by generating a beep sound by the buzzer 13 and lighting the lamp 11 in an arbitrary color different from the previous color, for example, green. In the present embodiment, the calculated internal temperature is displayed on the display unit 12 to notify the user, but the present invention is not limited to this, and the calculated internal temperature is stored in a memory provided in the contact-type internal thermometer 100. Alternatively, it may be output to a device external to the contact-type internal thermometer 100 by wire or wirelessly. In this case, the display unit 12 is not necessarily an essential configuration.

  In the above description, various notifications of measurement start and measurement end to the user are all performed by a beep sound by the buzzer 13 and lighting of the lamp 11, but these notification methods are limited to those exemplified here. Not. In particular, the beep sound may be omitted, or may not be uttered according to user settings. It is preferable to perform various notifications to the user only by lighting the lamp 11 without using sound, for example, when the measurement target is a sleeping baby, measurement is possible without disturbing the infant's sleep, etc. There is a case. Of course, how the lamp 11 is turned on, for example, how to select the emission color is arbitrary. In addition, various notifications are made to the user by flashing the lamp 11, changing the intensity of the emitted light, or providing a plurality of lamps 11 and changing the number and positions of the lamps 11 regardless of the colored light. It may be. Further, as described above, various notifications may be given to the user by the display unit 12 instead of the lamp 11.

  Procedure 4: The controller operates the blower 7 to cool the measurement unit. This operation cools the temperature sensor laminate 31 and prepares for the next measurement. In this embodiment, since temperature measurement in an unsteady state is necessary, when the internal temperature of some measurement object is once measured and the internal temperature of another measurement object is measured immediately thereafter, the first measurement is considered. Since the temperature sensor laminated body 31 is heated at the time of measurement, the temperature sensor laminated body 31 may quickly reach a steady state when measuring the internal temperature of another measurement target, and measurement may not be performed. . In such a case, in order to perform the measurement again, it is necessary to wait for the natural cooling due to the heat radiation of the temperature sensor laminated body 31, and it takes a considerable time until the measurement can be continuously performed. It will be. Therefore, the temperature sensor laminate 31 is forcibly cooled at each measurement, thereby enabling the subsequent measurement in a short time.

  In the present embodiment, the blower 7 generates an airflow that flows from the grip space 19a of FIG. 1 to the head space 19b. Therefore, the air flow induced by the blower 7 is sucked from the intake hole 16 as shown by an arrow in the figure, passes through the blower 7, passes through the vicinity of the temperature sensor stack 31, and is discharged from the exhaust hole 21. Will be. Therefore, the blower 7, the intake hole 16 and the exhaust hole 21 of the present embodiment cooperate to constitute a cooling mechanism for cooling the temperature sensor stacked body 31.

  The cooling mechanism may have any configuration, and the arrangement of the blower 7, the intake hole 16, and the exhaust hole 21 is arbitrary. Further, the direction of intake and exhaust may be reversed. The type of the blower 7 is not particularly limited, and may be a general fan or a micro blower using a piezoelectric element. Alternatively, if there is no practical problem in the measurement time for continuous measurement, the cooling mechanism itself may be omitted.

  Next, a second embodiment of the present invention will be described with reference to FIGS. The contact-type internal thermometer 200 according to the present embodiment is the same as the contact-type internal thermometer 100 according to the first embodiment described above, and uses a single temperature sensor stack to measure the internal temperature in an unsteady state. The difference is that the internal temperature in a steady state is measured using a plurality (two in this case) of temperature sensor laminates. On the other hand, since the contact-type internal thermometer 200 is substantially the same as the contact-type internal thermometer 100 with respect to portions other than this point, portions that are common to both are assigned the same reference numerals, and redundant descriptions are omitted. It shall be.

  FIG. 7 is an external view of the contact-type internal thermometer 200 according to the present embodiment as viewed from the measurement surface side. In the contact-type internal thermometer 200, a second probe 40 is provided on the measurement surface 20 in addition to the probe 30. The material of the second probe 40 is the same as that of the probe 30. Further, the arrangement of the probe 30 and the second probe 40 on the measurement surface 20 is arbitrary.

  FIG. 8 is an enlarged cross-sectional view of the vicinity of the measurement head of the contact-type internal thermometer 200 according to the present embodiment. The probe 30 and the temperature sensor laminated body 31 shown in the figure are the same as those in the first embodiment. In the contact-type internal thermometer 200, a second probe 40 and a second temperature sensor laminate 41 are provided on the back side thereof, and both are thermally coupled to each other. The second temperature sensor stacked body 41 is disposed on the measurement surface 20 side, contacts the second probe 40 and is thermally coupled, and the second measurement surface side temperature sensor 41a disposed on the back surface side. And a second thermal resistor 41c, which is a flexible printed circuit board mounted on both sides of the second measurement surface side temperature sensor 41a and the second back surface temperature sensor 41b. It has a laminated structure. The thermal resistor 31c is that the second thermal resistor 41c functions as a thermal resistor that forms a heat flow path, and that the material is not limited to the flexible printed circuit board, and an appropriate heat insulating material made of another material may be used. It is the same.

  And the 2nd back surface side temperature sensor 41b is not provided with the special heat dissipation structure. Therefore, the amount of heat dissipated from the second backside temperature sensor 41b is smaller than the amount of heat dissipated from the backside temperature sensor 31b, and the magnitude of the heat flow rate passing through the temperature sensor laminate 31 and the second temperature sensor laminate. The magnitude of the heat flow rate passing through the body 41 is simply different.

  The second back surface temperature sensor 41b may be provided with a heat dissipation structure. However, the heat flow rate passing through the temperature sensor stack 31 and the heat flow rate passing through the second temperature sensor stack 41 are set. Since it is necessary to make it different, its structure and heat dissipation performance must be different from that of the heat dissipation structure 31d of the back side temperature sensor 31b.

  Here, the measurement principle of the internal temperature by the contact-type internal thermometer 200 of the present embodiment will be described with reference to FIG.

FIG. 9 is a diagram illustrating an equivalent thermal circuit of a measurement unit provided in the measurement head 2 of the contact-type internal thermometer 200 according to the present embodiment. To explain with reference to FIG. 8 to FIG, _{T b} inside the measured object _{temperature, T 11} is the temperature at the measurement surface side temperature sensor _{31a, T 12} is the temperature at the back side temperature sensor _{31b, T 21} second temperature at the measurement surface side temperature sensor _41a, the _{T 22} is the temperature of the second rear-side temperature sensor 41b. The thermal resistance _Rb is a thermal resistance when heat is transmitted from the inside of the measurement object to the measurement surface side temperature sensor 31a and the second measurement surface side temperature sensor 41a through the probe 30 and the second probe 40, and the thermal resistance R Is the thermal resistance of the thermal resistor 31c and the second thermal resistor 41c. _{Then, T b> T 11> T} 12 _{and, T b> T 21> T} 22 is satisfied.

Here, when the system shown in FIG. Assuming a steady state, the heat flux flowing into the T ₁₂ than T _b is it is constant, the following equation is established.

又同様に、Ｔ_ｂよりＴ_２２へと流れる熱流束を考えると、

Similarly, given the heat flux flowing into _{T 22} than _{T b,}

が成立する。この数２及び数３より、内部温度Ｔ_ｂは、

Is established. From Equation 2 and Equation 3, the internal temperature _Tb is

として求められる。

As required.

  And the procedure of the temperature measurement operation | movement using the contact type internal thermometer 200 which concerns on this embodiment is the procedure 3 in the temperature measurement operation | movement demonstrated in the previous contact type internal thermometer 100, and a controller is the temperature sensor laminated body 31. And the point which calculates and displays the internal temperature of a measuring object after the 2nd temperature sensor laminated body 41 reaches a steady state is different. That is, the controller monitors the outputs of the measurement surface side temperature sensor 31a, the back surface temperature sensor 31b, the second measurement surface side temperature sensor 41a, and the second back surface temperature sensor 41b. When it is detected that the temperature is equal to or less than a predetermined threshold value, the internal temperature is obtained from the above equation 4 using the output from these temperature sensors. Therefore, the controller measures the measurement surface side temperature sensor 31a, the back surface temperature sensor 31b, and the second measurement surface side temperature sensor when the temperature sensor stacked body 31 and the second temperature sensor stacked body 41 are in a thermally steady state. The internal temperature is calculated based on the temperature measurement values of 41a and the second back surface temperature sensor 41b.

  The same applies to the point that the blower 7 is operated and the measurement unit is cooled in the procedure 4. The meaning of cooling in this case will be described. For example, when the internal temperature of a relatively high temperature measurement object is first measured, and immediately after that, the internal temperature of the relatively low temperature measurement object is continuously measured, During the first measurement, the temperature sensor stacked body 31 and the second temperature sensor stacked body 41 may be at a higher temperature than required for the next measurement. At this time, in order for the temperature sensor laminated body 31 and the second temperature sensor laminated body 41 to be in a steady state, it is necessary to wait for natural cooling due to heat radiation of these members, and measurement may take time. Therefore, the first temperature sensor stacked body 33 and the second temperature sensor stacked body 34 are forcibly cooled to some extent for each measurement. The same applies to the point that the cooling mechanism may be omitted if there is no practical problem.

  Then, the manufacturing method of the back side temperature sensor 31b used in the above-mentioned 1st Embodiment and 2nd Embodiment is demonstrated.

  First, a manufacturing method of the back surface side temperature sensor 31b having the plate type fin shown in FIG. 5A as the heat dissipation structure 31d will be described with reference to FIGS. 10A to 10D.

  First, as a first step, a plurality of green sheets 50 are prepared (FIG. 10A). Here, the green sheet is obtained by forming a slurry obtained by mixing an induction binder, a plasticizer, a solvent, and the like into ceramic powder made of a material constituting the semiconductor ceramic layer 32 and drying it. The green sheet can be produced by a known method, for example, by applying the slurry thinly on a support such as a sheet material of PET (Polyethylene Terephthalate) resin by the doctor blade method, etc., and peeling it off from the support after drying. . In addition, internal electrodes to be disposed inside the semiconductor ceramic layer 32 are printed on the green sheet in an appropriate pattern by a method such as screen printing.

  Subsequently, as a second step, the green sheets 50 are stacked and pressure-bonded and pressed (FIG. 10B). Thereby, the laminated body 51 of the green sheet 50 is obtained.

  Furthermore, as a third step, a heat dissipation structure is provided on the surface of the stacked body 51 (FIG. 10C). In this example, the heat dissipation structure is created by forming grooves 52 at appropriate positions on the surface of the laminate 51 by cutting with a dicing saw. In addition, the processing method for providing the heat dissipation structure is not limited to cutting with a dicing saw, and for example, processing with a laser or the like may be used.

  As a fourth step, the laminated body 51 is cut to obtain a semiconductor ceramic layer 32 which is an individual temperature sensor body (FIG. 10D). This cutting may be performed by a dicing saw. In FIG. 10C and FIG. 10D, four semiconductor ceramic layers 32 are obtained from one laminated body 51. However, this is shown as an example for convenience of description, In the process, a larger number of semiconductor ceramic layers 32 may be obtained from one laminated body 51.

  As a fifth step, the obtained individual semiconductor ceramic layer 32 is fired, and then a terminal electrode 33 is provided (see FIG. 5A). At this time, an appropriate protective film may be provided on the exposed portion of the semiconductor ceramic layer 32.

  Next, a manufacturing method of the back surface temperature sensor 31b having the partial plate type fin shown in FIG. 5B as the heat dissipation structure 31d will be described with reference to FIGS. 11A to 11D.

  First, as a first step, a plurality of green sheets 50 are prepared (FIG. 11A). This step is the same as that shown in FIG. 10A.

  Subsequently, as a second step, an opening 53 is provided in at least one of the green sheets 50. Here, as shown in FIG. 11B, the opening 53 is provided at a position that is in the shape of a gap between plate-type fins that are partially formed in the future. In this example, openings 53 are provided in the upper three green sheets 50, and the other green sheets 50 are left in a planar shape without openings. The method for forming the opening 53 is not particularly limited, but press working such as punching or laser trimming may be used.

  Further, as a third step, the green sheets 50 are stacked and pressure-bonded to be pressed (FIG. 11C). Thereby, the laminated body 51 of the green sheet 50 is obtained. A concave portion 54 is formed on the surface of the laminated body 51 at a position that becomes a shape of a gap between plate-type fins that will be partially formed in the future.

  As a fourth step, the laminated body 51 is cut to obtain a semiconductor ceramic layer 32 which is an individual temperature sensor body (FIG. 11D). This cutting may be performed by a dicing saw. 11B to 11D also illustrate that four semiconductor ceramic layers 32 are obtained from one laminated body 51, but this is shown as an example for convenience of description, and is actually In this step, a larger number of semiconductor ceramic layers 32 may be obtained from one laminated body 51.

  As a fifth step, the obtained individual semiconductor ceramic layer 32 is fired, and then a terminal electrode 33 is provided (see FIG. 5B). At this time, an appropriate protective film may be provided on the exposed portion of the semiconductor ceramic layer 32.

  The back side temperature sensor 31b having the pin type fin shown in FIG. 5C as the heat dissipation structure 31d and the back side temperature sensor 31b having the grid type fin shown in FIG. 5D as the heat dissipation structure 31d can be manufactured by the same method. . In addition, the manufacturing method of the temperature sensor shown here is shown as an example of the manufacturing method of the temperature sensor which has the heat dissipation structure 31d which has an unevenness | corrugation, and you may use another method.

  The specific configurations shown in the embodiments described above are shown as examples, and the invention disclosed in this specification is not limited to the configurations of these specific examples. Those skilled in the art may appropriately modify various modifications to the disclosed embodiments, for example, the shape, number, arrangement, etc. of each member or part thereof, and the technical scope of the invention disclosed in this specification is It should be understood to include such modifications.

  1 Case, 2 Measuring Head, 5 Support Ring, 6 Battery, 7 Blower, 10 Back, 11 Lamp, 12 Display, 13 Buzzer, 14 Grip, 15 Battery Cover, 16 Air Intake Hole, 17 Circuit Board, 18 Bulkhead, 19a Grip Space, 19b head space, 20 measurement surface, 21 exhaust hole, 30 probe, 31 temperature sensor laminate, 31a measurement surface side temperature sensor, 31b back surface temperature sensor, 31c thermal resistor, 31d heat dissipation structure, 32 semiconductor ceramic layer, 33 Terminal electrode, 40 2nd probe, 41 2nd temperature sensor laminated body, 41a 2nd measurement surface side temperature sensor, 41b 2nd back surface side temperature sensor, 41c 2nd thermal resistance body, 50 green sheet, 51 laminated body, 52 groove, 53 opening, 54 recessed part, 100,200 contact type internal thermometer.

Claims (6)

A measurement surface that is brought into contact with the measurement target surface of the measurement object to calculate the internal temperature of the measurement object;
A temperature sensor laminate in which a measurement surface side temperature sensor is disposed on the measurement surface side of the thermal resistor, and a back surface temperature sensor is disposed on the back surface;
A controller for calculating the internal temperature of the measurement object based on the measurement results of the measurement surface side temperature sensor and the back surface temperature sensor;
Have
The contact type internal thermometer whose at least one surface of the surface exposed to the outside air of the said back side temperature sensor is a heat dissipation structure which has an unevenness | corrugation.   The controller calculates the internal temperature based on a time change of temperature measurement values of the measurement surface side temperature sensor and the back surface temperature sensor when the temperature sensor stack is in a thermally unsteady state. The contact-type internal thermometer according to 1. Furthermore, it has a second temperature sensor laminate in which a second measurement surface side temperature sensor is disposed on the measurement surface side of the second thermal resistor, and a second back surface temperature sensor is disposed on the back surface side,
The controller includes the measurement surface side temperature sensor, the back surface temperature sensor, and the second measurement surface side temperature sensor when the temperature sensor stacked body and the second temperature sensor stacked body are in a thermally steady state. The contact-type internal thermometer according to claim 1, wherein the internal temperature is calculated based on a temperature measurement value of the second back side temperature sensor.   The contact-type internal thermometer according to claim 1, further comprising a cooling mechanism that cools at least the temperature sensor stack after the internal temperature is calculated by the controller. A manufacturing method of a temperature sensor for manufacturing a back side temperature sensor used in the contact-type internal thermometer according to any one of claims 1 to 4,
Preparing a plurality of green sheets;
Laminating the green sheets to obtain a laminate;
Providing the heat dissipation structure on the surface of the laminate;
Cutting the laminate to obtain individual temperature sensor bodies;
Firing the temperature sensor body and providing a terminal electrode;
The manufacturing method of the temperature sensor which has this. A manufacturing method of a temperature sensor for manufacturing a back side temperature sensor used in the contact-type internal thermometer according to any one of claims 1 to 4,
Preparing a plurality of green sheets;
Providing an opening in at least one of the green sheets;
Laminating the green sheets to obtain a laminate;
Cutting the laminate to obtain individual temperature sensor bodies;
Firing the temperature sensor body and providing a terminal electrode;
The manufacturing method of the temperature sensor which has this.

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