JP2013105752A - Alignment method between resin film and substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an alignment method, by which alignment between a resin film and a substrate can be precisely performed even when a shape change is caused in the resin film.SOLUTION: An alignment method for performing alignment between a resin film 16 and a substrate 18 in laminating one face 16a of the resin film 16 and one face 18a of the substrate 18 includes the following steps: a fixing step of mounting the resin film 16 so that the other face of the resin film 16 is brought into contact with a stage 12 arranged so as to face the substrate 18 and fixing the resin film 16 from a side of the other face; a detection step of detecting a deformed portion of the resin film 16; and an elongation and contraction step of elongating and contracting the resin film 16 in a plane direction thereof in the fixed state, on the basis of the detected result of the deformed portion.

Description

  The present invention relates to an alignment method for bonding a resin film and a substrate at an accurate position.

  Devices having structures and processes for laminating a plurality of substrates, such as electronic paper, liquid crystal display (LCD), information display panels such as organic EL displays, solar cells, printed wiring boards, and imprinting methods In the method and the like, a plurality of substrates on which patterns made of electrodes, unevenness, ink, and the like are formed are bonded to each other at desired positions.

  Particularly in recent years, a flexible resin film has been used as a substrate in order to give flexibility to an information display panel, a solar cell, and the like. For example, in the case of an information display panel having flexibility, an electrode pattern, a film provided with a concavo-convex pattern for enclosing a display medium to form a partition constituting a cell, and a pattern of electrodes and concavo-convex similarly Is bonded to the substrate on which the film is formed (Patent Document 1).

  Further, in the case of an information display panel capable of color display as well as an information display panel having flexibility, a color filter film with a color ink pattern and a front substrate on which an electrode pattern is formed Are pasted together (Patent Document 2). Furthermore, in the fields of imprinting using a resin film with a concavo-convex pattern as a stamper, and printed wiring boards in which a laminated film having an insulating layer and a conductor layer is laminated on the inner substrate, the resin is similarly used. The film and the substrate are bonded together (Patent Document 3 and Patent Document 4).

  When bonding such a resin film and a board | substrate, alignment (position alignment) is normally performed in order to bond a resin film and a board | substrate in a desired position.

  In general, two or more alignment marks are provided in advance on both the film and the substrate, and when the resin film and the substrate are arranged to face each other, the alignment mark is imaged by the alignment camera, and the resin film and / or This is done by moving the substrate in the X-axis, Y-axis, and θ-axis directions to match the alignment mark positions.

JP 2008-52091 A JP 2010-122492 A JP 2007-165812 A JP 2005-142253 A

  However, since the resin film has a high coefficient of thermal expansion and changes in shape even if the environmental temperature changes slightly, and the difference in coefficient of thermal expansion from the substrate is different, the positions of two or more alignment marks are aligned simultaneously. There is a case where they do not coincide with each other, and there is a problem that the bonding at a desired position becomes difficult. This problem has a great influence particularly on the case where a film on which a fine pattern is formed and a substrate are bonded together, an application where high-precision alignment is required, or an application using a relatively large size film and substrate.

  The present invention has been made in view of such circumstances, and its purpose is alignment that can accurately perform alignment between the resin film and the substrate even when the resin film undergoes a shape change. It is to provide a method.

  In order to improve the alignment accuracy between the resin film that has changed its shape and the substrate, for example, multiple points at the end of the contracted resin film are clamped from above and below, and extended outward to correct the shape. It is conceivable to perform the alignment after the operation. However, if stretching is performed by sandwiching multiple points from above and below, the resin film is distorted, and it becomes difficult to maintain flatness, and it may be difficult to perform accurate bonding.

Therefore, as a result of further investigation by the present inventors, the above object is an alignment method for aligning the resin film and the substrate when bonding one surface of the resin film and one surface of the substrate. The following steps:
A fixing step of placing the resin film on a stage disposed so as to face the substrate so that the other surface of the resin film is in contact therewith, and fixing the resin film from the other surface side; A resin film and a substrate, comprising: a detecting step of detecting a deformed portion; and an expanding and contracting step of expanding and contracting the resin film in the planar direction in the fixed state based on a detection result of the deformed portion. It has been clarified that this can be achieved by the alignment method.

  The shape of the resin film can be adjusted while maintaining the flatness of the resin film by fixing and expanding and contracting the resin film from the back surface (the surface opposite to the bonding surface with the substrate). And alignment precision can be improved by performing alignment with a board | substrate in the state which adjusted the shape of the resin film.

  Preferred embodiments of the present invention are as follows.

(1) The fixing is performed by a fixing mechanism having a fixing portion in contact with the other surface of the resin film when the resin film is placed, and the resin film is expanded and contracted in the fixed state. This is done by moving The resin film can be efficiently expanded and contracted by moving the fixing portion that is in direct contact with the resin film.
(2) The fixing mechanism is a suction mechanism that fixes the other surface of the resin film by suction. According to the suction, the resin film can be firmly fixed, and the subsequent expansion and contraction can be performed accurately.
(3) The planar shape of the resin film is a polygon, and in the expansion / contraction process, the center or the vicinity of each side of the resin film is expanded / contracted. When the planar shape is a polygonal resin film, since the deformation amount of the central part of each side is generally large, alignment suitable for the actual situation can be performed by expanding and contracting this part.
(4) The stage is divided into a plurality of parts, and at least a part of the plurality of divided placement parts is provided with the fixing mechanism. Thereby, expansion and contraction of the resin film can be performed while maintaining its flatness with certainty.
(5) The fixing mechanism includes a suction tube, and the end surface of the suction tube is in contact with the other surface of the resin film in a state where the resin film is placed. Thereby, resin film expansion and contraction can be performed while maintaining its flatness.
(6) The deformation part of the resin film is detected by measuring the resin film with a deformation measuring instrument arranged so as to face the resin film. By measuring the resin film and comparing it with a reference value such as design data, the deformed portion can be detected accurately and accurately.
(7) The method further includes a step of overlapping alignment marks provided on both the resin film and the substrate. Thereby, efficient and accurate alignment can be performed.

  The present invention is also a method for bonding a resin film and a substrate, wherein the alignment between the resin film and the substrate is performed by the alignment method. provide.

  According to the alignment method of the present invention, even when the shape of the resin film is changed, the shape can be adjusted while maintaining flatness by fixing and stretching the resin film from the back side. . By performing alignment with the substrate in a state where the shape of the resin film is adjusted, the resin film can be bonded to a desired position of the substrate. In particular, in the present invention, when using a film and a substrate on which a fine pattern is formed, the patterns can be bonded to each other at precise positions, and the resin film having a relatively large size that is easily affected by the shape change. It is effective when using.

It is a schematic sectional drawing which shows an example of a bonding apparatus. It is the schematic sectional drawing (a) which shows an example of a stage, and the schematic perspective view (b) of the state which mounted the resin film. It is the schematic plan view (a) of the state which moved the division | segmentation mounting part, and the schematic perspective view (b) which shows the state which has adjusted the shape of the resin film. It is a schematic sectional drawing of the division | segmentation mounting part which shows an example of a fixing mechanism. It is a schematic plan view which shows the other example of the division | segmentation form of a mounting base. It is the schematic sectional drawing (a) which shows the other example of a stage, and the schematic perspective view (b) of the state which mounted the resin film. It is a schematic sectional drawing which shows the detail of a suction mechanism. It is detailed sectional drawing explaining the shape adjustment of the resin film by a suction mechanism. It is a top view which shows the arrangement position of a suction mechanism. It is a schematic plan view which shows the other example of the arrangement | positioning form of a suction mechanism. It is a schematic plan view which shows the shrinkage | contraction characteristic of a resin film.

  Hereinafter, an alignment method according to the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing an example of a bonding apparatus that can be suitably used in the alignment method according to the present invention.

  The bonding apparatus includes a stage 12 that holds a resin film 16 and a substrate holder 14 that detachably holds a substrate 18, and the substrate holder 14 faces the resin film 16. Are arranged to be. Then, the substrate 18 and the resin film 16 are laminated by bonding one surface (bonding surface) 18a of the substrate 18 and one surface (bonding surface) 16a of the resin film 16 together.

  Prior to bonding, alignment for aligning the relative positions of the resin film 16 and the substrate 18 is performed. In general, two or more alignment marks (not shown) are attached in advance to arbitrary portions of the resin film 16 and the substrate 18, and the alignment marks are observed using a measuring instrument 22 such as a CCD camera. This is done by adjusting the positions of the substrate 18 and the film 16 so that the positions of the alignment marks are aligned. At least one of the stage 12 and the substrate holder 14 is configured to be movable in various directions such as the X-axis, Y-axis, Z-axis, and θ-axis, and the alignment marks are matched by moving in each direction. Let

  What is characteristic in the present invention is that, during this alignment, the resin film 16 is fixed from the back surface (surface opposite to the bonding surface 16a) side by the stage 12, and a portion whose shape has changed is measured. After the detection with the instrument 22 or the like, the film 16 is expanded or contracted in the plane direction in a fixed state based on the detection result. As described above, when the shape of the resin film changes, the resin film previously attached and the plurality of alignment marks on the substrate may not overlap at the same time. Thus, the position of the alignment mark can be adjusted by adjusting the shape of the resin film 16 at the time of alignment, and the substrate and the film can be precisely bonded at a desired position. In addition, since the resin film is fixed and stretched from the back surface side (the side opposite to the bonding surface), the shape can be adjusted while preventing the distortion and maintaining the flatness.

  The expansion and contraction of the resin film 16 is first performed by measuring the degree of shape change of the resin film with a deformation measuring instrument 22 such as a CCD camera, and comparing the obtained measurement data with a reference value such as design data of the resin film, After detecting the deformed part, it is performed by expanding / contracting the part that requires expansion / contraction of the resin film according to the detected deformed part and the amount of deformation.

  The deformation measurement location of the resin film 16 may be any location on the resin film. In general, the shape change of the resin film is preferably measured at the peripheral portion because the peripheral portion is larger than the central portion. Thereby, a deformation | transformation site | part and a deformation | transformation amount can be detected more correctly.

  As the stage 12 that fixes and stretches the resin film from the back side, a shape adjustment stage exemplified below can be used.

  FIG. 2A is a schematic plan view showing an example of a stage, and FIG. 2B is a schematic perspective view of a state in which a resin film is placed on the stage. The stage 40 includes a total of nine divided mounting portions 42-1 to 42-9 formed by dividing the mounting surface 42a on which the resin film 16 is mounted into three parts in the vertical direction and the horizontal direction. The mounting table 42 is provided.

  Each of the nine divided mounting portions 42-1 to 42-9 has a rectangular planar shape, and in a collective state that is not moved by a moving mechanism described later, the mounting table 42 having a rectangular planar shape as a whole is configured. Has been. The resin film 16 is placed such that the surface opposite to the surface to be bonded to the substrate (hereinafter also referred to as a back surface) is in contact with the placement surface 42 a of the placement table 42.

  Among these nine divided mounting portions, 42-2, 42-4, 42-6, and 42-8 have a fixing mechanism that can fix the resin film 16 mounted on the surface thereof from the back surface side. ing. Then, as shown in the schematic plan view (a) and schematic perspective view (b) of FIG. 3, 42-4 and 42-6 are in the lateral direction (X-axis direction) indicated by the arrow 100, and 4-2 and 42-42. -8 has a moving mechanism (not shown) that moves independently in the vertical direction (Y-axis direction) indicated by the arrow 200. In a state where the resin film is fixed by the fixing mechanism, the resin film 16 extends in the moving direction by moving the divided mounting portions 42-2, 42-4, 42-6, and 42-8 by the moving mechanism.

  The divided mounting portions 42-4, 42-6, 42-2, and 42-8 having these moving mechanisms are formed on the resin film 16 when the rectangular resin film 16 is mounted on the mounting surface 42a. It is the division | segmentation mounting part located in the center of each edge | side.

  In general, as shown in the plan view of FIG. 11, the resin film has a higher rate of contraction and deformation near the center of each side than before the apex (before deformation (a) and after deformation (b)). Therefore, a stage suitable for the actual situation of the shrinkage characteristics of the resin film is obtained by adopting a configuration in which the divided mounting portion corresponding to the vicinity of the center is movable in the above direction. In addition, the said vertical direction and a horizontal direction are orthogonal to the edge | side of the resin film which touches the division | segmentation mounting part which has a moving mechanism, or is located nearest, when a planar polygonal resin film is mounted in a mounting base. Corresponds to the direction.

  Examples of the fixing mechanism that fixes the resin film 16 from the back side include a suction mechanism that sucks and fixes the resin film, and an electrostatic suction mechanism that sucks and fixes the resin film by static electricity.

  Examples of the suction mechanism include a method in which the upper surface of each divided mounting portion is formed of a porous member such as ceramics and sucked from below through the porous member. In this method, for example, as shown in a schematic cross-sectional view showing one of the divided mounting portions in FIG. 4, a porous member 48 as a fixing portion that comes into contact with the resin film, and a hollow portion provided below the porous member 48 50, and a configuration in which the suction pipe 52 is connected to the hollow portion 50 can be adopted. The resin film is sucked and fixed by sucking the back surface side of the resin film to be placed on the placement surface 42a through the porous portion 48 from the suction tube 52. The electrostatic adsorption mechanism can be a fixing mechanism using an electrostatic chuck. For example, the structure which provided the electrostatic chuck in the surface of each division | segmentation mounting part of the mounting base 42 is mentioned.

  As a moving mechanism of the divided mounting portions 42-2, 42-4, 42-6, and 42-8, for example, there is a mechanism in which each divided mounting portion is provided with a driving mechanism such as an actuator and moved in each direction. Can be mentioned. The moving length of the divided mounting portion by the moving mechanism may be at least 0.5% with respect to the length of the side of the resin film 16. Therefore, it is possible to adjust the shape sufficiently within the range of the elastic deformation region of the resin film.

  At the time of the alignment, after the deformation site is detected, the resin film needs to be expanded or contracted among the divided mounting portions 42-2, 42-4, 42-6, and 42-8 according to the deformation amount. The resin film is expanded and contracted by moving the divided mounting portion corresponding to the location.

  The division form of the mounting table 42 of the stage 40 is not limited to the above-described example, and may be, for example, a division form as shown in FIGS.

  FIG. 5A shows that among the nine divided placement units in the above-described example, four movable placement units 42-2, 42-4, 42-6, and 42-8 that are movable are further divided. Further, each of the three sub-divided mounting portions can be moved independently. Thereby, according to the expansion-contraction amount in each site | part of a resin film, it becomes possible to adjust the shape of a resin film more precisely by moving required subdivision mounting part necessary length.

  FIG. 5B shows a stage having a rectangular planar shape, and is composed of eight divided mounting portions that are radially divided from the center. All the divided mounting portions are configured to move in the radial direction from the center.

  FIG. 5C has one large divided mounting portion at the center of the stage, and a plurality of small divided mounting portions are provided so as to surround the outer periphery of the large divided mounting portion. That is, the peripheral area of the mounting table 42 is divided into small divided mounting portions. The plurality of small divided placement portions are configured to be movable in the plane direction of the placement surface, and the shape of the resin film is adjusted by appropriately moving a necessary divided placement portion among them.

  FIG. 5D shows a stage whose overall planar shape is a circular shape, and the outer region of the circle is composed of a plurality of divided mounting portions that are radially divided from the center. Each of the divided placement portions is configured to be individually movable, and the shape of the resin film is adjusted by moving only the divided placement portions corresponding to the places where expansion / contraction is required in the radial direction.

  In the example of the stage described above, the resin film and the mounting table are described as examples in which the planar shape is a rectangular shape or a circular shape, but the present invention is not limited to this, and takes any shape such as an elliptical shape, a diamond shape, and a polygonal shape. be able to. Further, in the case where the mounting table is, for example, a planar rectangular mounting table, it is preferable that the mounting table is divided into about 3 to 10 parts in the vertical direction and the horizontal direction. In each of the above-exemplified stages, the divided placement portion having the fixing mechanism and the movement mechanism is disposed at a position corresponding to the peripheral edge when the resin film is placed. As a result, the peripheral portion having a larger amount of deformation than the vicinity of the center can be expanded and contracted, so that efficient shape adjustment can be performed.

  6 is a schematic plan view (a) showing another example of the stage 12 shown in FIG. 1, and a schematic perspective view (b) in a state where a resin film is placed. The stage 60 has a flat plate-like mounting table 62, and the resin film 16 is mounted on the surface (mounting surface) 62 a of the mounting table 62. The resin film 16 is mounted on the mounting table 62 such that the surface (back surface) opposite to the bonding surface with the substrate is in contact with the mounting surface 62a, and the mounting table 62 includes a plurality of suction mechanisms 64-1 to 64-1. 64-4 are provided at three locations near the center of each side.

  Each of the plurality of suction mechanisms 64-1 to 64-4 is provided in a hollow storage portion 68 formed on the mounting table 62, of which 64-2 and 64-3 are in the horizontal direction (the direction of the arrow 100). ) And 64-1 and 64-4 are movable independently in the vertical direction (in the direction of the arrow 200) by a moving mechanism (not shown).

  The resin film 16 is fixed by sucking the back surface side of the resin film 16 by the suction mechanisms 64-1 to 64-4, and the resin film 16 is moved in the respective directions so that the resin film 16 is sucked by the suction mechanisms 64-1 to 64-4. The shape is adjusted in each moving direction.

  These moving mechanisms 64-1 to 64-4 are provided at positions facing the inner portion of the side of the resin film 16 from the center to the vicinity thereof. As described above, the resin film often shrinks in the central direction near the center of each side. Therefore, by providing a suction mechanism at the place of the mounting table 62 corresponding to the place, a stage suitable for the shrinkage characteristics of the resin film is obtained. Specifically, the length in the side direction from the center to the vicinity thereof is specifically 20 to 80%, preferably 30 to 70% of the length of each side of the resin film.

  FIG. 7 is a schematic sectional view showing details of the suction mechanism 64. As shown in the drawing, the mounting table 62 is formed with a storage portion 68 having a crank-shaped cavity for storing the suction mechanism 64, and a part of the suction mechanism 64 is formed in the storage portion 68. Is installed. The suction mechanism 64 includes a suction pipe 64b and a suction pump (not shown) connected to the suction pipe 64b. The suction pipe 64b is formed in a crank shape so as to correspond to the shape of the storage portion 68. Yes.

  By operating the suction pump, the resin film is sucked from the suction hole 65 and fixed to the mounting table 62. The end surface 64a of the suction tube 64b is set to have substantially the same height as the mounting surface 62a of the mounting table 62, and the end surface 64a of the suction tube 64b and the back surface of the resin film are in contact with each other when the resin film is mounted. Thereby, when expanding and contracting the resin film, the flatness can be reliably maintained.

  As described above, the stage 60 of this example is provided with a moving mechanism (not shown) that can move the suction tube 64b as a fixed portion in the plane direction (arrow direction) of the mounting surface 62a. Examples of the moving mechanism include a configuration in which a driving mechanism such as an actuator is connected to the suction pipe 64b.

  The movable length of the suction pipe 64b by the moving mechanism depends on the size of the resin film and the fineness of the pattern formed on the resin film. For example, in the case of a fine pattern on the order of micrometers, it may be at least about 0.5% with respect to the length of the side of the resin film. Specifically, in the case of a resin film having a side of 200 mm, it is only necessary that the length can be moved by, for example, 1 mm or more. Therefore, the storage part 68 needs to be formed so that the suction pipe 64b can move by the length.

  Further, the end face 64a of the suction pipe 64b in contact with the resin film 16 may be formed of an elastic member such as rubber, or may be covered with an elastic member. As a result, the suction force during suction can be buffered and suction can be performed without damaging the resin film 16. The diameter of the suction hole 65 is not particularly limited, but may be about 1 mm, for example.

  FIG. 8 is an explanatory diagram when the shape of the resin film is adjusted by the suction mechanism. First, as shown in FIG. 8A, the resin film 16 is placed on the placement surface 62 a of the placement table 62, and then the back surface 16 b of the resin film 16 is sucked and fixed by the suction mechanism 64. Next, as shown in FIG. 8B, the resin film 16 is extended in the direction of the arrow by moving the suction mechanism 64 in the direction of the arrow by the moving mechanism, and its shape is adjusted.

  As shown in FIG. 6, in the present embodiment, the suction mechanisms 64-1 to 64-4 can move independently in the vertical direction (Y-axis direction) or the horizontal direction (X-axis direction), respectively. When the shape is actually adjusted, it is performed by moving the suction mechanism corresponding to the location where the shape of the resin film needs to be adjusted. These vertical and horizontal directions correspond to directions orthogonal to the sides of the resin film that are closest to the respective suction mechanisms when a planar polygonal resin film is mounted on the mounting table.

  Moreover, when the resin film 16 is mounted on the mounting table 62 as shown in the schematic plan view of FIG. 9, the center of the frame line 16-1 configured from the end portion of the resin film 16 is the same in plan view. As the suction mechanism 64 in the region between the virtual frame line 16-2 and the frame line 16-1 reduced by 50%, preferably 30%, more preferably 15%. 64 is preferably provided. Note that the reference of the position of the suction mechanism 64 at this time is the center of the suction hole 65.

  At the time of the alignment, after detecting the deformation part, according to the deformation amount, the suction mechanism 64-1, 64-2, 64-3 and 64-4 corresponds to the place where the expansion and contraction of the resin film is required. The resin film is expanded and contracted by moving the suction tube of the suction mechanism.

  FIG. 10A is a schematic plan view showing another example of the stage 60. As illustrated, the suction mechanism 64 may be further provided not only in the vicinity of the peripheral portion of the mounting surface 62a of the mounting table 62 but also on the center side of the mounting surface 62a. Since the change in the shape of the resin film 16 due to a change in heat or the surrounding environment varies depending on the part, it is possible to perform expansion and contraction in accordance with the amount of change in each part by providing the central part in this way.

  FIG. 10B is a schematic plan view showing another example of the stage 60. As illustrated, the suction mechanism 64 may be further provided in a portion of the mounting table 62 corresponding to the vicinity of the corner of the resin film when the resin film is mounted. Thereby, it is possible to perform expansion and contraction in accordance with the shape change amount of each part.

  FIG. 10C is a schematic plan view showing another example of the stage 60. As illustrated, the suction mechanism 64 may change the size and length of the storage unit, the suction tube, and the like so that the movable length is increased. Thereby, it becomes possible to deal with resin films of all sizes.

  The suction mechanism 64 is not limited to these examples, and can take any form. For example, in the example shown in FIG. 6, three suction mechanisms are provided in the vicinity of each side of the mounting table 62, but only one or more may be provided. Further, when it is provided, precise shape adjustment can be performed according to the amount of expansion and contraction of each part of the resin film.

  Further, each of the suction mechanisms 64 may be configured to be movable not only in the horizontal direction or the vertical direction but also in both the horizontal direction and the vertical direction. Thereby, since it can move in all directions, it becomes possible to perform delicate adjustment of the shape of the resin film 16. Furthermore, the suction area of the suction mechanism can be increased by making the suction hole elliptical or the like. Thereby, a resin film can be firmly fixed.

  The suction mechanism 64 includes a mechanism in which the height of the end surface 64a of the suction pipe 64b is substantially the same height as the placement surface 62a of the placement table 62 due to its weight when the resin film is placed. Also good. That is, before the resin film is placed, the end surface 64a slightly protrudes upward from the same height as the placement surface 62a, and when the resin film is placed, the end surface 64a is lowered by its weight. May be. Thereby, the back surface side 16b of the resin film 16 and the end surface 64a of the suction pipe 64 can be reliably opposed to each other and fixed by suction.

  In the example described above, the resin film and the mounting table have been described as examples in which the planar shape is a rectangular shape, but is not limited thereto, and may take any shape such as a circular shape, an elliptical shape, a diamond shape, and a polygonal shape. it can.

  In the present invention, the material of the resin film can be appropriately selected depending on the application. For example, polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, polyethylene, polypropylene, polyvinyl chloride, poly-4-methyl 1-pentene, polycarbonate, cycloolefin copolymer, polymethyl methacrylate, etc., transparency and releasability, etc. It selects suitably according to the physical property of. Although the thickness of a resin film is not specifically limited, If it is the range of 20-1000 micrometers, it can fix reliably by a fixing mechanism.

  In the present invention, the substrate may be a glass substrate, a hard plate such as an acrylic plate, or a flexible substrate having flexibility. In this case, the same material as the resin film described above may be used. it can.

  In the present invention, the pattern formed on the resin film and the substrate as necessary is a line electrode or TFT formed by using a conductive material such as indium tin oxide (ITO) by vacuum deposition, CVD (chemical vapor deposition), coating, or the like. Various planar patterns such as electrode patterns such as electrodes, thermal imprint method, optical imprint method, photolithography method, uneven pattern formed by cutting, etc., ink pattern formed by inkjet method, screen printing method, etc. It is appropriately selected depending on the application. The planar shape of the pattern can take various shapes such as a lattice shape, a honeycomb shape, a triangular shape, and a stripe shape, and is appropriately selected depending on the application.

  The alignment method of the present invention is particularly advantageously applied to bonding of a film and a substrate on which a fine pattern of nano to micrometer level is formed. By adjusting the shape of the resin film having a pattern, the dimension of the pattern is also corrected at the same time, and the substrate can be bonded to a desired position. The pattern formed on the resin film and the substrate may be a bonded surface or a surface opposite to the bonded surface.

  In the present invention, “bonding” refers to the case where one surface of the resin film and one surface of the substrate are bonded together in addition to the case where the one surface of the resin film and the one surface of the substrate are bonded together. In the case of bonding to each other via an intervening layer such as an adhesive layer or a photocurable resin layer. As an adhesive for the adhesive layer, an acrylic adhesive, a methacrylic adhesive, an epoxy adhesive or the like is applied, or an adhesive such as ethylene-vinyl acetate copolymer (EVA) or polyvinyl butyral (PVB) is adhered. It can be applied by attaching a film or the like.

  The method for actually bonding the resin film and the substrate after alignment is not particularly limited. For example, a press method using a press machine or a roller laminating method using a roller can be used. In order to prevent air from being mixed at the time of bonding, it is preferable to bond the film and the substrate in a vacuum atmosphere.

  In the example of the bonding apparatus shown in FIG. 1, a configuration in which the shape adjustment stage 12 is disposed on the lower side and the substrate holder 14 is disposed on the upper side is shown, but these arrangement configurations may be upside down. . Further, when a resin film is used as the substrate 18, the substrate holder 14 may be a shape adjustment stage having the same configuration as the stage 12.

  In addition, this invention is not limited to the structure of said each embodiment, A various deformation | transformation is possible within the range of the summary of invention. In the said embodiment, when the resin film shrink | contracts, the example which expands an edge part with the shape adjustment apparatus of this invention is shown, However, when a resin film expands conversely, the edge part is shown. It is also possible to adjust the shape by contracting.

  The present invention requires a laminate of a resin film and a substrate, such as an electronic paper, a liquid crystal display (LCD), an information display panel such as an organic EL display, a solar cell, a device such as a printed wiring board, and a method such as an imprint method The present invention can be applied to the field of devices and methods having the structure and process.

DESCRIPTION OF SYMBOLS 10 Bonding apparatus 12 Stage 14 Substrate holding body 16 Resin film 18 Substrate 22 Measuring instrument 40 Stage 42 Mounting base 42a Mounting surface 42-1 to 42-9 Divided mounting part 48 Porous member 50 Hollow part 52 Suction tube 60 Stage 62 Mounting base 64, 64-1 to 64-4 Suction mechanism 64a Suction tube end face 64b Suction tube 68 Storage portion 82 Resin film

Claims (9)

An alignment method for aligning the resin film and the substrate when bonding one surface of the resin film and one surface of the substrate together, the following steps:
A fixing step of placing the resin film on a stage disposed so as to face the substrate so that the other surface of the resin film is in contact therewith, and fixing the resin film from the other surface side;
A detecting step of detecting a deformed portion of the resin film; and an expanding / contracting step of expanding and contracting the resin film in the plane direction in the fixed state based on the detection result of the deformed portion;
A method of aligning a resin film and a substrate, comprising: The fixing is performed by a fixing mechanism having a fixing portion in contact with the other surface of the resin film when the resin film is placed;
The alignment method according to claim 1, wherein the expansion and contraction of the resin film is performed by moving the fixing portion in the fixed state.   The alignment method according to claim 2, wherein the fixing mechanism is a suction mechanism that fixes the other surface of the resin film by suction. The planar shape of the resin film is a polygon,
The alignment method according to any one of claims 1 to 3, wherein in the expansion and contraction step, the center of each side of the resin film or the vicinity thereof is expanded and contracted.   5. The alignment method according to claim 2, wherein the stage is divided into a plurality of parts, and at least a part of the plurality of divided mounting parts is provided with the fixing mechanism. .   5. The fixing mechanism according to claim 2, wherein the fixing mechanism includes a suction tube, and an end surface of the suction tube is in contact with and opposed to the other surface of the resin film in a state where the resin film is placed. The alignment method according to any one of the above.   The detection of the deformation | transformation site | part of the said resin film is performed by measuring the said resin film with the deformation | transformation measuring device arrange | positioned so as to oppose the said resin film, In any one of Claims 1-6 characterized by the above-mentioned. The alignment method described.   The alignment method according to any one of claims 1 to 7, further comprising a step of overlapping alignment marks provided on both the resin film and the substrate. A method of bonding a resin film and a substrate,
The bonding method of the resin film and a board | substrate characterized by performing alignment with the said resin film and the said board | substrate by the method of any one of Claims 1-8.

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