JP2013121571A - Die and manufacturing method of die - Google Patents

Die and manufacturing method of die Download PDF

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JP2013121571A
JP2013121571A JP2011271021A JP2011271021A JP2013121571A JP 2013121571 A JP2013121571 A JP 2013121571A JP 2011271021 A JP2011271021 A JP 2011271021A JP 2011271021 A JP2011271021 A JP 2011271021A JP 2013121571 A JP2013121571 A JP 2013121571A
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die
hip
support
bar
layer
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JP5912038B2 (en
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Masao Hirai
昌夫 平井
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HIRAI KOGYO KK
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Abstract

PROBLEM TO BE SOLVED: To provide a die in which an HIP bar in which an HIP layer is provided for a support that forms a part of a die member is allowed to connect with the die member, thereby, a large-scale HIP apparatus is unnecessary, and the reduction of the manufacturing cost of a die product can be attained.SOLUTION: In the die that has lip parts L and L at the end of a die channel 24 formed between two or more die members 5 and 5, and in which a coating liquid or a molten resin supplied to the die channel 24 is discharged from the lip part L; the die member 5 includes a die body part 4 and an HIP bar 3, the HIP bar 3 includes: a support 2 of a material that is the same or similar as the die body part 4; and an HIP layer 1 in which an alloy powder excellent in corrosion resistance and wear resistance is performed by direct diffusion connection to the support 2 by an HIP treatment, wherein the support 2 of the HIP bar 3 is connected to the end side of the die body part 4 by welding, and the lip part L is formed by the HIP layer 1.

Description

本発明は、複数のダイ部材間に形成されるダイ流路の先端部にリップ部を有し、ダイ流路に供給される塗工液又は溶融樹脂をリップ部から吐出するようにしたダイ(塗工ダイ又はTダイ)及びダイの製造方法に関する。   The present invention provides a die having a lip portion at a tip end portion of a die flow path formed between a plurality of die members, and discharging a coating liquid or molten resin supplied to the die flow path from the lip portion ( Coating die or T die) and a die manufacturing method.

従来使用されている塗工ダイには、ダイ部材間に形成されたダイ流路の先端側に超硬合金製のリップ部材を取り付けたものがあり、このリップ部材の超硬合金によって、高い剛性、耐摩耗性及び耐食性が得られ、先端部形状精度の向上が図られる。しかし、そのような超硬合金製のリップ部材をダイ部材に取り付けた塗工ダイでは、焼結体の中に微細な気孔が残留していて、この焼結体を研削すると、ピンホールが多く見られることから、表面粗度の点で問題があって、高精度の塗布が要求される液晶ディスプレイパネルの製造工程などでは使用できない。また、超硬合金製のリップ部材を、ロウ付けを含む溶接手段によりダイ部材に接合すると、接合部において溶接欠陥、接合強度の低下などの影響によって接合部の摩耗や変形が大きいために、上記同様に高い精度が要求される液晶ディスプレイパネルの製造工程などでの使用ができない。   Conventionally used coating dies include a cemented carbide lip member attached to the tip side of the die flow path formed between the die members. Thus, wear resistance and corrosion resistance can be obtained, and the tip shape accuracy can be improved. However, in a coating die in which such a lip member made of cemented carbide is attached to the die member, fine pores remain in the sintered body, and when this sintered body is ground, there are many pinholes. Since it is seen, there is a problem in terms of surface roughness, and it cannot be used in a manufacturing process of a liquid crystal display panel that requires high-precision coating. In addition, when the lip member made of cemented carbide is joined to the die member by welding means including brazing, the wear and deformation of the joint are large due to the influence of welding defects, reduction in joint strength, etc. in the joint. Similarly, it cannot be used in a liquid crystal display panel manufacturing process that requires high accuracy.

上記のような問題点を解決するために、本願の出願人は、以前に、超硬合金製のリップ部材に代え、HIP(Hot Isostatic Pressing の略称で、熱間等方圧加圧と言う)処理によってダイ部材の母材に耐食性及び耐摩耗性の良好な合金粉末が直接拡散接合されたHIP層からなるリップ部とすることにより、リップ部の組織が緻密化され、表面粗度を高精度に仕上げることができると共に、接合部の強度低下や接合欠陥の発生がなく、しかもエッジ部が高精度のシャープエッジに仕上げられ、耐摩耗性及び耐食性が良好となるリップ部を有するダイ及びダイの製造方法に係る発明を提案している。   In order to solve the above-described problems, the applicant of the present application previously replaced the lip member made of cemented carbide with HIP (abbreviated as Hot Isostatic Pressing, called hot isostatic pressing) By forming a lip part consisting of a HIP layer in which alloy powder with good corrosion resistance and wear resistance is directly diffusion bonded to the base material of the die member, the structure of the lip part is densified and the surface roughness is highly accurate. Of die and die having a lip portion that has a sharp edge with high precision and good wear resistance and corrosion resistance. An invention relating to a manufacturing method is proposed.

しかしながら、上記提案の発明では、リップ部をHIP層によって形成するためには、ダイ部材を形成するダイ素材の全体を、HIP(熱間等方圧加圧)装置の処理室に入れてHIP処理を行なう必要があり、そうすると大型のダイ素材の場合には、それに対応する大型のHIP装置が必要となって設備費の高騰を来たすと共に、ダイ素材の一部をHIP処理すればよいものを、ダイ素材全部をHIP処理しなければならないため、非常に効率が悪く、結果的にダイ製品の製作コスト高を招くことになる。   However, in the above proposed invention, in order to form the lip portion by the HIP layer, the entire die material forming the die member is placed in the processing chamber of the HIP (hot isostatic pressing) device to perform the HIP processing. In this case, in the case of a large die material, a large HIP device corresponding to the die material is required, resulting in an increase in equipment costs, and a part of the die material that needs to be HIP processed. Since the entire die material must be HIPed, it is very inefficient and results in high die product manufacturing costs.

本発明は、上記の事情に鑑みてなされたもので、ダイ部材の一部を成すような支持体にHIP層を形成することによってHIPバーを製作し、このHIPバーをダイ部材に対し溶接によって接合させるようにすることで、大型のHIP装置が不要となり、ダイ製品の製作コストの低減化を図ることのできるダイ及びダイの製造方法を提供することを目的としている。   The present invention has been made in view of the above circumstances. A HIP bar is manufactured by forming a HIP layer on a support that forms a part of a die member, and the HIP bar is welded to the die member. It is an object of the present invention to provide a die and a method of manufacturing a die that can eliminate the need for a large HIP device and reduce the manufacturing cost of the die product.

上記課題を解決するための手段を、後述する実施形態の参照符号を付して説明すると、請求項1に係る発明は、複数のダイ部材5,5間に形成されるダイ流路24の先端部にリップ部L,Lを有し、ダイ流路24に供給される塗工液又は溶融樹脂をリップ部Lから吐出するダイにおいて、ダイ部材5は、ダイ本体部4とHIPバー3とからなり、HIPバー3は、ダイ本体部4と同じ又は類似した材質の支持体2と、耐食性及び耐摩耗性の良好な合金粉末がHIP処理によって支持体2に直接拡散接合されたHIP層1とからなるもので、このHIPバー3の支持体2側がダイ本体部4に溶接により接合され、そのHIP層1によってリップ部Lが形成されてなることを特徴とする。   Means for solving the above problems will be described with reference numerals in the embodiments described later. The invention according to claim 1 is the tip of the die flow path 24 formed between the plurality of die members 5 and 5. In the die having the lip portions L, L in the portion and discharging the coating liquid or molten resin supplied to the die flow path 24 from the lip portion L, the die member 5 includes the die body portion 4 and the HIP bar 3. The HIP bar 3 includes a support 2 made of the same material as or similar to the die body 4 and an HIP layer 1 in which an alloy powder having good corrosion resistance and wear resistance is directly diffusion bonded to the support 2 by HIP treatment. The support body 2 side of the HIP bar 3 is joined to the die body portion 4 by welding, and the lip portion L is formed by the HIP layer 1.

請求項2は、請求項1に記載のダイにおいて、前記リップ部L以外のダイ流路24を形成するダイ部材5の内壁面に硬質クロムメッキ層26又は無電解ニッケルメッキ層が被覆されてなることを特徴とする。   A second aspect of the present invention is the die according to the first aspect, wherein the inner wall surface of the die member 5 forming the die flow path 24 other than the lip portion L is coated with a hard chrome plating layer 26 or an electroless nickel plating layer. It is characterized by that.

請求項3は、請求項1又は2に記載のダイにおいて、HIP処理される合金粉末は、ニッケル系合金又はコバルト系合金からなることを特徴とする。   According to a third aspect of the present invention, in the die according to the first or second aspect, the alloy powder to be HIP-treated is made of a nickel-based alloy or a cobalt-based alloy.

請求項4は、請求項1〜3の何れかに記載のダイにおいて、HIPバー3の支持体2は、オーステナイト/フェライトの2相系ステンレスからなることを特徴とする。   According to a fourth aspect of the present invention, in the die according to any one of the first to third aspects, the support 2 of the HIP bar 3 is made of austenite / ferrite duplex stainless steel.

請求項5に係る発明は、請求項1〜4の何れかに記載のダイの製造方法であって、耐食性及び耐摩耗性の良好な合金粉末をHIP処理により支持体2に対し直接拡散接合することによってHIPバー3を形成し、このHIPバー3の支持体2側をダイ本体部4に溶接により接合することによってダイ部材5を形成し、このHIPバー3のHIP層1によって前記リップ部Lを形成するようにしたことを特徴とする。   The invention according to claim 5 is the die manufacturing method according to any one of claims 1 to 4, wherein the alloy powder having good corrosion resistance and wear resistance is directly diffusion bonded to the support 2 by HIP treatment. Thus, the HIP bar 3 is formed, and the die 2 is formed by joining the support 2 side of the HIP bar 3 to the die body 4 by welding. The lip portion L is formed by the HIP layer 1 of the HIP bar 3. It is characterized by forming.

請求項6は、請求項5に記載のダイの製造方法において、前記リップ部L以外のダイ流路24を形成するダイ部材5の内壁面に硬質クロムメッキ層26又は無電解ニッケルメッキ層を被覆するようにしたことを特徴とする。   6. The method for manufacturing a die according to claim 5, wherein the inner wall surface of the die member 5 forming the die flow path 24 other than the lip portion L is coated with a hard chromium plating layer 26 or an electroless nickel plating layer. It was made to do.

請求項7は、請求項6に記載のダイの製造方法において、HIPバー3の支持体2側は、ダイ本体部4に対しロウ付け又は電子ビーム溶接もしくはレーザービーム溶接によって接合してなることを特徴とする。尚、ロウ付けは、接合する金属部材(母材)よりも融点の低い合金(ロウ)を溶かして一種の接着剤として用いることにより、母材自体は溶融させずに部材どうしを接合させる方法であるが、金属を接合する手段であることから、ここでは溶接の一種とする。   According to a seventh aspect of the present invention, in the die manufacturing method according to the sixth aspect, the support 2 side of the HIP bar 3 is joined to the die main body 4 by brazing, electron beam welding or laser beam welding. Features. Brazing is a method of joining members together without melting the base material itself by melting an alloy (wax) having a melting point lower than that of the metal member (base material) to be joined and using it as a kind of adhesive. Although it is a means for joining metals, it is a kind of welding here.

上記解決手段による発明の効果を、後述する実施形態の参照符号を付して説明すると、請求項1に係る発明のダイによれば、ダイ部材5は、ダイ本体部4とHIPバー3とからなり、HIPバー3は、ダイ本体部4と同じ又は類似した材質の支持体2と、耐食性及び耐摩耗性の良好な合金粉末がHIP処理により支持体2に直接拡散接合されたHIP層1とからなるもので、HIPバー3の支持体2がダイ本体部4に溶接により接合され、そのHIP層1によってリップ部Lが形成されているから、HIP層を形成するのに、ダイ素材の全体をHIP処理する必要がなく、ダイ素材の一部となるHIPバー3をあらかじめ形成しておいて、これをダイ本体部4に溶接によって接合すればよく、従ってダイ部材5の製作が簡単容易となり、ダイ製品の製作コストの著しい低減化を図ることができる。   The effect of the invention by the above solution will be described with reference numerals in the embodiments described later. According to the die of the invention according to claim 1, the die member 5 is composed of the die body portion 4 and the HIP bar 3. The HIP bar 3 includes a support 2 made of the same or similar material as that of the die body 4 and an HIP layer 1 in which an alloy powder having good corrosion resistance and wear resistance is directly diffusion bonded to the support 2 by HIP treatment. Since the support body 2 of the HIP bar 3 is joined to the die body portion 4 by welding and the lip portion L is formed by the HIP layer 1, the entire die material is formed to form the HIP layer. The HIP bar 3 to be a part of the die material is formed in advance and can be joined to the die body portion 4 by welding, so that the die member 5 can be manufactured easily and easily. The die It is possible to significantly reduce the manufacturing cost of the goods.

請求項2に係る発明によれば、ダイ部材5,5間に形成されるダイ流路24を全てHIP層によって形成しようとした場合は、ダイ製造コストが非常に高騰することになるが、リップ部L以外のダイ流路23を形成するダイ部材5の内壁面には、HIP処理よりはるかに安い硬質クロムメッキ層26又は無電解ニッケルメッキ層が被覆されるから、塗工液又は溶融樹脂との摩擦を低減することができながら、ダイの製造コストの軽減化が図られる。また硬質クロムメッキは、摩擦係数が小さく非常に滑りが良好で、他の物質が付着し難く、防錆力をもったメッキであるため、溶融樹脂や塗工液との摩擦を低減し、摩擦性の強い溶融樹脂や塗工液を使用した場合でも、ダイ流路24の接液部に傷、摩耗を発生することがなく、永続的に使用することができる。また、無電解ニッケルメッキ層は、母材との密着性が良く、硬質クロムメッキ層26と同等の優れた耐摩耗性を有する   According to the second aspect of the present invention, if all the die flow paths 24 formed between the die members 5 and 5 are formed by the HIP layer, the die manufacturing cost will be very high. Since the inner wall surface of the die member 5 that forms the die flow path 23 other than the portion L is coated with a hard chrome plating layer 26 or an electroless nickel plating layer that is much cheaper than the HIP process, The manufacturing cost of the die can be reduced while the friction can be reduced. Hard chrome plating has a small coefficient of friction, very good sliding, prevents other substances from adhering, and has rust-preventing power, reducing friction with molten resin and coating liquid, and reducing friction. Even when a highly melted resin or coating solution is used, the wetted part of the die channel 24 is not damaged or worn, and can be used permanently. Further, the electroless nickel plating layer has good adhesion to the base material and has excellent wear resistance equivalent to that of the hard chrome plating layer 26.

請求項3に係る発明によれば、HIP処理される合金粉末がニッケル系合金又はコバルト系合金からなる場合は、耐食性がより一層良好となる。   According to the third aspect of the present invention, when the alloy powder to be subjected to HIP treatment is made of a nickel-based alloy or a cobalt-based alloy, the corrosion resistance is further improved.

請求項4に係る発明のように、HIPバー3の支持体2がオーステナイト/フェライトの2相系ステンレスからなる場合は、HIP層1の合金粉末に使用されるニッケル系合金粉末又はコバルト系合金粉末と熱膨張率が近いことから、熱膨張差に起因する曲がり変形が少なくなる。   When the support 2 of the HIP bar 3 is made of austenite / ferrite duplex stainless steel as in the invention according to claim 4, the nickel alloy powder or the cobalt alloy powder used for the alloy powder of the HIP layer 1 Therefore, the bending deformation due to the difference in thermal expansion is reduced.

請求項5に係る発明のダイの製造方法によれば、耐食性及び耐摩耗性の良好な合金粉末をHIP処理により支持体2に対し直接拡散接合することによりHIPバー3を形成し、このHIPバー3の支持体2側をダイ本体部4に溶接により接合することによってダイ部材5を形成し、このHIPバー3のHIP層1によってリップ部Lを形成するようにしたから、HIP層を形成するのに、ダイ素材の全体をHIP処理する必要がなく、ダイ素材の一部となるHIPバー3をあらかじめ形成しておいて、これをダイ本体部4に溶接によって接合すればよく、従ってダイ部材5の製作が簡単容易となり、ダイ製品の製作コストの著しい低減化を図ることができる。   According to the die manufacturing method of the invention of claim 5, the HIP bar 3 is formed by directly diffusion-bonding the alloy powder having good corrosion resistance and wear resistance to the support 2 by HIP treatment. Since the die member 5 is formed by welding the support body 2 side of the die 3 to the die body portion 4 by welding, and the lip portion L is formed by the HIP layer 1 of the HIP bar 3, the HIP layer is formed. However, it is not necessary to perform the HIP process on the entire die material, and the HIP bar 3 to be a part of the die material may be formed in advance, and this may be joined to the die main body portion 4 by welding. 5 becomes simple and easy, and the production cost of the die product can be significantly reduced.

請求項6に係る発明によれば、ダイ流路24を全てHIP層によって形成しようとした場合は、ダイの製造コストが非常に高騰することになるが、リップ部L以外のダイ流路24を形成するダイ部材5の内壁面に、HIP処理よりもはるかに安い硬質クロムメッキ層26又は無電解ニッケルメッキ層を被覆するから、塗工液又は溶融樹脂との摩擦を低減することができながら、ダイの製造コストの軽減化を図ることができる。   According to the sixth aspect of the present invention, when all the die flow paths 24 are to be formed by the HIP layer, the die manufacturing cost is very high. Since the inner wall surface of the die member 5 to be formed is coated with the hard chrome plating layer 26 or the electroless nickel plating layer that is much cheaper than the HIP treatment, the friction with the coating liquid or the molten resin can be reduced, The die manufacturing cost can be reduced.

請求項7に係る発明のように、HIPバー3の支持体2側を、ダイ本体部4に対しロウ付けにより接合する場合は、設備が簡単で接合作業が容易となり、コストを安くできる。また電子ビーム溶接による場合は、溶け込み幅が狭く、溶け込み深さの深い溶接ができ、溶接部の接合強度を十分に高めることができる。またレーザービーム溶接による場合は、高速で深い溶け込み深さが得られ、溶接部の接合強度を十分に高めることができる上に、熱影響が少なく、溶接変形が少ない。   When the support body 2 side of the HIP bar 3 is joined to the die body portion 4 by brazing as in the invention according to claim 7, the equipment is simple and the joining work is facilitated, and the cost can be reduced. Further, in the case of electron beam welding, the penetration width is narrow and welding with a deep penetration depth can be performed, and the joint strength of the welded portion can be sufficiently increased. Further, in the case of laser beam welding, a deep penetration depth can be obtained at a high speed, the joint strength of the welded portion can be sufficiently increased, and there is little thermal influence and welding deformation is small.

(a) はHIPバーを示す斜視図、(b) はダイ本体部を示す斜視図、(c) はダイ本体部にHIPバーを接合したダイ部材の斜視図である。(a) is a perspective view showing a HIP bar, (b) is a perspective view showing a die main body, and (c) is a perspective view of a die member in which the HIP bar is joined to the die main body. (a) はHIPバーの端面図、(b) はダイ本体部の端面図、(c) はダイ部材の端面図である。(a) is an end view of the HIP bar, (b) is an end view of the die body, and (c) is an end view of the die member. (a) 〜(d) はHIP処理の製作方法を説明する説明図である。(a)-(d) is explanatory drawing explaining the manufacturing method of HIP processing. (a) 〜(c) はダイ本体部にHIPバーを接合した一対のダイ部材によって塗工ダイを製作する過程を示す説明図である。(a)-(c) is explanatory drawing which shows the process in which a coating die is manufactured with a pair of die member which joined the HIP bar to the die main-body part. 一対のダイ部材からなるTダイを示すもので、(a-1) は各一方のダイ部材を示す正面図、(a-2) は(a-1) のX−X線断面図、(b) はTダイの横断面図である。1 shows a T-die composed of a pair of die members, (a-1) is a front view showing one of the die members, (a-2) is a sectional view taken along line XX of (a-1), (b) ) Is a cross-sectional view of a T-die. 硬質クロムメッキ層を被覆する場合の実施形態を示し、ダイ本体部にHIPバーを接合した一対のダイ部材によって塗工ダイを製作する行程の前半部を示す説明図である。It is explanatory drawing which shows embodiment in the case of coat | covering a hard chromium plating layer, and shows the first half part of the process which manufactures a coating die with a pair of die member which joined the HIP bar to the die main-body part. 同塗工ダイを製作する行程の後半部を示す説明図である。It is explanatory drawing which shows the latter half part of the process which manufactures the same coating die. 硬質クロムメッキ層を被覆する場合において、一対のダイ部材からなるTダイを示すもので、(a-1) は各一方のダイ部材を示す正面図、(a-2) は(a-1) のY−Y線断面図、(b) はTダイの横断面図である。In the case of coating a hard chrome plating layer, it shows a T die consisting of a pair of die members, (a-1) is a front view showing one of the die members, and (a-2) is (a-1) FIG. 6 is a cross-sectional view taken along line YY of FIG.

以下に本発明の好適な実施形態を図面に基づいて説明すると、図1は本発明に係る塗工ダイやTダイを製作するダイ部材5を示すもので、(a) はHIPバー3の斜視図、(b) はダイ本体部4の斜視図、(c) はダイ本体部4にHIPバー3を接合して形成されたダイ部材5の斜視図であり、図2の(a) はHIPバー3の端面図、(b) はダイ本体部4の端面図であり(c) はダイ部材5の端面図であり、図3はHIPバー3の製作工程を示す説明図である。   A preferred embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a die member 5 for producing a coating die and a T die according to the present invention, and (a) is a perspective view of a HIP bar 3. FIG. 2B is a perspective view of the die main body 4, FIG. 2C is a perspective view of a die member 5 formed by joining the HIP bar 3 to the die main body 4, and FIG. FIG. 3B is an end view of the die body 4, FIG. 3C is an end view of the die member 5, and FIG. 3 is an explanatory view showing a manufacturing process of the HIP bar 3.

図1の(a) 及び図2の(a) に示すHIPバー3は、ダイ本体部4と同じ又は類似した材質の支持体2と、耐食性及び耐摩耗性の良好な合金粉末がHIP処理によって支持体2に直接拡散接合されたHIP層1とからなるもので、このHIPバー3の支持体2が、ダイ本体部4の先端部側に設けられた係合段部4aに係合されて、溶接によりダイ本体部4に接合され、そしてこのHIPバー3のHIP層1によってダイ部材5のリップ部が形成されるようになっている。   The HIP bar 3 shown in FIG. 1 (a) and FIG. 2 (a) has a support 2 made of the same or similar material as that of the die body 4 and an alloy powder having good corrosion resistance and wear resistance. The support body 2 of the HIP bar 3 is engaged with an engagement step portion 4a provided on the tip end side of the die body portion 4. The die body 5 is joined to the die body 4 by welding, and the lip portion of the die member 5 is formed by the HIP layer 1 of the HIP bar 3.

上記ダイ部材5のダイ本体部4には、SUS440(マルテンサイト系ステンレス)、SCM440(機械構造用合金鋼)、SUS329J1(オーステナイト/フェライトの2相系ステンレス等が使用される。   For the die body 4 of the die member 5, SUS440 (martensitic stainless steel), SCM440 (alloy steel for mechanical structure), SUS329J1 (austenite / ferrite duplex stainless steel, or the like is used.

上記HIPバー3の製作方法について図3を参照して説明すると、ここでは一対のHIPバー3,3を同時に製作する場合を示したもので、先ず図3の(a) に示すように、両カプセル素材12,12の互いの合わせ面側に形成した合金粉末用凹部13,13に、夫々耐熱性離型材が塗布された中子型14,14を収容した状態で、両カプセル素材12,12を突き合わせ、この突き合わさった両カプセル素材12,12を溶接により仮止めして、カプセル15を形成し、このカプセル15の粉末供給口16よりカプセル素材12,12の合金粉末用凹部13,13内に耐食性及び耐摩耗性の良好な合金粉末17を充填し、粉末供給口16を塞ぎ板18で塞いで脱気密封し、図3の(a) に示す状態とする。   The manufacturing method of the HIP bar 3 will be described with reference to FIG. 3. Here, a case where a pair of HIP bars 3 and 3 are manufactured simultaneously is shown. First, as shown in FIG. In a state where the core molds 14 and 14 each coated with a heat-resistant release material are accommodated in the recess portions 13 and 13 for the alloy powder formed on the mating surfaces of the capsule materials 12 and 12, both the capsule materials 12 and 12 are stored. The capsule materials 12 and 12 that have been butted together are temporarily fixed by welding to form a capsule 15, and inside the alloy powder recesses 13 and 13 of the capsule material 12 and 12 from the powder supply port 16 of the capsule 15. 3 is filled with alloy powder 17 having good corrosion resistance and wear resistance, and the powder supply port 16 is closed with a closing plate 18 to be deaerated and sealed, and the state shown in FIG.

この場合、カプセル素材12は、最終的にHIPバー3の支持体2となるもので、ダイ本体部4の材質と同じ又は類似する材料からなり、SCM440、SUS329J1〜4、SS400、S45C〜S55C等が使用されるが、好ましくはSUS329J1〜4(オーステナイト/フェライトの2相系ステンレス)を使用するのがよい。それは、HIP層1の合金粉末に使用されるニッケル系合金粉末又はコバルト系合金粉末と熱膨張率が近く、熱膨張差に起因する曲がり変形が少ないからである。   In this case, the capsule material 12 will eventually become the support 2 of the HIP bar 3 and is made of the same or similar material as the material of the die body 4, such as SCM440, SUS329J1-4, SS400, S45C-S55C, etc. However, SUS329J1-4 (austenite / ferrite duplex stainless steel) is preferably used. This is because the thermal expansion coefficient is close to that of the nickel-based alloy powder or cobalt-based alloy powder used for the alloy powder of the HIP layer 1, and the bending deformation due to the thermal expansion difference is small.

そして、耐食性及び耐摩耗性の良好な合金粉末17には、ニッケル系合金粉末又はコバルト系合金粉末が使用される。ニッケル系合金粉末として好ましいものは、その構成元素比率が、ニッケル69.75重量%、クロム16.5重量%、ホウ素3.3重量%、珪素4.0重量%、炭素0.65重量%、鉄3.5重量%、モリブデン3.0重量%及び銅2.3重量%からなるものである。コバルト系合金粉末として好ましいものは、その構成元素比率が、コバルト45.7重量%、クロム19.0重量%、タングステン15.0重量%、銅1.3重量%、ニッケル13.0重量%、ホウ素3.0重量%及び珪素3.0重量%からなるものである。   For the alloy powder 17 having good corrosion resistance and wear resistance, nickel-based alloy powder or cobalt-based alloy powder is used. A preferable nickel-based alloy powder has a constituent element ratio of 69.75% by weight of nickel, 16.5% by weight of chromium, 3.3% by weight of boron, 4.0% by weight of silicon, 0.65% by weight of carbon, It consists of 3.5 wt% iron, 3.0 wt% molybdenum and 2.3 wt% copper. The preferred cobalt-based alloy powder has a constituent element ratio of 45.7% by weight cobalt, 19.0% by weight chromium, 15.0% by weight tungsten, 1.3% by weight copper, 13.0% by weight nickel, It is composed of 3.0% by weight of boron and 3.0% by weight of silicon.

それから、カプセル15を、図3の(b) に示すようにHIP(熱間等方圧加圧)装置の処理室19に入れて、例えば1300℃、1300Kgf/cm2 の高温高圧下でHIP処理を行うことにより、図3の(c) に示すように、カプセル素材12,12の夫々内壁面に合金粉末が拡散接合されたHIP層1,1を形成する。こうして形成されたHIP層1は、上記のような構成元素比率のニッケル系合金又はコバルト系合金からなる硬度HRC57〜68の硬質層である。 Then, the capsules 15 are placed in the processing chamber 19 of HIP (hot isostatic pressing) apparatus as shown in (b) of FIG. 3, for example 1300 ° C., HIP treated at high pressure and high temperature of 1300 kgf / cm 2 As shown in FIG. 3C, the HIP layers 1 and 1 in which the alloy powder is diffusion bonded to the inner wall surfaces of the capsule materials 12 and 12 are formed. The HIP layer 1 thus formed is a hard layer having a hardness of HRC57 to 68 made of a nickel-based alloy or a cobalt-based alloy having a constituent element ratio as described above.

上記のようにHIP処理によって両カプセル素材12,12の夫々内壁面にHIP層1,1を形成したカプセル15を図3の(c) に示すように解体し、各素材12の中子型14を取り外した後、図中の2点鎖線で示す切断・切削線20に沿って所要の形状となるように適宜に切断及び切削加工を施して、図3の(d) に示すように支持体2とHIP層1とからなるHIPバー3を一対形成する。各HIPバー3の支持体2は、上記カプセル素材12が所要形状に切断及び切削加工されたものである。   The capsule 15 in which the HIP layers 1 and 1 are formed on the inner wall surfaces of the capsule materials 12 and 12 by HIP processing as described above is disassembled as shown in FIG. Then, the substrate is appropriately cut and cut so as to have a required shape along the cutting / cutting line 20 indicated by a two-dot chain line in the drawing, and the support is shown in FIG. 3 (d). A pair of HIP bars 3 composed of 2 and the HIP layer 1 is formed. The support 2 of each HIP bar 3 is obtained by cutting and cutting the capsule material 12 into a required shape.

上記のようにして製作したHIPバー3をダイ本体部4に溶接により接合することによってダイ部材5を形成する。即ち、図1及び図2に示すように、所定長さを有するダイ本体部4の先端部側内側面にHIPバー3と同じ矩形断面の係合段部4aを形成しておき、この係合段部4aにHIPバー3の支持体2側を当接係合させて図1の(c) に示すような状態とし、しかしてこの状態でHIPバー3の支持体2側をダイ本体部4に対し溶接により、好ましくはロウ付け又は電子ビーム溶接もしくはレーザービーム溶接により接合して一体化し、ダイ部材5とする。尚、ロウ付けは、一般に、接合する金属部材(母材)よりも融点の低い合金(ロウ)を溶かして一種の接着剤として用いることによって、母材自体は溶融させずに部材どうしを接合させる方法であるが、金属を接合する手段であるため、ここでは溶接の一種とする。   The die member 5 is formed by joining the HIP bar 3 manufactured as described above to the die body portion 4 by welding. That is, as shown in FIGS. 1 and 2, an engagement step 4a having the same rectangular cross section as that of the HIP bar 3 is formed on the inner surface of the tip end portion of the die body 4 having a predetermined length. The support 2 side of the HIP bar 3 is brought into contact with and engaged with the stepped portion 4a so as to be in a state as shown in FIG. 1C. In this state, the support 2 side of the HIP bar 3 is placed on the die body 4 Are joined together by welding, preferably by brazing, electron beam welding or laser beam welding to form a die member 5. In general, brazing is performed by melting an alloy (wax) having a melting point lower than that of a metal member (base material) to be joined and using it as a kind of adhesive, thereby joining the members without melting the base material itself. Although it is a method, since it is a means for joining metals, it is a kind of welding here.

HIPバー3の支持体2側をダイ本体部4をロウ付けによって接合する場合、そのロウとしては、銀、銅、亜鉛を主成分とする銀ロウを使用する。このロウ付けによる場合は、設備が簡単で接合作業が容易であるから、コストを安くできる。   When the die body portion 4 is joined to the support 2 side of the HIP bar 3 by brazing, a silver brazing mainly composed of silver, copper, and zinc is used as the brazing. In the case of this brazing, since the equipment is simple and the joining work is easy, the cost can be reduced.

また、電子ビーム溶接は、タングステンなどの高融点金属を加熱して、発生させた熱電子に50〜100kVの高電圧をかけて加速し、溶接部に衝突させ、このときに発生する熱エネルギーにより行なう溶接で、真空中で行なう。この電子ビーム溶接による場合は、溶け込み幅が狭く、溶け込み深さの深い溶接ができ、溶接部の接合強度を十分に高めることができる。また、レーザービーム溶接は、レーザー光線のエネルギーを利用して行なう溶接で、レーザー光線には炭酸ガスレーザー又はYAGレーザーを使用する。このレーザービーム溶接は、入熱量が少なく、高速で非常に深い溶け込み深さが得られ、溶接熱影響が非常に少なく、熱変形が少ない、等の利点がある。   In electron beam welding, a high melting point metal such as tungsten is heated and accelerated by applying a high voltage of 50 to 100 kV to the generated thermoelectrons to collide with a welded portion. The welding is performed in a vacuum. In the case of this electron beam welding, the penetration width is narrow, welding with a deep penetration depth can be performed, and the joint strength of the welded portion can be sufficiently increased. Laser beam welding is welding performed using the energy of a laser beam, and a carbon dioxide laser or a YAG laser is used as the laser beam. This laser beam welding has advantages such as a small amount of heat input, a very high penetration depth at a high speed, a very small influence of welding heat, and a small amount of thermal deformation.

本発明の特徴は、上記したように耐食性及び耐摩耗性の良好な合金粉末をHIP処理により支持体2に対し直接拡散接合することによりHIPバー3を形成し、このHIPバー3の支持体2側をダイ本体部4に対しロウ付けを含む溶接によって接合することにより、ダイ部材5を形成することにあって、リップ部Lを形成するためのHIP層1を形成するのに、従来のようにダイ素材の全体をHIP処理する必要がなく、ダイ素材の一部となるHIPバー3をあらかじめ製作しておいて、このHIPバー3をダイ本体部4に溶接によって接合すればよいから、比較的小さなHIP装置で済ませることができると共に、ダイ部材5の製作が簡単容易となって、ダイ製品の製作コストの著しい低減化を図ることができる。   The feature of the present invention is that, as described above, the HIP bar 3 is formed by directly diffusion-bonding the alloy powder having good corrosion resistance and wear resistance to the support 2 by HIP treatment, and the support 2 of the HIP bar 3 is formed. In forming the die member 5 by joining the side to the die body portion 4 by welding including brazing, the conventional HIP layer 1 for forming the lip portion L is formed. It is not necessary to HIP the entire die material, and the HIP bar 3 that is a part of the die material is manufactured in advance, and this HIP bar 3 can be joined to the die body 4 by welding. A small HIP apparatus can be used, and the die member 5 can be easily and easily manufactured, and the manufacturing cost of the die product can be significantly reduced.

図4の(a) 〜(c) は、HIPバー3をダイ本体部4に溶接により接合して形成した一対のダイ部材5,5によって塗工ダイAを製造する場合を図示したものであり、同図の(a) に示すように、両ダイ部材5,5を2点鎖線で示す切断切削加工線20に沿って所要形状に切断切削し、また(b) に示すように片方のダイ部材5には塗工液供給路22及びマニホールド23を形成し、しかして(c) に示すように両ダイ部材5,5を所定の間隔で突き合わせ配置して、両ダイ部材5,5間にダイ流路24を形成すると共に、ダイ流路24の先端部にHIP層1,1によってリップ部L,Lを形成し、かくして塗工ダイAを簡単容易に製造することができる。なお、両ダイ部材5,5を所定の間隔で突き合わせ配置する際、両ダイ部材5,5の夫々の合わせ面、或いは、リップ部L,Lの両ダイ部材5,5の夫々の合わせ面のみを鏡面研削加工しても良い。これにより、リップ部L,Lのエッジ部を、高精度のシャープエッジ(例えば、1μm単位)に仕上げることが可能となり、僅かな衝撃で生じる「カケ」の発生を低減させることができる。   FIGS. 4A to 4C illustrate a case where the coating die A is manufactured by a pair of die members 5 and 5 formed by joining the HIP bar 3 to the die body portion 4 by welding. As shown in (a) of the figure, both die members 5 and 5 are cut and cut into a required shape along a cutting line 20 indicated by a two-dot chain line, and one die is also shown in (b). A coating liquid supply path 22 and a manifold 23 are formed in the member 5, and both die members 5, 5 are arranged to face each other at a predetermined interval as shown in (c). In addition to forming the die channel 24, the lip portions L, L are formed by the HIP layers 1 and 1 at the tip of the die channel 24, and thus the coating die A can be easily and easily manufactured. When the die members 5 and 5 are arranged to face each other at a predetermined interval, only the mating surfaces of the die members 5 and 5 or only the mating surfaces of the die members 5 and 5 of the lip portions L and L are used. May be mirror-ground. Thereby, it becomes possible to finish the edge part of the lip | rip parts L and L to a highly accurate sharp edge (for example, 1 micrometer unit), and generation | occurrence | production of the "debris" which arises by a slight impact can be reduced.

図5は、HIPバー3をダイ本体部4に溶接により接合して形成した一対のダイ部材5,5によってTダイBを製造する場合を示したもので、(a-1) は各一方のダイ部材5を示す正面図、(a-2) は(a-1) のX−X線断面図であって、各ダイ部材5には内面側に、マニホールド部23a、ダイ流路部24a及び流入口部25aを形成していて、同図の(b) に示すように一対のダイ部材5,5を所定の間隔で突き合わせ配置することにより、両ダイ部材5,5間にダイ流路24を形成すると共に、ダイ流路24の入口部に溶融樹脂流入口25を、またその中間部にマニホールド23を形成し、そしてダイ流路24の先端部にHIP層1,1によってリップ部L,Lを形成し、かくしてTダイBを簡単容易に製造することができる。なお、上記TダイAの製造同様、両ダイ部材5,5を所定の間隔で突き合わせ配置する際、両ダイ部材5,5の夫々の合わせ面、或いは、リップ部L,Lの両ダイ部材5,5の夫々の合わせ面のみを鏡面研削加工しても良い。   FIG. 5 shows a case where a T-die B is manufactured by a pair of die members 5 and 5 formed by welding the HIP bar 3 to the die body 4 by welding (a-1) The front view which shows the die member 5, (a-2) is XX sectional drawing of (a-1), Comprising: On each die member 5, the manifold part 23a, the die flow path part 24a, An inflow port portion 25a is formed, and a pair of die members 5 and 5 are arranged to face each other at a predetermined interval as shown in FIG. A molten resin inlet 25 at the inlet of the die passage 24 and a manifold 23 at an intermediate portion thereof, and a lip portion L, HIP layers 1, 1 at the tip of the die passage 24. L can be formed, and thus the T die B can be manufactured easily and easily. Similar to the manufacture of the T-die A, when the two die members 5 and 5 are arranged to face each other at a predetermined interval, the die surfaces 5 of the die members 5 and 5 or the die members 5 of the lip portions L and L are arranged. , 5 may be mirror-polished only on the mating surfaces.

図6及び図7は、リップ部L以外のダイ流路24を形成するダイ部材5の内壁面に硬質クロムメッキ層26を被覆する場合の実施形態を示すもので、上記のようにHIPバー3をダイ本体部4に溶接して接合することにより形成した一対のダイ部材5,5によって本発明に係る塗工ダイAを製造する場合を示し、図6の(a-1) ,(a-2) 〜(c-1) ,(c-2) 及び図5の(a-1) ,(a-2) は、両ダイ部材5,5の片方のみの製造過程を示し、そして図7の(b) には両ダイ部材5,5からなる完成状態の塗工ダイAを示している。   6 and 7 show an embodiment in which the hard chrome plating layer 26 is coated on the inner wall surface of the die member 5 that forms the die flow path 24 other than the lip portion L. As described above, the HIP bar 3 6 shows a case where the coating die A according to the present invention is manufactured by a pair of die members 5 and 5 formed by welding and bonding to the die main body portion 4, and (a-1) and (a- 2) to (c-1) and (c-2) and (a-1) and (a-2) in FIG. 5 show the manufacturing process of only one of the die members 5 and 5, and FIG. (b) shows the coating die A in a completed state comprising both die members 5 and 5.

塗工ダイAの製造にあたって、先ず、図6の(a-1) ,(a-2) に示すように、ダイ部材5には、リップ部LとなるHIP層1以外のダイ部材5内面側と先端面側に表面処理である硬質クロムメッキ処理を行なうためのアンダーカットを研削加工によって行なう。図6の(a-2) にはアンダーカット部を21で示し、そのアンダーカット量をwで示す。アンダーカット量wは、この後に行なう硬質クロムメッキ層26の厚みを考慮して適宜に設定されるが、例えば100μとされる。尚、このアンダーカット処理は、図示のように、ダイ本体部4からHIPバー3の支持体2及びHIP層1の一部に亘って行う。   In the production of the coating die A, first, as shown in FIGS. 6A-1 and 6A-2, the die member 5 has an inner side of the die member 5 other than the HIP layer 1 serving as the lip portion L. And the undercut for performing the hard chrome plating process which is a surface treatment is performed on the front end surface side by grinding. In FIG. 6A-2, the undercut portion is denoted by 21 and the undercut amount is denoted by w. The undercut amount w is appropriately set in consideration of the thickness of the hard chrome plating layer 26 to be performed later, and is set to 100 μm, for example. In addition, this undercut process is performed over the support body 2 and part of the HIP layer 1 of the HIP bar 3 from the die body 4 as shown in the figure.

図6の(b-1), (b-2) は、アンダーカット研削加工を行なった後の状態を示すと共に、このアンダーカット部21に被覆される硬質クロムメッキ層26の膜厚を、その後の研削加工を考慮して、最終膜厚(アンダーカット量w)より十分に厚いWで示している。そして、図6の(c-1) ,(c-2) には、アンダーカット部21に膜厚Wにて被覆された硬質クロムメッキ層26を示す。尚、強固な硬質クロムメッキ層26を形成するためには、無電解ニッケルメッキ処理を行なってから、硬質クロムメッキ処理を行なうようにすればよく、そうすることによってダイ部材5に対する硬質クロムメッキ層26の密着力が非常に良好となる。   (B-1) and (b-2) of FIG. 6 show the state after the undercut grinding process, and the thickness of the hard chrome plating layer 26 covered by the undercut portion 21 In consideration of the grinding process, the thickness W is sufficiently thicker than the final film thickness (undercut amount w). 6 (c-1) and (c-2) show a hard chrome plating layer 26 in which the undercut portion 21 is coated with a film thickness W. FIG. In order to form the hard hard chrome plating layer 26, the electroless nickel plating process may be performed, and then the hard chrome plating process may be performed, whereby the hard chrome plating layer for the die member 5 is formed. The adhesion force of 26 is very good.

図7の(a-1) ,(a-2) は、図6の(c-1) ,(c-2) に示されるような厚い膜厚Wで被覆されたダイ部材5の硬質クロムメッキ層26を、リップ部LとなるHIPバー3のHIP層1と面一となるように研削加工した状態を示している。この実施形態に示すように、硬質クロムメッキ層26の一部をHIPバー3のHIP層1にダブらせることによって、HIP層1部分と硬質クロムメッキ層26(表面処理部)とが面一に加工でき、またHIPバー3とダイ本体部4との溶接部分が表面に出ることがなく、支持体2を含めHIP処理部と表面処理部とが一体化状態となる。   (A-1) and (a-2) of FIG. 7 show the hard chrome plating of the die member 5 coated with a thick film thickness W as shown in (c-1) and (c-2) of FIG. A state in which the layer 26 is ground so as to be flush with the HIP layer 1 of the HIP bar 3 to be the lip portion L is shown. As shown in this embodiment, by doubling a portion of the hard chrome plating layer 26 onto the HIP layer 1 of the HIP bar 3, the HIP layer 1 portion and the hard chrome plating layer 26 (surface treatment portion) are flush with each other. In addition, the welded portion between the HIP bar 3 and the die body portion 4 does not come out on the surface, and the HIP processing portion and the surface treatment portion including the support 2 are integrated.

上記のように硬質クロムメッキ層26をHIP層1と面一に研削加工すると共に必要に応じて所要形状に適宜切削し更に鏡面加工(バフを含む)することによって、塗工ダイ用の一対のダイ部材5,5を形成し、また片方のダイ部材5に塗工液供給路22及びマニホールド23を形成し、しかして図7の(b) に示すように、両ダイ部材5,5を所定間隔で対称状に突き合わせ接合して、両ダイ部材5,5間にダイ流路24を形成し、このダイ流路24の先端部側のリップ部L,Lを、両ダイ部材5,5におけるHIPバー3,3のHIP層1,1により形成することによって、塗工ダイAを製造する。なお、両ダイ部材5,5を所定間隔で対称状に突き合わせ接合する際、両ダイ部材5,5の夫々の合わせ面、或いは、リップ部L,Lの両ダイ部材5,5の夫々の合わせ面のみを鏡面研削加工しても良い。これにより、リップ部L,Lのエッジ部を、高精度のシャープエッジ(例えば、1μm単位)に仕上げることが可能となり、僅かな衝撃で生じる「カケ」の発生を低減させることができる。   As described above, the hard chrome plating layer 26 is ground to the same level as the HIP layer 1 and, if necessary, appropriately cut into a required shape and further mirror-finished (including buffing), thereby making a pair of coating dies. The die members 5 and 5 are formed, and the coating liquid supply path 22 and the manifold 23 are formed in one die member 5, and as shown in FIG. The die flow path 24 is formed between the two die members 5 and 5 by butt-joining symmetrically at intervals, and the lip portions L and L on the tip end side of the die flow path 24 are connected to both the die members 5 and 5. The coating die A is manufactured by forming the HIP layers 1 and 3 of the HIP bars 3 and 3. When the two die members 5 and 5 are butt-joined symmetrically at a predetermined interval, the mating surfaces of the die members 5 and 5 or the die members 5 and 5 of the lip portions L and L are mated. Only the surface may be mirror-polished. Thereby, it becomes possible to finish the edge part of the lip | rip parts L and L to a highly accurate sharp edge (for example, 1 micrometer unit), and generation | occurrence | production of the "debris" which arises by a slight impact can be reduced.

図8は、前述のようにHIPバー3をダイ本体部4に溶接によって接合することにより形成した一対のダイ部材5,5からなるTダイBを示したもので、(a-1) は各一方のダイ部材5を示す正面図、(a-2) は(a-1) のY−Y線断面図である。各ダイ部材5の内面側には、ダイ流路部24a、マニホールド部23a、流入口部27aを夫々形成すると共に、ダイ流路部24aの先端部にHIP層1によってリップ部Lを形成し、更にリップ部L以外のダイ流路24a(マニホールド部23aを含む)を形成するダイ部材5の内壁面に硬質クロムメッキ層26又は無電解ニッケルメッキ層を被覆形成し、しかして図8の(b) に示すように一対のダイ部材5,5を突き合わせ配置することによって、両ダイ部材5,5間にダイ流路24を形成すると共に、ダイ流路24の入口部に溶融樹脂流入口27を、またその中間部にマニホールド23を形成し、またダイ流路24の先端部にHIP層1,1によってリップ部L,Lを形成し、かくして簡単容易にTダイBを製造することができることになる。なお、上記TダイAの製造同様、一対のダイ部材5,5を突き合わせ配置する際、両ダイ部材5,5の夫々の合わせ面、或いは、リップ部L,Lの両ダイ部材5,5の夫々の合わせ面のみを鏡面研削加工しても良い。   FIG. 8 shows a T-die B composed of a pair of die members 5 and 5 formed by welding the HIP bar 3 to the die body portion 4 by welding as described above. The front view which shows the one die member 5, (a-2) is the YY sectional view taken on the line (a-1). On the inner surface side of each die member 5, a die flow path portion 24a, a manifold portion 23a, and an inflow port portion 27a are formed, and a lip portion L is formed by the HIP layer 1 at the tip of the die flow path portion 24a. Further, a hard chrome plating layer 26 or an electroless nickel plating layer is formed on the inner wall surface of the die member 5 that forms the die flow path 24a (including the manifold portion 23a) other than the lip portion L, and FIG. ), The die flow path 24 is formed between the die members 5 and 5, and a molten resin inlet 27 is provided at the inlet of the die flow path 24. In addition, the manifold 23 is formed in the middle portion thereof, and the lip portions L and L are formed by the HIP layers 1 and 1 at the tip end portion of the die flow path 24. Thus, the T die B can be easily and easily manufactured. Become. As in the manufacture of the T-die A, when the pair of die members 5 and 5 are arranged to face each other, the respective mating surfaces of the die members 5 and 5 or the die members 5 and 5 of the lip portions L and L Only the respective mating surfaces may be mirror-ground.

以上説明した本発明に係るTダイAや塗工ダイBによれば、ダイ部材5はダイ本体部4とHIPバー3とからなり、HIPバー3は、ダイ本体部4と同じ又は類似した材質の支持体2と、耐食性及び耐摩耗性の良好な合金粉末がHIP処理により支持体2に直接拡散接合されたHIP層1とからなるもので、HIPバー3の支持体2がダイ本体部4に溶接によって接合され、そのHIP層1によってリップ部Lが形成されているから、HIP層を形成するのに、ダイ素材の全体をHIP処理する必要がなく、ダイ素材の一部となるHIPバー3をあらかじめ形成しておいて、これをダイ本体部4に溶接によって接合すればよく、従ってダイ部材5の製作が容易となり、ダイ製品の製作コストの低減化を図ることができる。   According to the T die A and the coating die B according to the present invention described above, the die member 5 is composed of the die main body portion 4 and the HIP bar 3, and the HIP bar 3 is the same or similar material as the die main body portion 4. And a HIP layer 1 in which an alloy powder having good corrosion resistance and wear resistance is directly diffusion-bonded to the support 2 by HIP treatment, and the support 2 of the HIP bar 3 is the die body 4. Since the lip portion L is formed by the HIP layer 1 formed by welding, it is not necessary to perform the HIP process on the entire die material to form the HIP layer. 3 may be formed in advance and joined to the die body 4 by welding. Therefore, the die member 5 can be easily manufactured, and the manufacturing cost of the die product can be reduced.

また、ダイ部材5,5間に形成されるダイ流路24を全てHIP層によって形成しようとした場合は、ダイ製造コストが非常に高騰することになるが、リップ部L以外のダイ流路24を形成するダイ部材5の内壁面には、HIP処理よりはるかに安い硬質クロムメッキ層26又は無電解ニッケルメッキ層が被覆されるから、塗工液又は溶融樹脂との摩擦を低減することができながら、ダイの製造コストの軽減化が図られる。また硬質クロムメッキは、摩擦係数が小さく非常に滑りが良好で、他の物質が付着し難く、防錆力をもったメッキであるため、溶融樹脂や塗工液との摩擦を低減し、摩擦性の強い溶融樹脂や塗工液を使用した場合でも、ダイ流路24の接液部に傷、摩耗を発生することがなく、永続的に使用することができる。また、無電解ニッケルメッキ層は、母材との密着性が良く、硬質クロムメッキ層26と同等の優れた耐摩耗性を有する。   In addition, when all the die flow paths 24 formed between the die members 5 and 5 are formed by the HIP layer, the die manufacturing cost will be very high, but the die flow paths 24 other than the lip portion L are increased. Since the inner wall surface of the die member 5 that forms the surface is coated with the hard chromium plating layer 26 or the electroless nickel plating layer that is much cheaper than the HIP treatment, it is possible to reduce friction with the coating liquid or the molten resin. However, the manufacturing cost of the die can be reduced. Hard chrome plating has a small coefficient of friction, very good sliding, prevents other substances from adhering, and has rust-preventing power, reducing friction with molten resin and coating liquid, and reducing friction. Even when a highly melted resin or coating solution is used, the wetted part of the die channel 24 is not damaged or worn, and can be used permanently. Further, the electroless nickel plating layer has good adhesion to the base material and has excellent wear resistance equivalent to that of the hard chrome plating layer 26.

また、ダイ部材5のリップ部Lは、合金粉末がHIP処理によって支持体2に直接拡散接合したHIP層1により形成されたものであるから、超硬合金製のものを取り付けて構成されるリップ部に比べて、母材との接合強度が格段に大きくなる。またリップ部Lを形成するHIP層1は、少なくとも数ミリから数十ミリの厚さを有するものであるため、補修研削加工によって繰り返し使用可能で、HIP層1がなくなるまで何度でも加工できる。硬質クロムメッキ層26は、安価で復元することができる。   Further, the lip portion L of the die member 5 is formed by the HIP layer 1 in which the alloy powder is directly diffusion bonded to the support 2 by HIP processing. Compared with the portion, the bonding strength with the base material is remarkably increased. Further, since the HIP layer 1 forming the lip L has a thickness of at least several millimeters to several tens of millimeters, it can be used repeatedly by repair grinding and can be processed any number of times until the HIP layer 1 disappears. The hard chrome plating layer 26 can be restored at low cost.

以上の実施形態では、リップ部L以外のダイ流路24を形成するダイ部材5の内壁面に硬質クロムメッキ層26を被覆するようにしているが、この硬質クロムメッキ層26に代え、無電解ニッケルメッキ処理によって、リップ部L以外のダイ流路24を形成するダイ部材5内壁面にニッケルメッキ層を被覆形成してもよい。無電解ニッケルメッキ処理は、電気を使用しないでメッキする処理のことで、メッキの膜厚が均一につくため、メッキ液が浸漬していれば、複雑な形状、寸法精度を有するものに適している。この無電解ニッケルメッキ処理により形成されるメッキ層は、母材との密着性が良く、メッキ膜厚が均一となり、また硬質クロムメッキ層26と同等の優れた耐摩耗性を有し、そしてまた耐食性も優れている。   In the above embodiment, the hard chrome plating layer 26 is coated on the inner wall surface of the die member 5 that forms the die flow path 24 other than the lip portion L. A nickel plating layer may be formed on the inner wall surface of the die member 5 that forms the die flow path 24 other than the lip portion L by nickel plating. Electroless nickel plating is a plating process that does not use electricity. The plating film thickness is uniform, so it is suitable for those with complex shapes and dimensional accuracy if the plating solution is immersed. Yes. The plating layer formed by this electroless nickel plating treatment has good adhesion to the base material, the plating film thickness is uniform, and has excellent wear resistance equivalent to the hard chrome plating layer 26, and also Corrosion resistance is also excellent.

また、本発明に係るダイ(塗工ダイAやTダイB)は、通常は製作過程において新しいダイ本体部4にHIPバー取付用の係合段部4aを形成しておき、この係合段部4aにHIPバー3を一体接合して形成されるが、既存のダイの所要部にHIPバー3を取り付けることにより、HIPバー3付きのダイに変身(再生)させることができる。その場合、既存のダイの所要部にHIPバー取付用の係合段部を機械加工などでアンダーカットすることによって形成し、その係合段部にHIPバーを係合して好ましくはロウ付け又は電子ビーム溶接もしくはレーザービーム溶接によって接合する。このようにHIPバー3付きのダイに変身(再生)することにより、万一の傷や摩耗に対する保守においても、ミリ単位のHIP層1は、高硬度の維持ができる。   Further, the die according to the present invention (coating die A or T die B) is usually formed with an engaging step portion 4a for attaching a HIP bar on a new die main body portion 4 in the manufacturing process. The HIP bar 3 is integrally joined to the part 4a, but by attaching the HIP bar 3 to a required part of an existing die, it can be transformed (reproduced) into a die with the HIP bar 3. In that case, an engagement step for attaching the HIP bar is formed by cutting the required portion of the existing die by machining or the like, and the HIP bar is engaged with the engagement step, preferably brazing or Join by electron beam welding or laser beam welding. By transforming (reproducing) into a die having the HIP bar 3 in this way, the HIP layer 1 in millimeters can maintain high hardness even in the event of maintenance against damage or abrasion.

1 HIP層
2 支持体
3 HIPバー
4 ダイ本体部
5 ダイ部材
L リップ部
12 カプセル素材
13 合金粉末用凹部
14 中子型
15 カプセル
16 粉末供給口
17 合金粉末
19 HIP装置の処理室
24 ダイ流路
26 硬質クロムメッキ層
DESCRIPTION OF SYMBOLS 1 HIP layer 2 Support body 3 HIP bar 4 Die body part 5 Die member L Lip part 12 Capsule material 13 Recess for alloy powder 14 Core mold 15 Capsule 16 Powder supply port 17 Alloy powder 19 Processing chamber 24 of HIP apparatus Die flow path 26 Hard chrome plating layer

Claims (7)

複数のダイ部材間に形成されるダイ流路の先端部にリップ部を有し、ダイ流路に供給される塗工液又は溶融樹脂をリップ部から吐出するダイにおいて、ダイ部材は、ダイ本体部とHIPバーとからなり、HIPバーは、ダイ本体部と同じ又は類似した材質の支持体と、耐食性及び耐摩耗性の良好な合金粉末がHIP処理によって支持体に直接拡散接合されたHIP層とからなるもので、このHIPバーの支持体側がダイ本体部に溶接により接合され、そのHIP層によって前記リップ部が形成されてなるダイ。   In a die having a lip portion at a tip portion of a die flow path formed between a plurality of die members and discharging a coating liquid or molten resin supplied to the die flow path from the lip portion, the die member is a die body The HIP bar consists of a support made of the same or similar material as the die body, and an HIP layer in which an alloy powder having good corrosion resistance and wear resistance is directly diffusion bonded to the support by HIP processing. The die in which the support side of the HIP bar is joined to the die body by welding and the lip portion is formed by the HIP layer. 前記リップ部以外のダイ流路を形成するダイ部材の内壁面に硬質クロムメッキ層又は無電解ニッケルメッキ層が被覆されてなる請求項1に記載のダイ。   The die according to claim 1, wherein a hard chromium plating layer or an electroless nickel plating layer is coated on an inner wall surface of a die member that forms a die flow path other than the lip portion. HIP処理される合金粉末は、ニッケル系合金又はコバルト系合金からなる請求項1又は2に記載のダイ。   The die according to claim 1 or 2, wherein the alloy powder to be subjected to HIP treatment is made of a nickel-based alloy or a cobalt-based alloy. HIPバーの支持体は、オーステナイト/フェライトの2相系ステンレスからなる請求項1〜3の何れかに記載のダイ。   4. The die according to claim 1, wherein the support of the HIP bar is made of austenite / ferrite duplex stainless steel. 請求項1〜4の何れかに記載のダイの製造方法であって、耐食性及び耐摩耗性の良好な合金粉末をHIP処理により支持体に対し直接拡散接合することによってHIPバーを形成し、このHIPバーの支持体側をダイ本体部に溶接により接合することによってダイ部材を形成し、このHIPバーのHIP層によって前記リップ部を形成するようにしたダイの製造方法。   The die manufacturing method according to any one of claims 1 to 4, wherein an HIP bar is formed by directly diffusion-bonding an alloy powder having good corrosion resistance and wear resistance to a support by HIP treatment. A die manufacturing method in which a die member is formed by welding a support side of a HIP bar to a die main body portion, and the lip portion is formed by a HIP layer of the HIP bar. 前記リップ部以外のダイ流路を形成するダイ部材の内壁面に硬質クロムメッキ層又は無電解ニッケルメッキ層を被覆するようにした請求項5に記載のダイの製造方法。   The die manufacturing method according to claim 5, wherein a hard chromium plating layer or an electroless nickel plating layer is coated on an inner wall surface of a die member that forms a die flow path other than the lip portion. HIPバーの支持体側は、ダイ本体部に対しロウ付け又は電子ビーム溶接もしくはレーザービーム溶接によって接合してなる請求項5又は6に記載のダイの製造方法。   The die manufacturing method according to claim 5 or 6, wherein the support body side of the HIP bar is joined to the die body portion by brazing, electron beam welding or laser beam welding.
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