JP2013012756A

JP2013012756A - Magnetoresistance effect element and nonvolatile magnetic memory equipped with the same

Info

Publication number: JP2013012756A
Application number: JP2012181783A
Authority: JP
Inventors: Jun Hayakawa; 純早川; Hideo Ono; 英男大野; Shoji Ikeda; 正二池田
Original assignee: Tohoku University NUC; Hitachi Ltd
Current assignee: Tohoku University NUC; Hitachi Ltd
Priority date: 2005-07-28
Filing date: 2012-08-20
Publication date: 2013-01-17
Anticipated expiration: 2026-06-30
Also published as: JP5591888B2

Abstract

PROBLEM TO BE SOLVED: To provide a nonvolatile memory operates at high speed and has extremely low power consumption.SOLUTION: A nonvolatile magnetic memory is equipped with a high-output tunnel magnetoresistance effect element, and applies a writing method by spin-transfer torque. The tunnel magnetoresistance effect element 1 comprises a structure obtained by laminating a ferromagnetic film 304 having a body-centered cubic structure containing Co, Fe and B; an MgO insulating film 305 having a rock-salt structure oriented in (100); and a ferromagnetic film 306.

Description

本発明は、高出力トンネル磁気抵抗素子及びそれを装備した低消費電力不揮発性磁気メモリに関するものである。 The present invention relates to a high-power tunnel magnetoresistive element and a low power consumption nonvolatile magnetic memory equipped with the same.

従来のトンネル磁気抵抗効果素子は、Ａｌの酸化物を絶縁膜に用いたトンネル積層膜を用いていた（T. Miyazaki and N. Tezuka, J. Magn. Magn. Mater. 139, L231 (1995)）が、Ａｌ酸化物は非晶質であるため工業的に使用するための十分な電気的出力信号を得ることができなかった。最近、絶縁膜に酸化マグネシウムを用いたトンネル磁気抵抗効果素子において、上記のＡｌの酸化物を絶縁体に用いたトンネル磁気抵抗効果素子よりも数倍大きい磁気抵抗比が得られることが報告された（S. Yuasa. et al., Nature Material 3, 868(2004)）。また、従来の不揮発性磁気メモリは、ＭＯＳＦＥＴ上にトンネル磁気抵抗効果素子を形成したメモリセルにより構成される。スイッチングはＭＯＳＦＥＴを利用し、ビット線とワード線に通電させることにより発生する電流誘起の空間磁場を使ってトンネル磁気抵抗効果素子の磁化方向を回転させ、情報を書込み、トンネル磁気抵抗効果素子の出力電圧により情報を読み出す方式である。また、上記電流誘起の空間磁場を使った磁化回転のほかに、直接磁気抵抗効果素子に電流を流すことにより磁化を回転させるいわゆるスピントランスファートルク磁化反転あるいは同義であるスピン注入磁化反転方式があり、例えば米国特許第５，６９５，８６４号明細書あるいは特開２００２−３０５３３７号公報に開示されている。 A conventional tunnel magnetoresistive element uses a tunnel laminated film using an oxide of Al as an insulating film (T. Miyazaki and N. Tezuka, J. Magn. Magn. Mater. 139, L231 (1995)). However, since the Al oxide is amorphous, a sufficient electrical output signal for industrial use cannot be obtained. Recently, it has been reported that a tunnel magnetoresistive effect element using magnesium oxide as an insulating film can obtain a magnetoresistance ratio several times larger than that of a tunnel magnetoresistive effect element using the above-described Al oxide as an insulator. (S. Yuasa. Et al., Nature Material 3, 868 (2004)). A conventional nonvolatile magnetic memory is constituted by a memory cell in which a tunnel magnetoresistive element is formed on a MOSFET. Switching uses a MOSFET to rotate the magnetization direction of the tunnel magnetoresistive element using the current-induced spatial magnetic field generated by energizing the bit line and the word line, write information, and output the tunnel magnetoresistive element This is a method of reading information by voltage. In addition to the magnetization rotation using the current-induced spatial magnetic field, there is a so-called spin transfer torque magnetization reversal or synonymous spin injection magnetization reversal method in which magnetization is rotated by passing a current directly through the magnetoresistive element, For example, it is disclosed in US Pat. No. 5,695,864 or JP-A-2002-305337.

米国特許第５，６９５，８６４号明細書US Pat. No. 5,695,864 特開２００２−３０５３３７号公報JP 2002-305337 A

J. Magn. Magn. Mater. 139, L231 (1995)J. Magn. Magn. Mater. 139, L231 (1995) Nature Material 3, 868(2004)Nature Material 3, 868 (2004)

低消費電力不揮発性磁気メモリの実現には、トンネル磁気抵抗効果素子の高出力化とトンネル磁気抵抗効果素子へのスピントランスファートルク磁化反転による書込み方式を同時に満足する技術を開発することが重要な課題である。 To realize low-power non-volatile magnetic memory, it is important to develop a technology that simultaneously satisfies the high output of the tunnel magnetoresistive element and the write method by spin transfer torque magnetization reversal to the tunnel magnetoresistive element It is.

本発明は、このような要請に応えることのできるトンネル磁気抵抗効果素子及び不揮発性磁気メモリを提供することを目的とする。 It is an object of the present invention to provide a tunnel magnetoresistive element and a nonvolatile magnetic memory that can meet such a demand.

本発明は、上記の課題を解決するために、トンネル磁気抵抗効果素子の強磁性膜にＢを含むＣｏあるいはＦｅの体心立方格子をもつ化合物強磁性膜を用い、また絶縁膜に酸化マグネシウムを用いる。 In order to solve the above problems, the present invention uses a compound ferromagnetic film having a body-centered cubic lattice of Co or Fe containing B as a ferromagnetic film of a tunnel magnetoresistive element, and magnesium oxide as an insulating film. Use.

すなわち、本発明によるトンネル磁気抵抗効果素子は、絶縁膜と、その絶縁膜を挟んで設けられた第一の強磁性膜と第二の強磁性膜とを有し、第一の強磁性膜はＣｏとＦｅとＢを含有する体心立方構造の膜であり、絶縁膜は（１００）配向した岩塩構造のＭｇＯ膜であることを特徴とする。第二の強磁性膜は、ＣｏとＦｅとＢを含有する体心立方構造の膜であってもよい。また、第一の強磁性膜はＣｏとＦｅの組成比（ａｔｍ％の比）が５０：５０〜７０：３０であるのが好ましい。絶縁膜にＭｇＯを適用したトンネル磁気抵抗効果素子では、図８に示すように体心立方構造が安定に存在し、かつＣｏをＦｅより多く含むことでトンネル磁気抵抗比に寄与するスピン分極率を向上できるためである。ＣｏとＦｅとＢを含有する体心立方構造の強磁性膜は、膜厚が３ｎｍ以下で、Ｂを１０〜３０％ａｔｍ含有するのが好ましい。 That is, the tunnel magnetoresistive effect element according to the present invention has an insulating film, a first ferromagnetic film and a second ferromagnetic film sandwiched between the insulating films, and the first ferromagnetic film is The film is a body-centered cubic structure film containing Co, Fe, and B, and the insulating film is a (100) -oriented rock salt structure MgO film. The second ferromagnetic film may be a body-centered cubic film containing Co, Fe, and B. The first ferromagnetic film preferably has a Co / Fe composition ratio (atm% ratio) of 50:50 to 70:30. In the tunnel magnetoresistive effect element in which MgO is applied to the insulating film, as shown in FIG. 8, the body-centered cubic structure exists stably, and the spin polarizability contributing to the tunnel magnetoresistive ratio is increased by containing more Co than Fe. It is because it can improve. The body-centered cubic structure ferromagnetic film containing Co, Fe and B preferably has a film thickness of 3 nm or less and contains B at 10 to 30% atm.

本発明による磁気メモリは、トンネル磁気抵抗効果素子と、トンネル磁気抵抗効果素子に流れる電流をオン・オフ制御するスイッチング素子とを備える磁気メモリであり、トンネル磁気抵抗効果素子は、絶縁膜と、絶縁膜を挟んで設けられた第一の強磁性膜と第二の強磁性膜とを有し、第一の強磁性膜はＣｏとＦｅとＢを含有する体心立方構造の膜であり、絶縁膜は（１００）配向した岩塩構造のＭｇＯ膜であることを特徴とする。 A magnetic memory according to the present invention is a magnetic memory including a tunnel magnetoresistive effect element and a switching element that controls on / off of a current flowing through the tunnel magnetoresistive effect element. A first ferromagnetic film and a second ferromagnetic film provided on both sides of the film, the first ferromagnetic film being a body-centered cubic structure film containing Co, Fe, and B, and insulating The film is characterized by being a (100) -oriented rock salt structure MgO film.

本発明による磁気ランダムアクセスメモリは、複数の磁気メモリセルと、所望の磁気メモリセルを選択する手段とを備える磁気ランダムアクセスメモリであり、磁気メモリセルは、ＣｏとＦｅとＢを含有する体心立方構造の第一の強磁性膜と、（１００）配向した岩塩構造のＭｇＯ絶縁膜と、第二の強磁性膜とが積層されたトンネル磁気抵抗効果素子を含むことを特徴とする。 A magnetic random access memory according to the present invention is a magnetic random access memory comprising a plurality of magnetic memory cells and means for selecting a desired magnetic memory cell, and the magnetic memory cell includes a body core containing Co, Fe, and B. It includes a tunnel magnetoresistive element in which a first ferromagnetic film having a cubic structure, an MgO insulating film having a (100) -oriented rock salt structure, and a second ferromagnetic film are stacked.

本発明によると、高出力なトンネル磁気抵抗効果素子が得られる。また、そのトンネル磁気抵抗効果素子を磁気メモリに装備することにより、高速かつ消費電力が極めて小さい不揮発性メモリを実現することができる。 According to the present invention, a high-power tunnel magnetoresistive element can be obtained. In addition, by installing the tunnel magnetoresistive element in a magnetic memory, a non-volatile memory with high speed and extremely low power consumption can be realized.

本発明のトンネル磁気抵抗効果素子の第一の構成例を示した図である。It is the figure which showed the 1st structural example of the tunnel magnetoresistive effect element of this invention. 本発明のトンネル磁気抵抗効果素子の第二の構成例を示した図である。It is the figure which showed the 2nd structural example of the tunnel magnetoresistive effect element of this invention. 本発明のトンネル磁気抵抗効果素子の第三の構成例を示した図である。It is the figure which showed the 3rd structural example of the tunnel magnetoresistive effect element of this invention. 本発明のトンネル磁気抵抗効果素子の第四の構成例を示した図である。It is the figure which showed the 4th structural example of the tunnel magnetoresistive effect element of this invention. 本発明のトンネル磁気抵抗効果素子の第五の構成例を示した図である。It is the figure which showed the 5th structural example of the tunnel magnetoresistive effect element of this invention. 本発明のトンネル磁気抵抗効果素子の第六の構成例を示した図である。It is the figure which showed the 6th structural example of the tunnel magnetoresistive effect element of this invention. 本発明の磁気メモリセルの構成例を示した図である。It is the figure which showed the structural example of the magnetic memory cell of this invention. Ｃｏ_ｘＦｅ_{１００−ｘ}の組成に対する結晶構造を示した図である。It is a diagram showing the crystal structure on the composition of Co _{_x} Fe _{_100-x.} 本発明の磁気メモリセルの構成例を示した図である。It is the figure which showed the structural example of the magnetic memory cell of this invention. 本発明のトンネル磁気抵抗素子のＴＭＲ比と熱処理温度依存性を示した図である。It is the figure which showed the TMR ratio and heat processing temperature dependence of the tunnel magnetoresistive element of this invention.

以下、図面を参照して本発明の実施の形態を説明する。 Embodiments of the present invention will be described below with reference to the drawings.

［実施例１］
図１は、本発明によるトンネル磁気抵抗効果素子の一例を示す断面模式図である。このトンネル磁気抵抗効果素子１は、配向制御膜３００、反強磁性膜３０１、強磁性膜３０２、非磁性膜３０３、強磁性膜３０４、絶縁膜３０５、強磁性膜３０６、保護膜３０７を積層して形成され、適当な温度で熱処理することにより磁気抵抗比が最適化される。本実施例では、トンネル磁気抵抗効果素子はスパッタリング法を用いて作製した。 [Example 1]
FIG. 1 is a schematic cross-sectional view showing an example of a tunnel magnetoresistive effect element according to the present invention. The tunnel magnetoresistive effect element 1 includes an orientation control film 300, an antiferromagnetic film 301, a ferromagnetic film 302, a nonmagnetic film 303, a ferromagnetic film 304, an insulating film 305, a ferromagnetic film 306, and a protective film 307. The magnetoresistance ratio is optimized by heat treatment at an appropriate temperature. In this example, the tunnel magnetoresistive effect element was produced using a sputtering method.

配向制御膜３００はＮｉＦｅ（５ｎｍ）により形成したが、Ｔａ（５ｎｍ）／ＮｉＦｅ（５ｎｍ）の２層膜など、上記反強磁性膜３０１の配向性を向上させ、安定した反強磁性結合を実現することのできる他の材料を用いてもよい。反強磁性膜３０１にはＭｎＩｒ（８ｎｍ）を用いたが、膜厚は５〜１５ｎｍの範囲で選択可能である。また、ＭｎＰｔ，ＭｎＦｅなど、Ｍｎ化合物で構成される反強磁性膜を用いても安定に反強磁性結合を実現できる。強磁性膜３０２にはＣｏＦｅ（２ｎｍ）を、非磁性膜３０３にはＲｕ（０．８ｎｍ）を、強磁性膜３０４には体心立方格子をもつＣｏＦｅＢ（３ｎｍ）を用いた。強磁性膜３０２のＣｏＦｅの組成比は、主としてＣｏ組成が５０〜９０ａｔｍ％の間で使用した。この組成範囲において、上記反強磁性膜と安定した反強磁性結合を実現できる。強磁性膜３０２、非磁性膜３０３、強磁性膜３０４は、強磁性膜３０２と強磁性膜３０４の磁化が反強磁性結合するような材料を選択し、それぞれの膜厚は強磁性膜３０２と強磁性膜３０４の磁化の大きさが等しくなるように選択した。絶縁膜３０５は、岩塩構造をもつ酸化マグネシウム結晶膜を用い、（１００）方向に配向した膜である。絶縁膜の膜厚は０．８ｎｍ〜３ｎｍの範囲で使用した。強磁性膜３０６は体心立方格子をもつＣｏＦｅＢ（３ｎｍ）を用いた。強磁性膜３０４と強磁性膜３０６のＣｏＦｅＢのＣｏとＦｅの組成は５０：５０〜７０：３０で使用するのが好ましい。この組成範囲では、図８に示すように、体心立方構造が安定に存在し、かつ絶縁膜３０５にＭｇＯを適用したトンネル磁気抵抗効果素子１では、ＣｏをＦｅより多く含むことでトンネル磁気抵抗比に寄与するスピン分極率を向上できるためである。 Although the orientation control film 300 is formed of NiFe (5 nm), the orientation of the antiferromagnetic film 301 such as a two-layer film of Ta (5 nm) / NiFe (5 nm) is improved to realize stable antiferromagnetic coupling. Other materials that can be used may be used. Although MnIr (8 nm) was used for the antiferromagnetic film 301, the film thickness can be selected in the range of 5 to 15 nm. Further, even when an antiferromagnetic film made of a Mn compound such as MnPt or MnFe is used, antiferromagnetic coupling can be realized stably. CoFe (2 nm) was used for the ferromagnetic film 302, Ru (0.8 nm) was used for the nonmagnetic film 303, and CoFeB (3 nm) having a body-centered cubic lattice was used for the ferromagnetic film 304. The CoFe composition ratio of the ferromagnetic film 302 was mainly used when the Co composition was 50 to 90 atm%. In this composition range, stable antiferromagnetic coupling with the antiferromagnetic film can be realized. For the ferromagnetic film 302, the nonmagnetic film 303, and the ferromagnetic film 304, materials are selected so that the magnetizations of the ferromagnetic film 302 and the ferromagnetic film 304 are antiferromagnetically coupled. The ferromagnetic films 304 were selected so that the magnitudes of magnetization were equal. The insulating film 305 is a film oriented in the (100) direction using a magnesium oxide crystal film having a rock salt structure. The thickness of the insulating film was used in the range of 0.8 nm to 3 nm. As the ferromagnetic film 306, CoFeB (3 nm) having a body-centered cubic lattice was used. The composition of Co and Fe of CoFeB in the ferromagnetic film 304 and the ferromagnetic film 306 is preferably 50:50 to 70:30. In this composition range, as shown in FIG. 8, in the tunnel magnetoresistive effect element 1 in which the body-centered cubic structure is stably present and MgO is applied to the insulating film 305, the tunnel magnetoresistance is increased by containing Co more than Fe. This is because the spin polarizability contributing to the ratio can be improved.

強磁性膜３０４、強磁性膜３０６に使用できるＣｏＦｅＢ及びＣｏＦｅの組成を記載した例を表１に示す。トンネル磁気抵抗効果素子１において大きなＴＭＲ比を得るには、強磁性膜３０４及び強磁性膜３０６にＣｏＦｅＢを用い、Ｃｏ組成は５０〜９０ａｔｍ％の間で使用することが望ましいが、ＣｏのＦｅに対する組成比が０〜５０ａｔｍ％の間で使用することも可能である。このＣｏ組成を使用した場合、ＴＭＲ比の大きさはＣｏ組成が５０〜９０ａｔｍ％の場合に比べて低下するが、トンネル磁気抵抗効果素子に印加する電圧依存性が改善される傾向にある。通常ＴＭＲ比は印加電圧が大きくなるにつれて減少する傾向を示すが、Ｃｏ組成０〜５０ａｔｍ％の間の組成では、その減少率が最大で半減できる。 Table 1 shows an example in which the composition of CoFeB and CoFe that can be used for the ferromagnetic film 304 and the ferromagnetic film 306 is described. In order to obtain a large TMR ratio in the tunnel magnetoresistive effect element 1, it is desirable to use CoFeB for the ferromagnetic film 304 and the ferromagnetic film 306 and to use Co composition between 50 to 90 atm%. It is also possible to use the composition ratio between 0 and 50 atm%. When this Co composition is used, the magnitude of the TMR ratio is reduced as compared with the case where the Co composition is 50 to 90 atm%, but the dependency on the voltage applied to the tunnel magnetoresistive element tends to be improved. Usually, the TMR ratio shows a tendency to decrease as the applied voltage increases, but the reduction rate can be reduced to half at maximum in the composition of Co composition of 0 to 50 atm%.

上記強磁性膜３０４と強磁性膜３０６のＣｏＦｅＢは、非結晶であってもよく、適当な温度での熱処理により結晶化させてもよい。また、ＣｏＦｅＢの組成比は、体心立方格子となるＣｏ組成が４０〜６０ａｔｍ％、Ｂ組成が１０〜３０ａｔｍ％の間で使用した。さらに、強磁性膜３０６にはＣｏＦｅＢ以外に、ＣｏＦｅの単層膜、ＮｉＦｅの単層膜、ＣｏＦｅ／ＮｉＦｅあるいはＣｏＦｅＢ／ＮｉＦｅの２層膜を用いてもよい。このときのＣｏＦｅのＣｏ組成は体心立方格子が安定である５０ａｔｍ％としたが、５０〜９０％の間で使用してよい。Ｃｏ組成が大きいと、面心立方格子が安定であり、トンネル磁気抵抗比は減少するが、磁気フリー層として保磁力の小さい良好な磁気特性が実現でき、スピントランスファートルク磁化反転の閾値電流密度をそれぞれの磁気モーメントの大きさに対応して変化させることができる。保護膜３０７は、Ｔａ（５ｎｍ）／Ｒｕ（５ｎｍ）の２層膜で形成した。 The CoFeB of the ferromagnetic film 304 and the ferromagnetic film 306 may be amorphous, or may be crystallized by heat treatment at an appropriate temperature. Moreover, the composition ratio of CoFeB was used between 40 to 60 atm% for the Co composition to be a body-centered cubic lattice and 10 to 30 atm% for the B composition. Further, in addition to CoFeB, the ferromagnetic film 306 may be a single layer film of CoFe, a single layer film of NiFe, or a double layer film of CoFe / NiFe or CoFeB / NiFe. The Co composition of CoFe at this time is 50 atm% where the body-centered cubic lattice is stable, but may be used between 50 and 90%. When the Co composition is large, the face-centered cubic lattice is stable and the tunnel magnetoresistive ratio decreases, but as a magnetic free layer, good magnetic characteristics with a small coercive force can be realized, and the threshold current density of spin transfer torque magnetization reversal is reduced. It can be changed corresponding to the magnitude of each magnetic moment. The protective film 307 was formed of a two-layer film of Ta (5 nm) / Ru (5 nm).

素子加工にはフォトリソグラフィーとイオンミリングを用い、０．８μｍ×１．６μｍの面積をもつトンネル磁気抵抗効果素子を作製した。このように作製されたトンネル磁気抵抗効果素子のトンネル磁気抵抗比は、熱処理を施すことにより増大させることが可能であり、強磁性膜３０６にＣｏＦｅＢを用いた構成では、３７５℃以上で、１時間程度の熱処理を施すことにより２５０％に達した。また、絶縁膜３０５の厚さが０．８ｎｍから３．０ｎｍの範囲では、１００％以上のトンネル磁気抵抗比を示した。また、熱処理の温度は４００℃まで上昇させても、１５０％以上の良好な磁気抵抗比を得ることが可能である。特に、熱処理によりＣｏＦｅＢは結晶化することが確認され、結晶化した後のＣｏＦｅＢが体心立方格子の結晶構造をもつ場合に、トンネル磁気抵抗比は最も大きくなった。さらに、上記酸化マグネシウムの（１００）配向膜は、非晶質の強磁性膜の上にスパッタ法を用いて作製することは可能であるが、多結晶構造をもつ強磁性膜の上にスパッタ法を用いて作製した場合、良好な（１００）配向膜を得ることは困難であり、トンネル磁気抵抗比は最大でも５０％にとどまった。したがって、強磁性膜３０４と強磁性膜３０６が結晶のＣｏＦｅＢであり、かつ絶縁膜３０５が（１００）配向の結晶の酸化マグネシウムであるトンネル磁気抵抗効果素子１で、２００％以上のトンネル磁気抵抗比が得られている素子は、必ず製膜時の強磁性膜３０４と強磁性膜３０６は非結晶のＣｏＦｅＢであって、熱処理の過程を経て作製されたものであることを示している。 A tunnel magnetoresistive effect element having an area of 0.8 μm × 1.6 μm was manufactured by photolithography and ion milling for element processing. The tunnel magnetoresistive ratio of the tunnel magnetoresistive effect element manufactured in this way can be increased by performing heat treatment. In the configuration using CoFeB for the ferromagnetic film 306, it is 1 hour at 375 ° C. or more. It reached 250% by applying a degree of heat treatment. Further, when the thickness of the insulating film 305 was in the range of 0.8 nm to 3.0 nm, a tunnel magnetoresistance ratio of 100% or more was shown. Moreover, even if the temperature of the heat treatment is increased to 400 ° C., a good magnetoresistance ratio of 150% or more can be obtained. In particular, it was confirmed that CoFeB was crystallized by the heat treatment, and when the CoFeB after crystallization had a body-centered cubic lattice crystal structure, the tunnel magnetoresistance ratio was the largest. Further, the (100) oriented film of magnesium oxide can be formed on an amorphous ferromagnetic film by a sputtering method, but a sputtering method is applied on a ferromagnetic film having a polycrystalline structure. When using this, it was difficult to obtain a good (100) orientation film, and the tunnel magnetoresistance ratio was only 50% at the maximum. Therefore, the tunnel magnetoresistance effect element 1 in which the ferromagnetic film 304 and the ferromagnetic film 306 are crystalline CoFeB and the insulating film 305 is (100) -oriented crystalline magnesium oxide has a tunnel magnetoresistance ratio of 200% or more. In the device obtained, the ferromagnetic film 304 and the ferromagnetic film 306 at the time of film formation are necessarily amorphous CoFeB and are manufactured through a heat treatment process.

トンネル磁気抵抗効果素子１は、強磁性膜３０４をＣｏＦｅＢ、絶縁膜３０５をＭｇＯ、強磁性膜３０６をＣｏＦｅＢとし、反強磁性膜３０１を使用しない構造であり、強磁性膜３０４と強磁性膜３０６の磁気異方性のあるいは保磁力の大きさの違いを利用してＴＭＲ比を得る積層構造を使用してもよい。例えば、Ｔａ／ＣｏＦｅＢ／ＭｇＯ／ＣｏＦｅＢ／Ｔａの積層構造を用い、それぞれの膜において適当な膜厚を選ぶことにより、図１０に示すように、熱処理温度４５０℃において、４５０％のＴＭＲ比を得る。上記ＣｏＦｅＢの組成は、Ｃｏ：Ｆｅ：Ｂが４０：４０：２０（ａｔｍ％）である場合に、最大のＴＭＲ比を得ることができるが、Ｂ組成を０〜３０（ａｔｍ％）として、Ｃｏ：Ｆｅは０〜１００ａｔｍ％の間の任意の組成を選んでもよい。その組成比は表１に示すように、［Ｃｏ（１００−ｘ）Ｆｅ（ｘ）］（１００−ｙ）Ｂ（ｙ）、０＜ｘ＜１００（％）、０＜ｙ＜３０（％）の関係にある。表１は、本発明の強磁性膜に使用する可能な材料とその組成例を示した表である。上記Ｔａ以外に融点の高い非晶質膜を使用することも有効である。この場合の構造では、反強磁性膜３０１に用いられるＭｎ化合物のＭｎなどの熱拡散がないため、高い熱処理温度でさらに高いＴＭＲ比を得る事が可能となる。 The tunnel magnetoresistive element 1 has a structure in which the ferromagnetic film 304 is CoFeB, the insulating film 305 is MgO, the ferromagnetic film 306 is CoFeB, and the antiferromagnetic film 301 is not used. A laminated structure that obtains the TMR ratio by utilizing the difference in magnetic anisotropy or coercive force may be used. For example, by using a laminated structure of Ta / CoFeB / MgO / CoFeB / Ta and selecting an appropriate film thickness for each film, a TMR ratio of 450% is obtained at a heat treatment temperature of 450 ° C. as shown in FIG. . The composition of CoFeB can obtain the maximum TMR ratio when Co: Fe: B is 40:40:20 (atm%). : Fe may select any composition between 0 and 100 atm%. As shown in Table 1, the composition ratio is [Co (100-x) Fe (x)] (100-y) B (y), 0 <x <100 (%), 0 <y <30 (%) Are in a relationship. Table 1 is a table showing possible materials used for the ferromagnetic film of the present invention and examples of compositions thereof. It is also effective to use an amorphous film having a high melting point other than Ta. In the structure in this case, since there is no thermal diffusion of Mn of the Mn compound used for the antiferromagnetic film 301, it is possible to obtain a higher TMR ratio at a high heat treatment temperature.

上記のように、製膜時非晶質であった強磁性膜３０４と強磁性膜３０６を熱処理により結晶化させてトンネル磁気抵抗効果素子１を作製する方法は、従来の方法とは異なる。ただし、強磁性膜３０６にＣｏＦｅ単層膜、ＮｉＦｅ単層膜、ＣｏＦｅ／ＮｉＦｅ膜を使用したトンネル磁気抵抗効果素子１では、これらの強磁性膜３０６は製膜時から結晶質であり、熱処理により強磁性膜３０４のみが結晶化することになる。強磁性膜３０６にＣｏＦｅ単層膜、ＮｉＦｅ単層膜、ＣｏＦｅ／ＮｉＦｅ膜を使用したトンネル磁気抵抗効果素子１の最大のトンネル磁気抵抗比は、それぞれ、２００％、４０％、１５０％であった。 As described above, the method of fabricating the tunnel magnetoresistive effect element 1 by crystallizing the ferromagnetic film 304 and the ferromagnetic film 306 that were amorphous at the time of film formation by heat treatment is different from the conventional method. However, in the tunnel magnetoresistive effect element 1 using a CoFe single layer film, a NiFe single layer film, and a CoFe / NiFe film as the ferromagnetic film 306, these ferromagnetic films 306 are crystalline from the time of film formation and are subjected to heat treatment. Only the ferromagnetic film 304 is crystallized. The maximum tunnel magnetoresistance ratio of the tunnel magnetoresistive element 1 using a CoFe single layer film, a NiFe single layer film, and a CoFe / NiFe film as the ferromagnetic film 306 was 200%, 40%, and 150%, respectively. .

［実施例２］
図２は、本発明によるトンネル磁気抵抗効果素子の他の例を示す断面模式図である。このトンネル磁気抵抗効果素子２は、配向制御膜３００、強磁性膜３０６、絶縁膜３０５、強磁性膜３０４、非磁性膜３０３、強磁性膜３０２、反強磁性膜３０１、保護膜３０７を積層して形成した。特に強磁性膜３０６及び強磁性層膜３０４にＣｏＦｅＢを用いた場合、その結晶構造は体心立方格子であり、絶縁膜３０５は（１００）に高配向した岩塩構造をもつＭｇＯである。 [Example 2]
FIG. 2 is a schematic cross-sectional view showing another example of the tunnel magnetoresistive effect element according to the present invention. The tunnel magnetoresistive effect element 2 includes an orientation control film 300, a ferromagnetic film 306, an insulating film 305, a ferromagnetic film 304, a nonmagnetic film 303, a ferromagnetic film 302, an antiferromagnetic film 301, and a protective film 307. Formed. In particular, when CoFeB is used for the ferromagnetic film 306 and the ferromagnetic layer film 304, the crystal structure is a body-centered cubic lattice, and the insulating film 305 is MgO having a rock salt structure highly oriented to (100).

本構成のトンネル磁気抵抗効果素子２では、強磁性膜３０６は、配向絶縁膜３００に隣接して作製され平坦性に優れているため、実施例１の構造に比べて強磁性膜３０６の軟磁気特性が向上する。例えば、結晶化した後のＣｏＦｅＢの保磁力が実施例１に比べて半減する。絶縁膜３０５も平坦な膜に形成される。しかし、反強磁性膜３０１がトンネル磁気抵抗効果素子２の積層方向の上方に製膜されるため、当該膜の配向性が実施例１に比べ劣化するため反強磁性結合が弱くなり、実施例１に比べ耐熱処理特性が劣化し、４００℃の熱処理によりトンネル磁気抵抗比は減少する傾向を示す。トンネル磁気抵抗効果素子２の作製方法、それぞれの膜に使用した材料は実施例１と同様である。また、このトンネル磁気抵抗効果素子２によって得られた磁気抵抗比は、実施例１とほぼ同様の２００％であった。 In the tunnel magnetoresistive effect element 2 of this configuration, the ferromagnetic film 306 is formed adjacent to the alignment insulating film 300 and has excellent flatness. Therefore, the soft magnetism of the ferromagnetic film 306 is larger than that of the structure of the first embodiment. Improved characteristics. For example, the coercivity of CoFeB after crystallization is halved compared to Example 1. The insulating film 305 is also formed as a flat film. However, since the antiferromagnetic film 301 is formed above the tunnel magnetoresistive element 2 in the stacking direction, the orientation of the film is deteriorated as compared with the first embodiment, so that the antiferromagnetic coupling becomes weaker. Compared to 1, the heat resistance treatment characteristics are deteriorated, and the tunnel magnetoresistance ratio tends to decrease by heat treatment at 400 ° C. The manufacturing method of the tunnel magnetoresistive effect element 2 and the materials used for the respective films are the same as those in Example 1. Further, the magnetoresistive ratio obtained by the tunnel magnetoresistive element 2 was 200%, which was almost the same as that in Example 1.

［実施例３］
図３は、本発明によるトンネル磁気抵抗効果素子の他の例を示す断面模式図である。このトンネル磁気抵抗効果素子３は、図１に示したトンネル磁気抵抗効果素子１の構成において、強磁性膜３０６の上に、非磁性膜３０８、強磁性膜３０９、反強磁性膜３１０、保護膜３０７を、この順に積層したものに相当する。 [Example 3]
FIG. 3 is a schematic cross-sectional view showing another example of the tunnel magnetoresistive effect element according to the present invention. This tunnel magnetoresistive element 3 has the same structure as the tunnel magnetoresistive element 1 shown in FIG. 1 except that a nonmagnetic film 308, a ferromagnetic film 309, an antiferromagnetic film 310, and a protective film are formed on the ferromagnetic film 306. 307 corresponds to the stacked layers in this order.

本実施例では、非磁性膜３０８にＲｕ（６ｎｍ）を、強磁性膜３０９にＣｏＦｅ（２ｎｍ）を、反強磁性膜３１０にＭｎＩｒ（８ｎｍ）を用いた。強磁性膜３０９のＣｏＦｅの組成比は、反強磁性膜３１０との間に反強磁性結合が安定して実現できるＣｏ組成が５０〜９０％の間で使用した。非磁性膜３０８はＲｕ（６ｎｍ）以外に、強磁性膜３０６と強磁性膜３０９の間の磁気的な結合が消失する材料、膜厚を選択してもよい。トンネル磁気抵抗効果素子３の作製方法、配向制御膜３００、反強磁性膜３０１、強磁性膜３０２、非磁性膜３０３、強磁性膜３０４、絶縁膜３０５、強磁性膜３０６、保護膜３０７に使用した材料は、実施例１と同様である。特に強磁性膜３０６及び強磁性層膜３０４にＣｏＦｅＢを用いた場合、その結晶構造は体心立方格子であり、絶縁膜３０５は（１００）に高配向した岩塩構造をもつＭｇＯである。 In this embodiment, Ru (6 nm) is used for the nonmagnetic film 308, CoFe (2 nm) is used for the ferromagnetic film 309, and MnIr (8 nm) is used for the antiferromagnetic film 310. The CoFe composition ratio of the ferromagnetic film 309 was such that the Co composition capable of stably realizing antiferromagnetic coupling with the antiferromagnetic film 310 was between 50% and 90%. In addition to Ru (6 nm), the nonmagnetic film 308 may be made of a material and film thickness that eliminate the magnetic coupling between the ferromagnetic film 306 and the ferromagnetic film 309. Method for manufacturing tunnel magnetoresistive effect element 3, used for orientation control film 300, antiferromagnetic film 301, ferromagnetic film 302, nonmagnetic film 303, ferromagnetic film 304, insulating film 305, ferromagnetic film 306, and protective film 307 The materials obtained are the same as in Example 1. In particular, when CoFeB is used for the ferromagnetic film 306 and the ferromagnetic layer film 304, the crystal structure is a body-centered cubic lattice, and the insulating film 305 is MgO having a rock salt structure highly oriented to (100).

本実施例で得られた磁気抵抗比は１５０％であり、実施例１に比べ若干小さくなるが、非磁性膜３０８と強磁性膜３０９の界面で起きるスピン依存反射のため強磁性膜３０６に作用するスピントルクの効率を増大させることが可能であり、実施例１に比べスピントルク磁化反転の閾値電流密度がおよそ３分の２程度低減できる。 The magnetoresistance ratio obtained in this example is 150%, which is slightly smaller than that in Example 1, but acts on the ferromagnetic film 306 due to spin-dependent reflection that occurs at the interface between the nonmagnetic film 308 and the ferromagnetic film 309. As compared with the first embodiment, the threshold current density of the spin torque magnetization reversal can be reduced by about two thirds.

［実施例４］
図４は、本発明によるトンネル磁気抵抗効果素子の他の例を示す断面模式図である。このトンネル磁気抵抗効果素子４は、図２のトンネル磁気抵抗効果素子２の構成において、強磁性膜３０６と配向制御膜３００の間に、配向制御膜３００側から反強磁性膜３１０、強磁性膜３０９、非磁性膜３０８を、この順に積層したものに相当する。 [Example 4]
FIG. 4 is a schematic cross-sectional view showing another example of the tunnel magnetoresistive effect element according to the present invention. This tunnel magnetoresistive effect element 4 is the same as the tunnel magnetoresistive effect element 2 shown in FIG. 2, but between the ferromagnetic film 306 and the orientation control film 300, from the orientation control film 300 side, the antiferromagnetic film 310, the ferromagnetic film. 309 corresponds to a nonmagnetic film 308 laminated in this order.

本実施例では、非磁性膜３０８にＲｕ（６ｎｍ）を、強磁性膜３０９にＣｏＦｅ（２ｎｍ）を、反強磁性膜３１０にＭｎＩｒ（８ｎｍ）を用いた。強磁性膜３０９のＣｏＦｅの組成比は、反強磁性膜３１０との間に反強磁性結合が安定して実現できるＣｏ組成が５０〜９０％の間で使用した。非磁性膜３０８はＲｕ（６ｎｍ）以外に、強磁性膜３０６と強磁性膜３０９の間の磁気的な結合が消失する材料、膜厚を選択してもよい。トンネル磁気抵抗効果素子４の作製方法、配向制御膜３００、反強磁性膜３０１、強磁性膜３０２、非磁性膜３０３、強磁性膜３０４、絶縁膜３０５、強磁性膜３０６、保護膜３０７に使用した材料は、実施例２と同様である。特に強磁性膜３０６及び強磁性層膜３０４にＣｏＦｅＢを用いた場合、その結晶構造は体心立方格子であり、絶縁膜３０５は（１００）に高配向した岩塩構造をもつＭｇＯである。 In this embodiment, Ru (6 nm) is used for the nonmagnetic film 308, CoFe (2 nm) is used for the ferromagnetic film 309, and MnIr (8 nm) is used for the antiferromagnetic film 310. The CoFe composition ratio of the ferromagnetic film 309 was such that the Co composition capable of stably realizing antiferromagnetic coupling with the antiferromagnetic film 310 was between 50% and 90%. In addition to Ru (6 nm), the nonmagnetic film 308 may be made of a material and film thickness that eliminate the magnetic coupling between the ferromagnetic film 306 and the ferromagnetic film 309. Method for fabricating tunnel magnetoresistive effect element 4, used for orientation control film 300, antiferromagnetic film 301, ferromagnetic film 302, nonmagnetic film 303, ferromagnetic film 304, insulating film 305, ferromagnetic film 306, and protective film 307 The materials made are the same as in Example 2. In particular, when CoFeB is used for the ferromagnetic film 306 and the ferromagnetic layer film 304, the crystal structure is a body-centered cubic lattice, and the insulating film 305 is MgO having a rock salt structure highly oriented to (100).

本実施例で得られた磁気抵抗比は１４０％であり、実施例２に比べ若干小さくなるが、非磁性膜３０８と強磁性膜３０９の界面で起きるスピン依存反射のため強磁性膜３０６に作用するスピントルクの効率を増大させることが可能であり、実施例２に比べスピントルク磁化反転の閾値電流密度がおよそ３分の２程度低減できる。 The magnetoresistance ratio obtained in this example is 140%, which is slightly smaller than that in Example 2, but acts on the ferromagnetic film 306 due to spin-dependent reflection that occurs at the interface between the nonmagnetic film 308 and the ferromagnetic film 309. As compared with the second embodiment, the spin torque magnetization reversal threshold current density can be reduced by about two thirds.

［実施例５］
図５は、本発明によるトンネル磁気抵抗効果素子の他の例を示す断面模式図である。このトンネル磁気抵抗効果素子５は、図３に示したトンネル磁気抵抗効果素子３の構成において反強磁性膜３１０のない素子に相当する。 [Example 5]
FIG. 5 is a schematic cross-sectional view showing another example of the tunnel magnetoresistive effect element according to the present invention. The tunnel magnetoresistive element 5 corresponds to an element without the antiferromagnetic film 310 in the configuration of the tunnel magnetoresistive element 3 shown in FIG.

本実施例では、非磁性膜３０８にＲｕ（８ｎｍ）を用いた。非磁性膜３０８はＲｕ（８ｎｍ）以外に、強磁性膜３０６と強磁性膜３０９の間の反強磁性的な結合が消失する材料、膜厚を選択してもよい。トンネル磁気抵抗効果素子５の作製方法、配向制御膜３００、反強磁性膜３０１、強磁性膜３０２、非磁性膜３０３、強磁性膜３０４、絶縁膜３０５、強磁性膜３０６、強磁性膜３０９、保護膜３０７に使用した材料は、実施例３と同様である。特に強磁性膜３０６及び強磁性層膜３０４にＣｏＦｅＢを用いた場合、その結晶構造は体心立方格子であり、絶縁膜３０５は（１００）に高配向した岩塩構造をもつＭｇＯである。得られた磁気抵抗比は、実施例３とほぼ同様で１５０％程度である。 In this embodiment, Ru (8 nm) is used for the nonmagnetic film 308. In addition to Ru (8 nm), the nonmagnetic film 308 may be made of a material and film thickness that eliminate the antiferromagnetic coupling between the ferromagnetic film 306 and the ferromagnetic film 309. Method for fabricating tunnel magnetoresistive element 5, orientation control film 300, antiferromagnetic film 301, ferromagnetic film 302, nonmagnetic film 303, ferromagnetic film 304, insulating film 305, ferromagnetic film 306, ferromagnetic film 309, The material used for the protective film 307 is the same as in Example 3. In particular, when CoFeB is used for the ferromagnetic film 306 and the ferromagnetic layer film 304, the crystal structure is a body-centered cubic lattice, and the insulating film 305 is MgO having a rock salt structure highly oriented to (100). The obtained magnetoresistance ratio is substantially the same as in Example 3 and is about 150%.

本構成では、実施例３と同様に強磁性膜３０６に作用するスピントラスファートルクの効率が実施例１よりも増大し、スピントランスファートルクを用いた磁化回転が低電流で実現できる。さらに、実施例３に対して反強磁性膜３１０がないため、熱処理によるＭｎの拡散が抑制され、実施例３に比べ磁気抵抗比の耐熱性が向上する。 In this configuration, as in the third embodiment, the efficiency of the spin transfer torque acting on the ferromagnetic film 306 is increased as compared with the first embodiment, and the magnetization rotation using the spin transfer torque can be realized with a low current. Furthermore, since there is no antiferromagnetic film 310 as compared to Example 3, diffusion of Mn due to heat treatment is suppressed, and the heat resistance of the magnetoresistance ratio is improved as compared with Example 3.

［実施例６］
図６は、本発明によるトンネル磁気抵抗効果素子の他の例を示す断面模式図である。このトンネル磁気抵抗効果素子６は、図４に示したトンネル磁気抵抗効果素子４の構成において反強磁性膜３１０のない素子に相当する。 [Example 6]
FIG. 6 is a schematic cross-sectional view showing another example of the tunnel magnetoresistive effect element according to the present invention. The tunnel magnetoresistive element 6 corresponds to an element without the antiferromagnetic film 310 in the configuration of the tunnel magnetoresistive element 4 shown in FIG.

本実施例では、非磁性膜３０８にＲｕ（８ｎｍ）を用いた。非磁性膜３０８はＲｕ（８ｎｍ）以外に、強磁性膜３０６と強磁性膜３０９の間の反強磁性的な結合を消失できる得られる材料、膜厚を選択してもよい。トンネル磁気抵抗効果素子６の作製方法、配向制御膜３００、反強磁性膜３０１、強磁性膜３０２、非磁性膜３０３、強磁性膜３０４、絶縁膜３０５、強磁性膜３０６、強磁性膜３０９、保護膜３０７に使用した材料は、実施例４と同様である。特に強磁性膜３０６及び強磁性層膜３０４にＣｏＦｅＢを用いた場合、その結晶構造は体心立方格子であり、絶縁膜３０５は（１００）に高配向した岩塩構造をもつＭｇＯである。得られた最大の磁気抵抗比は実施例４とほぼ同様であり、１４０％程度であった。 In this embodiment, Ru (8 nm) is used for the nonmagnetic film 308. In addition to Ru (8 nm), the nonmagnetic film 308 may be made of a material and a film thickness that can eliminate the antiferromagnetic coupling between the ferromagnetic film 306 and the ferromagnetic film 309. Manufacturing method of tunnel magnetoresistive element 6, orientation control film 300, antiferromagnetic film 301, ferromagnetic film 302, nonmagnetic film 303, ferromagnetic film 304, insulating film 305, ferromagnetic film 306, ferromagnetic film 309, The material used for the protective film 307 is the same as in Example 4. In particular, when CoFeB is used for the ferromagnetic film 306 and the ferromagnetic layer film 304, the crystal structure is a body-centered cubic lattice, and the insulating film 305 is MgO having a rock salt structure highly oriented to (100). The maximum magnetoresistance ratio obtained was almost the same as in Example 4, and was about 140%.

本構成では、強磁性膜３０６に作用するスピントラスファートルクの効率が実施例４よりも増大し、スピントランスファートルクを用いた磁化回転が低電流で実現できる。さらに、実施例４に対して反強磁性膜３１０がないため、熱処理によるＭｎの拡散が抑制され、実施例４に比べ磁気抵抗比の耐熱性が向上する。 In this configuration, the efficiency of the spin transfer torque acting on the ferromagnetic film 306 is increased as compared with the fourth embodiment, and the magnetization rotation using the spin transfer torque can be realized with a low current. Furthermore, since there is no antiferromagnetic film 310 compared to Example 4, the diffusion of Mn by heat treatment is suppressed, and the heat resistance of the magnetoresistance ratio is improved compared to Example 4.

［実施例７］
図７は、本発明による磁気メモリセルの構成例を示す断面模式図である。この磁気メモリセルは、メモリセルとして実施例１〜実施例６に示したトンネル磁気抵抗効果素子１０を搭載している。 [Example 7]
FIG. 7 is a schematic cross-sectional view showing a configuration example of a magnetic memory cell according to the present invention. This magnetic memory cell is equipped with the tunnel magnetoresistive effect element 10 shown in the first to sixth embodiments as a memory cell.

Ｃ−ＭＯＳ１１は、２つのｎ型半導体１２，１３と一つのｐ型半導体１４からなる。ｎ型半導体１２にドレインとなる電極２１が電気的に接続され、電極４１及び電極４７を介してグラウンドに接続されている。ｎ型半導体１３には、ソースとなる電極２２が電気的に接続されている。さらに２３はゲート電極であり、このゲート電極２３のＯＮ／ＯＦＦによりソース電極２２とドレイン電極２１の間の電流をＯＮ／ＯＦＦ制御する。上記ソース電極２２に電極４５、電極４４、電極４３、電極４２、電極４６が積層され、電極４６を介してトンネル磁気抵抗効果素子１０の配向制御膜３００が接続されている。 The C-MOS 11 includes two n-type semiconductors 12 and 13 and one p-type semiconductor 14. An electrode 21 serving as a drain is electrically connected to the n-type semiconductor 12 and is connected to the ground via an electrode 41 and an electrode 47. An electrode 22 serving as a source is electrically connected to the n-type semiconductor 13. Further, reference numeral 23 denotes a gate electrode, and the current between the source electrode 22 and the drain electrode 21 is ON / OFF controlled by turning the gate electrode 23 ON / OFF. An electrode 45, an electrode 44, an electrode 43, an electrode 42, and an electrode 46 are stacked on the source electrode 22, and the orientation control film 300 of the tunnel magnetoresistive effect element 10 is connected through the electrode 46.

ビット線２１２は上記トンネル磁気抵抗効果素子１０の保護膜３０７に接続されている。本実施例の磁気メモリセルでは、トンネル磁気抵抗効果素子１０に流れる電流、いわゆるスピントランスファートルクによりトンネル磁気抵抗効果素子１０の強磁性膜３０６の磁化方向を回転し、磁気的情報を記録する。また、前記のスピントランスファートルクを用いずに、ビット線２１２とワード線を兼ねる電極４７に電流を流し、その周りに作られる磁界を用いてトンネル磁気抵抗効果素子１０の強磁性膜３０６の磁化方向を回転し、磁気的情報を記録してもよい。スピントランスファートルクにより書込みを行った場合、書込み時の電力は電流磁界を用いた場合に比べ百分の一程度まで低減可能である。 The bit line 212 is connected to the protective film 307 of the tunnel magnetoresistive element 10. In the magnetic memory cell of this embodiment, the magnetization direction of the ferromagnetic film 306 of the tunnel magnetoresistive effect element 10 is rotated by a current flowing through the tunnel magnetoresistive effect element 10, so-called spin transfer torque, and magnetic information is recorded. In addition, the magnetization direction of the ferromagnetic film 306 of the tunnel magnetoresistive effect element 10 using a magnetic field generated around the electrode 47 that also serves as the bit line 212 and the word line without using the spin transfer torque. May be rotated to record magnetic information. When writing is performed by spin transfer torque, the power at the time of writing can be reduced to about one-hundred compared with the case where a current magnetic field is used.

図９は、上記磁気メモリセルを配置した不揮発性磁気メモリの構成例を示す図である。ゲート電極２３とビット線２１２がメモリセル１００に電気的に接続されている。前記実施例に記載した磁気メモリセルを配置することにより前記磁気メモリは低消費電力で動作が可能であり、ギガビット級の高密度磁気メモリを実現可能である。 FIG. 9 is a diagram showing a configuration example of a nonvolatile magnetic memory in which the magnetic memory cells are arranged. The gate electrode 23 and the bit line 212 are electrically connected to the memory cell 100. By disposing the magnetic memory cells described in the embodiments, the magnetic memory can operate with low power consumption, and a gigabit-class high-density magnetic memory can be realized.

１…トンネル磁気抵抗効果素子、２…トンネル磁気抵抗効果素子、３…トンネル磁気抵抗効果、４…トンネル磁気抵抗効果素子、５…トンネル磁気抵抗効果素子、６…トンネル磁気抵抗効果素子、１０…トンネル磁気抵抗効果素子、１１…トランジスタ、１２…第一のｎ型半導体、１３…第二のｎ型半導体、１４…ｐ型半導体、２１…ドレイン電極、２１１…書込みワード線、２１２…ビット線、２２…ソース電極、２３…ゲート電極、３００…配向制御膜、３０１…反強磁性膜、３０２…強磁性膜、３０３…非磁性膜、３０４…強磁性膜、３０５…絶縁膜、３０６…強磁性膜、３０７…保護膜、３０８…非磁性膜、３０９…強磁性膜、３１０…反強磁性膜、４１…電極、４２…電極、４３…電極、４４…電極、４５…電極、４６…電極、４７…電極 DESCRIPTION OF SYMBOLS 1 ... Tunnel magnetoresistive effect element 2 ... Tunnel magnetoresistive effect element 3 ... Tunnel magnetoresistive effect 4 ... Tunnel magnetoresistive effect element 5 ... Tunnel magnetoresistive effect element 6 ... Tunnel magnetoresistive effect element 10 ... Tunnel Magnetoresistive effect element, 11... Transistor, 12... First n-type semiconductor, 13... Second n-type semiconductor, 14... P-type semiconductor, 21. ... Source electrode, 23 ... Gate electrode, 300 ... Orientation control film, 301 ... Antiferromagnetic film, 302 ... Ferromagnetic film, 303 ... Nonmagnetic film, 304 ... Ferromagnetic film, 305 ... Insulating film, 306 ... Ferromagnetic film 307: Protective film, 308 Nonmagnetic film, 309 Ferromagnetic film, 310 Antiferromagnetic film, 41 Electrode, 42 Electrode, 43 Electrode, 44 Electrode, 45 Electrode, 46 Electrode, 4 ... electrode

Claims

In a tunnel magnetoresistive element having an insulating film, and a first ferromagnetic film and a second ferromagnetic film provided with the insulating film interposed therebetween,
The first ferromagnetic film and the second magnetic film contain Co, Fe, and B, and have a body-centered cubic structure with a Co composition of 50 to 90 atm%,
The tunnel magnetoresistive element according to claim 1, wherein the insulating film is a (100) -oriented rock salt MgO film.

The tunnel magnetoresistive effect element according to claim 1.
An orientation control film, and an antiferromagnetic film, a third ferromagnetic film, and a nonmagnetic film sequentially stacked on the orientation control film, the first ferromagnetic film on the nonmagnetic film, An insulating film and a second ferromagnetic film are sequentially laminated,
The magnetization direction of the third ferromagnetic film is fixed by the antiferromagnetic film, and the third ferromagnetic film and the first ferromagnetic film are antiferromagnetically coupled through the nonmagnetic film. A tunnel magnetoresistive effect element.

The tunnel magnetoresistive effect element according to claim 2, wherein a second nonmagnetic film, a fourth ferromagnetic film, and a second antiferromagnetic film are laminated in this order on the second ferromagnetic film, A tunnel magnetoresistive effect element characterized in that the magnetization direction of the fourth ferromagnetic film is fixed by the second antiferromagnetic film.

3. The tunnel magnetoresistive element according to claim 2, wherein a second nonmagnetic film and a fourth ferromagnetic film are laminated in this order on the second ferromagnetic film. Effect element.

The tunnel magnetoresistive effect element according to claim 1.
Having an orientation control film, the first ferromagnetic film, the insulating film and the second ferromagnetic film are sequentially laminated on the orientation control film;
Furthermore, a nonmagnetic film, a third ferromagnetic film, and an antiferromagnetic film are sequentially laminated on the second ferromagnetic film,
The magnetization direction of the third ferromagnetic film is fixed by the antiferromagnetic film, and the third ferromagnetic film and the first ferromagnetic film are antiferromagnetically coupled through the nonmagnetic film. A tunnel magnetoresistive effect element.

6. The tunnel magnetoresistive element according to claim 5, wherein a second antiferromagnetic film, a fourth ferromagnetic film, and a second nonmagnetic film are provided between the orientation control film and the first ferromagnetic film. A tunneling magnetoresistive element, wherein the fourth ferromagnetic film is laminated in this order, and the magnetization direction of the fourth ferromagnetic film is fixed by the second antiferromagnetic film.

6. The tunnel magnetoresistive element according to claim 5, wherein a fourth ferromagnetic film and a second nonmagnetic film are laminated in this order between the orientation control film and the first ferromagnetic film. A tunneling magnetoresistive element.

In a magnetic memory comprising a tunnel magnetoresistive element and a switching element that controls on / off of a current flowing through the tunnel magnetoresistive element,
The tunnel magnetoresistive element includes an insulating film, a first ferromagnetic film and a second ferromagnetic film provided with the insulating film interposed therebetween, and the first ferromagnetic film and the second ferromagnetic film The magnetic film contains Co, Fe, and B and has a body-centered cubic structure with a Co composition of 50 to 90 atm%, and the insulating film is a (100) -oriented rock salt structure MgO film. Magnetic memory.

9. The magnetic memory according to claim 8, wherein magnetic information is recorded by a spin transfer torque.

In a magnetic random access memory comprising a plurality of magnetic memory cells and means for selecting a desired magnetic memory cell,
The magnetic memory cell includes Co, Fe, and B, a first ferromagnetic film having a body-centered cubic structure having a Co composition of 50 to 90 atm%, a (100) -oriented rock salt structure MgO insulating film, A magnetic random access memory comprising a tunnel magnetoresistive effect element including a second ferromagnetic film having a body-centered cubic structure containing Co, Fe, and B and having a Co composition of 50 to 90 atm% .

11. The magnetic random access memory according to claim 10, wherein magnetic information is recorded by a spin transfer torque.

2. The tunnel magnetoresistive element according to claim 1, wherein the insulating film is formed on the second ferromagnetic film, and the first ferromagnetic film is formed on the insulating film. A tunnel magnetoresistive effect element.

2. The tunnel magnetoresistive element according to claim 1, wherein the insulating film has a crystal structure.