JP2013045893A5 - - Google Patents
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- Publication number
- JP2013045893A5 JP2013045893A5 JP2011182711A JP2011182711A JP2013045893A5 JP 2013045893 A5 JP2013045893 A5 JP 2013045893A5 JP 2011182711 A JP2011182711 A JP 2011182711A JP 2011182711 A JP2011182711 A JP 2011182711A JP 2013045893 A5 JP2013045893 A5 JP 2013045893A5
- Authority
- JP
- Japan
- Prior art keywords
- hole
- electronic device
- coating layer
- cavity
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011182711A JP5773153B2 (ja) | 2011-08-24 | 2011-08-24 | 電子装置およびその製造方法、並びに発振器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011182711A JP5773153B2 (ja) | 2011-08-24 | 2011-08-24 | 電子装置およびその製造方法、並びに発振器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013045893A JP2013045893A (ja) | 2013-03-04 |
| JP2013045893A5 true JP2013045893A5 (zh) | 2014-08-21 |
| JP5773153B2 JP5773153B2 (ja) | 2015-09-02 |
Family
ID=48009565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011182711A Expired - Fee Related JP5773153B2 (ja) | 2011-08-24 | 2011-08-24 | 電子装置およびその製造方法、並びに発振器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5773153B2 (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015192871A1 (en) * | 2014-06-16 | 2015-12-23 | Epcos Ag | Microelectronic package and method of manufacturing a microelectronic package |
| JP2016138778A (ja) | 2015-01-27 | 2016-08-04 | セイコーエプソン株式会社 | 電子デバイス、圧力センサー、高度計、電子機器および移動体 |
| US10662055B2 (en) | 2017-04-27 | 2020-05-26 | Seiko Epson Corporation | MEMS element, sealing structure, electronic device, electronic apparatus, and vehicle |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4808971B2 (ja) * | 2005-01-13 | 2011-11-02 | 日本電信電話株式会社 | 微細構造体の製造方法 |
| JP5207547B2 (ja) * | 2009-04-06 | 2013-06-12 | 太陽誘電株式会社 | 電子デバイスおよびその製造方法 |
-
2011
- 2011-08-24 JP JP2011182711A patent/JP5773153B2/ja not_active Expired - Fee Related
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