JP2013181044A - Polyarylene sulfide resin composition, and molding - Google Patents
Polyarylene sulfide resin composition, and molding Download PDFInfo
- Publication number
- JP2013181044A JP2013181044A JP2012043625A JP2012043625A JP2013181044A JP 2013181044 A JP2013181044 A JP 2013181044A JP 2012043625 A JP2012043625 A JP 2012043625A JP 2012043625 A JP2012043625 A JP 2012043625A JP 2013181044 A JP2013181044 A JP 2013181044A
- Authority
- JP
- Japan
- Prior art keywords
- polyarylene sulfide
- sulfide resin
- resin composition
- resin
- fibrous filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000412 polyarylene Polymers 0.000 title claims abstract description 71
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 title claims abstract description 67
- 239000011342 resin composition Substances 0.000 title claims abstract description 47
- 238000000465 moulding Methods 0.000 title claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 83
- 239000011347 resin Substances 0.000 claims abstract description 83
- 239000012765 fibrous filler Substances 0.000 claims abstract description 42
- 125000001309 chloro group Chemical group Cl* 0.000 claims abstract description 38
- 229910052801 chlorine Inorganic materials 0.000 claims abstract description 36
- 239000000155 melt Substances 0.000 claims abstract description 23
- 238000004898 kneading Methods 0.000 claims abstract description 9
- -1 mercapto compounds Chemical class 0.000 claims description 48
- 150000001875 compounds Chemical class 0.000 claims description 39
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 150000003839 salts Chemical class 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Chemical class 0.000 claims description 11
- 229910052977 alkali metal sulfide Inorganic materials 0.000 claims description 9
- 239000002798 polar solvent Substances 0.000 claims description 9
- 229920006127 amorphous resin Polymers 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 150000002989 phenols Chemical class 0.000 claims description 6
- 229920001955 polyphenylene ether Polymers 0.000 claims description 6
- 230000009477 glass transition Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000004695 Polyether sulfone Substances 0.000 claims description 3
- 239000004697 Polyetherimide Substances 0.000 claims description 3
- 150000002019 disulfides Chemical class 0.000 claims description 3
- 229920002492 poly(sulfone) Polymers 0.000 claims description 3
- 229920006393 polyether sulfone Polymers 0.000 claims description 3
- 229920001601 polyetherimide Polymers 0.000 claims description 3
- 239000004962 Polyamide-imide Substances 0.000 claims description 2
- 238000011049 filling Methods 0.000 claims description 2
- 229920002312 polyamide-imide Polymers 0.000 claims description 2
- 229920001230 polyarylate Polymers 0.000 claims description 2
- 229920005668 polycarbonate resin Polymers 0.000 claims description 2
- 239000004431 polycarbonate resin Substances 0.000 claims description 2
- 238000010008 shearing Methods 0.000 abstract description 3
- 239000000460 chlorine Substances 0.000 abstract description 2
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 abstract 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 26
- 238000000034 method Methods 0.000 description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 23
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 21
- 239000000047 product Substances 0.000 description 14
- 239000002904 solvent Substances 0.000 description 14
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 12
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 10
- 239000002994 raw material Substances 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 239000004734 Polyphenylene sulfide Substances 0.000 description 8
- 239000000835 fiber Substances 0.000 description 8
- 229920000069 polyphenylene sulfide Polymers 0.000 description 8
- 238000005406 washing Methods 0.000 description 8
- PBKONEOXTCPAFI-UHFFFAOYSA-N 1,2,4-trichlorobenzene Chemical class ClC1=CC=C(Cl)C(Cl)=C1 PBKONEOXTCPAFI-UHFFFAOYSA-N 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 6
- 125000003700 epoxy group Chemical group 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000012066 reaction slurry Substances 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- 229910052979 sodium sulfide Inorganic materials 0.000 description 5
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000002216 antistatic agent Substances 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 230000001603 reducing effect Effects 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000005995 Aluminium silicate Substances 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 235000012211 aluminium silicate Nutrition 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 239000000446 fuel Substances 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 description 3
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- XKEFYDZQGKAQCN-UHFFFAOYSA-N 1,3,5-trichlorobenzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1 XKEFYDZQGKAQCN-UHFFFAOYSA-N 0.000 description 2
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- PMBXCGGQNSVESQ-UHFFFAOYSA-N 1-Hexanethiol Chemical compound CCCCCCS PMBXCGGQNSVESQ-UHFFFAOYSA-N 0.000 description 2
- ATCRIUVQKHMXSH-UHFFFAOYSA-N 2,4-dichlorobenzoic acid Chemical compound OC(=O)C1=CC=C(Cl)C=C1Cl ATCRIUVQKHMXSH-UHFFFAOYSA-N 0.000 description 2
- PMNLUUOXGOOLSP-UHFFFAOYSA-N 2-mercaptopropanoic acid Chemical compound CC(S)C(O)=O PMNLUUOXGOOLSP-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 229910000085 borane Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 150000003857 carboxamides Chemical class 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 229910052570 clay Inorganic materials 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 239000010459 dolomite Substances 0.000 description 2
- 229910000514 dolomite Inorganic materials 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000012760 heat stabilizer Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000004677 hydrates Chemical class 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910003002 lithium salt Inorganic materials 0.000 description 2
- 159000000002 lithium salts Chemical class 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 2
- 239000001095 magnesium carbonate Substances 0.000 description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- GLVAUDGFNGKCSF-UHFFFAOYSA-N mercaptopurine Chemical compound S=C1NC=NC2=C1NC=N2 GLVAUDGFNGKCSF-UHFFFAOYSA-N 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- IXQGCWUGDFDQMF-UHFFFAOYSA-N o-Hydroxyethylbenzene Natural products CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical class CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- 150000004760 silicates Chemical class 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- HYHCSLBZRBJJCH-UHFFFAOYSA-M sodium hydrosulfide Chemical compound [Na+].[SH-] HYHCSLBZRBJJCH-UHFFFAOYSA-M 0.000 description 2
- 159000000000 sodium salts Chemical class 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N trihydridoboron Substances B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 2
- 239000010456 wollastonite Substances 0.000 description 2
- 229910052882 wollastonite Inorganic materials 0.000 description 2
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 2
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 1
- GBDZXPJXOMHESU-UHFFFAOYSA-N 1,2,3,4-tetrachlorobenzene Chemical compound ClC1=CC=C(Cl)C(Cl)=C1Cl GBDZXPJXOMHESU-UHFFFAOYSA-N 0.000 description 1
- BSJWDQYZFBYNIM-UHFFFAOYSA-N 1,3,4,5-tetramethylpyrrolidin-2-one Chemical compound CC1C(C)N(C)C(=O)C1C BSJWDQYZFBYNIM-UHFFFAOYSA-N 0.000 description 1
- BIGYLAKFCGVRAN-UHFFFAOYSA-N 1,3,4-thiadiazolidine-2,5-dithione Chemical compound S=C1NNC(=S)S1 BIGYLAKFCGVRAN-UHFFFAOYSA-N 0.000 description 1
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- ZPQOPVIELGIULI-UHFFFAOYSA-N 1,3-dichlorobenzene Chemical compound ClC1=CC=CC(Cl)=C1 ZPQOPVIELGIULI-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- BCNBMSZKALBQEF-UHFFFAOYSA-N 1,3-dimethylpyrrolidin-2-one Chemical compound CC1CCN(C)C1=O BCNBMSZKALBQEF-UHFFFAOYSA-N 0.000 description 1
- WGJCBBASTRWVJL-UHFFFAOYSA-N 1,3-thiazolidine-2-thione Chemical compound SC1=NCCS1 WGJCBBASTRWVJL-UHFFFAOYSA-N 0.000 description 1
- RLTTZFDRZKJVKJ-UHFFFAOYSA-N 1,4,6-trichloronaphthalene Chemical compound ClC1=CC=C(Cl)C2=CC(Cl)=CC=C21 RLTTZFDRZKJVKJ-UHFFFAOYSA-N 0.000 description 1
- SWJPEBQEEAHIGZ-UHFFFAOYSA-N 1,4-dibromobenzene Chemical compound BrC1=CC=C(Br)C=C1 SWJPEBQEEAHIGZ-UHFFFAOYSA-N 0.000 description 1
- KFAKZJUYBOYVKA-UHFFFAOYSA-N 1,4-dichloro-2-methylbenzene Chemical compound CC1=CC(Cl)=CC=C1Cl KFAKZJUYBOYVKA-UHFFFAOYSA-N 0.000 description 1
- JDPKCYMVSKDOGS-UHFFFAOYSA-N 1,4-dichloronaphthalene Chemical compound C1=CC=C2C(Cl)=CC=C(Cl)C2=C1 JDPKCYMVSKDOGS-UHFFFAOYSA-N 0.000 description 1
- NCNWTBAWLAFYDR-UHFFFAOYSA-N 1,6-dimethylpiperidin-2-one Chemical compound CC1CCCC(=O)N1C NCNWTBAWLAFYDR-UHFFFAOYSA-N 0.000 description 1
- SZMLDVKZMIXAJF-UHFFFAOYSA-N 1-(2-methylpropyl)azepan-2-one Chemical compound CC(C)CN1CCCCCC1=O SZMLDVKZMIXAJF-UHFFFAOYSA-N 0.000 description 1
- IVUYGANTXQVDDG-UHFFFAOYSA-N 1-(2-methylpropyl)pyrrolidin-2-one Chemical compound CC(C)CN1CCCC1=O IVUYGANTXQVDDG-UHFFFAOYSA-N 0.000 description 1
- HQJQYILBCQPYBI-UHFFFAOYSA-N 1-bromo-4-(4-bromophenyl)benzene Chemical group C1=CC(Br)=CC=C1C1=CC=C(Br)C=C1 HQJQYILBCQPYBI-UHFFFAOYSA-N 0.000 description 1
- DGZQEAKNZXNTNL-UHFFFAOYSA-N 1-bromo-4-butan-2-ylbenzene Chemical class CCC(C)C1=CC=C(Br)C=C1 DGZQEAKNZXNTNL-UHFFFAOYSA-N 0.000 description 1
- VGZOTUWVGXUNRC-UHFFFAOYSA-N 1-butylazepan-2-one Chemical compound CCCCN1CCCCCC1=O VGZOTUWVGXUNRC-UHFFFAOYSA-N 0.000 description 1
- BNXZHVUCNYMNOS-UHFFFAOYSA-N 1-butylpyrrolidin-2-one Chemical compound CCCCN1CCCC1=O BNXZHVUCNYMNOS-UHFFFAOYSA-N 0.000 description 1
- KJGYFISADIZFEL-UHFFFAOYSA-N 1-chloro-4-(4-chlorophenyl)sulfinylbenzene Chemical compound C1=CC(Cl)=CC=C1S(=O)C1=CC=C(Cl)C=C1 KJGYFISADIZFEL-UHFFFAOYSA-N 0.000 description 1
- MXEOFTCIEDUHCX-UHFFFAOYSA-N 1-cyclohexylazepan-2-one Chemical compound O=C1CCCCCN1C1CCCCC1 MXEOFTCIEDUHCX-UHFFFAOYSA-N 0.000 description 1
- IVVVGBHWWAJRAY-UHFFFAOYSA-N 1-ethyl-3-methylpyrrolidin-2-one Chemical compound CCN1CCC(C)C1=O IVVVGBHWWAJRAY-UHFFFAOYSA-N 0.000 description 1
- GWCFTYITFDWLAY-UHFFFAOYSA-N 1-ethylazepan-2-one Chemical compound CCN1CCCCCC1=O GWCFTYITFDWLAY-UHFFFAOYSA-N 0.000 description 1
- VUQMOERHEHTWPE-UHFFFAOYSA-N 1-ethylpiperidin-2-one Chemical compound CCN1CCCCC1=O VUQMOERHEHTWPE-UHFFFAOYSA-N 0.000 description 1
- XOHZHMUQBFJTNH-UHFFFAOYSA-N 1-methyl-2h-tetrazole-5-thione Chemical compound CN1N=NN=C1S XOHZHMUQBFJTNH-UHFFFAOYSA-N 0.000 description 1
- GGYVTHJIUNGKFZ-UHFFFAOYSA-N 1-methylpiperidin-2-one Chemical compound CN1CCCCC1=O GGYVTHJIUNGKFZ-UHFFFAOYSA-N 0.000 description 1
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- DDBUVUBWJVIGFH-UHFFFAOYSA-N trichloro(3-isocyanatopropyl)silane Chemical compound Cl[Si](Cl)(Cl)CCCN=C=O DDBUVUBWJVIGFH-UHFFFAOYSA-N 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Abstract
Description
本発明は、塩素原子含有量が低減されたポリアリーレンサルファイド樹脂組成物およびその成形体に関する。 The present invention relates to a polyarylene sulfide resin composition having a reduced chlorine atom content and a molded article thereof.
ポリフェニレンサルファイド(以下PPSと略す)樹脂に代表されるポリアリーレンサルファイド(以下PASと略す)樹脂は、高い耐熱性、機械的物性、耐薬品性、寸法安定性、難燃性を有していることから、金属材料の代替材料として、自動車部品、電気電子部品、住宅設備部品を中心に幅広く用いられており、その使用量も拡大している。その中で、電気電子部品用途において環境保護の面から、ハロゲン規制の動きが急速に拡大し、PAS樹脂を含有する組成物(以下、PAS樹脂組成物と略す)中のハロゲン含有量が900ppm以下に規制される状況になっている。 Polyarylene sulfide (hereinafter abbreviated as PAS) resin represented by polyphenylene sulfide (hereinafter abbreviated as PPS) resin has high heat resistance, mechanical properties, chemical resistance, dimensional stability, and flame retardancy. Therefore, it is widely used as an alternative material for metal materials mainly in automobile parts, electrical and electronic parts, and housing equipment parts, and the amount of use is also increasing. Among them, from the viewpoint of environmental protection in the use of electrical and electronic parts, the movement of halogen regulation has expanded rapidly, and the halogen content in a composition containing PAS resin (hereinafter abbreviated as PAS resin composition) is 900 ppm or less. It is in a situation that is regulated by.
PAS樹脂は、p−ジクロロベンゼンとアルカリ金属硫化物あるいはアルカリ金属水硫化物を原料とした重合により得られるため、ポリマー末端にハロゲン原子の一つである塩素原子が必然的に残存する。上記のとおり、環境問題の観点から、塩素原子含有量がより少ないPAS樹脂が市場から求められているが、PAS樹脂の優れた特性を損なうことなく塩素原子含有量を低減し、かつ成形加工性に優れたPAS樹脂を提供することが求められていた。 Since the PAS resin is obtained by polymerization using p-dichlorobenzene and alkali metal sulfide or alkali metal hydrosulfide as raw materials, a chlorine atom, which is one of halogen atoms, inevitably remains at the polymer terminal. As mentioned above, from the viewpoint of environmental problems, PAS resins with a lower chlorine atom content are demanded from the market. However, the chlorine atom content is reduced without impairing the excellent properties of the PAS resin, and molding processability is reduced. It has been demanded to provide a PAS resin having excellent resistance.
そこで、低塩素原子含有量のPAS樹脂と、特定割合の非繊維状フィラーおよび繊維状フィラーとを組合せ、PAS樹脂に対するフィラー合計量を質量比で2〜3倍の範囲とすることで、塩素原子含有量が少なく、溶融流動性に優れ、かつ繰り返し成形時の寸法安定性に優れたPAS樹脂組成物およびその射出成形体が提案されている(特許文献1)。 Therefore, by combining a low chlorine atom content PAS resin with a specific proportion of non-fibrous fillers and fibrous fillers, the total amount of fillers relative to the PAS resin is in the range of 2 to 3 times by mass ratio, A PAS resin composition having a low content, excellent melt fluidity, and excellent dimensional stability during repeated molding and an injection-molded product thereof have been proposed (Patent Document 1).
しかしながら、該樹脂組成物で用いている塩素原子含有量の低いPAS樹脂は、洗浄工程でオリゴマー等の低分子量物量を低減させることによって得られたものであるため、PAS樹脂の溶融粘度が高く、そのため低粘度の汎用PAS樹脂と併用することによって、組成物全体の溶融粘度を低減させる必要があった。このため、組成物の塩素原子含有量をより低減させようとすると、組成物の溶融粘度が高くなり成形品の寸法安定性に問題があり、さらに、近年電子材料部品の小型化、軽量化に伴って、成形体の薄肉化が求められており、成形品を薄肉化した際の低そり性に問題があった。 However, since the PAS resin having a low chlorine atom content used in the resin composition is obtained by reducing the amount of low molecular weight substances such as oligomers in the washing step, the melt viscosity of the PAS resin is high, Therefore, it was necessary to reduce the melt viscosity of the entire composition by using it together with a low-viscosity general-purpose PAS resin. For this reason, if the chlorine atom content of the composition is further reduced, the melt viscosity of the composition is increased, which causes a problem in the dimensional stability of the molded product. Along with this, a reduction in the thickness of the molded body has been demanded, and there has been a problem in low warpage when the molded product is thinned.
そこで本発明が解決しようとする課題は、塩素原子含有量が少なく、溶融流動性に優れた、かつ繰り返し成形時の寸法安定性および低そり性に優れたポリアリーレンサルファイド樹脂組成物およびその成形体を提供することにある。 Therefore, the problem to be solved by the present invention is a polyarylene sulfide resin composition having a low chlorine atom content, excellent melt flowability, and excellent dimensional stability and low warpage during repeated molding, and a molded article thereof Is to provide.
本発明者らは上記課題を解決するため鋭意検討を行った結果、溶融粘度が低くかつ塩素原子含有量の低いPAS樹脂を用いて充填剤と配合することにより、塩素原子含有量が少なく、溶融流動性に優れた、かつ繰り返し成形時の寸法安定性および低そり性に優れたポリアリーレンサルファイド樹脂組成物およびその成形体を提供できることを見出し、本発明を完成するに至った。 As a result of intensive studies to solve the above-mentioned problems, the inventors of the present invention blended with a filler using a PAS resin having a low melt viscosity and a low chlorine atom content, so that the chlorine atom content is low and the melt is reduced. The present inventors have found that a polyarylene sulfide resin composition excellent in fluidity, dimensional stability during repeated molding, and low warpage can be provided, and a molded product thereof, and has completed the present invention.
即ち、本発明は、 (α)ポリアリーレンサルファイド樹脂、(β)非繊維状充填材および(γ)繊維状充填材を溶融混練してなるポリアリーレンサルファイド樹脂組成物であって、
前記(α)ポリアリーレンサルファイド樹脂は、溶融粘度(320 ℃、剪断速度1000/s)が100〔Pa・s〕未満の範囲かつ塩素原子含有量が2000ppm以下の範囲であり、前記(β)非繊維状充填材と(γ)繊維状充填材の合計量が、前記ポリアリーレンサルファイド樹脂組成物中の樹脂成分100質量部に対し、100〜300質量部であり、さらに(β)非繊維状充填材の含有量が(γ)繊維状充填材の含有量以上で、かつポリアリーレンサルファイド樹脂組成物中の塩素原子含有量が900ppm以下の範囲であることを特徴とするポリアリーレンサルファイド樹脂組成物ならびに前記ポリアリーレンサルファイド樹脂組成物を成形して得られる成形品に関する。
That is, the present invention is a polyarylene sulfide resin composition obtained by melt-kneading (α) polyarylene sulfide resin, (β) non-fibrous filler and (γ) fibrous filler,
The (α) polyarylene sulfide resin has a melt viscosity (320 ° C., shear rate 1000 / s) in a range of less than 100 [Pa · s] and a chlorine atom content in a range of 2000 ppm or less. The total amount of the fibrous filler and (γ) fibrous filler is 100 to 300 parts by mass with respect to 100 parts by mass of the resin component in the polyarylene sulfide resin composition, and (β) non-fibrous filling A polyarylene sulfide resin composition characterized in that the content of the material is not less than the content of the (γ) fibrous filler and the chlorine atom content in the polyarylene sulfide resin composition is in the range of 900 ppm or less, and The present invention relates to a molded product obtained by molding the polyarylene sulfide resin composition.
本発明によれば、塩素原子含有量が少なく、溶融流動性に優れた、かつ繰り返し成形時の寸法安定性および低そり性に優れたポリアリーレンサルファイド樹脂組成物およびその成形体を提供することができる。 According to the present invention, it is possible to provide a polyarylene sulfide resin composition having a low chlorine atom content, excellent melt fluidity, excellent dimensional stability and low warpage during repeated molding, and a molded product thereof. it can.
本発明のポリアリーレンサルファイド樹脂組成物は、(α)ポリアリーレンサルファイド樹脂、(β)非繊維状充填材および(γ)繊維状充填材を溶融混練してなるポリアリーレンサルファイド樹脂組成物であって、前記(α)ポリアリーレンサルファイド樹脂は、溶融粘度(320 ℃、剪断速度1000/s)が100〔Pa・s〕未満の範囲かつ塩素原子含有量が2000ppm以下の範囲であり、ポリアリーレンサルファイド樹脂組成物の塩素原子含有量が900ppm以下である。 The polyarylene sulfide resin composition of the present invention is a polyarylene sulfide resin composition obtained by melt-kneading (α) polyarylene sulfide resin, (β) non-fibrous filler and (γ) fibrous filler. The (α) polyarylene sulfide resin has a melt viscosity (320 ° C., shear rate 1000 / s) in the range of less than 100 [Pa · s] and a chlorine atom content in the range of 2000 ppm or less, and the polyarylene sulfide resin The chlorine atom content of the composition is 900 ppm or less.
本発明に用いる(α)PAS樹脂はその溶融粘度(320℃、剪断速度1000/s)が100〔Pa・s〕未満の範囲であり、かつ前記(α)ポリアリーレンサルファイド樹脂中の塩素原子含有量が2000ppm以下である。このようなPAS樹脂は、例えば極性溶媒中でアルカリ金属硫化物(A)とジハロ芳香族化合物(B)とを反応させてポリアリーレンサルファイドを製造する方法において、該ジハロ芳香族化合物(B)の反応率が0〜40%の時点でメルカプト化合物、メルカプト化合物の金属塩、フェノール化合物、フェノール化合物の金属塩およびジスルフィド化合物からなる群から選ばれる一種以上の化合物(C)を添加することを特徴とする製造方法により得られる(以下、本発明に用いるPAS樹脂の製造方法ということがある)。該ジハロ芳香族化合物(B)の反応率が0〜40%の時点で化合物(C)を添加することにより初めて同様の粘度であってもハロゲンの含有量が少ないポリアリーレンサルファイドが容易に得られるという優れた効果を奏する。化合物(C)の添加するタイミングは、前述したジハロ芳香族化合物(B)の反応率が0〜40%の時点が塩素原子量の低減化効果が高いが、より高い塩素原子量の低減効果を得るためには、ジハロ芳香族化合物(B)の反応率が0〜20%の時点が好ましく、0〜10%がより好ましい。尚、本発明における「ジハロ芳香族化合物(B)の反応率」とは、ある時点のジハロ芳香族化合物(B)の残存量から判断出来る、仕込み量からのジハロ芳香族化合物(B)の減少の割合を指す。 The (α) PAS resin used in the present invention has a melt viscosity (320 ° C., shear rate 1000 / s) in the range of less than 100 [Pa · s], and contains the chlorine atom in the (α) polyarylene sulfide resin. The amount is 2000 ppm or less. Such a PAS resin can be obtained by, for example, reacting an alkali metal sulfide (A) with a dihaloaromatic compound (B) in a polar solvent to produce polyarylene sulfide. One or more compounds (C) selected from the group consisting of mercapto compounds, metal salts of mercapto compounds, phenol compounds, metal salts of phenol compounds and disulfide compounds are added when the reaction rate is 0 to 40%. (Hereinafter, it may be called the manufacturing method of PAS resin used for this invention.). By adding the compound (C) when the reaction rate of the dihaloaromatic compound (B) is 0 to 40%, polyarylene sulfide having a low halogen content can be easily obtained for the first time even when the viscosity is the same. There is an excellent effect. The timing when the compound (C) is added is that when the reaction rate of the dihaloaromatic compound (B) is 0 to 40%, the effect of reducing the amount of chlorine atoms is high, but a higher effect of reducing the amount of chlorine atoms is obtained. The time when the reaction rate of the dihaloaromatic compound (B) is 0 to 20% is preferable, and 0 to 10% is more preferable. The “reaction rate of the dihaloaromatic compound (B)” in the present invention is a decrease in the dihaloaromatic compound (B) from the charged amount that can be judged from the remaining amount of the dihaloaromatic compound (B) at a certain time. Refers to the percentage of
本発明に用いるPAS樹脂の製造方法で用いる極性溶媒としては、例えば、有機アミド化合物、ラクタム化合物、尿素化合物、環式有機リン化合物等を使用することができる。該極性溶媒の具体例として、N,N−ジメチルホルムアミド、N,N−ジメチルアセトアミド、N,N−ジエチルアセトアミド、N,N−ジプロピルアセトアミド、N,N−ジメチル安息香酸アミド、カプロラクタム、N−メチルカプロラクタム、N−エチルカプロラクタム、N−イソプロピルカプロラクタム、N−イソブチルカプロラクタム、N−ノルマルプロピルカプロラクタム、N−ノルマルブチルカプロラクタム、N−シクロヘキシルカプロラクタム、N−メチル−2−ピロリドン、N−エチル−2−ピロリドン、N−イソプロピル−2−ピロリドン、N−イソブチル−2−ピロリドン、N−ノルマルプロピル−2−ピロリドン、N−ノルマルブチル−2−ピロリドン、N−シクロヘキシル−2−ピロリドン、N−メチル−3−メチル−2−ピロリドン、N−エチル−3−メチル−2−ピロリドン、N−メチル−3,4,5−トリメチル−2−ピロリドン、N−メチル−2−ピペリドン、N−イソプロピル−2−ピペリドン、N−エチル−2−ピペリドン、N−メチル−6−メチル−2−ピペリドン、N−メチル−3−エチル−2−ピペリドン、テトラメチル尿素、N,N´−ジメチルエチレン尿素、N,N´−ジメチルプロピレン尿素、1−メチル−1−オキソスルホラン、1−エチル−1−オキソスルホラン、1−フェニル−1−オキソスルホラン、1−メチル−1−オキソホスホラン、1−ノルマルプロピル−1−オキソホスホラン及び1−フェニル−1−オキソホスホラン等が挙げられる。これらの溶媒は、夫々単独でもよいし、2種以上を混合して用いてもよい。上記極性溶媒中、非プロトン性の有機アミド若しくはラクタム類が好ましく、そのなかでもN−アルキルラクタム及びN−アルキルピロリドンが好ましく、N−メチルピロリドンが特に好ましい。 As a polar solvent used in the method for producing a PAS resin used in the present invention, for example, an organic amide compound, a lactam compound, a urea compound, a cyclic organic phosphorus compound, or the like can be used. Specific examples of the polar solvent include N, N-dimethylformamide, N, N-dimethylacetamide, N, N-diethylacetamide, N, N-dipropylacetamide, N, N-dimethylbenzoic acid amide, caprolactam, N- Methylcaprolactam, N-ethylcaprolactam, N-isopropylcaprolactam, N-isobutylcaprolactam, N-normalpropylcaprolactam, N-normalbutylcaprolactam, N-cyclohexylcaprolactam, N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone N-isopropyl-2-pyrrolidone, N-isobutyl-2-pyrrolidone, N-normalpropyl-2-pyrrolidone, N-normalbutyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, N-methyl-3-methyl -2-pyrrolidone, N-ethyl-3-methyl-2-pyrrolidone, N-methyl-3,4,5-trimethyl-2-pyrrolidone, N-methyl-2-piperidone, N-isopropyl-2-piperidone, N -Ethyl-2-piperidone, N-methyl-6-methyl-2-piperidone, N-methyl-3-ethyl-2-piperidone, tetramethylurea, N, N'-dimethylethyleneurea, N, N'-dimethyl Propylene urea, 1-methyl-1-oxosulfolane, 1-ethyl-1-oxosulfolane, 1-phenyl-1-oxosulfolane, 1-methyl-1-oxophosphorane, 1-normalpropyl-1-oxophosphorane And 1-phenyl-1-oxophosphorane. These solvents may be used alone or in combination of two or more. Among the polar solvents, aprotic organic amides or lactams are preferable, and N-alkyl lactam and N-alkylpyrrolidone are preferable, and N-methylpyrrolidone is particularly preferable.
前記アルカリ金属硫化物(A)としては、例えば、硫化リチウム、硫化ナトリウム、硫化カリウム、硫化ルビジウム、硫化セシウム及びこれらの混合物等が挙げられる。これらの水和物及び水溶液であっても良い。また、これらにそれぞれ対応する水硫化物及び水和物を、それぞれに対応する水酸化物で中和して用いることができ、安価な硫化ナトリウムが好ましい。 Examples of the alkali metal sulfide (A) include lithium sulfide, sodium sulfide, potassium sulfide, rubidium sulfide, cesium sulfide, and a mixture thereof. These hydrates and aqueous solutions may also be used. In addition, hydrosulfides and hydrates corresponding to these can be used by neutralizing with the corresponding hydroxides, and inexpensive sodium sulfide is preferable.
前記ジハロ芳香族化合物(B)としては、例えば、p−ジクロロベンゼン、m−ジクロロベンゼン、o−ジクロロベンゼン、2,5−ジクロロトルエン、p−ジブロモベンゼン、1,4−ジクロロナフタレン、1−メトキシ−2,5−ジクロロベンゼン、4,4’−ジクロロビフェニル、4,4’−ジブロモビフェニル、2,4−ジクロロ安息香酸、2,5−ジクロロ安息香酸、3,5−ジクロロ安息香酸、2,4−ジクロロアニリン、2,5−ジクロロアニリン、3,5−ジクロロアニリン、4,4’−ジクロロフェニルエーテル、4,4’−ジクロロジフェニルスルホキシド、4,4’−ジクロロフェニルケトン等の芳香族ジハロゲン化合物、1,3,5−トリクロロベンゼン、1,2,4−トリクロロベンゼン等の芳香族トリハロゲン化合物、1,2,4,5−テトラクロロベンゼン等の芳香族テトラハロゲン化合物、及びこれらに類するものならびにこれらの混合物を挙げることができる。なかでもp−ジクロロベンゼンに代表されるパラ位で置換された芳香族ジハロゲン化合物を主成分とするものが好ましく、p−ジクロロベンゼンがより好ましい。 Examples of the dihaloaromatic compound (B) include p-dichlorobenzene, m-dichlorobenzene, o-dichlorobenzene, 2,5-dichlorotoluene, p-dibromobenzene, 1,4-dichloronaphthalene, 1-methoxy. -2,5-dichlorobenzene, 4,4'-dichlorobiphenyl, 4,4'-dibromobiphenyl, 2,4-dichlorobenzoic acid, 2,5-dichlorobenzoic acid, 3,5-dichlorobenzoic acid, 2, Aromatic dihalogen compounds such as 4-dichloroaniline, 2,5-dichloroaniline, 3,5-dichloroaniline, 4,4′-dichlorophenyl ether, 4,4′-dichlorodiphenyl sulfoxide, 4,4′-dichlorophenyl ketone, Aromatic trihalogens such as 1,3,5-trichlorobenzene and 1,2,4-trichlorobenzene Compounds, 1,2,4,5 aromatic tetracarboxylic halogen compounds tetra chlorobenzene, and as well as similar thereto can be mixtures thereof. Among them, those containing an aromatic dihalogen compound substituted at the para position represented by p-dichlorobenzene as a main component are preferable, and p-dichlorobenzene is more preferable.
本発明で用いるジハロ芳香族化合物(B)の使用量としては、アルカリ金属硫化物(A)のモル量に対して0.90〜1.10モル比が高分子量化の理由から好ましく、0.95〜1.05モル比がより好ましい。 The amount of the dihaloaromatic compound (B) used in the present invention is preferably 0.90 to 1.10 molar ratio with respect to the molar amount of the alkali metal sulfide (A) for reasons of high molecular weight. A 95 to 1.05 molar ratio is more preferred.
本発明で用いる化合物(C)は、メルカプト化合物、メルカプト化合物の金属塩、フェノール化合物、フェノール化合物の金属塩およびジスルフィド化合物からなる群から選ばれる一種以上の化合物である。前記メルカプト化合物としては、例えば、チオフェノール、o−チオクレゾール、m−チオクレゾール、p−チオクレゾール、1−ナフタレンチオール、2−ナフタレンチオール、3,4−ジメルカプトトルエン、1−ヘキサンチオール、1−ヘプタンチオール、1−オクタンチオール、メルカプトシクロペンタン、メルカプトシクロヘキサン、メルカプト酢酸、αーメルカプトプロピオン酸、βーメルカプトプロピオン酸、メルカプトコハク酸、チオサリチル酸、2−メルカプトエタノール、3−メルカプトー2−ブタノール、3−メルカプトー1,2−プロパンジオール、2−メルカプトエチルアミン、βーメルカプトバリン、2−メルカプトベンズイミダゾール、2−メルカプトベンゾチアゾール、2−メルカプトベンズオキサゾール、2−メルカプトー1−メチルテトラゾール、2−メルカプトー4−メチルピリミジン、2−メルカプトー4,6−ジメチルピロミジン、5−メルカプトー1−メチルテトラゾール、3−メルカプトー4−メチルー4Hー1,2,4−トリアゾール、2−メルカプトニコチン酸、6−メルカプトプリン、2−メルカプトー6−ヒドロキシプリン、6−メルカプトー2−アミノプリン、2−メルカプトピリジン、4−メルカプトピリジン、2−メルカプトピリジンーN−オキシド、2−メルカプトチアゾリン、3−メルカプト1Hー1,2,4ートリアゾール、2,5−ジメルカプトー1,3,4ーチアジアゾール、5−メルカプトー2ーアミノー1,3,4ーチアジアゾール、1,3,5−トリアジンー2,4,6ートリチオール、2−メルカプトイミダゾリン、2−メルカプトー4−ピリミドン、2−メルカプトー5−チアゾリドン等が挙げられる。前記メルカプト化合物の金属塩としては、前記メルカプト化合物のナトリウム塩、リチウム塩、カリウム塩等が挙げられる。 The compound (C) used in the present invention is one or more compounds selected from the group consisting of mercapto compounds, metal salts of mercapto compounds, phenol compounds, metal salts of phenol compounds, and disulfide compounds. Examples of the mercapto compound include thiophenol, o-thiocresol, m-thiocresol, p-thiocresol, 1-naphthalenethiol, 2-naphthalenethiol, 3,4-dimercaptotoluene, 1-hexanethiol, 1 -Heptanethiol, 1-octanethiol, mercaptocyclopentane, mercaptocyclohexane, mercaptoacetic acid, α-mercaptopropionic acid, β-mercaptopropionic acid, mercaptosuccinic acid, thiosalicylic acid, 2-mercaptoethanol, 3-mercapto-2-butanol, 3-mercapto-1,2-propanediol, 2-mercaptoethylamine, β-mercaptovaline, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, 2-mercaptobenzoxazole, -Mercapto-1-methyltetrazole, 2-mercapto-4-methylpyrimidine, 2-mercapto-4,6-dimethylpyromidine, 5-mercapto-1-methyltetrazole, 3-mercapto-4-methyl-4H-1,2,4-triazole, 2-mercaptonicotinic acid, 6-mercaptopurine, 2-mercapto-6-hydroxypurine, 6-mercapto-2-aminopurine, 2-mercaptopyridine, 4-mercaptopyridine, 2-mercaptopyridine-N-oxide, 2-mercaptothiazoline 3-mercapto 1H-1,2,4-triazole, 2,5-dimercapto-1,3,4-thiadiazole, 5-mercapto-2-amino-1,3,4-thiadiazole, 1,3,5-triazine-2,4 6-trithiol, 2-merca Toimidazorin, 2-mercapto 4-pyrimidone, 2- mercapto-5-thiazolidone, and the like. Examples of the metal salt of the mercapto compound include sodium salt, lithium salt, potassium salt and the like of the mercapto compound.
前記フェノール化合物としては、例えば、フェノール、クレゾール、エチルフェノール、イソプロピルフェノール、t−ブチルフェノールなどが好適に使用される。前記フェノール化合物の金属塩としては、前記フェノール化合物のナトリウム塩、リチウム塩、カリウム塩等が挙げられる。 As the phenol compound, for example, phenol, cresol, ethylphenol, isopropylphenol, t-butylphenol and the like are preferably used. Examples of the metal salt of the phenol compound include sodium salt, lithium salt, potassium salt and the like of the phenol compound.
前記ジスルフィド化合物としては、例えば、ジフェニルジスルフィド、p,p’−ジトリルジスルフィド、ジベンジルジスルフィド、ジベンゾイルジスルフィド、ジチオベンゾイルジスルフィド等が挙げられる。 Examples of the disulfide compound include diphenyl disulfide, p, p'-ditolyl disulfide, dibenzyl disulfide, dibenzoyl disulfide, dithiobenzoyl disulfide, and the like.
前記化合物(C)の中でもPAS末端と容易に反応出来ることからメルカプト化合物、メルカプト化合物の金属塩が好ましく、メルカプト化合物がより好ましく、チオフェノールが更に好ましい。 Among the compounds (C), a mercapto compound and a metal salt of a mercapto compound are preferable, a mercapto compound is more preferable, and a thiophenol is more preferable because it can easily react with a PAS end.
前記化合物(C)の使用量としては、アルカリ金属硫化物(A)のモル量に対して0.1〜2.0モル%が塩素原子低減効果の理由から好ましく、0.1から1.0がより好ましい。 The amount of the compound (C) used is preferably from 0.1 to 2.0 mol% for the reason of the chlorine atom reducing effect with respect to the molar amount of the alkali metal sulfide (A). Is more preferable.
本発明に用いるPAS樹脂の製造方法において、必要に応じて前記ジハロ芳香族化合物以外(B)のポリハロ芳香族化合物(D)を原料の一部に用いる事ができる。前記ポリハロ芳香族化合物としては、例えば、1,2,4−トリクロロベンゼン、1,3,5−トリクロロベンゼン及び1,4,6−トリクロロナフタレン等が好ましく、1,2,4−トリクロロベンゼン、1,3,5−トリクロロベンゼンが特に好ましい。 In the method for producing a PAS resin used in the present invention, the polyhaloaromatic compound (D) other than the dihaloaromatic compound (B) can be used as a part of the raw material as necessary. As the polyhaloaromatic compound, for example, 1,2,4-trichlorobenzene, 1,3,5-trichlorobenzene and 1,4,6-trichloronaphthalene are preferable, and 1,2,4-trichlorobenzene, 1 3,5-trichlorobenzene is particularly preferred.
前記ポリハロ芳香族化合物(D)の使用量としては粘度増大効果からアルカリ金属硫化物(A)のモル量に対して0.01〜1.5モル%が好ましく、0.05〜1.0モル%がより好ましい。 The amount of the polyhaloaromatic compound (D) used is preferably from 0.01 to 1.5 mol%, preferably from 0.05 to 1.0 mol, based on the molar amount of the alkali metal sulfide (A) because of the effect of increasing the viscosity. % Is more preferable.
上記した(α)ポリアリーレンスフィド樹脂の製造方法としては、通常、ジハロ芳香族化合物、例えばp−ジクロルベンゼンを極性溶媒中で硫化ナトリウムあるいは硫化水素ナトリウムと水酸化ナトリウムと重合させる方法が一般的である。中でもN−メチルピロリドン、ジメチルアセトアミド等のアミド系溶媒やスルホラン等のスルホン系溶媒中で硫化ナトリウムとp−ジクロルベンゼンを反応させる方法が適当である。 As a method for producing the above-mentioned (α) polyarylene sulfide resin, a method of polymerizing a dihaloaromatic compound such as p-dichlorobenzene with sodium sulfide or sodium hydrogen sulfide and sodium hydroxide in a polar solvent is generally used. Is. Among them, a method in which sodium sulfide and p-dichlorobenzene are reacted in an amide solvent such as N-methylpyrrolidone or dimethylacetamide or a sulfone solvent such as sulfolane is suitable.
しかしながら、上述の製造方法は公知の方法で得られるものであれば特に限定されるものではなく、例えば、米国特許第2513188号明細書、特公昭44−27671号公報、特公昭45−3368号公報、特公昭52−12240号公報、特開昭61−225217号および米国特許第3274165号明細書、英国特許第1160660号さらに特公昭46−27255号公報、ベルギー特許第29437号明細書、特開平5−222196号公報、等に記載された方法やこれら特許等に例示された先行技術の方法で得ることが出来る。一例を示せば、特公昭45−3368号公報に開示されている方法において、N−メチルピロリドン等の有機アミド溶媒中でジハロ芳香族化合物と含水硫化ナトリウム等のアルカリ金属化合物との求核置換反応による脱塩重縮合させる際に、含水硫化物からの脱水操作を行い脱水混合物を得た後、脱水混合物にジハロ芳香族化合物(B)を添加し、適時好適な温度で重合を行い、PASを得る方法において、該ジハロ芳香族化合物(B)の反応率が0〜40%の時点で化合物(C)を添加すれば、目的の低塩素原子含有PASが得られる。 However, the above production method is not particularly limited as long as it can be obtained by a known method. For example, US Pat. No. 2,513,188, Japanese Patent Publication No. 44-27671, Japanese Patent Publication No. 45-3368. JP-B-52-12240, JP-A-61-225217 and U.S. Pat. No. 3,274,165, British Patent No. 1160660, JP-B-46-27255, Belgian Patent No. 29437, JP-A-5 -222196 and the prior art methods exemplified in these patents. For example, in the method disclosed in Japanese Patent Publication No. 45-3368, a nucleophilic substitution reaction between a dihaloaromatic compound and an alkali metal compound such as hydrous sodium sulfide in an organic amide solvent such as N-methylpyrrolidone. In the desalination polycondensation by the above, after dehydration from the hydrous sulfide to obtain a dehydrated mixture, the dihaloaromatic compound (B) is added to the dehydrated mixture, polymerized at a suitable temperature at a suitable time, PAS In the obtained method, if the compound (C) is added when the reaction rate of the dihaloaromatic compound (B) is 0 to 40%, the desired low chlorine atom-containing PAS can be obtained.
重合反応で得られたPASを含有する反応スラリーは、常圧または減圧下での濾過により液体と固体を分離して液体部より溶媒を回収し、固体部より食塩等の副生成物や未反応原料等を除去するため、水洗や溶剤洗浄を繰り返し行い最後に乾燥してPASを取り出す事が通常行われる。 The reaction slurry containing PAS obtained by the polymerization reaction is separated from liquid and solid by filtration under normal pressure or reduced pressure, and the solvent is recovered from the liquid part. By-products such as salt and unreacted from the solid part In order to remove the raw materials and the like, it is usually performed by repeatedly washing with water and solvent, and finally drying to take out PAS.
具体的な重合反応後のPASを含むスラリーの後処理方法としては、例えば下記の方法が挙げられる。
(1)重合反応終了後、まず反応スラリーをそのまま、あるいは酸または塩基を加えた後、減圧下または常圧下で溶媒を留去し、次いで溶媒流去後の固形物を水、アセトン、メチルエチルケトン、アルコール類等の溶媒で1回または2回以上洗浄し、さらに中和、水洗、濾過及び乾燥してPASを分離して取り出す方法。
Specific examples of the post-treatment method of the slurry containing PAS after the polymerization reaction include the following methods.
(1) After the completion of the polymerization reaction, the reaction slurry is first added as it is, or an acid or a base is added, and then the solvent is distilled off under reduced pressure or normal pressure. Then, the solid after the solvent is removed is washed with water, acetone, methyl ethyl ketone, A method in which PAS is separated and removed by washing once or twice with a solvent such as alcohol, and further neutralizing, washing with water, filtering and drying.
(2)重合反応終了後、反応スラリーに水、アセトン、メチルエチルケトン、アルコール類、エーテル類、ハロゲン化炭化水素、芳香族炭化水素、脂肪族炭化水素等の溶媒(本発明で使用する有機極性溶媒に可溶であり、且つ少なくともPASに対しては貧溶媒である溶媒)を沈降剤として添加して、PASや無機塩等の固体性状生成物を沈降させ、これらを濾過してPASを含む固形分を分離し、洗浄、乾燥してPASを分離取得する方法。 (2) After completion of the polymerization reaction, the reaction slurry is mixed with a solvent such as water, acetone, methyl ethyl ketone, alcohols, ethers, halogenated hydrocarbons, aromatic hydrocarbons, aliphatic hydrocarbons (the organic polar solvent used in the present invention). Soluble and at least a solvent that is a poor solvent for PAS) is added as a precipitating agent to precipitate solid-state products such as PAS and inorganic salts, and these are filtered to obtain a solid content containing PAS. The PAS is separated and obtained by separating, washing and drying.
(3)重合反応終了後、反応スラリーに最初に加えた物と同じ有機極性溶媒(又は低分子量PASに対して同等の溶解度を有する有機溶媒)を加えて撹拌した後、濾過して低分子量PAS、有機極性溶媒とその溶解物を除いた後、PASを含む固形物を水、アセトン、メチルエチルケトン、アルコール類等の溶媒で1回または2回以上洗浄し、その後中和、水洗、濾過及び乾燥してPASを取り出す方法。 (3) After completion of the polymerization reaction, the same organic polar solvent (or an organic solvent having the same solubility as that of the low molecular weight PAS) added to the reaction slurry is added and stirred, and then filtered to obtain a low molecular weight PAS. After removing the organic polar solvent and its dissolved product, the solid containing PAS is washed once or twice with a solvent such as water, acetone, methyl ethyl ketone, alcohols, etc., and then neutralized, washed with water, filtered and dried. To take out PAS.
なお、前記(1)〜(3)に例示した様な後処理方法において、PASの乾燥は、真空中で行っても良いし、空気中あるいは窒素の様な不活性ガス雰囲気中で行っても良く、特に限定はしない。 In the post-treatment methods as exemplified in the above (1) to (3), the PAS may be dried in a vacuum, or in an inert gas atmosphere such as air or nitrogen. Good, no limitation.
この様にして得られたポリアリーレンスフィド樹脂は、そのまま各種成形材料等に利用可能であるが、空気あるいは酸素富化空気中あるいは減圧条件下で熱処理を行うことにより、溶融粘度を上昇させることが可能であり、必用に応じてこの様な増粘操作(通常、この様な操作を「架橋」という。)を行った後、各種成形材料に利用しても良い。この架橋温度は、目標とする架橋処理時間や処理する雰囲気によっても異なるので一概に規定できないが、通常は180℃以上で行われる。また、架橋を押出機等で行う場合、ポリアリーレンスフィド樹脂の融点以上の溶融状態で行っても良いが、ポリアリーレンスフィド樹脂の熱劣化を避けるため、融点プラス100℃以下で行うことが好ましい。 The polyarylene fried resin thus obtained can be used as it is for various molding materials, but it can increase the melt viscosity by heat treatment in air or oxygen-enriched air or under reduced pressure conditions. If necessary, such a thickening operation (usually such operation is referred to as “crosslinking”) may be used for various molding materials. This cross-linking temperature varies depending on the target cross-linking treatment time and the atmosphere to be treated. In addition, when crosslinking is performed with an extruder or the like, it may be performed in a molten state that is higher than the melting point of the polyarylene sulfide resin. preferable.
本発明に用いる(α)ポリアリーレンスフィド樹脂は、上記の方法で得られたPAS樹脂から、300 ℃で測定した溶融粘度(V6)が1〔Pa・s〕以上の範囲、より好ましくは2〔Pa・s〕以上の範囲、さらに好ましくは5〔Pa・s〕以上の範囲であり、かつ、100〔Pa・s〕未満、より好ましくは40〔Pa・s〕未満、さらに好ましくは20〔Pa・s〕未満のものを用いる。特に、架橋処理を行わないポリアリーレンスルフィド樹脂の場合には、その溶融粘度(V6)が40〔Pa・s〕未満のものを用いることが好ましい。ただし、300 ℃で測定した溶融粘度(V6)とは、フローテスターを用いて、温度300 ℃、荷重1.96MPa、オリフィス長とオリフィス径との、前者/後者の比が10/1であるオリフィスを使用して6分間保持した後の溶融粘度を表す。 The (α) polyarylene fide resin used in the present invention has a melt viscosity (V6) measured at 300 ° C. of 1 [Pa · s] or more from the PAS resin obtained by the above method, more preferably 2 [Pa · s] or more, more preferably 5 [Pa · s] or more, and less than 100 [Pa · s], more preferably less than 40 [Pa · s], still more preferably 20 [Pa · s]. [Pa · s] is used. In particular, in the case of a polyarylene sulfide resin not subjected to crosslinking treatment, it is preferable to use a resin having a melt viscosity (V6) of less than 40 [Pa · s]. However, the melt viscosity (V6) measured at 300 ° C. is an orifice having a temperature / 300 ° C., a load of 1.96 MPa and an orifice length / orifice diameter ratio of 10/1 using a flow tester. Represents the melt viscosity after holding for 6 minutes.
また、本発明に用いる(α)ポリアリーレンスフィド樹脂は、その含有塩素原子量が、2000ppm以下、より好ましくは1500ppm以下、さらに好ましくは1200ppm以下のものを用いる。一方、含有塩素原子量の下限値は少ないものほど良く、特に限定されるものではないが、上記の製造方法によれば500ppm以上、好ましくは900ppm以上、さらに好ましくは1000ppm以上である。 The (α) polyarylene fide resin used in the present invention has a chlorine atom content of 2000 ppm or less, more preferably 1500 ppm or less, and still more preferably 1200 ppm or less. On the other hand, the lower the lower limit of the amount of chlorine atoms contained, the better and not particularly limited, but according to the above production method, it is 500 ppm or more, preferably 900 ppm or more, more preferably 1000 ppm or more.
本発明に用いる(α)ポリアリーレンサルファイド樹脂は、優れた強度および低塩素化を得る観点から、クロロホルム抽出量が少ない方が好ましいものの、あまり少ないと溶融粘度が高くなる傾向にあることから、1.0質量%以上、より好ましくは1.5質量%以上、さらに好ましくは2.0質量%以上であり、一方、あまりクロロホルム量が高い場合には付着性ガス発生量が多くなる傾向にあることから、5.0質量%以下、より好ましくは4.0質量%以下、さらに好ましくは3.0質量%以下が好ましい。
かかるクロロホルム抽出量はポリアリーレンスフィド樹脂を製造する際の洗浄工程で、有機溶剤洗浄する方法等で適宜調整すればよい。なお本発明におけるクロロホルム抽出量は、ソックスレー抽出器を用い、PPSサンプル量約10g、クロロホルム200mlを用い5時間抽出し、その抽出液を50 ℃で乾燥し、得られた残さを仕込みPPSサンプル量で割り返し、100をかけて百分率表記としたものである。
From the viewpoint of obtaining excellent strength and low chlorination, the (α) polyarylene sulfide resin used in the present invention preferably has a small amount of chloroform extraction, but if it is too small, the melt viscosity tends to increase. 0.0 mass% or more, more preferably 1.5 mass% or more, and even more preferably 2.0 mass% or more. On the other hand, when the amount of chloroform is too high, the amount of adhesive gas generated tends to increase. Therefore, 5.0 mass% or less, More preferably, it is 4.0 mass% or less, More preferably, 3.0 mass% or less is preferable.
The amount of chloroform extracted may be appropriately adjusted by a method of washing with an organic solvent in the washing step when producing the polyarylene fide resin. The amount of chloroform extracted in the present invention was extracted with a Soxhlet extractor using a PPS sample amount of about 10 g and chloroform of 200 ml for 5 hours, and the extract was dried at 50 ° C. It is a percentage notation multiplied by 100.
本発明においては、(α)ポリアリーレンスフィド樹脂以外に配合可能な非晶性樹脂、非繊維状充填材や繊維状充填材の種類及び配合量等にもよるが、流動性、靱性、バリ、塩素原子量、低そり性のバランスを取るためには2種類以上のポリアリーレンサルファイド樹脂を併用することが好ましい。特に非晶性樹脂、非繊維状充填材や繊維状充填材を配合した場合は、流動性が悪化するため使用するポリアリーレンサルファイド樹脂の溶融粘度が重要となる。 In the present invention, although it depends on the type and blending amount of the amorphous resin, non-fibrous filler, and fibrous filler other than (α) polyarylene fide resin, it can be used for fluidity, toughness, variability. In order to balance the chlorine atom weight and low warpage, it is preferable to use two or more polyarylene sulfide resins in combination. In particular, when an amorphous resin, a non-fibrous filler, or a fibrous filler is blended, the melt viscosity of the polyarylene sulfide resin to be used is important because the fluidity is deteriorated.
本発明のポリアリーレンサルファイド樹脂組成物は、(α)ポリアリーレンスフィド樹脂とともに(β)非繊維状充填材と(γ)繊維状充填材を必須成分として含有する。質量 The polyarylene sulfide resin composition of the present invention contains (β) non-fibrous filler and (γ) fibrous filler as essential components together with (α) polyarylene sulfide resin. mass
かかる(β)非繊維状充填材の具体例としては、タルク、ワラステナイト、ゼオライト、セリサイト、マイカ、カオリン、クレー、パイロフィライト、ベントナイト、アスベスト、アルミナシリケートなどの珪酸塩、酸化珪素、酸化マグネシウム、アルミナ、酸化ジルコニウム、酸化チタン、酸化鉄などの金属化合物、炭酸カルシウム、炭酸マグネシウム、ドロマイトなどの炭酸塩、硫酸カルシウム、硫酸バリウムなどの硫酸塩、水酸化カルシウム、水酸化マグネシウム、水酸化アルミニウムなどの水酸化物、ガラスビーズ、ガラスフレーク、ガラス粉、セラミックビーズ、窒化ホウ素、炭化珪素、カーボンブラックおよびシリカ、黒鉛などが挙げられ、これらは中空であってもよく、さらにはこれら充填剤を2種類以上併用することも可能である。また、これらの充填材をイソシアネート系化合物、有機シラン系化合物、有機チタネート系化合物、有機ボラン系化合物およびエポキシ化合物などのカップリング剤で予備処理して使用してもよい。中でも炭酸カルシウム、炭酸マグネシウム、ドロマイトなどの炭酸塩、硫酸カルシウム、硫酸バリウムなどの硫酸塩、カオリン、クレー、タルクなどの珪酸塩、アルミナ、黒鉛が特に好ましい。 Specific examples of such (β) non-fibrous fillers include silicates such as talc, wollastonite, zeolite, sericite, mica, kaolin, clay, pyrophyllite, bentonite, asbestos, alumina silicate, silicon oxide, oxidation Metal compounds such as magnesium, alumina, zirconium oxide, titanium oxide and iron oxide, carbonates such as calcium carbonate, magnesium carbonate and dolomite, sulfates such as calcium sulfate and barium sulfate, calcium hydroxide, magnesium hydroxide and aluminum hydroxide Such as hydroxide, glass beads, glass flakes, glass powder, ceramic beads, boron nitride, silicon carbide, carbon black and silica, graphite, etc., and these may be hollow, and further these fillers Two or more types can be used together A. These fillers may be used after pretreatment with a coupling agent such as an isocyanate compound, an organic silane compound, an organic titanate compound, an organic borane compound, and an epoxy compound. Of these, carbonates such as calcium carbonate, magnesium carbonate and dolomite, sulfates such as calcium sulfate and barium sulfate, silicates such as kaolin, clay and talc, alumina and graphite are particularly preferable.
また、本発明のポリアリーレンサルファイド樹脂組成物の塩素原子含有量測定では、塩素原子含有量の測定値を安定化させる上で非繊維状充填材を配合することが好ましい。本発明においては、コスト、寸法安定性、塩素原子含有量の測定値安定化の観点から、炭酸カルシウムが特に好ましい。本発明における(β)非繊維状充填材の配合量は、本発明の効果を損なわない範囲であれば特に限定されるものではないが、本発明のポリアリーレンサルファイド樹脂組成物中の樹脂成分100質量部に対し、50質量部を超えて150質量部以下が好ましい。 In the measurement of the chlorine atom content of the polyarylene sulfide resin composition of the present invention, it is preferable to blend a non-fibrous filler in order to stabilize the measured value of the chlorine atom content. In the present invention, calcium carbonate is particularly preferable from the viewpoints of cost, dimensional stability, and stabilization of the measured value of the chlorine atom content. The blending amount of the (β) non-fibrous filler in the present invention is not particularly limited as long as it does not impair the effects of the present invention, but the resin component 100 in the polyarylene sulfide resin composition of the present invention. More than 50 mass parts and 150 mass parts or less are preferable with respect to a mass part.
また(γ)繊維状充填材の具体例としては、ガラス繊維、炭素繊維、チタン酸カリウィスカ、酸化亜鉛ウィスカ、炭酸カルシウムウィスカー、ワラステナイトウィスカー、硼酸アルミウィスカ、アラミド繊維、アルミナ繊維、炭化珪素繊維、セラミック繊維、アスベスト繊維、石コウ繊維、金属繊維などが挙げられ、これらは2種類以上併用することも可能である。また、これら充填材をイソシアネート系化合物、有機シラン系化合物、有機チタネート系化合物、有機ボラン系化合物およびエポキシ化合物などのカップリング剤で予備処理して使用することは、より優れた機械的強度を得る意味において好ましい。中でもガラス繊維、炭素繊維がより好適に用いられる。エポキシ基、アミノ基、イソシアネート基、水酸基、メルカプト基およびウレイド基の中から選ばれた少なくとも1種の官能基を有するシラン系化合物がカップリング剤として好ましい。さらにまた、エポキシ樹脂、ウレタン樹脂、アクリル樹脂、酢酸ビニルなどの合成樹脂エマルジョン、前記カップリング剤、その他界面活性剤などで構成された集束剤を繊維状フィラーに付与して、数百〜数千本集束させたチョップドストランド等を用いることがより高い機械的強度を得る意味においてさらに好ましい。本発明では、組成物中における塩素原子含有量の低いPAS樹脂の含有率が高いため、(γ)繊維状充填材との相溶性が向上する。このため、マトリックスとの密着性が向上し、耐湿熱性に優れたものとなる。この傾向は(γ)繊維状充填材にカップリング材で予備処理するとより顕著なものとなる。 Specific examples of the (γ) fibrous filler include glass fiber, carbon fiber, potassium titanate whisker, zinc oxide whisker, calcium carbonate whisker, wollastonite whisker, aluminum borate whisker, aramid fiber, alumina fiber, silicon carbide fiber, A ceramic fiber, asbestos fiber, a stone fiber, a metal fiber, etc. are mentioned, These can also be used together 2 or more types. In addition, using these fillers with a pretreatment with a coupling agent such as an isocyanate compound, an organic silane compound, an organic titanate compound, an organic borane compound, and an epoxy compound can provide better mechanical strength. Preferred in meaning. Of these, glass fiber and carbon fiber are more preferably used. A silane compound having at least one functional group selected from an epoxy group, amino group, isocyanate group, hydroxyl group, mercapto group and ureido group is preferred as the coupling agent. Furthermore, a binder made of a synthetic resin emulsion such as epoxy resin, urethane resin, acrylic resin, vinyl acetate, the above-mentioned coupling agent, and other surfactants is applied to the fibrous filler, and several hundred to several thousand. It is further preferable to use the bunched chopped strand or the like in the sense of obtaining higher mechanical strength. In this invention, since the content rate of PAS resin with low chlorine atom content in a composition is high, compatibility with ((gamma)) fibrous filler improves. For this reason, adhesiveness with a matrix improves and it becomes what was excellent in heat-and-moisture resistance. This tendency becomes more prominent when (γ) fibrous filler is pretreated with a coupling material.
本発明においては、(β)非繊維状充填材と(γ)繊維状充填材の合計量が、本発明のポリアリーレンサルファイド樹脂組成物中の樹脂成分100質量部に対し、100質量部以上300質量部以下含有する事が必要であり、135質量部以上250質量部以下の範囲が好ましく、170質量部以上200質量部以下の範囲がより好ましく選択される。 In the present invention, the total amount of (β) non-fibrous filler and (γ) fibrous filler is 100 parts by mass or more and 300 parts by mass with respect to 100 parts by mass of the resin component in the polyarylene sulfide resin composition of the present invention. It is necessary to contain it by mass part or less, the range of 135 mass parts or more and 250 mass parts or less is preferable, and the range of 170 mass parts or more and 200 mass parts or less is more preferably selected.
(β)非繊維状充填材と(γ)繊維状充填材の合計量が、本発明のポリアリーレンサルファイド樹脂組成物中の樹脂成分100質量部に対し、100質量部未満の場合、機械的強度が不十分となり、また300質量部以上の場合、溶融流動性や耐湿熱性が損なわれるため好ましくない。 When the total amount of (β) non-fibrous filler and (γ) fibrous filler is less than 100 parts by mass with respect to 100 parts by mass of the resin component in the polyarylene sulfide resin composition of the present invention, mechanical strength When the amount is 300 parts by mass or more, the melt fluidity and heat-and-moisture resistance are impaired.
また本発明において、(β)非繊維状充填材の含有量と(γ)繊維状充填材の含有量の比率は、本発明の効果を損ねない範囲であれば特に限定されないが、寸法安定性、特に低ソリ性の観点からは(β)非繊維状充填材の含有量が(γ)繊維状充填材の含有量以上であることが好ましい。 In the present invention, the ratio of the content of (β) non-fibrous filler and the content of (γ) fibrous filler is not particularly limited as long as it does not impair the effects of the present invention, but dimensional stability In particular, from the viewpoint of low warpage, the content of (β) non-fibrous filler is preferably equal to or greater than the content of (γ) fibrous filler.
さらに本発明のポリアリーレンサルファイド樹脂組成物中では、(δ)ガラス転移温度が110 ℃以上の非晶性樹脂を(α)ポリアリーレンサルファイド樹脂100質量部に対し、3〜50質量部含有することが好ましく、5〜40質量部の範囲がより好ましく、8〜30質量部の範囲が更に好ましい。ここで、ガラス転移温度は、示差走査熱量計(DSC)を用い、20 ℃/分の速度で昇温して求められた値である。 Furthermore, in the polyarylene sulfide resin composition of the present invention, (δ) an amorphous resin having a glass transition temperature of 110 ° C. or higher is contained in an amount of 3 to 50 parts by mass with respect to 100 parts by mass of (α) polyarylene sulfide resin. Is preferable, the range of 5-40 mass parts is more preferable, and the range of 8-30 mass parts is still more preferable. Here, the glass transition temperature is a value obtained by increasing the temperature at a rate of 20 ° C./min using a differential scanning calorimeter (DSC).
かかる(δ)ガラス転移温度が110 ℃以上の非晶性樹脂の具体例としては、ポリカーボネート系樹脂、ポリフェニレンエーテル系樹脂、ポリスルホン系樹脂、ポリエーテルスルホン系樹脂、ポリアリレート系樹脂、ポリエーテルイミド系樹脂、ポリアミドイミド系樹脂が例示できるが、なかでもポリフェニレンエーテル系樹脂、ポリエーテルイミド系樹脂、ポリスルホン系樹脂、ポリエーテルスルホン系樹脂が特に適しており、ポリフェニレンエーテル系樹脂が特に好ましい。 Specific examples of the amorphous resin having a glass transition temperature of 110 ° C. or higher (δ) include polycarbonate resins, polyphenylene ether resins, polysulfone resins, polyethersulfone resins, polyarylate resins, polyetherimide resins. Examples thereof include resins and polyamideimide resins, among which polyphenylene ether resins, polyetherimide resins, polysulfone resins and polyethersulfone resins are particularly suitable, and polyphenylene ether resins are particularly preferred.
本発明のポリアリーレンサルファイド樹脂組成物は、本発明の効果を損なわない範囲において、さらに他の樹脂をブレンドして用いてもよい。かかるブレンド可能な樹脂には特に制限はないが、その具体例としては、ナイロン6,ナイロン66,ナイロン610、ナイロン11、ナイロン12、芳香族系ナイロンなどのポリアミド、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリシクロヘキシルジメチレンテレフタレート、ポリナフタレンテレフタレートなどのポリエステル樹脂、ポリエチレン、ポリプロピレン、ポリテトラフルオロエチレン、カルボキシル基やカルボン酸エステル基や酸無水物基やエポキシ基などの官能基を有するオレフィン系コポリマー、ポリオレフィン系エラストマー、ポリエーテルエステルエラストマー、ポリエーテルアミドエラストマー、ポリアセタール、ポリイミド、ポリケトン樹脂、液晶ポリマー、ポリエーテルケトン樹脂、ポリチオエーテルケトン樹脂、ポリエーテルエーテルケトン樹脂、四フッ化ポリエチレン樹脂、エポキシ基含有ポリオレフィン共重合体、ポリスチレン、シンジオタックチックポリスチレンなどが挙げられる。 The polyarylene sulfide resin composition of the present invention may further be blended with other resins as long as the effects of the present invention are not impaired. The blendable resin is not particularly limited, and specific examples thereof include nylon 6, nylon 66, nylon 610, nylon 11, nylon 12, polyamide such as aromatic nylon, polyethylene terephthalate, polybutylene terephthalate, poly Polyester resins such as cyclohexyldimethylene terephthalate and polynaphthalene terephthalate, polyethylene, polypropylene, polytetrafluoroethylene, olefin copolymers having functional groups such as carboxyl groups, carboxylic ester groups, acid anhydride groups, and epoxy groups, polyolefin elastomers , Polyetherester elastomer, polyetheramide elastomer, polyacetal, polyimide, polyketone resin, liquid crystal polymer, polyetherketone resin, poly Oh ether ketone resin, polyether ether ketone resins, polyethylene tetrafluoride resins, epoxy group-containing polyolefin copolymer, polystyrene, etc. Shinji O tack tick polystyrene.
但し、本発明の効果を十分に発現させるためには、本発明のポリアリーレンサルファイド樹脂組成物を構成する樹脂成分の内、70質量%以上が(α)ポリアリーレンサルファイド樹脂であることが好ましい。さらに、本発明のPPS樹脂組成物には、本発明の効果を損なわない範囲において、機械的強度、靱性などの向上を目的に、エポキシ基、アミノ基、イソシアネート基、水酸基、メルカプト基およびウレイド基の中から選ばれた少なくとも1種の官能基を有するシラン化合物を添加してもよい。かかる化合物の具体例としては、γ−グリシドキシプロピルトリメトキシシラン、γ−グリシドキシプロピルトリエトキシシシラン、β−(3,4−エポキシシクロヘキシル)エチルトリメトキシシランなどのエポキシ基含有アルコキシシラン化合物、γ−メルカプトプロピルトリメトキシシラン、γ−メルカプトプロピルトリエトキシシランなどのメルカプト基含有アルコキシシラン化合物、γ−ウレイドプロピルトリエトキシシラン、γ−ウレイドプロピルトリメトキシシシラン、γ−(2−ウレイドエチル)アミノプロピルトリメトキシシランなどのウレイド基含有アルコキシシラン化合物、γ−イソシアナトプロピルトリエトキシシラン、γ−イソシアナトプロピルトリメトキシシラン、γ−イソシアナトプロピルメチルジメトキシシラン、γ−イソシアナトプロピルメチルジエトキシシラン、γ−イソシアナトプロピルエチルジメトキシシラン、γ−イソシアナトプロピルエチルジエトキシシラン、γ−イソシアナトプロピルトリクロロシランなどのイソシアナト基含有アルコキシシラン化合物、γ−(2−アミノエチル)アミノプロピルメチルジメトキシシラン、γ−(2−アミノエチル)アミノプロピルトリメトキシシラン、γ−アミノプロピルトリメトキシシランなどのアミノ基含有アルコキシシラン化合物、およびγ−ヒドロキシプロピルトリメトキシシラン、γ−ヒドロキシプロピルトリエトキシシランなどの水酸基含有アルコキシシラン化合物などが挙げられる。なかでもエポキシ基、アミノ基、イソシアネート基、水酸基を有するアルコキシシランが優れたウェルド強度を得る上で特に好適である。 However, in order to sufficiently exhibit the effects of the present invention, it is preferable that 70% by mass or more of the resin component constituting the polyarylene sulfide resin composition of the present invention is (α) polyarylene sulfide resin. Furthermore, the PPS resin composition of the present invention has an epoxy group, an amino group, an isocyanate group, a hydroxyl group, a mercapto group, and a ureido group for the purpose of improving mechanical strength, toughness and the like within a range not impairing the effects of the present invention. A silane compound having at least one functional group selected from among them may be added. Specific examples of such compounds include epoxy group-containing alkoxysilanes such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, and β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane. Compounds, mercapto group-containing alkoxysilane compounds such as γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-ureidopropyltriethoxysilane, γ-ureidopropyltrimethoxysilane, γ- (2-ureidoethyl) ) Ureido group-containing alkoxysilane compounds such as aminopropyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, γ-isocyanatopropyltrimethoxysilane, γ-isocyanatopropylmethyldimethoxysilane, Isocyanato group-containing alkoxysilane compounds such as γ-isocyanatopropylmethyldiethoxysilane, γ-isocyanatopropylethyldimethoxysilane, γ-isocyanatopropylethyldiethoxysilane, γ-isocyanatopropyltrichlorosilane, γ- (2- Amino group-containing alkoxysilane compounds such as aminoethyl) aminopropylmethyldimethoxysilane, γ- (2-aminoethyl) aminopropyltrimethoxysilane, γ-aminopropyltrimethoxysilane, and γ-hydroxypropyltrimethoxysilane, γ- Examples thereof include a hydroxyl group-containing alkoxysilane compound such as hydroxypropyltriethoxysilane. Among these, an alkoxysilane having an epoxy group, an amino group, an isocyanate group, or a hydroxyl group is particularly suitable for obtaining an excellent weld strength.
かかるシラン化合物の好適な添加量は、ポリフェニレンスルフィド樹脂100質量部に対し、0.05〜3質量部の範囲が選択される。 A suitable addition amount of the silane compound is selected in a range of 0.05 to 3 parts by mass with respect to 100 parts by mass of the polyphenylene sulfide resin.
なお、本発明のポリアリーレンサルファイド樹脂組成物には、本発明の効果を損なわない範囲で他の成分、例えば酸化防止剤や耐熱安定剤(ヒンダードフェノール系、ヒドロキノン系、ホスファイト系およびこれらの置換体等)、耐候剤(レゾルシノール系、サリシレート系、ベンゾトリアゾール系、ベンゾフェノン系、ヒンダードアミン系等)、離型剤及び滑剤(モンタン酸及びその金属塩、そのエステル、そのハーフエステル、ステアリルアルコール、ステアラミド、各種ビスアミド、ビス尿素及びポリエチレンワックス等)、顔料(硫化カドミウム、フタロシアニン、着色用カーボンブラック等)、染料(ニグロシン等)、結晶核剤(タルク、シリカ、カオリン、クレー等)、可塑剤(p−オキシ安息香酸オクチル、N−ブチルベンゼンスルホンアミド等)、帯電防止剤(アルキルサルフェート型アニオン系帯電防止剤、4級アンモニウム塩型カチオン系帯電防止剤、ポリオキシエチレンソルビタンモノステアレートのような非イオン系帯電防止剤、ベタイン系両性帯電防止剤等)、難燃剤(例えば、赤燐、燐酸エステル、メラミンシアヌレート、水酸化マグネシウム、水酸化アルミニウム等の水酸化物、ポリリン酸アンモニウム、臭素化ポリスチレン、臭素化ポリフェニレンエーテル、臭素化ポリカーボネート、臭素化エポキシ樹脂あるいはこれらの臭素系難燃剤と三酸化アンチモンとの組み合わせ等)、熱安定剤、ステアリン酸カルシウム、ステアリン酸アルミニウム、ステアリン酸リチウムなどの滑剤、紫外線防止剤、着色剤、難燃剤および発泡剤などの通常の添加剤を添加することができる。 In the polyarylene sulfide resin composition of the present invention, other components such as antioxidants and heat stabilizers (hindered phenol-based, hydroquinone-based, phosphite-based, and these) can be used as long as the effects of the present invention are not impaired. Substitutes, etc.), weathering agents (resorcinol, salicylate, benzotriazole, benzophenone, hindered amine, etc.), release agents and lubricants (montanic acid and its metal salts, esters, half esters, stearyl alcohol, stearamide) , Various bisamides, bisureas, polyethylene waxes, etc.), pigments (cadmium sulfide, phthalocyanine, carbon black for coloring, etc.), dyes (eg nigrosine), crystal nucleating agents (talc, silica, kaolin, clays, etc.), plasticizers (p -Octyl oxybenzoate, N-butylbenze Sulfonamides, etc.), antistatic agents (alkyl sulfate type anionic antistatic agents, quaternary ammonium salt type cationic antistatic agents, nonionic antistatic agents such as polyoxyethylene sorbitan monostearate, betaine amphoteric charging Inhibitors), flame retardants (eg, red phosphorus, phosphate esters, melamine cyanurate, magnesium hydroxide, aluminum hydroxide and other hydroxides, ammonium polyphosphate, brominated polystyrene, brominated polyphenylene ether, brominated polycarbonate, Brominated epoxy resins or combinations of these brominated flame retardants and antimony trioxide), heat stabilizers, lubricants such as calcium stearate, aluminum stearate, lithium stearate, UV inhibitors, colorants, flame retardants and foaming Normal additives such as agents It can be added.
本発明のポリアリーレンサルファイド樹脂組成物の調製方法には特に制限はないが、各原料を単軸あるいは2軸の押出機、バンバリーミキサー、ニーダーおよびミキシングロールなど通常公知の溶融混合機に供給して、280〜380 ℃の温度で混練する方法などを代表例として挙げることができる。原料の混合順序にも特に制限はなく、全ての原材料を配合後上記の方法により溶融混練する方法、一部の原材料を配合後上記の方法により溶融混練し、さらに残りの原材料を配合し溶融混練する方法、あるいは一部の原材料を配合後単軸あるいは2軸の押出機により溶融混練中にサイドフィーダーを用いて残りの原材料を混合する方法などのいずれの方法を用いてもよい。また、少量添加剤成分については、他の成分を上記の方法などで混練しペレット化した後、成形前に添加して成形に供することももちろん可能である。 The method for preparing the polyarylene sulfide resin composition of the present invention is not particularly limited, but each raw material is supplied to a generally known melt mixer such as a single or twin screw extruder, a Banbury mixer, a kneader and a mixing roll. As a representative example, a method of kneading at a temperature of 280 to 380 ° C. can be given. There are no particular restrictions on the mixing order of the raw materials, a method in which all raw materials are blended and melt kneaded by the above method, a part of the raw materials are melted and kneaded by the above method, and the remaining raw materials are further blended and melt kneaded. Any method may be used, such as a method of mixing a part of raw materials or a method of mixing the remaining raw materials using a side feeder during melt kneading by a single-screw or twin-screw extruder after compounding. As for the small amount additive component, other components may be kneaded and pelletized by the above-described method and then added before molding and used for molding.
中でも、本発明のポリアリーレンサルファイド樹脂組成物の調製方法としては、2軸の押出機により溶融混練する方法を好適な方法として挙げられる。かかる2軸の押出機により溶融混練する際、そのスクリュー回転数を200〜400rpmに制御することが好ましく、230〜350rpmに制御することがより好ましい。 Among them, a preferable method for preparing the polyarylene sulfide resin composition of the present invention is a method of melt-kneading with a twin-screw extruder. When melt-kneading with such a twin-screw extruder, the screw rotation speed is preferably controlled to 200 to 400 rpm, more preferably 230 to 350 rpm.
通常、単位時間当たりの吐出量を上げ、生産性を上げる観点からは、押出機のトルク容量が許す限り、スクリュー回転数を高めにする方法が採用される。しかしながら、本発明の樹脂組成物は多量の充填材を含むため、スクリュー回転数を上げすぎると、剪断発熱により樹脂の分解が助長される。本発明のポリアリーレンサルファイド樹脂組成物を、2軸の押出機により溶融混練する方法にて調整する際、そのスクリュー回転数を400rpm以下、好ましくは350rpm未満に制御することがより好ましい。但し、スクリュー回転数を200rpm未満にしても、剪断発熱により樹脂の分解抑制効果は小さく、生産性との兼ね合いから200rpm以上にすることが好ましい。 Usually, from the viewpoint of increasing the discharge amount per unit time and increasing the productivity, a method of increasing the screw rotation speed is adopted as long as the torque capacity of the extruder allows. However, since the resin composition of the present invention contains a large amount of filler, when the screw rotation speed is increased too much, decomposition of the resin is promoted by shearing heat generation. When adjusting the polyarylene sulfide resin composition of the present invention by a method of melt kneading with a biaxial extruder, it is more preferable to control the screw rotation speed to 400 rpm or less, preferably less than 350 rpm. However, even if the screw rotation speed is less than 200 rpm, the effect of suppressing the decomposition of the resin due to shearing heat generation is small, and it is preferable to set it to 200 rpm or more in consideration of productivity.
このようにして得られる本発明のポリアリーレンサルファイド樹脂組成物は、射出成形、押出成形、ブロー成形、トランスファー成形など各種成形に供することが可能であるが、特に射出成形用途に適している。 The polyarylene sulfide resin composition of the present invention thus obtained can be used for various moldings such as injection molding, extrusion molding, blow molding and transfer molding, and is particularly suitable for injection molding applications.
以上のようにして得られた本発明のポリアリーレンサルファイド樹脂組成物を溶融成形して得られる成形体(以下、本発明の成形品と略す)は、塩素原子含有量が少なく、溶融流動性に優れた、かつ繰り返し成形時の寸法安定性、とくに成形品を薄肉化した際の低そり性に優れ、さらに耐湿熱性にも優れる。
このため本発明のポリアリーレンサルファイド樹脂組成物は、例えばセンサー、LEDランプ、コネクター、コネクター構成部品、コンデンサー構成部品ソケット、抵抗器、リレーケース、スイッチ、コイルボビン、コンデンサー、バリコンケース、発振子、各種端子板、変成器、プラグ、プリント基板、チューナー、スピーカー、マイクロフォン、ヘッドフォン、小型モーター、磁気ヘッドベース、半導体、液晶、FDDキャリッジ、FDDシャーシ、モーターブラッシュホルダー、パラボラアンテナ、コンピューター関連部品などに代表される電気・電子部品;VTR部品、テレビ部品、アイロン、ヘアードライヤー、炊飯器部品、電子レンジ部品、音響部品、オーディオ・レーザディスク・コンパクトディスクなどの音声機器部品、光ピックアップ部品、再生及び記録両用の光ピックアップ部品、照明部品、冷蔵庫部品、エアコン部品、タイプライター部品、ワードプロセッサー部品などに代表される家庭、事務電気製品部品;オフィスコンピューター関連部品、電話器関連部品、ファクシミリ関連部品、複写機関連部品、洗浄用治具、モーター部品、ライター、タイプライターなどに代表される機械関連部品:顕微鏡、双眼鏡、カメラ、時計などに代表される光学機器、精密機械関連部品;水道蛇口コマ、混合水栓、ポンプ部品、パイプジョイント、水量調節弁、逃がし弁、湯温センサー、水量センサー、水道メーターハウジングなどの水廻り部品;バルブオルタネーターターミナル、オルタネーターコネクター,ICレギュレーター、ライトディヤー用ポテンシオメーターベース、排気ガスバルブなどの各種バルブ、燃料関係・排気系・吸気系各種パイプ、エアーインテークノズルスノーケル、インテークマニホールド、燃料ポンプ、エンジン冷却水ジョイント、キャブレターメインボディー、キャブレタースペーサー、排気ガスセンサー、冷却水センサー、油温センサー、スロットルポジションセンサー、クランクシャフトポジションセンサー、エアーフローメーター、ブレーキパッド摩耗センサー、エアコン用サーモスタットベース、暖房温風フローコントロールバルブ、ラジエーターモーター用ブラッシュホルダー、ウォーターポンプインペラー、タービンベイン、ワイパーモーター関係部品、デュストリビューター、スタータースイッチ、スターターリレー、トランスミッション用ワイヤーハーネス、ウィンドウォッシャーノズル、エアコンパネルスイッチ基板、燃料関係電磁気弁用コイル、ヒューズ用コネクター、ホーンターミナル、電装部品絶縁板、ステップモーターローター、ランプソケット、ランプリフレクター、ランプハウジング、ブレーキピストン、ソレノイドボビン、エンジンオイルフィルター、点火装置ケース、車速センサー、ケーブルライナーなどの自動車・車両関連部品など各種用途に用いることができる。
A molded product obtained by melt-molding the polyarylene sulfide resin composition of the present invention obtained as described above (hereinafter, abbreviated as the molded product of the present invention) has a low chlorine atom content and has high melt fluidity. Excellent dimensional stability during repeated molding, especially low warpage when the molded product is thinned, and also excellent in heat and moisture resistance.
Therefore, the polyarylene sulfide resin composition of the present invention includes, for example, a sensor, an LED lamp, a connector, a connector component, a capacitor component socket, a resistor, a relay case, a switch, a coil bobbin, a capacitor, a variable capacitor case, an oscillator, and various terminals. Board, transformer, plug, printed circuit board, tuner, speaker, microphone, headphones, small motor, magnetic head base, semiconductor, liquid crystal, FDD carriage, FDD chassis, motor brush holder, parabolic antenna, computer related parts Electrical / electronic parts: VTR parts, TV parts, irons, hair dryers, rice cooker parts, microwave oven parts, acoustic parts, audio equipment parts such as audio / laser disks / compact disks, light Houses, office electrical product parts, office computer parts, telephone equipment parts, facsimiles, such as backup parts, optical pickup parts for both reproduction and recording, lighting parts, refrigerator parts, air conditioner parts, typewriter parts, word processor parts, etc. Machine-related parts represented by related parts, copier-related parts, cleaning jigs, motor parts, lighters, typewriters, etc .: Optical equipment represented by microscopes, binoculars, cameras, watches, precision machine-related parts; Faucet piece, mixing faucet, pump parts, pipe joint, water volume control valve, relief valve, hot water temperature sensor, water volume sensor, water meter housing and other water-related parts; valve alternator terminal, alternator connector, IC regulator, for light dial Potentiometer Various valves such as base, exhaust gas valve, fuel-related / exhaust system / intake system pipes, air intake nozzle snorkel, intake manifold, fuel pump, engine coolant joint, carburetor main body, carburetor spacer, exhaust gas sensor, coolant sensor , Oil temperature sensor, throttle position sensor, crankshaft position sensor, air flow meter, brake pad wear sensor, thermostat base for air conditioner, heating hot air flow control valve, brush holder for radiator motor, water pump impeller, turbine vane, wiper motor Related parts, distributor, starter switch, starter relay, transmission wire harness, c Wind washer nozzle, air conditioner panel switch board, fuel-related electromagnetic valve coil, fuse connector, horn terminal, electrical component insulation plate, step motor rotor, lamp socket, lamp reflector, lamp housing, brake piston, solenoid bobbin, engine oil It can be used for various applications such as automobiles and vehicle-related parts such as filters, ignition device cases, vehicle speed sensors, and cable liners.
以下、実施例を示し、本発明をさらに具体的に説明するが、本発明はこれら実施例の記載に限定されるものではない。 EXAMPLES Hereinafter, although an Example is shown and this invention is demonstrated further more concretely, this invention is not limited to description of these Examples.
〔溶融粘度〕
フローテスター(島津製作所製高化式フローテスター「CFT−500D型」)を用いて、温度300 ℃、荷重1.96MPa、オリフィス長とオリフィス径との、前者/後者の比が10/1であるオリフィスを使用して6分間保持後の溶融粘度を測定した。
[Melt viscosity]
Using a flow tester (Shimadzu Corporation Koka-type flow tester “CFT-500D type”), the temperature / 300 ° C., the load 1.96 MPa, the orifice length / orifice diameter ratio is 10/1. The melt viscosity after holding for 6 minutes was measured using an orifice.
〔曲げ強度〕
ISO 178に準じて測定を行った。具体的には次のように測定を行った。ISOタイプA金型を用いて射出成形を行い、試験片を得た。試験片の中央部分幅10mm×長さ80mm×厚さ4mmの試験片を切り出し、23 ℃、相対湿度50%の雰囲気下、スパン64mm、歪み速度5mm/minの条件で測定を行った。
[Bending strength]
Measurements were performed according to ISO 178. Specifically, the measurement was performed as follows. Test pieces were obtained by injection molding using an ISO type A mold. A test piece having a central part width of 10 mm, a length of 80 mm and a thickness of 4 mm was cut out and measured under conditions of a span of 64 mm and a strain rate of 5 mm / min in an atmosphere of 23 ° C. and a relative humidity of 50%.
〔スパイラルフロー長〕
1.6mm厚みのスパイラルフロー金型を用い、シリンダー温度330 ℃、金型温度150 ℃、射出速度60mm/secで成形したときの流動長を測定した。
[Spiral flow length]
Using a 1.6 mm thick spiral flow mold, the flow length was measured when molding was performed at a cylinder temperature of 330 ° C., a mold temperature of 150 ° C., and an injection speed of 60 mm / sec.
〔含有塩素原子量〕
ダイアインスツルメンツ燃焼ガス吸収装置でポリマーを燃焼させ発生したガスを純水に吸収させ、吸収液中の塩素イオンをダイオネクスイオンクロマトグラフで定量して換算した。
[Amount of chlorine atom contained]
The gas generated by burning the polymer with a Dia Instruments combustion gas absorption device was absorbed into pure water, and the chlorine ions in the absorption solution were quantified and converted by a Dionex ion chromatograph.
〔低そり性〕
ISO タイプD1金型(1mm厚み、幅60mm×長さ60mmのフィルムゲート金型)を用いて射出成形を行った。成形後、デシケーター中に無荷重状態で成形品を24時間放置した。水平机上に上向きに反る向きに成形品を置き、ゲート側2頂点を机上に固定したとき、机上から最も離れた頂点と机の距離を測定した。
[Low warpage]
Injection molding was performed using an ISO type D1 mold (film gate mold having a thickness of 1 mm, a width of 60 mm and a length of 60 mm). After molding, the molded product was left in a desiccator under no load for 24 hours. When the molded product was placed on a horizontal desk in an upward direction and the two vertexes on the gate side were fixed on the desk, the distance between the vertex farthest from the desk and the desk was measured.
〔合成例1〕
温度センサー、冷却塔、滴下槽、滴下ポンプを連結した攪拌翼付チタンライニングステンレス製4リットルオートクレーブに、48%水流化ナトリウム(以下NaSH・3.4H2Oと略す)586.0g(5.0モル)、48%水酸化ナトリウム416g(5.0モル)及びN−メチルピロリドン(以下NMPと略)1586g(16モル)を室温で仕込み、攪拌しながら窒素雰囲気下で205 ℃まで昇温して、水522.0gを留出させた。その後、反応系を密閉し、更に220 ℃まで昇温し、NaSHに対し0.2モル%のチオフェノール1.10g(0.010モル)、p−ジクロルベンゼン(以下p−DCBと略す)735.0g(5.0モル)及びNMP396g(4モル)の混合液を1時間で滴下し、220 ℃で6時間攪拌した後、250 ℃まで昇温し、1時間攪拌した。ここで、チオフェノールは、p−ジクロルベンゼンの反応率が0%の時点で添加している。
[Synthesis Example 1]
In a 4 liter autoclave made of titanium-lined stainless steel with stirring blades connected to a temperature sensor, cooling tower, dropping tank, and dropping pump, 586.0 g of sodium hydrofluoride (hereinafter abbreviated as NaSH · 3.4H 2 O) 586.0 g (5.0 Mol), 416 g (5.0 mol) of 48% sodium hydroxide and 1586 g (16 mol) of N-methylpyrrolidone (hereinafter abbreviated as NMP) at room temperature, and heated to 205 ° C. in a nitrogen atmosphere while stirring. , 522.0 g of water was distilled off. Thereafter, the reaction system was sealed, and the temperature was further raised to 220 ° C., and 1.10 g (0.010 mol) of 0.2 mol% of thiophenol with respect to NaSH, p-dichlorobenzene (hereinafter abbreviated as p-DCB). A mixed solution of 735.0 g (5.0 mol) and NMP 396 g (4 mol) was added dropwise over 1 hour, and the mixture was stirred at 220 ° C. for 6 hours, then heated to 250 ° C. and stirred for 1 hour. Here, thiophenol is added when the reaction rate of p-dichlorobenzene is 0%.
反応終了後、冷却して反応スラリーを得た。得られたスラリーに20リットルの水を加えて80 ℃で1時間攪拌した後、濾過した。
得られたケーキを5リットルの水に再分散させ、80 ℃で1時間攪拌した後、濾過した。この操作を3回繰り返して得られたケーキを熱風乾燥機内で120 ℃で一晩乾燥して白色の粉末状のPASを515g(収率95%)得た。溶融粘度は37Pa・Sであった。PAS中の塩素原子含有量は、1800ppmであった。以下、得られたPASをPAS(A1)と記す。
After completion of the reaction, the reaction mixture was cooled to obtain a reaction slurry. 20 liters of water was added to the resulting slurry, stirred at 80 ° C. for 1 hour, and then filtered.
The obtained cake was redispersed in 5 liters of water, stirred at 80 ° C. for 1 hour, and then filtered. The cake obtained by repeating this operation three times was dried overnight at 120 ° C. in a hot air dryer to obtain 515 g (yield 95%) of white powdery PAS. The melt viscosity was 37 Pa · S. The chlorine atom content in PAS was 1800 ppm. Hereinafter, the obtained PAS is referred to as PAS (A1).
〔合成例2〕
p−DCB及びNMPの混合液を1時間で滴下した直後にNaSHに対し0.5モル%のチオフェノール2.75g(0.025モル)を添加した事以外は、実施例1と同じ操作を行った。チオフェノールを添加した時のp−DCBの反応率は25%であった。得られたPASの溶融粘度は28Pa・Sであった。PASの塩素原子含有量は、1900ppmであった。以下、得られたPASをPAS(A2)と記す。
[Synthesis Example 2]
The same operation as in Example 1 was performed except that 2.75 g (0.025 mol) of 0.5 mol% of thiophenol was added to NaSH immediately after dropwise addition of the mixed solution of p-DCB and NMP in 1 hour. went. The reaction rate of p-DCB when thiophenol was added was 25%. The melt viscosity of the obtained PAS was 28 Pa · S. The chlorine atom content of PAS was 1900 ppm. Hereinafter, the obtained PAS is referred to as PAS (A2).
〔合成例3〕
NaSHに対し1.0モル%のチオフェノール5.50g(0.050モル)を添加し、220 ℃で6時間攪拌した後、250 ℃まで昇温し、3時間攪拌とした以外は、実施例1と同じ操作を行った。得られたPASの溶融粘度は10Pa・Sであった。PASの塩素原子含有量は、1200ppmであった。以下、得られたPASをPAS(A3)と記す。
[Synthesis Example 3]
Except that 5.50 g (0.050 mol) of 1.0 mol% of thiophenol was added to NaSH and stirred for 6 hours at 220 ° C., then the temperature was raised to 250 ° C. and stirred for 3 hours. The same operation as 1 was performed. The melt viscosity of the obtained PAS was 10 Pa · S. The chlorine atom content of PAS was 1200 ppm. Hereinafter, the obtained PAS is referred to as PAS (A3).
〔比較合成例1〕
特開2010−53356号公報の合成例1に従ってPASを製造した。すなわち、撹拌機付きの70リットルオートクレーブに、47.5%水硫化ナトリウム8267.37g(70.00モル)、96%水酸化ナトリウム2957.21g(70.97モル)、N−メチル−2−ピロリドン(NMP)11434.50g(115.50モル)、酢酸ナトリウム1722.00g(21.00モル)、及びイオン交換水10500gを仕込み、常圧で窒素を通じながら245 ℃まで約3時間かけて徐々に加熱し、水14780.1gおよびNMP280gを留出した後、反応容器を160 ℃に冷却した。仕込みアルカリ金属硫化物1モル当たりの系内残存水分量は、NMPの加水分解に消費された水分を含めて1.06モルであった。また、硫化水素の飛散量は、仕込みアルカリ金属硫化物1モル当たり0.02モルであった。
[Comparative Synthesis Example 1]
PAS was produced according to Synthesis Example 1 of JP 2010-53356. That is, in a 70 liter autoclave equipped with a stirrer, 8267.37 g (70.00 mol) of 47.5% sodium hydrosulfide, 2957.21 g (70.97 mol) of 96% sodium hydroxide, N-methyl-2-pyrrolidone (NMP) 11434.50 g (115.50 mol), sodium acetate 1722.00 g (21.00 mol), and ion-exchanged water 10500 g were charged and gradually heated to 245 ° C. over about 3 hours through nitrogen at normal pressure. After distilling 14780.1 g of water and 280 g of NMP, the reaction vessel was cooled to 160 ° C. The residual water content in the system per 1 mol of the charged alkali metal sulfide was 1.06 mol including the water consumed for the hydrolysis of NMP. The amount of hydrogen sulfide scattered was 0.02 mol per mol of the charged alkali metal sulfide.
次に、p−ジクロロベンゼン10235.46g(69.63モル)、NMP9009.00g(91.00モル)を加え、反応容器を窒素ガス下に密封し、240rpmで撹拌しながら、0.6 ℃/分の速度で238 ℃まで昇温した。238 ℃で95分反応を行った後、0.8 ℃/分の速度で270 ℃まで昇温した。270 ℃で100分反応を行った後、1260g(70モル)の水を15分かけて圧入しながら250 ℃まで1.3 ℃/分の速度で冷却した。その後200 ℃まで1.0 ℃/分の速度で冷却してから、室温近傍まで急冷した。 Next, 10235.46 g (69.63 mol) of p-dichlorobenzene and 900.00 g (91.00 mol) of NMP were added, the reaction vessel was sealed under nitrogen gas, and stirred at 240 rpm while stirring at 0.6 ° C. / The temperature was raised to 238 ° C. at a rate of minutes. After reacting at 238 ° C. for 95 minutes, the temperature was raised to 270 ° C. at a rate of 0.8 ° C./min. After reacting at 270 ° C. for 100 minutes, 1260 g (70 mol) of water was injected over 15 minutes and cooled to 250 ° C. at a rate of 1.3 ° C./minute. Thereafter, it was cooled to 200 ° C. at a rate of 1.0 ° C./min, and then rapidly cooled to near room temperature.
内容物を取り出し、26300gのNMPで希釈後、溶剤と固形物をふるい(80mesh)で濾別し、得られた粒子を31900gのNMPで洗浄、濾別した。これを、56000gのイオン交換水で数回洗浄、濾別した後、0.05重量%酢酸水溶液70000gで洗浄、濾別した。70000gのイオン交換水で洗浄、濾別した後、得られた含水PPS粒子を80 ℃で熱風乾燥し、120 ℃で減圧乾燥した。得られたPPSは直鎖状であり、溶融粘度が100Pa・s、塩素原子含有量1300ppmであった。以下、得られたPASをPAS(A4)と記す。 The contents were taken out, diluted with 26300 g of NMP, the solvent and solid matter were filtered off with a sieve (80 mesh), and the resulting particles were washed with 31900 g of NMP and filtered off. This was washed several times with 56000 g of ion-exchanged water and filtered, then washed with 70000 g of 0.05 wt% aqueous acetic acid and filtered. After washing with 70000 g of ion-exchanged water and filtering, the resulting hydrous PPS particles were dried with hot air at 80 ° C. and dried under reduced pressure at 120 ° C. The obtained PPS was linear, had a melt viscosity of 100 Pa · s and a chlorine atom content of 1300 ppm. Hereinafter, the obtained PAS is referred to as PAS (A4).
〔比較合成例2〕
特許文献1(特開2010−53356号公報)の合成例3に従ってPASを製造した。東レ株式会社製M3910を熱風オーブン中210 ℃×1時間処理した。得られたPPSは架橋型であり、溶融粘度が15Pa・s、塩素原子含有量3000ppmであった。以下、得られたPASをPAS(A5)と記す。
[Comparative Synthesis Example 2]
PAS was produced according to Synthesis Example 3 of Patent Document 1 (Japanese Patent Laid-Open No. 2010-53356). M3910 manufactured by Toray Industries, Inc. was treated in a hot air oven at 210 ° C. for 1 hour. The obtained PPS was a crosslinking type, and had a melt viscosity of 15 Pa · s and a chlorine atom content of 3000 ppm. Hereinafter, the obtained PAS is referred to as PAS (A5).
実施例1〜5/比較例1〜3
表に示す割合で各成分をドライブレンドした後、東芝機械株式会社製TEM−35B2軸押出機を用い、スクリュー回転数250rpm、シリンダー設定温度が320 ℃で溶融混練し、ストランドカッターによりペレット化した。140 ℃で3時間乾燥したペレットを用い、成形、評価に供した。
Examples 1-5 / Comparative Examples 1-3
Each component was dry blended at the ratio shown in the table, and then melt-kneaded at a screw rotation speed of 250 rpm and a cylinder set temperature of 320 ° C. using a TEM-35B twin screw extruder manufactured by Toshiba Machine Co., Ltd., and pelletized with a strand cutter. The pellets dried for 3 hours at 140 ° C. were used for molding and evaluation.
第1〜2表中、成分(A)〜(D)のかっこ内数値の各数値は質量部を表し、各略称は以下の通りである。
非繊維状フィラー(B1):炭酸カルシウム 丸尾カルシウム社製「炭酸カルシウム1級」
ガラス繊維(C1):ガラス繊維チョップドストランド(繊維長3mm、平均繊維直径10μm)
非晶性樹脂(D1): 三菱エンジニアリングプラスチックス社製ポリフェニレンエーテル「PX−100L」
In Tables 1 and 2, numerical values in parentheses of components (A) to (D) represent parts by mass, and abbreviations are as follows.
Non-fibrous filler (B1): Calcium carbonate “Calcium carbonate grade 1” manufactured by Maruo Calcium
Glass fiber (C1): Glass fiber chopped strand (fiber length 3 mm, average fiber diameter 10 μm)
Amorphous resin (D1): Mitsubishi Engineering Plastics polyphenylene ether “PX-100L”
Claims (6)
前記(α)ポリアリーレンサルファイド樹脂は、溶融粘度(320℃、剪断速度1000/s)が100〔Pa・s〕未満の範囲かつ塩素原子含有量が2000ppm以下の範囲であり、前記(β)非繊維状充填材と(γ)繊維状充填材の合計量が、前記ポリアリーレンサルファイド樹脂組成物中の樹脂成分100質量部に対し、100〜300質量部であり、さらに(β)非繊維状充填材の含有量が(γ)繊維状充填材の含有量以上で、かつポリアリーレンサルファイド樹脂組成物中の塩素原子含有量が900ppm以下の範囲であることを特徴とするポリアリーレンサルファイド樹脂組成物。 (Α) a polyarylene sulfide resin, (β) a non-fibrous filler, and (γ) a polyarylene sulfide resin composition obtained by melt-kneading a fibrous filler,
The (α) polyarylene sulfide resin has a melt viscosity (320 ° C., shear rate 1000 / s) in a range of less than 100 [Pa · s] and a chlorine atom content in a range of 2000 ppm or less. The total amount of the fibrous filler and (γ) fibrous filler is 100 to 300 parts by mass with respect to 100 parts by mass of the resin component in the polyarylene sulfide resin composition, and (β) non-fibrous filling A polyarylene sulfide resin composition, wherein the content of the material is not less than the content of (γ) fibrous filler and the chlorine atom content in the polyarylene sulfide resin composition is 900 ppm or less.
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WO2021143348A1 (en) * | 2020-01-16 | 2021-07-22 | 金发科技股份有限公司 | Pps composition and preparation method therefor |
JP2021147513A (en) * | 2020-03-19 | 2021-09-27 | 株式会社クレハ | Method for producing modified polyarylene sulfide |
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JP2021147513A (en) * | 2020-03-19 | 2021-09-27 | 株式会社クレハ | Method for producing modified polyarylene sulfide |
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