JP2013026307A - Heat sink - Google Patents

Heat sink Download PDF

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JP2013026307A
JP2013026307A JP2011157565A JP2011157565A JP2013026307A JP 2013026307 A JP2013026307 A JP 2013026307A JP 2011157565 A JP2011157565 A JP 2011157565A JP 2011157565 A JP2011157565 A JP 2011157565A JP 2013026307 A JP2013026307 A JP 2013026307A
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heat
water
cooling jacket
locking
heat receiving
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Norio Mizuguchi
憲男 水口
Koji Yamada
浩司 山田
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Nasco Fitting Co Ltd
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Nasco Fitting Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To improve cooling efficiency without deteriorating the attachment/detachment workability of a water cooling jacket.SOLUTION: A heat sink A includes: a water cooling jacket 10 having a water passage 17 of a coolant; a base member 30 provided in the vicinity of a CPU 51 (heating member) and enabling the attachment/detachment of the water cooling jacket 10; a heat receiving plate 35 (heat receiving part) forming a heat transmission path 49 for transmitting heat received from the CPU to the coolant in the water passage 17; and holding means 45 holding the heat receiving plate 35 in the state that contacts with the CPU 51.

Description

本発明は、ヒートシンクに関するものである。   The present invention relates to a heat sink.

特許文献1には、水冷タイプのヒートシンクが開示されている。このヒートシンクは、ガイドレールに案内されることにより、並列配置された複数の電子機器の隙間に挿入するように設けられており、ガイドレールに沿って電子機器の間から抜き取ることができるようになっている。   Patent Document 1 discloses a water-cooled heat sink. The heat sink is provided so as to be inserted into a gap between a plurality of electronic devices arranged in parallel by being guided by the guide rail, and can be extracted from between the electronic devices along the guide rail. ing.

特開2008−53348号公報JP 2008-53348 A

上記のヒートシンクは、ヒートシンクを着脱する際の摺動抵抗に起因する作業性低下を回避するために、ヒートシンクと電子機器との間に隙間が空くようになっているのであるが、このような隙間が空くと、電子機器からヒートシンクへの熱伝達効率が悪いという問題がある。
本発明は上記のような事情に基づいて完成されたものであって、水冷ジャケットの着脱作業性を低下させずに、冷却効率の向上を図ることを目的とする。
The above heat sink has a gap between the heat sink and the electronic device in order to avoid a decrease in workability due to sliding resistance when the heat sink is attached / detached. If there is a gap, there is a problem that the heat transfer efficiency from the electronic device to the heat sink is poor.
The present invention has been completed based on the above-described circumstances, and an object thereof is to improve the cooling efficiency without deteriorating the detachability workability of the water cooling jacket.

上記の目的を達成するための手段として、請求項1の発明は、冷却水の水路を有する水冷ジャケットと、発熱部材の近傍に設けられ、前記水冷ジャケットの着脱を可能としたベース部材と、発熱部材から受けた熱を前記水路内の冷却水に伝達するための熱伝達経路を構成する受熱部と、前記受熱部を発熱部材に当接した状態に保持する保持手段とを備えているところに特徴を有する。   As means for achieving the above-mentioned object, the invention of claim 1 includes a water-cooling jacket having a cooling water channel, a base member provided in the vicinity of the heat-generating member and capable of attaching and detaching the water-cooling jacket, and heat generation. A heat receiving portion that constitutes a heat transfer path for transferring heat received from the member to the cooling water in the water passage, and a holding means for holding the heat receiving portion in contact with the heat generating member. Has characteristics.

請求項2の発明は、請求項1に記載のものにおいて、前記保持手段は、前記受熱部を発熱部材に当接する方向へ付勢する当接バネを備えて構成されているところに特徴を有する。   The invention of claim 2 is characterized in that, in the invention of claim 1, the holding means is configured to include a contact spring that urges the heat receiving portion in a direction to contact the heat generating member. .

請求項3の発明は、請求項1または請求項2に記載のものにおいて、前記受熱部が前記ベース部材に設けられ、前記ベース部材は、前記水冷ジャケットに係止して前記水冷ジャケットを装着状態に保持する係止状態と、前記水冷ジャケットに対する係止を解除する解除状態との間で変位可能な係止部材と、前記係止部材を係止方向へ付勢するとともに、前記係止部材を介して前記水冷ジャケットを前記受熱部に当接する方向へ付勢する兼用バネとを備えているところに特徴を有する。   According to a third aspect of the present invention, the heat receiving portion is provided in the base member according to the first or second aspect, and the base member is engaged with the water cooling jacket and the water cooling jacket is mounted. A latching member that is displaceable between a latching state that is held in a locking state and a unlocking state that unlocks the water-cooling jacket, and the latching member is biased in the latching direction, and the latching member is And a dual-purpose spring that urges the water-cooling jacket in a direction to contact the heat receiving portion.

請求項4の発明は、請求項1ないし請求項3のいずれかに記載のものにおいて、空冷用のフィンを備えているところに特徴を有する。   The invention of claim 4 is characterized in that in any one of claims 1 to 3, a fin for air cooling is provided.

<請求項1の発明>
水冷ジャケットをベース部材に取り付け、保持手段によって受熱部を発熱部材に当接させると、発熱部材から発せられた熱は、直接、受熱部に伝達され、熱伝達経路を通って水冷ジャケット内の冷却水に伝達される。受熱部を発熱部材に直接、接触させたので、受熱部と発熱部材との間に隙間が介在する場合に比べると、冷却効率が良い。
<Invention of Claim 1>
When the water cooling jacket is attached to the base member and the heat receiving part is brought into contact with the heat generating member by the holding means, the heat generated from the heat generating member is directly transmitted to the heat receiving part and is cooled in the water cooling jacket through the heat transfer path. Transmitted to water. Since the heat receiving part is brought into direct contact with the heat generating member, the cooling efficiency is better than when a gap is interposed between the heat receiving part and the heat generating member.

<請求項2の発明>
受熱部を当接バネによって発熱部材に当接する方向へ付勢しているので、各部材の熱膨張や寸法公差を吸収して、受熱部を発熱部材に確実に当接させることができる。
<Invention of Claim 2>
Since the heat receiving portion is urged by the contact spring in the direction of contacting the heat generating member, the thermal expansion and dimensional tolerance of each member can be absorbed and the heat receiving portion can be reliably brought into contact with the heat generating member.

<請求項3の発明>
兼用バネは、係止部材を係止方向へ付勢して水冷ジャケットを装着状態に保持する機能と、水冷ジャケットを受熱部に当接させて冷却効率を高める機能とを兼ね備えているので、両機能を別々のバネで発揮させる場合に比べると、部品点数が少なくてすむ。
<Invention of Claim 3>
The dual-purpose spring has both the function of urging the locking member in the locking direction to hold the water-cooling jacket in the mounted state and the function of bringing the water-cooling jacket into contact with the heat receiving part to increase the cooling efficiency. Compared to the case where the function is performed by separate springs, the number of parts can be reduced.

<請求項4の発明>
空冷用のフィンを備えているので、万一、冷却水による冷却機能に支障が生じても、冷却機能の大幅な低下を回避できる。
<Invention of Claim 4>
Since the air-cooling fins are provided, even if the cooling function by the cooling water is obstructed, a significant decrease in the cooling function can be avoided.

実施形態1のヒートシンクを回路基板に取り付けた状態をあらわす断面図Sectional drawing showing the state which attached the heat sink of Embodiment 1 to the circuit board ヒートシンクの断面図Cross section of heat sink ベース部材の一部切欠平面図Partial cutaway plan view of the base member ベース部材の一部切欠底面図Partial cutaway bottom view of base member 水冷ジャケットの平面図Top view of water cooling jacket 伝熱板を外した状態の水冷ジャケットの底面図Bottom view of water cooling jacket with heat transfer plate removed 水冷ジャケットの断面図Cross section of water cooling jacket 実施形態2のヒートシンクを回路基板に取り付けた状態をあらわす断面図Sectional drawing showing the state which attached the heat sink of Embodiment 2 to the circuit board ヒートシンクの断面図Cross section of heat sink ベース部材の平面図Top view of base member 水冷ジャケットの平面図Top view of water cooling jacket 受熱板の平面図Top view of heat receiving plate ベース部材に水冷ジャケットを係止した状態をあらわす断面図Sectional view showing the water cooling jacket locked to the base member ベース部材に対する水冷ジャケットの係止を解除した状態をあらわす断面図Sectional drawing which shows the state which the latching of the water cooling jacket with respect to the base member was cancelled | released

<実施形態1>
以下、本発明を具体化した実施形態1を図1〜図7を参照して説明する。本実施形態1のヒートシンクAは、水平に配置した回路基板50に取り付けられ、回路基板50の上面に実装したCPU51(本発明の構成要件である発熱部材)を冷却するためのものである。CPU51の上面は、回路基板50と平行な放熱面52となっており、ヒートシンクAは、この放熱面52の熱を奪って冷却を行う。
<Embodiment 1>
A first embodiment of the present invention will be described below with reference to FIGS. The heat sink A according to the first embodiment is attached to a horizontally arranged circuit board 50 and is for cooling a CPU 51 (a heat generating member which is a constituent element of the present invention) mounted on the upper surface of the circuit board 50. The upper surface of the CPU 51 is a heat radiating surface 52 parallel to the circuit board 50, and the heat sink A cools by taking heat from the heat radiating surface 52.

ヒートシンクAは、内部に冷却水の水路17を有する水冷ジャケット10と、CPU51の近傍に設けられ、水冷ジャケット10の着脱を可能としたベース部材30と、CPU51から受けた熱を水路17内の冷却水に伝達するための熱伝達経路49を構成する受熱板35(本発明の構成要件である受熱部)と、受熱板35をCPU51に当接した状態に保持する保持手段45とを備えている。   The heat sink A is provided in the vicinity of the CPU 51 with the water cooling jacket 10 having a cooling water passage 17 therein, a base member 30 that allows the water cooling jacket 10 to be attached and detached, and the heat received from the CPU 51 is cooled in the water passage 17. A heat receiving plate 35 (a heat receiving portion which is a constituent element of the present invention) constituting a heat transfer path 49 for transferring to water, and a holding means 45 for holding the heat receiving plate 35 in contact with the CPU 51 are provided. .

水冷ジャケット10は、熱伝導率の高い金属材料からなるジャケット本体11と、熱伝導率の高い金属材料からなり、ジャケット本体11に対しその下面全体を覆うように固定された伝熱板16(本発明の構成要件である熱伝達経路49)とを備えている。ジャケット本体11の後端縁部は、肉厚の基部12となっており、ジャケット本体11のうち基部12よりも前方の広い領域は、肉薄のカード状をなす吸熱部13となっている。   The water cooling jacket 10 includes a jacket main body 11 made of a metal material having a high thermal conductivity and a heat transfer plate 16 made of a metal material having a high thermal conductivity and fixed to the jacket main body 11 so as to cover the entire lower surface of the jacket main body 11. And a heat transfer path 49) which is a constituent element of the invention. A rear end edge portion of the jacket main body 11 is a thick base portion 12, and a wide area in front of the base portion 12 of the jacket main body 11 is a heat absorbing portion 13 having a thin card shape.

基部12の内部には、基部12の後面に開口する左右一対の接続孔14が形成され、各接続孔14には、軸線を前後方向(回路基板50及び放熱面52と略平行な方向)に向けたプラグ15が液密状に取り付けられている。一対のプラグ15には、冷却水を循環させるための冷却水循環装置(図示省略)から延ばしたホース(図示省略)が接続されるようになっている。   A pair of left and right connection holes 14 that open to the rear surface of the base 12 are formed inside the base 12, and the axis of each connection hole 14 extends in the front-rear direction (a direction substantially parallel to the circuit board 50 and the heat dissipation surface 52). A plug 15 is attached in a liquid-tight manner. The pair of plugs 15 are connected to hoses (not shown) extended from a cooling water circulation device (not shown) for circulating the cooling water.

吸熱部13内には、ジャケット本体11の下面を溝状に切欠することによって九十九折り状に屈曲した形態であって、伝熱板16で液密状に閉塞された1本の水路17が形成されている。水路17の両端は、連通孔18を介して一対の接続孔14に連通している。一方のプラグ15から流入した冷却水は、一方の接続孔14、一方の連通孔18、水路17、他方の連通孔18、他方の接続孔14を順に通り、他方のプラグ15から水冷ジャケット10外へ流出する。伝熱板16は水路17に直接臨んでいるので、冷却水は、伝熱板16の上面に接触しながら水路17を通過する。水路17を通過する間に、冷却水は、伝熱板16から熱を奪う。   In the heat absorbing portion 13, a single water channel 17 is formed in a shape that is bent into a ninety-nine fold shape by notching the lower surface of the jacket body 11 into a groove shape, and is closed in a liquid-tight manner by the heat transfer plate 16. Is formed. Both ends of the water channel 17 communicate with the pair of connection holes 14 via the communication holes 18. The cooling water flowing in from one plug 15 sequentially passes through one connection hole 14, one communication hole 18, a water channel 17, the other communication hole 18, and the other connection hole 14, and from the other plug 15 to the outside of the water cooling jacket 10. Spill to Since the heat transfer plate 16 directly faces the water channel 17, the cooling water passes through the water channel 17 while being in contact with the upper surface of the heat transfer plate 16. While passing through the water channel 17, the cooling water takes heat from the heat transfer plate 16.

ジャケット本体11には、吸熱部13の後端部上面を浅く凹ませた形態の係止凹部19が形成されている。基部12には、前後方向に相対変位可能な操作部材20が貫通して設けられている。操作部材20の前端部には、略L字形に屈曲した板状をなす解除部材21が固定され、解除部材21の前端部が係止凹部19内に収容されている。解除部材21は、通常は、退避バネ22の付勢により係止凹部19の後端部へ退避した状態に保持されている。   The jacket main body 11 is formed with a locking recess 19 in which the upper surface of the rear end portion of the heat absorbing portion 13 is shallowly recessed. An operating member 20 that can be relatively displaced in the front-rear direction is provided through the base 12. A release member 21 having a plate shape bent in a substantially L shape is fixed to the front end portion of the operation member 20, and the front end portion of the release member 21 is accommodated in the locking recess 19. The release member 21 is normally held in a state of being retracted to the rear end portion of the locking recess 19 by urging of the retracting spring 22.

ベース部材30は、ハウジング31と、ハウジング31を回路基板50に対し上下方向(回路基板50の板面と略直角な方向)へ変位し得るように取り付けるための4組の保持手段45とを備えている。ハウジング31は、熱伝導率の高い金属材料からなり回路基板50と略平行をなす方形のフレーム32と、フレーム32の中央に形成した方形の貫通形態の取付孔33を上から覆い隠すようにフレーム32に取り付けたカバー34と、熱伝導率の高い金属材料からなり取付孔33を下面側から塞ぐようにフレーム32に取り付けた受熱板35とから構成される。受熱板35の下面は、フレーム32の下面よりも下方へ突出している。   The base member 30 includes a housing 31 and four sets of holding means 45 for attaching the housing 31 to the circuit board 50 so that the housing 31 can be displaced in a vertical direction (a direction substantially perpendicular to the plate surface of the circuit board 50). ing. The housing 31 is made of a metal material having a high thermal conductivity so as to cover a rectangular frame 32 substantially parallel to the circuit board 50 and a rectangular through hole mounting hole 33 formed at the center of the frame 32 from above. And a heat receiving plate 35 made of a metal material having a high thermal conductivity and attached to the frame 32 so as to close the attachment hole 33 from the lower surface side. The lower surface of the heat receiving plate 35 protrudes downward from the lower surface of the frame 32.

フレーム32の上面側には、カバー34と受熱板35とで囲まれて、後面側のみにおいて横長のスリット状に開口する収容空間36が形成されている。収容空間36の下面壁は、受熱板35で構成され、受熱板35の上面が収容空間36内に臨んでいる。収容空間36内の後端部には、前後方向へのスライドが可能な押圧部材37が収容されている。押圧部材37は、戻しバネ38により後方へ付勢されている。   On the upper surface side of the frame 32, an accommodation space 36 that is surrounded by the cover 34 and the heat receiving plate 35 and opens in a horizontally long slit shape only on the rear surface side is formed. The lower surface wall of the accommodation space 36 is constituted by a heat receiving plate 35, and the upper surface of the heat receiving plate 35 faces the accommodation space 36. A pressing member 37 capable of sliding in the front-rear direction is accommodated at the rear end portion in the accommodation space 36. The pressing member 37 is urged rearward by a return spring 38.

収容空間36の内部には、前端部の揺動軸39を支点として上下方向への揺動を可能に支持された板状をなす係止部材40が収容されている。係止部材40の後端縁よりも少し前方の位置には、下方へ突出する係止突起41が形成されている。係止部材40には、係止突起41の下端縁から係止部材40の前端縁に向かって斜め上後方へ延びた傾斜面42が形成されている。傾斜面42は、前後方向(ベース部材30に対する水冷ジャケット10の着脱方向)及び上下方向(係止部材40の揺動方向)の両方向に対して傾斜している。係止部材40の揺動範囲は、係止部材40の前端縁部がカバー34の天井面に当たる最上端位置(解除状態)と、ストッパピン43に当接する最下端位置(係止状態)との間となっている。係止部材40は、通常は、係止部材40の上面とカバー34の天井面との間に設けた兼用バネ44により、最下端位置に保持されている。   Inside the accommodation space 36 is housed a plate-like locking member 40 supported so as to be able to swing in the vertical direction with the swing shaft 39 at the front end as a fulcrum. A locking projection 41 that protrudes downward is formed at a position slightly ahead of the rear end edge of the locking member 40. The locking member 40 is formed with an inclined surface 42 extending obliquely upward and rearward from the lower end edge of the locking protrusion 41 toward the front end edge of the locking member 40. The inclined surface 42 is inclined with respect to both the front-rear direction (the direction in which the water cooling jacket 10 is attached to and detached from the base member 30) and the up-down direction (the swinging direction of the locking member 40). The rocking range of the locking member 40 includes the uppermost position (released state) where the front edge of the locking member 40 hits the ceiling surface of the cover 34 and the lowermost position (locked state) where the stopper member 43 abuts. It is between. The locking member 40 is normally held at the lowermost position by a combined spring 44 provided between the upper surface of the locking member 40 and the ceiling surface of the cover 34.

保持手段45は、フレーム32の四隅を下向きに貫通するビス46と、フレーム32の下方においてビスに螺合された筒状のスペーサ47と、フレーム32の上面とビスの頭部との間に装着された圧縮コイルバネからなる当接バネ48とから構成される。ベース部材30を回路基板50から外した状態では、フレーム32が、当接バネ48の付勢によりスペーサ47の上端面に押し付けられた状態に保持されている。   The holding means 45 is mounted between a screw 46 that passes downward through the four corners of the frame 32, a cylindrical spacer 47 that is screwed to the screw below the frame 32, and the upper surface of the frame 32 and the screw head. And a contact spring 48 made of a compression coil spring. When the base member 30 is removed from the circuit board 50, the frame 32 is held in a state of being pressed against the upper end surface of the spacer 47 by the urging force of the contact spring 48.

ヒートシンクAを回路基板50に取り付ける際には、CPU51を上から覆うようにベース部材30を配置し、ビス46を回路基板50の所定位置にねじ込んで、スペーサ47の下端を回路基板50の上面に当接させる。ここで、スペーサ47の高さは、回路基板50の上面を基準とするCPU51の放熱面52(上面)の高さよりも低く、しかも、受熱板35はフレーム32の下面よりも下方へ突出している。したがって、受熱板35の下面がCPU51の放熱面52に当接し、フレーム32は、当接バネ48を弾性変形させた状態でスペーサ47の上面よりも上方に配置される。この当接バネ48の弾性復元力により、受熱板35の下面が、放熱面52に対し弾性的に押圧された状態で面接触する。   When the heat sink A is attached to the circuit board 50, the base member 30 is disposed so as to cover the CPU 51 from above, the screw 46 is screwed into a predetermined position of the circuit board 50, and the lower end of the spacer 47 is placed on the upper surface of the circuit board 50. Make contact. Here, the height of the spacer 47 is lower than the height of the heat radiation surface 52 (upper surface) of the CPU 51 with respect to the upper surface of the circuit board 50, and the heat receiving plate 35 projects downward from the lower surface of the frame 32. . Therefore, the lower surface of the heat receiving plate 35 contacts the heat radiating surface 52 of the CPU 51, and the frame 32 is disposed above the upper surface of the spacer 47 in a state where the contact spring 48 is elastically deformed. Due to the elastic restoring force of the contact spring 48, the lower surface of the heat receiving plate 35 comes into surface contact with the heat radiating surface 52 while being elastically pressed.

ベース部材30を回路基板50に取り付けた状態で、水冷ジャケット10のカード状をなす吸熱部13を収容空間36内に挿入する。挿入過程では、吸熱部13の前端縁が、兼用バネ44の付勢に抗して係止部材40の前端部を押し上げるので、係止部材40は解除状態へ変位する。また、挿入過程の終期では、吸熱部13の前端縁が押圧部材37を戻しバネ38の付勢に抗して前方(収容空間36の奥方)へ押し動かす。   With the base member 30 attached to the circuit board 50, the heat-absorbing part 13 having a card shape of the water-cooling jacket 10 is inserted into the accommodation space 36. In the insertion process, the front end edge of the heat absorbing portion 13 pushes up the front end portion of the locking member 40 against the bias of the dual purpose spring 44, so that the locking member 40 is displaced to the released state. At the end of the insertion process, the front end edge of the heat absorbing portion 13 pushes the pressing member 37 forward (backward of the accommodation space 36) against the biasing force of the return spring 38.

そして、水冷ジャケット10が正規の挿入状態に至ると、係止部材40が下方の係止状態へ弾性復帰して係止突起41が係止凹部19の前端内壁に係止し、この係止作用により、水冷ジャケット10がベース部材30に対して後方への抜けを規制された状態にロックされる。このとき、兼用バネ44は、係止凹部19に対する係止突起41の係止代を増す方向へ付勢している。また、戻しバネ38は、係止突起41を係止凹部19の前端内壁に押し付けて両者の摩擦抵抗を増す方向へ付勢する。水冷ジャケット10が正しくベース部材30に取りつけられた状態では、係止突起41が、兼用バネ44の付勢により吸熱部13を下方へ弾性的に押圧するので、伝熱板16の下面が受熱板35の上面に対して弾性的に面接触した状態に保持される。   Then, when the water cooling jacket 10 reaches the normal insertion state, the locking member 40 is elastically returned to the lower locking state, and the locking projection 41 is locked to the inner wall of the front end of the locking recess 19. As a result, the water cooling jacket 10 is locked in a state in which the backward cooling with respect to the base member 30 is restricted. At this time, the dual purpose spring 44 is biased in the direction of increasing the locking allowance of the locking projection 41 with respect to the locking recess 19. Further, the return spring 38 presses the locking projection 41 against the inner wall of the front end of the locking recess 19 and urges the both in the direction of increasing the frictional resistance between them. When the water cooling jacket 10 is correctly attached to the base member 30, the locking protrusion 41 elastically presses the heat absorbing portion 13 downward by the bias of the dual purpose spring 44, so that the lower surface of the heat transfer plate 16 is the heat receiving plate. The upper surface of 35 is held in a state of being in elastic surface contact.

このように水冷ジャケット10をベース部材30に取り付けた状態では、CPU51で発生した熱は、受熱板35と伝熱板16を介して水路17内の冷却水に伝達される。この間、熱を奪った冷却水が水冷ジャケット10外へ流出するとともに、低温の冷却水が水冷ジャケット10内に流入するので、CPU51が効果的に冷却される。   In this state where the water cooling jacket 10 is attached to the base member 30, the heat generated by the CPU 51 is transmitted to the cooling water in the water passage 17 through the heat receiving plate 35 and the heat transfer plate 16. During this time, the cooling water that has deprived of heat flows out of the water cooling jacket 10 and low-temperature cooling water flows into the water cooling jacket 10, so that the CPU 51 is effectively cooled.

回路基板50のメンテナンスや交換等のために、CPU51の冷却を一時的に中断する際には、水冷ジャケット10をベース部材30から外す。このとき、操作部材20を後方へ押し込むと、解除部材21が係止部材40の傾斜面42を押して、係止部材40を押し上げるので、係止突起41と係止凹部19との係止状態が解除される。これに伴い、水冷ジャケット10が、戻しバネ38の付勢により後方へ押されるので、収容空間36外へ排出される。この後は、基部12を掴んで、水冷ジャケット10を収容空間36外へ引き抜けばよい。   When the cooling of the CPU 51 is temporarily interrupted for maintenance or replacement of the circuit board 50, the water cooling jacket 10 is removed from the base member 30. At this time, when the operation member 20 is pushed backward, the release member 21 pushes the inclined surface 42 of the locking member 40 and pushes up the locking member 40, so that the locking state between the locking protrusion 41 and the locking recess 19 is established. Canceled. Along with this, the water cooling jacket 10 is pushed rearward by the biasing force of the return spring 38, so that it is discharged out of the accommodation space 36. Thereafter, the base 12 may be grasped and the water cooling jacket 10 may be pulled out of the accommodation space 36.

本実施形態1のヒートシンクAは、水冷ジャケット10をベース部材30に取り付け、保持手段45によって受熱板35をCPU51に当接させると、CPU51から発せられた熱は、直接、受熱板35に伝達され、熱伝達経路49(受熱板35と伝熱板16)を通って水冷ジャケット10内の冷却水に伝達される。受熱板35をCPU51に直接、接触させたので、受熱板35とCPU51との間に隙間(空気)が介在する場合に比べると、冷却効率が良い。このように、本実施形態によれば、水冷ジャケット10の着脱作業性を低下させずに、冷却効率の向上を図ることができる。   In the heat sink A of the first embodiment, when the water cooling jacket 10 is attached to the base member 30 and the heat receiving plate 35 is brought into contact with the CPU 51 by the holding means 45, the heat generated from the CPU 51 is directly transmitted to the heat receiving plate 35. The heat transfer path 49 (the heat receiving plate 35 and the heat transfer plate 16) is transmitted to the cooling water in the water cooling jacket 10. Since the heat receiving plate 35 is brought into direct contact with the CPU 51, the cooling efficiency is better than when a gap (air) is interposed between the heat receiving plate 35 and the CPU 51. Thus, according to the present embodiment, it is possible to improve the cooling efficiency without deteriorating the detachability workability of the water cooling jacket 10.

また、保持手段45は、受熱板35をCPU51に当接する方向へ付勢する当接バネ48を備えて構成されているので、各部材の熱膨張や寸法公差を吸収して、受熱板35をCPU51に確実に当接させることができる。   Further, since the holding means 45 includes a contact spring 48 that urges the heat receiving plate 35 in the direction in which the heat receiving plate 35 contacts the CPU 51, the holding means 45 absorbs thermal expansion and dimensional tolerance of each member to The CPU 51 can be surely brought into contact.

また、受熱板35がベース部材30に設けられ、ベース部材30は、水冷ジャケット10に係止して水冷ジャケット10を装着状態に保持する係止状態と、水冷ジャケット10に対する係止を解除する解除状態との間で変位可能な係止部材40と、係止部材40を係止方向へ付勢するとともに、係止部材40を介して水冷ジャケット10を受熱板35に当接する方向へ付勢する兼用バネ44とを備えている。兼用バネ44は、係止部材40を係止方向へ付勢して水冷ジャケット10を装着状態に保持する機能と、水冷ジャケット10を受熱板35に当接させて冷却効率を高める機能とを兼ね備えているので、両機能を別々のバネで発揮させる場合に比べると、部品点数が少なくて済む。   In addition, a heat receiving plate 35 is provided on the base member 30, and the base member 30 is engaged with the water cooling jacket 10 to hold the water cooling jacket 10 in the mounted state, and is released to release the engagement with the water cooling jacket 10. The locking member 40 that is displaceable between the states and the locking member 40 are biased in the locking direction, and the water cooling jacket 10 is biased in the direction of contacting the heat receiving plate 35 via the locking member 40. A dual-purpose spring 44 is provided. The combined spring 44 has a function of urging the locking member 40 in the locking direction to hold the water cooling jacket 10 in a mounted state, and a function of bringing the water cooling jacket 10 into contact with the heat receiving plate 35 to increase the cooling efficiency. Therefore, the number of parts can be reduced compared to the case where both functions are exhibited by separate springs.

<実施形態2>
次に、本発明を具体化した実施形態2を図8〜図14を参照して説明する。本実施形態2のヒートシンクBは、水平に配置した回路基板50に取り付けられ、回路基板50の上面に実装したCPU51(本発明の構成要件である発熱部材)を冷却するためのものである。CPU51の上面は、回路基板50と平行な放熱面52となっており、ヒートシンクBは、この放熱面52の熱を奪って冷却を行う。
<Embodiment 2>
Next, a second embodiment of the present invention will be described with reference to FIGS. The heat sink B according to the second embodiment is attached to a horizontally arranged circuit board 50 and is for cooling a CPU 51 (a heat generating member which is a constituent element of the present invention) mounted on the upper surface of the circuit board 50. The upper surface of the CPU 51 is a heat radiating surface 52 parallel to the circuit board 50, and the heat sink B cools by taking heat from the heat radiating surface 52.

ヒートシンクBは、内部に冷却水の水路67を有す水冷ジャケット60と、CPU51の近傍に設けられ、水冷ジャケット60の着脱を可能としたベース部材80と、CPU51から受けた熱を水路67内の冷却水に伝達するための熱伝達経路79を構成する受熱板65(本発明の構成要件である受熱部)と、受熱板65をCPU51に当接した状態に保持する保持手段70とを備えている。   The heat sink B is provided in the vicinity of the CPU 51 with a water cooling jacket 60 having a cooling water channel 67 therein, a base member 80 that allows the water cooling jacket 60 to be attached and detached, and heat received from the CPU 51 in the water channel 67. A heat receiving plate 65 (a heat receiving portion which is a constituent element of the present invention) constituting a heat transfer path 79 for transferring to the cooling water, and a holding means 70 for holding the heat receiving plate 65 in a state in contact with the CPU 51 are provided. Yes.

水冷ジャケット60は、熱伝導率の高い金属材料からなるジャケット本体61と、熱伝導率の高い金属材料からなり、ジャケット本体61に対しその下面のほぼ全体を覆うように固定された略方形の受熱板65とを備えている。ジャケット本体61には、その上面に開口する左右一対の接続孔62が形成され、各接続孔62には、軸線を上下方向(回路基板50及び放熱面52と略直角な方向)に向けたプラグ63が液密状に取り付けられている。一対のプラグ63には、冷却水を循環させるための冷却水循環装置(図示省略)から延ばしたホース(図示省略)が接続されるようになっている。   The water cooling jacket 60 includes a jacket body 61 made of a metal material having a high thermal conductivity and a substantially square heat receiving member made of a metal material having a high thermal conductivity and fixed to the jacket body 61 so as to cover almost the entire lower surface thereof. And a plate 65. The jacket body 61 is formed with a pair of left and right connection holes 62 opened on the upper surface thereof. Each connection hole 62 has a plug whose axis is directed in the vertical direction (a direction substantially perpendicular to the circuit board 50 and the heat radiation surface 52). 63 is attached in a liquid-tight manner. The pair of plugs 63 are connected to hoses (not shown) extending from a cooling water circulation device (not shown) for circulating the cooling water.

ジャケット本体61には、その下面を略方形に浅く凹ませた形態の収容凹部64が形成されている。上記一対の接続孔62は、収容凹部64の天井面における左右両端部に連通している。この収容凹部64は、受熱板65によって液密状に閉塞されている。受熱板65の上面には、左右方向に細長い板状に突出した形態の複数のリブ66が、前後方向に一定ピッチで形成されており、この複数のリブ66が収容凹部64内に収容されている。左右方向におけるリブ66の形成範囲は、収容凹部64の左右両端部を除いた領域であり、リブ66の上端縁が収容凹部64の天井面に対して当接又は、接近して対向している。このリブ66により、受熱板65で閉塞された収容凹部64内には、左右方向(一対のプラグ63を結ぶ方向)に貫通して前後方向に並列配置された複数の貫通流路68から構成される水路67が形成されている。   The jacket main body 61 is formed with an accommodation recess 64 having a lower surface that is shallowly recessed in a substantially square shape. The pair of connection holes 62 communicate with both left and right ends of the ceiling surface of the housing recess 64. The housing recess 64 is liquid-tightly closed by the heat receiving plate 65. On the upper surface of the heat receiving plate 65, a plurality of ribs 66 are formed at a constant pitch in the front-rear direction and project in a shape that is elongated in the left-right direction, and the plurality of ribs 66 are accommodated in the accommodation recess 64. Yes. The formation range of the rib 66 in the left-right direction is a region excluding the left and right ends of the housing recess 64, and the upper edge of the rib 66 is in contact with or close to the ceiling surface of the housing recess 64. . By the rib 66, the housing recess 64 closed by the heat receiving plate 65 is constituted by a plurality of through passages 68 penetrating in the left-right direction (direction connecting the pair of plugs 63) and arranged in parallel in the front-rear direction. A water channel 67 is formed.

一方のプラグ63から流入した冷却水は、一方の接続孔62、複数の貫通流路68、他方の接続孔62を順に通り、他方のプラグ63から水冷ジャケット60外へ流出する。受熱板65の上面は、水路67に直接臨んでいるので、冷却水は、受熱板65の上面に接触しながら水路67を通過する。そして、水路67を通過する間に、冷却水は受熱板65から熱を奪う。また、水冷ジャケット60には、ジャケット本体61の上面から突出する複数の板片から構成される空冷用のフィン69が形成されている。このフィン69の形成領域は、水路67の形成両隊と概ね対向している。   The cooling water flowing from one plug 63 passes through one connection hole 62, the plurality of through passages 68, and the other connection hole 62 in order, and flows out of the water cooling jacket 60 from the other plug 63. Since the upper surface of the heat receiving plate 65 directly faces the water channel 67, the cooling water passes through the water channel 67 while being in contact with the upper surface of the heat receiving plate 65. The cooling water takes heat from the heat receiving plate 65 while passing through the water channel 67. The water-cooling jacket 60 is formed with air-cooling fins 69 composed of a plurality of plate pieces protruding from the upper surface of the jacket body 61. The formation area of the fin 69 is generally opposed to both the formations of the water channel 67.

保持手段70について説明する。水冷ジャケット60の左右両端部には、一対の支持部71が形成されている。支持部71の下面は受熱板65の下面よりも上方に位置する。支持部71には前後一対のビスからなる連結部材72が貫通され、連結部材72の下端部には係止板73が固定され、連結部材72の上端部には押さえ板74が固定されている。また、支持部71内には、軸線を上下方向に向けた圧縮コイルバネからなる当接バネ75が収容され、当接バネ75の上端が押さえ板74の下面に当接している。この当接バネ75の付勢により、水冷ジャケット60は、支持部71を係止板73の上面に当接させた状態に保持される。   The holding means 70 will be described. A pair of support portions 71 are formed at the left and right ends of the water cooling jacket 60. The lower surface of the support portion 71 is located above the lower surface of the heat receiving plate 65. A connecting member 72 composed of a pair of front and rear screws is passed through the support portion 71, a locking plate 73 is fixed to the lower end portion of the connecting member 72, and a pressing plate 74 is fixed to the upper end portion of the connecting member 72. . In addition, a contact spring 75 made up of a compression coil spring whose axis is directed in the vertical direction is accommodated in the support portion 71, and the upper end of the contact spring 75 is in contact with the lower surface of the pressing plate 74. By the urging of the contact spring 75, the water cooling jacket 60 is held in a state where the support portion 71 is in contact with the upper surface of the locking plate 73.

ベース部材80は、中央に方形の取付孔82が貫通形成されたフレーム81と、フレーム81の左右両側縁部に設けた一対の収容部83とを備える。一対の収容部83は、互いに対向する内向きの側面と上面とに開口されており、収容部83内には、係止部材84が、左右方向へのスライドを可能に収容されている。係止部材84には、収容部83の内向きの側面の開口から突出する係止突起85と、収容部83の上面の開口から突出する操作部86とを有する。係止部材84は、係止バネ87により、係止突起85を内向きに突出させる方向へ付勢されている。   The base member 80 includes a frame 81 in which a square mounting hole 82 is formed in the center, and a pair of accommodating portions 83 provided at both left and right edges of the frame 81. The pair of accommodating portions 83 are opened to the inwardly facing side surfaces and the upper surface facing each other, and the locking member 84 is accommodated in the accommodating portion 83 so as to be slidable in the left-right direction. The locking member 84 includes a locking protrusion 85 that protrudes from the opening on the inward side surface of the housing portion 83, and an operation portion 86 that protrudes from the opening on the top surface of the housing portion 83. The locking member 84 is biased by a locking spring 87 in a direction in which the locking projection 85 protrudes inward.

ヒートシンクBを回路基板50に取り付ける際には、取付孔82がCPU51と対応するようにベース部材80を配置し、ビス(図示省略)によりフレーム81(ベース部材80)を回路基板50に固定する。この後、上から取付孔82内に落とし込むようにして水冷ジャケット60をベース部材80に組み付ける。組付けの途中で、係止板73が係止部材84に当接するので、それ以降は、押さえ板74を上から押すことにより、係止バネ87の付勢に抗して係止部材84を側方へ退避させながら、水冷ジャケット60の組付けを進める。   When the heat sink B is attached to the circuit board 50, the base member 80 is disposed so that the attachment hole 82 corresponds to the CPU 51, and the frame 81 (base member 80) is fixed to the circuit board 50 with screws (not shown). Thereafter, the water cooling jacket 60 is assembled to the base member 80 so as to drop into the mounting hole 82 from above. Since the locking plate 73 abuts against the locking member 84 during the assembly, the pressing member 74 is pushed from above so that the locking member 84 is resisted against the bias of the locking spring 87. The assembly of the water cooling jacket 60 is advanced while retracting to the side.

水冷ジャケット60が正規の組付け状態になると、係止板73が、係止突起85に係止して上方への変位を規制される。また、組み付けの終期で受熱板65の下面がCPU51の上面(放熱面52)に当接するので、水冷ジャケット60は、当接バネ75の付勢に抗して係止板73に対して上昇する。そして、当接バネ75の付勢により、受熱板65の下面がCPU51の放熱面52に対して弾性的に面接触した状態に保持される。   When the water-cooling jacket 60 is in the proper assembled state, the locking plate 73 is locked to the locking protrusion 85 and the upward displacement is restricted. In addition, since the lower surface of the heat receiving plate 65 comes into contact with the upper surface (heat radiation surface 52) of the CPU 51 at the end of assembly, the water cooling jacket 60 rises with respect to the locking plate 73 against the urging of the contact spring 75. . Then, the lower surface of the heat receiving plate 65 is held in an elastic surface contact with the heat radiating surface 52 of the CPU 51 by the urging of the contact spring 75.

水冷ジャケット60をベース部材80に取り付けた状態では、CPU51で発生した熱が、受熱板65を介して水路67内の冷却水に伝達される。そして、熱を奪った冷却水が水冷ジャケット60外へ流出するとともに、低温の冷却水が水冷ジャケット60内に流入するので、CPU51が効果的に冷却される。   In a state where the water cooling jacket 60 is attached to the base member 80, the heat generated by the CPU 51 is transmitted to the cooling water in the water channel 67 through the heat receiving plate 65. And since the cooling water which took the heat flows out of the water cooling jacket 60, and the low-temperature cooling water flows into the water cooling jacket 60, the CPU 51 is effectively cooled.

回路基板50のメンテナンスや交換等のために、CPU51の冷却を一時的に中断する際には、水冷ジャケット60をベース部材80から外す。このとき、操作部86に指を掛け、係止バネ87の付勢に抗して、係止突起85が係止板73から外れる方向へ係止部材84をスライドさせる。係止突起85が係止板73から外れると、当接バネ75の付勢により、係止板73と押さえ板74が水冷ジャケット60に対して相対的に上方へ変位する。この後は、水冷ジャケット60を持ち上げればよい。   When the cooling of the CPU 51 is temporarily interrupted for maintenance or replacement of the circuit board 50, the water cooling jacket 60 is removed from the base member 80. At this time, a finger is put on the operation portion 86, and the locking member 84 is slid in a direction in which the locking projection 85 is detached from the locking plate 73 against the urging force of the locking spring 87. When the locking projection 85 is disengaged from the locking plate 73, the locking plate 73 and the pressing plate 74 are displaced upward relative to the water cooling jacket 60 by the biasing of the contact spring 75. Thereafter, the water cooling jacket 60 may be lifted.

本実施形態2のヒートシンクBは、水冷ジャケット60をベース部材80に取り付け、保持手段70によって受熱板65をCPU51に当接させると、CPU51から発せられた熱は、熱伝達経路79を構成する受熱板65に、直接伝達され、水冷ジャケット60内の冷却水に伝達される。受熱板65をCPU51に直接、接触させたので、受熱板65とCPU51との間に隙間が介在する場合に比べると、冷却効率が良い。このように、本実施形態によれば、水冷ジャケット60の着脱作業性を低下させずに、冷却効率の向上を図ることができる。   In the heat sink B of the second embodiment, when the water cooling jacket 60 is attached to the base member 80 and the heat receiving plate 65 is brought into contact with the CPU 51 by the holding means 70, the heat generated from the CPU 51 is the heat receiving path that forms the heat transfer path 79. Directly transmitted to the plate 65 and transmitted to the cooling water in the water cooling jacket 60. Since the heat receiving plate 65 is brought into direct contact with the CPU 51, the cooling efficiency is better than when a gap is interposed between the heat receiving plate 65 and the CPU 51. Thus, according to the present embodiment, it is possible to improve the cooling efficiency without deteriorating the detachability workability of the water cooling jacket 60.

また、保持手段70は、受熱板65をCPU51に当接する方向へ付勢する当接バネ75を備えて構成されているので、各部材の熱膨張や寸法公差を吸収して、受熱板65をCPU51に確実に当接させることができる。また、空冷用のフィン69を備えているので、万一、冷却水による冷却機能に支障が生じても、冷却機能の大幅な低下を回避できる。   Further, the holding means 70 is configured to include a contact spring 75 that urges the heat receiving plate 65 in the direction in which the heat receiving plate 65 contacts the CPU 51, and therefore absorbs thermal expansion and dimensional tolerance of each member to The CPU 51 can be surely brought into contact. In addition, since the air cooling fins 69 are provided, even if the cooling function by the cooling water is disturbed, a significant decrease in the cooling function can be avoided.

<他の実施形態>
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれる。
(1)上記実施形態1では、受熱部をベース部材のみに設けたが、受熱部をベース部材と水冷ジャケットの両方に設けてもよい。
(2)上記実施形態2では、受熱部を水冷ジャケットのみに設けたが、受熱部を水冷ジャケットとベース部材の両方に設けてもよい。
(3)上記実施形態1では、兼用バネが、係止部材を係止方向へ付勢して水冷ジャケットを装着状態に保持する機能と、水冷ジャケットを受熱部に当接させて冷却効率を高める機能とを兼ね備えるようにしたが、この両機能を別々のバネで発揮させてもよい。
(4)上記実施形態1では、ホースが接続されるプラグの軸線を、水冷ジャケットの着脱方向と略平行に向けたが、プラグの軸線は、水冷ジャケットの着脱方向と交差する方向に向けてもよい。この場合、プラグの軸線は、受熱部の板面と平行な方向と、受熱部の板面と交差する方向のいずれでもよい。
(5)上記実施形態2では、ホースが接続されるプラグの軸線を、水冷ジャケットの着脱方向と略平行に向けたが、プラグの軸線は、水冷ジャケットの着脱方向と交差する方向に向けてもよい。
(6)上記実施形態1,2では、2つの接続部の軸線を平行にしたが、2つの接続部の軸線は互いに異なる向きであってもよい。
(7)上記実施形態1において、ベース部材又は水冷ジャケットに空冷用のフィンを設けてもよい。
(8)上記実施形態2において、水冷ジャケットに空冷用のフィンを設けない形態としてもよく、水冷ジャケットとベース部材の両方に空冷用のフィンを設ける構成としてもよい。
(9)上記実施形態1の水路の形態は実施形態2にも適用することができ、実施形態2の水路の形態は実施形態1にも適用することができる。
<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In Embodiment 1 described above, the heat receiving portion is provided only on the base member, but the heat receiving portion may be provided on both the base member and the water cooling jacket.
(2) In Embodiment 2 described above, the heat receiving portion is provided only in the water cooling jacket, but the heat receiving portion may be provided in both the water cooling jacket and the base member.
(3) In the first embodiment, the dual-purpose spring urges the locking member in the locking direction to hold the water-cooling jacket in the mounted state, and brings the water-cooling jacket into contact with the heat receiving portion to increase the cooling efficiency. Although both functions are combined, these two functions may be exhibited by separate springs.
(4) In the first embodiment, the axis of the plug to which the hose is connected is oriented substantially parallel to the attaching / detaching direction of the water cooling jacket. However, the axis of the plug may be oriented in a direction intersecting the attaching / detaching direction of the water cooling jacket. Good. In this case, the axis line of the plug may be either a direction parallel to the plate surface of the heat receiving unit or a direction intersecting the plate surface of the heat receiving unit.
(5) In Embodiment 2 above, the axis of the plug to which the hose is connected is oriented substantially parallel to the direction of attaching and detaching the water cooling jacket, but the axis of the plug may be oriented in a direction that intersects with the direction of attaching and detaching the water cooling jacket. Good.
(6) In the first and second embodiments, the axes of the two connecting portions are parallel to each other, but the axes of the two connecting portions may be in different directions.
(7) In the said Embodiment 1, you may provide the fin for air cooling in a base member or a water cooling jacket.
(8) In the second embodiment, the air cooling fins may not be provided in the water cooling jacket, or the air cooling fins may be provided in both the water cooling jacket and the base member.
(9) The form of the water channel of the first embodiment can also be applied to the second embodiment, and the form of the water channel of the second embodiment can also be applied to the first embodiment.

A…ヒートシンク
10…水冷ジャケット
16…伝熱板(熱伝達経路)
17…水路
30…ベース部材
35…受熱板(受熱部)
40…係止部材
45…保持手段
44…兼用バネ
48…当接バネ
49…熱伝達経路
B…ヒートシンク
60…水冷ジャケット
65…受熱板(受熱部)
67…水路
69…フィン
70…保持手段
75…当接バネ
79…熱伝達経路
80…ベース部材
A ... Heat sink 10 ... Water cooling jacket 16 ... Heat transfer plate (Heat transfer path)
17 ... Water channel 30 ... Base member 35 ... Heat receiving plate (heat receiving portion)
DESCRIPTION OF SYMBOLS 40 ... Locking member 45 ... Holding means 44 ... Combined spring 48 ... Contact spring 49 ... Heat transfer path B ... Heat sink 60 ... Water cooling jacket 65 ... Heat receiving plate (heat receiving part)
67 ... Water channel 69 ... Fin 70 ... Holding means 75 ... Abutting spring 79 ... Heat transfer path 80 ... Base member

Claims (4)

冷却水の水路を有する水冷ジャケットと、
発熱部材の近傍に設けられ、前記水冷ジャケットの着脱を可能としたベース部材と、
発熱部材から受けた熱を前記水路内の冷却水に伝達するための熱伝達経路を構成する受熱部と、
前記受熱部を発熱部材に当接した状態に保持する保持手段とを備えていることを特徴とするヒートシンク。
A water cooling jacket having a cooling water channel;
A base member provided in the vicinity of the heat generating member and capable of attaching and detaching the water cooling jacket;
A heat receiving part that constitutes a heat transfer path for transferring heat received from the heat generating member to the cooling water in the water channel;
A heat sink, comprising: holding means for holding the heat receiving portion in contact with the heat generating member.
前記保持手段は、前記受熱部を発熱部材に当接する方向へ付勢する当接バネを備えて構成されていることを特徴とする請求項1記載のヒートシンク。   The heat sink according to claim 1, wherein the holding unit includes a contact spring that urges the heat receiving portion in a direction to contact the heat generating member. 前記受熱部が前記ベース部材に設けられており、
前記ベース部材は、
前記水冷ジャケットに係止して前記水冷ジャケットを装着状態に保持する係止状態と、前記水冷ジャケットに対する係止を解除する解除状態との間で変位可能な係止部材と、
前記係止部材を係止方向へ付勢するとともに、前記係止部材を介して前記水冷ジャケットを前記受熱部に当接する方向へ付勢する兼用バネとを備えていることを特徴とする請求項1又は請求項2記載のヒートシンク。
The heat receiving portion is provided on the base member;
The base member is
A locking member that is displaceable between a locking state that locks the water cooling jacket and holds the water cooling jacket in a mounted state, and a release state that releases the locking to the water cooling jacket;
A dual-purpose spring that biases the locking member in the locking direction and biases the water-cooling jacket in a direction to contact the heat receiving portion via the locking member. The heat sink according to claim 1 or 2.
空冷用のフィンを備えていることを特徴とする請求項1ないし請求項3のいずれか1項に記載のヒートシンク。   The heat sink according to any one of claims 1 to 3, further comprising air-cooling fins.
JP2011157565A 2011-07-19 2011-07-19 Heat sink Withdrawn JP2013026307A (en)

Priority Applications (1)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101697325B1 (en) * 2016-07-18 2017-01-17 민형식 Cooling Device for Processing Unit of Computer
JP2018006526A (en) * 2016-06-30 2018-01-11 富士通株式会社 Information processing device and cooling unit
JP2018206790A (en) * 2017-05-30 2018-12-27 カルソニックカンセイ株式会社 Cooling device for semiconductor device
KR200490077Y1 (en) * 2016-10-07 2019-09-20 이브이지에이 코포레이션 Heat dissipation device of graphics card

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018006526A (en) * 2016-06-30 2018-01-11 富士通株式会社 Information processing device and cooling unit
KR101697325B1 (en) * 2016-07-18 2017-01-17 민형식 Cooling Device for Processing Unit of Computer
KR200490077Y1 (en) * 2016-10-07 2019-09-20 이브이지에이 코포레이션 Heat dissipation device of graphics card
JP2018206790A (en) * 2017-05-30 2018-12-27 カルソニックカンセイ株式会社 Cooling device for semiconductor device

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