JP2013166347A - Inkjet head, and inkjet recording device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inkjet head that can approximately uniformize an ink temperature by dissipating heat generated from a driving IC chip inserted into an inkjet head to ink in a common liquid chamber.SOLUTION: An inkjet head includes: a nozzle plate 2; an individual liquid chamber forming substrate 101; an actuator substrate 14 having a pressure generating element, and a driving IC chip 105; a first heat dissipating member 202 that transfers heat from the driving IC chip to liquid; a second heat dissipating member 201 that transfers heat from the driving IC chip to the first heat dissipating member; a common liquid chamber forming substrate 103 in which a common liquid chamber for supplying the liquid to the common liquid chamber is formed; and a manifold in which a supply hole for supplying the liquid to the common liquid chamber is formed. The first heat dissipating member is disposed so that at least some of the heat dissipating member contacts the liquid supplied to the common liquid chamber along a center axis of the supply hole.

Description

  The present invention relates to an ink jet head that is mounted on an ink jet printer and performs recording by discharging ink onto a recording medium.

As an image forming apparatus, an ink jet printer that forms an image pattern by ejecting micro droplets of ink from an ink jet head and landing on a recording medium while reciprocating a carriage mounted with the ink jet head in the main scanning direction. It has been known.
In an ink jet head for color printing, ink of each color is supplied from each ink tank of yellow, magenta, cyan, and black to a common liquid chamber for each color via an ink supply hole, and from each common liquid chamber It is supplied to the nozzle via each individual liquid chamber.
Recently, on-demand ink jet printers configured to eject ink droplets only when recording is required have become the mainstream, and the ink jet heads equipped therein have individual liquid chambers ( A piezoelectric type in which the pressure in the individual liquid chamber is increased by the displacement of a piezoelectric element as a pressure generation source provided in the pressure chamber), and ink is generated by generating bubbles in the ink in the liquid chamber by a heater. It is distinguished from the thermal method that discharges water. In either method, a pressure generation source is operated by a drive signal from a drive IC chip for driving an ink jet head, and ink droplets are ejected from nozzles to land on a recording medium.
In recent years, there has been an increasing demand for miniaturization and cost reduction for inkjet heads, and various attempts have been made to incorporate a drive IC chip in an inkjet head in order to meet this demand. As a specific countermeasure, a configuration in which a driving IC chip is flip-chip bonded inside an ink jet head has been proposed.
For example, a configuration has been proposed in which an inkjet head is miniaturized by flip-chip bonding a drive IC chip between an actuator substrate and a subframe laminated thereon.

  By the way, when a drive signal is output to the ink jet head, a large current flows through the drive IC chip, so that the drive IC chip generates heat and the temperature rises. The heat generated from the driving IC chip is locally transmitted to the ink in the common liquid chamber through the common liquid chamber forming substrate to locally increase the temperature of the ink. For this reason, the ink in the common liquid chamber is in a state where the normal temperature ink as it is supplied from the ink tank and the ink heated in contact with the common liquid chamber forming substrate are mixed. The ink in the common liquid chamber whose temperature has partially increased is ejected from the nozzle to the outside through the individual liquid chamber. Thereby, the heat generated from the drive IC chip is radiated to the outside.

However, since the common liquid chamber is elongated, when supplying ink from the common liquid chamber to the individual liquid chamber, the ink sequentially moves from the individual liquid chamber close to the supply liquid chamber to the individual liquid chamber located far from the supply liquid chamber. Ink having a variation in temperature is supplied from the common liquid chamber to the individual liquid chamber. That is, each individual liquid has an ink flow in which an ink portion having a normal temperature and a relatively high temperature ink whose temperature is locally increased by the heat generated from the driving IC chip in the process of flowing into each individual liquid chamber. Sequentially supplied to the chamber. Such temperature unevenness of ink causes unevenness of ink viscosity, resulting in variations in ink discharge characteristics between nozzles.
More specifically, the drive IC chip is elongated so as to correspond to the entire length of the elongated common liquid chamber, and the drive IC chip generates heat over the entire length. Heat generated from the entire length of the drive IC chip is transmitted to the ink in the common liquid chamber through the common liquid chamber forming member, and the temperature of the ink is increased uniformly. On the other hand, when ink is ejected from a nozzle located downstream of the common liquid chamber, normal temperature ink passes from the ink tank located upstream of the common liquid chamber via the ink supply hole in the longitudinal center of the common liquid chamber. Supplied to the department. Normal temperature ink supplied from the ink supply hole to the central portion of the common liquid chamber gradually flows to both ends in the longitudinal direction of the elongated supply liquid chamber. When reaching the end of the supply liquid chamber, the ink at room temperature gradually rises in temperature due to heat from the driving IC chip. As a result, temperature variations (temperature unevenness) occur in the ink temperatures at the central and end portions of the common liquid chamber. Such temperature variation of ink causes unevenness of ink viscosity, and thus causes variation in ink discharge characteristics between nozzles.

Further, in this prior art, since the common liquid chamber forming substrate is provided in the upper surface direction of the driving IC chip, and there is a gap between the driving IC chip and the common liquid chamber forming substrate, the driving IC chip The effect of suppressing the temperature rise is limited.
As a countermeasure against such a problem, a proposal has been made to equalize the ink temperature in the common liquid chamber by providing a cooling channel in the common liquid chamber forming member. For example, in the inkjet head disclosed in Patent Document 1, a pressure for ejecting ink by providing a temperature equalizing member such as a heat pipe or a cooling channel on a common liquid chamber forming member in which a plurality of ink common liquid chambers are formed. There has been proposed a configuration that suppresses temperature unevenness in the ink in the common liquid chamber by discharging heat generated from the generating member to the cooling liquid in the heat pipe or the cooling flow path via the common liquid chamber forming member. In this configuration, by disposing the heat pipe and the cooling flow path between the common liquid chamber and the pressure generating member, heat from the pressure generating member can be appropriately suppressed, and the common liquid chamber The temperature unevenness in the ink can be reduced efficiently.

However, in the configuration described in Patent Document 2, since a heat pipe or a cooling channel must be provided between the pressure generating member and the common liquid chamber, there is a limit to downsizing the inkjet head.
The present invention has been made in view of the above, and by radiating the heat generated from the drive IC chip disposed inside the inkjet head to the ink immediately after being supplied from the ink tank side to the common liquid chamber, It is an object of the present invention to provide an ink jet head capable of making the temperature of ink moving into the individual liquid chambers substantially uniform.

In order to solve the above-described problems, an inkjet head according to the present invention includes a nozzle for discharging a liquid, a nozzle plate having at least one nozzle row composed of a plurality of the nozzles, and an individual partition defined by a flow path partition. Individual liquid chamber forming substrate for forming a liquid chamber, a diaphragm constituting a part of the individual liquid chamber, a pressure generating element formed on the diaphragm, and a driving IC chip for sending a driving signal to the pressure generating element An actuator substrate, a first heat radiating member that transmits heat from the drive IC chip to the liquid, and at least a part of the drive IC chip, and heat from the drive IC chip A second heat dissipating member that transmits to one heat dissipating member, a common liquid chamber forming substrate in which a common liquid chamber for supplying the liquid to the individual liquid chamber is formed, and a supply hole for supplying the liquid to the common liquid chamber An ink-jet head having a formed manifold, wherein at least a part of the first heat radiating member is in contact with the liquid supplied to the common liquid chamber along a central axis of the supply hole. It is arranged so that it may be arranged.
All the liquids supplied from the supply holes always come into contact with a part of the first heat radiating member and rise in temperature evenly, so that the variation in liquid temperature when reaching the individual liquid chamber is eliminated.

  According to the present invention, it is possible to manufacture an ink jet head that can dissipate heat generated from the drive IC chip integrated in the ink jet head to the ink in the common liquid chamber and make the ink temperature substantially uniform.

1 is an exploded perspective view of an inkjet head according to a first embodiment of the present invention. It is sectional drawing which follows the A-A 'line of FIG. It is a disassembled perspective view of the inkjet head by the 2nd Embodiment of this invention. It is a disassembled perspective view of the inkjet head by the 3rd Embodiment of this invention. It is explanatory drawing of the inkjet recording device by which the inkjet head based on this invention was mounted.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is an exploded perspective view of the inkjet head according to the first embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the line AA ′ of the assembled inkjet head of FIG.

The inkjet head has a slit shape extending in the X direction and a nozzle plate 2 on which at least one nozzle row 1 (1y, 1m, 1c, 1k) composed of nozzles for discharging ink (liquid) is formed, and for each nozzle. The individual liquid chamber forming substrate 101 on which the individual liquid chambers 3 (3y, 3m, 3c, 3k) provided correspondingly and partitioned by the flow path partition walls are formed, and the ink in the image individual liquid chamber 3 is pushed in. The actuators 15y, 15m, 15c, and 15k for ejecting ink droplets from the nozzles (by applying pressure) and driving IC chips 105a and 105b that output ejection signals to the actuators 15y, 15m, 15c, and 15k, From the actuator substrate 14 on which 105c and 105d are formed and the drive IC chips 105a, 105b, 105c and 105d, From the second heat radiating members 201a, 201b, 201c, 201d that directly receive heat and transmit to the other, the subframe 102 that protects the actuators 15y, 15m, 15c, 15k, and the second heat radiating members 201a, 201b, 201c, 201d The first heat dissipating member 202 that receives the heat of the ink and transmits it to the ink, the common liquid chamber forming substrate 103 having the common liquid chambers 4y, 4m, 4c, and 4k, and the ink supply holes 107y, 107m, 107c, and 107k are formed. A manifold 104 and a housing 106 into which the manifold is inserted are stacked in order.
The actuators 15y, 15m, 15c, and 15k include lower electrodes 11y, 11m, 11c, and 11k, pressure generating elements 12y, 12m, 12c, and 12k such as piezoelectric elements, and upper electrodes 13y, 13m, 13c, and 13k. The actuator is provided on a diaphragm constituting a part (ceiling surface) of each individual liquid chamber. Further, the pressure generating element is connected to the driving IC chip via a driving circuit wiring (not shown) and receives a driving signal from the driving IC chip. These are mounted on the actuator substrate 14.

A characteristic configuration of the present invention is that at least a part of the first heat radiating member is disposed so as to be located on the central axis of the supply hole, is exposed in the common liquid chamber, and is in contact with the ink.
In other words, the first heat radiating member is disposed at the lower part (downstream side) of each common liquid chamber so that at least a part of the first heat radiating member comes into contact with the liquid supplied to the common liquid chamber along the central axis of the supply hole. The structure is characteristic.
The first heat radiating member 202 is made of, for example, a high heat conductive metal or a high heat conductive resin.
The second heat radiating member 201 is made of, for example, heat transfer rubber.

Here, the first heat dissipating member 202 has protrusions 108y, 108m in the Y1 or Y2 direction so as to be orthogonal to the central axes 109y, 109m, 109c, 109k of the ink supply holes 107y, 107m, 107c, 107k of the manifold 104. 108c and 108k. That is, the first heat dissipating member 202 is a lattice-shaped member having four strip-shaped long holes 202y, 202m, 202c, and 202k, and a part of the narrow strip-shaped partitioning portion located between the long holes ( The middle part in the longitudinal direction) is projecting parts (wide parts) 108y, 108m, 108c, 108k. Each narrow strip-shaped partition corresponds to an elongated common liquid chamber and is configured to transmit heat over the entire length of the common liquid chamber. Since the protruding portion is provided at the center in the longitudinal direction of each partition portion, the protruding portion comes into contact with the ink flowing down from the ink supply hole and passing through the common liquid chamber, and heats it.
Accordingly, all of the inks supplied from the ink supply holes 107y, 107m, 107c, and 107k are always part of the first heat radiating member 202 before going to the individual liquid chambers 3y, 3m, 3c, and 3k. It is configured to receive heat transfer in contact with the protruding portions (wide portions) 108y, 108m, 108c, 108k provided on the surface.

In addition, since most of the heat from each driving IC chip reaches the common liquid chamber forming member 103, the heat is evenly dissipated to the ink through the protrusions (wide portions) 108y, 108m, 108c, and 108k. The amount of heat released from the indoor wall is greatly reduced, and the temperature of the ink in the common liquid chamber is not locally increased by the common liquid chamber wall.
The subscripts y, m, c, and k correspond to cyan, magenta, yellow, and black colors, respectively.
As shown in FIG. 2, the second heat radiation members 201b and 201c are mounted in close contact with the upper surfaces of the drive IC chips 105b and 105c, respectively, and the first heat radiation members 202 are mounted on the second heat radiation members 201b and 201c. Are in close contact. Note that the second heat radiating members 201a and 201d and the second heat radiating member 202 are sequentially stacked on the driving IC chips 105a and 105d (not shown in FIG. 2).

  In the present embodiment, the heat generated from the drive IC chip 105b is transmitted to the second heat radiating member 201b in contact with the drive IC chip 105b. The heat transmitted to the second heat radiating member 201b is transmitted to the first heat radiating transmission member 202 that is in contact with the second heat radiating member 201b. The heat transmitted to the first heat radiating member 202 is relatively supplied from the ink supply holes 107y and 107m toward the common liquid chambers 4y and 4m through the protruding portions (wide portions) 108y and 108m of the first heat radiating member 202. Heat is dissipated in low-temperature ink. That is, all the inks supplied from the respective ink supply holes 107y and 107m always come into contact with the projecting portions (wide portions) 108y and 108m, and the temperature rises evenly, so when the ink reaches the individual liquid chambers 3y and 3m. Ink temperature variation is eliminated.

On the other hand, the heat generated from the drive IC chip 105c is transmitted to the second heat radiating member 201c in contact with the drive IC chip 105c. The heat transmitted to the second heat radiating member 201c is transmitted to the first heat radiating member 202 in contact with the second heat radiating member 201c. The heat transmitted to the first heat radiating member 202 passes through the protruding portions 108c and 108k (not shown in FIG. 2) of the first heat radiating member 202 close to the central axes 109c and 109k of the ink supply holes 107c and 107k. Then, heat is radiated from the ink supply holes 107c and 107k to the relatively low temperature ink supplied to the common liquid chambers 4c and 4k.
That is, all the inks supplied from the respective ink supply holes 107c and 107k are always brought into contact with the protruding portions (wide portions) 108c and 108k, and the temperature rises evenly. Therefore, when the ink reaches the individual liquid chambers 3c and 3k. Ink temperature variation is eliminated.

Further, heat generated from the other driving IC chips 105a and 105d (not shown) is also supplied from the ink supply holes 107y, 107m, 107c, and 107k through the protruding portions 108c, 108k, 108c, and 108k of the first heat radiating member 202. Heat is radiated to the relatively low temperature ink supplied to the common liquid chambers 4y, 4m, 4c, and 4k. Therefore, the heat generated from the drive IC chips 105a, 105b, 105c, and 105d is suppressed from being locally transmitted to the ink in the common liquid chambers 4y, 4m, 4c, and 4k through the common liquid chamber forming substrate 103. The temperature of the ink in each common liquid chamber can be adjusted to be approximately equal.
Here, in order to efficiently transfer heat from the drive IC chips 105a, 105b, 105c, and 105d to the first heat dissipation member 202, the material of the second heat dissipation members 201a, 201b, 201c, and 201d is the drive IC chips 105a, 105b. , 105c, 105d, and a material that can be elastically deformed, for example, high thermal conductive silicon rubber, is preferable so that the upper surface of the first heat radiating member 202 can be in close contact with the upper surface. Further, the first heat dissipating member 202 is preferably a metal that can quickly dissipate heat from the first heat dissipating members 201a, 201b, 201c, and 201d to the ink and that is resistant to corrosion by ink, such as gold, or a high thermal conductive resin member. .

FIG. 3 is an exploded perspective view of an ink jet head according to the second embodiment of the present invention. The cross-sectional configuration will be described with reference to FIG.
The inkjet head according to the present embodiment has a second heat radiating member on at least one end portion of the drive IC chip at a position spaced apart from a position where the liquid supplied along the central axis of the supply hole contacts the first heat radiating member. The structure provided with is characteristic.
In FIG. 3, the second heat radiation members 201a, 201b, 201c, and 201d that are in contact with the upper surfaces of the driving IC chips 105a, 105b, 105c, and 105d are the x1 direction or the x2 direction in the driving IC chips 105a, 105b, 105c, and 105d. And is in contact with the first heat dissipating member 202.

  The heat generated from the driving IC chips 105a, 105b, 105c, and 105d is transmitted to the second heat radiation members 201a, 201b, 201c, and 201d that are in contact with the upper surfaces of the end portions of the driving IC chips 105a, 105b, 105c, and 105d. The The heat transferred to the second heat radiating members 201 a, 201 b, 201 c, 201 d is transferred to the first heat radiating member 202. Further, the heat transferred to the first heat radiating member 202 passes from the ink supply holes 107y, 107m, 107c, 107k through the protrusions 108y, 108m, 108c, 108k of the first heat radiating member 202, and the common liquid chambers 4y, 4m, 4c. The heat is radiated to the relatively low temperature ink supplied to 4k. Therefore, the heat from the end of the driving IC chips 105a, 105b, 105c, 105d in the x1 or x2 direction is transmitted to the ink located around the end of the common liquid chambers 4y, 4m, 4c, 4k in the x1 or x2 direction. And the temperature of the ink in the common liquid chamber can be adjusted to be substantially uniform.

That is, of the heat from each drive IC chip 105a, 105b, 105c, 105d, a position close to the protrusions 108y, 108m, 108c, 108k with which the ink flow at normal temperature from each ink supply hole 107y, 107m, 107c, 107k contacts. However, the temperature of the ink located at the end in the x1 or x2 direction, which is far from the protrusion, is easily raised by the heat from each driving IC chip. For this reason, although the ink temperature varies at both ends in the longitudinal direction of the drive IC chip, the upper surface of the drive IC chip located at the end where the ink temperature easily rises is locally covered with the second heat radiation member 202. Thus, the heat generated from the end portion is not directly radiated to the surrounding ink. On the other hand, the heat generated from the end of the driving IC chip is transmitted to the first heat radiating member via the second heat radiating member and radiated from the protrusions 108y, 108m, 108c, 108k, and the temperature of the ink at room temperature is raised. For this reason, the variation between the ink temperature around the protruding portion and the ink temperature around the end portion separated from the protruding portion is eliminated and equalized.
In other words, since the second heat radiation members 201a, 201b, 201c, and 201d are arranged at the ends of the long and narrow drive IC chips 105a, 105b, 105c, and 105d, the end portions of the drive IC chip The heat from the driving IC chip is not transmitted to the ink in the end of the common liquid chamber adjacent to the ink. If heat generated from the end of the driving IC chip is transmitted to the ink in the central portion in the longitudinal direction of the common liquid chamber via the second and first heat radiating members, the end of the common liquid chamber is transferred from the end of the driving IC chip. Heat transfer to the ink can be prevented.

On the other hand, the heat transmitted to the central portion in the longitudinal direction of the common liquid chamber (the protruding portion of the first heat radiating member) via the second and first heat radiating members is cooled by the ink supplied from the ink supply holes. Further, when the ink moves from the central portion in the longitudinal direction of the common liquid chamber to both ends of the common liquid chamber, heat from the end of the drive IC chip is transmitted to the protrusion of the first heat radiating member. It is possible to prevent the temperature of the ink located at both ends from rising from the heat from the chip end.
Accordingly, the ink temperature at the central portion of the common liquid chamber and the ink temperature at the end are constant.
In the present embodiment, the short second heat radiation members 201a, 201b, 201c, and 201d are provided at both ends of the drive IC chips 105a, 105b, 105c, and 105d far from the central axes 109y, 109m, 109c, and 109k. Therefore, compared with the first embodiment, there is an advantage that the same effect can be obtained even if the second heat radiation members 201a, 201b, 201c, and 201d are small in size.

Next, FIG. 4 is an exploded perspective view of an ink jet head according to a third embodiment of the present invention. The cross-sectional configuration will be described with reference to FIG.
The ink jet head according to the present embodiment is characterized in that a through hole is formed in at least a part of the first heat radiating member excluding the end of the drive IC chip on which the second heat radiating member is disposed.
The second heat radiating members 201a, 201b, 201c, and 201d that are in contact with the upper surfaces of the driving IC chips 105a, 105b, 105c, and 105d are located at the ends of the driving IC chips 105a, 105b, 105c, and 105d in the x1 direction or the x2 direction. Is provided. Each second heat radiating member is in contact with the lower surface of the first heat radiating member 202. On the other hand, the first heat radiating member 202 is in the x1 direction in the region where the projection surfaces in the z2 direction of the second heat radiating members 201a, 201b, 201c, and 201d do not overlap on the projection surface in the z2 direction of the drive IC chips 105a, 105b, 105c, and 105d. Through holes 110a and 110b are provided in the direction x2.
That is, the first heat dissipating member 202 is a lattice-shaped member having four strip-shaped long holes 202y, 202m, 202c, and 202k, and the narrow strip-shaped partition portions 202A and 202B located between the long holes. Some (longitudinal intermediate portions) are protruding portions (wide portions) 108y, 108m, 108c, and 108k. Further, the two partition portions 202A and 202B are provided with elongated through holes 110a and 110b at positions from the center in the longitudinal direction to the front of both ends. The second heat radiating members 201a, 201b, 201c, and 201d are in contact with both end portions of the partition portion in which the through holes 110a and 110b are not formed.

The through holes 110a and 110b are provided to prevent heat from the driving IC chip excluding both ends from being directly transmitted to the protruding portions 108y, 108m, 108c, and 108k through the first heat radiating member. . By providing the through hole, only the heat from the end of the driving IC chip can be transmitted to the protruding portion via the second heat radiating member and the first heat radiating member.
As described above, since the through holes 110a and 110b are formed in the region including the central portion excluding both ends of the partitioning portion that is in contact with the second heat radiating member, the heat from the portion of the driving IC chip facing the through hole is applied to the protruding portion. Without being transmitted, only the heat from both ends of the driving IC chip is transmitted to the projecting portion via the second and first heat radiating members. For this reason, it is possible to prevent the amount of heat released from the protruding portion from becoming excessive, and it is possible to eliminate the temperature variation of the ink due to the difference in location.

The heat generated from the driving IC chips 105a, 105b, 105c, and 105d is transmitted to the second heat radiation members 201a, 201b, 201c, and 201d that are in contact with the upper surfaces of the end portions of the driving IC chips 105a, 105b, 105c, and 105d. The The heat transferred to the second heat radiating members 201 a, 201 b, 201 c, 201 d is transferred to the first heat radiating member 202. The heat transmitted to the first heat radiating member 202 is transmitted to the protrusions 108y, 108m, 108c, and 108k through the region excluding the through holes 110a and 110c. The heat from the protrusions 108y, 108m, 108c, and 108k is radiated to the relatively low temperature ink supplied from the ink supply holes 107y, 107m, 107c, and 107k to the common liquid chambers 4y, 4m, 4c, and 4k. Accordingly, heat from the end of the driving IC chips 105a, 105b, 105c, and 105d in the x1 or x2 direction is transmitted to the ink at the end of the common liquid chamber 4y, 4m, 4c, 4k in the x1 or x2 direction. The temperature of the ink in the common liquid chamber is suppressed and can be adjusted to be approximately equal.
In the present embodiment, the projection surfaces of the drive IC chips 105a, 105b, 105c, and 105d in the z2 direction do not overlap with the projection surfaces of the second heat radiation members 201a, 201b, 201c, and 201d in the z2 direction. Since the through holes 110a and 110b are provided in the region, there is an advantage that the cost applied to the first heat radiating member 202 can be reduced as compared with the first and second embodiments.

FIG. 5 is a schematic perspective view showing a configuration of a main part in the ink jet recording apparatus 1000. In the ink jet recording apparatus 1000, a printing mechanism unit 1002 and the like are accommodated inside the apparatus main body 1001. In this printing mechanism 1002, an ink cartridge 1004 is mounted on a carriage 1003 that can move in the operation direction, and an ink jet head of the present invention is mounted under the ink cartridge 1004.
In the above embodiment, the case where the present invention is applied to an ink jet head having an integrated form of four colors has been described. However, the present invention can also be applied to one or more colors and an arbitrary number of ink jet heads.

1y, 1m, 1c, 1k: nozzle row, 2: nozzle plate, 3y, 3m, 3c, 3k: individual liquid chamber, 4y, 4m, 4c, 4k: common liquid chamber, 11y, 11m, 11c, 11k: lower electrode , 12y, 12m, 12c, 12k: Piezoelectric element, 13y, 13m, 13c, 13k: Upper electrode, 14: Actuator substrate, 15y, 15m, 15c, 15k: Actuator, 101: Individual liquid chamber forming substrate, 102: Subframe 103: Common liquid chamber forming substrate, 104: Manifold, 105a, 105b, 105c, 105d: Drive IC chip, 106: Housing, 107y, 107m, 107c, 107k: Ink supply hole, 108y, 108m, 108c, 108k: Projection Part, 109y, 109m, 109c, 109k: central axis, 110a, 110b: through hole, 01a, 201b, 201c, 201d: second heat radiating member, 202: first heat radiating members, 1000: an ink jet recording apparatus, 1001: the ink jet recording apparatus main body, 1002: printing mechanism unit, 1003: Carriage, 1004: the ink cartridge

JP 2009-149057 A

Claims (6)

A nozzle for discharging a liquid, a nozzle plate having at least one nozzle row composed of a plurality of the nozzles, an individual liquid chamber forming substrate having an individual liquid chamber defined by a flow path partition, and the individual liquid A diaphragm constituting a part of the chamber, a pressure generating element formed on the diaphragm, an actuator substrate having a driving IC chip for sending a driving signal to the pressure generating element, and a driving IC chip from the driving IC chip A first heat dissipating member that transmits heat to the liquid, a second heat dissipating member that is in contact with at least a portion of the drive IC chip and transmits heat from the drive IC chip to the first heat dissipating member, and the individual liquids. An inkjet head comprising: a common liquid chamber forming substrate in which a common liquid chamber for supplying the liquid to the chamber is formed; and a manifold in which a supply hole for supplying the liquid to the common liquid chamber is formed. I,
The ink jet head according to claim 1, wherein at least a part of the first heat radiating member is disposed so as to contact the liquid supplied to the common liquid chamber along a central axis of the supply hole.   The second heat radiating member is provided at at least one end of the driving IC chip at a position spaced from a position where the liquid supplied along the central axis of the supply hole contacts the first heat radiating member. The inkjet head according to claim 1, wherein   The inkjet head according to claim 2, wherein a through hole is formed in at least a part of the first heat radiating member excluding an end portion of the driving IC chip on which the second heat radiating member is disposed.   The inkjet head according to any one of claims 1 to 3, wherein the first heat radiating member is made of a highly thermally conductive metal or highly thermally conductive resin.   The inkjet head according to any one of claims 1 to 4, wherein the second heat radiating member is made of heat transfer rubber.   An ink jet recording apparatus comprising the ink jet head according to claim 1.

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