JP2013055246A - Manufacturing method of surface emitting laser module, surface emitting laser module, optical scanner, and image formation apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface emitting laser module where laser light emitted from a surface emitting laser and reflected by a transparent member is incident into a light receiving element.SOLUTION: A manufacturing method of a surface emitting laser module comprises the steps of: installing a surface emitting laser element 110 and a light receiving element 120 in a package part; applying an adhesive resin to a joining part between the package part and a lid part and placing the lid part on the adhesive resin at the package part; causing surface emitting lasers for positioning 116, 117 to emit light; adjusting the position of the lid part so that the laser light emitted from the surface emission lasers for the positioning and partially reflected by the transparent member is received by light receiving parts for positioning 126, 127 and the output at the light receiving part for the positioning 126, 127, which is generated by the received laser light, is maximized; and bonding the package part to the lid part by the adhesive resin.

Description

  The present invention relates to a method for manufacturing a surface emitting laser module, a surface emitting laser module, an optical scanning device, and an image forming apparatus.

  In a general edge-emitting semiconductor laser, a resonator having reflection surfaces at both end surfaces formed by cleaving after laminating a semiconductor layer on a substrate such as a semiconductor is formed. For this reason, laser light is emitted in two directions on both end faces, that is, laser light that is front light emitted from one of the end faces and laser light that is back light emitted from the other of the end faces.

  The semiconductor laser has a feature that when the temperature of the semiconductor laser rises due to environmental temperature, self-heating, or the like, the relationship between the drive current and the amount of emitted laser light changes. For this reason, a light receiving element such as a photodiode is usually provided in the semiconductor laser, and the amount of light emitted from the semiconductor laser is monitored by detecting the back light of the semiconductor laser with the light receiving element, and is monitored by the light receiving element. Feedback control is performed so that the amount of light emitted from the semiconductor laser becomes a predetermined value in accordance with the amount of light.

  However, in the case of a surface emitting laser, since the laser beam is emitted in only one direction, feedback control cannot be performed by receiving the back light by a light receiving element as in the case of an edge emitting semiconductor laser.

  When the surface emitting laser element is actually used, it is necessary to cover and seal the surface emitting laser element with a lid portion or the like for dust prevention or the like. Therefore, in the lid portion, a region where the laser beam is emitted, that is, a region near the optical axis of the laser beam emitted from the surface emitting laser element is formed by the transparent member. However, when the surface of the transparent member and the optical axis of the laser light are perpendicular, the laser light reflected on the surface of the transparent member is incident on the surface emitting laser element as return light, and laser oscillation in the surface emitting laser is generated. It becomes unstable.

  For this reason, the inventors sealed the surface emitting laser element with a lid portion or the like, and a transparent member formed of a material that transmits the laser light emitted from the surface emitting laser was placed on the lid portion with the surface emitting laser. Inventing a surface-emitting laser module having a structure in which laser light emitted from a surface-emitting laser is reflected by the surface of a transparent member and the reflected laser light is incident on a light-receiving element. It came to.

  However, the laser light emitted from the surface emitting laser is partially reflected by the transparent member provided in the lid portion. However, in order to make the reflected laser light enter the light receiving element, the lid portion is placed at a desired position. Therefore, it is required to perform positioning with high accuracy and to join the package part.

  Therefore, the present invention has been made in view of the above, and is a surface emitting device that can be installed with high accuracy so that laser light emitted from a surface emitting laser and partially reflected by a transparent member enters the light receiving element. It is an object of the present invention to provide a method for manufacturing a laser module and a surface emitting laser module. It is another object of the present invention to provide an optical scanning device and an image forming apparatus that stably provide high-quality images.

  In the present invention, the surface emitting laser element and the light receiving element are covered by joining a package part and a lid part, and laser light emitted from the surface emitting laser in the surface emitting laser element is transmitted through the lid part. In the method of manufacturing the surface emitting laser module, a transparent member is provided, the surface emitting laser element is provided with a positioning surface emitting laser, and the light receiving element is provided with a positioning light receiving unit. A step of installing the surface emitting laser element and the light receiving element on the package portion; and an adhesive resin is applied to a joint portion between the package portion and the lid portion in the package portion, and the lid is disposed on the adhesive resin. A step of placing the portion, a step of emitting the surface emitting laser for positioning, and a light emitting from the surface emitting laser for positioning. Receiving the laser beam partially reflected by the member, and adjusting the position of the lid portion so that the output of the received laser beam in the positioning light receiving unit is maximized; and the package unit, And a step of bonding the lid portion with the adhesive resin.

  In the present invention, the surface emitting laser element and the light receiving element are covered by joining the package part and the lid part, and laser light emitted from the surface emitting laser in the surface emitting laser element is applied to the lid part. A transparent member is provided, the surface emitting laser element is provided with a positioning surface emitting laser, the light receiving element is provided with a positioning light receiving part, and the lid part is a lid part body. In the method of manufacturing the surface emitting laser module having a portion and a lid portion side surface portion, the step of installing the surface emitting laser element on the package portion, and bonding the package portion and the lid portion main body portion A step of applying an adhesive resin to a region where the light receiving element is installed in the lid body portion, and placing the light receiving element on the adhesive resin; The step of emitting the positioning surface emitting laser; and the positioning light receiving unit that receives the laser light emitted from the positioning surface emitting laser and partially reflected by the transparent member; The step of adjusting the position of the light receiving element so that the output at is substantially maximized, the step of bonding the light receiving element to the lid portion main body portion with the adhesive resin, and the both side surfaces of the lid portion main body portion. Adhering the side surface of the lid part.

  The present invention further includes a surface emitting laser element, a light receiving element, and a package part and a lid part that cover the surface emitting laser element and the light receiving element, and the package part and the lid part are joined. The lid portion is provided with a transparent member that transmits laser light emitted from the surface emitting laser in the surface emitting laser element, and a part of the laser light emitted from the surface emitting laser is the transparent member. The surface-emitting laser element is provided with a positioning surface-emitting laser, and the light-receiving element is emitted from the positioning surface-emitting laser, A positioning light receiving portion that receives light partially reflected by the transparent member is provided.

  According to the present invention, a method of manufacturing a surface-emitting laser module and surface-emitting that can be installed with high accuracy so that laser light emitted from a surface-emitting laser and partially reflected by a transparent member enters the light-receiving element. A laser module can be provided. Further, by using this surface emitting laser module, it is possible to provide an optical scanning device and an image forming apparatus capable of stably forming a high-quality image.

Explanatory drawing of surface emitting laser module (1) Explanatory drawing of surface emitting laser module (2) Explanatory drawing (1) of the surface emitting laser module in 1st Embodiment Explanatory drawing (2) of the surface emitting laser module in 1st Embodiment The flowchart which shows the manufacturing method of the surface emitting laser module in 1st Embodiment Explanatory drawing of the surface emitting laser module in 2nd Embodiment The flowchart which shows the manufacturing method of the surface emitting laser module in 2nd Embodiment Explanatory drawing of the surface emitting laser module in 3rd Embodiment Explanatory drawing of the manufacturing method of the surface emitting laser module in 3rd Embodiment The flowchart which shows the manufacturing method of the surface emitting laser module in 3rd Embodiment Explanatory drawing (1) of the other surface emitting laser module in 3rd Embodiment Explanatory drawing (2) of the other surface emitting laser module in 3rd Embodiment Explanatory drawing of the manufacturing method of the surface emitting laser module in 4th Embodiment The flowchart which shows the manufacturing method of the surface emitting laser module in 4th Embodiment Configuration diagram of laser printer in fifth embodiment Configuration of Optical Scanning Device in Fifth Embodiment Configuration diagram of color printer according to sixth embodiment

  The form for implementing this invention is demonstrated below. In addition, about the same member etc., the same code | symbol is attached | subjected and description is abbreviate | omitted.

[First Embodiment]
First, a surface emitting laser module using a lid portion having a transparent member inclined according to FIGS. 1 and 2 will be described. In this surface emitting laser module, as shown in FIG. 1, the surface emitting laser element 10 and the light receiving element 20 are installed in a space formed by joining a package part 30 and a lid part 40. . FIG. 1 is a view of the inside of the surface emitting laser module as seen from the side, and FIG. 2 is a view of the inside as seen from the top, that is, a view with the lid portion 40 removed.

  The surface emitting laser element 10 is installed on the bottom surface 31 of the package unit 30, and the light receiving element 20 is installed on a step 32 higher than the bottom surface 31 of the package unit 30. The lid portion 40 is provided with a transparent member 41 formed of a material through which light emitted from the surface emitting laser in the surface emitting laser element 10 is transmitted, for example, glass or transparent plastic. Most of the laser light emitted from the surface emitting laser 10 is transmitted through the transparent member 41 and emitted outside the space covered with the lid portion 40 and the package portion 30. Although the transparent member 41 is made of a material that transmits light, it has a predetermined refractive index, so that the laser light emitted from the surface emitting laser is partially on the front or back surface of the transparent member 41. The reflected light is incident on the light receiving element 20.

  Here, as shown in FIG. 2, when the surface emitting laser element 10 is provided with a plurality of surface emitting lasers, for example, five surface emitting lasers 11 to 15, the five surfaces of the surface emitting laser element 10. The laser beams emitted from the light emitting lasers 11 to 15 are reflected by the transparent member 41 and form five light spots 11 a to 15 a on the surface of the photodiode that is the light receiving element 20. Since the five light spots 11a to 15a irradiated on the surface of the photodiode that is the light receiving element 20 are formed by the laser light reflected by the transparent member 41, the position of the transparent member 41 is more than the predetermined position. If shifted, the positions of the light spots 11a to 15a irradiated on the surface of the photodiode which is the light receiving element 20 are also greatly shifted. That is, the package part 30 and the lid part 40 are joined by adhesion, welding, or the like, but when the joining position is slightly displaced at the time of joining, the respective light spots 11a to 15a In some cases, the light does not enter the light receiving surface. In this case, it is impossible to detect the exact light amount of the laser light emitted from the surface emitting laser. Further, as a method corresponding to such a case, there is a method using a photodiode having a large light receiving area as a photodiode as the light receiving element 20, but the use of the large light receiving element 20 increases the size of the surface emitting laser module. This is not preferable.

(Surface emitting laser module)
Next, the surface emitting laser module in the first embodiment will be described. As shown in FIGS. 3 and 4, the surface emitting laser module according to the present embodiment includes a surface emitting laser element 110, a light receiving element 120, a package part 130, and a lid part 140. 3 is a view of the inside of the surface emitting laser module according to the present embodiment as seen from the side, and FIG. 4 is a view of the inside as seen from the top, that is, a view with the lid portion 140 removed. is there. The package part 130 and the lid part 140 are bonded together by bonding or the like, and are installed inside the bonded part of the package part 130 and the lid part 140 in order to protect the surface emitting laser element 110 and the light receiving element 120 from dust. .

  A concave portion is formed in the package portion 130, and the surface emitting laser element 110 is installed in the approximate center of the bottom surface 131 of the concave portion. The surface emitting laser element 110 is connected to an electrode (not shown) provided on the bottom surface 131 of the package unit 130 by a bonding wire or the like. The electrode (not shown) is an electron (not shown) provided outside the package unit 130. Connected to the drive circuit, the on / off timing, light quantity, and the like are controlled by the electronic drive circuit.

  The light receiving element 120 is installed in a stepped portion 132 that is one step higher than the bottom 131 of the package portion 130, and receives laser light emitted from the surface emitting laser in the surface emitting laser element 110 and partially reflected by the transparent member 141. It is installed in a position where it can. The light receiving element 120 can obtain an output corresponding to the amount of light detected by each light detection unit of the light receiving element 120, an electrode (not shown) provided in the stepped portion 132 of the package unit 130, a bonding wire, and the like. Connected by. The electrode (not shown) is connected to an electronic drive circuit (not shown) provided outside the package unit 130, and the amount of light emitted from the surface emitting laser element 110 is output by the output obtained by the light receiving element 120 in the electronic drive circuit. Feedback control is performed to control.

  The lid portion 140 has a substantially quadrangular columnar shape (columnar portion), and a transparent member 141 that transmits laser light emitted from the surface emitting laser in the surface emitting laser element 110 is provided. . The transparent member 141 is formed in a flat plate shape using glass, a transparent resin material, or the like, and most of the laser light emitted from the surface emitting laser passes through the transparent member 141, but a part of the surface is the surface of the transparent member 141. Is reflected at. The transparent member 141 is installed in an inclined state with respect to the surface of the surface emitting laser element 110 so that laser light emitted from the surface emitting laser and partially reflected by the transparent member 141 is incident on the light receiving element 120. . In this way, by arranging the transparent member 141 so as to be inclined with respect to the surface of the surface emitting laser element 110, the light emitted from the surface emitting laser element 110 enters the surface emitting laser element 110 as return light. Can be prevented.

  As shown in FIG. 4, in the present embodiment, the surface emitting laser element 110 includes, in addition to the five surface emitting lasers 111 to 115, a first positioning surface emitting laser 116 and a second positioning surface. A light emitting laser 117 is provided. The light receiving element 120 includes three photodiodes, that is, a light detection unit 121, a first positioning light detection unit 126, and a second positioning light detection unit 127. The light detection unit 121 receives the light spots 111 a to 115 a formed by reflecting the laser light emitted from the five surface emitting lasers 111 to 115 on the surface of the transparent member 141. The first positioning light detection unit 126 detects a light spot 116 a formed by reflecting the laser light emitted from the first positioning surface emitting laser 116 on the surface of the transparent member 141 for alignment. It receives light. The second positioning light detector 127 detects a light spot 117a formed by reflecting the laser light emitted from the second positioning surface emitting laser 117 on the surface of the transparent member 141 for alignment. It receives light.

  The first positioning light detection unit 126 and the second positioning light detection unit 127 are the first positioning light detection units in a state where the light spots 111a to 115a are irradiated at desired positions in the light detection unit 121. The light amount of the light spot 116a detected at 126 is maximized, and the light spot 117a detected at the second positioning light detection unit 127 is formed at a position where the light amount is maximized.

  In the present embodiment, the positioning surface emitting laser and the positioning light detection unit can be positioned even if each has one, but in order to perform more accurate positioning. Preferably, two or more of each are provided, and it is preferable that the number of the surface emitting laser for positioning and the number of the light detecting portions for positioning are equal.

(Method for manufacturing surface emitting laser module)
Next, a method for manufacturing the surface emitting laser module according to the present embodiment will be described with reference to FIG.

  First, in step 102 (S102), the surface emitting laser element 110 and the light receiving element 120 are installed in the package unit 130. The package unit 130 is provided with wiring (not shown) corresponding to the surface emitting laser element 110 and the light receiving element 120, and the surface emitting laser element 110 and the light receiving element 120 are respectively provided to the package unit 130. Each wire is connected to each wire by a bonding wire or the like.

  Next, in step 104 (S104), an adhesive resin such as an ultraviolet curable resin (UV curable resin) is applied to the adhesive portion of the package portion 130 with the lid portion 140, and then the lid portion 140 is placed on the adhesive resin. .

  Next, in step 106 (S106), the first positioning surface emitting laser 116 and the second positioning surface emitting laser 117 in the surface emitting laser element 110 are caused to emit light. As a result, light spots 116 a and 117 a are formed on the surface of the light receiving element 120.

  Next, in step 108 (S108), a collet or the like is used so that the amounts of light detected by the first positioning light detection unit 126 and the second positioning light detection unit 127 in the light receiving element 120 are both maximized. The position of the lid part 140 is finely adjusted. Specifically, the laser light emitted from the first positioning surface emitting laser 116 is partially reflected by the transparent member 141 to form a light spot 116a on the surface of the light receiving element 120. The position is adjusted to a position where the output of the positioning light detection unit 126 becomes maximum. Similarly, the laser beam emitted from the second positioning surface emitting laser 117 is partially reflected by the transparent member 141 to form a light spot 117a on the surface of the light receiving element 120. The second positioning light beam is formed by the light spot 117a. The position of the output of the light detection unit 127 is adjusted to the maximum.

  Next, in step 110 (S110), the ultraviolet curable resin is cured by irradiating ultraviolet rays or the like, and the package part 130 and the lid part 140 are bonded and bonded.

  Thereby, the surface emitting laser module according to the present embodiment can be manufactured.

[Second Embodiment]
Next, a second embodiment will be described. The present embodiment is a method for manufacturing the surface emitting laser module according to the first embodiment, which is different from the first embodiment. A part of the laser light emitted from the surface emitting laser element 110 is reflected on the front surface and the back surface of the transparent member 141 in the lid portion 140, but this reflectance is as low as about 4 to 10%. Therefore, in order to allow a sufficient amount of reflected light to enter the light receiving element 120, it is necessary to increase the amount of laser light emitted from the surface emitting laser element 110. However, if the amount of emitted light is high, FFP (Far Field Pattern) spreads and accurate alignment becomes difficult. Further, when finely adjusting the lid portion 140, if the first positioning surface emitting laser 116 and the second positioning surface emitting laser 117 in the surface emitting laser element 110 emit light, the laser light is transmitted through the transparent member 141. Is dangerous because it is emitted outside.

  Therefore, in the present embodiment, as shown in FIG. 6, the protective sheet 160 having a high reflectance is attached to the transparent member 141, so that the laser beam can be obtained with a high reflectance when finely adjusting the position of the lid portion 140. Is reflected. Further, since the laser light emitted from the surface emitting laser element 110 hardly passes through the protective sheet 160, it is not emitted outside, and the fine adjustment of the position of the lid portion 140 can be performed safely. The protective sheet 160 is formed with an adhesive material or the like for adhering to a transparent member on the surface of a highly reflective metal film such as aluminum.

  Next, a method for manufacturing the surface emitting laser module in the present embodiment will be described with reference to FIG.

  First, in step 202 (S202), the surface emitting laser element 110 and the light receiving element 120 are installed in the package unit 130. The package unit 130 is provided with wiring (not shown) corresponding to the surface emitting laser element 110 and the light receiving element 120, and the surface emitting laser element 110 and the light receiving element 120 are respectively provided to the package unit 130. Each wire is connected to each wire by a bonding wire or the like.

  Next, in step 204 (S204), the protective sheet 160 is affixed to the outside of the transparent member 141. The protective sheet 160 has an adhesive material or the like formed on the surface, and is attached to the surface of the transparent member 141 as closely as possible.

  Next, in step 206 (S206), after applying an adhesive resin such as an ultraviolet curable resin (UV curable resin) to the adhesive portion of the package portion 130 with the lid portion 140, the lid portion 140 is placed on the adhesive resin. .

  Next, in step 208 (S208), the first positioning surface emitting laser 116 and the second positioning surface emitting laser 117 in the surface emitting laser element 110 are caused to emit light. As a result, light spots 116 a and 117 a are formed on the surface of the light receiving element 120.

  Next, in step 210 (S210), a collet or the like is used so that the amount of light detected by the first positioning light detection unit 126 and the second positioning light detection unit 127 in the light receiving element 120 is maximized. The position of the lid part 140 is finely adjusted. Specifically, the laser light emitted from the first positioning surface emitting laser 116 is partially reflected by the transparent member 141 to form a light spot 116a on the surface of the light receiving element 120. The position is adjusted to a position where the output of the positioning light detection unit 126 becomes maximum. Similarly, the laser beam emitted from the second positioning surface emitting laser 117 is partially reflected by the transparent member 141 to form a light spot 117a on the surface of the light receiving element 120. The second positioning light beam is formed by the light spot 117a. The position of the output of the light detection unit 127 is adjusted to the maximum.

  Next, in step 212 (S212), the ultraviolet curable resin is cured by irradiating ultraviolet rays or the like, and the package part 130 and the lid part 140 are bonded and bonded.

  Next, in step 214 (S214), the protective sheet 160 is removed from the transparent member 141.

  Thereby, the surface emitting laser module according to the present embodiment can be manufactured. The contents other than the above are the same as in the first embodiment.

[Third Embodiment]
Next, a third embodiment will be described. The surface emitting laser module in the present embodiment has a structure in which a light receiving element is installed in a lid portion. Specifically, as shown in FIG. 8, in the surface emitting laser module according to the present embodiment, the light receiving element 120 is installed in the light receiving element installation unit 242 provided in the lid unit 240. For this reason, the light receiving element 120 is not installed in the package unit 230. The package unit 230 is the same as that of the first embodiment except that a wiring connected to the light receiving element 120 is not provided. Further, the lid portion 240 is provided with a light receiving element installation portion 242 where the light receiving element 120 is installed, and as shown in FIG. 9, the lid portion main body portions 243 and 2 provided with a transparent member 141. The lid portion 140 is the same as the lid portion 140 in the first embodiment except that the lid portion is formed by the side surface portions 244a and 244b. In the lid portion 240 in the present embodiment, the light receiving element installation portion 242 is provided in the lid portion main body portion 243. The light receiving element 120 is connected to a wiring formed by a flexible substrate or the like for connection to the outside.

(Method for manufacturing surface emitting laser module)
Next, a method for manufacturing the surface emitting laser module according to the present embodiment will be described with reference to FIG.

  First, in step 302 (S302), the surface emitting laser element 110 is installed in the package unit 230. The package unit 230 is provided with a wiring (not shown) corresponding to the surface emitting laser element 110, and the surface emitting laser element 110 is connected to a corresponding wiring provided in the package unit 230 by a bonding wire or the like. .

  Next, in step 304 (S304), an adhesive resin such as an ultraviolet curable resin is applied to the adhesive portion of the lid portion 240 with the lid portion main body portion 243 in the package portion 230, and then the lid portion main body portion 243 is formed on the adhesive resin. After that, the package part 230 and the lid part main body part 243 are bonded to each other by irradiating ultraviolet rays or the like.

  Next, in step 306 (S306), an adhesive resin such as an ultraviolet curable resin is applied to the surface of the light receiving element installation portion 242 in the lid main body 243, and then the light receiving element 120 is placed on the adhesive resin.

  Next, in Step 308 (S308), the first positioning surface emitting laser 116 and the second positioning surface emitting laser 117 in the surface emitting laser element 110 are caused to emit light. As a result, light spots 116 a and 117 a are formed on the surface of the light receiving element 120.

  Next, in step 310 (S310), a collet or the like is used so that the amount of light detected by the first positioning light detection unit 126 and the second positioning light detection unit 127 in the light receiving element 120 is maximized. The position of the light receiving element 120 is finely adjusted. Specifically, the laser light emitted from the first positioning surface emitting laser 116 is partially reflected by the transparent member 141 to form a light spot 116a on the surface of the light receiving element 120. The position is adjusted to a position where the output of the positioning light detection unit 126 becomes maximum. Similarly, the laser beam emitted from the second positioning surface emitting laser 117 is partially reflected by the transparent member 141 to form a light spot 117a on the surface of the light receiving element 120. The second positioning light beam is formed by the light spot 117a. The position of the output of the light detection unit 127 is adjusted to the maximum.

  Next, in step 312 (S312), the ultraviolet curable resin is cured by irradiating ultraviolet rays or the like, and the light receiving element 120 is bonded and bonded to the light receiving element installation portion 242 in the lid main body 243.

  Next, in step 314 (S314), the lid portion side surface portions 244a and 244b are bonded to both side surfaces of the lid portion main body portion 243, and the package portion 230 and the lid portion 240 are sealed.

  Thereby, the surface emitting laser module according to the present embodiment can be manufactured. The contents other than the above are the same as in the first embodiment.

  Further, as shown in FIG. 11, the present embodiment has a structure in which a light receiving element installation portion 242a in which the light receiving element 120 is installed is formed by the lid portion 240a bending the side surface of the lid portion 240a. It may be a surface emitting laser module. Further, as shown in FIG. 12, a surface emitting laser module having a structure in which the light receiving element 120 is installed inside the side surface 245b of the lid main body 243b may be used. These surface emitting laser modules can be similarly manufactured by the method in the present embodiment. The contents other than the above are the same as in the first embodiment. Moreover, the method of affixing the protective sheet 160 with a high reflectance on the transparent member 141 similarly to 2nd Embodiment may be sufficient.

[Fourth Embodiment]
Next, a fourth embodiment will be described. This embodiment is a surface emitting laser having a structure using the light receiving element 320 in which the first positioning light detection unit 126 and the second positioning light detection unit 127 are not provided in the third embodiment or the like. It is a manufacturing method of a module. The position where the light receiving element 320 is installed is the same as the position where the light receiving element 120 in the third embodiment shown in FIG. 8 is installed. That is, in this embodiment, a light receiving element 320 is installed instead of the light receiving element 120 shown in FIG. In this embodiment, as shown in FIG. 13, a light shielding sheet 370 attached to the light receiving element 320 is used. The light shielding sheet 370 includes the first positioning light detection unit 126, the second light detection unit 126, and the second light detection unit 126. Openings 371 and 372 are provided at positions corresponding to regions where the positioning light detection unit 127 is formed. 13A shows a state before the light shielding sheet 370 is attached to the light receiving element 320, and FIG. 13B shows a state where the light shielding sheet 370 is attached to the light receiving element 320. Is shown.

  Next, a method for manufacturing the surface emitting laser module in the present embodiment will be described with reference to FIG.

  First, in step 402 (S402), a light shielding sheet 370 is attached to the surface of the light receiving element 320. Specifically, as illustrated in FIG. 13B, the light shielding sheet 370 is attached to the light receiving element 320 such that the openings 371 and 372 provided in the light shielding sheet 370 are at predetermined positions.

  Next, in step 404 (S404), the surface emitting laser element 110 is installed in the package unit 230. The package unit 230 is provided with a wiring (not shown) corresponding to the surface emitting laser element 110, and the surface emitting laser element 110 is connected to a corresponding wiring provided in the package unit 230 by a bonding wire or the like. .

  Next, in step 406 (S406), an adhesive resin such as an ultraviolet curable resin is applied to the adhesive portion of the lid portion 240 with the lid portion main body portion 243 in the package portion 230, and then the lid portion main body portion 243 is formed on the adhesive resin. After that, the package part 230 and the lid part main body part 243 are bonded to each other by irradiating ultraviolet rays or the like.

  Next, in step 408 (S408), an adhesive resin such as an ultraviolet curable resin is applied to the surface of the light receiving element installation portion 242 in the lid main body 243, and then the light receiving sheet 370 is pasted on the adhesive resin. The element 320 is mounted.

  Next, in step 410 (S410), the first positioning surface emitting laser 116 and the second positioning surface emitting laser 117 in the surface emitting laser element 110 are caused to emit light. As a result, light spots 116 b and 117 b are formed on the surface of the light receiving element 320.

  Next, in step 412 (S412), the position of the light receiving element 320 is finely adjusted by a collet or the like so that the amount of light detected by the light receiving element 320 becomes maximum. Specifically, in the openings 371 and 372 provided in the light shielding sheet 370, the position where the light amount by the light spots 116b and 117b received in the openings 371 and 372 is the maximum is the optimum position of the light receiving element 320. It is formed to become. Therefore, by finely adjusting the position of the light receiving element 320 with a collet or the like so that the amount of light detected by the light receiving element 320 is maximized, the light receiving element 320 can be aligned at an optimum position.

  Next, in step 414 (S414), the ultraviolet curable resin is cured by irradiating ultraviolet rays or the like, and the light receiving element 320 is bonded and bonded to the light receiving element installation portion 242 in the lid portion main body portion 243.

  Next, in step 416 (S 416), the light shielding sheet 370 is removed from the surface of the light receiving element 320.

  Next, in step 418 (S418), the lid portion side surface portions 244a and 244b are bonded to both side surfaces of the lid portion main body portion 243, and the package portion 230 and the lid portion 240 are sealed.

  Thereby, the surface emitting laser module according to the present embodiment can be manufactured. In the present embodiment, since it is not necessary to separately provide the first positioning light detection unit and the second positioning light detection unit in the light receiving element, a general light receiving element can be used at low cost. A surface emitting laser module can be manufactured.

  The contents other than those described above are the same as in the third embodiment. Moreover, the method of affixing the protective sheet 160 with a high reflectance on the transparent member 141 similarly to 2nd Embodiment may be sufficient.

[Fifth Embodiment]
Next, a fifth embodiment will be described. The present embodiment is a laser printer 1000 as an image forming apparatus using the surface emitting laser module in the first to fourth embodiments.

  Based on FIG. 15, the laser printer 1000 in the present embodiment will be described. The laser printer 1000 according to this embodiment includes an optical scanning device 1010, a photosensitive drum 1030, a charging charger 1031, a developing roller 1032, a transfer charger 1033, a charge eliminating unit 1034, a cleaning unit 1035, a toner cartridge 1036, a paper feeding roller 1037, a feeding roller. A paper tray 1038, a registration roller pair 1039, a fixing roller 1041, a paper discharge roller 1042, a paper discharge tray 1043, a communication control device 1050, and a printer control device 1060 that comprehensively controls each of the above parts are provided. These are housed in predetermined positions in the printer housing 1044.

  The communication control device 1050 controls bidirectional communication with a host device (for example, a personal computer) via a network or the like.

  The photosensitive drum 1030 is a cylindrical member, and a photosensitive layer is formed on the surface thereof. That is, the surface of the photoconductor drum 1030 is a scanned surface. The photosensitive drum 1030 rotates in the direction indicated by the arrow X.

  The charging charger 1031, the developing roller 1032, the transfer charger 1033, the charge removal unit 1034, and the cleaning unit 1035 are each disposed in the vicinity of the surface of the photosensitive drum 1030. Then, along the rotation direction of the photosensitive drum 1030, the charging charger 1031 → the developing roller 1032 → the transfer charger 1033 → the discharging unit 1034 → the cleaning unit 1035 are arranged in this order.

  The charging charger 1031 uniformly charges the surface of the photosensitive drum 1030.

  The optical scanning device 1010 scans the surface of the photosensitive drum 1030 charged by the charging charger 1031 with a light beam modulated based on image information from the host device, and corresponds to the image information on the surface of the photosensitive drum 1030. A latent image is formed. The latent image formed here moves in the direction of the developing roller 1032 as the photosensitive drum 1030 rotates. The configuration of the optical scanning device 1010 will be described later.

  Toner cartridge 1036 stores toner, and this toner is supplied to developing roller 1032.

  The developing roller 1032 causes the toner supplied from the toner cartridge 1036 to adhere to the latent image formed on the surface of the photosensitive drum 1030 to visualize the image information. Here, the latent image to which the toner is attached (hereinafter also referred to as “toner image” for the sake of convenience) moves in the direction of the transfer charger 1033 as the photosensitive drum 1030 rotates.

  Recording paper 1040 is stored in the paper feed tray 1038. A paper feed roller 1037 is disposed in the vicinity of the paper feed tray 1038. The paper feed roller 1037 takes out the recording paper 1040 one by one from the paper feed tray 1038 and conveys it to the registration roller pair 1039. The registration roller pair 1039 temporarily holds the recording paper 1040 taken out by the paper supply roller 1037, and in the gap between the photosensitive drum 1030 and the transfer charger 1033 according to the rotation of the photosensitive drum 1030. Send it out.

  A voltage having a polarity opposite to that of the toner is applied to the transfer charger 1033 in order to electrically attract the toner on the surface of the photosensitive drum 1030 to the recording paper 1040. With this voltage, the toner image on the surface of the photosensitive drum 1030 is transferred to the recording paper 1040. The recording sheet 1040 transferred here is sent to the fixing roller 1041.

  In the fixing roller 1041, heat and pressure are applied to the recording paper 1040, whereby the toner is fixed on the recording paper 1040. The recording paper 1040 fixed here is sent to the paper discharge tray 1043 via the paper discharge roller 1042 and is sequentially stacked on the paper discharge tray 1043.

  The neutralization unit 1034 neutralizes the surface of the photosensitive drum 1030.

  The cleaning unit 1035 removes the toner remaining on the surface of the photosensitive drum 1030 (residual toner). The surface of the photosensitive drum 1030 from which the residual toner has been removed returns to the position facing the charging charger 1031 again.

  Next, the optical scanning device 1010 will be described with reference to FIG. The optical scanning device 1010 collectively includes a light source unit 1100, a coupling lens 1111, an aperture 1112, a cylindrical lens 1113, a polygon mirror 1114, an fθ lens 1115, a toroidal lens 1116, two mirrors (1117, 1118), and the above parts. A control device (not shown) for controlling is provided. The light source unit 1100 includes the surface emitting laser modules in the first to fourth embodiments.

  The coupling 1111 shapes the laser light emitted from the surface emitting laser in the light source unit 1100 into substantially parallel light.

  The aperture 1112 defines the laser light from the coupling lens 1111 so as to have a predetermined beam shape.

  The cylindrical lens 1113 condenses the light output from the light source unit 1100 in the vicinity of the deflection reflection surface of the polygon mirror 1114 via the mirror 1117.

  The polygon mirror 1114 is made of a regular hexagonal columnar member having a low height, and six deflection reflection surfaces are formed on the side surface. Then, it is rotated at a constant angular velocity in the direction indicated by the arrow Y by a rotation mechanism (not shown).

  Accordingly, the light emitted from the light source unit 1100 and condensed near the deflection reflection surface of the polygon mirror 1114 by the cylindrical lens 1113 is deflected at a constant angular velocity by the rotation of the polygon mirror 1114.

  The fθ lens 1115 has an image height proportional to the incident angle of light from the polygon mirror 1114, and moves the image surface of light deflected by the polygon mirror 1114 at a constant angular velocity with constant speed in the main scanning direction. The toroidal lens 1116 forms an image of the light from the fθ lens 1115 on the surface of the photosensitive drum 1030 via the mirror 1118.

  The toroidal lens 1116 is disposed on the optical path of the light beam through the fθ lens 1115. Then, the light beam that has passed through the toroidal lens 1116 is irradiated onto the surface of the photosensitive drum 1030 to form a light spot. This light spot moves in the longitudinal direction of the photosensitive drum 1030 as the polygon mirror 1114 rotates. That is, the photoconductor drum 1030 is scanned. The moving direction of the light spot at this time is the “main scanning direction”. The rotation direction of the photosensitive drum 1030 is the “sub-scanning direction”.

  The optical system arranged on the optical path between the polygon mirror 1114 and the photosensitive drum 1030 is also called a scanning optical system. In this embodiment, the scanning optical system includes an fθ lens 1115 and a toroidal lens 1116. Note that at least one folding mirror may be disposed on at least one of the optical path between the fθ lens 1115 and the toroidal lens 1116 and on the optical path between the toroidal lens 1116 and the photosensitive drum 1030.

  Since the laser printer 1000 according to the present embodiment uses the surface emitting laser modules according to the first to fourth embodiments, the laser printer 1000 can perform stable writing with light, and has high definition. High-quality image formation can be performed.

  In the description of the present embodiment, the case of the laser printer 1000 as the image forming apparatus has been described. However, the present invention is not limited to this.

  For example, an image forming apparatus that directly irradiates laser light onto a medium (for example, paper) that develops color with laser light may be used.

  Further, an image forming apparatus using a silver salt film as the image carrier may be used. In this case, a latent image is formed on the silver salt film by optical scanning, and this latent image can be visualized by a process equivalent to a developing process in a normal silver salt photographic process. Then, it can be transferred to photographic paper by a process equivalent to a printing process in a normal silver salt photographic process. Such an image forming apparatus can be implemented as an optical plate making apparatus or an optical drawing apparatus that draws a CT scan image or the like.

[Sixth Embodiment]
Next, a sixth embodiment will be described. The sixth embodiment is a color printer 2000 including a plurality of photosensitive drums.

  A color printer 2000 according to the present embodiment will be described with reference to FIG. The color printer 2000 in the present embodiment is a tandem multicolor printer that forms a full-color image by superimposing four colors (black, cyan, magenta, and yellow). “Charging device K2, developing device K4, cleaning unit K5, and transfer device K6”, “photosensitive drum C1, charging device C2, developing device C4, cleaning unit C5, and transfer device C6” for cyan, and magenta “Photosensitive drum M1, charging device M2, developing device M4, cleaning unit M5, and transfer device M6” and yellow “photosensitive drum Y1, charging device Y2, developing device Y4, cleaning unit Y5, and transfer device Y6” ”, Optical scanning device 2010, transfer belt 2080, fixing unit 2030, and the like. It is equipped with a.

  Each photosensitive drum rotates in the direction of the arrow shown in FIG. 17, and a charging device, a developing device, a transfer device, and a cleaning unit are arranged around each photosensitive drum in the order of rotation. Each charging device uniformly charges the surface of the corresponding photosensitive drum. The surface of each photoconductive drum charged by the charging device is irradiated with light by the optical scanning device 2010, and a latent image is formed on each photoconductive drum. Then, a toner image is formed on the surface of each photosensitive drum by a corresponding developing device. Further, the toner image of each color is transferred onto the recording paper on the transfer belt 2080 by the corresponding transfer device, and finally the image is fixed on the recording paper by the fixing unit 2030.

  The optical scanning device 2010 includes a light source unit including the surface emitting laser modules in the first to fourth embodiments for each color, and the optical scanning device 1010 described in the fifth embodiment. Similar effects can be obtained. In addition, since the color printer 2000 includes the optical scanning device 2010, it is possible to obtain the same effect as the laser printer 1000 in the fifth embodiment.

  By the way, in the color printer 2000, color misregistration may occur due to manufacturing error or position error of each component. Even in such a case, each light source of the optical scanning device 2010 is formed by the light source unit including the surface emitting laser module according to any one of the first to fourth embodiments. By selecting, color misregistration can be reduced.

  Therefore, since the color printer 2000 according to the present embodiment uses the surface emitting laser modules according to the first to fourth embodiments, a high-definition and high-quality image can be formed.

  As mentioned above, although the form which concerns on implementation of this invention was demonstrated, the said content does not limit the content of invention.

110 surface emitting laser elements 111, 112, 113, 114, 115 surface emitting lasers 111a, 112a, 113a, 114a, 115a light spot 116 first positioning surface emitting laser 116a light spot 117 second positioning surface emitting laser 117a Light spot 120 Light receiving element 121 Light detection unit 126 First positioning light detection unit 127 Second positioning light detection unit 130 Package portion 131 Bottom surface 132 Step portion 140 Lid portion 141 Transparent member 1000 Laser printer (image forming apparatus)
1010 Optical scanning device 2000 Color printer (image forming apparatus)

JP-A-6-97597 JP-A-6-164056

Claims (10)

The surface emitting laser element and the light receiving element are covered by joining the package part and the lid part, and the lid part is provided with a transparent member that transmits laser light emitted from the surface emitting laser in the surface emitting laser element. In the manufacturing method of the surface emitting laser module, the surface emitting laser element is provided with a positioning surface emitting laser, and the light receiving element is provided with a positioning light receiving unit.
Installing the surface emitting laser element and the light receiving element in the package portion;
In the package portion, a step of applying an adhesive resin to a joint portion between the package portion and the lid portion, and placing the lid portion on the adhesive resin;
Emitting the positioning surface emitting laser; and
The lid portion receives the laser light emitted from the positioning surface emitting laser and partially reflected by the transparent member, and the output from the positioning light receiving portion by the received laser light is maximized. Adjusting the position of
Bonding the package part and the lid part with the adhesive resin;
A method for manufacturing a surface emitting laser module, comprising: The surface emitting laser element and the light receiving element are covered by joining the package part and the lid part, and the lid part is provided with a transparent member that transmits laser light emitted from the surface emitting laser in the surface emitting laser element. The surface emitting laser element is provided with a positioning surface emitting laser, the light receiving element is provided with a positioning light receiving part, and the lid part includes a lid part main body part and a lid part side part. In the manufacturing method of the surface emitting laser module having
Installing the surface-emitting laser element in the package part;
Bonding the package part and the lid part main body part;
Applying an adhesive resin to a region where the light receiving element is installed in the lid body part, and placing the light receiving element on the adhesive resin;
Emitting the positioning surface emitting laser; and
The laser beam emitted from the positioning surface emitting laser and partially reflected by the transparent member is received, and the output from the positioning light receiving unit by the received laser beam is substantially maximized. Adjusting the position of the light receiving element;
Bonding the light receiving element to the lid main body with the adhesive resin;
Bonding the lid portion side surface to both side surfaces of the lid portion main body portion;
A method for manufacturing a surface emitting laser module, comprising: The positioning surface emitting laser and the positioning light receiving part are each provided in two or more,
3. The method of manufacturing a surface emitting laser according to claim 1, wherein the number of the positioning surface emitting lasers is equal to the number of the positioning light receiving portions. In the light receiving element, instead of the positioning light receiving part, a light shielding sheet having an opening in a region corresponding to the positioning light receiving part is pasted on the surface of the light receiving element.
The step of adjusting the position of the light receiving element is to adjust the position of the light receiving element so that the output by the laser beam received at the opening of the light shielding sheet attached to the light receiving element is substantially maximized. ,
A step of attaching the light shielding sheet to the light receiving element before placing the light receiving element on an adhesive resin;
Removing the light shielding sheet from the light receiving element after bonding the light receiving element to the lid body part;
The method of manufacturing a surface emitting laser module according to claim 2, wherein: Two or more of the openings in the surface emitting laser for positioning and the light shielding sheet are provided, respectively.
5. The method of manufacturing a surface emitting laser according to claim 4, wherein the number of the surface emitting lasers for positioning is equal to the number of the openings in the light shielding sheet. Before the step of emitting the positioning surface emitting laser, a step of attaching a protective sheet formed of a metal or a metal-containing material to the transparent member;
After the step of adhering the lid or the step of adhering the light receiving element, the step of removing the protective sheet from the transparent member;
The method of manufacturing a surface emitting laser according to claim 1, wherein:   The method for manufacturing a surface emitting laser according to claim 1, wherein the adhesive resin is an ultraviolet curable resin. A surface emitting laser element;
A light receiving element;
A package part and a lid part covering the surface-emitting laser element and the light-receiving element;
The package part and the lid part are joined, and the lid part is provided with a transparent member that transmits laser light emitted from the surface emitting laser in the surface emitting laser element,
A part of the laser light emitted from the surface emitting laser is reflected by the transparent member and enters the light receiving element,
The surface emitting laser element is provided with a positioning surface emitting laser,
A surface-emitting laser module, wherein the light-receiving element is provided with a positioning light-receiving portion that receives light emitted from the positioning surface-emitting laser and partially reflected by the transparent member. An optical scanning device that scans a surface to be scanned with light,
A light source comprising the surface emitting laser module according to claim 8;
A light deflector for deflecting light from the light source;
A scanning optical system for condensing the light deflected by the light deflection unit on the surface to be scanned;
An optical scanning device comprising: An image carrier;
The optical scanning device according to claim 9, which scans the image carrier with light modulated according to image information;
An image forming apparatus comprising:

Images