JP2012245571A - Device and method for dividing permanent magnet base material - Google Patents

Device and method for dividing permanent magnet base material Download PDF

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JP2012245571A
JP2012245571A JP2011117346A JP2011117346A JP2012245571A JP 2012245571 A JP2012245571 A JP 2012245571A JP 2011117346 A JP2011117346 A JP 2011117346A JP 2011117346 A JP2011117346 A JP 2011117346A JP 2012245571 A JP2012245571 A JP 2012245571A
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permanent magnet
base material
magnet base
cleaving
force
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JP5760692B2 (en
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Yasushi Nishikuma
靖 西隈
Tetsuyoshi Fukaya
哲義 深谷
Katsuhiko Takebe
勝彦 建部
Shingo Yukibuki
晋吾 雪吹
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Toyota Motor Corp
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Toyota Motor Corp
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Abstract

PROBLEM TO BE SOLVED: To divide a permanent magnet base material by a small loading.SOLUTION: A device 1 for dividing a permanent magnet base material is configured to fix the permanent magnet base material 40 by a movable retainer 2 and a static retainer 3, rotate the movable retainer 2 about a movable part rotation axis 22, and divide the permanent magnet base material 40 to form division surfaces. The movable part rotation axis 22 is offset in a direction perpendicular to the division surfaces so as to be positioned on a side of the static retainer 3. Thus, the permanent magnet base material is divided by a small loading.

Description

本発明は、永久磁石基材を可動側保持部及び固定側保持部により固定し、前記可動側保持部を可動部回転軸を中心に回転させることにより前記永久磁石基材を割断し割断面を成形する永久磁石基材割断装置、及び前記永久磁石基材割断装置を用いた永久磁石基材割断方法に関する。   In the present invention, the permanent magnet base material is fixed by the movable side holding part and the fixed side holding part, and the permanent magnet base material is cleaved by rotating the movable side holding part around the rotation axis of the movable part. The present invention relates to a permanent magnet base material cleaving apparatus to be molded and a permanent magnet base material cleaving method using the permanent magnet base material cleaving apparatus.

従来、この種の技術として図9に示す永久磁石基材の永久磁石割断装置100が用いられてきた。図9に示す永久磁石割断装置100は、永久磁石基材を割断するための装置である。永久磁石割断装置100は、可動側保持部101と固定側保持部102を有する。可動側保持部101内と固定側保持部102内には、永久磁石基材保持部103が形成されており、永久磁石基材保持部103には焼結部材である永久磁石基材200が固定保持されている。可動側保持部101は可動部回転軸104を中心に矢印Y方向へ回転可動する。それにより、永久磁石基材200に対しては、矢印Z方向に引張力が発生し、可動側保持部101に保持された永久磁石基材200を割断することができる。   Conventionally, a permanent magnet cleaving apparatus 100 for a permanent magnet base material shown in FIG. 9 has been used as this type of technology. A permanent magnet cleaving apparatus 100 shown in FIG. 9 is an apparatus for cleaving a permanent magnet base material. The permanent magnet cleaving device 100 includes a movable side holding part 101 and a fixed side holding part 102. A permanent magnet base material holding part 103 is formed in the movable side holding part 101 and the fixed side holding part 102, and the permanent magnet base material 200 as a sintered member is fixed to the permanent magnet base material holding part 103. Is retained. The movable side holding part 101 is rotatable in the direction of arrow Y about the movable part rotation shaft 104. Thereby, with respect to the permanent magnet base material 200, a tensile force is generated in the arrow Z direction, and the permanent magnet base material 200 held by the movable side holding portion 101 can be cleaved.

例えば、特許文献1には、上記した従来の割断方法が記載されている。   For example, Patent Document 1 describes the conventional cleaving method described above.

特開2006−137170号公報JP 2006-137170 A

しかしながら、従来技術には、以下の問題があった。すなわち、引っ張り強度が大きい材料を永久磁石基材200とする場合には、矢印Z方向の引張力だけで割断しようとすると大きな力が必要となる。矢印Z方向の引張力が大きくなると、永久磁石基材200が滑って狙った位置以外で割れる問題、割れ部の形状が悪化する問題、滑りにより永久磁石基材表面に傷つきが発生する問題など永久磁石基材200の割断後の永久磁石の品質が悪化するため問題となる。
また、永久磁石基材200が滑らないようにする保持固定をするため、図9中上方向から掛かる磁石保持力Xを大きくすることも考えられる。しかし、保持固定をするための磁石保持力Xを大きくすると磁石保持力Xにより永久磁石基材200が圧壊してしまうため、磁石保持力Xを大きくすることはできないため問題となる。
However, the prior art has the following problems. That is, when the material having a high tensile strength is used as the permanent magnet base material 200, a large force is required if the material is to be cleaved only by the tensile force in the arrow Z direction. When the tensile force in the direction of arrow Z increases, the permanent magnet base material 200 slips and breaks at other than the target position, the crack shape deteriorates, and the permanent magnet base material is damaged due to slipping. Since the quality of the permanent magnet after cleaving of the magnet base material 200 is deteriorated, it becomes a problem.
It is also conceivable to increase the magnet holding force X applied from above in FIG. 9 in order to hold and fix the permanent magnet base material 200 so as not to slip. However, if the magnet holding force X for holding and fixing is increased, the permanent magnet base material 200 is crushed by the magnet holding force X, so that the magnet holding force X cannot be increased, which is a problem.

そこで、本発明は、上記問題点を解決するためになされたものであり、その目的は永久磁石基材に対し引張力に加え曲げ力を付与することで小さな荷重で永久磁石基材を割断できる永久磁石基材割断装置、及び永久磁石基材割断方法を提供することを目的とする。   Therefore, the present invention has been made to solve the above-described problems, and the purpose thereof is to cleave the permanent magnet base material with a small load by applying a bending force in addition to a tensile force to the permanent magnet base material. An object of the present invention is to provide a permanent magnet base material cleaving apparatus and a permanent magnet base material cleaving method.

上記目的を達成するために、本発明の一態様における永久磁石基材割断装置、及び永久磁石基材割断方法は、以下の構成を有する。
(1)永久磁石基材を可動側保持部及び固定側保持部により固定し、前記可動側保持部を可動部回転軸を中心に回転させることにより前記永久磁石基材を割断し割断面を成形する永久磁石基材割断装置において、前記可動部回転軸を前記割断面と直角方向にオフセットさせ、前記固定側保持部側に位置させること、を特徴とする。
In order to achieve the above object, a permanent magnet base material cleaving apparatus and a permanent magnet base material cleaving method in one embodiment of the present invention have the following configurations.
(1) A permanent magnet base material is fixed by a movable side holding part and a fixed side holding part, and the permanent magnet base material is cleaved by forming the split section by rotating the movable side holding part about a movable part rotation axis. In the permanent magnet base material cleaving apparatus, the movable part rotating shaft is offset in a direction perpendicular to the split surface and is positioned on the fixed side holding part side.

(2)(1)に記載する永久磁石基材割断装置を用いた永久磁石基材割断方法であって、前記可動部回転軸を前記割断面と直角方向にオフセットさせ、前記固定側保持部側に位置させること、を特徴とする。 (2) A permanent magnet substrate cleaving method using the permanent magnet substrate cleaving device described in (1), wherein the movable part rotating shaft is offset in a direction perpendicular to the split section, and the fixed side holding part side It is characterized by being located in.

上記永久磁石基材割断装置の作用及び効果について説明する。
(1)永久磁石基材を可動側保持部及び固定側保持部により固定し、可動側保持部を可動部回転軸を中心に回転させることにより永久磁石基材を割断し割断面を成形する永久磁石基材割断装置において、可動部回転軸を割断面と直角方向にオフセットさせ、固定側保持部側に位置させることにより、小さな荷重で永久磁石基材を割断できる。
その理由は、可動部回転軸を割断予定面と直角方向にオフセットさせ、固定側保持部側に位置させることにより、割断予定面に対して図1の矢印Fで示す方向に引張力と曲げ力の合力が発生するためである。図1に示す矢印Fで示す引張力と曲げ力の合力は、図9に示す従来技術に係る矢印Zで示す引張力と比較して可動部移動方向である矢印Yに近く、永久磁石基材に対して下斜め方向に発生する。すなわち、割断予定面に対して矢印Ftで示す引張力のほかに曲げの方向への矢印Fbで示す曲げ力が加わることにより、小さな荷重により割断できるためである。また、小さな荷重で割断可能なことにより、保持固定時のズレによる割断品質の悪化の防止や、ズレ防止を狙った磁石保持力の増大に起因する永久磁石基材の圧壊を防止することができる。
The operation and effect of the permanent magnet substrate cleaving device will be described.
(1) A permanent magnet base material is fixed by a movable side holding part and a fixed side holding part, and the permanent magnet base material is cleaved by rotating the movable side holding part about the movable part rotation axis to form a cut section. In the magnet base material cleaving apparatus, the permanent magnet base material can be cleaved with a small load by offsetting the rotation axis of the movable part in the direction perpendicular to the fractured surface and positioning it on the fixed side holding part side.
The reason is that the tensile force and the bending force in the direction indicated by arrow F in FIG. This is because the resultant force is generated. The resultant force of the tensile force and the bending force indicated by the arrow F shown in FIG. 1 is close to the arrow Y that is the moving part moving direction as compared with the tensile force indicated by the arrow Z according to the prior art shown in FIG. Occurs in a downward diagonal direction. That is, it is possible to cleave with a small load by applying a bending force indicated by an arrow Fb in the bending direction to the surface to be cleaved in addition to a tensile force indicated by an arrow Ft. Moreover, by being able to be cleaved with a small load, it is possible to prevent degradation of cleaving quality due to deviation at the time of holding and fixing, and to prevent the permanent magnet base material from being collapsed due to an increase in magnet holding force aimed at preventing deviation. .

(2)上記永久磁石基材割断装置を用いた永久磁石基材割断方法であって、可動部回転軸を前記割断面と直角方向にオフセットさせ、前記固定側保持部側に位置させることにより、小さな荷重で永久磁石基材を割断できる。
その理由は、可動部回転軸を割断予定面と直角方向にオフセットさせ、固定側保持部側に位置させることにより、割断予定面に対して図1の矢印Fで示す方向に引張力と曲げ力の合力が発生するためである。図1に示す矢印Fで示す引張力と曲げ力の合力は、図9に示す従来技術に係る矢印Zで示す引張力と比較して可動部移動方向である矢印Yに近く、永久磁石基材に対して下斜め方向に発生する。すなわち、割断予定面に対して矢印Ftで示す引張力のほかに曲げの方向への矢印Fbで示す曲げ力が加わることにより、小さな荷重により割断できるためである。また、小さな荷重で割断可能なことにより、保持固定時のズレによる割断品質の悪化の防止や、ズレ防止を狙った磁石保持力の増大に起因する永久磁石基材の圧壊を防止することができる。
また、動部回転軸を割断面と直角方向にオフセットさせるそのオフセット量は、永久磁石基材が滑らない必要面圧を有し、かつ、磁石圧壊強度を超えない範囲とすることにより、永久磁石が滑り狙った位置以外で割れる問題及び磁石保持力が大きいことによる永久磁石の圧壊の問題を解決することができる。
(2) A permanent magnet substrate cleaving method using the permanent magnet substrate cleaving apparatus, wherein the movable part rotating shaft is offset in a direction perpendicular to the split section, and is positioned on the fixed side holding part side, The permanent magnet substrate can be cleaved with a small load.
The reason is that the tensile force and the bending force in the direction indicated by arrow F in FIG. This is because the resultant force is generated. The resultant force of the tensile force and the bending force indicated by the arrow F shown in FIG. 1 is close to the arrow Y that is the moving part moving direction as compared with the tensile force indicated by the arrow Z according to the prior art shown in FIG. Occurs in a downward diagonal direction. That is, it is possible to cleave with a small load by applying a bending force indicated by an arrow Fb in the bending direction to the surface to be cleaved in addition to a tensile force indicated by an arrow Ft. Moreover, by being able to be cleaved with a small load, it is possible to prevent degradation of cleaving quality due to deviation at the time of holding and fixing, and to prevent the permanent magnet base material from being collapsed due to an increase in magnet holding force aimed at preventing deviation. .
In addition, the offset amount for offsetting the moving part rotation axis in the direction perpendicular to the fractured section has a necessary surface pressure that does not cause the permanent magnet base material to slip, and does not exceed the magnet crushing strength. It is possible to solve the problem of cracking at a position other than the position where the slid is aimed and the problem of crushing the permanent magnet due to the large magnet holding force.

本発明の本実施例1に係る永久磁石基材の割断装置の概念断面図である。1 is a conceptual cross-sectional view of a cleaving device for a permanent magnet substrate according to a first embodiment of the present invention. 本発明の本実施例1に係る永久磁石基材の割断装置の断面図である。It is sectional drawing of the cleaving apparatus of the permanent magnet base material which concerns on the present Example 1 of this invention. 本発明の本実施例1に係る引張力の応力分布図である。It is a stress distribution map of tensile force concerning this example 1 of the present invention. 本発明の本実施例1に係る曲げ力の応力分布図である。It is a stress distribution map of the bending force which concerns on the present Example 1 of this invention. 本発明の本実施例1に係る引張力と曲げ力の合力の応力分布図である。It is a stress distribution map of the resultant force of the tensile force and the bending force according to the first embodiment of the present invention. 本発明の本実施例1に係るオフセット量と割断に必要な磁石作用力の関係を示した図である。It is the figure which showed the relationship between the offset amount which concerns on the present Example 1 of this invention, and the magnet action force required for cleaving. 本発明の本実施例1に係るオフセット量と保持部で滑らない必要面圧の関係を示した図である。It is the figure which showed the relationship between the offset amount which concerns on the present Example 1 of this invention, and the required surface pressure which does not slip by a holding | maintenance part. 本発明の本実施例2に係る永久磁石基材割断装置の概念図である。It is a conceptual diagram of the permanent magnet base material cleaving apparatus which concerns on the present Example 2 of this invention. 従来技術に係る永久磁石基材の割断装置の概念図である。It is a conceptual diagram of the cleaving apparatus of the permanent magnet base material which concerns on a prior art.

次に、本発明に係る永久磁石基材割断装置及び永久磁石基材割断方法の一実施の形態について図面を参照して説明する。   Next, an embodiment of a permanent magnet base material cleaving apparatus and a permanent magnet base material cleaving method according to the present invention will be described with reference to the drawings.

(第1実施形態)
<割断装置の全体構成>
図1には、永久磁石基材割断装置1の概念断面図を示す。図2に、永久磁石基材割断装置1の断面図を示す。
図1及び図2においては、本発明の本質部分である永久磁石基材40を割断する部分以外の部分である例えば駆動手段等については省略する。なお、本実施形態において駆動手段等に関しては省略したが、駆動手段等に関しては従来技術と変わらない構成及び作用効果を有する。
(First embodiment)
<Overall configuration of cleaving device>
In FIG. 1, the conceptual sectional drawing of the permanent-magnet-base material cutting apparatus 1 is shown. FIG. 2 is a cross-sectional view of the permanent magnet base material cleaving apparatus 1.
In FIG.1 and FIG.2, it is abbreviate | omitting about parts other than the part which cleaves the permanent magnet base material 40 which is an essential part of this invention, such as a drive means. In this embodiment, the driving means and the like are omitted, but the driving means and the like have the same configuration and operational effects as the conventional technology.

図1に示す永久磁石基材40は、割断予定面40Aで割断されることにより、割断面41Aを有する永久磁石41となる。本実施形態においては、永久磁石基材40は約3mmの厚みを有し、幅が28mmであり、割断することにより、2つの幅14mmの永久磁石41を成形する。
割断予定面40Aのうち、永久磁石基材40の外周側(固定ネジ11によって固定される側)には、永久磁石基材40に応力が掛かると割断予定面40Aから割断できるように切欠部401Aが形成されている。切欠部401Aは、永久磁石基材40に対してあらかじめレーザ加工等により成形されている(切欠部401Aは、小さな凹部であるため図1中には現れない)。
なお、本実施形態においては永久磁石として記載しているものは、ロータに挿入後強い磁界を与えられて永久磁石となるものである。本実施形態ではロータに挿入せず、強い磁界が与えられていないが永久磁石として記載している。
The permanent magnet base material 40 shown in FIG. 1 becomes a permanent magnet 41 having a fractured surface 41A by being cleaved by a cleaved planned surface 40A. In the present embodiment, the permanent magnet base material 40 has a thickness of about 3 mm, a width of 28 mm, and the two permanent magnets 41 having a width of 14 mm are formed by cleaving.
Of the planned cutting surface 40A, the outer peripheral side of the permanent magnet base material 40 (the side fixed by the fixing screw 11) has a notch 401A so that it can be cut from the planned cutting surface 40A when stress is applied to the permanent magnet base material 40. Is formed. The notch 401A is preliminarily formed by laser machining or the like on the permanent magnet base material 40 (the notch 401A is a small recess and does not appear in FIG. 1).
In the present embodiment, what is described as a permanent magnet is a permanent magnet that is given a strong magnetic field after being inserted into the rotor. In this embodiment, it is not inserted into the rotor and a strong magnetic field is not applied, but it is described as a permanent magnet.

図2に示すように永久磁石基材割断装置1は、永久磁石基材40を割断し、割断された永久磁石41に成形するための装置である。永久磁石基材割断装置1は、可動側保持部2、固定側保持部3等により構成されている。   As shown in FIG. 2, the permanent magnet base material cleaving device 1 is a device for cleaving the permanent magnet base material 40 and forming it into a cleaved permanent magnet 41. The permanent magnet base material cleaving device 1 includes a movable side holding part 2, a fixed side holding part 3, and the like.

固定側保持部3は、永久磁石基材40を保持固定するためのものである。固定側保持部3は固定された固定部6に固定されている。固定側保持部3は固定部6に固定されていることにより、永久磁石基材40を固定することができる。固定側保持部3には、可動側保持部2に対して割断力を付与するための割断力付与ロッド5が形成されている。   The fixed side holding part 3 is for holding and fixing the permanent magnet base material 40. The fixed side holding part 3 is fixed to a fixed part 6 that is fixed. The fixed-side holding part 3 can fix the permanent magnet base material 40 by being fixed to the fixing part 6. A cleaving force application rod 5 for applying a cleaving force to the movable side holding unit 2 is formed in the fixed side holding unit 3.

可動側保持部2は、第1に永久磁石基材40を保持固定し、第2に可動することで永久磁石基材40を割断するものである。可動側保持部2は可動回転部21が形成されており、可動回転部21の可動部回転軸22を中心に回転する。可動回転部21は、可動側保持部2の下面2Aに突出する形で形成されている。可動回転部21の可動部回転軸22は、永久磁石基材40の割断面となる予定の割断予定面40A(割断面41Aと同じ。明細書中において同じ。)と直角方向にオフセットされ、かつ、固定側保持部3側に位置する。   The movable-side holding part 2 is configured to first hold and fix the permanent magnet base material 40 and secondly move the permanent magnet base material 40 to break the permanent magnet base material 40. The movable side holding part 2 is formed with a movable rotating part 21 and rotates around the movable part rotating shaft 22 of the movable rotating part 21. The movable rotating part 21 is formed so as to protrude from the lower surface 2 </ b> A of the movable side holding part 2. The movable part rotating shaft 22 of the movable rotating part 21 is offset in a direction perpendicular to the planned cutting surface 40A (same as the cut section 41A, the same in the specification) that is to be the cut section of the permanent magnet base 40, and It is located on the fixed holding part 3 side.

本実施形態における可動回転部21のオフセット量は、永久磁石基材40が滑らない必要面圧を有し、かつ、磁石圧壊強度を超えない範囲により決定する。本実施形態においては、図7に示す保持部で滑らない必要面圧を有し、かつ磁石圧壊強度を超えない範囲により決定する。図7に示す圧壊面圧Tは、永久磁石基材を保持固定するため面圧をかけた場合に圧壊面圧Tを超える値となると、永久磁石基材に圧壊が生じる恐れがある値である。本実施形態においては、圧壊面圧Tは、約940MPaであり、永久磁石基材40においては約940MPaの面圧をかけたとしても圧壊が生じない値である。本実施形態において圧壊面圧Tは、約940MPaであるが、圧壊面圧Tは、磁石材料や磁石材料を圧縮する際の圧縮強度等の条件によって大きく異なる。ただし、圧壊面圧が永久磁石基材を保持固定するため面圧をかけた場合に圧壊しない値であることは、変わりはない。   The offset amount of the movable rotating portion 21 in the present embodiment is determined by a range in which the permanent magnet base material 40 has a necessary surface pressure that does not slip and does not exceed the magnet crushing strength. In this embodiment, it determines with the range which has required surface pressure which does not slip with the holding | maintenance part shown in FIG. 7, and does not exceed magnet crushing strength. The crushing surface pressure T shown in FIG. 7 is a value that may cause crushing in the permanent magnet base material when the surface pressure T is exceeded in order to hold and fix the permanent magnet base material and exceed the crushing surface pressure T. . In this embodiment, the crushing surface pressure T is about 940 MPa, and even if a surface pressure of about 940 MPa is applied to the permanent magnet base material 40, the crushing surface pressure T is a value that does not cause crushing. In this embodiment, the crushing surface pressure T is about 940 MPa, but the crushing surface pressure T varies greatly depending on conditions such as the compression strength when compressing the magnet material and the magnet material. However, the crushing surface pressure is a value that does not crush when a surface pressure is applied to hold and fix the permanent magnet base material.

図7に示す実線Sは保持部で滑らない面圧とオフセット量の関係を示したものである。本実施形態においてオフセット量は、磁石圧壊強度を示す圧壊面圧Tの範囲内であり、かつ保持部で滑らない必要面圧を有する約940MPa以下とする。圧壊面圧Tの約940MPa以下であるのは実線SではS1以上のオフセット量となる。すなわち、本実施形態においてはオフセット量を3mm以上とすることにより、永久磁石基材40が滑らない必要面圧を有し、かつ、磁石圧壊強度を超えない範囲とすることができる。
なお、本実施形態においては、オフセット量を3mm以上としたが、オフセット量は永久磁石基材40の厚み等及び永久磁石基材割断装置1の大きさ等により変更される。したがって、オフセット量は、永久磁石基材の厚み等及び割断装置の大きさ等により影響を受けない永久磁石基材が滑らない必要面圧を有し、かつ、磁石圧壊強度を超えない範囲により決定することが好ましい。
The solid line S shown in FIG. 7 shows the relationship between the surface pressure that does not slip at the holding portion and the offset amount. In the present embodiment, the offset amount is set to about 940 MPa or less having a necessary surface pressure that is within the range of the crushing surface pressure T indicating the magnet crushing strength and does not slip at the holding portion. In the solid line S, the crushing surface pressure T is about 940 MPa or less, which is an offset amount of S1 or more. That is, in this embodiment, by setting the offset amount to 3 mm or more, the permanent magnet base material 40 can have a necessary surface pressure that does not slip and can be within a range that does not exceed the magnet crushing strength.
In the present embodiment, the offset amount is set to 3 mm or more, but the offset amount is changed depending on the thickness of the permanent magnet base material 40 and the size of the permanent magnet base material cleaving apparatus 1. Therefore, the amount of offset is determined by the range in which the permanent magnet base material that is not affected by the thickness of the permanent magnet base material and the size of the cleaving device has a necessary surface pressure that does not slip and does not exceed the magnet crushing strength. It is preferable to do.

図2に示すように、固定側保持部3及び可動側保持部2には、永久磁石基材40を固定するための磁石固定部10が形成されている。磁石固定部10は、可動側保持部2が可動することにより分割される。固定側保持部3及び可動側保持部2のうち、磁石固定部10に配置した永久磁石基材40に対して上部から押圧する固定ネジ11A及び11Bが各々形成されている。固定ネジ11Aは可動側保持部2に形成され、固定ネジ11Bは固定側保持部3に固定されている。そのため、磁石固定部10が分割された際に固定ネジ11A及び12Bがそれぞれ可動側保持部2及び固定側保持部3に存在することとなる。
なお、本実施形態においては固定ネジ11としたが、固定できるものであればその他のものを応用することも可能である。
As shown in FIG. 2, the fixed side holding part 3 and the movable side holding part 2 are formed with a magnet fixing part 10 for fixing the permanent magnet base material 40. The magnet fixing part 10 is divided by moving the movable side holding part 2. Of the fixed side holding part 3 and the movable side holding part 2, fixing screws 11 </ b> A and 11 </ b> B are formed to press the permanent magnet base material 40 disposed in the magnet fixing part 10 from above. The fixing screw 11 </ b> A is formed in the movable side holding portion 2, and the fixing screw 11 </ b> B is fixed to the fixed side holding portion 3. Therefore, when the magnet fixing part 10 is divided, the fixing screws 11A and 12B exist in the movable side holding part 2 and the fixed side holding part 3, respectively.
Although the fixing screw 11 is used in the present embodiment, other screws can be applied as long as they can be fixed.

<割断装置の作用効果>
第1に、永久磁石基材40を磁石固定部10に配置する。続いて固定ネジ11を用いて永久磁石基材40を保持固定する。本実施形態においては、固定ネジ11を回転させることにより永久磁石基材40に対して図1に示す磁石保持力Wが発生することで、磁石固定部10に固定することができる。
<Operational effect of cleaving device>
First, the permanent magnet base material 40 is disposed on the magnet fixing portion 10. Subsequently, the permanent magnet base material 40 is held and fixed using the fixing screw 11. In the present embodiment, the magnet holding force W shown in FIG. 1 is generated with respect to the permanent magnet base material 40 by rotating the fixing screw 11, so that the magnet fixing portion 10 can be fixed.

第2に、可動側保持部2が可動部回転軸22を中心に図中矢印Y方向(可動部移動方向)へ移動する。可動側保持部2が矢印Y方向へ移動することにより、永久磁石基材40が割断予定面40Aから割断され割断面41Aを有する永久磁石41が成形される。割断予定面40Aのうち、始めに割断されるのは永久磁石基材40の外周に成形される切欠部401Aである。本実施形態においては永久磁石基材割断装置1を用いることにより、小さな荷重で永久磁石基材40を割断することができる。   Second, the movable side holding part 2 moves in the direction of arrow Y (movable part moving direction) in the figure around the movable part rotating shaft 22. As the movable side holding part 2 moves in the arrow Y direction, the permanent magnet base 40 is cleaved from the cleaved planned surface 40A, and the permanent magnet 41 having the cleaved section 41A is formed. Of the planned cutting surface 40A, the first portion to be cut is a notch 401A formed on the outer periphery of the permanent magnet base 40. In the present embodiment, by using the permanent magnet base material cleaving apparatus 1, the permanent magnet base material 40 can be cleaved with a small load.

図6に、割断に必要な磁石作用力(KN)及びオフセット量(mm)の関係を示した図を示す。ここで磁石作用力とは、永久磁石基材を割断するために必要とされる力をいう(明細書中において同じ)。実線Rは、割断に必要な磁石作用力(KN)及びオフセット量(mm)の関係を示したものである。例えば、従来技術に係る図9に示す永久磁石割断装置100のように可動部回転軸104がオフセットされていない場合のR0においては割断に必要な磁石作用力は約8KN必要となる。それに対して本実施形態のように可動部回転軸22を3mmオフセットさせた場合のR3においては割断に必要な磁石作用力は約7.5KNである。また、可動部回転軸22を5mmオフセットさせた場合のR5においては割断に必要な磁石作用力は約7KNである。また、可動部回転軸22を8mmオフセットさせた場合のR8においては割断に必要な磁石作用力は約6.5KNである。以上より、可動部回転軸22をオフセットさせることにより永久磁石基材40を割断するために必要な磁石作用力は小さくなるため、小さな荷重により永久磁石基材40を割断するこ
とができる。
なお、本実施形態においては、割断に必要な磁石作用力が約8KN(R0)〜約6.5KN(R8)としたが、割断に必要な磁石作用力は、永久磁石基材40の厚み等により変更される。ただし、オフセットすることにより割断に必要な磁石作用力が小さくなることは変わりがない。
FIG. 6 shows a relationship between the magnet acting force (KN) and the offset amount (mm) necessary for cleaving. Here, the magnet acting force refers to a force required to cleave the permanent magnet base material (the same applies in the specification). The solid line R shows the relationship between the magnet acting force (KN) and the offset amount (mm) necessary for cleaving. For example, in R0 when the movable part rotating shaft 104 is not offset like the permanent magnet cleaving apparatus 100 shown in FIG. 9 according to the prior art, about 8 KN of the magnet acting force necessary for cleaving is required. On the other hand, in R3 when the movable part rotating shaft 22 is offset by 3 mm as in this embodiment, the magnet acting force necessary for cleaving is about 7.5 KN. Further, in R5 when the movable portion rotating shaft 22 is offset by 5 mm, the magnet acting force necessary for cleaving is about 7 KN. Further, in R8 when the movable portion rotating shaft 22 is offset by 8 mm, the magnet acting force necessary for cleaving is about 6.5 KN. As described above, since the magnet acting force necessary for cleaving the permanent magnet base material 40 is reduced by offsetting the movable portion rotating shaft 22, the permanent magnet base material 40 can be cleaved with a small load.
In this embodiment, the magnet acting force necessary for cleaving is about 8 KN (R0) to about 6.5 KN (R8), but the magnet acting force necessary for cleaving is the thickness of the permanent magnet base material 40 or the like. It is changed by. However, there is no change in the fact that the magnet acting force required for cleaving is reduced by offsetting.

小さな荷重で永久磁石基材40を割断することができる理由は、可動部回転軸22を割断予定面40Aと直角方向にオフセットさせ、固定側保持部3側に位置させることにより、割断予定面40Aに対して矢印Fで示す方向に引張力と曲げ力の合力が発生するためである。図1の矢印Fで示す引張力と曲げ力の合力は、図9に示す従来技術に係る矢印Zで示す引張力と比較して可動部移動方向である矢印Yに近く、永久磁石基材40に対して下方斜め方向に発生する。それに対して、図9に示す矢印Zで示す引張力においては、永久磁石基材40に対して横方向に発生する。すなわち、図1に示す矢印Fで示す引張力と曲げ力の合力においては、可動部回転軸22が割断予定面40Aと直角方向にオフセットされ固定側保持部3側に位置することで、割断予定面40Aに対して曲げの方向への力が加わるため矢印Fの方向に力が生じるのである。永久磁石基材40を割断する際に引張力により割断するよりも引張力に曲げ力を加えた合力により割断した方が小さな荷重により割断できる。したがって、本実施形態の永久磁石基材割断装置1を用いることにより小さな荷重で永久磁石基材40を割断することができる。   The reason why the permanent magnet base material 40 can be cleaved with a small load is that the movable part rotating shaft 22 is offset in a direction perpendicular to the cleaving face 40A and positioned on the fixed holding part 3 side, thereby cleaving the cleaving face 40A. This is because a resultant force of a tensile force and a bending force is generated in the direction indicated by the arrow F. The resultant force of the tensile force and the bending force indicated by the arrow F in FIG. 1 is closer to the arrow Y that is the moving part moving direction as compared with the tensile force indicated by the arrow Z according to the prior art shown in FIG. Occurs in an obliquely downward direction. On the other hand, the tensile force indicated by the arrow Z shown in FIG. That is, in the resultant force of the tensile force and the bending force indicated by the arrow F shown in FIG. 1, the movable portion rotating shaft 22 is offset in the direction perpendicular to the planned cutting surface 40 </ b> A and positioned on the fixed side holding portion 3 side. Since a force in the bending direction is applied to the surface 40A, a force is generated in the direction of the arrow F. When the permanent magnet base material 40 is cleaved, it can be cleaved by a smaller load when it is cleaved by a resultant force obtained by adding a bending force to the tensile force than cleaving by a tensile force. Therefore, the permanent magnet base material 40 can be cleaved with a small load by using the permanent magnet base material cleaving apparatus 1 of the present embodiment.

<引張力と曲げ力の合力の説明>
具体的には、可動側保持部2が移動した場合、永久磁石基材40に対して図5の矢印Fa11〜Fa18で示す引張力と曲げ力の合力が発生するため永久磁石基材40を小さな荷重で割断することができる。引張力と曲げ力の合力による磁石作用力について詳細に後述する。
図3に、本実施形態における引張力の応力分布図を示す。図4に、本実施形態における曲げ力の応力分布図を示す。図5に、本実施形態における引張力及び曲げ力が加わった引張力と曲げ力の合力の応力分布図を示す。
<Description of resultant force of tensile force and bending force>
Specifically, when the movable side holding part 2 moves, the resultant force of the tensile force and the bending force indicated by arrows Fa11 to Fa18 in FIG. Can be cleaved by load. The magnet action force resulting from the combined force of the tensile force and the bending force will be described in detail later.
FIG. 3 shows a stress distribution diagram of the tensile force in the present embodiment. FIG. 4 shows a stress distribution diagram of the bending force in the present embodiment. FIG. 5 shows a stress distribution diagram of the resultant force of the tensile force and the bending force applied with the tensile force and the bending force in the present embodiment.

図3に示すように、矢印Ftで示す引張力である応力Ft11〜Ft18は割断予定面40Aから割断垂直方向に対して均等に発生する。
また、図4に示すように、矢印Fbで示す曲げ力は割断予定面40Aから割断垂直方向に応力Fb11〜Fb13が発生する。応力Fb11の応力が最も大きく応力Fb12、応力Fb13と小さくなる。すなわち応力Fb1は、割断中心点40AP(割断予定面40Aの断面中心)から遠く、かつ可動部回転軸22から遠い方向(永久磁石基材40の外周)へ向かうに従って応力が大きくなる。さらに、矢印Fbで示す曲げ力は割断予定面40Aから反対割断垂直方向に応力Fb21〜Fb23が発生する。応力Fb21の応力が最も大きく応力Fb22、応力Fb13と小さくなる。すなわち応力Fb2は、割断中心点40AP(割断予定面40Aの断面中心)から遠く、かつ可動部回転軸22から遠い方向(永久磁石基材40の外周)へ向かうに従って応力が大きくなる。
As shown in FIG. 3, the stresses Ft11 to Ft18, which are tensile forces indicated by the arrows Ft, are uniformly generated from the planned cutting surface 40A in the cutting vertical direction.
Further, as shown in FIG. 4, the bending force indicated by the arrow Fb generates stresses Fb11 to Fb13 in the cleaved vertical direction from the cleaved planned surface 40A. The stress Fb11 is the largest, and the stresses Fb12 and Fb13 are reduced. That is, the stress increases as the stress Fb1 moves away from the cleaving center point 40AP (the center of the cross section of the cleaved planned surface 40A) and away from the movable portion rotating shaft 22 (outer periphery of the permanent magnet base material 40). Further, the bending force indicated by the arrow Fb generates stresses Fb21 to Fb23 in the opposite cleaved vertical direction from the cleaved planned surface 40A. The stress Fb21 is the largest, and the stresses Fb22 and Fb13 are small. That is, the stress Fb <b> 2 increases as it goes away from the cleaving center point 40 </ b> AP (the center of the cross section of the cleaving planned surface 40 </ b> A) and away from the movable portion rotating shaft 22 (outer periphery of the permanent magnet base material 40).

図5に示すように、図3に示す応力Ft1及び図4に示す応力Fb1、Fb2が加わることにより矢印Fa11〜Fa18で示す引張力と曲げ力の合力の応力分布図となる。すなわち、割断予定面40Aのうち可動部回転軸22に近い部分から、可動部回転軸22から最も遠い部分へと行くほど応力は大きくなる。その理由は、図3における矢印Ftで示す引張力である応力Ft11〜Ft18は、割断予定面40Aから割断垂直方向に対して均等に発生しているのに対して、矢印Fbで示す曲げ力である応力Fb11〜Fb13及び応力Fb21〜Fb23は永久磁石基材40の割断中心点40APに近いほど応力は小さく、永久磁石基材40の外周に近いほど応力が大きくなる。そのため、図5に示す矢印Faで示す引張力と曲げ力の合力では、割断中心点40APから可動部回転軸22に遠い部分では応力Ft11からFt13に対して応力Fb11〜Fb13が加えられ応力が大きくなる。他方、割断中心点40APから可動部回転軸22に近い部分では応力Ft16〜Ft18に対して応力Fb21〜Fb23が加えられ応力は小さくなる。その結果、引張力の応力Ft1〜Ft18及び曲げ力の応力Fb11〜Fb13、Fb21〜Fb23が加えられた引張力と曲げ力の合力の応力Faは、図5に示すように割断予定面40Aのうち可動部回転軸22に近い部分の応力Fa18から、可動部回転軸22から最も遠い部分の応力Fa11へと行くほど応力が大きくなる。   As shown in FIG. 5, when the stress Ft1 shown in FIG. 3 and the stresses Fb1 and Fb2 shown in FIG. 4 are applied, a stress distribution diagram of the resultant force of the tensile force and the bending force indicated by arrows Fa11 to Fa18 is obtained. That is, the stress increases as it goes from the portion near the movable portion rotating shaft 22 to the portion farthest from the movable portion rotating shaft 22 in the cleaving planned surface 40A. The reason is that the stresses Ft11 to Ft18, which are the tensile forces indicated by the arrows Ft in FIG. 3, are generated evenly in the vertical direction of the cutting from the planned cutting surface 40A, whereas the stresses Ft11 to Ft18 are the bending forces indicated by the arrows Fb. The stresses Fb11 to Fb13 and the stresses Fb21 to Fb23 are smaller as they are closer to the cleaving center point 40AP of the permanent magnet base 40, and are larger as they are closer to the outer periphery of the permanent magnet base 40. Therefore, in the resultant force of the tensile force and the bending force indicated by the arrow Fa shown in FIG. Become. On the other hand, stresses Fb21 to Fb23 are applied to the stresses Ft16 to Ft18 at a portion close to the movable portion rotating shaft 22 from the cleaving center point 40AP, and the stress is reduced. As a result, the stress Fa of the combined force of the tensile force and the bending force to which the stresses Ft1 to Ft18 of the tensile force and the stresses Fb11 to Fb13 and Fb21 to Fb23 of the bending force are applied is as shown in FIG. The stress increases as it goes from the stress Fa18 in the portion near the movable portion rotating shaft 22 to the stress Fa11 in the portion farthest from the movable portion rotating shaft 22.

割断予定面40Aの上部には切欠部401Aが形成されており、切欠部401Aから割断が開始する。そのため、切欠部401Aが形成された可動部回転軸22から遠い永久磁石基材40の外周部に応力Faが集中し大きな力が掛かれば全体として小さな荷重で永久磁石基材40を割断することができる。本実施形態においては、図6に示すように従来のオフセットをしない場合と比較して小さな荷重であるが、切欠部401Aが形成された可動部回転軸22から遠い永久磁石基材40の外周部に対して図5に示すように大きな引張力と曲げ力の合力が掛かる。そのため、従来技術よりも小さな荷重で永久磁石40を割断し永久磁石41に成形することができる。   A notch 401A is formed on the upper part of the planned cutting surface 40A, and the cleaving starts from the notch 401A. Therefore, if the stress Fa is concentrated on the outer peripheral portion of the permanent magnet base material 40 far from the movable portion rotating shaft 22 where the notch 401A is formed and a large force is applied, the permanent magnet base material 40 can be cleaved with a small load as a whole. it can. In the present embodiment, as shown in FIG. 6, the outer load of the permanent magnet base material 40 is far from the movable part rotating shaft 22 where the notch 401A is formed, although the load is small compared to the case where the conventional offset is not applied. On the other hand, as shown in FIG. 5, a resultant force of a large tensile force and a bending force is applied. Therefore, the permanent magnet 40 can be cleaved and formed into the permanent magnet 41 with a load smaller than that of the prior art.

また、小さな荷重で割断可能なことにより、保持固定時のズレによる分割品質の悪化の防止することができる。例えば、水平方向に働く引張力により永久磁石基材を割断しようとした場合には、永久磁石基材は引き裂かれるため、狙った割断予定面で割断することが困難である。それに対して、垂直方向に働く曲げ力により永久磁石基材を割断する場合には、荷重が下方向へと掛かるため割断予定面で割断することが容易である。よって、保持固定時に永久磁石基材がズレ割断品質の悪化するのを防止することができる。   In addition, since it can be cleaved with a small load, it is possible to prevent deterioration of division quality due to deviation at the time of holding and fixing. For example, when the permanent magnet base material is to be cleaved by a tensile force acting in the horizontal direction, the permanent magnet base material is torn, so that it is difficult to cleave at the intended cleaving plane. On the other hand, when the permanent magnet base material is cleaved by the bending force acting in the vertical direction, the load is applied in the downward direction, so that it is easy to cleave at the planned cleaving surface. Therefore, it is possible to prevent the permanent magnet base material from deteriorating the misalignment cutting quality during holding and fixing.

また、小さな荷重で永久磁石基材を割断することができるため、永久磁石基材を保持固定するための磁石保持力Xを低減することができる。そのため、磁石保持力Xの増大に起因する永久磁石基材の圧壊を防止することができる。   Further, since the permanent magnet base material can be cleaved with a small load, the magnet holding force X for holding and fixing the permanent magnet base material can be reduced. Therefore, it is possible to prevent the permanent magnet base material from being crushed due to the increase in the magnet holding force X.

上述したように、第1実施形態のように永久磁石基材割断装置及び割断方法によれば、以下の作用効果を有する。
永久磁石基材40を可動側保持部2及び固定側保持部3により固定し、可動側保持部2を可動部回転軸22を中心に回転させることにより永久磁石基材40を割断し割断面41Aを成形する永久磁石基材割断装置1において、可動部回転軸22を割断予定面40Aと直角方向にオフセットさせ、固定側保持部3側に位置させることにより、小さな荷重で永久磁石基材40を割断できる。
その理由は、可動部回転軸22を割断予定面40Aと直角方向にオフセットさせ、固定側保持部3側に位置させることにより、割断予定面40Aに対して図1の矢印Fで示す引張力と曲げ力の合力が発生するためである。図1の矢印Fで示す引張力と曲げ力の合力は、図9に示す従来技術に係る矢印Zで示す引張力と比較して可動部移動方向である矢印Yに近く、永久磁石基材40に対して下斜め方向に発生する。すなわち、割断予定面40Aに対して矢印Ftで示す引張力のほかに曲げの方向への矢印Fbで示す曲げ力が加わることにより、小さな荷重により割断できるためである。また、小さな荷重で永久磁石基材40を割断可能なことにより、保持固定時のズレによる割断品質の悪化の防止や、ズレ防止を狙った磁石保持力Xの増大に起因する永久磁石基材40の圧壊を防止することができる。
As described above, according to the permanent magnet base material cleaving apparatus and the cleaving method as in the first embodiment, the following operational effects are obtained.
The permanent magnet base material 40 is fixed by the movable side holding part 2 and the fixed side holding part 3, and the permanent magnet base material 40 is cleaved by rotating the movable side holding part 2 about the movable part rotating shaft 22, so that the section 41 </ b> A is cut. In the permanent magnet base material cleaving apparatus 1 for molding the permanent magnet base material 40 with a small load, the movable part rotating shaft 22 is offset in the direction perpendicular to the planned cutting surface 40A and positioned on the fixed side holding part 3 side. Can be cleaved.
The reason for this is that the movable portion rotating shaft 22 is offset in the direction perpendicular to the cleaving planned surface 40A and positioned on the fixed side holding unit 3 side, whereby the tensile force indicated by the arrow F in FIG. This is because the resultant bending force is generated. The resultant force of the tensile force and the bending force indicated by the arrow F in FIG. 1 is closer to the arrow Y that is the moving part moving direction as compared with the tensile force indicated by the arrow Z according to the prior art shown in FIG. Occurs in a downward diagonal direction. That is, when the bending force shown by the arrow Fb in the bending direction is applied to the planned cutting surface 40A in addition to the tensile force shown by the arrow Ft, it can be cut by a small load. Further, since the permanent magnet base material 40 can be cleaved with a small load, the permanent magnet base material 40 caused by an increase in the magnet holding force X aiming at prevention of deviation and prevention of deviation due to deviation at the time of holding and fixing. Can be prevented.

可動部回転軸22を割断予定面40Aと直角方向にオフセットさせるそのオフセット量は、永久磁石基材40が滑らない必要面圧を有し、かつ、磁石圧壊強度を超えない範囲とすることにより、永久磁石基材40が滑り狙った位置以外で割れる問題及び磁石保持力が大きいことによる永久磁石基材40の圧壊の問題を解決することができる。具体的には、永久磁石基材40が滑らないことにより、永久磁石基材40表面への傷つきを防止し品質を保つことができる。また、磁石圧壊強度を超えない範囲とすることにより、永久磁石基材40の圧壊を防止することができる。   The offset amount for offsetting the movable part rotating shaft 22 in the direction perpendicular to the cleaving scheduled surface 40A has a necessary surface pressure that the permanent magnet base material 40 does not slip and does not exceed the magnet crushing strength, The problem that the permanent magnet base material 40 is cracked at a position other than the position at which the permanent magnet base material 40 is slid and the problem that the permanent magnet base material 40 is crushed due to the large magnet holding force can be solved. Specifically, since the permanent magnet base material 40 does not slip, the surface of the permanent magnet base material 40 can be prevented from being damaged and the quality can be maintained. Moreover, the permanent magnet base material 40 can be prevented from being crushed by setting it within a range that does not exceed the magnet crushing strength.

(第2実施形態)
第2実施形態に係る磁石基材割断装置70は、第1実施形態に係る永久磁石基材割断装置1と比較して、引張力付与装置71が形成されていること以外異なるところがない。そのため、第2実施形態においては、磁石基材割断装置70のうち引張力付与装置71について詳細に説明することにより、その他の説明を割愛する。
なお、第2実施形態で引張力付与装置71以外の構成、作用効果については説明を割愛するが、その他の部分は第1実施形態と同様の構成、作用効果を有する。
(Second Embodiment)
Compared with the permanent magnet base material cleaving apparatus 1 according to the first embodiment, the magnet base material cleaving apparatus 70 according to the second embodiment has no difference except that a tensile force applying device 71 is formed. Therefore, in 2nd Embodiment, other description is omitted by demonstrating in detail the tension | tensile_strength provision apparatus 71 among the magnet base material cleaving apparatuses 70. FIG.
In addition, although description is abbreviate | omitted about the structure other than the tension | tensile_strength provision apparatus 71 in 2nd Embodiment, and an effect, the other part has the structure and effect similar to 1st Embodiment.

図8に、第2実施形態に係る磁石基材割断装置70の概念断面図を示す。
磁石基材割断装置70には、可動側保持部2に引張力を付与するための引張力付与装置71が形成されている。引張力付与装置71は、付勢部材73により可動側保持部2に対して矢印Fk5で示す引張力を付与することができる。
また、可動回転部21には、ガイド29が形成されており、ガイド29には可動側保持部2が摺動可能な構成で取り付けられている。そのため、可動側保持部2のみが矢印Fk5方向の引張力を受けることができる。可動側保持部2は引張力を受けた状態で、可動回転部21により回転方向に回転力を受けることができる。
FIG. 8 is a conceptual cross-sectional view of a magnet base cleaving device 70 according to the second embodiment.
The magnet base cleaving device 70 is formed with a tensile force applying device 71 for applying a tensile force to the movable side holding portion 2. The tensile force applying device 71 can apply a tensile force indicated by an arrow Fk5 to the movable side holding portion 2 by the urging member 73.
In addition, a guide 29 is formed on the movable rotating portion 21, and the movable side holding portion 2 is attached to the guide 29 in a slidable configuration. Therefore, only the movable side holding part 2 can receive the tensile force in the direction of the arrow Fk5. The movable side holding part 2 can receive the rotational force in the rotational direction by the movable rotating part 21 in a state of receiving the tensile force.

第1実施形態において可動部回転軸22を大きくオフセットした場合には、磁石に加わる曲げ力が大きくなりすぎる恐れがある。曲げ力が大きくなりすぎると、曲げ力の応力が集中する部分において磁石が部分的に破壊される可能性があるため問題となる。
また、曲げ力が大きくなると永久磁石基材を保持するための磁石保持力を増加させる必要があり、増加により永久磁石基材が圧壊してしまうため、磁石保持力Xを大きくすることはできないため問題となる。
When the movable part rotating shaft 22 is largely offset in the first embodiment, the bending force applied to the magnet may be too large. If the bending force becomes too large, there is a possibility that the magnet may be partially broken at the portion where the stress of the bending force is concentrated.
Further, when the bending force increases, it is necessary to increase the magnet holding force for holding the permanent magnet base material, and the permanent magnet base material is crushed by the increase, and therefore the magnet holding force X cannot be increased. It becomes a problem.

本実施形態においては、磁石基材割断装置70は、引張力付与装置71を有する。そのため、可動側保持部2に対して、第1実施形態と比較して矢印Fk5で示す引張力を付与することができる。そのため、可動側保持部2に固定された永久磁石基材200に対しても同様に矢印Fk5で示す引張力を付与できる。したがって、矢印Fk5及びFt5で示す引張力を付与することで曲げ力を打ち消し、矢印F5で示す引張力と曲げ力の合力を発生させることができる。本実施形態における矢印F5で示す引張力と曲げ力の合力は、磁石が部分的に破壊されることなく、さらに、磁石保持力の増加をしないで永久磁石基材を割断することができる力となる。   In the present embodiment, the magnet substrate cleaving device 70 has a tensile force applying device 71. Therefore, a tensile force indicated by an arrow Fk5 can be applied to the movable side holding portion 2 as compared with the first embodiment. Therefore, the tensile force indicated by the arrow Fk5 can be similarly applied to the permanent magnet base material 200 fixed to the movable side holding portion 2. Therefore, the bending force can be canceled by applying the tensile force indicated by the arrows Fk5 and Ft5, and the resultant force of the tensile force and the bending force indicated by the arrow F5 can be generated. The resultant force of the tensile force and the bending force indicated by the arrow F5 in the present embodiment is a force that can cleave the permanent magnet base without increasing the magnet holding force without partially destroying the magnet. Become.

尚、本発明は、上記実施の形態に限定されることなく、発明の趣旨を逸脱することのない範囲で色々な応用が可能である。
例えば、本実施形態においては、オフセット量を3mm以上としたが、オフセット量は永久磁石基材40の厚み等及び永久磁石基材割断装置1の大きさ等により変更される。したがって、オフセット量は、永久磁石基材の厚み等及び割断装置の大きさ等により影響を受けない永久磁石基材が滑らない必要面圧を有し、かつ、磁石圧壊強度を超えない範囲により決定することが好ましい。
Note that the present invention is not limited to the above-described embodiment, and various applications are possible without departing from the spirit of the invention.
For example, in the present embodiment, the offset amount is 3 mm or more, but the offset amount is changed depending on the thickness of the permanent magnet base material 40 and the size of the permanent magnet base material cleaving apparatus 1. Therefore, the amount of offset is determined by the range in which the permanent magnet base material that is not affected by the thickness of the permanent magnet base material and the size of the cleaving device has a necessary surface pressure that does not slip and does not exceed the magnet crushing strength. It is preferable to do.

例えば、本実施形態においては、割断に必要な磁石作用力が約8KN(R0)〜約6.5KN(R8)としたが、割断に必要な磁石作用力は、永久磁石基材40の厚み等により変更される。ただし、オフセットすることにより割断に必要な磁石作用力が小さくなることは変わりがない。   For example, in this embodiment, the magnet acting force necessary for cleaving is about 8 KN (R0) to about 6.5 KN (R8), but the magnet acting force necessary for cleaving is the thickness of the permanent magnet base material 40 or the like. It is changed by. However, there is no change in the fact that the magnet acting force required for cleaving is reduced by offsetting.

1 永久磁石基材割断装置
2 可動側保持部
22 可動部回転軸
3 固定側保持部
40 永久磁石基材
40A 割断予定面
41A 割断面
DESCRIPTION OF SYMBOLS 1 Permanent magnet base material cutting apparatus 2 Movable side holding | maintenance part 22 Movable part rotating shaft 3 Fixed side holding | maintenance part 40 Permanent magnet base material 40A Splitting plan surface 41A

Claims (2)

永久磁石基材を可動側保持部及び固定側保持部により固定し、前記可動側保持部を可動部回転軸を中心に回転させることにより前記永久磁石基材を割断し割断面を成形する永久磁石基材割断装置において、
前記可動部回転軸を前記割断面と直角方向にオフセットさせ、前記固定側保持部側に位置させること、
を特徴とする永久磁石基材割断装置。
A permanent magnet for fixing a permanent magnet base material by a movable side holding portion and a fixed side holding portion, and cleaving the permanent magnet base material by rotating the movable side holding portion around a rotation axis of the movable portion to form a cut section In the substrate cleaving device,
Offsetting the movable part rotation axis in a direction perpendicular to the split cross section, and positioning it on the fixed side holding part side;
A permanent magnet substrate cleaving device characterized by the above.
請求項1に記載する永久磁石基材割断装置を用いた永久磁石基材割断方法であって、
前記可動部回転軸を前記割断面と直角方向にオフセットさせ、前記固定側保持部側に位置させること、
を特徴とする永久磁石基材割断方法。



A permanent magnet substrate cleaving method using the permanent magnet substrate cleaving apparatus according to claim 1,
Offsetting the movable part rotation axis in a direction perpendicular to the split cross section, and positioning it on the fixed side holding part side;
A permanent magnet substrate cleaving method characterized by



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US5133491A (en) * 1990-12-20 1992-07-28 Die Tech, Inc. Substrate breaker
JP2002018797A (en) * 2000-06-29 2002-01-22 Nisshinbo Ind Inc Dividing method for fragile material board and device therefor
JP2009142081A (en) * 2007-12-06 2009-06-25 Toyota Motor Corp Permanent magnet and method of manufacturing the same, and rotor and ipm motor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5865329U (en) * 1981-10-27 1983-05-02 株式会社リコー Cutting device for sheet glass, etc.
US5133491A (en) * 1990-12-20 1992-07-28 Die Tech, Inc. Substrate breaker
JP2002018797A (en) * 2000-06-29 2002-01-22 Nisshinbo Ind Inc Dividing method for fragile material board and device therefor
JP2009142081A (en) * 2007-12-06 2009-06-25 Toyota Motor Corp Permanent magnet and method of manufacturing the same, and rotor and ipm motor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104249412A (en) * 2013-06-28 2014-12-31 三星钻石工业股份有限公司 Brittle material base board parting tool and brittle material base board supporting fixture

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