JP2013026052A - Resin mold structure with cable - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin mold structure with a cable which allows the improvement of the airtightness between a sheath and a resin mold part even in the case of using a cable subjected to a crosslinking treatment for the purpose of increasing the heat resistance.SOLUTION: The resin mold structure 10 with a cable comprises: a cable 11 having a conductor 12 and a sheath 13 which is provided on the outer periphery of the conductor 12, and subjected to a crosslinking treatment for increasing the heat resistance; and a resin mold part 15 formed by the resin-molding on an end portion of the cable 11. For at least a portion of the sheath 13 located inside the resin mold part 15, a low-crosslink-density part 16 is formed over the whole circumference of the sheath 13 in a circumferential direction of the sheath, which is lower in the density of crosslink on the sheath 13 than the remaining portion of the sheath 13.

Description

  The present invention relates to a resin molded structure with a cable.

  Conventionally, a cable having a conductor and a sheath covering the outer periphery of the conductor, a vehicle-mounted sensor or the like mounted on a circuit board connected to the conductor of the cable, and a resin mold part that resin-molds the circuit board together with the ends of the cable; There is a resin mold structure with a cable having (see, for example, Patent Document 1). In this resin mold structure with a cable, it is desirable that the airtightness between the sheath and the resin mold portion is high so that water does not enter the circuit board, the conductor of the cable, and the like.

  With the widespread use of vehicles such as electric vehicles such as HEV, the use environment level has become stricter, such as expansion of the range of use and use in the vicinity of the engine. Application needs are expected to become significant. Therefore, the cable used for the resin mold structure with a cable exposed to a high temperature environment such as a vehicle is required to have a high heat resistance.

  In response to such a demand, a cable in which the sheath of the cable is subjected to a crosslinking treatment to improve the heat resistance of the sheath has been actively developed in recent years (for example, Patent Document 2).

JP 2001-37058 A Japanese Patent Laid-Open No. 11-329098

  However, as described in Patent Document 2, if an end of a cable having a sheath subjected to crosslinking treatment is to be resin-molded, the sheath and resin mold portion are difficult to interfacely bond between the sheath subjected to crosslinking treatment and the resin mold portion. And the airtightness between the sheath and the resin mold part is lowered.

  Therefore, the present invention has been made in view of the above circumstances, and even if a cable having a sheath subjected to a crosslinking treatment to improve heat resistance is used, the airtightness between the sheath and the resin mold portion is used. An object of the present invention is to provide a resin-molded structure with a cable that can suppress a decrease in the thickness.

  The present invention has been made to solve the above problems, a cable having a conductor and a sheath provided on the outer peripheral side of the conductor and subjected to a crosslinking treatment to improve heat resistance, A low-crosslinking density portion having a cross-linking density lower than that of other sheath portions, at least a part of the sheath located in the resin mold portion. Is a resin mold structure with a cable, characterized in that it is formed over the entire circumference in the circumferential direction of the sheath.

  The sheath may have a heat resistance of 125 to 200 ° C.

  A plurality of the low crosslink density portions may be formed.

  The present invention has been made to solve the above-described problem, and includes a conductor and a sheath provided on the outer peripheral side of the conductor and subjected to a cross-linking treatment to improve heat resistance. And at least a part of the sheath positioned in the resin mold portion, a non-crosslinked portion that is not subjected to crosslinking treatment is provided on the sheath. A resin-molded structure with a cable, characterized by being formed over the entire circumference in the circumferential direction.

  The sheath may have a heat resistance of 125 to 200 ° C.

  A plurality of the non-crosslinked parts may be formed.

  Even if a cable having a sheath subjected to a crosslinking treatment to improve heat resistance is used, it is possible to suppress a decrease in hermeticity between the sheath and the resin mold portion.

The (a) transverse cross section which shows the resin mold structure 10 with a cable which concerns on 1st embodiment of this invention, and (b) X-X 'cross section. The figure which shows the manufacturing method of the resin mold structure 10 with a cable which concerns on 1st embodiment of this invention. The cross-sectional view which shows the resin mold structure 30 with a cable which concerns on the modification of 1st embodiment of this invention. The cross-sectional view which shows the resin mold structure 20 with a cable which concerns on 2nd embodiment of this invention. The cross-sectional view which shows the modification of the resin mold structure 40 with a cable which concerns on 2nd embodiment of this invention.

[First embodiment]
The resin molded structure with cable 10 according to the first embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a (a) cross-sectional view and (b) XX ′ cross-sectional view showing a resin-molded structure 10 with a cable according to a first embodiment of the present invention.

[Configuration of Resin Mold Structure 10 with Cable]
As shown in FIG. 1, the resin-molded structure with cable 10 according to the first embodiment of the present invention is provided on the outer periphery of the conductor 12 and the conductor 12, and is subjected to a crosslinking treatment to improve heat resistance. A cable 11 having a sheath 13, and a resin mold portion 15 that resin-molds an end portion of the cable 11, and at least a part of the sheath 13 located in the resin mold portion 15 has a crosslink density or the like. A low crosslink density portion 16 lower than the sheath portion is formed over the entire circumference in the circumferential direction of the sheath 13. Here, the crosslinking density is the number of crosslinking points present in a unit volume. Hereinafter, each configuration will be described in detail.

  The cable 11 includes at least a conductor 12 and a sheath 13 provided on the outer peripheral side of the conductor 12. In the present embodiment, the cable 11 further includes an insulating layer 18 between the conductor 12 and the sheath 13 as shown in FIG. As shown in FIG. 1B, the cable 11 has a circular cross section, but other forms such as a rectangular shape can also be used.

  The conductor 12 is formed by twisting a plurality of strands made of copper. The conductor 12 is electrically connected to a circuit board 14 described later by soldering. At this time, in order to improve the strength of the connection between the conductor 12 and the circuit board 14, it is preferable that the portion of the conductor 12 connected to the circuit board 14 is plated. In the present embodiment, two conductors 12 are provided, and the two conductors 12 are twisted together. In addition, the strand used for the conductor 12 may be made of not only copper but also a metal such as copper alloy, aluminum, or iron, and only one conductor 12 is provided, or three or more conductors are provided. Also good.

  The sheath 13 is provided on the outer peripheral side of the conductor 12 and the insulating layer 18 for the purpose of protecting the insulating layer 18. The sheath 13 is made of an insulating material such as ETFE or PTFE. In the present embodiment, the sheath 13 is subjected to a crosslinking treatment in order to improve heat resistance. Examples of the crosslinking treatment include a method in which a sheath 13 is mixed with a crosslinking agent such as dicumyl peroxide (DCP) and the sheath 13 is heated, or a method in which the sheath 13 is irradiated with radiation. The cable 11 thus subjected to the crosslinking treatment can have a heat resistance of 125 to 200 ° C. Although the sheath 13 in the present embodiment is subjected to a crosslinking treatment, a part of the sheath 13 located in the resin mold portion 15 described later has a low crosslinking having a crosslinking density lower than that of the other sheaths 13. The density portion 16 is formed over the entire circumference of the sheath 13 in the circumferential direction. That is, the low crosslink density portion 16 is continuously formed at 360 ° in a part of the sheath 13 located in the resin mold portion 15 in the longitudinal direction. In the present embodiment, since the cable 11 has a circular cross section, the cross-sectional shape of the low crosslink density portion 16 is also circular. The low crosslink density portion 16 is inferior in heat resistance because the crosslink density is lower than other sheath 13 portions, but is located in the resin mold portion 15, so that the influence of heat on the low crosslink density portion 16 is present. There are few. That is, the resin mold part 15 described later also has a function of protecting the low crosslink density part 16 from heat.

  The circuit board 14 uses a rigid board that does not have flexibility in the present embodiment, but a flexible board or the like having flexibility may be used as another form. A conductor 12 is connected to the circuit board 14. A sensor 17 is mounted on the circuit board 14. As the sensor 17, an in-vehicle sensor, more specifically, a magnetic sensor for detecting a rotation angle or a rotation speed, an MR (magnetoresistive) sensor, or a GMR (giant magnetoresistive) sensor can be used.

  The resin mold part 15 resin-molds the circuit board 14 and the sensor 17 with the edge part of the cable 11, as shown to Fig.1 (a). At this time, the resin mold part 15 is resin-molded so as to cover the low cross-linking density part 16 as well. Examples of the material of the resin mold portion 15 include polyamide (PA), polyphthalamide (PPA), polyphenylene sulfide (PPS), and the like. As shown in FIG. 1, the resin mold portion 15 has a cylindrical shape, but other shapes such as a rectangular parallelepiped shape can also be used.

[Manufacturing Method of Resin Mold Structure 10 with Cable]
Hereinafter, the manufacturing method of the resin mold structure with a cable 10 according to the first embodiment of the present invention will be described with reference to FIG. FIG. 2 is a diagram showing a method for manufacturing the resin mold structure with cable 10 according to the first embodiment of the present invention. Here, as a method for manufacturing the resin-molded structure 10 with cable, a method will be described in which a sheath 13 is mixed with a crosslinking agent and the sheath 13 is heated.

  First, as shown in FIG. 2, a part of the cable 11 (sheath 13) in which the cross-linking agent is mixed with the sheath 13 is covered with a heat insulating material 19, and the cable 11 is heated in this state. At this time, the cross-linking is promoted in the portion of the sheath 13 not covered with the heat insulating material 19, but the cross-linking is suppressed in the portion of the sheath 13 covered with the heat insulating material 19 because heat does not reach sufficiently. A low crosslink density portion 16 having a low crosslink density is formed.

  Next, the conductor 12 of the cable 11 processed as described above is connected to the circuit board 14 on which the sensor 17 is mounted.

  Thereafter, these are placed in a mold for resin molding, and the molten resin is poured into the mold so that the sensor 17 and the circuit board 14 and further the low-crosslinking density portion 16 are resin-molded together with the ends of the cable 11. The resin mold part 15 is completed.

[Operational effects of resin mold structure with cable 10]
In the resin mold structure with a cable 10 according to the first embodiment of the present invention, a low crosslink density is lower in a part of the sheath 13 located in the resin mold part 15 than in a part of the other sheath 13. The portion 16 is formed over the entire circumference of the sheath 13 in the circumferential direction. Since the low crosslink density portion 16 is more easily interfaced with the resin mold portion 15 than the portion other than the low crosslink density portion 16 of the sheath 13, the low crosslink density portion 16 is difficult to peel off from the resin mold portion 15. Therefore, even if water invades between the sheath 13 and the resin mold portion 15 due to the separation of the resin mold portion 15 from the portion other than the low crosslink density portion 16 of the sheath 13, the low crosslink density portion 16. Since the water is blocked at the welded portion where the resin mold part 15 and the resin mold part 15 are welded, the airtightness between the sheath 13 and the resin mold part 15 can be ensured. Therefore, even if a cable having a sheath subjected to a crosslinking treatment to improve heat resistance is used, it is possible to suppress a decrease in airtightness between the sheath and the resin mold portion.

[Modification of First Embodiment]
FIG. 3 is a cross-sectional view showing a resin-molded structure 30 with a cable according to a modification of the first embodiment of the present invention.

  In the above-described embodiment, one low crosslink density portion 16 is provided in the sheath 13, but two low crosslink density portions 16 are provided in the sheath 13 as in the resin-molded structure 30 with cable shown in FIG. It is also possible to provide three or more.

  Further, in the above-described embodiment, the low cross-linking density portion 16 is formed over the entire circumferential circumference of a part of the sheath 13 located in the resin mold portion 15, but is not limited thereto. It is also possible to form the low cross-linking density portion 16 over the entire circumferential direction of the sheath 13 located in the resin mold portion 15.

[Other variations]
In the first embodiment of the present invention, the resin mold portion 15 is for resin-molding the circuit board 14 to which the conductor 12 is connected together with the end portions of the cable 11. For example, the resin mold portion 15 connects the conductors of the cables. The connection portion may be resin-molded together with the end portion of the cable.

[Second Embodiment]
The resin-molded structure with cable 20 according to the second embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 4 is a cross-sectional view showing the resin-molded structure with cable 20 according to the first embodiment of the present invention.

[Configuration of Resin Mold Structure 20 with Cable]
As shown in FIG. 4, the resin-molded structure with cable 20 according to the second embodiment of the present invention is provided on the outer periphery of the conductor 12 and the conductor 12 and is subjected to a crosslinking process to improve heat resistance. A cable 11 having a sheath 13 and a resin mold portion 15 for resin-molding an end portion of the cable 11, and at least a part of the sheath 13 positioned in the resin mold portion 15 is subjected to a crosslinking treatment. The non-bridge | crosslinking part 26 which is not made is formed over the circumferential direction perimeter of the sheath 13. It is characterized by the above-mentioned. In addition, in the resin mold structure with a cable 20 according to the second embodiment, the same reference numerals are given to the same configurations as those in the first embodiment.

[Operational effect of resin molded structure 20 with cable]
In the resin mold structure with a cable 20 according to the second embodiment of the present invention, an uncrosslinked portion 26 that is not subjected to crosslinking treatment is formed instead of the low crosslinked density portion 16 of the first embodiment. Yes. Thereby, also in 2nd embodiment, there exists an effect similar to 1st embodiment. That is, the non-crosslinked portion 26 is more easily interfaced with the resin mold portion 15 than the portion other than the non-crosslinked portion 26 of the sheath 13, and thus is not easily peeled off from the resin mold portion 15. Accordingly, even if the portion other than the non-crosslinked portion 26 of the sheath 13 and the resin mold portion 15 are separated and water enters between the sheath 13 and the resin mold portion 15, the non-crosslinked portion 26 and the resin Since the water is blocked by the welded portion where the mold portion 15 is welded, the airtightness between the sheath 13 and the resin mold portion 15 can be ensured. Therefore, even if a cable having a sheath subjected to a crosslinking treatment to improve heat resistance is used, it is possible to suppress a decrease in airtightness between the sheath and the resin mold portion.

  Further, according to the present embodiment, the non-crosslinked portion 26 is more easily interfaced with the resin mold portion 15 than the low crosslink density portion 16 of the first embodiment, and thus is more difficult to peel from the resin mold portion 15. The effect of becoming.

[Modification of Second Embodiment]
The second embodiment of the present invention is not limited to the above-described embodiment, and can be implemented with modifications as shown in FIG. 5, for example. FIG. 5 is a cross-sectional view showing a resin-molded structure 40 with a cable according to a modification of the second embodiment of the present invention.

  In the embodiment described above, one non-crosslinked portion 26 is provided in the sheath 13, but as in the resin-molded structure with cable 40 according to the modification of the second embodiment of the present invention, there is no crosslink. Two portions 26 can be provided on the sheath 13, and three or more portions can be provided.

  Further, in the above-described embodiment, the non-crosslinking portion 26 is formed over the circumferential outer periphery of a part of the sheath 13 located in the resin mold portion 15. However, the present invention is not limited to this, and the resin mold It is also possible to form the non-bridging portion 16 over the entire circumference in the circumferential direction of the sheath 13 located in the portion 15.

DESCRIPTION OF SYMBOLS 10, 20 Resin mold structure with cable 11 Cable 12 Conductor 13 Sheath 14 Circuit board 15 Resin mold part 16 Low bridge | crosslinking density part 17 Sensor 18 Insulating layer 19 Heat insulating material 26 Unbridged part

Claims (6)

A cable having a conductor and a sheath provided on the outer periphery of the conductor and subjected to a crosslinking treatment to improve heat resistance;
A resin mold part that resin molds the end of the cable;
Have
At least a part of the sheath located in the resin mold part is formed with a low cross-linking density part having a cross-linking density lower than that of the other sheath part over the entire circumference in the circumferential direction of the sheath. Resin mold structure with cable.   The resin-molded structure with cable according to claim 1, wherein the sheath has a heat resistance of 125 to 200 ° C.   The resin mold structure with a cable according to claim 1, wherein a plurality of the low cross-linking density portions are formed. A cable having a conductor and a sheath provided on the outer periphery of the conductor and subjected to a crosslinking treatment to improve heat resistance;
A resin mold part that resin molds the end of the cable;
Have
A resin-molded structure with a cable, wherein a non-crosslinked portion that is not subjected to crosslinking treatment is formed on at least a part of the sheath located in the resin mold portion over the entire circumference in the circumferential direction of the sheath.   The resin-molded structure with cable according to claim 4, wherein the sheath has a heat resistance of 125 to 200 ° C.   The resin-molded structure with a cable according to claim 4 or 5, wherein a plurality of the non-crosslinked portions are formed.

Images