JP2013007066A - Method and device for producing plated wire material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress adhesion of foreign matters and generation of bare spot on a plated wire material during production.SOLUTION: In a production method for a plated wire material, a wire material is subjected to an annealing and softened, then immersed in a molten metal and pulled up by being guided along a guide roll to form a plated layer so as to cover the surface thereof. The wire material is heated before being subjected to the annealing for softening to burn oils and fats adhered to the surface thereof.

Description

  The present invention relates to a method and an apparatus for manufacturing a plated wire.

  In order to connect the cells of the crystalline solar cell panel, a flat plated wire called an interconnector is used.

  In the production of the plated wire, the wire is purified before the plating layer is formed. For example, Patent Document 1 discloses purification by degreasing and acid cleaning, purification by immersion in a flux bath, and ultrasonic waves. The removal of rust by cleaning is disclosed.

JP-A-4-293757

  In the manufacture of a flat plated wire, a rough drawn wire as a copper bus is drawn so that the cross-sectional shape is circular, and then rolled so that the cross-sectional shape is flat. Then, after annealing it in a reducing gas atmosphere, it is immersed in a hot dipping bath, pulled up and wound up. At this time, in wire drawing and rolling, fats and oils such as processing oil are applied to the surface of the wire, and foreign matters such as copper powder adhere. When such a wire with oils and fats and foreign matters attached is immersed in a hot dipped bath, a plated wire with a poor surface condition will be produced, so the surface of the wire before dipping in the hot dipped layer Cleaning is performed.

  However, although the problem of fats and oils adhering to the surface of the wire rod is solved to some extent by washing, it is difficult to completely remove the fats and oils in particular. If a compound derived from the deposit adheres to the guide roll that guides the wire, the deposit may adhere to the surface of the wire at a certain timing to become foreign matter, or unplating may occur.

  An object of the present invention is to suppress adhesion and non-plating of foreign matters to a plated wire during production.

  The present invention is a method for producing a plated wire material in which a wire layer is annealed and softened, and then a plating layer is formed so as to cover the surface by being immersed in a molten metal by a guide roll and pulled up, Prior to annealing and softening the wire, the wire is heated to burn the oils and fats adhering to the surface.

  The present invention includes an annealing furnace for annealing and softening a passing wire, a plating tank for storing molten metal provided on the downstream side of the annealing furnace, and a wire passing through the annealing furnace. A plating wire manufacturing apparatus comprising: a guide roll for guiding so as to be immersed in a molten metal stored in a tank, and heating the wire provided on the upstream side of the annealing furnace Thus, a heating means for burning the fats and oils adhering to the surface is further provided.

  According to the present invention, before the wire is annealed and softened, by heating the wire, the oils and fats adhering to the surface are burned, so that the oils and fats or compounds derived therefrom are guided to the guide roll that guides the wire. Adhesion and deposition can be restricted, and as a result, adhesion and non-plating of foreign matter to the plated wire due to deposits on the guide roll during manufacturing can be suppressed.

(A)-(c) is a perspective view which shows the plating wire which concerns on embodiment. It is explanatory drawing which shows the manufacturing method of the plated wire which concerns on embodiment. It is a schematic block diagram which shows the plating wire manufacturing apparatus which concerns on embodiment. It is a figure which shows the modification of a plating wire manufacturing apparatus. It is a figure which shows another modification of a plating wire manufacturing apparatus.

  Hereinafter, embodiments will be described in detail based on the drawings.

(Plating wire)
Fig.1 (a)-(c) shows the plating wire 10 which concerns on embodiment. The plated wire rod 10 according to this embodiment is used as, for example, an interconnector for subdividing and connecting cells of a crystalline solar cell panel.

  The plated wire 10 according to the embodiment is configured by a flat wire including a flat metal wire 11 and a solder plating layer 12 provided so as to cover the surface thereof. Here, the rectangular wire constituting the plated wire rod 10 is shown in FIG. 1B, which is formed by compressing a round wire from four sides in addition to a rectangular cross section having a corner as shown in FIG. In such a cross section as shown in FIG. 1 (c) formed by compressing the round line from above and below, the upper and lower sides are straight and both sides are arcuate. A track-shaped track with a flat and substantially rectangular cross section is also included. The flat wire 10 is, for example, 1 to 2 mm in width and 0.1 to 0.2 mm in thickness. In addition, the plated wire 10 may be a round wire or a square wire in addition to a flat wire.

  Examples of the metal constituting the wire 11 include oxygen-free copper and tough pitch copper. The wire 11 can be obtained by drawing and rolling a rough drawn wire as a bus bar as described later.

  The solder composition for forming the solder plating layer 12 is Sn—Pb alloy having a melting point of about 130 to 300 ° C., Sn— (0.5 to 5 mass%) Ag alloy, Sn— (0.5 to 5 mass%). Ag- (0.3-1.0 mass%) Cu alloy, Sn- (0.3-1.0 mass%) Cu alloy, Sn- (1.0-5.0 mass%) Ag- (5- 8 mass%) In alloy, Sn- (1.0-5.0 mass%) Ag- (40-50 mass%) Bi alloy, Sn- (40-50 mass%) Bi alloy, Sn- (1.0 -5.0 mass%) Ag- (40-50 mass%) Bi- (5-8 mass%) In alloy etc. are mentioned. Since Pb is harmful to the human body and may contaminate the natural environment, Pb-free Sn—Ag alloy, Sn—Ag—Cu alloy, Sn—Cu alloy, Sn—Ag—In alloy are used from the viewpoint of pollution prevention. A solder material such as a Sn-Ag-Bi alloy is preferable, and specifically, a Sn-3.0 mass% Ag-0.5 mass% Cu alloy is preferable. The thickness of the solder plating layer 12 is preferably 5 to 80 μm, and more preferably 10 to 50 μm.

  In the plated wire 10 according to the embodiment, the 0.2% proof stress is preferably 60 MPa or less, and more preferably 50 MPa or less, when the wire 11 is subjected to an ultrasoftening treatment (annealing treatment).

  The plated wire 10 according to the embodiment preferably does not contain a flux component. Examples of such flux components include rosin component materials such as abietic acid, amines and salts thereof, organic acids having an aliphatic skeleton such as sebacic acid, azelaic acid, and corkic acid.

(Plating wire manufacturing method)
Next, the manufacturing method of the plated wire 10 which concerns on embodiment is demonstrated.

  As shown in FIG. 2, the manufacturing method of the plated wire rod 10 according to the embodiment includes a wire drawing process, a rolling process, a cleaning process, a heating process, an annealing process, and a plating process.

  In the manufacturing method of the plated wire rod 10 according to the embodiment, first, a rough drawn wire as a bus wire is reduced in diameter and drawn into a round wire having a circular cross section (drawing step). The wire drawing is performed by passing the rough wire through a wire drawing die. The outer diameter of the rough drawn wire is, for example, 6.0 to 10 mm, and the outer diameter of the round wire after drawing is, for example, 0.5 to 2.0 mm.

  After the wire drawing step, the drawn round wire is cold-rolled into a wire 11 having a flat cross-sectional shape (rolling step). Cold rolling is performed by passing a round wire between rollers of a rolling mill.

  Here, in the wire drawing step and the rolling step, fats and oils are applied to the rough drawn wire or the round wire. Examples of the fats and oils include processing oil and rust preventive agent, and examples of the processing oil include oil-based lubricants and aqueous lubricants.

  After the rolling step, oils and fats and foreign matters adhering to the surface of the wire 11 are washed away (cleaning step). The cleaning step can be performed, for example, by immersing the wire 11 in the cleaning liquid stored in the cleaning tank. Examples of the cleaning liquid include water (warm water), an organic solvent, and the like. When the cleaning liquid is water, the water temperature is, for example, 10 to 60 ° C. The cleaning liquid may contain a detergent. In addition, this washing | cleaning process may be after the below-mentioned heating process.

  After the cleaning process, the wire 11 is heated to burn and carbonize the oils and fats remaining on the surface and adhering (heating process). In the heating step, for example, the bobbin wound with the wire 11 is stored in a constant temperature bath, the wire 11 is continuously passed through a heating furnace, or the wire 11 is continuously passed through the flame. Can be done. The temperature (furnace temperature) for heating the wire 11 is, for example, 400 to 800 ° C, and preferably 500 to 700 ° C. Moreover, it is preferable to make temperature which heats the wire 11 lower than the temperature which anneals and softens the wire 11 in the below-mentioned annealing process from a viewpoint which suppresses that 0.2% yield strength becomes high. The time for heating the wire 11 is, for example, 0.01 to 30 minutes, and preferably 0.01 to 5.0 minutes. The heating of the wire 11 is preferably performed in an air atmosphere.

  After the heating step, the wire 11 burned with fats and oils is annealed and softened (annealing step). The annealing step can be performed, for example, by storing the bobbin around which the wire 11 is wound in a constant temperature bath, or by continuously passing the wire 11 through an annealing furnace. The temperature (furnace temperature) for annealing the wire 11 is, for example, 300 to 900 ° C., and more preferably 500 to 800 ° C. from the viewpoint of effectively softening the wire 11. The time for annealing the wire 11 is, for example, 0.01 to 30 minutes, and preferably 0.01 to 5.0 minutes. The annealing of the wire 11 is preferably performed in a reducing gas atmosphere. Examples of the reducing gas that forms such an atmosphere include hydrogen gas and carbon monoxide gas. Among these, hydrogen gas is preferable from the viewpoint of working environment. Further, when the reducing gas atmosphere is formed, the reducing gas may be diluted with an inert gas. Examples of the inert gas include nitrogen gas and argon gas. Among these, nitrogen gas is preferable from the viewpoint of versatility. When diluting the reducing gas with an inert gas, the concentration of the reducing gas is preferably 10 to 80% by volume, and more preferably 20 to 50% by volume from an economic viewpoint.

  After the annealing process, the wire 11 that has been annealed and softened is immersed in a solder (molten metal) that has been melted by guiding with a guide roll, and then pulled up to form a plating layer 12 so as to cover the surface. 10 is processed (plating process). The plating step can be performed by immersing the wire 11 in molten solder stored in the plating tank 25 and pulling it up. The temperature of the molten solder is, for example, 230 to 300 ° C, and preferably 250 to 300 ° C. The temperature of the wire 11 when immersed in the solder is, for example, 100 to 500 ° C., and preferably 150 to 450 ° C. from the viewpoint of suppressing the thickness of the solder plating layer 12. The immersion time of the wire 11 in the solder is, for example, 0.005 to 5.0 seconds, and preferably 0.01 to 2.0 seconds.

  The wire drawing process, rolling process, cleaning process, heating process, annealing process, and plating process may be performed independently or all may be performed continuously. Furthermore, these may be divided into a plurality. For example, the above process is divided into a wire drawing process, a subsequent rolling process, a cleaning process, a heating process, an annealing process, and a plating process, and a round wire is produced from the rough drawn wire in the wire drawing process. The plated wire 10 may be manufactured from a round wire in a continuous rolling process, a cleaning process, a heating process, an annealing process, and a plating process. In addition, the above process is divided into a wire drawing process and a rolling process, a heating process, a subsequent cleaning process, an annealing process, and a plating process, and in a continuous wire drawing process and rolling process, a flat wire is drawn from a rough drawing line. The wire 11 is prepared and wound up, and then the wire 11 is subjected to heat treatment in the heating process and wound up again, and then plated from the heat treated wire 11 in the continuous cleaning process, annealing process, and plating process. The wire 10 may be manufactured. In particular, with regard to the heating step and the annealing step, the heating step of heating the wire 11 with the fats and oils attached to the surface and burning the fats and oils and the annealing step of annealing and softening the wire 11 that burns the fats and oils are batched. Although it may be performed independently by the formula, from the viewpoint of production efficiency and from the viewpoint of preventing undesired deformation by winding once after the heating process, the annealing process is performed continuously following the heating process. Is preferred. In that case, the feeding speed of the wire 11 is, for example, 5 to 50 m / min, and preferably 7 to 40 m / min.

  According to the method for manufacturing the plated wire 10 according to the above embodiment, before the wire 11 is annealed and softened, the wire 11 is heated to burn the oil and fat attached to the surface thereof. It is possible to restrict the compounds derived therefrom from adhering to and depositing on the guide roll that guides the wire 11, and as a result, adherence and non-plating of the foreign matter to the solder plating wire 10 due to the deposit on the guide roll during manufacture. Can be suppressed.

(Plating wire manufacturing equipment)
FIG. 3 shows one embodiment of the plated wire 1 manufacturing apparatus 20 according to the embodiment. The plated wire 1 manufacturing apparatus 20 according to this embodiment manufactures the plated wire 10 by dividing the manufacturing process into a wire drawing process, a subsequent rolling process, a cleaning process, a heating process, an annealing process, and a plating process. Used in the latter stage in the embodiment.

  The plated wire 1 manufacturing apparatus 20 according to the embodiment includes a wire rod supply unit 21, a cleaning tank 22, a heating furnace 23, an annealing furnace 24, a plating tank 25, and a wire rod recovery unit 26.

  The wire supply unit 21 is configured such that the bobbin B around which the round wire 11 ′ produced in the wire drawing process is wound is attached, and includes a rolling mill 21 a. In this wire supply section 21, the round wire 11 ′ is pulled out from the bobbin B, and cold rolled while pouring lubricant (oils and fats) from above and below by the roller of the rolling mill 21a, and processed into a flat wire 11. To the washing tank 22.

  The cleaning tank 22 is formed in a long shape, and cleaning liquid is stored in the tank. In this cleaning tank 22, the wire 11 from the wire supply unit 21 is immersed in the cleaning liquid, and the resin 11 is passed through the cleaning liquid to clean and remove surface oils and the like, and then pulled up and sent to the heating furnace 23. The immersion length of the wire 11 in the cleaning liquid is, for example, 0.5 to 5 m.

  The heating furnace 23 has a configuration in which a wire rod insertion tube 23b is inserted in a longitudinal direction through a long box-shaped furnace main body 23a and is provided in a penetrating state. The heater is provided inside the furnace body 23a. An air introduction means may be provided in the wire rod insertion pipe 23b. In this heating furnace 23, the wire 11 from the cleaning tank 22 is introduced into a high-temperature air atmosphere in the wire insertion tube 23b, and is heated by passing through it, thereby burning the remaining fats and oils adhering to the surface thereof. And carbonized and sent to an annealing furnace 24. Therefore, the heating furnace 23 constitutes a heating means for burning the fats and oils attached to the surface of the wire 11 provided on the upstream side of the annealing furnace 24 described later. The heating length of the wire 11 in the heating furnace 23 is, for example, 0.5 to 5.0 m. The inner diameter of the wire rod insertion tube 23b is, for example, 2.0 to 20 mm.

  The annealing furnace 24 has a configuration in which a wire rod insertion tube 24b is inserted in a longitudinal direction through a long box-shaped furnace body 24a and is provided in a penetrating state. The heater is provided inside the furnace body 24a. The annealing furnace 24 is configured to be tiltable between a horizontal position during standby and an inclined position during processing. When the annealing furnace 24 is positioned at the inclined position, the distal end of a wire rod insertion tube 24b protruding downstream from the furnace body 24a. The portion is immersed in molten solder M (molten metal) in the plating tank 25 described later, and therefore the wire outlet at the downstream end of the annealing furnace 24 is positioned in the molten solder M in the plating tank 25. Yes. Moreover, a reducing gas supply pipe 27 is connected to the wire rod insertion pipe 24b protruding to the downstream side of the furnace body 24a, and the reducing gas flows in the annealing path 23 from the downstream side to the upstream side. In this annealing furnace 24, the wire 11 from the heating furnace 23 is introduced into a high-temperature reducing gas atmosphere, the passing wire is annealed and softened, the surface is reduced with a reducing gas to remove the oxide film, and It is sent out from the wire rod outlet into the molten solder M in the plating tank 25. At this time, the oxide film generated by heating in the air atmosphere in the heating furnace 23 is also removed. Note that the reducing gas supply pipe 27 may be connected to a portion other than the wire rod insertion pipe 24b protruding to the downstream side of the furnace body 24a, but from the viewpoint of efficiently removing the oxide film with the reducing gas, As described above, it is preferable that the reducing gas supply pipe 27 is connected to the wire rod insertion pipe 24b protruding to the downstream side of the furnace body 24a so that the reducing gas flows from the downstream side to the upstream side. The heating length of the wire 11 in the annealing furnace 24 is, for example, 0.5 to 3.0 m. The inner diameter of the wire rod insertion tube 24b is, for example, 5 to 30 mm.

  As shown in FIG. 3, the heating furnace 23 and the annealing furnace 24 may be provided such that there is a gap between the wire rod outlet of the former wire rod insertion tube 23b and the wire rod inlet of the latter wire rod insertion tube 24b. Moreover, as shown in FIG. 4, the wire rod outlet of the former wire rod insertion tube 23b and the wire rod inlet of the latter wire rod insertion tube 24b may be connected and provided continuously. The heating furnace 23 and the annealing furnace 24 may have a common heat source from the viewpoint of simplifying the device configuration.

  The plating tank 25 is provided on the downstream side of the annealing furnace 24, and molten solder M is stored in the tank. In this plating tank 25, the wire 11 from the annealing furnace 24 is immersed in molten solder M, wound around a guide roll R 1 (turn roll) provided in the molten solder M, and then melted. Plating wire 10 in which the solder plating layer 12 is formed so as to cover the surface by air cooling until it is wound out on the lifting guide roll R2 provided above the plating tank 25. To manufacture. Therefore, the guide rolls R1 and R2 guide the wire 11 that has passed through the annealing furnace 24 so as to be immersed in the molten solder M stored in the plating tank 25 and pulled up. A cooler that cools the wire 11 pulled up from the plating tank 25 may be provided above the plating tank 25. Further, a die for adjusting the thickness of the solder plating layer 12 formed on the wire 11 pulled up from the plating tank 25 may be provided. Regardless of the presence or absence of dies, the wire 11 pulled up from the plating tank 25 is vertically moved upward so that the solder attached to the wire 11 falls downward due to its own weight and the thickness of the solder plating layer 12 is adjusted. It is preferable that the lifting guide roll R2 is provided so as to extend in the direction.

  The wire rod recovery unit 26 is configured to have the bobbin B attached thereto and to rotate the attached bobbin B. In the wire rod recovery unit 26, the plated wire rod 10 that is guided by the pulling guide roll R <b> 2 extending from the plating tank 25 is wound around the bobbin B and collected.

  In addition, in the plated wire 1 manufacturing apparatus 20 according to the embodiment, guide rolls R3 to R5 are provided between the respective portions in addition to the guide roll R1 and the pulling guide roll R2 in the plating tank 25, whereby the wire 11 or It is configured to guide the plated wire 10. Moreover, although the plating wire 1 manufacturing apparatus 20 which concerns on embodiment may be comprised so that only the single plating wire 10 may be manufactured at once, from the viewpoint of obtaining high productivity, the several plating wire 10 is manufactured simultaneously. It is preferably configured to manufacture.

  In the plated wire 1 manufacturing apparatus 20 according to the embodiment having the above-described configuration, the wire 11 in the round wire 11 ′ is cold-rolled from the vertical direction by the rolling mill 21 a and sent out as a flat wire 11 in the wire supply unit 21. In the cleaning tank 22, oils and fats, foreign matters and the like on the surface of the wire 11 are cleaned and removed with a cleaning liquid. Moreover, the aspect which pours a washing | cleaning liquid on the wire 11 may be sufficient instead of the aspect which immerses the wire 11 in the washing | cleaning liquid stored in the washing tank 22. FIG.

  In the heating furnace 23, the wire 11 is heated in a high-temperature air atmosphere to burn and carbonize the remaining fats and oils attached to the surface. In the annealing furnace 24, the wire 11 is annealed in a high-temperature reducing gas atmosphere, and the oxide film is removed by reducing the surface with a reducing gas. At this time, the reducing gas flows in the annealing furnace 24 from the downstream side to the upstream side, so that the oxide film on the surface of the wire 11 can be effectively removed. The flow rate of the gas supplied into the annealing furnace 24 is, for example, 2 to 3 L / min. In the plating tank 25, the molten solder M is attached to the surface of the wire 11, pulled up and air-cooled, and the solder plating layer 12 is formed so as to cover the surface of the wire 11. In the wire rod collection unit 26, the plated wire rod 10 is wound around the bobbin B and collected.

  In the plated wire 1 manufacturing apparatus 20 according to the above embodiment, the heating means configured to burn the oils and fats adhering to the surface of the wire by the heating furnace 23 is configured. However, the present invention is not particularly limited to this, and FIG. As shown, a flame generator 28 provided in the front stage of the annealing furnace 24 may be used. Moreover, since fats and oils are burned by the heating furnace 23, the cleaning tank 22 (cleaning process) is not essential, and if there is no cleaning tank 22 (cleaning process), it is preferable because the plated wire 10 can be produced in a shorter process.

  The present invention is useful for a method and an apparatus for manufacturing a plated wire.

DESCRIPTION OF SYMBOLS 10 Plated wire 11 Wire 11 'Round wire 12 Solder plating layer 20 Plating wire manufacturing apparatus 21 Wire supply part 21a Rolling machine 22 Cleaning tank 23 Heating furnace 23a Furnace main body 23b Wire material insertion pipe 24 Annealing furnace 24a Furnace main body 24b Wire material insertion pipe 25 Plating Tank 26 Wire rod recovery unit 27 Reducing gas supply pipe 28 Flame generator B Bobbin M Molten solder R1 to R5 Guide roll

Claims (9)

After annealing and softening the wire, it is a method for producing a plated wire that forms a plating layer so as to cover the surface by dipping in the molten metal by a guide roll and pulling up,
A method for producing a plated wire material, in which the wire material is heated to burn the oils and fats adhering to the surface thereof before the wire material is annealed and softened. In the manufacturing method of the plated wire according to claim 1,
A method for producing a continuous plated wire in which a wire with oils and fats attached to the surface is heated to burn the oils and fats, followed by annealing and softening. In the manufacturing method of the plated wire according to claim 2,
The manufacturing method of the plating wire which heats by passing a wire through a heating furnace, burns fats and oils, anneals and softens by passing the wire which passed through the heating furnace through an annealing furnace. In the manufacturing method of the plated wire according to any one of claims 1 to 3,
The manufacturing method of the plating wire which makes the temperature which heats a wire and burns fats and oils lower than the temperature which anneals and softens a wire. In the manufacturing method of the plated wire according to any one of claims 1 to 4,
A method for producing a plated wire, wherein the wire is heated in an air atmosphere to burn oils and fats, while the wire is annealed and softened in a reducing gas atmosphere. An annealing furnace for annealing and softening the passing wire, a plating tank for storing molten metal provided on the downstream side of the annealing furnace, and a wire that has passed through the annealing furnace are stored in the plating tank. And a guide roll for guiding the guide wire so as to be immersed in the molten metal and pulling it up,
The plating wire manufacturing apparatus further provided with the heating means provided in the upstream of the said annealing furnace for burning the fats and oils adhering to the surface by heating a wire. In the plated wire manufacturing apparatus according to claim 6,
The said heating means is a plating wire manufacturing apparatus comprised by the heating furnace through which the wire with which fats and oils adhered to the surface passes. In the plated wire manufacturing apparatus according to claim 7,
A plated wire manufacturing apparatus in which the heat source is common to the annealing furnace and the heating furnace. In the plated wire manufacturing apparatus according to claim 7 or 8,
A plating wire manufacturing apparatus in which the heating furnace is coupled to the annealing furnace.

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