JP2013058359A - Mounting component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting component in which a solder contact surface in plating state can be made larger even when a substrate connection part is downsized, while minimizing decrease in retention after solder connection.SOLUTION: The shield connector includes a shell 15 having a board connection part 61 formed by bending a metal plate subjected to plating, inserted into a connection hole 63 formed in a circuit board 55, and connected therewith by soldering. The board connection part 61 is configured to form a through space 65, where the solder is accumulated, in a surface where the metal plates are superimposed in the plate thickness direction. The through space 65 is preferably formed in parallel with the substrate surface 67 of the circuit board 55.

Description

  The present invention relates to a mounting component that is soldered to a circuit board.

2. Description of the Related Art Conventionally, there has been known a connector including a shell formed by bending a metal plate, a terminal fitting surrounded by the inside of the shell, and an insulating housing in which the terminal fitting and the shell are assembled. The connector includes a shell formed by bending a conductive metal plate into a box shape, and the shell has a leg-shaped board connection portion that is inserted into a connection hole formed in a printed circuit board and soldered. .
By the way, although the metal plate which comprises a shell is plated, there exists a situation that the torn surface of a non-plating state is exposed unavoidably when it punches with a press. However, since it is difficult for solder to adhere to such a non-plated fracture surface, connection reliability decreases.

  In order to eliminate this problem, as shown in FIG. 8, the board connecting portion 511 provided in the shell 509 is connected to the lower end of the side plate portion 513 and is suspended along the plate surface, and the lower end of the neck portion 515. A connector including a bent portion 517 that is continuously bent into a predetermined shape has been proposed (see, for example, Patent Document 1).

  The bent portion 517 includes a base plate portion 519 that continuously hangs coaxially with the neck portion 515, a pair of projecting plate portions 521 that are bent substantially at right angles from both front and rear ends of the base plate portion 519, and both projecting plates. A bent portion (inner end) of the portion is bent at a substantially right angle toward the inside, and the bent ends are integrally formed with a pair of opposing plate portions 523 that abut each other at the center in the front-rear direction of the substrate connecting portion 511, As a whole, it is formed in a substantially rectangular tube shape with rounded four corners.

  The inside of the bent portion 517 is a hollow portion 525 having a square cross section. As described above, the board connecting portion 511 has a bent shape so that the fracture surface of the metal plate is hidden. As a result, the soldered portions are formed so as not to expose the fractured surfaces of the metal plates having poor solder wettability because they are in an unplated state.

JP 2010-61849 A

  By the way, in recent years, with the miniaturization, weight reduction, and thinning of electronic devices, there is an increasing demand for reducing the size of the board connection portion in order to reduce the size of a mounting component to be soldered to a circuit board. Therefore, if the board connecting portion 511 shown in FIG. 8 is made smaller in accordance with the miniaturization of the connector described above, the surface area of the board connecting portion 511 to which the solder adheres becomes narrower and the solder contact surface becomes smaller. The problem was that it was difficult to ensure connection reliability due to the decline in power.

  The present invention has been made in view of the above situation, and its purpose is to make the solder contact surface in a plated state larger even when the board connection portion is miniaturized, and to suppress a decrease in holding force after solder connection. It is to provide a mounting component that can be used.

The above object of the present invention is achieved by the following configuration.
(1) A mounting component including a shell having a board connection portion formed by bending a plated metal plate, inserted into a connection hole formed in a circuit board, and solder-connected to the circuit board. The board connection part is configured to form a through space in which solder accumulates on a surface of the metal plates stacked in the plate thickness direction.

According to the mounting component having the configuration (1), the through space formed in the board connection portion is formed so as to be surrounded by the plated surface of the metal plate subjected to the plating process. That is, the inner wall surface of the through space is a metal plate plating surface with good solder wettability.
Therefore, when soldering to the board connection part inserted into the connection hole of the circuit board, the molten solder adheres to the outer surface of the board connection part and is sucked and collected in the through space with good solder wettability. Even when the board connection portion is downsized, the solder contact surface in the plated state can be enlarged to improve the holding force after the solder connection.

(2) The mounting component according to (1), wherein the through space is formed in parallel to the substrate surface of the circuit board.

  According to the mounting component having the configuration (2), the solder adhered and solidified in the connection hole and the lower surface (soldering surface) of the circuit board passes through the through space of the substrate connection portion and is fixed. That is, the board connecting portion is fixed to the circuit board by the hook-shaped solder penetrating the through space, so that the soldering strength of the board connecting portion in the direction orthogonal to the board surface is further improved.

  According to the mounting component according to the present invention, the solder contact surface in the plated state can be made larger even when the board connection portion is miniaturized, and a decrease in holding force after solder connection can be suppressed.

  The present invention has been briefly described above. Furthermore, the details of the present invention will be further clarified by reading through a mode for carrying out the invention described below (hereinafter referred to as “embodiment”) with reference to the accompanying drawings. .

It is a disassembled perspective view of the mounting component which concerns on one Embodiment of this invention. It is the perspective view which looked at the assembly of the mounting components shown in FIG. 1 from diagonally downward. It is the A section enlarged view of FIG. (A) is a perspective view showing an example of development of a board connection part that is folded back at an intermediate part in the longitudinal direction, (b) is a perspective view showing an example of development of a board connection part that is turned up at an intermediate part in the width direction, and (c) consists of two pieces. It is a perspective view which shows the example of a board | substrate connection part. It is a side view which shows the state which mounted | wore the circuit board with the mounting component shown in FIG. It is a BB cross-sectional arrow view of FIG. It is the C section enlarged view of FIG. It is a rear view of the conventional connector which provided the board | substrate connection part bent so that the fracture surface of the metal plate might be hidden in the shell.

Hereinafter, a mounting component according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
The shield connector 11 as a mounting component according to an embodiment of the present invention can be suitably used as a receptacle connector for a digital camera or a mobile phone, for example.
As shown in FIGS. 1 and 2, the shield connector 11 includes an insulating housing 13 (also called an insulator), a shell 15, and a receptacle-side contact 17. The receptacle-side contact 17 includes a lower terminal 19 and an upper terminal 21.

  The shield connector 11 is connected to a plug connector having a conductive shell (not shown). When the shield connector 11 and the plug connector are connected, the receptacle-side contact 17 is electrically connected to the plug-side contact of the plug connector, and as a countermeasure against EMI (electromagnetic interference noise), the shell 15 of the conductive shield connector 11 is connected. And covered by the plug connector shell.

  The insulating housing 13 is integrally formed of a synthetic resin material, and the terminal support portion 20 projects forward from the base portion 18. The terminal support part 20 arranges the upper terminal 21 and the lower terminal 19 in alignment on the upper and lower surfaces. In the shield connector 11, a connector fitting space 23 is formed by the shell 15 and the insulating housing 13, and an end portion of the shell 15 becomes a plug insertion port 25.

The shell 15 includes a shell main body 27 and an engagement support member 29. The shell body 27 is manufactured by processing a metal plate, which is a conductive material, into a sheet metal shape, and is formed in a flat rectangular tube shape having a front portion opened as a plug insertion opening 25 as shown in FIG. A metal plate for punching and bending the shell 15 is preliminarily subjected to a plating process for improving solder wettability.
A long locking hole 33 is formed in the main body side plate portion 31 of the shell main body 27 in the front-rear direction. A locking claw 35 is formed in front of the locking hole 33. The locking holes 33 and the locking claws 35 are for engaging the engagement support member 29 with the shell body 27.

  The engagement support member 29 protrudes rearward from each of the main body side plate portions 31 on both sides and is bent 180 ° forward and disposed. Accordingly, the engagement support member 29 is provided on both side surfaces of the shell body 27. Each engagement support member 29 is formed with an elastic engagement plate 39 inside a frame-shaped portion 37 punched into a U-shape. The elastic engagement plate 39 is disposed inward from the locking hole 33 of the shell main body 27 and sandwiches both side surfaces of the plug connector entering from the plug insertion opening 25. At the front part of the frame-shaped part 37, a locking edge part 41 that is locked by a locking claw 35 provided on the shell body 27 is formed.

  The shell main body 27 is provided with an erroneous fitting preventing portion 43. The erroneous fitting preventing portion 43 has arms 45 that are folded forward 180 ° from the rear portion of the shell body 27 and extend forward, on both sides in the width direction. A free end portion of the arm 45 extending forwardly projects into the connector fitting space 23 of the shell body 27 through a hole 49 formed in the upper wall 47 of the shell body 27 from the outside of the shell body 27. A stopper wall 51 that comes into contact with the non-regular plug when a non-regular plug (not shown) is inserted is formed at the free end. Further, the arm 45 is provided with a plug pickup portion 53 that is integrally formed in parallel with the stopper wall 51 and protrudes into the connector fitting space 23 and comes into contact with the plug connector when a proper plug connector is inserted. Yes.

  The engagement support member 29 is provided with a board connection leg 57 having a punched hole at a drooping tip extending downward and soldered to the circuit board 55 (see FIG. 5). The punching hole takes in the solder and increases the contact area with the solder. A board connecting portion 61 is suspended from the engagement support member 29 behind the board connecting leg 57. The board connecting portion 61 is also soldered to the circuit board 55 as will be described in detail later.

  The board connection legs 57 and the board connection part 61 according to the present embodiment are indirectly provided via the engagement support member 29, so that it is not necessary to provide them directly on the shell body 27. Thereby, since the cut-and-raised opening is not formed when the board connecting leg 57 and the board connecting portion 61 are formed by cutting and raising the bottom surface of the shell main body 27, it is possible to prevent entry of solder and flux into the shell main body 27. it can.

  The board connecting portion 61 is formed by bending a metal plate, inserted into a connection hole 63 (see FIG. 6) formed in the circuit board 55, and soldered to the circuit board 55. As shown in FIG. 3, the board connecting portion 61 is configured to form a through space 65 in which solder accumulates on a surface where metal plates are overlapped in the plate thickness direction. The through space 65 is formed in parallel to the substrate surface 67 of the circuit board 55.

4A is a perspective view showing a development example of the board connection portion 61 that is folded back at the middle portion in the longitudinal direction, and FIG. 4B is a perspective view showing a development example of the board connection portion 61 that is folded back at the middle portion in the width direction. (C) is a perspective view which shows the example of the board | substrate connection part 61 which consists of two pieces.
The substrate connecting portion 61 of the present embodiment can be formed later by bending by providing a developed shape on the base plate when the engagement support member 29 is press-formed. For example, as shown in FIG. 4A, two thin portions 71 are formed on the developed piece 69 of the substrate connecting portion 61 by thinning. This thinning process is conditional on the plating process not being impaired. By folding the intermediate portion in the longitudinal direction of the development piece 69 with a fold line 73 so that the thin portion 71 is combined as the through space 65, the through space 65 is sandwiched between the metal plate plating surfaces 75 shown in FIG. A substrate connecting portion 61 is formed.

  In addition, as shown in FIG. 4B, the board connecting portion 61 is formed with the development piece 77 having a width twice that of the board connecting portion 61 and the thin portion 71 similar to the above in the width direction. The board connecting portion 61 having the through space 65 sandwiched between the metal plate plating surfaces 75 can also be formed by overlapping the left and right sides with the folding line 79 at the center in the width direction. In this case, it is necessary to make one opening hole 81 of the through space 65 in the center in the width direction of the development piece 77.

  Further, as shown in FIG. 4C, the board connecting portion 61 forms two unfolded piece portions 83 and unfolded piece portions 85 that are combined by pressing, and is bent at the tip of the unfolded piece portion 85. It can also be formed by providing the portion 87. In this case, a through space 65 sandwiched between the metal plate plating surfaces 75 separated by the thickness of the bent portion 87 is formed in the substrate connecting portion 61.

Next, the operation of the shield connector 11 as a mounting component having the above configuration will be described with reference to FIGS.
In the shield connector 11 of the present embodiment, a through space 65 is formed in the board connection portion 61 formed in the engagement support member 29 of the shell 15. The through space 65 is formed so as to be surrounded by a metal plate plating surface 75 that has been plated. That is, the inner wall surface 89 of the through space 65 is a metal plate plating surface 75 with good solder wettability and good solder adhesion (see FIG. 7).

  Therefore, when soldering to the board connection portion 61 inserted into the connection hole 63 of the circuit board 55, the molten solder adheres to the outer surface of the board connection portion 61 and is sucked into the through space 65 with good solder wettability. Therefore, even when the board connecting portion 61 is downsized, the solder contact surface in the plated state can be enlarged to improve the holding force after the solder connection.

  Further, in the connection hole 63, the through space 65 formed by being surrounded by the metal plate plating surface 75 is arranged in parallel to the substrate surface 67. For this reason, the solder solidified by adhering to the inside of the connection hole 63 of the circuit board 55 and the lower surface 68 as the soldering surface passes through the through space 65 of the board connection portion 61 and is fixed. That is, the board connection portion 61 is fixed to the circuit board 55 by the hook-shaped solder penetrating the through space 65, so that the soldering strength of the board connection portion 61 in the direction orthogonal to the board surface 67 is further improved.

  Therefore, according to the shield connector 11 of the present embodiment described above, the solder wettability is good on the outer surface of the board connecting portion 61 and the inner wall surface 89 of the through space 65 even when the board connecting portion 61 is downsized. By arranging the metal plate plating surface 75, a solder contact surface in a plated state can be made larger, and a decrease in holding force after solder connection can be suppressed. Of course, when the board connecting portion 61 is not downsized, the holding force after solder connection can be improved as compared with the conventional board connecting portion.

  In addition, this invention is not limited to embodiment mentioned above, A deformation | transformation, improvement, etc. are possible suitably. In addition, the material, shape, dimensions, number, arrangement location, and the like of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.

11 ... Shield connector (mounting parts)
DESCRIPTION OF SYMBOLS 15 ... Shell 55 ... Circuit board 61 ... Board | substrate connection part 63 ... Connection hole 65 ... Through space 67 ... Board surface

Claims (2)

A mounting component comprising a shell having a board connecting portion that is formed by bending a metal plate that has been plated, inserted into a connection hole formed in a circuit board, and soldered to the circuit board,
The mounting component, wherein the board connecting portion is configured to form a through space in which solder accumulates on a surface obtained by superimposing the metal plates in the thickness direction. The mounting component according to claim 1,
The mounting component, wherein the through space is formed in parallel to a substrate surface of the circuit board.

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