JP2013071297A - Seal structure and joining device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a seal structure and a joining device whose sealing performance can be prevented from decreasing even when it is used for a long time under a high-temperature environment.SOLUTION: The seal structure includes: a hot plate 40 provided with a heating mechanism; a frame body 42 which is positioned lateral to the hot plate 40; and a seal part 52 which is positioned between the hot plate 40 and the frame body 42 and seals a gap between the hot plate 40 and the frame body 42. The seal part 52 is arranged in a groove 48 which is formed in the hot plate 40 or in the frame body 42. Concave parts 54 and 56 are formed in the direction perpendicular to the depth of the groove 48. The concave parts 54 and 56 are positioned in the groove 48 with the seal part 52 arranged in the groove 48 formed in the hot plate 40 or in the frame body 42.

Description

  The present invention relates to, for example, a seal structure used in a joining apparatus that joins base materials for bonding together by thermocompression bonding, and a joining apparatus provided with the seal structure.

  As a conventional seal structure, a ring-shaped packing composed of a ring-shaped main body and a ring-shaped lip is used. The main body of the packing is fitted in a groove formed in the metal flange, and a lip projects from the main body in the direction of the penetration portion. The lip comes into contact with the penetrating portion for sealing (see FIG. 3 of Patent Document 1 below).

Japanese Patent No. 3418680

  By the way, in the sealing material of the above prior art, the shape becomes complicated, and when the temperature becomes high, thermal stress is applied to the lip which is a thin portion, and the lip is easily broken. As a result, if the conventional seal structure is used in a high temperature environment for a long time, the seal performance may be deteriorated.

  In view of the above problems, an object of the present invention is to provide a sealing structure and a joining device that have a simple shape and can prevent deterioration in sealing performance even when used for a long time in a high temperature environment.

  The present invention includes a heating platen provided with a heating mechanism, a frame body part positioned on the side of the heating platen part, and the heating platen and the frame plate part positioned between the heating platen and the frame body part. A seal portion that seals a gap with the frame body portion, wherein the seal portion is disposed in a groove portion formed in the hot platen portion or the frame body portion, and the seal portion includes: A recess is formed in a direction perpendicular to the depth direction of the groove, and the seal is disposed in the groove formed in the hot platen or the frame body, and the recess is in the groove of the groove. It is located in.

  In this case, it is preferable that a flat portion that is in surface contact with the inner wall surface of the groove portion is formed in the seal portion.

  In this case, it is preferable that the concave portion is formed to have a V shape in a cross-sectional view when the seal portion is cut in the thickness direction.

  In this case, when the seal portion is heated in a state where the gap between the heat plate portion and the frame body portion is sealed by the seal portion, the volume increase accompanying the thermal expansion of the seal portion is the heat plate portion. It is preferable that the seal portion is set to be smaller than the volume of the concave portion when the seal portion is not heated in a state where the gap between the frame portion and the frame portion is sealed by the seal portion.

  In this case, it is preferable that the seal portion is made of fluorine rubber.

  The present invention provides a pedestal part to which a predetermined load is applied by a pressurizing mechanism, a heating platen part provided with a heating mechanism, the pedestal part, and the heat applied using the load applied to the pedestal part as an applied pressure. A support part for transmitting to the board part; a frame part located on the side of the hot board part; and a position between the hot board part and the frame body part, the hot board part and the frame part And a vacuum chamber formed between the adjacent hot platen portions connected to a vacuum source, and the substrates for bonding are thermocompression bonded in the vacuum chamber The sealing portion is arranged in a groove formed in the heating platen or the frame body portion, and the sealing portion is oriented in a direction perpendicular to the depth direction of the groove. In a state where a recess is formed and the seal portion is disposed in the groove portion formed in the hot platen portion or the frame body portion. Wherein the recess is located in the groove of the groove.

  In this case, it is preferable that a flat portion that is in surface contact with the inner wall surface of the groove portion is formed in the seal portion.

  In this case, it is preferable that the concave portion is formed to have a V shape in a cross-sectional view when the seal portion is cut in the thickness direction.

  In this case, when the seal portion is heated in a state where the gap between the heat plate portion and the frame body portion is sealed by the seal portion, the volume increase accompanying the thermal expansion of the seal portion is the heat plate portion. It is preferable that the seal portion is set to be smaller than the volume of the concave portion when the seal portion is not heated in a state where the gap between the frame portion and the frame portion is sealed by the seal portion.

  In this case, it is preferable that the seal portion is made of fluorine rubber.

  According to the present invention, even when used for a long time in a high temperature environment, the seal part that seals the gap between the hot platen part and the frame body part is not damaged by thermal expansion, and high sealing performance can be maintained. it can.

  Moreover, since the flat part is formed in the seal part, the seal part is in surface contact with the inner wall surface of the groove part. Thereby, even when the frame body portion moves relative to the hot platen portion, the seal portion itself can be prevented from being twisted.

  Furthermore, the cost is reduced by using an existing O-ring as the seal portion. Moreover, it can process easily by using the existing O-ring.

It is a block diagram when each hot-plate part of the joining apparatus which concerns on one Embodiment of this invention will be in an initial state (non-overlapping state). It is a block diagram when each hot-plate part of the joining apparatus which concerns on one Embodiment of this invention is piled up. It is a block diagram of the frame part arrange | positioned at the side of the heat | fever board part of the joining apparatus which concerns on one Embodiment of this invention. It is sectional drawing of the seal | sticker part used for the joining apparatus which concerns on one Embodiment of this invention. It is a perspective view of the seal part used for the joining device concerning one embodiment of the present invention. It is sectional drawing which showed the processing method of the seal part used for the joining apparatus which concerns on one Embodiment of this invention. It is sectional drawing of the modification 1 of the seal part used for the joining apparatus which concerns on one Embodiment of this invention. It is sectional drawing of the modification 2 of the seal part used for the joining apparatus which concerns on one Embodiment of this invention. It is sectional drawing of the modification 3 of the seal part used for the joining apparatus which concerns on one Embodiment of this invention. It is sectional drawing of the modification 4 of the seal part used for the joining apparatus which concerns on one Embodiment of this invention.

  A seal structure and a joining device according to an embodiment of the present invention will be described with reference to the drawings. In the following description, a configuration in which the seal structure of the present invention is applied to the joining apparatus of the present invention will be described as an embodiment.

  The joining apparatus of this embodiment is an apparatus for joining base materials for bonding together by thermocompression bonding, and a press mechanism is used. Note that the base material for bonding is a substrate before bonding, and includes a subdivided child substrate in addition to the wafer and the aggregate substrate. A plurality of bonding substrates are bonded to each other with the bonding apparatus of this embodiment to produce a composite substrate. The base material for bonding for producing the composite substrate may be different or the same kind. The produced composite substrate is used as a component of an electronic device.

  As shown in FIGS. 1 and 2, the joining device 20 includes a housing 22. Inside the housing 22, a plurality of heating platens 40 are arranged side by side along the vertical direction. A plurality of base materials for bonding, which are objects to be joined, are arranged between the hot platens 40. A pressure mechanism 24 is disposed at the bottom of the housing 22. For example, a hydraulic piston rod 24 </ b> A that can be expanded and contracted in the vertical direction is applied to the pressurizing mechanism 24. The pressurizing mechanism 24 is driven and controlled by a control unit (not shown).

  A lower pedestal portion 26 is connected to the pressure mechanism 24. A plurality of support portions 28 are provided on the upper surface of the lower pedestal portion 26. For this reason, when the piston rod 24A as the pressurizing mechanism 24 expands and contracts in the vertical direction, the lower pedestal portion 26 and the plurality of support portions 28 move in the vertical direction.

  An upper pedestal 30 is fixed to the upper part of the housing 22. A plurality of support portions 32 are provided on the lower surface of the upper pedestal portion 30. In addition, between the support part 28 of the lower pedestal part 26 and the support part 32 of the upper pedestal part 30, a plurality of (for example, five stages) hot platen parts 40A, 40B, 40C, 40D, 40E is sandwiched with a predetermined pressure. Hereinafter, the heating platens 40A, 40B, 40C, 40D, and 40E are collectively referred to as the heating platen 40.

  Inside the housing 22, a plurality of heating platens 40 are arranged side by side along the vertical direction. In the joining apparatus 10 of the present embodiment, five hot platens 40 are provided inside the housing 22 and function as a multi-stage laminating and laminating apparatus.

  As shown in FIG. 2, in the joining apparatus 20 of the present embodiment, four vacuum chambers 62A, 62B, 62C, and 62D are formed when all of the five stages of the heating platens 40 are in pressure contact with each other. Substrate bonding processing is performed in the chambers 62A, 62B, 62C, and 62D. The vacuum chambers 62A, 62B, 62C, and 62D are collectively referred to as the vacuum chamber 62.

  Here, the configuration of the frame body portion 42 of the hot platen portion 40 will be described. In addition, the structure of the 1st step | paragraph and the 2nd step | paragraph hot platen part 40A, 40B located in the lowest part among the five hot platen parts 40 is demonstrated. The configuration of the other heating platens 40C, 40D, and 40E is basically the same as the configuration of the heating plates 40A and 40B, and thus the description thereof is omitted.

  As shown in FIG. 3, each heat platen unit 40 is provided with a heat source unit 44 and a cooling unit 46. Thereby, the heating platen 40 can be heated by the heat source unit 44, or the heating platen 40 can be cooled by the cooling unit 46.

  As the heat source unit 44, for example, a heater is applied. Further, as the cooling unit 46, a cooling water channel through which cooling water flows is applied.

  On the outer surface 40Ba of each hot platen 40 forming the vacuum chamber, the frame body portion 42 is disposed with a minute gap. The frame body portion 42 is annularly disposed so as to surround the side of the hot platen portion 40.

  As shown in FIG. 3, the frame body portion 42 has an annular shape, and the first groove portion 48 is formed in an annular shape on the first side surface 42 </ b> A of the frame body portion 42. In addition, 42 A of 1st side surfaces of the frame part 42 are made into the side surface which opposes the hot platen part 40B arrange | positioned along with a horizontal direction (for example, side surface side).

  Further, the second groove portion 50 is formed in an annular shape on the second side surface 42 </ b> B of the frame body portion 42. The second side surface 42B of the frame body portion 42 is a side surface facing the heating platen 40A arranged in the vertical direction (for example, the lower surface side).

  A first seal portion 52 is disposed in the first groove portion 48 formed on the first side surface 42 </ b> A of the frame body portion 42. Since the frame body portion 42 is disposed so as to surround the side of the heating platen 40, the first seal portion 52 is disposed in an annular shape along the side of the heating platen 40. The first seal portion 52 is made of, for example, heat-resistant fluorine-based rubber. The first seal portion 52 has a function of sealing a gap between the outer side surface 40Ba of the heating platen 40B located on the inner side surface side of the frame body portion 42 and the first side surface 42A (inner side surface) of the frame body portion 42.

  As shown in FIG. 3, a flange 68 is fixed to the frame body portion 42. A predetermined elastic force is applied to the flange 68 from the coil spring 70. For this reason, when the heating platen 40B located on the upper side does not receive the pressure from the heating platen 40A located on the lower side, the coil spring 70 is extended, and the frame body portion 42 is elastic force from the coil spring 70. In response, it moves relative to the lower side with respect to the outer side surface 40Ba of the hot platen 40B located on the upper side. On the other hand, for example, when the hot platen 40B located on the upper side receives pressure from the hot platen 40A located on the lower side when the vacuum chamber is formed, the coil spring 70 is heated to the lower side. It shrinks by the pressure from the board part 40A. Thereby, the frame body part 42 moves relative to the upper side with respect to the outer side surface 40Ba of the hot platen part 40B located on the upper side, and slides via the first seal part 52.

  As shown in FIG. 4, the upper surface and the lower surface of the first seal portion 52 are perpendicular to the depth direction of the first groove portion 48 on the basis of the state where the first seal portion 52 is accommodated in the first groove portion 48. Recesses 54 and 56 are formed in various directions. The concave portion 54 on the upper surface and the concave portion 56 on the lower surface are formed at positions that are vertically symmetrical. As shown in FIG. 5, the shape of each of the recesses 54 and 56 is formed to be V-shaped when viewed in a cut direction in the thickness direction of the first seal portion 52.

  Planar portions 52A and 52B are formed in the radially outer and radially inner regions with respect to the concave portion 54 on the upper surface of the first seal portion 52, respectively. Further, in a state where the first seal portion 52 is accommodated in the first groove portion 48, the flat portions 52 </ b> A and 52 </ b> B are in surface contact with a part of the inner wall surface 48 </ b> A of the first groove portion 48.

  Planar portions 52C and 52D are respectively formed in the radially outer and radially inner regions with reference to the recess 56 on the lower surface of the first seal portion 52. Further, in a state where the first seal portion 52 is accommodated in the first groove portion 48, the planar portions 52 </ b> C and 52 </ b> D are in surface contact with a part of the inner wall surface 48 </ b> B of the first groove portion 48.

  The concave portions 54 and 56 on the upper surface and the lower surface of the first seal portion 52 are positioned in the grooves of the first groove portion 48 in a state where the first seal portion 52 is accommodated in the first groove portion 48. Is configured to do.

  In other words, as shown in FIGS. 4 and 5, the first seal portion 52 is positioned on the radially inner side of the upper surface and the lower surface of the first seal portion 52 in a state where the first seal portion 52 is accommodated in the first groove portion 48. Since at least a part of the flat surfaces 52B and 52D are in surface contact with the inner wall surface of the first groove 48, at least a part of the recesses 54 and 56 is not exposed to the outside of the first groove 48, and the first groove 48 is completely buried inside.

  Further, as shown in FIG. 4, in a state where the first seal portion 52 is accommodated in the first groove portion 48, the radially inner side surface of the first seal portion 52 is in a position protruding from the first groove portion 48, The seal part 52 protrudes slightly from the first groove part 48. In a state where the heating platen 40 is positioned on the radially inner side of the frame body part 42, a part of the first seal portion 52 on the radially inner side is heated even at room temperature (for example, 0 ° C. to 30 ° C.). It will be in the state which receives the reaction force from outer side surface 40Ba of the board part 40, and is elastically deforming. Thereby, the clearance gap between the frame part 42 and the hot platen part 40 will be in the state sealed airtightly.

  Here, when the first seal part 52 is heated in a state where the gap between the hot platen part 40 and the frame part 42 is sealed by the first seal part 52, the volume associated with the thermal expansion of the first seal part 52. The increased amount is larger than the volume of the recesses 54 and 56 of the first seal part 52 when the first seal part 52 is not heated in the state where the gap between the hot platen part 40 and the frame part 42 is sealed in the first seal part 52. It is set to be smaller. In the present embodiment, since the two concave portions 54 and 56 are formed, the total volume of the concave portions 54 and 56 is set to be larger than the volume increase of the first seal portion 52.

  In the present embodiment, the “volume increase” is defined as a volume change amount of the first seal portion 52 obtained by subtracting the volume of the first seal portion 52 at normal temperature from the volume of the first seal portion 52 at the time of heating. To do.

  Specifically, even at room temperature, a part of the first seal portion 52 is elastically deformed (for example, compressively deformed) by receiving a reaction force from the hot platen 40. Thereby, compared with the state which does not receive the reaction force from the hot platen part 40, the shape of the 1st seal | sticker part 52 changes slightly and the volume of the recessed parts 54 and 56 also changes the recessed parts 54 and 56. FIG. That is, as compared with the case where the reaction force from the hot platen 40 is not received, the volumes of the recesses 54 and 56 are slightly reduced. Further, when the hot platen 40 becomes high temperature by heating the hot platen 40, the heat is transmitted to the first seal portion 52. And the 1st seal | sticker part 52 is heated and the 1st seal | sticker part 52 whole thermally expands based on a predetermined | prescribed thermal expansion coefficient. Thereby, the volume of the 1st seal | sticker part 52 becomes large. The volume increase of the first seal portion 52 is absorbed by the volumes of the recesses 54 and 56. As described above, the volumes of the recesses 54 and 56 decrease with the elastic deformation of the first seal portion 52, and the volume of the first seal portion 52 can be absorbed by the volume of the recesses 54 and 56 after the decrease. Is set to

  Further, as shown in FIG. 3, the second seal portion 60 is disposed in the second groove portion 50 in the second side surface 42 </ b> B of the frame body portion 42. Since the frame body portion 42 is disposed so as to surround the side of the hot platen portion 40, the second seal portion 60 is disposed along the outer periphery of the hot platen portion 40. The second seal part 60 is made of, for example, heat-resistant fluorine-based rubber. The second seal portion 60 has a function of sealing a gap between the hot platen portion (meaning reference numeral 40 </ b> A in FIG. 3) located on the lower surface side and the frame body portion 42.

  The second seal portion 60 is accommodated in the second groove portion 50 in a state where the first seal portion 52 is rotated 90 degrees. The second seal part 60 has a function of sealing a gap between the lower surface of the frame body part 42 and the upper surface of the hot platen part 40 located below.

  Similar to the first seal portion 52, the second seal portion 60 is formed with two concave portions 64 and 66, respectively. Since the shape and characteristics of the second seal portion 60 are the same as the shape and characteristics of the first seal portion 52, description of the shape and characteristics of the second seal portion 60 is omitted.

  In addition, although the 1st seal | sticker part 52 and the 2nd seal | sticker part 60 showed the structure accommodated in the groove part formed in the frame part side, it is not restricted to this, In the groove part formed in the hot platen part 40 side It may be accommodated. However, since the heat source is arranged in the heating platen 40, in order to reduce the volume increase due to the thermal expansion of each seal part 52, 60 and to effectively prevent the damage of each seal part 52, 60. It is preferable that it is accommodated in the groove part on the frame body side, not on the hot platen part 40 side.

  Next, operation | movement of the joining apparatus 20 of this embodiment is demonstrated.

(Overlapping of each heating panel)
As shown in FIGS. 1 and 2, the pressurizing mechanism 24 is driven and controlled by the control unit, and the piston rod 24 </ b> A extends upward. As a result, the lower pedestal portion 26 and the plurality of support portions 28 provided on the lower pedestal portion 26 move upward so as to be pushed by the piston rod 24A.

  When the piston rod 24A extends upward by a predetermined distance, the tip of the support portion 28 provided on the lower pedestal portion 26 comes into contact with the first stage heating platen 40A and the first stage heat. The board portion 40A is pushed upward by the plurality of support portions 28 and moves upward.

  When the first-stage heating platen 40A moves upward together with the lower pedestal portion 26 and the support unit 28, the first-stage heating platen 40A approaches the second-stage heating platen 40B.

  When the lower pedestal portion 26 and the support portion 28 are further moved upward, the first stage heating platen 40A and the second stage heating platen 40B are integrally moved upward, and eventually. The second stage hot platen 40B approaches the third stage hot platen 40C.

  When the lower pedestal portion 26 and the support portion 28 are further moved upward, the first-stage heating platen 40A, the second-stage heating platen 40B, and the third-stage heating platen 40C are integrated. The third stage hot platen 40C eventually approaches the fourth stage hot platen 40D.

  When the lower pedestal portion 26 and the support portion 28 are further moved upward, the first-stage heating platen 40A, the second-stage heating platen 40B, the third-stage heating platen 40C, and the fourth-stage heating platen 40A. The heating platen 40D of the eye moves together and moves upward, and the heating platen 40D at the fourth level approaches the heating platen 40E at the fifth level.

  When the lower pedestal portion 26 and the support portion 28 are further moved upward, the first-stage heating platen 40A, the second-stage heating platen 40B, the third-stage heating platen 40C, and the fourth-stage The heating platen 40D of the eye and the heating platen 40E of the fifth stage move together upward, and eventually the heating platen 40E of the fifth stage is supported by a plurality of supports provided on the upper pedestal 30. The tip of the part 32 is approached. Thereby, the applied pressure applied from the fifth stage hot platen 40 </ b> E to the support 32 is transmitted to the upper pedestal 30.

  As described above, the five-stage heating platen 40 is stacked with a predetermined pressure in the vertical direction, and the five-stage heating platen 40 is formed between the plurality of support portions 32 of the upper pedestal portion 30 and the lower pedestal portion 26. The structure is sandwiched between the plurality of support portions 28.

  Here, as shown in FIG. 2, when the hot platens adjacent in the vertical direction are pressed against each other with a predetermined pressure, a vacuum chamber 62 is formed between the hot platens. That is, a first vacuum chamber 62A is formed between the first-stage hot platen 40A and the second-stage hot platen 40B. A second vacuum chamber 62B is formed between the second-stage hot platen 40B and the third-stage hot platen 40C. A third vacuum chamber 62C is formed between the third-stage heating platen 40C and the fourth-stage heating platen 40D. A fourth vacuum chamber 62D is formed between the fourth stage hot platen 40D and the fifth stage hot platen 40E.

  Note that at the completion of the lamination process, the vacuum chamber 62 is only a sealed space and is not evacuated. For this reason, the vacuum chamber 62 is not in a vacuum state.

(Evacuation)
Next, the vacuum pump is driven and controlled by the control unit, and each vacuum chamber 62 is in a vacuum state. Thereby, all the vacuum chambers 62 are evacuated.

(Heating / pressurizing treatment)
Next, a heating process is performed by each heating platen 40. Since each heat platen 40 has a built-in heat source unit 44 such as a heater, the heat source unit 44 is driven by the control unit so that heat treatment can be performed. The heating platen 40 is set to a temperature of 280 ° C. to 300 ° C. by a temperature controller.

  At the same time, when the heating platen 40 adjacent in the vertical direction receives a pressing force, the bonding substrates disposed between the heating platen 40 are pressed together with a predetermined pressing force. Moreover, since the pressure-contact process of the base material for bonding is performed inside a vacuum chamber, it can be performed in a clean environment where dust and dust do not enter. As a result, the electrical characteristics of the composite substrate manufactured using the bonding base material can be maintained at high quality.

  In addition, the bonding process of the bonding base material is performed in the four vacuum chambers 62 substantially simultaneously. Thereby, in the four vacuum chambers 62, the substrate bonding process is performed substantially simultaneously.

(Cooling of vacuum chamber)
After the pressure bonding between the bonding substrates, the bonding substrate is cooled in a state where the vacuum degree of the vacuum chamber 62 is maintained at a predetermined value. The base material for bonding is cooled by flowing cooling water through a cooling water channel which is a cooling unit 46 disposed inside each heating platen 40.

(Vacuum release)
Next, the atmosphere is put in order to release the vacuum state of the vacuum chamber 62, and all the vacuum chambers 62 are opened to the atmosphere.

(Descent of each hot platen)
Next, each heating platen 40 descends. In this descending process, the pressurizing mechanism controlled by the control unit moves downward. Accordingly, since the first stage hot platen 40A moves downward, the other hot platens 40B, 40C, 40D, and 40E also move downward.

  Specifically, first, the heating platen 40 from the first stage to the fifth stage moves downward as a unit. And if it reaches the holding position of the fifth stage hot platen 40E, the fifth stage hot platen 40E stops at the holding position. Next, the heating platens 40A, 40B, 40C, and 40D from the first stage to the fourth stage move downward as a unit. And if it reaches the holding position of the fourth-stage hot platen 40D, the fourth-stage hot platen 40D stops at the holding position. Next, the heating platens 40A, 40B, 40C from the first stage to the third stage move downward as a unit. Then, when the position reaches the holding position of the third-stage heating platen 40C, the third-stage heating platen 40C stops at the holding position. Next, the first-stage and second-stage heating platens 40A and 40B move downward as a unit. And if it reaches the holding position of the second stage hot platen 40B, the second stage hot board 40B stops at the holding position. Finally, the first stage hot platen 40A moves downward. Then, when the holding position of the first stage hot platen 40A is reached, the first stage hot board 40A stops at the holding position. Note that the piston rod 24A of the pressurizing mechanism 24 returns to the initial position.

  According to the bonding apparatus 20 of the present embodiment, for example, the heating platen 40 is heated by the heat source unit 44 in the heating / pressurizing process. When the heating platen 40 is heated, heat is transferred to the frame body 42. Since the first seal portion 52 and the second seal portion 60 are interposed between the hot platen portion 40 and the frame body portion 42, the heat of the hot platen portion 40 is transferred to the first seal portion 52 and the second seal portion. It is transmitted to part 60.

  Here, when heat is transferred to the first seal portion 52, the first seal portion 52 is heated. Thereby, the 1st seal | sticker part 42 is thermally expanded based on a predetermined | prescribed thermal expansion coefficient. In other words, the volume of the first seal portion 52 increases due to thermal expansion. For this reason, if the recessed part 54,56 is not formed in the 1st seal | sticker part 52, although the thermal stress as a volume expansion will be applied from the 1st seal | sticker part 52 with respect to the hot platen part 40B, a hot platen is a rigid body. Therefore, the first seal part 52 side is damaged by the stress.

  By the way, as shown in FIG. 4, the first seal portion 52 is formed with the recesses 54 and 56. Therefore, the volume increase due to the thermal expansion of the first seal portion 52 is absorbed by the volume of the recesses 54 and 56. . For this reason, the crushing amount L (broken line portion in FIG. 4) at the contact portion of the first seal portion 52 with the hot platen 40B does not increase greatly due to thermal expansion. In other words, it is possible to suppress a large increase in the pressure acting on the hot platen 40B from the first seal portion 52. Thereby, even when the heating platen 40B is heated, the first seal portion 52 can be prevented from being damaged by the stress due to thermal expansion. As a result, it is possible to prevent the sealing performance of the first seal portion 52 from being deteriorated even at high temperatures, and it is possible to perform evacuation while maintaining high sealing performance.

  Moreover, since the recessed parts 54 and 56 are formed in V shape in the cross sectional view cut | disconnected along the thickness direction of the 1st seal | sticker part 52, the bottom part has an acute angle. Accordingly, the recesses 54 and 56 are easily deformed when the first seal portion 52 is thermally expanded, and the volume increase of the first seal portion 52 is reliably absorbed by the recesses 54 and 56.

  Moreover, since the recessed parts 54 and 56 are formed in the vertically symmetrical position of the 1st seal | sticker part 52, the process of the 1st seal | sticker part 52 becomes easy. In addition, the processing method of each seal part 52 and 60 is mentioned later.

  Furthermore, as described above, the frame body portion 42 moves (slids) relative to the hot platen portion 40B, but the first seal portion 52 is in surface contact with the inner wall surface of the first groove portion 48. Since the flat portions 52A, 52B, 52C, and 52D are formed, the first seal portion 52 can be prevented from being twisted when the frame body portion 42 is moved relative to the hot platen 40B. As a result, it is possible to prevent damage due to twisting of the first seal portion 52.

  In addition, the same effect can be said for the second seal portion 60 in terms of the operational effects of the first seal portion 52 described above. Thereby, the 2nd seal part 60 is not damaged by high temperature or twist, and a high sealing performance can be secured between the frame body part 42 and the hot platen part 40.

  Next, the processing method of each seal part 52 and 60 is demonstrated.

  As shown in FIG. 6, a part of the upper surface and a part of the lower surface are planarized by cutting using a commercially available O-ring 72. Then, V-groove processing is performed on the flat portions 72A and 72B formed on the upper surface and the lower surface of the O-ring 72 by cutting. Thereby, the 1st seal | sticker part 52 in which several recessed parts 54 and 56 were formed is obtained. In addition, the 2nd seal | sticker part 60 should just be processed similarly, and should be reversed 90 degree | times. A commercially available O-ring 72 is not always essential, but it is convenient to use an O-ring 72 because a commercially available O-ring 72 can be easily obtained.

  In addition, each seal part 52 and 60 is not limited to the processing method by cutting, For example, you may make a type | mold and manufacture by shaping | molding with a type | mold. In molding using a mold, a curved surface can be formed in the concave portion, so that it is possible to provide variations in the shape of the concave portion.

  In the above-described embodiment, the configuration in which the two V-shaped grooves are formed as the concave portions 54 and 56 in the seal portions 52 and 60 is exemplified, but the present invention is not limited thereto.

  For example, as shown in FIG. 7, a seal portion 74 in which a plurality of V-shaped grooves 76 are formed side by side may be used.

  Further, as shown in FIG. 8, a seal portion 78 in which a concave portion 80 having a square shape in a cross-sectional view cut in the thickness direction of the seal portion may be used.

  Further, as shown in FIG. 9, a seal portion 82 having a V-shaped groove 84 and having no flat portion may be used.

  Furthermore, as shown in FIG. 10, a seal portion 86 formed by cutting the recess 88 only on one side and to the center (core) of the seal is also effective. The seal portion 86 has a structure that is more difficult to break because it reduces the stress at the seal tip due to thermal expansion at high temperatures. Further, when the inside of the vacuum chamber is evacuated, the pressure of the atmosphere is received by the pressure difference and the recess 88 opens, so that the sealing performance between the hot platen and the frame is maintained.

DESCRIPTION OF SYMBOLS 10 Press mechanism 12 Base part 14 Support part 16 Heating board part 20 Joining device 24 Pressurization mechanism 26 Lower side base part (base part)
28 Supporting portion 30 Upper pedestal portion (pedestal portion)
32 support part 40A 1st stage heating platen (heating platen part)
40B 2nd stage hot platen (hot platen)
40C 3rd stage hot platen (hot platen)
40D 4th stage hot platen (hot platen)
40E 5th stage hot platen (hot platen)
42 Frame body part 48 1st groove part (groove part)
50 Second groove (groove)
52 1st seal part (seal part)
52A Plane part 52B Plane part 52C Plane part 52D Plane part
54 recess 56 recess 60 second seal part (seal part)
62A Vacuum chamber 62B Vacuum chamber 62C Vacuum chamber 62D Vacuum chamber 64 Recess 66 Recess

Claims (10)

A heating platen provided with a heating mechanism, a frame body portion located on a side of the heating platen,
A seal portion that is located between the hot platen portion and the frame body portion and seals a gap between the hot platen portion and the frame body portion;
A seal structure having
The seal part is disposed in a groove part formed in the hot platen part or the frame body part,
A concave portion is formed in the seal portion in a direction perpendicular to the depth direction of the groove portion,
The seal structure, wherein the concave portion is located in a groove of the groove portion in a state where the seal portion is disposed in the groove portion formed in the hot platen portion or the frame body portion.   The seal structure according to claim 1, wherein the seal portion is formed with a flat portion that is in surface contact with an inner wall surface of the groove portion.   2. The seal structure according to claim 1, wherein the recess is formed to have a V shape in a cross-sectional view when the seal portion is cut in a thickness direction.   When the seal portion is heated in a state where the gap between the hot platen portion and the frame body portion is sealed by the seal portion, an increase in volume due to thermal expansion of the seal portion is caused by the heat plate portion and the frame. The volume of the said recessed part of the said seal part when the said seal part is not heated in the state sealed with the said seal part in the state sealed with the body part is set so that it may become smaller. Seal structure.   The seal structure according to claim 1, wherein the seal portion is made of fluorine-based rubber. A pedestal to which a predetermined load is applied by a pressurizing mechanism;
A heating platen equipped with a heating mechanism;
A support portion that is provided on the pedestal portion and transmits a load applied to the pedestal portion to the heating platen as an applied pressure;
A frame body portion located on a side of the hot platen portion;
A seal portion located between the hot platen portion and the frame body portion, and sealing a gap between the hot platen portion and the frame body portion;
A vacuum chamber connected to a vacuum source and formed between the adjacent heating platens;
Have
A bonding apparatus for bonding the base materials for bonding in the vacuum chamber by thermocompression bonding,
The seal part is disposed in a groove part formed in the hot platen part or the frame body part,
A concave portion is formed in the seal portion in a direction perpendicular to the depth direction of the groove portion,
The joining apparatus, wherein the recess is located in a groove of the groove part in a state where the seal part is disposed in the groove part formed in the hot platen part or the frame body part.   The joining apparatus according to claim 6, wherein a flat portion that is in surface contact with an inner wall surface of the groove portion is formed in the seal portion.   The joining device according to claim 6, wherein the recess is formed to be V-shaped in a cross-sectional view when the seal portion is cut in a thickness direction.   When the seal portion is heated in a state where the gap between the hot platen portion and the frame body portion is sealed by the seal portion, an increase in volume due to thermal expansion of the seal portion is caused by the heat plate portion and the frame. The volume of the said recessed part of the said seal part is set so that it may become smaller than the volume when the said seal part is not heated in the state which sealed the clearance gap with the body part by the said seal part. Welding equipment.   The joining apparatus according to claim 6, wherein the seal portion is made of fluorine-based rubber.

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