JP2013023741A - Arc ion plating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an arc ion plating apparatus capable of reducing the change in smoothness of a thin film surface which is changed according to the consumption of an evaporation source, and improving the utilization efficiency of the evaporation source.SOLUTION: The direction of the polarity of a back side ring-shaped magnet 17 and that of an outer ring-shaped magnet 16 are set in the same way. The direction of the polarity of a center magnet 15 is set opposite to that of magnets 16, 17. In the back side ring-shaped magnet 17, the center position O of the ring width W is arranged in the range of D/20 from an end face of an evaporation source 5, where D denotes the diameter of the evaporation source 5. The initial set value of the magnetic field generated on a surface of the evaporation source 5 by the magnets 15, 16, 17 is 7-10 mT in terms of the magnetic flux density on a surface of an inner area C except an end area E in the range of D/20 inwardly from the end face of the evaporation surface, while the magnetic flux density on the surface of the end area E is continuously increased from the center part side of the evaporation source to the end of the evaporation source; and the initial set value is 7-10 mT in terms of the magnetic flux density on the surface center side of the end area E, and ≥15 mT at the surface outermost end of the end area E. The standard deviation of the magnetic flux density on the surface of the inner area is set to be ≤0.6.

Description

  The present invention relates to an arc ion plating apparatus in which an evaporation source is ionized by arc discharge to form a film on a workpiece.

  An arc ion plating apparatus causes arc discharge in a vacuum using an evaporation source of a metal material or ceramic material as a cathode, thereby evaporating the evaporation source and simultaneously releasing it as ions. ) Is a device for forming a film by applying a negative bias voltage and accelerating and supplying ions to the work surface. As the evaporation source, titanium and chromium are widely used. For example, hard surfaces such as TiN, TiAlN, and CrAlN are used on the surface of cutting tools made of high-speed steel, cemented carbide, cermet, etc. to improve wear resistance. It is used in technology for forming a film.

In this type of arc ion plating apparatus, when the arc current concentrates on a minute region on the surface of the evaporation source, the minute region becomes an arc spot to dissolve and evaporate the evaporation source. When this arc spot stays, the material in the vicinity of the staying portion melts and scatters without evaporating, so that a magnet is installed behind the evaporation source to promote the movement of the arc spot.
As the magnetic field, Patent Document 1 recommends that the strength of the magnetic field on the evaporation surface of the evaporation source is 5 mT (millitesla) or more and the arc current value is 200 A or more. Further, it is recommended that the maximum angle θ of the magnetic field lines with respect to the normal line on the evaporation surface is 60 ° or less.
Patent Document 2 discloses that the minimum value of the magnetic flux density on an arbitrary line segment from the center of the evaporation surface along the radial direction of the evaporation surface is 4.5 mT or more, the average value is 8 mT or more, and the standard deviation is 3 or less. By forming a certain magnetic field, the direction of the lines of magnetic force is perpendicular to the evaporation surface of the cathode (cathode), and the magnetic flux density on the evaporation surface of the cathode can be made uniform, improving the utilization efficiency of the cathode. It is stated that you can.

Japanese Patent No. 40345563 JP 2009-144236 A

  However, even in the magnetic field set as described in Patent Document 2, the magnetic flux density is not uniform enough, and a part of the evaporation source is preferentially consumed and biased, resulting in a thin film surface. There is a problem that the smoothness changes. The evaporation source in which the consumption amount is biased has to be replaced with a new one, leaving the majority, and there is a problem that the utilization efficiency is low.

  The present invention has been made in view of such circumstances, and it is possible to reduce the change in the smoothness of the thin film surface that changes as the evaporation source is consumed, and to improve the utilization efficiency of the evaporation source. It is an object of the present invention to provide a lighting device.

  The arc ion plating apparatus of the present invention, a central magnet disposed in the center of the back surface of the cathode on which the evaporation source is placed, a back side ring-shaped magnet disposed to face the outer peripheral end of the back surface of the cathode, An outer ring magnet disposed radially outward of the evaporation source, the polarity of the polarity of the back ring magnet and the outer ring magnet is set to be the same, and the polarity of the center magnet is When the reverse side ring-shaped magnet and the outer ring-shaped magnet are set to have opposite polarities and the diameter of the evaporation source is D, the back-side ring-shaped magnet has a center position of the ring width of the evaporation source. The initial setting value of the magnetic field generated on the surface of the evaporation source by the central magnet, the back ring magnet, and the outer ring magnet is an end surface of the evaporation surface. From On the other hand, the magnetic flux density on the inner region surface excluding the end region in the range of D / 20 is 7 to 10 mT, and continuously increases from the evaporation source center side to the evaporation source end on the end region surface. The center of the surface is set to 7 to 10 mT, the extreme end of the end region is set to 15 mT or more, and the standard deviation of the magnetic flux density on the inner region surface is set to 0.6 or less.

Since the arc spot generated on the evaporation surface is an electron emission point, it is important to make the arc spot move around on the entire evaporation surface in order to increase the utilization efficiency of the evaporation source.
On the surface of the inner region where the magnetic flux density on the evaporation surface is 7 to 10 mT, the arc spot can move randomly at high speed. Further, by eliminating local concentration in the inner region, the arc spot can be moved uniformly throughout, so that the film can be formed with uniform film quality and the evaporation source can be evenly consumed.
In the present invention, a back side ring-shaped magnet is provided, the center position of the ring width is arranged within the range of D / 20 from the end face of the evaporation source, and a part of the magnetic field of the back side ring-shaped magnet is placed in the end region of the evaporation source. By acting so as to cancel out part of the magnetic field of the outer ring-shaped magnet, the magnetic flux density on the surface of the evaporation source by the central magnet, the back-side ring-shaped magnet and the outer ring-shaped magnet is 7-10 mT in a wide range. In addition, the standard deviation of the magnetic flux density is suppressed to 0.6 or less so that the magnetic field distribution on the evaporation surface becomes smooth. Therefore, the moving speed of the arc spot can be made constant, the change in smoothness of the thin film surface can be reduced, and the film can be formed with a uniform film quality. Moreover, since the evaporation source can be evenly consumed, the utilization efficiency of the evaporation source can be dramatically improved.
In order to obtain the effect of confining the arc spot in the discharge region, the magnetic flux density needs to be 7 mT or more. If the magnetic flux density exceeds 15 mT, the presence of the arc spot itself is remarkably limited, and there is a problem that the film forming speed is remarkably reduced. Moreover, the problem that the voltage value of arc discharge rises from the normal time also occurs.
On the other hand, since the magnetic flux density is larger in the end region of the evaporation source than in the inner region surface, the arc spot on the inner region surface is bounced back by the strong magnetic field in the end region even if it goes to the end region. , Returned to the inner area. Therefore, it is possible to prevent the arc spot from entering the region other than the surface portion from the end region, and to move the arc spot while being confined in the inner region.

In the arc ion plating apparatus of the present invention, the magnetic force lines on the evaporation surface have an angle θ of 0 ° ≦ θ <20 ° with respect to the normal line of the evaporation surface, and the surface of the end region is inclined toward the inner region. It is good to have.
When the line of magnetic force is set at the above angle with respect to the normal line of the evaporation surface, there is an effect of confining the arc spot on the evaporation surface.
In addition, the force that moves the arc spot is determined by the magnitude of each of the component parallel to the evaporation surface and the component perpendicular to the evaporation surface in the magnetic field, and the direction is a direction perpendicular to the component parallel to the evaporation surface. , The direction of synthesis of the parallel component and the same direction. Therefore, if the component parallel to the evaporation surface in the magnetic field is directed to the inner region of the evaporation surface, a force acts in the direction to return to the inner region of the evaporation surface even if the arc spot moves to the end region surface. Jumping out of the area is prevented.

  According to the arc ion plating apparatus of the present invention, since the distribution of the magnetic field on the surface of the evaporation source can be smoothed, the utilization efficiency of the evaporation source can be dramatically improved. Further, by making the magnetic force in the arc spot generation region constant, the arc spot velocity can be made constant, and a film can be formed with a uniform film quality.

It is the plane sectional view showing typically one embodiment of the arc ion plating apparatus of the present invention. It is a longitudinal cross-sectional view of FIG. It is a schematic diagram of the magnetic force line which each magnet forms, (a) shows an outer ring magnet, (b) shows a center magnet, and (c) shows a magnetic field line of a back ring magnet. It is a figure explaining arrangement | positioning of a back side ring-shaped magnet. It is a magnetic flux density distribution map by the magnetic field which each magnet forms, (a) shows an outer ring magnet, (b) shows a center magnet, and (c) shows a distribution map of a back ring magnet. It is a graph which shows distribution of the magnetic flux density on an evaporation surface, and the angle of a magnetic force line. It is a schematic diagram which shows the vector of the magnetic force line on an evaporation surface. It is a schematic diagram explaining the movement principle of the arc spot by the magnetic force line on an evaporation surface.

Hereinafter, an embodiment of an arc ion plating apparatus of the present invention will be described with reference to the drawings.
As shown in FIGS. 1 and 2, the arc ion plating apparatus 1 of this embodiment is provided with a table 4 for holding a workpiece (coating object) 3 in a vacuum chamber 2, and through the table 4. On both sides, an evaporation source 5 as a cathode is provided. The table 4 has a mechanism in which a plurality of support bars 6 holding a plurality of workpieces 3 are erected on the upper surface of the table 4 at intervals in the circumferential direction, and the support bars 6 rotate horizontally as indicated by arrows in FIG. The turntable itself is a turntable that can be turned horizontally by a turning mechanism (not shown). And it is the structure which revolves while rotating the workpiece | work 3 hold | maintained at the support rod 6. As shown in FIG.
The vacuum chamber 2 is provided with a gas introduction port 7 for introducing a reaction gas into the interior and a gas discharge port 8 for exhausting the reaction gas from the inside, and on the table 4 behind the table 4. A heater 9 is provided to heat the workpiece 3 and increase the adhesion of the coating.

In the illustrated example, the evaporation source 5 is formed in a disk shape, and one surface of the evaporation source 5 faces the work 3 on the table 4 (perpendicular to the radial direction of the table 4). The arrangement is such that the evaporated surface 11 becomes the evaporation surface 11. Then, an anode electrode 12 is arranged with an appropriate portion of the surface of the evaporation source 5 (evaporation surface 11), the evaporation source 5 is a cathode, and a negative bias voltage is applied between the anode electrode 12 and the evaporation source 5. An arc power supply 13 is connected.
The table 4 is also connected to a bias power source 14 that applies a negative bias voltage to the work 3 held by the table 4.

A central magnet 15 is provided at the center of the back surface of the evaporation source 5, and a back ring magnet 17 is provided at the outer peripheral end of the back surface of the evaporation source 5. An outer ring-shaped magnet 16 is provided so as to surround the outer peripheral surface.
Each magnet 15, 16, and 17 is a permanent magnet. In the present embodiment, for example, the center magnet 15 and the outer ring-shaped magnet 16 are formed of a neodymium magnet, and the back-side ring-shaped magnet 17 is formed of a ferrite magnet having a lower magnetic force than those magnets 15 and 16.
The polarity direction of the back ring magnet 17 and the outer ring magnet 16 is set to be the same, and the polarity direction of the center magnet 15 is set to be opposite to the polarity direction of the back ring magnet 17 and the outer ring magnet 16. Part of the magnetic field generated by these magnets 15, 16, and 17 acts so as to overlap each other.

As shown in FIG. 3A, the outer ring magnet 16 disposed outside the evaporation source 5 has, for example, an S pole on the front side of the evaporation source 5 and an N pole on the rear side, and the magnetic field is in an outer ring shape. Magnetic field lines from the N pole to the S pole of the magnet 16 are formed so as to pass from the rear of the evaporation source 5 to the front through the evaporation source 5. On the other hand, as shown in FIG. 3B, the central magnet 15 at the center of the back surface of the evaporation source 5 has an N pole on the side facing the evaporation source 5 and an S pole on the opposite side. It is formed so as to pass through the evaporation source 5 from the back surface side of the liquid and to come out in front of the evaporation source 5. Therefore, in the central part of the evaporation source 5, a part of the magnetic field of both the magnets 15 and 16 acts so that it may mutually overlap.
Further, as shown in FIGS. 3 (c) and 4, the back-side ring magnet 17 has an S pole on the side facing the evaporation source 5 and an N pole on the opposite side, and the diameter of the evaporation source 5 is D. In this case, the center position O of the ring width W of the back side ring-shaped magnet 17 is arranged within the range of D / 20 from the end surface of the evaporation source 5 (end region E of the evaporation source 5). Thereby, a part of the magnetic field by the back side ring-shaped magnet 17 acts so as to cancel out a part of the magnetic field of the outer ring-shaped magnet 16 at the outer peripheral end of the evaporation source 5.

The magnetic field which these magnets 15, 16, and 17 form on the evaporation surface 11 of the evaporation source 5 will be specifically described with reference to FIG. In FIG. 5, the magnetic flux density from the north pole to the south pole is represented as positive.
As shown in FIG. 5A, the magnetic field generated by the outer ring-shaped magnet 16 is formed with a high magnetic flux density in the end region of the evaporation surface 11, and the magnetic field generated by the central magnet 15 is shown in FIG. Thus, the outer ring-shaped magnet 16 is formed in the same direction with the central portion of the evaporation surface as the center. Further, the magnetic field generated by the back side ring-shaped magnet 17 is formed in the end region of the evaporation surface 11 in the opposite direction to the magnetic fields of the outer ring-shaped magnet 16 and the central magnet 15 as shown in FIG.
And the magnetic field which acts on the evaporation surface 11 of the evaporation source 5 is formed like the magnetic flux density a shown in FIG. 6 by setting the magnetic flux density of these magnets 15, 16, and 17 suitably. The magnetic flux density b indicates a magnetic field formed by the central magnet 15 and the outer ring-shaped magnet 16, and the magnetic flux density a is obtained by causing the back-side ring-shaped magnet 17 to act on the magnetic flux density b. As shown in the figure, the magnetic flux density at the outer peripheral end of the evaporation surface 11 can be made substantially uniform on the entire surface so as to match the magnetic flux density at the center.

  In the arc ion plating apparatus 1 of the present embodiment, as described above, the back-side ring-shaped magnet 17 is provided, and a part of the magnetic field acts so as to cancel out a part of the magnetic field of the outer ring-shaped magnet 16. 6, the initial setting value (magnetic flux density a) of the magnetic field generated on the surface of the evaporation source 5 by the central magnet 15, the back ring magnet 17, and the outer ring magnet 16 is obtained from the end surface of the evaporation surface 11. The magnetic flux density in the inner region C excluding the ring-shaped end region E in the range of D / 20 is 7 to 10 mT inward, and the magnetic flux density on the surface of the end region E is continuous from the evaporation source center to the evaporation source end. The end region E surface center side is set to 7 to 10 mT, the end region E surface endmost part is set to 15 mT or more, and the standard deviation of the magnetic flux density on the inner region C surface is set to 0.6 or less. Yes.

Further, the magnetic field lines passing through the evaporation source 5 have an angle θ of 0 ° ≦ θ <20 ° with respect to the normal line of the evaporation surface 11, and the angle is directed toward the inner region C on the surface of the ring-shaped end region E. Are formed to be inclined.
As schematically shown in FIG. 7 as a vector of magnetic force lines on the evaporation surface 11, in the inner region C, the angle with respect to the normal line of the evaporation surface 11 is 0 ° ≦ θ <20 ° as indicated by a broken line. In the end region E, as shown by the solid line, the angle of the magnetic force line having a magnetic flux density larger than the magnetic force line of the inner region C with respect to the normal line of the evaporation surface 11 is 0 ° ≦ θ <20 °. It is formed in a state inclined toward C.

A method of forming a film on the workpiece 3 using the arc ion plating apparatus 1 configured as described above will be described.
First, the work 3 is held on the support rod 6 of the table 4 and the inside of the vacuum chamber 2 is evacuated. Then, Ar or the like is introduced from the gas introduction port 7, and oxides on the evaporation source 5 and the work 3 are removed. Impurities are removed by sputtering. Then, after evacuating the inside of the vacuum chamber 2 again, a reactive gas such as nitrogen gas is introduced from the gas introduction port 7, and an arc discharge is generated using the anode electrode 12 directed to the evaporation source 5 as a trigger. 5 is converted into plasma and reacted with a reactive gas, and a nitride film or the like is formed on the surface of the work 3 on the table 4.

During this film forming process, the discharge current is concentrated on a minute region on the evaporation surface 11 of the evaporation source 5, and an arc spot having a diameter of several μm that is extremely active at a high temperature is generated. While moving around at random speed, the evaporation source 5 is instantly dissolved and evaporated and released as ions.
On the evaporation surface 11 of the evaporation source 5, a magnetic field is generated as shown by the solid line in FIG. 6 by the magnets 15, 16, and 17 described above, and this initial set value (magnetic flux density a) is set. The movement of the arc spot is controlled by the action of the applied magnetic field.

Specifically, since the magnetic flux density is 7 to 10 mT on the surface of the inner region C excluding the end region E on the outer periphery of the evaporation source 5, the arc spot generated on the surface of the inner region C is , And is confined in the inner region C. Further, the magnetic field lines on the evaporation surface 11 are set to 0 ° ≦ θ <20 ° with respect to the normal line of the evaporation surface 11 due to the interaction of the magnets 15, 16, and 17 described above. 11 acts to be confined.
Further, in the inner region C, the standard deviation of the magnetic flux density is 0.6 or less, and there is no local concentration, and the arc spot moving speed can be made constant. As a result, the evaporation source 5 can be consumed evenly, the change in smoothness of the thin film surface can be reduced, and a uniform film quality can be formed.

  On the other hand, in the end region E of the evaporation source 5, the magnetic flux density is set to 15 mT or higher, which is larger than the surface of the inner region C. Therefore, even if the arc spot on the surface of the inner region C tends to go to the end region E, It is bounced back by the strong magnetic field in the end region E and returned to the inner region C.

  In addition, since the angle of the magnetic force line with respect to the normal line of the evaporation surface 11 is formed so as to be inclined toward the inner region C in the end region E, there is an effect of returning the arc spot toward the inner region C. According to Robson et al. (Springer, Cathodic arcs, p. 140), the force applied to the arc spot by the magnetic field generated on the evaporation surface 11 is parallel to the evaporation surface 11 when the magnetic field indicated by B in FIG. 8 is taken as an example. The magnetic field component BH becomes a force AH in a direction inclined by 90 ° with respect to the magnetic field component, and the magnetic field component BV perpendicular to the evaporation surface 11 acts on the force AV in the same direction as the parallel magnetic field component BH. The arc spot A is moved by the combined force of the forces AH and AV acting from these magnetic fields. Therefore, the direction of the force AV acting on the arc spot A from the magnetic field can be directed to the inner region C by directing the angle θ of the magnetic force line with respect to the normal line of the evaporation surface 11 to the inner region C. Further, by increasing the magnetic field component BV perpendicular to the evaporation surface 11, the magnitude of the force AV can be increased, and the force for returning the arc spot A to the inner region C can be increased.

By increasing the magnetic flux density in these end regions E and inclining the magnetic field lines toward the inner region C, the arc spot A tends to move to the end regions E as indicated by arrows in FIG. Then, it is returned and returned to the inner area C.
Further, since the arc spot A is confined in the inner region C and restricted beyond the end region E in this way, the phenomenon that the arc spot enters other than the evaporation source surface portion is prevented, and stable discharge is maintained. be able to.

  As described above, in the arc ion plating apparatus 1 according to the present embodiment, the back side ring-shaped magnet 17 is provided, and a part of the magnetic field of the magnetic field of the outer ring-shaped magnet 16 in the end region E of the evaporation source 5 is provided. By acting so as to cancel each other, the initial setting value of the magnetic field generated on the surface of the evaporation source 5 by the central magnet 15, the back ring-shaped magnet 17, and the outer ring-shaped magnet 16 is changed over a wide range (inner region) of the evaporation surface 11. C), the magnetic flux density can be set to 7 to 10 mT, and the standard deviation of the magnetic flux density can be suppressed to 0.6 or less. Therefore, on the surface of the inner region C of the evaporation surface 11, the distribution of the magnetic field can be smoothed and the evaporation source can be evenly consumed, so that the utilization efficiency of the evaporation source can be dramatically improved. In addition, since the moving speed of the arc spot can be made constant, the change in the smoothness of the thin film surface can be reduced, and the film can be formed with uniform film quality.

Examples and comparative examples performed for confirming the effects of the present invention will be described. Examples are shown in Table 1, and Comparative Examples are shown in Table 2.
In the arc ion plating apparatus of the embodiment, a central magnet, an outer ring magnet, and a back ring magnet are provided. A permanent magnet neodymium magnet is used for the center magnet and the outer ring magnet, and a permanent magnet is used for the back ring magnet. A magnet ferrite magnet was used. As the neodymium magnet, a magnet having a coercive force of 2000 kA / m and a surface magnetic flux density of 1150 mT was used, and as the ferrite magnet, a magnet having a coercive force of 250 kA / m and a surface magnetic flux density of 350 mT was used. Further, in the arc ion plating apparatus of the comparative example, a configuration including only a central magnet and an outer ring magnet was used, and permanent magnet neodymium magnets were used as the central magnet and the outer ring magnet. As the neodymium magnet, a magnet having a coercive force of 2000 kA / m and a surface magnetic flux density of 1150 mT was used.
Further, Ti or TiAl (Ti: Al = 50: 50) having a diameter D = 100 mm and a thickness t = 16 mm was used as an evaporation source. In the arc ion plating apparatus of the example, the back side ring-shaped magnet was arranged so that the center position of the ring width was within the range of D / 20 (within 5 mm) from the end face of the evaporation source. .

Next, when the evaporation source was arranged in the arc ion plating apparatus of the example and the comparative example and the magnetic field on the evaporation surface was measured, the results shown in Table 1 and Table 2 were obtained. In “Sample No.” in the table, “actual” was given to the examples, and “ratio” was given to the comparative examples.
The magnetic flux density was measured on a straight line passing through the center of the evaporation source surface at the evaporation source surface with a magnetometer. On the surface of the evaporation source, the measurement locations were set at 5 mm intervals, and the magnetic flux density in the vertical direction and parallel direction of the evaporation source surface was measured at each measurement point. Further, from these measured values, the magnetic flux density at each measurement point and the angle (tilt angle) formed by the lines of magnetic force and the normal line of the evaporation surface were calculated. Further, the standard deviation of the magnetic flux density on the surface of the evaporation source was calculated from the numerical value of the magnetic flux density excluding the portion where the magnetic flux density in the end region was large.
Using such an arc ion plating apparatus, a film was formed under various conditions shown in Tables 1 and 2, and the surface roughness of the film was measured. Nitrogen gas was used as the reaction gas. The surface roughness was measured 10 times in a 10 μm square range with a laser microscope, and the average value was taken as the measured value.
Tables 1 and 2 show the results. “Evaporation source utilization efficiency” represents the ratio of the consumption thickness t1 until reaching the limit thickness at which the evaporation source can be used with respect to the thickness t of the evaporation source before film formation, and is expressed as t1 / t × 100 (% ). The consumption thickness t1 is an in-plane average value of the evaporation source. For example, when the consumption thickness t1 is a circular evaporation source similar to the embodiment, the consumption depth is measured at intervals of 5 mm on a straight line passing through the center on the surface of the evaporation source, and the average value is calculated as the consumption thickness. T1. Further, “end region” in the table indicates a range of D / 20 from the end face of the evaporation source.

As is apparent from the results of Tables 1 and 2, it can be seen that the “evaporation source utilization efficiency” is as high as 70% or more in the apparatus of the example where the standard deviation of the magnetic flux density is 0.6 or less. Further, it can be seen that the value of “standard deviation of surface roughness” is smaller than the value of “maximum surface roughness Ra”, and the variation of the surface roughness on the film surface is small.
It can be seen that in the apparatus of the comparative example in which the standard deviation of the magnetic flux density exceeds 0.6, the “utilization efficiency of the evaporation source” is as small as 60% or less. In addition, the value of “standard deviation of surface roughness” is larger than the value of “maximum surface roughness Ra”, and it can be seen that the variation in surface roughness on the film surface is large.

In addition, this invention is not limited to the said embodiment, A various change can be added in the range which does not deviate from the meaning of this invention.
For example, in the above embodiment, the evaporation source is formed in a disk shape, but it can also be applied to a columnar shape, a cylindrical shape, etc. In this case, the end region is within the range of D / 20 from the end surface. The magnetic field as described above may be set.

DESCRIPTION OF SYMBOLS 1 Arc ion plating apparatus 2 Vacuum chamber 3 Work 4 Table 5 Evaporation source 6 Support rod 7 Gas introduction port 8 Gas discharge port 9 Heater 11 Evaporation surface 12 Anode electrode 13 Arc power supply 14 Bias power supply 15 Central magnet 16 Outer ring magnet 17 Back side magnet

Claims (2)

  A central magnet disposed in the center of the back surface of the cathode on which the evaporation source is placed, a back side ring-shaped magnet disposed facing the outer peripheral end of the back surface of the cathode, and disposed radially outward of the evaporation source The outer ring-shaped magnet is configured such that the back ring magnet and the outer ring magnet have the same polarity direction, and the central magnet has a polarity direction of the back ring magnet and the outer ring magnet. If the diameter of the evaporation source is set to D and the diameter of the evaporation source is set to D, the center position of the ring width of the back side ring magnet is within the range of D / 20 from the end face of the evaporation source. The initial value of the magnetic field generated on the surface of the evaporation source by the central magnet, the back ring magnet, and the outer ring magnet is in the range of D / 20 inward from the end surface of the evaporation surface. Inner area excluding edge area The magnetic flux density on the surface is 7-10 mT, and the magnetic flux density on the surface of the end region is continuously increased from the evaporation source center side to the evaporation source end side. An arc ion plating apparatus characterized in that the end is set to 15 mT or more and the standard deviation of the magnetic flux density on the inner region surface is set to 0.6 or less. The magnetic field lines on the evaporation surface have an angle θ with respect to a normal line of the evaporation surface of 0 ° ≦ θ <20 °, and the end region surface is inclined toward the inner region. The arc ion plating apparatus described.

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