JP2013164965A - Electrical component and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrical component including an insulation coating.SOLUTION: An electrical component comprises: a metal base; and an insulation coating with electrical insulation covering a whole circumference of the metal base at any cross section thereof at which a thickness is from a maximal value Tsatisfying T≤50 μm to a minimal value Tsatisfying 0.1 μm≤T. In the above mentioned electrical component, the cross section of the metal base is in a shape having a corner part between a pair of flat parts, and a thickness Tof the insulation coating covering the pair of flat parts and a thickness Tof the insulation coating covering the corner part may satisfy 0.71≤T/T.

Description

  The present invention relates to an electrical component and an electronic device.

It has been proposed to uniformly coat a metal workpiece by painting (see Patent Document 1).
[Patent Document 1] Japanese Patent Application Laid-Open No. 2005-046795

  When electrical components such as connector contact materials are mounted at a high density, electrical components may be short-circuited. Therefore, when the insulating coating is provided on the electrical component for the purpose of preventing a short circuit, the mounting density of the electrical component is restricted. However, if the insulating coating is made thin for the purpose of improving the mounting density, the resin easily breaks due to sliding, and the insulating coating deteriorates and cannot be practically used. In addition, in an electrical component plated with Sn, Ag, Au or the like, it is difficult to prevent a short circuit due to the occurrence of migration, whisker, or the like.

As a first aspect of the present invention, satisfies a metal substrate, in any cross-section covering the entire circumference of the metal substrate, the maximum value T _Max thickness in cross section a T _Max ≦ 50 [mu] m, and a thickness in the cross section There is provided an electrical component including an insulating coating having an electrical insulation property in which a minimum value T _Min of 0.1 μm ≦ T _Min is satisfied.

  As a second aspect of the present invention, there is provided an electronic apparatus comprising the above-described electrical component and a housing that houses at least a part of the electrical component.

  The above summary of the present invention does not enumerate all necessary features of the present invention. Sub-combinations of these feature groups can also be an invention.

2 is a perspective view of a connection mechanism 100. FIG. 2 is a cross-sectional view of a receptacle 130. FIG. 2 is a partial cross-sectional view of a connector 110 and a receptacle 130. FIG. 3 is a perspective view of a lead pin 134. FIG. 3 is a cross-sectional view of a lead pin 134. FIG. 2 is a partial perspective view of a hoop material 200. FIG. 2 is a partial cross-sectional view of a hoop material 200. FIG. 3 is a partially enlarged cross-sectional view of a hoop material 200. FIG. It is a graph which shows the relationship between the flat part thickness of an insulation coating, and a corner | angular part thickness. It is a graph which shows evaluation of a hoop material.

  The above summary of the present invention does not enumerate all necessary features of the present invention. Sub-combinations of these feature groups can also be an invention.

  FIG. 1 is a perspective view of a connection mechanism 100 that is an example of an electronic apparatus. The connection mechanism 100 includes a connector 110 and a receptacle 130, and has a function of connecting or disconnecting a power or electric signal transmission path.

  The connector 110 has a housing 112. The housing 112 is attached to one end of the flat cable 120. The flat cable 120 has a plurality of signal lines that are electrically independent from each other.

  The housing 112 accommodates a plurality of internal conductors. Each of the plurality of inner conductors is individually electrically coupled to any one of the plurality of signal lines of the flat cable 120. Further, the housing 112 has a key 113 that is raised on the side surface in the approximate center in the longitudinal direction.

  The receptacle 130 is fixed to the surface of the substrate 140 and includes a housing 132, a side wall 133, and a keyway 135. The side wall 133 of the receptacle 130 is disposed so as to surround the plurality of lead pins 134 and has an inner surface shape complementary to the outer peripheral surface of the housing 112 of the connector 110.

  The keyway 135 is disposed at the approximate center in the longitudinal direction on the side wall 133 on one side. The keyway 135 has a shape complementary to the key 113 of the connector 110, and engages with the key 113 when the connector 110 is inserted into the receptacle 130.

  A plurality of lead pins 134 are arranged on the inner side of the side wall portion 133 and stand parallel to each other. The lead pins 134 are electrically insulated from each other.

  The lock lever 136 rotates with respect to the housing 132. When the housing 112 of the connector 110 is inserted into the housing 132 of the receptacle 130, the lock lever 136 rises and engages the upper surface of the housing 112 of the connector 110. This prevents the connector 110 from being pulled out.

  When the connector 110 is inserted into the receptacle 130, the inner conductor of the connector 110 and the lead pin 134 of the receptacle 130 come into contact with each other to form an electrical connection. Thereby, the circuit on the substrate 140 and the flat cable 120 are coupled.

  The plurality of inner conductors and the plurality of lead pins 134 are insulated from each other. Therefore, the electrical connection formed by the connector 110 and the receptacle 130 is electrically independent for each lead pin 134.

  FIG. 2 is a cross-sectional view of the receptacle 130, showing the AA cross section shown in FIG. Elements that are the same as those in FIG. 1 are given the same reference numerals, and redundant descriptions are omitted.

  In the receptacle 130, the lower surface of the housing 132 is in close contact with the surface of the substrate 140. The lead pin 134 includes a metal base 131 that penetrates the bottom surface of the housing 132 and further penetrates the substrate 140. On the lower surface of the substrate 140, the lower end of the metal base 131 in the figure is fixed to the conductor pattern 142 formed on the substrate 140 with solder 144. As a result, the entire receptacle 130 is also fixed to the substrate 140.

  In the lead pins 134, the lower portions of the metal base 131 each have an insulating coating 138. The insulating coating 138 is also formed up to a height D on a part of the lead pin 134 exposed from the bottom of the inner surface of the housing 132. As a result, even when the distance between the lead pins 134 is narrow inside the housing 132, the creeping distance between the lead pins 134 is increased, so that the insulation strength is improved.

  FIG. 3 is a partial cross-sectional view of the connector 110 and the receptacle 130, and shows a state where the connector 110 is attached to the receptacle 130 shown in FIG. Elements common to those in FIGS. 1 and 2 are denoted by the same reference numerals, and redundant description is omitted.

  When the connector 110 is attached to the receptacle 130, the lead pins 134 of the receptacle 130 are inserted into the housing 112 of the connector 110. Thereby, the tip of the lead pin 134 contacts the conductor inside the connector 110 to form an electrical connection.

  Here, the insulating coating 138 attached to the lead pins 134 enters the housing 112 from the lower end of the connector 110. Accordingly, the metal lead pin 134 is protected by the insulating coating 138 even in a slight gap between the housing 132 of the receptacle 130 and the housing 112 of the connector 110.

  Therefore, the creepage distance and the spatial distance between the lead pins 134 are increased, and the insulation strength and tracking resistance of the lead pins 134 are improved. Such an action of the insulating coating 138 is effective when the height D of the portion where the insulating coating 138 rises from the housing 132 is 0.1 mm or more.

  In other words, by extending the insulating coating 138 from the housing 132 to the outside, even if the gap between the plurality of lead pins 134 becomes narrow, the short-circuit between the lead pins 134 is prevented. Therefore, the pitch of the lead pins 134 can be made narrower, and the mounting density of the lead pins 134 can be improved.

  However, in order for the connector 110 and the receptacle 130 to keep fitting with each other, it is desirable that the distance between the lead pins 134 be 0.1 mm or more. Therefore, the pitch of the lead pins 134 is preferably 0.2 mm or more.

  FIG. 4 is a perspective view showing the lead pin 134 alone. Elements common to those in FIGS. 1 and 2 are denoted by the same reference numerals, and redundant description is omitted.

  The lead pin 134 has a metal base 131 and an insulating coating 138. The metal substrate 131 can be formed of copper, a copper base alloy, iron, an iron base alloy, or the like, and has a shape of an elongated bar. The insulating coating 138 is formed of a resin that is painted on the surface of the metal base 131. Examples of the resin that forms the insulating coating 138 include thermoplastic resins such as polyamideimide or thermosetting resins. Thereby, the insulation coating 138 can be formed by one liquid coating.

  FIG. 5 is a cross-sectional view of the lead pin 134 shown in FIG. 4 and shows a cross section taken along line BB shown in FIG. Elements common to FIGS. 1 to 4 are given the same reference numerals, and redundant description is omitted.

  As shown in the figure, in the lead pin 134, the insulating coating 138 surrounds the entire circumference of the metal substrate 131 without any break. Thereby, even if it is the thin insulation coating 138, high electrical insulation can be acquired. Further, by thinning the insulating coating 138, the interval between the lead pins 134 can be narrowed, and the lead pins 134 can be arranged in the receptacle 130 with a high mounting density.

  FIG. 6 is a partial perspective view of the hoop material 200 including the lead pins 134. Elements common to FIGS. 1 to 5 are denoted by the same reference numerals, and redundant description is omitted.

  The hoop material 200 includes a lead pin 134 and a tape portion 210. The pair of tape portions 210 extend parallel to each other in the longitudinal direction of the hoop material 200. The plurality of lead pins 134 are arranged at regular intervals in a direction orthogonal to the extending direction of the tape portion 210. Both ends of the lead pin 134 are integrally coupled to either one of the pair of tape portions 210.

  In the hoop material 200, at least one tape part 210 is provided with a perforation 212 indicating the position of the lead pin 134 for each lead pin 134. In addition, each of the lead pins 134 has an insulating coating 138 individually. Such a hoop material 200 can circulate a large amount of lead pins 134 in a lump by, for example, winding it around a reel. Further, the assembly of the lead pin 134 to the electronic device can be automated.

  Such a hoop material 200 is formed by, for example, punching a strip material to form a metal substrate 131, and masking a part of the formed metal substrate 131 while liquefying a resin that forms an insulating coating 138. Can be continuously produced. Thereby, a lot of lead pins 134 can be manufactured efficiently.

  FIG. 7 is a partial cross-sectional view of the hoop material 200, showing the CC cross section shown in FIG. Elements that are the same as those in FIG. 6 are given the same reference numerals, and redundant descriptions are omitted.

  The metal substrate 131 in the hoop material 200 is manufactured by stamping a strip metal material. Thereby, in the illustrated cross section, the metal substrate 131 forms a plurality of portions separated from each other. For this reason, in the lead pins 134 included in the hoop material 200, each metal base 131 is formed with a cut surface facing the metal base 131 of the adjacent lead pin 134 on the side surface.

  For example, a varnish-like resin material can be pressurized and sprayed and attached to the cut surface where the resin material cannot be applied from the front because it faces the other cut surfaces. In this case, it is preferable to adjust the viscosity of the varnish as well as the spraying pressure applied to the varnish serving as the insulating coating 138.

  In addition, for the purpose of attaching the varnish to the four surfaces of the metal base 131, the varnish may be repeatedly applied by changing the injection direction. Furthermore, a series of steps including application of varnish and drying and curing may be repeated a plurality of times.

  As a result, in each of the metal bases 131, the insulating coating 138 is formed that surrounds the entire four surfaces including the surface formed by punching, and electrical insulation as an electrical component is ensured. Further, even when the shape of the metal base 131 is more complicated, the insulating coating 138 can be formed without interruption. In addition, when apply | coating a varnish with a dipping, a roller, a brush, etc., it apply | coats on the conditions which can avoid both the thick coating by high viscosity and the square transparency by surface tension.

  When, for example, polyamideimide is used as the material of the insulating coating 138, the thickness T of the insulating coating 138 is preferably set to 0.1 μm or more in consideration of the volume resistivity and the voltage used. Thereby, electrical insulation up to about 10 kV is ensured between the lead pins 134 when incorporated in the receptacle 130, and a dielectric strength voltage between the signal lines in the connection mechanism 100 is obtained.

  On the other hand, if the thickness of the insulating coating 138 exceeds 50 μm, when the insulating coating 138 is incorporated in the receptacle 130 or the like, the insulating coating 138 may be in contact with adjacent lead pins 134 and may not be disposed close to each other. Therefore, the thickness of the insulating coating 138 is preferably 50 μm or less.

  In addition, there is a constant demand for downsizing and increasing the density of electronic devices, and it is desired that the lead pins 134 be mounted at a higher density in the connection mechanism 100 as well. Therefore, by setting the thickness of the insulating coating 138 to 20 μm or less, it is possible to effectively contribute to downsizing of electronic devices and improvement of mounting density of electric components.

  Further, if the distance between the insulating coatings 138 of the adjacent lead pins 134 is narrowed, when molding the housing 132 of the receptacle 130, it becomes difficult for the molding resin to rotate between the lead pins 134, which causes molding defects. Therefore, the thickness of the insulating coating 138 is more preferably 10 μm or less.

  In addition, when forming the insulating coating 138 on the surface of the metal base 131, the surface of the metal base 131 may be degreased in advance. Thereby, the adhesiveness of the insulation coating 138 can be improved.

  Further, the surface properties of the metal substrate 131 may be improved by pickling the metal substrate 131. Thereby, it can prevent that the film thickness of the insulation coating 138 changes locally, and can prevent that the electrical insulation of the whole lead pin 134 falls.

  Furthermore, prior to the formation of the insulating coating 138, the surface of the metal substrate 131 may be modified by applying a silane coupling agent to the surface of the metal substrate 131, or forming a nickel plating layer. Thereby, the adhesion strength of the insulation coating 138 can be improved, and the high insulation by the insulation coating 138 can be maintained over a long period of time.

  The lead pins 134 formed as the hoop material 200 as described above can be used as conductive parts, such as connector lead pins, socket receptacles, switch contacts, lead frames, and the like. In addition, since a portion other than a portion to be conducted as a contact or the like is electrically insulated by the insulating coating 138, a plurality of lead pins 134 can be arranged close to each other.

  As a result, the electrical components can be mounted at a high density while preventing a short circuit between the electrical components, thereby contributing to downsizing and stabilization of the electronic device. Moreover, the anticorrosion property of a metal part can also be improved by providing insulation coating. Note that when a plurality of lead pins 134 and the like are combined to form an electronic device such as the connection mechanism 100, a plurality of types of electrical components having different shapes may be combined.

  Next, the distribution of the thickness of the insulating coating formed on the surface of the metal substrate 131 was examined. When the varnish is applied to the metal base 131 having a rectangular cross-sectional shape, the amount of varnish attached to the flat portion of the metal base 131 may be different from the amount attached to the corner.

  FIG. 8 is a partially enlarged cross-sectional view showing a state where the cross section of the hoop material 200 shown in FIG. 7 is partially further enlarged. Elements that are the same as those in FIG. 7 are given the same reference numerals, and redundant descriptions are omitted.

  When the varnish that is the material of the insulating coating 138 is sprayed toward the metal base 131, if the viscosity of the varnish is extremely low, the thickness of the varnish that adheres to the corners becomes thin due to the surface tension of the varnish. In addition, when the viscosity of the varnish is high, the varnish is thickly deposited on the surface of the metal substrate 131 facing the varnish injection direction.

For this reason, when the varnish is sprayed from diagonally above the hoop material 200 so that the varnish adheres also to the cut surface facing the adjacent metal base 131, the varnish is attached to the corner portion rather than the thickness of the varnish attached to the flat portion. The attached varnish tends to be thick. In this case, even in the insulating coating 138 which is finally formed, the thickness T _c of the corner, tends to be larger than the thickness T _p of the flat portion. In addition, the thickness _Tc of the insulating coating 138 at the corner means the maximum thickness in the region of the insulating coating 138 excluding the portion adhering to the flat portion.

  A metal substrate 131 was produced using a strip of copper base alloy “EFTEC64T-C (C18045)” manufactured by Furukawa Electric Co., Ltd. The metal base 131 formed by press working has a prismatic shape, and has a length of 40 mm and a rectangular cross section of 0.5 mm × 0.5 mm.

The metal substrate 131 was first degreased. More specifically, a degreasing solution in which sodium hydroxide was dissolved at a rate of 60 g / liter was heated to 60 ° C., and electrolytic degreasing was performed by dipping for 15 seconds while flowing a current of 2.5 A / dm ² .

  Next, pickling treatment was performed in which the metal substrate 131 was immersed for 15 seconds at room temperature using sulfuric acid having a concentration of 10% as a pickling solution. Thereby, scales and the like were removed, and the surface properties of the metal substrate 131 were improved. As said manufacturing process, processes, such as electrolytic degreasing and a pickling process, were implemented by the horizontal conveyance type so that it could manufacture continuously. The strip is punched to generate burrs on the shearing surface of the metal base 131. It was found that the burr was formed to be 0.1 μm or less when a later resin material was applied. Therefore, the strip material was punched and the surface having the burr of the metal base 131 was placed under the horizontal conveying device. In the electrolytic degreasing or pickling treatment, it is necessary to circulate the liquid. Therefore, the liquid is blown up with a pump, the strip material is punched out, contacted with the metal substrate, and subjected to electrolytic degreasing or pickling treatment. There is a feature that the flow of liquid is fast. This is effective in removing burrs. Thus, in the electrolytic degreasing and pickling treatments, not only the oil and oxide on the surface of the metal substrate can be removed, but also the burrs generated by punching the strip can be removed.

  Coating was performed by pressurizing and spraying the varnish to the metal substrate 131 that had been pretreated in this way. As the resin material, polyamideimide was used, and the viscosity was adjusted by diluting with an organic solvent. The viscosity of the varnish was adjusted so that the varnish adhered to the metal substrate 131 even when sprayed from any direction with respect to the direction of gravity.

  The varnish was sprayed intermittently to prevent coarsening of the varnish droplets. Further, the spray gun changed the spraying direction without moving the position, and translated or rotated the metal substrate 131 to change the location of the varnish adhering to the metal substrate 131. Thereby, a thin and uniform coating film could be formed.

  The resin material adhering to the metal base 131 as described above was cured by heating after removing the organic solvent. Furthermore, the series of steps of coating, drying and curing was repeated once more to form an insulating coating 138 that continuously surrounds one cross section of the metal substrate 131 over the entire circumference.

  Further, a plurality of lead pins 134 having different thicknesses of the insulation coating 138 were prepared as samples by the method described above. The characteristics of each prepared sample were evaluated according to the thickness T of the insulating coating 138. As a result, it was found that when the thickness T of the insulating coating 138 exceeds 50 μm, the gap between the adjacent lead pins 134 becomes narrow when incorporated in an electronic device such as the receptacle 130, resulting in a molding failure or the like.

In addition, as described above, when the insulating coating 138 is thinner than 0.1 μm, the insulation withstand voltage by the insulating coating 138 is insufficient. Therefore, in the lead pin 134 of the hoop material 200, the maximum value T _Max of the insulating coating 138 satisfies T _Max ≦ 50 μm, and the minimum value T _{Min of the} insulating coating 138 is 0.1 μm ≦ T _Min. It is desirable to satisfy.

Furthermore, when the thickness of the corner portion of the insulating coating 138 is relatively large with respect to the thickness of the flat portion, stress is concentrated on the corner portion due to non-uniform shape, and the insulating coating 138 is slid due to sliding. It turns out that it becomes easy to be destroyed. In addition, when the varnish forming the insulating coating 138 is applied and cured, the amount of residual solvent is increased at the corners of the insulating coating 138 compared to the flat portion, the resin hardness is lowered, and the resistance to sliding is increased. Presumed to be the cause of lowering. Accordingly, with 0.71 ≦ _T p / _{T c} the ratio of the thickness _{T c} of the corner to the thickness _{T p} of the flat portion of the insulating coating 138, improving the sliding resistance of the corner portion of the insulating coating 138 Can be made.

  Thus, by devising the thickness, shape and location of the insulating coating, the suitability for mounting and the sliding resistance can be improved while ensuring the insulating resistance of the electrical component. In addition, by using such an electrical component, it is possible to reduce the size of an electronic device such as a connector without degrading the quality.

With regard to the thickness of the insulating coating 138, paying attention to the relationship between the thickness T _p of the flat portion of the metal substrate 131 and the thickness T _c of the corner portion, the thickness T _p of the flat portion and the thickness T _{c of the} corner portion. A plurality of lead pins 134 having different insulation coatings 138 were prepared as samples. About the produced sample, the quality of the insulation coating 138 was evaluated by sliding resistance, mounting suitability, and withstand voltage. In addition, the suitability when each sample was used as a connector part was evaluated as a connector suitability.

  The sample was prepared as follows. First, a lead pin 134 provided with an insulating coating 138 was produced, and an Au plating layer was formed on a part of the surface of the metal base 131 using the insulating coating 138 as a mask for plating in each lead pin 134. The Au plating layer was formed by electroplating, and the thickness of the plating layer was 0.1 μm. Thus, a lead pin 134 having an Au plating layer was produced.

  Thus, you may provide the area | region where a plating layer is not partially formed by providing insulation coating in part of an electrical component before plating. Thereby, the short circuit of the components resulting from a plating layer can be prevented. Further, by preventing the short circuit, it is possible to narrow the mounting interval of the electrical components and improve the mounting density.

  The evaluation of the sliding resistance of the lead pin 134 was carried out using a 14 FW model of a surface property measuring machine TRIBOGEAR (registered trademark) and applying a load of 100 g to a 3 mm steel ball. The test results are “A” when the insulation coating 138 is not peeled off even when sliding by the surface property measuring machine exceeds 500 times, and “O” when the insulation coating 138 is peeled after sliding from 101 to 500 times. The case where the insulation coating was peeled off by sliding up to 100 times was evaluated as “x”.

  In addition, the thickness of the insulating coating 138 was evaluated as suitability for mounting the lead pins 134. The thickness of the insulating coating 138 was calculated from an image obtained by observing a cross section that appeared by cutting each sample with a scanning electron microscope. Appropriate evaluation for high-density mounting is “◎” when the maximum thickness of the insulating coating 138 is 10 μm or less, “◯” when it exceeds 10 μm and 20 μm or less, and “△” when it exceeds 20 μm and 50 μm or less. , The case of exceeding 50 μm was designated as “x”.

  Further, the thickness of the insulating coating 138 was evaluated from the viewpoint of the withstand voltage of the lead pin 134. With respect to the insulation resistance, “◯” was given when the thickness of the insulation coating 138 was 0.1 μm or more, and “X” was given when the thickness was less than 0.1 μm.

  Furthermore, the pressure resistance performance when the lead pin 134 as an electronic component was incorporated in a connector as an electronic device was evaluated as the connector suitability of the lead pin 134. The pressure resistance performance was evaluated by applying an AC voltage of 500 V for one hour with a pair of lead pins 134 arranged at intervals of 0.1 mm. The evaluation was “◯” when no short circuit and damage to the plating layer occurred, and “X” when damage occurred.

The evaluation results on sliding resistance, mounting suitability, withstand voltage and connector suitability for each sample are shown in Table 1, Table 2 and Table 3 below. In addition, comprehensive evaluations that take these evaluations into account are also described in Table 1, Table 2, and Table 3. Table 4 shows the evaluation criteria for comprehensive evaluation. As shown in Table 5, samples evaluated as “x” in any of sliding resistance, mounting suitability, and withstand voltage were not evaluated as comparative examples.

FIG. 9 is a graph showing the thickness distribution of the insulating coating 138 in the above sample. Moreover, the above-mentioned evaluation results of the sliding resistance are shown together in FIG. As shown in the figure, when the relationship between the thickness T _p of the flat portion and the thickness T _c of the corner portion satisfies the following formula 1, a high evaluation “◎” was obtained for the sliding resistance.
1 ≦ T _p / T _c Formula 1

In addition, when the relationship between the thickness T _p of the flat portion and the thickness T _c of the corner portion satisfies the following expression 2, the evaluation “◯” following the above range was obtained. However, a positive evaluation for sliding resistance was not obtained outside these ranges.
0.71 ≦ T _p / T _c <1 Equation 2

  FIG. 10 is a graph plotting the distribution of samples to be evaluated among the samples shown in Table 1, Table 2 and Table 3 above. However, in FIG. 10, A to F and A + to F + are collectively shown as A to F for the purpose of avoiding complicated drawing. As shown in the figure, among the samples evaluated as “◎” or “○” in the sliding resistance, each of the samples is divided into three stages in the comprehensive evaluation in consideration of mounting suitability and withstand voltage.

  That is, when the evaluation of sliding resistance is “「 ”and the thickness of the insulating coating 138 is 10 μm or less, the overall evaluation is“ A ”, which is the highest. Next, when the evaluation of the sliding resistance is “◯” and the thickness of the insulating coating 138 is 10 μm or less, the comprehensive evaluation is “B” after “A”.

  Next, when the evaluation of sliding resistance is “「 ”and the thickness of the insulating coating 138 is larger than 10 μm and not larger than 20 μm, the overall evaluation is“ C ”after“ B ”. . Further, when the evaluation of the sliding resistance is “◯” and the thickness of the insulating coating 138 is larger than 10 μm and 50 μm or less, the comprehensive evaluation is “D” next to “C”.

  Finally, when the evaluation of the sliding resistance is “」 ”and the thickness of the insulating coating 138 is larger than 20 μm and not larger than 50 μm, the overall evaluation is“ E ”after“ D ”. . Further, when the evaluation of the sliding resistance is “◯” and the thickness of the insulating coating 138 is larger than 50 μm and equal to or smaller than 50 μm, the comprehensive evaluation is “D” after “C”.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

100 connection mechanism, 110 connector, 112, 132 housing, 113 key, 120 flat cable, 130 receptacle, 131 metal substrate, 133 side wall, 134 lead pin, 135 key groove, 136 lock lever, 138 insulation coating, 140 substrate, 142 Conductor pattern, 144 solder, 200 hoop material, 210 tape portion, 212 perforation

Claims (10)

A metal substrate;
The cross section covers the entire circumference of the metal substrate in any cross section, the maximum thickness value T _{Max in the} cross section satisfies T _Max ≦ 50 μm, and the minimum thickness value T _Min in the cross section is 0.1 μm ≦ An electrical component comprising an insulating coating having electrical insulation that satisfies T _Min . The cross section of the metal substrate has a shape including a corner portion sandwiched between a pair of flat portions,
According to claim 1, the thickness T _p of the insulating coating covering said pair of flat portions, and the thickness T _c of the insulating coating covering the angle portion satisfies 0.71 ≦ T _{p /} T _c Electrical parts.   The electrical component according to claim 2, wherein the metal base is formed by punching from a metal plate material, and one of the pair of flat portions includes a cut surface formed by punching.   The electrical component according to any one of claims 1 to 3, wherein the insulating coating includes at least one of a thermoplastic resin and a thermosetting resin.   The electrical component according to claim 4, wherein the insulating coating includes polyamideimide.   The electrical component according to any one of claims 1 to 5, further comprising any one of a silane coupling agent and a nickel plating layer interposed between the metal substrate and the insulating coating.   The electrical component according to any one of claims 1 to 6, wherein the metal substrate includes any one of iron and an iron-based alloy, and copper and a copper-based alloy.   The cross section of the metal substrate has a plurality of parts separated from each other, and the insulating coating individually covers the entire circumference of the plurality of parts. Electrical parts.   An electronic device comprising the electrical component according to any one of claims 1 to 8 and a housing that houses at least a part of the electrical component.   The electronic device according to claim 9, comprising a plurality of the electrical components, wherein a distance between the plurality of electrical components is 0.1 mm or more.

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