JP2013167825A - Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, method for manufacturing electronic device using the same, and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pattern forming method, an actinic ray-sensitive or radiation-sensitive resin composition, and a resist film, in which a pattern can be formed with high sensitivity, while suppressing pattern collapse or generation of outgas and preventing digging in a pattern lower part, in microprocessing such as for formation of a fine pattern in a semiconductor device, particularly, for formation of a negative pattern by development with an organic solvent, and to provide a method for manufacturing an electronic device and an electronic device using the above method and composition.SOLUTION: The pattern forming method includes the steps of: (1) forming a film by using an actinic ray-sensitive or radiation-sensitive resin composition comprising (A) resin in which the solubility for a developing solution including an organic solvent decreases by an action of an acid, (B) a compound expressed by a specific general formula (Z1) that generates an acid by irradiation with actinic rays or radiation, and (C) a solvent; (2)exposing the film by use of actinic rays or radiation; and (4) forming a negative pattern by developing the film after exposure by use of the developing solution containing an organic solvent. The present invention also discloses an actinic ray-sensitive or radiation-sensitive resin composition to be used for the above pattern forming method, a resist film formed by using the composition, and a method for manufacturing an electronic device and an electronic device using the above pattern forming method.

Description

  The present invention relates to a pattern formation method using a developer containing an organic solvent, an actinic ray-sensitive property, or a photoluminescence process, which is suitably used in an ultramicrolithography process such as the manufacture of VLSI and high-capacity microchips and other photofabrication processes. The present invention relates to a radiation-sensitive resin composition, a resist film, an electronic device manufacturing method using the same, and an electronic device. More specifically, a pattern forming method using a developer containing an organic solvent, an actinic ray-sensitive or radiation-sensitive resin composition, and a resist film, which can be suitably used for fine processing of semiconductor elements using actinic rays or radiation. And an electronic device manufacturing method and an electronic device using the same.

  Conventionally, in the manufacturing process of semiconductor devices such as IC and LSI, fine processing by lithography using a photoresist composition has been performed. In recent years, with the high integration of integrated circuits, the formation of ultrafine patterns in the submicron region and the quarter micron region has been required. Along with this, there is a tendency to shorten the exposure wavelength from g-line to i-line, and further to KrF excimer laser light. Furthermore, at present, in addition to excimer laser light, lithography using electron beams, X-rays, or EUV light is being developed.

  Higher sensitivity is a very important issue for shortening the wafer processing time. However, if higher sensitivity is pursued, the pattern shape and resolution represented by the limit resolution line width will decrease. Therefore, development of a resist composition that satisfies these characteristics simultaneously is strongly desired.

High sensitivity, high resolution, and good pattern shape are in a trade-off relationship, and it is very important how to satisfy this simultaneously.
In the actinic ray-sensitive or radiation-sensitive resin composition, generally, a resin that is hardly soluble or insoluble in an alkali developer is used, and a pattern is formed by solubilizing an exposed portion in an alkali developer by exposure to radiation. There are a “positive type” and a “negative type” in which a resin is soluble in an alkali developer and a pattern is formed by making the exposed portion insoluble or insoluble in an alkali developer by radiation exposure.
As such an actinic ray-sensitive or radiation-sensitive resin composition, a chemically amplified positive resist composition mainly utilizing an acid-catalyzed reaction has been studied from the viewpoint of high sensitivity, and is insoluble in an alkali developer as a main component. A chemically amplified positive resist composition comprising a phenolic resin (hereinafter abbreviated as a phenolic acid-decomposable resin) that is hardly soluble and soluble in an alkaline developer by the action of an acid, and an acid generator. Used effectively.
For example, Patent Document 1 discloses a sulfonium salt having a specific betaine structure as an acid generator for a chemically amplified positive resist composition from the viewpoint of achieving an improvement in exposure margin while having low sensitivity.

On the other hand, there is a demand for forming patterns having various shapes such as lines, trenches, holes, etc. in the manufacture of semiconductor elements and the like. In order to meet the demand for pattern formation having various shapes, not only positive type but also negative type actinic ray-sensitive or radiation-sensitive resin compositions have been developed.
In particular, in the formation of a fine pattern having a line width of 50 nm or less, further improvements in resolution and pattern shape are required.
In order to solve this problem, a method of developing an acid-decomposable resin using an organic developer other than an alkali developer has also been proposed (for example, see Patent Document 2).
However, in a fine region having a line width of 50 nm or less, it is required to form a pattern having a high sensitivity, a pattern collapse, a generation of outgas, and a shape that does not bite under the pattern.

JP 2011-16746 A JP 2010-217884 A

  It is an object of the present invention to provide high sensitivity, suppress pattern collapse, suppress outgassing, and suppress the occurrence of outgassing in fine processing such as formation of a fine pattern in a semiconductor element, particularly negative pattern formation by organic solvent development. An object of the present invention is to provide a pattern forming method, an actinic ray-sensitive or radiation-sensitive resin composition and a resist film that can form a pattern in which no bite occurs, and an electronic device manufacturing method and electronic device using these.

That is, the present invention is as follows.
[1]
(A) a resin whose solubility in a developer containing an organic solvent is reduced by the action of an acid, (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation represented by the following general formula (Z1), and (C ) A step of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition containing a solvent (1),
A pattern forming method comprising: a step (2) of exposing the film using actinic rays or radiation; and a step (4) of forming a negative pattern by developing with a developer containing an organic solvent after the exposure. .

In the general formula (Z1),
L ₁ represents —O—, —S—, —OS (═O) ₂ —, —S (═O) ₂ O—, —OC (═O) —, —C (═O) O—, —S ( _{= O) -, - S (} = O) 2 -, - C (= O) -, - N (R 7) C (= O) -, - C (= O) N (R 7) -, - N (R ₇ ) S (═O) ₂ — or —S (═O) ₂ N (R ₇ ) — (the right side is the R ₁ side), and R ₇ represents a hydrogen atom, an alkyl group or a cycloalkyl group. .
R ₁ represents an alkylene group, a cycloalkylene group, an arylene group or a divalent group formed by a combination thereof, in which —O—, —C (═O) —, —S (═O) ₂ — or -S- may be included.
A ₁ is _-SO ³ _{-, -SO} ² N - represents a _{(SO 2 R 9) 2 -} SO 2 R 8 or _-SO 2 ^C. R ₈ represents an alkyl group, a cycloalkyl group or an aryl group, R ₉ represents an alkyl group, a cycloalkyl group or an aryl group, and two R _{9 s} may be the same or different.
R ₂ and R ₃ each independently represents an alkyl group, an alkenyl group, a cycloalkyl group, an aryl group or a heterocyclic group.
R ₄ represents a monovalent substituent, and n ₁ represents an integer of 0 to 4. When n ₁ is 2 or more, the plurality of R ₄ may be the same or different.
Further, R ₂ and R ₃ , R ₂ and R ₄ , R ₃ and R ₄ , R ₂ and the benzene ring in the general formula (Z1), R ₃ and the benzene ring, and when n ₁ is 2 or more R ₄ may be connected to each other to form a ring.
[2]
The pattern formation method according to [1], wherein the compound (B) represented by the general formula (Z1) is a compound represented by the following general formula (Z2).

In the general formula (Z2),
_{L 1, R 1, A 1} , R 4, n 1 has the same meaning as _{L 1, R 1, A 1} , R 4, n 1 in the general formula (Z1).
R ₅ and R ₆ each independently represent a monovalent substituent, and n ₂ and n ₃ each independently represent an integer of 0 to 5.
A plurality of R ₄ when n ₁ is 2 or more, a plurality of R ₅ when n ₂ is 2 or more, and a plurality of R ₆ when n ₃ is 2 or more may be the same or different and are connected to each other To form a ring. R ₄ and R ₅ , R ₅ and R ₆ , and R ₄ and R ₆ may be connected to each other to form a ring. At that time, R ₄ , R ₅ and R ₆ may each be a single bond.
[3]
The pattern formation method according to [1] or [2], wherein A ₁ in the general formula (Z1) or (Z2) is —SO ₃ ^— .
[4]
In the benzene ring to which -L ₁ -R ₁ -A ₁ in the general formula (Z1) or (Z2) is bonded, the -L ₁ -R ₁ -A ₁ is substituted at the meta position or the ortho position with respect to S ⁺ . The pattern forming method according to any one of [1] to [3].
[5]
-L ₁ -R ₁ -A _{1 in the} general formula (Z1) or (Z2) is bonded to the benzene ring in the general formula (Z1) or (Z2) to which the -L ₁ -R ₁ -A ₁ is bonded. Regarding the benzene ring to be bonded, the -L ₁ -R ₁ -A ₁ is substituted in the para position with respect to S ⁺ , and L ₁ is -S-, -S (= O)-, -S (= O). _{2 -, - C (= O} ) -, - OS (= O) 2 -, - S (= O) 2 O -, - OC (= O) -, - C (= O) O -, - N ( R ₇ ) C (═O) —, —C (═O) N (R ₇ ) —, —N (R ₇ ) S (═O) ₂ — or —S (═O) ₂ N (R ₇ ) — The pattern forming method according to any one of [1] to [3].
[6]
The pattern forming method according to any one of [1] to [5], wherein the resin (A) further includes a repeating unit having a polar group.
[7]
The polar group is selected from a hydroxyl group, a cyano group, a lactone group, a carboxylic acid group, a sulfonic acid group, an amide group, a sulfonamide group, an ammonium group, a sulfonium group, and a group formed by combining two or more thereof. [6] The pattern forming method according to [6].
[8]
The pattern forming method according to any one of [1] to [7], wherein the resin (A) further includes a repeating unit having an acidic group.
[9]
The acidic group is a phenolic hydroxyl group, carboxylic acid group, sulfonic acid group, fluorinated alcohol group, sulfonamide group, sulfonylimide group, (alkylsulfonyl) (alkylcarbonyl) methylene group, (alkylsulfonyl) (alkylcarbonyl) Imido group, bis (alkylcarbonyl) methylene group, bis (alkylcarbonyl) imide group, bis (alkylsulfonyl) methylene group, bis (alkylsulfonyl) imide group, tris (alkylcarbonyl) methylene group or tris (alkylsulfonyl) methylene group The pattern forming method according to [8].
[10]
The pattern forming method according to any one of [1] to [9], wherein the actinic ray-sensitive or radiation-sensitive resin composition further contains a hydrophobic resin.
[11]
The pattern forming method according to any one of [1] to [10], which is exposed to an electron beam, an X-ray, or EUV light.
[12]
The pattern forming method according to any one of [1] to [11], which is for forming a semiconductor fine circuit.
[13]
[1] to [12] An actinic ray-sensitive or radiation-sensitive resin composition used in the pattern forming method according to any one of [12].
[14]
A resist film formed using the actinic ray-sensitive or radiation-sensitive resin composition according to [13].
[15]
The manufacturing method of an electronic device containing the pattern formation method of any one of [1]-[12].
[16]
The electronic device manufactured by the manufacturing method of the electronic device as described in [15].

The present invention preferably further has the following configuration.
[17]
L ₁ in the general formula (Z1) or (Z2) is —O—, —S—, —OS (═O) ₂ —, —S (═O) ₂ O—, —OC (═O) — or —. The pattern formation method according to any one of [1] to [3], which is C (= O) O-.
[18]
[1] to [10] and [17] wherein R ₁ in the general formula (Z1) or (Z2) is an alkylene group, a partially or fully fluorinated alkylene group, an arylene group, a partially or fully fluorinated arylene group. ] The pattern formation method of any one of.
[19]
The monovalent substituent R ₄ , R ₅ or R _{6 in the} general formula (Z1) or (Z2) is an alkyl group, a cycloalkyl group, an aryl group, a halogen atom, a hydroxyl group, an alkoxy group, an alkoxycarbonyl group or an arylthio group. The pattern forming method according to any one of [1] to [10], [17] and [18].

  According to the present invention, in fine processing such as formation of a fine pattern in a semiconductor element, in particular, in negative pattern formation by organic solvent development, pattern collapse is suppressed, generation of outgas is suppressed, and the lower part of the pattern is suppressed. It is possible to provide a pattern forming method capable of forming a pattern in which no bite occurs, an actinic ray-sensitive or radiation-sensitive resin composition and a resist film, and an electronic device manufacturing method and an electronic device using the same.

Hereinafter, embodiments of the present invention will be described in detail.
In the description of the group (atomic group) in this specification, the notation which does not describe substitution and non-substitution includes the thing which has a substituent with the thing which does not have a substituent. For example, the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
In the present specification, “active light” or “radiation” means, for example, the emission line spectrum of a mercury lamp, far ultraviolet rays represented by excimer laser, extreme ultraviolet rays (EUV light), X-rays, electron beams (EB), etc. To do. In the present invention, light means actinic rays or radiation.
In addition, “exposure” in the present specification is not limited to exposure to far ultraviolet rays, extreme ultraviolet rays, X-rays, EUV light and the like represented by mercury lamps and excimer lasers, but also electron beams, ion beams, and the like, unless otherwise specified. The exposure with the particle beam is also included in the exposure.

[Pattern formation method]
First, the pattern forming method of the present invention will be described.
The pattern forming method of the present invention comprises (A) a resin whose solubility in a developer containing an organic solvent is reduced by the action of an acid, and (B) an acid by irradiation with an actinic ray or radiation represented by the following general formula (Z1). (1) a step of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition containing a compound capable of generating
A step (2) of exposing the film with actinic rays or radiation, and a step (4) of developing with a developer containing an organic solvent after the exposure to form a negative pattern.

In the general formula (Z1),
L ₁ represents —O—, —S—, —OS (═O) ₂ —, —S (═O) ₂ O—, —OC (═O) —, —C (═O) O—, —S ( _{= O) -, - S (} = O) 2 -, - C (= O) -, - N (R 7) C (= O) -, - C (= O) N (R 7) -, - N (R ₇ ) S (═O) ₂ — or —S (═O) ₂ N (R ₇ ) — (the right side is the R ₁ side), and R ₇ represents a hydrogen atom, an alkyl group or a cycloalkyl group. .
R ₁ represents an alkylene group, a cycloalkylene group, an arylene group or a divalent group formed by a combination thereof, in which —O—, —C (═O) —, —S (═O) ₂ — or -S- may be included.
A ₁ is _-SO ³ _{-, -SO} ² N - represents a _{(SO 2 R 9) 2 -} SO 2 R 8 or _-SO 2 ^C. R ₈ represents an alkyl group, a cycloalkyl group or an aryl group, R ₉ represents an alkyl group, a cycloalkyl group or an aryl group, and two R _{9 s} may be the same or different.
R ₂ and R ₃ each independently represents an alkyl group, an alkenyl group, a cycloalkyl group, an aryl group or a heterocyclic group.
R ₄ represents a monovalent substituent, and n ₁ represents an integer of 0 to 4. When n ₁ is 2 or more, the plurality of R ₄ may be the same or different.
Further, R ₂ and R ₃ , R ₂ and R ₄ , R ₃ and R ₄ , R ₂ and the benzene ring in the general formula (Z1), R ₃ and the benzene ring, and when n ₁ is 2 or more R ₄ may be connected to each other to form a ring.

  According to the pattern formation method of the present invention using the compound (B) that generates an acid upon irradiation with actinic rays or radiation having the specific structure, the pattern collapse is suppressed with high sensitivity in the negative pattern formation by organic solvent development. However, the reason for suppressing the outgas generation and forming a pattern that does not bite below the pattern is not clear, but is estimated as follows.

For example, in the case of forming a fine line and space pattern with a line width of 50 nm or less, a stronger capillary force (capillary force) is likely to be generated in the fine space formed during development. When the developer is discharged, this capillary force is applied to the side wall of the pattern having a fine line width. When a positive pattern is formed with an alkali developer, the affinity between the resin-based pattern and the alkali developer tends to be low, so that the capillary force applied to the side wall of the pattern is large. It ’s easy to fall down.
On the other hand, when a negative pattern is formed with an organic developer as in the present invention, the affinity between the resin-based pattern and the organic developer tends to be high, so that the pattern is applied to the side wall of the pattern. Capillary force is small and pattern collapse is unlikely to occur. In addition, since the resist film is mainly composed of a resin and has a high affinity with an organic developer, the organic developer rapidly penetrates into the resist film and develops faster than an alkali developer. It is estimated that what can be done also contributes to high sensitivity.
In the present invention, the compound (B) represented by the general formula (Z1) in the exposed portion is decomposed by irradiation with actinic rays or radiation to reduce the solubility in an organic solvent and generate an acid. Therefore, penetration of the organic developer into the pattern (that is, the exposed portion) is suppressed, the strength of the pattern is increased, the pattern is less likely to collapse, and the organic solvent between the exposed portion and the unexposed portion It is considered that the dissolution contrast is improved and the sensitivity is improved.

Further, the reaction due to light irradiation (that is, acid decomposition reaction) is not sufficiently progressed at the bottom of the pattern, and the bottom of the pattern remains easily dissolved in the organic developer. As a result, when development is performed with an organic developer in such a state, the bottom of the pattern is easily dissolved in the organic developer, and thus there is a problem that the pattern is likely to have an undercut shape.
On the other hand, in the present invention, as described above, the compound (B) represented by the general formula (Z1) in the exposed portion is decomposed by irradiation with actinic rays or radiation, thereby reducing the solubility in an organic solvent. In addition, since the acid is generated, it is presumed that the decrease in the solubility of the exposed portion in the organic developer is strengthened, and the occurrence of the undercut in the lower portion of the pattern is suppressed.
Further, as described above, the compound (B) represented by the general formula (Z1) is decomposed by irradiation with actinic rays or radiation to generate an acid. It is estimated that there are few.

(1) Film Formation The resist film of the present invention is a film formed from the actinic ray-sensitive or radiation-sensitive resin composition described above.
More specifically, the resist film is formed by dissolving each component described later of the actinic ray-sensitive or radiation-sensitive resin composition in a solvent, filtering the filter as necessary, and then applying the solution to a support (substrate). Can be done. The filter is preferably made of polytetrafluoroethylene, polyethylene, or nylon having a pore size of 0.1 μm or less, more preferably 0.05 μm or less, and still more preferably 0.03 μm or less.
The composition is applied by a suitable coating method such as a spin coater on a substrate (for example, silicon, silicon dioxide coating) used for manufacturing an integrated circuit device. Thereafter, it is dried to form a photosensitive film. Heating (pre-baking) is preferably performed in the drying stage.
Although there is no restriction | limiting in particular in a film thickness, Preferably it adjusts to the range of 10-500 nm, More preferably, it is the range of 10-200 nm, More preferably, it is adjusted to the range of 10-80 nm. When the actinic ray-sensitive or radiation-sensitive resin composition is applied by a spinner, the rotation speed is usually 500 to 3000 rpm, preferably 800 to 2000 rpm, more preferably 1000 to 1500 rpm.
The heating (pre-baking) temperature is preferably 60 to 200 ° C, more preferably 80 to 150 ° C, and still more preferably 90 to 140 ° C.
The time for heating (pre-baking) is not particularly limited, but is preferably 30 to 300 seconds, more preferably 30 to 180 seconds, and still more preferably 30 to 90 seconds.
Heating can be performed by means provided in a normal exposure / developing machine, and may be performed using a hot plate or the like.
If necessary, a commercially available inorganic or organic antireflection film can be used. Further, an antireflection film can be applied to the lower layer of the actinic ray-sensitive or radiation-sensitive resin composition. As the antireflection film, any of an inorganic film type such as titanium, titanium dioxide, titanium nitride, chromium oxide, carbon, and amorphous silicon, and an organic film type made of a light absorber and a polymer material can be used. In addition, as the organic antireflection film, commercially available organic antireflection films such as DUV30 series, DUV-40 series manufactured by Brewer Science, AR-2, AR-3, AR-5 manufactured by Shipley, etc. may be used. it can.

(2) Exposure Although there is no restriction | limiting in the light source wavelength used for the exposure apparatus in this invention, Infrared light, visible light, ultraviolet light, far ultraviolet light, extreme ultraviolet light (EUV light), X-ray | X_line, an electron beam (EB) Preferably, far ultraviolet light having a wavelength of 250 nm or less, more preferably 220 nm or less, particularly preferably 1 to 200 nm, specifically KrF excimer laser (248 nm), ArF excimer laser (193 nm), F ₂ excimer laser (157 nm), X-ray, EUV light (13 nm), electron beam (EB), etc., preferably KrF excimer laser, ArF excimer laser, X-ray, EUV light or electron beam, electron beam, X-ray Or it is more preferable that it is EUV light.
When extreme ultraviolet (EUV light) or the like is used as an exposure source, it is preferable to irradiate the formed film with EUV light (around 13 nm) through a predetermined mask. In irradiation with an electron beam (EB), drawing (direct drawing) without using a mask is common.

(3) Baking It is preferable to perform baking (heating) after exposure and before development.
The heating temperature is preferably 60 to 150 ° C, more preferably 80 to 150 ° C, and still more preferably 90 to 140 ° C.
The heating time is not particularly limited, but is preferably 30 to 300 seconds, more preferably 30 to 180 seconds, and still more preferably 30 to 90 seconds.
Heating can be performed by means provided in a normal exposure / developing machine, and may be performed using a hot plate or the like.
The reaction of the exposed part is promoted by baking, and the sensitivity and pattern profile are improved. It is also preferable to include a heating step (Post Bake) after the rinsing step. The heating temperature and heating time are as described above. The developing solution and the rinsing solution remaining between the patterns and inside the patterns are removed by baking.

(4) Development In the present invention, development is performed using a developer containing an organic solvent.
-Developer The vapor pressure of the developer (the vapor pressure as a whole in the case of a mixed solvent) is preferably 5 kPa or less, more preferably 3 kPa or less, and particularly preferably 2 kPa or less at 20 ° C. By setting the vapor pressure of the organic solvent to 5 kPa or less, evaporation of the developer on the substrate or in the developing cup is suppressed, temperature uniformity in the wafer surface is improved, and as a result, dimensional uniformity in the wafer surface is improved. It improves.
Various organic solvents are widely used as the organic solvent used in the developer. For example, solvents such as ester solvents, ketone solvents, alcohol solvents, amide solvents, ether solvents, hydrocarbon solvents, etc. Can be used.

In the present invention, the ester solvent is a solvent having an ester group in the molecule, the ketone solvent is a solvent having a ketone group in the molecule, and the alcohol solvent is alcoholic in the molecule. It is a solvent having a hydroxyl group, an amide solvent is a solvent having an amide group in the molecule, and an ether solvent is a solvent having an ether bond in the molecule. Among these, there is a solvent having a plurality of types of the above functional groups in one molecule. In that case, it corresponds to any solvent type including the functional group of the solvent. For example, diethylene glycol monomethyl ether corresponds to both alcohol solvents and ether solvents in the above classification. Further, the hydrocarbon solvent is a hydrocarbon solvent having no substituent.
In particular, a developer containing at least one kind of solvent selected from ketone solvents, ester solvents, alcohol solvents and ether solvents is preferable.

  Examples of the ester solvent include methyl acetate, ethyl acetate, butyl acetate, pentyl acetate, isopropyl acetate, amyl acetate, isoamyl acetate, ethyl methoxyacetate, ethyl ethoxyacetate, propylene glycol monomethyl ether acetate (PGMEA; also known as 1-methoxy- 2-acetoxypropane), ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, ethylene glycol monobutyl ether acetate, ethylene glycol monophenyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monopropyl ether acetate, diethylene glycol monoethyl ether acetate, Diethylene glycol monophenyl ether ace , Diethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, 2-methoxybutyl acetate, 3-methoxybutyl acetate, 4-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-ethyl-3-methoxybutyl Acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, 2-ethoxybutyl acetate, 4-ethoxybutyl acetate, 4-propoxybutyl acetate, 2-methoxypentyl acetate, 3-methoxypentyl acetate, 4-methoxypentyl Acetate, 2-methyl-3-methoxypentyl acetate, 3-methyl-3-methoxypentyl acetate, 3-methyl Ru-4-methoxypentyl acetate, 4-methyl-4-methoxypentyl acetate, propylene glycol diacetate, methyl formate, ethyl formate, butyl formate, propyl formate, ethyl lactate, butyl lactate, propyl lactate, ethyl carbonate, propyl carbonate, Butyl carbonate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, butyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl propionate, ethyl propionate, propyl propionate, isopropyl propionate, methyl 2-hydroxypropionate, Examples include ethyl 2-hydroxypropionate, methyl-3-methoxypropionate, ethyl-3-methoxypropionate, ethyl-3-ethoxypropionate, propyl-3-methoxypropionate, and the like. it can.

  Examples of the ketone solvent include 1-octanone, 2-octanone, 1-nonanone, 2-nonanone, acetone, 2-heptanone, 4-heptanone, 1-hexanone, 2-hexanone, diisobutyl ketone, cyclohexanone, methylcyclohexanone, Examples include phenylacetone, methyl ethyl ketone, methyl isobutyl ketone, acetylacetone, acetonylacetone, ionone, diacetonyl alcohol, acetylcarbinol, acetophenone, methylnaphthylketone, isophorone, propylene carbonate, and γ-butyrolactone.

  Examples of the alcohol solvent include methyl alcohol, ethyl alcohol, n-propyl alcohol, isopropyl alcohol, n-butyl alcohol, sec-butyl alcohol, tert-butyl alcohol, isobutyl alcohol, n-hexyl alcohol, 2-hexyl alcohol, alcohols such as n-heptyl alcohol, n-octyl alcohol, n-decanol, 3-methoxy-1-butanol, glycol solvents such as ethylene glycol, diethylene glycol, triethylene glycol, ethylene glycol monomethyl ether, propylene glycol monomethyl ether (PGME; also known as 1-methoxy-2-propanol), diethylene glycol monomethyl ether, triethylene glycol monoethyl ether Contains hydroxyl groups such as methoxymethyl butanol, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, propylene glycol monophenyl ether Examples include glycol ether solvents. Among these, it is preferable to use a glycol ether solvent.

  Examples of ether solvents include glycol ether solvents that contain hydroxyl groups, glycol ether solvents that do not contain hydroxyl groups such as propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol dimethyl ether, and diethylene glycol diethyl ether, anisole, and phenetole. Aromatic ether solvents, dioxane, tetrahydrofuran, tetrahydropyran, perfluoro-2-butyltetrahydrofuran, perfluorotetrahydrofuran, 1,4-dioxane and the like. Preferably, an glycol ether solvent or an aromatic ether solvent such as anisole is used.

  Examples of the amide solvent include N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, hexamethylphosphoric triamide, 1,3-dimethyl-2-imidazolidinone and the like. Can be used.

  Examples of the hydrocarbon solvent include aliphatic hydrocarbon solvents such as pentane, hexane, octane, decane, 2,2,4-trimethylpentane, 2,2,3-trimethylhexane, perfluorohexane, and perfluoroheptane. Aromatic hydrocarbon solvents such as toluene, xylene, ethylbenzene, propylbenzene, 1-methylpropylbenzene, 2-methylpropylbenzene, dimethylbenzene, diethylbenzene, ethylmethylbenzene, trimethylbenzene, ethyldimethylbenzene, dipropylbenzene, etc. Can be mentioned. Among these, aromatic hydrocarbon solvents are preferable.

A plurality of the above solvents may be mixed, or may be used by mixing with a solvent other than those described above or water. However, in order to fully exhibit the effects of the present invention, the water content of the developer as a whole is preferably less than 10% by mass, and more preferably substantially free of moisture.
The concentration (content) of the organic solvent in the developer (total in the case of multiple mixing) is preferably 50% by mass to 100% by mass, more preferably 70% by mass to 100% by mass with respect to the total amount of the developer. Hereinafter, it is more preferably 90% by mass or more and 100% by mass or less. Particularly preferred is a case consisting essentially of an organic solvent. In addition, the case where it consists only of an organic solvent includes the case where a trace amount surfactant, antioxidant, stabilizer, an antifoamer, etc. are contained.

Of the above solvents, it is more preferable to contain one or more selected from the group consisting of butyl acetate, pentyl acetate, isopentyl acetate, propylene glycol monomethyl ether acetate, and anisole.
Preferable examples of the organic solvent used as the developer include ester solvents.
As the ester solvent, it is more preferable to use a solvent represented by the general formula (S1) described later or a solvent represented by the general formula (S2) described later, and use a solvent represented by the general formula (S1). It is even more preferred that alkyl acetate is used, and butyl acetate, pentyl acetate, and isopentyl acetate are most preferred.

  R—C (═O) —O—R ′ Formula (S1)

In the general formula (S1),
R and R ′ each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an alkoxyl group, an alkoxycarbonyl group, a carboxyl group, a hydroxyl group, a cyano group or a halogen atom. R and R ′ may be bonded to each other to form a ring.
The alkyl group, alkoxyl group and alkoxycarbonyl group for R and R ′ preferably have 1 to 15 carbon atoms, and the cycloalkyl group preferably has 3 to 15 carbon atoms.
R and R ′ are preferably a hydrogen atom or an alkyl group, and an alkyl group, a cycloalkyl group, an alkoxyl group, an alkoxycarbonyl group, and a ring formed by combining R and R ′ with respect to R and R ′, It may be substituted with a hydroxyl group, a group containing a carbonyl group (for example, an acyl group, an aldehyde group, alkoxycarbonyl, etc.), a cyano group, or the like.

  Examples of the solvent represented by the general formula (S1) include methyl acetate, butyl acetate, ethyl acetate, isopropyl acetate, amyl acetate, isoamyl acetate, methyl formate, ethyl formate, butyl formate, propyl formate, ethyl lactate, and butyl lactate. , Propyl lactate, ethyl carbonate, propyl carbonate, butyl carbonate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, butyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl propionate, ethyl propionate, propyl propionate, propion Examples include isopropyl acid, methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate, and the like.

Among these, it is preferable that R and R ′ are unsubstituted alkyl groups.
The solvent represented by the general formula (S1) is preferably alkyl acetate, more preferably butyl acetate, pentyl acetate, or isopentyl acetate.

  The solvent represented by the general formula (S1) may be used in combination with one or more other organic solvents. The combined solvent in this case is not particularly limited as long as it can be mixed without being separated into the solvent represented by the general formula (S1), and the solvents represented by the general formula (S1) may be used in combination. The solvent represented by the general formula (S1) may be used by mixing it with a solvent selected from other ester solvents, ketone solvents, alcohol solvents, amide solvents, ether solvents and hydrocarbon solvents. good. One or more solvents can be used in combination, but it is preferable to use one solvent in order to obtain stable performance. The mixing ratio of the solvent represented by the general formula (S1) and the combined solvent in the case of using one mixed solvent together is usually 20:80 to 99: 1, preferably 50:50 to 97: by mass ratio. 3, more preferably 60:40 to 95: 5, most preferably 60:40 to 90:10.

  R "-C (= O) -O-R" "-O-R" "" general formula (S2)

In general formula (S2),
R ″ and R ″ ″ each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, an alkoxyl group, an alkoxycarbonyl group, a carboxyl group, a hydroxyl group, a cyano group or a halogen atom. R ″ and R ″ ″ may be bonded to each other to form a ring.
R ″ and R ″ ″ are preferably a hydrogen atom or an alkyl group. The carbon number of the alkyl group, alkoxyl group, and alkoxycarbonyl group for R ″ and R ″ ″ is preferably in the range of 1 to 15, and the carbon number of the cycloalkyl group is 3 to 15. Is preferred.
R ′ ″ represents an alkylene group or a cycloalkylene group. R ′ ″ is preferably an alkylene group. The number of carbon atoms of the alkylene group for R ′ ″ is preferably in the range of 1-10. The carbon number of the cycloalkylene group for R ′ ″ is preferably in the range of 3-10.
An alkyl group, a cycloalkyl group, an alkoxyl group, an alkoxycarbonyl group for R ″ and R ″ ″, an alkylene group, a cycloalkylene group for R ′ ″, and R ″ and R ″ ″. The ring formed by bonding to each other may be substituted with a hydroxyl group, a group containing a carbonyl group (for example, an acyl group, an aldehyde group, alkoxycarbonyl, etc.), a cyano group, or the like.

  In general formula (S2), the alkylene group for R ′ ″ may have an ether bond in the alkylene chain.

Examples of the solvent represented by the general formula (S2) include propylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, ethylene glycol monobutyl ether acetate, ethylene glycol monophenyl ether acetate, diethylene glycol monomethyl. Ether acetate, diethylene glycol monopropyl ether acetate, diethylene glycol monophenyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, methyl-3-methoxy Propionate, ethyl-3-methoxypropionate, ethyl-3-ethoxypropionate, propyl-3-methoxypropionate, ethyl methoxyacetate, ethyl ethoxyacetate, 2-methoxybutyl acetate, 3-methoxybutyl acetate, 4 -Methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-ethyl-3-methoxybutyl acetate, 2-ethoxybutyl acetate, 4-ethoxybutyl acetate, 4-propoxybutyl acetate, 2-methoxypentyl acetate, 3 -Methoxypentyl acetate, 4-methoxypentyl acetate, 2-methyl-3-methoxypentyl acetate, 3-methyl-3-methoxypentyl acetate, 3-methyl-4-methoxypentyl acetate, 4- Chill -4-methoxy pentyl acetate and the like, it is preferably a propylene glycol monomethyl ether acetate.
Among these, R ″ and R ″ ″ are preferably unsubstituted alkyl groups, R ′ ″ is preferably an unsubstituted alkylene group, and R ″ and R ″ ″ are methyl groups. And R ″ and R ″ ″ are more preferably methyl groups.

The solvent represented by the general formula (S2) may be used in combination with one or more other organic solvents. The combined solvent in this case is not particularly limited as long as it can be mixed without being separated into the solvent represented by the general formula (S2), and the solvents represented by the general formula (S2) may be used in combination. The solvent represented by the general formula (S2) may be used by mixing it with a solvent selected from other ester solvents, ketone solvents, alcohol solvents, amide solvents, ether solvents and hydrocarbon solvents. good. One or more solvents can be used in combination, but it is preferable to use one solvent in order to obtain stable performance. The mixing ratio of the solvent represented by the general formula (S2) and the combined solvent when the combined solvent is used is usually 20:80 to 99: 1, preferably 50:50 to 97: 3, more preferably 60:40 to 95: 5, most preferably 60:40 to 90:10.
Moreover, as an organic solvent used as a developing solution, an ether type solvent can also be mentioned suitably.
Examples of the ether solvent that can be used include the ether solvents described above, and among these, an ether solvent containing one or more aromatic rings is preferable, and a solvent represented by the following general formula (S3) is more preferable. Most preferred is anisole.

In general formula (S3),
R _S represents an alkyl group. The alkyl group preferably has 1 to 4 carbon atoms, more preferably a methyl group or an ethyl group, and most preferably a methyl group.
In the present invention, the water content of the developer is usually 10% by mass or less, preferably 5% by mass or less, more preferably 1% by mass or less, and most preferably contains no water. preferable.

-Surfactant A developer containing an organic solvent can contain an appropriate amount of a surfactant as required.
As the surfactant, the same surfactants as those used in the actinic ray-sensitive or radiation-sensitive resin composition described later can be used.
The amount of the surfactant used is usually 0.001 to 5% by mass, preferably 0.005 to 2% by mass, and more preferably 0.01 to 0.5% by mass with respect to the total amount of the developer.

・ Development method As a development method, for example, the substrate is immersed in a tank filled with a developer for a certain period of time (dip method), and the developer is developed on the surface of the substrate by surface tension and kept stationary for a certain period of time. Method (paddle method), Method of spraying developer on the substrate surface (spray method), Method of continuously discharging developer while scanning the developer discharge nozzle at a constant speed on a substrate rotating at a constant speed (dynamic Dispensing method) can be applied.
Moreover, you may implement the process of stopping image development, after the process of developing, substituting with another solvent.
The development time is not particularly limited as long as the resin in the unexposed area is sufficiently dissolved, and is usually 10 seconds to 300 seconds. Preferably, it is 20 seconds to 120 seconds.
The temperature of the developer is preferably from 0 ° C to 50 ° C, more preferably from 15 ° C to 35 ° C.

(5) Rinse In the pattern formation method of this invention, the process (5) wash | cleaned using the rinse liquid containing an organic solvent may be included after the image development process (4).

-Rinse solution The vapor pressure of the rinse solution used after development (the vapor pressure as a whole in the case of a mixed solvent) is preferably 0.05 kPa or more and 5 kPa or less at 20 ° C, more preferably 0.1 kPa or more and 5 kPa or less. Preferably, it is 0.12 kPa or more and 3 kPa or less. By setting the vapor pressure of the rinse liquid to 0.05 kPa or more and 5 kPa or less, the temperature uniformity in the wafer surface is improved, and further, the swelling due to the penetration of the rinse solution is suppressed, and the dimensional uniformity in the wafer surface. Improves.

  As the rinsing liquid, various organic solvents are used. At least one organic solvent selected from a hydrocarbon solvent, a ketone solvent, an ester solvent, an alcohol solvent, an amide solvent, and an ether solvent or It is preferable to use a rinse solution containing water.

More preferably, after the development, a step of washing with a rinse solution containing at least one organic solvent selected from a ketone solvent, an ester solvent, an alcohol solvent, an amide solvent or a hydrocarbon solvent. Do. Even more preferably, after the development, a step of washing with a rinse solution containing an alcohol solvent or a hydrocarbon solvent is performed.
Particularly preferably, a rinse liquid containing at least one selected from the group of monohydric alcohols and hydrocarbon solvents is used.

Here, examples of the monohydric alcohol used in the rinsing step after development include linear, branched, and cyclic monohydric alcohols. Specifically, 1-butanol, 2-butanol, 3-methyl- 1-butanol, tert-butyl alcohol, 1-pentanol, 2-pentanol, 1-hexanol, 1-heptanol, 1-octanol, 2-hexanol, 2-heptanol, 2-octanol, 3-hexanol, 3-heptanol 3-octanol, 4-octanol, 3-methyl-3-pentanol, cyclopentanol, 2,3-dimethyl-2-butanol, 3,3-dimethyl-2-butanol, 2-methyl-2-pentanol 2-methyl-3-pentanol, 3-methyl-2-pentanol, 3-methyl-3-pentanol, 4 Methyl-2-pentanol, 4-methyl-3-pentanol, cyclohexanol, 5-methyl-2-hexanol, 4-methyl-2-hexanol, 4,5-dityl-2-hexal, 6-methyl-2 -Heptanol, 7-methyl-2-octanol, 8-methyl-2-nonal, 9-methyl-2-decanol, etc. can be used, preferably 1-hexanol, 2-hexanol, 1-pentanol, 3 -Methyl-1-butanol, 3-methyl-2-pentanol, 3-methyl-3-pentanol, 4-methyl-2-pentanol, 4-methyl-3-pentanol, most preferably 1 -Hexanol or 4-methyl-2-pentanol.
Examples of the hydrocarbon solvent include aromatic hydrocarbon solvents such as toluene and xylene, and aliphatic hydrocarbon solvents such as octane and decane.

  More preferably, the rinse liquid contains one or more selected from the group consisting of 1-hexanol, 4-methyl-2-pentanol, and decane.

  A plurality of these components may be mixed, or may be used by mixing with an organic solvent other than the above. The solvent may be mixed with water, but the water content in the rinsing liquid is usually 60% by mass or less, preferably 30% by mass or less, more preferably 10% by mass or less, and most preferably 5% by mass or less. is there. A favorable rinse characteristic can be acquired by making a moisture content into 60 mass% or less.

An appropriate amount of a surfactant can be contained in the rinse liquid.
As the surfactant, the same surfactants used in the actinic ray-sensitive or radiation-sensitive resin composition described later can be used, and the amount used is usually 0 with respect to the total amount of the rinsing liquid. 0.001 to 5 mass%, preferably 0.005 to 2 mass%, more preferably 0.01 to 0.5 mass%.

-Rinsing method In the rinsing step, the developed wafer is cleaned using the rinsing liquid containing the organic solvent.
The method of the cleaning process is not particularly limited. For example, a method of continuously discharging the rinse liquid onto the substrate rotating at a constant speed (rotary discharge method), or immersing the substrate in a tank filled with the rinse liquid for a certain period of time. A method (dip method), a method of spraying a rinsing liquid on the substrate surface (spray method), and the like can be applied. Among these, a cleaning process is performed by a rotary discharge method, and after cleaning, the substrate is rotated at a speed of 2000 rpm to 4000 rpm. It is preferable to rotate and remove the rinse liquid from the substrate.
The rinsing time is not particularly limited, but is usually 10 seconds to 300 seconds. It is preferably 10 seconds to 180 seconds, and most preferably 20 seconds to 120 seconds.
The temperature of the rinse liquid is preferably 0 ° C. to 50 ° C., more preferably 15 ° C. to 35 ° C.

In addition, after the developing process or the rinsing process, a process of removing the developing solution or the rinsing liquid adhering to the pattern with a supercritical fluid can be performed.
Furthermore, after the development processing, the rinsing processing or the processing with the supercritical fluid, a heat processing can be performed to remove the solvent remaining in the pattern. The heating temperature is not particularly limited as long as a good resist pattern can be obtained, and is usually 40 ° C to 160 ° C. The heating temperature is preferably 50 ° C. or higher and 150 ° C. or lower, and most preferably 50 ° C. or higher and 110 ° C. or lower. The heating time is not particularly limited as long as a good resist pattern is obtained, but is usually 15 seconds to 300 seconds, and preferably 15 to 180 seconds.

Alkali development The pattern formation method of the present invention can further include a step of performing development using an aqueous alkali solution to form a resist pattern (alkali development step). Thereby, a finer pattern can be formed.
In the present invention, the portion with low exposure intensity is removed by the organic solvent development step (4), but the portion with high exposure strength is also removed by further performing the alkali development step. In this way, the multiple development process in which development is performed a plurality of times enables pattern formation without dissolving only the intermediate exposure intensity region, so that a finer pattern than usual can be formed (Japanese Patent Laid-Open No. 2008-292975 [0077]). The same mechanism).
The alkali development can be performed either before or after the step (4) of developing using a developer containing an organic solvent, but is more preferably performed before the organic solvent developing step (4).

Examples of the alkaline aqueous solution that can be used for alkali development include inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, and aqueous ammonia, and first amines such as ethylamine and n-propylamine. Secondary amines such as amines, diethylamine and di-n-butylamine, tertiary amines such as triethylamine and methyldiethylamine, alcohol amines such as dimethylethanolamine and triethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxy And alkaline aqueous solutions of quaternary ammonium salts such as pyrrole and cyclic amines such as pyrrole and pihelidine.
Furthermore, an appropriate amount of alcohol or surfactant may be added to the alkaline aqueous solution.
The alkali concentration of the alkali developer is usually from 0.1 to 20% by mass.
The pH of the alkali developer is usually from 10.0 to 15.0.
In particular, an aqueous solution of 2.38% by mass of tetramethylammonium hydroxide is desirable.
The alkali development time is not particularly limited, and is usually 10 seconds to 300 seconds. Preferably, it is 20 seconds to 120 seconds.
The temperature of the alkali developer is preferably from 0 ° C to 50 ° C, more preferably from 15 ° C to 35 ° C.

A rinsing treatment can be performed after the development with an aqueous alkali solution. As the rinsing liquid in the rinsing treatment, pure water is preferable, and an appropriate amount of a surfactant can be added and used.
Further, after the development process or the rinsing process, a heat treatment can be performed in order to remove moisture remaining in the pattern.
Moreover, the process which removes the developing solution or rinse liquid which remain | survives by heating can be performed. The heating temperature is not particularly limited as long as a good resist pattern can be obtained, and is usually 40 ° C to 160 ° C. The heating temperature is preferably 50 ° C. or higher and 150 ° C. or lower, and most preferably 50 ° C. or higher and 110 ° C. or lower. The heating time is not particularly limited as long as a good resist pattern is obtained, but is usually 15 seconds to 300 seconds, and preferably 15 to 180 seconds.

  When a film formed from the resist composition according to the present invention is irradiated with an electron beam or extreme ultraviolet rays, a liquid (immersion medium) having a refractive index higher than that of air is filled between the film and the lens for exposure (immersion exposure). ) May be performed. Thereby, resolution can be improved. As the immersion medium to be used, any liquid can be used as long as it has a higher refractive index than air, but pure water is preferred.

The immersion liquid used for the immersion exposure will be described below.
The immersion liquid is preferably a liquid that is transparent to the exposure wavelength and has a refractive index temperature coefficient as small as possible so as to minimize distortion of the optical image projected onto the resist film. In addition, it is preferable to use water from the viewpoints of easy availability and ease of handling.
Further, a medium having a refractive index of 1.5 or more can be used in that the refractive index can be further improved. This medium may be an aqueous solution or an organic solvent.
When water is used as the immersion liquid, the surface tension of the water is decreased and the surface activity is increased, so that the resist film on the wafer is not dissolved and the influence on the optical coating on the lower surface of the lens element can be ignored. An additive (liquid) may be added in a small proportion. The additive is preferably an aliphatic alcohol having a refractive index substantially equal to that of water, and specifically includes methyl alcohol, ethyl alcohol, isopropyl alcohol and the like. By adding an alcohol having a refractive index substantially equal to that of water, even if the alcohol component in water evaporates and the content concentration changes, an advantage that the change in the refractive index of the entire liquid can be made extremely small can be obtained. On the other hand, when an impurity whose refractive index is significantly different from that of water is mixed, the optical image projected on the resist film is distorted, so that distilled water is preferable as the water to be used. Further, pure water filtered through an ion exchange filter or the like may be used.

The electrical resistance of water is desirably 18.3 MQcm or more, the TOC (organic substance concentration) is desirably 20 ppb or less, and deaeration treatment is desirably performed.
Moreover, it is possible to improve lithography performance by increasing the refractive index of the immersion liquid. From such a viewpoint, an additive that increases the refractive index may be added to water, or heavy water (D ₂ O) may be used instead of water.

An immersion liquid poorly soluble film (hereinafter also referred to as “topcoat”) may be provided between the film of the composition of the present invention and the immersion liquid so that the film does not directly contact the immersion liquid. Good. The functions necessary for the top coat are suitability for application to the upper layer portion of the composition film and poor solubility of the immersion liquid. It is preferable that the top coat is not mixed with the composition film and can be uniformly applied to the upper layer of the composition film.
Specific examples of the topcoat include hydrocarbon polymers, acrylic ester polymers, polymethacrylic acid, polyacrylic acid, polyvinyl ether, silicon-containing polymers, fluorine-containing polymers, and the like. From the viewpoint of contaminating the optical lens when impurities are eluted from the top coat into the immersion liquid, it is preferable that the residual monomer component of the polymer contained in the top coat is small.

When peeling the top coat, a developer may be used, or a separate release agent may be used. As the release agent, a solvent having low penetration into the film is preferable. From the viewpoint that the peeling step can be performed at the same time as the film development processing step, it is preferable that the peeling step can be performed with a developer containing an organic solvent.
The resolution is improved when there is no difference in refractive index between the top coat and the immersion liquid. When water is used as the immersion liquid, the top coat is preferably close to the refractive index of the immersion liquid. From the viewpoint of making the refractive index close to the immersion liquid, it is preferable to have fluorine atoms in the topcoat. A thin film is more preferable from the viewpoint of transparency and refractive index.
The topcoat is preferably not mixed with the membrane and further not mixed with the immersion liquid. From this point of view, when the immersion liquid is water, the solvent used for the top coat is preferably a water-insoluble medium that is hardly soluble in the solvent used for the composition of the present invention. Further, when the immersion liquid is an organic solvent, the topcoat may be water-soluble or water-insoluble.

[1] Actinic ray-sensitive or radiation-sensitive resin composition The actinic ray-sensitive or radiation-sensitive resin composition according to the present invention has a negative development (when exposed to a developer, the solubility is reduced. , The exposed portion remains as a pattern, and the unexposed portion is removed). That is, the actinic ray-sensitive or radiation-sensitive resin composition according to the present invention is an actinic ray-sensitive or radiation-sensitive resin composition for organic solvent development used in development using a developer containing an organic solvent. be able to. Here, the term “for organic solvent development” means an application that is used in a step of developing using a developer containing at least an organic solvent.
Thus, the present invention also relates to an actinic ray-sensitive or radiation-sensitive resin composition that is used in the above-described pattern forming method of the present invention.
The actinic ray-sensitive or radiation-sensitive resin composition of the present invention is typically a resist composition, particularly a negative resist composition (that is, a resist composition for developing an organic solvent). It is preferable because a high effect can be obtained. The composition according to the present invention is typically a chemically amplified resist composition.

  The composition used in the present invention has an acid-decomposable repeating unit and generates an acid upon irradiation with actinic rays or radiation with a resin (A) whose solubility in a developer containing an organic solvent is reduced by the action of an acid. And a low molecular weight compound (B) that decomposes by the action of an acid and decreases the solubility in an organic solvent. Hereinafter, the resin (A) will be described.

[1] (A) Resin (a) Repeating unit having acid-decomposable group Resin (A) is a resin whose solubility in a developer containing an organic solvent is reduced by the action of an acid, and having a repeating unit having an acid-decomposable group It is preferable to have a unit. The repeating unit having an acid-decomposable group is, for example, a group that is decomposed by the action of an acid on the main chain or side chain of the resin, or both of the main chain and side chain (hereinafter also referred to as “acid-decomposable group”). ). The group generated by the decomposition of the acid-decomposable group is preferably a polar group, since the affinity with a developer containing an organic solvent is lowered and insolubilization or insolubilization (negative conversion) proceeds. The polar group is more preferably an acidic group. The definition of the polar group is synonymous with the definition described in the section of the repeating unit (b) described later. Examples of the polar group generated by the decomposition of the acid-decomposable group include an alcoholic hydroxyl group, an amino group, and an acidic group. Is mentioned.

The polar group generated by the decomposition of the acid-decomposable group is preferably an acidic group.
The acidic group is not particularly limited as long as it is a group that is insolubilized in a developer containing an organic solvent, but is preferably a phenolic hydroxyl group, a carboxylic acid group, a sulfonic acid group, a fluorinated alcohol group, a sulfonamide group, a sulfonyl group. Imido group, (alkylsulfonyl) (alkylcarbonyl) methylene group, (alkylsulfonyl) (alkylcarbonyl) imide group, bis (alkylcarbonyl) methylene group, bis (alkylcarbonyl) imide group, bis (alkylsulfonyl) methylene group, bis (Alkylsulfonyl) imide group, tris (alkylcarbonyl) methylene group, tris (alkylsulfonyl) methylene group, more preferably carboxylic acid group, fluorinated alcohol group (preferably hexafluoroisopropanol), phenolic hydro Sill group, (used as a developer for conventional resist, a group dissociated in 2.38 mass% tetramethylammonium hydroxide aqueous solution) acidic group such as a sulfonic acid group include.

A preferable group as the acid-decomposable group is a group in which the hydrogen atom of these groups is substituted with a group capable of leaving with an acid.
As the acid eliminable group, there can be, for _{example, -C (R 36) (R} 37) (R 38), - C (R 36) (R 37) (OR 39), - C (R 01) (R 02 ) (OR ₃₉ ) and the like.
In the formula, each of R _{36 to} R ₃₉ independently represents an alkyl group, a cycloalkyl group, a monovalent aromatic ring group, a group in which an alkylene group and a monovalent aromatic ring group are combined, or an alkenyl group. R ₃₆ and R ₃₇ may be bonded to each other to form a ring.
R ₀₁ and R ₀₂ each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, a monovalent aromatic ring group, a group in which an alkylene group and a monovalent aromatic ring group are combined, or an alkenyl group.
The acid-decomposable group is preferably a cumyl ester group, an enol ester group, an acetal ester group, a tertiary alkyl ester group or the like. More preferably, it is a tertiary alkyl ester group.
As the repeating unit (a), a repeating unit represented by the following general formula (V) is more preferable.

In general formula (V),
R ₅₁ , R ₅₂ , and R ₅₃ each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group, or an alkoxycarbonyl group. R ₅₂ may be bonded to L ₅ to form a ring, and R ₅₂ in this case represents an alkylene group.
L ₅ represents a single bond or a divalent linking group, and in the case of forming a ring with R ₅₂ , represents a trivalent linking group.
R ₅₄ represents an alkyl group, and R ₅₅ and R ₅₆ each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, a monovalent aromatic ring group, or an aralkyl group. R ₅₅ and R ₅₆ may combine with each other to form a ring. _However, no and _{R 55} and _{R 56} are hydrogen atoms at the same time.

The general formula (V) will be described in more detail.
As the alkyl group of R _{51 to} R ₅₃ in the general formula (V), a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, which may preferably have a substituent, Examples thereof include alkyl groups having 20 or less carbon atoms such as hexyl group, 2-ethylhexyl group, octyl group and dodecyl group, more preferably alkyl groups having 8 or less carbon atoms, and particularly preferably alkyl groups having 3 or less carbon atoms.
The alkyl group contained in the alkoxycarbonyl group is preferably the same as the alkyl group in the above R _{51 to} R ₅₃ .
The cycloalkyl group may be monocyclic or polycyclic. Preferable examples include a monocyclic cycloalkyl group having 3 to 8 carbon atoms such as a cyclopropyl group, a cyclopentyl group and a cyclohexyl group which may have a substituent.
Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom, and a fluorine atom is particularly preferable.

  Preferred substituents in each of the above groups include, for example, alkyl groups, cycloalkyl groups, aryl groups, amino groups, amide groups, ureido groups, urethane groups, hydroxyl groups, carboxyl groups, halogen atoms, alkoxy groups, thioether groups, acyls. Group, acyloxy group, alkoxycarbonyl group, cyano group, nitro group and the like, and the substituent preferably has 8 or less carbon atoms.

When R ₅₂ is an alkylene group and forms a ring with L ₅ , the alkylene group is preferably an alkylene group having 1 to 8 carbon atoms such as a methylene group, an ethylene group, a propylene group, a butylene group, a hexylene group, or an octylene group. Groups. An alkylene group having 1 to 4 carbon atoms is more preferable, and an alkylene group having 1 to 2 carbon atoms is particularly preferable. The ring formed by combining R ₅₂ and L ₅ is particularly preferably a 5- or 6-membered ring.

R ₅₁ and R ₅₃ in Formula (V) are more preferably a hydrogen atom, an alkyl group, or a halogen atom, and a hydrogen atom, a methyl group, an ethyl group, a trifluoromethyl group (—CF ₃ ), a hydroxymethyl group (—CH ₃ ). _2- OH), a chloromethyl group (—CH ₂ —Cl), and a fluorine atom (—F) are particularly preferable. R ₅₂ is more preferably a hydrogen atom, an alkyl group, a halogen atom, or an alkylene group (forming a ring with L ₅ ), a hydrogen atom, a methyl group, an ethyl group, a trifluoromethyl group (—CF ₃ ), a hydroxymethyl group Particularly preferred are (—CH ₂ —OH), a chloromethyl group (—CH ₂ —Cl), a fluorine atom (—F), a methylene group (forms a ring with L ₅ ), and an ethylene group (forms a ring with L ₅ ). .

Examples of the divalent linking group represented by L _5, an alkylene group, a divalent aromatic ring _{group, -COO-L 1 -, -} O-L 1 -, a group formed by combining two or more of these Etc. Here, L ₁ represents an alkylene group, a cycloalkylene group, a divalent aromatic ring group, or a group in which an alkylene group and a divalent aromatic ring group are combined.
L ₅ is preferably a single bond, a group represented by —COO—L ₁ —, or a divalent aromatic ring group. L ₁ is preferably an alkylene group having 1 to 5 carbon atoms, more preferably a methylene or propylene group. As the divalent aromatic ring group, a 1,4-phenylene group, a 1,3-phenylene group, a 1,2-phenylene group, and a 1,4-naphthylene group are preferable, and a 1,4-phenylene group is more preferable.
In the case of which L ₅ to form a ring with R _52, examples of the trivalent linking group represented by L _5, a specific example described above divalent linking group represented by L ₅ 1 single Preferable examples include groups formed by removing any hydrogen atom.
The alkyl group for R _{54 to} R ₅₆ is preferably an alkyl group having 1 to 20 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms, and includes a methyl group, an ethyl group, an n-propyl group, an isopropyl group, and an n-butyl group. Particularly preferred are those having 1 to 4 carbon atoms such as a group, an isobutyl group and a t-butyl group.
The cycloalkyl group represented by R ₅₅ and R _56, preferably one having 3 to 20 carbon atoms, cyclopentyl, may be of monocyclic and cyclohexyl group, norbornyl group, adamantyl group, Polycyclic ones such as a tetracyclodecanyl group and a tetracyclododecanyl group may be used.

The ring formed by combining R ₅₅ and R ₅₆ with each other preferably has 3 to 20 carbon atoms, and may be monocyclic such as a cyclopentyl group or a cyclohexyl group, or a norbornyl group. A polycyclic group such as an adamantyl group, a tetracyclodecanyl group, or a tetracyclododecanyl group. When R ₅₅ and R ₅₆ are bonded to each other to form a ring, R ₅₄ is preferably an alkyl group having 1 to 3 carbon atoms, more preferably a methyl group or an ethyl group.
The monovalent aromatic ring group represented by R ₅₅ and R ₅₆ is preferably one having 6 to 20 carbon atoms, and may be monocyclic or polycyclic, and may have a substituent. For example, a phenyl group, 1-naphthyl group, 2-naphthyl group, 4-methylphenyl group, 4-methoxyphenyl group and the like can be mentioned. When one of R ₅₅ and R ₅₆ is a hydrogen atom, the other is preferably a monovalent aromatic ring group.
The aralkyl group represented by R ₅₅ and R ₅₆ may be monocyclic or polycyclic and may have a substituent. Preferably it is C7-21, and a benzyl group, 1-naphthylmethyl group, etc. are mentioned.

As a method for synthesizing a monomer corresponding to the repeating unit represented by the general formula (V), a general method for synthesizing a polymerizable group-containing ester can be applied and is not particularly limited.
Specific examples of the repeating unit (a) represented by the general formula (V) are shown below, but the present invention is not limited thereto.
In specific examples, Rx and Xa ₁ represent a hydrogen atom, CH ₃ , CF ₃ , or CH ₂ OH. Rxa and Rxb each independently represent an alkyl group having 1 to 4 carbon atoms, an aryl group having 6 to 18 carbon atoms, or an aralkyl group having 7 to 19 carbon atoms. Z represents a substituent. p represents 0 or a positive integer, preferably 0 to 2, and more preferably 0 or 1. When a plurality of Z are present, they may be the same as or different from each other. Z is preferably a group consisting of only a hydrogen atom and a carbon atom from the viewpoint of increasing the dissolution contrast with respect to a developer containing an organic solvent before and after acid decomposition, for example, a linear or branched alkyl group, A cycloalkyl group is preferred.

  The resin (A) may contain a repeating unit represented by the following general formula (VI) as the repeating unit (a).

In general formula (VI),
R ₆₁ , R ₆₂ and R ₆₃ each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group or an alkoxycarbonyl group. However, R ₆₂ may be bonded to Ar ₆ to form a ring, and R ₆₂ in this case represents a single bond or an alkylene group.
X ₆ represents a single bond, —COO—, or —CONR ₆₄ —. R ₆₄ represents a hydrogen atom or an alkyl group.
L ₆ represents a single bond or an alkylene group.
Ar ₆ represents an (n + 1) -valent aromatic ring group, and represents an (n + 2) -valent aromatic ring group when bonded to R ₆₂ to form a ring.
Y ₂ independently represents a hydrogen atom or a group capable of leaving by the action of an acid when n ≧ 2. However, at least one of Y ₂ represents a group capable of leaving by the action of an acid.
n represents an integer of 1 to 4.

General formula (VI) will be described in more detail.
As the alkyl group of R _{61 to} R ₆₃ in the general formula (VI), a methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, sec-butyl group, which may preferably have a substituent, Examples thereof include alkyl groups having 20 or less carbon atoms such as hexyl group, 2-ethylhexyl group, octyl group, and dodecyl group, and more preferable examples include alkyl groups having 8 or less carbon atoms.
As the alkyl group contained in the alkoxycarbonyl group, the same alkyl groups as those described above for R _{61 to} R ₆₃ are preferable.
The cycloalkyl group may be monocyclic or polycyclic, and is preferably a monocyclic type having 3 to 8 carbon atoms such as a cyclopropyl group, cyclopentyl group or cyclohexyl group which may have a substituent. A cycloalkyl group is mentioned.
Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom, and a fluorine atom is more preferable.

If R ₆₂ represents an alkylene group, the alkylene group, preferably a methylene group which may have a substituent group, an ethylene group, a propylene group, butylene group, hexylene group, 1 to 8 carbon atoms such as octylene Can be mentioned.
_-CONR 64 represented by X ₆ - _{(R 64} represents a hydrogen atom, an alkyl group) The alkyl group for _{R 64 in,} the same as the alkyl group of R 61 _{to R 63.}
X ₆ is preferably a single bond, —COO—, or —CONH—, and more preferably a single bond or —COO—.
The alkylene group for L ₆ is preferably an alkylene group having 1 to 8 carbon atoms, such as an optionally substituted methylene group, ethylene group, propylene group, butylene group, hexylene group or octylene group. The ring formed by combining R ₆₂ and L ₆ is particularly preferably a 5- or 6-membered ring.
Ar ₆ represents an (n + 1) -valent aromatic ring group. The divalent aromatic ring group when n is 1 may have a substituent, for example, an arylene group having 6 to 18 carbon atoms such as a phenylene group, a tolylene group, or a naphthylene group, or, for example, Preferred examples include divalent aromatic ring groups containing heterocycles such as thiophene, furan, pyrrole, benzothiophene, benzofuran, benzopyrrole, triazine, imidazole, benzimidazole, triazole, thiadiazole, and thiazole.

Specific examples of the (n + 1) -valent aromatic ring group in the case where n is an integer of 2 or more include (n-1) arbitrary hydrogen atoms removed from the above-described specific examples of the divalent aromatic ring group. The group formed can be preferably mentioned.
The (n + 1) -valent aromatic ring group may further have a substituent.

Examples of the substituent that the above-described alkyl group, cycloalkyl group, alkoxycarbonyl group, alkylene group, and (n + 1) -valent aromatic ring group may have are represented by R _{51 to} R ₅₃ in the general formula (V). Specific examples similar to the substituents that the group may have are exemplified.
n is preferably 1 or 2, and more preferably 1.
n Y ₂ each independently represents a hydrogen atom or a group capable of leaving by the action of an acid. However, at least one of n represents a group capable of leaving by the action of an acid.
Examples of the group Y ₂ leaving by the action of an acid include —C (R ₃₆ ) (R ₃₇ ) (R ₃₈ ), —C (═O) —O—C (R ₃₆ ) (R ₃₇ ) (R _{38), - C (R 01} ) (R 02) (OR 39), - C (R 01) (R 02) -C (= O) -O-C (R 36) (R 37) (R 38) , —CH (R ₃₆ ) (Ar) and the like.
In the formula, R _{36 to} R ₃₉ each independently represent an alkyl group, a cycloalkyl group, a monovalent aromatic ring group, a group in which an alkylene group and a monovalent aromatic ring group are combined, or an alkenyl group. R ₃₆ and R ₃₇ may be bonded to each other to form a ring.
R ₀₁ and R ₀₂ each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, a monovalent aromatic ring group, a group in which an alkylene group and a monovalent aromatic ring group are combined, or an alkenyl group.

Ar represents a monovalent aromatic ring group.
The alkyl group of R _{36 to} R ₃₉ , R ₀₁ and R ₀₂ is preferably an alkyl group having 1 to 8 carbon atoms, such as methyl group, ethyl group, propyl group, n-butyl group, sec-butyl group, hexyl. Group, octyl group and the like.
The cycloalkyl group of R _{36 to} R ₃₉ , R ₀₁ and R ₀₂ may be monocyclic or polycyclic. The monocyclic type is preferably a cycloalkyl group having 3 to 8 carbon atoms, and examples thereof include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group. As the polycyclic type, a cycloalkyl group having 6 to 20 carbon atoms is preferable. Group, androstanyl group and the like. A part of carbon atoms in the cycloalkyl group may be substituted with a hetero atom such as an oxygen atom.

The monovalent aromatic ring group of R _{36 to} R ₃₉ , R ₀₁ , R ₀₂ and Ar is preferably a monovalent aromatic ring group having 6 to 10 carbon atoms, for example, an aryl such as a phenyl group, a naphthyl group or an anthryl group. And a divalent aromatic ring group containing a heterocyclic ring such as a group, thiophene, furan, pyrrole, benzothiophene, benzofuran, benzopyrrole, triazine, imidazole, benzimidazole, triazole, thiadiazole, thiazole.
The group in which the alkylene group of R _{36 to} R ₃₉ , R ₀₁ and R ₀₂ and the monovalent aromatic ring group are combined is preferably an aralkyl group having 7 to 12 carbon atoms, such as benzyl group, phenethyl group, naphthylmethyl. Groups and the like.
The alkenyl group of R _{36 to} R ₃₉ , R ₀₁ and R ₀₂ is preferably an alkenyl group having 2 to 8 carbon atoms, and examples thereof include a vinyl group, an allyl group, a butenyl group, and a cyclohexenyl group.

The ring formed by combining R ₃₆ and R ₃₇ with each other may be monocyclic or polycyclic. The monocyclic type is preferably a cycloalkyl structure having 3 to 8 carbon atoms, and examples thereof include a cyclopropane structure, a cyclobutane structure, a cyclopentane structure, a cyclohexane structure, a cycloheptane structure, and a cyclooctane structure. As the polycyclic type, a cycloalkyl structure having 6 to 20 carbon atoms is preferable, and examples thereof include an adamantane structure, a norbornane structure, a dicyclopentane structure, a tricyclodecane structure, and a tetracyclododecane structure. A part of carbon atoms in the cycloalkyl structure may be substituted with a hetero atom such as an oxygen atom.
Each of the groups as R _{36 to} R ₃₉ , R ₀₁ , R ₀₂ and Ar may have a substituent, and examples of the substituent include an alkyl group, a cycloalkyl group, an aryl group, and an amino group. Amide group, ureido group, urethane group, hydroxyl group, carboxyl group, halogen atom, alkoxy group, thioether group, acyl group, acyloxy group, alkoxycarbonyl group, cyano group, nitro group, etc. The number of carbon atoms is preferably 8 or less.
As the group Y ₂ leaving by the action of an acid, a structure represented by the following general formula (VI-A) is more preferable.

Here, L ₁ and L ₂ each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, a monovalent aromatic ring group, or a group in which an alkylene group and a monovalent aromatic ring group are combined.
M represents a single bond or a divalent linking group.
Q represents an alkyl group, a cycloalkyl group which may contain a hetero atom, a monovalent aromatic ring group which may contain a hetero atom, an amino group, an ammonium group, a mercapto group, a cyano group or an aldehyde group.
At least two of Q, M, and L ₁ may combine to form a ring (preferably a 5-membered or 6-membered ring).
The alkyl group as L ₁ and L ₂ is, for example, an alkyl group having 1 to 8 carbon atoms, specifically, methyl group, ethyl group, propyl group, n-butyl group, sec-butyl group, hexyl. Preferred examples include a group and an octyl group.
The cycloalkyl group as L ₁ and L ₂ is, for example, a cycloalkyl group having 3 to 15 carbon atoms. Specifically, a cyclopentyl group, a cyclohexyl group, a norbornyl group, an adamantyl group, and the like are preferable examples. Can do.

The monovalent aromatic ring group as L ₁ and L ₂ is, for example, an aryl group having 6 to 15 carbon atoms. Specifically, a phenyl group, a tolyl group, a naphthyl group, an anthryl group and the like are preferable examples. Can be mentioned.
Group formed by combining an alkylene group and a monovalent aromatic ring group represented by L ₁ and L ₂ are, for example, a 6 to 20 carbon atoms, a benzyl group, an aralkyl group such as a phenethyl group.
The divalent linking group as M is, for example, an alkylene group (for example, methylene group, ethylene group, propylene group, butylene group, hexylene group, octylene group, etc.), cycloalkylene group (for example, cyclopentylene group, cyclohexylene group). Group, adamantylene group, etc.), alkenylene group (for example, ethenylene group, propenylene group, butenylene group, etc.), divalent aromatic ring group (for example, phenylene group, tolylene group, naphthylene group, etc.), -S-, -O _{-, - CO -, - SO} 2 -, - N (R 0) -, and a divalent linking group formed by combining a plurality of these. R ₀ is a hydrogen atom or an alkyl group (for example, an alkyl group having 1 to 8 carbon atoms, specifically, methyl group, ethyl group, propyl group, n-butyl group, sec-butyl group, hexyl group). Octyl group, etc.).

The alkyl group as Q is the same as each group as L ₁ and L ₂ described above.
In the cycloalkyl group which may contain a hetero atom as Q and the monovalent aromatic ring group which may contain a hetero atom, an aliphatic hydrocarbon ring group which does not contain a hetero atom and a hetero atom Examples of the monovalent aromatic ring group that does not include the above-described cycloalkyl groups as L ₁ and L ₂ , and monovalent aromatic ring groups, preferably 3 to 15 carbon atoms.
Examples of the cycloalkyl group containing a hetero atom and the monovalent aromatic ring group containing a hetero atom include thiirane, cyclothiolane, thiophene, furan, pyrrole, benzothiophene, benzofuran, benzopyrrole, triazine, imidazole, benzimidazole, triazole, Groups having a heterocyclic structure such as thiadiazole, thiazole, pyrrolidone and the like can be mentioned, but if it is a structure generally called a heterocyclic ring (a ring formed of carbon and a heteroatom, or a ring formed of a heteroatom), these It is not limited to.

Q, M, as a ring which may be formed by combining at least two L _1, Q, M, by combining at least two L _1, for example, a propylene group, to form a butylene group, an oxygen atom The case where a 5-membered or 6-membered ring containing is formed is mentioned.
Each group represented by L ₁ , L ₂ , M, and Q in the general formula (VI-A) may have a substituent, for example, R _{36 to} R ₃₉ , R ₀₁ , R ₀₂ described above. And those described as the substituent that Ar may have, and the carbon number of the substituent is preferably 8 or less.
The group represented by -MQ is preferably a group composed of 1 to 30 carbon atoms, more preferably a group composed of 5 to 20 carbon atoms.

  Specific examples of the repeating unit represented by formula (VI) are shown below as preferred specific examples of the repeating unit (a), but the present invention is not limited thereto.

  Moreover, resin (A) may contain the repeating unit represented by the following general formula (BZ) as a repeating unit (a).

In general formula (BZ), AR represents an aryl group. Rn represents an alkyl group, a cycloalkyl group, or an aryl group. Rn and AR may be bonded to each other to form a non-aromatic ring.
R ₁ represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group or an alkyloxycarbonyl group.

The aryl group for AR is preferably a group having 6 to 20 carbon atoms such as a phenyl group, a naphthyl group, an anthryl group, or a fluorene group, and more preferably a group having 6 to 15 carbon atoms.
When AR is a naphthyl group, anthryl group, or fluorene group, the bonding position between the carbon atom to which Rn is bonded and AR is not particularly limited. For example, when AR is a naphthyl group, this carbon atom may be bonded to the α-position of the naphthyl group or may be bonded to the β-position. Alternatively, when AR is an anthryl group, this carbon atom may be bonded to the 1-position, the 2-position, or the 9-position of the anthryl group.
Each of the aryl groups as AR may have one or more substituents. Specific examples of such substituents include, for example, methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, pentyl group, hexyl group, octyl group and dodecyl group. A linear or branched alkyl group having 1 to 20 carbon atoms, an alkoxy group containing these alkyl group parts, a cycloalkyl group such as a cyclopentyl group and a cyclohexyl group, a cycloalkoxy group containing these cycloalkyl group parts, a hydroxyl group , Halogen atom, aryl group, cyano group, nitro group, acyl group, acyloxy group, acylamino group, sulfonylamino group, alkylthio group, arylthio group, aralkylthio group, thiophenecarbonyloxy group, thiophenemethylcarbonyloxy group, and pyrrolidone residue And heterocyclic residues such as groups. As this substituent, a linear or branched alkyl group having 1 to 5 carbon atoms and an alkoxy group containing the alkyl group portion are preferable, and a paramethyl group or a paramethoxy group is more preferable.

When the aryl group as AR has a plurality of substituents, at least two of the plurality of substituents may be bonded to each other to form a ring. The ring is preferably a 5- to 8-membered ring, and more preferably a 5- or 6-membered ring. Moreover, this ring may be a heterocycle containing a heteroatom such as an oxygen atom, a nitrogen atom, or a sulfur atom as a ring member.
Furthermore, this ring may have a substituent. As this substituent, the thing similar to what is mentioned later about the further substituent which Rn may have is mentioned.
Moreover, it is preferable that the repeating unit (a) represented by general formula (BZ) contains two or more aromatic rings from a viewpoint of roughness performance. The number of aromatic rings contained in this repeating unit is usually preferably 5 or less, and more preferably 3 or less.
In the repeating unit (a) represented by the general formula (BZ), from the viewpoint of roughness performance, AR preferably contains two or more aromatic rings, and AR is a naphthyl group or a biphenyl group. Is more preferable. The number of aromatic rings possessed by AR is usually preferably 5 or less, and more preferably 3 or less.

As described above, Rn represents an alkyl group, a cycloalkyl group, or an aryl group.
The alkyl group of Rn may be a straight chain alkyl group or a branched chain alkyl group. The alkyl group is preferably a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, a pentyl group, a hexyl group, a cyclohexyl group, an octyl group or a dodecyl group. A thing with 1-20 carbon atoms is mentioned. The alkyl group of Rn preferably has 1 to 5 carbon atoms, and more preferably has 1 to 3 carbon atoms.
Examples of the cycloalkyl group represented by Rn include those having 3 to 15 carbon atoms such as a cyclopentyl group and a cyclohexyl group.
As the aryl group of Rn, for example, those having 6 to 14 carbon atoms such as phenyl group, xylyl group, toluyl group, cumenyl group, naphthyl group and anthryl group are preferable.

Each of the alkyl group, cycloalkyl group and aryl group as Rn may further have a substituent. Examples of the substituent include an alkoxy group, a hydroxyl group, a halogen atom, a nitro group, an acyl group, an acyloxy group, an acylamino group, a sulfonylamino group, a dialkylamino group, an alkylthio group, an arylthio group, an aralkylthio group, and a thiophenecarbonyloxy group. , Thiophenemethylcarbonyloxy group, and heterocyclic residues such as pyrrolidone residues. Among these, an alkoxy group, a hydroxyl group, a halogen atom, a nitro group, an acyl group, an acyloxy group, an acylamino group, and a sulfonylamino group are particularly preferable.
R ₁ represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group, or an alkyloxycarbonyl group as described above.
Examples of the alkyl group and cycloalkyl group for R ₁ include the same groups as those described above for Rn. Each of these alkyl groups and cycloalkyl groups may have a substituent. Examples of this substituent include the same as those described above for Rn.

When R ₁ is an alkyl group or a cycloalkyl group having a substituent, particularly preferable R ₁ includes, for example, a trifluoromethyl group, an alkyloxycarbonylmethyl group, an alkylcarbonyloxymethyl group, a hydroxymethyl group, and an alkoxymethyl group. Groups.
Examples of the halogen atom for R ₁ include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Among these, a fluorine atom is particularly preferable.
The alkyl group moiety contained in the alkyloxycarbonyl group of R _1, for example, it is possible to adopt a configuration in which previously mentioned as the alkyl group of R _1.
Rn and AR are preferably bonded to each other to form a non-aromatic ring, and in particular, roughness performance can be further improved.

The non-aromatic ring that may be formed by bonding Rn and AR to each other is preferably a 5- to 8-membered ring, more preferably a 5- or 6-membered ring.
The non-aromatic ring may be an aliphatic ring or a heterocycle containing a hetero atom such as an oxygen atom, a nitrogen atom, or a sulfur atom as a ring member.
The non-aromatic ring may have a substituent. As this substituent, the thing similar to having demonstrated previously about the further substituent which Rn may have is mentioned, for example.

  Specific examples of the repeating unit (a) represented by the general formula (BZ) are shown below, but are not limited thereto.

  Moreover, the aspect of the repeating unit which produces an alcoholic hydroxyl group may be sufficient as the aspect of the repeating unit which has an acid-decomposable group different from the repeating unit illustrated above. In this case, it is preferably represented by any one of the following general formulas (I-1) to (I-10). The repeating unit is more preferably represented by any one of the following general formulas (I-1) to (I-3), and more preferably represented by the following general formula (I-1).

Where
Each Ra independently represents a hydrogen atom, an alkyl group or a group represented by —CH ₂ —O—Ra ₂ . Here, Ra ₂ represents a hydrogen atom, an alkyl group, or an acyl group.
R ₁ represents an (n + 1) valent organic group.
R ₂ independently represents a single bond or an (n + 1) -valent organic group when m ≧ 2.
OP each independently represents the above group which decomposes by the action of an acid to produce an alcoholic hydroxy group. When n ≧ 2 and / or m ≧ 2, two or more OPs may be bonded to each other to form a ring.
W represents a methylene group, an oxygen atom or a sulfur atom.
n and m represent an integer of 1 or more. In general formula (I-2), (I-3) or (I-8), n is 1 when R ₂ represents a single bond.
l represents an integer of 0 or more.
L ₁ represents a linking group represented by —COO—, —OCO—, —CONH—, —O—, —Ar—, —SO ₃ — or —SO ₂ NH—. Here, Ar represents a divalent aromatic ring group.
Each R independently represents a hydrogen atom or an alkyl group.
R ₀ represents a hydrogen atom or an organic group.
L ₃ represents a (m + 2) -valent linking group.
R ^L each independently represents an (n + 1) -valent linking group when m ≧ 2.
R ^S each independently represents a substituent when p ≧ 2. For p ≧ 2, plural structured R ^S may be bonded to each other to form a ring.
p represents an integer of 0 to 3.

Ra represents a hydrogen atom, an alkyl group, or a group represented by —CH ₂ —O—Ra ₂ . Ra is preferably a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and more preferably a hydrogen atom or a methyl group.
W represents a methylene group, an oxygen atom or a sulfur atom. W is preferably a methylene group or an oxygen atom.
R ₁ represents an (n + 1) valent organic group. R ₁ is preferably a non-aromatic hydrocarbon group. In this case, R ₁ may be a chain hydrocarbon group or an alicyclic hydrocarbon group. R ₁ is more preferably an alicyclic hydrocarbon group.
R ₂ represents a single bond or an (n + 1) valent organic group. R ₂ is preferably a single bond or a non-aromatic hydrocarbon group. In this case, R ₂ may be a chain hydrocarbon group or an alicyclic hydrocarbon group.
When R ₁ and / or R ₂ is a chain hydrocarbon group, the chain hydrocarbon group may be linear or branched. The chain hydrocarbon group preferably has 1 to 8 carbon atoms. For example, when R ₁ and / or R ₂ is an alkylene group, R ₁ and / or R ₂ is a methylene group, ethylene group, n-propylene group, isopropylene group, n-butylene group, isobutylene group or sec- A butylene group is preferred.
When R ₁ and / or R ₂ is an alicyclic hydrocarbon group, the alicyclic hydrocarbon group may be monocyclic or polycyclic. This alicyclic hydrocarbon group has, for example, a monocyclo, bicyclo, tricyclo or tetracyclo structure. The carbon number of this alicyclic hydrocarbon group is usually 5 or more, preferably 6 to 30, and more preferably 7 to 25.

Examples of the alicyclic hydrocarbon group include those having the partial structures listed below. Each of these partial structures may have a substituent. In each of these partial structures, the methylene group (—CH ₂ —) includes an oxygen atom (—O—), a sulfur atom (—S—), a carbonyl group [—C (═O) —], a sulfonyl group [ -S (= O) _2- ], a sulfinyl group [-S (= O)-], or an imino group [-N (R)-] (R is a hydrogen atom or an alkyl group).

For example, when R ₁ and / or R ₂ is a cycloalkylene group, R ₁ and / or R ₂ may be an adamantylene group, a noradamantylene group, a decahydronaphthylene group, a tricyclodecanylene group, a tetracyclododeca group. Nylene group, norbornylene group, cyclopentylene group, cyclohexylene group, cycloheptylene group, cyclooctylene group, cyclodecanylene group, or cyclododecanylene group are preferable, and adamantylene group, norbornylene group, cyclohexylene group, cyclopentylene It is more preferable that they are a len group, a tetracyclododecanylene group, or a tricyclodecanylene group.
The non-aromatic hydrocarbon group of R ₁ and / or R ₂ may have a substituent. Examples of the substituent include an alkyl group having 1 to 4 carbon atoms, a halogen atom, a hydroxy group, an alkoxy group having 1 to 4 carbon atoms, a carboxy group, and an alkoxycarbonyl group having 2 to 6 carbon atoms. The above alkyl group, alkoxy group and alkoxycarbonyl group may further have a substituent. As this substituent, a hydroxy group, a halogen atom, and an alkoxy group are mentioned, for example.
L ₁ represents a linking group represented by —COO—, —OCO—, —CONH—, —O—, —Ar—, —SO ₃ — or —SO ₂ NH—. Here, Ar represents a divalent aromatic ring group. L ₁ is preferably a linking group represented by —COO—, —CONH— or —Ar—, and more preferably a linking group represented by —COO— or —CONH—.
R represents a hydrogen atom or an alkyl group. The alkyl group may be linear or branched. Carbon number of this alkyl group becomes like this. Preferably it is 1-6, More preferably, it is 1-3. R is preferably a hydrogen atom or a methyl group, and more preferably a hydrogen atom.

R ₀ represents a hydrogen atom or an organic group. Examples of the organic group include an alkyl group, a cycloalkyl group, an aryl group, an alkynyl group, and an alkenyl group. R ₀ is preferably a hydrogen atom or an alkyl group, and more preferably a hydrogen atom or a methyl group.
L ₃ represents a (m + 2) -valent linking group. That is, L ₃ represents a trivalent or higher linking group. Examples of such a linking group include corresponding groups in specific examples described later.
R ^L represents a (n + 1) -valent linking group. That is, R ^L represents a divalent or higher linking group. Examples of such a linking group include an alkylene group, a cycloalkylene group, and corresponding groups in the specific examples described below. R ^L may be bonded to each other or bonded to the following R ^S to form a ring structure.
R ^S represents a substituent. Examples of the substituent include an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an alkoxy group, an acyloxy group, an alkoxycarbonyl group, and a halogen atom.
n is an integer of 1 or more. n is preferably an integer of 1 to 3, and more preferably 1 or 2. When n is 2 or more, it is possible to further improve the dissolution contrast with respect to a developer containing an organic solvent. Accordingly, in this way, the limit resolution and roughness characteristics can be further improved.
m is an integer of 1 or more. m is preferably an integer of 1 to 3, and more preferably 1 or 2.
l is an integer of 0 or more. l is preferably 0 or 1.
p is an integer of 0-3.
Specific examples of the repeating unit having a group that decomposes by the action of an acid to generate an alcoholic hydroxy group are shown below. In specific examples, Ra and OP have the same meanings as in general formulas (I-1) to (I-3). Further, when a plurality of OPs are bonded to each other to form a ring, the corresponding ring structure is represented as “OPO” for convenience.

  The group that decomposes by the action of an acid to produce an alcoholic hydroxy group is preferably represented by any one of the following general formulas (II-1) to (II-4).

Where
Rx ₃ each independently represents a hydrogen atom or a monovalent organic group. Rx ₃ may be bonded to each other to form a ring.
Rx ₄ each independently represents a monovalent organic group. Rx ₄ may be bonded to each other to form a ring. Rx ₃ and Rx ₄ may be bonded to each other to form a ring.
Rx ₅ each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an alkenyl group, or an alkynyl group. At least two Rx ₅ may be bonded to each other to form a ring. However, when one or two of the three Rx ₅ are hydrogen atoms, at least one of the remaining Rx ₅ represents an aryl group, an alkenyl group, or an alkynyl group.
The group that decomposes by the action of an acid to produce an alcoholic hydroxy group is also preferably represented by any one of the following general formulas (II-5) to (II-9).

Where
Rx ₄ has the same meaning as in general formulas (II-1) to (II-3).
Rx ₆ each independently represents a hydrogen atom or a monovalent organic group. Rx ₆ may be bonded to each other to form a ring.
The group that decomposes by the action of an acid to produce an alcoholic hydroxy group is more preferably represented by any one of the general formulas (II-1) to (II-3). More preferably, it is represented by II-3), and particularly preferably represented by formula (II-1).

Rx ₃ represents a hydrogen atom or a monovalent organic group as described above. Rx ₃ is preferably a hydrogen atom, an alkyl group or a cycloalkyl group, and more preferably a hydrogen atom or an alkyl group.
The alkyl group of Rx ₃ may be linear or branched. The carbon number of the alkyl group of rx ₃ is preferably 1 to 10, more preferably 1-3. Examples of the alkyl group for Rx ₃ include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, and an n-butyl group.
The cycloalkyl group represented by Rx ₃ may be monocyclic or polycyclic. The number of carbon atoms in the cycloalkyl group of Rx ₃ is preferably 3 to 10, and more preferably 4 to 8. Examples of the cycloalkyl group represented by Rx ₃ include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a norbornyl group, and an adamantyl group.

In general formula (II-1), at least one of Rx ₃ is preferably a monovalent organic group. When such a configuration is employed, particularly high sensitivity can be achieved.
Rx ₄ represents a monovalent organic group. Rx ₄ is preferably an alkyl group or a cycloalkyl group, and more preferably an alkyl group. These alkyl groups and cycloalkyl groups may have a substituent.
The alkyl group of Rx ₄ preferably has no substituent, or has one or more aryl groups and / or one or more silyl groups as substituents. The carbon number of the unsubstituted alkyl group is preferably 1-20. It is preferable that carbon number of the alkyl group part in the alkyl group substituted by one or more aryl groups is 1-25. It is preferable that carbon number of the alkyl group part in the alkyl group substituted by the 1 or more silyl group is 1-30. Also, if the cycloalkyl group Rx ₄ does not have a substituent, the carbon number thereof is preferably from 3 to 20.
Rx ₅ represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an alkenyl group, or an alkynyl group. However, when one or two of the three Rx ₅ are hydrogen atoms, at least one of the remaining Rx ₅ represents an aryl group, an alkenyl group, or an alkynyl group. Rx ₅ is preferably a hydrogen atom or an alkyl group. The alkyl group may have a substituent or may not have a substituent. When the alkyl group does not have a substituent, the carbon number is preferably 1 to 6, and preferably 1 to 3.
Rx ₆ represents a hydrogen atom or a monovalent organic group as described above. Rx ₆ is preferably a hydrogen atom, an alkyl group or a cycloalkyl group, more preferably a hydrogen atom or an alkyl group, and still more preferably a hydrogen atom or an alkyl group having no substituent. Rx ₆ is preferably a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 10 carbon atoms and having no substituent.
Examples of the alkyl group and cycloalkyl group of Rx ₄ , Rx _5, and Rx ₆ include the same as those described above for Rx ₃ .
Below, the specific example of the group which decomposes | disassembles by the effect | action of an acid and produces an alcoholic hydroxy group is shown.

Specific examples of the repeating unit having a group that decomposes by the action of an acid to generate an alcoholic hydroxy group are shown below. In the following specific examples, Xa ₁ represents a hydrogen atom, CH ₃ , CF ₃ , or CH ₂ OH.

  One type of repeating unit having the acid-decomposable group may be used, or two or more types may be used in combination.

  The content of the repeating unit having an acid-decomposable group in the resin (A) (when there are a plurality of types) is 5 mol% or more and 80 mol% or less with respect to all the repeating units in the resin (A). It is preferably 5 mol% or more and 75 mol% or less, more preferably 10 mol% or more and 65 mol% or less.

(B) Repeating unit having a polar group The resin (A) preferably contains a repeating unit (b) having a polar group.
By including the repeating unit (b), for example, the sensitivity of the composition containing a resin can be improved. The repeating unit (b) is preferably a non-acid-decomposable repeating unit (that is, having no acid-decomposable group).
Examples of the “polar group” that the repeating unit (b) may contain include the following (1) to (4). In the following, “electronegativity” means a value by Pauling.

(1) A functional group including a structure in which an oxygen atom and an atom having an electronegativity difference of 1.1 or more are bonded by a single bond. Examples of such a polar group include a hydroxy group and the like. And a group containing a structure represented by O—H.
(2) Functional group including a structure in which a nitrogen atom and an atom having a difference in electronegativity of the nitrogen atom of 0.6 or more are bonded by a single bond. Examples of such a polar group include an amino group and the like. And a group containing a structure represented by N—H.
(3) Functional group including a structure in which two atoms having electronegativity different by 0.5 or more are bonded by a double bond or a triple bond. Examples of such a polar group include C≡N, C═O, N = And a group containing a structure represented by O, S═O or C═N.
(4) Functional group having an ionic moiety Examples of such a polar group include a group having a moiety represented by N ⁺ or S ⁺ .
Specific examples of the partial structure that can be included in the “polar group” are given below. In the following specific examples, X ⁻ represents a counter anion.

  The “polar group” that the repeating unit (b) may contain includes, for example, (I) hydroxy group, (II) cyano group, (III) lactone group, (IV) carboxylic acid group or sulfonic acid group, (V) amide group , A group corresponding to a sulfonamide group or a derivative thereof, (VI) an ammonium group or a sulfonium group, and at least one selected from the group consisting of a combination of two or more thereof.

The polar group is selected from a hydroxyl group, a cyano group, a lactone group, a carboxylic acid group, a sulfonic acid group, an amide group, a sulfonamide group, an ammonium group, a sulfonium group, and a group formed by combining two or more thereof. Are preferable, and an alcoholic hydroxy group, a cyano group, a lactone group, or a group containing a cyanolactone structure is particularly preferable.
When the resin further contains a repeating unit having an alcoholic hydroxy group, the exposure latitude (EL) of the composition containing the resin can be further improved.
When the resin further contains a repeating unit having a cyano group, the sensitivity of the composition containing the resin can be further improved.
If the resin further contains a repeating unit having a lactone group, the dissolution contrast with respect to the developer containing an organic solvent can be further improved. This also makes it possible to further improve the dry etching resistance, coating properties, and adhesion to the substrate of the resin-containing composition.
If the resin further contains a repeating unit having a group containing a lactone structure having a cyano group, the dissolution contrast with respect to the developer containing an organic solvent can be further improved. This also makes it possible to further improve the sensitivity, dry etching resistance, applicability, and adhesion to the substrate of the composition containing the resin. In addition, this makes it possible for a single repeating unit to have a function attributable to each of the cyano group and the lactone group, thereby further increasing the degree of freedom in designing the resin.

  When the polar group which the repeating unit (b) has is an alcoholic hydroxy group, it is preferably represented by any one of the following general formulas (I-1H) to (I-10H). In particular, it is more preferably represented by any one of the following general formulas (I-1H) to (I-3H), and more preferably represented by the following general formula (I-1H).

In the formula, Ra, R ₁ , R ₂ , W, n, m, l, L ₁ , R, R ₀ , L ₃ , R ^L , R ^S and p are represented by the general formulas (I-1) to (I− It is synonymous with each of 10).
When a repeating unit having a group that decomposes by the action of an acid to generate an alcoholic hydroxy group and a repeating unit represented by any one of the above general formulas (I-1H) to (I-10H) are used in combination, Improved exposure latitude (EL) without degrading other performances by suppressing acid diffusion by alcoholic hydroxy groups and increasing sensitivity by groups that decompose by the action of acids to produce alcoholic hydroxy groups It becomes possible to do.
The content of the repeating unit having an alcoholic hydroxy group is preferably from 1 to 60 mol%, more preferably from 3 to 50 mol%, still more preferably from 5 to 40 mol%, based on all repeating units in the resin (A).
Specific examples of the repeating unit represented by any one of the general formulas (I-1H) to (I-10H) are shown below. In specific examples, Ra is as defined in general formulas (I-1H) to (I-10H).

  When the polar group which the repeating unit (b) has is an alcoholic hydroxy group or a cyano group, it is a repeating unit having an alicyclic hydrocarbon structure substituted with a hydroxyl group or a cyano group as one embodiment of a preferable repeating unit. Is mentioned. At this time, it is preferable not to have an acid-decomposable group. The alicyclic hydrocarbon structure in the alicyclic hydrocarbon structure substituted with a hydroxyl group or a cyano group is preferably an adamantyl group, a diamantyl group, or a norbornane group. As the alicyclic hydrocarbon structure substituted with a preferred hydroxyl group or cyano group, partial structures represented by the following general formulas (VIIa) to (VIIc) are preferable. This improves the substrate adhesion and developer compatibility.

In general formulas (VIIa) to (VIIc),
R ₂ c to R ₄ c each independently represents a hydrogen atom, a hydroxyl group, or a cyano group. However, at least one of R ₂ c to R ₄ c represents a hydroxyl group. Preferably, one or two of R ₂ c to R ₄ c are a hydroxyl group and the rest are hydrogen atoms. In general formula (VIIa), more preferably, _two of R ₂ c to R ₄ c are a hydroxyl group and the rest are hydrogen atoms.

  Examples of the repeating unit having a partial structure represented by the general formulas (VIIa) to (VIIc) include the repeating units represented by the following general formulas (AIIa) to (AIIc).

In the general formulas (AIIa) to (AIIc),
R ₁ c represents a hydrogen atom, a methyl group, a trifluoromethyl group, or a hydroxymethyl group.

R ₂ c to R ₄ c are in the general formula (VIIa) ~ _(VIIc), same meanings as R 2 c~R ₄ c.

  The resin (A) may or may not contain a repeating unit having a hydroxyl group or a cyano group. However, when it is contained, the content of the repeating unit having a hydroxyl group or a cyano group is in the resin (A). The total repeating unit is preferably 1 to 60 mol%, more preferably 3 to 50 mol%, still more preferably 5 to 40 mol%.

  Specific examples of the repeating unit having a hydroxyl group or a cyano group are given below, but the present invention is not limited thereto.

The repeating unit (b) may be a repeating unit having a lactone structure as a polar group.
The repeating unit having a lactone structure is more preferably a repeating unit represented by the following general formula (AII).

In general formula (AII),
Rb ₀ represents a hydrogen atom, a halogen atom or an optionally substituted alkyl group (preferably having 1 to 4 carbon atoms).
Preferable substituents that the alkyl group of Rb ₀ may have include a hydroxyl group and a halogen atom. Examples of the halogen atom for Rb ₀ include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Rb ₀ is preferably a hydrogen atom, a methyl group, a hydroxymethyl group or a trifluoromethyl group, and particularly preferably a hydrogen atom or a methyl group.

Ab represents a single bond, an alkylene group, a divalent linking group having a monocyclic or polycyclic cycloalkyl structure, an ether bond, an ester bond, a carbonyl group, or a divalent linking group obtained by combining these. Ab is preferably a single bond or a divalent linking group represented by —Ab ₁ —CO ₂ —.
Ab ₁ is a linear or branched alkylene group, a monocyclic or polycyclic cycloalkylene group, and preferably a methylene group, an ethylene group, a cyclohexylene group, an adamantylene group, or a norbornylene group.
V represents a group having a lactone structure.

  As the group having a lactone structure, any group having a lactone structure can be used, but a 5- to 7-membered ring lactone structure is preferable, and a bicyclo structure or a spiro structure is added to the 5- to 7-membered ring lactone structure. Those in which other ring structures are condensed in the form to be formed are preferred. It is more preferable to have a repeating unit having a lactone structure represented by any of the following general formulas (LC1-1) to (LC1-17). The lactone structure may be directly bonded to the main chain. Preferred lactone structures are (LC1-1), (LC1-4), (LC1-5), (LC1-6), (LC1-8), (LC1-13), and (LC1-14).

The lactone structure portion may or may not have a substituent (Rb ₂ ). Preferred substituents (Rb ₂ ) include an alkyl group having 1 to 8 carbon atoms, a monovalent cycloalkyl group having 4 to 7 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, and an alkoxycarbonyl group having 2 to 8 carbon atoms. , Carboxyl group, halogen atom, hydroxyl group, cyano group, acid-decomposable group and the like. More preferably, they are a C1-C4 alkyl group, a cyano group, and an acid-decomposable group. n ₂ represents an integer of 0-4. When n ₂ is 2 or more, a plurality of substituents (Rb ₂ ) may be the same or different, and a plurality of substituents (Rb ₂ ) may be bonded to form a ring. .

  The repeating unit having a lactone group usually has an optical isomer, but any optical isomer may be used. One optical isomer may be used alone, or a plurality of optical isomers may be mixed and used. When one kind of optical isomer is mainly used, the optical purity (ee) thereof is preferably 90% or more, more preferably 95% or more.

The resin (A) may or may not contain a repeating unit having a lactone structure, but when it contains a repeating unit having a lactone structure, the content of the repeating unit in the resin (A) is The range of 1 to 70 mol% is preferable with respect to the repeating unit, more preferably 3 to 65 mol%, and still more preferably 5 to 60 mol%.
Specific examples of the repeating unit having a lactone structure in the resin (A) are shown below, but the present invention is not limited thereto. In the formula, Rx represents H, CH ₃ , CH ₂ OH, or CF ₃ .

  Moreover, it is also one of the especially preferable aspects that the polar group which a repeating unit (b) can have is an acidic group. Preferred acidic groups include phenolic hydroxyl groups, carboxylic acid groups, sulfonic acid groups, fluorinated alcohol groups (eg hexafluoroisopropanol group), sulfonamide groups, sulfonylimide groups, (alkylsulfonyl) (alkylcarbonyl) methylene groups, Alkylsulfonyl) (alkylcarbonyl) imide group, bis (alkylcarbonyl) methylene group, bis (alkylcarbonyl) imide group, bis (alkylsulfonyl) methylene group, bis (alkylsulfonyl) imide group, tris (alkylcarbonyl) methylene group, A tris (alkylsulfonyl) methylene group is mentioned. Of these, the repeating unit (b) is more preferably a repeating unit having a carboxyl group. By containing the repeating unit having an acidic group, the resolution in the contact hole application is increased. The repeating unit having an acidic group includes a repeating unit in which an acidic group is directly bonded to the main chain of the resin, such as a repeating unit of acrylic acid or methacrylic acid, or an acidic group in the main chain of the resin through a linking group. It is preferable to use a polymerization initiator or a chain transfer agent having a repeating unit bonded to each other, or an acidic group, at the time of polymerization and introduce it at the end of the polymer chain. Particularly preferred are repeating units of acrylic acid or methacrylic acid.

The acidic group that the repeating unit (b) can have may or may not contain an aromatic ring, but when it has an aromatic ring, it is preferably selected from acidic groups other than phenolic hydroxyl groups. When the repeating unit (b) has an acidic group, the content of the repeating unit having an acidic group is preferably 30 mol% or less, preferably 20 mol% or less, based on all repeating units in the resin (A). More preferably. When resin (A) contains the repeating unit which has an acidic group, content of the repeating unit which has an acidic group in resin (A) is 1 mol% or more normally.
Specific examples of the repeating unit having an acidic group are shown below, but the present invention is not limited thereto.
In specific examples, Rx represents H, CH ₃ , CH ₂ OH, or CF ₃ .

  The resin (A) of the present invention can have a non-acid-decomposable repeating unit (b) having a phenolic hydroxyl group. As the repeating unit (b) in this case, a structure represented by the following general formula (I) is more preferable.

Where
R ₄₁ , R ₄₂ and R ₄₃ each independently represents a hydrogen atom, an alkyl group, a halogen atom, a cyano group or an alkoxycarbonyl group. However, R ₄₂ may form a ring with Ar _4, R ₄₂ in this case represents a single bond or an alkylene group.
X ₄ represents a single bond, —COO—, or —CONR ₆₄ —, and R ₆₄ represents a hydrogen atom or an alkyl group.
L ₄ represents a single bond or an alkylene group.
Ar ₄ represents an (n + 1) -valent aromatic ring group, and when bonded to R ₄₂ to form a ring, represents an (n + 2) -valent aromatic ring group.
n represents an integer of 1 to 4.

Specific examples of the alkyl group, cycloalkyl group, halogen atom, alkoxycarbonyl group of R ₄₁ , R ₄₂ , and R ₄₃ in formula (I), and the substituents that these groups may have include the above general formula (V). Are the same as the specific examples described for the groups represented by R ₅₁ , R ₅₂ , and R ₅₃ .
Ar ₄ represents an (n + 1) -valent aromatic ring group. The divalent aromatic ring group in the case where n is 1 may have a substituent, for example, an arylene group having 6 to 18 carbon atoms such as a phenylene group, a tolylene group, a naphthylene group, and an anthracenylene group, or Examples of preferred aromatic ring groups include heterocycles such as thiophene, furan, pyrrole, benzothiophene, benzofuran, benzopyrrole, triazine, imidazole, benzimidazole, triazole, thiadiazole, thiazole.

Specific examples of the (n + 1) -valent aromatic ring group in the case where n is an integer of 2 or more include (n-1) arbitrary hydrogen atoms removed from the above-described specific examples of the divalent aromatic ring group. The group formed can be preferably mentioned.
The (n + 1) -valent aromatic ring group may further have a substituent.

Examples of the substituent that the above-described alkyl group, cycloalkyl group, alkoxycarbonyl group, alkylene group, and (n + 1) -valent aromatic ring group may have include the alkyl groups exemplified as R _{51 to} R ₅₃ in formula (V), Examples thereof include alkoxy groups such as methoxy group, ethoxy group, hydroxyethoxy group, propoxy group, hydroxypropoxy group and butoxy group, and aryl groups such as phenyl group.
_-CONR 64 represented by X ₄ - _{(R 64} represents a hydrogen atom, an alkyl group) The alkyl group for _{R 64 in,} the same as the alkyl group of R 61 _{to R 63.}
X ₄ is preferably a single bond, —COO—, or —CONH—, and more preferably a single bond or —COO—.

The alkylene group for L ₄ is preferably an alkylene group having 1 to 8 carbon atoms, such as an optionally substituted methylene group, ethylene group, propylene group, butylene group, hexylene group, octylene group.
Ar ₄ is more preferably an aromatic ring group having 6 to 18 carbon atoms which may have a substituent, and particularly preferably a benzene ring group, a naphthalene ring group or a biphenylene ring group.
The repeating unit (b) preferably has a hydroxystyrene structure. That is, Ar ₄ is preferably a benzene ring group.

  Specific examples of the repeating unit (b) represented by the general formula (I) are shown below, but the present invention is not limited thereto. In the formula, a represents an integer of 1 or 2.

  The resin (A) may contain two or more types of repeating units represented by the general formula (I).

(C) Repeating unit having a plurality of aromatic rings The resin (A) may have a repeating unit (c) having a plurality of aromatic rings represented by the following general formula (c1).

In general formula (c1),
R ₃ represents a hydrogen atom, an alkyl group, a halogen atom, a cyano group or a nitro group;
Y represents a single bond or a divalent linking group;
Z represents a single bond or a divalent linking group;
Ar represents an aromatic ring group;
p represents an integer of 1 or more.
The alkyl group as R ₃ may be either linear or branched, for example, methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, sec-butyl group, t-butyl. Group, n-pentyl group, n-hexyl group, n-heptyl group, n-octyl group, n-nonyl group, n-decanyl group and i-butyl group, and may further have a substituent. Preferred examples of the substituent include an alkoxy group, a hydroxyl group, a halogen atom, and a nitro group. Among them, examples of the alkyl group having a substituent include a CF ₃ group, an alkyloxycarbonylmethyl group, an alkylcarbonyloxymethyl group, and hydroxymethyl. Group, alkoxymethyl group and the like are preferable.

Examples of the halogen atom as R ₃ include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom, and a fluorine atom is particularly preferable.
Y represents a single bond or a divalent linking group, and examples of the divalent linking group include an ether group (oxygen atom), a thioether group (sulfur atom), an alkylene group, an arylene group, a carbonyl group, a sulfide group, Sulfone group, —COO—, —CONH—, —SO ₂ NH—, —CF ₂ —, —CF ₂ CF ₂ —, —OCF ₂ O—, —CF ₂ OCF ₂ —, —SS—, —CH ₂ SO ₂ CH ₂ —, —CH ₂ COCH ₂ —, —COCF ₂ CO—, —COCO—, —OCOO—, —OSO ₂ O—, amino group (nitrogen atom), acyl group, alkylsulfonyl group, —CH═CH And —C—C≡C—, an aminocarbonylamino group, an aminosulfonylamino group, or a combination thereof. Y preferably has 15 or less carbon atoms, more preferably 10 or less carbon atoms.

Y is preferably a single bond, —COO— group, —COS— group, —CONH— group, more preferably —COO— group, —CONH— group, and particularly preferably —COO— group.
Z represents a single bond or a divalent linking group, and examples of the divalent linking group include an ether group (oxygen atom), a thioether group (sulfur atom), an alkylene group, an arylene group, a carbonyl group, a sulfide group, Sulfone group, —COO—, —CONH—, —SO ₂ NH—, amino group (nitrogen atom), acyl group, alkylsulfonyl group, —CH═CH—, aminocarbonylamino group, aminosulfonylamino group, or these Examples include groups consisting of combinations.
Z is preferably a single bond, an ether group, a carbonyl group, or —COO—, more preferably a single bond or an ether group, and particularly preferably a single bond.

Ar represents an aromatic ring group, specifically, phenyl group, naphthyl group, anthracenyl group, phenanthrenyl group, quinolinyl group, furanyl group, thiophenyl group, fluorenyl-9-one-yl group, anthraquinonyl group, phenanthralkyl. A nonyl group, a pyrrole group, etc. are mentioned, A phenyl group is preferable. These aromatic ring groups may further have a substituent. Preferred examples of the substituent include an alkyl group, an alkoxy group, a hydroxyl group, a halogen atom, a nitro group, an acyl group, an acyloxy group, an acylamino group, and a sulfonylamino group. Group, aryl group such as phenyl group, aryloxy group, arylcarbonyl group, heterocyclic residue, etc. Among them, phenyl group suppresses deterioration of exposure latitude and pattern shape caused by out-of-band light It is preferable from the viewpoint.
p is an integer of 1 or more, and is preferably an integer of 1 to 3.

  The repeating unit (c) is more preferably a repeating unit represented by the following formula (c2).

In general formula (c2), R ₃ represents a hydrogen atom or an alkyl group. The thing preferable as an alkyl group as R < ₃ > is the same as that of general formula (c1).

Here, regarding extreme ultraviolet (EUV light) exposure, leakage light (out-of-band light) generated in the ultraviolet region with a wavelength of 100 to 400 nm deteriorates surface roughness, resulting in bridges between patterns and disconnection of patterns. , Resolution and LWR performance tend to decrease.
However, the aromatic ring in the repeating unit (c) functions as an internal filter capable of absorbing the out-of-band light. Therefore, from the viewpoint of high resolution and low LWR, the resin (A) preferably contains the repeating unit (c).
Here, it is preferable that the repeating unit (c) does not have a phenolic hydroxyl group (a hydroxyl group directly bonded on an aromatic ring) from the viewpoint of obtaining high resolution.

  Specific examples of the repeating unit (c) are shown below, but are not limited thereto.

  The resin (A) may or may not contain the repeating unit (c), but when it is contained, the content of the repeating unit (c) is 1 to 30 with respect to the entire repeating unit (A). It is preferably in the range of mol%, more preferably in the range of 1 to 20 mol%, and still more preferably in the range of 1 to 15 mol%. The repeating unit (c) contained in the resin (A) may contain a combination of two or more types.

  The resin (A) in the present invention may appropriately have a repeating unit other than the repeating units (a) to (c). As an example of such a repeating unit, a repeating unit that has an alicyclic hydrocarbon structure that does not have a polar group (for example, the acid group, hydroxyl group, or cyano group) and does not exhibit acid decomposability can be included. Thereby, the solubility of the resin can be appropriately adjusted during development using a developer containing an organic solvent. Examples of such a repeating unit include a repeating unit represented by the general formula (IV).

In general formula (IV), R ₅ represents a hydrocarbon group having at least one cyclic structure and having no polar group.
Ra represents a hydrogen atom, an alkyl group, or a —CH ₂ —O—Ra ₂ group. In the formula, Ra ₂ represents a hydrogen atom, an alkyl group, or an acyl group. Ra is preferably a hydrogen atom, a methyl group, a hydroxymethyl group or a trifluoromethyl group, particularly preferably a hydrogen atom or a methyl group.

The cyclic structure possessed by R ₅ includes a monocyclic hydrocarbon group and a polycyclic hydrocarbon group. Examples of the monocyclic hydrocarbon group include cycloalkenyl having 3 to 12 carbon atoms such as cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group and the like, and cycloalkyl groups having 3 to 12 carbon atoms and cyclohexenyl group. Groups. The preferred monocyclic hydrocarbon group is a monocyclic hydrocarbon group having 3 to 7 carbon atoms, more preferably a cyclopentyl group or a cyclohexyl group.

The polycyclic hydrocarbon group includes a ring assembly hydrocarbon group and a bridged cyclic hydrocarbon group, and examples of the ring assembly hydrocarbon group include a bicyclohexyl group and a perhydronaphthalenyl group. As the bridged cyclic hydrocarbon ring, for example, bicyclic such as pinane, bornane, norpinane, norbornane, bicyclooctane ring (bicyclo [2.2.2] octane ring, bicyclo [3.2.1] octane ring, etc.) Hydrocarbon rings and tricyclic hydrocarbon rings such as homobredan, adamantane, tricyclo [5.2.1.0 ^2,6 ] decane, tricyclo [4.3.1.1 ^2,5 ] undecane ring, tetracyclo [ 4.4.0.1 ^2,5 . 1 ^7,10 ] dodecane, and tetracyclic hydrocarbon rings such as perhydro-1,4-methano-5,8-methanonaphthalene ring. The bridged cyclic hydrocarbon ring includes a condensed cyclic hydrocarbon ring such as perhydronaphthalene (decalin), perhydroanthracene, perhydrophenanthrene, perhydroacenaphthene, perhydrofluorene, perhydroindene, perhydroindene. A condensed ring in which a plurality of 5- to 8-membered cycloalkane rings such as a phenalene ring are condensed is also included.

Preferred examples of the bridged cyclic hydrocarbon ring include a norbornyl group, an adamantyl group, a bicyclooctanyl group, a tricyclo [5.2.1.0 ^2,6 ] decanyl group, and the like. More preferable examples of the bridged cyclic hydrocarbon ring include a norbornyl group and an adamantyl group.

  These alicyclic hydrocarbon groups may have a substituent. Preferred examples of the substituent include a halogen atom, an alkyl group, a hydroxyl group substituted with a hydrogen atom, and an amino group substituted with a hydrogen atom. It is done. Preferred halogen atoms include bromine, chlorine and fluorine atoms, and preferred alkyl groups include methyl, ethyl, butyl and t-butyl groups. The alkyl group described above may further have a substituent, and examples of the substituent that may further include a halogen atom, an alkyl group, a hydroxyl group substituted with a hydrogen atom, and an amino group substituted with a hydrogen atom. The group can be mentioned.

  Examples of the substituent for the hydrogen atom include an alkyl group, a cycloalkyl group, an aralkyl group, a substituted methyl group, a substituted ethyl group, an alkoxycarbonyl group, and an aralkyloxycarbonyl group. Preferred alkyl groups include alkyl groups having 1 to 4 carbon atoms, preferred substituted methyl groups include methoxymethyl, methoxythiomethyl, benzyloxymethyl, t-butoxymethyl, 2-methoxyethoxymethyl groups, and preferred substituted ethyl groups. 1-ethoxyethyl, 1-methyl-1-methoxyethyl, preferred acyl groups include formyl, acetyl, propionyl, butyryl, isobutyryl, valeryl, pivaloyl groups, etc., aliphatic acyl groups having 1 to 6 carbon atoms, alkoxycarbonyl Examples of the group include an alkoxycarbonyl group having 1 to 4 carbon atoms.

The resin (A) has an alicyclic hydrocarbon structure having no polar group, and may or may not contain a repeating unit that does not exhibit acid decomposability. The content is preferably 1 to 20 mol%, more preferably 5 to 15 mol%, based on all repeating units in the resin (A).
Specific examples of the repeating unit having an alicyclic hydrocarbon structure having no polar group and not exhibiting acid decomposability are shown below, but the present invention is not limited thereto. In the formula, Ra represents H, CH ₃ , CH ₂ OH, or CF ₃ .

  Further, the resin (A) may contain the following monomer components in view of the effects such as improvement of Tg, improvement of dry edging resistance, the above-described internal filter of out-of-band light, and the like.

  In the resin (A) used in the composition of the present invention, the content molar ratio of each repeating structural unit is the resist dry etching resistance, standard developer suitability, substrate adhesion, resist profile, and general resist requirements. It is appropriately set in order to adjust the resolution, heat resistance, sensitivity, etc., which are performance.

The form of the resin (A) of the present invention may be any of random type, block type, comb type, and star type.
Resin (A) is compoundable by the radical, cation, or anion polymerization of the unsaturated monomer corresponding to each structure, for example. It is also possible to obtain the desired resin by conducting a polymer reaction after polymerization using an unsaturated monomer corresponding to the precursor of each structure.
For example, as a general synthesis method, an unsaturated monomer and a polymerization initiator are dissolved in a solvent, and a batch polymerization method in which polymerization is performed by heating, a solution of an unsaturated monomer and a polymerization initiator in a heating solvent for 1 to 10 hours. The dropping polymerization method etc. which are dropped and added over are mentioned, and the dropping polymerization method is preferable.

Examples of the solvent used for the polymerization include a solvent that can be used in preparing the actinic ray-sensitive or radiation-sensitive resin composition described below, and more preferably the composition of the present invention. Polymerization is preferably carried out using the same solvent as used in the above. Thereby, generation | occurrence | production of the particle at the time of a preservation | save can be suppressed.
The polymerization reaction is preferably performed in an inert gas atmosphere such as nitrogen or argon. As a polymerization initiator, a commercially available radical initiator (azo initiator, peroxide, etc.) is used to initiate the polymerization. As the radical initiator, an azo initiator is preferable, and an azo initiator having an ester group, a cyano group, or a carboxyl group is preferable. Preferred examples of the initiator include azobisisobutyronitrile, azobisdimethylvaleronitrile, dimethyl 2,2′-azobis (2-methylpropionate) and the like. If necessary, the polymerization may be performed in the presence of a chain transfer agent (for example, alkyl mercaptan).

The reaction concentration is 5 to 70% by mass, preferably 10 to 50% by mass. The reaction temperature is usually from 10 ° C to 150 ° C, preferably from 30 ° C to 120 ° C, more preferably from 40 ° C to 100 ° C.
The reaction time is usually 1 to 48 hours, preferably 1 to 24 hours, more preferably 1 to 12 hours.
After completion of the reaction, the mixture is allowed to cool to room temperature and purified. Purification can be accomplished by a liquid-liquid extraction method that removes residual monomers and oligomer components by combining water and an appropriate solvent, and a purification method in a solution state such as ultrafiltration that extracts and removes only those having a specific molecular weight or less. , Reprecipitation method that removes residual monomer by coagulating resin in poor solvent by dripping resin solution into poor solvent and purification in solid state such as washing filtered resin slurry with poor solvent A normal method such as a method can be applied. For example, the resin is precipitated as a solid by contacting a solvent (poor solvent) in which the resin is hardly soluble or insoluble in a volume amount of 10 times or less, preferably 10 to 5 times that of the reaction solution.

The solvent (precipitation or reprecipitation solvent) used in the precipitation or reprecipitation operation from the polymer solution may be a poor solvent for the polymer, and may be a hydrocarbon, halogenated hydrocarbon, nitro, depending on the type of polymer. A compound, ether, ketone, ester, carbonate, alcohol, carboxylic acid, water, a mixed solvent containing these solvents, and the like can be appropriately selected for use. Among these, as a precipitation or reprecipitation solvent, a solvent containing at least an alcohol (particularly methanol or the like) or water is preferable.
The amount of the precipitation or reprecipitation solvent used can be appropriately selected in consideration of efficiency, yield, and the like, but generally 100 to 10000 parts by mass, preferably 200 to 2000 parts by mass with respect to 100 parts by mass of the polymer solution, More preferably, it is 300-1000 mass parts.
The temperature for precipitation or reprecipitation can be appropriately selected in consideration of efficiency and operability, but is usually about 0 to 50 ° C., preferably around room temperature (for example, about 20 to 35 ° C.). The precipitation or reprecipitation operation can be performed by a known method such as a batch method or a continuous method using a conventional mixing vessel such as a stirring tank.
The precipitated or re-precipitated polymer is usually subjected to conventional solid-liquid separation such as filtration and centrifugation, and dried before use. Filtration is performed using a solvent-resistant filter medium, preferably under pressure. Drying is performed at a temperature of about 30 to 100 ° C., preferably about 30 to 50 ° C. under normal pressure or reduced pressure (preferably under reduced pressure).

In addition, once the resin is precipitated and separated, it may be dissolved again in a solvent, and the resin may be brought into contact with a hardly soluble or insoluble solvent. That is, after completion of the radical polymerization reaction, a solvent in which the polymer is hardly soluble or insoluble is brought into contact, the resin is precipitated (step a), the resin is separated from the solution (step b), and dissolved again in the solvent. (Step c), and then contact the resin solution A with a solvent in which the resin is hardly soluble or insoluble in a volume amount less than 10 times that of the resin solution A (preferably 5 times or less volume). This may be a method including precipitating a resin solid (step d) and separating the precipitated resin (step e).
The polymerization reaction is preferably performed in an inert gas atmosphere such as nitrogen or argon. As a polymerization initiator, a commercially available radical initiator (azo initiator, peroxide, etc.) is used to initiate the polymerization. As the radical initiator, an azo initiator is preferable, and an azo initiator having an ester group, a cyano group, or a carboxyl group is preferable. Preferred examples of the initiator include azobisisobutyronitrile, azobisdimethylvaleronitrile, dimethyl 2,2′-azobis (2-methylpropionate) and the like. If desired, an initiator is added or added in portions, and after completion of the reaction, it is put into a solvent and a desired polymer is recovered by a method such as powder or solid recovery. The concentration of the reaction is 5 to 50% by mass, preferably 10 to 30% by mass. The reaction temperature is usually from 10 ° C to 150 ° C, preferably from 30 ° C to 120 ° C, more preferably from 60 ° C to 100 ° C.

  The molecular weight of the resin (A) according to the present invention is not particularly limited, but the weight average molecular weight is preferably in the range of 1000 to 100,000, more preferably in the range of 1500 to 60000, and in the range of 2000 to 30000. It is particularly preferred. By setting the weight average molecular weight in the range of 1000 to 100,000, it is possible to prevent heat resistance and dry etching resistance from being deteriorated, and also to prevent developability from being deteriorated and the film forming property from being deteriorated due to increased viscosity. be able to. Here, the weight average molecular weight of the resin indicates a molecular weight in terms of polystyrene measured by GPC (carrier: THF or N-methyl-2-pyrrolidone (NMP)).

  The dispersity (Mw / Mn) is preferably 1.00 to 5.00, more preferably 1.03 to 3.50, and still more preferably 1.05 to 2.50. The smaller the molecular weight distribution, the better the resolution and the resist shape, and the smoother the side wall of the resist pattern, the better the roughness.

  Resin (A) of this invention can be used individually by 1 type or in combination of 2 or more types. The content of the resin (A) is preferably 20 to 99% by mass, more preferably 30 to 89% by mass, based on the total solid content in the actinic ray-sensitive or radiation-sensitive resin composition of the present invention. 40-79 mass% is especially preferable.

[2] Compound (B) that generates an acid upon irradiation with an actinic ray or radiation represented by formula (Z1)
The actinic ray-sensitive or radiation-sensitive resin composition of the present invention is a compound (B) that generates an acid upon irradiation with actinic rays or radiation represented by the following general formula (Z1) (hereinafter simply referred to as an acid generator). "Acid generator (B)" and "compound (B)").

In the general formula (Z1), L ₁ represents —O—, —S—, —OS (═O) ₂ —, —S (═O) ₂ O—, —OC (═O) —, —C (═O _{) O -, - S (=} O) -, - S (= O) 2 -, - C (= O) -, - N (R 7) C (= O) -, - C (= O) N ( R ₇ ) —, —N (R ₇ ) S (═O) ₂ — or —S (═O) ₂ N (R ₇ ) — (wherein the right side is the R ₁ side), —O—, —S— , —OS (═O) ₂ —, —S (═O) ₂ O—, —OC (═O) —, or —C (═O) O— are preferable.

R ₇ represents a hydrogen atom, an alkyl group or a cycloalkyl group, and is preferably a hydrogen atom or an alkyl group.
The alkyl group for R ₇ may be linear or branched, may have a substituent, and is preferably an alkyl group having 1 to 20 carbon atoms, for example, a methyl group , Ethyl group, propyl group, butyl group, i-propyl group, t-butyl group, benzyl group, hydroxyethyl and the like.
The cycloalkyl group for R ₇ may have a substituent and is preferably a cycloalkyl group having 3 to 20 carbon atoms, such as a cyclopropyl group, a cyclopentyl group, a cyclohexyl group, or a 4-methylcyclohexyl group. , Norbornyl group, adamantyl group and the like.

R ₁ represents an alkylene group, a cycloalkylene group, an arylene group or a divalent group formed by a combination thereof, in which —O—, —C (═O) —, —S (═O) ₂ — or -S- may be included.
The alkylene group for R ₁ may be linear or branched, may have a substituent, and is preferably an alkylene group having 1 to 20 carbon atoms.
The cycloalkylene group for R ₁ may have a substituent and is preferably a cycloalkylene group having 3 to 20 carbon atoms.
Examples of the substituent that the alkylene group and cycloalkylene group for R ₁ may have include a halogen atom, an aryl group, and an alkyl group. A halogen atom or an aryl group is preferable, and a fluorine atom is more preferable. .
Examples of the alkylene group for R ₁ include a methylene group, an ethylene group, a propylene group, a butylene group, a methylethylene group, a benzylidene group, a phenylethylene group, —CF ₂ —, — (CF ₂ ) ₂ —, — (CF ₂ ) ₃₋ , — (CF ₂ ) ₄ —, —CH ₂ CF ₂ —, —CH ₂ CH ₂ CF ₂ CF ₂ —, —CH (CF ₃ ) CF ₂ — and the like.
Examples of the cycloalkylene group for R ₁ include a 1,3-cyclopentylene group and a 1,4-cyclohexylene group.

The arylene group for R ₁ may have a substituent, may be condensed, and is preferably an arylene group having 6 to 26 carbon atoms.
Examples of the substituent that the arylene group for R ₁ may have include a halogen atom, an alkyl group, a cycloalkyl group, and an aryl group, and a fluorine atom, an isopropyl group, and a cyclohexyl group are preferable.
As the arylene group for R ₁ , for example, 1,2-phenylene group, 1,3-phenylene group, 1,4-phenylene group, 1,4-naphthylene group, 2,5-naphthylene group, 9,10- Anthracenylene group, 2,3,5,6-tetrafluoro-1,4-phenylene group, 2,5-dimethyl-1,4-phenylene group, 3-isopropyl-1,4-phenylene group, 2-isopropyl-1 , 4-phenylene group, 3-cyclohexyl-1,4-phenylene group, 2-cyclohexyl-1,4-phenylene group, 3,5-diisopropyl-1,4-phenylene group, 2,6-diisopropyl-1,4 -Phenylene group, 3,5-dicyclohexyl-1,4-phenylene group, 2,6-dicyclohexyl-1,4-phenylene and the like.

A divalent group formed by combining an alkylene group, a cycloalkylene group or an arylene group as R ₁ , and —O—, —C (═O) —, —S (═O) ₂ — or —S— in the group. As the group having, for example, —CH ₂ C ₆ H ₄ CH ₂ —, —CH ₂ C ₆ H ₄ —, —CH ₂ CH ₂ OCH ₂ CH ₂ —, —CF ₂ CF ₂ OCF ₂ CF ₂ —, _{-CF 2 CH 2 OCH 2 CF 2} -, - CH 2 CH 2 SCH 2 CF 2 -, - CH 2 C (= O) C 6 H 4 -, - CF 2 CF 2 CF 2 S (= O) 2 CF _{2 CF 2 CF 2 -, -} CH 2 C (= O) OCH (CF 3) CF 2 -, - CH 2 CH 2 C (= O) OCH 2 CF 2 - , and the like.
R ₁ is preferably an alkylene group, a partially or fully fluorinated alkylene group, an arylene group, or a partially or fully fluorinated arylene group.

A ₁ is _-SO ³ - It is ^{_{SO 2 R 8 -, -SO 2}} N - SO 2 R 8 or ^{_{-SO 2 C - (SO 2 R}} 9) represents a _2, -SO ₃ ^- or _-SO 2 ^N Is preferable, and —SO ₃ ^— is more preferable.
R ₈ represents an alkyl group, a cycloalkyl group or an aryl group, R ₉ represents an alkyl group, a cycloalkyl group or an aryl group, and two R _{9 s} may be the same or different.

The alkyl group for R ₈ may be linear or branched, may have a substituent, and is preferably an alkyl group having 1 to 20 carbon atoms. Examples of the substituent that the alkyl group for R ₈ may have include an electron withdrawing group (such as a cyano group), a halogen atom, and an aryl group, and is preferably an electron withdrawing group or a halogen atom. More preferably, it is a fluorine atom.
Examples of the alkyl group for R ₈ include a methyl group, an ethyl group, an i-propyl group, a t-butyl group, a benzyl group, a cyanomethyl group, a trifluoromethyl group, a 2,2,2-trifluoroethyl group, a per group. A fluoropropyl group, a perfluorobutyl group, etc. are mentioned.
The cycloalkyl groups for R _8, may have a substituent group, it is preferably a cycloalkyl group having 3 to 20 carbon atoms.
Examples of the substituent that the cycloalkyl group represented by R ₈ may have include an electron withdrawing group and a halogen atom.
Examples of the cycloalkyl group for R ₈ include a cyclopentyl group, a cyclopentyl group, a cyclohexyl group, a norbornyl group, an adamantyl group, and the like.
The aryl group for R ₈ may have a substituent, and is preferably an aryl group having 6 to 26 carbon atoms. Examples of the substituent that the aryl group for R ₈ may have include an electron withdrawing group, a halogen atom, an alkyl group, and a hydroxyl group, and is preferably an electron withdrawing group or a halogen atom, and is a fluorine atom. It is more preferable.
Examples of the aryl group for R ₈ include a phenyl group, 1-naphthyl group, 2-naphthyl group, pentafluorophenyl group, 4-trifluoromethylphenyl group, 4-cyanophenyl group, 3-hydroxyphenyl group, 2 -A methylphenyl group etc. are mentioned.
R ₈ is preferably an alkyl group, a partially or fully fluorinated alkyl group, an aryl group, or a partially or fully fluorinated aryl group.
Specific examples of the alkyl group, cycloalkyl group or aryl group for R _9, preferred examples include specific examples described above as alkyl group, cycloalkyl group or aryl group for R _8, are the same as those of the preferred embodiment .

R ₂ and R ₃ each independently represents an alkyl group, an alkenyl group, a cycloalkyl group, an aryl group or a heterocyclic group.
The alkyl group for R ₂ and R ₃ may be linear or branched, may have a substituent, and is preferably an alkyl group having 1 to 20 carbon atoms. . When it has a substituent, it is preferable to have a substituent at the 1-position (α-position) of the alkyl group. Examples of the substituent that the alkyl group may have include an acyl group, an alkoxycarbonyl group, a cycloalkoxy group, an alkyl group, an aryl group, an arylcarbonyl group, and the like, and an acyl group or an alkoxycarbonyl group is preferable.
Examples of the alkyl group for R ₂ and R ₃ include a methyl group, an ethyl group, a propyl group, an i-propyl group, an n-butyl group, a t-butyl group, a benzyl group, a benzoylmethyl group, and a 1-benzoylethyl group. 1-methyl-1-benzoylethyl group, acetylmethyl group, cyclohexyloxymethyl group, methoxycarbonylmethyl group, 1- (ethoxycarbonyl) ethyl group and the like.
The alkenyl group for R ₂ and R ₃ may have a substituent, and is preferably an alkenyl group having 2 to 20 carbon atoms, and examples thereof include a vinyl group and an allyl group.
The cycloalkyl group for R ₂ and R ₃ may have a substituent and is preferably a cycloalkyl group having 3 to 20 carbon atoms. When it has a substituent, the cycloalkyl group preferably has a substituent at the 1-position (α-position). Examples of the substituent that the cycloalkyl group may have include an acyl group, an alkoxycarbonyl group, and an arylcarbonyl group.
Examples of the cycloalkyl group for R ₂ and R ₃ include a cyclopentyl group, a cyclopropyl group, a cyclohexyl group, a norbornyl group, an adamantyl group, a 1-benzoylcyclohexyl group, a 1-acetylcyclopentyl group, and a 1- (methoxycarbonyl) cyclohexyl group. Groups and the like.
The aryl group for R ₂ and R ₃ may have a substituent, and is preferably an aryl group having 6 to 26 carbon atoms.
Examples of the substituent that the aryl group for R ₂ and R ₃ may have include an alkyl group, a cycloalkyl group, an aryl group, a heterocyclic group, a nitro group, a cyano group, a halogen atom, a hydroxyl group, an alkoxy group, and an aryloxy group. , Acyloxy group, carboxyl group, alkoxycarbonyl group, aryloxycarbonyl group, carbamoyl group, acyl group, alkylthio group, arylthio group, alkylsulfonyl group, arylsulfonyl group, alkoxysulfonyl group, aryloxysulfonyl group, sulfamoyl group, etc. It is done.
Examples of the aryl group for R ₂ and R ₃ include a phenyl group, a 1-naphthyl group, a 2-naphthyl group, a 9-anthranyl group, and a phenyl group substituted with the aforementioned substituent.
The heterocyclic group for R ₂ and R ₃ may have a substituent, and is preferably a heterocyclic group having 2 to 20 carbon atoms. Specific examples of the substituent heterocyclic group may have about R ₂ and R _3, are the same as specific examples described above as the substituent which may have an aryl group for R ₂ and R ₃ may be mentioned.
Examples of the heterocyclic group for R ₂ and R ₃ include thienyl group, benzothienyl group, tetrahydrothienyl group, pyrrolyl group, indolyl group, carbazolyl group, furyl group, benzofuryl group, tetrahydrofuryl group, pyrimidyl group, pyrazyl group And a pyridazyl group.
R ₂ and R ₃ are preferably an aryl group, an alkyl group, a 1-acylalkyl group or a 1- (alkoxycarbonyl) alkyl group, and more preferably an aryl group.

R ₂ and R ₃ may be connected to each other to form a ring. At that time, the ring may contain an oxygen atom, a sulfur atom, an ester bond, an amide bond, a carbonyl group or the like. As a ring to be formed, a cycloheptane ring, a cyclohexane ring, a cycloheptanone ring, a cyclohexanone ring, or a ring containing S ⁺ includes a tetrahydrothiophene ring, a dihydrothiophene ring, a thiophene ring, a benzothiophene ring, a dibenzothiophene ring, a thianthrene Ring, dibenzooxathian ring and the like.

R ₄ represents a monovalent substituent, an alkyl group, a cycloalkyl group, an aryl group, a heterocyclic group, a nitro group, a cyano group, a halogen atom, a hydroxyl group, an alkoxy group, an aryloxy group, an acyloxy group, a carboxyl group, Alkoxycarbonyl group, aryloxycarbonyl group, carbamoyl group, acyl group, alkylthio group, arylthio group, alkylsulfonyl group, arylsulfonyl group, alkoxysulfonyl group, aryloxysulfonyl group, sulfamoyl group, etc. are mentioned, alkyl group, cycloalkyl It is preferably a group, an aryl group, a halogen atom, a hydroxyl group, an alkoxy group, an alkoxycarbonyl group or an arylthio group. n ₁ represents an integer of 0 to 4, preferably an integer of 0 to 2, and more preferably 0. When n ₁ is 2 or more, the plurality of R ₄ may be the same or different, and R ₄ may be connected to each other to form a ring. As the ring to be formed, a benzene ring, a cyclohexane ring, a cycloheptane ring and the like are preferable.

R ₂ and R ₄ , R ₃ and R ₄ , R ₂ , the benzene ring in the general formula (Z1), R ₃ and the benzene ring may be connected to each other to form a ring. The ring to be formed is preferably the same ring as described above as the ring formed by connecting R ₂ and R ₃ .

In addition, the compound which has two or more structures represented by general formula (Z1) may be sufficient. For example, R ₂ or R ₃ of the compound represented by the general formula (Z1) is bonded to R ₂ or R ₃ of another compound represented by the general formula (Z1) through a single bond or a linking group. A compound having the above structure may be used.

  It is preferable that the compound (B) represented by the general formula (Z1) is a compound represented by the following general formula (Z2).

In the general formula (Z2),
_{L 1, R 1, A 1} , R 4, n 1 has the same meaning as _{L 1, R 1, A 1} , R 4, n 1 in the general formula (Z1).

R ₅ and R ₆ each independently represent a monovalent substituent. Specific examples and preferred examples of the monovalent substituent for R ₅ and R ₆ include a monovalent group for R _{4 in} formula (Z1). Specific examples and preferred examples of the substituents are the same.
n ₂ and n ₃ each independently represents an integer of 0 to 5, preferably an integer of 0 to 2, and more preferably 0.
A plurality of R ₄ when n ₁ is 2 or more, a plurality of R ₅ when n ₂ is 2 or more, and a plurality of R ₆ when n ₃ is 2 or more may be the same or different and are connected to each other To form a ring. Preferred rings that can be formed include a benzene ring, a cyclohexane ring, and a cycloheptane ring.
R ₄ and R ₅ , R ₅ and R ₆ , and R ₄ and R ₆ may be connected to each other to form a ring. At that time, R ₄ , R ₅ and R ₆ may each be a single bond, and the ring may contain an oxygen atom, a sulfur atom, an ester bond, an amide bond, a carbonyl group or the like. Preferably, the ring to be formed includes a tetrahydrothiophene ring, a dihydrothiophene ring, a thiophene ring, a benzothiophene ring, a dibenzothiophene ring, a thianthrene ring, a dibenzooxathiane ring and the like as a ring containing S ⁺ .

The compound which has two or more structures represented by general formula (Z2) may be sufficient. For example, the compound represented by the general formula (Z2) has a structure in which R ₅ or R ₆ is shared and bonded via R ₅ or R ₆ with another compound represented by the general formula (Z2). It may be a compound.

In the benzene ring to which -L ₁ -R ₁ -A ₁ in General Formula (Z1) or (Z2) is bonded, the -L ₁ -R ₁ -A ₁ is substituted in the para position with respect to S ⁺ . and _{L 1} is _{-S -, - S (= O} ) -, - S (= O) 2 -, - C (= O) -, - OS (= O) 2 -, - S (= O) 2 O -, - OC (= O ) -, - C (= O) O -, - N (R 7) C (= O) -, - C (= O) N (R 7) -, - N (R ₇ ) S (═O) ₂ — or —S (═O) ₂ N (R ₇ ) — is preferred.
In addition, with respect to the benzene ring in the general formula (Z1) or (Z2) to which the -L ₁ -R ₁ -A ₁ is bonded, the -L ₁ -R ₁ -A ₁ is in a meta position with respect to S ⁺ or More preferably, it is substituted at the ortho position.

  Hereinafter, although the specific example of the compound (B) which generate | occur | produces an acid by irradiation of the actinic ray or radiation represented with the said general formula (Z1) is given, this invention is not limited to these.

Although there is no restriction | limiting in particular as a manufacturing method of the compound represented by the said general formula (Z1) or (Z2), It can manufacture by the following synthesis methods 1-4 or those combinations. It can be produced by appropriately changing or selecting the synthesis method depending on the substitution position of -L ₁ -R ₁ -A ₁ or the type of L ₁ . The compound represented by the general formula (Z2) will be described below as an example. In addition, compounds other than the general formula (Z2) among the compounds represented by the general formula (Z1) can also be produced by the following synthesis methods 1 to 4 or a combination thereof. In addition, the manufacturing method of the compound represented by the said general formula (Z1) or (Z2) is not limited to these.
_{Further, R 1, R 4 ~R 6} , n 1 ~n 3, A 1, L 1 R 1 in the general formula (Z1) or (Z2) is, _{R 4} in the scheme for the following synthesis method 1-4 ~R _{6, n} 1 _~n 3, the same meanings as a _{1, L} 1.

(Synthesis method 1) Dehydration condensation method

The sulfoxide (1) and the benzene derivative (2) are combined with (CF ₃ SO ₂ ) ₂ O, CH ₃ SO _{3 in} a solventless, acidic solvent, hydrocarbon solvent, halogenated hydrocarbon solvent, or the like. The compound represented by the general formula (Z1) or (Z2) can be produced by dehydration condensation using a Lewis acid catalyst such as HP-O ₂ O ₅ or AlCl ₃ .
When -L ₁ -R ₁ -A ₁ is para-substituted ^{S +,} _{L 1} is _{-O -, - S -, -} N (R 7) C (= O) -, - N (R 7) This is a particularly useful method in the case of S (═O) ₂ — and the like.

(Synthesis method 2) Grignard method

The halogen compound (3) is reacted with Mg in an ether solvent such as tetrahydrofuran or diethyl ether to prepare a Grignard reagent, which is reacted with the sulfoxide (1) using TMS-Cl (trimethylsilyl chloride) or the like. By making it, the compound represented by the said general formula (Z1) or (Z2) can be manufactured.
It is a widely effective method regardless of the substitution position of -L ₁ -R ₁ -A ₁ and the type of L ₁ .

(Synthesis Method 3) Nucleophilic substitution method

Intermediate HL ₁ -R that can be synthesized by a commercially available or known method in an aprotic polar solvent such as N, N-dimethylacedamide, N-ethylpyrrolidone, N, N-dimethylimidazolidinone potassium carbonate ₁ -A _1, triethylamine, potassium t- butoxide, by the action of a base such as sodium hydride anion ^- L ₁ -R ₁ -A ₁ on the preparation of the (synthesis 2) and known methods The compound represented by the general formula (Z1) or (Z2) can be produced by reacting the fluoro form (4) synthesized in (1).
When L ₁ is —O—, —S—, or the like, it can be applied regardless of the substitution position of —L ₁ —R ₁ —A ₁ . In addition, a compound in which L ₁ is —S— is then oxidized with hydrogen peroxide solution-acetic acid or the like to produce a compound in which L ₁ is —S (═O) —, —S (═O) ₂ — or the like. can do.

(Synthesis Method 4) Condensation Linkage Method

This is a production method in which L ₁ moieties are linked and synthesized by a condensation reaction. L ₁ is —OS (═O) ₂ —, —S (═O) ₂ O—, —OC (═O) —, —C (═O) O—, —N (R ₇ ) C (═O). _{-, - C (= O)} N (R 7) -, - N (R 7) S (= O) 2 -, - S (= O) 2 N (R 7) - -L 1 when such - This is a useful method that can be widely applied regardless of the substitution position of R ₁ -A ₁ . The triphenylsulfonium (5) can be generally synthesized by (Synthesis Method 1), (Synthesis Method 2) or a known method. Y ₂ —R ₁ —A ₁ is commercially available or can be synthesized by a known method. For example, when L ₁ is —OS (═O) ₂ —, Y ₁ : —OH and Y ₂ : FO ₂ S—R ₁ —A ₁ can be synthesized by a condensation reaction by a known method. When L ₁ is —C (═O) O—, Y ₁ : —COOH, —COCl and the like and Y ₂ : HO—R ₁ —A ₁ can be synthesized by a condensation reaction by a known method. it can.

  In the actinic ray-sensitive or radiation-sensitive resin composition of the present invention, the compound (B) can be used singly or in combination of two or more, and the content thereof is an actinic ray. 0.1 to 70% by mass, preferably 0.5 to 40% by mass, more preferably 10 to 35% by mass based on the total solid content of the light-sensitive or radiation-sensitive resin composition Is more preferable.

[3] (B ′) Combined Acid Generator The actinic ray-sensitive or radiation-sensitive resin composition of the present invention is a compound that generates an acid upon irradiation with actinic rays or radiation in addition to the compound (B) ( B ′) (hereinafter also referred to as “combination acid generator (B ′)”).
The combined acid generator (B ′) other than the compound (B) will be described below.
As the combined acid generator (B ′), an active photocatalyst polymerization photoinitiator, radical photopolymerization photoinitiator, dye photodecoloring agent, photochromic agent, or microresist is used. Known compounds that generate an acid upon irradiation with light or radiation and mixtures thereof can be appropriately selected and used.

Examples thereof include diazonium salts, phosphonium salts, sulfonium salts, iodonium salts, imide sulfonates, oxime sulfonates, diazodisulfones, disulfones, and o-nitrobenzyl sulfonates.
Among the combined acid generators, preferred compounds are not particularly limited as long as they are known, but preferably include compounds represented by the following general formula (ZI ′), (ZII ′) or (ZIII ′). it can.

In the general formula (ZI ′), R ₂₀₁ , R ₂₀₂ and R ₂₀₃ each independently represents an organic group.
The carbon number of the organic group as R ₂₀₁ , R ₂₀₂ and R ₂₀₃ is generally 1 to 30, preferably 1 to 20.
Two of R _{201 to} R ₂₀₃ may be bonded to form a ring structure, and the ring may contain an oxygen atom, a sulfur atom, an ester bond, an amide bond, or a carbonyl group. Examples of the group formed by combining two of R _{201 to} R ₂₀₃ include an alkylene group (eg, butylene group, pentylene group).
Examples of the organic group represented by R ₂₀₁ , R ₂₀₂ and R ₂₀₃ include a corresponding group in the compound (ZI′-1) described later.

In addition, the compound which has two or more structures represented by general formula (ZI ') may be sufficient. For example, at least one of R _{201 to} R ₂₀₃ of the compound represented by the general formula (ZI ′) is different from at least one of R _{201 to} R ₂₀₃ of the other compound represented by the general formula (ZI ′). It may be a compound having a structure bonded through a bond or a linking group.
Z ⁻ represents a non-nucleophilic anion (an anion having an extremely low ability to cause a nucleophilic reaction).
Examples of Z ⁻ include a sulfonate anion (an aliphatic sulfonate anion, an aromatic sulfonate anion, a camphor sulfonate anion, etc.), a carboxylate anion (an aliphatic carboxylate anion, an aromatic carboxylate anion, an aralkyl carboxylate anion). Etc.), sulfonylimide anion, bis (alkylsulfonyl) imide anion, tris (alkylsulfonyl) methide anion and the like.
The aliphatic moiety in the aliphatic sulfonate anion and the aliphatic carboxylate anion may be an alkyl group or a cycloalkyl group, preferably a linear or branched alkyl group having 1 to 30 carbon atoms and a carbon number. 3-30 cycloalkyl groups are mentioned.
The aromatic group in the aromatic sulfonate anion and aromatic carboxylate anion is preferably an aryl group having 6 to 14 carbon atoms such as a phenyl group, a tolyl group, and a naphthyl group.
The alkyl group, cycloalkyl group and aryl group mentioned above may have a substituent. Specific examples thereof include nitro groups, halogen atoms such as fluorine atoms, carboxyl groups, hydroxyl groups, amino groups, cyano groups, alkoxy groups (preferably having 1 to 15 carbon atoms), cycloalkyl groups (preferably having 3 to 15 carbon atoms). ), An aryl group (preferably 6 to 14 carbon atoms), an alkoxycarbonyl group (preferably 2 to 7 carbon atoms), an acyl group (preferably 2 to 12 carbon atoms), an alkoxycarbonyloxy group (preferably 2 to 2 carbon atoms). 7), an alkylthio group (preferably 1 to 15 carbon atoms), an alkylsulfonyl group (preferably 1 to 15 carbon atoms), an alkyliminosulfonyl group (preferably 2 to 15 carbon atoms), an aryloxysulfonyl group (preferably carbon) Number 6-20), alkylaryloxysulfonyl group (preferably C7-20), cycloalkylary Examples thereof include an oxysulfonyl group (preferably having 10 to 20 carbon atoms), an alkyloxyalkyloxy group (preferably having 5 to 20 carbon atoms), a cycloalkylalkyloxyalkyloxy group (preferably having 8 to 20 carbon atoms), and the like. . About the aryl group and ring structure which each group has, an alkyl group (preferably C1-C15) can further be mentioned as a substituent.

The aralkyl group in the aralkyl carboxylate anion is preferably an aralkyl group having 7 to 12 carbon atoms, such as a benzyl group, a phenethyl group, a naphthylmethyl group, a naphthylethyl group, and a naphthylbutyl group.
Examples of the sulfonylimide anion include saccharin anion.
The alkyl group in the bis (alkylsulfonyl) imide anion and tris (alkylsulfonyl) methide anion is preferably an alkyl group having 1 to 5 carbon atoms.
Two alkyl groups in the bis (alkylsulfonyl) imide anion may be linked to each other to form an alkylene group (preferably having 2 to 4 carbon atoms), and may form a ring together with the imide group and the two sulfonyl groups.
The alkylene group formed by linking two alkyl groups in these alkyl groups and bis (alkylsulfonyl) imide anions may have a halogen atom, an alkyl group substituted with a halogen atom, an alkoxy group, an alkylthio group. Group, an alkyloxysulfonyl group, an aryloxysulfonyl group, a cycloalkylaryloxysulfonyl group, and the like, and a fluorine atom or an alkyl group substituted with a fluorine atom is preferable.

Examples of other Z ⁻ include fluorinated phosphorus (for example, PF ₆ ⁻ ), fluorinated boron (for example, BF ₄ ⁻ ), fluorinated antimony (for example, SbF ₆ ⁻ ), and the like.
Z ^- The aliphatic sulfonate anion in which at least α-position of the sulfonic acid is substituted with a fluorine atom, an aromatic sulfonate anion substituted with a group having a fluorine atom or a fluorine atom, an alkyl group with a fluorine atom A substituted bis (alkylsulfonyl) imide anion and a tris (alkylsulfonyl) methide anion in which the alkyl group is substituted with a fluorine atom are preferred. The non-nucleophilic anion is more preferably a perfluoroaliphatic sulfonate anion (more preferably 4 to 8 carbon atoms), a benzenesulfonate anion having a fluorine atom, still more preferably a nonafluorobutanesulfonate anion, or perfluorooctane. A sulfonate anion, a pentafluorobenzenesulfonate anion, and a 3,5-bis (trifluoromethyl) benzenesulfonate anion.
From the viewpoint of acid strength, the pKa of the generated acid is preferably −1 or less in order to improve sensitivity.
As more preferred (ZI ′) component, there can be mentioned the compound (ZI′-1) described below.
The compound (ZI′-1) is an arylsulfonium compound in which at least one of R _{201 to} R _{203 in} the general formula (ZI ′) is an aryl group, that is, a compound having arylsulfonium as a cation.
Arylsulfonium _compound, all of R 201 _{to R 203} may be an aryl group _{or a} part of R 201 _{to R 203} is an aryl group, but the remainder is an alkyl group or a cycloalkyl _group, the R 201 _{to R 203} All are preferably aryl groups.

  Examples of the arylsulfonium compound include a triarylsulfonium compound, a diarylalkylsulfonium compound, an aryldialkylsulfonium compound, a diarylcycloalkylsulfonium compound, and an aryldicycloalkylsulfonium compound, and a triarylsulfonium compound is preferable. .

  The aryl group of the arylsulfonium compound is preferably a phenyl group or a naphthyl group, and more preferably a phenyl group. The aryl group may be an aryl group having a heterocyclic structure having an oxygen atom, a nitrogen atom, a sulfur atom or the like. Examples of the heterocyclic structure include a pyrrole residue, a furan residue, a thiophene residue, an indole residue, a benzofuran residue, and a benzothiophene residue. When the arylsulfonium compound has two or more aryl groups, the two or more aryl groups may be the same or different.

  The alkyl group or cycloalkyl group that the arylsulfonium compound has as necessary is preferably a linear or branched alkyl group having 1 to 15 carbon atoms and a cycloalkyl group having 3 to 15 carbon atoms, such as a methyl group, Examples thereof include an ethyl group, a propyl group, an n-butyl group, a sec-butyl group, a t-butyl group, a cyclopropyl group, a cyclobutyl group, and a cyclohexyl group.

The aryl group, alkyl group and cycloalkyl group of R _{201 to} R ₂₀₃ are an alkyl group (for example, 1 to 15 carbon atoms), a cycloalkyl group (for example, 3 to 15 carbon atoms), an aryl group (for example, 6 to 14 carbon atoms). , An alkoxy group (for example, having 1 to 15 carbon atoms), a halogen atom, a hydroxyl group, or a phenylthio group may be substituted. Preferred substituents are linear or branched alkyl groups having 1 to 12 carbon atoms, cycloalkyl groups having 3 to 12 carbon atoms, and linear, branched or cyclic alkoxy groups having 1 to 12 carbon atoms, more preferably carbon. These are an alkyl group having 1 to 4 carbon atoms and an alkoxy group having 1 to 4 carbon atoms. The substituent may be substituted with any one of three R _{201 to} R ₂₀₃ , or may be substituted with all three. When R _{201 to} R ₂₀₃ are an aryl group, the substituent is preferably substituted at the p-position of the aryl group.

Next, general formulas (ZII ′) and (ZIII ′) will be described.
In general formulas (ZII ′) and (ZIII ′),
R ₂₀₄ to R ₂₀₇ each independently represents an aryl group, an alkyl group or a cycloalkyl group.
The aryl group, alkyl group, and cycloalkyl group of R _{204 to} R ₂₀₇ are the same as the aryl group described as the aryl group, alkyl group, and cycloalkyl group of R _{201 to} R ₂₀₃ in the aforementioned compound (ZI′-1). It is.
The aryl group, alkyl group, and cycloalkyl group of R _{204 to} R ₂₀₇ may have a substituent. Also as this substituent, what the aryl group, alkyl group, and cycloalkyl group of R _{201 to} R ₂₀₃ in the above-mentioned compound (ZI′-1) may have may be mentioned.
Z ⁻ represents a non-nucleophilic anion, and examples thereof include the same as the non-nucleophilic anion of Z ^{− in} the general formula (ZI ′).
Examples of the acid generator (B ′) that can be used in combination with the acid generator in the present invention further include compounds represented by the following general formulas (ZIV ′), (ZV ′), and (ZVI ′).

In general formulas (ZIV ′) to (ZVI ′),
Ar ₃ and Ar ₄ each independently represents an aryl group.
R ₂₀₈ , R ₂₀₉ and R ₂₁₀ each independently represents an alkyl group, a cycloalkyl group or an aryl group.
A represents an alkylene group, an alkenylene group or an arylene group.
Specific examples of the aryl group represented by Ar ₃ , Ar ₄ , R ₂₀₈ , R ₂₀₉ and R ₂₁₀ are the same as the specific examples of the aryl group represented by R ₂₀₁ , R ₂₀₂ and R ₂₀₃ in the general formula (ZI′-1). Can be mentioned.
Specific examples of the alkyl group and the cycloalkyl group represented by R ₂₀₈ , R _209, and R ₂₁₀ include an alkyl group and a cycloalkyl group represented by R ₂₀₁ , R _202, and R ₂₀₃ in the general formula (ZI′-1), respectively. The thing similar to a specific example can be mentioned.
The alkylene group of A is alkylene having 1 to 12 carbon atoms (for example, methylene group, ethylene group, propylene group, isopropylene group, butylene group, isobutylene group, etc.), and the alkenylene group of A is 2 to 2 carbon atoms. 12 alkenylene groups (for example, ethenylene group, propenylene group, butenylene group, etc.), and as the arylene group for A, arylene groups having 6 to 10 carbon atoms (for example, phenylene group, tolylene group, naphthylene group, etc.) Can be mentioned.
Among the combined acid generators (B ′) that can be used in combination with the acid generator of the present invention, particularly preferred examples are given below.

The combined acid generator (B ′) can be synthesized by a known method, for example, according to the method described in JP-A No. 2007-161707.
The combined acid generator (B ′) can be used alone or in combination of two or more.
The actinic ray-sensitive or radiation-sensitive resin composition of the present invention may or may not contain the combined acid generator (B ′), but if included, the combined acid generator (B ′). The content in the composition is preferably 0.05 to 15% by mass, more preferably 0.1 to 10% by mass, based on the total solid content of the actinic ray-sensitive or radiation-sensitive resin composition. Preferably it is 1-6 mass%.

[4] (C) Solvent (coating solvent)
The solvent that can be used in preparing the composition is not particularly limited as long as it dissolves each component. For example, alkylene glycol monoalkyl ether carboxylate (propylene glycol monomethyl ether acetate (PGMEA; also known as 1-methoxy- 2-acetoxypropane)), alkylene glycol monoalkyl ether (propylene glycol monomethyl ether (PGME; 1-methoxy-2-propanol), etc.), lactic acid alkyl ester (ethyl lactate, methyl lactate, etc.), cyclic lactone (γ-butyrolactone) Etc., preferably 4 to 10 carbon atoms, chain or cyclic ketone (2-heptanone, cyclohexanone, etc., preferably 4 to 10 carbon atoms), alkylene carbonate (ethylene carbonate, propylene) Boneto etc.), alkyl acetate such as carboxylic acid alkyl (butyl acetate is preferred), and the like alkoxy alkyl acetates (ethyl ethoxypropionate). Other usable solvents include, for example, the solvents described in US Patent Application Publication No. 2008 / 0248425A1 after [0244].

  Of the above, alkylene glycol monoalkyl ether carboxylate and alkylene glycol monoalkyl ether are preferred.

These solvents may be used alone or in combination of two or more. When mixing 2 or more types, it is preferable to mix the solvent which has a hydroxyl group, and the solvent which does not have a hydroxyl group. The mass ratio of the solvent having a hydroxyl group and the solvent having no hydroxyl group is from 1/99 to 99/1, preferably from 10/90 to 90/10, and more preferably from 20/80 to 60/40.
The solvent having a hydroxyl group is preferably an alkylene glycol monoalkyl ether, and the solvent having no hydroxyl group is preferably an alkylene glycol monoalkyl ether carboxylate.

[5] Basic compound The actinic ray-sensitive or radiation-sensitive resin composition of the present invention preferably contains a basic compound.
The basic compound is preferably a nitrogen-containing organic basic compound.
Although the compound which can be used is not specifically limited, For example, the compound classified into the following (1)-(4) is used preferably.

(1) Compound represented by the following general formula (BS-1)

In general formula (BS-1),
R _bs1 independently represents any of a hydrogen atom, an alkyl group (straight or branched), a cycloalkyl group (monocyclic or polycyclic), an aryl group, and an aralkyl group. However, not all three R _bs1 are hydrogen atoms.
Although carbon number of the alkyl group as _Rbs1 is not specifically limited, Usually, 1-20, Preferably it is 1-12.
Although carbon number of the cycloalkyl group as _Rbs1 is not specifically limited, Usually, 3-20, Preferably it is 5-15.
Although carbon number of the aryl group as _Rbs1 is not specifically limited, Usually, 6-20, Preferably it is 6-10. Specific examples include a phenyl group and a naphthyl group.
Although carbon number of the aralkyl group as _Rbs1 is not specifically limited, Usually, 7-20, Preferably it is 7-11. Specific examples include a benzyl group.
In the alkyl group, cycloalkyl group, aryl group or aralkyl group as R _bs1 , a hydrogen atom may be substituted with a substituent. Examples of the substituent include an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, a hydroxyl group, a carboxyl group, an alkoxy group, an aryloxy group, an alkylcarbonyloxy group, and an alkyloxycarbonyl group.
In the compound represented by the general formula (BS-1), it is preferable that only one of the three R _bs1 is a hydrogen atom, and it is more preferable that all R _bs1 is not a hydrogen atom.

Specific examples of the compound of the general formula (BS-1) include tri-n-butylamine, tri-n-pentylamine, tri-n-octylamine, tri-n-decylamine, tri-n-dodecylamine, triiso Decylamine, dicyclohexylmethylamine, tetradecylamine, pentadecylamine, hexadecylamine, octadecylamine, didecylamine, methyloctadecylamine, dimethylundecylamine, N, N-dimethyldodecylamine, methyldioctadecylamine, N, N- Examples thereof include dibutylaniline and N, N-dihexylaniline.
In addition, a compound in which at least one R _bs1 in the general formula (BS-1) is an alkyl group substituted with a hydroxyl group can be mentioned as one of preferable embodiments. Specific examples of the compound include triethanolamine and N, N-dihydroxyethylaniline.

Moreover, the alkyl group as _Rbs1 may have an oxygen atom in the alkyl chain, and an oxyalkylene chain may be formed. As the oxyalkylene chain, —CH ₂ CH ₂ O— is preferable. Specific examples include tris (methoxyethoxyethyl) amine and compounds exemplified in column 3, line 60 and thereafter of US Pat. No. 6,040,112.

(2) Compound having a nitrogen-containing heterocyclic structure The heterocyclic structure may or may not have aromaticity. Moreover, you may have two or more nitrogen atoms, Furthermore, you may contain hetero atoms other than nitrogen. Specifically, compounds having an imidazole structure (2-phenylbenzimidazole, 2,4,5-triphenylimidazole, etc.), compounds having a piperidine structure (N-hydroxyethylpiperidine, bis (1,2,2,6) , 6-pentamethyl-4-piperidyl) sebacate), compounds having a pyridine structure (such as 4-dimethylaminopyridine), and compounds having an antipyrine structure (such as antipyrine and hydroxyantipyrine).
A compound having two or more ring structures is also preferably used. Specific examples include 1,5-diazabicyclo [4.3.0] non-5-ene and 1,8-diazabicyclo [5.4.0] -undec-7-ene.

(3) Amine compound having a phenoxy group An amine compound having a phenoxy group has a phenoxy group at the terminal opposite to the nitrogen atom of the alkyl group of the amine compound. The phenoxy group is, for example, a substituent such as an alkyl group, an alkoxy group, a halogen atom, a cyano group, a nitro group, a carboxyl group, a carboxylic acid ester group, a sulfonic acid ester group, an aryl group, an aralkyl group, an acyloxy group, and an aryloxy group. You may have.
More preferably, it is a compound having at least one alkyleneoxy chain between the phenoxy group and the nitrogen atom. The number of alkyleneoxy chains in one molecule is preferably 3-9, more preferably 4-6. Among the alkyleneoxy chains, —CH ₂ CH ₂ O— is preferable.
Specific examples include 2- [2- {2- (2,2-dimethoxy-phenoxyethoxy) ethyl} -bis- (2-methoxyethyl)]-amine and US Patent Application Publication No. 2007 / 0224539A1. The compounds (C1-1) to (C3-3) exemplified in paragraph [0066] of the above.

(4) Ammonium salt Ammonium salts are also used as appropriate. Preferred is hydroxide or carboxylate. More specifically, tetraalkylammonium hydroxide represented by tetrabutylammonium hydroxide is preferable. In addition, ammonium salts derived from the amines of the above (1) to (3) can be used.

(5) Compounds having an amine oxide structure Compounds having an amine oxide structure represented by the following general formulas (1) to (3) are preferred, but are not limited to these and have a structure in which a nitrogen atom is oxidized. Any nitrogen-containing organic compound can be used.

(In the above general formula, R ¹ , R ² and R ³ are each independently a hydrogen atom, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, An aralkyl group having 7 to 20 carbon atoms, a hydroxyalkyl group having 2 to 10 carbon atoms, an alkoxyalkyl group having 2 to 10 carbon atoms, an acyloxyalkyl group having 3 to 10 carbon atoms, or an alkylthioalkyl group having 1 to 10 carbon atoms. .
Further, any ^{two of} R ¹ , R ² and R ³ may be bonded to form a ring structure or an aromatic ring.
R ⁴ is a hydrogen atom, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, or an alkoxy having 2 to 10 carbon atoms. An alkyl group, a C2-C10 hydroxyalkyl group or a C3-C10 acyloxyalkyl group is represented. R ⁵ represents a hydrogen atom, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms. )

  Specific examples of the aryl group having 6 to 20 carbon atoms include a phenyl group, a naphthyl group, an anthryl group, a phenanthryl group, a pyrenyl group, a naphthacenyl group, and a fluorenyl group. Or, as the cyclic alkyl group, specifically, methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, t-butyl group, pentyl group, hexyl group, decyl group, cyclopentyl group, cyclohexyl group Specifically, the decahydronaphthalenyl group is an aralkyl group having 7 to 20 carbon atoms, specifically a benzyl group, a phenethyl group, a phenylpropyl group, a naphthylmethyl group, a naphthylethyl group, or an anthracenylmethyl group. Specific examples of the 2-10 hydroxyalkyl group include a hydroxymethyl group, a hydroxyethyl group, a hydroxy group. Specifically, the pill group is an alkoxyalkyl group having 2 to 10 carbon atoms such as methoxymethyl group, ethoxymethyl group, propoxymethyl group, isopropoxymethyl group, butoxymethyl group, isobutoxymethyl group, t-butoxymethyl group. , T-amyloxymethyl group, cyclohexyloxymethyl group, and cyclopentyloxymethyl group as acyloxyalkyl groups having 3 to 10 carbon atoms, specifically, formyloxymethyl group, acetoxymethyl group, propionyloxymethyl group, butyryl Specifically, an oxymethyl group, a pivaloyloxymethyl group, a cyclohexanecarbonyloxymethyl group, and a decanoyloxymethyl group as an alkylthioalkyl group having 1 to 10 carbon atoms include a methylthiomethyl group, an ethylthiomethyl group, a propylthio group. Methyl group, isopropyl Examples include a ruthiomethyl group, a butylthiomethyl group, an isobutylthiomethyl group, a t-butylthiomethyl group, a t-amylthiomethyl group, a decylthiomethyl group, and a cyclohexylthiomethyl group, but the present invention is not limited thereto. It is not something.

  Although the compound which has an amine oxide structure represented by the said General formula (1) is illustrated concretely below, this invention is not limited to these.

  Next, although the compound which has an amine oxide structure represented by the said General formula (2), (3) is specifically illustrated below, this invention is not limited to these.

  In the present invention, in these nitrogen-containing organic compounds having an amine oxide structure in these molecules, the presence of a functional group substituted with a nitrogen atom enables rapid capture of the generated acid, while the structure in which the nitrogen atom is oxidized It is expected to affect the distribution in the resist film, and as a result, it is considered that high resolution and excellent pattern shape can be achieved in the photoresist to which the compound having the amine oxide structure is added. It is done. In addition, by selecting an appropriate structure from the possible structures of the compound having the amine oxide structure, the volatility, basicity, acid capture speed, diffusion speed in the resist of the compound having the amine oxide structure Provides a compound additive having an amine oxide structure that can be appropriately adjusted according to the combination of resist polymer and acid generator to be used, and that can optimally adjust the properties of the resist material such as the pattern shape. It is thought to be possible.

  The amine oxide structure represented by the general formulas (1) to (3) is produced by selecting an optimum method according to the structure of the compound. Examples include a method using an oxidation reaction of a nitrogen-containing compound using an oxidizing agent, or a method using an oxidation reaction of a nitrogen-containing compound in a diluted hydrogen peroxide solution, but the present invention is limited to these. It is not a thing.

  Other usable basic compounds include compounds described in JP2011-85926A, compounds synthesized in Examples of JP2002-363146A, paragraph 0108 of JP2007-298869A. The compounds described can also be used.

The composition according to the present invention comprises a low molecular compound having a nitrogen atom and a group capable of leaving by the action of an acid (hereinafter referred to as “low molecular compound (D)” or “compound (D)” as a basic compound. May also be included).
The group leaving by the action of an acid is not particularly limited, but is preferably an acetal group, carbonate group, carbamate group, tertiary ester group, tertiary hydroxyl group, or hemiaminal ether group, and a carbamate group or hemiaminal ether group. Particularly preferred is a group.
100-1000 are preferable, as for the molecular weight of a compound (D), 100-700 are more preferable, and 100-500 are especially preferable.
As the compound (D), an amine derivative having a group capable of leaving by the action of an acid on the nitrogen atom is preferable.
Compound (D) may have a carbamate group having a protecting group on the nitrogen atom. The protecting group constituting the carbamate group can be represented by the following general formula (d-1), for example.

In general formula (d-1),
R ′ each independently represents a hydrogen atom, a linear or branched alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or an alkoxyalkyl group. R ′ may be bonded to each other to form a ring.
R ′ is preferably a linear or branched alkyl group, cycloalkyl group, or aryl group. More preferably, it is a linear or branched alkyl group or a cycloalkyl group.
Specific examples of such groups are shown below.

A compound (D) can also be comprised by combining arbitrarily the various basic compounds mentioned above and the structure represented by general formula (d-1).
The compound (D) particularly preferably has a structure represented by the following general formula (F).
The compound (D) may correspond to the various basic compounds described above as long as it is a low molecular compound having a group capable of leaving by the action of an acid.

In the general formula (F), Ra represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group or an aralkyl group. When n = 2, the two Ras may be the same or different, and the two Ras are bonded to each other to form a divalent heterocyclic hydrocarbon group (preferably having 20 or less carbon atoms) or a derivative thereof. May be formed.
Rb independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or an alkoxyalkyl group. However, in -C (Rb) (Rb) (Rb), when one or more Rb is a hydrogen atom, at least one of the remaining Rb is a cyclopropyl group, a 1-alkoxyalkyl group or an aryl group.
At least two Rb may combine to form an alicyclic hydrocarbon group, an aromatic hydrocarbon group, a heterocyclic hydrocarbon group or a derivative thereof.
n represents an integer of 0 to 2, m represents an integer of 1 to 3, and n + m = 3.

  In general formula (F), the alkyl group, cycloalkyl group, aryl group, and aralkyl group represented by Ra and Rb are functional groups such as hydroxyl group, cyano group, amino group, pyrrolidino group, piperidino group, morpholino group, and oxo group. , An alkoxy group and a halogen atom may be substituted. The same applies to the alkoxyalkyl group represented by Rb.

The alkyl group, cycloalkyl group, aryl group, and aralkyl group of Ra and / or Rb (these alkyl group, cycloalkyl group, aryl group, and aralkyl group are substituted with the above functional group, alkoxy group, or halogen atom). As may be)
For example, groups derived from linear or branched alkanes such as methane, ethane, propane, butane, pentane, hexane, heptane, octane, nonane, decane, undecane, dodecane, etc., groups derived from these alkanes, for example, A group substituted with one or more cycloalkyl groups such as a cyclobutyl group, a cyclopentyl group, and a cyclohexyl group,
Groups derived from cycloalkanes such as cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, norbornane, adamantane, noradamantane, groups derived from these cycloalkanes, for example, methyl group, ethyl group, n-propyl group, a group substituted with one or more linear or branched alkyl groups such as i-propyl group, n-butyl group, 2-methylpropyl group, 1-methylpropyl group, t-butyl group and the like,
Groups derived from aromatic compounds such as benzene, naphthalene, anthracene, etc., and groups derived from these aromatic compounds are, for example, methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, 2 A group substituted with one or more linear or branched alkyl groups such as -methylpropyl group, 1-methylpropyl group, t-butyl group, and the like;
Groups derived from heterocyclic compounds such as pyrrolidine, piperidine, morpholine, tetrahydrofuran, tetrahydropyran, indole, indoline, quinoline, perhydroquinoline, indazole, benzimidazole, and groups derived from these heterocyclic compounds are linear or branched A group substituted with one or more groups derived from an alkyl group or aromatic compound, a group derived from a linear or branched alkane, a group derived from a cycloalkane, a phenyl group, a naphthyl group , A group substituted with one or more groups derived from an aromatic compound such as anthracenyl group or the like, or the above substituent is a hydroxyl group, cyano group, amino group, pyrrolidino group, piperidino group, morpholino group, oxo And a group substituted with a functional group such as a group.

  Examples of the divalent heterocyclic hydrocarbon group (preferably having 1 to 20 carbon atoms) or a derivative thereof formed by bonding of Ra to each other include, for example, pyrrolidine, piperidine, morpholine, 1, 4, 5 , 6-tetrahydropyrimidine, 1,2,3,4-tetrahydroquinoline, 1,2,3,6-tetrahydropyridine, homopiperazine, 4-azabenzimidazole, benzotriazole, 5-azabenzotriazole, 1H-1, 2,3-triazole, 1,4,7-triazacyclononane, tetrazole, 7-azaindole, indazole, benzimidazole, imidazo [1,2-a] pyridine, (1S, 4S)-(+)-2 , 5-diazabicyclo [2.2.1] heptane, 1,5,7-triazabicyclo [4.4.0] dec-5-ene Groups derived from heterocyclic compounds such as indole, indoline, 1,2,3,4-tetrahydroquinoxaline, perhydroquinoline, 1,5,9-triazacyclododecane, groups derived from these heterocyclic compounds A group derived from a linear or branched alkane, a group derived from a cycloalkane, a group derived from an aromatic compound, a group derived from a heterocyclic compound, a hydroxyl group, a cyano group, an amino group, a pyrrolidino group, a piperidino And groups substituted with one or more functional groups such as a group, a morpholino group and an oxo group.

  A particularly preferred compound (D) in the present invention is specifically shown, but the present invention is not limited thereto.

  The compound represented by the general formula (F) can be easily synthesized from a commercially available amine by a method described in Protective Groups in Organic Synthesis Fourth Edition. As the most general method, there is a method obtained by reacting a dicarbonate or haloformate with a commercially available amine. In the formula, X represents a halogen atom. The definition and specific examples of Ra and Rb are the same as those described in the general formula (F).

  Photodegradable basic compounds (initially basic nitrogen atoms act as a base and show basicity, but are decomposed by irradiation with actinic rays or radiation to have amphoteric compounds having basic nitrogen atoms and organic acid sites. A compound in which basicity is reduced or eliminated by generating ionic compounds and neutralizing them in the molecule, for example, Toho 3577743, JP 2001-215589 A, JP 2001-166476 A, JP 2008-102383 A. Onium salts) and photobase generators (for example, compounds described in JP2010-243773) are also used as appropriate.

The basic compounds (including compound (D)) are used alone or in combination of two or more.
The usage-amount of a basic compound is 0.001-10 mass% normally on the basis of solid content of a composition, Preferably it is 0.01-5 mass%.

  The molar ratio of acid generator / basic compound is preferably 2.5 to 300. That is, the molar ratio is preferably 2.5 or more from the viewpoints of sensitivity and resolution, and is preferably 300 or less from the viewpoint of suppressing the reduction in resolution due to pattern thickening over time until post-exposure heat treatment. This molar ratio is more preferably 5.0 to 200, and still more preferably 7.0 to 150.

[6] Surfactant The composition according to the present invention may further contain a surfactant. By containing a surfactant, when an exposure light source having a wavelength of 250 nm or less, particularly 220 nm or less, is used, it is possible to form a pattern with less adhesion and development defects with good sensitivity and resolution. Become.
As the surfactant, it is particularly preferable to use a fluorine-based and / or silicon-based surfactant.

  Examples of the fluorine-based and / or silicon-based surfactant include surfactants described in [0276] of US Patent Application Publication No. 2008/0248425. F top EF301 or EF303 (manufactured by Shin-Akita Kasei Co., Ltd.); Florard FC430, 431 or 4430 (manufactured by Sumitomo 3M Co., Ltd.); Megafac F171, F173, F176, F189, F113, F110, F177, F120 or R08 (manufactured by DIC Corporation); Surflon S-382, SC101, 102, 103, 104, 105 or 106 (manufactured by Asahi Glass Co., Ltd.); Troisol S-366 (manufactured by Troy Chemical Co., Ltd.); GF-300 or GF-150 (manufactured by Toa Synthetic Chemical Co., Ltd.), Surflon S-393 (manufactured by Seimi Chemical Co., Ltd.); 01 (manufactured by Gemco); PF636, PF656, PF6320 or PF6520 (manufactured by OMNOVA); or FTX-204G, 208G, 218G, 230G, 204D, 208D, 212D, 218D or 222D (manufactured by Neos) May be used. Polysiloxane polymer KP-341 (manufactured by Shin-Etsu Chemical Co., Ltd.) can also be used as a silicon-based surfactant.

  In addition to known surfactants as described above, the surfactant is a fluoroaliphatic compound produced by a telomerization method (also referred to as a telomer method) or an oligomerization method (also referred to as an oligomer method). You may synthesize. Specifically, a polymer having a fluoroaliphatic group derived from this fluoroaliphatic compound may be used as a surfactant. This fluoroaliphatic compound can be synthesized, for example, by the method described in JP-A-2002-90991.

The polymer having a fluoroaliphatic group is preferably a copolymer of a monomer having a fluoroaliphatic group and (poly (oxyalkylene)) acrylate or methacrylate and / or (poly (oxyalkylene)) methacrylate. Even if it distributes, block copolymerization may be sufficient.
Examples of the poly (oxyalkylene) group include a poly (oxyethylene) group, a poly (oxypropylene) group, and a poly (oxybutylene) group. In addition, units having different chain length alkylene in the same chain, such as poly (block connection body of oxyethylene, oxypropylene, and oxyethylene) and poly (block connection body of oxyethylene and oxypropylene) Also good.

Furthermore, a copolymer of a monomer having a fluoroaliphatic group and (poly (oxyalkylene)) acrylate or methacrylate is composed of a monomer having two or more different fluoroaliphatic groups and two or more different (poly (oxyalkylene). )) It may be a ternary or higher copolymer obtained by copolymerizing acrylate or methacrylate simultaneously.
Examples of commercially available surfactants include Megafac F178, F-470, F-473, F-475, F-476, and F-472 (manufactured by DIC Corporation). Further, a copolymer of an acrylate or methacrylate having a C ₆ F ₁₃ group and (poly (oxyalkylene)) acrylate or methacrylate, an acrylate or methacrylate having a C ₆ F ₁₃ group and (poly (oxyethylene)) acrylate or methacrylate And a copolymer of (poly (oxypropylene)) acrylate or methacrylate, a copolymer of an acrylate or methacrylate having a C ₈ F ₁₇ group and (poly (oxyalkylene)) acrylate or methacrylate, and C ₈ F ₁₇ Copolymerization of a group-containing acrylate or methacrylate with (poly (oxyethylene)) acrylate or methacrylate and (poly (oxypropylene)) acrylate or methacrylate Body, and the like.

Further, surfactants other than fluorine-based and / or silicon-based surfactants described in [0280] of US Patent Application Publication No. 2008/0248425 may be used.
One of these surfactants may be used alone, or two or more thereof may be used in combination.
When the composition according to the present invention contains a surfactant, the content is preferably 0 to 2% by mass, more preferably 0.0001 to 2% by mass, based on the total solid content of the composition. More preferably, it is 0.0005-1 mass%.

[7] Hydrophobic resin The composition according to the present invention may further contain a hydrophobic resin. By including the hydrophobic resin, the hydrophobic resin is unevenly distributed on the surface layer of the composition film, and it becomes possible to improve the receding contact angle of the film with respect to the immersion liquid when water is used as the immersion medium. Thereby, the immersion liquid followability of a film | membrane can be improved.

The receding contact angle of the film after baking and before exposure is preferably 60 ° to 90 ° at a temperature of 23 ± 3 ° C. and a humidity of 45 ± 5%, more preferably 65 ° or more, still more preferably 70 ° or more, and particularly preferably. It is 75 ° or more.
The hydrophobic resin is unevenly distributed at the interface as described above, but unlike the surfactant, it does not necessarily have a hydrophilic group in the molecule and contributes to uniform mixing of polar / nonpolar substances. It is not necessary.

In the immersion exposure process, the immersion head needs to move on the wafer following the movement of the exposure head to scan the wafer at high speed to form the exposure pattern. The contact angle of the immersion liquid with respect to the film is important, and the actinic ray-sensitive or radiation-sensitive resin composition is required to follow the high-speed scanning of the exposure head without remaining droplets.
The hydrophobic resin (HR) is preferably a resin having at least one of a fluorine atom and a silicon atom. The fluorine atom or silicon atom in the hydrophobic resin (HR) may be contained in the main chain of the resin or may be substituted on the side chain. When the hydrophobic resin has at least one of a fluorine atom and a silicon atom, the hydrophobicity (water followability) of the film surface is improved and the development residue (scum) is reduced.
The hydrophobic resin (HR) is preferably a resin having an alkyl group having a fluorine atom, a cycloalkyl group having a fluorine atom, or an aryl group having a fluorine atom as a partial structure having a fluorine atom.

  The alkyl group having a fluorine atom (preferably having 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms) is a linear or branched alkyl group in which at least one hydrogen atom is substituted with a fluorine atom, It may have a substituent.

The cycloalkyl group having a fluorine atom is a monocyclic or polycyclic cycloalkyl group in which at least one hydrogen atom is substituted with a fluorine atom, and may further have another substituent.
Examples of the aryl group having a fluorine atom include those in which at least one hydrogen atom of an aryl group such as a phenyl group or a naphthyl group is substituted with a fluorine atom, and the aryl group may further have another substituent.
Preferred examples of the alkyl group having a fluorine atom, the cycloalkyl group having a fluorine atom, or the aryl group having a fluorine atom include groups represented by the following general formulas (F2) to (F4). The present invention is not limited to this.

In general formulas (F2) to (F4),
R _{57 to} R ₆₈ each independently represents a hydrogen atom, a fluorine atom or an alkyl group. However, at least one of R _{57 to} R ₆₁ , R _{62 to} R ₆₄ and R _{65 to} R ₆₈ is a fluorine atom or an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom (preferably having 1 carbon atom). ~ 4). R _{57 to} R ₆₁ and R _{65 to} R ₆₇ are preferably all fluorine atoms. R ₆₂ , R ₆₃ and R ₆₈ are preferably an alkyl group (preferably having 1 to 4 carbon atoms) in which at least one hydrogen atom is substituted with a fluorine atom, and preferably a perfluoroalkyl group having 1 to 4 carbon atoms. Further preferred. R ₆₂ and R ₆₃ may be connected to each other to form a ring.

  Specific examples of the group represented by the general formula (F2) include a p-fluorophenyl group, a pentafluorophenyl group, and a 3,5-di (trifluoromethyl) phenyl group.

  Specific examples of the group represented by the general formula (F3) include trifluoromethyl group, pentafluoropropyl group, pentafluoroethyl group, heptafluorobutyl group, hexafluoroisopropyl group, heptafluoroisopropyl group, hexafluoro (2 -Methyl) isopropyl group, nonafluorobutyl group, octafluoroisobutyl group, nonafluorohexyl group, nonafluoro-t-butyl group, perfluoroisopentyl group, perfluorooctyl group, perfluoro (trimethyl) hexyl group, 2,2 , 3,3-tetrafluorocyclobutyl group, perfluorocyclohexyl group and the like. Hexafluoroisopropyl group, heptafluoroisopropyl group, hexafluoro (2-methyl) isopropyl group, octafluoroisobutyl group, nonafluoro-t-butyl group and perfluoroisopentyl group are preferable, and hexafluoroisopropyl group and heptafluoroisopropyl group are preferable. Further preferred.

Specific examples of the group represented by the general formula (F4) include, for example, —C (CF ₃ ) ₂ OH, —C (C ₂ F ₅ ) ₂ OH, —C (CF ₃ ) (CH ₃ ) OH, -CH _(CF 3) OH and the like, -C _{(CF 3)} 2 OH is preferred.
Suitable examples of the repeating unit having a fluorine atom include those shown below.

In the formula, R ₁₀ and R ₁₁ are each independently a hydrogen atom, a fluorine atom, or an alkyl group (preferably a linear or branched alkyl group having 1 to 4 carbon atoms, and particularly as an alkyl group having a substituent, Fluorinated alkyl group can be mentioned).
W _{3 to} W ₆ each independently represents an organic group containing at least one fluorine atom. Specific examples include groups represented by the general formulas (F2) to (F4).
Moreover, you may have a unit as shown below as a repeating unit which has a fluorine atom besides these.

In the formula, R _{4 to} R ₇ are each independently a hydrogen atom, a fluorine atom, or an alkyl group (preferably a linear or branched alkyl group having 1 to 4 carbon atoms, and the alkyl group having a substituent is In particular, a fluorinated alkyl group can be mentioned).

However, at least one of R _{4 to} R ₇ represents a fluorine atom. R ₄ and R ₅ or R ₆ and R ₇ may form a ring.
W ₂ represents an organic group containing at least one fluorine atom. Specific examples include the atomic groups (F2) to (F4).

  Q represents an alicyclic structure. The alicyclic structure may have a substituent and may be monocyclic or polycyclic. In the case of a polycyclic type, a bridge type may be used. As the monocyclic type, a cycloalkyl group having 3 to 8 carbon atoms is preferable, and examples thereof include a cyclopentyl group, a cyclohexyl group, a cyclobutyl group, and a cyclooctyl group. Examples of the polycyclic type include groups having a bicyclo, tricyclo or tetracyclo structure having 5 or more carbon atoms, and a cycloalkyl group having 6 to 20 carbon atoms is preferable, for example, an adamantyl group, norbornyl group, dicyclopentyl group. , Tricyclodecanyl group, tetocyclododecyl group and the like. A part of carbon atoms in the cycloalkyl group may be substituted with a hetero atom such as an oxygen atom.

L ₂ represents a single bond or a divalent linking group. Examples of the divalent linking group include a substituted or unsubstituted arylene group, a substituted or unsubstituted alkylene group, a substituted or unsubstituted cycloalkylene group, —O—, —SO ₂ —, —CO—, —N (R )-(Wherein R represents a hydrogen atom or an alkyl group), —NHSO ₂ — or a divalent linking group obtained by combining a plurality of these.
The hydrophobic resin (HR) may contain a silicon atom. The partial structure having a silicon atom is preferably a resin having an alkylsilyl structure (preferably a trialkylsilyl group) or a cyclic siloxane structure.

  Specific examples of the alkylsilyl structure or the cyclic siloxane structure include groups represented by the following general formulas (CS-1) to (CS-3).

In general formulas (CS-1) to (CS-3),
R _{12 to} R ₂₆ each independently represent a linear or branched alkyl group (preferably having 1 to 20 carbon atoms) or a cycloalkyl group (preferably having 3 to 20 carbon atoms).
L < ₃ > -L < ₅ > represents a single bond or a bivalent coupling group. Examples of the divalent linking group include an alkylene group, a phenylene group, an ether group, a thioether group, a carbonyl group, an ester group, an amide group, a urethane group, or a urea group, or a single group of two or more groups. A combination is mentioned.
n represents an integer of 1 to 5. n is preferably an integer of 2 to 4.
Specific examples of the repeating unit containing a fluorine atom or a silicon atom are shown below. In specific examples, X ₁ represents a hydrogen atom, —CH ₃ , —F or —CF ₃ , and X ₂ represents —F or —CF ₃ .

Furthermore, the hydrophobic resin (HR) may have at least one group selected from the following (x) and (z).
(X) a polar group;
(Z) A group that decomposes by the action of an acid.
(X) Examples of polar groups include phenolic hydroxy groups, carboxylic acid groups, fluorinated alcohol groups, sulfonic acid groups, sulfonamido groups, sulfonylimide groups, (alkylsulfonyl) (alkylcarbonyl) methylene groups, (alkylsulfonyl) ( Alkylcarbonyl) imide group, bis (alkylcarbonyl) methylene group, bis (alkylcarbonyl) imide group, bis (alkylsulfonyl) methylene group, bis (alkylsulfonyl) imide group, tris (alkylcarbonyl) methylene group, tris (alkylsulfonyl) ) And a methylene group.
Preferred polar groups include fluorinated alcohol groups (preferably hexafluoroisopropanol), sulfonimide groups, and bis (carbonyl) methylene groups.
As the repeating unit having a polar group (x), a repeating unit in which a polar group is directly bonded to the main chain of the resin, such as a repeating unit of acrylic acid or methacrylic acid, or the main chain of the resin through a linking group Examples thereof include a repeating unit to which a polar group is bonded. Furthermore, a polymerization initiator or a chain transfer agent having a polar group can be introduced at the end of the polymer chain at the time of polymerization.
As for content of the repeating unit which has polar group (x), 1-50 mol% is preferable with respect to all the repeating units in hydrophobic resin, More preferably, it is 3-35 mol%, More preferably, it is 5-20 mol%.
Specific examples of the repeating unit having a polar group (x) are shown below. In specific examples, Rx represents H, CH ₃ , CH ₂ OH, or CF ₃ .

In the hydrophobic resin (HR), examples of the repeating unit having a group (z) that is decomposed by the action of an acid include the same repeating units having an acid-decomposable group as mentioned above for the acid-decomposable resin. .
In the hydrophobic resin (HR), the content of the repeating unit having a group (z) that is decomposed by the action of an acid is preferably 1 to 80 mol%, more preferably based on all repeating units in the hydrophobic resin. It is 10-80 mol%, More preferably, it is 20-60 mol%.
The hydrophobic resin (HR) may further have a repeating unit represented by the following general formula (VI).

In general formula (VI):
R _c31 represents a hydrogen atom, an alkyl group _optionally substituted with fluorine, a cyano group, or a —CH ₂ —O—Rac ₂ group. In the formula, Rac ₂ represents a hydrogen atom, an alkyl group or an acyl group. R _c31 is preferably a hydrogen atom, a methyl group, a hydroxymethyl group or a trifluoromethyl group, particularly preferably a hydrogen atom or a methyl group.
R _c32 represents a group having an alkyl group, a cycloalkyl group, an alkenyl group, a cycloalkenyl group or an aryl group. These groups may be substituted with a fluorine atom, a group containing a silicon atom, or the like.
L _c3 represents a single bond or a divalent linking group.

In general formula (VI), the alkyl group represented by R _c32 is preferably a linear or branched alkyl group having 3 to 20 carbon atoms.
The cycloalkyl group is preferably a cycloalkyl group having 3 to 20 carbon atoms.
The alkenyl group is preferably an alkenyl group having 3 to 20 carbon atoms.
The cycloalkenyl group is preferably a cycloalkenyl group having 3 to 20 carbon atoms.
The aryl group is preferably a phenyl group or naphthyl group having 6 to 20 carbon atoms, and these may have a substituent.

R _c32 is preferably an unsubstituted alkyl group or an alkyl group substituted with a fluorine atom.
The divalent linking group of L _c3 is preferably an alkylene group (preferably having 1 to 5 carbon atoms), an oxy group, a phenylene group, or an ester bond (a group represented by —COO—).
The hydrophobic resin (HR) may contain a repeating unit represented by the following general formula (VII) or (VIII) as the repeating unit represented by the general formula (VI).

In general formula (VII), R _c5 represents a hydrocarbon group having at least one cyclic structure and having neither a hydroxy group nor a cyano group.
In General Formula (VII) and General Formula (VIII), Rac represents a hydrogen atom, an alkyl group which may be substituted with a fluorine atom, a cyano group, or a —CH ₂ —O—Rac ₂ group. In the formula, Rac ₂ represents a hydrogen atom, an alkyl group or an acyl group. Rac is preferably a hydrogen atom, a methyl group, a hydroxymethyl group or a trifluoromethyl group, particularly preferably a hydrogen atom or a methyl group.

The cyclic structure possessed by R _c5 includes a monocyclic hydrocarbon group and a polycyclic hydrocarbon group. As a monocyclic hydrocarbon group, a C3-C12 cycloalkyl group and a C3-C12 cycloalkenyl group are mentioned, for example. A preferable monocyclic hydrocarbon group is a monocyclic hydrocarbon group having 3 to 7 carbon atoms.

  The polycyclic hydrocarbon group includes a ring assembly hydrocarbon group and a bridged cyclic hydrocarbon group. Examples of the bridged cyclic hydrocarbon ring include a bicyclic hydrocarbon ring, a tricyclic hydrocarbon ring, and a tetracyclic hydrocarbon ring. The bridged cyclic hydrocarbon ring also includes a condensed cyclic hydrocarbon ring (for example, a condensed ring in which a plurality of 5- to 8-membered cycloalkane rings are condensed). Preferred examples of the bridged cyclic hydrocarbon ring include a norbornyl group and an adamantyl group.

  These alicyclic hydrocarbon groups may have a substituent, and preferred substituents include a halogen atom, an alkyl group, a hydroxyl group protected with a protecting group, an amino group protected with a protecting group, and the like. It is done. Preferred halogen atoms include bromine, chlorine and fluorine atoms, and preferred alkyl groups include methyl, ethyl, butyl and t-butyl groups. The above alkyl group may further have a substituent, and the substituent which may further have a halogen atom, an alkyl group, a hydroxyl group protected with a protecting group, an amino protected with a protecting group The group can be mentioned.

  Examples of the protecting group include an alkyl group, a cycloalkyl group, an aralkyl group, a substituted methyl group, a substituted ethyl group, an alkoxycarbonyl group, and an aralkyloxycarbonyl group. Preferred alkyl groups include alkyl groups having 1 to 4 carbon atoms, preferred substituted methyl groups include methoxymethyl, methoxythiomethyl, benzyloxymethyl, t-butoxymethyl, 2-methoxyethoxymethyl groups, and preferred substituted ethyl groups. 1-ethoxyethyl, 1-methyl-1-methoxyethyl, preferred acyl groups include formyl, acetyl, propionyl, butyryl, isobutyryl, valeryl, pivaloyl groups, etc., aliphatic acyl groups having 1 to 6 carbon atoms, alkoxycarbonyl Examples of the group include an alkoxycarbonyl group having 1 to 4 carbon atoms.

In the general formula (VIII), R _c6 represents an alkyl group, a cycloalkyl group, an alkenyl group, a cycloalkenyl group, an alkoxycarbonyl group, or an alkylcarbonyloxy group. These groups may be substituted with a fluorine atom, a group containing a silicon atom, or the like.
The alkyl group for R _c6 is preferably a linear or branched alkyl group having 1 to 20 carbon atoms.
The cycloalkyl group is preferably a cycloalkyl group having 3 to 20 carbon atoms.
The alkenyl group is preferably an alkenyl group having 3 to 20 carbon atoms.
The cycloalkenyl group is preferably a cycloalkenyl group having 3 to 20 carbon atoms.
The alkoxycarbonyl group is preferably an alkoxycarbonyl group having 2 to 20 carbon atoms.
The alkylcarbonyloxy group is preferably an alkylcarbonyloxy group having 2 to 20 carbon atoms.

n represents an integer of 0 to 5. When n is 2 or more, the plurality of R _c6 may be the same or different.
R _c6 is preferably an unsubstituted alkyl group or an alkyl group substituted with a fluorine atom, and particularly preferably a trifluoromethyl group or a t-butyl group.
The hydrophobic resin (HR) preferably further has a repeating unit represented by the following general formula (CII-AB).

In the formula (CII-AB),
R _c11 ′ and R _c12 ′ each independently represents a hydrogen atom, a cyano group, a halogen atom or an alkyl group.
Zc ′ represents an atomic group for forming an alicyclic structure containing two bonded carbon atoms (C—C).
The general formula (CII-AB) is more preferably the following general formula (CII-AB1) or general formula (CII-AB2).

In the formulas (CII-AB1) and (CII-AB2), Rc ₁₃ ′ to Rc ₁₆ ′ each independently represents a hydrogen atom, a halogen atom, an alkyl group, or a cycloalkyl group.
In addition, at least two members out of Rc ₁₃ ′ to Rc ₁₆ ′ may combine to form a ring.
n represents 0 or 1.
Specific examples of the repeating unit represented by the general formula (VI) or (CII-AB) are shown below, but the present invention is not limited thereto. In the formula, Ra represents H, CH ₃ , CH ₂ OH, CF ₃ or CN.

  Specific examples of the hydrophobic resin (HR) are shown below. Tables 1 to 3 below show the molar ratio of the repeating units in each resin (corresponding to each repeating unit in order from the left), the weight average molecular weight, and the degree of dispersion.

  When the hydrophobic resin has a fluorine atom, the fluorine atom content is preferably 5 to 80% by mass and more preferably 10 to 80% by mass with respect to the weight average molecular weight of the resin (HR). . Moreover, it is preferable that the repeating unit containing a fluorine atom is 10-100 mol% with respect to all the repeating units in resin (HR), and it is more preferable that it is 30-100 mol%.

When resin (HR) has a silicon atom, it is preferable that the content rate of a silicon atom is 2-50 mass% with respect to the weight average molecular weight of resin (HR), and it is more preferable that it is 2-30 mass%. preferable. Moreover, it is preferable that it is 10-90 mol% with respect to all the repeating units of resin (HR), and, as for the repeating unit containing a silicon atom, it is more preferable that it is 20-80 mol%.
The weight average molecular weight of the resin (HR) in terms of standard polystyrene is preferably 1,000 to 100,000, more preferably 1,000 to 50,000, and still more preferably 2,000 to 15,000.

  Hydrophobic resins can be used alone or in combination of two or more. The content of the resin (HR) in the composition can be appropriately adjusted and used so that the receding contact angle of the composition film falls within the above range, but 0.01 to 10 mass based on the total solid content of the composition. %, More preferably 0.1 to 9% by mass, still more preferably 0.5 to 8% by mass.

  As in the case of the acid-decomposable resin, the resin (HR) preferably has 0 to 10% by mass of residual monomer and oligomer components, and more preferably 0 to 10% by mass, as a matter of course. 5 mass% and 0-1 mass% are still more preferable. Thereby, a resist having no change over time such as foreign matter in liquid or sensitivity can be obtained. The molecular weight distribution (Mw / Mn, also referred to as dispersity) is preferably in the range of 1 to 3, more preferably 1 to 2, and still more preferably 1 in terms of resolution, pattern shape, pattern sidewall, roughness, and the like. -1.8, most preferably in the range of 1-1.5.

  As the resin (HR), various commercially available products can be used, or they can be synthesized according to a conventional method (for example, radical polymerization). For example, as a general synthesis method, a monomer polymerization method in which a monomer species and an initiator are dissolved in a solvent and heating is performed, and a solution of the monomer species and the initiator is dropped into the heating solvent over 1 to 10 hours. The dropping polymerization method is added, and the dropping polymerization method is preferable. Examples of the reaction solvent include ethers such as tetrahydrofuran, 1,4-dioxane and diisopropyl ether, ketones such as methyl ethyl ketone and methyl isobutyl ketone, ester solvents such as ethyl acetate, amide solvents such as dimethylformamide and dimethylacetamide, Furthermore, the solvent which melt | dissolves the composition of this invention like the above-mentioned propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl ether (PGME), and cyclohexanone is mentioned. More preferably, the polymerization is performed using the same solvent as that used in the resist composition of the present invention. Thereby, generation | occurrence | production of the particle at the time of a preservation | save can be suppressed.

  The polymerization reaction is preferably performed in an inert gas atmosphere such as nitrogen or argon. As a polymerization initiator, a commercially available radical initiator (azo initiator, peroxide, etc.) is used to initiate the polymerization. As the radical initiator, an azo initiator is preferable, and an azo initiator having an ester group, a cyano group, or a carboxy group is preferable. Preferred examples of the initiator include azobisisobutyronitrile, azobisdimethylvaleronitrile, dimethyl 2,2′-azobis (2-methylpropionate) and the like. The concentration of the reaction is usually 5 to 50% by mass, preferably 30 to 50% by mass. The reaction temperature is usually from 10 ° C to 150 ° C, preferably from 30 ° C to 120 ° C, more preferably from 60 ° C to 100 ° C.

  After completion of the reaction, the mixture is allowed to cool to room temperature and purified. Purification can be accomplished by a liquid-liquid extraction method that removes residual monomers and oligomer components by combining water and an appropriate solvent, and a purification method in a solution state such as ultrafiltration that extracts and removes only those having a specific molecular weight or less. , Reprecipitation method that removes residual monomer by coagulating resin in poor solvent by dripping resin solution into poor solvent and purification in solid state such as washing filtered resin slurry with poor solvent A normal method such as a method can be applied. For example, the resin is precipitated as a solid by contacting a solvent (poor solvent) in which the resin is hardly soluble or insoluble in a volume amount of 10 times or less, preferably 10 to 5 times that of the reaction solution.

  The solvent (precipitation or reprecipitation solvent) used in the precipitation or reprecipitation operation from the polymer solution may be a poor solvent for the polymer, and may be a hydrocarbon, halogenated hydrocarbon, nitro, depending on the type of polymer. A compound, ether, ketone, ester, carbonate, alcohol, carboxylic acid, water, a mixed solvent containing these solvents, and the like can be appropriately selected for use. Among these, as a precipitation or reprecipitation solvent, a solvent containing at least an alcohol (particularly methanol or the like) or water is preferable.

The amount of the precipitation or reprecipitation solvent used can be appropriately selected in consideration of efficiency, yield, and the like, but generally 100 to 10000 parts by mass, preferably 200 to 2000 parts by mass with respect to 100 parts by mass of the polymer solution, More preferably, it is 300-1000 mass parts.
The temperature for precipitation or reprecipitation can be appropriately selected in consideration of efficiency and operability, but is usually about 0 to 50 ° C., preferably around room temperature (for example, about 20 to 35 ° C.). The precipitation or reprecipitation operation can be performed by a known method such as a batch method or a continuous method using a conventional mixing vessel such as a stirring tank.

  The precipitated or re-precipitated polymer is usually subjected to conventional solid-liquid separation such as filtration and centrifugation, and dried before use. Filtration is performed using a solvent-resistant filter medium, preferably under pressure. Drying is performed at a temperature of about 30 to 100 ° C., preferably about 30 to 50 ° C. under normal pressure or reduced pressure (preferably under reduced pressure).

In addition, once the resin is precipitated and separated, it may be dissolved again in a solvent, and the resin may be brought into contact with a hardly soluble or insoluble solvent. That is, after completion of the radical polymerization reaction, a solvent in which the polymer is hardly soluble or insoluble is brought into contact, the resin is precipitated (step a), the resin is separated from the solution (step b), and dissolved again in the solvent. (Step c), and then contact the resin solution A with a solvent in which the resin is hardly soluble or insoluble in a volume amount less than 10 times that of the resin solution A (preferably 5 times or less volume). This may be a method including precipitating a resin solid (step d) and separating the precipitated resin (step e).
About the film formed from the resist composition according to the present invention, upon irradiation with actinic rays or radiation, a liquid (immersion medium) having a refractive index higher than that of air is filled between the film and the lens for exposure (immersion exposure). May be performed. Thereby, resolution can be improved. As the immersion medium to be used, any liquid can be used as long as it has a higher refractive index than air, but pure water is preferred.
The immersion liquid used for the immersion exposure will be described below.

The immersion liquid is preferably a liquid that is transparent to the exposure wavelength and has a refractive index temperature coefficient as small as possible so as to minimize distortion of the optical image projected onto the resist film. In addition, it is preferable to use water from the viewpoints of easy availability and ease of handling.
Further, a medium having a refractive index of 1.5 or more can be used in that the refractive index can be further improved. This medium may be an aqueous solution or an organic solvent.

  When water is used as the immersion liquid, the surface tension of the water is decreased and the surface activity is increased, so that the resist film on the wafer is not dissolved and the influence on the optical coating on the lower surface of the lens element can be ignored. An additive (liquid) may be added in a small proportion. The additive is preferably an aliphatic alcohol having a refractive index substantially equal to that of water, and specifically includes methyl alcohol, ethyl alcohol, isopropyl alcohol and the like. By adding an alcohol having a refractive index substantially equal to that of water, even if the alcohol component in water evaporates and the content concentration changes, an advantage that the change in the refractive index of the entire liquid can be made extremely small can be obtained. On the other hand, when an impurity whose refractive index is significantly different from that of water is mixed, the optical image projected on the resist film is distorted, so that distilled water is preferable as the water to be used. Further, pure water filtered through an ion exchange filter or the like may be used.

The electrical resistance of water is desirably 18.3 MQcm or more, the TOC (organic substance concentration) is desirably 20 ppb or less, and deaeration treatment is desirably performed.
Moreover, it is possible to improve lithography performance by increasing the refractive index of the immersion liquid. From such a viewpoint, an additive for increasing the refractive index may be added to water, or heavy water (D ₂ O) may be used instead of water.

  An immersion liquid poorly soluble film (hereinafter also referred to as “topcoat”) may be provided between the film of the composition of the present invention and the immersion liquid so that the film does not directly contact the immersion liquid. Good. The functions necessary for the top coat are suitability for application to the upper layer portion of the composition film and poor solubility of the immersion liquid. It is preferable that the top coat is not mixed with the composition film and can be uniformly applied to the upper layer of the composition film.

  Specific examples of the topcoat include hydrocarbon polymers, acrylic ester polymers, polymethacrylic acid, polyacrylic acid, polyvinyl ether, silicon-containing polymers, fluorine-containing polymers, and the like. The aforementioned hydrophobic resin (HR) is also suitable as a top coat. Commercially available top coat materials can also be used as appropriate. From the viewpoint of contaminating the optical lens when impurities are eluted from the top coat into the immersion liquid, it is preferable that the residual monomer component of the polymer contained in the top coat is small.

  When peeling the top coat, a developer may be used, or a separate release agent may be used. As the release agent, a solvent having low penetration into the film is preferable. From the viewpoint that the peeling step can be performed at the same time as the film development processing step, it is preferable that the peeling step can be performed with a developer containing an organic solvent.

  The resolution is improved when there is no difference in refractive index between the top coat and the immersion liquid. When water is used as the immersion liquid, the top coat is preferably close to the refractive index of the immersion liquid. From the viewpoint of making the refractive index close to the immersion liquid, it is preferable to have fluorine atoms in the topcoat. A thin film is more preferable from the viewpoint of transparency and refractive index.

  The topcoat is preferably not mixed with the membrane and further not mixed with the immersion liquid. From this point of view, when the immersion liquid is water, the solvent used for the top coat is preferably a water-insoluble medium that is hardly soluble in the solvent used for the composition of the present invention. Further, when the immersion liquid is an organic solvent, the topcoat may be water-soluble or water-insoluble.

  The hydrophobic resin can also be used when immersion exposure is not performed. As an effect brought about in this case, the hydrophobic resin can be unevenly distributed on the surface of the resist film, and promotes the dissolution of the resist film in the organic developer regardless of the exposed part and the unexposed part of the resist film. As a result, even when an extremely fine pattern is formed, it is possible to expect a function of suppressing generation of roughness (especially in the case of EUV exposure), T-top shape, reverse taper shape, and bridge portion on the pattern surface. .

[8] Other additives In addition to the components described above, the composition of the present invention has a molecular weight of 3000 or less as described in carboxylic acid, carboxylic acid onium salt, Proceeding of SPIE, 2724, 355 (1996), etc. A blocking compound, a dye, a plasticizer, a photosensitizer, a light absorber, an antioxidant, and the like can be appropriately contained.
In particular, carboxylic acid is preferably used for improving the performance. As the carboxylic acid, aromatic carboxylic acids such as benzoic acid and naphthoic acid are preferable.
The content of the carboxylic acid is preferably 0.01 to 10% by mass, more preferably 0.01 to 5% by mass, and still more preferably 0.01 to 3% by mass in the total solid content concentration of the composition.

The actinic ray-sensitive or radiation-sensitive resin composition in the present invention is preferably used at a thickness of 10 to 250 nm, more preferably at a thickness of 20 to 200 nm, from the viewpoint of improving resolution. More preferably, it is preferably used at 30 to 100 nm. Such a film thickness can be obtained by setting the solid content concentration in the composition to an appropriate range to give an appropriate viscosity and improving the coating property and film forming property.
The solid content concentration of the actinic ray-sensitive or radiation-sensitive resin composition in the present invention is usually 1.0 to 10.0% by mass, preferably 1.0 to 5.7% by mass, and more preferably 1. 0.0 to 3.0% by mass. By setting the solid content concentration within the above range, it is possible to uniformly apply the resist solution on the substrate, and it is possible to form a resist pattern having excellent line width roughness. The reason for this is not clear, but perhaps the solid content concentration is 10% by mass or less, preferably 5.7% by mass or less, which suppresses aggregation of the material in the resist solution, particularly the photoacid generator. As a result, it is considered that a uniform resist film was formed.
The solid content concentration is a weight percentage of the weight of other resist components excluding the solvent with respect to the total weight of the actinic ray-sensitive or radiation-sensitive resin composition.

  In the actinic ray-sensitive or radiation-sensitive resin composition of the present invention, the above components are dissolved in a predetermined organic solvent, preferably the mixed solvent, filtered, and then applied onto a predetermined support (substrate). Use. The pore size of the filter used for filter filtration is preferably 0.1 μm or less, more preferably 0.05 μm or less, and still more preferably 0.03 μm or less made of polytetrafluoroethylene, polyethylene, or nylon. In filter filtration, for example, as in JP-A-2002-62667, circulation filtration may be performed, or filtration may be performed by connecting a plurality of types of filters in series or in parallel. The composition may be filtered multiple times. Furthermore, you may perform a deaeration process etc. with respect to a composition before and behind filter filtration.

[Usage]
The pattern forming method of the present invention is suitably used for the production of semiconductor microcircuits such as the manufacture of VLSI and high-capacity microchips. When creating a semiconductor microcircuit, the patterned resist film is used for circuit formation and etching, and the remaining resist film portion is finally removed with a solvent or the like. Unlike so-called permanent resists, the resist film derived from the actinic ray-sensitive or radiation-sensitive resin composition described in the present invention does not remain in the final product such as a microchip.

The present invention also relates to an electronic device manufacturing method including the above-described pattern forming method of the present invention, and an electronic device manufactured by this manufacturing method.
The electronic device of the present invention is suitably mounted on electrical and electronic equipment (home appliances, OA / media related equipment, optical equipment, communication equipment, etc.).

  EXAMPLES Hereinafter, although an Example demonstrates this invention further more concretely, this invention is not limited to a following example.

Synthesis Example 1 (Synthesis of Resin (A1-1))
Under a nitrogen stream, 20 g of cyclohexanone was placed in a three-necked flask and heated to 80 ° C. (solvent 1). The following M-1, M-2, M-3, and M-4 were dissolved in cyclohexanone at a molar ratio of 40/10/40/10 to prepare a 22% by mass monomer solution (200 g). . Furthermore, 6 mol% of initiator V-601 (manufactured by Wako Pure Chemical Industries, Ltd.) was added to the monomer, and the dissolved solution was added dropwise to (solvent 1) over 6 hours. After completion of dropping, the reaction was further continued at 80 ° C. for 2 hours. The reaction solution was allowed to cool and then poured into a mixed solution of 1400 ml of hexane / 600 ml of ethyl acetate, and the precipitated powder was collected by filtration and dried to obtain 37 g of Resin (A1-1). The obtained resin (A1-1) had a weight average molecular weight (Mw: polystyrene equivalent) determined from GPC of 10,000 and a dispersity (Mw / Mn) of 1.60.

  Hereinafter, resins (A1-2) to (A1-15) were synthesized using the same method. The synthesized polymer structure, weight average molecular weight (Mw) and dispersity (Mw / Mn) are described below. Moreover, the composition ratio of each repeating unit of the following polymer structure was shown by molar ratio.

Synthesis Example 2 (Synthesis of Resin (A2-1))
4.66 parts by mass of 1-methoxy-2-propanol was heated to 80 ° C. under a nitrogen stream. While stirring this liquid, 5.05 parts by mass of 4-hydroxystyrene and 4.95 parts by mass of monomer (M-5) (that is, the molar ratio of 4-hydroxystyrene to monomer (M-5) is 7: 3). 18.6 parts by mass of 1-methoxy-2-propanol, 1.36 parts by mass of dimethyl 2,2′-azobisisobutyrate [V-601, manufactured by Wako Pure Chemical Industries, Ltd.] was added dropwise over 2 hours. did. After completion of dropping, the mixture was further stirred at 80 ° C. for 4 hours. After allowing the reaction liquid to cool, 5.9 parts by mass of the resin (A2-1) of the present invention was obtained by reprecipitation and vacuum drying with a large amount of hexane / ethyl acetate (mass ratio 9: 1).
The weight average molecular weight (Mw: polystyrene conversion) determined from GPC was Mw = 15100, and the dispersity (Mw / Mn) was 1.40.

  Hereinafter, resins (A2-2) to (A2-4) were synthesized using the same method. The synthesized polymer structure, weight average molecular weight (Mw) and dispersity (Mw / Mn) are described below. Moreover, the composition ratio of each repeating unit of the following polymer structure was shown by molar ratio.

[Preparation of coating solution of actinic ray-sensitive or radiation-sensitive resin composition]
The components shown in Table 4 below are dissolved in the solvent shown in Table 4 below to prepare a solution having a solid content concentration of 2.8% by mass, and this is filtered through a polyethylene filter having a pore size of 0.05 μm. Radiation resin compositions (resist compositions) Ra1 to Ra23, and Rb1 and Rb2 were prepared. In addition, the usage-amount of surfactant is a value with respect to the solvent in a composition.

<Acid generator>
As an acid generator, except the following Z-2 and Z-4, it mentioned above as a compound (B) which generate | occur | produces an acid by irradiation of the actinic ray or radiation represented by the said general formula (Z1) (b-). 1) to (b-63) were appropriately selected and used.

Abbreviations in the table represent the following.
<Basic compound>
D-1: Tetra- (n-butyl) ammonium hydroxide D-2: 1,8-diazabicyclo [5.4.0] -7-undecene D-3: 2,4,5-triphenylimidazole D-4 : Tri-n-dodecylamine <Surfactant>
W-1: Megafuck F176 (manufactured by DIC Corporation) (fluorine-based)
W-2: Megafuck R08 (manufactured by DIC Corporation) (fluorine and silicon)
W-3: Polysiloxane polymer KP-341 (manufactured by Shin-Etsu Chemical Co., Ltd.) (silicon-based)
W-4: PF6320 (manufactured by OMNOVA) (fluorine type)

<Coating solvent>
S-1: Propylene glycol monomethyl ether acetate (PGMEA)
S-2: Propylene glycol monomethyl ether (PGME)
S-3: Cyclohexanone

[Examples 1 to 23, Comparative Example 1 (extreme ultraviolet (EUV) exposure, organic solvent development)]
The composition shown in Table 5 was applied onto an 8-inch silicon wafer (substrate) that had been subjected to hexamethyldisilazane (HMDS) treatment using a spin coater ACT-12 manufactured by Tokyo Electron, and 100 ° C. on a hot plate. Was baked for 60 seconds to form an 80 nm thick film (resist film).
The wafer coated with the resist film is exposed to an EUV exposure apparatus (Microexposure Tool, manufactured by Exitech, NA 0.3, Quadrupole, outer sigma 0.68, inner sigma 0.36) using an exposure mask (line / space = 1 / Pattern exposure was performed using 1). After irradiation, after heating for 60 seconds at 110 ° C. on a hot plate, paddle the organic solvent developer described in Table 5 for 30 seconds, rinse with the rinse solution listed in Table 5, The wafer was rotated at 4000 rpm for 30 seconds, and then baked at 90 ° C. for 60 seconds to obtain a 1: 1 line and space pattern having a line width of 50 nm. In Table 5, those having no description of the rinsing liquid mean that rinsing was not performed. In addition, when a plurality of types of organic solvents are used as a developer, they are shown together with their mass ratios.

[Comparative Example 2 (extreme ultraviolet (EUV) exposure, alkali development)]
The composition was changed as shown in Table 5 below, and instead of the organic solvent-based developer, development was performed with an alkaline aqueous solution (TMAH; 2.38 mass% tetramethylammonium hydroxide aqueous solution), and the rinse solution was water. Except for the above, pattern formation was performed in the same manner as in Example 1.

[Evaluation of resist pattern / EUV]
The performance evaluation of the resist pattern was performed using a scanning electron microscope. For the pattern formed using EUV exposure, performance evaluation was performed using a scanning electron microscope (S-9380II, manufactured by Hitachi, Ltd.).

<Sensitivity>
Irradiation energy when resolving a 1: 1 line and space pattern with a line width of 50 nm was defined as sensitivity (Eop). The smaller this value, the better the performance. The results are shown in Table 5.

<Pattern collapse>
When the exposure amount was reduced from the Eop and the line line width was narrowed, the minimum line width that could be resolved without falling down the pattern was defined as the limit pattern falling line width, which was used as an index for suppressing the occurrence of pattern collapse. The smaller the value is, the smaller pattern is resolved without falling, and the occurrence of pattern falling is suppressed. The results are shown in Table 5. Since Comparative Example 2 is positive development, when the exposure amount is increased from the Eop and the line line width is narrowed, the minimum line width that resolves without falling down the pattern is defined as the limit pattern falling line width, It was used as an index for suppressing the occurrence of pattern collapse.

<Evaluation of pattern shape (bite shape under pattern)>
In the above Eop, a 1: 1 line and space pattern with a line width of 50 nm was observed using a scanning electron microscope (S4800, manufactured by Hitachi, Ltd.). When the line width is 101% or less to 99% or more with respect to the line width at the upper part of the pattern, although the bite at the lower part of the resist pattern is slightly seen, the line width at the lower part of the pattern is equal to the line width at the upper part of the pattern. ○ when the line width is less than 99% to 90% or more, bite is seen at the lower part of the resist pattern, and the line width at the lower part of the pattern is less than 90% of the line width at the upper part of the pattern. Expressed in The results are shown in Table 5.
The line width at the bottom of the pattern is the height of the resist pattern from the substrate surface (when the resist pattern height is not uniform, the maximum height of the resist pattern from the substrate surface) is T. Means the line width of the resist pattern at a height of 0.1 × T from the substrate surface. The line width above the pattern means the line width of the resist pattern at a height of 0.9 × T from the substrate surface.
<Outgas performance: Film thickness fluctuation rate due to exposure>
Irradiate with EUV light at an exposure amount that is 2.0 times the exposure amount giving the above sensitivity, measure the film thickness after exposure and before post-heating, and use the following formula to calculate the film thickness from the unexposed film thickness. The rate of change was determined.
Film thickness variation rate (%) = [(film thickness at unexposed−film thickness after exposure) / film thickness at unexposed] × 100

As is clear from the above table, it can be seen that Comparative Example 1 using an acid generator that does not satisfy the general formula (Z1) is inferior in sensitivity and pattern collapse suppression. Although the acid generator satisfies the above general formula (Z1), it can be seen that Comparative Example 2 in which a positive pattern was formed with an alkaline developer was inferior in sensitivity and pattern collapse suppression, and bite under the pattern was also generated.
On the other hand, Examples 1-23 which used the acid generator which satisfy | fills the said general formula (Z1), and formed the negative pattern using the organic type developing solution are high sensitivity, a pattern collapse is suppressed, pattern lower part It can be seen that there is little occurrence of bite.
Regarding outgas performance, Examples 1 to 23 using an acid generator that satisfies the general formula (Z1) are more outgassed than Comparative Example 1 using an acid generator that does not satisfy the general formula (Z1). The amount was confirmed to be small.
From the above results, it is clear that according to the present invention, the above-mentioned performance is excellent and a highly accurate fine pattern can be stably formed in EUV exposure.

[Examples 101 to 123, Comparative Example 101 (electron beam (EB) exposure, organic solvent development)]
The composition shown in Table 6 was applied on a 6-inch silicon wafer (substrate) subjected to hexamethyldisilazane (HMDS) treatment using a spin coater Mark8 manufactured by Tokyo Electron, and the composition shown in Table 6 was applied on a hot plate at 100 ° C. at 60 ° C. Baking was performed for 2 seconds to form a film (resist film) having a thickness of 80 nm.
The wafer coated with this resist film was subjected to pattern irradiation using an electron beam lithography apparatus (HL750 manufactured by Hitachi, Ltd., acceleration voltage 50 keV). At this time, drawing was performed so that a 1: 1 line and space pattern was formed. After the electron beam drawing, after heating at 110 ° C. for 60 seconds on a hot plate, paddle the organic solvent-based developer listed in Table 6 for 30 seconds, and rinse using the rinse liquid listed in Table 6 Thereafter, the wafer was rotated at a rotational speed of 4000 rpm for 30 seconds and then baked at 90 ° C. for 60 seconds to obtain a 1: 1 line and space pattern having a line width of 50 nm. In Table 6, those having no description of the rinsing liquid mean that rinsing was not performed. In addition, when a plurality of types of organic solvents are used as a developer, they are shown together with their mass ratios.

[Comparative Example 102 (Electron Beam (EB) Exposure, Alkaline Development)]
The composition was changed as shown in Table 6 below, and instead of the organic solvent-based developer, development was performed with an alkaline aqueous solution (TMAH; 2.38 mass% tetramethylammonium hydroxide aqueous solution), and the rinse solution was water. Except for the above, pattern formation was performed in the same manner as in Example 101.

[Resist evaluation / EB]
The performance evaluation of the resist pattern was performed using a scanning electron microscope. For the pattern formed using EB exposure, performance evaluation was performed using a scanning electron microscope (S-9220, manufactured by Hitachi, Ltd.).

<Sensitivity>
Irradiation energy when resolving a 1: 1 line and space pattern with a line width of 50 nm was defined as sensitivity (Eop). The smaller this value, the better the performance. The results are shown in Table 6.

<Pattern collapse>
When the exposure amount was reduced from the Eop and the line line width was narrowed, the minimum line width that could be resolved without falling down the pattern was defined as the limit pattern falling line width, which was used as an index for suppressing the occurrence of pattern collapse. The smaller the value is, the smaller pattern is resolved without falling, and the occurrence of pattern falling is suppressed. The results are shown in Table 6. Since Comparative Example 102 is positive development, when the exposure amount is increased from the Eop and the line line width is narrowed, the minimum line width that can be resolved without falling down is set as the limit pattern falling line width. It was used as an index for suppressing the occurrence of pattern collapse.

<Evaluation of pattern shape (bite shape under pattern)>
In the above Eop, a 1: 1 line and space pattern with a line width of 50 nm was observed using a scanning electron microscope (S4800, manufactured by Hitachi, Ltd.). When the line width is 101% or less to 99% or more with respect to the line width at the upper part of the pattern, although the bite at the lower part of the resist pattern is slightly seen, the line width at the lower part of the pattern is equal to the line width at the upper part of the pattern. ○ when the line width is less than 99% to 90% or more, bite is seen at the lower part of the resist pattern, and the line width at the lower part of the pattern is less than 90% of the line width at the upper part of the pattern. Expressed in The results are shown in Table 6.
The line width at the bottom of the pattern is the height of the resist pattern from the substrate surface (when the resist pattern height is not uniform, the maximum height of the resist pattern from the substrate surface) is T. Means the line width of the resist pattern at a height of 0.1 × T from the substrate surface. The line width above the pattern means the line width of the resist pattern at a height of 0.9 × T from the substrate surface.
<Outgas performance: Film thickness fluctuation rate due to exposure>
Irradiate an electron beam at a dose that is 2.0 times the dose giving the above sensitivity, measure the film thickness after exposure and before post-heating, and use the following formula to calculate the film thickness from the unexposed film thickness: The rate of change was determined.
Film thickness variation rate (%) = [(film thickness at unexposed−film thickness after exposure) / film thickness at unexposed] × 100

As is clear from the above table, it can be seen that Comparative Example 101 using an acid generator that does not satisfy the general formula (Z1) is inferior in sensitivity and pattern collapse suppression. Although the acid generator satisfies the general formula (Z1), Comparative Example 102 in which a positive pattern was formed with an alkali developer has particularly poor sensitivity, poor pattern collapse suppression, and bite under the pattern. I understand.
On the other hand, Examples 101-123 which used the acid generator which satisfy | fills the said general formula (Z1), and formed the negative pattern using the organic type developing solution are high sensitivity, a pattern collapse is suppressed, pattern lower part It can be seen that there is little occurrence of bite.
Regarding the outgas performance, Examples 101 to 123 using the acid generator satisfying the general formula (Z1) also generate outgas compared to the comparative example 101 using the acid generator not satisfying the general formula (Z1). The amount was confirmed to be small.
From the above results, it is clear that according to the present invention, the above-mentioned performance is excellent and a highly accurate fine pattern can be stably formed in EB exposure.
In addition, even when the resist compositions of Examples 101 to 123 containing the acid generator described above were applied to ArF exposure and evaluated, they were similarly excellent in high sensitivity and pattern collapse performance. A shape without biting was obtained.

Claims (16)

(A) a resin whose solubility in a developer containing an organic solvent is reduced by the action of an acid, (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation represented by the following general formula (Z1), and (C ) A step of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition containing a solvent (1),
A pattern forming method comprising: a step (2) of exposing the film using actinic rays or radiation; and a step (4) of forming a negative pattern by developing with a developer containing an organic solvent after the exposure. .

In the general formula (Z1),
L ₁ represents —O—, —S—, —OS (═O) ₂ —, —S (═O) ₂ O—, —OC (═O) —, —C (═O) O—, —S ( _{= O) -, - S (} = O) 2 -, - C (= O) -, - N (R 7) C (= O) -, - C (= O) N (R 7) -, - N (R ₇ ) S (═O) ₂ — or —S (═O) ₂ N (R ₇ ) — (the right side is the R ₁ side), and R ₇ represents a hydrogen atom, an alkyl group or a cycloalkyl group. .
R ₁ represents an alkylene group, a cycloalkylene group, an arylene group or a divalent group formed by a combination thereof, in which —O—, —C (═O) —, —S (═O) ₂ — or -S- may be included.
A ₁ is _-SO ³ _{-, -SO} ² N - represents a _{(SO 2 R 9) 2 -} SO 2 R 8 or _-SO 2 ^C. R ₈ represents an alkyl group, a cycloalkyl group or an aryl group, R ₉ represents an alkyl group, a cycloalkyl group or an aryl group, and two R _{9 s} may be the same or different.
R ₂ and R ₃ each independently represents an alkyl group, an alkenyl group, a cycloalkyl group, an aryl group or a heterocyclic group.
R ₄ represents a monovalent substituent, and n ₁ represents an integer of 0 to 4. When n ₁ is 2 or more, the plurality of R ₄ may be the same or different.
Further, R ₂ and R ₃ , R ₂ and R ₄ , R ₃ and R ₄ , R ₂ and the benzene ring in the general formula (Z1), R ₃ and the benzene ring, and when n ₁ is 2 or more R ₄ may be connected to each other to form a ring. The pattern formation method of Claim 1 whose compound (B) represented by the said general formula (Z1) is a compound represented by the following general formula (Z2).

In the general formula (Z2),
_{L 1, R 1, A 1} , R 4, n 1 has the same meaning as _{L 1, R 1, A 1} , R 4, n 1 in the general formula (Z1).
R ₅ and R ₆ each independently represent a monovalent substituent, and n ₂ and n ₃ each independently represent an integer of 0 to 5.
A plurality of R ₄ when n ₁ is 2 or more, a plurality of R ₅ when n ₂ is 2 or more, and a plurality of R ₆ when n ₃ is 2 or more may be the same or different and are connected to each other To form a ring. R ₄ and R ₅ , R ₅ and R ₆ , and R ₄ and R ₆ may be connected to each other to form a ring. At that time, R ₄ , R ₅ and R ₆ may each be a single bond. The pattern formation method according to claim 1, wherein A ₁ in the general formula (Z1) or (Z2) is —SO ₃ ^— . In the benzene ring to which -L ₁ -R ₁ -A ₁ in the general formula (Z1) or (Z2) is bonded, the -L ₁ -R ₁ -A ₁ is substituted at the meta position or the ortho position with respect to S ⁺ . The pattern formation method of any one of Claims 1-3. In the general formula (Z1) or (Z2), with respect to the benzene ring to which -L ₁ -R ₁ -A ₁ is bonded, the -L ₁ -R ₁ -A ₁ is substituted in the para position with respect to S ⁺ ; L ₁ is —S—, —S (═O) —, —S (═O) ₂ —, —C (═O) —, —OS (═O) ₂ —, —S (═O) ₂ O—. , -OC (= O) -, - C (= O) O -, - N (R 7) C (= O) -, - C (= O) N (R 7) -, - N (R 7) S (= _{O) 2} - or _{-S (= O) 2 N (} R 7) - is a pattern forming method according to any one of claims 1 to 3.   The pattern formation method according to claim 1, wherein the resin (A) further has a repeating unit having a polar group.   The polar group is selected from a hydroxyl group, a cyano group, a lactone group, a carboxylic acid group, a sulfonic acid group, an amide group, a sulfonamide group, an ammonium group, a sulfonium group, and a group formed by combining two or more thereof. The pattern forming method according to claim 6.   The pattern formation method according to claim 1, wherein the resin (A) further has a repeating unit having an acidic group.   The acidic group is a phenolic hydroxyl group, carboxylic acid group, sulfonic acid group, fluorinated alcohol group, sulfonamide group, sulfonylimide group, (alkylsulfonyl) (alkylcarbonyl) methylene group, (alkylsulfonyl) (alkylcarbonyl) Imido group, bis (alkylcarbonyl) methylene group, bis (alkylcarbonyl) imide group, bis (alkylsulfonyl) methylene group, bis (alkylsulfonyl) imide group, tris (alkylcarbonyl) methylene group or tris (alkylsulfonyl) methylene group The pattern forming method according to claim 8, wherein   The pattern forming method according to claim 1, wherein the actinic ray-sensitive or radiation-sensitive resin composition further contains a hydrophobic resin.   The pattern formation method of any one of Claims 1-10 exposed by an electron beam, an X-ray, or EUV light.   The pattern formation method of any one of Claims 1-11 which is an object for semiconductor fine circuit preparation.   The actinic-ray-sensitive or radiation-sensitive resin composition used for the pattern formation method of any one of Claims 1-12.   A resist film formed using the actinic ray-sensitive or radiation-sensitive resin composition according to claim 13.   The manufacturing method of an electronic device containing the pattern formation method of any one of Claims 1-12.   An electronic device manufactured by the electronic device manufacturing method according to claim 15.