JP2013004176A - Universal serial bus device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compact universal serial bus device which protrudes only a little from a housing of an electronic apparatus when in use and has an excellent heat dissipation structure.SOLUTION: Provided is a universal serial bus device 1 which is attached to a receptacle r of an electronic apparatus P and is used while being connected to the electronic apparatus P. The universal serial bus device 1 comprises a single circuit board 2 in which a connection terminal 2s to be connected to a mating terminal r2 of the receptacle r is mounted on one face 2u thereof and electronic components 2d for performing control are mounted on both of the face 2u and a face 2t thereof.

Description

  The present invention relates to a space-saving universal serial bus device that has a small protruding volume into an external space when mounted on an electronic device.

Conventionally, USB standard USB transmission interfaces have been widely used in various computer peripheral devices, information home appliances, and the like.
In recent years, various products that adopt the USB standard have products that do not require a cable depending on the circuit scale by mounting the circuit inside the A plug (USB plug standard) of the USB transmission interface on the device side. It can be seen.

Examples include a wireless mouse receiver that uses radio, a Bluetooth device receiver, and a small USB memory.
These have the convenience that a portable notebook personal computer or terminal device can be transported while the device (USB A plug) is attached to the notebook personal computer or terminal device.

FIG. 29A is a perspective view showing a USB memory of a conventional USB application apparatus, and FIG. 29B is a partially cutaway perspective view showing an internal structure of the conventional USB application apparatus. It is.
The
As shown in FIG. 29A, in the conventional USB application device 500, a USB plug 512 to be inserted into a USB socket such as a personal computer (not shown) is joined to the front end of the USB electronic application module 515 of the main body.

When the USB application apparatus 500 is not used, the protective cap 517 is fitted on the USB plug 512 so as to cover the USB plug 512.
As shown in FIG. 29B, a resin mounting plate 511 is provided in the metal case layer 514 of the USB plug 512, and a plurality of connection terminals 513 are mounted on the mounting plate 511. Yes.

A circuit placement board 519 is provided inside the case layer 555 of the USB electronic application module 515, and a circuit board 557 on which the memory device 553 and the control circuit 551 are mounted is placed on the circuit placement board 519. Has been.
The plurality of connection terminals 513 on the mounting board 511 are electrically connected to the control circuit 551 and the memory device 553 mounted on the circuit board 557.

Japanese Patent No. 44472550

  Incidentally, as shown in FIG. 29B, in order to connect the connection terminals 513, the control circuit 551, and the memory device 553 that are configured independently, it is necessary to connect them using soldering, connectors, or the like. Therefore, the USB application device 500 may become large.

  For example, when the USB application apparatus 500 shown in FIG. 29A is used for a notebook computer (not shown), for example, the USB plug 512 is inserted into the USB socket of the notebook computer. At this time, the USB electronic application module 515 of the main body protrudes outside the casing of the notebook computer.

For this reason, there is a problem that the USB electronic application module 515 protrudes from the casing of the notebook personal computer when it is carried around the notebook personal computer equipped with the USB applied device 500.
Therefore, if the USB application device 500 is downsized, heat generation becomes a problem due to integration of electronic components mounted on the USB application device 500.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a universal serial bus device that is compact and has a small amount of protrusion from the casing of an electronic device when in use and has a good heat dissipation structure.

  In order to achieve the above object, a universal serial bus device according to the present invention is a universal serial bus device that is attached to a receptacle of an electronic device and used by being connected to the electronic device, and is connected to a connected terminal of the receptacle. And a single circuit board on which the electronic components responsible for control are mounted on both sides.

  According to the present invention, it is possible to realize a universal serial bus device that is small in size and has a small amount of protrusion from the casing of the electronic device when in use and has a good heat dissipation structure.

(a) is the perspective view which looked at the mounting | wearing operation to the receptacle of the notebook computer of the USB memory of Embodiment 1 which concerns on this invention from the upper direction, (b) is a partially notched perspective view of the USB memory of (a). It is. (a) is the perspective view which looked at the mounting | wearing operation to the receptacle of the notebook computer of the USB memory of Embodiment 1 from the downward | lower direction, (b) is a partially cutaway perspective view of the USB memory of (a). (a) is the perspective view which looked at the printed circuit board of Embodiment 1 from upper direction, (b) is the perspective view which looked at the printed circuit board from the downward direction. FIG. 3 is a perspective view of the USB memory according to the first embodiment with the plug portion removed, as viewed from above, and (b) is a perspective view of the USB memory with the plug portion removed, as viewed from below. (a) is the perspective view which looked at the mounting | wearing operation | movement to the receptacle of the notebook personal computer of USB memory of Embodiment 2 from upper direction, (b) is a partially notched perspective view of the USB memory of (a). FIG. 6A is a perspective view of the USB memory according to the second embodiment attached to the receptacle of the notebook computer as viewed from below, and FIG. 6B is a partially cutaway perspective view of the USB memory of FIG. is there. It is the partially cutaway side view which looked at the state with which the USB personal computer of Embodiment 2 was mounted | worn from the side. (a) is the perspective view which looked at the L-shaped flexible circuit board of Embodiment 2 from the upper part, (b) is the perspective view which looked at the L-shaped flexible circuit board from the lower part. (a) is the perspective view which looked at the state which removed the plug part of USB memory of Embodiment 2 from the upper part, (b) is the perspective view which looked at the state which removed the plug part of USB memory from the lower part. (a) is the perspective view which looked at the USB memory of Embodiment 3 from the top, (b) is the partially cutaway perspective view which looked at the USB memory from the top, (c) is the USB memory seen from the bottom. FIG. (a) is the perspective view which looked at the state which removed the plug part of the metal case layer of USB memory from the upper direction, (b) is the state which removed the plug part of the metal case layer of USB memory downward It is the perspective view seen from. (a) is the perspective view which looked at the L-shaped large flexible circuit board of USB memory from the upper part, (b) is the perspective view which looked at the L-shaped large flexible circuit board of USB memory from the downward direction. (a) is the partially cutaway perspective view of the USB memory of Embodiment 4 as viewed from above, and (b) is the partially cutaway perspective view of the USB memory of (a) as viewed from below. (a) is the perspective view which looked at the state which removed the plug part of the metal case layer of the USB memory of Embodiment 4, and (b) removed the plug part of the metal case layer of the USB memory. FIG. (a) is the perspective view which looked at the U-shaped flexible circuit board of Embodiment 4 from the upper part, (b) is the perspective view which looked at the U-shaped flexible circuit board from the lower part, and (c) is (a) FIG. (a) is the perspective view which looked at the USB memory of Embodiment 5 from the upper part, (b) is the perspective view which looked at the USB memory of Embodiment 5 from the lower part. (a) is the partially cutaway perspective view of the USB memory of Embodiment 5 as seen from above, and (b) is the partially cutaway perspective view of the USB memory as seen from below. (a) is the perspective view which looked at the state which removed the plug part of the metal case layer of the USB memory of Embodiment 5, and (b) removed the plug part of the metal case layer of the USB memory. It is the perspective view which looked at the state which carried out from the downward direction. (a) is the perspective view which looked at the U-shaped large flexible circuit board of USB memory of Embodiment 5 from the upper part, (b) is the perspective view which looked at the U-shaped large flexible circuit board of USB memory from the lower part is there. (a) is a perspective view of the USB memory of Embodiment 6 as viewed from above, (b) is a perspective view of the USB memory as viewed from below, and (c) is a perspective view of the USB memory of (a) from above. FIG. (a) is the perspective view which looked at the state which removed the plug part from the USB memory of Embodiment 6, and (b) is the perspective view which looked at the state which removed the plug part from the USB memory of Embodiment 6, from the bottom. FIG. (a) is the partially notched perspective view which looked at the state which pulled out the heat sink with the USB memory of Embodiment 6 from the upper direction, (b) is the state which pulled out the heat sink with USB memory outward It is the partially cutaway perspective view which looked at from the bottom. (a) is the perspective view which looked at the mode which pulled out the heat sink outside in the state where the plug part was removed from the USB memory of Embodiment 6, and (b) the state where the plug part was removed from the USB memory It is the perspective view which looked at a mode that the heat sink was pulled out by the bottom. (a) is the perspective view which looked at the heat sink of the USB memory of Embodiment 6 from upper direction, (b) is the perspective view which looked at the heat sink of USB memory from the downward direction. FIG. 7 is a perspective view showing a USB memory in which the heat dissipation structure of Embodiment 6 is attached to the USB memory of Embodiment 1, (a) is a perspective view showing an unused state of the USB memory, and (a) is a perspective view of the USB memory. It is a perspective view which shows a use condition. FIG. 7 is a perspective view showing a USB memory in which the heat dissipation structure of Embodiment 6 is attached to the USB memory of Embodiment 2, (a) is a perspective view showing an unused state of the USB memory, and (a) is a perspective view of the USB memory. It is a perspective view which shows a use condition. FIG. 7 is a perspective view showing a USB memory in which the heat dissipation structure of Embodiment 6 is attached to the USB memory of Embodiment 3, (a) is a perspective view showing an unused state of the USB memory, and (a) is a perspective view of the USB memory. It is a perspective view which shows a use condition. FIG. 7 is a perspective view showing a USB memory in which the heat dissipation structure of Embodiment 6 is attached to the USB memory of Embodiment 5, (a) is a perspective view showing an unused state of the USB memory, and (a) is a perspective view of the USB memory. It is a perspective view which shows a use condition. (a) is a perspective view which shows the USB memory of the conventional USB application apparatus, (b) is a partially cutaway perspective view which shows the internal structure of the conventional USB application apparatus.

Embodiments of the present invention will be described below with reference to the accompanying drawings.
<< Embodiment 1 >>
FIG. 1 is a top view of the mounting operation of a USB (Universal Serial Bus) memory according to Embodiment 1 of the present invention to a receptacle of a notebook computer, and FIG. 1 (a) is a perspective view seen from above. FIG. 1B is a partially cutaway perspective view of the USB memory of FIG.
FIG. 2 is a diagram showing the mounting operation of the USB memory according to the first embodiment to the receptacle of the notebook personal computer as seen from below, FIG. 2 (a) is a perspective view seen from below, and FIG. FIG. 3 is a partially cutaway perspective view of the USB memory of FIG. In FIGS. 1 and 2, the notebook computer is omitted.

  The USB memory (universal serial bus device) 1 according to the first embodiment is attached to, for example, a receptacle r of a notebook personal computer (not shown) of an electronic device. Then, the user stores data from the personal computer in the memory device of the USB memory 1 or performs work on the personal computer using the data stored in the memory device of the USB memory 1.

The USB memory 1 includes a printed circuit board 2 on which electronic terminals 2d such as a connection terminal 2s, a control circuit, and a memory device are mounted, a plug portion 3 that forms a metal case layer that encloses the printed circuit board 2, and a plug. And a grip portion 4 that is formed at the end of the portion 3 and is gripped by the user when the USB memory 1 is attached or detached.
FIG. 3A is a perspective view of the printed circuit board as viewed from above, and FIG. 3B is a perspective view of the printed circuit board as viewed from below.

The printed circuit board 2 is formed in a flat plate shape using a resin material such as glass epoxy, and the USB memory 1 is configured to serve as a circuit board and a structural member.
On the printed circuit board 2, connection terminals 2s are mounted on the upper surface 2u, and electronic components 2d such as a control circuit and a memory device are mounted on the upper and lower surfaces 2u and 2t.

Specifically, a circuit pattern (not shown) of a conductor such as copper foil is formed on the upper and lower surfaces 2u, 2t of the flat printed circuit board 2 by etching, and the upper and lower surfaces 2u, A through hole (not shown) for conducting the 2t circuit pattern is formed.
At one end of the upper surface 2u of the printed circuit board 2, a connection terminal 2s is brought into contact with and electrically connected to a connection terminal r2 (see FIG. 2A) disposed in the receptacle r when the USB memory 1 is used. Is arranged. The connection terminals 2s are a power supply terminal 2s1, a D + transmission signal connection terminal 2s2, a D-transmission signal connection terminal 2s3, and a GND terminal 2s4.

  The circuit patterns on the upper surface 2u and the lower surface 2t of the printed circuit board 2 are mounted with various electronic components 2d for controlling the USB memory 1 constituting the control circuit and the memory device, and connected terminals 2s (2s1, 2s2, 2s3). 2s4) and various electronic components 2d are electrically connected through a circuit pattern. An electronic component 2d is mounted on the upper surface 2u of the printed circuit board 2 except for an area where the connection terminals 2s are installed.

It is not necessary to mount the electronic component 2d on the upper surface 2u of the printed circuit board 2, but it is more preferable to mount the electronic component 2d because the space in the USB memory 1 can be used effectively.
As shown in FIG. 1B, the plug portion 3 includes an opening 3k1 formed so that the connection terminal 2s of the printed circuit board 2 on one end side of the USB memory 1 is exposed to the external space, It is formed so as to cover the printed circuit board 2 except for the opening 3k2 facing the grip portion 4 on the end side. The plug part 3 is comprised using the metal which has rust prevention property, for example, stainless steel etc.

  A front plate 3m is formed on the opening 3k1 side of the plug portion 3 by bending (bending) the lower surface plate 3s to the upper side of the front end portion. The front plate 3m of the plug portion 3 can prevent dust from entering the USB memory 1 from the lower front side of the printed circuit board 2.

  As shown in FIG. 1A, the upper surface plate 3u of the plug portion 3 is provided with locking holes 3u1, 3u1 that are locked to spring members (not shown) in the receptacle r. Similarly, as shown in FIG. 2A, locking holes 3s1, 3s1 that are locked to spring members (not shown) in the receptacle r are formed in the lower surface plate 3s of the plug portion 3. . When the locking holes 3u1 and 3s1 of the plug portion 3 are locked by the spring member in the receptacle r, the USB memory 1 is held in the receptacle r.

4A is a perspective view of the USB memory with the plug part removed, as viewed from above. FIG. 4B is a perspective view of the USB memory with the plug part removed as seen from below. is there.
The grip portion 4 of the USB memory 1 is formed in a flat plate shape extending in a substantially vertical direction with respect to the plug portion 3 on the other end side of the USB memory 1 using resin (see FIGS. 1 and 2).

As shown in FIG. 4 (a), the grip portion 4 is formed with a plug support rib 4p projecting forward in a rectangular flat plate shape extending forward, and the plug support rib 4p is formed on the grip portion 4 side. The plug portion 3 is supported by contacting the inner surface of the plug portion 3 forming the metal case layer (see FIG. 1B).
Further, as shown in FIG. 4B, the grip portion 4 is formed with a rectangular peripheral support rib 4 s extending forward, and the peripheral support rib 4 s is provided on the lower surface 2 t of the printed circuit board 2. In such a manner as to avoid the electronic component 2d, the printed circuit board 2 is supported in contact with the periphery.

And the lower center support rib 4o1 is formed in the aspect which crosses the lower center part of the periphery support rib 4s in the horizontal direction, and the lower center support rib 4o1 avoids the electronic component 2d provided in the lower surface 2t of the printed circuit board 2. The printed circuit board 2 is in contact with and supported by the central portion of the lower surface 2t.
Further, as shown in FIGS. 4A and 1B, an upper central support rib 4o2 is formed on the upper side of the peripheral support rib 4s so as to cross the upper central portion of the peripheral support rib 4s in the lateral direction. The upper center support rib 4o2 is in contact with and supports the central portion of the upper surface 2u of the printed circuit board 2 in such a manner as to avoid the electronic component 2d provided on the upper surface 2u of the printed circuit board 2.

The printed circuit board 2 is fixed and held in the USB memory 1 by the peripheral support rib 4s, the lower center support rib 4o1, and the upper center support rib 4o2.
The grip portion 4, the plug support rib 4p, the peripheral support rib 4s, the lower center support rib 4o1, and the upper center support rib 4o2 are integrally configured by injection molding using resin.

  When assembling, the printed circuit board 2 is fixed to the grip portion 4, the plug support rib 4p, the peripheral support rib 4s, the lower center support rib 4o1, and the upper center support rib 4o2, and then the plug portion 3 forming a metal case layer is formed. , Plug support rib 4p, peripheral support rib 4s, lower center support rib 4o1, and upper center support rib 4o2.

When the USB memory 1 is used, the plug portion 3 of the USB memory 1 is inserted into (attached to) the mounting opening r1 of the receptacle r of the personal computer, for example, as indicated by an arrow α1 in FIGS. 1 (a) and 2 (a). ), The connection terminal r2 disposed in the receptacle r and the connection terminal 2s on the printed circuit board 2 of the USB memory 1 come into contact with each other and are electrically connected.
At this time, the locking hole 3u1 of the upper surface plate 3u of the plug portion 3 of the USB memory 1 and the locking hole 3s1 of the lower surface plate 3s are elastically locked to the spring member in the receptacle r, so that the USB memory 1 is connected to the receptacle r. Securely held inside.

According to the first embodiment, a plurality of conventional circuit boards and circuit mounting boards (the conventional mounting board 511, circuit mounting board 519, connection terminal 513, control circuit 551, and memory device shown in FIG. 29B) Since the configuration of the single printed circuit board 2 that also serves as the reference numeral 553), the configuration is simple.
Therefore, the number of parts can be reduced and the cost can be reduced.
In addition, since the single printed circuit board 2 serves as the circuit board and the circuit mounting board, the USB memory 1 can be reduced in size.

Since the USB memory 1 is reduced in size, for example, even when the notebook computer is carried with the USB memory 1 attached to the notebook computer, it is only necessary that the grip portion 4 held by the user protrudes outside the notebook computer. , Do not get in the way of carrying your laptop.
Further, when the USB memory 1 is mounted, there are very few portions that protrude to the outside, so that it is not necessary to remove the USB memory 1 from the notebook personal computer (electronic device).

Note that the area between the upper surface 2u of the printed circuit board 2 excluding the vicinity of the connection terminals 2s (2s1, 2s2, 2s3, 2s4) and the metal case layer of the plug portion 3 and the lower surface 2t of the printed circuit board 2 and the plug A resin may be filled between the metal case layer of the portion 3. Further, a resin may be filled between the printed circuit board 2 and the plug support rib 4p.
In this case, the surrounding support rib 4s, the lower center support rib 4o1, and the upper center support rib 4o2 may or may not be provided.

  Heat is generated in the electronic component 2d mounted on the printed circuit board 2 by filling the resin between the printed circuit board 2 and the metal case layer of the plug portion 3 and the plug support rib 4p (gripping portion 4). Can be conducted to the plug portion 3 and the grip portion 4 of the metal case layer to effectively dissipate heat. Further, by filling the resin between the printed circuit board 2 and the metal case layer of the plug portion 3, the printed circuit board 2 can be securely fixed to the plug portion 3 of the metal case layer. is there.

  In the first embodiment, the grip 4 and the surrounding support ribs 4s, the lower center support rib 4o1, and the upper center support rib 4o2 are illustrated as being integrally formed by injection molding, but may be configured separately. .

<< Embodiment 2 >>
FIG. 5 is a view of the mounting operation of the USB memory according to the second embodiment to the receptacle of the notebook personal computer as viewed from above, FIG. 5A is a perspective view as viewed from above, and FIG. FIG. 5 is a partially cutaway perspective view of the USB memory of FIG.
6 is a diagram showing the mounting operation of the USB memory according to the second embodiment of the present invention to the receptacle of the notebook computer as viewed from below, and FIG. 6 (a) is a perspective view as viewed from below. FIG. 7B is a partially cutaway perspective view of the USB memory of FIG.

The USB memory 21 of the second embodiment is an L-shaped flexible circuit board 22 that is obtained by bending the printed circuit board 2 of the first embodiment into an L shape.
Since the other configuration is the same as that of the first embodiment, the same components are denoted by reference numerals in the 20th order and detailed description thereof is omitted.
5 and 6, the notebook personal computer is omitted.

FIG. 7 is a partially cutaway side view of a state in which the USB memory according to Embodiment 2 is attached to a notebook personal computer as viewed from the side.
The USB memory (universal serial bus device) 21 according to the second embodiment is attached (attached) to the receptacle r of the notebook personal computer P in the direction of the arrow α1 in FIGS. 5A and 6A (see FIG. 7). The data is stored in the memory device of the USB memory 21 from the notebook personal computer P, or the data is stored in the memory device of the USB memory 1 and the work is performed on the notebook personal computer P of the electronic device.

  The USB memory 21 according to the second embodiment includes an L-shaped flexible circuit board 22 on which an electronic component 22d such as a connection terminal 22s, a control circuit, and a memory device is mounted, and a metal that encloses the L-shaped flexible circuit board 22. A plug portion 23 forming a case layer, and a grip portion 24 formed at an end portion of the plug portion 23 and gripped by a user when the USB memory 21 is attached (attached) to an electronic device are provided.

FIG. 8A is a perspective view of the L-shaped flexible circuit board 22 as viewed from above, and FIG. 8B is a perspective view of the L-shaped flexible circuit board 22 as viewed from below.
The L-shaped flexible circuit board 22 is formed by being bent into an L-shape using a flexible resin material. As in the first embodiment, the USB memory 21 serves as a circuit board and a structural member. Yes.

The L-shaped flexible circuit board 22 has a flat plate portion 22A and an upper bent portion 22B bent upward substantially perpendicular to the flat plate portion 22A. Note that the upward bent portion 22B is formed in a direction along the wall surface Pk of the notebook computer P perpendicular to the fitting (attaching) direction to the receptacle r (see FIGS. 5B and 7).
The L-shaped flexible circuit board 22 has the connection terminals 22s mounted on the front surface 22u and the electronic components 22d responsible for controlling the USB memory 21 constituting the control circuit, memory device, etc. mounted on the front and back surfaces 22u and 22t. .

On one side of the surface 22u of the flat plate portion 22A of the extending surface of the L-shaped flexible circuit board 22, a connection terminal r2 (inside the receptacle r of the notebook personal computer (not shown) when the USB memory 21 is used) A connection terminal 22s that is in contact with and electrically connected to FIG. 6A is disposed.
Various electronic components 22d constituting a control circuit and a memory device are mounted on the circuit pattern formed on the front surface 22u and the back surface 22t of the L-shaped flexible circuit board 22, and connection terminals 22s (22s1, 22s2, 22s3, 22s4) and various electronic components 22d are electrically connected via a circuit pattern. An electronic component 22d can be mounted on the surface 22u of the L-shaped flexible circuit board 22 except for a region where the connection terminal 22s is installed.

  As shown in FIG. 5B, the plug portion 23 includes an opening 23k1 formed so that the connection terminal 22s of the L-shaped flexible circuit board 22 on one end side of the USB memory 21 is exposed to the external space, and a USB memory. A metal case layer covering the L-shaped flexible circuit board 22 is formed except for the opening 23k2 facing the grip portion 24 on the other end side of 21.

  As shown in FIG. 5A, the upper surface plate 23u of the plug portion 23 is provided with a locking hole 23u1 that is locked to a spring member (not shown) for holding the USB memory 21 in the receptacle r. Has been. Similarly, as shown in FIG. 6A, the lower surface plate 23s of the plug portion 23 has a locking hole that is locked to a spring member (not shown) for holding the USB memory 21 in the receptacle r. 23s1 is perforated.

FIG. 9A is a perspective view of the state in which the plug portion of the USB memory is removed as seen from above, and FIG. 9B is a perspective view of the state in which the plug portion of the USB memory is removed as seen from below. is there.
The grip portion 24 of the USB memory 21 is formed in a flat plate shape that extends in the vertical direction to the plug portion 23 on the other end side of the USB memory 21 using resin.
The upward bent portion 22 </ b> B of the L-shaped flexible circuit board 22 is arranged along the grip portion 24.

As shown in FIGS. 5 (b) and 9 (a), the grip portion 24 is formed with a plug support rib 24p extending forward in the shape of a rectangular flat plate and extending forward, and the plug support rib 24p. Are supported by contacting the inner surface of the plug portion 23 forming the metal case layer on the gripping portion 24 side.
The upward bent portion 22B of the L-shaped flexible circuit board 22 is disposed along the plug support rib 24p. The upward bent portion 22B of the L-shaped flexible circuit board 22 is joined to the plug support rib 24p via an adhesive layer (not shown).

  Further, as shown in FIGS. 6B and 9B, the grip portion 24 is formed with a rectangular peripheral support rib 24s extending forward, and the rectangular peripheral support rib 24s The L-shaped flexible circuit board 22 is in contact with and supported by the periphery of the L-shaped flexible circuit board 22 in a manner that avoids the electronic component 22d provided on the back surface 22t of the flat plate portion 22A of the L-shaped flexible circuit board 22.

  And the lower center support rib 24o1 is formed in the aspect which crosses the lower center part of the periphery support rib 24s to the horizontal direction, and the lower center support rib 24o1 is provided in the back surface 22t of the flat plate part 22A of the L-shaped flexible circuit board 22. The electronic component 22d is avoided and is in contact with and supported by the central portion of the back surface 22t of the L-shaped flexible circuit board 22.

  Further, as shown in FIGS. 5B and 9A, an upper central support rib 24o2 is formed on the upper side of the peripheral support rib 24s so as to cross the upper central portion of the peripheral support rib 24s in the lateral direction. The upper center support rib 24o2 is an aspect that avoids the electronic component 22d provided on the surface 22u of the flat plate portion 22A of the L-shaped flexible circuit board 22, and is the center of the surface 22u of the flat plate portion 22A of the L-shaped flexible circuit board 22 It abuts on the part and supports it.

The L-shaped flexible circuit board 22 is fixed and held in the USB memory 21 by the peripheral support rib 24s, the lower center support rib 24o1, and the upper center support rib 24o2.
The grip portion 24, the plug support rib 24p, the peripheral support rib 24s, the lower center support rib 24o1, and the upper center support rib 24o2 are integrally configured using resin by injection molding.

When the USB memory 21 is used, as shown by an arrow α1 in FIGS. 5A and 6A, for example, the plug portion 23 of the USB memory 21 is inserted into the mounting port r1 of the receptacle r of the personal computer (FIG. 7). The connection terminal r2 (see FIG. 6A) disposed in the receptacle r and the connection terminal 22s on the L-shaped flexible circuit board 22 of the USB memory 21 are in contact with each other and are electrically connected. The
At this time, the locking hole 23u1 of the upper surface plate 23u and the locking hole 23s1 of the lower surface plate 23s of the plug portion 23 of the USB memory 21 are elastically locked to the spring member in the receptacle r, so that the USB memory 21 is securely held in the receptacle r.

According to the second embodiment, by using the L-shaped flexible circuit board 22 of the flexible printed board, the mounting area of the electronic component 22d can be widened by folding. That is, the electronic component 22d can be mounted in the vertical direction, and the mounting area of the electronic component 22d can be expanded. Also, unnecessary connection lines can be minimized.
Therefore, the USB memory 21 can be further reduced in size.

Further, since the upper bent portion 22B formed by bending the L-shaped flexible circuit board 22 is formed along the wall surface Pk of the notebook personal computer (electronic device) P including the receptacle r, the receptacle r of the USB memory 21 is provided. The amount of protrusion from the electronic device can be reduced as much as possible.
In addition, the effect of Embodiment 1 is show | played similarly.

  In the second embodiment, the case where the L-shaped flexible circuit board 22 is bent upward is illustrated, but the L-shaped flexible circuit board 22 may be bent downward and the bending direction of the L-shaped flexible circuit board 22 is not particularly limited.

  In addition, between the area | region except the vicinity of the connection terminal 22s of the surface 22u of the L-shaped flexible circuit board 22 and the metal case layer of the plug part 23, and the back surface 22t of the L-shaped flexible circuit board 22 and the plug part 23 A resin may be filled between the metal case layer and the plug support rib 24p (see FIG. 5B). In this case, the peripheral support rib 24s, the lower center support rib 24o1, and the upper center support rib 24o2 may or may not be provided.

  The resin mounted on the L-shaped flexible circuit board 22 by filling the resin between the L-shaped flexible circuit board 22 and the metal case layer of the plug portion 23 and the plug support rib 24p (gripping portion 24). The heat generated in the component 22d can be conducted to the plug portion 23 and the grip portion 24 of the metal case layer, and can be effectively radiated.

  Further, the L-shaped flexible circuit board 22 is plugged into the metal case layer by filling the resin between the L-shaped flexible circuit board 22 and the metal case layer of the plug portion 23 and the plug support rib 24p. It is possible to securely fix to the portion 23 and the plug support rib 24p (grip portion 24).

  In the second embodiment, the grip 24, the surrounding support ribs 24s, the lower center support rib 24o1, and the upper center support rib 24o2 are illustrated as being integrally formed by injection molding, but may be configured separately. Good. In this case, at least one of the peripheral support rib 24s, the lower center support rib 24o1, and the upper center support rib 24o2 may be fixed to the inner surface of the plug portion 23 by bonding or the like.

<< Embodiment 3 >>
10A is a perspective view of the USB memory according to the third embodiment as viewed from above, and FIG. 10B is a partially cutaway perspective view of the USB memory as viewed from above. ) Is a partially cutaway perspective view of the USB memory as viewed from below.
In the USB memory 31 of the third embodiment, the upper bent portion 22B of the L-shaped flexible circuit board 22 described in the second embodiment is an L-shaped large flexible circuit board 32 arranged on the grip portion 34 of the USB memory 31. It is.
Since the other configuration is the same as that of the USB memory 21 of the second embodiment, the same components as those of the second embodiment are denoted by reference numerals in the thirties and detailed description thereof is omitted.

In the USB memory 31 of the third embodiment, the L-shaped flexible circuit board 22 described in the second embodiment is formed as an L-shaped large flexible circuit board 32 having an enlarged size, and the L-shaped large flexible circuit board 32 is formed. The upper bent portion 32 </ b> B is accommodated in the grip portion 34 of the USB memory 31.
Therefore, the holding part 34 of the USB memory 31 is divided into a first holding part 34a and a second holding part 34b so that the upward bent part 32B of the L-shaped large flexible circuit board 32 is accommodated.

FIG. 11A is a perspective view of a state in which the plug portion of the metal case layer of the USB memory is removed from above, and FIG. 11B is a view of the plug portion of the metal case layer of the USB memory. It is the perspective view which looked at the state which removed from the lower part.
The first gripping portion 34a shown in FIG. 11 is formed by injection molding integrally with the plug support rib 34p, the peripheral support rib 34s, the lower center support rib 34o1, and the upper center support rib 34o2 using resin. The second grip 34b is formed by injection molding or the like independently of the first grip 34a.

FIG. 12A is a perspective view of the L-shaped large flexible circuit board of the USB memory as viewed from above, and FIG. 12B is a perspective view of the L-shaped large flexible circuit board of the USB memory as viewed from below. FIG.
Various circuit components 22d constituting a control circuit and a memory device are mounted on the circuit pattern of the front surface 32u and the back surface 32t of the L-shaped large flexible circuit board 32, and the connection terminals 32s disposed on the front surface 32u and the various types. The electronic component 32d is electrically connected through a circuit pattern. On the surface 32u of the L-shaped large flexible circuit board 32, electronic components 32d as necessary are mounted except for the region where the connection terminals 32s are installed.

The USB memory 31 is assembled as follows.
With the second gripping portion 34b shown in FIG. 11 removed from the first gripping portion 34a, the flat plate portion 32A of the L-shaped large flexible circuit board 32 is surrounded by the peripheral support rib 34s, the lower center support rib 34o1, and the upper center support rib 34o2. And an upward bent portion 32B of the L-shaped large flexible circuit board 32 is disposed inside the first gripping portion 34a (see FIGS. 10B and 10C).

Thereafter, the second gripping portion 34b is joined to the first gripping portion 34a, and the upward bent portion 32B of the L-shaped large flexible circuit board 32 is accommodated in the gripping portion 34.
Thereafter, the plug portion 33 constituting a metal case layer is attached to the first grip portion 34a, the plug support rib 34p, the peripheral support rib 24s, the lower center support rib 24o1, and the upper center support rib 24o2 of the grip portion 34.

  According to the USB memory 31 of the third embodiment, the upper bent portion 32B of the L-shaped large flexible circuit board 32 is accommodated in the grip portion 34, so that the flat plate portion 22A of the L-shaped large flexible circuit board 32 is formed large. In addition, the size of the upper bent portion 32 </ b> B that can be accommodated in the grip portion 34 can be increased. Therefore, the mounting area of the electronic component 32b on the L-shaped large flexible circuit board 32 can be increased.

Thus, since the internal space of the USB memory 31 can be used effectively, the USB memory 31 can be further reduced in size.
In addition, the effect of Embodiment 1, 2 is show | played similarly.

  In the third embodiment, the case where the L-shaped large flexible circuit board 32 is bent upward is illustrated, but the L-shaped large flexible circuit board 32 may be bent downward, and the bending direction of the L-shaped large flexible circuit board 32 is particularly limited. Not.

  Further, between the region excluding the vicinity of the connection terminal 32 s on the surface 32 u of the surface 32 u of the L-shaped large flexible circuit board 32, the metal case layer and the holding part 34 of the plug portion 33, and the L-shaped large flexible circuit board 32. A resin may be filled between the back surface 32 t of the metal plate and the metal case layer and the holding portion 34 of the plug portion 33. In this case, the peripheral support rib 24s, the lower center support rib 24o1, and the upper center support rib 24o2 may or may not be provided.

The resin is filled between the L-shaped large flexible circuit board 32 and the metal case layer of the plug part 33 and the holding part 34, thereby generating the electronic component 32d mounted on the L-shaped large flexible circuit board 32. It is possible to conduct heat to the plug portion 33 and the grip portion 34 of the metal case layer, and to effectively dissipate heat.
Further, the L-shaped large flexible circuit board 32 is made of a metal case layer by filling the resin between the L-shaped large flexible circuit board 32 and the metal case layer of the plug portion 33 and the holding portion 34. The plug part 33 and the grip part 34 can be securely fixed.

<< Embodiment 4 >>
FIG. 13A is a partially cutaway perspective view of the USB memory according to the fourth embodiment of the present invention as viewed from above, and FIG. 13B is a view of the USB memory of FIG. 13A as viewed from below. It is a partially cutaway perspective view.
The USB memory 41 of the fourth embodiment is a U-shaped flexible circuit board 42 obtained by folding the printed circuit board 2 of the first embodiment into a U-shape. Since other configurations are the same as those of the first embodiment, the same components are denoted by reference numerals in the 40s and detailed description thereof is omitted.

  The USB memory 41 according to the fourth embodiment is made of a U-shaped flexible circuit board 42 on which electronic components 42d such as a connection terminal 42s, a control circuit, and a memory device are mounted, and a metal that encloses the U-shaped flexible circuit board 42. A plug portion 43 that forms a case layer, and a grip portion 44 that is formed at an end portion of the plug portion 43 and is gripped by a user when the USB memory 41 is attached (attached) to an electronic device.

On the U-shaped flexible circuit board 42, connection terminals 42s are mounted on the front surface 42u, and electronic components 42d that form a control circuit, a memory device, and the like and control the USB memory 41 are mounted on the front and back surfaces 42u and 42t. ing.
14A is a perspective view of the USB memory metal case layer with the plug portion removed, as viewed from above, and FIG. 14B is a USB memory metal case layer plug portion. It is the perspective view which looked at the state which removed from the lower part.

The grip 44, the plug support rib 44p, the peripheral support rib 44s, the lower center support rib 44o1, and the upper center support rib 44o2 are integrally configured using resin by injection molding.
FIG. 15A is a perspective view of the U-shaped flexible circuit board as viewed from above, and FIG. 15B is a perspective view of the U-shaped flexible circuit board as viewed from below. ) Is a view in the direction of arrow A in FIG.

The U-shaped flexible circuit board 42 is formed by being folded into a U-shape using a flexible resin material. As in the first embodiment, the USB memory 41 has a configuration that serves as both a circuit board and a structural member. Yes.
The U-shaped flexible circuit board 42 includes a flat plate portion 42A and a folded portion 42B formed by folding the flat plate portion 42A.

On one side of the surface 42u of the flat plate portion 42A of the extending surface of the U-shaped flexible circuit board 42, there is a connection terminal r2 disposed in a receptacle r of a notebook computer (not shown) when the USB memory 41 is used. Connection terminals 42s (42s1, 42s2, 42s3, 42s4) that are in contact and electrically connected are arranged.
Various electronic components 42d constituting a control circuit and a memory device are mounted on the circuit pattern formed on the front surface 42u and the back surface 42t of the U-shaped flexible circuit board 42. The connection terminal 42s and the various electronic components 42d Are electrically connected via a circuit pattern. On the surface 42u of the U-shaped flexible circuit board 42, an electronic component 42d can be mounted as necessary, except for a region where the connection terminal 42s is installed.

  As shown in FIG. 15 (c), the surface of the U-shaped flexible circuit board 42 where the flat plate portion 42 </ b> A and the folded portion 42 </ b> B are opposed to each other is formed by mounting the electronic component 42 d on only one of the surfaces. The disposed electronic components 42d are disposed close to each other to prevent interference with electromagnetic waves or the like. If interference does not occur, the electronic component 42d may be mounted on both surfaces where the flat plate portion 42A and the folded portion 42B face each other.

As shown in FIG. 14, the U-shaped flexible circuit board 42 abuts on the peripheral support rib 44s, the lower center support rib 44o1, and the upper center support rib 44o2, avoiding the connection terminals 42s and various electronic components 42d. Fixed and held.
According to the fourth embodiment, the U-shaped flexible circuit board 42 that serves as a plurality of conventional circuit boards and circuit mounting boards is folded so that the mounting area of the electronic component 42d on the circuit board is reduced. The USB memory 41 can be further reduced in size.
In addition, the effect of Embodiment 1 is show | played similarly.

In the fourth embodiment, the case where the U-shaped flexible circuit board 42 is folded upward is illustrated. However, the U-shaped flexible circuit board 42 may be folded downward and the folding direction of the U-shaped flexible circuit board 42 is not particularly limited.
The U-shaped flexible circuit board 42 except for the vicinity of the connection terminal 42s on the surface 42u of the U-shaped flexible circuit board 42, the metal case layer of the plug portion 43, and the plug support rib 44p, and the U-shape A resin may be filled between the flat plate portion 42 </ b> A and the folded portion 42 </ b> B of the flexible circuit board 42. In this case, the peripheral support rib 44s, the lower center support rib 44o1, and the upper center support rib 44o2 may or may not be provided.

  Heat is generated in the electronic component 42d mounted on the U-shaped flexible circuit board 42 by filling the resin between the U-shaped flexible circuit board 42 and the metal case layer of the plug portion 43 and the grip portion 44. Can be conducted to the plug part 43 and the grip part 44 of the metal case layer to effectively dissipate heat.

  Further, a resin is formed between the U-shaped flexible circuit board 42 and the metal case layer of the plug portion 43 and the plug support rib 44p, and between the flat plate portion 42A and the folded portion 42B of the U-shaped flexible circuit substrate 42. It is possible to reliably fix the U-shaped flexible circuit board 42 to the plug portion 43 and the plug support rib 44p of the metal case layer. In this case, the peripheral support rib 44s, the lower center support rib 44o1, and the upper center support rib 44o2 may or may not be provided.

  In the fourth embodiment, the grip 44, the peripheral support rib 44s, the lower center support rib 44o1, and the upper center support rib 44o2 are illustrated as being integrally formed by injection molding, but may be configured separately. Good. In this case, at least one of the peripheral support rib 44s, the lower center support rib 44o1, and the upper center support rib 44o2 may be fixed to the inner surface of the plug portion 23 by bonding or the like.

<< Embodiment 5 >>
FIG. 16A is a perspective view of the USB memory according to the fifth embodiment as viewed from above, and FIG. 16B is a perspective view of the USB memory as viewed from below.
FIG. 17A is a partially cutaway perspective view of the USB memory according to the fifth embodiment viewed from above, and FIG. 17B is a partially cutaway perspective view of the USB memory viewed from below.

The USB memory 51 of the fifth embodiment is a U-shaped large flexible circuit board 52 formed by enlarging the U-shaped flexible circuit board 42 described in the fourth embodiment, and the folded portion 52C is accommodated in the grip portion 54. It is what.
Since other configurations are the same as those in the fourth embodiment, the same components are denoted by reference numerals in the 50s and detailed description thereof is omitted.

  In the USB memory 51 of the fifth embodiment, a U-shaped large flexible circuit board 52 is formed in an enlarged size, and as shown in FIG. 17, the folded portion 52C of the U-shaped large flexible circuit board 52 is replaced with a USB memory. 51 is configured to be accommodated in the grip portion 54.

Therefore, the grip portion 54 of the USB memory 51 has a first grip portion 54a and a second grip portion 54b so that the folded portion 52C of the U-shaped large flexible circuit board 52 is accommodated.
18A is a perspective view of the USB memory metal case layer with the plug portion removed, as viewed from above, and FIG. 18B is a USB memory metal case layer plug portion. It is the perspective view which looked at the state which removed from the lower part.

  The first holding part 54a shown in FIG. 18 is molded by injection molding or the like integrally with the plug support rib 54p, the surrounding support rib 54s, the lower center support rib 54o1, and the upper center support rib 54o2 using resin. The second grip portion 54b is molded by injection molding or the like using a resin independently of the first grip portion 54a.

FIG. 19A is a perspective view of the U-shaped large flexible circuit board of the USB memory as viewed from above. FIG. 19B is a perspective view of the U-shaped large flexible circuit board of the USB memory as viewed from below. FIG.
The U-shaped large flexible circuit board 52 has a flat plate portion 52A, a folded portion 52B formed by being folded with respect to the flat plate portion 52A, and a folded portion 52C by being folded.

  The circuit patterns formed on the front and back surfaces 52u and 52t of the U-shaped large flexible circuit board 52 are mounted with various electronic components 52d constituting a control circuit and a memory device, and on the front surface 52u, connection terminals 52s (52s1 , 52s2, 52s3, 52s4) and various electronic components 52d are electrically connected to each other through a circuit pattern. An electronic component 52d can be mounted on the surface 52u of the U-shaped large flexible circuit board 52 as necessary, except for the region where the connection terminals 52s are installed.

  Since the U-shaped large flexible circuit board 52 is configured such that the folded portion 52C between the flat plate portion 52A and the folded portion 52B is accommodated in the grip portion 54 of the USB memory 51, the flat plate portion 52A and the folded portion 52B are enlarged. Is formed.

The USB memory 51 is assembled as follows.
With the second gripping portion 54b shown in FIG. 18 removed from the first gripping portion 54a, the flat plate portion 52A of the U-shaped large flexible circuit board 52 has the peripheral support rib 54s, the lower center support rib 54o1, and the upper center support rib 54o2. The folded portion 52C between the flat plate portion 52A and the folded portion 52B of the U-shaped large flexible circuit board 52 is disposed inside the first gripping portion 54a (see FIG. 17B). .

  Thereafter, as shown in FIG. 18, the second gripping portion 54 b is joined to the first gripping portion 54 a, and a part of the flat plate portion 52 </ b> A of the U-shaped large flexible circuit board 52 and the folded portion 52 </ b> B are inside the gripping portion 54. A part and the folded portion 52C are accommodated.

  Thereafter, as shown in FIGS. 16 and 17, the first gripping portion 54a of the gripping portion 54, the plug support rib 54p, the peripheral support rib 54s, the lower center support rib 54o1, and the upper center support rib 54o2 are made of a metal case. A layered plug 53 is attached.

  According to the USB memory 51 of the fifth embodiment, the folded portion 52C between the flat plate portion 52A and the folded portion 52B of the U-shaped large flexible circuit board 52 is accommodated in the grip portion 54, so the flat plate portion 52A and the folded portion 52B. Is enlarged and the U-shaped large flexible circuit board 52 can be formed larger. Therefore, the mounting area of the electronic component 52b on the U-shaped large flexible circuit board 52 can be increased.

Since the internal space of the USB memory 51 can be used effectively, the USB memory 51 can be further reduced in size.
In addition, the effect of Embodiment 1, 4 is show | played similarly.

  Incidentally, although the case where the U-shaped large flexible circuit board 52 is bent upward is illustrated in the fifth embodiment, the U-shaped large flexible circuit board 52 may be bent downward and the bending direction of the U-shaped large flexible circuit board 52 is particularly limited. Not.

  Between the region excluding the vicinity of the connection terminal 52s (52s1, 52s2, 52s3, 52s4) on the surface 52u of the U-shaped large flexible circuit board 52 and the metal case layer and the gripping part 54 of the plug part 53, and The resin may be filled between the flat plate portion 52A and the folded portion 52B of the U-shaped large flexible circuit board 52. In this case, the peripheral support rib 54s, the lower center support rib 54o1, and the upper center support rib 54o2 may or may not be provided.

  The resin is filled between the U-shaped large flexible circuit board 52 and the metal case layer of the plug part 53 and the grip part 54, thereby generating the electronic component 52d mounted on the U-shaped large flexible circuit board 52. It is possible to conduct heat to the plug portion 53 and the grip portion 54 of the metal case layer and effectively dissipate heat. Further, by filling the U-shaped large flexible circuit board 52 with the metal case layer of the plug portion 53 and the grip portion 54, the U-shaped large flexible circuit board 52 is made of the metal case layer. It is possible to securely fix the plug portion 53 and the grip portion 54 inside.

<< Embodiment 6 >>
20A is a perspective view of the USB memory according to the sixth embodiment of the present invention as viewed from above, and FIG. 20B is a perspective view of the USB memory as illustrated in FIG. 20A as viewed from below. FIG. 20C is a partially cutaway perspective view of the USB memory of FIG. 20A as viewed from above.
FIG. 21A is a perspective view of the state in which the plug portion is removed from the USB memory according to the sixth embodiment as viewed from above, and FIG. 21B is a diagram in which the plug portion is removed from the USB memory in FIG. It is the perspective view which looked at the state from the lower part.

  FIG. 22A is a partially cutaway perspective view of the USB memory according to the sixth embodiment when the heat sink is pulled out from the top, and FIG. 22B is a USB perspective view of FIG. It is the partially notched perspective view which looked at the state which pulled out the heat sink with memory from the lower part.

In the USB memory 61 of the sixth embodiment, a heat radiating plate 67 that radiates heat generated from the electronic component 42d mounted on the U-shaped flexible circuit board 42 of the USB memory 41 of the fourth embodiment to the external space can be taken out to the outside. It is added to.
Since other configurations are the same as those of the fourth embodiment, the same components are denoted by reference numerals in the 60s and detailed description thereof is omitted.

FIG. 23 (a) is a perspective view of the state in which the heat sink is pulled out with the plug portion removed from the USB memory according to the sixth embodiment, and FIG. 23 (b) is a perspective view of the sixth embodiment. It is the perspective view which looked at a mode that the heat sink was pulled out in the state which removed the plug part from USB memory from the downward direction.
As shown in FIGS. 21B and 22B, the USB memory 61 of the sixth embodiment shown in FIG. 20 has a heat radiating plate 67 facing the back surface 62t of the U-shaped flexible circuit board 62. It can be removed freely.

FIG. 24A is a perspective view of the heat sink of the USB memory according to the sixth embodiment as viewed from above, and FIG. 24B is a perspective view of the heat sink of the USB memory as viewed from below.
At one end of the heat radiating plate 67, as shown in FIG. 22, when the user uses the USB memory 61, a heat radiating plate take-out portion 68 is formed that is gripped when the heat radiating plate 67 is pulled out (FIG. 24). reference).
A large number of heat radiating fins 68a are formed on the outside of the heat radiating plate take-out portion 68 to increase the heat radiating area and improve the heat radiating efficiency.

  As shown in FIGS. 22 and 23, when the heat sink 67 is pulled outward, the heat sink 67 is locked to the stopper 66, and the heat sink 67 has a partial area on the back surface 62t of the U-shaped flexible circuit board 62. opposite. Therefore, the heat generated in the electronic component 62d mounted on the U-shaped flexible circuit board 62 is transmitted to the heat radiating plate 67 by radiation, convection, etc., and is thermally conducted from the heat radiating plate 67 to the heat radiating plate takeout portion 68. The heat can be efficiently radiated through the heat radiation fins 68a of the heat radiation plate 67 and the heat radiation plate take-out portion 68.

The use operation of the USB memory 61 will be described below.
When the USB memory 61 is not used, the user handles the USB memory 61 in the state shown in FIG.
When the USB memory 61 is used, the user attaches the USB memory 61 to the receptacle r of the electronic device shown in FIG. 1 as described above. Then, the user grips the heat sink extraction part 68 of the USB memory 61 shown in FIG. 20, pulls it outward (see FIG. 22), and uses the electronic device.

As a result, the heat generated in the electronic component 62d mounted on the U-shaped flexible circuit board 62 is transmitted to the heat radiating plate 67, and is thermally conducted from the heat radiating plate 67 to the heat radiating plate taking-out portion 68. The heat is efficiently radiated from the heat radiation fins 68a of the portion 68 to the external space.
For example, the exposed heat radiation plate take-out portion 68 that is exposed to the outside when exposed is made of metal and has a structure of heat radiation fins 68a in the longitudinal groove in order to enhance the heat radiation effect. It is possible to increase.
It is more preferable that the heat radiating plate 67 and the heat radiating plate take-out portion 68 are integrally formed of a metal having good heat conductivity because heat conduction is increased.

According to the USB memory 61 of the sixth embodiment, since the heat sink 67 that can be pulled out is provided outside, the electronic memory 62d is mounted on the U-shaped flexible circuit board 62 of the miniaturized USB memory 61. Heat can be efficiently radiated through the heat radiating plate 67 and the heat radiating fins 68a drawn outward. For example, a slidable metal plate heat dissipation plate 67 can be stored in the main body of the USB memory 61, and by sliding it out during operation, the heat dissipation effect can be enhanced during extraction.
Therefore, it is possible to prevent the temperature of the miniaturized USB memory 61 from rising.

  In addition, since the USB memory 61 is used in the state shown in FIG. 22, when the user removes the USB memory 61 from the receptacle r of the electronic device, the heat radiation plate take-out portion 68 can be easily grasped. Therefore, it is possible to easily remove the USB memory 61 from the electronic device.

  In the sixth embodiment, the case where the radiating fins 68a are provided outside the radiating plate taking-out portion 68 is illustrated. However, the radiating fins 68a may be provided inside or outside the radiating plate taking-out portion 68. The position provided in the heat sink extraction part 68 is not limited.

<< Other Embodiments >>
The heat dissipation structure described in the sixth embodiment includes the USB memories 1 (see FIG. 1), 21 (see FIG. 5), 31 (see FIG. 10), and 51 (see FIG. 16) of the first, second, third, and fifth embodiments. It is also applicable to.

  FIGS. 25 to 28 show USB memories 1H, 21H, 31H, and 51H in which the heat dissipation structures described in Embodiment 6 are attached to the USB memories 1, 21, 31, and 51 of Embodiments 1, 2, 3, and 5, respectively. Indicates. FIGS. 25A to 28A show the unused states of the USB memories 1H, 21H, 31H, and 51H. FIGS. 25B to 28B show the USB memories 1H, 21H, 31H, and 51H. Indicates the state of use.

In other words, FIGS. 25 (a) to 28 (a) show a state in which the heat dissipation plate 67 is housed in the USB memories 1H, 21H, 31H and 51H, respectively, and FIGS. 25 (b) to 28 (b). These show the state which extracted the heat sink 67 from the USB memories 1H, 21H, 31H, and 51H to the external space, respectively.
Since these USB memories 1H, 21H, 31H, and 51H have the same heat dissipation structure as that of the sixth embodiment, the same effects as those of the sixth embodiment can be obtained.

In the sixth embodiment and the other embodiments, the configuration in which the heat radiating plate 67 is linearly moved and drawn outward is illustrated, but the heat radiating plate 67 may be rotationally moved and drawn outward. If the heat radiating plate 67 is pulled out of the electronic device, the pulling method is not limited.
In the above-described embodiment, the case where the plug portion is made of metal has been exemplified. However, the plug portion may be made of a material other than metal as long as the plug portion having a predetermined strength or the like can be maintained.

  In the above-described embodiment, the USB memory 1 is illustrated as an example of the universal serial bus device. However, if the device uses the USB standard, a wireless mouse receiver, a Bluetooth device receiver, It can be widely applied to devices other than USB memory, such as network card modules and digital cameras.

  While various embodiments of the present invention have been described above, the description is intended to be exemplary. And of course, many forms and implementation are possible within the scope of the present invention. Accordingly, the present invention includes various modifications and changes within the scope of the appended claims.

1, 21, 31, 41, 51, 61, 1H, 21H, 31H, 51H USB memory (universal serial bus device)
2 Printed circuit board (single circuit board)
2d, 22d, 32d Electronic component 2s, 2s1, 2s2, 2s3, 2s4 Connection terminal 3, 23, 33, 43, 53, 63 Plug part 3k1, 23k1, 33k1, 43k1, 53k1, 63k1 Opening 3m, 23m, 33m, 43m 53m, 63m Front plate (plate material)
4, 24, 44 Grip part 4o1, 24o1, 34o1, 44o1, 54o1 Lower center support rib (support rib)
4o2, 24o2, 34o2, 44o2, 54o2 Upper center support rib (support rib)
4s, 24s, 34s, 44s, 54s Surrounding support ribs (support ribs)
22 L-shaped flexible circuit board (single circuit board, circuit board formed by bending)
22 s, 22 s 1, 22 s 2, 22 s 3, 22 s 4 connection terminal 32 L-shaped large flexible circuit board (single circuit board, circuit board formed by bending)
32 s, 32 s 1, 32 s 2, 32 s 3, 32 s 4 connection terminal 34 grip part (grip part in which a circuit board is bent and accommodated)
42 U-shaped flexible circuit board (single circuit board, circuit board formed by bending, circuit board formed by folding back)
42d, 52d, 62d Electronic component (electronic component folded and mounted on the area of one of the opposing surfaces)
42s connection terminal 52 U-shaped large flexible circuit board (single circuit board, circuit board formed by bending, circuit board formed by folding back)
52C U-shaped large flexible circuit board folded part (circuit board folded part)
52 s, 52 s 1, 52 s 2, 52 s 3, 52 s 4 connection terminal 54 gripping part (griping part in which the circuit board is folded)
62 U-shaped flexible circuit board (single circuit board, circuit board formed by bending, circuit board formed by folding back)
67 Heat sink 68 Heat sink take-out part (take-out part)
68a Radiating fin P Notebook PC (electronic equipment)
Pk wall surface (outside of electronic equipment)
r Receptacle r2 Connection terminal (receptacle connected terminal)

Claims (12)

A universal serial bus device used by being attached to a receptacle of an electronic device and connected to the electronic device,
A universal serial bus device comprising a single circuit board on which a connection terminal connected to a connection terminal of the receptacle is mounted on one surface and an electronic component responsible for control is mounted on both surfaces. The universal serial bus device according to claim 1, wherein the circuit board is filled and fixed with resin in the universal serial bus device. A plug portion shaped to cover the connection terminal opened on the attachment side to the receptacle,
The universal material according to claim 1, wherein the plug portion is formed on the opening side with a plate material that covers a surface of the circuit board opposite to a surface on which the connection terminal is mounted. Serial bus device. The universal serial bus device according to any one of claims 1 to 3, wherein the circuit board is formed by bending. The universal serial bus device according to claim 4, wherein the circuit board is formed by being bent along an outer surface of the electronic device from a direction in which the circuit board is attached to the receptacle. It has a gripping part that is gripped when attaching to or removing from the receptacle,
The universal serial bus device according to claim 4, wherein a portion of the circuit board formed by bending from the direction of attachment to the receptacle is accommodated in the grip portion. The universal serial bus device according to any one of claims 1 to 3, wherein the circuit board is formed by being folded. The universal serial bus device according to claim 7, wherein the electronic component is mounted on a region of any one of the surfaces of the circuit board that are folded back and face each other. It has a gripping part that is gripped when attaching to or removing from the receptacle,
The universal serial bus device according to claim 7 or 8, wherein the folded portion formed by folding the circuit board is accommodated in the grip portion. It has a gripping part that is gripped when attaching to or removing from the receptacle,
The universal serial bus device according to any one of claims 1 to 9, wherein the circuit board is supported by a support rib integrally formed with the grip portion. The heat sink which can be pulled out from the accommodation state in the said universal serial bus apparatus in the state facing the said circuit board, and radiates the heat | fever which generate | occur | produces in the said electronic component is provided. The universal serial bus device according to claim 9. It includes a take-out portion that is gripped when the heat sink is pulled out or returned to the stored state and continuously provided on the heat sink,
The universal serial bus device according to claim 11, wherein the take-out unit is formed with a heat radiating fin.

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