JP2012242556A - Method for forming pattern, active ray-sensitive or radiation-sensitive resin composition, resist film, method for manufacturing electronic device, and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming a pattern excellent in roughness performance such as line width roughness, uniformity in a local pattern dimension, exposure latitude, and dry etching durability, to provide an active ray-sensitive or radiation-sensitive resin composition to be used for the method, and to provide a resist film, a method for manufacturing an electronic device, and an electronic device.SOLUTION: The method for forming a pattern includes steps of: (1) forming a film by using an active ray-sensitive or radiation-sensitive resin composition containing a resin (P) having a repeating unit (A) including a N-methylol type moiety structure; (2) exposing the film; and (3) forming a negative pattern by developing the exposed film by using a developing solution containing an organic solvent. The present invention also discloses an active ray-sensitive or radiation-sensitive resin composition to be used for the above method, and a resist film, a method for manufacturing an electronic device, and an electronic device.

Description

  The present invention relates to a pattern forming method, an actinic ray-sensitive or radiation-sensitive resin composition used therefor, a resist film, an electronic device manufacturing method, and an electronic device. More specifically, the present invention relates to a pattern forming method suitable for a semiconductor manufacturing process such as an IC, a circuit board such as a liquid crystal and a thermal head, and other photofabrication lithography processes, and the pattern forming method. The present invention relates to an actinic ray-sensitive or radiation-sensitive resin composition, a resist film, a method for producing an electronic device, and an electronic device. In particular, the present invention uses a pattern forming method suitable for exposure in an ArF exposure apparatus, an ArF immersion projection exposure apparatus, and an EUV exposure apparatus using far ultraviolet light having a wavelength of 300 nm or less as a light source, and the pattern forming method. The present invention relates to an actinic ray-sensitive or radiation-sensitive resin composition, a resist film, a method for producing an electronic device, and an electronic device.

  Since the resist for KrF excimer laser (248 nm), a pattern formation method using chemical amplification has been used to compensate for the sensitivity reduction due to light absorption. For example, in the positive chemical amplification method, first, a photoacid generator contained in an exposed portion is decomposed by light irradiation to generate an acid. Then, in the post-exposure baking (PEB: Post Exposure Bake) process or the like, the alkali-insoluble group contained in the photosensitive composition is changed to an alkali-soluble group by the catalytic action of the generated acid. Thereafter, development is performed using, for example, an alkaline solution. Thereby, an exposed part is removed and a desired pattern is obtained.

  In the above method, various alkali developers have been proposed. For example, as this alkaline developer, a 2.38 mass% TMAH (tetramethylammonium hydroxide aqueous solution) aqueous alkaline developer is generally used.

  To reduce the size of semiconductor elements, the exposure light source has become shorter and the projection lens has a higher numerical aperture (high NA). Currently, an exposure machine using an ArF excimer laser having a wavelength of 193 nm as a light source has been developed. ing. As a technique for further increasing the resolving power, a method of filling a liquid having a high refractive index (hereinafter also referred to as “immersion liquid”) between the projection lens and the sample (that is, an immersion method) has been proposed. In addition, EUV lithography in which exposure is performed with ultraviolet light having a shorter wavelength (13.5 nm) has also been proposed.

  However, in reality, it is extremely difficult to find an appropriate combination of a resist composition, a developing solution, a rinsing solution and the like necessary for forming a pattern having comprehensively excellent performance.

  In recent years, various configurations have been proposed as positive resist compositions (see, for example, Patent Documents 1 to 4). Development of negative resist compositions in pattern formation by alkali development has also been carried out (see, for example, Patent Documents 5 to 8). This is because, in the manufacture of semiconductor elements and the like, there is a demand for pattern formation having various shapes such as lines, trenches, and holes, but there are patterns that are difficult to form with current positive resists. .

  In recent years, a pattern forming method using a negative developer, that is, a developer containing an organic solvent is being developed (see, for example, Patent Documents 9 to 11). For example, Patent Document 11 discloses a step of applying a positive resist composition on a substrate, which increases the solubility in a positive developer and decreases the solubility in a negative developer by irradiation with actinic rays or radiation. There is disclosed a pattern forming method including an exposure step and a step of developing using a negative developer. According to this method, a highly accurate fine pattern can be stably formed.

  However, with the miniaturization of patterns and the like, even when developing using a developer containing an organic solvent, the performance of the resist composition is required to be further improved.

JP 2008-203639 A JP 2007-146613 A JP 2006-131739 A JP 2000-122295 A JP 2006-317803 A JP 2006-259582 A JP 2006-195050 A JP 2000-206694 A JP 2008-281974 A JP 2008-281975 A JP 2008-292975 A

  An object of the present invention is to provide a pattern forming method excellent in roughness performance such as line width roughness, local pattern dimension uniformity, exposure latitude, and dry etching resistance, and actinic ray sensitivity or radiation sensitivity used therein. It is providing the resin composition, a resist film, the manufacturing method of an electronic device, and an electronic device.

  The present invention has the following configuration, which solves the above-described problems of the present invention.

[1] (A) a step of forming a film with an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (P) having a repeating unit (A) having an N-methylol-based partial structure;
(A) A pattern forming method comprising: a step of exposing the film; and (c) a step of developing using a developer containing an organic solvent to form a negative pattern.
[2] The pattern forming method according to [1], wherein a content of the organic solvent in the developer containing the organic solvent is 90% by mass or more and 100% by mass or less with respect to the total amount of the developer.
[3] The pattern forming method according to [1] or [2], wherein the repeating unit (A) has two or more N-methylol-based partial structures.
[4] Any one of the above [1] to [3], wherein the resin (P) is a resin having a repeating unit (B) having a group that decomposes by the action of an acid to generate a polar group. The pattern forming method according to 1.
[5] The resin according to any one of [1] to [4], wherein the resin (P) is a resin having a repeating unit (C) having a hydroxyl group, which is different from the repeating unit (A). Pattern forming method.
[6] The pattern forming method according to [5], wherein the repeating unit (C) is a repeating unit having an aliphatic cyclic structure.
[7] The pattern forming method according to any one of [4] to [6], wherein the repeating unit (B) is a repeating unit having an aliphatic cyclic structure.
[8] The pattern formation according to any one of [1] to [7], wherein the actinic ray-sensitive or radiation-sensitive resin composition contains a compound that generates an acid upon irradiation with an actinic ray or radiation. Method.
[9] The developer is a developer containing at least one organic solvent selected from the group consisting of ketone solvents, ester solvents, alcohol solvents, amide solvents and ether solvents. [1] The pattern forming method according to any one of [8].
[10] The pattern forming method according to any one of [1] to [9], further including (d) a step of washing with a rinse solution containing an organic solvent.
[11] An actinic ray-sensitive or radiation-sensitive resin composition used in the pattern forming method according to any one of [1] to [8].
[12] A resist film formed from the actinic ray-sensitive or radiation-sensitive resin composition according to [11].
[13] A method for manufacturing an electronic device, comprising the pattern forming method according to any one of [1] to [10].
[14] An electronic device manufactured by the method for manufacturing an electronic device according to [13].

The present invention preferably further has the following configuration.
[15] The pattern forming method according to any one of [1] to [10], wherein the repeating unit (A) is a repeating unit having two or more N-methylol-based partial structures.
[16] The [1] to [10] and [15] above, wherein the N-methylol-based partial structure is a partial structure represented by the following general formula (L-1): Pattern forming method.

In General Formula (L-1), R ^L1 represents a hydrogen atom, an alkyl group, or a cycloalkyl group. p represents 1 or 2. q represents an integer represented by (2-p). * Represents a bond with another atom constituting the repeating unit (A).

[17] The pattern forming method according to any one of [1] to [10], [15], and [16], further including a compound that crosslinks the resin (P) by the action of an acid.
[18] The pattern formation according to any one of [1] to [10] and [15] to [17], further including a low molecular weight compound having two or more hydroxyl groups and having a molecular weight of 2000 or less. Method.
[19] The pattern forming method according to any one of [1] to [10] and [15] to [18], further comprising a hydrophobic resin having at least one of a fluorine atom and a silicon atom. .
[20] The pattern forming method according to any one of [1] to [10] and [15] to [19], further including a basic compound.

  According to the present invention, a pattern forming method excellent in roughness performance such as line width roughness (LWR), local pattern dimension uniformity, exposure latitude, and dry etching resistance, actinic ray sensitivity used in the pattern forming method, or A radiation-sensitive resin composition, a resist film, a method for producing an electronic device, and an electronic device can be provided.

Hereinafter, embodiments of the present invention will be described in detail.
In the description of the group (atomic group) in this specification, the notation which does not describe substitution and non-substitution includes the thing which has a substituent with the thing which does not have a substituent. For example, the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
In the present specification, “active light” or “radiation” means, for example, the emission line spectrum of a mercury lamp, far ultraviolet rays represented by excimer laser, extreme ultraviolet rays (EUV light), X-rays, electron beams (EB), etc. To do. In the present invention, light means actinic rays or radiation.
In addition, “exposure” in the present specification is not limited to exposure to far ultraviolet rays, extreme ultraviolet rays, X-rays, EUV light and the like represented by mercury lamps and excimer lasers, but also electron beams, ion beams, and the like, unless otherwise specified. The exposure with the particle beam is also included in the exposure.

The pattern forming method of the present invention comprises:
(A) a step of forming a film with an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (P) having a repeating unit (A) having an N-methylol-based partial structure;
(A) a step of exposing the film; and (c) a step of developing using a developer containing an organic solvent to form a negative pattern.

The pattern forming method of the present invention using the resin (P) having the repeating unit (A) having an N-methylol-based partial structure is used in the negative pattern formation with a developer containing an organic solvent. The reasons for the excellent roughness performance, local pattern dimension uniformity, exposure latitude, and dry etching resistance are not clear, but are estimated as follows.
When developing using a developer containing an organic solvent, the pattern boundary portion is partially dissolved if the dissolution contrast in the resist film is low, and the roughness performance such as line width roughness and the exposure latitude are deteriorated. .
However, in the present invention, since the resin and a site that causes a crosslinking reaction (crosslinkable site) in the exposed portion, that is, an N-methylol partial structure is combined in advance, The curing reaction is completed only by the cross-linking reaction between them (that is, the curability is high). Thereby, the difference in dissolution rate with respect to the developer containing the organic solvent in the unexposed area and the exposed area can be increased (in other words, the solvent contrast can be improved).
Such an improvement in solvent contrast is considered to have contributed to excellent roughness performance, uniformity of local pattern dimensions, and exposure latitude.
Further, as described above, the curability in the exposed area is high, and it is considered that the dry etching resistance is excellent.

  The pattern forming method of the present invention preferably further includes a step of (d) washing with a rinse solution containing an organic solvent.

  The rinsing liquid may be a rinsing liquid containing at least one organic solvent selected from the group consisting of hydrocarbon solvents, ketone solvents, ester solvents, alcohol solvents, amide solvents, and ether solvents. preferable.

  The pattern forming method of the present invention preferably includes (e) a heating step after (b) the exposure step.

  Resin (P) is also a resin whose polarity is increased by the action of an acid and its solubility in an alkaline developer is increased. Therefore, the pattern forming method of the present invention may further include (f) a step of developing using an alkali developer.

  The pattern formation method of this invention can have (b) exposure process in multiple times.

  The pattern formation method of this invention can have (e) a heating process in multiple times.

  The resist film of the present invention is a film formed from the actinic ray-sensitive or radiation-sensitive resin composition, and is formed, for example, by applying an actinic ray-sensitive or radiation-sensitive resin composition to a substrate. It is a film to be made.

Hereinafter, the actinic ray-sensitive or radiation-sensitive resin composition that can be used in the present invention will be described.
The present invention also relates to an actinic ray-sensitive or radiation-sensitive resin composition described below.
The actinic ray-sensitive or radiation-sensitive resin composition according to the present invention has a negative development (when exposed, the solubility in the developer decreases, the exposed area remains as a pattern, and the unexposed area is removed. Development). That is, the actinic ray-sensitive or radiation-sensitive resin composition according to the present invention is an actinic ray-sensitive or radiation-sensitive resin composition for organic solvent development used in development using a developer containing an organic solvent. be able to. Here, the term “for organic solvent development” means an application that is used in a step of developing using a developer containing at least an organic solvent.
The actinic ray-sensitive or radiation-sensitive resin composition of the present invention is typically a resist composition, particularly a negative resist composition (that is, a resist composition for developing an organic solvent). It is preferable because a high effect can be obtained. The composition according to the present invention is typically a chemically amplified resist composition.

[1] (P) Resin having repeating unit (A) having N-methylol-based partial structure Resin (P) used in the pattern forming method of the present invention is a repeating unit having an N-methylol-based partial structure ( A).
As described above, the N-methylol-based partial structure in the resin (P) is a crosslinkable site that causes a crosslinking reaction in the exposed portion. Therefore, the film formed from the actinic ray-sensitive or radiation-sensitive resin composition containing the resin (P) is exposed and developed using a developer containing an organic solvent, so that only the unexposed portions are developed. It can be dissolved in a liquid to form a negative pattern.

[Repeating unit (A)]
The repeating unit (A) is not particularly limited as long as it has an N-methylol-based partial structure, but more preferably has two or more N-methylol-based partial structures.
Here, the N-methylol-based partial structure refers to a methylol-based group covalently bonded to a nitrogen atom. Therefore, “having two or more N-methylol partial structures” means not only a form in which two or more methylol groups are covalently bonded to different nitrogen atoms, but also two or more methylol groups. The case where a group is covalently bonded to the same nitrogen atom is also included.
The N-methylol-based partial structure refers to, for example, a partial structure represented by the following general formula (L-1).

In General Formula (L-1), R ^L1 represents a hydrogen atom, an alkyl group, or a cycloalkyl group. p represents 1 or 2. q represents an integer represented by (2-p). * Represents a bond with another atom constituting the repeating unit (A).
The alkyl group in R ^L1 may be linear or branched, and may be an alkyl group having 1 to 20 carbon atoms (for example, methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group). , T-butyl group, n-pentyl group, n-hexyl group, n-octyl group, n-dodecyl group, etc.). An alkyl group having 1 to 8 carbon atoms is preferable, an alkyl group having 1 to 6 carbon atoms is more preferable, and an alkyl group having 1 to 4 carbon atoms is particularly preferable.
The cycloalkyl group in R ^L1 may be monocyclic or polycyclic, and includes a cycloalkyl group having 3 to 17 carbon atoms (for example, a cyclopentyl group, a cyclohexyl group, a norbornanyl group, an adamantyl group, etc.). Can be mentioned. A cycloalkyl group having 5 to 12 carbon atoms is preferable, a cycloalkyl group having 5 to 10 carbon atoms is more preferable, and a cycloalkyl group having 5 to 6 carbon atoms is particularly preferable.
R ^L1 in formula (L-1) is preferably a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. Are particularly preferred.

  The repeating unit (A) is preferably a repeating unit represented by the following general formula (L-2).

In General Formula (L-2), R ^L2 , R ^L3, and R ^L4 each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group, or an alkoxycarbonyl group. X is each independently a single bond or a linear or branched hydrocarbon group, a cyclic hydrocarbon group that may contain a hetero atom as a ring member, -O-, -S-, -CO —, —SO ₂ —, —NR— (R is a hydrogen atom, an alkyl group or a group represented by —CH ₂ OR ^L1 ), and (r + 1) -valent selected from the group consisting of a combination thereof. Represents a group. _{Incidentally,} ^{R L1} in the group represented by -CH 2 ^{OR L1} has the same meaning as ^{R L1} in formula (L1).
L represents a monovalent organic group including a partial structure represented by the general formula (L-1).
r represents an integer of 1 to 5. However, r is 1 when X is a single bond.

Specific examples and preferred examples of the alkyl group in R ^L2 , R ^L3 and R ^L4 are the same as those described above for the alkyl group in R ^L1 .
Specific examples and preferred examples of the cycloalkyl group in R ^L2 , R ^L3 and R ^L4 are the same as the above-described specific examples of the cycloalkyl group in R ^L1 .
Examples of the halogen atom in R ^L2 , R ^L3 and R ^L4 include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom, and a fluorine atom is more preferable.
Specific examples and preferred examples of the alkyl moiety of the alkoxycarbonyl group in R ^L2 , R ^L3 and R ^L4 are the same as those described above for the alkyl group in R ^L1 .

R ^L2 and R ^L3 are each independently preferably a hydrogen atom or an alkyl group, and more preferably a hydrogen atom.
R ^L4 is preferably a hydrogen atom, an alkyl group, or a halogen atom, and more preferably a hydrogen atom or an alkyl group.

  As the linear or branched hydrocarbon group, a linear or branched hydrocarbon group having 1 to 5 carbon atoms is preferable, and a linear or branched hydrocarbon group having 1 to 3 carbon atoms is preferable. .

The cyclic hydrocarbon group which may contain a hetero atom as a ring member may be an aromatic ring group or a non-aromatic ring group.
As the aromatic ring in the aromatic ring group, those having 3 to 12 carbon atoms are preferable, and more specifically, a benzene ring, naphthalene ring, furan ring, pyrrole ring, thiophene ring, pyrazole ring, oxazole ring, thiazole ring. Pyridine ring, pyrazine ring, pyrimidine ring, triazine ring and the like.
As a non-aromatic ring in a non-aromatic ring group, a C4-C12 thing is preferable, A cyclopentane ring, a cyclohexane ring, a tetrahydrofuran ring etc. can be mentioned more specifically.

L is not particularly limited as long as it is a monovalent organic group including a partial structure represented by the general formula (L-1), but is preferably a partial structure itself represented by the general formula (L-1). . In this case and in the general formula (L-1), when p = 1 (that is, q = 1), the two bonds in the partial structure represented by the general formula (L-1) are Even when only one is bonded to X, one is bonded to X and the other is a linking group (for example, an alkylene group, a carbonyl group, —O—, —S—, —CO—, — SO ₂ — or a combination thereof may be bonded to X via a ring to form a ring, but when only one is bonded to X, the other * is a hydrogen atom, Or bonded to a monovalent organic group (for example, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group, —O—, —S—, —CO—, —SO ₂ — or a combination thereof). Is preferred.

  r is preferably an integer of 1 to 3, and more preferably 1 or 2.

  The repeating unit represented by the general formula (L-2) is preferably a repeating unit represented by the following general formula (L-3).

In formula ^{(L3), R L2, R} L3, R L4, L and r have the general formula (L2) on at at ^{R L2, R L3, R L4} , L and r synonymous There are also preferred examples. However, r is 1 when X ′ is a single bond.
X ′ has the same meaning as X in formula (L-2).

  Although the specific example of a repeating unit (A) is given to the following, this invention is not limited to this. In the following specific examples, R ′ represents a hydrogen atom, an alkyl group, a cyano group, or a halogen atom.

  The repeating unit (A) may be used alone or in combination of two or more.

  The content of the repeating unit (A) is preferably 3 mol% or more, more preferably 5 mol% or more, more preferably 10 mol% or more based on all repeating units in the resin (P). Is more preferable. The content of the repeating unit (A) is preferably 70 mol% or less, more preferably 65 mol% or less, and more preferably 60 mol% or less, based on all repeating units in the resin (P). More preferably.

(B) Repeating unit having a group that decomposes by the action of an acid to generate a polar group Resin (P) is a group that decomposes by the action of an acid to generate a polar group (hereinafter also referred to as “acid-decomposable group”). It is preferable that the repeating unit (B) to be further included. When the resin (P) generates a polar group, it is considered that the affinity with a developer containing an organic solvent is lowered, and insolubilization (negative conversion) is further promoted.

The repeating unit (B) preferably has a structure in which a polar group is protected by a group that decomposes and leaves by the action of an acid.
Examples of the polar group include a phenolic hydroxy group, a carboxy group, a sulfonic acid group, a sulfonamide group, a sulfonylimide group, an (alkylsulfonyl) (alkylcarbonyl) methylene group, an (alkylsulfonyl) (alkylcarbonyl) imide group, Acids such as bis (alkylcarbonyl) methylene group, bis (alkylcarbonyl) imide group, bis (alkylsulfonyl) methylene group, bis (alkylsulfonyl) imide group, tris (alkylcarbonyl) methylene group, tris (alkylsulfonyl) methylene group Groups. Preferred polar groups include a carboxy group and a sulfonic acid group.

A preferable group as the acid-decomposable group is a group in which the hydrogen atom of these polar groups is substituted with a group capable of leaving with an acid.
As the acid eliminable group, there can be, for _{example, -C (R 36) (R} 37) (R 38), - C (R 36) (R 37) (OR 39), - C (R 01) (R 02 ) (OR ₃₉ ) and the like.
In the formula, R _{36 to} R ₃₉ each independently represents an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or an alkenyl group. R ₃₆ and R ₃₇ may be bonded to each other to form a ring.

R ₀₁ and R ₀₂ each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or an alkenyl group.

The alkyl group of R _{36 to} R ₃₉ , R ₀₁ and R ₀₂ is preferably an alkyl group having 1 to 8 carbon atoms, such as methyl group, ethyl group, propyl group, n-butyl group, sec-butyl group, hexyl. Group, octyl group and the like.
The cycloalkyl group of R _{36 to} R ₃₉ , R ₀₁ and R ₀₂ may be monocyclic or polycyclic. The monocyclic type is preferably a cycloalkyl group having 3 to 8 carbon atoms, and examples thereof include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group. As the polycyclic type, a cycloalkyl group having 6 to 20 carbon atoms is preferable. For example, an adamantyl group, norbornyl group, isobornyl group, camphanyl group, dicyclopentyl group, α-pinel group, tricyclodecanyl group, tetracyclododecyl group. Group, androstanyl group and the like. Note that at least one carbon atom in the cycloalkyl group may be substituted with a heteroatom such as an oxygen atom.
The aryl group of R _{36 to} R ₃₉ , R ₀₁ and R ₀₂ is preferably an aryl group having 6 to 10 carbon atoms, and examples thereof include a phenyl group, a naphthyl group, and an anthryl group.
The aralkyl group of R _{36 to} R ₃₉ , R ₀₁ and R ₀₂ is preferably an aralkyl group having 7 to 12 carbon atoms, and examples thereof include a benzyl group, a phenethyl group, and a naphthylmethyl group.
The alkenyl group of R _{36 to} R ₃₉ , R ₀₁ and R ₀₂ is preferably an alkenyl group having 2 to 8 carbon atoms, and examples thereof include a vinyl group, an allyl group, a butenyl group, and a cyclohexenyl group.
The ring formed by combining R ₃₆ and R ₃₇ is preferably a cycloalkyl group (monocyclic or polycyclic). The cycloalkyl group is preferably a monocyclic cycloalkyl group such as a cyclopentyl group or a cyclohexyl group, or a polycyclic cycloalkyl group such as a norbornyl group, a tetracyclodecanyl group, a tetracyclododecanyl group or an adamantyl group. A monocyclic cycloalkyl group having 5 to 6 carbon atoms is more preferable, and a monocyclic cycloalkyl group having 5 carbon atoms is particularly preferable.

  The repeating unit (B) is preferably a repeating unit having an aliphatic cyclic structure (alicyclic structure) such as a cycloalkyl group or a cycloalkylene group. The aliphatic ring in the aliphatic cyclic structure is preferably an aliphatic ring having 3 to 20 carbon atoms, for example, a monocyclic cycloalkane ring such as a cyclopentane ring or a cyclohexane ring, a norbornane ring, a tetracyclodecane ring, Preferred examples include polycyclic cycloalkane group rings such as a tetracyclododecane ring and an adamantane ring.

  The acid-decomposable group is preferably a cumyl ester group, an enol ester group, an acetal ester group, a tertiary alkyl ester group or the like. More preferably, it is a tertiary alkyl ester group.

The repeating unit having an acid-decomposable group that can be contained in the resin (P) is preferably a repeating unit represented by the following general formula (AI).

In general formula (AI),
Xa ₁ represents a hydrogen atom, a methyl group which may have a substituent, or a group represented by —CH ₂ —R ₉ . R ₉ represents a hydroxy group or a monovalent organic group, and examples of the monovalent organic group include an alkyl group having 5 or less carbon atoms and an acyl group, preferably an alkyl group having 3 or less carbon atoms. More preferably, it is a methyl group. Xa ₁ preferably represents a hydrogen atom, a methyl group, a trifluoromethyl group or a hydroxymethyl group.

T represents a single bond or a divalent linking group.
Rx _{1 to} Rx ₃ each independently represents an alkyl group (straight or branched) or a cycloalkyl group (monocyclic or polycyclic).
Two of Rx _{1 to} Rx ₃ may combine to form a cycloalkyl group (monocyclic or polycyclic).

Examples of the divalent linking group for T include an alkylene group, —COO—Rt— group, —O—Rt— group, and the like. In the formula, Rt represents an alkylene group or a cycloalkylene group.
T is preferably a single bond or a —COO—Rt— group. Rt is preferably an alkylene group having 1 to 5 carbon atoms, more preferably a —CH ₂ — group, — (CH ₂ ) ₂ — group, or — (CH ₂ ) ₃ — group.
Examples of the alkyl group rx ₁ to Rx _3, methyl, ethyl, n- propyl group, an isopropyl group, n- butyl group, an isobutyl group, those having 1 to 4 carbon atoms such as t- butyl group.

Examples of the cycloalkyl group represented by Rx _{1 to} Rx ₃ include monocyclic cycloalkyl groups such as cyclopentyl group and cyclohexyl group, polycyclic cycloalkyl groups such as norbornyl group, tetracyclodecanyl group, tetracyclododecanyl group, and adamantyl group. Groups are preferred.
Examples of the cycloalkyl group formed by combining at least two of Rx _{1 to} Rx ₃ include a monocyclic cycloalkyl group such as a cyclopentyl group and a cyclohexyl group, a norbornyl group, a tetracyclodecanyl group, a tetracyclododecanyl group, A polycyclic cycloalkyl group such as an adamantyl group is preferred. A monocyclic cycloalkyl group having 5 to 6 carbon atoms is particularly preferable.
An embodiment in which Rx ₁ is a methyl group or an ethyl group, and Rx ₂ and Rx ₃ are bonded to form the above-described cycloalkyl group is preferable.

  Each of the above groups is preferably unsubstituted (has no substituent), but may have a substituent. Examples of the substituent include an alkyl group (having 1 to 4 carbon atoms), Examples include a cycloalkyl group (3 to 8 carbon atoms), a halogen atom, an alkoxy group (1 to 4 carbon atoms), a carboxyl group, an alkoxycarbonyl group (2 to 6 carbon atoms), and preferably 8 or less carbon atoms. Among these, from the viewpoint of further improving the dissolution contrast with respect to a developer containing an organic solvent before and after acid decomposition, a substituent having no hetero atom such as an oxygen atom, a nitrogen atom, or a sulfur atom is more preferable ( For example, it is more preferable that it is not an alkyl group substituted with a hydroxyl group, etc.), a group consisting of only a hydrogen atom and a carbon atom is more preferable, and a linear or branched alkyl group or a cycloalkyl group is particularly preferable. preferable.

The resin (P) preferably has a repeating unit represented by the general formula (I) and / or a repeating unit represented by the general formula (II) as the repeating unit represented by the general formula (AI). .

In formulas (I) and (II),
R ₁ and R ₃ each independently represent a hydrogen atom, an optionally substituted methyl group, or a group represented by —CH ₂ —R ₉ . R ₉ represents a monovalent organic group.
R ₂ , R ₄ , R ₅ and R ₆ each independently represents an alkyl group or a cycloalkyl group.
R represents an atomic group necessary for forming an alicyclic structure together with a carbon atom.

R ₁ preferably represents a hydrogen atom, a methyl group, a trifluoromethyl group or a hydroxymethyl group. Specific examples and preferred examples of the monovalent organic group in R ₉ are the same as those described for R ₉ in formula (AI).

The alkyl group in R ₂ may be linear or branched, and may have a substituent.
The cycloalkyl group in R ₂ may be monocyclic or polycyclic and may have a substituent.
R ₂ is preferably an alkyl group, more preferably 1 to 10 carbon atoms, still more preferably 1 to 5 carbon atoms, and examples thereof include a methyl group and an ethyl group.

  R represents an atomic group necessary for forming an alicyclic structure together with a carbon atom. The alicyclic structure formed by R together with the carbon atom is preferably a monocyclic alicyclic structure, and the carbon number thereof is preferably 3 to 7, more preferably 5 or 6.

R ₃ is preferably a hydrogen atom or a methyl group, and more preferably a methyl group.

The alkyl group in R ₄ , R ₅ , and R ₆ may be linear or branched and may have a substituent. As the alkyl group, those having 1 to 4 carbon atoms such as methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group and t-butyl group are preferable.

The cycloalkyl group in R ₄ , R ₅ and R ₆ may be monocyclic or polycyclic and may have a substituent. The cycloalkyl group is preferably a monocyclic cycloalkyl group such as a cyclopentyl group or a cyclohexyl group, or a polycyclic cycloalkyl group such as a norbornyl group, a tetracyclodecanyl group, a tetracyclododecanyl group or an adamantyl group.
R ₄ , R ₅ and R ₆ are preferably each independently an alkyl group.

As a repeating unit represented by general formula (I), the repeating unit represented by the following general formula (1-a) is mentioned, for example.

In formula, R < ₁ > and R < ₂ > are synonymous with each in general formula (I).

The repeating unit represented by the general formula (II) is more preferably a repeating unit represented by the following general formula (II-1).

In formula (II-1),
R _{3 to} R ₅ are respectively synonymous with those in the general formula (II).

R ₁₀ represents a substituent. When a plurality of R ₁₀ are present, they may be the same as or different from each other. Examples of R ₁₀ include a group consisting of only a hydrogen atom and a carbon atom from the viewpoint of increasing the dissolution contrast in a developer containing an organic solvent before and after acid decomposition. An alkyl group is preferred.

  p represents an integer of 0 to 15. p is preferably 0 to 2, more preferably 0 or 1.

  The resin (P) is a resin containing at least one of the repeating unit represented by the general formula (I) and the repeating unit represented by the general formula (II) as the repeating unit represented by the general formula (AI). More preferably, the resin is preferably a resin containing a repeating unit represented by the general formula (I) and a repeating unit represented by the general formula (II). In another embodiment, a resin containing at least two kinds of repeating units represented by the general formula (I) as the repeating unit represented by the general formula (AI) is more preferable.

When the resin of the present invention has a repeating unit (B), the total content is preferably from 20 to 80 mol%, more preferably from 25 to 75 mol%, based on all repeating units in the resin, 30 -70 mol% is still more preferable.
In this case, the molar ratio of the repeating unit (B) to the repeating unit (A) is preferably 5:95 to 95: 5, more preferably 30:70 to 93:17, 35 : 65 to 90:10 is particularly preferable.

Specific examples of preferred repeating units (B) are shown below, but the present invention is not limited thereto.
In specific examples, Rx and Xa ₁ represent a hydrogen atom, CH ₃ , CF ₃ , or CH ₂ OH. Rxa and Rxb each represents an alkyl group having 1 to 4 carbon atoms. Z represents a substituent, and when there are a plurality of them, each is independent. p represents 0 or a positive integer. Specific examples and preferred examples of Z are the same as the specific examples and preferred examples of R ₁₀ in formula (II-1) described above.

  In the case where the acid-decomposable resin contains a plurality of repeating units (B), preferable combinations are as follows. In the following formula, each R independently represents a hydrogen atom or a methyl group.

(C) Repeating unit having a hydroxyl group The resin (P) preferably further has a repeating unit (C) having a hydroxyl group, which is different from the repeating unit (A), and is a repeating unit having an alcoholic hydroxyl group. More preferably.
When the repeating unit (C) having a hydroxyl group is contained in the resin (P), the dissolution contrast with respect to a developer containing an organic solvent can be further improved, and various performances (for example, sensitivity, LWR, resolution, dry resistance) Etching properties and the like can be further improved.

The hydroxyl group in the repeating unit (C) is preferably an alcoholic hydroxyl group.
That is, the hydroxyl group in the repeating unit (C) preferably forms a structure having an alcoholic hydroxyl group.

In the present specification, the alcoholic hydroxyl group is a hydroxyl group bonded to a hydrocarbon group and is not limited as long as it is other than a hydroxyl group bonded directly on an aromatic ring (phenolic hydroxyl group). Those other than the hydroxyl group in the aliphatic alcohol substituted with an attractive group are preferred. In order to improve the reaction efficiency with the N-methylol-based partial structure in the repeating unit (A), the hydroxyl group is a primary alcoholic hydroxyl group (the carbon atom substituted by the hydroxyl group has two hydrogen atoms separately from the hydroxyl group). Or a secondary alcoholic hydroxyl group in which no other electron-withdrawing group is bonded to the carbon atom substituted by the hydroxyl group. The hydroxyl group is particularly preferably a primary alcoholic hydroxyl group, whereby the shape of the resulting pattern can be made better.
Examples of the structure having an alcoholic hydroxyl group include a hydroxyalkyl group (preferably having 2 to 8 carbon atoms, more preferably 2 to 4 carbon atoms), a hydroxycycloalkyl group (preferably having 4 to 14 carbon atoms), and a hydroxyalkyl group. A substituted cycloalkyl group (preferably having a total carbon number of 5 to 20), an alkyl group substituted with a hydroxyalkoxy group (preferably a total of 3 to 15 carbon atoms), a cycloalkyl group substituted with a hydroxyalkoxy group (preferably total number 5-20) such as carbon and the like, preferably residues of primary alcohols as described _{above, - (CH 2) n-} OH (n is an integer of 1 or more, preferably an integer of 2 to 4) The structure represented is more preferred.

  The repeating unit (C) is preferably a repeating unit having an aliphatic cyclic structure (alicyclic structure) such as a cycloalkyl group or a cycloalkylene group. The aliphatic ring in the aliphatic cyclic structure is preferably an aliphatic ring having 3 to 20 carbon atoms, for example, a monocyclic cycloalkane ring such as a cyclopentane ring or a cyclohexane ring, a norbornane ring, a tetracyclodecane ring, Preferred examples include polycyclic cycloalkane group rings such as a tetracyclododecane ring and an adamantane ring.

The repeating unit (C) can be roughly classified into a repeating unit (C1) having only one hydroxyl group and a repeating unit (C2) having two or more hydroxyl groups.
Examples of the repeating unit (C1) having only one hydroxyl group include repeating units represented by the following general formula (I-1).

In the general formula (I-1),
Ra represents a hydrogen atom, a halogen atom, or an alkyl group.
L ₁ represents a single bond or a divalent linking group.
A ₁ represents a divalent hydrocarbon group.
R ₁ represents a hydroxyl group or an organic group having a hydroxyl group.

Examples of the halogen atom for Ra include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
As carbon number of the alkyl group of Ra, a C1-C4 thing is preferable.
The alkyl group of Ra may have a substituent other than a hydroxyl group, and examples thereof include a halogen atom.
Ra is preferably a hydrogen atom, a methyl group, or a trifluoromethyl group, and particularly preferably a hydrogen atom or a methyl group.
As the divalent linking group for L ₁ , —COO—, —OCO—, —CO—, —O—, —S—, —SO—, —SO ₂ —, an alkylene group, a cycloalkylene group, an alkenylene group or A linking group in which a plurality of these are linked can be mentioned, and a linking group having a total carbon number of 12 or less is preferred.
Preferred examples of the divalent hydrocarbon group for A ₁ include norbornylene group, isobornylene group, tricyclodecanylene group, tetracyclododecanylene group, hexacycloheptadecanylene group, adamantylene group, diamantylene group, spirodecanylene group, Examples thereof include a spiroundecanylene group, and among these, an adamantylene group, a diamantylene group, and a norbornylene group are more preferable.
Examples of the organic group having a hydroxyl group of R _1, is not particularly limited, and may be a group represented by -L ₁ '-OH. Here, L ₁ ′ represents a divalent linking group, and specific examples thereof are the same as those described for L ₁ above. The organic group having a hydroxyl group is represented by an alkoxy group having a hydroxyl group (for example, 2-hydroxyethoxy group) or a fluorinated alkyl group having a hydroxyl group (for example, —CH ₂ C (CF ₃ ) ₂ OH). (Group etc.) can also be mentioned suitably.

Although the repeating unit (C1) is illustrated below, this invention is not limited to these. In specific examples, R ^X represents a hydrogen atom or a methyl group.

The repeating unit (C2) having two or more hydroxyl groups preferably has 2 to 8 hydroxyl groups, more preferably 2 to 6 hydroxyl groups, and particularly preferably 3 to 5 hydroxyl groups.
By setting the number of hydroxyl groups to 8 or less, the solubility of the resin (P) in a developer containing an organic solvent can be reliably imparted, so that a good pattern can be more reliably formed without causing unintended development failure. can do.

  Examples of the repeating unit (C2) having two or more hydroxyl groups include a repeating unit represented by formula (I-2).

In the general formula (I-2),
Ra ′ represents a hydrogen atom, a hydroxyl group, a halogen atom, or an alkyl group that may be substituted with a hydroxyl group.
L ₁ represents a single bond or a divalent linking group.
A ₁ represents a (n1 + 1) -valent hydrocarbon group.
R ₁ represents a hydroxyl group or an organic group having a hydroxyl group. When a plurality of R ₁ are present, R ₁ may be the same or different.
n1 represents an integer of 1 or more.
However, when n1 is 1, Ra ′ represents a hydroxyl group or an alkyl group substituted with a hydroxyl group, and is preferably an alkyl group substituted with a hydroxyl group.

Examples of the halogen atom for Ra ′ include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
As carbon number of the alkyl group which may be substituted by the hydroxyl group of Ra ', a C1-C4 thing is preferable.
Ra ′ is preferably a hydrogen atom, a methyl group, a hydroxymethyl group, a hydroxyl group or a trifluoromethyl group, and particularly preferably a hydrogen atom or a methyl group.
Specific examples and preferred examples of the linking group L _1, respectively, may be mentioned divalent groups described as L ₁ in the general formula (I-1).
The (n1 + 1) -valent hydrocarbon group for A ₁ is preferably a linear or branched aliphatic hydrocarbon group, or a monocyclic or polycyclic alicyclic hydrocarbon group. Here, the ring of the monocyclic or polycyclic alicyclic hydrocarbon group may contain a hetero atom such as oxygen as an atom constituting the ring.

Examples of the linear or branched aliphatic hydrocarbon group include an alkyl group having 1 to 12 carbon atoms, and an alkyl group having 2 to 6 carbon atoms is preferable.
Examples of the monocyclic alicyclic hydrocarbon group include a group derived from a cycloalkyl group having 3 to 12 carbon atoms, a group derived from a cycloalkenyl group having 3 to 12 carbon atoms, and preferably , A C3-C7 monocyclic hydrocarbon group.
Preferred examples of the (n1 + 1) -valent monocyclic alicyclic hydrocarbon group include groups derived from cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl and 2-tetrahydropyranyl groups. Can be mentioned.
The polycyclic alicyclic hydrocarbon group includes a ring assembly hydrocarbon group (for example, a bicyclohexyl group) and a bridged cyclic hydrocarbon group. Examples of the bridged cyclic hydrocarbon group include a bicyclic hydrocarbon group, a tricyclic hydrocarbon group, and a tetracyclic hydrocarbon group. The bridged cyclic hydrocarbon group also includes a condensed cyclic hydrocarbon group (for example, a group in which a plurality of 5- to 8-membered cycloalkane rings are condensed).
Preferred examples of the (n1 + 1) -valent polycyclic alicyclic hydrocarbon group include a norbornyl group, an isobornyl group, a tricyclodecanyl group, a tetracyclododecanyl group, a hexacycloheptadecanyl group, an adamantyl group, a diamantyl group, Examples include a group derived from each group of a spirodecanyl group and a spiroundecanyl group, and among these, a group derived from each group of an adamantyl group, a diamantyl group, and a norbornyl group is more preferable.

The (n1 + 1) -valent hydrocarbon group for A ₁ may be a linear or branched aliphatic hydrocarbon group or a monocyclic or polycyclic alicyclic hydrocarbon group, but is resistant to dry etching. From this viewpoint, it is preferably a monocyclic or polycyclic alicyclic hydrocarbon group, more preferably a polycyclic alicyclic hydrocarbon group.

n1 is preferably an integer of 1 to 5, and more preferably an integer of 1 to 3.
Specific examples and preferred examples of the organic group having a hydroxyl group of R ₁ include those similar to R ₁ described in the general formula (I).

In the repeating unit represented by the general formula (I), an alkyl group which may be substituted with a hydroxyl group as Ra, a divalent linking group as L ₁ and L ₁ ′, and a (n1 + 1) valent carbonization as A ₁ Each of the hydrogen group and the organic group having a hydroxyl group as R ₁ may further have a substituent other than the hydroxyl group, and examples of such a substituent include a halogen atom and an alkyl group. Preferred halogen atoms include bromine, chlorine and fluorine atoms, and preferred alkyl groups include methyl, ethyl, n-butyl and t-butyl groups. The above alkyl group may further have a substituent, and examples of the substituent that may further have a halogen atom and an alkyl group.

  The repeating unit (C2) is preferably a repeating unit derived from an ester of acrylic acid which may be substituted at the α-position of the main chain (for example, Ra ′ in the formula (I-2)). More preferably, it is derived from a monomer having a structure corresponding to -2.

  Although the repeating unit (C2) is illustrated below, this invention is not limited to these.

  The repeating unit (C) may have a structure in which at least one of the above-described repeating unit (B) and the repeating units (D) to (E) described later has a hydroxyl group.

When resin (P) has a repeating unit (C), it is preferable that the content is 1-60 mol% with respect to all the repeating units which comprise resin (P), and 3-50 mol%. It is more preferable that
In particular, when the resin (P) contains a repeating unit (C1) having only one hydroxyl group, the content thereof is 1 to 60 mol% with respect to all the repeating units constituting the resin (P). It is preferably 5 to 55 mol%, more preferably 10 to 50 mol%.
In particular, when the resin (P) contains a repeating unit (C2) having two or more hydroxyl groups, its content is generally 1 with respect to all the repeating units constituting the resin (P). -40 mol%, preferably 3-30 mol%, more preferably 5-20%.

(D) Repeating unit having nonpolar group The resin (P) of the present invention preferably further has a repeating unit (D) having a nonpolar group. Thus, elution of low molecular components from the resist film to the immersion liquid during immersion exposure can be reduced, and the solubility of the resin can be appropriately adjusted during development using a developer containing an organic solvent. The repeating unit (D) having a nonpolar group is preferably a repeating unit that does not contain a polar group (for example, the acid group, hydroxyl group, cyano group, etc.) in the repeating unit, and has no lactone structure to be described later. Preferably it is a unit. Examples of such a repeating unit include a repeating unit represented by the general formula (4) or the general formula (5).

In the above general formula,
R ₅ represents a hydrocarbon group having neither a hydroxyl group nor a cyano group.
Ra represents a hydrogen atom, a hydroxyl group, a halogen atom or an alkyl group (preferably having 1 to 4 carbon atoms) independently of each other when a plurality of Ra are present. The alkyl group of Ra may have a substituent, and examples of the substituent include a hydroxyl group and a halogen atom. Examples of the halogen atom for Ra include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Ra is preferably a hydrogen atom, a methyl group, a trifluoromethyl group or a hydroxymethyl group, particularly preferably a hydrogen atom or a methyl group.
n represents an integer of 0 to 2.

R ₅ preferably has at least one cyclic structure.
Examples of the hydrocarbon group for R ₅ include chain and branched hydrocarbon groups, monocyclic hydrocarbon groups, and polycyclic hydrocarbon groups. From the viewpoint of dry etching resistance, R ₅ preferably contains a monocyclic hydrocarbon group and a polycyclic hydrocarbon group, and more preferably contains a polycyclic hydrocarbon group.
R ₅ is preferably _-L 4 _-A 4 _- represents a group represented by (R _{4) n4.} L ₄ represents a single bond or a divalent hydrocarbon group, preferably a single bond, an alkylene group (preferably having 1 to 3 carbon atoms) or a cycloalkylene group (preferably having 5 to 7 carbon atoms). A ₄ represents a (n4 + 1) -valent hydrocarbon group, preferably a monocyclic or polycyclic alicyclic hydrocarbon group. n4 represents an integer of 0 to 5, preferably an integer of 0 to 3. R ₄ represents a hydrocarbon group, preferably an alkyl group (preferably having 1 to 3 carbon atoms) or a cycloalkyl group (preferably having 5 to 7 carbon atoms).

  Examples of chain and branched hydrocarbon groups include alkyl groups having 3 to 12 carbon atoms. Examples of the monocyclic hydrocarbon group include a cycloalkyl group having 3 to 12 carbon atoms and a cycloalkenyl group having 3 to 12 carbon atoms. A preferable monocyclic hydrocarbon group is a monocyclic hydrocarbon group having 3 to 7 carbon atoms.

  The polycyclic hydrocarbon group includes a ring assembly hydrocarbon group (for example, a bicyclohexyl group) and a bridged cyclic hydrocarbon group. Examples of the bridged cyclic hydrocarbon group include a bicyclic hydrocarbon group, a tricyclic hydrocarbon group, and a tetracyclic hydrocarbon group. The bridged cyclic hydrocarbon group also includes a condensed cyclic hydrocarbon group (for example, a group in which a plurality of 5- to 8-membered cycloalkane rings are condensed). Preferred examples of the bridged cyclic hydrocarbon group include a norbornyl group and an adamantyl group.

  These groups may further have a substituent, and preferred examples of the substituent include a halogen atom and an alkyl group. Preferred halogen atoms include bromine, chlorine and fluorine atoms, and preferred alkyl groups include methyl, ethyl, butyl and t-butyl groups. The above alkyl group may further have a substituent, and examples of the substituent that may further have a halogen atom and an alkyl group.

  Although the specific example of the repeating unit which has a nonpolar group is given below, this invention is not limited to these. In the formula, Ra represents a hydrogen atom, a hydroxyl group, a halogen atom, or an alkyl group having 1 to 4 carbon atoms which may have a substituent. Preferable substituents that the alkyl group of Ra may have include a hydroxyl group and a halogen atom. Examples of the halogen atom for Ra include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Ra is preferably a hydrogen atom, a methyl group, a hydroxymethyl group, or a trifluoromethyl group, and particularly preferably a hydrogen atom or a methyl group.

  When resin (P) has a repeating unit (D), it is preferable that the content is 1-50 mol% with respect to all the repeating units which comprise resin (P), and 5-30 mol%. It is more preferable that

(E) Repeating unit having a lactone structure The resin (P) may contain a repeating unit (E) having a lactone structure.

  Any lactone structure can be used, but it is preferably a 5- to 7-membered ring lactone structure, and other ring structures are condensed to form a bicyclo structure or a spiro structure in the 5- to 7-membered ring lactone structure. Is preferred. It is more preferable to have a repeating unit having a lactone structure represented by any of the following general formulas (LC1-1) to (LC1-17). The lactone structure may be directly bonded to the main chain. Preferred lactone structures are (LC1-1), (LC1-4), (LC1-5), (LC1-6), (LC1-13), (LC1-14), and (LC1-17). By using this lactone structure, LWR and development defects are improved.

The lactone structure portion may or may not have a substituent (Rb ₂ ). Preferred substituents (Rb ₂ ) include an alkyl group having 1 to 8 carbon atoms, a cycloalkyl group having 4 to 7 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, an alkoxycarbonyl group having 2 to 8 carbon atoms, and a carboxyl group. , Halogen atom, hydroxyl group, cyano group, acid-decomposable group and the like. More preferably, they are a C1-C4 alkyl group, a cyano group, and an acid-decomposable group. n ₂ represents an integer of 0-4. When n ₂ is 2 or more, a plurality of substituents (Rb ₂ ) may be the same or different, and a plurality of substituents (Rb ₂ ) may be bonded to form a ring. .

  The repeating unit having a lactone group usually has an optical isomer, but any optical isomer may be used. One optical isomer may be used alone, or a plurality of optical isomers may be mixed and used. When one kind of optical isomer is mainly used, the optical purity (ee) thereof is preferably 90% or more, more preferably 95% or more.

  The repeating unit having a lactone structure is preferably a repeating unit represented by the following general formula (AII ′).

In general formula (AII ′),
Rb ₀ represents a hydrogen atom, a halogen atom or an alkyl group (preferably having 1 to 4 carbon atoms). Preferable substituents that the alkyl group of Rb ₀ may have include a hydroxyl group and a halogen atom. Examples of the halogen atom for Rb ₀ include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Preferred are a hydrogen atom, a methyl group, a hydroxymethyl group, and a trifluoromethyl group, and a hydrogen atom and a methyl group are particularly preferred.

  V represents a group having a structure represented by any one of the general formulas (LC1-1) to (LC1-17).

  Specific examples of the repeating unit having a lactone structure are given below, but the present invention is not limited thereto.

  Particularly preferred repeating units having a lactone structure include the following repeating units. By selecting an optimal lactone structure, the pattern profile and the density dependency are improved.

  The repeating unit having a lactone structure preferably contains a unit represented by the following general formula (III).

In formula (III),
A represents an ester bond (a group represented by —COO—) or an amide bond (a group represented by —CONH—).
R ₀ represents an alkylene group, a cycloalkylene group, or a combination thereof independently when there are a plurality of R ₀ .
When there are a plurality of Zs, each independently represents an ether bond, an ester bond, an amide bond, or a urethane bond.

Or urea bond

Represents. Here, R represents a hydrogen atom, an alkyl group, a cycloalkyl group, or an aryl group.

R ₈ represents a monovalent organic group having a lactone structure.
n is the repeating number of the structure represented by —R ₀ —Z—, represents an integer of 1 to 5, and is preferably 1.
R ₇ represents a hydrogen atom, a halogen atom or an alkyl group.

The alkylene group and cycloalkylene group represented by R ₀ may have a substituent.
Z is preferably an ether bond or an ester bond, and particularly preferably an ester bond.

The alkyl group for R ₇ is preferably an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group or an ethyl group, and particularly preferably a methyl group.
The alkylene group of R ₀ , the cycloalkylene group, and the alkyl group in R ₇ may each be substituted. Examples of the substituent include a halogen atom such as a fluorine atom, a chlorine atom and a bromine atom, a mercapto group, a hydroxyl group, Examples thereof include alkoxy groups such as methoxy group, ethoxy group, isopropoxy group, t-butoxy group and benzyloxy group, and acyloxy groups such as acetyloxy group and propionyloxy group.
R ₇ is preferably a hydrogen atom, a methyl group, a trifluoromethyl group, or a hydroxymethyl group.

Preferable chain alkylene group in R ₀ is preferably a chain alkylene having 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, and examples thereof include a methylene group, an ethylene group, and a propylene group. A preferable cycloalkylene group is a cycloalkylene group having 3 to 20 carbon atoms, and examples thereof include a cyclohexylene group, a cyclopentylene group, a norbornylene group, and an adamantylene group. In order to exhibit the effect of the present invention, a chain alkylene group is more preferable, and a methylene group is particularly preferable.

The monovalent organic group having a lactone structure represented by R ₈ is not limited as long as it has a lactone structure, and is represented by general formulas (LC1-1) to (LC1-17) as specific examples. Among them, the structure represented by (LC1-4) is particularly preferable. Further, n ₂ in (LC1-1) to (LC1-17) is more preferably 2 or less.
R ₈ is preferably a monovalent organic group having an unsubstituted lactone structure or a monovalent organic group having a lactone structure having a methyl group, a cyano group or an alkoxycarbonyl group as a substituent. A monovalent organic group having a lactone structure (cyanolactone) as is more preferable.

Specific examples of the repeating unit having a group having a lactone structure represented by the general formula (III) are shown below, but the present invention is not limited thereto.
In the following specific examples, R represents a hydrogen atom, an alkyl group which may have a substituent, or a halogen atom, preferably a hydrogen atom, a methyl group, a hydroxymethyl group or an acetyloxymethyl group.

  The repeating unit having a lactone structure is more preferably a repeating unit represented by the following general formula (III-1).

In general formula (III-1),
R ₇ , A, R ₀ , Z, and n are as defined in the general formula (III).
R ₉ independently represents an alkyl group, a cycloalkyl group, an alkoxycarbonyl group, a cyano group, a hydroxyl group or an alkoxy group when there are a plurality of R _{9 s, and} when there are a plurality of R _{9 s} , May be formed.

X represents an alkylene group, an oxygen atom, or a sulfur atom.
m is the number of substituents and represents an integer of 0 to 5. m is preferably 0 or 1.

The alkyl group for R ₉ is preferably an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group or an ethyl group, and most preferably a methyl group. Examples of the cycloalkyl group include cyclopropyl, cyclobutyl, cyclopentyl, and cyclohexyl groups. Examples of the alkoxycarbonyl group include a methoxycarbonyl group, an ethoxycarbonyl group, an n-butoxycarbonyl group, and a t-butoxycarbonyl group. Examples of the alkoxy group include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, and a butoxy group. These groups may have a substituent, and examples of the substituent include an alkoxy group such as a hydroxyl group, a methoxy group, and an ethoxy group, and a halogen atom such as a cyano group and a fluorine atom. R ₉ is more preferably a methyl group, a cyano group or an alkoxycarbonyl group, and even more preferably a cyano group.

  Examples of the alkylene group for X include a methylene group and an ethylene group. X is preferably an oxygen atom or a methylene group, and more preferably a methylene group.

When m is 1 or more, at least one R ₉ is preferably substituted at the α-position or β-position of the lactone carbonyl group, particularly preferably at the α-position.

  Specific examples of the repeating unit having a group having a lactone structure represented by formula (III-1) are shown below, but the present invention is not limited thereto. In the following specific examples, R represents a hydrogen atom, an alkyl group which may have a substituent, or a halogen atom, preferably a hydrogen atom, a methyl group, a hydroxymethyl group or an acetyloxymethyl group.

In order to enhance the effect of the present invention, two or more lactone repeating units can be used in combination. When using together, it is also preferable to select and use 2 or more types from the lactone repeating unit in which n is 1 in general formula (III).
When the resin (P) contains a repeating unit (E) having a lactone, the content thereof is preferably 15 to 70 mol%, more preferably 20 with respect to all repeating units constituting the resin (P). It is -60 mol%, More preferably, it is 30-50 mol%.

  Resin (P) adjusts dry etching resistance, standard developer suitability, substrate adhesion, resist profile, and resolution, heat resistance, sensitivity, etc., which are general necessary characteristics of resist, in addition to the above repeating structural units. For this purpose, various repeating structural units can be included.

  Examples of such repeating structural units include, but are not limited to, repeating structural units corresponding to the following monomers.

  Thereby, performance required for the resin used in the composition of the present invention, in particular, (1) solubility in coating solvent, (2) film-forming property (glass transition point), (3) developability in organic solvent, Fine adjustments such as (4) film sliding (hydrophobic hydrophobicity, polar group selection), (5) adhesion of the unexposed part to the substrate, and (6) dry etching resistance are possible.

  As such a monomer, for example, a compound having one addition polymerizable unsaturated bond selected from acrylic acid esters, methacrylic acid esters, acrylamides, methacrylamides, allyl compounds, vinyl ethers, vinyl esters, etc. Etc.

  In addition, any addition-polymerizable unsaturated compound that can be copolymerized with monomers corresponding to the above various repeating structural units may be copolymerized.

  In addition, in the resin (P), the content molar ratio of each repeating structural unit is the resist dry etching resistance, the standard developer suitability, the substrate adhesion, the resist profile, and the resolving power and heat resistance which are general required performance of the resist. In order to adjust the sensitivity and the like, it is set as appropriate.

When the composition of the present invention is for ArF exposure, the resin (P) used in the composition of the present invention has substantially no aromatic group from the viewpoint of transparency to ArF light (specifically, The ratio of the repeating unit having an aromatic group in the resin is preferably 5 mol% or less, more preferably 3 mol% or less, ideally 0 mol%, that is, no aromatic group). The resin (P) preferably has a monocyclic or polycyclic alicyclic hydrocarbon structure.
In addition, when resin (P) contains resin (E) mentioned later, it is preferable that resin (P) does not contain a fluorine atom and a silicon atom from a compatible viewpoint with resin (E).

  The resin (P) used in the composition of the present invention is preferably one in which all of the repeating units are composed of (meth) acrylate-based repeating units. In this case, all of the repeating units are methacrylate repeating units, all of the repeating units are acrylate repeating units, or all of the repeating units are methacrylate repeating units and acrylate repeating units. Although it can be used, the acrylate-based repeating unit is preferably 50 mol% or less of the total repeating units.

  When the composition of the present invention is irradiated with KrF excimer laser light, electron beam, X-ray, high energy light beam (EUV, etc.) having a wavelength of 50 nm or less, the resin (P) further has a hydroxystyrene-based repeating unit. It is preferable. More preferably, it has a hydroxystyrene-based repeating unit, a hydroxystyrene-based repeating unit protected with an acid-decomposable group, and an acid-decomposable repeating unit such as a (meth) acrylic acid tertiary alkyl ester.

  Examples of the repeating unit having a preferred acid-decomposable group based on hydroxystyrene include, for example, t-butoxycarbonyloxystyrene, 1-alkoxyethoxystyrene, a repeating unit of (meth) acrylic acid tertiary alkyl ester, and the like. More preferred are repeating units of 2-alkyl-2-adamantyl (meth) acrylate and dialkyl (1-adamantyl) methyl (meth) acrylate.

  The resin (P) in the present invention can be synthesized according to a conventional method (for example, radical polymerization). For example, as a general synthesis method, a monomer polymerization method in which a monomer species and an initiator are dissolved in a solvent and heating is performed, and a solution of the monomer species and the initiator is dropped into the heating solvent over 1 to 10 hours. The dropping polymerization method is added, and the dropping polymerization method is preferable. Examples of the reaction solvent include ethers such as tetrahydrofuran, 1,4-dioxane and diisopropyl ether, ketones such as methyl ethyl ketone and methyl isobutyl ketone, ester solvents such as ethyl acetate, amide solvents such as dimethylformamide and dimethylacetamide, Furthermore, the solvent which melt | dissolves the composition of this invention like the below-mentioned propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, and cyclohexanone is mentioned. More preferably, the polymerization is performed using the same solvent as the solvent used in the photosensitive composition of the present invention. Thereby, generation | occurrence | production of the particle at the time of a preservation | save can be suppressed.

  The polymerization reaction is preferably performed in an inert gas atmosphere such as nitrogen or argon. As a polymerization initiator, a commercially available radical initiator (azo initiator, peroxide, etc.) is used to initiate the polymerization. As the radical initiator, an azo initiator is preferable, and an azo initiator having an ester group, a cyano group, or a carboxyl group is preferable. Preferred initiators include azobisisobutyronitrile, azobisdimethylvaleronitrile, dimethyl 2,2'-azobis (2-methylpropionate) and the like. If desired, an initiator is added or added in portions, and after completion of the reaction, it is put into a solvent and a desired polymer is recovered by a method such as powder or solid recovery. The concentration of the reaction is 5 to 50% by mass, preferably 10 to 30% by mass. The reaction temperature is usually from 10 ° C to 150 ° C, preferably from 30 ° C to 120 ° C, more preferably from 60 ° C to 100 ° C.

  After completion of the reaction, the mixture is allowed to cool to room temperature and purified. Purification can be accomplished by a liquid-liquid extraction method that removes residual monomers and oligomer components by combining water and an appropriate solvent, and a purification method in a solution state such as ultrafiltration that extracts and removes only those having a specific molecular weight or less. , Reprecipitation method that removes residual monomer by coagulating resin in poor solvent by dripping resin solution into poor solvent and purification in solid state such as washing filtered resin slurry with poor solvent A normal method such as a method can be applied. For example, the resin is precipitated as a solid by contacting a solvent (poor solvent) in which the resin is hardly soluble or insoluble in a volume amount of 10 times or less, preferably 10 to 5 times that of the reaction solution.

  The solvent (precipitation or reprecipitation solvent) used in the precipitation or reprecipitation operation from the polymer solution may be a poor solvent for the polymer, and may be a hydrocarbon, halogenated hydrocarbon, nitro, depending on the type of polymer. A compound, ether, ketone, ester, carbonate, alcohol, carboxylic acid, water, a mixed solvent containing these solvents, and the like can be appropriately selected for use. Among these, as a precipitation or reprecipitation solvent, a solvent containing at least an alcohol (particularly methanol or the like) or water is preferable.

  The amount of the precipitation or reprecipitation solvent used can be appropriately selected in consideration of efficiency, yield, and the like, but generally 100 to 10000 parts by mass, preferably 200 to 2000 parts by mass with respect to 100 parts by mass of the polymer solution, More preferably, it is 300-1000 mass parts.

  The temperature for precipitation or reprecipitation can be appropriately selected in consideration of efficiency and operability, but is usually about 0 to 50 ° C., preferably around room temperature (for example, about 20 to 35 ° C.). The precipitation or reprecipitation operation can be performed by a known method such as a batch method or a continuous method using a conventional mixing vessel such as a stirring tank.

  The precipitated or re-precipitated polymer is usually subjected to conventional solid-liquid separation such as filtration and centrifugation, and dried before use. Filtration is performed using a solvent-resistant filter medium, preferably under pressure. Drying is performed at a temperature of about 30 to 100 ° C., preferably about 30 to 50 ° C. under normal pressure or reduced pressure (preferably under reduced pressure).

In addition, after depositing and separating the resin once, it may be dissolved again in a solvent, and the resin may be brought into contact with a hardly soluble or insoluble solvent. That is, after completion of the radical polymerization reaction, a solvent in which the polymer is hardly soluble or insoluble is contacted to precipitate a resin (step a), the resin is separated from the solution (step b), and dissolved again in the solvent to obtain a resin solution A. (Step c), and then contact the resin solution A with a solvent in which the resin is hardly soluble or insoluble in a volume amount less than 10 times that of the resin solution A (preferably 5 times or less volume). This may be a method including precipitating a resin solid (step d) and separating the precipitated resin (step e).
In order to prevent the resin from aggregating after the preparation of the composition, for example, as described in JP-A-2009-037108, the synthesized resin is dissolved in a solvent to form a solution. A step of heating at about 30 ° C. to 90 ° C. for about 30 minutes to 4 hours may be added.

  The weight average molecular weight of the resin (P) in the present invention is preferably 1,000 to 200,000, more preferably 2,000 to 20,000, still more preferably 3, as a polystyrene conversion value by GPC method. 000 to 18,000, particularly preferably 3,000 to 10,000. By setting the weight average molecular weight to 1,000 to 200,000, deterioration of heat resistance and dry etching resistance can be prevented, and developability is deteriorated, and viscosity is increased, resulting in deterioration of film forming property. Can be prevented.

  The degree of dispersion (molecular weight distribution) of the resin (P) is usually 1.0 to 3.0, preferably 1.0 to 2.6, more preferably 1.0 to 2.0, and particularly preferably 1. The thing of the range of 4-2.0 is used. The smaller the molecular weight distribution, the better the resolution and the resist shape, the smoother the sidewall of the resist pattern, and the better the roughness.

In the actinic ray-sensitive or radiation-sensitive resin composition of the present invention, the content of the resin (P) in the entire composition is preferably 30 to 99% by mass, more preferably 60 to 95% by mass in the total solid content. It is.
In the present invention, the resin (P) may be used alone or in combination. Or you may use together resin (P) and the other resin which does not correspond to resin (P). In that case, it is preferable that 50 mass% or more of resin (P) exists in all the resins.

In particular, the resin (P) preferably contains at least one of the repeating unit (B) and the repeating unit (C) in addition to the repeating unit (A), and contains the repeating unit (C). It is more preferable to contain the repeating unit (B) and the repeating unit (C).
As described above, the actinic ray-sensitive or radiation-sensitive resin composition of the present invention is also referred to as resin (P) and other resins not corresponding to resin (P) (hereinafter simply referred to as “other resins”). ), It is preferable that at least one of the resin (P) and the other resin contains at least one of the repeating unit (B) and the repeating unit (C). It is more preferable to contain, and it is still more preferable to contain the said repeating unit (B) and the said repeating unit (C).

[2] Compound (B) that generates an acid upon irradiation with an actinic ray or radiation
The actinic ray-sensitive or radiation-sensitive resin composition used in the present invention preferably contains a compound that generates an acid upon irradiation with actinic rays or radiation (hereinafter also referred to as “acid generator”).
As an acid generator, photo-initiator of photocation polymerization, photo-initiator of photo-radical polymerization, photo-decoloring agent of dyes, photo-discoloring agent, or irradiation with actinic ray or radiation used for micro-resist etc. Known compounds that generate acids and mixtures thereof can be appropriately selected and used.

  Examples thereof include diazonium salts, phosphonium salts, sulfonium salts, iodonium salts, imide sulfonates, oxime sulfonates, diazodisulfones, disulfones, and o-nitrobenzyl sulfonates.

  Preferred compounds among the acid generators include compounds represented by the following general formulas (ZI), (ZII), and (ZIII).

In the general formula (ZI), R ₂₀₁ , R ₂₀₂ and R ₂₀₃ each independently represents an organic group. The carbon number of the organic group as R ₂₀₁ , R ₂₀₂ and R ₂₀₃ is generally 1 to 30, preferably 1 to 20. Two of R _{201 to} R ₂₀₃ may be bonded to form a ring structure, and the ring may contain an oxygen atom, a sulfur atom, an ester bond, an amide bond, or a carbonyl group. Examples of the group formed by combining two of R _{201 to} R ₂₀₃ include an alkylene group (eg, butylene group, pentylene group). Z ⁻ represents a non-nucleophilic anion.

Examples of the non-nucleophilic anion as Z ⁻ include a sulfonate anion, a carboxylate anion, a sulfonylimide anion, a bis (alkylsulfonyl) imide anion, and a tris (alkylsulfonyl) methide anion.

  A non-nucleophilic anion is an anion that has an extremely low ability to cause a nucleophilic reaction, and is an anion that can suppress degradation over time due to an intramolecular nucleophilic reaction. This improves the temporal stability of the resist.

  Examples of the sulfonate anion include an aliphatic sulfonate anion, an aromatic sulfonate anion, and a camphor sulfonate anion.

  Examples of the carboxylate anion include an aliphatic carboxylate anion, an aromatic carboxylate anion, and an aralkylcarboxylate anion.

  The aliphatic moiety in the aliphatic sulfonate anion may be an alkyl group or a cycloalkyl group, and preferably includes an alkyl group having 1 to 30 carbon atoms and a cycloalkyl group having 3 to 30 carbon atoms. it can.

  The aromatic group in the aromatic sulfonate anion is preferably an aryl group having 6 to 14 carbon atoms, such as a phenyl group, a tolyl group, and a naphthyl group.

  The alkyl group, cycloalkyl group and aryl group in the aliphatic sulfonate anion and aromatic sulfonate anion may have a substituent. Examples of the substituent of the alkyl group, cycloalkyl group, and aryl group in the aliphatic sulfonate anion and aromatic sulfonate anion include, for example, a nitro group, a halogen atom (fluorine atom, chlorine atom, bromine atom, iodine atom), carboxyl group , Hydroxyl group, amino group, cyano group, alkoxy group (preferably having 1 to 15 carbon atoms), cycloalkyl group (preferably having 3 to 15 carbon atoms), aryl group (preferably having 6 to 14 carbon atoms), alkoxycarbonyl group ( Preferably 2 to 7 carbon atoms, acyl group (preferably 2 to 12 carbon atoms), alkoxycarbonyloxy group (preferably 2 to 7 carbon atoms), alkylthio group (preferably 1 to 15 carbon atoms), alkylsulfonyl group (Preferably 1 to 15 carbon atoms), alkyliminosulfonyl group (preferably 1 to 15 carbon atoms), ant Ruoxysulfonyl group (preferably having 6 to 20 carbon atoms), alkylaryloxysulfonyl group (preferably having 7 to 20 carbon atoms), cycloalkylaryloxysulfonyl group (preferably having 10 to 20 carbon atoms), alkyloxyalkyloxy group (Preferably having 5 to 20 carbon atoms), a cycloalkylalkyloxyalkyloxy group (preferably having 8 to 20 carbon atoms), and the like. About the aryl group and ring structure which each group has, an alkyl group (preferably C1-C15) and a cycloalkyl group (preferably C3-C15) can further be mentioned as a substituent.

  As the aromatic sulfonate anion, an anion that generates an aryl sulfonic acid represented by the following formula (BI) is also preferable.

In formula (BI),
Ar represents an aromatic ring and may further have a substituent in addition to the sulfonic acid group and the A group.
p represents an integer of 0 or more.
A represents a group having a hydrocarbon group.
When p is 2 or more, the plurality of A groups may be the same or different.

General formula (BI) will be described in more detail.
As the aromatic ring represented by Ar, an aromatic ring having 6 to 30 carbon atoms is preferable.
Specifically, benzene ring, naphthalene ring, pentalene ring, indene ring, azulene ring, heptalene ring, indecene ring, perylene ring, pentacene ring, acetaphthalene ring, phenanthrene ring, anthracene ring, naphthacene ring, pentacene ring, chrysene ring, Triphenylene ring, indene ring, fluorene ring, triphenylene ring, naphthacene ring, biphenyl ring, pyrrole ring, furan ring, thiophene ring, imidazole ring, oxazole ring, thiazole ring, pyridine ring, pyrazine ring, pyrimidine ring, pyridazine ring, indolizine Ring, indole ring, benzofuran ring, benzothiophene ring, isobenzofuran ring, quinolidine ring, quinoline ring, phthalazine ring, naphthyridine ring, quinoxaline ring, quinoxazoline ring, isoquinoline ring, carbazole ring, phenanthri Down ring, acridine ring, phenanthroline ring, thianthrene ring, chromene ring, xanthene ring, phenoxathiin ring, phenothiazine ring, phenazine ring, and the like, a benzene ring, a naphthalene ring, an anthracene ring are preferred, a benzene ring is more preferable.

  Examples of the substituent that the aromatic ring may have other than the sulfonic acid group and the A group include a halogen atom (fluorine atom, chlorine atom, bromine atom, iodine atom, etc.), hydroxyl group, cyano group, nitro group, carboxyl group, and the like. Can be mentioned. Moreover, when it has two or more substituents, at least two substituents may be bonded to each other to form a ring.

Examples of the group having a hydrocarbon group include alkoxy groups such as methoxy group, ethoxy group, and tert-butoxy group, aryloxy groups such as phenoxy group and p-tolyloxy group, methylthioxy group, ethylthioxy group, and tert-butylthioxy group. Alkylthioxy groups such as phenylthioxy groups, arylthioxy groups such as p-tolylthioxy groups, alkoxycarbonyl groups such as methoxycarbonyl groups, butoxycarbonyl groups, phenoxycarbonyl groups, acetoxy groups, methyl groups, ethyl groups, propyl groups , Butyl group, heptyl group, hexyl group, dodecyl group, linear alkyl group such as 2-ethylhexyl group and branched alkyl group, alkenyl group such as vinyl group, propenyl group, hexenyl group, acetylene group, propynyl group, hexynyl group, etc. The alkynyl group of Aryl groups such as tolyl group, a benzoyl group, an acetyl group, and the like acyl groups such as tolyl group.
Examples of the hydrocarbon group in the group having a hydrocarbon group represented by A include an acyclic hydrocarbon group or a cyclic aliphatic group, and the hydrocarbon group has 3 or more carbon atoms. preferable.
As the A group, the carbon atom adjacent to Ar is preferably a tertiary or quaternary carbon atom.
Examples of the acyclic hydrocarbon group as the A group include isopropyl group, t-butyl group, t-pentyl group, neopentyl group, s-butyl group, isobutyl group, isohexyl group, 3,3-dimethylpentyl group, 2- An ethylhexyl group etc. are mentioned. The upper limit of the number of carbon atoms of the acyclic hydrocarbon group is preferably 12 or less, more preferably 10 or less.

  Cycloaliphatic groups as the A group include cyclobutyl groups, cyclopentyl groups, cyclohexyl groups, cycloheptyl groups, cyclooctyl groups and other cycloalkyl groups, adamantyl groups, norbornyl groups, bornyl groups, camphenyl groups, decahydronaphthyl groups. , Tricyclodecanyl group, tetracyclodecanyl group, camphoroyl group, dicyclohexyl group, pinenyl group and the like, which may have a substituent. The upper limit of the carbon number of the cycloaliphatic group is preferably 15 or less, more preferably 12 or less.

When the acyclic hydrocarbon group or the cyclic aliphatic group has a substituent, examples of the substituent include halogen atoms such as a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom, a methoxy group, and an ethoxy group. Group, alkoxy group such as tert-butoxy group, aryloxy group such as phenoxy group, p-tolyloxy group, alkylthioxy group such as methylthioxy group, ethylthioxy group, tert-butylthioxy group, phenylthioxy group, p-tolyloxy group Arylthiooxy group such as methoxycarbonyl group, butoxycarbonyl group, phenoxycarbonyl group, etc., acetoxy group, methyl group, ethyl group, propyl group, butyl group, heptyl group, hexyl group, dodecyl group, 2- Linear alkyl groups such as ethylhexyl group, branched alkyl groups, A cyclic alkyl group such as a rohexyl group, an alkenyl group such as a vinyl group, a propenyl group and a hexenyl group, an alkynyl group such as an acetylene group, a propynyl group and a hexynyl group, an aryl group such as a phenyl group and a tolyl group, a hydroxy group, a carboxy group, Examples include a sulfonic acid group, a carbonyl group, and a cyano group.
Specific examples of the cyclic aliphatic group or acyclic hydrocarbon group as A include the following.

  Among the above, the following structures are more preferable from the viewpoint of suppressing acid diffusion.

  p represents an integer of 0 or more, and the upper limit is not particularly limited as long as it is a chemically possible number. From the viewpoint of suppressing acid diffusion, p is usually 0 to 5, preferably 1 to 4, more preferably 2 to 3, and most preferably 3.

From the viewpoint of suppressing acid diffusion, the A group preferably substitutes at least one o-position of the sulfonic acid group, and more preferably has a structure in which two o-positions are substituted.
In one embodiment, the acid generator (B) of the present invention is a compound that generates an acid represented by the following general formula (BII).

In the formula, A is the same as A in the general formula (BI), and two A may be the same or different. R _{1 to} R ₃ each independently represents a hydrogen atom, a group having a hydrocarbon group, a halogen atom, a hydroxyl group, a cyano group, or a nitro group. Specific examples of the group having a hydrocarbon group include the same groups as those exemplified above.

  Moreover, the anion which produces the acid represented with the following general formula (I) as a preferable sulfonate anion can also be mentioned.

In the formula, each Xf independently represents a fluorine atom or an alkyl group substituted with at least one fluorine atom. R ¹ and R ² each independently represents a group selected from a hydrogen atom, a fluorine atom and an alkyl group, and when there are a plurality of R ¹ and R ² , they may be the same or different. L represents a divalent linking group, and when there are a plurality of L, L may be the same or different. A represents a cyclic organic group. x represents an integer of 1 to 20, y represents an integer of 0 to 10, and z represents an integer of 0 to 10.

General formula (I) will be described in more detail.
The alkyl group in the alkyl group substituted with the fluorine atom of Xf preferably has 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms. The alkyl group substituted with a fluorine atom of Xf is preferably a perfluoroalkyl group.
Xf is preferably a fluorine atom or a perfluoroalkyl group having 1 to 4 carbon atoms. Specific examples of Xf include a fluorine atom, CF ₃ , C ₂ F ₅ , C ₃ F ₇ , C ₄ F ₉ , C ₅ F ₁₁ , C ₆ F ₁₃ , C ₇ F ₁₅ , C ₈ F ₁₇ , CH ₂ CF ₃ , CH ₂ CH ₂ CF ₃ , CH ₂ C ₂ F ₅ , CH ₂ CH ₂ C ₂ F ₅ , CH ₂ C ₃ F ₇ , CH ₂ CH ₂ C ₃ F ₇ , CH ₂ C ₄ F ₉ , CH ₂ CH ₂ C ₄ F ₉ can be mentioned, among which a fluorine atom and CF ₃ are preferable. In particular, it is preferable that both Xf are fluorine atoms.

The alkyl group of R ¹ and R ² may have a substituent (preferably a fluorine atom), and preferably has 1 to 4 carbon atoms. More preferably, it is a C1-C4 perfluoroalkyl group. Specific examples of the alkyl group having a substituent for R ¹ and R ² include CF ₃ , C ₂ F ₅ , C ₃ F ₇ , C ₄ F ₉ , C ₅ F ₁₁ , C ₆ F ₁₃ , and C ₇ F _{15. , C 8 F 17, CH 2} CF 3, CH 2 CH 2 CF 3, CH 2 C 2 F 5, CH 2 CH 2 C 2 F 5, CH 2 C 3 F 7, CH 2 CH 2 C 3 F 7, CH ₂ C ₄ F ₉ and CH ₂ CH ₂ C ₄ F ₉ can be mentioned, among which CF ₃ is preferable.
R ¹ and R ² are preferably a fluorine atom or CF ₃ .

y is preferably 0 to 4, and more preferably 0. x is preferably from 1 to 8, and preferably from 1 to 4. z is preferably 0 to 8, particularly preferably 0 to 4. The divalent linking group of L is not particularly limited, and is —COO—, —OCO—, —CO—, —O—, —S—, —SO—, —SO ₂ —, an alkylene group, a cycloalkylene group, An alkenylene group or a linking group in which a plurality of these groups are linked can be exemplified, and a linking group having a total carbon number of 12 or less is preferred. Among these, —COO—, —OCO—, —CO—, —O—, and —SO ₂ — are preferable, and —COO—, —OCO—, and —SO ₂ — are more preferable.

  The cyclic organic group of A is not particularly limited, and examples thereof include an alicyclic group, an aryl group, and a heterocyclic group (including not only those having an aromatic attribute but also those having no aromatic attribute).

  The alicyclic group may be monocyclic or polycyclic, and may be a monocyclic cycloalkyl group such as a cyclopentyl group, a cyclohexyl group, or a cyclooctyl group, a norbornyl group, a tricyclodecanyl group, a tetracyclodecanyl group, or a tetracyclododecane group. A polycyclic cycloalkyl group such as a nyl group and an adamantyl group is preferred. Among them, an alicyclic group having a bulky structure having 7 or more carbon atoms such as a norbornyl group, a tricyclodecanyl group, a tetracyclodecanyl group, a tetracyclododecanyl group, and an adamantyl group is used in the PEB (post-exposure heating) step. It is preferable from the viewpoint of improving MEEF (mask error enhancement factor) because diffusibility in the film can be suppressed.

  Examples of the aryl group include a benzene ring, a naphthalene ring, a phenanthrene ring, and an anthracene ring. Of these, naphthalene having low absorbance is preferred from the viewpoint of light absorbance at 193 nm.

  Examples of the heterocyclic group include those derived from a furan ring, a thiophene ring, a benzofuran ring, a benzothiophene ring, a dibenzofuran ring, a dibenzothiophene ring, a pyridine ring, and a piperidine ring. Of these, those derived from a furan ring, a thiophene ring, a pyridine ring and a piperidine ring are preferred.

  In addition, examples of the cyclic organic group may include a lactone structure, and specific examples include those represented by the general formulas (LC1-1) to (LC1-17) even if the resin (P) described above has. Lactone structure.

  The cyclic organic group may have a substituent, and examples of the substituent include an alkyl group (which may be linear or branched and preferably have 1 to 12 carbon atoms), a cycloalkyl group. (A monocyclic ring, a polycyclic ring or a spiro ring may be used, preferably having 3 to 20 carbon atoms), aryl group (preferably having 6 to 14 carbon atoms), hydroxyl group, alkoxy group, ester group, amide group, urethane Group, ureido group, thioether group, sulfonamide group, sulfonic acid ester group and the like. The carbon constituting the cyclic organic group (carbon contributing to ring formation) may be a carbonyl carbon.

  Examples of the aliphatic moiety in the aliphatic carboxylate anion include the same alkyl group and cycloalkyl group as in the aliphatic sulfonate anion.

  Examples of the aromatic group in the aromatic carboxylate anion include the same aryl group as in the aromatic sulfonate anion.

  The aralkyl group in the aralkyl carboxylate anion is preferably an aralkyl group having 7 to 12 carbon atoms, such as a benzyl group, a phenethyl group, a naphthylmethyl group, a naphthylethyl group, and a naphthylbutyl group.

  The alkyl group, cycloalkyl group, aryl group and aralkyl group in the aliphatic carboxylate anion, aromatic carboxylate anion and aralkylcarboxylate anion may have a substituent. Examples of the substituent of the alkyl group, cycloalkyl group, aryl group and aralkyl group in the aliphatic carboxylate anion, aromatic carboxylate anion and aralkylcarboxylate anion include, for example, the same halogen atom as in the aromatic sulfonate anion, Examples thereof include an alkyl group, a cycloalkyl group, an alkoxy group, and an alkylthio group.

  Examples of the sulfonylimide anion include saccharin anion.

The alkyl group in the bis (alkylsulfonyl) imide anion and tris (alkylsulfonyl) methide anion is preferably an alkyl group having 1 to 5 carbon atoms, for example, methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, isobutyl. Group, sec-butyl group, pentyl group, neopentyl group and the like. Examples of substituents for these alkyl groups include halogen atoms, alkyl groups substituted with halogen atoms, alkoxy groups, alkylthio groups, alkyloxysulfonyl groups, aryloxysulfonyl groups, cycloalkylaryloxysulfonyl groups, and the like. Alkyl groups substituted with fluorine atoms are preferred.
The two alkyl groups in the bis (alkylsulfonyl) imide anion may be the same or different. Similarly, the plurality of alkyl groups in the tris (alkylsulfonyl) methide anion may be the same or different.
In particular, examples of the bis (alkylsulfonyl) imide anion and tris (alkylsulfonyl) methyl anion include anions represented by the following general formula (A3) or (A4).

In general formulas (A3) and (A4),
Y is an alkylene group substituted with at least one fluorine atom, preferably an alkylene group having 2 to 4 carbon atoms. An oxygen atom may be contained in the alkylene chain. A perfluoroalkylene group having 2 to 4 carbon atoms is more preferable, and a tetrafluoroethylene group, a hexafluoropropylene group, and an octafluorobutylene group are most preferable.
R in the formula (A4) represents an alkyl group or a cycloalkyl group. In addition, the alkylene chain in the alkyl group or cycloalkyl group may contain an oxygen atom.
Specific examples of the compound having an anion represented by the general formula (A3) or (A4) include those described in JP-A-2005-221721.

  Examples of other non-nucleophilic anions include fluorinated phosphorus, fluorinated boron, and fluorinated antimony.

Examples of the non-nucleophilic anion of Z ⁻ include an aliphatic sulfonate anion in which the α-position of the sulfonic acid is substituted with a fluorine atom, an aromatic sulfonate anion substituted with a fluorine atom or a group having a fluorine atom, and an alkyl group. A bis (alkylsulfonyl) imide anion substituted with a fluorine atom and a tris (alkylsulfonyl) methide anion wherein an alkyl group is substituted with a fluorine atom are preferred. The non-nucleophilic anion is more preferably a perfluoroaliphatic sulfonic acid anion having 4 to 8 carbon atoms, a benzenesulfonic acid anion having a fluorine atom, still more preferably a nonafluorobutanesulfonic acid anion, a perfluorooctanesulfonic acid anion, It is a pentafluorobenzenesulfonic acid anion and 3,5-bis (trifluoromethyl) benzenesulfonic acid anion.

Examples of the organic group as R ₂₀₁ , R ₂₀₂ and R ₂₀₃ in the general formula (ZI) include corresponding groups in the compounds (ZI-1) to (ZI-4) described later.

In addition, the compound which has two or more structures represented by general formula (ZI) may be sufficient. For example, the general formula at least one of _R 201 _{to R 203} of a compound represented by (ZI), the structures attached to at least one of _R 201 _{to R 203} of another compound represented by formula (ZI) It may be a compound.

  More preferred (ZI) components include compounds (ZI-1) to (ZI-4) described below.

The compound (ZI-1) is an arylsulfonium compound in which at least one of R _{201 to} R _{203 in} the general formula (ZI) is an aryl group, that is, a compound having arylsulfonium as a cation.

In the arylsulfonium compound, all of R _{201 to} R ₂₀₃ may be an aryl group, or a part of R _{201 to} R ₂₀₃ may be an aryl group, and the rest may be an alkyl group or a cycloalkyl group.

  Examples of the arylsulfonium compound include triarylsulfonium compounds, diarylalkylsulfonium compounds, aryldialkylsulfonium compounds, diarylcycloalkylsulfonium compounds, and aryldicycloalkylsulfonium compounds.

  The aryl group of the arylsulfonium compound is preferably a phenyl group or a naphthyl group, and more preferably a phenyl group. The aryl group may be an aryl group having a heterocyclic structure having an oxygen atom, a nitrogen atom, a sulfur atom or the like. Examples of the heterocyclic structure include pyrrole, furan, thiophene, indole, benzofuran, benzothiophene, and the like. When the arylsulfonium compound has two or more aryl groups, the two or more aryl groups may be the same or different.

  The alkyl group or cycloalkyl group that the arylsulfonium compound has as necessary is preferably a linear or branched alkyl group having 1 to 15 carbon atoms and a cycloalkyl group having 3 to 15 carbon atoms, such as a methyl group, Examples thereof include an ethyl group, a propyl group, an n-butyl group, a sec-butyl group, a t-butyl group, a cyclopropyl group, a cyclobutyl group, and a cyclohexyl group.

The aryl group, alkyl group and cycloalkyl group of R _{201 to} R ₂₀₃ are an alkyl group (for example, 1 to 15 carbon atoms), a cycloalkyl group (for example, 3 to 15 carbon atoms), an aryl group (for example, 6 to 14 carbon atoms). , An alkoxy group (for example, having 1 to 15 carbon atoms), a halogen atom, a hydroxyl group, or a phenylthio group may be substituted. Preferred substituents are linear or branched alkyl groups having 1 to 12 carbon atoms, cycloalkyl groups having 3 to 12 carbon atoms, and linear, branched or cyclic alkoxy groups having 1 to 12 carbon atoms, more preferably carbon. These are an alkyl group having 1 to 4 carbon atoms and an alkoxy group having 1 to 4 carbon atoms. The substituent may be substituted with any one of three R _{201 to} R ₂₀₃ , or may be substituted with all three. When R _{201 to} R ₂₀₃ are an aryl group, the substituent is preferably substituted at the p-position of the aryl group.

Next, the compound (ZI-2) will be described.
Compound (ZI-2) is a compound in which R _{201 to} R ₂₀₃ in formula (ZI) each independently represents an organic group having no aromatic ring. Here, the aromatic ring includes an aromatic ring containing a hetero atom.

The organic group not containing an aromatic ring as R _{201 to} R ₂₀₃ generally has 1 to 30 carbon atoms, preferably 1 to 20 carbon atoms.

R _{201 to} R ₂₀₃ are each independently preferably an alkyl group, a cycloalkyl group, an allyl group, or a vinyl group, more preferably a linear or branched 2-oxoalkyl group, 2-oxocycloalkyl group, alkoxy group. A carbonylmethyl group, particularly preferably a linear or branched 2-oxoalkyl group.

Preferred examples of the alkyl group and cycloalkyl group represented by R _{201 to} R ₂₀₃ include a linear or branched alkyl group having 1 to 10 carbon atoms and a cycloalkyl group having 3 to 10 carbon atoms. More preferred examples of the alkyl group include a 2-oxoalkyl group and an alkoxycarbonylmethyl group. More preferred examples of the cycloalkyl group include a 2-oxocycloalkyl group.

The 2-oxoalkyl group may be either linear or branched, and a group having> C = O at the 2-position of the above alkyl group is preferable.
The 2-oxocycloalkyl group is preferably a group having> C═O at the 2-position of the cycloalkyl group.

  The alkoxy group in the alkoxycarbonylmethyl group is preferably an alkoxy group having 1 to 5 carbon atoms.

R _{201 to} R ₂₀₃ may be further substituted with a halogen atom, an alkoxy group (eg, having 1 to 5 carbon atoms), a hydroxyl group, a cyano group, or a nitro group.

  The compound (ZI-3) is a compound represented by the following general formula (ZI-3), and is a compound having a phenacylsulfonium salt structure.

In General Formula (ZI-3), R _{1c to} R _5c each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, an alkoxy group, a phenyl group, a phenylthio group, or a halogen atom. R _6c and R _7c each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group or an aryl group. R _x and R _y each independently represents an alkyl group, a cycloalkyl group, an allyl group, a 2-oxoalkyl group, a 2-oxocycloalkyl group, an alkoxycarbonylalkyl group, or a vinyl group.

Any two or more of R _{1c to} R _5c , R _6c and R _7c , and R _x and R _y may be bonded to each other to form a ring structure, and this ring structure includes an oxygen atom, a sulfur atom , An ester bond and an amide bond may be included. Examples of the group formed by combining any two or more of R _{1c to} R _5c , R _6c and R _7c , and R _x and R _y include a butylene group and a pentylene group.
Examples of the ring structure include an aromatic or non-aromatic hydrocarbon ring, an aromatic or non-aromatic heterocycle, or a polycyclic fused ring formed by combining two or more of these rings. Examples of the ring structure include 3- to 10-membered rings, preferably 4- to 8-membered rings, and more preferably 5- or 6-membered rings.

Zc ^- represents a non-nucleophilic anion, in the general formula (ZI) Z ^- and include the same non-nucleophilic anion.

The alkyl group as R _{1c to} R _7c may be either linear or branched, for example, an alkyl group having 1 to 20 carbon atoms, preferably a linear or branched alkyl group having 1 to 12 carbon atoms. Examples of the cycloalkyl group include a cycloalkyl group having 3 to 8 carbon atoms.

The alkoxy group as R _{1c to} R _{5c may} be linear, branched or cyclic, for example, an alkoxy group having 1 to 10 carbon atoms, preferably a linear or branched alkoxy group having 1 to 5 carbon atoms. And a cyclic alkoxy group having 3 to 8 carbon atoms. The aryl group as R _6c and R _7c preferably has 5 to 15 carbon atoms, and examples thereof include a phenyl group and a naphthyl group.
When R _6c and R _7c are combined to form a ring, the group formed by combining R _6c and R _7c is preferably an alkylene group having 2 to 10 carbon atoms, such as ethylene group, propylene Group, butylene group, pentylene group, hexylene group and the like. The ring formed by combining R _6c and R _7c may have a hetero atom such as an oxygen atom in the ring.

Preferably, any one of R _{1c to} R _5c is a linear or branched alkyl group, a cycloalkyl group, or a linear, branched or cyclic alkoxy group, and more preferably the sum of carbon numbers of R _{1c to} R _5c. Is 2-15. Thereby, solvent solubility improves more and generation | occurrence | production of a particle is suppressed at the time of a preservation | save.

_Examples of the alkyl group and cycloalkyl group as R _x and R _y include the same alkyl group and cycloalkyl group as those in R _{1c to} R _7c, such as a 2-oxoalkyl group, a 2-oxocycloalkyl group, An alkoxycarbonylmethyl group is more preferred.

Examples of the 2-oxoalkyl group and 2-oxocycloalkyl group include a group having> C═O at the 2-position of the alkyl group or cycloalkyl group as R _{1c to} R _7c .

Examples of the alkoxy group in the alkoxycarbonylalkyl group include the same alkoxy groups as in R _{1c to} R _5c , and examples of the alkyl group include an alkyl group having 1 to 12 carbon atoms, preferably 1 to 1 carbon atom. 5 linear alkyl groups (for example, a methyl group and an ethyl group).
The allyl group is not particularly limited, but is preferably an allyl group which is unsubstituted or substituted with a monocyclic or polycyclic cycloalkyl group.
Although there is no restriction | limiting in particular as a vinyl group, It is preferable that it is a vinyl group substituted by the unsubstituted or monocyclic or polycyclic cycloalkyl group.
As the ring structure that R _x and R _y may be bonded to each other, divalent R _x and R _y (for example, a methylene group, an ethylene group, a propylene group, and the like) are represented by the general formula (ZI-3). A 5-membered or 6-membered ring formed with a sulfur atom, particularly preferably a 5-membered ring (that is, a tetrahydrothiophene ring).

R _x and R _y are preferably an alkyl group or cycloalkyl group having 4 or more carbon atoms, more preferably 6 or more, and still more preferably 8 or more alkyl groups or cycloalkyl groups.

  The compound (ZI-4) is a compound represented by the following general formula (ZI-4).

In general formula (ZI-4),
R ₁₃ represents a hydrogen atom, a fluorine atom, a hydroxyl group, an alkyl group, a cycloalkyl group, an alkoxy group, an alkoxycarbonyl group, or a group having a cycloalkyl group. These groups may have a substituent.
When there are a plurality of R _{14 s,} each independently represents a group having a hydroxyl group, an alkyl group, a cycloalkyl group, an alkoxy group, an alkoxycarbonyl group, an alkylcarbonyl group, an alkylsulfonyl group, a cycloalkylsulfonyl group, or a cycloalkyl group. Represent. These groups may have a substituent.
R ₁₅ each independently represents an alkyl group, a cycloalkyl group or a naphthyl group. Two R ₁₅ may be bonded to each other to form a ring.
l represents an integer of 0-2.
r represents an integer of 0 to 10.
Z ^- represents a non-nucleophilic anion, in the general formula (ZI) Z ^- and include the same non-nucleophilic anion.

In the general formula (ZI-4), the alkyl group of R ₁₃ , R ₁₄ and R ₁₅ is linear or branched and preferably has 1 to 10 carbon atoms, and is preferably a methyl group, an ethyl group, n -Propyl group, i-propyl group, n-butyl group, 2-methylpropyl group, 1-methylpropyl group, t-butyl group, n-pentyl group, neopentyl group, n-hexyl group, n-heptyl group, n -An octyl group, 2-ethylhexyl group, n-nonyl group, n-decyl group etc. can be mentioned. Of these alkyl groups, a methyl group, an ethyl group, an n-butyl group, a t-butyl group, and the like are preferable.
Examples of the cycloalkyl group of R ₁₃ , R ₁₄ and R ₁₅ include monocyclic or polycyclic cycloalkyl groups (preferably cycloalkyl groups having 3 to 20 carbon atoms), and cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl , Cycloheptyl, cyclooctyl, cyclododecanyl, cyclobenenyl, cyclohexenyl, cyclooctadienyl, norbornyl, tricyclodecanyl, tetracyclodecanyl, adamantyl and the like, particularly cyclopropyl, cyclopentyl, cyclohexyl, Cycloheptyl and cyclooctyl are preferred.

The alkoxy group of R ₁₃ and R ₁₄ is linear or branched and preferably has 1 to 10 carbon atoms, such as methoxy group, ethoxy group, n-propoxy group, i-propoxy group, n -Butoxy group, 2-methylpropoxy group, 1-methylpropoxy group, t-butoxy group, n-pentyloxy group, neopentyloxy group, n-hexyloxy group, n-heptyloxy group, n-octyloxy group, 2-ethylhexyloxy group, n-nonyloxy group, n-decyloxy group and the like can be mentioned. Of these alkoxy groups, a methoxy group, an ethoxy group, an n-propoxy group, an n-butoxy group, and the like are preferable.

The alkoxycarbonyl group for R ₁₃ is linear or branched and preferably has 2 to 11 carbon atoms, such as a methoxycarbonyl group, an ethoxycarbonyl group, an n-propoxycarbonyl group, or an i-propoxycarbonyl group. N-butoxycarbonyl group, 2-methylpropoxycarbonyl group, 1-methylpropoxycarbonyl group, t-butoxycarbonyl group, n-pentyloxycarbonyl group, neopentyloxycarbonyl group, n-hexyloxycarbonyl group, n-heptyl Examples thereof include an oxycarbonyl group, an n-octyloxycarbonyl group, a 2-ethylhexyloxycarbonyl group, an n-nonyloxycarbonyl group, and an n-decyloxycarbonyl group. Of these alkoxycarbonyl groups, a methoxycarbonyl group, an ethoxycarbonyl group, an n-butoxycarbonyl group, and the like are preferable.

Examples of the group having a cycloalkyl group of R ₁₃ and R ₁₄ include a monocyclic or polycyclic cycloalkyl group (preferably a cycloalkyl group having 3 to 20 carbon atoms), and examples thereof include a monocyclic or polycyclic cycloalkyl group. Examples thereof include a cycloalkyloxy group and an alkoxy group having a monocyclic or polycyclic cycloalkyl group. These groups may further have a substituent.
The monocyclic or polycyclic cycloalkyloxy group of R ₁₃ and R ₁₄ preferably has a total carbon number of 7 or more, more preferably a total carbon number of 7 or more and 15 or less, and a monocyclic ring It is preferable to have a cycloalkyl group. The monocyclic cycloalkyloxy group having 7 or more carbon atoms is cyclopropyloxy group, cyclobutyloxy group, cyclopentyloxy group, cyclohexyloxy group, cycloptyloxy group, cyclooctyloxy group, cyclododecanyloxy group, etc. Optionally substituted with methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, dodecyl, 2-ethylhexyl, isopropyl, sec-butyl, t -Alkyl group such as butyl group, iso-amyl group, hydroxyl group, halogen atom (fluorine, chlorine, bromine, iodine), nitro group, cyano group, amide group, sulfonamido group, methoxy group, ethoxy group, hydroxyethoxy group, Alkoxy groups such as propoxy group, hydroxypropoxy group, butoxy group, Monocyclic cycloalkyloxy having a substituent such as an alkoxycarbonyl group such as a toxylcarbonyl group, an ethoxycarbonyl group, an acyl group such as a formyl group, an acetyl group or a benzoyl group, an acyloxy group such as an acetoxy group or a butyryloxy group, or a carboxyl group And a group having a total carbon number of 7 or more in combination with an arbitrary substituent on the cycloalkyl group.
Examples of the polycyclic cycloalkyloxy group having 7 or more total carbon atoms include a norbornyloxy group, a tricyclodecanyloxy group, a tetracyclodecanyloxy group, an adamantyloxy group, and the like.

The alkoxy group having a monocyclic or polycyclic cycloalkyl group of R ₁₃ and R ₁₄ preferably has a total carbon number of 7 or more, more preferably a total carbon number of 7 or more and 15 or less, An alkoxy group having a monocyclic cycloalkyl group is preferable. The alkoxy group having a total of 7 or more carbon atoms and having a monocyclic cycloalkyl group is methoxy, ethoxy, propoxy, butoxy, pentyloxy, hexyloxy, heptoxy, octyloxy, dodecyloxy, 2-ethylhexyloxy, isopropoxy, A monocyclic cycloalkyl group that may have the above-mentioned substituents is substituted on an alkoxy group such as sec-butoxy, t-butoxy, iso-amyloxy, etc., and the total carbon number including the substituents is 7 or more Represents things. Examples thereof include a cyclohexylmethoxy group, a cyclopentylethoxy group, a cyclohexylethoxy group, and the like, and a cyclohexylmethoxy group is preferable.
Examples of the alkoxy group having a polycyclic cycloalkyl group having a total carbon number of 7 or more include a norbornyl methoxy group, a norbornyl ethoxy group, a tricyclodecanyl methoxy group, a tricyclodecanyl ethoxy group, a tetracyclo group. A decanyl methoxy group, a tetracyclodecanyl ethoxy group, an adamantyl methoxy group, an adamantyl ethoxy group, etc. are mentioned, A norbornyl methoxy group, a norbornyl ethoxy group, etc. are preferable.
The alkyl group of the alkyl group of R _14, include the same specific examples as the alkyl group as R ₁₃ to R ₁₅ described above.

The alkylsulfonyl group and cycloalkylsulfonyl group of R ₁₄ are linear, branched, or cyclic, and preferably those having 1 to 10 carbon atoms, such as methanesulfonyl group, ethanesulfonyl group, n-propanesulfonyl. Group, n-butanesulfonyl group, tert-butanesulfonyl group, n-pentanesulfonyl group, neopentanesulfonyl group, n-hexanesulfonyl group, n-heptanesulfonyl group, n-octanesulfonyl group, 2-ethylhexanesulfonyl group n -Nonanesulfonyl group, n-decanesulfonyl group, cyclopentanesulfonyl group, cyclohexanesulfonyl group, etc. can be mentioned. Of these alkylsulfonyl groups and cycloalkylsulfonyl groups, a methanesulfonyl group, an ethanesulfonyl group, an n-propanesulfonyl group, an n-butanesulfonyl group, a cyclopentanesulfonyl group, a cyclohexanesulfonyl group, and the like are preferable.

l is preferably 0 or 1, and more preferably 1.
As r, 0-2 are preferable.

Examples of the substituent that each group of R ₁₃ , R ₁₄ , and R ₁₅ may have include a halogen atom (for example, a fluorine atom), a hydroxyl group, a carboxyl group, a cyano group, a nitro group, an alkoxy group, and an alkoxy group. Examples thereof include an alkyl group, an alkoxycarbonyl group, and an alkoxycarbonyloxy group.
Examples of the alkoxy group include methoxy group, ethoxy group, n-propoxy group, i-propoxy group, n-butoxy group, 2-methylpropoxy group, 1-methylpropoxy group, t-butoxy group, cyclopentyloxy group, Examples thereof include a linear, branched or cyclic alkoxy group having 1 to 20 carbon atoms such as a cyclohexyloxy group.
Examples of the alkoxyalkyl group include straight chain having 2 to 21 carbon atoms such as methoxymethyl group, ethoxymethyl group, 1-methoxyethyl group, 2-methoxyethyl group, 1-ethoxyethyl group, and 2-ethoxyethyl group. Examples thereof include a chain, branched or cyclic alkoxyalkyl group.
Examples of the alkoxycarbonyl group include methoxycarbonyl group, ethoxycarbonyl group, n-propoxycarbonyl group, i-propoxycarbonyl group, n-butoxycarbonyl group, 2-methylpropoxycarbonyl group, 1-methylpropoxycarbonyl group, t Examples thereof include linear, branched or cyclic alkoxycarbonyl groups having 2 to 21 carbon atoms such as butoxycarbonyl group, cyclopentyloxycarbonyl group, cyclohexyloxycarbonyl and the like.
Examples of the alkoxycarbonyloxy group include methoxycarbonyloxy group, ethoxycarbonyloxy group, n-propoxycarbonyloxy group, i-propoxycarbonyloxy group, n-butoxycarbonyloxy group, t-butoxycarbonyloxy group, and cyclopentyloxy. Examples thereof include straight-chain, branched or cyclic alkoxycarbonyloxy groups having 2 to 21 carbon atoms such as carbonyloxy group and cyclohexyloxycarbonyloxy group.

As the ring structure that two R ₁₅ may be bonded to each other, a 5- or 6-membered ring, particularly preferably a 5-membered ring (that is, a 5-membered ring together with the sulfur atom in the general formula (ZI-4) (that is, A group that forms a tetrahydrothiophene ring) is desirable. Examples of the substituent for the divalent group include a hydroxyl group, a carboxyl group, a cyano group, a nitro group, an alkyl group, a cycloalkyl group, an alkoxy group, an alkoxyalkyl group, an alkoxycarbonyl group, and an alkoxycarbonyloxy group. Etc. There may be a plurality of substituents for the ring structure, and they may be bonded to each other to form a ring (aromatic or non-aromatic hydrocarbon ring, aromatic or non-aromatic heterocyclic ring, or these A polycyclic fused ring formed by combining two or more rings may be formed.
R ₁₅ in the general formula (ZI-4) is preferably a methyl group, an ethyl group, a divalent group in which two R ₁₅ are bonded to each other to form a tetrahydrothiophene ring structure together with a sulfur atom.
The alkyl group, cycloalkyl group, alkoxy group, or alkoxycarbonyl group of R _13, the alkyl group, cycloalkyl group, alkoxy group, alkylsulfonyl group, and cycloalkylsulfonyl group of R ₁₄ may be substituted as described above. The substituent is preferably a hydroxyl group, an alkoxy group, an alkoxycarbonyl group, or a halogen atom (particularly a fluorine atom).

  Below, the preferable specific example of the cation in the compound represented by general formula (ZI-4) is shown.

In the general formulas (ZII) and (ZIII), R _{204 to} R ₂₀₇ each independently represents an aryl group, an alkyl group, or a cycloalkyl group.

The aryl group for R _{204 to} R ₂₀₇ is preferably a phenyl group or a naphthyl group, and more preferably a phenyl group. The aryl group of R _{204 to} R ₂₀₇ may be an aryl group having a heterocyclic structure having an oxygen atom, a nitrogen atom, a sulfur atom, or the like. Examples of the heterocyclic structure include pyrrole, furan, thiophene, indole, benzofuran, benzothiophene, and the like.

The alkyl group and cycloalkyl group in R _{204 to} R ₂₀₇ preferably include a linear or branched alkyl group having 1 to 10 carbon atoms and a cycloalkyl group having 3 to 10 carbon atoms.

The aryl group, alkyl group, and cycloalkyl group of R _{204 to} R ₂₀₇ may have a substituent. Aryl group, alkyl group of R ₂₀₄ to R _207, the cycloalkyl group substituent which may be possessed by, for example, an alkyl group (for example, 1 to 15 carbon atoms), a cycloalkyl group (for example, 3 to 15 carbon atoms ), An aryl group (for example, having 6 to 15 carbon atoms), an alkoxy group (for example, having 1 to 15 carbon atoms), a halogen atom, a hydroxyl group, and a phenylthio group.
Z ⁻ represents a non-nucleophilic anion, and examples thereof include the same as the non-nucleophilic anion of Z ^{− in} formula (ZI).

  Examples of the acid generator further include compounds represented by the following general formulas (ZIV), (ZV), and (ZVI).

In general formulas (ZIV) to (ZVI), Ar ₃ and Ar ₄ each independently represents an aryl group. R ₂₀₈ , R ₂₀₉ and R ₂₁₀ each independently represents an alkyl group, a cycloalkyl group or an aryl group. A represents an alkylene group, an alkenylene group or an arylene group.
Specific examples of the aryl group of Ar ₃ , Ar ₄ , R ₂₀₈ , R ₂₀₉ and R ₂₁₀ are the same as the specific examples of the aryl group as R ₂₀₁ , R ₂₀₂ and R ₂₀₃ in the general formula (ZI-1). Things can be mentioned.
Specific examples of the alkyl group and cycloalkyl group represented by R ₂₀₈ , R _209, and R ₂₁₀ include specific examples of the alkyl group and cycloalkyl group represented by R ₂₀₁ , R _202, and R ₂₀₃ in the general formula (ZI-2), respectively. The same thing as an example can be mentioned.
The alkylene group of A is alkylene having 1 to 12 carbon atoms (for example, methylene group, ethylene group, propylene group, isopropylene group, butylene group, isobutylene group, etc.), and the alkenylene group of A is 2 to 2 carbon atoms. 12 alkenylene groups (for example, ethynylene group, propenylene group, butenylene group, etc.), and the arylene group of A is an arylene group having 6 to 10 carbon atoms (for example, phenylene group, tolylene group, naphthylene group, etc.) Can be mentioned.

  Among the acid generators, compounds represented by the general formulas (ZI) to (ZIII) are more preferable. Further, the acid generator is preferably a compound that generates an acid having one sulfonic acid group or imide group, more preferably a compound that generates monovalent perfluoroalkanesulfonic acid, or a monovalent fluorine atom or fluorine atom. A compound that generates an aromatic sulfonic acid substituted with a group that contains a monovalent fluorine atom or an imido acid that is substituted with a group containing a fluorine atom, and even more preferably, a fluorinated compound It is a sulfonium salt of a substituted alkanesulfonic acid, a fluorine-substituted benzenesulfonic acid, a fluorine-substituted imide acid or a fluorine-substituted methide acid. The acid generator that can be used is particularly preferably a fluorinated substituted alkane sulfonic acid, a fluorinated substituted benzene sulfonic acid, or a fluorinated substituted imido acid whose pKa of the generated acid is −1 or less, and the sensitivity is improved.

  Among acid generators, particularly preferred examples are given below.

  An acid generator can be used individually by 1 type or in combination of 2 or more types. The content of the acid generator is preferably 0.1 to 20% by mass, more preferably 0.5 to 17% by mass, and still more preferably based on the total solid content of the actinic ray-sensitive or radiation-sensitive resin composition. Is 1 to 15% by mass.

[3] Crosslinking agent (C)
The actinic ray-sensitive or radiation-sensitive resin composition used in the present invention may further contain a compound (hereinafter referred to as a crosslinking agent) that crosslinks the resin (P) by the action of an acid.
The crosslinking agent (C) is a compound having a crosslinkable group capable of crosslinking the resin (P), and preferably a melamine compound, urea compound, alkylene urea compound, or glycoluril compound. It is an agent.

Examples of preferable crosslinking agents include compounds having an N-hydroxymethyl group, an N-alkoxymethyl group, or an N-acyloxymethyl group.
As a compound having an N-hydroxymethyl group, an N-alkoxymethyl group, or an N-acyloxymethyl group, two or more (more preferably 2 to 8) partial structures represented by the following general formula (CLNM-1) are used. ) Is preferred.

In General Formula (CLNM-1), R ^NM1 represents a hydrogen atom, an alkyl group, a cycloalkyl group, or an oxoalkyl group. In general formula (CLNM-1), the alkyl group of R ^NM1 is preferably a linear or branched alkyl group having 1 to 6 carbon atoms. The cycloalkyl group of R ^NM1 is preferably a cycloalkyl group having 5 to 6 carbon atoms. The oxoalkyl group of R ^NM1 is preferably an oxoalkyl group having 3 to 6 carbon atoms, and examples thereof include a β-oxopropyl group, a β-oxobutyl group, a β-oxopentyl group, and a β-oxohexyl group. it can.

  As a more preferable embodiment of the compound having two or more partial structures represented by the general formula (CLNM-1), a urea-based crosslinking agent represented by the following general formula (CLNM-2), the following general formula (CLNM-3) , A glycoluril crosslinking agent represented by the following general formula (CLNM-4), and a melamine crosslinking agent represented by the following general formula (CLNM-5).

In the general formula (CLNM-2),
, Each R ^NM1 independently, are those in formula (CLNM-1) ^at, the same as ^{R NM1.}
R ^NM2 each independently represents a hydrogen atom, an alkyl group (preferably having 1 to 6 carbon atoms), or a cycloalkyl group (preferably having 5 to 6 carbon atoms).

  Specific examples of the urea crosslinking agent represented by the general formula (CLNM-2) include, for example, N, N-di (methoxymethyl) urea, N, N-di (ethoxymethyl) urea, N, N-di (Propoxymethyl) urea, N, N-di (isopropoxymethyl) urea, N, N-di (butoxymethyl) urea, N, N-di (t-butoxymethyl) urea, N, N-di (cyclohexyloxy) And methyl) urea, N, N-di (cyclopentyloxymethyl) urea, N, N-di (adamantyloxymethyl) urea, N, N-di (norbornyloxymethyl) urea and the like.

In the general formula (CLNM-3),
, Each R ^NM1 independently, are those in formula (CLNM-1) ^at, the same as ^{R NM1.}
R ^NM3 each independently represents a hydrogen atom, a hydroxyl group, a linear or branched alkyl group (preferably having 1 to 6 carbon atoms), a cycloalkyl group (preferably having 5 to 6 carbon atoms), an oxoalkyl group (having 3 carbon atoms). To 6), an alkoxy group (preferably having 1 to 6 carbon atoms) or an oxoalkoxy group (preferably having 1 to 6 carbon atoms).
G represents a single bond, an oxygen atom, a sulfur atom, an alkylene group (preferably having 1 to 3 carbon atoms) or a carbonyl group. More specifically, a methylene group, ethylene group, propylene group, 1-methylethylene group, hydroxymethylene group, cyanomethylene group and the like can be mentioned.

  Specific examples of the alkylene urea crosslinking agent represented by the general formula (CLNM-3) include, for example, N, N-di (methoxymethyl) -4,5-di (methoxymethyl) ethylene urea, N, N- Di (ethoxymethyl) -4,5-di (ethoxymethyl) ethyleneurea, N, N-di (propoxymethyl) -4,5-di (propoxymethyl) ethyleneurea, N, N-di (isopropoxymethyl) -4,5-di (isopropoxymethyl) ethylene urea, N, N-di (butoxymethyl) -4,5-di (butoxymethyl) ethylene urea, N, N-di (t-butoxymethyl) -4, 5-di (t-butoxymethyl) ethyleneurea, N, N-di (cyclohexyloxymethyl) -4,5-di (cyclohexyloxymethyl) ethyleneurea, N, N-di (cyclo Nthyloxymethyl) -4,5-di (cyclopentyloxymethyl) ethyleneurea, N, N-di (adamantyloxymethyl) -4,5-di (adamantyloxymethyl) ethyleneurea, N, N-di (nor Bornyloxymethyl) -4,5-di (norbornyloxymethyl) ethyleneurea and the like.

In the general formula (CLNM-4),
, Each R ^NM1 independently, are those in formula (CLNM-1) ^at, the same as ^{R NM1.}
R ^NM4 each independently represents a hydrogen atom, a hydroxyl group, an alkyl group, a cycloalkyl group or an alkoxy group.

R ^NM4 alkyl group (preferably having 1 to 6 carbon atoms), cycloalkyl group (preferably having 5 to 6 carbon atoms), alkoxy group (preferably having 1 to 6 carbon atoms), more specifically, methyl group, Examples include an ethyl group, a butyl group, a cyclopentyl group, a cyclohexyl group, a methoxy group, an ethoxy group, and a butoxy group.

  Specific examples of the glycoluril-based crosslinking agent represented by the general formula (CLNM-4) include, for example, N, N, N, N-tetra (methoxymethyl) glycoluril, N, N, N, N-tetra ( Ethoxymethyl) glycoluril, N, N, N, N-tetra (propoxymethyl) glycoluril, N, N, N, N-tetra (isopropoxymethyl) glycoluril, N, N, N, N-tetra (butoxy) Methyl) glycoluril, N, N, N, N-tetra (t-butoxymethyl) glycoluril, N, N, N, N-tetra (cyclohexyloxymethyl) glycoluril, N, N, N, N-tetra ( Cyclopentyloxymethyl) glycoluril, N, N, N, N-tetra (adamantyloxymethyl) glycoluril, N, N, N, N- Tiger (norbornyloxymethyl) glycoluril, and the like.

In the general formula (CLNM-5),
, Each R ^NM1 independently, are those in formula (CLNM-1) ^at, the same as ^{R NM1.}
R ^NM5 each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or an atomic group represented by the following general formula (CLNM-5 ′).
R ^NM6 represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or an atomic group represented by the following general formula (CLNM-5 ″).

In the general formula (CLNM-5 ′),
R ^NM1 are those in formula (CLNM-1) ^at, the same as ^{R NM1.}
In the general formula (CLNM-5 ″),
R ^NM1 of the general formula are those (CLNM-1) in ^at, the same as ^{R NM1, R NM5} are those formula (CLNM-5) in the same manner as in ^{R NM5.}

Alkyl group R ^NM5 and ^{R NM6} (1 to 6 carbon atoms is preferred), cycloalkyl groups (5 to 6 carbon atoms is preferred), an aryl group (having 6 to 10 carbon atoms is preferred), and more specifically, Examples thereof include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a t-butyl group, a pentyl group, a cyclopentyl group, a hexyl group, a cyclohexyl group, a phenyl group, and a naphthyl group.

  Examples of the melamine crosslinking agent represented by the general formula (CLNM-5) include N, N, N, N, N, N-hexa (methoxymethyl) melamine, N, N, N, N, N, N Hexa (ethoxymethyl) melamine, N, N, N, N, N, N-hexa (propoxymethyl) melamine, N, N, N, N, N, N-hexa (isopropoxymethyl) melamine, N, N , N, N, N, N-hexa (butoxymethyl) melamine, N, N, N, N, N, N-hexa (t-butoxymethyl) melamine, N, N, N, N, N, N-hexa (Cyclohexyloxymethyl) melamine, N, N, N, N, N, N-hexa (cyclopentyloxymethyl) melamine, N, N, N, N, N, N-hexa (adamantyloxymethyl) melamine, N, N , N, N, N, N-hexa ( Rubornyloxymethyl) melamine, N, N, N, N, N, N-hexa (methoxymethyl) acetoguanamine, N, N, N, N, N, N-hexa (ethoxymethyl) acetoguanamine, N, N, N, N, N, N-hexa (propoxymethyl) acetoguanamine, N, N, N, N, N, N-hexa (isopropoxymethyl) acetoguanamine, N, N, N, N, N, N -Hexa (butoxymethyl) acetoguanamine, N, N, N, N, N, N-hexa (t-butoxymethyl) acetoguanamine, N, N, N, N, N, N-hexa (methoxymethyl) benzoguanamine, N, N, N, N, N, N-hexa (ethoxymethyl) benzoguanamine, N, N, N, N, N, N-hexa (propoxymethyl) benzoguanamine, N, N, N, N, N, N Hexa (isopropoxymethyl) benzoguanamine, N, N, N, N, N, N-hexa (butoxymethyl) benzoguanamine, N, N, N, N, N, N-hexa (t-butoxymethyl) benzoguanamine, etc. Can be mentioned.

The groups represented by R ^{NM1 to} R ^NM6 in the general formulas (CLNM-1) to (CLNM-5) may further have a substituent. Examples of the substituent that R ^{NM1 to} R ^NM6 may have include, for example, a halogen atom, a hydroxyl group, a nitro group, a cyano group, a carboxyl group, a cycloalkyl group (preferably having 3 to 20 carbon atoms), and an aryl group (preferably 6 to 14 carbon atoms), alkoxy group (preferably 1 to 20 carbon atoms), cycloalkoxy group (preferably 4 to 20 carbon atoms), acyl group (preferably 2 to 20 carbon atoms), acyloxy group (preferably carbon 2-20) etc. can be mentioned.

The crosslinking agent (C) may be a phenol compound having a benzene ring in the molecule.
The phenolic compound has a molecular weight of 1200 or less, 3 to 5 benzene rings in the molecule, and two or more hydroxymethyl groups or alkoxymethyl groups, and at least any of the hydroxymethyl group and alkoxymethyl group. Phenol derivatives formed by concentrating on these benzene rings or by sorting and binding are preferred. By using such a phenol derivative, the effect of the present invention can be made more remarkable. As the alkoxymethyl group bonded to the benzene ring, those having 6 or less carbon atoms are preferable. Specifically, a methoxymethyl group, an ethoxymethyl group, an n-propoxymethyl group, an i-propoxymethyl group, an n-butoxymethyl group, an i-butoxymethyl group, a sec-butoxymethyl group, and a t-butoxymethyl group are preferable. Furthermore, alkoxy-substituted alkoxy groups such as 2-methoxyethoxy group and 2-methoxy-1-propyl group are also preferable.

The phenol compound is more preferably a phenol compound having two or more benzene rings in the molecule, and is preferably a phenol compound containing no nitrogen atom.
Specifically, it is preferably a phenol compound having 2 to 8 crosslinkable groups per molecule that can crosslink the resin (P), and more preferably 3 to 6 crosslinkable groups.

Among these phenol derivatives, particularly preferable ones are listed below. In the formula, L ^{1 to} L ⁸ represent a crosslinkable group and may be the same or different, and the crosslinkable group preferably represents a hydroxymethyl group, a methoxymethyl group or an ethoxymethyl group.

A commercially available phenol compound can be used, and it can also be synthesized by a known method. For example, a phenol derivative having a hydroxymethyl group is obtained by reacting a phenol compound not having a corresponding hydroxymethyl group (a compound in which L ^{1 to} L ⁸ are hydrogen atoms in the above formula) with formaldehyde in the presence of a base catalyst. be able to. At this time, in order to prevent resinification or gelation, the reaction temperature is preferably 60 ° C. or lower. Specifically, it can be synthesized by the methods described in JP-A-6-282067, JP-A-7-64285 and the like.

  A phenol derivative having an alkoxymethyl group can be obtained by reacting a corresponding phenol derivative having a hydroxymethyl group with an alcohol in the presence of an acid catalyst. At this time, in order to prevent resinification and gelation, the reaction temperature is preferably 100 ° C. or lower. Specifically, it can be synthesized by the method described in EP632003A1 and the like. A phenol derivative having a hydroxymethyl group or an alkoxymethyl group synthesized in this manner is preferable from the viewpoint of stability during storage, but a phenol derivative having an alkoxymethyl group is particularly preferable from the viewpoint of stability during storage. Such a phenol derivative having two or more hydroxymethyl groups or alkoxymethyl groups in total and concentrated on any benzene ring or distributed and bonded may be used alone or in combination of two kinds. A combination of the above may also be used.

The crosslinking agent (C) may be an epoxy compound having an epoxy group in the molecule.
As an epoxy compound, the compound represented by the following general formula (EP2) is mentioned.

In formula (EP2),
R ^{EP1 to} R ^EP3 each independently represent a hydrogen atom, a halogen atom, an alkyl group or a cycloalkyl group, and the alkyl group and the cycloalkyl group may have a substituent. R ^EP1 and R ^EP2 , R ^EP2 and R ^EP3 may be bonded to each other to form a ring structure.
Examples of the substituent that the alkyl group and cycloalkyl group may have include a hydroxyl group, a cyano group, an alkoxy group, an alkylcarbonyl group, an alkoxycarbonyl group, an alkylcarbonyloxy group, an alkylthio group, an alkylsulfone group, and an alkylsulfonyl group. Groups, alkylamino groups, alkylamide groups, and the like.
^QEP represents a single bond or an ^nEP- valent organic group. R ^EP1 to R ^EP3 may be combined to form a ring structure with ^{Q EP} not only with each other but.
n ^EP represents an integer of 2 or more, preferably 2 to 10, more preferably 2 to 6. However, ^nEP is 2 when ^QEP is a single bond.

When ^QEP is an ^nEP- valent organic group, a chain or cyclic saturated hydrocarbon structure (preferably having 2 to 20 carbon atoms) or an aromatic ring structure (preferably having 6 to 30 carbon atoms), or these are ethers and esters , Amides, sulfonamides and the like linked structures are preferred.

  Specific examples of the compound (B) having an epoxy structure are illustrated below, but the present invention is not limited thereto.

In this invention, a crosslinking agent may be used independently and may be used in combination of 2 or more type.
The actinic ray-sensitive or radiation-sensitive resin composition may or may not contain a crosslinking agent, but when it is contained, the content of the crosslinking agent is the total of the actinic ray-sensitive or radiation-sensitive resin composition. 3-15 mass% is preferable on the basis of solid content, More preferably, it is 3.5-12 mass%, More preferably, it is 4-10 mass%.

[4] Crosslinking aid The actinic ray-sensitive or radiation-sensitive resin composition used in the present invention may further contain a crosslinking aid to assist the crosslinking reaction of the resin (P).
The crosslinking aid is preferably a compound having 2 or more hydroxyl groups, more preferably a compound having 2 to 6 hydroxyl groups, and further preferably a compound having 3 or 4 hydroxyl groups. preferable.
The hydroxyl group in the crosslinking aid is preferably an alcoholic hydroxyl group.
The crosslinking aid is preferably a low molecular compound having a molecular weight of 2000 or less, more preferably a low molecular compound having a molecular weight of 1500 or less, and still more preferably a low molecular compound having a molecular weight of 900 or less. Here, the low molecular weight compound in the present invention refers to a compound having an unsaturated bond (so-called polymerizable monomer) by cleaving the unsaturated bond using an initiator and growing the bond in a chain manner. It is not a so-called polymer or oligomer obtained, but a compound having a constant molecular weight of 2000 or less (more preferably 1500 or less, more preferably 900 or less) (a compound having substantially no molecular weight distribution). The molecular weight is usually 100 or more.

The crosslinking aid is preferably a compound represented by the formula L (OH) _p . Here, L is a p-valent hydrocarbon group, and p is an integer of 1 or more.
Examples of the hydrocarbon group as L include a chain or branched hydrocarbon group having 1 to 10 carbon atoms (preferably 3 to 6 carbon atoms) and a cyclic group having 4 to 12 carbon atoms (preferably 6 to 10 carbon atoms). Preferred examples thereof include the following hydrocarbon groups.
p is preferably an integer of 2 to 6, and more preferably an integer of 3 or 4.

  Hereinafter, although the specific example of a crosslinking adjuvant is illustrated, this invention is not limited to these.

In the present invention, the crosslinking aids may be used alone or in combination of two or more.
The actinic ray-sensitive or radiation-sensitive resin composition may or may not contain a crosslinking aid, but when it is contained, the content of the crosslinking aid is the actinic ray-sensitive or radiation-sensitive resin composition. 3 to 15% by mass, preferably 4 to 12% by mass, and more preferably 4 to 10% by mass, based on the total solid content.

[5] Solvent (D)
The actinic ray-sensitive or radiation-sensitive resin composition of the present invention usually contains a solvent.
Solvents that can be used when preparing the actinic ray-sensitive or radiation-sensitive resin composition by dissolving the above components include, for example, alkylene glycol monoalkyl ether carboxylate, alkylene glycol monoalkyl ether, alkyl lactate Esters, alkyl alkoxypropionates, cyclic lactones (preferably having 4 to 10 carbon atoms), monoketone compounds which may contain rings (preferably having 4 to 10 carbon atoms), alkylene carbonates, alkyl alkoxyacetates, alkyl pyruvates, etc. Mention may be made of organic solvents.

Examples of the alkylene glycol monoalkyl ether carboxylate include propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, propylene glycol monomethyl ether propionate, propylene glycol monoethyl Preferred examples include ether propionate, ethylene glycol monomethyl ether acetate, and ethylene glycol monoethyl ether acetate.
Preferred examples of the alkylene glycol monoalkyl ether include propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, ethylene glycol monomethyl ether, and ethylene glycol monoethyl ether.

Preferred examples of the alkyl lactate include methyl lactate, ethyl lactate, propyl lactate and butyl lactate.
Preferred examples of the alkyl alkoxypropionate include ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, methyl 3-ethoxypropionate, and ethyl 3-methoxypropionate.

  Examples of cyclic lactones include β-propiolactone, β-butyrolactone, γ-butyrolactone, α-methyl-γ-butyrolactone, β-methyl-γ-butyrolactone, γ-valerolactone, γ-caprolactone, and γ-octano. Preferred are iclactone and α-hydroxy-γ-butyrolactone.

  Examples of the monoketone compound which may contain a ring include 2-butanone, 3-methylbutanone, pinacolone, 2-pentanone, 3-pentanone, 3-methyl-2-pentanone, 4-methyl-2-pentanone, 2 -Methyl-3-pentanone, 4,4-dimethyl-2-pentanone, 2,4-dimethyl-3-pentanone, 2,2,4,4-tetramethyl-3-pentanone, 2-hexanone, 3-hexanone, 5-methyl-3-hexanone, 2-heptanone, 3-heptanone, 4-heptanone, 2-methyl-3-heptanone, 5-methyl-3-heptanone, 2,6-dimethyl-4-heptanone, 2-octanone, 3-octanone, 2-nonanone, 3-nonanone, 5-nonanone, 2-decanone, 3-decanone, 4-decanone, 5-hexen-2-one 3-penten-2-one, cyclopentanone, 2-methylcyclopentanone, 3-methylcyclopentanone, 2,2-dimethylcyclopentanone, 2,4,4-trimethylcyclopentanone, cyclohexanone, 3- Methylcyclohexanone, 4-methylcyclohexanone, 4-ethylcyclohexanone, 2,2-dimethylcyclohexanone, 2,6-dimethylcyclohexanone, 2,2,6-trimethylcyclohexanone, cycloheptanone, 2-methylcycloheptanone, 3-methyl Preferred is cycloheptanone.

Preferred examples of the alkylene carbonate include propylene carbonate, vinylene carbonate, ethylene carbonate, and butylene carbonate.
Examples of the alkyl alkoxyacetate include 2-methoxyethyl acetate, 2-ethoxyethyl acetate, 2- (2-ethoxyethoxy) ethyl acetate, 3-methoxy-3-methylbutyl acetate, and 1-methoxy-acetate. 2-propyl is preferred.
Preferred examples of the alkyl pyruvate include methyl pyruvate, ethyl pyruvate, and propyl pyruvate.
As a solvent which can be preferably used, a solvent having a boiling point of 130 ° C. or higher under normal temperature and normal pressure can be mentioned. Specifically, cyclopentanone, γ-butyrolactone, cyclohexanone, ethyl lactate, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, ethyl 3-ethoxypropionate, ethyl pyruvate, 2-ethoxyethyl acetate, acetic acid -2- (2-ethoxyethoxy) ethyl and propylene carbonate are mentioned.
In the present invention, the above solvents may be used alone or in combination of two or more.

In this invention, you may use the mixed solvent which mixed the solvent which contains a hydroxyl group in a structure, and the solvent which does not contain a hydroxyl group as an organic solvent.
As the solvent containing a hydroxyl group and the solvent not containing a hydroxyl group, the above-mentioned exemplary compounds can be selected as appropriate, but as the solvent containing a hydroxyl group, alkylene glycol monoalkyl ether, alkyl lactate, etc. are preferable, propylene glycol monomethyl ether, More preferred is ethyl lactate. Further, as the solvent not containing a hydroxyl group, alkylene glycol monoalkyl ether acetate, alkyl alkoxypropionate, monoketone compound which may contain a ring, cyclic lactone, alkyl acetate and the like are preferable, and among these, propylene glycol monomethyl ether Acetate, ethyl ethoxypropionate, 2-heptanone, γ-butyrolactone, cyclohexanone and butyl acetate are particularly preferred, and propylene glycol monomethyl ether acetate, ethyl ethoxypropionate and 2-heptanone are most preferred.
The mixing ratio (mass) of the solvent containing a hydroxyl group and the solvent not containing a hydroxyl group is 1/99 to 99/1, preferably 10/90 to 90/10, more preferably 20/80 to 60/40. . A mixed solvent containing 50% by mass or more of a solvent not containing a hydroxyl group is particularly preferred from the viewpoint of coating uniformity.

  The solvent is preferably a mixed solvent of two or more containing propylene glycol monomethyl ether acetate.

[5] Hydrophobic resin (E)
The actinic ray-sensitive or radiation-sensitive resin composition in the present invention is a hydrophobic resin having at least one of a fluorine atom and a silicon atom (hereinafter referred to as “hydrophobic resin (E)”), particularly when applied to immersion exposure. Or you may contain only "resin (E)." As a result, the hydrophobic resin (E) is unevenly distributed on the surface of the film, and when the immersion medium is water, the static / dynamic contact angle of the resist film surface to water is improved, and the immersion liquid followability is improved. be able to.
The hydrophobic resin (E) is preferably designed to be unevenly distributed at the interface as described above. However, unlike the surfactant, the hydrophobic resin (E) is not necessarily required to have a hydrophilic group in the molecule. There is no need to contribute to uniform mixing.

  The hydrophobic resin (E) typically contains a fluorine atom and / or a silicon atom. The fluorine atom and / or silicon atom in the hydrophobic resin (E) may be contained in the main chain of the resin or may be contained in the side chain.

When the hydrophobic resin (E) contains a fluorine atom, the partial structure having a fluorine atom is a resin having an alkyl group having a fluorine atom, a cycloalkyl group having a fluorine atom, or an aryl group having a fluorine atom. Preferably there is.
The alkyl group having a fluorine atom (preferably having 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms) is a linear or branched alkyl group in which at least one hydrogen atom is substituted with a fluorine atom, and further a fluorine atom It may have a substituent other than.
The cycloalkyl group having a fluorine atom is a monocyclic or polycyclic cycloalkyl group in which at least one hydrogen atom is substituted with a fluorine atom, and may further have a substituent other than a fluorine atom.
Examples of the aryl group having a fluorine atom include those in which at least one hydrogen atom of an aryl group such as a phenyl group or a naphthyl group is substituted with a fluorine atom, and may further have a substituent other than a fluorine atom. .

  Preferred examples of the alkyl group having a fluorine atom, the cycloalkyl group having a fluorine atom, and the aryl group having a fluorine atom include groups represented by the following general formulas (F2) to (F4). The invention is not limited to this.

In general formulas (F2) to (F4),
R _{57 to} R ₆₈ each independently represent a hydrogen atom, a fluorine atom or an alkyl group (straight or branched). However, at least one of R _{57 to} R _61, at least one of R _{62 to} R ₆₄ , and at least one of R _{65 to} R ₆₈ are each independently substituted with a fluorine atom or at least one hydrogen atom. Represents an alkyl group (preferably having 1 to 4 carbon atoms).
R _{57 to} R ₆₁ and R _{65 to} R ₆₇ are preferably all fluorine atoms. R ₆₂ , R ₆₃ and R ₆₈ are preferably an alkyl group (preferably having 1 to 4 carbon atoms) in which at least one hydrogen atom is substituted with a fluorine atom, and preferably a perfluoroalkyl group having 1 to 4 carbon atoms. Further preferred. R ₆₂ and R ₆₃ may be connected to each other to form a ring.

Specific examples of the group represented by the general formula (F2) include a p-fluorophenyl group, a pentafluorophenyl group, and a 3,5-di (trifluoromethyl) phenyl group.
Specific examples of the group represented by the general formula (F3) include trifluoromethyl group, pentafluoropropyl group, pentafluoroethyl group, heptafluorobutyl group, hexafluoroisopropyl group, heptafluoroisopropyl group, hexafluoro (2 -Methyl) isopropyl group, nonafluorobutyl group, octafluoroisobutyl group, nonafluorohexyl group, nonafluoro-t-butyl group, perfluoroisopentyl group, perfluorooctyl group, perfluoro (trimethyl) hexyl group, 2,2 , 3,3-tetrafluorocyclobutyl group, perfluorocyclohexyl group and the like. Hexafluoroisopropyl group, heptafluoroisopropyl group, hexafluoro (2-methyl) isopropyl group, octafluoroisobutyl group, nonafluoro-t-butyl group and perfluoroisopentyl group are preferable, and hexafluoroisopropyl group and heptafluoroisopropyl group are preferable. Further preferred.
Specific examples of the group represented by the general formula (F4) include, for example, —C (CF ₃ ) ₂ OH, —C (C ₂ F ₅ ) ₂ OH, —C (CF ₃ ) (CH ₃ ) OH, -CH _(CF 3) OH and the like, -C _{(CF 3)} 2 OH is preferred.

  The partial structure containing a fluorine atom may be directly bonded to the main chain, and further from the group consisting of an alkylene group, a phenylene group, an ether bond, a thioether bond, a carbonyl group, an ester bond, an amide bond, a urethane bond and a ureylene bond. You may couple | bond with a principal chain through the group selected or the group which combined these 2 or more.

  Suitable examples of the repeating unit having a fluorine atom include those shown below.

In the formula, R ₁₀ and R ₁₁ each independently represent a hydrogen atom, a fluorine atom or an alkyl group. The alkyl group is preferably a linear or branched alkyl group having 1 to 4 carbon atoms, which may have a substituent, and examples of the alkyl group having a substituent include a fluorinated alkyl group. it can.

W _{3 to} W ₆ each independently represents an organic group containing at least one fluorine atom. Specific examples include the atomic groups (F2) to (F4).

  In addition to these, the hydrophobic resin (E) may have a unit as shown below as a repeating unit having a fluorine atom.

In the formula, R _{4 to} R ₇ each independently represents a hydrogen atom, a fluorine atom, or an alkyl group. The alkyl group is preferably a linear or branched alkyl group having 1 to 4 carbon atoms, which may have a substituent, and examples of the alkyl group having a substituent include a fluorinated alkyl group. it can.
However, at least one of R _{4 to} R ₇ represents a fluorine atom. R ₄ and R ₅ or R ₆ and R ₇ may form a ring.
W ₂ represents an organic group containing at least one fluorine atom. Specific examples include the atomic groups (F2) to (F4).
L ₂ represents a single bond or a divalent linking group. Examples of the divalent linking group include a substituted or unsubstituted arylene group, a substituted or unsubstituted alkylene group, a substituted or unsubstituted cycloalkylene group, —O—, —SO ₂ —, —CO—, —N (R )-(Wherein R represents a hydrogen atom or alkyl), —NHSO ₂ — or a divalent linking group in which a plurality of these are combined.
Q represents an alicyclic structure. The alicyclic structure may have a substituent, may be monocyclic, may be polycyclic, and may be bridged in the case of polycyclic. As the monocyclic type, a cycloalkyl group having 3 to 8 carbon atoms is preferable, and examples thereof include a cyclopentyl group, a cyclohexyl group, a cyclobutyl group, and a cyclooctyl group. Examples of the polycyclic type include groups having a bicyclo, tricyclo or tetracyclo structure having 5 or more carbon atoms, and a cycloalkyl group having 6 to 20 carbon atoms is preferable, for example, an adamantyl group, norbornyl group, dicyclopentyl group. , Tricyclodecanyl group, tetocyclododecyl group and the like. A part of carbon atoms in the cycloalkyl group may be substituted with a hetero atom such as an oxygen atom. Particularly preferred examples of Q include a norbornyl group, a tricyclodecanyl group, a tetocyclododecyl group, and the like.

Hereinafter, although the specific example of the repeating unit which has a fluorine atom is shown, this invention is not limited to this.
In specific examples, X ₁ represents a hydrogen atom, —CH ₃ , —F or —CF ₃ . X ₂ represents -F or -CF _3.

The hydrophobic resin (E) may contain a silicon atom. The partial structure having a silicon atom is preferably a resin having an alkylsilyl structure (preferably a trialkylsilyl group) or a cyclic siloxane structure.
Specific examples of the alkylsilyl structure or the cyclic siloxane structure include groups represented by the following general formulas (CS-1) to (CS-3).

In general formulas (CS-1) to (CS-3),
R _{12 to} R ₂₆ each independently represent a linear or branched alkyl group (preferably having 1 to 20 carbon atoms) or a cycloalkyl group (preferably having 3 to 20 carbon atoms).
L < ₃ > -L < ₅ > represents a single bond or a bivalent coupling group. Examples of the divalent linking group include an alkylene group, a phenylene group, an ether bond, a thioether bond, a carbonyl group, an ester bond, an amide bond, a urethane bond, and a urea bond, or a combination of two or more ( Preferably, the total carbon number is 12 or less).
n represents an integer of 1 to 5. n is preferably an integer of 2 to 4.

Hereinafter, although the specific example of the repeating unit which has group represented by general formula (CS-1)-(CS-3) is given, this invention is not limited to this. In specific examples, X ₁ represents a hydrogen atom, —CH ₃ , —F or —CF ₃ .

Furthermore, the hydrophobic resin (E) may have at least one group selected from the following groups (x) to (z).
(X) acid group (y) a group having a lactone structure, an acid anhydride group, or an acid imide group,
(Z) a group decomposable by the action of an acid

Examples of the acid group (x) include a phenolic hydroxyl group, a carboxylic acid group, a fluorinated alcohol group, a sulfonic acid group, a sulfonamide group, a sulfonylimide group, an (alkylsulfonyl) (alkylcarbonyl) methylene group, and an (alkylsulfonyl) (alkyl Carbonyl) imide group, bis (alkylcarbonyl) methylene group, bis (alkylcarbonyl) imide group, bis (alkylsulfonyl) methylene group, bis (alkylsulfonyl) imide group, tris (alkylcarbonyl) methylene group, tris (alkylsulfonyl) A methylene group etc. are mentioned.
Preferred acid groups include fluorinated alcohol groups (preferably hexafluoroisopropanol), sulfonimide groups, and bis (alkylcarbonyl) methylene groups.

The repeating unit having an acid group (x) includes a repeating unit in which an acid group is directly bonded to the main chain of the resin, such as a repeating unit of acrylic acid or methacrylic acid, or a resin having a linking group. Examples include a repeating unit in which an acid group is bonded to the main chain, and a polymerization initiator or chain transfer agent having an acid group can be introduced at the end of the polymer chain at the time of polymerization. preferable. The repeating unit having an acid group (x) may have at least one of a fluorine atom and a silicon atom.
As for content of the repeating unit which has an acid group (x), 1-50 mol% is preferable with respect to all the repeating units in hydrophobic resin (E), More preferably, it is 3-35 mol%, More preferably, it is 5- 20 mol%.

Specific examples of the repeating unit having an acid group (x) are shown below, but the present invention is not limited thereto. In the formula, Rx represents a hydrogen atom, CH ₃ , CF ₃ , or CH ₂ OH.

As the group having a lactone structure, the acid anhydride group, or the acid imide group (y), a group having a lactone structure is particularly preferable.
The repeating unit containing these groups is a repeating unit in which this group is directly bonded to the main chain of the resin, such as a repeating unit of acrylic acid ester and methacrylic acid ester. Alternatively, this repeating unit may be a repeating unit in which this group is bonded to the main chain of the resin via a linking group. Or this repeating unit may be introduce | transduced into the terminal of resin using the polymerization initiator or chain transfer agent which has this group at the time of superposition | polymerization.

  Examples of the repeating unit having a group having a lactone structure include those similar to the repeating unit having a lactone structure described above in the section of the resin (P).

  The content of the repeating unit having a group having a lactone structure, an acid anhydride group, or an acid imide group is preferably 1 to 100 mol% based on all repeating units in the hydrophobic resin, and preferably 3 to 98. It is more preferable that it is mol%, and it is still more preferable that it is 5-95 mol%.

  In the hydrophobic resin (E), examples of the repeating unit having a group (z) that is decomposed by the action of an acid are the same as the repeating unit having an acid-decomposable group listed for the resin (P). The repeating unit having a group (z) that is decomposed by the action of an acid may have at least one of a fluorine atom and a silicon atom. In the hydrophobic resin (E), the content of the repeating unit having a group (z) that decomposes by the action of an acid is preferably 1 to 80 mol% with respect to all the repeating units in the resin (E). Preferably it is 10-80 mol%, More preferably, it is 20-60 mol%.

  The hydrophobic resin (E) may further have a repeating unit represented by the following general formula (III).

In general formula (III):
R _c31 represents a hydrogen atom, an alkyl group (which may be substituted with a fluorine atom or the like), a cyano group, or a —CH ₂ —O—Rac ₂ group. In the formula, Rac ₂ represents a hydrogen atom, an alkyl group or an acyl group. R _c31 is preferably a hydrogen atom, a methyl group, a hydroxymethyl group or a trifluoromethyl group, particularly preferably a hydrogen atom or a methyl group.
R _c32 represents a group having an alkyl group, a cycloalkyl group, an alkenyl group, a cycloalkenyl group or an aryl group. These groups may be substituted with a group containing a fluorine atom or a silicon atom.
L _c3 represents a single bond or a divalent linking group.

In general formula (III), the alkyl group represented by R _c32 is preferably a linear or branched alkyl group having 3 to 20 carbon atoms.
The cycloalkyl group is preferably a cycloalkyl group having 3 to 20 carbon atoms.
The alkenyl group is preferably an alkenyl group having 3 to 20 carbon atoms.
The cycloalkenyl group is preferably a cycloalkenyl group having 3 to 20 carbon atoms.
The aryl group is preferably an aryl group having 6 to 20 carbon atoms, more preferably a phenyl group or a naphthyl group, and these may have a substituent.
R _c32 is preferably an unsubstituted alkyl group or an alkyl group substituted with a fluorine atom.
The divalent linking group of L _c3 is preferably an alkylene group (preferably having 1 to 5 carbon atoms), an ether bond, a phenylene group, or an ester bond (a group represented by —COO—).
The content of the repeating unit represented by the general formula (III) is preferably 1 to 100 mol%, more preferably 10 to 90 mol%, based on all repeating units in the hydrophobic resin. 30 to 70 mol% is more preferable.

  It is also preferable that the hydrophobic resin (E) further has a repeating unit represented by the following general formula (CII-AB).

In the formula (CII-AB),
R _c11 ′ and R _c12 ′ each independently represents a hydrogen atom, a cyano group, a halogen atom or an alkyl group.
Zc ′ represents an atomic group for forming an alicyclic structure containing two bonded carbon atoms (C—C).
The content of the repeating unit represented by the general formula (CII-AB) is preferably 1 to 100 mol%, and preferably 10 to 90 mol%, based on all repeating units in the hydrophobic resin. More preferably, it is more preferably 30 to 70 mol%.

Specific examples of the repeating unit represented by the general formulas (III) and (CII-AB) are shown below, but the present invention is not limited thereto. In the formula, Ra represents H, CH ₃ , CH ₂ OH, CF ₃ or CN.

When the hydrophobic resin (E) has a fluorine atom, the content of the fluorine atom is preferably 5 to 80% by mass with respect to the weight average molecular weight of the hydrophobic resin (E), preferably 10 to 80% by mass. More preferably. Moreover, it is preferable that the repeating unit containing a fluorine atom is 10-100 mol% in all the repeating units contained in hydrophobic resin (E), and it is more preferable that it is 30-100 mol%.
When the hydrophobic resin (E) has a silicon atom, the content of the silicon atom is preferably 2 to 50% by mass, and 2 to 30% by mass with respect to the weight average molecular weight of the hydrophobic resin (E). More preferably. Moreover, it is preferable that the repeating unit containing a silicon atom is 10-100 mol% in all the repeating units contained in hydrophobic resin (E), and it is more preferable that it is 20-100 mol%.

The weight average molecular weight of the hydrophobic resin (E) in terms of standard polystyrene is preferably 1,000 to 100,000, more preferably 1,000 to 50,000, and still more preferably 2,000 to 15,000. is there.
Moreover, the hydrophobic resin (E) may be used alone or in combination.
The content of the hydrophobic resin (E) in the composition is preferably 0.01 to 10% by mass, more preferably 0.05 to 8% by mass, based on the total solid content in the composition of the present invention. More preferably, the content is 1 to 5% by mass.

  The hydrophobic resin (E), like the resin (P), naturally has few impurities such as metals, and the residual monomer and oligomer components are preferably 0.01 to 5% by mass, more preferably. Is more preferably 0.01 to 3% by mass and 0.05 to 1% by mass. As a result, an actinic ray-sensitive or radiation-sensitive resin composition that does not change over time such as foreign matter in liquid or sensitivity can be obtained. The molecular weight distribution (Mw / Mn, also referred to as dispersity) is preferably in the range of 1 to 5, more preferably 1 to 3, and still more preferably from the viewpoints of resolution, resist shape, resist pattern sidewall, roughness, and the like. It is the range of 1-2.

As the hydrophobic resin (E), various commercially available products can be used, and can be synthesized according to a conventional method (for example, radical polymerization). For example, as a general synthesis method, a monomer polymerization method in which a monomer species and an initiator are dissolved in a solvent and heating is performed, and a solution of the monomer species and the initiator is dropped into the heating solvent over 1 to 10 hours. The dropping polymerization method is added, and the dropping polymerization method is preferable.
The reaction solvent, the polymerization initiator, the reaction conditions (temperature, concentration, etc.) and the purification method after the reaction are the same as those described for the resin (P), but in the synthesis of the hydrophobic resin (E), The reaction concentration is preferably 30 to 50% by mass.

  Specific examples of the hydrophobic resin (E) are shown below. The following table shows the molar ratio of repeating units in each resin (corresponding to each repeating unit in order from the left), the weight average molecular weight, and the degree of dispersion.

[7] Surfactant (F)
The actinic ray-sensitive or radiation-sensitive resin composition of the present invention may or may not further contain a surfactant. When it is contained, it contains a fluorine-based and / or silicon-based surfactant (fluorine-based surfactant). , A silicon-based surfactant, a surfactant having both a fluorine atom and a silicon atom), or two or more thereof.

When the composition of the present invention contains the above-described surfactant, it is possible to provide a resist pattern with less adhesion and development defects with good sensitivity and resolution when using an exposure light source of 250 nm or less, particularly 220 nm or less. It becomes.
Examples of the fluorine-based and / or silicon-based surfactant include surfactants described in [0276] of US Patent Application Publication No. 2008/0248425. For example, F-top EF301, EF303, (Shin-Akita Kasei Co., Ltd.) )), FLORARD FC430, 431, 4430 (manufactured by Sumitomo 3M Co., Ltd.), MegaFac F171, F173, F176, F189, F113, F110, F177, F120, R08 (manufactured by Dainippon Ink & Chemicals, Inc.), Surflon S-382, SC101, 102, 103, 104, 105, 106 (manufactured by Asahi Glass Co., Ltd.), Troisol S-366 (manufactured by Troy Chemical Co., Ltd.), GF-300, GF-150 (Toagosei Chemical Co., Ltd.) ), Surflon S-393 (Seimi Chemical Co., Ltd.), F-top EF121, E 122A, EF122B, RF122C, EF125M, EF135M, EF351, EF352, EF801, EF802, EF601 (manufactured by Gemco), PF636, PF656, PF6320, PF6520 (manufactured by OMNOVA), FTX-204G, 230G, 218G, 218G 204D, 208D, 212D, 218D, 222D (manufactured by Neos Co., Ltd.) and the like. Polysiloxane polymer KP-341 (manufactured by Shin-Etsu Chemical Co., Ltd.) can also be used as a silicon-based surfactant.

In addition to the known surfactants described above, surfactants are derived from fluoroaliphatic compounds produced by the telomerization method (also referred to as the telomer method) or the oligomerization method (also referred to as the oligomer method). A surfactant using a polymer having a fluoroaliphatic group can be used. The fluoroaliphatic compound can be synthesized by the method described in JP-A-2002-90991.
As the surfactant corresponding to the above, Megafac F178, F-470, F-473, F-475, F-476, F-472 (manufactured by Dainippon Ink & Chemicals, Inc.), C ₆ F ₁₃ group Copolymer of acrylate (or methacrylate) and (poly (oxyalkylene)) acrylate (or methacrylate), acrylate (or methacrylate) and (poly (oxyethylene)) acrylate (or methacrylate) having a C ₃ F ₇ group And a copolymer of (poly (oxypropylene)) acrylate (or methacrylate).

  In the present invention, surfactants other than fluorine-based and / or silicon-based surfactants described in [0280] of US Patent Application Publication No. 2008/0248425 can also be used.

  These surfactants may be used alone or in several combinations.

The actinic ray-sensitive or radiation-sensitive resin composition may or may not contain a surfactant, but when it is contained, the amount of the surfactant used is the actinic ray-sensitive or radiation-sensitive resin composition. Is preferably 0.0001 to 2% by mass, more preferably 0.0005 to 1% by mass, based on the total amount of (excluding the solvent).
On the other hand, when the amount of the surfactant added is 10 ppm or less with respect to the total amount of the actinic ray-sensitive or radiation-sensitive resin composition (excluding the solvent), the surface unevenness of the hydrophobic resin is increased. As a result, the surface of the resist film can be made more hydrophobic, and the water followability during immersion exposure can be improved.

[8] Basic Compound The actinic ray-sensitive or radiation-sensitive resin composition of the present invention may contain a basic compound in order to reduce the change in performance over time from exposure to heating.
Specific examples of such basic compounds include basic compounds having structures represented by the following general formulas (A) to (E).

Here, R ²⁵⁰ , R ²⁵¹ and R ²⁵² are each independently a hydrogen atom, an alkyl group (preferably having 1 to 20 carbon atoms), a cycloalkyl group (preferably having 3 to 20 carbon atoms) or an aryl group (preferably 6 to 20), and R ²⁵⁰ and R ²⁵¹ may be bonded to each other to form a ring (R ²⁵⁰ and R ²⁵¹ are bonded to each other through a hetero atom such as an oxygen atom). To form a ring).
These groups may have a substituent. Examples of such a substituent include an alkyl group, a cycloalkyl group, an alkoxy group, an aryloxy group, an alkylcarbonyloxy group, an alkoxyalkyl group, and an aryloxyalkyl group. These may contain one or more atoms selected from an oxygen atom, a sulfur atom, a nitrogen atom and the like in the alkyl chain.
Examples of the alkyl group having a substituent and the cycloalkyl group having a substituent include an aminoalkyl group having 1 to 20 carbon atoms, an aminocycloalkyl group having 3 to 20 carbon atoms, a hydroxyalkyl group having 1 to 20 carbon atoms, or a carbon number. 3-20 hydroxycycloalkyl groups are preferred.
Preferable examples of the aryl group having a substituent include an aryl group having one or more alkyl groups as a substituent.

In the formula, R ²⁵³ , R ²⁵⁴ , R ²⁵⁵ and R ²⁵⁶ each independently represent an alkyl group (preferably having 1 to 6 carbon atoms) or a cycloalkyl group (preferably having 3 to 6 carbon atoms).

  Preferable compounds include guanidine, aminopyrrolidine, pyrazole, pyrazoline, piperazine, aminomorpholine, aminoalkylmorpholine, and piperidine, and may have a substituent. Further preferable compounds include an imidazole structure, a diazabicyclo structure, an onium hydroxide structure (particularly preferably, a tetraalkylammonium hydroxide such as tetrabutylammonium hydroxide), an onium carboxylate structure, a trialkylamine structure, an aniline structure, or a pyridine structure. A compound having a hydroxyl group and / or an ether bond, an aniline derivative having a hydroxyl group and / or an ether bond, and the like.

  Further, at least one nitrogen-containing compound selected from an amine compound having a phenoxy group, an ammonium salt compound having a phenoxy group, an amine compound having a sulfonic acid ester group, and an ammonium salt compound having a sulfonic acid ester group can be exemplified. . Examples of these compounds include, but are not limited to, compounds (C1-1) to (C3-3) exemplified in [0066] of US Patent Application Publication No. 2007/02245539. It is not a thing.

  Further, as one kind of basic compound, a nitrogen-containing organic compound having a group capable of leaving by the action of an acid can also be used. As an example of this compound, the compound represented by the following general formula (F) can be mentioned, for example. In addition, the compound represented by the following general formula (F) exhibits effective basicity in the system when a group capable of leaving by the action of an acid is eliminated.

In General Formula (F), R _a independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group. When n = 2, two R _{a s} may be the same or different, and the two R _a are bonded to each other to form a divalent heterocyclic hydrocarbon group (preferably having a carbon number of 20 or less) or A derivative thereof may be formed.
R _b independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group or an aralkyl group. However, in -C ( _Rb ) ( _Rb ) ( _Rb ), when one or more _Rb is a hydrogen atom, at least one of the remaining _Rb is a cyclopropyl group or a 1-alkoxyalkyl group. .
At least two R _b may be bonded to form an alicyclic hydrocarbon group, an aromatic hydrocarbon group, a heterocyclic hydrocarbon group or a derivative thereof.
n represents an integer of 0 to 2, m represents an integer of 1 to 3, and n + m = 3.

In general formula (F), the alkyl group, cycloalkyl group, aryl group and aralkyl group represented by R _a and R _b are functional groups such as a hydroxyl group, a cyano group, an amino group, a pyrrolidino group, a piperidino group, a morpholino group and an oxo group. It may be substituted with a group, an alkoxy group or a halogen atom.
As the alkyl group, cycloalkyl group, aryl group or aralkyl group of R (these alkyl group, cycloalkyl group, aryl group and aralkyl group may be substituted with the above functional group, alkoxy group or halogen atom) Is
For example, a group derived from a linear or branched alkane such as methane, ethane, propane, butane, pentane, hexane, heptane, octane, nonane, decane, undecane, dodecane, etc., a group derived from these alkanes, for example, A group substituted with one or more cycloalkyl groups such as a cyclobutyl group, a cyclopentyl group, and a cyclohexyl group,
Groups derived from cycloalkanes such as cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, norbornane, adamantane, noradamantane, groups derived from these cycloalkanes, for example, methyl group, ethyl group, n-propyl group, a group substituted with one or more linear or branched alkyl groups such as i-propyl group, n-butyl group, 2-methylpropyl group, 1-methylpropyl group, t-butyl group and the like,
Groups derived from aromatic compounds such as benzene, naphthalene, anthracene, etc., and groups derived from these aromatic compounds are, for example, methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, 2 A group substituted with one or more linear or branched alkyl groups such as -methylpropyl group, 1-methylpropyl group, t-butyl group, and the like;
Groups derived from heterocyclic compounds such as pyrrolidine, piperidine, morpholine, tetrahydrofuran, tetrahydropyran, indole, indoline, quinoline, perhydroquinoline, indazole, benzimidazole, and groups derived from these heterocyclic compounds are linear or branched A group substituted with one or more groups derived from an alkyl group or aromatic compound, a group derived from a linear or branched alkane, a group derived from a cycloalkane, a phenyl group, a naphthyl group A group substituted with one or more groups derived from an aromatic compound such as an anthracenyl group or the like, or the above substituent is a hydroxyl group, a cyano group, an amino group, a pyrrolidino group, a piperidino group, a morpholino group, an oxo group And a group substituted with a functional group such as.

Examples of the divalent heterocyclic hydrocarbon group (preferably having a carbon number of 1 to 20) or a derivative thereof formed by bonding of R _a to each other include, for example, pyrrolidine, piperidine, morpholine, 1, 4, 5,6-tetrahydropyrimidine, 1,2,3,4-tetrahydroquinoline, 1,2,3,6-tetrahydropyridine, homopiperazine, 4-azabenzimidazole, benzotriazole, 5-azabenzotriazole, 1H-1 , 2,3-triazole, 1,4,7-triazacyclononane, tetrazole, 7-azaindole, indazole, benzimidazole, imidazo [1,2-a] pyridine, (1S, 4S)-(+)- 2,5-diazabicyclo [2.2.1] heptane, 1,5,7-triazabicyclo [4.4.0] dec-5-ene Derived from heterocyclic compounds such as, indole, indoline, 1,2,3,4-tetrahydroquinoxaline, perhydroquinoline, 1,5,9-triazacyclododecane, etc. Groups derived from linear or branched alkanes, groups derived from cycloalkanes, groups derived from aromatic compounds, groups derived from heterocyclic compounds, hydroxyl groups, cyano groups, amino groups, pyrrolidino groups, piperidino groups And groups substituted with one or more functional groups such as a group, a morpholino group and an oxo group.

  Specifically shown in the present invention are particularly preferred examples: Nt-butoxycarbonyldi-n-octylamine, Nt-butoxycarbonyldi-n-nonylamine, Nt-butoxycarbonyldi-n-decylamine, Nt-butoxycarbonyldicyclohexylamine, Nt-butoxycarbonyl-1-adamantylamine, Nt-butoxycarbonyl-2-adamantylamine, Nt-butoxycarbonyl-N-methyl-1-adamantylamine, ( S)-(−)-1- (t-butoxycarbonyl) -2-pyrrolidinemethanol, (R)-(+)-1- (t-butoxycarbonyl) -2-pyrrolidinemethanol, Nt-butoxycarbonyl- 4-hydroxypiperidine, Nt-butoxycarbonylpyrrolidine, Nt-butoxy Rubonylmorpholine, Nt-butoxycarbonylpiperazine, N, N-di-t-butoxycarbonyl-1-adamantylamine, N, N-di-t-butoxycarbonyl-N-methyl-1-adamantylamine, Nt -Butoxycarbonyl-4,4'-diaminodiphenylmethane, N, N'-di-t-butoxycarbonylhexamethylenediamine, N, N, N'N'-tetra-t-butoxycarbonylhexamethylenediamine, N, N ' -Di-t-butoxycarbonyl-1,7-diaminoheptane, N, N'-di-t-butoxycarbonyl-1,8-diaminooctane, N, N'-di-t-butoxycarbonyl-1,9- Diaminononane, N, N′-di-t-butoxycarbonyl-1,10-diaminodecane, N, N′-di-t-butoxy Carbonyl-1,12-diaminododecane, N, N′-di-t-butoxycarbonyl-4,4′-diaminodiphenylmethane, Nt-butoxycarbonylbenzimidazole, Nt-butoxycarbonyl-2-methylbenzimidazole Nt-butoxycarbonyl-2-phenylbenzimidazole and the like.

The compound represented by the general formula (F) may be a commercially available compound, or may be synthesized from a commercially available amine by the method described in Protective Groups in Organic Synthesis Fourth Edition. Further, the synthesis can be performed according to the method described in JP2009-199021A. As the most general method, there is a method obtained by reacting a dicarbonate or haloformate with a commercially available amine. In the formula, X represents a halogen atom. R _a and R _b have the same meaning as in formula (F).

  The molecular weight of the basic compound is preferably 250 to 2000, and more preferably 400 to 1000. From the viewpoint of further reducing LWR, the molecular weight of the basic compound is preferably 400 or more, more preferably 500 or more, and even more preferably 600 or more.

These basic compounds are used alone or in combination of two or more.
When the basic compound is contained, the content thereof is preferably 0.05 to 8.0% by mass, more preferably based on the total solid content of the actinic ray-sensitive or radiation-sensitive resin composition. It is 0.05-5.0 mass%, Most preferably, it is 0.05-4.0 mass%.

[9] Basic compound or ammonium salt compound whose basicity is reduced by irradiation with actinic rays or radiation The actinic ray-sensitive or radiation-sensitive resin composition of the present invention is reduced in basicity by irradiation with actinic rays or radiation. A basic compound or an ammonium salt compound (hereinafter also referred to as “compound (PA)”) may be contained.

  The compound (PA) is preferably a compound (PA ′) having a basic functional group or an ammonium group and a group capable of generating an acidic functional group upon irradiation with actinic rays or radiation. That is, the compound (PA) is a basic compound having a basic functional group and a group capable of generating an acidic functional group upon irradiation with active light or radiation, or an acidic functional group upon irradiation with an ammonium group and active light or radiation. An ammonium salt compound having a group to be generated is preferable.

Preferable partial structures of basic functional groups include, for example, the structures of crown ethers, primary to tertiary amines, and nitrogen-containing heterocyclic rings (pyridine, imidazole, pyrazine, etc.).
Preferable partial structures of the ammonium group include, for example, primary to tertiary ammonium, pyridinium, imidazolinium, pyrazinium structures and the like.
In addition, as a basic functional group, the functional group which has a nitrogen atom is preferable, and the structure which has a 1-3 primary amino group, or a nitrogen-containing heterocyclic structure is more preferable. In these structures, it is preferable from the viewpoint of improving basicity that all atoms adjacent to the nitrogen atom contained in the structure are carbon atoms or hydrogen atoms. From the viewpoint of improving basicity, it is preferable that an electron-withdrawing functional group (such as a carbonyl group, a sulfonyl group, a cyano group, or a halogen atom) is not directly connected to the nitrogen atom.

In the present invention, the decrease in basicity upon irradiation with actinic rays or radiation means that the acceptor property to protons (acids generated by irradiation with actinic rays or radiation) of compound (PA) upon irradiation with actinic rays or radiation. Means lower. The acceptor property decreases when an equilibrium reaction occurs in which a non-covalent complex that is a proton adduct is formed from a compound having a basic functional group and a proton, or the counter cation of a compound having an ammonium group is exchanged for a proton. This means that when an equilibrium reaction occurs, the equilibrium constant at that chemical equilibrium decreases.
Thus, the compound (PA) whose basicity is reduced by irradiation with actinic rays or radiation is contained in the resist film, so that the acceptor property of the compound (PA) is sufficiently expressed in the unexposed area. In addition, it is possible to suppress unintentional reaction between the acid diffused from the exposed portion or the like and the resin (P), and in the exposed portion, the acceptor property of the compound (PA) is reduced, so that the acid and the resin (P) It is presumed that the intended reaction of the above occurs more surely and that a pattern excellent in line width variation (LWR), focus margin (DOF) and pattern shape can be obtained due to the contribution of such an action mechanism.
In addition, basicity can be confirmed by performing pH measurement, and it is also possible to calculate a calculated value with commercially available software.

Specific examples of the compound (PA) whose basicity is lowered by irradiation with actinic rays or radiation include those described in, for example, JP-A-2006-208781 and JP-A-2006-330098.
Hereinafter, although the specific example of a compound (PA) is given, this invention is not limited to this.

  These compounds are synthesized from acids corresponding to the above compounds or lithium, sodium and potassium salts thereof and hydroxides, bromides and chlorides of iodonium or sulfonium, etc. It can be easily synthesized using the salt exchange method described in JP-A-246786. Further, the synthesis method described in JP-A-7-333851 can also be applied.

  Moreover, although the specific example of a compound (PA) is given, this invention is not limited to this.

These compounds can be easily synthesized by using a general sulfonic acid esterification reaction or sulfonamidation reaction.
The molecular weight of the compound (PA) is preferably 500 to 1000.

The content of the compound (PA) is preferably 0.1 to 20% by mass, more preferably 0.1 to 10% by mass, based on the solid content of the actinic ray-sensitive or radiation-sensitive resin composition.
Compound (PA) may be used alone or in combination of two or more. In addition, compound (PA) may be used in combination with the aforementioned basic compound.

[10] Other additives The actinic ray-sensitive or radiation-sensitive resin composition of the present invention may further include a dye, a plasticizer, a photosensitizer, a light absorber, a dissolution inhibitor, and a dissolution accelerator, as necessary. An agent or the like can be contained.

The total solid content concentration of the actinic ray-sensitive or radiation-sensitive resin composition of the present invention is usually 1.0 to 10% by mass, preferably 2.0 to 5.7% by mass, and more preferably 2. It is 0-5.3 mass%. By setting the solid content concentration within the above range, it is possible to uniformly apply the resist solution on the substrate and to form a resist pattern having excellent line edge roughness. The reason for this is not clear, but perhaps the solid content concentration is 10% by mass or less, preferably 5.7% by mass or less, which suppresses aggregation of the material in the resist solution, particularly the photoacid generator. As a result, it is considered that a uniform resist film can be formed.
The solid content concentration is a mass percentage of the mass of other resist components excluding the solvent with respect to the total mass of the actinic ray-sensitive or radiation-sensitive resin composition.

[11] Pattern Forming Method The pattern forming method of the present invention (negative pattern forming method)
(A) a step of forming a film with an actinic ray-sensitive or radiation-sensitive resin composition;
(A) a step of exposing the film, and (c) a step of developing using a developer containing an organic solvent,
At least.
The resist film is formed from the actinic ray-sensitive or radiation-sensitive resin composition of the present invention described above, and more specifically, is preferably formed on a substrate. In the pattern forming method of the present invention, the step of forming a film of a resist composition on the substrate, the step of exposing the film, and the developing step can be performed by generally known methods.
The pattern of the present invention is formed by the pattern forming method of the present invention.

It is also preferable to include a preheating step (PB; Prebake) after the film formation and before the exposure step.
It is also preferable to include a post-exposure heating step (PEB; Post Exposure Bake) after the exposure step and before the development step.
The heating temperature is preferably 70 to 120 ° C., more preferably 80 to 110 ° C. for both PB and PEB.
The heating time is preferably 30 to 300 seconds, more preferably 30 to 180 seconds, and still more preferably 30 to 90 seconds.
Heating can be performed by means provided in a normal exposure / developing machine, and may be performed using a hot plate or the like.
The reaction of the exposed part is promoted by baking, and the sensitivity and pattern profile are improved.

Is not limited to the light source wavelength used for the exposure apparatus in the present invention, KrF excimer laser wavelength (248 nm), ArF excimer laser wavelength (193 nm), can be applied _{F 2} excimer laser wavelength (157 nm) or the like.

The resist film of the present invention may be exposed (immersion exposure) by filling a liquid (immersion medium) having a higher refractive index than air between the film and the lens during irradiation with actinic rays or radiation. . Thereby, resolution can be improved. As the immersion medium to be used, any liquid can be used as long as it has a higher refractive index than air, but pure water is preferred.
In this case, the above-mentioned hydrophobic resin may be added to the resist composition in advance, or after forming the resist film, an immersion liquid hardly soluble film (hereinafter referred to as “top coat”) is formed on the resist film. May be provided).
The performance required for the top coat and how to use it are explained in chapter 7 of CM Publishing “Immersion Lithography Processes and Materials”.
From the viewpoint of transparency to a laser having a wavelength of 193 nm, the top coat is preferably a polymer that does not contain abundant aromatics. Specifically, the polymer is a hydrocarbon polymer, an acrylate polymer, polymethacrylic acid, polyacrylic acid, polyvinyl. Examples include ethers, silicon-containing polymers, fluorine-containing polymers. The aforementioned hydrophobic resin (E) is also suitable as a top coat. Commercially available top coat materials can also be used as appropriate.
When the topcoat is peeled after exposure, a developer may be used, or a separate release agent may be used. As the release agent, a solvent having low penetration into the film is preferable. From the viewpoint that the peeling step can be performed simultaneously with the development processing step of the film, it is preferable that the peeling step can be performed with a developer.
In the present invention, the substrate on which the film is formed is not particularly limited, and silicon, SiN, inorganic substrates such as SiO ₂ and SiN, coated inorganic substrates such as SOG, semiconductor manufacturing processes such as IC, liquid crystal, and thermal head For example, a substrate generally used in a circuit board manufacturing process or other photofabrication lithography process can be used. Further, if necessary, an organic antireflection film may be formed between the film and the substrate.

・ Development process As an organic developer that can be used when developing with a developer containing an organic solvent, a polar solvent such as a ketone solvent, an ester solvent, an alcohol solvent, an amide solvent, or an ether solvent, or A developer containing a hydrocarbon solvent can be used, and preferably contains at least one organic solvent selected from ketone solvents, ester solvents, alcohol solvents, amide solvents and ether solvents. .

Examples of the ketone solvent include 1-octanone, 2-octanone, 1-nonanone, 2-nonanone, acetone, 4-heptanone, 1-hexanone, 2-hexanone, diisobutyl ketone, cyclohexanone, methylcyclohexanone, phenylacetone, and methyl ethyl ketone. And methyl isobutyl ketone, acetylacetone, acetonylacetone, ionone, diacetonyl alcohol, acetylcarbinol, acetophenone, methyl naphthyl ketone, methyl amyl ketone, isophorone, propylene carbonate, and the like.
Examples of ester solvents include methyl acetate, butyl acetate, ethyl acetate, isopropyl acetate, pentyl acetate, isopentyl acetate, amyl acetate, propylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol monoethyl. Examples include ether acetate, ethyl-3-ethoxypropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, methyl formate, ethyl formate, butyl formate, propyl formate, ethyl lactate, butyl lactate, and propyl lactate. be able to. In particular, alkyl acetates such as methyl acetate, butyl acetate, ethyl acetate, isopropyl acetate, and amyl acetate are preferred.
Examples of the alcohol solvent include methyl alcohol, ethyl alcohol, n-propyl alcohol, isopropyl alcohol, n-butyl alcohol, sec-butyl alcohol, tert-butyl alcohol, isobutyl alcohol, n-hexyl alcohol, 4-methyl-2. -Alcohols such as pentanol, n-heptyl alcohol, n-octyl alcohol, n-decanol; glycol solvents such as ethylene glycol, diethylene glycol, triethylene glycol; ethylene glycol monomethyl ether, propylene glycol monomethyl ether, ethylene glycol mono Ethyl ether, propylene glycol monoethyl ether, diethylene glycol monomethyl ether, triethylene glycol monoethyl Ether, may be mentioned glycol monoethyl ether and methoxymethyl butanol.
Examples of the ether solvent include dioxane, tetrahydrofuran and the like in addition to the glycol ether solvent.
Examples of the amide solvent include N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, hexamethylphosphoric triamide, 1,3-dimethyl-2-imidazolidinone and the like. Can be used.
Examples of the hydrocarbon solvent include aromatic hydrocarbon solvents such as toluene and xylene, and aliphatic hydrocarbon solvents such as pentane, hexane, octane and decane.

A plurality of the above solvents may be mixed, or may be used by mixing with a solvent other than the above or water within the range having performance. However, in order to fully exhibit the effects of the present invention, the water content of the developer as a whole is preferably less than 10% by mass, and more preferably substantially free of moisture.
That is, the amount of the organic solvent used with respect to the developer is preferably 90% by mass or more and 100% by mass or less, and more preferably 95% by mass or more and 100% by mass or less with respect to the total amount of the developer.
In particular, the developer containing an organic solvent is preferably a developer containing at least one solvent selected from ketone solvents, ester solvents, alcohol solvents, amide solvents, and ether solvents.

The vapor pressure of the developer containing the organic solvent is preferably 5 kPa or less, more preferably 3 kPa or less, and particularly preferably 2 kPa or less at 20 ° C. By setting the vapor pressure of the developing solution to 5 kPa or less, evaporation of the developing solution on the substrate or in the developing cup is suppressed, temperature uniformity in the wafer surface is improved, and as a result, dimensional uniformity in the wafer surface is improved. It improves.
Specific examples having a vapor pressure of 5 kPa or less include 1-octanone, 2-octanone, 1-nonanone, 2-nonanone, 4-heptanone, 2-hexanone, diisobutyl ketone, cyclohexanone, methylcyclohexanone, phenylacetone, methyl Ketone solvents such as amyl ketone and methyl isobutyl ketone, butyl acetate, pentyl acetate, isopentyl acetate, amyl acetate, propylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl- 3-ethoxypropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, butyl formate, propyl formate Ester solvents such as ethyl lactate, butyl lactate, propyl lactate, n-propyl alcohol, isopropyl alcohol, n-butyl alcohol, sec-butyl alcohol, tert-butyl alcohol, isobutyl alcohol, n-hexyl alcohol, 4-methyl-2- Alcohol solvents such as pentanol, n-heptyl alcohol, n-octyl alcohol, n-decanol, glycol solvents such as ethylene glycol, diethylene glycol, triethylene glycol, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, ethylene glycol mono Ethyl ether, propylene glycol monoethyl ether, diethylene glycol monomethyl ether, triethylene glycol monoethyl ether Glycol ether solvents such as methoxymethylbutanol, ether solvents such as tetrahydrofuran, amide solvents such as N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, aromatics such as toluene and xylene Examples thereof include hydrocarbon solvents, and aliphatic hydrocarbon solvents such as octane and decane.
Specific examples having a vapor pressure of 2 kPa or less, which is a particularly preferable range, include 1-octanone, 2-octanone, 1-nonanone, 2-nonanone, 4-heptanone, 2-hexanone, diisobutyl ketone, cyclohexanone, and methylcyclohexanone. , Ketone solvents such as phenylacetone, methyl amyl ketone, butyl acetate, pentyl acetate, isopentyl acetate, amyl acetate, propylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl -3-Ethoxypropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, ethyl lactate, butyl lactate, milk Ester solvents such as propyl, n-butyl alcohol, sec-butyl alcohol, tert-butyl alcohol, isobutyl alcohol, n-hexyl alcohol, 4-methyl-2-pentanol, n-heptyl alcohol, n-octyl alcohol, n- Alcohol solvents such as decanol, glycol solvents such as ethylene glycol, diethylene glycol, triethylene glycol, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monoethyl ether, diethylene glycol monomethyl ether, triethylene Glycol ether solvents such as glycol monoethyl ether and methoxymethylbutanol, N-methyl-2-pyro Don, N, N- dimethylacetamide, N, N-dimethylformamide amide solvents, aromatic hydrocarbon solvents such as xylene, octane, aliphatic hydrocarbon solvents decane.

-Surfactant A proper quantity of surfactant can be added to a developing solution as needed.
As the surfactant, the same surfactants as those used in the resist composition described above can be used.
The amount of the surfactant used is usually 0.001 to 5% by mass, preferably 0.005 to 2% by mass, and more preferably 0.01 to 0.5% by mass with respect to the total amount of the developer.

・ Resin (A ')
The developer containing the organic solvent and the rinse liquid described later may contain a resin (A ′) that is soluble in the organic solvent. Accordingly, it is estimated that the resin (A ′) is dissolved in advance in the processing liquid, so that the dissolution of the resist film into the processing liquid and the penetration of the processing liquid into the resist film are promoted.
The resin (A ′) is not particularly limited as long as it is soluble in an organic solvent, and a resin used for a resist composition can be suitably used. Epoxy resin, melamine resin, urea resin, polyester resin, polyurethane Resin, polyimide resin, etc. can also be used.
Examples of the resin (A ′) soluble in the organic solvent include those having the following repeating units.
・ Repeating unit with acid-decomposable group ・ Repeating unit with hydroxyl group ・ Repeating unit with nonpolar group ・ Repeating unit with lactone structure ・ Repeating unit derived from hydroxystyrene and its derivatives ・ Aromatic ring in side chain (meta ) Acrylic ester repeating unit Specific examples include the same resins as those contained in the actinic ray-sensitive or radiation-sensitive resin composition.

The weight average molecular weight of the resin (A ′) of the present invention is preferably 3,000 to 25,000, more preferably 5,000 to 15,000 as a polystyrene conversion value by GPC method.
The dispersity (molecular weight distribution) of the resin (A ′) is preferably 1.2 to 3.0, more preferably 1.4 to 1.8.
The blending amount of the resin (A ′) in the entire treatment liquid is preferably 0.0001 to 10% by mass, more preferably 0.001 to 5% by mass with respect to the total amount of the treatment liquid.
Moreover, the resin (A ′) may be contained in the treatment liquid or may be contained in plural.
The resin (A ′) of the present invention can be synthesized according to a conventional method (for example, radical polymerization).

As a developing method, for example, a method in which a substrate is immersed in a tank filled with a developer for a certain period of time (dip method), a method in which the developer is raised on the surface of the substrate by surface tension and is left stationary for a certain time (paddle) Method), a method of spraying the developer on the substrate surface (spray method), a method of continuously discharging the developer while scanning the developer discharge nozzle on the substrate rotating at a constant speed (dynamic dispensing method) Etc. can be applied.
When the various development methods described above include a step of discharging the developer from the developing nozzle of the developing device toward the resist film, the discharge pressure of the discharged developer (the flow rate per unit area of the discharged developer) is Preferably it is 2 mL / sec / mm ² or less, More preferably, it is 1.5 mL / sec / mm ² or less, More preferably, it is 1 mL / sec / mm ² or less. There is no particular lower limit on the flow rate, but 0.2 mL / sec / mm ² or more is preferable in consideration of throughput.
By setting the discharge pressure of the discharged developer to be in the above range, pattern defects derived from the resist residue after development can be remarkably reduced.
The details of this mechanism are not clear, but perhaps by setting the discharge pressure within the above range, the pressure applied by the developer to the resist film will decrease, and the resist film / resist pattern may be inadvertently cut or collapsed. This is considered to be suppressed.
The developer discharge pressure (mL / sec / mm ² ) is a value at the developing nozzle outlet in the developing device.

  Examples of the method for adjusting the discharge pressure of the developer include a method for adjusting the discharge pressure with a pump and the like, and a method for changing the pressure by adjusting the pressure by supplying from a pressurized tank.

  Moreover, you may implement the process of stopping image development, after the process of developing, substituting with another solvent.

-Rinse process It is preferable to include the process of rinsing using a rinse liquid after the image development by the developing solution containing an organic solvent. As the rinse liquid, a rinse liquid containing an organic solvent is preferable.

  The rinsing solution used in the rinsing step after development with a developing solution containing an organic solvent is not particularly limited as long as the resist pattern is not dissolved, and a solution containing a general organic solvent can be used. As the rinsing liquid, it is preferable to use a rinsing liquid containing at least one organic solvent selected from hydrocarbon solvents, ketone solvents, ester solvents, alcohol solvents, amide solvents and ether solvents. . The rinse liquid more preferably contains at least one organic solvent selected from a ketone solvent, an ester solvent, an alcohol solvent, and an amide solvent, and more preferably contains an alcohol solvent or an ester solvent. Even more preferably, it contains a monohydric alcohol, particularly preferably a monohydric alcohol having 5 or more carbon atoms. Here, examples of the monohydric alcohol used in the rinsing step after development include linear, branched, and cyclic monohydric alcohols. Specifically, 1-butanol, 2-butanol, 3-methyl- 1-butanol, tert-butyl alcohol, 1-pentanol, 2-pentanol, 1-hexanol, 4-methyl-2-pentanol, 1-heptanol, 1-octanol, 2-hexanol, cyclopentanol, 2- Heptanol, 2-octanol, 3-hexanol, 3-heptanol, 3-octanol, 4-octanol and the like can be used, and particularly preferable monohydric alcohols having 5 or more carbon atoms include 1-hexanol, 2-hexanol, 4 -Use methyl-2-pentanol, 1-pentanol, 3-methyl-1-butanol, etc. Rukoto can. Among these, branched alkyl alcohols having 5 or more carbon atoms are preferable.

  A plurality of these components may be mixed, or may be used by mixing with an organic solvent other than the above.

The water content in the rinse liquid is preferably less than 10% by mass, more preferably less than 5% by mass, and particularly preferably less than 3% by mass. By setting the water content to less than 10% by mass, good development characteristics can be obtained.
That is, the amount of the organic solvent used in the rinse liquid is preferably 90% by mass or more and 100% by mass or less, more preferably 95% by mass or more and 100% by mass or less, based on the total amount of the rinse liquid. Most preferably, it is at least 100% by mass.

  The vapor pressure of the rinsing solution used after development with a developer containing an organic solvent is preferably 0.05 kPa or more and 5 kPa or less, more preferably 0.1 kPa or more and 5 kPa or less, and 0.12 kPa or more and 3 kPa or less at 20 ° C. Is most preferred. By setting the vapor pressure of the rinse liquid to 0.05 kPa or more and 5 kPa or less, the temperature uniformity in the wafer surface is improved, and further, the swelling due to the penetration of the rinse solution is suppressed, and the dimensional uniformity in the wafer surface. Improves.

  An appropriate amount of a surfactant and a resin (A ′) can be added to the rinse liquid. The types and addition amounts of the surfactant and the resin (A ′) that can be contained are the same as those in the developer.

  In the rinsing step, the developed wafer is cleaned using a rinsing solution containing the organic solvent. The cleaning method is not particularly limited. For example, a method of continuing to discharge the rinse liquid onto the substrate rotating at a constant speed (rotary coating method), or immersing the substrate in a tank filled with the rinse liquid for a certain period of time. A method (dip method), a method of spraying a rinsing liquid on the substrate surface (spray method), and the like can be applied. Among them, a cleaning treatment is performed by a spin coating method, and after cleaning, the substrate is rotated at a speed of 2000 rpm to 4000 rpm. It is preferable to rotate and remove the rinse liquid from the substrate. It is also preferable to include a heating step (Post Bake) after the rinsing step. The developing solution and the rinsing solution remaining between the patterns and inside the patterns are removed by baking. The heating step after the rinsing step is usually 40 to 160 ° C., preferably 70 to 95 ° C., and usually 10 seconds to 3 minutes, preferably 30 seconds to 90 seconds.

The present invention also relates to an electronic device manufacturing method including the above-described pattern forming method of the present invention, and an electronic device manufactured by this manufacturing method.
The electronic device of the present invention is suitably mounted on electrical and electronic equipment (home appliances, OA / media related equipment, optical equipment, communication equipment, etc.).

  EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, the content of this invention is not limited by this.

<Synthesis Example (Synthesis of Resin P-1)>
123.1 parts by mass of cyclohexanone was heated to 65 ° C. under a nitrogen stream. While stirring this liquid, 27.8 parts by mass of the monomer represented by the following structural formula LM-1, 34.3 parts by mass of the monomer represented by the following structural formula AM-1, 228.6 parts by mass of cyclohexanone, 2, A mixed solution of 3.73 parts by mass of 2′-azobis (2,2′-dimethylvaleronitrile) [V-65, manufactured by Wako Pure Chemical Industries, Ltd.] was added dropwise over 4 hours. After completion of dropping, the mixture was further stirred at 65 ° C. for 2 hours. The reaction solution is allowed to cool, then reprecipitated with a large amount of hexane / ethyl acetate (mass ratio: 9/1), filtered, and the obtained solid is vacuum-dried, whereby the resin (P-1) of the present invention is 49. Obtained 4 parts by mass.

The weight average molecular weight (Mw: in terms of polystyrene) determined from GPC (carrier: N-methylpyrrolidone (NMP)) of the obtained resin was Mw = 1300, and the dispersity was Mw / Mn = 1.89. The composition ratio of P-1 measured by ¹³ C-NMR was 50/50 (molar ratio; corresponding sequentially from the left).

<Resin>
Thereafter, Resins P-2 to P-11 were synthesized in the same manner. The synthesized polymer structure is described below.

  In addition, the composition ratio (molar ratio; corresponding in order from the left), weight average molecular weight, and degree of dispersion of each repeating unit are shown in the table below.

<Acid generator>
The following compounds were used as the acid generator.

<Basic compound>
The following compounds were used as basic compounds.

<Crosslinking agent>
The following compounds were used as the crosslinking agent.

<Crosslinking aid>
The following compounds were used as crosslinking aids.

<Hydrophobic resin>
As the hydrophobic resin, it was appropriately selected from the resins (HR-1) to (HR-90) listed above.
The hydrophobic resin (HR-79) was synthesized based on the descriptions in US Patent Application Publication No. 2010/0152400, International Publication No. 2010/069705, International Publication No. 2010/067898, and the like.

<Surfactant>
The following were prepared as surfactants.
W-1: MegaFuck F176 (Dainippon Ink & Chemicals, Inc .; fluorine-based)
W-2: Megafuck R08 (Dainippon Ink & Chemicals, Inc .; fluorine and silicon)
W-3: Polysiloxane polymer KP-341 (manufactured by Shin-Etsu Chemical Co., Ltd .; silicon-based)

<Solvent>
The following were prepared as solvents.
A-1: Propylene glycol monomethyl ether acetate (PGMEA)
A-2: γ-butyrolactone A-3: Cyclohexanone B-1: Propylene glycol monomethyl ether (PGME)
B-2: Ethyl lactate

<Developer>
The following were prepared as developers.
SG-1: Butyl acetate SG-2: Methyl amyl ketone SG-3: Ethyl-3-ethoxypropionate SG-4: Pentyl acetate SG-5: Isopentyl acetate SG-6: Propylene glycol monomethyl ether acetate (PGMEA)

<Rinse solution>
The following rinse solutions were used.
SR-1: 4-methyl-2-pentanol SR-2: 1-hexanol SR-3: butyl acetate SR-4: methyl amyl ketone SR-5: ethyl-3-ethoxypropionate

[Examples 1 to 25 and Comparative Example 1]
<ArF dry exposure>
(Resist preparation)
The components shown in Table 4 below were dissolved in a solvent shown in the same table in a solid content of 3.8% by mass, and each was filtered through a polyethylene filter having a pore size of 0.1 μm to obtain an actinic ray-sensitive or radiation-sensitive resin composition. A product (resist composition) was prepared. An organic antireflection film ARC29A (Nissan Chemical Co., Ltd.) was applied on the silicon wafer, and baked at 205 ° C. for 60 seconds to form an antireflection film having a thickness of 86 nm. An actinic ray-sensitive or radiation-sensitive resin composition was applied thereon and baked (PB: Prebake) at 100 ° C. for 60 seconds to form a resist film having a thickness of 100 nm.
The obtained resist film was subjected to pattern exposure using an ArF excimer laser scanner (PAS5500 / 1100, manufactured by ASML, NA0.75, Dipole, outer sigma 0.89, inner sigma 0.65). As the reticle, a 6% halftone mask having a line size = 75 nm and a line: space = 1: 1 was used. Then, it heated at 105 degreeC for 60 second (PEB: Post Exposure Bake). Subsequently, development was carried out by padding with an organic solvent-based developer described in the following table for 30 seconds, and paddle was rinsed for 30 seconds with a rinse solution described in the following table. Subsequently, the wafer was rotated at 4000 rpm for 30 seconds to obtain a line and space pattern having a line width of 75 nm (1: 1).

[Exposure latitude (EL,%)]
An exposure amount for reproducing a line-and-space (line: space = 1: 1) mask pattern having a line width of 75 nm was determined, and this was set as the optimum exposure amount E _opt . Next, the exposure amount when the line width was ± 10% of the target value of 75 nm (that is, 67.5 nm and 82.5 nm) was determined. Then, an exposure latitude (EL) defined by the following equation was calculated. The larger the value of EL, the smaller the performance change due to the exposure amount change.
[EL (%)] = [(exposure amount at which line width is 82.5 nm) − (exposure amount at which line width is 67.5 nm)] / E _opt

[Line width roughness (LWR, nm)]
In observation of a 75 nm (1: 1) line-and-space resist pattern resolved at an optimum exposure amount in exposure latitude evaluation, using a length-measuring scanning electron microscope (SEM (Hitachi Ltd. S-9380II)) When observing from the upper part of the pattern, the line width was observed at an arbitrary point, and the measurement variation was evaluated by 3σ. A smaller value indicates better performance.

  These evaluation results are shown in Table 4 below.

As is apparent from the results shown in Table 4, Comparative Example 1 in which the resin does not have a repeating unit (A) having an N-methylol-based partial structure has a small exposure latitude (EL) and a line width roughness (LWR). Is large and is inferior to both EL and LWR.
On the other hand, in Examples 1 to 25 using the resin (P) having the repeating unit (A) having an N-methylol-based partial structure, EL is large, LWR is small, and both EL and LWR are excellent. Recognize.
In addition, in Examples 2 to 8 in which the repeating unit (B) having a group that decomposes by the action of an acid to generate a polar group or the repeating unit (C) having a hydroxyl group is contained in the resin, EL and LWR are more excellent. In Examples 9, 10, and 12 to 25, in which the repeating unit (B) and the repeating unit (C) were contained in the resin, it was found that EL and LWR tend to be further improved.

[Examples 26 to 50 and Comparative Example 2]
<ArF immersion exposure>
(Resist preparation)
The components shown in Table 5 below are dissolved in a solvent shown in the same table in a solid content of 3.8% by mass, and each is filtered through a polyethylene filter having a pore size of 0.03 μm to obtain an actinic ray-sensitive or radiation-sensitive resin composition. A product (resist composition) was prepared. An organic antireflection film ARC29SR (manufactured by Nissan Chemical Industries, Ltd.) was applied onto the silicon wafer and baked at 205 ° C. for 60 seconds to form an antireflection film having a thickness of 95 nm. An actinic ray-sensitive or radiation-sensitive resin composition was applied thereon and baked (PB: Prebake) at 100 ° C. for 60 seconds to form a resist film having a thickness of 100 nm.
The obtained wafer was used with an ArF excimer laser immersion scanner (manufactured by ASML; XT1700i, NA1.20, C-Quad, outer sigma 0.900, inner sigma 0.812, XY deflection), and the hole portion was 60 nm. Further, pattern exposure was performed through a square array halftone mask having a pitch between holes of 90 nm (here, the portion corresponding to the holes was shielded for forming a negative image). Ultra pure water was used as the immersion liquid. Then, it heated at 105 degreeC for 60 second (PEB: Post Exposure Bake). Subsequently, development was carried out by padding with an organic solvent-based developer described in the following table for 30 seconds, and paddle was rinsed for 30 seconds with a rinse solution described in the following table. Subsequently, the contact hole pattern with a hole diameter of 45 nm was obtained by rotating the wafer for 30 seconds at a rotational speed of 4000 rpm.

[Exposure latitude (EL,%)]
The hole diameter is observed with a length-measuring scanning electron microscope (SEM, Hitachi, Ltd. S-9380II), and the optimum exposure dose when resolving a contact hole pattern with a hole diameter of 45 nm is expressed as sensitivity (E _opt ) (mJ / cm ² ). Based on the determined optimum exposure dose (E _opt ), the exposure dose when the hole size is the target value of 45 nm ± 10% (that is, 40.5 nm and 49.5 nm) was determined. Then, the exposure latitude (EL,%) defined by the following equation was calculated. The larger the value of EL, the smaller and better the performance change due to the change in exposure amount. [EL (%)] = [(exposure amount at which the hole diameter becomes 40.5 nm) − (exposure amount at which the hole diameter becomes 49.5 nm) ] / E _opt

[Local pattern dimension uniformity (Local CDU, nm)]
In one shot exposed at the optimum exposure amount in the exposure latitude evaluation, arbitrary 25 hole sizes, that is, a total of 500 hole sizes, are measured for each of the 20 regions whose intervals are 1 μm. These standard deviations were obtained and 3σ was calculated. The smaller the value, the smaller the dimensional variation, indicating better performance.

  These evaluation results are shown in Table 5 below.

As is apparent from the results shown in Table 5, Comparative Example 2 in which the resin does not have the repeating unit (A) having an N-methylol-based partial structure has a small exposure latitude (EL), a large local CDU, It turns out that it is inferior to any of local CDU.
On the other hand, in Examples 26 to 50 using the resin (P) having the repeating unit (A) having an N-methylol-based partial structure, EL is large, local CDU is small, and both EL and local CDU are excellent. I understand that.
In addition, Examples 27 to 33 in which the repeating unit (B) having a group capable of decomposing by the action of an acid to generate a polar group or the repeating unit (C) having a hydroxyl group are contained in the resin are more excellent in EL and LWR. In Examples 34, 35, and 37 to 50, in which the above repeating unit (B) and the above repeating unit (C) were contained in the resin, it was found that EL and local CDU tend to be more excellent.

[Examples 51 to 75 and Comparative Example 3]
<Dry etching resistance evaluation>
(Resist preparation)
The components shown in Table 6 below were dissolved in a solvent shown in the same table in a solid content of 3.8% by mass, and each was filtered through a polyethylene filter having a pore size of 0.1 μm to obtain an actinic ray-sensitive or radiation-sensitive resin composition. A product (resist composition) was prepared. An organic antireflection film ARC29A (Nissan Chemical Co., Ltd.) was applied on the silicon wafer, and baked at 205 ° C. for 60 seconds to form an antireflection film having a thickness of 86 nm. An actinic ray-sensitive or radiation-sensitive resin composition was applied thereon and baked (PB: Prebake) at 100 ° C. for 60 seconds to form a resist film having a thickness of 100 nm.
The obtained resist film, ArF excimer laser scanner (ASML Co. PAS5500 / 1100, NA0.75, Conventional, outer sigma 0.89) was used to perform the entire collective exposure with an exposure amount of 30 mJ / cm ² . Then, it heated at 105 degreeC for 60 second (PEB: Post Exposure Bake). Subsequently, development was carried out by padding with an organic solvent-based developer described in the following table for 30 seconds, and paddle was rinsed for 30 seconds with a rinse solution described in the following table. Subsequently, the wafer was rotated at a rotational speed of 4000 rpm for 30 seconds to obtain a resist film for dry etching evaluation.

[Dry etching rate (DE, Å / sec)]
The initial film thickness (FT1, Å) of the resist film obtained above was measured. Next, etching was performed for 30 seconds using a dry etcher (H-621, manufactured by Hitachi High-Technology Corporation) while supplying C ₄ F ₆ gas. Thereafter, the film thickness (FT2, Å) of the resist film obtained after the etching was measured. Then, a dry etching rate (DE) defined by the following equation was calculated.
[DE (Å / sec)] = (FT1-FT2) / 30
The superiority or inferiority of DE was evaluated according to the following criteria. The smaller the DE value, the smaller the change in film thickness due to etching, and the better the performance.
○ ・ ・ ・ Dry etching rate less than 10Å / sec △ ・ ・ ・ Dry etching rate 10 / sec or more and less than 12Å / sec × ・ ・ ・ Dry etching rate 12 エ ッ チ ン グ / sec or more

  The evaluation results are shown in Table 6 below.

As is apparent from the results shown in Table 6, it can be seen that Comparative Example 3 in which the resin does not have the repeating unit (A) having an N-methylol partial structure is inferior in dry etching resistance.
On the other hand, it turns out that Examples 51-75 using resin (P) which has a repeating unit (A) which has a partial structure of N-methylol type are excellent in dry etching tolerance.

Claims (14)

(A) a step of forming a film with an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (P) having a repeating unit (A) having an N-methylol-based partial structure;
(A) A pattern forming method comprising: a step of exposing the film; and (c) a step of developing using a developer containing an organic solvent to form a negative pattern.   The pattern formation method of Claim 1 whose content of the organic solvent in the developing solution containing the said organic solvent is 90 to 100 mass% with respect to the whole quantity of the said developing solution.   The pattern formation method according to claim 1, wherein the repeating unit (A) has two or more N-methylol-based partial structures.   The pattern formation method according to any one of claims 1 to 3, wherein the resin (P) is a resin having a repeating unit (B) having a group that decomposes by the action of an acid to generate a polar group. .   The pattern formation method of any one of Claims 1-4 whose said resin (P) is resin which has a repeating unit (C) which has a hydroxyl group different from the said repeating unit (A).   The pattern forming method according to claim 5, wherein the repeating unit (C) is a repeating unit having an aliphatic cyclic structure.   The pattern forming method according to claim 4, wherein the repeating unit (B) is a repeating unit having an aliphatic cyclic structure.   The pattern formation method of any one of Claims 1-7 in which actinic-ray-sensitive or radiation-sensitive resin composition contains the compound which generate | occur | produces an acid by irradiation of actinic light or a radiation.   The developer is a developer containing at least one organic solvent selected from the group consisting of ketone solvents, ester solvents, alcohol solvents, amide solvents, and ether solvents. The pattern formation method of any one of these.   Furthermore, (d) The pattern formation method of any one of Claims 1-9 including the process of wash | cleaning using the rinse liquid containing an organic solvent.   The actinic-ray sensitive or radiation sensitive resin composition used for the pattern formation method of any one of Claims 1-8.   A resist film formed from the actinic ray-sensitive or radiation-sensitive resin composition according to claim 11.   The manufacturing method of an electronic device containing the pattern formation method of any one of Claims 1-10.   An electronic device manufactured by the method for manufacturing an electronic device according to claim 13.