JP2013108024A - Epoxy resin composition for sealing and electronic component device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing, which is excellent in reliability of moisture resistance, as well as moldability and solder resistance, and an electronic component device including an element sealed with a hardened product of the epoxy resin composition.SOLUTION: The epoxy resin composition for sealing contains: (A) an epoxy resin; (B) a phenol resin hardener; (C) an inorganic filler; and (D) a silane compound represented by general formula (1). The component (D) has a purity of 98.5-99.5 mass%, a content of 1-5C monovalent alcohol of 1,000-2,500 ppm, and a content of a silane compound having no mercapto group in the molecule of less than 8,000 ppm.

Description

  The present invention relates to a sealing epoxy resin composition and an electronic component device.

In the field of electronic component devices in recent years, in order to reduce the size, weight, and performance of devices, high-density mounting of devices, finer wiring, multilayering, and multi-pins, the area occupied by the device package Is increasing. At the same time, the trend toward thinner packages for electronic component devices is advancing, and as such development progresses, the requirements for sealing materials are becoming increasingly severe.
In general, epoxy resin compositions for sealing electronic parts such as semiconductors are composed of 3-mercaptopropyltrimethoxy for the purpose of improving the adhesion between inorganic substances such as inorganic fillers and elements and organic substances such as epoxy resins and phenol resins. Various coupling agents such as silane, 3-anilinopropyltriethoxysilane, and 3-glycidoxypropyltrimethoxysilane have been added to the epoxy resin composition.

  For example, in Patent Document 1 and Patent Document 2, a sealing material added with 3-mercaptopropyltrimethoxysilane is used for the purpose of improving solder reflow resistance, but the method described in Patent Document 1 and Patent Document 2 is used. However, solder resistance and formability were insufficient.

Japanese Patent Laid-Open No. 10-25335 JP 2009-249424 A

  The present invention has been made in view of such a situation, and has an element formed with an epoxy resin composition for sealing excellent in moldability and solder resistance, and excellent in moisture resistance reliability, and a cured product of the epoxy resin composition for sealing. An electronic component device in which is sealed is intended to be provided.

  As a result of intensive studies to solve the above problems, the present inventors have a purity of 98.5 to 99.5% by mass as a silane compound represented by the following general formula (1), and have 1 carbon atom. By adding to the epoxy resin composition for sealing, the content of monohydric alcohol of ˜5 is 1000 to 2500 ppm and the content of silane compound having no mercapto group in the molecule is less than 8000 ppm. The inventors have found that the object can be achieved, and have completed the present invention.

Such an object is achieved by the following present invention [1] to [4].
[1] An epoxy resin composition for sealing containing (A) an epoxy resin, (B) a phenol resin curing agent, (C) an inorganic filler, and (D) a silane compound represented by the following general formula (1) The component (D) has a purity of 98.5 to 99.5% by mass, a monohydric alcohol content of 1 to 5 carbon atoms of 1000 to 2500 ppm, and a mercapto in the molecule. An epoxy resin composition for sealing, wherein the content of a silane compound having no group is less than 8000 ppm.

（式中、Ｒ１は炭素数１〜５のアルキル基である。Ｒ２は炭素数１〜５のアルキル基である。ｍは１〜６の整数である。ｎは１〜３の正数である。）

(In the formula, R1 is an alkyl group having 1 to 5 carbon atoms. R2 is an alkyl group having 1 to 5 carbon atoms. M is an integer of 1 to 6. n is a positive number of 1 to 3. .)

[2] The component (A) is a biphenyl type epoxy resin represented by the following general formula (2), a phenol aralkyl type epoxy resin having a phenylene skeleton represented by the following general formula (3), and the following general formula (4) The sealing epoxy resin composition according to the above [1], comprising at least one epoxy resin selected from the group consisting of phenol aralkyl type epoxy resins having a biphenylene skeleton represented by formula (1).

（上記一般式（２）において、Ｒ^３〜Ｒ^６は水素原子及び炭素数１〜１０の置換もしくは無置換の炭化水素基から選ばれ、全てが同一でも互いに異なっていてもよい。ｎは０〜３の整数を示す。）

(In the general formula (2), R ^{3 to} R ⁶ are selected from a hydrogen atom and a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, and all may be the same or different from each other. N is 0. Represents an integer of ~ 3.)

（上記一般式（３）において、Ｒ^７〜Ｒ^９は水素原子及び炭素数１〜１０の置換もしくは無置換の炭化水素基から選ばれ、全てが同一でも互いに異なっていてもよい。ｎは０〜３の整数を示す。）

(In the general formula (3), R ^{7 to} R ⁹ are selected from a hydrogen atom and a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, and all may be the same or different from each other. N is 0. Represents an integer of ~ 3.)

（上記一般式（４）において、Ｒ^１０〜Ｒ^１８は水素原子及び炭素数１〜１０の置換もしくは無置換の炭化水素基から選ばれ、全てが同一でも互いに異なっていてもよい。ｎは０〜３の整数を示す。）

(In the general formula (4), R ^{10 to} R ¹⁸ are selected from a hydrogen atom and a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, and all may be the same or different from each other. N is 0. Represents an integer of ~ 3.)

[3] The above [1] or [2], wherein the component (B) includes at least one phenol resin selected from the group consisting of phenol aralkyl resins having a biphenylene skeleton represented by the following general formula (5). The epoxy resin composition for sealing as described in 2.

（上記一般式（５）において、Ｒ^１９〜Ｒ^２７は水素原子及び炭素数１〜１０の置換もしくは無置換の炭化水素基から選ばれ、全てが同一でも互いに異なっていてもよい。ｎは０〜３の整数を示す。）

(In the above general formula (5), R ^{19 to} R ²⁷ are selected from a hydrogen atom and a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, and all may be the same or different from each other. N is 0. Represents an integer of ~ 3.)

[4] An electronic component device, wherein an element is sealed with a cured product of the sealing epoxy resin composition according to any one of [1] to [3].

ADVANTAGE OF THE INVENTION According to this invention, the epoxy resin composition for sealing excellent in a moldability and solder resistance, and excellent in moisture-proof reliability can be obtained.
In addition, if this sealing epoxy resin composition is used to seal an electronic component such as an IC or LSI, an electronic component device having excellent reliability can be obtained.

It is the figure which showed the cross-sectional structure about an example of the electronic component apparatus using the epoxy resin composition for sealing which concerns on this invention.

The epoxy resin composition for sealing of the present invention (hereinafter sometimes simply referred to as “epoxy resin composition”) includes (A) an epoxy resin, (B) a phenol resin curing agent, (C) an inorganic filler, and (D) a silane compound represented by the general formula (1), wherein the component (D) has a predetermined purity, a monohydric alcohol content of 1 to 5 carbon atoms, and a mercapto group in the molecule. It has the content of the silane compound which does not have.
Thereby, the epoxy resin composition excellent in moldability, solder resistance, and moisture resistance reliability can be obtained.
The electronic component device of the present invention is characterized in that an element is sealed with a cured product of the above-described epoxy resin composition. Thereby, the electronic component apparatus excellent in reliability can be obtained.
Hereinafter, the present invention will be described in detail.

First, the epoxy resin composition of the present invention will be described.
The epoxy resin of the component (A) used in the epoxy resin composition of the present invention is not particularly limited as long as it is generally used in the epoxy resin composition. For example, a phenol novolak type epoxy resin, an orthocresol novolak Phenols such as epoxy resin, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, and / or naphthols such as α-naphthol, β-naphthol, dihydroxynaphthalene, and formaldehyde, acetaldehyde, propion Epoxidized novolak resin obtained by condensation or cocondensation with a compound having an aldehyde group such as aldehyde, benzaldehyde, salicylaldehyde in the presence of an acidic catalyst, bisphenol A, bisphenol Diglycidyl ethers such as diol F, bisphenol S and bisphenol A / D, biphenyl type epoxy resins which are diglycidyl ethers of alkyl-substituted or unsubstituted biphenol, phenols and / or naphthols and dimethoxyparaxylene or bis (methoxy Epoxy product of phenol aralkyl resin synthesized from (methyl) biphenyl, stilbene type epoxy resin, hydroquinone type epoxy resin, glycidyl ester type epoxy resin obtained by reaction of polybasic acid such as phthalic acid and dimer acid and epichlorohydrin, diaminodiphenylmethane, Diglycolamine type epoxy resin obtained by reaction of polyamine such as isocyanuric acid and epichlorohydrin, epoxidized product of cocondensation resin of dicyclopentadiene and phenols Clopentadiene type epoxy resin, epoxy resin having a naphthalene ring, triphenolmethane type epoxy resin, trimethylolpropane type epoxy resin, terpene modified epoxy resin, a line obtained by oxidizing 1-alkene bond with peracid such as peracetic acid Aliphatic epoxy resins, alicyclic epoxy resins, and epoxy resins obtained by modifying these epoxy resins with silicone, acrylonitrile, butadiene, isoprene-based rubber, polyamide-based resin, and the like. You may use combining more than a seed.

  Among these, from the viewpoint of moldability and adhesiveness, a biphenyl type epoxy resin represented by the following general formula (2), a phenol aralkyl type epoxy resin having a phenylene skeleton represented by the following general formula (3), and the following general formula ( A phenol aralkyl type epoxy resin having a biphenylene skeleton represented by 4) is preferred.

（上記一般式（２）において、Ｒ^３〜Ｒ^６は水素原子及び炭素数１〜１０の置換もしくは無置換の炭化水素基から選ばれ、全てが同一でも互いに異なっていてもよい。ｎは０〜３の整数を示す。）

(In the general formula (2), R ^{3 to} R ⁶ are selected from a hydrogen atom and a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, and all may be the same or different from each other. N is 0. Represents an integer of ~ 3.)

（上記一般式（３）において、Ｒ^７〜Ｒ^９は水素原子及び炭素数１〜１０の置換もしくは無置換の炭化水素基から選ばれ、全てが同一でも互いに異なっていてもよい。ｎは０〜３の整数を示す。）

(In the general formula (3), R ^{7 to} R ⁹ are selected from a hydrogen atom and a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, and all may be the same or different from each other. N is 0. Represents an integer of ~ 3.)

（上記一般式（４）において、Ｒ^１０〜Ｒ^１８は水素原子及び炭素数１〜１０の置換もしくは無置換の炭化水素基から選ばれ、全てが同一でも互いに異なっていてもよい。ｎは０〜３の整数を示す。）

(In the general formula (4), R ^{10 to} R ¹⁸ are selected from a hydrogen atom and a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, and all may be the same or different from each other. N is 0. Represents an integer of ~ 3.)

R < ³ > -R < ⁶ > in the said General formula (2) is a C1-C10 alkyl group, such as a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group, an isobutyl group, a methoxy group, ethoxy Groups, propoxy groups, butoxy groups, etc., C1-C10 alkoxy groups, phenyl groups, tolyl groups, xylyl groups, etc. aryl groups, and benzyl groups, phenethyl groups, etc. Among them, a hydrogen atom or a methyl group is preferable. Examples of the biphenyl type epoxy resin represented by the general formula (2) include 4,4′-bis (2,3-epoxypropoxy) biphenyl or 4,4′-bis (2,3-epoxypropoxy) -3,3. Reaction of epoxy resin based on ', 5,5'-tetramethylbiphenyl, epichlorohydrin and 4,4'-biphenol or 4,4'-(3,3 ', 5,5'-tetramethyl) biphenol Epoxy resin obtained by the above-mentioned process. Among them, an epoxy resin mainly composed of 4,4′-bis (2,3-epoxypropoxy) -3,3 ′, 5,5′-tetramethylbiphenyl is more preferable. Preferably, for example, YX-4000K, YX-4000H (both are trade names manufactured by Mitsubishi Chemical Corporation) and the like are commercially available. When this biphenyl type epoxy resin is used, improvement in solder resistance can be expected by improving adhesion to a die pad or a lead frame. The blending amount is preferably 20% by mass or more, more preferably 30% by mass or more, and further preferably 50% by mass or more based on the total amount of the epoxy resin in order to exhibit the performance.

R ^{7 to} R ⁹ in the general formula (3) are each an alkyl group having 1 to 10 carbon atoms such as a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group, or an isobutyl group, a methoxy group, and an ethoxy group. Groups, propoxy groups, butoxy groups, etc., C1-C10 alkoxy groups, phenyl groups, tolyl groups, xylyl groups, etc. aryl groups, and benzyl groups, phenethyl groups, etc. Among them, a hydrogen atom or a methyl group is preferable. As the phenol aralkyl type epoxy resin having a phenylene skeleton represented by the general formula (3), an epoxy resin having n = 0 as a main component is more preferable. For example, NC-2000 (trade name, manufactured by Nippon Kayaku Co., Ltd.) Etc. are available as commercial products. When the phenol aralkyl type epoxy resin having this phenylene skeleton is used, the distance between cross-linking points is widened, so that the elastic modulus of the cured product can be reduced, and improvement in solder resistance can be expected. The blending amount is preferably 10% by mass or more, more preferably 20% by mass or more with respect to the total amount of the epoxy resin in order to exhibit the performance.

R ^{10 to} R ¹⁸ in the general formula (4) are a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group, an isobutyl group or the like, an alkyl group having 1 to 10 carbon atoms, a methoxy group, or an ethoxy group. Groups, propoxy groups, butoxy groups, etc., C1-C10 alkoxy groups, phenyl groups, tolyl groups, xylyl groups, etc. aryl groups, and benzyl groups, phenethyl groups, etc. Among them, a hydrogen atom or a methyl group is preferable. As the phenol aralkyl type epoxy resin having a biphenylene skeleton represented by the general formula (4), an epoxy resin having n = 0 as a main component is more preferable. For example, NC-3000L (trade name, manufactured by Nippon Kayaku Co., Ltd.) Etc. are available as commercial products. When the phenol aralkyl type epoxy resin having this biphenylene skeleton is used, the distance between cross-linking points is widened, so that the elastic modulus of the cured product can be reduced, and improvement in solder resistance can be expected. The blending amount is preferably 10% by mass or more, more preferably 20% by mass or more with respect to the total amount of the epoxy resin in order to exhibit the performance.

  Biphenyl type epoxy resin represented by the general formula (2), phenol aralkyl type epoxy resin having a phenylene skeleton represented by the general formula (3), and phenol aralkyl type having a biphenylene skeleton represented by the general formula (4) Epoxy resins may be used alone or in combination of two or more. When used alone or in combination of two or more, their blending amount is preferably 50% by mass or more, more preferably 70% by mass or more, based on the total amount of the epoxy resin.

Although it does not specifically limit as a compounding ratio of the whole epoxy resin of the (A) component used with the epoxy resin composition of this invention, It is 1 mass% or more and 15 mass% or less in all the epoxy resin compositions. Preferably, it is 2 mass% or more and 10 mass% or less.
When the blending ratio of the entire epoxy resin of the component (A) is not less than the above lower limit value, the fluidity at the time of melting of the epoxy resin composition can be improved. Moreover, the solder resistance of a molded article can be made favorable as it is below the said upper limit.

The phenol resin curing agent of component (B) used in the epoxy resin composition of the present invention is not particularly limited as long as it is generally used in epoxy resin compositions. For example, phenol novolak resin, cresol novolak resin Such as phenol, cresol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol, aminophenol and the like and / or naphthols such as α-naphthol, β-naphthol, dihydroxynaphthalene and aldehyde groups such as formaldehyde A resin obtained by condensing or co-condensing a compound having an acid with an acidic catalyst, a phenol aralkyl resin synthesized from phenols and / or naphthols and dimethoxyparaxylene or bis (methoxymethyl) biphenyl These may be used, and these may be used alone or in combination of two or more.

  Among these, from the viewpoint of fluidity and low hygroscopicity, a phenol aralkyl resin having a biphenylene skeleton represented by the following general formula (5) is preferable.

（上記一般式（５）において、Ｒ^１９〜Ｒ^２７は水素原子及び炭素数１〜１０の置換もしくは無置換の炭化水素基から選ばれ、全てが同一でも異なっていてもよい。ｎは０〜３の整数を示す。）

(In the general formula (5), R ^{19 to} R ²⁷ are selected from a hydrogen atom and a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, all of which may be the same or different. Indicates an integer of 3.)

R ^{19 to} R ²⁷ in the formula (5) may all be the same or different and have 1 to 10 carbon atoms such as a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group, and an isobutyl group. An alkyl group, a methoxy group, an ethoxy group, a propoxy group, a butoxy group and the like, an alkoxy group having 1 to 10 carbon atoms, a phenyl group, a tolyl group, a xylyl group and the like aryl group, and a benzyl group, It is selected from aralkyl groups having 7 to 10 carbon atoms such as phenethyl group, among which hydrogen atom and methyl group are preferable. Examples of the phenol aralkyl resin having a biphenylene skeleton represented by the general formula (5) include compounds in which R ^{19 to} R ²⁷ are all hydrogen atoms. Among them, a component having n of 0 from the viewpoint of melt viscosity Is preferably a mixture of condensates containing 50% by mass or more. As such a compound, MEH-7851SS (trade name, manufactured by Meiwa Kasei Co., Ltd.) is commercially available. When using this phenol aralkyl resin having a biphenylene skeleton, its blending amount is preferably 50% by mass or more, more preferably 70% by mass or more based on the total amount of the phenol resin curing agent in order to exhibit its performance. .

The blending ratio of the phenol curing agent of component (B) used in the epoxy resin composition of the present invention is not particularly limited, but is 0.5% by mass or more and 12% by mass or less in the total epoxy resin composition. Is preferably 1% by mass or more and 9% by mass or less.
When the blending ratio of the (B) component phenolic resin curing agent is equal to or higher than the lower limit, the fluidity at the time of melting of the epoxy resin composition can be improved. Moreover, the solder resistance of a molded article can be made favorable as it is below the said upper limit.

  The equivalent ratio of the (A) component epoxy resin and the (B) component phenol resin curing agent, that is, the ratio of the number of epoxy groups in the epoxy resin / the number of hydroxyl groups in the phenol resin curing agent is not particularly limited. In order to suppress the amount of unreacted material to be small, it is preferably set in the range of 0.5 to 2, and more preferably in the range of 0.6 to 1.5. Moreover, in order to obtain the epoxy resin composition excellent in moldability and reflow resistance, it is more preferable to set in the range of 0.8 to 1.2.

  The inorganic filler of component (C) used in the epoxy resin composition of the present invention is blended in the epoxy resin composition to reduce hygroscopicity, reduce linear expansion coefficient, improve thermal conductivity, and improve mechanical strength. For example, fused silica, crystalline silica, alumina, calcium silicate, calcium carbonate, potassium titanate, silicon carbide, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, fosterite, steatite, spinel, mullite , Powders such as titania, or beads formed by spheroidizing these, glass fibers, and the like. Furthermore, examples of the inorganic filler having a flame retardant effect include aluminum hydroxide, magnesium hydroxide, zinc borate, and zinc molybdate. These inorganic fillers may be used alone or in combination of two or more. Among the above inorganic fillers, fused silica is preferable from the viewpoint of reducing the linear expansion coefficient, and alumina is preferable from the viewpoint of high thermal conductivity, and the filler shape is spherical from the viewpoint of fluidity and mold wear during molding. Is preferred.

The blending amount of the inorganic filler (C) is 80% by mass or more and 96% by mass or less based on the entire epoxy resin composition from the viewpoints of improvement of moldability, hygroscopicity, reduction of linear expansion coefficient and improvement of mechanical strength. The range is preferably 82% by mass or more and 92% by mass or less, and more preferably 86% by mass or more and 90% by mass or less.
By making the compounding quantity of an inorganic filler (C) more than the said lower limit, the compounding quantity of the resin component which is a moisture absorption factor can be decreased, and the moisture absorption of the hardened | cured material of an epoxy resin composition can be restrained low. Moreover, a moldability can be made favorable by setting it as the said upper limit or less.

The component (D) used in the epoxy resin composition of the present invention is represented by the following general formula (1), has a purity of 98.5 to 99.5% by mass, and has 1 to 5 carbon atoms. It can be applied if the content of the hydric alcohol is 1000 to 2500 ppm and the content of the silane compound having no mercapto group in the molecule is less than 8000 ppm.
For example, the carbon number of the alkyl groups R ₁ and R ₂ in the general formula (1) can be selected from 1 to 5, and the carbon number of the monovalent alcohol contained is also selected from 1 to 5. be able to. Moreover, the alkylene group which couple | bonds a mercapto group and a silyl group can be selected from C1-C6. These compounds may be used alone or in combination of two or more.

（式中、Ｒ１は炭素数１〜５のアルキル基である。Ｒ２は炭素数１〜５のアルキル基である。ｍは１〜６の整数である。ｎは１〜３の正数である。）

(In the formula, R1 is an alkyl group having 1 to 5 carbon atoms. R2 is an alkyl group having 1 to 5 carbon atoms. M is an integer of 1 to 6. n is a positive number of 1 to 3. .)

  The component (D) used in the present invention has a purity of 98.5 to 99.5% by mass. By using such a high purity component (D), the adhesion between the organic resin component in the epoxy resin composition, the inorganic filler, and the insert part can be improved. Here, the purity of the component (D) can be measured, for example, by gas chromatography (GC).

The component (D) used in the present invention has a monovalent alcohol content of 1 to 5 carbon atoms of 1000 to 2500 ppm. Such a predetermined amount of monohydric alcohol causes the compound produced by the condensation reaction of alkoxysilanes to undergo solvolysis and returns to alkoxysilyl groups. Thereby, in the epoxy resin composition, the dispersibility of the component (D) can be improved, and the local increase in the molecular weight of the resin composition can be suppressed, so that the moldability can be improved. If the content of monohydric alcohol is less than 1000 ppm, this effect is not sufficient, and if it exceeds 2500 ppm, voids are generated in the molded product due to the large amount of volatile components, and solder resistance decreases. Will come to do.
Examples of the monohydric alcohol having 1 to 5 carbon atoms include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methyl-2-butanol, 1-pentanol, 2- Examples include pentanol, 3-pentanol, 2,2 dimethyl-1-propal, 1-methylbutanol, 2-methylbutanol, 3-methyl-1-butanol, and 3-methyl-2-butanol. Among these, alcohols having 1 to 3 carbon atoms are preferable, and methanol is more preferable among these. Thereby, the self-condensate of (D) component can be efficiently returned to a monomer, and purity can be improved.

Furthermore, the content of a silane compound that does not react with an epoxy resin and does not contain a mercapto group in the molecule is reduced to less than 8000 ppm. This makes it possible to efficiently form a chemical bond between the inorganic filler or the surfaces of various base materials and the organic resin component, thereby improving the solder resistance.
Furthermore, since the component (D) used in the present invention is sufficiently purified by distillation or the like, the moisture resistance reliability is improved. When the content of the silane compound containing no mercapto group in the molecule is 8000 ppm or more, the adhesion between the organic resin component in the epoxy resin composition, the inorganic filler, and the insert part is lowered.
Here, examples of the silane compound containing no mercapto group in the molecule include propyltrimethoxysilane (the following formula a), 3-methylthiopropyltrimethoxysilane (the following formula b), and 1,6-bis (trimethoxy). Silyl) hexane (formula c below). In this invention, the said effect can be expressed by making total content of these compounds in (D) component less than 8000 ppm.
C ₃ H ₇ Si (OCH ₃ ) ₃ (a)
_{CH 3 SC 3 H 6 Si (} OCH 3) 3 (b)
(CH ₃ O) ₃ SiC ₆ H ₁₂ Si (OCH ₃ ) ₃ (c)
In the component (D) used in the epoxy resin composition of the present invention, the content of monohydric alcohol and the content of silane compound not containing a mercapto group in the molecule are both measured by gas chromatography (GC). The peak area can be quantified.

  The method for preparing the component (D) having properties as used in the present invention is not particularly limited. For example, a silane that does not contain a mercapto group while suppressing self-condensation of the component (D) by vacuum distillation purification. It can prepare by the method of adjusting the content of the said monohydric alcohol by reducing the content of the compound to less than 8000 ppm and adding a monohydric alcohol having 1 to 5 carbon atoms to this distillation component.

In the epoxy resin composition of the present invention, the amount of the component (D) is preferably 0.05 to 2% by mass, particularly preferably 0.1 to 0.4% by mass, based on the total epoxy resin composition.
By setting the blending amount of the component (D) to be equal to or higher than the lower limit, the solder resistance of the molded product can be improved. Moreover, a moldability can be made favorable by setting it as the said upper limit or less.

  The said (D) component used in the epoxy resin composition of this invention can be used together with another silane coupling agent in the range by which the characteristic is not impaired. The silane coupling agent that can be used in combination refers to all silane compounds having an alkoxy group and an organic functional group such as an epoxy group in one molecule. For example, various silanes such as epoxy silane, amino silane, alkyl silane, ureido silane, and vinyl silane. Compounds. Examples of these include vinyltriethoxysilane, vinyltris (β-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltri Methoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropyltriethoxysilane, vinyltriacetoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropyltriethoxy Silane, γ-anilinopropyltrimethoxysilane, γ-anilinopropylmethyldimethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, γ- (β-aminoethyl) aminopropyldimethoxy Methylsilane, N- (trimethoxysilylpropyl) ethylenediamine, N- (dimethoxymethylsilylisopropyl) ethylenediamine, N-β- (N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane And silane coupling agents such as hexamethyldisilane and vinyltrimethoxysilane. These may be used alone or in combination of two or more.

  Usually, the coupling agent is mixed into the epoxy resin composition by integral blending. In the epoxy resin composition of the present invention, the component (D) is preheated to all or part of the epoxy resin or phenol resin. You may mix.

  Moreover, in the epoxy resin composition of this invention, you may process the inorganic filler surface with the said (D) component. The component (D) is considered to be effective in improving the adhesion at the interface by chemically bonding the inorganic filler and the organic component in the epoxy resin composition by being present on the surface of the inorganic filler. . For this reason, it is effective that the component (D) is present on the surface of the inorganic filler, more preferably adsorbed or immobilized. As a method of treating the surface of the inorganic filler with the component (D), for example, the component (D) is sprayed on the inorganic filler being stirred, and the mixture is further stirred and left at room temperature or heated. By doing so, a method of obtaining a surface-treated inorganic filler can be exemplified.

In the epoxy resin composition of the present invention, a curing accelerator can be used for the purpose of obtaining an epoxy resin composition having good curability and fluidity.
The curing accelerator that can be used in the present invention is generally used in an epoxy resin composition for sealing and is not particularly limited. For example, 1,8-diaza-bicyclo (5,4,0) undecene is used. Cycloamidine compounds such as -7, 1,5-diaza-bicyclo (4,3,0) nonene, 5,6-dibutylamino-1,8-diaza-bicyclo (5,4,0) undecene-7; Tertiary amine compounds such as benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol and their derivatives, 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, etc. Imidazole compounds and their derivatives, tributylphosphine, methyldiphenylphosphine, triphenyl Organic phosphines such as sphin, tris (4-methylphenyl) phosphine, diphenylphosphine and phenylphosphine, and 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethyl to these organic phosphines Benzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1
Quinone compounds such as 1,4-benzoquinone, organophosphorus compounds such as bisphenol A, bisphenol F, bisphenol S, compounds having intramolecular polarization formed by adding a compound having a π bond such as phenol resin, tetraphenylphosphonium tetraphenylborate And tetraphenylboron salts such as triphenylphosphine tetraphenylborate and derivatives thereof. These may be used alone or in combination of two or more.
Among these, from the viewpoint of moldability, an organic phosphorus compound is preferable, an organic phosphine and an adduct of an organic phosphine and a quinone compound are more preferable, and triphenylphosphine, tris (4-methylphenyl) phosphine, tris (4-methoxyphenyl). ) Adducts of tertiary phosphines such as phosphine and quinone compounds such as p-benzoquinone and 1,4-naphthoquinone are more preferred.

Although the compounding quantity of a hardening accelerator will not be restrict | limited especially if the hardening acceleration effect is achieved, 0.1-10 mass% is preferable with respect to an epoxy resin (A), More preferably, 1 ˜5 mass%.
By making the compounding quantity of a hardening accelerator more than the said lower limit, sclerosis | hardenability in a short time can be made favorable. Moreover, by setting it as the said upper limit or less, a hardening rate can be made appropriate and a molded article with favorable filling property can be obtained.

  A siloxane addition polymer can be added to the epoxy resin composition of the present invention for the purpose of obtaining an epoxy resin composition having good solder stress resistance and fluidity. The siloxane addition polymer is not particularly limited, and a conventionally known polymer can be used. For example, a part of the methyl substituent of dimethylsiloxane may be an alkyl group, an epoxy group, a carboxyl group, an amino group, or the like. Examples thereof include modified silicone oil substituted with a substituent.

One or two or more siloxane addition polymers can be mixed and used in a proportion of 0.1% by mass or more and 2% by mass or less based on the entire epoxy resin composition.
By setting the blending amount to be equal to or higher than the above lower limit value, a sufficiently low elastic modulus can be exhibited in the molded product, and the dispersibility of the release agent can be improved. Moreover, by setting it as the said upper limit or less, surface contamination can be suppressed and it can suppress that a resin bleed becomes long.

An anion exchanger may be added to the epoxy resin composition of the present invention from the viewpoint of improving the moisture resistance and high temperature storage characteristics of an element such as an IC. The anion exchanger is not particularly limited and conventionally known anion exchangers can be used. For example, hydrotalcite, hydrous oxide of an element selected from antimony, bismuth, zirconium, titanium, tin, magnesium, and aluminum These can be used, and these can be used alone or in combination of two or more. Among these, hydrotalcite and bismuth hydrous oxide represented by the following general formula (6) are preferable.
Mg _1-X Al _X (OH) ₂ (CO ₃ ) _{X / 2} · mH ₂ O (6)
(In the above general formula (6), 0 <X ≦ 0.5, m is a positive integer.)

The amount of the anion exchanger is not particularly limited as long as it is an amount sufficient to capture ionic impurities such as halogen ions, but it is 0.1 parts by mass or more with respect to 100 parts by mass of the epoxy resin of component (A). 30 parts by mass or less, preferably 1 part by mass or more and 10 parts by mass or less, more preferably 2 parts by mass or more and 5 parts by mass or less.
By setting the blending amount to be equal to or more than the above lower limit value, sufficient capture of ionic impurities can be achieved. Moreover, it can be made economical by setting it as the said upper limit or less.

Furthermore, the epoxy resin composition of the present invention contains a halogen atom such as brominated epoxy resin, antimony trioxide, antimony tetroxide, antimony pentoxide, antimony atom, nitrogen atom or phosphorus atom as other additives. Organic or inorganic compounds, flame retardants such as metal hydroxides, carbon black, organic dyes, organic pigments, colorants such as titanium oxide, red lead, bengara, imidazole, triazole, tetrazole, triazine, etc. and their derivatives, Adhesion promoters such as anthranilic acid, gallic acid, malonic acid, malic acid, maleic acid, aminophenol, quinoline, etc. and their derivatives, aliphatic acid amide compounds, dithiocarbamate, thiadiazole derivatives, etc. are blended as necessary. be able to.

  The epoxy resin composition of the present invention can be prepared by any method as long as various raw materials can be uniformly dispersed and mixed, but as a general method, raw materials of a predetermined blending amount are sufficiently mixed by a mixer or the like. Thereafter, a method of melting and kneading with a mixing roll, a kneader, an extruder or the like, followed by cooling and pulverization can be exemplified. It is easy to use if it is tableted with dimensions and mass that match the molding conditions.

  In addition, the epoxy resin composition of the present invention can be dissolved in various organic solvents and used as a liquid sealing epoxy resin composition. The liquid sealing epoxy resin composition is thinly applied onto a plate or film. Further, it can also be used as a sheet or film-like epoxy resin composition obtained by scattering an organic solvent under conditions such that the resin curing reaction does not proceed so much.

Next, the electronic component device of the present invention will be described.
The electronic component device of the present invention is characterized in that the element is sealed with the cured product of the epoxy resin composition of the present invention described above.
As an electronic component device obtained by sealing an element with the epoxy resin composition obtained in the present invention, an active element such as a semiconductor chip, transistor, diode, thyristor, capacitor, resistor, Examples thereof include an electronic component device in which an element such as a coil or the like is mounted and a necessary portion is sealed with the epoxy resin composition of the present invention.
As such an electronic component device, for example, an element is fixed on a copper lead frame, and the terminal part and the lead part of an element such as a bonding pad are connected by wire bonding or bump, and then the epoxy resin composition of the present invention is used. DIP (Dual Inline Package), PLCC (Plastic Leaded Chip Carrier), QFP (Quad Flat Package), SOP (Small Outline Package), SOJ (Small Outer Jap) Common resin-sealed ICs such as TSOP (Thin Small Outline Package), TQFP (Thin Quad Flat Package), and the like. In addition, a package in which chips such as MCP (Multi Chip Stacked Package) are stacked in multiple stages is also included.

The material of the lead frame sealed with the epoxy resin composition of the present invention is not particularly limited, and copper, copper alloy, 42 alloy (Fe-42% Ni alloy), or the like can be used.
The surface of the lead frame is made of, for example, pure copper strike plating, silver plating (mainly wire bonding portion or die pad portion at the tip of the inner lead), or nickel / palladium / gold multi-layer plating (PPF (Palladium Pre-Plated Frame)). It may be plated.

  FIG. 1 is a view showing a cross-sectional structure of an example of an electronic component device using the epoxy resin composition according to the present invention. On the die pad 3, the element 1 is laminated and fixed in two stages via a die bond material cured body 2. The electrode pads of the element 1 and the copper lead frame 5 are connected by bonding wires 4. The element 1 is sealed with a cured body 6 of an epoxy resin composition.

  As a method for sealing an element using the epoxy resin composition of the present invention, a low-pressure transfer molding method is the most common, but an injection molding method, a compression molding method, or the like may be used. When the epoxy resin composition is liquid or paste at normal temperature, a dispensing method, a casting method, a printing method, and the like can be given.

  In addition to a general sealing method for directly sealing an element with a resin, there is also a hollow package system in which an epoxy resin composition for sealing is not in direct contact with the element. An epoxy resin composition for a hollow package Can also be suitably used.

  EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in detail, this invention is not limited to these at all.

It shows below about the component used in Examples 1-6 and Comparative Examples 1-3.
(A) Component epoxy resin:
Epoxy resin 1: Biphenyl type epoxy resin having an epoxy equivalent of 185 g / eq and a melting point of 108 ° C. (trade name YX-4000K, manufactured by Mitsubishi Chemical Corporation). In the general formula (2), R3 to R6 have a structure in which they are methyl groups introduced at the 3,3 ′ and 5,5 ′ positions.
Epoxy resin 2: A phenol aralkyl type epoxy resin having a phenylene skeleton having an epoxy equivalent of 238 g / eq and a softening point of 52 ° C. (trade name NC-2000 manufactured by Nippon Kayaku Co., Ltd.). In the general formula (3), R7 to R9 have a structure of hydrogen.
Epoxy resin 3: A phenol aralkyl type epoxy resin having a biphenylene skeleton having an epoxy equivalent of 276 g / eq and a softening point of 52 ° C. (trade name NC-3000L, manufactured by Nippon Kayaku Co., Ltd.). In the general formula (4), R10 to R18 have a structure of hydrogen.

(B) component phenolic resin curing agent:
Phenol resin curing agent 1: a phenol aralkyl resin having a biphenylene skeleton having a hydroxyl group equivalent of 198 g / eq and a softening point of 64 ° C. (trade name MEH-7785SS manufactured by Meiwa Kasei Co., Ltd.). In the general formula (5), R19 to R27 have a structure of hydrogen.

Component (C) inorganic filler:
Inorganic filler 1: spherical fused silica having an average particle size of 10.8 μm and a specific surface area of 5.1 m ² / g

(D) component:
Synthesis Example 1 (Preparation method of silane coupling agent 1)
3-mercaptopropyl trimethoxysilane (manufactured by Jiangsu Foreign Economic Trade Co., Ltd.) is distilled under reduced pressure, and the fraction at 85 ° C is collected and purified at 4 mmHg to purify 3-mercaptopropyl with very little impurities 1350 g of trimethoxysilane was obtained. Silane coupling agent 1 was prepared by adding 1.8 g of methanol to 1000 g of this distilled 3-mercaptopropyltrimethoxysilane.
When the obtained silane coupling agent 1 was analyzed by GC, the purity of 3-mercaptopropyltrimethoxysilane was 99.0% by mass, the content of the silane compound not containing a mercapto group in the molecule was 7700 ppm, and the content of methanol The amount was 1800 ppm.

Synthesis Example 2 (Method for Preparing Silane Coupling Agent 2)
Silane coupling agent 2 was prepared by the method described in Synthesis Example 1 except that the amount of methanol added after distillation purification was changed to 2.5 g.
When the obtained silane coupling agent 2 was analyzed by GC, the purity of 3-mercaptopropyltrimethoxysilane was 98.9% by mass, the content of the silane compound not containing a mercapto group in the molecule was 7700 ppm, and the content of methanol The amount was 2500 ppm.

Synthesis Example 3 (Preparation method of silane coupling agent 3)
Silane coupling agent 3 was prepared by the method described in Synthesis Example 1 except that the amount of methanol added after distillation purification was changed to 1.0 g.
When the obtained silane coupling agent 3 was analyzed by GC, the purity of 3-mercaptopropyltrimethoxysilane was 99.1% by mass, the content of the silane compound not containing a mercapto group in the molecule was 7700 ppm, and the content of methanol The amount was 1000 ppm.

Synthesis Example 4 (Method for Preparing Silane Coupling Agent 4)
3-mercaptopropyl triethoxysilane (manufactured by Jiangsu Foreign Economic Trade Co., Ltd.) 1500 g is distilled under reduced pressure, and a fraction at 115 ° C. is collected and purified at 14 mmHg, so that 3-mercaptopropyl with extremely low impurity content is obtained. 1350 g of triethoxysilane was obtained.
Silane coupling agent 4 was prepared by adding 1.8 g of ethanol to 1000 g of this distilled 3-mercaptopropyltriethoxysilane.
When the obtained silane coupling agent 4 was analyzed by GC, the purity of 3-mercaptopropyltriethoxysilane was 99.0% by mass, the content of the silane compound not containing a mercapto group in the molecule was 7700 ppm, and the content of ethanol The amount was 1800 ppm.

Synthesis Example 5 (Method for Preparing Silane Coupling Agent 6)
Silane coupling agent 6 was prepared by the method described in Synthesis Example 1 except that the amount of methanol added after distillation purification was changed to 3.0 g.
When the obtained silane coupling agent 5 was analyzed by GC, the purity of 3-mercaptopropyltrimethoxysilane was 98.9% by mass, the content of the silane compound not containing a mercapto group in the molecule was 7700 ppm, and the content of methanol The amount was 3000 ppm.

Synthesis Example 6 (Method for Preparing Silane Coupling Agent 7)
Silane coupling agent 7 was prepared by the method described in Synthesis Example 1 except that methanol was not added after distillation purification.
When the obtained silane coupling agent 7 was analyzed by GC, the purity of 3-mercaptopropyltrimethoxysilane was 99.2% by mass, the content of the silane compound not containing a mercapto group in the molecule was 7700 ppm, and the content of methanol The amount was 300 ppm.

Synthesis Example 7 (Preparation method of silane coupling agent 8)
Purified 3-mercaptopropyl obtained by purifying 1500 g of 3-mercaptopropyltrimethoxysilane (manufactured by Jiangsu Foreign Economic Trade Co., Ltd.) by silica gel column chromatography (Wakogel C-300) using hexane as a developing solvent. Silane coupling agent 8 was prepared by adding 1.8 g of methanol to 1000 g of trimethoxysilane.
When the obtained silane coupling agent 8 was analyzed by GC, the purity of 3-mercaptopropyltrimethoxysilane was 98.8% by mass, the content of the silane compound not containing a mercapto group in the molecule was 10,000 ppm, and the content of methanol The amount was 1800 ppm.

Coupling agent 1 (CA1): 3-mercaptopropyltrimethoxysilane coupling agent 2 described in synthesis example 1 (CA2): 3-mercaptopropyltrimethoxysilane coupling agent 3 described in synthesis example 2 (CA3): 3-mercaptopropyltrimethoxysilane coupling agent 4 (CA4) described in Synthesis Example 3: 3-mercaptopropyltriethoxysilane coupling agent 5 (CA5) described in Synthesis Example 4: phenylaminopropyltrimethoxysilane (Shin-Etsu) Chemical Industry Co., Ltd. trade name KBM-573)
Coupling agent 6 (CA6): 3-mercaptopropyltrimethoxysilane coupling agent 7 (CA7) described in Synthesis Example 5: 3-mercaptopropyltrimethoxysilane coupling agent 8 (CA8) described in Synthesis Example 6: 3-mercaptopropyltrimethoxysilane coupling agent 9 (CA9) described in Synthesis Example 7: 3-mercaptopropyltrimethoxysilane (trade name KBM-803, manufactured by Shin-Etsu Chemical Co., Ltd.). According to GC analysis, the purity was 97.5% by mass, the content of the silane compound containing no mercapto group in the molecule was 17000 ppm, and the content of methanol was 300 ppm.

Curing accelerator:
Curing accelerator 1: Adduct of triphenylphosphine and p-benzoquinone

Other additives:
Mold release agent 1: Oxidized polyethylene wax (trade name Rico Wax PED191, manufactured by Clariant Japan KK)
Colorant 1: Carbon black (trade name carbon # 5 manufactured by Mitsubishi Chemical Corporation)

  The above components were blended in parts by mass shown in Tables 1 and 2, respectively, biaxially kneaded under conditions of a kneading temperature of 100 ° C. and a kneading time of 30 minutes, cooled and pulverized to prepare an epoxy resin composition for sealing.

  The produced epoxy resin compositions for sealing of Examples and Comparative Examples were evaluated by the following tests. The evaluation results are shown in Tables 1 and 2.

Spiral flow (SF):
Using a low-pressure transfer molding machine (manufactured by Kotaki Seiki Co., Ltd., KTS-15), a spiral flow measurement mold according to EMMI-1-66 was applied at 175 ° C., injection pressure 6.9 MPa, and holding time 120 seconds. The resin composition was injected under the following conditions, and the flow length was measured. The spiral flow is a fluidity parameter, and the larger the value, the better the fluidity. The unit is cm.

Continuous formability (air vent block):
Using a low-pressure transfer automatic molding machine (Daiichi Seiko Co., Ltd., GP-ELF), chips and the like are formed with an epoxy resin composition under conditions of a mold temperature of 175 ° C., an injection pressure of 9.8 MPa, and a curing time of 70 seconds. Sealed 80 pink quad flat package (80pQFP; copper lead frame, package outer dimensions: 14mm x 20mm x 2mm thickness, pad size: 6.5mm x 6.5mm, chip size 6.0mm x 6.0mm x 0.00mm Molding to obtain a thickness of 35 mm was continuously performed up to 400 shots.
Regarding the evaluation of the air vent block, the mold is visually observed every 50 shots, so that the air vent block (the state where the cured resin is fixed to the air vent (width 0.5 mm, thickness 50 μm) and the air vent is blocked) The following four levels were evaluated. The preferred order is the order of A, B, C, D, but if it is C rank or higher, it is within the practical range. The evaluation results are shown below.
A: No problem up to 400 shots B: Air vent block generated by 300 shots C: Air vent block generated by 200 shots D: Air vent block generated by 100 shots

Solder resistance:
Using a low-pressure transfer molding machine (Daiichi Seiko Co., Ltd., GP-ELF), an epoxy resin composition was injected under conditions of a mold temperature of 180 ° C., an injection pressure of 7.4 MPa, and a curing time of 120 seconds. (Silicon chip) mounted lead frame or the like is sealed, 80pQFP (copper lead frame, size 14 x 20 mm x thickness 2.00 mm, semiconductor element 7 x 7 mm x thickness 0.35 mm, die pad and The inner lead was plated with silver, and the semiconductor element and the inner lead of the lead frame were bonded with a gold wire with a diameter of 25 μm. Twelve semiconductor devices heat-treated at 175 ° C. for 4 hours as post-cure were humidified at 60 ° C. and 60% relative humidity for 120 hours, and then subjected to IR reflow treatment (in accordance with JEDEC Level 3 conditions at 260 ° C.). The presence or absence of peeling and cracks inside these semiconductor devices was observed with an ultrasonic flaw detector (manufactured by Hitachi Construction Machinery Finetech Co., Ltd., mi-scope 10), and the occurrence of either peeling or cracking was regarded as defective. The number of defective semiconductor devices in n = 12 is displayed. If the number of defects is 1 or less, it is within the practical range.

Moisture resistance reliability:
Using a low-pressure transfer molding machine, the resulting epoxy resin composition was injected at a mold temperature of 175 ° C., an injection pressure of 9.8 MPa, and a curing time of 120 seconds to obtain a 16-pin SOP (chip size: 3.0 mm × 3.5 mm). ) Was then heat treated at 175 ° C. for 4 hours as a post cure. Thereafter, a pressure cooker test (130 ° C., pressure 2.3 × 10 5 Pa, 240 hours) was performed, and open circuit failures were measured. The number of defects in 15 packages is shown.

  Examples 1-7 are (A) an epoxy resin, (B) a phenol resin curing agent, (C) an inorganic filler, and (D) a purity of 98.5 to 99.5% by mass and having 1 to 5 carbon atoms. Epoxy resin of the present invention containing 3-mercaptopropyltrimethoxysilane CA1, CA2, CA3, CA4 containing 1000 to 2500 ppm of monohydric alcohol and containing less than 8000 ppm of silane compound having no mercapto group in the molecule It is a composition, including (A) the type and amount of component, and (D) the type of component being changed, all of which have a spiral flow exceeding 100 cm, continuous formability, solder resistance, and moisture resistance reliability. Excellent results were obtained.

On the other hand, in Comparative Example 1 using CA6 having a methanol content of 3000 ppm instead of the component (D), there was no problem in spiral flow, continuous formability, and moisture resistance reliability. There were also voids.
In Comparative Example 2 in which CA7 having a methanol content of 300 ppm was used instead of the component (D), there was no problem in solder resistance and moisture resistance reliability, but the spiral flow was short and the continuous moldability deteriorated. became.
In the comparative example 3 using CA8 whose content of the silane compound which does not have a mercapto group in a molecule | numerator instead of (D) component is 10000 ppm, and the comparative example 4 which similarly uses CA9 which is 17000 ppm, spiral flow is both. Although there was no problem in the continuous formability, in Comparative Example 3, both moisture resistance reliability and Comparative Example 4 resulted in a decrease in both solder resistance and moisture resistance reliability.

  According to the present invention, as shown in the above examples, the dispersibility of the mercaptosilane coupling agent is improved, and an epoxy resin composition for sealing excellent in moldability, solder resistance, and moisture resistance reliability is obtained. Therefore, this sealing epoxy resin composition can be used suitably for electronic component devices such as IC and LSI.

DESCRIPTION OF SYMBOLS 1 Element 2 Die-bonding material hardening body 3 Die pad 4 Bonding wire 5 Copper lead frame 6 Hardening body of epoxy resin composition for sealing

Claims (4)

It is an epoxy resin composition for sealing containing (A) an epoxy resin, (B) a phenol resin curing agent, (C) an inorganic filler, and (D) a silane compound represented by the following general formula (1). The component (D) has a purity of 98.5 to 99.5% by mass, a monohydric alcohol content of 1 to 5 carbon atoms of 1000 to 2500 ppm, and has a mercapto group in the molecule. An epoxy resin composition for sealing, characterized in that the content of the silane compound not to be removed is less than 8000 ppm.

(In the formula, R1 is an alkyl group having 1 to 5 carbon atoms. R2 is an alkyl group having 1 to 5 carbon atoms. M is an integer of 1 to 6. n is a positive number of 1 to 3. .) The component (A) is represented by the biphenyl type epoxy resin represented by the following general formula (2), the phenol aralkyl type epoxy resin having a phenylene skeleton represented by the following general formula (3), and the following general formula (4). The epoxy resin composition for sealing according to claim 1, comprising at least one epoxy resin selected from the group consisting of phenol aralkyl type epoxy resins having a biphenylene skeleton.

(In the general formula (2), R ^{3 to} R ⁶ are selected from a hydrogen atom and a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, and all may be the same or different from each other. N is 0. Represents an integer of ~ 3.)

(In the general formula (3), R ^{7 to} R ⁹ are selected from a hydrogen atom and a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, and all may be the same or different from each other. N is 0. Represents an integer of ~ 3.)

(In the general formula (4), R ^{10 to} R ¹⁸ are selected from a hydrogen atom and a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, and all may be the same or different from each other. N is 0. Represents an integer of ~ 3.) The sealing component according to claim 1 or 2, wherein the component (B) contains at least one phenol resin selected from the group consisting of phenol aralkyl resins having a biphenylene skeleton represented by the following general formula (5). Epoxy resin composition.

(In the above general formula (5), R ^{19 to} R ²⁷ are selected from a hydrogen atom and a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, and all may be the same or different from each other. N is 0. Represents an integer of ~ 3.)   An electronic component device, wherein an element is sealed with a cured product of the epoxy resin composition for sealing according to any one of claims 1 to 3.

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