JP2013160644A - Semiconductor module test jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor module test jig capable of performing a test while suppressing damages to an element in a module caused by a surge voltage generated in the semiconductor module test jig.SOLUTION: A semiconductor module test jig according to the present invention performs a test on electrical characteristics of a semiconductor module 3 by pressing a probe pin against the module terminal of the semiconductor module 3 and applying a predetermined electrical pattern. The semiconductor module test jig includes a set of probe pins 1a and 1b whose bottoms are electrically connected and a conductive member 20 electrically joined in the vicinity of the tip of the probe pins between the probe pins 1a and 1b.

Description

  The present invention relates to a semiconductor module test jig, and in particular, a semiconductor module test jig for testing electrical characteristics of a semiconductor module by applying a predetermined electrical pattern by pressing a probe pin to a terminal of the semiconductor module. Concerning ingredients.

  Generally, at the end of the manufacturing process of a semiconductor module including semiconductor elements such as IGBTs, a test is performed to determine whether the manufactured semiconductor module has the performance as designed, and only semiconductor modules that meet the standards are shipped as products. Is done.

  When testing a semiconductor module, for example, the operation test is performed by connecting each terminal of the semiconductor module with a probe and applying a predetermined electrical pattern.

  More specifically, each semiconductor element is turned on and off by controlling the gate voltage of the semiconductor element included in the module, for example, with an IC or the like, and it is investigated whether switching is performed appropriately. At this time, a surge voltage is generated on the test jig side including the probe and the like, and the surge voltage is applied to the semiconductor element, thereby impairing the performance of the semiconductor element. In particular, when a surge voltage exceeding the withstand voltage is applied, there is a problem that the element itself is destroyed.

  Patent Document 1 describes a semiconductor module having a structure for suppressing a surge voltage. According to Patent Document 1, in a module including power transistors connected in series, the power transistor is connected to the series connection portion when the power transistor is turned on and off by bypassing the serial connection portion of the power transistor with a wiring material having low inductance. Suppresses surge voltage.

Japanese Patent Laid-Open No. 5-044744

  The technique described in Patent Document 1 described above suppresses a surge voltage generated inside the module when the semiconductor device is turned on / off by the structure inside the semiconductor module, and suppresses the surge voltage applied from the outside of the module. It is not a technology to suppress. Therefore, another measure is required to protect the semiconductor module from damage to the surge voltage generated on the test jig side when the semiconductor is turned on and off.

  The present invention has been made to solve the above-described problem, and a semiconductor module test capable of performing a test while suppressing damage to a device inside a module caused by a surge voltage generated by a semiconductor module test jig. The purpose is to provide jigs.

  A semiconductor module test jig according to the present invention is a semiconductor module test jig for testing electrical characteristics of a semiconductor module by applying a predetermined electrical pattern by pressing a probe pin against a terminal of the semiconductor module. A pair of probe pins in which the bases of the probe pins are electrically connected to each other, and a conductive member electrically joined in the vicinity of the tip of the probe pin between the pair of probe pins. Prepare.

  By conducting a test of the electrical characteristics of the semiconductor module using the semiconductor module test jig according to the present invention, the surge voltage generated by the semiconductor test jig is suppressed from damaging the elements inside the module. A test can be performed. Therefore, quality such as durability of the semiconductor module is not impaired, and the yield in manufacturing the semiconductor module is improved.

  Moreover, it is possible to acquire said effect by changing a part of common test jig | tool used for a semiconductor module test, and the effect of surge voltage suppression can be acquired at low cost.

4 is a circuit diagram of a semiconductor module test jig according to Embodiment 1. FIG. 3 is a diagram showing a structure of a probe pin according to Embodiment 1. FIG. FIG. 6 is a diagram showing a joint portion of a conductive member according to Embodiment 3. It is a figure which shows the junction part of the electroconductive member which concerns on Embodiment 4. FIG. It is a figure which shows the junction part of the electroconductive member which concerns on Embodiment 5 and Embodiment 6. FIG. It is a figure which shows the junction part of the electroconductive member which concerns on Embodiment 7. FIG.

<Embodiment 1>
<Circuit configuration>
FIG. 1 shows a circuit diagram of a semiconductor module test jig according to the present embodiment. A semiconductor module test jig is connected to the semiconductor module 3 to be tested, and a test is performed by applying a predetermined electrical pattern. Here, the semiconductor module 3 has a structure in which a semiconductor element 4 and a semiconductor element 6 and a circuit in which the semiconductor element 5 and the semiconductor element 7 are connected in series in two stages are arranged in parallel. Here, the semiconductor elements 4, 5, 6, and 7 are, for example, those in which a reflux diode is connected to an IGBT.

  Between the high-side module terminal 2e and the low-side module terminals 2a and 2b of the semiconductor module 3, a power supply 14 and a smoothing electrolytic capacitor 13 are connected via probe pins 1e, 1a and 1b, respectively. Is done. The probe pin 1a and the probe pin 1b are connected to each other at a connection point 16 at the base of the probe pins 1a and 1b.

  A load 10 is connected between the module terminals 2c and 2d drawn from the middle stage of the semiconductor module 3 via probe pins 1c and 1d. Here, the load 10 is, for example, a two-phase drive motor.

  The gate terminals of the semiconductor elements 4, 5, 6, 7 included in the semiconductor module 3 are connected to the gate control IC 11. The gate control IC 11 is driven by a power supply 15. The module terminals 2a and 2b are connected to the ground of the power source 15 of the gate control IC 11 through the probe pins 1f and 1g and the switching relay 12.

  In FIG. 2, the detail of the connection part of the electroconductive member 20 is shown. The probe pins 1a and 1b are inserted into the probe socket 3 and supported. The probe socket 3 is fixed to the plate 4. A spring is built in the probe socket 3, and the probe pins 1a and 1b are pressed against the module terminals 2a and 2b by the elasticity of the spring.

  The probe pin 1a and the probe pin 1b are electrically connected to each other at the connection point 16 of the wiring 5 at the base of the probe pins 1a and 1b. The conductive member 20 is joined in the vicinity of the tips of the probe pins 1a and 1b. Here, as the conductive member 20, for example, a twisted wire obtained by twisting a copper wire, a copper braided wire, or the like is used, and is joined to the probe pins 1a and 1b by soldering.

  Note that the semiconductor module 3 shown in FIG. 1 is an example, and the semiconductor elements 4, 5, 6, and 7 may be other types of power devices. It may be.

<Semiconductor module test and surge voltage>
In the present embodiment, it is considered that the on / off test of the semiconductor elements 4 and 5 on the low side of the semiconductor module 3 is performed. For example, when testing the semiconductor element 4, the switching relay is connected to the probe pin 1 e as shown in FIG. 1, and the gate voltage of the semiconductor element 4 is controlled by the gate control IC 11. Toggle on / off. It is assumed that the semiconductor elements 6 and 7 are always on.

  First, consider the case where there is no conductive member 20.

  When testing the semiconductor element 4, when the semiconductor element 4 is turned on, the current (i) that has passed between the collector and the emitter of the semiconductor element 4 flows from the module terminal 2a to the connection point 16 via the probe pin 1a. At this time, a surge voltage (V = L × di / dt) is generated due to the time variation of the inductance (L) of the wiring from the probe pin 1a and the probe pin 1a to the connection point 16 and the current (i). The voltage is applied between the gate and the emitter of the semiconductor element 5 on the untested side with respect to the ground. Further, when the semiconductor element 4 is turned off, a surge voltage is applied between the gate and the emitter of the semiconductor element 5 in the direction opposite to that when the semiconductor element 4 is turned on.

  Further, when testing the transistor 5, a similar surge voltage is applied between the gate and the emitter of the semiconductor element 4.

  As described above, when the surge voltage exceeds the breakdown voltage between the gate and the emitter, the semiconductor elements 4 and 5 are damaged and the performance is deteriorated. Further, when the current passed through the semiconductor module 3 is increased, the surge voltage is increased. Therefore, it is necessary to suppress the surge voltage generated during the test.

  Therefore, in the present embodiment, the above-described problem is solved by connecting the conductive member 20 near the tips of the probe pins 1a and 1b. When the semiconductor element 4 is tested, when the conductive member 20 is not present, the current flows between the probe pin 1a and the connection point 16 as described above. However, the conductive member 20 causes the probe pins 1a and 1b to flow. By bypassing the gap, the current passes through the conductive member 20 and is shunted to the probe pin 1b. Therefore, when the current is shunted, the current flowing per probe pin is reduced, so that the amount of time change of the current is also reduced, and the surge voltage applied to the transistor 5 is suppressed. The same applies to the test of the semiconductor element 5.

  In addition, the effect which suppresses the surge voltage mentioned above can be heightened more by using a member with low inductance as the conductive member 20. In addition, it is preferable that the conductive member 20 be joined as close to the tip of the probe pins 1a and 1b as possible because it is not affected by the inductance of the probe pins 1a and 1b, and the surge voltage can be suppressed lower. .

<Effect>
The semiconductor module testing jig in the present embodiment is a semiconductor module that tests the electrical characteristics of the semiconductor module 3 by applying a predetermined electrical pattern by pressing a probe pin to the module terminal of the semiconductor module 3. It is a test jig, and the probe pins 1a, 1b are connected between a set of probe pins 1a, 1b and probe pins 1a, 1b, where the bases of the probe pins 1a, 1b are electrically connected to each other. And a conductive member 20 electrically joined in the vicinity of the tip.

  Therefore, since the current flowing between the semiconductor element 4 or the semiconductor element 5 and the connection point 16 is shunted by the conductive member 20, the current flowing per probe pin is reduced, so that the time change of the current is also reduced. Thus, the surge voltage applied to the semiconductor element 4 or the semiconductor element 5 is suppressed. Therefore, damage to the semiconductor elements 4 and 5 due to the surge voltage is reduced, so that the durability of the semiconductor elements 4 and 5, that is, the durability of the semiconductor module 3 can be improved. Moreover, the yield at the time of manufacturing the semiconductor module 3 is also improved.

  Moreover, since the semiconductor module test jig in the present embodiment can be realized only by changing a part of the commonly used semiconductor module test jig, the above-described effects can be obtained at low cost. Is possible.

  Further, the conductive member 20 provided in the semiconductor module test jig in the present embodiment is characterized by being joined by soldering. Therefore, by joining by soldering, it can join easily, ensuring the electroconductivity of a junction part.

<Embodiment 2>
The present embodiment is different from the first embodiment in that the conductive member 20 is joined to the probe pins 1a and 1b by welding. Since other circuit configurations and operations are the same as those of the first embodiment, description thereof is omitted.

  The conductive member 20 provided in the semiconductor module test jig in the present embodiment is characterized by being joined by welding. Therefore, it is possible to perform bonding with stronger bonding strength than in the first embodiment.

<Embodiment 3>
In the present embodiment, the conductive member 20 is a member on which the probe pins 1a and 1b can slide independently. As shown in FIG. 3, a twisted wire or a copper braided wire formed by twisting copper wires is used. The conductive member 20 is joined to the probe pins 1a and 1b in a state where the conductive member 20 is bent. Joining is performed by soldering or welding. Since other circuit structures and operations are the same as those of the first embodiment, description thereof is omitted.

  The conductive member 20 provided in the semiconductor module test jig in the present embodiment is characterized in that each probe pin of the set of probe pins 1a and 1b is a member that can slide independently. Therefore, the probe pins 1a and 1b can be independently slid by joining with the probe pins 1a and 1b in a state where the conductive member 20 is bent, so that the terminals 2a and 2b of the semiconductor module 3 can be slid. Even when the heights of the terminals 2a and 2b are different, it is possible to press the terminals 2a and 2b with a stable contact load.

  Further, the conductive member 20 provided in the semiconductor module test jig in the present embodiment is characterized by being joined in a bent state. Accordingly, the probe pins 1a and 1b can be easily slidable by joining twisted wires or copper braided wires twisted with copper wires in a bent state.

<Embodiment 4>
In the present embodiment, the conductive member 20 is a member on which the probe pins 1a and 1b can slide independently. For example, as shown in FIG. 4, the conductive member 20 is the conductive member 20 described in the first embodiment. A spring material 20a such as a copper spring is used. Both ends of the spring material 20a are joined to the vicinity of the tips of the probe pins 1a and 1b by soldering or welding. Since other circuit structures and operations are the same as those of the first embodiment, description thereof is omitted.

  The conductive member 20 provided in the semiconductor module test jig in the present embodiment is a spring material 20a. Therefore, since the conductive member 20 has elasticity, the probe pins 1a and 1b can slide independently of each other more smoothly than in the third embodiment.

<Embodiment 5>
FIG. 5 shows a connection structure of the conductive member 20 in the present embodiment. Holes are formed in the vicinity of the tips of the probe pins 1a and 1b, and the conductive member 20 is passed through these holes and joined by soldering or welding. Here, when the conductive member 20 is the spring material 20a such as the copper spring described in the fourth embodiment, the probe pins 1a and 1b can be slid independently and smoothly, which is preferable.

  Since other circuit configurations and circuit operations are the same as those in the first embodiment, description thereof is omitted.

  In the semiconductor module testing jig according to the present embodiment, each probe pin of the set of probe pins 1a and 1b further includes a hole near the tip of the pin, and the conductive member 20 is passed through this hole and soldered or welded. It is characterized by being joined by.

  Therefore, when the conductive member 20 is attached, it can be attached by soldering or welding while holding the conductive member by passing it through the hole provided near the tip of the probe pin 1a, 1b. In addition, the bonding strength is improved by bonding through the hole.

<Embodiment 6>
The present embodiment is different from the fifth embodiment in that the conductive member 20 passed through the holes of the probe pins 1a and 1b is joined by pressure welding. Since other points are the same as those of the fifth embodiment, the description thereof is omitted.

  In the semiconductor module test jig according to the present embodiment, each probe pin of the set of probe pins 1a and 1b further includes a hole in the vicinity of the tip of the pin, and the conductive member 20 is passed through this hole and joined by pressure welding. It is characterized by. Therefore, the conductive member 20 can be easily attached as compared with the fifth embodiment in which joining is performed by soldering or welding.

<Embodiment 7>
In this Embodiment, as shown in FIG. 6, the electroconductive member 20 is equipped with the clip 20b at the both ends. The conductive member 20 is joined by sandwiching the vicinity of the tips of the probe pins 1a and 1b with the clip 20b. Since other circuit configurations and circuit operations are the same as those of the first embodiment, description thereof is omitted. As described in the fourth embodiment, it is preferable that the conductive member 20 is a spring material 20a such as a copper spring because the probe pins 1a and 1b can be slid independently and smoothly.

  The conductive member 20 provided in the semiconductor module test jig in the present embodiment further includes clips 20b at both ends, and is joined by being sandwiched between the clips 20b. Therefore, the conductive member 20 can be easily attached and detached, and is convenient when the probe pins 1a and 1b are exchanged, so that the maintainability is improved.

  It should be noted that the present invention can be freely combined with each other within the scope of the invention, and each embodiment can be appropriately modified or omitted.

  1a, 1b, 1c, 1d, 1e, 1f Probe pin, 2a, 2b, 2c, 2d, 2c Module terminal, 3 Semiconductor module, 4, 5, 6, 7 Semiconductor element, 10 Load, 11 Gate control IC, 12 Switching relay, 13 Smoothing electrolytic capacitor, 14, 15 Power supply, 16 Connection point, 20 Conductive member, 20a Spring material, 20b Clip.

Claims (9)

A semiconductor module testing jig for testing electrical characteristics of the semiconductor module by applying a predetermined electrical pattern by pressing a probe pin to a terminal of the semiconductor module,
A set of probe pins in which the bases of the probe pins are electrically connected to each other;
A conductive member electrically joined in the vicinity of the tip of the probe pin between the set of the probe pins;
Comprising
Semiconductor module test jig. The conductive member is a member in which each probe pin of the set of the probe pins can slide independently,
The semiconductor module test jig according to claim 1. The conductive member is bonded in a bent state,
The jig for testing a semiconductor module according to claim 2. The conductive member is a spring material,
The jig for testing a semiconductor module according to claim 2. The conductive member is bonded by soldering,
The semiconductor module test jig according to claim 1. The conductive member is joined by welding,
The semiconductor module test jig according to claim 1. Each probe pin of the set of probe pins further comprises a hole near the tip of the pin,
The conductive member is passed through the hole and joined by soldering or welding,
The semiconductor module test jig according to claim 1. Each probe pin of the set of probe pins further comprises a hole near the tip of the pin,
The conductive member is passed through the hole and joined by pressure welding,
The semiconductor module test jig according to claim 1. The conductive member further includes clips at both ends,
It is joined by sandwiching with the clip,
The semiconductor module test jig according to claim 1.

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