JP2013062685A - Electret capacitor type sounding body - Google Patents

Electret capacitor type sounding body Download PDF

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JP2013062685A
JP2013062685A JP2011199843A JP2011199843A JP2013062685A JP 2013062685 A JP2013062685 A JP 2013062685A JP 2011199843 A JP2011199843 A JP 2011199843A JP 2011199843 A JP2011199843 A JP 2011199843A JP 2013062685 A JP2013062685 A JP 2013062685A
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electret
substrate
sounding body
vibrating membrane
type sounding
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JP5626907B2 (en
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Yoshinori Jinbo
嘉規 仁保
Takashi Miyakura
隆志 宮倉
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Hosiden Corp
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Hosiden Corp
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Abstract

PROBLEM TO BE SOLVED: To provide an electret capacitor type sounding body where the internal structure is simplified and an element itself is miniaturized.SOLUTION: An electret capacitor type sounding body includes: an oscillation film 3; a substrate 5 arranged at a position opposing to the oscillation film 3 via a spacer 4 for keeping a fixed distance from the oscillation film 3; an electret 6 to be arranged on a surface opposing to the oscillation film 3 on the substrate 5 as a back plate; sound holes 8 formed in the substrate 5 and the electret 6 for continuity from an outside; and a metallic and cylindrical capsule 7 for storing the oscillation film 3, the spacer 4, the substrate 5, and the electret 6. An input terminal 9 for applying an electric signal is connected to the electret 6 and also a ground terminal 10 is connected to the oscillation film 3. The oscillation film 3 and the substrate 5 are exposed on the opposite sides of the cylindrical capsule 7.

Description

本発明は、カプセルの内部に、振動膜と、振動膜の表面のいずれか一方に対向して配置されるエレクトレットとを有するエレクトレットコンデンサ型の発音体に関する。   The present invention relates to an electret condenser-type sounding body having a vibrating membrane and an electret disposed opposite to one of the surfaces of the vibrating membrane inside a capsule.

カプセルの内部に、振動膜と、振動膜の表面のいずれか一方に対向して配置されるエレクトレットとを設けたエレクトレットコンデンサマイクロホン(以下、ECMと略称する)は、携帯電話、PDA、デジタルカメラ等の幅広い電子機器に適用されている。特許文献1には、単一指向性のECMの構造が示されている。ここでは、金属製の筒状カプセルの一端面は前面板により閉塞されており、金属材料よりなる振動膜リングに貼り付けられた振動膜が筒状カプセル内に収容されている。振動膜リングは前面板に電気的及び機械的に接触している。振動膜の対向面に背極板が配置され、背極板の振動膜に対向する側の面にはエレクトレット誘導体膜が被着形成されている。背極板の周囲が絶縁材料の背極ホルダで支持されており、背極ホルダの背極板とは反対側にはプリント基板が配置されている。これにより、背極板とプリント基板との間には背極室が形成されている。   An electret condenser microphone (hereinafter abbreviated as ECM) provided with a vibrating membrane and an electret disposed opposite to one of the surfaces of the vibrating membrane inside a capsule is a mobile phone, PDA, digital camera, etc. Applied to a wide range of electronic devices. Patent Document 1 discloses a structure of a unidirectional ECM. Here, one end surface of the metallic cylindrical capsule is closed by the front plate, and the vibration film attached to the vibration film ring made of a metal material is accommodated in the cylindrical capsule. The diaphragm ring is in electrical and mechanical contact with the front plate. A back electrode plate is disposed on the opposite surface of the vibration film, and an electret derivative film is deposited on the surface of the back electrode plate facing the vibration film. The periphery of the back electrode plate is supported by a back electrode holder made of an insulating material, and a printed circuit board is arranged on the opposite side of the back electrode holder from the back electrode plate. As a result, a back electrode chamber is formed between the back electrode plate and the printed circuit board.

こうしたECMは、背極板に電気信号を付与することにより発音体として用いることができる。背極板に電気信号を付与すると、エレクトレットによる振動膜への静電引力が変化する。これにより、振動膜が振動して音響が発生する。   Such an ECM can be used as a sounding body by applying an electrical signal to the back electrode plate. When an electrical signal is applied to the back electrode plate, the electrostatic attractive force on the diaphragm by the electret changes. As a result, the vibration film vibrates to generate sound.

特開2000−232700号公報JP 2000-232700 A

ECMを発音体として用いる場合において、音圧を多く得るためには振動膜の径が大きいものが好ましい。また、ECMを発音体として用いた場合、カプセル内において、背極板とプリント基板との間に背極室が形成されることから、発音体の厚みは大きくなる。このため、例えば、イヤホンにエレクトレットコンデンサ型の発音体を組み込む際には、イヤホン筐体の設計の自由度が制約されることになる。加えて、発音体の内部に形成される背極室による気室とイヤホン筐体内部の音響用気室とが、相互作用を起こして音響特性に影響を与えてしまうことも考えられる。   In the case where the ECM is used as a sounding body, it is preferable that the diaphragm has a large diameter in order to obtain a large sound pressure. Further, when the ECM is used as a sounding body, a back electrode chamber is formed between the back electrode plate and the printed board in the capsule, so that the sounding body becomes thick. For this reason, for example, when an electret condenser type sounding body is incorporated into the earphone, the degree of freedom in designing the earphone housing is limited. In addition, it is conceivable that the air chamber formed by the back electrode chamber formed inside the sounding body and the acoustic air chamber inside the earphone housing cause an interaction and affect the acoustic characteristics.

本発明は、内部構造を簡素化し、素子自体を小型化したエレクトレットコンデンサ型発音体を提供することを目的としている。   An object of the present invention is to provide an electret condenser type sounding body in which the internal structure is simplified and the element itself is miniaturized.

本発明のエレクトレットコンデンサ型発音体の第1特徴構成は、振動膜と、前記振動膜に対向する位置に前記振動膜との間に一定の距離を保持させるスペーサを介して配置された基板と、前記基板における前記振動膜に対向する面に背面電極として配置されるエレクトレットと、前記基板及び前記エレクトレットに外方から連続して形成された音孔と、前記振動膜、前記スペーサ、前記基板、及び前記エレクトレットを収容する金属製の筒状カプセルと、を備え、前記エレクトレットに電気信号を印加する入力端子を接続するとともに、前記振動膜にグランド端子を接続し、前記振動膜及び前記基板を前記筒状カプセルの対向する側に露出させてある点にある。   A first characteristic configuration of the electret condenser-type sounding body of the present invention includes: a vibration film; and a substrate disposed via a spacer that maintains a certain distance between the vibration film at a position facing the vibration film; An electret disposed as a back electrode on a surface of the substrate facing the vibrating membrane; a sound hole formed continuously from the outside on the substrate and the electret; the vibrating membrane, the spacer, the substrate, and A metal cylindrical capsule that accommodates the electret, and an input terminal for applying an electric signal to the electret is connected, a ground terminal is connected to the vibration film, and the vibration film and the substrate are connected to the cylinder. It is in the point exposed to the opposite side of a capsule.

本構成の如く、振動膜に対向する位置に振動膜との間に一定の距離を保持させるスペーサを介して配置された基板と、基板における振動膜に対向する面に背面電極として配置されるエレクトレットとを備えたので、振動膜に対向する面には、エレクトレット膜が被覆される背極板及び背極板を保持するホルダが不要となる。これにより、エレクトレットコンデンサ型発音体の厚みを小さくすることができ、小型化が図られる。
また、エレクトレットコンデンサ型発音体を組付ける際には、表面にエレクトレットが配置された基板をそのままカプセル内に組み付けることができる。このため、コロナ放電されたエレクトレット膜が被覆された背極板をホルダによってカプセル内に押し込む必要も無く、エレクトレットコンデンサ型発音体の組み付け作業が簡略化される。
さらに、基板における振動膜に対向する面にエレクトレットを背面電極として配置するので、基板と背面電極間に背気室は形成されない。このため、例えば、エレクトレットコンデンサ型発音体をイヤホンの筐体に組み込んだ際に、背気室による不要な共振が起き難い。その結果、イヤホンにおいて所望する音圧特性の調整が容易となる。
As in this configuration, a substrate disposed via a spacer that maintains a certain distance between the diaphragm and the position facing the diaphragm, and an electret disposed as a back electrode on the surface of the substrate facing the diaphragm Thus, the back electrode plate covered with the electret film and the holder for holding the back electrode plate are not required on the surface facing the vibration film. Thereby, the thickness of the electret condenser type sounding body can be reduced, and the size can be reduced.
Further, when the electret condenser type sounding body is assembled, the substrate having the electret disposed on the surface can be directly assembled in the capsule. For this reason, it is not necessary to push the back electrode plate coated with the electret film subjected to corona discharge into the capsule by the holder, and the assembling work of the electret capacitor type sounding body is simplified.
Furthermore, since the electret is disposed as a back electrode on the surface of the substrate facing the vibration film, no back air chamber is formed between the substrate and the back electrode. For this reason, for example, when an electret condenser type sounding body is incorporated in the housing of the earphone, unnecessary resonance due to the back air chamber hardly occurs. As a result, it is easy to adjust a desired sound pressure characteristic in the earphone.

本発明のエレクトレットコンデンサ型発音体の第2特徴構成は、前記基板に前記エレクトレットに連通する貫通孔を形成し、当該貫通孔の前記基板における前記エレクトレットとは反対の側に電気信号を印加する端子を設けた点にある。   According to a second characteristic configuration of the electret condenser-type sounding body of the present invention, a terminal that forms a through-hole communicating with the electret in the substrate and applies an electrical signal to a side of the substrate opposite to the electret in the through-hole. It is in the point which provided.

本構成により、電気信号を印加する端子は、基板に形成された貫通孔を介してエレクトレットに導通され、エレクトレットに対して電気信号を確実に印加することができる。   With this configuration, the terminal to which the electric signal is applied is electrically connected to the electret via the through hole formed in the substrate, and the electric signal can be reliably applied to the electret.

エレクトレットコンデンサ型発音体の断面図Cross section of electret condenser type sounding body エレクトレットコンデンサ型発音体の分解斜視図Disassembled perspective view of electret condenser type sounding body 基板のパターンを示す平面図Plan view showing substrate pattern 別実施形態のエレクトレットコンデンサ型発音体の断面図Sectional drawing of electret condenser type sounding body of another embodiment 別実施形態のエレクトレットコンデンサ型発音体の分解斜視図An exploded perspective view of an electret condenser type sounding body of another embodiment

以下、本発明のエレクトレットコンデンサ型発音体の実施形態を図面に基づいて説明する。   Hereinafter, embodiments of an electret condenser type sounding body of the present invention will be described with reference to the drawings.

[第1実施形態]
図1はエレクトレットコンデンサ型発音体100の断面図であり、図2はエレクトレットコンデンサ型発音体100の分解斜視図である。
図1に示すように、エレクトレットコンデンサ型発音体100は、円筒状の側面部7aと天面部7bとを備える筒状カプセル7の内部に各種部品を収容して構成されている。筒状カプセル7の内部には、天面部7bの側から順に、振動膜3、スペーサ4、基板5が収容されている。そして、筒状カプセル7の側面部7aの端部が、基板5を筒状カプセル7の内部へとかしめることで、上述の各種部品が筒状カプセル7の内部に固定される。筒状カプセル7は金属等の導電性部材を用いて形成される。
本実施形態では、筒状カプセル7が円筒形状である例について説明するが、筒状カプセル7は角筒形状であってもよい。
[First embodiment]
FIG. 1 is a cross-sectional view of an electret capacitor-type sounding body 100, and FIG. 2 is an exploded perspective view of the electret capacitor-type sounding body 100.
As shown in FIG. 1, the electret condenser type sounding body 100 is configured by housing various components inside a cylindrical capsule 7 having a cylindrical side surface portion 7a and a top surface portion 7b. Inside the cylindrical capsule 7, the diaphragm 3, the spacer 4, and the substrate 5 are accommodated in this order from the top surface 7b side. And the above-mentioned various components are fixed inside the cylindrical capsule 7 by the edge part of the side part 7a of the cylindrical capsule 7 caulking the board | substrate 5 inside the cylindrical capsule 7. FIG. The cylindrical capsule 7 is formed using a conductive member such as metal.
In the present embodiment, an example in which the cylindrical capsule 7 has a cylindrical shape will be described, but the cylindrical capsule 7 may have a rectangular tube shape.

振動膜3は、その周囲が金属製の振動膜リング3aに一定のテンションで支持固定されており、筒状カプセル7の内部においては、振動膜リング3aが天面部7bの内面側に固着されている。振動膜3は樹脂材料で構成されており、例えば、数μm程度のPPS(ポリフェニレンサルファイド)フィルムを用い、チタン等の金属をスパッタリングして振動電極として使用する。スペーサ4は樹脂製であってリング状に形成され、基板5と振動膜3との間に一定の距離を保持させる。スペーサ4の厚みは、所望の音圧特性に合わせて適宜変更する。基板5はセラミック製基板あるいはプリント基板である。基板5の振動膜3に対向する面には、エレクトレット6が配置されており、このエレクトレット6が背面電極となる。エレクトレット6は、フッ素系樹脂あるいはセラミックに代表される強誘電材料を基板5の表面にコーティングし、コロナ放電により表面電位を与えて形成される。エレクトレット6と、振動膜3と、スペーサ4とでコンデンサ部Cが構成される。   The periphery of the vibrating membrane 3 is supported and fixed to the metallic vibrating membrane ring 3a with a constant tension. Inside the cylindrical capsule 7, the vibrating membrane ring 3a is fixed to the inner surface side of the top surface portion 7b. Yes. The vibration film 3 is made of a resin material. For example, a PPS (polyphenylene sulfide) film of about several μm is used, and a metal such as titanium is sputtered and used as a vibration electrode. The spacer 4 is made of resin and is formed in a ring shape, and holds a certain distance between the substrate 5 and the vibration film 3. The thickness of the spacer 4 is appropriately changed in accordance with a desired sound pressure characteristic. The substrate 5 is a ceramic substrate or a printed substrate. An electret 6 is disposed on the surface of the substrate 5 facing the vibration film 3, and this electret 6 serves as a back electrode. The electret 6 is formed by coating the surface of the substrate 5 with a ferroelectric material typified by fluorine resin or ceramic and applying a surface potential by corona discharge. The electret 6, the vibration film 3, and the spacer 4 constitute a capacitor unit C.

基板5及びエレクトレット6に外方から振動膜3が配置されている空間まで連続する音抜け用の音孔8が形成されている。図2及び図3に示されるように、音孔8は、基板5の中央付近の1箇所と周囲の四方付近の4箇所の計5箇所に設けられている。   A sound hole 8 for sound removal is formed in the substrate 5 and the electret 6 continuously from the outside to the space where the vibration film 3 is disposed. As shown in FIGS. 2 and 3, the sound holes 8 are provided at a total of five locations, one in the vicinity of the center of the substrate 5 and four in the vicinity of the surrounding four sides.

基板5にエレクトレット6に連通する貫通孔5aが形成されており、基板5の外面側の当該貫通孔5aを覆う位置に電気信号を印加する入力端子9を設けてある。また、同じく、基板5の外面側には、グランド端子10が設けてある。図1及び図3に示すように、グランド端子10は筒状カプセル7と導通しており、筒状カプセル7の加締めにより筒状カプセル7とグランド端子10の導電パターンが電気的に接続される。こうして、振動膜3は筒状カプセル7を介してグランド端子10に接続されている。エレクトレット6に電気信号を印加する入力端子9を接続するとともに、振動膜3にグランド端子10を接続する。振動膜3及び基板5は、筒状カプセル7の対向する側においてそれぞれ露出させてある。   A through hole 5 a communicating with the electret 6 is formed in the substrate 5, and an input terminal 9 for applying an electric signal is provided at a position covering the through hole 5 a on the outer surface side of the substrate 5. Similarly, a ground terminal 10 is provided on the outer surface side of the substrate 5. As shown in FIGS. 1 and 3, the ground terminal 10 is electrically connected to the cylindrical capsule 7, and the conductive pattern of the cylindrical capsule 7 and the ground terminal 10 is electrically connected by caulking the cylindrical capsule 7. . Thus, the vibrating membrane 3 is connected to the ground terminal 10 via the cylindrical capsule 7. An input terminal 9 for applying an electric signal is connected to the electret 6, and a ground terminal 10 is connected to the vibrating membrane 3. The vibration film 3 and the substrate 5 are exposed on the opposite sides of the cylindrical capsule 7.

以上のようにエレクトレットコンデンサ型発音体100を構成することで、入力端子9からエレクトレット6に電気信号が付与されると、振動膜3への静的引力が変化し、振動膜3が振動する。つまり、エレクトレットコンデンサ型発音体100において電気信号が音波に変換される。   By configuring the electret capacitor-type sounding body 100 as described above, when an electric signal is applied from the input terminal 9 to the electret 6, the static attractive force to the vibration film 3 changes, and the vibration film 3 vibrates. That is, the electrical signal is converted into sound waves in the electret condenser type sounding body 100.

基板5における振動膜3に対向する面にエレクトレット6を背面電極として配置するため、振動膜3に対向する面には、エレクトレット6が被覆される背極板及び背極板を保持するホルダが不要となる。これにより、エレクトレットコンデンサ型発音体100の厚みを小さくすることができ、素子本体の小型化が図ることができる。   Since the electret 6 is disposed as a back electrode on the surface of the substrate 5 facing the vibrating membrane 3, a back electrode plate covered with the electret 6 and a holder for holding the back electrode plate are not necessary on the surface facing the vibrating membrane 3 It becomes. Thereby, the thickness of the electret capacitor type sounding body 100 can be reduced, and the element body can be miniaturized.

エレクトレットコンデンサ型発音体100を組付ける際には、表面にエレクトレット6が配置された基板5を筒状カプセル7内に組み付ける。このため、コロナ放電されたエレクトレット6が被覆された背極板をホルダによって筒状カプセル7内に押し込む必要も無く、エレクトレットコンデンサ型発音体100の組み付け作業が簡略化される。   When the electret condenser type sounding body 100 is assembled, the substrate 5 on which the electret 6 is arranged is assembled in the cylindrical capsule 7. For this reason, it is not necessary to push the back electrode plate covered with the electret 6 subjected to the corona discharge into the cylindrical capsule 7 by the holder, and the assembling work of the electret capacitor type sounding body 100 is simplified.

また、基板5における振動膜3に対向する面にエレクトレット6を背面電極として配置するので、基板5と背面電極(エレクトレット6)間に背気室は形成されない。このため、例えば、エレクトレットコンデンサ型発音体100をイヤホンの筐体に組み込んだ際に、背気室による不要な共振が起き難い。その結果、イヤホンにおいて所望する音圧特性の調整が容易となる。   Moreover, since the electret 6 is arrange | positioned as a back electrode in the surface facing the diaphragm 3 in the board | substrate 5, a back air chamber is not formed between the board | substrate 5 and a back electrode (electret 6). For this reason, for example, when the electret condenser type sounding body 100 is incorporated in the earphone housing, unnecessary resonance due to the back air chamber is unlikely to occur. As a result, it is easy to adjust a desired sound pressure characteristic in the earphone.

[別実施形態]
上記の第1実施形態では、振動膜3を支持する振動膜リング3aを筒状カプセル7に固着する例を示したが、図4および図5に示すように、振動膜3を筒状カプセル7の天面部7bの内面に直接接着させてもよい。こうすることで、振動膜リング3aが不要となり、エレクトレットコンデンサ型発音体100のさらなる低背化が可能となる。
[Another embodiment]
In the first embodiment, the example in which the vibrating membrane ring 3a that supports the vibrating membrane 3 is fixed to the cylindrical capsule 7 has been shown. However, as shown in FIGS. 4 and 5, the vibrating membrane 3 is attached to the cylindrical capsule 7. The top surface portion 7b may be directly bonded to the inner surface. By doing so, the diaphragm ring 3a is unnecessary, and the electret condenser type sounding body 100 can be further reduced in height.

本発明のエレクトレットコンデンサ型発音体は、携帯電話、PDA、デジタルカメラ、ヘッドホン、イヤホン等の幅広い機器に適用することができる。   The electret condenser type sounding body of the present invention can be applied to a wide range of devices such as mobile phones, PDAs, digital cameras, headphones, and earphones.

3 振動膜
3a 振動膜リング
4 スペーサ
5 基板
5a 貫通孔
6 エレクトレット
7 筒状カプセル
8 音孔
9 入力端子
10 グランド端子
3 Vibration film 3a Vibration film ring 4 Spacer 5 Substrate 5a Through hole 6 Electret 7 Cylindrical capsule 8 Sound hole 9 Input terminal 10 Ground terminal

Claims (2)

振動膜と、
前記振動膜に対向する位置に前記振動膜との間に一定の距離を保持させるスペーサを介して配置された基板と、
前記基板における前記振動膜に対向する面に背面電極として配置されるエレクトレットと、
前記基板及び前記エレクトレットに外方から連続して形成された音孔と、
前記振動膜、前記スペーサ、前記基板、及び前記エレクトレットを収容する金属製の筒状カプセルと、を備え、
前記エレクトレットに電気信号を印加する入力端子を接続するとともに、前記振動膜にグランド端子を接続し、
前記振動膜及び前記基板を前記筒状カプセルの対向する側に露出させてあるエレクトレットコンデンサ型発音体。
A vibrating membrane;
A substrate disposed via a spacer that maintains a certain distance between the vibrating membrane at a position facing the vibrating membrane;
An electret disposed as a back electrode on the surface of the substrate facing the vibrating membrane;
A sound hole formed continuously from the outside in the substrate and the electret;
A metal cylindrical capsule that houses the vibrating membrane, the spacer, the substrate, and the electret;
While connecting an input terminal for applying an electric signal to the electret, a ground terminal is connected to the vibrating membrane,
An electret condenser type sounding body in which the vibrating membrane and the substrate are exposed on opposite sides of the cylindrical capsule.
前記基板に前記エレクトレットに連通する貫通孔を形成し、当該貫通孔の前記基板における前記エレクトレットとは反対の側に電気信号を印加する端子を設けてある請求項1記載のエレクトレットコンデンサ型発音体。   The electret condenser type sounding body according to claim 1, wherein a through-hole communicating with the electret is formed in the substrate, and a terminal for applying an electric signal is provided on a side of the through-hole opposite to the electret in the substrate.
JP2011199843A 2011-09-13 2011-09-13 Electret condenser type sounding body Expired - Fee Related JP5626907B2 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5685998A (en) * 1979-12-15 1981-07-13 Toshiba Corp Electrostatic type head phone set
JP2000232700A (en) * 1999-02-08 2000-08-22 Hosiden Corp Unidirectional electret condenser microphone
WO2007125985A1 (en) * 2006-04-27 2007-11-08 National University Corporation Saitama University Mechanical-electrical converting device and its manufacturing method
JP2010062622A (en) * 2008-09-01 2010-03-18 Yamaha Corp Electrostatic speaker
JP2011223133A (en) * 2010-04-06 2011-11-04 Hosiden Corp Microphone

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5685998A (en) * 1979-12-15 1981-07-13 Toshiba Corp Electrostatic type head phone set
JP2000232700A (en) * 1999-02-08 2000-08-22 Hosiden Corp Unidirectional electret condenser microphone
WO2007125985A1 (en) * 2006-04-27 2007-11-08 National University Corporation Saitama University Mechanical-electrical converting device and its manufacturing method
JP2010062622A (en) * 2008-09-01 2010-03-18 Yamaha Corp Electrostatic speaker
JP2011223133A (en) * 2010-04-06 2011-11-04 Hosiden Corp Microphone

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