JP2013110306A - Deposition device and installation method of vaporizer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a deposition apparatus which eases a height limit for installation in a building when installed and enables easy maintenance, and to provide an installation method of a vaporizer.SOLUTION: A deposition apparatus is composed of: a liquid material supply system for deposition; a vaporizer 30a for mixing a liquid material with a carrier gas and vaporizing the mixture; a deposition chamber 40a where a material vaporization gas discharged from the vaporizer 30a is flowed to a substrate to deposit a film; and a material vaporization gas supply pipeline 50a for supplying the gas from the vaporizer 30a to the deposition chamber. The vaporizer 30a is arranged in parallel with a side surface of the deposition chamber 40a.

Description

  The present invention relates to a film forming apparatus and a vaporizer installation method, and in particular, a film formation chamber and a vaporizer are arranged in parallel, and a floor surface on which the vaporizer is installed and the film formation chamber are installed. The present invention relates to a film forming apparatus having a common floor surface and a method for installing a vaporizer.

  2. Description of the Related Art Conventionally, in a film forming apparatus that forms a surface of a semiconductor wafer using a CVD apparatus including an MOCVD apparatus, a carrier gas containing a film forming liquid material is supplied to the vaporizer and the raw material is vaporized in the vaporizer. Technology is known.

In such a vaporizer, a heater is disposed on the outer circumference of the vaporizer or on the outer circumference of a pipe for supplying the carrier gas into the vaporizer, and the raw material is vaporized by the heater heat.
Further, in Patent Document 1, a liquid raw material is introduced into a carrier gas, and the micron order or less (1
The liquid raw material that has been refined to a micron or less) is dispersed in a carrier gas (hereinafter, the carrier gas in which the liquid raw material is dispersed is referred to as a raw material gas). A technique for forming a film in a film chamber is disclosed. At this time, means for cooling the outlet is provided for the purpose of preventing only the solvent from being evaporated and causing the outlet to be clogged. Further, in order to disperse the liquid raw material as smaller particles in the carrier gas, the carrier gas flow rate is preferably set to 50 to 340 m / sec.
However, when film formation is performed by the above technique, ripples may occur on the surface of the film. In addition, the presence of particles is observed in the film or on the surface. Furthermore, the composition of the film may deviate from the target composition. In addition, the presence of particles is observed in the film or on the surface. Furthermore, the composition of the film may deviate from the target composition. Also, the carbon content may increase.

FIG. 3 is a diagram of a conventional film forming apparatus. In FIG. 3, the film forming apparatus 101 has a structure in which a vaporizer 30b is disposed on the upper side of the film forming chamber 40b and connected by a material vaporized gas supply pipe 50b.
FIG. 4 is a diagram of a conventional vaporizer. The conventional vaporizer is configured by sequentially connecting the dispersion unit main body 8, the connection unit 23, and the vaporization unit 22 in the downward direction.

WO02 / 058141 Publication

  Conventional film deposition equipment has a vaporizer placed above the film deposition chamber, which requires a high installation in the building, which requires building construction costs, and vaporization when maintenance is performed. Since the container is at a high position, there is a problem that maintenance is complicated and work time is required.

  An object of the present invention is to provide a deposition apparatus and a vaporizer installation method in which, when installed, the height restriction of installation in a building is relaxed and maintenance (maintenance) is simple. .

  According to a first aspect of the present invention, a film forming apparatus includes a film forming liquid material supply system, a vaporizer that mixes and vaporizes the liquid material with a carrier gas, and a material vaporized gas that exits the vaporizer flows to a substrate. A film forming apparatus comprising: a film forming chamber for forming a film; and a material vaporizing gas supply pipe for supplying a gas from the vaporizer to the film forming chamber, wherein the vaporizer includes the vaporizer. The film forming apparatus is arranged in parallel with a side surface of the film chamber.

  The film forming apparatus according to claim 2 of the present invention is characterized in that a floor surface on which the vaporizer is installed and a floor surface on which the film forming chamber is installed are common. A film forming apparatus.

  The film forming apparatus according to claim 3 of the present invention is characterized in that the vaporizer has a structure in which a dispersion unit body, a connection unit, and a vaporization unit are sequentially connected in a direction perpendicular to the floor surface. A film forming apparatus according to claim 1 or 2. Also, if necessary, an internal heater is installed in the material vaporization gas supply pipe that is a vaporization transport pipe connected to the vaporizer, and the amount of heat energy supplied from the outer wall of the material vaporization gas supply pipe that is the vaporization transport pipe is compensated. It has the characteristic that it can be set as the structure which can also complete the vaporization of a raw material more.

According to a fourth aspect of the present invention, there is provided a vaporizer installation method in which a vaporizer in which a dispersion unit main body, a connection unit, and a vaporization unit are sequentially stacked (connected) upward in a vertical direction from a floor surface is formed. Placed parallel to the side of the room,
The vaporizer installation method is characterized in that material vaporized gas is supplied from the vaporizer to the film forming chamber through a material vaporized gas supply pipe. By doing in this way, it is expected that the flow of the air current has a spout-like aspect, and smoother vaporization proceeds.

  According to the film forming apparatus according to the first, second, and third aspects of the present invention, it is possible to provide a film forming apparatus in which the restriction on the height of installation in a building is relaxed and maintenance is simple.

  According to the vaporizer installation method according to claim 4 of the present invention, the height limit of installation of the film forming apparatus in the building has been relaxed, and maintenance (maintenance) can be simplified. .

  ADVANTAGE OF THE INVENTION According to this invention, the height restriction of the installation in a building was eased, and the installation method of the film-forming apparatus and vaporizer which are easy to maintain (maintenance) can be provided.

The figure of the film-forming apparatus by Example 1 of this invention. Sectional drawing of the vaporizer | carburetor used for the film-forming apparatus of Example 1 of FIG. It is a figure of the conventional film-forming apparatus. Sectional drawing of the vaporizer | carburetor used for the conventional film-forming apparatus of FIG.

  The film forming apparatus of the present invention includes a film forming liquid material supply system, a vaporizer that mixes and vaporizes the liquid material with a carrier gas, and a material vaporized gas that exits the vaporizer flows to the substrate to form a film. A film forming apparatus, and a material vaporizing gas supply pipe for supplying gas from the vaporizer to the film forming chamber, wherein the vaporizer includes a side surface of the film forming chamber, The film forming apparatus is characterized by being arranged in parallel.

  2. The film forming apparatus according to claim 1, wherein the floor surface on which the vaporizer is installed and the floor surface on which the film forming chamber is installed are common. It is.

  Further, in the film forming apparatus according to the present invention, the structure of the vaporizer is configured such that a dispersion unit main body, a connection unit, and a vaporization unit are sequentially connected in a vertical direction from the floor surface. Or it is the film-forming apparatus of 2.

In addition, the vaporizer installation method of the present invention is arranged in parallel with the side surface of the film formation chamber,
In addition, the structure of the vaporizer is a structure in which the dispersion unit main body, the connection unit, and the vaporization unit are sequentially connected to the upper side in the vertical direction, and the material vaporized gas is supplied from the vaporizer to the material vaporized gas supply pipe. The vaporizer is installed in the film forming chamber.

  Embodiments of the film forming apparatus and the vaporizer installation method of the present invention will be described below.

Example 1
FIG. 1 is a diagram of a film forming apparatus 100 of the present invention. The film forming apparatus 100 includes a film forming liquid material supply system (not shown), a vaporizer 30a that mixes and vaporizes the liquid material with a carrier gas, and a material vaporized gas that exits the vaporizer 30a. A film forming chamber 40a for forming a film and a material vaporizing gas supply pipe 50a for supplying a gas from the vaporizer to the film forming chamber 40a.

Here, the vaporizer 30a is a film forming apparatus in which the vaporizer 30a is arranged in parallel with the side surface of the film forming chamber 40a. With this structure, the height of the film forming apparatus 100 is in the range of 1,5 to 1,6 meters, and the film forming apparatus 100 can be easily maintained and maintained.
In the conventional film forming apparatus 101 of FIG. 3, since the vaporizer 30 is located above the film forming chamber 40b, the height of the entire apparatus is 2 meters or more, and maintenance work is difficult.

  FIG. 2 is a cross-sectional view of the vaporizer 30a used in the film forming apparatus of the first embodiment shown in FIG. 1. The vaporizer 30a has a structure in which the dispersion portion 8a and the connection portion 23a are perpendicular to the floor surface 70. And the vaporizing section 22a are sequentially connected.

  According to the deposition apparatus and vaporizer installation method of the present invention, when installed, the deposition height limit in the building is relaxed and the maintenance is simple, and the vaporization apparatus The installation method of the vessel can be provided, and the production efficiency of the semiconductor manufacturing apparatus can be increased.

DESCRIPTION OF SYMBOLS 1 Dispersion part main body 2 Gas passage 3 Carrier gas 4 Gas inlet 5a 1st thin film formation raw material solution 5b 2nd thin film formation raw material solution 5c 3rd thin film formation raw material solution 5d 4th thin film formation raw material solution 5e 5th Thin film forming raw material solution 5f Sixth thin film forming raw material solution 6 Raw material supply hole 7 Gas outlet 8, 8a Dispersing part main body 9a, 9b, screw 10, 10a, 10b Center rod 11 O-ring 16 Stopper 17 Notch 18 Cooling water 20 Vapor soot 21, 21a Heating means 22, 22a Vaporization section 23, 23a Connection section 8, 8a Dispersion section main body 2424a Joint 40a, 30b Vaporizer 40a, 40b Deposition chamber 41a, 41b Substrate 42a, 42b Substrate 50a, 50b Material Vaporized gas supply pipes 60a and 60b Exhaust pipe 70 Floor 5g Seventh thin film forming raw material solution 5h Eighth thin film forming raw material solution 100, 101 Deposition system

Claims (4)

A liquid material supply system for film formation;
A vaporizer that mixes and vaporizes the liquid material with a carrier gas;
A film formation chamber for forming a film by flowing a material vaporized gas from the vaporizer to a substrate;
A film forming apparatus configured with a material vaporized gas supply pipe for supplying the gas from the vaporizer to the film forming chamber,
The film forming apparatus, wherein the vaporizer is disposed in parallel with a side surface of the film forming chamber. 2. The film forming apparatus according to claim 1, wherein a floor surface on which the vaporizer is installed and a floor surface on which the film forming chamber is installed are common. 3. The film forming apparatus according to claim 1, wherein the vaporizer has a structure in which a dispersion unit body, a connection unit, and a vaporization unit are sequentially connected in a direction perpendicular to the floor surface. Place the vaporizer in parallel with the side of the deposition chamber,
In addition, the structure of the vaporizer is a structure in which the dispersion unit main body, the connection unit, and the vaporization unit are sequentially connected to the upper side in the vertical direction, and the material vaporized gas is supplied from the vaporizer to the material vaporized gas supply pipe. The vaporizer is installed in the film forming chamber.

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