JP2013098484A - Susceptor and semiconductor manufacturing apparatus using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a susceptor which achieves the cost reduction for replacing substrate holding components and improves the throughput of semiconductor manufacturing, and to provide a semiconductor manufacturing apparatus using the susceptor.SOLUTION: In a susceptor used in a face down type semiconductor manufacturing apparatus, which places a surface of a substrate so as to face a reaction gas passage located below the substrate to form a semiconductor film on the surface of the substrate through vapor phase growth, a claw component supporting the substrate is detachably provided.

Description

  The present invention relates to a susceptor used in a face-down type semiconductor manufacturing apparatus and a semiconductor manufacturing apparatus using the susceptor.

  A face-down type semiconductor manufacturing apparatus in which a semiconductor film is vapor-grown on the surface of the substrate with the surface of the substrate facing the reaction gas flow path underneath is a deposit (product deposited) during vapor-phase growth. It is a structure that is not easily attached to the surface of the substrate and is often used in the manufacture of semiconductors (see, for example, Patent Document 1).

  In this semiconductor manufacturing apparatus, the substrate is held by a substrate holding component placed on the susceptor body in order to expose the surface of the substrate in the reaction gas. Also, as shown in FIG. 3, when the susceptor body 31 revolves during vapor phase growth, the gear structure 33 of the substrate holding component 32 is engaged with the gear structure 35 of the rotation generating component 34 to which the substrate holding component 32 is fixed. In addition to the susceptor body 31, a self-revolving susceptor 30 that rotates may be used (see, for example, Patent Document 2).

JP 2006-344758 A Japanese Patent No. 4533766

  As shown in FIG. 4, the substrate holding component 32 supports the outer periphery of the substrate 37 only by a thin claw portion 38 in order to gain a vapor phase growth region of the semiconductor film 36, but the substrate holding component 32 is boron nitride (BN). In the case where it is made of a fragile material that is easy to machine mechanically, the thin claw portion 38 is chipped and the substrate 37 cannot be placed, and the substrate holding component 32 is replaced every time the claw portion 38 is cut. Cost.

  In particular, when the self-revolving susceptor 30 shown in FIG. 3 is used, since the substrate holding component 32 has a complicated gear structure 33 for rotation, the cost of the substrate holding component 32 itself is high. The cost required for replacing the substrate holding component 32 increases.

  Further, the bottom 39 of the substrate holding component 32 is exposed to the reaction gas together with the surface of the substrate 37, and the product adheres. Therefore, when this product is deposited to some extent, the baking process is performed to evaporate and remove the product. That hinders continuous semiconductor manufacturing and reduces throughput.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a susceptor capable of realizing a reduction in cost for replacing a substrate holding component and improving the throughput of semiconductor manufacturing, and a semiconductor manufacturing apparatus using the susceptor.

  The present invention devised to achieve this object is used in a face-down type semiconductor manufacturing apparatus in which a semiconductor film is vapor-grown on the surface of the substrate with the surface of the substrate facing the reaction gas flow path below the substrate surface. In this susceptor, a claw component that supports the substrate is detachably provided.

  The present invention also provides a susceptor body and the susceptor used in a face-down type semiconductor manufacturing apparatus in which a semiconductor film is vapor-grown on the surface of the substrate with the surface of the substrate facing the reaction gas channel below the substrate. A substrate holding component mounted on the main body for holding the substrate, and the substrate holding component is detachably attached to the substrate holding component main body and the substrate holding component main body by a connecting member to support the substrate. A susceptor having claw parts.

  It is preferable that the susceptor body revolves and the substrate holding component rotates independently of the susceptor body, and a rotation mechanism for rotating the substrate holding component is provided in the substrate holding component body.

  Further, the present invention provides a face-down type semiconductor manufacturing apparatus in which a semiconductor film is vapor-grown on the surface of the substrate with the surface of the substrate facing the reaction gas flow path below the substrate, and the claw parts that support the substrate are detachable. It is a semiconductor manufacturing apparatus provided with the susceptor provided in.

  The present invention also provides a susceptor body and a susceptor body mounted on a susceptor body in a face-down type semiconductor manufacturing apparatus in which a semiconductor film is vapor-grown on the surface of the substrate with the surface of the substrate facing a reaction gas channel below the substrate. A susceptor having a substrate holding component for holding the substrate, the substrate holding component being detachably attached to the substrate holding component main body and the substrate holding component main body by a connecting member and supporting the substrate. A semiconductor manufacturing apparatus having a component.

  It is preferable that the susceptor body revolves and the substrate holding component rotates independently of the susceptor body, and a rotation mechanism for rotating the substrate holding component is provided in the substrate holding component body.

  According to the present invention, it is possible to provide a susceptor and a semiconductor manufacturing apparatus using the susceptor that can realize a reduction in cost required for replacing a substrate holding component and improve the throughput of semiconductor manufacturing.

It is sectional drawing which shows the susceptor which concerns on embodiment of this invention. It is sectional drawing which shows the semiconductor manufacturing apparatus which concerns on embodiment of this invention. It is a top view which shows a self-revolving susceptor. FIG. 4 is a sectional view taken along line AA in FIG. 3.

  Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

  As shown in FIGS. 1 and 2, the susceptor 10 according to the present embodiment has a face for vapor-phase-growing a semiconductor film 13 on the surface of the substrate 11 with the surface of the substrate 11 facing the reaction gas channel 12 below the substrate 11. It is used in the down type semiconductor manufacturing apparatus 20 and is characterized in that a claw component 14 that supports the substrate 11 is detachably provided.

  More specifically, the susceptor 10 includes a disc-shaped susceptor body 15 and a substrate holding component 16 that is placed on the susceptor body 15 and holds the substrate 11. The susceptor body 15 has a hole 17 for placing the substrate holding component 16 arranged circumferentially. The substrate holding component 16 includes a substrate holding component main body 18 and a claw component 14 that is detachably attached to the substrate holding component main body 18 by a connecting member 19 and supports the substrate 11. The connecting member 19 is made of, for example, a screw, and has a structure that allows the board holding component main body 18 and the claw component 14 to be easily connected by being inserted into a screw hole provided at the bottom of the claw component 14. The substrate holding component main body 18 is placed on the outer peripheral portion of the hole 17 of the susceptor main body 15 via a ball bearing 21. A step portion 22 formed by the substrate holding component body 18 and the claw component 14 is provided with a heat equalizing plate 23 for uniformly transferring heat over the surface of the substrate 11.

  Similar to the susceptor 30 described with reference to FIG. 3, the susceptor 10 is a self-revolving type in which the susceptor body 15 revolves and the substrate holding component 16 rotates independently of the susceptor body 15. A rotation mechanism (for example, a gear structure) 24 is provided in the substrate holding component main body 18.

Examples of materials constituting the substrate holding component main body 18, the claw component 14, and the connecting member 19 include carbon (C), silicon carbide (SiC), boron nitride (BN), pyrolytic boron nitride (PBN), quartz (SiO 2). ₂ ), tungsten (W), molybdenum (Mo) and the like.

  The substrate holding component body 18, the claw component 14, and the connecting member 19 may be made of the same material or different materials. However, in consideration of the provision of the rotation mechanism 24 and the contact of the ball bearing 21, the substrate holding component body 18 is preferably made of a material (such as metal) that is resistant to mechanical driving. Further, considering that the product adheres to the substrate 11 when exposed to the reaction gas, the claw component 14 is preferably made of a material in which the product corresponding to the reaction gas is difficult to deposit. Thus, by appropriately selecting the materials constituting the substrate holding component main body 18, the claw component 14, and the connecting member 19, it is possible to improve the yield of semiconductor manufacturing.

  According to the susceptor 10 described above, since the substrate holding component main body 18 and the claw component 14 are separate, it is not necessary to replace the entire substrate holding component 16 even when the claw component 14 is missing, and the rotation mechanism 24. It is only necessary to replace the low-priced claw component 14 while leaving the expensive substrate holding component main body 18 having the above. For this reason, it is possible to reduce the cost required for replacing the substrate holding component.

  Further, the claw component 14 may be replaced when a product is deposited on the bottom of the claw component 14 exposed to the reaction gas together with the surface of the substrate 11 due to semiconductor manufacturing and baking is necessary. Therefore, it is possible to save the time required for the baking process and improve the throughput of semiconductor manufacturing.

  In addition to the susceptor 10, the face-down type semiconductor manufacturing apparatus 20 using the susceptor 10 includes a rotation mechanism 25 that rotates the susceptor 10 around its central axis, a heater 26 provided on the susceptor 10, and a susceptor. 10 includes a reaction tube 27 that forms a reaction gas flow path 12 below, a reaction tube stage 28 that supports the reaction tube 27, and a reaction furnace 29 that accommodates these.

  The susceptor 10 is provided in the susceptor opening 42 formed in the upper wall 41 of the reaction tube 27 so that the surface of the substrate 11 faces the reaction gas channel 12. The reaction tube 27 linearly crosses the reaction furnace 29 in the horizontal direction. An inlet 43 for supplying a reaction gas is formed at one end (left side in FIG. 1) of the reaction tube 27, and a discharge port 44 for discharging the reaction gas is formed at the other end (right side in FIG. 1). The

  In this semiconductor manufacturing apparatus 20, a plurality of substrates 11 are set concentrically on the susceptor 10, and the susceptor 10 is revolved by the rotation mechanism 25, and then reacts with the surface of the substrate 11 from the raw material supply system via the reaction tube 27. A gas is supplied, the reaction gas is thermally decomposed by the heater 26, and the semiconductor film 13 is vapor-grown on the surfaces of the plurality of substrates 11.

  According to the semiconductor manufacturing apparatus 20 described above, since the susceptor 10 that can reduce the cost for replacing the substrate holding component and can improve the throughput of the semiconductor manufacturing is used, the semiconductor manufacturing is performed at a low cost. be able to.

DESCRIPTION OF SYMBOLS 10 Susceptor 11 Substrate 12 Reaction gas flow path 13 Semiconductor film 14 Claw component 15 Susceptor main body 16 Substrate holding component 17 Hole 18 Substrate holding component main body 19 Connecting member 20 Semiconductor manufacturing device 21 Ball bearing 22 Stepped portion 23 Soaking plate 24 Rotating mechanism 25 Rotating mechanism 26 Heater 27 Reaction tube 28 Reaction tube stage 29 Reaction furnace 41 Upper wall 42 Opening 43 Introduction port 44 Discharge port

Claims (6)

In a susceptor used in a face-down type semiconductor manufacturing apparatus in which a semiconductor film is vapor-phase grown on a surface of the substrate with the surface of the substrate facing a reaction gas channel below the substrate,
A susceptor, wherein a claw part for supporting the substrate is detachably provided. In a susceptor used in a face-down type semiconductor manufacturing apparatus in which a semiconductor film is vapor-phase grown on a surface of the substrate with the surface of the substrate facing a reaction gas channel below the substrate,
A susceptor main body and a substrate holding component mounted on the susceptor main body for holding the substrate;
The substrate holding component includes a substrate holding component main body and a claw component that is detachably attached to the substrate holding component main body by a connecting member and supports the substrate.   3. The substrate holding component body according to claim 2, wherein the susceptor body revolves and the substrate holding component is a self-revolving type that rotates independently of the susceptor body, and a rotation mechanism for rotating the substrate holding component is provided in the substrate holding component body. Susceptor. In a face-down type semiconductor manufacturing apparatus in which a semiconductor film is vapor-phase grown on a surface of the substrate with the surface of the substrate facing a reaction gas flow path below the substrate,
A semiconductor manufacturing apparatus comprising: a susceptor on which a claw component for supporting the substrate is detachably provided. In a face-down type semiconductor manufacturing apparatus in which a semiconductor film is vapor-phase grown on a surface of the substrate with the surface of the substrate facing a reaction gas flow path below the substrate,
A susceptor having a susceptor body and a substrate holding component mounted on the susceptor body to hold the substrate;
2. The semiconductor manufacturing apparatus according to claim 1, wherein the substrate holding component includes a substrate holding component main body and a claw component that is detachably attached to the substrate holding component main body by a connecting member and supports the substrate.   6. The substrate holding component main body according to claim 5, wherein the substrate holding component is a self-revolving type in which the susceptor main body revolves and the substrate holding component rotates independently of the susceptor main body, and a rotation mechanism for rotating the substrate holding component is provided in the substrate holding component main body. Semiconductor manufacturing equipment.