JP2013000865A - Wire for wire saw - Google Patents

Wire for wire saw Download PDF

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JP2013000865A
JP2013000865A JP2011137160A JP2011137160A JP2013000865A JP 2013000865 A JP2013000865 A JP 2013000865A JP 2011137160 A JP2011137160 A JP 2011137160A JP 2011137160 A JP2011137160 A JP 2011137160A JP 2013000865 A JP2013000865 A JP 2013000865A
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wire
mass
saw
less
carbon
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Akito Hoshima
昭人 星間
Kenichi Shimauchi
謙一 島内
Yoshiro Fujino
善郎 藤野
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Sumitomo SEI Steel Wire Corp
Sumitomo Electric Tochigi Co Ltd
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Sumitomo SEI Steel Wire Corp
Sumitomo Electric Tochigi Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To reduce cost of wire for a wire saw while maintaining the strength, etc. thereof.SOLUTION: Wire for a wire saw having a wire diameter of ≤0.16 mm and a tensile strength of 3,300-3,800 MPa is obtained by applying patenting and wire drawing processes to a wire rod containing 0.68-0.75 mass% of C, 0.10-0.50 mass% of Si, 0.30-0.90 mass% of Mn, ≤0.025 mass% of P, ≤0.025 mass% of S, ≤0.2 mass% of Cu, and the remainder consisting of Fe and unavoidable impurities. The obtained wire contains less amount of carbon in comparison with conventional high-carbon wire, and so raw material cost can be suppressed. Since the wire contains less amount of carbon and is improved in processability, wire breakage in a wire drawing process is reduced to improve the yield, and a patenting process prior to finish drawing can be applied to the wire having a larger diameter and smaller length, thus allowing a processing cost to be reduced.

Description

本発明は、シリコンインゴット等の硬質材料を切断するのに好適な切断装置としてのワイヤソーに用いられるワイヤに関する。   The present invention relates to a wire used in a wire saw as a cutting device suitable for cutting a hard material such as a silicon ingot.

シリコンインゴットからシリコンウェハを切り出す作業など、硬質材料の切断作業に用いられる切断装置として、ワイヤソーが知られている。
ワイヤソーは、複数のロール間に多数のワイヤソー用ワイヤを巻き回し、そのロールの回転によりワイヤを高速で走行させ、その走行するワイヤに砥粒を供給しつつシリコンインゴットなどの被切断材料を押し付けることで、切断加工をおこなうしくみとなっている。
A wire saw is known as a cutting device used for cutting hard materials such as cutting silicon wafers from silicon ingots.
A wire saw winds a large number of wire saw wires between a plurality of rolls, causes the wire to travel at a high speed by rotating the roll, and presses a material to be cut such as a silicon ingot while supplying abrasive grains to the traveling wire. Therefore, it is a mechanism for cutting.

上述のように、走行するワイヤに被切断材料を押し付けて切断することから、被切断材料の削り代の大きさはワイヤの径の大きさに依存することになる。
そのため、ワイヤを細径化するほど、切断時の歩留まりが向上することになる。このことから、ワイヤ細径化の要請が存在する。
As described above, since the material to be cut is pressed against the traveling wire and cut, the size of the cutting allowance of the material to be cut depends on the size of the diameter of the wire.
Therefore, the yield at the time of cutting | disconnection improves, so that a wire is reduced in diameter. For this reason, there is a demand for wire diameter reduction.

また、ワイヤに高い張力を加えるほど、ワイヤの振動が抑えられて被切断材料の切断面に凹凸ができにくくなり、切断面の面精度が向上する。このことから、ワイヤ高張力化の要請も存在する。   Further, as the tension is applied to the wire, the vibration of the wire is suppressed and the cut surface of the material to be cut is less likely to be uneven, and the surface accuracy of the cut surface is improved. For this reason, there is a demand for higher wire tension.

その一方で、ワイヤを細径化するほどその強度が低下して断線の危険性が増す。そのうえに、ワイヤに高い張力を加えるとなると、さらに断線の危険性が増すことになる。   On the other hand, the thinner the wire, the lower its strength and the risk of breakage. Moreover, if a high tension is applied to the wire, the risk of disconnection further increases.

したがって従来は、特許文献1および2に開示されているように、ワイヤソー用ワイヤとして、細径化および高張力化に耐えうる高強度を有する、炭素含有量が0.80質量%以上の高炭素ワイヤを用いるのが一般的であった。   Therefore, conventionally, as disclosed in Patent Documents 1 and 2, as a wire saw wire, the carbon content is 0.80% by mass or more, having a high strength capable of withstanding a reduction in diameter and an increase in tension. It was common to use a wire.

特開2001−225257号公報JP 2001-225257 A 特開平7−136923号公報JP-A-7-136923

しかし、高炭素ワイヤの原材料となる高炭素線材は高価であるため、ワイヤソー用ワイヤの原材料コストが嵩む問題がある。   However, since the high carbon wire used as the raw material of the high carbon wire is expensive, there is a problem that the raw material cost of the wire for the wire saw increases.

また高炭素線材は加工性が悪いため、ワイヤへの最終伸線工程前に既に相当に細径化がなされていなければならないが、伸線工程前のパテンティング処理を相当程度細径化された線材におこなうとなると、その長さが大きいため処理コスト(製造コスト)も嵩むことになる。   In addition, since the high carbon wire has poor workability, it must already be made considerably thinner before the final wire drawing process, but the patenting process before the wire drawing process has been made much thinner. When it is applied to the wire, the processing cost (manufacturing cost) increases because of its large length.

さらに高炭素線材は加工性が悪いため、ワイヤへの伸線工程時に断線することが多く歩留まりが悪い。そのため、歩留まりの観点からも製造コストが嵩む問題がある。   Furthermore, since the high carbon wire has poor workability, it is often disconnected during the wire drawing process, resulting in poor yield. Therefore, there is a problem that the manufacturing cost increases from the viewpoint of yield.

そこで本発明の解決すべき課題は、ワイヤソー用ワイヤの強度等は維持しつつ、そのコストの低廉化を図ることである。   Therefore, the problem to be solved by the present invention is to reduce the cost while maintaining the strength of the wire saw wire.

上記した課題を解決するため、本発明のワイヤソー用ワイヤを、0.68〜0.75質量%のC(炭素)と、0.10〜0.50質量%のSi(ケイ素)と、0.30〜0.90質量%のMn(マンガン)と、0.025質量%以下のP(リン)と、0.025質量%以下のS(硫黄)と、0.2質量%以下のCu(銅)と、を含有し、残部がFe(鉄)および不可避不純物からなる線材をパテンティング処理および伸線処理することで得られるものとしたのである。
また本発明のワイヤソー用ワイヤを、線径が0.16mm以下であり、引張強さが3300〜3800MPaであるものとしたのである。
In order to solve the above-described problems, the wire for a wire saw of the present invention includes 0.68 to 0.75% by mass of C (carbon), 0.10 to 0.50% by mass of Si (silicon), and 0.0. 30 to 0.90 mass% Mn (manganese), 0.025 mass% or less P (phosphorus), 0.025 mass% or less S (sulfur), and 0.2 mass% or less Cu (copper) ), With the balance being Fe (iron) and inevitable impurities, which is obtained by patenting and wire drawing.
Further, the wire saw wire of the present invention has a wire diameter of 0.16 mm or less and a tensile strength of 3300 to 3800 MPa.

本発明のワイヤソー用ワイヤは、炭素含有量が従来の0.80質量%以上のワイヤに比べて少ないため、原材料コストの低減が実現できる。   Since the wire for wire saw of the present invention has less carbon content than the conventional wire having 0.80% by mass or more, the cost of raw materials can be reduced.

また、炭素含有量が少ないために加工性が向上しており、伸線工程前のパテンティング処理を従来よりも太径の状態、つまり長さの短い状態でおこなえるため、処理量を少なくでき、処理コストの低減も実現できる。   In addition, because the carbon content is low, the workability is improved, and since the patenting process before the wire drawing process can be performed in a larger diameter state, that is, in a shorter length state than before, the processing amount can be reduced, Reduction of processing cost can also be realized.

同様に加工性が向上しているため、伸線工程での断線が少なく、歩留まりが向上し、製造コストの低減も実現できる。   Similarly, since the workability is improved, there is little disconnection in the wire drawing process, the yield is improved, and the manufacturing cost can be reduced.

ワイヤソー用ワイヤの製造工程の概略図Schematic of manufacturing process for wire saw wire

図1を参照して、実施形態のワイヤソー用ワイヤの製造工程の概略を説明する。伸線加工により、線材から実施形態のワイヤソー用ワイヤを製造する。   With reference to FIG. 1, the outline of the manufacturing process of the wire for wire saws of embodiment is demonstrated. The wire saw wire according to the embodiment is manufactured from the wire by wire drawing.

まずS0で線径4.0〜6.0mmの線材を準備する。
この線材としては、0.68〜0.75質量%のCと、0.10〜0.50質量%のSiと、0.30〜0.90質量%のMnと、0.025質量%以下のPと、0.025質量%以下のSと、0.2質量%以下のCuと、を含有し、100質量%中のその残部がFeおよび不可避不純物からなるものを用いる。
従来のように、Cが0.80質量%以上含まれる線材からワイヤを製造する場合に比べて、炭素含有量が少ないため原材料コストが低廉である。
なお、この線材はあらかじめ酸洗等されることで適宜スケールが除去されているものとする。
First, a wire having a wire diameter of 4.0 to 6.0 mm is prepared at S 0 .
As this wire, 0.68 to 0.75 mass% C, 0.10 to 0.50 mass% Si, 0.30 to 0.90 mass% Mn, and 0.025 mass% or less P, 0.025% by mass or less of S, and 0.2% by mass or less of Cu, and the remaining part of 100% by mass of Fe and inevitable impurities are used.
Compared with the case where a wire is manufactured from a wire containing 0.80% by mass or more of C as in the conventional case, the raw material cost is low because the carbon content is small.
In addition, the scale shall be removed suitably by pickling this wire beforehand.

ここでCは、0.68質量%未満であるとワイヤが強度不足となり、0.75質量%を超えるとワイヤの靭性が低下しまた材料コストが嵩むため、以上の割合に限定している。ワイヤの強度と靭性の均衡上、0.68〜0.75質量%であればより好ましい。
また鋼材の溶解精錬時に脱酸剤として使用されるSiは、フェライト中に固溶して鋼の強度を向上させる効果があることから0.10質量%未満であるとワイヤが強度不足となり、0.50質量%を超えると靭性が低下するため、以上の割合に限定している。
同様に溶解精錬時の脱酸剤として使用されるMnは、0.30質量%未満であると脱酸剤に最低限必要な添加量を下回り、0.90質量%を超えるとパテンティング時にマルテンサイトが生成しやすくなり伸線時の断線が増えるため、以上の割合に限定している。
オ−ステナイト粒界、パ−ライトブロック粒界に不純物として偏析するPおよびSは、0.025質量%を超えるとワイヤの靭性が低下するため、以上の割合に限定している。
Here, if C is less than 0.68% by mass, the strength of the wire becomes insufficient, and if it exceeds 0.75% by mass, the toughness of the wire is lowered and the material cost increases, so the ratio is limited to the above. From the balance of strength and toughness of the wire, 0.68 to 0.75% by mass is more preferable.
In addition, Si used as a deoxidizer during melting and refining of steel has the effect of improving the strength of the steel by solid solution in ferrite, so if it is less than 0.10% by mass, the wire becomes insufficient in strength. When it exceeds .50 mass%, the toughness decreases, so the ratio is limited to the above.
Similarly, if Mn used as a deoxidizer during melting and refining is less than 0.30% by mass, it is less than the minimum amount required for the deoxidizer, and if it exceeds 0.90% by mass, Since the site is easy to generate and the disconnection at the time of wire drawing increases, it is limited to the above ratio.
P and S segregated as impurities at the austenite grain boundary and the pearlite block grain boundary are limited to the above ratio because the toughness of the wire is lowered when it exceeds 0.025 mass%.

つぎにS1で、この線材をたとえば乾式伸線機により、線径0.5〜1.5mmに一次伸線する。
さらにS2で、この伸線された線材を加熱および急速冷却してパテンティング処理をおこなう。
またS3で、このパテンティング処理された線材に、電気めっきによりCu(銅)、Zn(亜鉛)の順にめっき処理をしたうえで、拡散流動層炉で拡散処理することによりブラス(黄銅)めっきを施す。
線材の炭素含有量が少なく加工性が高いため、最終伸線前の線材の線径が0.5〜1.5mmと従来よりも太径でも構わない。したがってパテンティング処理およびめっき処理をする際の線材の長さを従来よりも短くすることができ、処理量を少なくすることができる。
Next, in S 1, the the wire eg dry wire drawing machine, to TEMPORARY drawing the wire diameter 0.5 to 1.5 mm.
Further in S 2, it performs patenting treatment by heating and rapidly cooling the drawn and wire rod.
In S 3 , the patented wire is plated in the order of Cu (copper) and Zn (zinc) by electroplating, and then subjected to diffusion treatment in a diffusion fluidized bed furnace to thereby perform brass (brass) plating. Apply.
Since the carbon content of the wire is small and the processability is high, the wire diameter of the wire before final drawing may be 0.5 to 1.5 mm, which is larger than the conventional wire diameter. Therefore, the length of the wire at the time of the patenting process and the plating process can be made shorter than before, and the processing amount can be reduced.

最後にS4で、このブラスめっきが施された線材をたとえば湿式伸線機により、線径0.16mm以下、好ましくは0.12〜0.15mmに仕上げ伸線(二次伸線)して、ワイヤソー用ワイヤが完成する。
線材の炭素含有量が少なく加工性が高いため、伸線工程でも断線がすくなく、歩留まりが向上している。
Finally, in S 4 , the brass-plated wire rod is subjected to finish drawing (secondary drawing) to a wire diameter of 0.16 mm or less, preferably 0.12 to 0.15 mm, for example, by a wet wire drawing machine. A wire saw wire is completed.
Since the carbon content of the wire is low and the workability is high, the wire is not broken even in the wire drawing process, and the yield is improved.

ここで、仕上げ伸線加工における線材の減面率を調整することで、加工硬化の度合い等を調整可能である。
これにより、できあがったワイヤソー用ワイヤの引張強さが3300〜3800MPaとなり、その捻回試験における捻回値(ワイヤの両端をチャックでつかみ捻回させたときのワイヤが破断するまでの回数。ここでチャック間距離は、ワイヤの線径をDとしたとき100Dとする。)が25回以上となり、その伸びが2.0%以上になるように調整しておく。
Here, the degree of work hardening or the like can be adjusted by adjusting the surface area reduction rate of the wire in the finish wire drawing.
As a result, the tensile strength of the finished wire saw wire becomes 3300 to 3800 MPa, and the twist value in the twist test (the number of times until the wire breaks when both ends of the wire are gripped and twisted. The distance between chucks is adjusted so that the wire diameter is 100 D when the wire diameter is D.) is 25 times or more and the elongation is 2.0% or more.

引張強さは、3300MPa未満であると上述した被切断材料の面精度向上の要請からワイヤに高い張力を負荷する場合にその張力に耐えられず、3800MPaを超えるとワイヤの靭性が低下して断線が生じやすくなるため、以上の範囲に限定している。
また捻回値は、25回未満であるとワイヤソーでの被切断材料の切断時にワイヤに生じるねじれ方向の張力に耐えられず断線が生じやすくなるため、以上の範囲に限定している。
さらに伸びは、2.0%未満であると、ワイヤソーでの切断時にはある程度の張力変動があると考えられ、その変動に耐えうるだけの靭性が確保できないため、以上の範囲に限定している。
If the tensile strength is less than 3300 MPa, a high tension is applied to the wire due to the above-described demand for improving the surface accuracy of the material to be cut. If the tensile strength exceeds 3800 MPa, the toughness of the wire is reduced and the wire is broken. This is limited to the above range.
Further, if the twist value is less than 25 times, it is difficult to withstand the tension in the torsional direction generated in the wire when the material to be cut with a wire saw is cut, and disconnection is likely to occur. Therefore, the twist value is limited to the above range.
Further, if the elongation is less than 2.0%, it is considered that there is a certain amount of tension fluctuation at the time of cutting with a wire saw, and the toughness that can withstand the fluctuation cannot be secured. Therefore, the elongation is limited to the above range.

以下、本発明の実施例および比較例を挙げて、発明の内容を一層明確なものとする。
まず表1に示す組成を有する線径5.5mmの線材A〜Eを準備した。表中の各数値は、質量%を示す。また表1に示された以外の組成は、鉄と不可避不純物からなるものとする。
Hereinafter, examples of the present invention and comparative examples will be given to further clarify the contents of the invention.
First, wire rods A to E having a composition shown in Table 1 and having a wire diameter of 5.5 mm were prepared. Each numerical value in the table indicates mass%. Compositions other than those shown in Table 1 are composed of iron and inevitable impurities.

Figure 2013000865
Figure 2013000865

つぎに実施形態で述べたように、線材A〜Eを、一次伸線加工、パテンティング処理、ブラスめっき処理、仕上げ伸線加工(二次伸線加工)して、線径0.15mmの実施例1〜6、比較例1〜5のワイヤを作製した。
ここで、最終伸線加工の減面率を調整し、まためっき線径を変化させることで、真歪等を調整した。
結果を表2に示す。表中の断線率は、比較例3を基準とした指数表示で表している。
表2のように、実施例のワイヤが比較例のワイヤよりも断線が少ないことがわかった。
Next, as described in the embodiment, the wire rods A to E are subjected to primary wire drawing, patenting treatment, brass plating treatment, finish wire drawing (secondary wire drawing), and a wire diameter of 0.15 mm. Wires of Examples 1 to 6 and Comparative Examples 1 to 5 were produced.
Here, the true strain and the like were adjusted by adjusting the area reduction rate of the final wire drawing and changing the plating wire diameter.
The results are shown in Table 2. The disconnection rate in the table is represented by an index based on Comparative Example 3.
As shown in Table 2, it was found that the wire of the example had less disconnection than the wire of the comparative example.

Figure 2013000865
Figure 2013000865

今回開示された実施形態と実施例はすべての点で例示であって制限的なものではないと考慮されるべきである。本発明の範囲は以上の実施形態と実施例ではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての修正と変形を含むものであることが意図される。   The embodiments and examples disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the embodiments and examples described above, and is intended to include any modifications and variations within the scope and meaning equivalent to the terms of the claims.

Claims (3)

0.68〜0.75質量%のCと、0.10〜0.50質量%のSiと、0.30〜0.90質量%のMnと、0.025質量%以下のPと、0.025質量%以下のSと、0.2質量%以下のCuと、を含有し、残部がFeおよび不可避不純物からなる線材をパテンティング処理および伸線処理することで得られる、
線径が0.16mm以下であり、
引張強さが3300〜3800MPaであるワイヤソー用ワイヤ。
0.68 to 0.75 mass% C, 0.10 to 0.50 mass% Si, 0.30 to 0.90 mass% Mn, 0.025 mass% or less P, 0 0.025 mass% or less of S and 0.2 mass% or less of Cu, and the balance is obtained by patenting and wire drawing of a wire consisting of Fe and inevitable impurities,
The wire diameter is 0.16 mm or less,
A wire saw wire having a tensile strength of 3300 to 3800 MPa.
捻回試験における捻回値が25回以上である請求項1に記載のワイヤソー用ワイヤ。   The wire for a wire saw according to claim 1, wherein a twist value in the twist test is 25 times or more. 伸びが2.0%以上である請求項1または2に記載のワイヤソー用ワイヤ。   The wire for a wire saw according to claim 1 or 2, wherein the elongation is 2.0% or more.
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