JP2013080678A - Connection structure of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connection structure of an electronic component capable of connecting various surface mounting electronic components having different pitch between contacts, external shape, size, and the like.SOLUTION: A pair of bus bars 13 each having a terminal 19a formed at one end 17 thereof are placed in parallel while spaced apart from each other. A pair of parallel right and left contact spring pieces 24a, 23a capable of coming into elastic contact with a contact 21 provided on one surface of a semiconductor light-emitting element 25, and right and left component seats 47b, 47a for holding the semiconductor light-emitting element 25 with the right and left contact spring pieces 24a, 23a are formed to face each other in the terminal 19a. Two adjoining contact spring pieces 24a, 23a out of the right and left contact spring pieces 24a, 23a are connected with a pair of contacts 21 of the semiconductor light-emitting element 25 interposed between the bus bars 13. Two adjoining component seats 47b, 47a out of the right and left component seats 47b, 47a abut against the other surface of the semiconductor light-emitting element 25 and the side surfaces intersecting orthogonally on both side ends thereof.

Description

  The present invention relates to an electronic component connection structure that enables connection of electronic components having different pitches between contacts.

  Patent Document 1 discloses a connection structure for an electronic component that obtains high reliability by reliably performing electrical connection of the electronic component. As shown in FIG. 20, in this electronic component connection structure, a pair of bus bars 501 and 503 is assembled to a housing, and a semiconductor light emitting element (LED) 505 as a light source is assembled to a housing. The bus bars 501 and 503 having a flat plate shape and divided into two include an electric wire connection portion 507, a Zener diode connection portion 509, a resistor connection portion 511, and an LED connection portion 513. The resistor connection portion 511 is provided with press contact blades 515 and 515 in each of the bus bars 501 and 503 divided into two. In the Zener diode connection portion 509, a single press contact blade 517 is provided on one bus bar 501, and a single press contact blade 519 is provided on the other bus bar 503.

  The zener diode 521 includes a pair of bus bars 501 on the downstream side of the resistor 527 by electrically connecting one lead portion 523 to one bus bar 501 and the other lead portion 525 to the other bus bar 503. 503 is connected in parallel and protects the LED from sudden high voltage applied to the circuit due to static electricity in the direction in which the forward electromotive force flows in the diode from destruction, and prevents energization in the direction in which the counter electromotive force flows in the diode. It also serves to protect the LED from destruction.

JP 2007-149762 A

  However, the conventional electronic component connection structure has two types of bus bars 501 and 503 in which connection parts (pressure contact blades 515, 515, pressure contact blades 517, and pressure contact blades 519) having different dimensions are formed according to the shape and size of the electronic components. Needed. In addition, only through-hole electronic components (zener diode 521 and resistor 527) having lead portions can be mounted, and there has been a problem that it is not possible to connect surface-mounted electronic components, which have recently been demanded and have become inexpensive.

  The present invention has been made in view of the above situation, and an object thereof is to provide an electronic component connection structure capable of connecting various surface mount electronic components having different pitches, outer shapes, sizes, and the like between contacts. It is in.

The above object of the present invention is achieved by the following configuration.
(1) At least a pair of bus bars each having a terminal portion formed at one end thereof are arranged in parallel and spaced apart, and each terminal portion is at least a pair that can be elastically contacted with a pair of contact portions provided on one surface of the electronic component. The left and right contact spring pieces and the left and right contact spring pieces sandwiched between the left and right contact spring pieces, and the two left and right contact spring pieces are adjacent to each other. The two component seats that are connected to the pair of contact portions of the electronic component disposed between the bus bars and that are adjacent to each other among the left and right component seats are the other surface of the electronic component and both side ends of the other surface. An electronic component connection structure, wherein the electronic component abuts against each orthogonal side surface.

According to the electronic component connection structure having the configuration (1), at least a pair of the left and right contact spring pieces and the left and right component seats that sandwich the electronic component between the left and right contact spring pieces are formed to face each other. At least a pair of bus bars having terminal portions are spaced apart and arranged in parallel, and two adjacent contact spring pieces among the left and right contact spring pieces in each pair of bus bars are connected to a pair of contact parts of an electronic component disposed between the bus bars. Connected. Accordingly, various electronic components having different inter-contact pitches, outer shapes, sizes, and the like can be connected to the terminal portions between each pair of bus bars arranged in parallel at a desired interval.
Further, two adjacent component seats among the left and right component seats abut on the other surface of the electronic component and the side surfaces orthogonal to each other at both ends of the other surface. Therefore, the lateral displacement of the electronic component with respect to the terminal portion of the bus bar can be prevented, and the connection between the left and right contact spring pieces and the contact portion is stabilized.
Further, at least a pair of bus bars arranged in parallel can have the same shape, and the bus bar shape can be one type.

(2) In the electronic component connection structure according to (1), the bus bar is formed in a U shape so that a pair of side walls are parallel to each other, and the contact spring pieces and The connection structure for electronic components, wherein the left and right component seats are stamped and formed.

  According to the electronic component connection structure having the configuration (2) above, the bus bar body is formed by being bent into a U shape, and the left and right contact spring pieces and the left and right component seats are formed by punching on a pair of opposing side walls. Are formed respectively. Thereby, the elastic contact structure which has many electrical contact parts can be manufactured easily and compactly.

(3) At least a pair of bus bars each having a terminal portion formed at one end are arranged in parallel with a separation, and each terminal portion is a contact spring that can be elastically contacted with a pair of contact portions provided on one surface of the electronic component. And each contact point of the electronic component in which the contact spring piece in each terminal portion is disposed between the bus bars. An electronic component connection structure, wherein the component seat portion in each terminal portion abuts against the other surface of the electronic component and the side surfaces orthogonal to each other at both ends of the other surface.

According to the electronic component connection structure having the configuration of (3) above, at least a pair of contact spring pieces and terminal portions formed by opposing the contact spring pieces and the component seats sandwiching the electronic components by the contact spring pieces are provided. The bus bars are spaced apart and arranged in parallel, and the contact spring pieces at the terminal portions are connected to the contact portions of the electronic components disposed between the bus bars. Accordingly, various electronic components having different inter-contact pitches, outer shapes, sizes, and the like can be connected to the terminal portions between each pair of bus bars arranged in parallel at a desired interval.
In addition, the component seat portion in each terminal portion abuts on the other surface of the electronic component and each side surface that is orthogonal at both ends of the other surface. Therefore, the lateral displacement of the electronic component with respect to the terminal portion of the bus bar can be prevented, and the connection between the contact spring piece and the contact portion is stabilized.

(4) The electronic component connection structure according to any one of (1) to (3), wherein the electronic component is a semiconductor light emitting element, and the semiconductor light emitting element has a light emitting portion between the bus bars. A connection structure for an electronic component, wherein a reflection surface is formed on each side wall surface that is disposed and sandwiches the light emitting portion of the bus bar.

  According to the electronic component connection structure having the configuration (4), the light emitting portion of the semiconductor light emitting element is disposed in a state of being sandwiched between at least a pair of bus bars spaced apart in parallel. Each side wall of the two bus bars sandwiching the light emitting part is formed by a reflecting surface, so that the light emitted from the light emitting part is reflected by the reflecting surface and directed in the direction of emission, and the emitted light can be used effectively. It becomes.

  According to the electronic component connection structure of the present invention, it is possible to connect various surface mounting electronic components having different pitches, outer shapes, sizes, and the like between the contacts.

It is a perspective view of a pair of bus bars used for the connection structure of the electronic component which concerns on 1st Embodiment of this invention. It is a perspective view of the housing which accommodated the bus-bar shown in FIG. FIG. 2 is a perspective view of one bus bar shown in FIG. 1. (A) is a plan view of the bus bar shown in FIG. 1, (b) is an AA cross-sectional arrow view, (c) is a BB cross-sectional arrow view, and shows a mounting state of electronic components It is. (A) is a perspective view of a semiconductor light emitting element, (b) is a perspective view of a Zener diode. It is a figure explaining the bus-bar assembly | attachment process in the connection structure of the electronic component which concerns on 1st Embodiment of this invention. It is a figure explaining an electronic component assembly | attachment process similarly. It is a figure explaining a housing assembly process similarly. It is a figure explaining an electric wire holder assembly process similarly. It is a perspective view of the LED unit using the connection structure of the electronic component which concerns on 1st Embodiment of this invention. (A) is a top view of the LED unit which concerns on a modification, (b) is the CC sectional view taken on the line, (c) is the DD sectional view taken on the arrow. It is a principal part enlarged view of FIG.11 (c). It is a perspective view of a pair of bus bar used for the connection structure of the electronic component which concerns on 2nd Embodiment of this invention. It is a perspective view of the connection structure of the conventional electronic component.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view of two bus bars used in the electronic component connection structure according to the first embodiment of the present invention, and FIG. 2 is a perspective view of a housing that houses the bus bars shown in FIG.
The electronic component connection structure according to the first embodiment includes two identically-shaped bus bars 13 shown in FIG. The two bus bars 13 are accommodated and used in a housing 15 shown in FIG.

  The two bus bars 13 according to the first embodiment form upper and lower two-stage terminal portions 19 a and 19 b at one end 17, and are arranged in parallel at a distance from each other. The bus bar 13 of the present embodiment includes upper and lower two-stage terminal portions 19a and 19b so that a plurality of types (two types in the present embodiment) of the first and second electronic components 11a and 11b can be connected. However, the connection structure of the electronic component according to the present invention is not limited to this, and may be configured with only one terminal portion 19a.

The upper terminal portion 19a includes a pair of parallel left and right contact spring pieces 23a and 24a that can be elastically contacted with the pair of contact portions 21 of the first electronic component 11a, and the left and right contact spring pieces 23a and 24a. The left and right component seat portions 47a and 47b sandwiching 11a are formed to face each other.
The lower terminal portion 19b includes a pair of parallel left and right contact spring pieces 23b and 24b that can be elastically contacted with a pair of contact portions 21 of different types of second electronic components 11b, and the left and right contact spring pieces 23b and 24b. The left and right component seats 49a and 49b sandwiching the electronic component 11b are formed to face each other.

  In the first embodiment, one bus bar 13 is provided with two pairs of left and right contact spring pieces 23a, 24a, 23b, 24b at the tips of a pair of contact spring pieces 23, 24 branched in a substantially Y shape. Of the four left and right contact spring pieces 23 a, 24 a, 23 a, 24 a in the upper row of the bus bars 13 arranged in parallel, the electric contact portions 45 of the two adjacent left and right contact spring pieces 24 a, 23 a are arranged between the two bus bars 13. It connects with a pair of contact part 21 provided in one surface of the semiconductor light emitting element 25 which is the 1st electronic component 11a which was made (refer FIG. 4). In addition, of the four left and right contact spring pieces 23b, 24b, 23b and 24b in the lower stage of the bus bar 13 arranged in parallel, the electric contact portion 45 of the two left and right contact spring pieces 24b and 24b straddling the one left and right contact spring piece 23b. Is connected to a pair of contact portions 21 provided on one surface of a Zener diode 27, which is the second electronic component 11b located below the semiconductor light emitting element 25, between the two bus bars 13 (see FIG. 4). .

FIG. 3 is a perspective view of one bus bar 13 shown in FIG.
A part of the bus bar 13 is projected to the outside of the housing 15 in a state of being mounted on the housing 15. In this embodiment, the side where a part of the bus bar 13 protrudes from the housing 15 is referred to as “rear”, and the opposite side is referred to as “front”. A pressure contact blade 31 is provided at the rear end of the bus bar 13 for electrically contacting the covered conductor with the tearing of the covered electric wire. A rear abutment piece 33, a rear elastic leg 35, a front elastic leg 37, and a front abutment piece 39 are connected to the front portion of the press contact blade 31.

  The front contact piece 39 on the back side in FIG. 3 is connected to upper and lower two-stage terminal portions 19a and 19b serving as one end 17 (front end) of the bus bar 13 via a connecting portion 41 (see FIG. 4A). It is installed. The press contact blade 31, the rear abutting piece 33, the rear elastic leg 35, the front elastic leg 37, the front abutting piece 39, and the terminal portions 19a and 19b are integrally punched out by sheet metal processing, and then have the shape shown in FIG. It is bent into The terminal portions 19a and 19b of the bus bar 13 are bent and formed in a U shape so that the pair of side walls 43 are parallel to each other, and contact spring pieces 23 and 24 are punched and formed on the side walls 43, respectively. The body of the bus bar 13 is formed by being bent in a U-shape, and two pairs of left and right contact spring pieces are formed at the ends of the contact spring pieces 23 and 24 branched into a substantially Y shape by punching on a pair of opposing side walls 43. 23a, 24a, 23b, and 24b and left and right component seats 47a, 47b, 49a, and 49b that face the left and right contact spring pieces 23a, 24a, 23b, and 24b are formed. The elastic contact structure is easy and compact.

4A is a plan view of the bus bar 13 shown in FIG. 1, FIG. 4B is a sectional view taken along the line AA, and FIG. 4C is a sectional view taken along the line BB. FIG. 5A is a perspective view of the semiconductor light emitting element 25, and FIG. 5B is a perspective view of the Zener diode 27.
In one bus bar 13, the pair of contact spring pieces 23, 24 are formed to be parallel, and two pairs of left and right contact spring pieces 23a, 24a, 23b, 24b are provided at the respective ends branched in a substantially Y shape. Have. The electrical contact portion 45 protruding from the tip of each of the left and right contact spring pieces 23a, 24a, 23b, 24b is formed in a triangular shape with the contact point being an apex angle. As shown in FIG. 4A, two bus bars 13 are spaced apart in parallel. Thereby, as shown in FIG.4 (c), the electrical contact part 45 of the front-end | tip of the right-and-left contact spring piece 23a, 24a, 23b, 24b of the bus bar 13 arrange | positioned in parallel is arrange | positioned at eight places of each four places. Will be.

The upper four left and right contact spring pieces 23a, 24a, 23a, 24a on the upper stage of the bus bar 13 arranged in parallel are arranged on the upper four left and right component seats 47a, 47b, 47a, 47b are confronted.
The left and right component seats 47a and 47b in each terminal portion 19a are at the first contact portion 44 that contacts the other surface (the upper surface in FIG. 4) of the first electronic component 11a and at both ends of the other surface. And a second abutting portion 46 that abuts on each of the orthogonal side surfaces (left and right side surfaces in FIG. 4).
Further, the lower left and right component seats formed on the respective bus bars 13 are provided on the lower four electrical contact portions 45 of the four left and right contact spring pieces 23b, 24b, 23b, 24b in the lower stage of the bus bars 13 arranged in parallel. The parts 49, 49b, 49a, 49b are confronted.

  Between the upper left and right component seats 47a, 47b, 47a and 47b and the four electric contact portions 45 on the upper side of the four left and right contact spring pieces 23a, 24a, 23a and 24a, the semiconductor light emitting element 25 is provided. It is installed. A Zener diode 27 is mounted between the four electrical contact portions 45 on the lower side of the four left and right contact spring pieces 23b, 24b, 23b, and 24b and the lower left and right component seat portions 49 in the lower stage. As shown in FIG. 5A, the semiconductor light emitting element 25 is a first electronic component 11a for surface mounting in which a pair of contact portions 21 are provided on one surface. Also, the Zener diode 27 is a second electronic component 11b for surface mounting in which a pair of contact portions 21 are provided on one surface, as shown in FIG. 5B.

  As shown in FIG. 4C, the semiconductor light emitting element 25 has one surface provided with the contact portion 21 directed to the electrical contact portion 45 of the upper left and right contact spring pieces 23a, 24a and the other surface ( The back surface 25a) is in contact with the upper left and right component seats 47a, 47b, 47a, 47b. The zener diode 27 has one surface provided with the contact portion 21 directed toward the electric contact portion 45 side of the lower left and right contact spring pieces 23b, 24b, and the other surface (rear surface) of the lower left and right component seat portion. 49 abuts.

  In the present embodiment, the pitch between the contacts of the semiconductor light emitting element 25 is smaller than the pitch between the contacts of the Zener diode 27. That is, the two electronic components 11a and 11b have different contact pitches. In the electronic component connection structure of the present embodiment, two types of electronic components 11a and 11b having different pitches between contacts can be mounted simultaneously.

That is, as shown in FIG. 4C, electrical contact between two left and right contact spring pieces 24a and 23a adjacent to each other among the four left and right contact spring pieces 23a, 24a, 23a and 24a in the upper stage of the bus bar 13 arranged in parallel. The portion 45 contacts the pair of contact portions 21 of the semiconductor light emitting element 25, and two adjacent left and right component seat portions 47 b and 47 a among the upper four left and right component seat portions 47 a, 47 b, 47 a and 47 b are the semiconductor light emitting device 25. It is in contact with the other surface side.
Specifically, the first contact portions 44 of the left and right component seat portions 47b and 47a contact the back surface 25a of the semiconductor light emitting element 25, and the second contact portions 46 of the left and right component seat portions 47b and 47a are the semiconductor light emitting device 25. Are in contact with the side surfaces 25b orthogonal to each other at the left and right ends of the back surface 25a.

  On the other hand, of the four left and right contact spring pieces 23b, 24b, 23b and 24b in the lower stage of the bus bar 13 arranged in parallel, the electric contact portion 45 of the two left and right contact spring pieces 24b and 24b straddling the one left and right contact spring piece 23b. Contacts the pair of contact portions 21 of the Zener diode 27, and two left and right component seat portions 49b and 49b straddling one left and right component seat portion 49a among the lower four left and right component seat portions 49a, 49b, 49a and 49b. Is in contact with the back surface of the Zener diode 27.

  That is, in FIG. 4C, the semiconductor light emitting element 25 includes the second electrical contact portion 45 from the left side and the third electrical contact portion 45 from the left side in the upper electrical contact portion 45 of the bus bar 13 arranged in parallel. And connected to. The zener diode 27 is connected to the first electrical contact portion 45 from the left side and the third electrical contact portion 45 from the left side in the lower electrical contact portion 45 of the bus bar 13 arranged in parallel. It is also possible to connect to the second electrical contact portion 45 from the left and the fourth electrical contact portion 45 from the left side. In the present embodiment, the Zener diode 27 has a pitch between the contacts that is twice the distance between the contacts of the electrical contact portion 45, but the contact pitch of the electrical contact portion 45 is the contact pitch. Those having a distance three times the inter-pitch can also be used. In this case, the pair of contact portions 21 of the Zener diode 27 are connected to the first electrical contact portion 45 from the left side and the fourth electrical contact portion 45 from the left side.

Next, an assembling process of the connection structure of the electronic component 11 having the above configuration will be described.
FIG. 6 is a diagram for explaining the bus bar assembly process in the electronic component connection structure according to the first embodiment of the present invention, FIG. 7 is a diagram for explaining the electronic component assembly process, and FIG. FIG. 9 is a diagram for explaining the process, FIG. 9 is a diagram for similarly explaining the electric wire holder assembly process, and FIG. 10 is a perspective view of the LED unit 53 using the electronic component connection structure according to the first embodiment of the present invention.
The connection structure of the electronic component of the above embodiment can be suitably employed for the LED unit 53, for example. In order to apply the electronic component connection structure to the LED unit 53, two bus bars 13 are attached to the housing 15 as shown in FIG. 6.

  In the housing 15, two bus bar collecting chambers 55 are formed. The rear end of the bus bar storage chamber 55 is a rear wall 57, and a pair of holding grooves 59 are formed in the front inner wall surface of each bus bar storage chamber 55. The bus bar 13 inserted into the bus bar collecting chamber 55 is mounted so that the rear wall 57 is sandwiched between the rear abutting piece 33 and the rear elastic leg 35 and is prevented from dropping from the housing 15.

As shown in FIG. 7, an LED mounting opening 61 and a diode mounting opening 63 are formed on the front surface of the housing 15 in two upper and lower stages. The semiconductor light emitting element 25 is inserted into the LED mounting opening 61 with the contact portion 21 facing downward. A Zener diode 27 is inserted into the diode mounting opening 63 with the contact portion 21 facing upward. Thereby, each contact part 21 is connected to each electric contact part 45 as shown in FIG.4 (c). In addition, a resistance mounting opening (not shown) is formed on the bottom surface of the housing 15, and the resistor 28 is inserted. Accordingly, the resistor 28 is sandwiched between the front contact piece 39 and the front elastic leg 37 in the front bus bar 13, and the electrical contact portion of the front elastic leg 37 is connected to the pair of contact portions of the resistor 28. (See FIG. 1).
Here, the LED unit 53 according to this embodiment needs to be a circuit in which the resistor 28 is provided between the semiconductor light emitting element 25 and the Zener diode 27, and the anode terminal and the negative electrode terminal. Therefore, as shown in FIG. 7, the fracture portion 16 is formed between the pair of front contact pieces 39 and the front elastic legs 37 in the front bus bar 13. Thereby, the resistor 28 attached to the front bus bar 13 is connected in series with the semiconductor light emitting element 25 and the Zener diode 27.

  As shown in FIG. 8, the housing 15 in which the semiconductor light emitting element 25 and the Zener diode 27 are mounted is mounted on the lens cover 65. A housing insertion opening 67 is formed in the rear end surface of the lens cover 65. In the housing 15 inserted into the lens cover 65, the press contact blade 31 protrudes rearward inside the lens cover 65.

  As shown in FIG. 9, the wire holder 69 is inserted from the housing insertion opening 67 into the lens cover 65 to which the housing 15 is attached. U-shaped wire holding grooves 71 are formed in two places on the outer surface of the three sides of the wire holder 69. In each electric wire holding groove 71, the covered electric wire 29 is bent and attached in a U-shape. A horizontal pressure contact blade entrance slit 73 is formed on the front surface of the electric wire holder 69 across the electric wire holding grooves 71. Thereby, when the electric wire holder 69 is inserted into the lens cover 65, the press contact blade 31 of the bus bar 13 protruding rearward inside the lens cover 65 enters the press contact blade entry slit 73, and the press contact blade 31 and the electric wire 29 conductors are connected.

  The electric wire holder 69 inserted into the lens cover 65 is engaged with a locking claw 77 projecting from the side surface in a locking hole 75 formed on the side of the lens cover 65, so that the housing 15 from the lens cover 65 is secured. And the detachment | leave with the electric wire holder 69 itself is controlled. The LED unit 53 shown in FIG. 10 is configured by mounting the housing 15 and the wire holder 69 on the lens cover 65.

  Thus, in the electronic component connection structure of the first embodiment, the terminal portions 19a and 19b formed by arranging two pairs of parallel left and right contact spring pieces 23a, 24a, 23b, and 24b in two upper and lower stages are provided. The two bus bars 13 are spaced apart and arranged in parallel. The electric contact portions 45 of the two left and right contact spring pieces 24 a and 23 a among the four left and right contact spring pieces 23 a, 24 a, 23 a and 24 a in the upper stage of the bus bar 13 arranged in parallel are between the two bus bars 13. Are connected to a pair of contact portions 21 of the semiconductor light emitting element 25 arranged in the. In addition, of the four left and right contact spring pieces 23b, 24b, 23b and 24b in the lower stage of the bus bar 13 arranged in parallel, the electric contact portion 45 of the two left and right contact spring pieces 24b and 24b straddling the one left and right contact spring piece 23b. Is connected to the pair of contact portions 21 of the Zener diode 27 located below the semiconductor light emitting element 25 between the two bus bars 13, and the electronic components 11 having different pitches, outer shapes, and sizes between the contacts can be connected. .

  In addition, two bus bars 13 having a pair of contact spring pieces 23, 24 in which two pairs of parallel left and right contact spring pieces 23a, 24a, 23b, 24b are formed at the respective ends branched in a substantially Y shape are parallel. By being spaced apart, four electrical contact portions 45 on one side are arranged on eight sides. As a result, the size and size of the electrical contact portion 45 of the two left and right contact spring pieces 24a and 23a adjacent to each other among the four left and right contact spring pieces 23a, 24a, 23a and 24a in the upper stage of the two bus bars 13 arranged in parallel are increased. The semiconductor light emitting element 25 having a small pitch between the contacts can be connected, and two left and right contact spring pieces 24b and 24b straddling one left and right contact spring piece 23b among the four left and right contact spring pieces 23b, 24b, 23b and 24b in the lower stage. The zener diode 27 having a large size and a large pitch between the contacts can be connected to the electrical contact portion 45.

Further, two adjacent left and right component seats 47b and 47a out of the upper four left and right component seats 47a, 47b, 47a and 47b are provided with a first contact portion 44 which contacts the back surface 25a of the semiconductor light emitting element 25; And a second abutting portion 46 that abuts on the side surfaces 25b orthogonal to each other at both right and left ends of the back surface 25a of the semiconductor light emitting element 25. Therefore, the lateral deviation of the semiconductor light emitting element 25 with respect to the terminal portion 19a of the bus bar 13 can be prevented, and the connection between the left and right contact spring pieces 24b, 24b and the contact portion 21 is stabilized.
Furthermore, according to the bus bar 13 of the said embodiment, a pair of bus bar 13 arrange | positioned in parallel can be made into the same shape, and a bus bar shape can be made into one kind.

Next, a modification of the above-described electronic component connection structure will be described.
11A is a plan view of the LED unit 53 according to the modification, FIG. 11B is a sectional view taken along the line CC, FIG. 11C is a sectional view taken along the line DD, and FIG. FIG.
In the electronic component connection structure according to this modification, the first electronic component 11a is the semiconductor light emitting element 25, and the light emitting portion 79 is disposed between the two bus bars 13A. On the other hand, the two bus bars 13 </ b> A are formed with reflecting surfaces 83 on the respective side wall surfaces 81 sandwiching the light emitting portion 79.

  In this modification, the light emitting portion 79 of the semiconductor light emitting element 25 is disposed in a state of being sandwiched between two bus bars 13A that are spaced apart in parallel. By forming the reflecting surface 83 on the side wall surface 81 of each side wall 43 of the two bus bars 13A sandwiching the light emitting portion 79, the light emitted from the light emitting portion 79 is reflected on the reflecting surface 83 as shown in FIG. The reflected light is directed toward the lens 65a of the lens cover 65 arranged in the direction of emission, and the emitted light can be effectively used.

Next, an electronic component connection structure according to a second embodiment of the present invention will be described.
FIG. 13 is a perspective view of a pair of bus bars used in the electronic component connection structure according to the second embodiment of the present invention.
As shown in FIG. 13, the electronic component connection structure according to the second embodiment includes a pair of symmetrical bus bars 201 and 203 as main parts. The pair of bus bars 201 and 203 are used by being accommodated in the housing 15 shown in FIG. 2 as in the first embodiment.

  The pair of bus bars 201 and 203 according to the second embodiment form upper and lower two-stage terminal portions 119a and 119b at one end 117, respectively, and are arranged in parallel at a distance from each other. Note that the bus bars 201 and 201 of the present embodiment have upper and lower two-stage terminal portions 119a and 119b so that a plurality of types (two types in the present embodiment) of the first and second electronic components 11a and 11b can be connected. However, the connection structure of the electronic component according to the present invention is not limited to this, and may be configured with only one terminal portion 119a.

The upper terminal portion 119a includes contact spring pieces 123 and 124 that can be elastically contacted with the pair of contact portions 21 of the first electronic component 11a, and a component that holds the electronic component 11a between the contact spring pieces 123 and 124. The seats 147 and 149 are formed to face each other.
The lower terminal portion 119b has contact spring pieces 223 and 224 that can be elastically contacted with a pair of contact portions 21 of different types of second electronic components 11b, and the contact spring pieces 223 and 224, respectively. The component seats 247 and 249 to be sandwiched are formed to face each other.

  The pair of bus bars 201 and 203 according to the present embodiment are formed symmetrically with each other so as to form upper and lower two-stage terminal portions 119a and 119b at one end, and are spaced apart and arranged in parallel. Note that the bus bars 201 and 203 of the present embodiment have upper and lower two-stage terminal portions 119a and 119b so that a plurality of types (two types in the present embodiment) of the first and second electronic components 11a and 11b can be connected. Although it is configured, the connection structure of the electronic component of the present invention is not limited to this, and may be configured with only one stage terminal portion 119a.

In the second embodiment, each of the bus bars 201 and 203 is provided with contact spring pieces 123 and 124 constituting the upper terminal portion 119a and contact spring pieces 223 and 224 constituting the lower terminal portion 119b.
A semiconductor light emitting element in which the electrical contact portions 145 of the two contact spring pieces 123 and 124 in the upper stage of the bus bars 201 and 203 arranged in parallel is the first electronic component 11 a arranged between the pair of bus bars 201 and 203. It connects with a pair of contact part 21 provided in one surface of 25. In addition, the second electronic component in which the electrical contact portion 45 of the two contact spring pieces 223 and 224 in the lower stage of the bus bars 201 and 203 arranged in parallel is positioned below the semiconductor light emitting element 25 between the pair of bus bars 201 and 203. It connects with a pair of contact part 21 provided in one surface of the Zener diode 27 which is 11b.

  In addition, similarly to the bus bar 13 of the first embodiment, a press contact blade 31 is provided at the rear ends of the bus bars 201 and 203 for electrically contacting the covered electric wire with the tearing conductor. A rear abutment piece 33, a rear elastic leg 35, a front elastic leg 37, and a front abutment piece 39 are connected to the front portion of the press contact blade 31.

The terminal portions 119a and 119b of each bus bar 201 (203) are bent inwardly in an inverted J shape so that the upper ends of the outer walls 143 are parallel, and contact spring pieces 123 and 223 are formed on the outer walls 143, respectively. (124, 224) is stamped and formed.
A component seat portion 147 (149) corresponding to the contact spring piece 123 (124) is formed at the upper end portion of the outer wall 143 formed by bending the main body of each bus bar 201 (203) in an inverted J shape. In the lower end portion of the outer wall 143, a component seat portion 247 (249) corresponding to the contact spring piece 223 (224) is formed. The contact spring piece 123 (124) is formed in an L-shaped cross section in which an intermediate portion of the outer wall 143 is cut and raised at a right angle inward along the bent portion, and the piece 151 is cut and raised. 145.

  The component seat portion 147 (149) includes a first contact portion 144 that contacts the other surface (upper surface in FIG. 13) of the first electronic component 11a, and each side surface that is orthogonal to both ends of the other surface ( 13, a second abutting portion 46 that abuts on the left and right side surfaces). The first contact portion 144 is formed at the lower end edge of the inner wall formed by bending the upper end portion of the outer wall 143 inwardly in an inverted J shape. The second contact portion 146 is formed at the leading edge of a cut-and-raised piece 153 formed by cutting and raising the vicinity of the upper end portion of the outer wall 143 along the bent portion at a right angle inward.

  By forming the contact spring pieces 123, 223 (124, 224) and the component seat portions 147, 247 (149, 249) facing the contact spring pieces 123, 223 (124, 224) by punching, An elastic contact structure having a large number of electrical contact portions 45 and 145 can be easily and compactly manufactured.

  According to the electronic component connection structure of the second embodiment described above, the contact spring pieces 123 and 124 and the component seat portions 147 and 149 that sandwich the semiconductor light emitting element 25 by the contact spring pieces 123 and 124 face each other. A pair of bus bars 201, 203 having terminal portions 119 a formed in this manner are arranged in parallel with appropriate separation, and contact spring pieces 123, 124 in the terminal portions 119 a are disposed between the bus bars 201, 203. Are connected to the respective contact portions 21. Therefore, various semiconductor light emitting elements 25 having different contact pitches, outer shapes, sizes, and the like can be connected to the terminal portions 119a between the bus bars 201 and 203 arranged in parallel at a desired interval.

In addition, the component seats 147 and 149 in the terminal portion 119a are provided on the first contact portion 144 that contacts the back surface 25a of the semiconductor light emitting element 25 and the side surfaces 25b that are orthogonal to the left and right ends of the back surface 25a of the semiconductor light emitting element 25. A second abutting portion 146 that abuts. Therefore, the lateral displacement of the semiconductor light emitting element 25 with respect to the terminal portions 119a of the bus bars 201 and 203 can be prevented, and the connection between the contact spring pieces 123 and 124 and the contact portion 21 is stabilized.
The pair of bus bars 201 and 203 arranged in parallel is punched and formed as an integral symmetrical shape by opening the connecting portion, and then the pair of bus bars 201 and 203 are punched and formed by cutting and separating the connecting portion. One type of mold can also be used.

  The connection structure of the electronic component of the present invention is not limited to the above-described embodiment, and can be appropriately modified and improved. In addition, the material, shape, dimensions, number, arrangement location, and the like of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.

11a First electronic component (electronic component)
11b Second electronic component 13 Bus bar 17 One end 19a Terminal portion 19b Terminal portion 21 Contact portion 23 Contact spring piece 23a, 24a Left and right contact spring piece 23b, 24b Left and right contact spring piece 24 Contact spring piece 25 Semiconductor light emitting device (first electron parts)
27 Zener diode (second electronic component)
43 Side wall 45 Electrical contact portion 79 Light emitting portion 81 Side wall surface 83 Reflecting surface

Claims (4)

At least a pair of bus bars each having a terminal portion formed at one end are arranged in parallel and spaced apart from each other, and each terminal portion has at least a pair of parallel contacts that can be elastically contacted with a pair of contact portions provided on one surface of the electronic component. The left and right contact spring pieces, and the left and right component seats sandwiching the electronic component between these left and right contact spring pieces are formed opposite to each other,
Two adjacent contact spring pieces among the left and right contact spring pieces are connected to a pair of the contact parts of the electronic component disposed between the bus bars, and two adjacent component seat parts of the left and right part seat parts are A connection structure for an electronic component, wherein the electronic component is in contact with the other surface of the electronic component and the side surfaces orthogonal to each other at both ends of the other surface. The electronic component connection structure according to claim 1,
The bus bar is formed in a U shape so that a pair of side walls are parallel to each other, and the contact spring piece and the left and right component seats are stamped and formed on each of the side walls. Connection structure. At least a pair of bus bars each having a terminal portion formed at one end are arranged in parallel with a separation, and each terminal portion has a contact spring piece that can be elastically contacted with a pair of contact portions provided on one surface of the electronic component; The contact spring piece and the component seat that sandwiches the electronic component are formed opposite to each other,
The contact spring piece in each terminal portion is connected to each contact portion of the electronic component disposed between the bus bars, and the component seat portion in each terminal portion is connected to the other surface of the electronic component and the other side. An electronic component connection structure, wherein the electronic component abuts against each orthogonal side surface at both ends of the surface. It is the connection structure of the electronic component of any one of Claims 1-3,
The electronic component is a semiconductor light emitting device;
In the semiconductor light emitting device, a light emitting portion is disposed between the bus bars,
A connection structure for an electronic component, wherein a reflection surface is formed on each side wall surface of the bus bar sandwiching the light emitting portion.

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