JP2013175623A5 - - Google Patents

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Publication number
JP2013175623A5
JP2013175623A5 JP2012039657A JP2012039657A JP2013175623A5 JP 2013175623 A5 JP2013175623 A5 JP 2013175623A5 JP 2012039657 A JP2012039657 A JP 2012039657A JP 2012039657 A JP2012039657 A JP 2012039657A JP 2013175623 A5 JP2013175623 A5 JP 2013175623A5
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JP
Japan
Prior art keywords
flexible substrate
light emitting
emitting module
substrate
connection member
Prior art date
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Application number
JP2012039657A
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Japanese (ja)
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JP2013175623A (en
JP5772657B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2012039657A priority Critical patent/JP5772657B2/en
Priority claimed from JP2012039657A external-priority patent/JP5772657B2/en
Priority to US13/777,852 priority patent/US9024514B2/en
Publication of JP2013175623A publication Critical patent/JP2013175623A/en
Publication of JP2013175623A5 publication Critical patent/JP2013175623A5/ja
Application granted granted Critical
Publication of JP5772657B2 publication Critical patent/JP5772657B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

＜第１の局面＞
第１の局面は、
基板と、
前記基板上に搭載された複数個のＬＥＤチップと、
前記ＬＥＤチップを封止する封止体と、
前記基板におけるＬＥＤチップと同一面上に配置形成され、前記ＬＥＤチップに接続された外部電極とを有するＬＥＤランプと、
電極部を有するフレキシブル基板と、
前記ＬＥＤランプおよび前記フレキシブル基板を挟持固定する接続部材と
を備えた発光モジュールであって、
前記外部電極に対して前記電極部が、前記フレキシブル基板に被着された前記接続部材により押圧され、前記外部電極と前記電極部とが直接的に接触して電気的に接続され、
前記接続部材における前記基板上から最も高い部分が、前記封止体における前記基板上から最も高い部分よりも低く形成された発光モジュールである。 <First aspect>
The first aspect is
A substrate,
A plurality of LED chips mounted on the substrate;
A sealing body for sealing the LED chip;
An LED lamp disposed on the same surface as the LED chip on the substrate and having an external electrode connected to the LED chip;
A flexible substrate having an electrode part;
A light emitting module comprising a connection member for sandwiching and fixing the LED lamp and the flexible substrate,
The electrode portion is pressed against the external electrode by the connecting member attached to the flexible substrate, and the external electrode and the electrode portion are in direct contact and electrically connected,
In the light emitting module, the highest part of the connecting member from above the substrate is formed lower than the highest part of the sealing body from above the substrate.

Claims (12)

基板と、
前記基板上に搭載された複数個のＬＥＤチップと、
前記ＬＥＤチップを封止する封止体と、
前記基板におけるＬＥＤチップと同一面上に配置形成され、前記ＬＥＤチップに接続された外部電極と
を有するＬＥＤランプと、
電極部を有するフレキシブル基板と、
前記ＬＥＤランプおよび前記フレキシブル基板を挟持固定する接続部材と
を備えた発光モジュールであって、
前記外部電極に対して前記電極部が、前記フレキシブル基板に被着された前記接続部材により押圧され、前記外部電極と前記電極部とが直接的に接触して電気的に接続され、
前記接続部材における前記基板上から最も高い部分が、前記封止体における前記基板上から最も高い部分よりも低く形成された発光モジュール。 A substrate,
A plurality of LED chips mounted on the substrate;
A sealing body for sealing the LED chip;
An LED lamp disposed on the same surface as the LED chip on the substrate and having an external electrode connected to the LED chip;
A flexible substrate having an electrode part;
A light emitting module comprising a connection member for sandwiching and fixing the LED lamp and the flexible substrate,
The electrode portion is pressed against the external electrode by the connecting member attached to the flexible substrate, and the external electrode and the electrode portion are in direct contact and electrically connected,
The light emitting module in which the highest part from the said board | substrate in the said connection member is formed lower than the highest part from the said board | substrate in the said sealing body. 前記接続部材の弾性力により、前記接続部材が前記フレキシブル基板における前記電極部の背面側を押圧し、その押圧力により前記電極部が前記外部電極の側に付勢される、請求項１に記載の発光モジュール。   The said connection member presses the back side of the said electrode part in the said flexible substrate with the elastic force of the said connection member, The said electrode part is urged | biased by the said external electrode side with the pressing force. Light emitting module. 前記接続部材から下向きに突出した凸部を備え、
前記凸部の先端部分が前記フレキシブル基板における前記電極部の背面側を押圧する、請求項１または請求項２に記載の発光モジュール。 A convex portion protruding downward from the connection member;
The light emitting module of Claim 1 or Claim 2 with which the front-end | tip part of the said convex part presses the back side of the said electrode part in the said flexible substrate. 前記接続部材と前記フレキシブル基板との間に挟設された押圧部材を備え、
前記接続部材は前記押圧部材を介して前記フレキシブル基板における前記電極部の背面側を押圧する、請求項１または請求項２に記載の発光モジュール。 A pressing member sandwiched between the connection member and the flexible substrate;
The light emitting module according to claim 1, wherein the connection member presses a back side of the electrode portion of the flexible substrate via the pressing member. 前記基板上にて前記複数個のＬＥＤチップを取り囲むように形成された封止枠を備え、
前記封止体は前記封止枠の内側に充填されて前記ＬＥＤチップを封止し、
前記保持接触端子における前記基板上から最も高い部分が、前記封止枠における前記基板上から最も高い部分よりも低く形成された、請求項１〜４のいずれか１項に記載の発光モジュール。 A sealing frame formed so as to surround the plurality of LED chips on the substrate;
The sealing body is filled inside the sealing frame to seal the LED chip,
5. The light emitting module according to claim 1, wherein a highest portion from above the substrate in the holding contact terminal is formed lower than a highest portion from above the substrate in the sealing frame. 前記ＬＥＤランプの外側にて、前記フレキシブル基板の端面は前記接続部材の端面と面一になっているか、または、前記フレキシブル基板の端面は前記接続部材の端面の内側に位置しており、前記接続部材から前記フレキシブル基板がはみ出ない、請求項１〜５のいずれか１項に記載の発光モジュール。   Outside the LED lamp, the end surface of the flexible substrate is flush with the end surface of the connection member, or the end surface of the flexible substrate is located inside the end surface of the connection member, and the connection The light emitting module according to claim 1, wherein the flexible substrate does not protrude from a member. 前記接続部材は金属の薄板材によって形成されている、請求項１〜６のいずれか１項に記載の発光モジュール。   The light emitting module according to claim 1, wherein the connection member is formed of a metal thin plate material. 前記基板における前記ＬＥＤチップが搭載されている面の反対面に面接触する放熱部材を備えた、請求項１〜７のいずれか１項に記載の発光モジュール。   The light emitting module of any one of Claims 1-7 provided with the thermal radiation member which surface-contacts the surface opposite to the surface in which the said LED chip is mounted in the said board | substrate. 前記フレキシブル基板の一部が前記ＬＥＤランプの前記封止体を除く部分を覆うように折り曲げられ、そのフレキシブル基板の折り曲げられた部分が前記放熱部材に当接する、請求項８に記載の発光モジュール。   The light emitting module according to claim 8, wherein a part of the flexible substrate is bent so as to cover a portion of the LED lamp excluding the sealing body, and the bent portion of the flexible substrate contacts the heat radiating member. 前記フレキシブル基板は、前記電極部と接続された配線パターンを備え、
前記配線パターンは、前記フレキシブル基板の折り曲げられた部分に配置形成され、
前記フレキシブル基板の折り曲げられた部分が前記放熱部材に面接触する、請求項９に記載の発光モジュール。 The flexible substrate includes a wiring pattern connected to the electrode portion,
The wiring pattern is arranged and formed in a bent portion of the flexible substrate,
The light emitting module according to claim 9, wherein the bent portion of the flexible substrate is in surface contact with the heat dissipation member. 前記電極部の表面にディンプル加工が施されて凹凸が形成された、請求項１〜１０のいずれか１項に記載の発光モジュール。   The light emitting module of any one of Claims 1-10 in which the dimple process was given to the surface of the said electrode part, and the unevenness | corrugation was formed. 前記フレキシブル基板はフレキシブルフラットケーブルである、請求項１〜１１のいずれか１項に記載の発光モジュール。
The light emitting module according to claim 1, wherein the flexible substrate is a flexible flat cable.
JP2012039657A 2012-02-27 2012-02-27 Light emitting module Expired - Fee Related JP5772657B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012039657A JP5772657B2 (en) 2012-02-27 2012-02-27 Light emitting module
US13/777,852 US9024514B2 (en) 2012-02-27 2013-02-26 Light-emitting module having connection member to press for direct electrical contact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012039657A JP5772657B2 (en) 2012-02-27 2012-02-27 Light emitting module

Publications (3)

Publication Number Publication Date
JP2013175623A JP2013175623A (en) 2013-09-05
JP2013175623A5 true JP2013175623A5 (en) 2014-04-17
JP5772657B2 JP5772657B2 (en) 2015-09-02

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6844994B2 (en) * 2016-11-25 2021-03-17 古河電気工業株式会社 Laser device and light source device
JP6844993B2 (en) * 2016-11-25 2021-03-17 古河電気工業株式会社 Laser device and light source device

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JPS61167574A (en) * 1985-01-21 1986-07-29 Nippon Telegr & Teleph Corp <Ntt> Thermal head and its manufacture
JPS6319885A (en) * 1986-07-11 1988-01-27 Matsushita Electric Ind Co Ltd Light-emitting diode supporting device
JPH0415496Y2 (en) * 1989-05-01 1992-04-07
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JP2006215276A (en) * 2005-02-03 2006-08-17 Yazaki Corp Optical connector
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