JP2013064759A - Thin display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin display device that employs a common chassis frame to which a circuit board is attached, to reduce the kinds of components.SOLUTION: A rear cabinet body 23 of a rear cabinet 22 has a shape of covering the whole of a back surface of a thin display device 10. In substantially the center thereof, a board attachment recess 40 is formed to be recessed inward so as to form substantially rectangular parallelepiped space. In the board attachment recess 40, an electric circuit board 50 such as a power source substrate or an image processing substrate is installed. In a liquid crystal module housed in the rear cabinet 22, no electric circuit board 50 is installed.

Description

  The present invention relates to a thin display device, and more particularly to a thin display device having a structure in which a rear surface of a display panel unit is covered with a resin rear cabinet.

  In the internal structure of a liquid crystal television that is a thin display device, a structure in which a predetermined mounting structure is provided on the back of a liquid crystal module that is a display panel unit and an electric circuit board is attached is the mainstream. FIG. 1 shows the structure of a thin display device 100 that is generally put on the market. The thin display device 100 is a liquid crystal television, and a substrate mounting structure 141 is provided in a liquid crystal module 140 as shown. Then, the electric circuit board 150 is fixed to the determined place with screws or the like, and the rear cabinet 122 is attached so as to cover the back surface of the liquid crystal module 140.

  Therefore, manufacturers have introduced various technologies for standardizing liquid crystal modules, electric circuit boards, and the like. As such a technology, for example, in the process of producing a thin display device such as a liquid crystal television of the same size, even if the configuration of the electric circuit board is different for each model, the chassis frame to which the board is attached is shared and the component type is changed. Techniques for reducing the number have been proposed (see, for example, Patent Document 1).

JP 2006-65139 A

  By the way, even when standardization is performed, a structure other than the minimum required mounting structure may be processed for the liquid crystal module. In particular, when a product for one destination is used as a product for another destination, it cannot be used as it is, and another part may be used in the production area. In such a case, module processing is required, and as a result, when a liquid crystal panel having the same performance is processed, a plurality of types of liquid crystal modules are generated, which complicates production management. In the technique of Patent Document 1, a chassis frame made of resin is used. However, after all, fixing to the liquid crystal module side is required, and in some cases, a structure other than the minimum required mounting structure is required.

  In view of the above problems, an object of the present invention is to provide a technology for reducing the types of components in a thin display device by sharing a chassis frame to which a circuit board is attached.

The thin display device according to the present invention is a thin display device including a display panel unit and a resin rear cabinet that covers the entire back surface of the display panel unit, and the rear cabinet is formed in a concave shape, A circuit board mounting housing portion to which a circuit board is mounted on an outer portion of the concave bottom surface; and a cover portion that covers the concave opening provided by the circuit board mounting housing portion, and the display panel unit is attached to the rear cabinet. A structure for attaching the circuit board is not provided in the region facing the attached circuit board.
In addition, a bottom opening may be formed on the bottom surface of the substrate mounting storage portion, and the circuit board may be attached to cover the bottom opening.
Further, a side opening capable of routing a cable connecting the circuit board side and the display panel unit side may be formed on a side surface of the board mounting / accommodating portion.
Moreover, you may provide the 1st board | substrate holding | suppressing part of the push-off structure extended from the said bottom face and fixing the said circuit board.
Moreover, it may include a second substrate pressing portion that extends from a side surface of the substrate mounting and accommodating portion and fixes the circuit board, and the second substrate pressing portion may have a line shaping function.
Further, a circuit board other than the circuit board constituting the display panel unit may not be fixed over the entire back surface of the display panel unit.
In addition, the back surface of the display panel unit is configured to be a plane in a region facing the circuit board fixed to the bottom surface of the substrate mounting housing portion, and the circuit board passes through the bottom surface opening and is You may have an earth spring electrically connected with the back surface of a display panel unit.
Further, in a state where the cover part is attached to the board mounting / accommodating part, at least one of the signal force terminals provided on the circuit board is exposed to the outside, the board attaching / accommodating part, the cover part, It may be sandwiched between.

  ADVANTAGE OF THE INVENTION According to this invention, in the thin display apparatus, the technique which makes a chassis frame to which a circuit board is attached in common and reduces a component kind can be provided.

It is the perspective view which showed the structure of the thin display apparatus generally put on the market based on a prior art. It is the figure which showed the external appearance of the thin display apparatus based on embodiment of this invention. It is a perspective view of the back surface of the thin display apparatus based on embodiment of this invention. It is the perspective view which showed the state which removed the rear cover and the stand cover about the thin display apparatus based on embodiment of this invention. It is the perspective view which showed the rear cabinet main body based on embodiment of this invention. It is the perspective view which showed the back surface of the liquid crystal module based on embodiment of this invention. It is the figure which showed the 1st-3rd electric circuit board based on embodiment of this invention. It is the figure which expanded and showed the part of the recessed part for board | substrate attachment based on embodiment of this invention. It is the figure which showed the recessed part for board | substrate attachment of the state to which the electric circuit board | substrate was attached based on embodiment of this invention. It is the figure which each showed the state in which the 1st-3rd electric circuit board | substrate based on embodiment of this invention was attached. It is the figure which showed the area | region where the 1st electric circuit board | substrate is attached in the recessed part for board | substrate attachment based on embodiment of this invention. It is the figure which showed the rib for line shaping based on embodiment of this invention. It is a perspective view of the rear cover based on embodiment of this invention. It is the perspective view which showed the arrangement structure of the antenna terminal based on embodiment of this invention. It is the perspective view which looked at the rear cabinet main body based on embodiment of this invention from the inner surface. It is the figure which showed the earth spring of the recessed part for board | substrate attachment based on embodiment of this invention.

  Next, embodiments for carrying out the present invention will be specifically described with reference to the drawings. In this embodiment, the circuit board mounting structure on the liquid crystal module side which is the display panel unit is eliminated, and the mounting structure is provided on a part of the rear cabinet. Details will be described below.

  2A to 2C are views showing the appearance of the thin display device 10 according to the present embodiment. FIG. 3 is a perspective view of the back surface of the thin display device 10 according to the present embodiment. Compared with the conventional structure of FIG. 1, the rear cover 30 and the stand are shown so that the mounting state of the electric circuit board 50 can be seen. The cover 39 is shown separately. Further, FIG. 4 is a perspective view showing the thin display device 10 with the rear cover 30 and the stand cover 39 removed.

  The thin display device 10 is a liquid crystal television, and as illustrated, the entire back surface of the thin display device 10 is covered with a resin rear cabinet 22. The rear cabinet 22 includes a rear cabinet body 23, a rear cover 30, and a stand cover 39.

  FIG. 5 shows a perspective view of the rear cabinet body 23. FIG. 6A is a perspective view of the back surface of the thin display device 10 in a state where the rear cabinet 22 is removed and the back surface of the liquid crystal module 15 is exposed. Further, FIG. 6B shows only the liquid crystal module 15 with the stand 29 and the like removed from the state of FIG.

  As shown in FIGS. 3 to 5, the rear cabinet main body 23 has a shape that covers the entire back surface of the thin display device 10, and is recessed inward so as to form a substantially rectangular parallelepiped space in the approximate center. A substrate mounting recess 40 is provided. An electric circuit board 50 such as a power supply board or an image processing board is attached to the board mounting recess 40. As described above, the electric circuit board 50 is conventionally attached to the liquid crystal module 15. The circuit board originally provided as a component of the liquid crystal module 15 is not included as the electric circuit board 50 described above.

  Then, as shown in FIGS. 2 and 3, the rear cover 30 is attached so as to cover the outer opening portion of the substrate mounting recess 40. A stand cover 39 that covers the mounting portion of the stand 29 is attached below the substrate mounting recess 40. In addition, the electric circuit board 50 is comprised from 3 parts of the 1st-3rd electric circuit boards 50a-50c, as shown in an example in FIG. The first electric circuit board 50a includes a terminal group 52 including a plurality of external input / output terminals. The third electric circuit board 50c is provided with an antenna terminal 59 in the leftmost region.

  Next, the structure of the board mounting recess 40 and the mounting mode of the electric circuit board 50 will be described in detail. FIG. 8A shows an enlarged view of the substrate mounting recess 40. FIG. 8B shows the bottom surface opening 48 of the bottom surface 41 and the side surface opening 49 of the side surface 42 in black for easy understanding. FIG. 9 shows the board mounting recess 40 in a state where the electric circuit board 50 is mounted. Further, FIGS. 10A to 10C show the states where the first to third electric circuit boards 50a to 50c of FIG. 9 are attached independently.

  As described above, the substrate mounting recess 40 has a shape in which a part of the rear cabinet body 23 is recessed inward so as to form a substantially rectangular parallelepiped space. Further, a cover mounting boss 44 a for fixing the rear cover 30 is provided at a predetermined position on the side surface 42 of the substrate mounting recess 40. A screw hole 44b for screw fixing is provided at the top of the cover mounting boss 44a.

  A substantially square first electric circuit board 50 a is attached to the upper left area of the bottom surface 41 of the board mounting recess 40. In addition, a substantially square second electric circuit board 50b smaller than the first electric circuit board 50a is attached to the upper right region. Furthermore, a substantially inverted L-shaped third electric circuit board 50c is attached in the upper area excluding the majority of the lower area and the area of the second electric circuit board 50b.

  The board mounting recess 40 is provided with a shape for mounting the electric circuit board 50 and routing a connection cable between the electric circuit board 50 and the liquid crystal module 15. Specifically, a board fixing boss 46 a for mounting the electric circuit board 50 is provided on the bottom surface 41 of the board mounting recess 40. The position of the board fixing boss 46a is provided at a position corresponding to a screw hole provided in the electric circuit board 50 to be attached.

  The bottom surface 41 is provided with a bottom surface opening 48 except for a frame portion required as a structure for maintaining the bottom surface 41 with a desired rigidity. Further, side openings 49 are provided in the upper, lower, left, and right side surfaces 42 in order to route a wire harness or the like for electrical connection between the electric circuit board 50 and the liquid crystal module 15. The bottom opening 48 is also used for wiring a wire harness or a cable. Here, the opening is also provided from the viewpoint of increasing the distance between the high-pressure primary circuit component and the resin. In addition, for example, as shown in a substantially central left region of the substrate mounting recess 40 in FIG. 8, a region in which the side opening 49 and the bottom opening 48 are continuously formed as one opening is also provided.

  Furthermore, a substrate pressing rib 43 having a push-off structure for pressing the electric circuit board 50 and a board arrangement rib 45 for supporting the electric circuit board 50 at a desired height are provided. Further, an antenna terminal fixing rib 61 is provided in the lower left region of the bottom surface 41. This structure will be described later with reference to FIG.

  Here, as a representative example of a region to which the electric circuit board 50 is attached, FIG. 11A shows a region in which the first electric circuit board 50a is attached in the substrate attachment recess 40. FIG. Note that FIG. 11B shows the bottom opening 48 and the side opening 49 of FIG. 11A in black. As shown in the figure, the region where the first electric circuit board 50a is attached is one level higher than the region where the second electric circuit board 50b and the third electric circuit board 50c are attached.

  In the conventional structure in which the electric circuit board 50 is attached to the liquid crystal module 15 when determining the position at which the terminal group 52 is exposed from the rear cabinet body 23, the design restrictions are very large. For example, when the mounting structure is provided in the metal frame portion of the liquid crystal module 15, the terminal group 52 cannot always be exposed at a desired position due to restrictions such as drawing processing of the metal frame. In addition, it is possible to newly provide metal parts or resin molded parts as height adjustment spacers, but it is difficult to adopt from the viewpoint of increasing the assembly process and the number of parts. There was a strong demand to adopt. In addition, when the design of the electric circuit board 50 is changed, it is necessary to process the metal frame or the like of the liquid crystal module 15. As a result, as described above, despite the liquid crystal modules 15 having substantially the same specifications, the components have different production control numbers due to differences in the mounting structure of the electric circuit board 50 and the like. Regarding the liquid crystal module 15, there was a strong demand for reducing the number of products as much as possible from the viewpoint of cost, because the lead time for design change was difficult.

  On the other hand, by adopting a structure in which the electric circuit board 50 is attached to the board attaching recess 40 of the rear cabinet body 23 as in the present embodiment, even when a design change occurs in the electric circuit board 50, it is easy to cope with it. . That is, it is possible to cope with the design change of the rear cabinet body 23 instead of the liquid crystal module 15. As described above, the liquid crystal module 15 is often manufactured intensively in a specific factory. Thereafter, exteriors such as the rear cabinet 22 are manufactured in the country / region used, and the exterior and the liquid crystal module 15 are often assembled.

  Therefore, conventionally, it was necessary to deal with a design change or the like at a factory that manufactures the liquid crystal module 15, but in this embodiment, it is only necessary to change the exterior (rear cabinet 22) at the final shipping location. As a result, the lead time for design change is shortened. Furthermore, it is easy to change the design in a more preferable form in accordance with the area where it is used. In addition, since the design change itself can be realized by replacing one part of the mold insert for resin molding, it is easy to cope with the technical and cost.

  Furthermore, since the design can be changed at the final shipping place, the degree of freedom in changing the design of the electric circuit board 50 itself is improved. In particular, regarding the electric circuit board 50, the size of the board is conventionally limited by the restriction of the mounting position with respect to the liquid crystal module 15 although the size of the required area can be greatly reduced by reviewing the circuit components. There were also problems such as being unable to reduce the size. However, in the present embodiment, it is possible to flexibly cope with the rear cabinet body 23 side even when the size of the substrate or the like is significantly changed. As a result, the degree of freedom of design for significant cost reduction has become very high.

  Furthermore, by adopting a structure in which the electric circuit board 50 is fixed only to the rear cabinet 22, work efficiency can be improved when maintenance of the thin display device 10 is required. That is, in the maintenance of the electric circuit board 50, it is not necessary to expose the liquid crystal module 15, and it is only necessary to open the rear cover 30. Further, in the maintenance of the liquid crystal module 15, the work of removing the electric circuit board 50 from the liquid crystal module 15 becomes unnecessary. That is, by removing the rear cabinet 22 from the liquid crystal module 15, the liquid crystal module 15 can be easily taken out.

  Subsequently, FIG. 12 shows the line shaping rib 47 in an enlarged manner. As shown in the figure, a line shaping rib 47 is provided so as to extend inward from the lower right side surface 42 of the substrate mounting recess 40. In the third electric circuit board 50c, a connector 58 is provided in the vicinity of a region where the line shaping rib 47 is pressed. The line shaping rib 47 has a function of organizing the wiring in the upper portion 47b, and the bottom surface portion of the line shaping rib 47 becomes a substrate pressing portion 47a having a function of pressing the third electric circuit board 50c. ing. Moreover, the connection part of the board | substrate holding | maintenance part 47a and the upper part 47b is formed in the slope shape. Specifically, as shown in FIG. 12 (c), the connector 58 is used in a so-called AC cord direct output type. The AC cord 81 directly taken out from the connector 58 is first subjected to line shaping of the AC cord 81 at the upper portion 47 b of the line shaping rib 47. Thereafter, as shown in FIG. 12D, the rear cover 30 is attached from above. At this time, the AC cord 81 is drawn from a cord lead portion 82 provided on the rear cover 30. By adopting such a configuration, it is possible to prevent the AC cord 81 from coming off from the connector 58.

  Next, a process of attaching the third electric circuit board 50c to the bottom surface 41 of the board mounting recess 40 will be described mainly with reference to FIGS. First, the worker arranges the lower portion of the third electric circuit board 50c so as to be inserted between the board pressing portion 47a and the bottom surface 41 from an oblique direction. Thereafter, the entire third electric circuit board 50 c is placed on the board fixing boss 46 a on the bottom surface 41. At this time, the third electric circuit board 50c is also placed in contact with a part of the stepped plane provided on the board placement rib 45.

  During this placement operation, the outer peripheral portion of the electric circuit board 50 hits the board pressing rib 43 and is once bent outward. Then, when the third electric circuit board 50c is arranged on the board fixing boss 46a, the bending of the board pressing rib 43 is restored. As a result, the electric circuit board 50 is pressed against the board mounting recess 40.

  The third electric circuit board 50c is completely fixed to the board mounting recess 40 by screw fixing. Conventionally, a boss is attached to the metal frame of the liquid crystal module 15 or attached via a resin frame. On the other hand, in the present embodiment, the board pressing rib 43 formed extending from the board mounting recess 40 functions as a fixing means for the electric circuit board 50, so that the portion for screw fixing can be reduced. That is, the number of parts can be greatly reduced. In other words, the fitting locking structure and the screw fixing structure can be selected to optimize the mounting process.

  In addition, cable routing, which conventionally had to use a lot of wire harnesses, can easily use the wire shaping ribs 47 extending from the side surfaces 42, and can easily organize the cables without using the wire harness. It becomes. As a result, the degree of freedom in designing the circuit configuration of the electric circuit board 50 is also improved. It is also possible to fix the electric circuit board 50 with only the board pressing ribs 43. In that case, screw fixing becomes unnecessary. In that case, if the board-fixing boss 46a is provided with a projection shape and the projection shape is fitted into a predetermined concave shape or through-hole provided in the electric circuit board 50, the position can be fixed reliably and easily. .

  FIG. 13 shows a perspective view of the rear cover 30. Fig.13 (a) is the perspective view seen from the outer side, FIG.13 (b) is the perspective view seen from the inner side. As shown in the drawing, a fixing hole 34 and a cover locking piece 36 for fixing the rear cover 30 to the opening portion of the substrate mounting recess 40 are provided in the outer edge portion of the rear cover 30. Here, five fixing holes 34 are provided at positions corresponding to the screw holes 44b of the cover mounting boss 44a of the substrate mounting recess 40, and are fixed by screws. A terminal region 31 is formed in the rear cover 30 in a region corresponding to the mounting position of the first electric circuit board 50a. The terminal region 31 has a shape recessed one step lower than the surroundings, and has a height corresponding to the position and height of the terminal group 52 of the first electric circuit board 50a. Terminal holes corresponding to the number are provided.

  Further, as shown in FIG. 13B, reinforcing ribs 37 are provided on the inner surface of the rear cover 30. Here, the reinforcing rib 37 is generally provided in a region other than the terminal region 31. Further, a rod-shaped deflection preventing rib 35 is provided substantially at the center. When the rear cover 30 is attached, the deflection preventing rib 35 is provided with an electric circuit at its tip so that the rear cover 30 does not bend when a force is applied to the outer surface of the rear cover 30. The shape is substantially in contact with the substrate 50. Further, on the lower side, a plate-like partition shape 33 extending in the inner direction is provided. In the rear cabinet body 23, the portion to which the stand 29 is attached has a concave shape that is continuous with the substrate mounting recess 40. Therefore, even when the stand cover 39 is removed during the fixing / removing work of the stand 29, the partition circuit 33 is used to block the electric circuit board 50 from being exposed.

  FIG. 14 is a perspective view showing an arrangement structure of the antenna terminals 59 attached to the third electric circuit board 50c. In a state where the third electric circuit board 50 c is attached to the board mounting recess 40, the antenna terminal 59 is disposed in the lower left region of the board mounting recess 40. The tip of the antenna terminal 59 is exposed at the antenna terminal cover portion 32 of the rear cover 30. Here, when the third electric circuit board 50 c is attached to the board mounting recess 40, the antenna terminal fixing rib 61 provided on the bottom surface 41 is arranged so that the vicinity of the end of the antenna terminal 59 is in contact with the antenna terminal fixing rib 61. . More specifically, the antenna terminal fixing rib 61 is formed to extend from the bottom surface 41. For example, as shown in FIG. 14B, the antenna terminal fixing rib 61 has a tip that is recessed in a semicircular shape, and the lower half of the end of the antenna terminal 59 can be arranged.

  As shown in FIGS. 13 and 14, the antenna terminal cover portion 32 has a shape in which the lower left region of the rear cover 30 is recessed inwardly on a substantially rectangular parallelepiped. Here, as shown in FIG. 14 (a), left and right side surfaces 32b, an upper side surface 32a, and a bottom surface 32c are provided, and the lower side surface is not provided and is open. An antenna terminal pressing portion 38 is formed as an opening having a predetermined shape on the upper side surface 32a.

  Specifically, as shown in FIG. 13B and FIG. 14A, the boundary region between the upper side surface and the bottom surface of the antenna terminal cover portion 32 is an inclined surface 32d. An approximately rectangular opening having a width slightly wider than the diameter of the antenna terminal 59 is formed as the antenna terminal pressing portion 38 from the left and right center of the inclined surface 32d to the approximate center of the upper side surface 32a. Note that the upper end portion of the substantially rectangular shape has a semicircular convex shape, and the end portion of the antenna terminal 59 can be just arranged. When the rear cover 30 is attached to the board mounting recess 40, the antenna terminal fixing rib 61 is covered from the outside so as to hold the antenna terminal 59. That is, the wobbling of the antenna terminal 59 can be prevented by sandwiching the tip portion of the antenna terminal 59 between the antenna terminal fixing rib 61 and the substrate mounting recess 40.

  Furthermore, in the rear cabinet main body 23, the outer peripheral part adjacent to the antenna terminal cover part 32 of the board mounting concave part 40 has a shape in which a concave part of a substantially rectangular parallelepiped bulges outward. For this reason, the space which can connect the cable to the antenna terminal 59 is secured in a state where the rear cover 30 is attached. Here, the antenna terminal 59 is exemplified as the signal terminal to be sandwiched, but naturally, the structure can be applied to various input / output terminals.

  FIG. 15A is a perspective view of the rear cabinet body 23 viewed from the inner side surface 71, and FIG. 15B is an enlarged view of the region X1 of FIG. 15A. This corresponds to a state where the region of the bottom surface 41 to which the first electric circuit board 50a and the third electric circuit board 50c are attached is viewed from the inside. As illustrated, partition ribs 75 are provided on the side surface 42. By providing the substrate mounting recess 40, the shape of the partition rib 75 extends from both the rear portion of the rear cabinet body 23 and the side surface 42 of the substrate mounting recess 40. By adopting such a structure, it is possible to avoid occurrence of a short mold when the partition rib 75 is formed. In addition, a rib shape is provided in the inner portion of the bottom surface 41 at the edge portion of the bottom surface opening 48 so that desired strength can be obtained so that the bottom surface 41 does not bend.

  FIG. 16 is a view showing the ground spring 55 of the substrate mounting recess 40. FIG. 16A is a diagram showing a general example of the earth spring 55 provided on the substrate. FIG. 16B is a cross-sectional view showing how the ground spring 55 is used in the present embodiment. As shown in FIG. 16B, a ground spring 55 is provided on the back surface 54 of the electric circuit board 50. When the electric circuit board 50 is attached to the board fixing boss 46a, the bottom opening 48 is formed. It communicates and contacts the liquid crystal module 15 so as to be pressed by an elastic force. Since a large area of the bottom opening 48 can be secured, the shape on the liquid crystal module 15 side has no structure for mounting the circuit board, and the area facing the electric circuit board 50 is flat. As a result, the degree of freedom in designing the arrangement of the ground spring 55 is very high. Also from this viewpoint, the degree of freedom of design of the electric circuit board 50 is high, and it is possible to flexibly cope with design changes.

As described above, the outline of the effects that can be realized by the present embodiment can be summarized as follows.
1. In the process of producing a thin display device such as a liquid crystal television of the same size, even when the board configuration is different for each model, it is possible to provide a technique for reducing the component types by sharing the chassis frame to which the board is attached.
2. A substrate mounting structure on the back of the liquid crystal module is not required.
3. Since it is a resin rear cabinet, a highly flexible structure can be easily formed.
4). The board fixing method can be selected such as screwing / fitting locking.
5. The mounting structure of the rear cabinet can easily handle multiple types of products by replacing the molding die.
6). Multi-model parallel production is possible due to the rear cabinet with short production lead time.

  The present invention has been described based on the embodiments. This embodiment is an exemplification, and it will be understood by those skilled in the art that various modifications can be made to combinations of these components, and such modifications are also within the scope of the present invention. For example, the electric circuit board 50 can be attached to the inner side surface of the rear cover 30. Moreover, although the liquid crystal television was illustrated as the thin display device 10, the said embodiment is applicable also to a plasma display television and an organic electroluminescent television.

DESCRIPTION OF SYMBOLS 10 Thin display apparatus 15 Liquid crystal module 22 Rear cabinet 23 Rear cabinet main body 30 Rear cover 32 Antenna terminal cover part 38 Antenna terminal holding | maintenance part 40 Substrate mounting recessed part 41 Bottom 42 Side 43 Substrate pressing rib 44a Cover mounting boss 44b Screw hole 45 Substrate arrangement Rib 46a Substrate fixing boss 46b Screw hole 47 Line shaping rib 47a Substrate holding part 48 Bottom opening 49 Side opening 50 Electric circuit board 50a First electric circuit board 50b Second electric circuit board 50c Third electric circuit board 52 Terminal Group 55 Earth Spring 59 Antenna Terminal 61 Antenna Terminal Fixing Rib 75 Partition Rib

Claims (8)

A thin display device comprising a display panel unit and a resin rear cabinet that covers the entire back surface of the display panel unit,
The rear cabinet is
A board mounting housing portion that is formed in a concave shape, and a circuit board is attached to an outer portion of the concave bottom surface;
A cover portion covering the concave opening presented by the substrate mounting housing portion;
With
The display panel unit does not include a structure for attaching a circuit board in a region facing the circuit board attached to the rear cabinet.   2. The thin display device according to claim 1, wherein a bottom opening is formed on the bottom surface of the substrate attachment housing portion, and the circuit board is attached so as to cover the bottom opening.   The thin side according to claim 1 or 2, wherein a side opening capable of routing a cable connecting the circuit board side and the display panel unit side is formed on a side surface of the board mounting / accommodating portion. Display device.   4. The thin display device according to claim 1, further comprising a first substrate pressing portion having a push-off structure extending from the bottom surface and fixing the circuit substrate.   The second board pressing part, which extends from a side surface of the board mounting / accommodating part and fixes the circuit board, is provided, and the second board pressing part has a line shaping function. 5. A thin display device according to any one of 1 to 4.   6. The thin display device according to claim 1, wherein a circuit board other than the circuit board constituting the display panel unit is not fixed over the entire rear surface of the display panel unit. The back surface of the display panel unit is configured as a flat surface in a region facing the circuit board fixed to the bottom surface of the substrate mounting storage portion.
The thin display device according to claim 1, wherein the circuit board includes an earth spring that is electrically connected to the back surface of the display panel unit through the bottom surface opening.   In a state where the cover part is attached to the board attachment / accommodation part, at least one of the signal terminals provided on the circuit board is sandwiched between the substrate attachment / accommodation part and the cover part at a portion exposed to the outside. The thin display device according to claim 1, wherein the display device is a thin display device.

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