JP2013044645A - Submount mid package of physical quantity sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a submount MID package of physical quantity sensors, by which a triaxial physical quantity sensor module can be inexpensively and highly accurately obtained.SOLUTION: A submount MID package 10 of physical quantity sensors includes: a tapered approximately triangular prism-shaped body 11, a first physical quantity sensor 13 formed on a first conical surface of the body 11; a second physical quantity sensor 15 formed on a second conical surface 14 of the body 11 orthogonally to the first conical surface 12; and a third physical quantity sensor 17 formed on a third conical surface 16 of the body 11 orthogonally to the first conical surface 12 and the second conical surface 14. The submount MID package of the physical quantity sensor may be configured to include a right triangular prism-shaped body and a physical quantity sensor formed on a square side face held between acute angle ridge lines.

Description

  The present invention relates to a submount MID package of a physical quantity sensor.

  2. Description of the Related Art There is known a physical quantity sensor module that is mounted on a moving body such as a ship or an automobile and used for device attitude control, an automobile navigation system, or the like. The physical quantity sensor module is configured as a whole by housing the physical quantity sensor in a case. For example, Patent Document 1 discloses an automobile angle sensor as a physical quantity sensor that can detect angular velocities and angles of three axes of an XYZ orthogonal triaxial coordinate system and can also detect a failure thereof. This automobile angle sensor has four physical quantity sensors (referred to as “gyro” in the same document) in an orthogonal triaxial coordinate system consisting of a horizontal plane including orthogonal X and Y axes and a Z axis perpendicular to this plane. Consists of That is, a total of four gyros are provided, one on each of the four slopes of the quadrangular pyramid body.

  The four gyros have the angles θ1, θ2, θ3, and θ4 when the angles formed by the measurement axis and the horizontal plane are θ1, θ2, θ3, and θ4 (however, all of θ1, θ2, θ3, and θ4 are 90). Less than degrees) are equal to each other. Also, let α be the angle formed by the projected image obtained by projecting the measurement axis of one of the four gyros onto the horizontal plane and the X axis. At this time, the angles formed by the projection image obtained by projecting the measurement axes of the other three gyros on the horizontal plane and the X axis are 180 degrees −α, 180 degrees + α, and 360 degrees −α, respectively.

  Since the above-mentioned angle sensor for automobiles has such a configuration, the physical quantity (rotation) in the three directions of the X-axis direction, the Y-axis direction, and the Z-axis direction orthogonal to each other by calculating the values detected from the four gyros. Can be detected. Further, in this automotive angular velocity sensor, two solutions of the detected X-axis component, Y-axis component, and Z-axis component of the angular velocity are obtained. The two solutions for each component have substantially the same value when there is no failure. From this, the angular velocity sensor for automobiles can determine the presence or absence of a failure by measuring the angular velocity with four gyros and obtaining the error of the two solutions.

Japanese Patent Laying-Open No. 2005-189083 (Claim 1, FIG. 2, paragraph 0012)

  However, since the above-described conventional angle sensor for automobiles requires four physical quantity sensors, the process of forming the main body so that the crossing angle of each inclined surface on which each physical quantity sensor is provided becomes a desired value, which is difficult to produce. Low and expensive. In addition, as shown in FIG. 11, there is a physical quantity sensor in which a main body 100 composed of three cubes is formed, and a first physical quantity sensor 102, a second physical quantity sensor 103, and a third physical quantity sensor 104 are provided on one surface 101 of each main body 100. Conceivable. This physical quantity sensor was mounted by rotating the directions of the first physical quantity sensor 102, the second physical quantity sensor 103, and the third physical quantity sensor 104 in the X-axis direction, the Y-axis direction, and the Z-axis direction when mounted on the board. . However, when the main bodies 100 have directivity, the positions of the center of gravity are different and the resonance points are different. Therefore, when the physical quantity sensor using the main body 100 having different resonance points is used in a vibration environment, the uniformity of the sensor characteristics of each of the three axes is impaired, and the detection accuracy is lowered.

  The present invention has been made in view of the above situation, and an object thereof is to provide a submount MID package of a physical quantity sensor in which a triaxial physical quantity sensor module can be obtained at low cost and with high accuracy.

  The physical quantity sensor submount MID package of the present invention includes a substantially triangular pyramid-shaped main body in which the first conical surface, the second conical surface, and the third conical surface that are adjacent to each other are orthogonal to each other, and a first conical surface provided on the first conical surface. A physical quantity sensor, a second physical quantity sensor provided on the second conical surface, and a third physical quantity sensor provided on the third conical surface.

  In the physical quantity sensor submount MID package of the present invention, the main body has a triangular pyramid shape.

  In addition, the submount MID package of the physical quantity sensor of the present invention includes a right triangular prism-shaped main body and a physical quantity sensor provided on a square side surface sandwiched between acute ridge lines in the main body.

  According to the submount MID package of the physical quantity sensor according to the present invention, the triaxial physical quantity sensor module can be obtained at low cost and with high accuracy.

(A) is a plan view of a submount MID package according to the present invention, (B) is a perspective view of (A). The perspective view which represented the main body of the submount MID package shown in FIG. 1 with the base material (A) is a plan view of the base material shown in FIG. 2, and (B) is a plan view of the base material including a cutting allowance. The perspective view of the physical quantity sensor module which accommodated the submount MID package shown in FIG. The perspective view of the submount MID package of 2nd Embodiment which concerns on this invention. Side view of the submount MID package shown in FIG. The perspective view of the physical quantity sensor module which accommodated the submount MID package shown in FIG. The perspective view of the submount MID package which concerns on the modification obtained by cut | disconnecting the submount MID package shown in FIG. 2 by the plane cross section parallel to a bottom face (A) is a perspective view of a submount MID package according to a modified example shown together with a rectangular parallelepiped, and (B) is a perspective view after cutting out the submount MID package shown in (A). (A) is a perspective view of a submount MID package according to a modification in which a chip mounting reference surface is provided, and (B) is a side view of (A). A perspective view of a conventional physical quantity sensor composed of a plurality of cubes in which three surfaces are orthogonal to each other

Hereinafter, embodiments according to the present invention will be described with reference to the drawings.
1A is a plan view of a submount MID package according to the present invention, and FIG. 1B is a perspective view of FIG.
As shown in FIGS. 1A and 1B, a submount MID package 10 according to this embodiment is provided on a main body 11 having a substantially triangular prism shape and a first conical surface 12 of the main body 11. The first physical quantity sensor 13, the second physical quantity sensor 15 orthogonal to the first conical surface 12 and provided on the second conical surface 14 of the main body 11, and the first conical surface 12 and the second conical surface 14 And a third physical quantity sensor 17 provided on the third conical surface 16 of the main body 11 which is orthogonal to each other.

FIG. 2 is a perspective view showing the main body 11 of the submount MID package 10 shown in FIGS. 1A and 1B together with the base material 18.
The main body 11 is cut out from a cubic base material 18. Therefore, each surface of the cube that is the base material 18 is accurately formed in a mutually orthogonal plane. Also, in terms of material, each surface is uniformly formed so as to be equidistant from the center of gravity. The base material 18 is made of a plastic material or a ceramic material. As the plastic material, LCP, PPA, PPS, PEEK or the like can be used, and as the ceramic material, for example, aluminum nitride (AlN) or aluminum oxide (alumina) can be used.

  The main body 11 is formed of a triangular pyramid 20 having one corner 19 of the base material 18 as a vertex. That is, the main body 11 is cut by the diagonal line 21 between the first conical surface 12, the second conical surface 14, and the third conical surface 16 that are adjacent to each other with the vertex of the base material 18 as the center and does not include the vertex. The cut out triangular pyramid 20 is obtained. Therefore, the sensitivity directions of the first physical quantity sensor 13, the second physical quantity sensor 15, and the third physical quantity sensor 17 provided on the first conical surface 12, the second conical surface 14, and the third conical surface 16 of the triangular pyramid 20 are orthogonal. Will be placed.

3A is a plan view of the base material 18 shown in FIG. 2, and FIG. 3B is a plan view of the base material 18 including the cutting allowance 22.
The base material 18 is cut along the diagonal line 21 to cut out the main body 11. Therefore, in practice, it is preferable that the base material 18 has a cutting allowance 22 in which the thickness of the blade formed by translating the diagonal line 21 is added to the cut portion. Thereby, four main bodies 11 can be cut out from one base material 18, and the yield at the time of obtaining main bodies 11 can be raised.

  The submount MID package 10 whose main body 11 is a triangular pyramid 20 has a wiring pattern 23 shown in FIG. 1 directly on the first conical surface 12, the second conical surface 14, and the third conical surface 16 by MID (Molded Interconnect) technology. It is formed. MID is a three-dimensional molded circuit component in which an electric circuit is integrally formed on the surface of an injection-molded product. Unlike conventional two-dimensional circuits, MID is formed on an inclined surface, a vertical surface, a curved surface, a through-hole in a molded body, etc. Also add a circuit. In the submount MID package 10, a sensor chip 24 that is a piezoelectric element is mounted on each of the first conical surface 12, the second conical surface 14, and the third conical surface 16, and the wiring pattern 23 including a plurality of terminals 25 is MID. It is formed. A piezoelectric element is one in which electrodes are formed on both sides of a piezoelectric ceramic, for example. The sensor chip 24 and the terminal 25 are electrically connected by a wire 26.

  For this MID, MIPTEC (fine composite processing technology) proposed by Panasonic Electric Works Co., Ltd. can be used. According to MIPTEC, a 3D mounting device capable of fine patterning and bare chip mounting by using a molding surface activation processing technology and a laser patterning method for MID technology for forming an electric circuit on the surface of an injection molded product. realizable.

FIG. 4 is a perspective view of the physical quantity sensor module 27 that houses the submount MID package 10 shown in FIG.
The submount MID package 10 is accommodated in a case 28 made of a ceramic multilayer package and mounted on a substrate 29 to constitute a physical quantity sensor module 27. A signal processing device 30 is provided on the substrate 29 in the case, and the signal processing device 30 is electrically connected to the submount MID package 10 via the substrate wiring. When the vibration directions of the first physical quantity sensor 13, the second physical quantity sensor 15, and the third physical quantity sensor 17 change due to the Coriolis force, the physical quantity sensor module 27 responds accordingly, and the first physical quantity sensor 13, the second physical quantity sensor 15, and the third physical quantity sensor module 27. A difference occurs in the output voltage of the physical quantity sensor 17. The signal processing device 30 detects the rotational angular velocity applied to the physical quantity sensor module 27 by measuring the difference between the output voltages. The case 28 is sealed with an upper lid or a mold. The case 28 is provided with an external terminal connected to the signal processing device 30.

Next, the operation of the first embodiment will be described.
In the physical quantity sensor module 27 that accommodates the submount MID package 10, when a rotational angular velocity is applied to a vibrating object, a mechanical phenomenon is used in which a Coriolis force is generated in a direction perpendicular to the vibration direction. In a composite vibration system configured to excite vibrations in two different directions orthogonal to each other, if one of the vibrations is excited and the vibrator is rotated, force is applied in a direction perpendicular to this vibration due to the action of the Coriolis force. The other vibration is excited. Since the magnitude of this vibration is proportional to the magnitude of the vibration on the input side and the rotational angular velocity, with the input voltage kept constant, the magnitude of the rotational angular velocity is determined from the output voltage proportional to the magnitude of this vibration. Can be requested. In the physical quantity sensor module 27, the magnitude of the output voltage can be calculated by the signal processing device 30 to detect, for example, a rotational angular velocity that is a physical quantity.

  In the submount MID package 10, the first physical quantity sensor 13 is formed on the first conical surface 12 of the substantially triangular prism-shaped main body 11 and the second physical quantity sensor 15 and the third conical surface 16 are formed on the second conical surface 14. The third physical quantity sensor 17 is provided. For this reason, the center of gravity of the main body 11 is equidistant from the first physical quantity sensor 13, the second physical quantity sensor 15, and the third physical quantity sensor 17. Thereby, sensor characteristics are stabilized. Moreover, since the first physical quantity sensor 13, the second physical quantity sensor 15, and the third physical quantity sensor 17 are arranged on the three surfaces of the main body 11 cut out from the cube, different X-axis directions and Y-axis directions that intersect at 90 degrees. , And can be oriented with high accuracy in the three-axis direction in the Z-axis direction. Moreover, since the main body 11 can be formed from the base material 18 by a single cutting process, the productivity is high and the cost is low. Further, since four submount MID packages 10 can be manufactured from one cubic base material 18, the yield is good and the productivity can be increased.

Next, a second embodiment according to the present invention will be described.
FIG. 5 is a perspective view of the submount MID package 31 according to the second embodiment of the present invention, and FIG. 6 is a side view of the submount MID package 31 shown in FIG. In addition, the same code | symbol and the overlapping description are abbreviate | omitted to the member and site | part equivalent to the member and site | part shown in FIGS.
The submount MID package 31 according to this embodiment includes a main body 32 having a right triangular prism shape, and a physical quantity sensor (for example, the first physical quantity sensor 13) provided on a square side surface sandwiched between acute ridge lines 33 in the main body 32. .

  The main body 32 having a right triangular prism shape can be cut out from the triangular pyramid 20. As described above, the triangular pyramid 20 is cut out by cutting along the diagonal line 21 between the diagonals that do not include this vertex with one corner 19 of the base material 18 made of a cube as the vertex. The main body 32 is obtained by further cutting out from the triangular pyramid 20 thus formed. That is, the triangular pyramid 20 shown in FIG. 2 is cut by a flat section 34 (see FIG. 2) parallel to the bottom surface. A triangular prism approximate body having both ends tapered by cutting a triangular pyramid 20 from which a vertex has been removed in a plan view into a triangle and cutting along a vertical plane perpendicular to the bottom surface along each of the three sides. cut. Finally, both ends of the triangular prism approximate body are cut by a pair of parallel both end surfaces 35 orthogonal to the vertical plane, and three right triangular prism-shaped main bodies 32 are formed from one triangular pyramid 20.

  One of the three main bodies 32 in the shape of three right triangular prisms has the first conical surface 12 of the triangular pyramid 20, the other one has the second conical surface 14, and the remaining main body 32 has A third conical surface 16 is provided. The first physical quantity sensor 13 is provided in the main body 32 having the first conical surface 12, the second physical quantity sensor 15 is provided in the main body 32 having the second conical surface 14, and the third physical quantity sensor 17 is provided in the main body 32 having the third conical surface 16. Provided. Each submount MID package 31 is mounted on a substrate 29. Accordingly, the first cone 12, the second cone 14, and the third cone 16 provided with the first physical quantity sensor 13, the second physical quantity sensor 15, and the third physical quantity sensor 17 are angle θ formed with the board mounting surface 36. Is about 35.3 degrees.

FIG. 7 is a perspective view of the physical quantity sensor module 37 accommodating the submount MID package 31 shown in FIG.
Three submount MID packages 31 are accommodated in a case 28 made of a ceramic multilayer package and mounted on a substrate 29 to constitute a physical quantity sensor module 37. The three submount MID packages 31 are preferably arranged so as to be parallel to each side of the triangle so as not to be at least collinear or parallel on the substrate mounting surface. That is, they are arranged in different directions.

  A signal processing device 30 is provided on the substrate 29 in the case, and the signal processing device 30 is electrically connected to the submount MID package 31 via the substrate wiring. When the vibration direction of the first physical quantity sensor 13, the second physical quantity sensor 15, and the third physical quantity sensor 17 changes due to the Coriolis force, the physical quantity sensor module 37 changes the first physical quantity sensor 13, the second physical quantity sensor 15, and the third physical quantity sensor accordingly. A difference occurs in the output voltage of the physical quantity sensor 17. The signal processing device 30 detects the rotational angular velocity applied to the physical quantity sensor module 27 by measuring the difference between the output voltages. The case 28 is sealed with an upper lid or a mold. The case 28 is provided with an external terminal connected to the signal processing device 30.

  According to the submount MID package 31 according to this embodiment, the center of gravity of the main body 32 is equidistant from the first physical quantity sensor 13, the second physical quantity sensor 15, and the third physical quantity sensor 17, so that the sensor characteristics are stabilized. . Thereby, the 1st physical quantity sensor 13, the 2nd physical quantity sensor 15, and the 3rd physical quantity sensor 17 are orientated with high precision toward three different axis directions which intersect at 90 degrees.

Next, a modification of the above embodiment will be described.
FIG. 8 is a perspective view of a submount MID package 38 according to a modification obtained by cutting the submount MID package 10 shown in FIG. 2 along a plane section 34 parallel to the bottom surface.
The submount MID package 38 according to this modification is formed by cutting the top portion 39 of the submount MID package 10 shown in FIG. 1 with a flat cross section 34 parallel to the bottom surface. The total height of the submount MID package 38 is lower than that of the submount MID package 10 because the top 39 is cut off. Thereby, the height required for housing in the case 28 is reduced, and the physical quantity sensor module 27 can be downsized.

FIG. 9A is a perspective view of a submount MID package 40 according to a modified example shown together with a rectangular parallelepiped, and FIG. 9B is a perspective view after the submount MID package 40 shown in FIG. 9A is cut out. .
In the above embodiment, the case where the base material 18 is made of a cube has been described as an example, but the base material 41 may be a rectangular parallelepiped. Also in the base material 41 made of a rectangular parallelepiped, the main body 42 has one corner portion 19 of the base material 41 as a vertex, and the first cone surface 12, the second cone surface 14 and the third cone surface 16 which are adjacent to each other with the vertex as a center. The triangular pyramid 43 is cut out by the diagonal line 21 between the diagonals not including the vertex. Therefore, the sensitivity directions of the first physical quantity sensor 13, the second physical quantity sensor 15, and the third physical quantity sensor 17 provided on the first conical surface 12, the second conical surface 14, and the third conical surface 16 of the triangular pyramid 43 are orthogonal. Will be placed.

FIG. 10A is a perspective view of a submount MID package 45 according to a modification in which a chip mounting reference surface 44 is provided, and FIG. 10B is a side view of FIG.
In the submount MID package 45 according to this modification, a chip mounting reference surface 44 parallel to the substrate mounting surface 36 is formed on the triangular prism side surface 46. In the submount MID package 45 having the chip mounting reference surface 44, for example, a triangular prism-shaped top 48 shown in FIG. 6 is cut off by a plane section 49 parallel to the substrate mounting surface 36, and the vertical side 50 is formed as a first conical surface. 12 by cutting away at an inclined surface 52 parallel to 12.
According to this modification, die bonding and wire bonding can be facilitated by providing the inclined surface 52 parallel to the first conical surface 12.
Further, according to the submount MID package 45, since the chip mounting reference surface 44 parallel to the substrate mounting surface 36 is provided, the submount MID package 45 can be used as a suction surface to which the mounting machine sucks. The submount MID package 45 can be easily mounted.

  Therefore, according to the submount MID package 10, the submount MID package 31, the submount MID package 38, the submount MID package 40, and the submount MID package 45 of the physical quantity sensor according to the present embodiment, the three-axis physical quantity sensor module It can be obtained inexpensively and with high accuracy.

  The submount MID package 10, the submount MID package 31, the submount MID package 38, the submount MID package 40, and the submount MID package 45 are, for example, a three-axis LED package (LED illumination) in addition to the angular velocity sensor and the angle sensor. ) And the like, and has the same effects as described above.

10 Submount MID Package 11 Main Body 12 First Conical Surface 13 First Physical Quantity Sensor (Physical Quantity Sensor)
14 Second conical surface 15 Second physical quantity sensor (physical quantity sensor)
16 Third conical surface 17 Third physical quantity sensor (physical quantity sensor)
33 Sharp corner ridgeline

Claims (3)

A substantially triangular pyramid-shaped main body in which the first conical surface, the second conical surface and the third conical surface which are adjacent to each other are orthogonal to each other;
A first physical quantity sensor provided on the first conical surface;
A second physical quantity sensor provided on the second conical surface;
A third physical quantity sensor provided on the third conical surface;
Submount MID package of physical quantity sensor comprising The physical quantity sensor submount MID package according to claim 1,
The submount MID package of the physical quantity sensor whose said main body is a triangular pyramid shape. A right triangular prism body,
A physical quantity sensor provided on a square side surface sandwiched between acute ridges in the main body;
Submount MID package of physical quantity sensor comprising

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