JP2013041262A - Method of manufacturing connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a connector which can easily and reliably manufacture a connector suitably connected to another connector.SOLUTION: A method of manufacturing a connector includes: a first step of inserting an optical waveguide 20 into a first cavity 101 of a shaping mold 100 until one end surface 203 of the optical waveguide 20 butts against a bottom 107; a second step of filling a first resin material 10 in a liquid state, which is liquid when uncured and forms a connector housing 2 and guide pins 4a and 4b when cured, into the first cavity 101 and second cavities 105a and 105b; a third step of curing the liquid first resin material 10 and then forming the connector housing 2 and the guide pins 4a and 4b together by the cured first resin material 10; and a fourth step of releasing the shaping mold 100.

Description

  The present invention relates to a method for manufacturing a connector.

  In recent years, optical communications that transport data using optical frequency carriers have become increasingly important. In such optical communication, there is an optical waveguide as a means for guiding signal propagation light from one point to another point.

  This optical waveguide has a core layer provided between a pair of clad layers, for example. The core layer has a linear core portion and a clad portion, which are alternately arranged. A plurality of core portions generally exist in the core layer, but there may be one core portion. The core portion is made of a material that is substantially transparent to light of an optical frequency carrier wave, and the cladding layer and the cladding portion are made of a material having a lower refractive index than the core portion.

  Such an optical waveguide has a connector housing (ferrule) attached to one end thereof, and the attached portion is used as a connector (see, for example, Patent Document 1). Further, this connector is connected via two guide pins when, for example, another connector having the same configuration as the connector is connected. For this reason, a guide hole (insertion hole) into which each guide pin is inserted is provided in the connector housing in advance.

  When manufacturing the connector described in Patent Document 1, one end of the optical waveguide is inserted into a tubular connector housing, and in the inserted state, the inner peripheral portion of the connector housing and the outer peripheral portion of the optical waveguide An adhesive is filled in the gap formed between the two and cured.

  However, in the connector described in Patent Document 1, for example, when the thickness of the adhesive changes in the process of curing the adhesive, the optical waveguide is displaced, or the optical waveguide is deformed. Sometimes. In this case, there arises a problem that the positional accuracy between the optical waveguide and each guide hole of the connector housing is lowered. Thus, even if a connector in which a problem (problem) has occurred in the manufacturing process is connected to another connector via a guide pin, light cannot enter and exit (traverse) between the optical waveguides reliably. .

JP 2008-96669 A

  The objective of this invention is providing the manufacturing method of the connector which can manufacture the connector which can be suitably connected to another connector easily and reliably.

  Such an object is achieved by the present inventions (1) to (13) below.

(1) Manufacturing a connector comprising a strip-shaped optical waveguide, a connector housing attached to one end of the optical waveguide, and guide pins for positioning with the other connector when connected to the other connector (Hereinafter sometimes referred to as “guide pin connector manufacturing method”),
A bottom portion and a side wall standing from an edge of the bottom portion, and a lumen portion surrounded by the bottom portion and the side wall serves as a first cavity for molding the connector housing, and communicates with the first cavity. Then, the optical waveguide is inserted into the first cavity of the molding die in which the concave portion formed by being recessed in the bottom portion becomes the second cavity for molding the guide pin until the one end surface thereof abuts against the bottom portion. A first step of:
A second step of filling the first cavity and the second cavity in a liquid state with the resin material that becomes the connector housing and the guide pin when cured in a liquid state. ,
A third step of curing the liquid resin material and collectively molding the connector housing and the guide pin with the cured resin material;
And a fourth step of releasing the molding die.
(2) An optical waveguide having a strip shape and a connector housing attached to one end of the optical waveguide, and a guide hole for positioning with the other connector when connected to the other connector is the connector. A method of manufacturing a connector formed in a housing (hereinafter, also referred to as “guide hole connector manufacturing method”),
A projecting portion having a bottom and a side wall provided upright from an edge of the bottom, the inner cavity surrounded by the bottom and the side wall serving as a cavity for molding the connector housing; A first step of inserting the optical waveguide into the cavity of the mold formed so as to protrude from the bottom into the cavity until one end surface of the mold hits the bottom;
A second step of filling the cavity in the liquid state with a resin material that becomes the connector housing when the liquid is uncured and cured; and
A third step of curing the liquid resin material, and molding the connector housing in which the guide hole is formed with the cured resin material;
And a fourth step of releasing the molding die.

(3) The side wall is provided with an inlet that communicates with the first cavity and injects the liquid resin material into the first cavity.
In the second step, the method for manufacturing a connector according to (1) or (2), wherein the liquid resin material is filled through the injection port.

(4) The connector includes a support plate that contacts at least one surface of one end of the optical waveguide and supports the one end.
In the first step, when the optical waveguide is inserted into the first cavity, the insertion is performed while the support plate is in contact with one end of the optical waveguide. A manufacturing method of a connector given in any 1 paragraph.

  (5) The connector according to (4), wherein a width of the support plate is larger than a width of the optical waveguide.

(6) Manufacture a connector including a strip-shaped optical waveguide, a connector housing attached to one end of the optical waveguide, and a guide pin for positioning with the other connector when connected to the other connector A way to
A bottom portion and a side wall standing from an edge of the bottom portion, and a lumen portion surrounded by the bottom portion and the side wall serves as a first cavity for molding the connector housing, and communicates with the first cavity. The recess formed by recessing the bottom portion forms an uncured liquid in the first cavity and the second cavity of the molding die that becomes the second cavity for molding the guide pin. A first step of filling the resin material that becomes the connector housing and the guide pin in the liquid state when cured;
A second step of inserting the optical waveguide into the first cavity until one end face thereof abuts against the bottom;
A third step of curing the liquid resin material and collectively molding the connector housing and the guide pin with the cured resin material;
And a fourth step of releasing the molding die.

(7) An optical waveguide having a strip shape and a connector housing attached to one end of the optical waveguide, and a guide hole for positioning with the other connector when connected to the other connector is the connector. A method of manufacturing a connector formed in a housing, comprising:
A projecting portion having a bottom and a side wall provided upright from an edge of the bottom, the inner cavity surrounded by the bottom and the side wall serving as a cavity for molding the connector housing; Is filled in the liquid state with the resin material that becomes the connector housing when cured in the cavity of the molding die formed to protrude from the bottom portion into the cavity. And the process of
A second step of inserting the optical waveguide into the cavity until one end surface thereof abuts against the bottom;
A third step of curing the liquid resin material, and molding the connector housing in which the guide hole is formed with the cured resin material;
And a fourth step of releasing the molding die.

(8) The side wall is provided with an inlet that communicates with the first cavity and injects the liquid resin material into the first cavity.
In the first step, the connector manufacturing method according to (6) or (7), wherein the liquid resin material is filled through the injection port.

(9) The connector includes a support plate that contacts at least one surface of one end of the optical waveguide and supports the one end.
In the second step, when the optical waveguide is inserted into the first cavity, the insertion is performed while the support plate is in contact with one end of the optical waveguide. A manufacturing method of a connector given in any 1 paragraph.

  (10) The connector according to (9), wherein a width of the support plate is larger than a width of the optical waveguide.

(11) The optical waveguide has at least one core portion,
Prior to the third step, the connector manufacturing method according to any one of (1) to (10), wherein the optical waveguide and the second cavity are positioned with reference to the core portion. .

  (12) The method for manufacturing a connector according to any one of (1) to (11), wherein the resin material is cured by being irradiated with ultraviolet rays.

(13) In the connector, the optical waveguide has at least one core part, and further includes a lens that covers one end surface of the core part,
The method for manufacturing a connector according to any one of (1) to (12), wherein the mold has a recess for forming the lens.

According to the present invention, the optical waveguide can be directly fixed by the connector housing, and the connector housing and the guide pins can be molded together. As a result, for example, a connector with higher positional accuracy between members constituting the connector is easier than a conventional manufacturing method in which the optical waveguide is fixed via an adhesive or the guide pin is provided separately from the connector housing. And it can manufacture reliably. Such connectors can be preferably connected to other connectors.

It is a perspective view which shows the connector manufactured with the manufacturing method (1st Embodiment) of the connector of this invention. It is a front view for demonstrating in order each process in the manufacturing method (1st Embodiment) of the connector of this invention. It is a front view for demonstrating in order each process in the manufacturing method (1st Embodiment) of the connector of this invention. It is a front view for demonstrating in order each process in the manufacturing method (1st Embodiment) of the connector of this invention. It is a front view for demonstrating in order each process in the manufacturing method (1st Embodiment) of the connector of this invention. It is a front view for demonstrating in order each process in the manufacturing method (1st Embodiment) of the connector of this invention. It is a front view for demonstrating in order each process in the manufacturing method (1st Embodiment) of the connector of this invention. It is the figure seen from the arrow A direction in FIG. FIG. 5 is a cross-sectional view taken along line BB in FIG. 3 in the case of the “guide pin connector manufacturing method”. FIG. 5 is a cross-sectional view taken along line BB in FIG. 3 in the case of the “guide hole connector manufacturing method”. FIG. 5 is a cross-sectional view taken along line CC in FIG. 4 in the case of the “guide pin connector manufacturing method”. FIG. 5 is a cross-sectional view taken along line CC in FIG. 4 in the case of the “guide hole connector manufacturing method”.

FIG. 6 is a sectional view taken along the line DD in FIG. 5 in the case of the “guide pin connector manufacturing method”. FIG. 6 is a cross-sectional view taken along the line DD in FIG. 5 in the case of the “guide hole connector manufacturing method”. FIG. 7 is a cross-sectional view taken along line EE in FIG. 6 in the case of the “guide pin connector manufacturing method”. FIG. 7 is a cross-sectional view taken along line EE in FIG. 6 in the case of “guide hole connector manufacturing method”. FIG. 8 is a cross-sectional view taken along line FF in FIG. 7 in the case of the “guide pin connector manufacturing method”. FIG. 8 is a cross-sectional view taken along line FF in FIG. 7 in the case of the “guide hole connector manufacturing method”. In the case of "guide pin connector manufacturing method", it is a longitudinal cross-sectional view for describing each process in the manufacturing method (2nd Embodiment) of the connector of this invention in order. In the case of "guide hole connector manufacturing method", it is a longitudinal cross-sectional view for demonstrating in order each process in the manufacturing method (2nd Embodiment) of the connector of this invention. In the case of "guide pin connector manufacturing method", it is a longitudinal cross-sectional view for describing each process in the manufacturing method (2nd Embodiment) of the connector of this invention in order. In the case of "guide hole connector manufacturing method", it is a longitudinal cross-sectional view for demonstrating in order each process in the manufacturing method (2nd Embodiment) of the connector of this invention. In the case of the “guide pin connector manufacturing method”, it is a longitudinal sectional view for explaining one step in the connector manufacturing method (third embodiment) of the present invention. In the case of the “guide hole connector manufacturing method”, it is a longitudinal sectional view for explaining one process in the connector manufacturing method (third embodiment) of the present invention. In the case of the “guide pin connector manufacturing method”, it is a partial longitudinal sectional view for explaining one step in the connector manufacturing method (fourth embodiment) of the present invention. In the case of the “guide hole connector manufacturing method”, it is a partial longitudinal sectional view for explaining one step in the connector manufacturing method (fourth embodiment) of the present invention.

  Hereinafter, the manufacturing method of the connector of the present invention is explained in detail based on the suitable embodiment shown in an accompanying drawing.

<First Embodiment>
FIG. 1 is a perspective view showing a connector manufactured by a connector manufacturing method (first embodiment) according to the present invention, and FIGS. 2 to 7 are respectively a connector manufacturing method (first embodiment) according to the present invention. FIG. 8 is a front view for explaining each step in order, FIG. 8 is a view seen from the direction of arrow A in FIG. 2, FIG. 9 (guide pin connector manufacturing method), or FIG. 10 (guide hole connector manufacturing method) 3 is a cross-sectional view taken along line B-B in FIG. 3, FIG. 11 (manufacturing method for guide pin connector), or FIG. 12 (manufacturing method for guide hole connector) is a cross-sectional view taken along line CC in FIG. Manufacturing method) or FIG. 14 (guide hole connector manufacturing method) is a sectional view taken along the line DD in FIG. 5, FIG. 15 (guide pin connector manufacturing method), or FIG. 16 (guide hole connector manufacturing method) is a diagram. 6 is a cross-sectional view taken along line E-E in FIG. Connector manufacturing method), or 18 (the guide hole connector manufacturing method) is a sectional view taken along line F-F in FIG. Hereinafter, for convenience of explanation, the upper side in FIGS. 1 to 7 is referred to as “upper” or “upper”, and the lower side is referred to as “lower” or “lower”. Further, the lower left side in FIG. 1 is referred to as “one end side”, the upper right side is referred to as “the other end side”, and the lower side in FIGS. 8 to 18 (the same applies to FIGS. 19 to 24) is referred to as “one end side”. The upper side is called the “other end side”.

  A connector 1 shown in FIG. 1 is attached to a strip-shaped optical waveguide 20, a pair of support plates 5 a and 5 b that support one end of the optical waveguide 20, and the support plates 5 a and 5 b to one end of the optical waveguide 20. Connector housing 2 and guide pins 4a and 4b. The connector 1 can be connected to an optical cable 90 which is a counterpart (another connector) to be connected. Hereinafter, the configuration of each unit will be described.

  The optical waveguide 20 is formed with core portions (waveguide channels) 201a, 201b, 201c, which are long (linear) in plan view, and clad portions 202a, 202b, 202c, 202d, which are alternately arranged. Has been. The core parts 201a, 201b, 201c and the clad parts 202a, 202b, 202c, 202d are sandwiched between the upper clad part 204a and the lower clad part 204b, respectively, in the vertical direction. As described above, the optical waveguide 20 is a multi-channel optical waveguide having a plurality of core portions. The one end surfaces of the core portions 201a to 201c are connection ends connected to the one end surfaces of the core portions 201a to 201c of the optical waveguide (passage path) 20 'of the optical cable 90, respectively. Then, the light can pass through the core portions 201a to 201c between the optical waveguides 20 and 20 '.

  The core portions 201a to 201c, the clad portions 202a to 202d, the upper clad portion 204a, and the lower clad portion 204b have different light refractive indexes, and the difference in refractive index is 0.5% or more. Is more preferably 0.8 or more, and particularly preferably 1.0% or more.

The constituent materials of the core parts 201a to 201c, the clad parts 202a to 202d, the upper clad part 204a, and the lower clad part 204b are not particularly limited as long as they have different refractive indexes. Constituent materials of “core region” and “cladding region” described in JP-A-090328, “core layer (core portion, cladding portion)” and “first cladding” described in JP 2010-189458 A The constituent materials of “layer” and “second cladding layer” can be used.

  In addition, the thickness of the optical waveguide 20 is preferably about 15 to 200 μm, and more preferably about 30 to 100 μm.

With such a configuration, the optical waveguide 20 becomes flexible, and a device on which the connector 1 is installed (for example, a high performance computing server (HPC) server, a short / medium distance harness such as a router / automobile, a general-purpose personal computer) Wiring (cabling) within the mobile phone internal wiring is facilitated.

  A pair of support plates 5 a and 5 b are disposed at one end of the optical waveguide 20 so as to sandwich the one end from both sides. The support plate 5 a is in contact with the lower surface of the optical waveguide 20, and the support plate 5 b is in contact with the upper surface of the optical waveguide 20. The support plates 5 a and 5 b are bonded to the optical waveguide 20 via an adhesive 30, respectively.

  Each of the support plates 5a and 5b is formed of a strip (flat plate) having a strip shape. Each of the support plates 5a and 5b is higher in rigidity than the optical waveguide 20, and preferably has a thickness of 0.01 to 5.00 mm, for example, 0.10 to 1.00 mm. Is more preferable.

  The width of the support plates 5a and 5b is set to be larger than the width of the optical waveguide 20, and is preferably 1.01 to 1.50 times the width of the optical waveguide 20, for example, 1.05 to It is more preferably 1.20 times. Thereby, for example, even when the support plate 5a is slightly displaced in the width direction with respect to the optical waveguide 20 when the support plate 5a is installed in the optical waveguide 20, the support plate 5a has a larger width. The plate 5a and the entire lower surface of the one end portion of the optical waveguide 20 can reliably contact each other (the same applies to the support plate 5b). Therefore, in the process of manufacturing the connector 1, the support plates 5a and 5b can be positioned relatively roughly in the width direction of the optical waveguide 20.

  By the way, since the optical waveguide 20 is flexible, when the connector 1 is manufactured, the first end in the liquid state is formed in the mold 100 with one end thereof in a state in which the support plates 5a and 5b are omitted. When the first resin material 10 is cured (molded) with the resin material (resin material) 10, the optical waveguide 20 is displaced in the process of curing the first resin material 10. , It may be deformed (for example, wrinkles may occur). Here, in the case of the guide pin connector manufacturing method, the first resin material 10 is a material constituting the connector housing 2 and the guide pins 4a and 4b. In the case of the guide hole connector manufacturing method, the first resin material 10 is used. Is a material constituting the connector housing 2.

  However, in the connector 1, since one end part of the optical waveguide 20 is sandwiched between the support plate 5a and the support plate 5b, it is supported and reinforced, so that the positional deviation and deformation can be reliably prevented. Can do. Thus, in a state where the connector 1 is connected to the optical cable 90, the core portion 201a of the optical waveguide 20 and the core portion 201a of the optical waveguide 20 ′ are reliably optically connected, and the core portion 201b of the optical waveguide 20 and the optical waveguide are reliably connected. The core portion 201b of 20 ′ is reliably optically connected, and the core portion 201c of the optical waveguide 20 and the core portion 201c of the optical waveguide 20 ′ are reliably optically connected. And between the connector 1 and the optical cable 90 which were connected in this way, light can go in and out (going back and forth) reliably.

  The connector housing 2 is provided so as to cover the outer peripheral side of one end of the optical waveguide 20 together with the support plates 5a and 5b. The connector housing 2 is molded into a block shape with a molding die 100 (see FIGS. 6, 7, 17, and 18).

As shown in FIG. 1, in the connector 1, the entire support plates 5 a and 5 b are respectively embedded in the connector housing 2. Thereby, in the process in which the connector housing 2 is cured, the support plate 5a and the support plate 5b can press the optical waveguide 20 in opposite directions by the connector housing 2. Therefore, the optical waveguide 20 is corrected along the planar shape of the support plates 5a and 5b, and the deformation can be prevented more reliably.
In the case of the guide pin connector manufacturing method, the guide pins 4 a and 4 b are formed to protrude from the one end surface 21 of the connector housing 2. In addition, the guide pin 4 a and the guide pin 4 b are spaced apart via the optical waveguide 20. The guide pins 4a and 4b are formed by the forming die 100 (see FIGS. 17 and 18).

  The guide pins 4a and 4b are inserted into the guide holes 902a and 902b of the optical cable 90 when the connector 1 is connected to the optical cable 90, respectively. Thereby, the optical waveguide 20 of the connector 1 and the optical waveguide 20 'of the optical cable 90 are positioned. Therefore, the optical connection between the core portions 201a to 201c of the optical waveguide 20 and the core portions 201a to 201c of the optical waveguide 20 'can be more reliably performed.

  Each of the guide pins 4a and 4b has a cylindrical shape, and the one end surface 41 may be a flat surface or a rounded curved surface.

The connector housing 2 and the guide pins 4a and 4b and the support plates 5a and 5b are each made of a resin material, but the compositions thereof are different from each other.
In the case of the guide hole connector manufacturing method, the connector housing 2 is formed with guide holes 22a and 22b penetrating from one end surface 21 to the other end surface 24 thereof. The inner diameter of the guide hole 22a and the inner diameter of the guide hole 22b are constant along the longitudinal direction, and their sizes are also the same. Further, the guide hole 22 a and the guide hole 22 b are spaced apart via the optical waveguide 20.

  The guide holes 22a and 22b are inserted into the guide pins 902a and 902b of the optical cable 90 when the connector 1 is connected to the optical cable 90, respectively. Thereby, the optical waveguide 20 of the connector 1 and the optical waveguide 20 'of the optical cable 90 are positioned. Therefore, the optical connection between the core portions 201a to 201c of the optical waveguide 20 and the core portions 201a to 201c of the optical waveguide 20 'can be more reliably performed.

  The connector housing 2 and the support plates 5a and 5b are each made of a resin material, but the compositions thereof are different from each other.

First resin material 10 constituting the connector housing 2 and guide pins 4a and 4b (in the case of the guide pin connector manufacturing method), or first resin material 10 constituting the connector housing 2 (in the case of the guide hole connector manufacturing method) ) Can be used as a photocurable resin. Examples of the resin include an ultraviolet curable resin mainly composed of an acrylic compound (acrylic resin) and a cyclic olefin compound (cyclic olefin resin). UV curable resin mainly composed of at least one selected from the group consisting of ultraviolet curable resin mainly composed of urethane acrylate oligomer or polyester urethane acrylate oligomer, epoxy resin and vinyl phenol resin. Resin etc. are mentioned. Among these, an ultraviolet curable resin mainly comprising at least one selected from the group consisting of an ultraviolet curable resin mainly containing an acrylic compound and an ultraviolet curable resin mainly containing a cyclic olefin compound. preferable. The acrylic compound and the cyclic olefin compound have a high curing rate when irradiated with light, and the resin can be cured with a relatively small amount of irradiation, which is preferable in manufacturing the connector 1.

When an ultraviolet curable resin mainly composed of an acrylic compound (acrylic resin) is used as the photocurable resin, examples of the acrylic compound include acrylic acid ester or methacrylic acid ester monomers. Specifically, ethylene glycol diacrylate, ethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, glyceryl diacrylate, glyceryl dimethacrylate, 1,10-decanediol diacrylate , Bifunctional acrylates such as 1,10-decanediol dimethacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, hexaacrylic acid And polyfunctional acrylates such as dipentaerythritol and dipentaerythritol hexamethacrylate. Among these, acrylic acid esters are preferable, and acrylic acid esters or methacrylic acid alkyl esters having 1 to 15 carbon atoms in the ester moiety are particularly preferable.

  On the other hand, examples of the second resin material constituting the support plates 5a and 5b include inorganic materials such as ceramic materials such as alumina, glass materials such as quartz glass and soda glass, aluminum, and stainless steel. In addition, metal materials, resin materials such as polyethylene terephthalate, polypropylene, cycloolefin polymer, polymethyl methacrylate, polycarbonate, and polyarylate are used.

  By using resin materials having different compositions as described above, for example, materials suitable for molding of each member can be used.

  The connector 1 having the above configuration is manufactured by the connector manufacturing method of the present invention.

  As shown in FIG. 1, the optical cable 90 is optically connected to the optical waveguide 20 of the connector 1. Similar to the optical waveguide 20, the optical cable 90 is attached to an optical waveguide 20 ′ having core portions 201 a, 201 b, 201 c and clad portions 202 a, 202 b, 202 c, 202 d, and one end of the optical waveguide 20 ′. And a connector housing (hereinafter simply referred to as “housing”) 901.

In a connected state where the optical cable 90 and the connector 1 are connected, optical communication can be performed between the optical waveguide 20 ′ of the optical cable 90 and the optical waveguide 20 of the connector 1.
In the case of the guide pin connector manufacturing method, the housing 901 is formed of a cylindrical body, and one end portion of the optical waveguide 20 ′ can be fixed inside thereof. As described above, the housing 901 is formed with guide holes 902a and 902b into which the guide pins 4a and 4b of the connector housing 2 of the connector 1 are respectively inserted.
In the case of the guide hole connector manufacturing method, the housing 901 is formed of a cylindrical body, and one end portion of the optical waveguide 20 ′ can be fixed inside thereof. In the housing 901, cylindrical guide pins 902a and 902b are formed so as to protrude. Then, the guide pin 902a is inserted into the guide hole 22a of the connector housing 2 of the connector 1, and the guide pin 902b is inserted into the guide hole 22b of the connector housing 2 of the connector 1.

Next, a method for manufacturing the connector 1 (in the case of a guide pin connector manufacturing method) will be described with reference to FIGS. 2 to 9, 11, 13, 15, and 17.

  In this manufacturing method, a mold 100 shown in FIGS. 3 to 6, 9, 11, 13, and 15 is used during the manufacturing process.

  The molding die 100 is composed of a bottomed tubular (square tubular) member having a bottom 107 and a wall (side wall) 103 erected from the edge of the bottom 107. The lumen portion surrounded by the bottom portion 107 and the wall portion 103 becomes the first cavity 101 for molding the connector housing 2 into a block shape.

  In the bottom portion 107, second cavities 105a and 105b each formed of a concave portion formed by being recessed in the other end surface 108 are formed. The second cavities 105 a and 105 b each open to the other end surface 108 and communicate with the first cavity 101. The second cavity 105a is a part for molding the guide pin 4a, and the second cavity 105b is a part for molding the guide pin 4b.

  Further, the bottom 107 is formed with exhaust holes 106a and 106b constituted by pores communicating from the one end face 104 to the second cavities 105a and 105b, respectively. As shown in FIG. 11, during the manufacture of the connector 1, the air G in the second cavity 105a is exhausted through the exhaust hole 106a, and the air G in the second cavity 105b is exhausted through the exhaust hole 106b. Is discharged. A hydrophobic filter (not shown) is installed in the exhaust holes 106a and 106b. Thereby, it is possible to reliably prevent the liquid first resin material 10 from leaking from the exhaust holes 106a and 106b.

  In addition, a wall (injection port) 102 into which the liquid first resin material 10 is injected is formed in the wall portion 103 of the mold 100. The gate 102 communicates with the first cavity 101. The first resin material 10 can be filled (injected) into the mold 100 through the gate 102. It is preferable that the gate 102 is disposed at a position closer to the proximal end opening 109 side than the bottom 107 side.

  In addition, when the mold 100 is used, it is preferable to install the mold 100 so that the bottom 107 is positioned vertically downward and the base end opening 109 faces vertically upward.

  The mold 100 having such a configuration has optical transparency and the material thereof is not particularly limited, and examples thereof include glass, acrylic, polyester (PES), polyethylene terephthalate (PET), and silicone rubber. .

  Further, the molding die 100 may be one in which the bottom 107 and the wall 103 are integrally formed, or the bottom 107 and the wall 103 are formed as separate bodies, and these separate bodies are joined together. It may be what was done.

  Further, the mold 100 may be provided with a lens portion functioning as a lens on the bottom portion 107. This lens unit directs the ultraviolet light toward the first resin material 10 when the liquid first resin material 10 in the first cavity 101 is cured by irradiating the ultraviolet light during the manufacture of the connector 1. It is comprised so that it can condense. Thereby, ultraviolet rays can be applied to the first resin material 10 sufficiently and reliably, and thus the first resin material 10 can be reliably cured.

In the case of the guide pin connector manufacturing method, the manufacturing method of the connector 1 includes a preparation process, an insertion process (first process), a filling process (second process), a positioning process, and a curing process (third process). ) And a release step (fourth step), and each step is performed in this order.

[A-1] Preparation Step First, as shown in FIGS. 2 and 8, one optical waveguide 20 and support plates 5a and 5b are prepared. Then, the support plate 5a is brought into contact with the lower surface of one end portion of the optical waveguide 20 in a state where the bonding sheet (adhesive 30) is pasted with a laminator, and the light is in a state where the bonding sheet (adhesive 30) is pasted with the laminator. The support plate 5b is brought into contact with the upper surface of one end of the waveguide 20 and is crimped. Also, as shown in FIG. 8, at this time, each end surface 51 of the support plates 5a and 5b is overlapped with one end surface 203 of the optical waveguide 20, and the optical waveguide 20 is placed in the width direction of the support plates 5a and 5b. Located in the center.

[A-2] Insertion step (first step)
Next, as shown in FIGS. 3 and 9, one end of the optical waveguide 20 in a state in which the support plates 5 a and 5 b are in contact with each other is inserted (stored) in the first cavity 101 of the mold 100. Also at this time, the positional relationship between the optical waveguide 20 and the support plates 5a and 5b is maintained in the same state as the positional relationship in the preparation step. Thereby, the optical waveguide 20 is supported by the support plates 5a and 5b also in the subsequent steps.

  The insertion depth of the optical waveguide 20 with respect to the first cavity 101 is until the one end surface 203 of the optical waveguide 20 abuts against the other end surface 108 of the bottom 107 of the mold 100.

  At the time of this insertion, the optical waveguide 20 is disposed on the central portion of the mold 100 (first cavity 101), that is, on the central axis of the mold 100.

As shown in FIG. 9, a CCD (Charge Coupled Device) camera 500 used in the positioning step is disposed on one end side of the mold 100. The CCD camera 500 remains in this position after the next process.

[A-3] Filling step (second step)
Next, as shown in FIGS. 4 and 11, the first resin material 10 in a liquid state (uncured state) is injected (filled) from the gate 102 of the mold 100. Thereby, the inside of the first cavity 101 and the inside of the second cavities 105 a and 105 b are surely filled with the first resin material 10. At this time, the air G in the second cavity 105 a is pushed by the first resin material 10 and is discharged from the exhaust hole 106 a, and the air G in the second cavity 105 b also enters the first resin material 10. It is pushed and discharged through the exhaust hole 106b. As a result, the first resin material 10 reliably spreads throughout the second cavities 105 a and 105 b having a smaller (narrower) space than the first cavity 101.

[A-4] Positioning Step Next, light is irradiated from the other end side of the optical waveguide 20 in the direction using, for example, a surface light source. Thereby, the one end surface of the core parts 201a-201c of the optical waveguide 20 light-emits, respectively.

Furthermore, a grayscale image on one end face side of the optical waveguide 20 in this state is captured using a CCD (Charge Coupled Device) camera 500, for example. Thereby, core part 201a-201c
, Ie, three light emitting points can be detected. Then, the leftmost light-emitting point among these three light-emitting points is extracted, and the position of the light-emitting point (center point) between the optical waveguide 20 and the second cavity 105a (guide pin 4a) is determined. It is set as the standard S when doing.

Next, the central point O ₁ of the second cavity 105a is separated by a predetermined distance Lx from the reference S on the left side in FIG. 5, so as to have the same position as the reference S in the vertical direction, the position of the optical waveguide 20 fine Adjust (see FIG. 11). Thereby, the connector 1 in which the optical waveguide 20 and the guide pins 4a and 4b (second cavities 105a and 105b) are accurately positioned is obtained. The center point O ₁ of the second cavity 105a is detected in advance, and the predetermined distance Lx is also determined in advance.

  By the way, when the connector 1 is connected to the optical cable 90, positioning, that is, connection between the core portions 201a to 201c of the optical waveguide 20 and the core portions 201a to 201c of the optical waveguide 20 'is most important. Therefore, if the position of the second cavity 105a is determined using the core portion as the reference S as described above, the guide pin 4a formed by the second cavity 105a is simply inserted into the guide hole 902a of the optical cable 90. Thus, the positioning of the core parts 201a to 201c is performed reliably. Therefore, it can be seen that “using the core portion as the reference S” is preferable in determining the position of the second cavity 105a.

  Further, it is preferable that a position restricting means (not shown) for restricting the position of the optical waveguide 20 finely adjusted is installed in the mold 100. The position restricting hand is not particularly limited, and examples thereof include a vise.

[A-5] Curing step (third step)
Next, as shown in FIG. 6, the ultraviolet irradiation device 400 a that irradiates ultraviolet rays is arranged on the upper side of the mold 100 in the drawing, and the ultraviolet irradiation device 400 b is arranged on the lower side of the molding die 100 in the drawing. In this state, the ultraviolet irradiation devices 400a and 400b are operated to irradiate ultraviolet rays. Thus, the first resin material 10 in the first cavity 101 and the first resin material 10 in the second cavities 105a and 105b can be reliably cured, and thus the cured first The connector housing 2 and the guide pins 4a and 4b can be molded together with the resin material 10 (see FIGS. 6 and 15).

In addition, it is preferable that the wavelength of the ultraviolet-ray in this process is 200-500 nm, and it is more preferable that it is 350-380 nm. Moreover, the exposure amount of an ultraviolet-ray is 10-200 kJ / m < ² >.
Is preferable, and it is more preferable that it is 60-120 kJ / m < ² >.

[A-6] Mold release step (fourth step)
Next, as shown in FIGS. 7 and 17, the mold 100 is released.

  Through the steps as described above, the connector 1 that can be suitably connected to the optical cable 90 can be manufactured easily and reliably.

  In addition, according to the present manufacturing method, the guide pins 4a and 4b accurately positioned with respect to the optical waveguide 20 and the connector housing 2 can be integrally formed. Therefore, for example, the guide pins are separated from the connector housing. The connector 1 can be manufactured more easily than the conventional manufacturing method as described above. In this manufacturing method, the position accuracy of the guide pin is usually within an error range of 10 μm or less, and the accuracy is improved as compared with the conventional manufacturing method.

  Moreover, in this manufacturing method, the grinding | polishing process with respect to the one end surface 21 of the connector housing 2 can be abbreviate | omitted.

Second Embodiment
FIG. 19 and FIG. 21 are longitudinal sectional views for sequentially explaining the respective steps in the connector manufacturing method (second embodiment) of the present invention.

  Hereinafter, the second embodiment of the connector manufacturing method of the present invention will be described with reference to these drawings. However, the difference from the above-described embodiment will be mainly described, and the description of the same matters will be omitted.

  This embodiment is the same as the first embodiment except that the order of some steps is different. That is, the manufacturing method in this embodiment is the same as that of the said 1st Embodiment except the order of a filling process and an insertion process changing.

  The manufacturing method in the present embodiment goes through the same steps as the [A-1] preparation step of the manufacturing method in the first embodiment, and then [B-2] a filling step (first step), [B-3] After an insertion step (second step), finally, [A-4] positioning step and [A-5] curing step (third step) of the manufacturing method in the first embodiment. ) And [A-6] each step similar to the mold release step (fourth step). Through such steps, the connector 1 that can be suitably connected to the optical cable 90 can be easily and reliably manufactured.

  Here, the [B-2] filling step and the [B-3] insertion step will be described.

[B-2] Filling Step As shown in FIG. 19, the liquid first resin material 10 is filled from the gate 102 of the mold 100. Thereby, the inside of the first cavity 101 and the inside of the second cavities 105 a and 105 b are surely filled with the first resin material 10. Note that the optical waveguide 20 has not yet been inserted into the first cavity 101.

  In addition, when the first resin material 10 is filled, the air G in the second cavity 105a is pushed by the first resin material 10 and discharged from the exhaust hole 106a. The air G is also pushed by the first resin material 10 and discharged through the exhaust hole 106b. Thereby, the 1st resin material 10 spreads reliably in the 2nd cavity 105a, 105b whole.

[B-3] Insertion Step Next, as shown in FIG. 21, one end of the optical waveguide 20 with the support plates 5 a and 5 b in contact with each other is inserted into the first cavity 101 of the mold 100. The insertion depth at this time is until the one end surface 203 of the optical waveguide 20 abuts against the other end surface 108 of the bottom 107 of the mold 100.

  At this time, the optical waveguide 20 is disposed on the central portion of the mold 100 (first cavity 101), that is, on the central axis of the mold 100.

  Then, the connector 1 is obtained by passing through [A-4] positioning process, [A-5] hardening process, and [A-6] mold release process in order.

<Third Embodiment>
FIG. 23 is a longitudinal sectional view for explaining one step in the method for manufacturing a connector of the present invention (third embodiment).

  Hereinafter, the third embodiment of the connector manufacturing method of the present invention will be described with reference to this figure, but the description will focus on differences from the above-described embodiment, and the description of the same matters will be omitted.

This embodiment is the same as the first embodiment except that the configuration of the connector is different. That is, in this embodiment, the connector is the same as that of the first embodiment except that the support plate is omitted.

  As shown in FIG. 23, in the insertion step, the optical waveguide 20 that is not supported by the support plates 5a and 5b, that is, the optical waveguide 20 alone, and one end of the optical waveguide 20 is connected to the molding die 100 of the molding die 100. Insert into the first cavity 101. The insertion depth at this time is until the one end surface 203 of the optical waveguide 20 abuts against the other end surface 108 of the bottom 107 of the mold 100.

  At the time of this insertion, the optical waveguide 20 is disposed on the central portion of the mold 100 (first cavity 101), that is, on the central axis of the mold 100.

  Then, the connector 1 from which the support plates 5a and 5b are omitted is obtained by sequentially performing a filling step, a positioning step, a curing step, and a release step.

<Fourth embodiment>
FIG. 25 is a partial longitudinal sectional view for explaining one process in the method for manufacturing a connector of the present invention (fourth embodiment).

  Hereinafter, the fourth embodiment of the connector manufacturing method of the present invention will be described with reference to this drawing. However, the difference from the above-described embodiment will be mainly described, and the description of the same matters will be omitted.

  The present embodiment is the same as the first embodiment except that the configuration of the connector and the mold is different.

  As shown in FIG. 25, the mold 100 is formed by recessing three concave portions 110 on the other end surface 108 of the bottom portion 107. Each recessed part 110 is arrange | positioned in the position corresponding to the core parts 201a-201c of the optical waveguide 20, respectively, ie, facing.

  The mold 100 is configured such that when the liquid state first resin material 10 is filled from the gate 102 in the filling step, the first resin material 10 is also filled into the recesses 110. The first resin material 10 filled in each of the concave portions 110 is cured in a curing process, and becomes a lens that covers one end surfaces of the core portions 201a to 201c.

  Even when the optical waveguide 20 of the connector 1 and the optical waveguide 20 ′ of the optical cable 90 are slightly misaligned when the connector 1 is connected to the optical cable 90, the condensing effect of the lens causes a gap between the connector 1 and the optical cable 90. The light is sure to come and go.

  As mentioned above, although the manufacturing method of the connector of this invention was demonstrated about embodiment of illustration, this invention is not limited to this. Moreover, each part which comprises a connector can be substituted with the thing of the arbitrary structures which can exhibit the same function. Moreover, arbitrary components may be added.

  The connector manufacturing method of the present invention may be a combination of any two or more configurations (features) of the above-described embodiments.

  Moreover, although the number of the core parts of the optical waveguide was three in each said embodiment, it is not limited to this, For example, one, two, or four or more may be sufficient.

In addition, in the above-described embodiments, two support plates are provided so as to be in contact with both surfaces of the optical waveguide, but the present invention is not limited to this. For example, the support plate 1 is in contact with one surface (one surface) of the optical waveguide. It may be installed.

  Further, the second resin material constituting the support plate is a resin material different from the first resin material in each of the above embodiments, but is not limited thereto, and the same material may be used.

In addition to the resin material, a metal material such as stainless steel can be used as a constituent material of the support plate.
Next, a method for manufacturing the connector 1 (guide hole connector manufacturing method) will be described with reference to FIGS. 2 to 10, 12, 14, 16, and 18.

  In this manufacturing method, the mold 100 shown in FIGS. 3 to 6, 10, 12, 14, and 16 is used during the manufacturing process.

  The molding die 100 is composed of a bottomed tubular (square tubular) member having a bottom 107 and a wall (side wall) 103 erected from the edge of the bottom 107. The lumen portion surrounded by the bottom portion 107 and the wall portion 103 becomes a cavity 101 for molding the connector housing 2 into a block shape.

  Projections 105a and 105b are formed on the bottom 107 so as to project from the other end face 108 into the cavity 101, that is, toward the other end. The protrusions 105a and 105b each have a cylindrical shape. Further, the outer diameters of the protrusions 105a and 105b are constant along the longitudinal direction. In the manufacturing process of the connector 1, the protrusion 105 a becomes a part for forming the guide hole 22 a of the connector housing 2, and the protrusion 105 b becomes a part for forming the guide hole 22 b of the connector housing 2.

  In addition, a wall (injection port) 102 into which the liquid first resin material 10 is injected is formed in the wall portion 103 of the mold 100. The gate 102 communicates with the cavity 101. The first resin material 10 can be filled (injected) into the cavity 101 through the gate 102. It is preferable that the gate 102 is disposed at a position closer to the proximal end opening 109 side than the bottom 107 side. Furthermore, the gate 102 is preferably located on the bottom 107 side of the end surfaces (top surfaces) 106 of the protrusions 105a and 105b.

  In addition, when the mold 100 is used, it is preferable to install the mold 100 so that the bottom 107 is positioned vertically downward and the base end opening 109 faces vertically upward.

  The mold 100 having such a configuration has optical transparency and the material thereof is not particularly limited, and examples thereof include glass, acrylic, polyester (PES), polyethylene terephthalate (PET), and silicone rubber. .

  Further, the molding die 100 may be one in which the bottom 107 and the wall 103 are integrally formed, or the bottom 107 and the wall 103 are formed as separate bodies, and these separate bodies are joined together. It may be what was done.

Further, the mold 100 may be provided with a lens portion functioning as a lens on the bottom portion 107. This lens part condenses the ultraviolet rays toward the first resin material 10 when the first resin material 10 in the liquid state in the cavity 101 is cured by irradiating the ultraviolet rays during the manufacturing of the connector 1. It is configured to be able to. Thereby, ultraviolet rays can be applied to the first resin material 10 sufficiently and reliably, and thus the first resin material 10 can be reliably cured.

  In the case of the guide hole connector manufacturing method, the manufacturing method of the connector 1 includes a preparation process, an insertion process (first process), a filling process (second process), a positioning process, and a curing process (third process). Step) and a release step (fourth step), and each step is performed in this order.

[A-1] Preparation Step First, as shown in FIGS. 2 and 8, one optical waveguide 20 and support plates 5a and 5b are prepared. Then, the support plate 5a is brought into contact with the lower surface of one end portion of the optical waveguide 20 in a state where the bonding sheet (adhesive 30) is pasted with a laminator, and the light is in a state where the bonding sheet (adhesive 30) is pasted with the laminator. The support plate 5b is brought into contact with the upper surface of one end of the waveguide 20 and is crimped. Also, as shown in FIG. 8, at this time, each end surface 51 of the support plates 5a and 5b is overlapped with one end surface 203 of the optical waveguide 20, and the optical waveguide 20 is placed in the width direction of the support plates 5a and 5b. Located in the center.

[A-2] Insertion step (first step)
Next, as shown in FIGS. 3 and 10, one end of the optical waveguide 20 in a state where the support plates 5 a and 5 b are in contact with each other is inserted (stored) in the cavity 101 of the mold 100. Also at this time, the positional relationship between the optical waveguide 20 and the support plates 5a and 5b is maintained in the same state as the positional relationship in the preparation step. Thereby, the optical waveguide 20 is supported by the support plates 5a and 5b also in the subsequent steps.

  The insertion depth of the optical waveguide 20 with respect to the cavity 101 is until the one end surface 203 of the optical waveguide 20 abuts against the other end surface 108 of the bottom 107 of the mold 100.

  At the time of this insertion, the optical waveguide 20 is disposed on the central portion of the mold 100 (cavity 101), that is, on the central axis of the mold 100.

As shown in FIG. 10, a CCD (Charge Coupled Device) camera 500 used in the positioning process is disposed on one end side of the mold 100. This CCD camera 500
It remains in this position after the next process.

[A-3] Filling step (second step)
Next, as shown in FIGS. 4 and 12, the first resin material 10 in a liquid state (uncured state) is injected (filled) from the gate 102 of the mold 100. As a result, the cavity 101 is reliably filled with the first resin material 10.

  In the configuration shown in FIG. 14, the filling amount of the first resin material 10 is such that the liquid level is positioned on one end side with respect to the end surfaces 106 of the protruding portions 105a and 105b. Thereby, the guide holes 22a and 22b penetrate the connector housing 2, respectively.

[A-4] Positioning Step Next, light is irradiated from the other end side of the optical waveguide 20 in the direction using, for example, a surface light source. Thereby, the one end surface of the core parts 201a-201c of the optical waveguide 20 light-emits, respectively.

Furthermore, a grayscale image on one end face side of the optical waveguide 20 in this state is captured using a CCD (Charge Coupled Device) camera 500, for example. Thereby, core part 201a-201c
, Ie, three light emitting points can be detected. Then, the leftmost light-emitting point among these three light-emitting points is extracted, and the light-emitting point (center point) is
The reference S is used when the positions of the optical waveguide 20 and the cavity 101 (guide hole 22a) are determined.

Next, the central point O ₁ of the projection 105a is separated by a predetermined distance Lx from the reference S on the left side in FIG. 5, so that the same position as the reference S in the vertical direction, to finely adjust the position of the optical waveguide 20 (See FIG. 14). Thereby, the connector 1 in which the optical waveguide 20 and the guide holes 22a and 22b (protrusions 105a and 105b) are accurately positioned is obtained. Note that the center point O ₁ of the protrusion 105a is detected in advance, and the predetermined distance Lx is also determined in advance.

  By the way, when the connector 1 is connected to the optical cable 90, positioning, that is, connection between the core portions 201a to 201c of the optical waveguide 20 and the core portions 201a to 201c of the optical waveguide 20 'is most important. Therefore, if the position of the protruding portion 105a is determined using the core portion as a reference S as described above, the guide hole 22a formed by the protruding portion 105a is simply inserted into the guide pin 902a of the optical cable 90, and the core portion 201a. Positioning of ~ 201c is surely performed. Therefore, it is understood that “using the core portion as the reference S” is preferable in determining the position of the protruding portion 105a.

  Further, it is preferable that a position restricting means (not shown) for restricting the position of the optical waveguide 20 finely adjusted is installed in the mold 100. The position restricting hand is not particularly limited, and examples thereof include a vise.

[A-5] Curing step (third step)
Next, as shown in FIG. 6, the ultraviolet irradiation device 400 a that irradiates ultraviolet rays is arranged on the upper side of the mold 100 in the drawing, and the ultraviolet irradiation device 400 b is arranged on the lower side of the molding die 100 in the drawing. In this state, the ultraviolet irradiation devices 400a and 400b are operated to irradiate ultraviolet rays. Thus, the first resin material 10 in the cavity 101 can be reliably cured, and thus the connector housing 2 in which the guide holes 22a and 22b are collectively formed with the cured first resin material 10. Can be formed (see FIGS. 6 and 16).

In addition, it is preferable that the wavelength of the ultraviolet-ray in this process is 200-500 nm, and it is more preferable that it is 350-380 nm. Moreover, the exposure amount of an ultraviolet-ray is 10-200 kJ / m < ² >.
Is preferable, and it is more preferable that it is 60-120 kJ / m < ² >.

[A-6] Mold release step (fourth step)
Next, as shown in FIGS. 7 and 18, the mold 100 is released.

  Through the steps as described above, the connector 1 that can be suitably connected to the optical cable 90 can be manufactured easily and reliably.

  Further, according to this manufacturing method, the connector housing 2 having the guide holes 22a and 22b accurately positioned with respect to the optical waveguide 20 can be molded together with the formation of the guide holes 22a and 22b. Therefore, for example, the connector 1 can be manufactured more easily than the conventional manufacturing method in which the guide hole is processed and formed after the connector housing is formed. In this manufacturing method, the position accuracy of the guide hole is usually within an error range of 10 μm or more, and the accuracy is improved as compared with the conventional manufacturing method.

  Moreover, in this manufacturing method, the grinding | polishing process with respect to the one end surface 21 of the connector housing 2 can be abbreviate | omitted.

Second Embodiment
20 and 22 are longitudinal cross-sectional views for sequentially explaining the respective steps in the connector manufacturing method (second embodiment) of the present invention.

  Hereinafter, the second embodiment of the connector manufacturing method of the present invention will be described with reference to these drawings. However, the difference from the above-described embodiment will be mainly described, and the description of the same matters will be omitted.

  This embodiment is the same as the first embodiment except that the order of some steps is different. That is, the manufacturing method in this embodiment is the same as that of the said 1st Embodiment except the order of a filling process and an insertion process changing.

  The manufacturing method in the present embodiment goes through the same steps as the [A-1] preparation step of the manufacturing method in the first embodiment, and then [B-2] a filling step (first step), [B-3] After an insertion step (second step), finally, [A-4] positioning step and [A-5] curing step (third step) of the manufacturing method in the first embodiment. ) And [A-6] each step similar to the mold release step (fourth step). Through such steps, the connector 1 that can be suitably connected to the optical cable 90 can be easily and reliably manufactured.

  Here, the [B-2] filling step and the [B-3] insertion step will be described.

[B-2] Filling Step As shown in FIG. 14, the liquid first resin material 10 is filled from the gate 102 of the mold 100. As a result, the cavity 101 is reliably filled with the first resin material 10. Note that the optical waveguide 20 has not yet been inserted into the cavity 101.

[B-3] Insertion Step Next, as shown in FIG. 15, one end of the optical waveguide 20 with the support plates 5 a and 5 b in contact with each other is inserted into the cavity 101 of the mold 100. The insertion depth at this time is until the one end surface 203 of the optical waveguide 20 abuts against the other end surface 108 of the bottom 107 of the mold 100.

  At this time, the optical waveguide 20 is disposed on the central portion of the mold 100 (cavity 101), that is, on the central axis of the mold 100.

  Then, the connector 1 is obtained by passing through [A-4] positioning process, [A-5] hardening process, and [A-6] mold release process in order.

<Third Embodiment>
FIG. 24 is a longitudinal sectional view for explaining one step in the method for manufacturing a connector of the present invention (third embodiment).

  Hereinafter, the third embodiment of the connector manufacturing method of the present invention will be described with reference to this figure, but the description will focus on differences from the above-described embodiment, and the description of the same matters will be omitted.

  This embodiment is the same as the first embodiment except that the configuration of the connector is different. That is, in this embodiment, the connector is the same as that of the first embodiment except that the support plate is omitted.

As shown in FIG. 24, in the insertion step, the optical waveguide 20 that is not supported by the support plates 5a and 5b, that is, the optical waveguide 20 alone, and one end of the optical waveguide 20 is connected to the molding die 100 of the molding die 100. Insert into the cavity 101. The insertion depth at this time is until the one end surface 203 of the optical waveguide 20 abuts against the other end surface 108 of the bottom 107 of the mold 100.

  At the time of this insertion, the optical waveguide 20 is disposed on the central portion of the mold 100 (cavity 101), that is, on the central axis of the mold 100.

  Then, the connector 1 from which the support plates 5a and 5b are omitted is obtained by sequentially performing a filling step, a positioning step, a curing step, and a release step.

<Fourth embodiment>
FIG. 26 is a partial longitudinal sectional view for explaining one step in the method for manufacturing a connector of the present invention (fourth embodiment).

  Hereinafter, the fourth embodiment of the connector manufacturing method of the present invention will be described with reference to this drawing. However, the difference from the above-described embodiment will be mainly described, and the description of the same matters will be omitted.

  The present embodiment is the same as the first embodiment except that the configuration of the connector and the mold is different.

  As shown in FIG. 26, the mold 100 is formed by recessing three concave portions 110 on the other end surface 108 of the bottom portion 107. Each recessed part 110 is arrange | positioned in the position corresponding to the core parts 201a-201c of the optical waveguide 20, respectively, ie, facing.

  The mold 100 is configured such that when the liquid state first resin material 10 is filled from the gate 102 in the filling step, the first resin material 10 is also filled into the recesses 110. The first resin material 10 filled in each of the concave portions 110 is cured in a curing process, and becomes a lens that covers one end surfaces of the core portions 201a to 201c.

  Even when the optical waveguide 20 of the connector 1 and the optical waveguide 20 ′ of the optical cable 90 are slightly misaligned when the connector 1 is connected to the optical cable 90, the condensing effect of the lens causes a gap between the connector 1 and the optical cable 90. The light is sure to come and go.

  As mentioned above, although the manufacturing method of the connector of this invention was demonstrated about embodiment of illustration, this invention is not limited to this. Moreover, each part which comprises a connector can be substituted with the thing of the arbitrary structures which can exhibit the same function. Moreover, arbitrary components may be added.

  The connector manufacturing method of the present invention may be a combination of any two or more configurations (features) of the above-described embodiments.

  Moreover, although the number of the core parts of the optical waveguide was three in each said embodiment, it is not limited to this, For example, one, two, or four or more may be sufficient.

  In addition, in the above-described embodiments, two support plates are provided so as to be in contact with both surfaces of the optical waveguide, but the present invention is not limited to this. It may be installed.

  Further, the second resin material constituting the support plate is a resin material different from the first resin material in each of the above embodiments, but is not limited thereto, and the same material may be used.

  In addition to the resin material, a metal material such as stainless steel can be used as a constituent material of the support plate.

  In addition, each guide hole formed in the connector housing penetrates the connector housing in each of the above embodiments, but is not limited to this. For example, each guide hole is formed halfway through the connector housing. Also good.

DESCRIPTION OF SYMBOLS 1 Connector 2 Connector housing 21 One end surface 22a, 22b Guide hole 24 Other end surface 4a, 4b Guide pin 41 One end surface 5a, 5b Support plate 51 One end surface 10 1st resin material (resin material)
20, 20 'Optical waveguide 201a, 201b, 201c Core part (waveguide channel)
202a, 202b, 202c, 202d Clad part 203 One end face 204a Upper clad part 204b Lower mold clad part 30 Adhesive 90 Optical cable 901 Connector housing (housing)
902a, 902b Guide hole 100 Mold 101 First cavity 102 Pouring gate (injection port)
103 Wall (side wall)
104 One end face 105a, 105b Second cavity 106a, 106b Exhaust hole 107 Bottom part 108 Other end face 109 Opening part 110 Recessed part 400a, 400b Ultraviolet irradiation device 500 CCD (Charge Coupled Device) camera G Air Lx Predetermined distance S Reference O ₁ Center point

Claims (13)

A method of manufacturing a connector comprising a strip-shaped optical waveguide, a connector housing attached to one end of the optical waveguide, and a guide pin for positioning with the other connector when connected to the other connector There,
A bottom portion and a side wall standing from an edge of the bottom portion, and a lumen portion surrounded by the bottom portion and the side wall serves as a first cavity for molding the connector housing, and communicates with the first cavity. Then, the optical waveguide is inserted into the first cavity of the molding die in which the concave portion formed by being recessed in the bottom portion becomes the second cavity for molding the guide pin until the one end surface thereof abuts against the bottom portion. A first step of:
A second step of filling the first cavity and the second cavity in a liquid state with the resin material that becomes the connector housing and the guide pin when cured in a liquid state. ,
A third step of curing the liquid resin material and collectively molding the connector housing and the guide pin with the cured resin material;
And a fourth step of releasing the molding die. An optical waveguide having a strip shape and a connector housing mounted on one end of the optical waveguide, and a guide hole for positioning with the other connector is formed in the connector housing when connected to the other connector. A method of manufacturing a connector that includes:
A projecting portion having a bottom and a side wall provided upright from an edge of the bottom, the inner cavity surrounded by the bottom and the side wall serving as a cavity for molding the connector housing; A first step of inserting the optical waveguide into the cavity of the mold formed so as to protrude from the bottom into the cavity until one end surface of the mold hits the bottom;
A second step of filling the cavity in the liquid state with a resin material that becomes the connector housing when the liquid is uncured and cured; and
A third step of curing the liquid resin material, and molding the connector housing in which the guide hole is formed with the cured resin material;
And a fourth step of releasing the molding die. The side wall is provided with an inlet that communicates with the first cavity and injects the liquid resin material into the first cavity.
The connector manufacturing method according to claim 1, wherein in the second step, the liquid resin material is filled through the injection port. The connector is provided with a support plate that contacts at least one surface of one end of the optical waveguide and supports the one end.
4. The method according to claim 1, wherein when the optical waveguide is inserted into the first cavity in the first step, the insertion is performed while the support plate is in contact with one end of the optical waveguide. The manufacturing method of the connector as described in claim | item.   The connector according to claim 4, wherein a width of the support plate is larger than a width of the optical waveguide. A method of manufacturing a connector comprising a strip-shaped optical waveguide, a connector housing attached to one end of the optical waveguide, and a guide pin for positioning with the other connector when connected to the other connector There,
A bottom portion and a side wall standing from an edge of the bottom portion, and a lumen portion surrounded by the bottom portion and the side wall serves as a first cavity for molding the connector housing, and communicates with the first cavity. The recess formed by recessing the bottom portion forms an uncured liquid in the first cavity and the second cavity of the molding die that becomes the second cavity for molding the guide pin. A first step of filling the resin material that becomes the connector housing and the guide pin in the liquid state when cured;
A second step of inserting the optical waveguide into the first cavity until one end face thereof abuts against the bottom;
A third step of curing the liquid resin material and collectively molding the connector housing and the guide pin with the cured resin material;
And a fourth step of releasing the molding die. An optical waveguide having a strip shape and a connector housing mounted on one end of the optical waveguide, and a guide hole for positioning with the other connector is formed in the connector housing when connected to the other connector. A method of manufacturing a connector that includes:
A projecting portion having a bottom and a side wall provided upright from an edge of the bottom, the inner cavity surrounded by the bottom and the side wall serving as a cavity for molding the connector housing; Is filled in the liquid state with the resin material that becomes the connector housing when cured in the cavity of the molding die formed to protrude from the bottom portion into the cavity. And the process of
A second step of inserting the optical waveguide into the cavity until one end surface thereof abuts against the bottom;
A third step of curing the liquid resin material, and molding the connector housing in which the guide hole is formed with the cured resin material;
And a fourth step of releasing the molding die. The side wall is provided with an inlet that communicates with the first cavity and injects the liquid resin material into the first cavity.
The manufacturing method of the connector according to claim 6 or 7, wherein in the first step, the liquid resin material is filled through the injection port. The connector is provided with a support plate that contacts at least one surface of one end of the optical waveguide and supports the one end.
9. The method according to claim 6, wherein when the optical waveguide is inserted into the first cavity in the second step, the support plate is inserted while being in contact with one end of the optical waveguide. The manufacturing method of the connector as described in claim | item.   The connector according to claim 9, wherein a width of the support plate is larger than a width of the optical waveguide. The optical waveguide has at least one core part,
11. The method of manufacturing a connector according to claim 1, wherein prior to the third step, the optical waveguide and the second cavity are positioned with respect to the core portion as a reference.   The method for manufacturing a connector according to claim 1, wherein the resin material is cured by irradiating ultraviolet rays. In the connector, the optical waveguide has at least one core portion, and further includes a lens that covers one end surface of the core portion,
The method for manufacturing a connector according to claim 1, wherein the mold has a recess for forming the lens.