JP2012234851A - Electric electronic component mounting structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively utilize a discarded substrate, which inevitably occurs as a disposal part when a wiring board is manufactured, for adjusting a height dimension of an electric electronic component in the mounting state.SOLUTION: An electric electronic component 100 having straight type terminal pins 110 is mounted on a main substrate 10. An electric electronic component includes: the main substrate 10; an auxiliary substrate 20 for mounting height adjustment 20; terminal pin insertion holes 22 formed on the auxiliary substrate 20; through hole parts 40 penetrating through the main substrate 10 and the auxiliary substrate 20; and insertion members 32 inserted into the through hole parts 40. The electric electronic component 100 further includes cable ways 61, 62, 63 connecting a surface conductive layer 66 of the insertion member 32 with the terminal pins 110. The auxiliary substrate 20 and the insertion member 32 are cut out from discarded substrates 72 occurring when the main substrate 10 is manufactured.

Description

  The present invention relates to an electrical / electronic component mounting structure, more specifically, when mounting an electrical / electronic component having a straight type terminal pin on a wiring board, a discarded portion of the wiring board called a “discarded board” The present invention relates to an electric / electronic component mounting structure that can be effectively used to adjust the height dimension of the electronic component.

  Recently, in thin television receivers such as liquid crystal television receivers, measures are often taken to arrange external terminals such as run connectors on the back of the television receiver. Further, in this type of thin television receiver, the wiring board necessary for driving the liquid crystal module is attached to the sheet metal chassis at the back of the liquid crystal module, so that the television receiver is mounted on the wiring board. As electrical and electronic components arranged on the back of the machine, straight type terminal pins protruding in the back are often used.

  On the other hand, several types of external terminals assembled in one television receiver often have different height dimensions, and a plurality of such external terminals having different height dimensions can be connected to a common flat surface. When mounted on the wiring board in a directly seated state, the end faces of those external terminals are not aligned at a certain height. Therefore, it is necessary to take measures to align the end faces of the external terminals mounted on the wiring board at a certain height.

  In the prior example, an LED mounting structure has been proposed (see, for example, Patent Document 1). In this mounting structure, spacers having different heights are superimposed on the surface of the printed circuit board so that a plurality of LEDs are seated on different heights of the spacers and lead wires extending from the individual LEDs. Is inserted through a through-hole formed in the spacer and the printed circuit board and protruded from the back surface of the printed circuit board.

  In another prior example, it has been proposed to use a “throwing board” in order to prevent an electrical component mounted on a wiring board from falling down (see, for example, Patent Document 2).

  In still another prior example, a proposal for a flip chip mounting structure on a multilayer substrate has been made (see, for example, Patent Document 3). In addition, research on the structure of a printed circuit board in which a sub-board is mounted on a main board and research on the structure of a multilayer printed circuit board itself are performed (for example, see Patent Document 4 and Patent Document 5).

Japanese Patent Laid-Open No. 9-148711 JP 2010-245104 A JP 2002-217240 A JP 2008-300734 A Japanese Utility Model Publication No. 61-136580

  However, in the LED mounting structure proposed by Patent Document 1, the tops of the LEDs are not aligned at a constant height, but only means for varying the heights of the tops of LEDs of the same size. . In addition, the “throwing board” proposed in Patent Document 2 is merely effectively used as a member for preventing the electrical components from falling down.

  The present invention has been made in view of the above situation, and a so-called “discarded substrate” that is inevitably generated as a waste part when manufacturing a wiring substrate such as a multilayer substrate is a high-level in a mounted state of electrical and electronic components. It is an object of the present invention to provide an electric / electronic component mounting structure that can be effectively used for adjusting the height dimension.

  In the electrical / electronic component mounting structure according to the present invention, an electrical / electronic component having a straight type terminal pin protruding backward is mounted on the main board. And the main board, the auxiliary board for mounting height adjustment superimposed on the plate surface of the main board, and the electric and electronic formed on the auxiliary board and superimposed on the seating surface on the auxiliary board A terminal pin insertion hole into which the terminal pin of the component is inserted, a through-hole portion formed in an overlapping portion of the main board and the auxiliary board and penetrating the main board and the auxiliary board, and the through-hole A plate-like insertion member inserted through the portion, a surface conductive layer formed on the surface of the insertion member and electrically connected to the circuit pattern formed on the main substrate, and inserted into the terminal pin insertion hole And an electric circuit for connecting the terminal pin and the surface conductive layer of the insertion member. Furthermore, the auxiliary board and the plate-shaped insertion member have the same thickness as the main board.

  In this invention, since the auxiliary board and the plate-like insertion member have the same thickness as the main board, the auxiliary board and the insertion member are unavoidably disposed as a disposal part when the main board is manufactured. It is possible to manufacture by using the generated “discarded substrate”. Therefore, it is possible not only to effectively use the “discarded board”, which is a waste part, as an auxiliary board and an insertion member, but also to make the mounting height dimensions of electric and electronic parts such as external terminals constant. In addition, it is not necessary to use extra special parts.

  In the electrical / electronic component mounting structure according to the present invention, the terminal pins of the electrical / electronic component inserted into the terminal pin insertion hole of the auxiliary substrate are electrically connected to the circuit pattern of the main substrate via the electrical path and the surface conductive layer of the insertion member. Connected. Therefore, it is not necessary to project the terminal pins of the electric and electronic parts superimposed on the seating surface of the auxiliary board to the back side of the main board, so even if the terminal pins of the electric and electronic parts are short, the terminal pins are not connected to the main board. The circuit pattern is appropriately electrically connected.

  In the present invention, the electrical path is formed on the hole wall surface of the terminal pin insertion hole and contacts the terminal pin inserted in the terminal pin insertion hole, and the first in-hole conductive layer. A conductive pattern provided on the auxiliary substrate continuously with the layer, and a conductive pattern formed on the hole wall surface of the through-hole portion continuously with both the conductive pattern and the circuit pattern and contacting the conductive pattern of the insertion member. It is desirable that the two-hole conductive layer is formed. By adopting this configuration, there is no need to separately form an electric path for connecting the terminal pin of the electric / electronic component and the surface conductive layer of the plug-in member with a lead wire.

  In the present invention, the through hole portion is formed by a main substrate side hole portion penetrating the main substrate and an auxiliary substrate side hole portion penetrating the auxiliary substrate, and the second in-hole conductivity is formed. A main board side in-hole conductive layer formed on the hole wall surface of the main board side hole and continuing to the circuit pattern, and an auxiliary board continuing to the conductive pattern formed on the hole wall surface of the auxiliary hole A structure in which the surface conductive layer of the plug-in member is in contact with and electrically connected to each of the conductive layers in the holes on the main substrate side and the auxiliary substrate side. Can be adopted. With this configuration, the second in-hole conductive layer can be easily formed.

  In the present invention, it is possible to adopt a configuration in which the three main members, the auxiliary substrate and the insertion member, are cut out from the same mother substrate. With this configuration, it is possible to effectively use the “throwing board” of the mother board that cuts out the main board as the auxiliary board and the insertion member.

  In the present invention, a plurality of the terminal pin insertion holes in which the plurality of terminal pins of the electric and electronic parts are inserted into the auxiliary board, and a plurality of the terminal pins corresponding to the terminal pin insertion holes, respectively. And a plurality of the insertion members inserted into the through-hole portions separately, and the plurality of through-hole portions are formed side by side at the overlapping portion of the main substrate and the auxiliary substrate. However, it is possible to adopt a configuration in which a plurality of portions of one girder overlapped with the auxiliary substrate extend in a comb shape. With this configuration, since the plurality of insertion members inserted into the plurality of through-hole portions are integrated by one girder portion, the plurality of insertion members can be simultaneously inserted into the plurality of through-hole portions. As a result, the speed of the assembly work can be easily achieved.

  As described above, according to the present invention, the “throwing board” that is inevitably generated as a waste part when manufacturing the main board is effectively used to adjust the height dimension of the mounted state of the electric and electronic parts. In addition, it is not necessary to use extra special parts to align the mounting heights of electrical and electronic parts such as external terminals having different height dimensions and terminal pin lengths at a constant height. For this reason, when an electric / electronic component such as a run connector is arranged on the back of the thin television receiver, there is an effect that the cost for adjusting the height of the electric / electronic component can be easily reduced.

It is a disassembled perspective view of the electrical and electronic component mounting structure which concerns on embodiment of this invention. It is the top view which showed the electric circuit etc. which are formed in an auxiliary substrate explanatory. It is a vertical side view of the said mounting structure. FIG. 4 is an enlarged view of a part IV in FIG. 3. It is the V section enlarged view of FIG. It is a principal part vertical side view of the example which applied the mounting structure to the thin television receiver. It is the schematic plan view which illustrated the mother board.

  FIG. 1 is an exploded perspective view of an electrical / electronic component mounting structure according to an embodiment of the present invention, and FIG. 2 is a plan view illustratively showing an electric circuit formed on an auxiliary substrate 20. 3 is a vertical side view of the above mounting structure, FIG. 4 is an enlarged view of the IV part of FIG. 3, FIG. 5 is an enlarged view of the V part of FIG. 3, and FIG. It is a principal part vertical side view of the example which applied No .. Further, FIG. 7 is a schematic plan view illustrating the mother substrate 70.

  As shown in FIG. 1, the electrical / electronic component mounting structure according to this embodiment includes a main substrate 10, an auxiliary substrate 20, and a comb-like member 30, and an electrical / electronic component using these elements. 100 is mounted on the main board 10. The electrical / electronic component 100 includes various external terminals such as a run connector, a pin socket, a jack, and a pin header. In addition, the electric / electronic component 100 is provided with a plurality of straight type terminal pins 110.

  As shown in FIG. 3, the auxiliary substrate 20 is overlaid on the plate surface of the main substrate 10, and the electric / electronic component 100 is overlaid on the seating surface 21 partitioned and formed on the plate surface of the auxiliary substrate 20. Compared with the case where the electrical / electronic component 100 is directly mounted, the height dimension H1 in the mounted state of the electrical / electronic component 100 is raised by a dimension corresponding to the thickness T1 of the auxiliary substrate 20.

  Therefore, as illustrated in FIG. 6, the common main substrate 10 has a tall electrical and electronic component 200 having a height dimension H <b> 3 and is shorter than the tall electrical and electronic component 200 by a dimension corresponding to the thickness T <b> 1 of the auxiliary substrate 20. When the low electrical component 100 having the height H2 is mixed, both the low electrical component 100 is superposed on the seating surface 21 of the auxiliary substrate 20 superimposed on the main substrate 10. The height dimensions H1 of the electric and electronic parts 100 and 200 in the mounted state are substantially the same to the extent that they do not cause the same or inconvenience. Therefore, in a thin television receiver or the like employing this configuration, it is possible to dispose both the electric and electronic components 100 and 200 in the same state with respect to the component windows 51 and 52 of the rear cover 50. In FIG. 6, reference numeral 220 denotes a straight type terminal pin provided in the tall electrical / electronic component 200, and this terminal pin 220 is inserted into the terminal pin insertion hole 11 of the main board 10 and protrudes to the back side thereof.

  As shown in FIG. 1 or FIG. 2, an electrical / electronic component (corresponding to the above-mentioned low electrical / electronic component) 100 is provided at a plurality of locations in the formation region of the seating surface 21 defined on the auxiliary substrate 20. Terminal pin insertion holes 22 individually corresponding to the plurality of terminal pins 110... Since the eight terminal pins 110... Are arranged in a staggered manner in the illustrated electric / electronic component 100, a plurality of terminal pin insertion holes 22 are similarly arranged in a staggered manner. On the other hand, as shown in FIG. 1, a plurality of terminal pin insertion holes 12 arranged in a staggered manner are also provided at eight locations on the main board 10, and these terminal pin insertion holes 12. By superimposing the auxiliary board 20 on the surface, it communicates with each terminal pin insertion hole 22 on the auxiliary board 20 side.

  In the process of assembling the electrical / electronic component mounting structure of this embodiment, as shown in FIG. 3, the auxiliary substrate 20 is overlaid on the plate surface of the main substrate 10, and each terminal pin insertion hole 22 on the auxiliary substrate 20 side is formed in the main substrate 10. The terminal pins 110 are inserted into the terminal pin insertion holes 22, 12 described above, with the electrical / electronic component 100 superimposed on the seating surface 21 of the auxiliary substrate 20. Is done. Each of these operations can be performed by an arbitrary procedure.

  As shown in FIG. 3, the main substrate 10 and the auxiliary substrate 20 are arranged at four equally spaced intervals on both sides of the formation area of the seating surface 21 of the auxiliary substrate 20 superimposed on the main substrate 10. The through-hole part 40 which penetrates both is formed. As is apparent from FIG. 1 or FIG. 2, the through-hole portion 40 includes a main substrate side hole portion 41 penetrating the main substrate 10 and an auxiliary substrate side hole portion 42 penetrating the auxiliary substrate 20. It is divided (see FIG. 4).

  As shown in FIG. 1, in the comb-like member 30 of the illustrated example, a rectangular cross-section is formed from a plurality of positions at equal intervals in the longitudinal direction of the elongated girder portion 31 having a rectangular cross-sectional shape toward one side of the girder portion 31. A narrow plate-like insertion member 32 extends in a comb-like shape. In the illustrated example, four insertion members 32 extend from the girder 31. Then, as shown in FIG. 3, the four insertion members of the comb-like member 30 are inserted into the four through-hole portions 40 formed in a line at the overlapping portion of the main substrate 10 and the auxiliary substrate 20. 32 is inserted, and the girder 31 is superimposed on the auxiliary substrate 20. In the electric and electronic component mounting structure shown in the figure, comb-like members 30 and 30 each having a pair are used, and the four insertion members 32 and 32 of the comb-like members 30 and 30 are provided as follows. The four through-hole portions 40, 40 formed on both sides sandwiching the formation area of the seating surface 21 of the auxiliary substrate 20 are inserted.

  At the insertion position of the insertion member 32 with respect to the through hole portion 40, the insertion member 32 is lightly press-fitted into the through hole portion 40. Therefore, the main board is formed by the plurality of insertion members 32 inserted through the plurality of through-hole portions 40..., Specifically, by the eight insertion members 32 inserted through the eight through-hole portions 40. 10 and the auxiliary substrate 20 superimposed on the plate surface are integrated so as not to be easily separated.

  As shown in FIG. 5, the first in-hole conductive layer 61 made of copper foil is formed on the hole wall surface of each terminal pin insertion hole 22 formed in the auxiliary member 20. In addition, the terminal pins 110 of the electrical / electronic component 100 inserted into the terminal pin insertion holes 22 are in contact with each other and are electrically connected. In addition, the first in-hole conductive layer 61 formed in each terminal pin insertion hole 22 includes a plurality (eight in the illustrated example) formed on the auxiliary substrate 20 as illustrated in FIG. The conductive patterns 62 are continuous to each other, and the conductive patterns 62 are divided into four strips and drawn out to both sides of the seating surface 21. Further, as shown in FIG. 4, a second in-hole conductive layer 63 made of copper foil is formed on the hole wall surface of the through-hole portion 40 described above. The second hole conductive layer 63 includes a main substrate side hole conductive layer 64 formed on the hole wall surface of the main substrate side hole 41 and an auxiliary substrate side hole formed on the hole wall surface of the auxiliary substrate side hole 42. It is divided into an inner conductive layer 65. The plurality of conductive patterns 62 (eight in the illustrated example) are continuously connected to the auxiliary substrate side hole conductive layer 65 of each auxiliary substrate side hole 42, respectively. Further, a surface conductive layer 66 is formed on the outer surface of the insertion member 32 inserted through the through-hole portion 40, and the surface conductive layer 66 is formed on the hole conductive layers 64 and 65 on the main substrate side and the auxiliary substrate side. In contact. In addition, the circuit pattern 13 formed on the main substrate 10 is continuous with the conductive layer 65 in the main substrate side hole, and the circuit pattern 13 forms a circuit for transmitting and receiving signals to the electric / electronic component 100. .

  In the above, the first in-hole conductive layer 61 in contact with the terminal pin 110, the conductive pattern 62 continuous to the first in-hole conductive layer 61, and both the conductive pattern 62 and the circuit pattern 13 are provided. An electric circuit that connects the terminal pin 110 and the surface conductive layer 66 of the insertion member 32 is formed by the continuous second in-hole conductive layer 63. Therefore, even if the electrical / electronic component 100 is mounted in a state of being superimposed on the seating surface 21 of the auxiliary substrate 20 that is superimposed on the main substrate 10, the function of the electrical / electronic component 100 is not impaired.

  In the above configuration, the thickness T2 of the main substrate 10 and the thickness T1 of the auxiliary substrate 20 shown in FIG. 6 are the same. Further, the thickness T3 of the beam portion 31 of the comb-like member 30 and the insertion member 32 are also the same as the thicknesses of the main substrate 10 and the auxiliary substrate 20. The main board 10, the auxiliary board 20, and the comb-like member 30 are cut out from the same mother board 70 having a uniform thickness illustrated in FIG. In the mother substrate 70 of FIG. 7, two main substrates 10, 10 arranged side by side are manufactured, and each main substrate 10 is obtained by dividing the boundary line 71 between the two main substrates 10, 10. . Further, when the main board 10 is manufactured, the discarded boards 72 and 72 which are the discarded parts are inevitably generated at the same time due to the manufacturing technical circumstances. In the formation region of the discarded substrate 72, the auxiliary substrate 20 and the comb-like member 30 are configured as shown in the figure, and they are cut out from the discarded substrate 72. In this way, if the auxiliary board 20 and the comb-like member 30 used for raising the mounting height of the short electrical and electronic component 100 are discarded and obtained from the board 72, extra parts are added. There is an advantage that it is not necessary to use it and cost increase can be avoided.

  In the embodiment described above, the mounting height of the electric / electronic component 100 is adjusted by using one auxiliary substrate 20, but this point is 2 when the height dimension of the electric / electronic component is shorter. The mounting height can be adjusted by stacking one or more auxiliary substrates. The main substrate 10 and the auxiliary substrate 20 may be a single layer substrate or a multilayer substrate.

DESCRIPTION OF SYMBOLS 10 Main board 13 Circuit pattern 20 Auxiliary board 21 Seating surface 22 Terminal pin insertion hole 32 Insertion member 40 Through-hole part 41 Main board side hole part 42 Auxiliary board side hole part 61 1st hole conductive layer (electric circuit)
62 Conductive pattern (electric circuit)
63 Second hole conductive layer (electric circuit)
64 Main board side hole conductive layer 65 Auxiliary board side hole conductive layer 66 Surface conductive layer 70 Mother board 100 Electrical and electronic component 110 Terminal pin T1 Auxiliary board thickness T3 Thickness of insertion member (thickness of comb-like member) )
T2 Main board thickness

Claims (5)

In the electrical and electronic component mounting structure in which the electrical and electronic components with straight type terminal pins protruding to the back are mounted on the main board,
The main board, the auxiliary board for adjusting the mounting height superimposed on the plate surface of the main board, and the electric / electronic component formed on the auxiliary board and superimposed on the seating surface on the plate surface of the auxiliary board. A terminal pin insertion hole into which the terminal pin is inserted, a through-hole portion that is formed at an overlapping portion of the main substrate and the auxiliary substrate, and penetrates the main substrate and the auxiliary substrate; The inserted plate-shaped insertion member, the surface conductive layer formed on the surface of the insertion member and electrically connected to the circuit pattern formed on the main board, and the insertion into the terminal pin insertion hole An electric circuit connecting the terminal pin and the surface conductive layer of the insertion member,
The electric and electronic component mounting structure, wherein the auxiliary board and the plate-shaped insertion member have the same thickness as the main board.   The electric path is formed on the hole wall surface of the terminal pin insertion hole and is continuous with the first hole conductive layer in contact with the terminal pin inserted into the terminal pin insertion hole, and the first hole conductive layer. In the second hole that is formed on the hole wall surface of the through-hole portion and is in contact with the surface conductive layer of the insertion member continuously from both the conductive pattern provided on the auxiliary substrate and the conductive pattern and the circuit pattern. The electrical / electronic component mounting structure according to claim 1, wherein the electrical / electronic component mounting structure is formed by a conductive layer.   The through hole portion is formed by a main substrate side hole portion penetrating the main substrate and an auxiliary substrate side hole portion penetrating the auxiliary substrate, and the second in-hole conductive layer is A main board side in-hole conductive layer formed on the hole wall surface of the main board side hole and continuing to the circuit pattern, and an auxiliary board side in-hole conductivity continuing to the conductive pattern formed on the hole wall surface of the auxiliary hole. 3. The electricity according to claim 2, wherein the surface conductive layer of the plug-in member is in contact with and electrically connected to both of the conductive layers in the holes on the main substrate side and the auxiliary substrate side. Electronic component mounting structure.   The electrical / electronic component mounting structure according to any one of claims 1 to 3, wherein the main board, the auxiliary board, and the insertion member are cut out from the same mother board.   A plurality of the terminal pin insertion holes in which the plurality of terminal pins of the electric and electronic components are inserted into the auxiliary board, and a plurality of through hole portions corresponding to the terminal pin insertion holes, respectively. The plurality of through-hole portions are formed side by side at the overlapping portion of the main substrate and the auxiliary substrate, and the plurality of insertion members respectively inserted into the through-hole portions are the auxiliary 5. The electrical and electronic component mounting structure according to claim 1, wherein the electrical and electronic component mounting structure extends in a comb-tooth shape from a plurality of locations of one girder that overlaps the substrate.

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