JP2012233643A - Thermally conductive member with thermal anisotropy and magnetic refrigerator employing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermally conductive member with thermal anisotropy, the member which is capable of improving a heat transport capacity and a heat transport efficiency, and to provide a magnetic refrigerator employing the same.SOLUTION: The thermally conductive member 30 is provided for conducting heat through a magnetic material which exhibits a magneto-caloric effect. A thermal conductivity of a base material 32 constituting the thermally conductive member 30 is adapted such that the thermal conductivity λL in a direction intersecting with one direction where the magnetic materials are arranged may be small compared with the thermal conductivity λv in one direction where the magnetic materials are arranged.

Description

  The present invention relates to a heat conducting member having thermal anisotropy and a magnetic refrigerator using the heat conducting member, and more particularly, having heat anisotropy capable of efficiently conducting heat between magnetic bodies. The present invention relates to a heat conduction member and a magnetic refrigerator using the heat conduction member.

  Most of the refrigerators in the room temperature range conventionally used, for example, refrigerators such as a refrigerator, a freezer, and an air conditioner, use the heat conduction of a gaseous refrigerant such as chlorofluorocarbon gas or chlorofluorocarbon alternative gas. Recently, the problem of ozone depletion due to the emission of chlorofluorocarbons has been exposed, and there is also concern about the impact on global warming caused by the emission of alternative chlorofluorocarbons. For this reason, there is a strong demand for the development of an innovative refrigerator that is clean and has a high heat transport capability, replacing the refrigerator that uses a gaseous refrigerant such as CFC and CFC.

  Against this background, the refrigeration technology that has recently attracted attention is the magnetic refrigeration technology. Some magnetic materials exhibit a so-called magnetocaloric effect that changes their temperature according to the change of the magnitude of the magnetic field applied to the magnetic material. A refrigeration technique that transports heat using a magnetic material that exhibits this magnetocaloric effect is a magnetic refrigeration technique.

  As an application of the magnetic refrigeration technology, for example, there is a magnetic refrigerator that transports heat using the heat conduction of a solid substance as described in Patent Document 1 below. This magnetic refrigerator conducts heat by the following configuration.

  A plurality of positive magnetic bodies that increase in temperature when magnetism is applied and negative magnetic bodies that decrease in temperature when magnetism is applied are alternately arranged in one direction at predetermined intervals. One magnetic body block is formed by a pair of positive and negative magnetic bodies. A plurality of magnetic blocks arranged in one direction are arranged in a ring shape to form a magnetic unit. A permanent magnet is arranged on a hub-like rotator that is concentric with the magnetic unit and has substantially the same inner diameter and outer diameter to form a magnetic circuit. A heat conducting member for inserting and removing between the positive and negative magnetic bodies is disposed so as to be slidable between the positive and negative magnetic bodies. The rotating body on which the permanent magnet is disposed is disposed so as to face the magnetic body unit, and is rotated relative to the magnetic body unit. The heat conducting member inserted and removed between the positive and negative magnetic bodies is rotated relative to the magnetic body unit. By the rotation of the rotating body, magnetism is simultaneously applied to and removed from the positive and negative magnetic bodies. Further, the heat conducting member is inserted and removed between the positive and negative magnetic bodies arranged in the rotation direction. The heat generated by the magnetic body due to the magnetocaloric effect is transported through the heat conducting member in one direction in which the magnetic body is disposed.

JP 2007-147209 A

  However, in the case of the invention of the cited document 1, when the heat conducting member is at a position straddling the magnetic bodies adjacent to each other in the rotation direction, not only the heat is transported toward one direction in which the magnetic bodies are arranged, but also the rotation. Heat is also transported to the side of the magnetic material adjacent in the direction. Therefore, the heat transported to the magnetic bodies adjacent to each other in the rotation direction is lost, and the heat transport capacity and heat transport efficiency of the magnetic refrigerator are reduced.

  The present invention has been made to solve the above problems, and can improve the heat transport capability and the heat transport efficiency, and a heat conducting member having thermal anisotropy and a magnetic field using the same. The purpose is to provide a refrigerator.

  In order to achieve the above object, the heat conducting member having thermal anisotropy according to the present invention conducts heat through a magnetic material that exhibits a magnetocaloric effect. The heat conductivity of the base material constituting the heat conducting member is smaller than the heat conductivity in one direction in which the magnetic materials are arranged, and the heat conductivity in the direction crossing the one direction in which the magnetic materials are arranged. Therefore, the heat conducting member has thermal anisotropy in which the heat conductivity varies depending on the heat conducting direction.

  In order to achieve the above object, a magnetic refrigerator according to the present invention includes a magnetic body arranging plate, a low temperature side heat exchange unit, a high temperature side heat exchange unit, a magnetic application unit, and a heat conduction member.

  A plurality of magnetic bodies are arranged at intervals on the magnetic body arranging plate. The low temperature side heat exchange part is adjacent to the magnetic body located at one end of the magnetic body arranging plate with a gap. The high temperature side heat exchange part is adjacent to the magnetic body located at the other end of the magnetic body arranging plate with a gap. The magnetism applying unit applies magnetism to each magnetic material of the magnetic material arranging plate. The heat conducting member is between a plurality of magnetic bodies of the magnetic body arrangement plate, between the magnetic body located at one end of the magnetic body arrangement board and the low temperature side heat exchanging unit, and between the magnetic body located at the other end of the magnetic body arrangement board and the high temperature. It is inserted into and removed from the side heat exchange unit to conduct heat. The thermal conductivity of the heat conducting member is smaller than the thermal conductivity in one direction in which the magnetic materials are arranged, and the thermal conductivity in the direction intersecting with the one direction in which the magnetic materials are arranged is smaller. It has.

  According to the present invention configured as described above, the heat conduction member can transfer almost all heat toward one direction in which the magnetic bodies are arranged, so that the heat transport capability and the heat transport efficiency can be improved. The size, weight and cost of the magnetic refrigerator can be reduced.

It is a principle figure of the magnetic refrigeration applied to this invention. It is a graph which shows the effect of magnetic refrigeration of the present invention. It is a figure for demonstrating a mode that heat moves in the principle figure of FIG. It is a block diagram of a magnetic board. It is a block diagram of a magnetic circuit board. It is a figure for demonstrating the necessity of the heat conductive member provided with the thermal anisotropy which concerns on this embodiment. It is a figure for demonstrating the necessity of the heat conductive member provided with the thermal anisotropy which concerns on this embodiment. It is sectional drawing of the heat conductive member provided with the thermal anisotropy which concerns on this embodiment. It is a figure for demonstrating the effect of the heat conductive member provided with the thermal anisotropy which concerns on this embodiment. It is an enlarged view of the base material formed with the fibrous material. It is an enlarged view of the base material formed by laminating | stacking several heat conductive material from which heat conductivity differs. It is an enlarged view of the base material formed by mix | blending and orienting the several heat conductive material from which heat conductivity differs. It is a figure which shows the shape of a base material. It is a figure which shows the heat conductive member which arranged the nanotube on the surface facing the magnetic body of a base material, and formed the nanostructure. It is a top view which shows schematic structure of the magnetic refrigerator based on this embodiment. It is a top view of the heat exchange part support disk which comprises the magnetic refrigerator shown in FIG. It is a top view of the magnetic body arrangement | positioning board which comprises the magnetic refrigerator shown in FIG. It is a top view of the magnet / heat conduction part arrangement | positioning board which comprises the magnetic refrigerator shown in FIG. FIG. 16 is an exploded cross-sectional view of the magnetic refrigerator shown in FIG. 15. It is a schematic diagram for demonstrating a heat | fever moving, when rotating the magnet / heat conduction part arrangement | positioning board of the magnetic refrigerator which concerns on this embodiment. It is a figure with which it uses for operation | movement description of the magnetic refrigerator which concerns on this embodiment. It is sectional drawing of the magnetic body which concerns on this embodiment. It is a figure for demonstrating the effect of the magnetic body which concerns on this embodiment. It is a schematic block diagram of the magnetic refrigerator which concerns on other embodiment.

  First, before describing embodiments of the present invention, the principle of magnetic refrigeration applied to the present invention will be described in detail with reference to the drawings.

(Principle of magnetic refrigeration)
FIG. 1 is a principle diagram of magnetic refrigeration applied to the present invention. In the magnetic bodies 10A to 10F, a positive magnetic body is used as a magnetic body made of the same material and having the same type of magnetocaloric effect. The magnetic bodies 100A and 10B form the magnetic body block 100A, the magnetic bodies 10C and 10D form the magnetic body block 100B, and the magnetic bodies 10E and 10F form the magnetic body block 100C. Further, the magnetic body unit 200 is formed by the magnetic body blocks 100A-100C.

  The magnetic circuits 20A and 20B, the magnetic circuits 20C and 20D, and the magnetic circuits 20E and 20F reciprocate between the magnetic bodies 10A to 10F. That is, from the state of FIG. 1A, the magnetic circuits 20A and 20B move from the magnetic bodies 10A to 10B, the magnetic circuits 20C and 20D move from the magnetic bodies 10C to 10D, and the magnetic circuits 20E and 20F move from the magnetic bodies 10E to 10F all at once. Thus, the state shown in FIG. 1B is obtained. Next, from the state of FIG. 1B, the magnetic circuits 20A and 20B are changed from the magnetic bodies 10B to 10A, the magnetic circuits 20C and 20D are changed from the magnetic bodies 10D to 10C, and the magnetic circuits 20E and 20F are changed from the magnetic bodies 10F to 10E all at once. By moving, the positional relationship between the magnetic circuit and the magnetic body returns to the state shown in FIG. Therefore, when the magnetic circuit reciprocates, the states of FIGS. 1A and 1B are alternately repeated.

  Here, as the plurality of magnetic bodies 10A-10F made of the same material, a positive magnetic body that generates heat when the magnetism is applied by the magnetic circuits 20A, 20B-magnetic circuits 20E, 20F and absorbs heat when removed is used, or the magnetic circuit 20A. , 20B—Use only one of the negative magnetic materials that absorbs heat when heat is applied and is removed by the magnetic circuits 20E and 20F. A positive magnetic body and a negative magnetic body have opposite magneto-caloric effects, and the types of magneto-caloric effects are different. In the case of FIG. 1, a positive magnetic material that is less expensive than a negative magnetic material is used. This is because a negative magnetic material has to be manufactured from a rare magnetic material, which increases the cost, and the magnitude of the magnetocaloric effect of the negative magnetic material is smaller than that of the positive magnetic material. .

  The magnetic circuits 20A, 20B-20E, 20F are provided with permanent magnets (not shown). The magnetic circuits 20A and 20B, the magnetic circuits 20C and 20D, and the magnetic circuits 20E and 20F are integrated to reciprocate in the left-right direction in the figure, thereby individually applying magnetism to the magnetic bodies 10A to 10F.

  The heat conducting members 30A-30G conduct the heat generated by the magnetic bodies 10A-10F due to the magnetocaloric effect from the low temperature side heat exchange unit 40A to the high temperature side heat exchange unit 40B. The heat conducting members 30A-30G have thermal anisotropy and can efficiently transfer heat toward one direction in which the magnetic bodies 10A-10F are arranged. The heat conducting member 30A is inserted and removed between the low temperature side heat exchanging portion 40A and the adjacent magnetic body 10A to mechanically connect the two. The heat conducting member 30B is inserted and removed between the magnetic bodies 10A and 10B to mechanically connect the two. Similarly, the heat conducting members 30C, 30D, 30E, and 30F are provided between the magnetic bodies 10B and 10C, between the magnetic bodies 10C and 10D, between the magnetic bodies 10D and 10E, and between the magnetic bodies 10E and 10F. The two are mechanically connected with each other. The heat conducting member 30G is inserted and removed between the magnetic body 10F and the high temperature side heat exchanging portion 40B to mechanically connect the two. The heat conducting members 30B, 30D, and 30F are inserted / removed between the magnetic bodies 10A and 10B, between the magnetic bodies 10C and 10D, and between the magnetic bodies 10E and 10F at the same timing, thereby mechanically connecting them. Connecting. Further, the heat conducting members 30A, 30C, 30E, and 30G are also at the same timing, between the low temperature side heat exchange unit 40A and the magnetic body 10A, between the magnetic bodies 10B and 10C, between the magnetic bodies 10D and 10E, It is inserted and removed between the magnetic body 10F and the high temperature side heat exchanging section 40B to mechanically connect them. The heat conducting members 30B, 30D, and 30F and the heat conducting members 30A, 30C, 30E, and 30G are alternately inserted and removed repeatedly.

  As shown in FIG. 1A, the magnetic circuits 20A and 20B are the magnetic body 10A of the magnetic body block 100A, the magnetic circuits 20C and 20D are the magnetic body 10C of the magnetic body block 100B, and the magnetic circuits 20E and 20F are the magnetic body block 100C. It is located on each of the magnetic bodies 10E. At this time, magnetism is applied to the magnetic bodies 10A, 10C, and 10E, and no magnetism is applied to the magnetic bodies 10B, 10D, and 10F, and the magnetism is removed. Therefore, the magnetic bodies 10A, 10C, and 10E generate heat. At the same time, the heat conducting member 30B is inserted between the magnetic bodies 10A and 10B, the heat conducting member 30D is inserted between the magnetic bodies 10C and 10D, and the heat conducting member 30F is inserted between the magnetic bodies 10E and 10F. Is done. Therefore, heat is conducted between adjacent magnetic bodies in each magnetic body block. That is, the heat generated by the magnetic bodies 10A, 10C, and 10E due to the magnetocaloric effect is transferred to the magnetic bodies 10B, 10D, and 10F, respectively. At this time, the heat conducting members 30A and 30G are not inserted between the low temperature side heat exchange unit 40A and the magnetic body 10A and between the high temperature side heat exchange unit 40B and the magnetic body 10F. Further, the heat conducting members 30C and 30E that conduct heat between the magnetic blocks are not inserted between the magnetic bodies 10B and 10C and between the magnetic bodies 10D and 10E.

  Next, as shown in FIG. 1B, the magnetic circuits 20A and 20B are the magnetic body 10B of the magnetic block 100A, the magnetic circuits 20C and 20D are the magnetic body 10D of the magnetic block 100B, and the magnetic circuits 20E and 20F are the magnetic bodies. It is located on the magnetic body 10F of the block 100C. At this time, magnetism is applied to the magnetic bodies 10B, 10D, and 10F, and no magnetism is applied to the magnetic bodies 10A, 10C, and 10E, and the magnetism is removed. Therefore, the magnetic bodies 10B, 10D, and 10F generate heat. Further, the heat conducting member 30A is between the low temperature side heat exchanging portion 40A and the magnetic body 10A, the heat conducting member 30C is between the magnetic bodies 10B and 10C, and the heat conducting member 30E is between the magnetic bodies 10D and 10E. In addition, the heat conducting member 30G is inserted between the magnetic body 10F and the high temperature side heat exchanging portion 40B. At this time, between the low temperature side heat exchange part 40A, the high temperature side heat exchange part 40B and the magnetic bodies 10A and 10F located at both ends of the magnetic body unit 200, and between the adjacent magnetic bodies of the adjacent magnetic body blocks. Heat is conducted. That is, the magnetic bodies 10A, 10C, and 10E absorb heat by the magnetocaloric effect, and the magnetic bodies 10B, 10D, and 10F generate heat by the magnetocaloric effect. Accordingly, heat is transferred from the low temperature side heat exchange section 40A to the magnetic body 10A, from the magnetic body 10B to the magnetic body 10C, from the magnetic body 10D to the magnetic body 10E, and from the magnetic body 10F to the high temperature side heat exchange section 40B. At this time, the heat conducting members 30B, 30D, and 30F that conduct heat in the magnetic block are between the magnetic bodies 10A and 10B, between the magnetic bodies 10C and 10D, and between the magnetic bodies 10E and 10F. Is not inserted.

  As described above, by reciprocating the magnetic circuit provided corresponding to each magnetic body block 100A-100C in conjunction with the horizontal direction in the figure, the magnetic bodies located at both ends of each magnetic body block 100A-100C are alternated. Repeat the application and removal of magnetism. Further, in conjunction with the movement of the magnetic circuit, the insertion / removal of the heat conducting members 30A-30G between the low temperature side heat exchange unit 40A, the magnetic bodies 10A-10F, and the high temperature side heat exchange unit 40B is repeated. Thereby, the heat obtained by the magnetocaloric effect moves from the low temperature side heat exchange unit 40A to the high temperature side heat exchange unit 40B.

  FIG. 2 is a graph showing the effect of the magnetic refrigeration of the present invention. As shown in this graph, the temperature difference between the low temperature side heat exchange unit 40A and the high temperature side heat exchange unit 40B is small at a relatively initial stage after the operation of the magnetic refrigerator. As time passes, the temperature difference between the low temperature side heat exchange section 40A and the high temperature side heat exchange section 40B gradually increases, and finally, as shown by the straight line after a long time has passed, The temperature difference between the heat exchange unit 40A and the high temperature side heat exchange unit 40B is maximized. In this state, for example, the indoor temperature can be lowered using the heat of the low temperature side heat exchange unit 40A, and the indoor temperature can be increased, for example, using the heat of the high temperature side heat exchange unit 40B.

  Next, based on the schematic diagram of FIG. 3, how the heat moves when the magnetic circuit provided corresponding to each magnetic block is reciprocally moved in conjunction with the horizontal direction in the figure as shown in FIG. I will explain.

  First, as a premise, all the magnetic bodies forming the magnetic unit 200 are made of the same material, and all the magnetic bodies have the same magnetocaloric effect and have a temperature change of 5 ° C. Assuming that Specifically, it is assumed that all magnetic materials have a characteristic that the temperature increases by 5 ° C. when magnetism is applied and decreases by 5 ° C. when the magnetism is removed.

  First, as shown in (1) of FIG. 3, in the initial state, all the magnetic bodies are at room temperature of 20 ° C.

  Next, as shown in (2) of FIG. 3, in this state, the magnetic circuit is moved to the right side, the magnetism is removed from the magnetic body located at one end of each magnetic body block 100A-100C, and the magnetic circuit is located at the other end. Magnetism is applied to the magnetic material. At the same time, between the adjacent magnetic bodies of the adjacent magnetic body blocks 100A to 100C, between the magnetic body positioned at one end of the magnetic body unit 200 and the low temperature side heat exchange unit 40A, and the other end of the magnetic body unit 200. A heat conducting member is inserted so that heat conduction between the magnetic body located at the high temperature side and the high temperature side heat exchanging portion 40B is possible.

  In the state of (2) in FIG. 3, the temperature of the magnetic body from which magnetism has been removed decreases to 15 ° C., and the temperature of the magnetic body to which magnetism has been applied increases to 25 ° C. For this reason, as shown in the figure, heat moves from the higher temperature side to the lower temperature side through the heat conducting member.

  Due to this heat transfer, the temperature of the magnetic body located at one end of the magnetic body unit 200 and the low-temperature side heat exchanging portion 40A becomes 18 ° C. as shown in FIG. The temperature of the magnetic body located at the end and the high temperature side heat exchange section 40B becomes 22 ° C.

  Next, as shown in (3) of FIG. 3, in this state, the magnetic circuit is moved to the left side to remove the magnetism from the magnetic body located at the other end of each magnetic body block 100A-100C and located at one end. Magnetism is applied to the magnetic material. At the same time, a heat conducting member is inserted so that heat conduction between adjacent magnetic bodies in each magnetic body block 100A-100C is possible.

  In the state of (3) in FIG. 3, the temperature of the magnetic body to which magnetism is applied rises by 5 ° C. from the temperature of the state of (2) ′ in FIG. (2) Decrease by 5 ° C. from the temperature in state '. For this reason, as shown in the figure, in each of the magnetic body blocks 100A to 100C, heat moves from the higher temperature to the lower temperature through the heat conducting member.

  Due to this heat transfer, as shown in (3) ′ of FIG. 3, the temperature of the low-temperature side heat exchanging portion 40A becomes 18 ° C., and the temperature of the magnetic body of the magnetic block 100A becomes 19 ° C. Further, the temperature of the magnetic body of the magnetic block 100B is 20 ° C., and the temperature of the magnetic body of the magnetic block 100C is 21 ° C. And the temperature of the high temperature side heat exchange part 40B will be 22 degreeC.

  As described above, the magnetic circuit is reciprocated left and right along the magnetic body, and the heat conduction member is inserted and removed in synchronization with the movement of the magnetic circuit, so that the low temperature side heat exchange unit 40A is replaced with the high temperature side heat exchange unit. Heat moves to 40B. As time elapses, the temperature difference between the low temperature side heat exchange unit 40A and the high temperature side heat exchange unit 40B increases. Eventually, the temperature difference between the low temperature side heat exchange part 40A and the high temperature side heat exchange part 40B becomes constant. In this state, for example, the indoor temperature can be lowered using the heat of the low temperature side heat exchange unit 40A, and the indoor temperature can be increased, for example, using the heat of the high temperature side heat exchange unit 40B.

  The description of FIGS. 1 and 3 is applicable when a positive magnetic material is used as a magnetic material of the same material having the same type of magnetocaloric effect. When a negative magnetic material is used as a magnetic material of the same material having the same type of magnetocaloric effect, the heat transfer direction is opposite to the direction shown in FIG. Therefore, when a negative magnetic material is used, the positions of the low temperature side heat exchange unit 40A and the high temperature side heat exchange unit 40B are opposite to those in FIGS.

  The above is the principle of magnetic refrigeration applied to the present invention. In the above description, the magnetic body block is formed by two magnetic bodies, and the magnetic body unit is formed by arranging three magnetic body blocks in a line.

  However, the present invention is not limited to this mode, and more magnetic bodies are arranged in a row to form a magnetic block, and more magnetic blocks are arranged in a row to form a magnetic unit. It can also be applied to. Also in this embodiment, providing a magnetic circuit for each magnetic block is the same as in the above embodiment.

  In addition, a magnetic body plate is formed by arranging a plurality of magnetic body units in which a large number of magnetic bodies are arranged in a row as described above in a direction orthogonal to the arrangement direction of the magnetic bodies, or by arranging a plurality in a ring shape. It is applicable also to the form to do.

  In the case of this embodiment, as shown in FIG. 4, as shown in FIG. 5, the magnetic circuit plate 25 is magnetically coupled to the magnetic bodies 10 Aa to 10 Af, 10 Ba to 10 Bf, and 10 Ca to 10 Cf of the magnetic body plate 15. Circuits 20Aa-20Ae, 20Bb-20Bf, and 20Ca-20Ce are provided in a checkered pattern. The heat conducting members 30Ab-30Af, 30Ba-30Bg are attached to the magnetic circuits 20Aa-20Ae, 20Bb-20Bf, 20Ca-20Ce. The magnetic circuit board 25 is opposed to the magnetic body plate 15, and the magnetic circuit board 25 is moved relative to the magnetic body plate 15 in the direction in which the magnetic body units are arranged (arrow direction in FIG. 4). When a positive magnetic material is used as the magnetic material, the magnetic material on which the magnetic circuit is located generates heat due to the magnetocaloric effect due to the movement of the magnetic circuit plate. Further, as the magnetic circuit plate 25 moves, the heat conducting member is inserted between the magnetic bodies of the magnetic plate 15. Therefore, the heat obtained by the plurality of magnetic body units by the movement of the magnetic circuit board moves from the low temperature side heat exchange unit 40A to the high temperature side heat exchange unit 40B. The principle that heat is transferred from the low temperature side heat exchange section 40A to the high temperature side heat exchange section 40B by the magnetocaloric effect of the magnetic body is the same as that shown in FIG. 3 in each magnetic body unit.

  As described above, the heat conducting member having thermal anisotropy according to the present embodiment moves the magnetic circuit plate 25 relative to the magnetic plate 15 in the arrangement direction of the magnetic units. Heat is efficiently conducted in the magnetic body unit.

(Need to give thermal anisotropy to heat conduction member)
6 and 7 are views for explaining the necessity of a heat conducting member having thermal anisotropy according to the present embodiment.

  The magnetic circuit plate 25 is moved relative to the magnetic plate 15 in the direction in which the magnetic units are arranged (in the direction of the arrow in FIG. 6). When the magnetic circuit board 25 is moved, the magnetic circuits 20Aa, 20Ac, 20Ae (see FIG. 5) are at positions facing the magnetic bodies 10Aa, 10Ac, 10Ae, and the heat conducting members 30Ab, 30Ad, 30Af are the magnetic bodies 10Aa. -10Ab, magnetic body 10Ac-10Ad, magnetic body 10Ae-10Af. Further, the magnetic circuits 20Bb, 20Bd, and 20Bf (see FIG. 5) are at positions facing the magnetic bodies 10Bb, 10Bd, and 10Bf, and the heat conducting member 30Ba is between the low temperature side heat exchanging portion 40A and the magnetic body 10Ba, and the heat conducting member 30Bc. 30Be is between the magnetic bodies 10Bb-10Bc and 10Bd-10Be, and the heat conducting member 30Bg is between the magnetic body 10Bf and the high temperature side heat exchanging section 40B.

  At this time, the magnetic body unit including the magnetic body 10Aa is in the state of FIG. 1A, and the magnetic body unit including the magnetic body 10Ba is in the state of FIG. 1B. Next, when the magnetic circuit board 25 is moved in the direction in which the magnetic units are arranged by one magnetic circuit, the magnetic unit including the magnetic body 10Aa is now in the state of FIG. 1B, and the magnetic body including the magnetic body 10Ba is obtained. The unit is in the state of FIG. 1A. Each time the magnetic circuit board 25 is moved in the direction in which the magnetic body units are arranged by one magnetic circuit, the state of FIG. 1A and the state of FIG. 1B are repeated in each magnetic unit. Therefore, by moving the magnetic circuit plate 25 relative to the magnetic plate 15, heat is transferred from the low temperature side heat exchange unit 40A to the high temperature side heat exchange unit 40B according to the principle described in FIG.

  However, as shown in FIG. 7, when the magnetic circuit board 25 is moved relative to the magnetic body plate 15, there is a moment when the heat conducting member is located across the magnetic bodies of the adjacent magnetic body units. is there.

  As shown in FIG. 7, when the magnetic circuit board 25 is moved, the heat conducting members 30Ab, 30Ad, 30Af are not only between the magnetic bodies 10Aa-10Ab, the magnetic bodies 10Ac-10Ad, and the magnetic bodies 10Ae-10Af, It may be positioned between the magnetic bodies 10Ba-10Bb, the magnetic bodies 10Bc-10Bd, and the magnetic bodies 10Be-10Bf.

  Further, the heat conduction member 30Ba is between the low temperature side heat exchange section 40A and the magnetic body 10Ba, the heat conduction members 30Bc and 30Be are between the magnetic bodies 10Bb-10Bc and the magnetic bodies 10Bd-10Be, and the heat conduction member 30Bg is the magnetic body 10Bf-high temperature side. It may be located not only between the heat exchangers 40B but also between the magnetic members 10Ca, between the magnetic members 10Cb-10Cc, between the magnetic members 10Cd-10Ce, and between the magnetic member 10Cf and the high temperature side heat exchanger 40B.

  The heat conductive members 30Ab-30Bg are made of a material having a high thermal conductivity so that heat transfer can be performed efficiently. Therefore, as shown in FIG. 7, when the heat conducting members 30Ab-30Bg are positioned across the magnetic bodies of the adjacent magnetic body units, originally, it is desired to transfer heat only between one magnetic body unit. Heat leaks to the adjacent magnetic unit. This causes a decrease in heat transport capacity and heat transport efficiency. The heat conducting member having thermal anisotropy according to this embodiment solves this problem by imparting anisotropy to the heat transfer coefficient.

(Configuration of heat conduction member)
The heat conducting member with thermal anisotropy according to the present embodiment is a heat conducting member that conducts heat through a magnetic material that exhibits a magnetocaloric effect, and the heat conductivity of the base material that constitutes the heat conducting member is Compared with the thermal conductivity in one direction in which the magnetic bodies are arranged, the thermal conductivity in the direction intersecting with the one direction in which the magnetic bodies are arranged is made smaller.

  FIG. 8 is a cross-sectional view of a heat conducting member having thermal anisotropy according to the present embodiment. In this figure, the heat conductive member 30 is comprised by the base material 32 used as the nucleus of a heat conductive member, and the nanostructure 34 which covers the surface of a base material.

  Regarding the thermal conductivity of the base material 32 constituting the heat conductive member 30, the thermal conductivity λL in the longitudinal direction of the base material 32 is smaller than the thermal conductivity λv in the width direction of the base material 32. Here, the width direction of the base material 32 is the thickness direction of the base material 32 from left to right in FIG. 8, and is a direction (one direction) in which the magnetic bodies constituting the magnetic body unit are arranged. More specifically, in FIG. 6 and FIG. 7, it is the direction in which the magnetic bodies 10Aa-10Af are arranged. Moreover, the longitudinal direction of the base material 32 is the length direction of the base material 32 from the top to the bottom in FIG. 8, and this is a direction intersecting with one direction in which the magnetic bodies are arranged. More specifically, in FIG. 6 and FIG. 7, the magnetic body units of the magnetic bodies 10Aa-10Af, the magnetic body units of the magnetic bodies 10Ba-10Bf, and the magnetic body units of the magnetic bodies 10Ca-10Cf are aligned.

  The nanostructure 34 that covers the surface of the substrate 32 is provided on at least the surface facing the magnetic body. For example, in FIGS. 6 and 7, the nanostructure 34 is provided on the surface facing the magnetic bodies 10Aa and 10Ab. As shown in FIG. 8, the nanostructure 34 is formed in the length direction of the base material 32 with a thickness in the width direction of the base material 32. By providing the nanostructure 34, the heat transfer coefficient in the width direction of the heat conducting member 30 can be increased. As a technique for arranging the nanostructures on the base material 32, a known technique (see, for example, JP-T-2009-537339) is used.

  When the heat conducting member 30 is configured as described above, for example, as shown in FIGS. 7 and 9, even if the heat conducting member 30Ab is located between the magnetic bodies 10Aa-10Ab and between the magnetic bodies 10Ba-10Bb, Most of the heat is transferred between the bodies 10Aa and 10Ab and between the magnetic bodies 10Ba and 10Bb. On the other hand, almost no heat is transferred between the magnetic bodies 10Aa and 10Ba and between the magnetic bodies 10Aa and 10Bb.

  This is because the thermal conductivity λv in the width direction of the heat conducting member 30 is overwhelmingly larger than the thermal conductivity λL in the longitudinal direction. Therefore, according to the heat transfer member of the present embodiment, it is possible to prevent a decrease in heat transport capability and heat transport efficiency of heat from the low temperature side heat exchange unit 40A toward the high temperature side heat exchange unit 40B. According to the experiment, when the heat conductivity λL in the longitudinal direction of the heat conducting member 30 becomes 1/10 of the heat conductivity λv in the width direction of the heat conducting member 30, the refrigerating capacity is improved by 20%.

  The effect of preventing the heat transport ability and heat transport efficiency of the heat from the low temperature side heat exchange section 40A toward the high temperature side heat exchange section 40B is the heat conduction member in which the nanostructure 34 is formed on the surface of the base material 32. By using 30, the size can be further increased. This is because the provision of the nanostructure 34 increases the heat transfer coefficient in the width direction of the heat conducting member 30.

(Structure of base material)
The base material 32 constituting the heat conducting member 30 is configured as follows in order to have thermal anisotropy.

  FIG. 10 is an enlarged view of the base material 32 formed of a fibrous material. The base material 32 is formed by bundling a plurality of fibrous heat conductive materials in a direction crossing the magnetic material alignment direction with the cross section of the heat conductive material facing the magnetic material alignment direction.

  Specifically, as shown in FIG. 10, a cylindrical fiber 33 having a high thermal conductivity in the fiber length direction is used as the fibrous material forming the base material 32. The shape of the fiber 33 is not limited to a cylindrical shape, and may be various shapes such as a quadrangle, a triangle, and an ellipse. The thermal conductivity in the radial direction of the fiber 33 is smaller than the thermal conductivity in the length direction.

  The fibers 33 are bundled in the thickness direction and the longitudinal direction of the base material 32 so that the circular cross section of the fibers 33 is arranged on the surface in contact with the magnetic body. Although not shown, a material having a low thermal conductivity may be embedded in the gap between the fibers 33. By embedding a material having a small thermal conductivity, the thermal conductivity in the radial direction of the fibers 33 can be made smaller than the thermal conductivity in the length direction.

  Thus, when the base material 32 is formed of the fibers 33, the thermal conductivity in the longitudinal direction of the base material 32 becomes small. Therefore, as shown in FIG. 8, the thermal conductivity λv in one direction in which the magnetic bodies are arranged is large, and the thermal conductivity λL in the other direction can be decreased, and the thermal conduction member 30 has a thermal anisotropy. Can be given.

  FIG. 11 is an enlarged view of the base material 32 formed by laminating a plurality of heat conductive materials having different heat conductivities. 11A is a plan view of the base material 32 as viewed from above as shown in FIGS. 6 and 7, and FIG. 11B is a perspective view of the base material 32.

  As shown in FIG. 11, the base material 32 is formed by laminating a heat conductive material 34 </ b> A having a high thermal conductivity and a heat conductive material 34 </ b> B having a low heat conductivity alternately arranged in a direction crossing the alignment direction of the magnetic bodies. Form. A metal such as copper, aluminum, or silicon carbide is used as the heat conductive material having a high thermal conductivity, and a material other than a metal such as glass is used as the heat conductive material having a low thermal conductivity.

  The thickness of the thermal conductive material 34A having a large thermal conductivity (the thickness in the longitudinal direction of the base material 32) is made larger than the thickness of the thermal conductive material 34B having a small thermal conductivity. If this is not done, the thermal conductivity in the width direction of the substrate 32 becomes high, and the thermal anisotropy cannot be increased. For this reason, as shown in FIG. 11, it is preferable that the thickness of the heat conductive material 34A having a high thermal conductivity is set to about 4 to 10 times the thickness of the heat conductive material 34B having a low conductivity.

  When the ratio of the thicknesses of the heat conductive material 34A and the heat conductive material 34B is set in this way, the heat conductivity in the longitudinal direction of the base material 32 becomes small. Therefore, as shown in FIG. 8, the thermal conductivity λv in one direction in which the magnetic materials are arranged is large, and the thermal conductivity λL in the direction intersecting with the one direction in which the magnetic materials are arranged can be reduced. 30 can have thermal anisotropy.

  FIG. 12 is an enlarged view of the base material 32 formed by blending and orienting a plurality of heat conductive materials having different heat conductivities.

  As shown in FIG. 12, in the base material 32, a heat conducting material 37 having a high thermal conductivity such as a carbon nanotube or graphene is blended with a heat conducting material 36 having a low thermal conductivity such as a polymer, and the alignment direction of the magnetic materials. Compared to the thermal conductivity, the orientation is formed such that the thermal conductivity in the direction crossing the direction in which the magnetic materials are arranged is smaller. Specifically, as shown in FIG. 12, carbon nanotubes and graphene are mixed in the heat conductive material 36 having a low thermal conductivity, and the long axes of the carbon nanotubes and graphene are aligned in the width direction of the substrate 32. .

  When the long axes of carbon nanotubes and graphene are aligned in the width direction of the substrate 32, the aligned carbon nanotubes and graphene form a network with each other. For this reason, the thermal conductivity of the longitudinal direction of the base material 32 becomes small. Therefore, as shown in FIG. 8, the thermal conductivity λv in one direction in which the magnetic materials are arranged is large, and the thermal conductivity λL in the direction intersecting with the one direction in which the magnetic materials are arranged can be reduced. 30 can have thermal anisotropy.

  FIG. 13 is a diagram showing the shape of the base material 32. In the above embodiment, the rectangular-shaped base material 32 was illustrated and demonstrated. In addition to this shape, the shape of the base material is a shape in which rectangular corners are chamfered as shown in FIG. 13A, a shape in which both ends of the rectangle are formed in a triangular shape as shown in FIG. 13B, and as shown in FIG. 13C. Various shapes such as a shape in which one end of a rectangle is formed in a triangular shape, and an elliptical shape streamlined as shown in FIG. 13D can be used.

  Since the heat conducting member 30 is inserted while moving between the magnetic body and the magnetic body, by making the shape of the base material 32 sharp in the moving direction of the heat conducting member 30, The insertion between the magnetic body and the magnetic body is performed smoothly, and the insertion resistance can be reduced. In particular, it is preferable to adopt a shape as shown in FIGS. 13B, 13C, and 13D.

(Nanostructure structure)
FIG. 14 is a view showing a heat conducting member in which a nanostructure is formed by arranging nanotubes on the surface of the base material 32 facing the magnetic body.

  The nanostructure 34 covering the surface of the base material 32 shown in FIG. 8 is formed by arranging carbon nanotubes 34C extending from the surface of the base material 32 in one direction in which magnetic materials are arranged as shown in FIG. . In the case of FIG. 14A, the carbon nanotube 34C is grown in the thickness direction of the rectangular base material 32, that is, in the direction from the left to the right in FIG. 14 and in the direction in which the magnetic bodies constituting the magnetic unit are arranged. These are arranged at a uniform density in the longitudinal direction of the substrate 32. Thus, the heat transfer coefficient in the width direction of the heat conducting member 30 can be increased by forming the nanostructure 34 with the carbon nanotube 34C.

  In the case of FIG. 14B, the carbon nanotube 334C is grown in the thickness direction of the rectangular base material 32 whose one end is triangular. The density of the arrangement of the carbon nanotubes 34C is such that the triangular portion (tip portion) of the base material 32 is rougher than the other portions. This is to reduce the insertion resistance when the heat conducting member 30 is inserted between the magnetic bodies.

  In the case of FIG. 14C, the carbon nanotubes 34C are grown in the thickness direction of the streamlined elliptical base material 32. The density of the arrangement of the carbon nanotubes 34C is such that both end portions of the base material 32 are rougher than the other portions. This is to reduce the insertion resistance when the heat conducting member 30 is inserted between the magnetic bodies. In the case of this heat conducting member 30, since the density of the arrangement of the carbon nanotubes 34C is made rough at both ends of the heat conducting member 30, the insertion resistance can be reduced with respect to the movement of the heat conducting member 30 in both directions along its longitudinal direction. .

  In the case of FIG. 14D, similarly to FIG. 14C, the carbon nanotube 34C is grown in the thickness direction of the streamlined elliptical base material 32. The density of the arrangement of the carbon nanotubes 34 </ b> C is uniform in the longitudinal direction of the base material 32. The length of the carbon nanotube 34 </ b> C is such that the central portion of the base material 32 is short and becomes longer toward both ends of the base material 32.

  The nanostructure 34 covering the surface of the substrate 32 shown in FIG. 8 can have a sponge structure in which fibrous nanotubes are entangled vertically and horizontally. A sponge structure can be formed by growing a large number of carbon nanotubes randomly and entwining them in a fibrous form. Thus, by making the nanostructure 34 into a sponge structure, the heat transfer coefficient in the width direction of the heat conducting member 30 can be increased, and at the same time, wear resistance against contact with the magnetic body can be provided. . Therefore, the durability of the heat conducting member 30 can be increased.

  Furthermore, a lubricant containing fine particles having a large thermal conductivity can be included in the nanostructure 34 having a sponge structure. Examples of the fine particles having a high thermal conductivity include nano diamond (powdered diamond). When a lubricant containing nanodiamond is included in the nanostructure 34, the nanostructure 34 is deformed flexibly when it comes into contact with the magnetic body, and heat transfer between the nanostructure 34 and the magnetic body is improved. Moreover, since nano diamond is contained, the durability of the heat conducting member 30 can be increased against friction with the magnetic material.

  The above is the configuration of the heat conducting member having thermal anisotropy according to the present embodiment. Next, a magnetic refrigerator using this heat conducting member will be described.

(Configuration and operation of magnetic refrigerator)
FIG. 15 is a top view showing a schematic configuration of the magnetic refrigerator according to this embodiment, and shows a state seen through from above so that the positional relationship among the magnetic body, the permanent magnet forming the magnetic circuit, and the heat conducting member can be understood. FIG. 16A to 16C are top views of the heat exchange unit support plate, the magnetic body arrangement plate, and the magnet / heat conduction unit arrangement plate that constitute the magnetic refrigerator shown in FIG. FIG. 17 is an exploded cross-sectional view of the magnetic refrigerator shown in FIG. FIG. 18 is a schematic diagram for explaining how heat moves when the magnet / heat conduction unit arrangement plate of the magnetic refrigerator according to the present embodiment is rotated. FIG. 19 is a diagram for explaining the operation of the magnetic refrigerator according to the present embodiment. FIG. 18 omits the description of the drive unit shown in FIG. 17 in order to facilitate understanding of the invention.

  The magnetic refrigerator according to this embodiment uses the same principle as the magnetic refrigeration shown in FIG. In order to perform magnetic refrigeration using this principle, it is configured as follows.

  As shown in FIGS. 15 to 18, a magnetic refrigerator 500 according to the present embodiment includes a circular heat exchange unit support plate 600 (see particularly FIG. 16A), a hollow disk-shaped magnetic body arrangement plate having an open center. 700 (especially refer to FIG. 16B) and a hollow disk-like magnet / heat conduction part arrangement plate 800 (particularly refer to FIG. 16C) having an open center. The heat exchanging part support board 600 has a low temperature side heat exchanging part 40A at the center thereof, and has a high temperature side heat exchanging part 40B at the outer periphery thereof. The magnet / heat conduction part arrangement plate 800 has two disks, an upper disk 800A and a lower disk 800B, which are arranged with a gap (see particularly FIG. 17). In the magnetic refrigerator 500, a heat exchanging unit support plate 600, a magnetic body arrangement plate 700, and a magnet / heat conduction unit arrangement plate 800 are arranged concentrically (see particularly FIGS. 15, 17, and 18). The magnetic body arranging plate 700 is inserted between the upper disc 800A and the lower disc 800B of the magnet / heat conducting unit arranging plate 800 (see FIGS. 17 and 18 in particular). The low temperature side heat exchanging portion 40A is arranged in the hollow portion at the center of the magnetic material arranging plate 700 and the magnet / heat conducting portion arranging plate 800. The high temperature side heat exchanging part 40B is arranged on the outer peripheral part of the magnetic body arranging plate 700 and the magnet / heat conducting unit arranging plate 800 (see particularly FIGS. 15, 17, and 18). In the present embodiment, since it is assumed that a positive magnetic body is arranged on the magnetic body arrangement plate 700, the low-temperature side heat exchange section 40A is arranged at the center of the heat exchange section support board 600. The high temperature side heat exchanging part 40B is arranged on the outer peripheral part. When a negative magnetic material is arranged on the magnetic material arranging plate 700, the high temperature side heat exchange unit 40B is arranged at the center of the heat exchange unit support board 600, and the low temperature side heat exchange unit 40A is arranged on the outer periphery thereof. . The arrangement of the low temperature side heat exchange unit 40A and the high temperature side heat exchange unit 40B differs depending on which of the positive and negative magnetic bodies is used for the magnetic body arrangement plate 700.

  As shown in FIG. 16A, a cylindrical low temperature side heat exchanging unit 40A that also serves as a fixed shaft of the magnet / heat conducting unit arrangement plate 800 is erected at the center of the heat exchanging unit support plate 600 of the magnetic refrigerator 500. It is. In addition, a cylindrical high temperature side heat exchanging portion 40 </ b> B for fixing the magnetic body arranging plate 700 is erected along the outer periphery of the heat exchanging portion support plate 600 at the outer peripheral portion of the heat exchanging portion support plate 600.

  As shown in FIG. 16B, the magnetic body arranging plate 700 is a hollow disk having an opening at the center thereof, and the opening diameter at the center is slightly larger than the diameter of the columnar low temperature side heat exchanging portion 40A. is there. Moreover, the diameter of the magnetic body arrangement | positioning board 700 is made the same as the dimension of the inner periphery of the cylindrical high temperature side heat exchange part 40B. As shown in FIG.17 and FIG.18, the magnetic body arrangement | positioning board 700 is being fixed to the high temperature side heat exchange part 40B. It is preferable to interpose a heat insulating material (not shown) between the magnetic body arrangement plate 700 and the high temperature side heat exchange unit 40B so that heat does not move between the magnetic body arrangement plate 700 and the high temperature side heat exchange unit 40B. .

  As shown in FIG. 16B, a plurality of magnetic bodies are formed annularly and radially at intervals on one side of the magnetic body arranging plate 700 (opposite surface of the disc 800A). In the present embodiment, twelve magnetic units 200A, 200B, 200C,..., 200G,..., 200L are formed adjacent to each other in the circumferential direction in a region on the magnetic member arranging plate 700 divided by a central angle of 30 °. doing. Each of the magnetic body units 200 </ b> A, 200 </ b> B, 200 </ b> C,..., 200 </ b> G, ..., 200 </ b> L has six magnetic bodies arranged from the center to the outer periphery of the magnetic body arranging plate 700. For example, the magnetic body unit 200A arranges magnetic bodies 10Aa, 10Ab, 10Ac, 10Ad, 10Ae, and 10Af, and the magnetic body unit 200B arranges magnetic bodies 10Ba, 10Bb, 10Bc, 10Bd, 10Be, and 10Bf, respectively. In each magnetic body unit, a pair of two magnetic bodies forms a magnetic body block. For example, in the magnetic body unit 200A, the magnetic bodies 10Aa and 10Ab form the magnetic body block 100Aa, the magnetic bodies 10Ac and 10Ad form the magnetic body block 100Ab, and the magnetic bodies 10Ae and 10Af form the magnetic body block 100Ac. In the magnetic unit 200B, the magnetic bodies 10Ba and 10Bb form the magnetic body block 100Ba, the magnetic bodies 10Bc and 10Bd form the magnetic body block 100Bb, and the magnetic bodies 10Be and 10Bf form the magnetic body block 100Bc.

  Therefore, in the magnetic body arrangement plate 700 of this embodiment, each of the magnetic body units 200A, 200B, 200C, ..., 200G, ..., 200L has three magnetic body blocks 100Aa-100Ab-100Ac, 100Ba-100Bb-100Bc, ... Formed with. In addition, each of the magnetic blocks 100Aa, 100Ab, 100Ac, 100Ba, 100Bb, 100Bc,... Has two magnetic bodies, 10Aa-10Ab, 10Ac-10Ad, 10Ae-10Af, 10Ba-10Bb, 10Bc-10Bd, 10Be-10Bf, ... is formed. When attention is paid to one magnetic body unit 200A of the magnetic body arrangement plate 700 of the present embodiment, the magnetic body unit 200A is formed of six magnetic bodies 10Aa, 10Ab, 10Ac, 10Ad, 10Ae, 10Af. These magnetic bodies have three magnetic body blocks 100Aa, 100Ab, and 100Ac. These magnetic blocks are formed of a set of two magnetic bodies 10Aa-10Ab, 10Ac-10Ad, and 10Ae-10Af. The magnetic body units 200B to 200L are formed in the same manner as the magnetic body unit 200A. For this reason, the magnetic body arrangement | positioning board 700 of this embodiment becomes a structure equivalent to what arranged the magnetic body unit 200 shown in FIG. 1A in 12 rows in parallel.

  In this embodiment, as shown in FIG. 20, a DLC (diamond-like carbon) film 15 is formed on the surface of the magnetic bodies 10Aa-10Bf. The DLC film 15 is provided on a surface facing a heat conductive member to be described later. Although it can be provided on the entire surface of the magnetic material, the DLC film 15 becomes a magnetic resistance, so it is preferable to form it only on the opposing surface as much as possible. When the DLC film 15 is formed on the surface facing the heat conducting member, the surface of the magnetic body can be protected and the wear resistance against the heat conducting member can be improved.

  The magnetic bodies 10Aa,... Used in the present embodiment may be directly formed on the magnetic body arrangement plate 700. However, in order to effectively use the magnetocaloric effect, the magnetic body arrangement board 700 has a thermal resistance. It is desirable that the material is made of a large material. This is because if the thermal resistance is small, the heat generated by the magnetic bodies 10Aa,... Further, in order to increase the thermal resistance, the magnetic bodies 10Aa,... Are not directly formed on the magnetic body arrangement plate 700, but a heat insulating film between the magnetic bodies 10Aa,. Alternatively, a heat insulating layer may be provided.

  Further, the magnetic bodies 10Aa,... May be integrally formed on the magnetic body arrangement plate 700 as a magnetic body unit 200A,... Via a heat insulating film or a heat insulating layer. Further, the magnetic material blocks 100Aa,... May be divided and formed via a heat insulating film or a heat insulating layer and arranged on the magnetic material arranging plate 700.

  The magnetic bodies 10Aa,... Are formed of the same material in this embodiment, and positive magnetic bodies are used as the same material. A positive magnetic substance is in a paramagnetic state (magnetic spin is in a disordered state) when no magnetism is applied, and in a paramagnetic state (magnetic spin is aligned in one direction) when magnetism is applied. Manufactured using a material that reversibly produces a ferromagnetic state.

  As the material of the positive magnetic body, Gd-Y series, Gd-Dy series, Gd-Er series, Gd-Ho series, La (Fe, Si) 13 and La (which are alloys based on Gd and Gd) are used. Magnetic materials such as Fe, Al) 13 can be used.

  On the other hand, although not used in the present embodiment, a negative magnetic material can be used as the same material for the magnetic bodies 10Aa,. Negative magnetic materials have different ordered states when no magnetism is applied and when magnetism is applied. In addition, the negative magnetic material has a higher order when the magnetism is not applied than when the magnetism is applied. The negative magnetic material uses a material that causes an order-order transition between the two ordered states with application / removal of magnetism. A negative magnetic material is in an antiferromagnetic state (state where adjacent spins are aligned in opposite directions) when no magnetism is applied, and is in a ferromagnetic state (adjacent spins in one direction when magnetism is applied). In the same state). A negative magnetic material can be manufactured using a material in which an antiferromagnetic state and a ferromagnetic state are reversibly generated when the magnetic moment of the material changes greatly.

  As the negative magnetic material, a magnetic material such as an FeRh alloy, CoMnSiGe system, or NiMnSn system can be used.

  Generally, positive and negative magnetic materials generate heat or absorb heat opposite to the application of magnetism, so the magnetocaloric effect of positive and negative magnetic materials The magnitude of the temperature change is different. Therefore, when one of the positive and negative magnetic bodies is used as in this embodiment, the magnitude of the temperature change due to the magnetocaloric effect of all the magnetic bodies is the same. Therefore, stable heat transfer characteristics can be obtained as a whole of the magnetic refrigerator, and heat transport efficiency can be improved. In addition, since the magnetocaloric effect of the negative magnetic material is smaller than the magnetocaloric effect of the positive magnetic material, considering the heat transport efficiency, the magnetic material arranging plate 700 is configured using the positive magnetic material. It is preferable. Furthermore, since a negative magnetic material is rarer than a positive magnetic material, the magnetic material arranging plate 700 can be configured using a positive magnetic material in terms of cost. preferable.

  In the present embodiment, the shape of the magnetic bodies 10Aa,... Is as shown in FIG. 15, FIG. 16B, and FIG. For example, a spherical shape, an ellipsoidal shape, a cubic shape, a cylindrical shape, an elliptical columnar shape, or the like may be adopted.

  As described above, the magnetic body arranging plate 700 includes the magnetic body blocks 100Aa,... In which the magnetic bodies 10Aa,. Furthermore, it has magnetic body unit 200A which arrange | positioned magnetic body block 100Aa ... in multiple rows | lines at intervals in the arrangement direction of magnetic body 10Aa. In the magnetic body arranging plate 700, a plurality of the magnetic body units 200A are arranged adjacent to each other at intervals in the circumferential direction intersecting the arrangement direction of the magnetic bodies 10Aa,.

  Since the magnetic body arrangement | positioning board 700 is comprised as mentioned above, 40A of low temperature side heat exchange parts are the magnetic body units 200A, 200B, 200C, ..., 200G, ..., 200L formed in the magnetic body arrangement board 700. Are adjacent to each other with a gap therebetween. Further, the high temperature side heat exchanging section 40B includes magnetic bodies 10Af, 10Bf,... Located at the other end of the magnetic body units 200A, 200B, 200C,. Adjacent with a gap.

  As shown in FIG. 16C, the magnet / heat conduction part arrangement plate 800 is a hollow disk whose center part is opened, and the opening diameter of the center part is a columnar low temperature side heat that the heat exchange part support plate 600 has. It is slightly larger than the diameter of the exchange part 40A. Moreover, the diameter of the magnet / heat conduction part arrangement | positioning board 800 is made slightly smaller than the dimension of the inner periphery of the cylindrical high temperature side heat exchange part 40B which the heat exchange part support board 600 has. This is because the magnet / heat conduction part arrangement plate 800 can be rotated between the low temperature side heat exchange part 40A and the high temperature side heat exchange part 40B. As shown in FIGS. 17 and 18, the magnet / heat conduction unit arrangement plate 800 includes two upper and lower disks 800 </ b> A that are magnetically connected to each other with a magnetic material arrangement plate 700 interposed between them. It is composed of 800B.

  The two disks 800A and 800B on the upper side and the lower side can be separately rotated around the low-temperature side heat exchange unit 40A, and the bearings provided in the low-temperature side heat exchange unit 40A and the two upper and lower disks It is supported by bearings provided at the outer peripheral ends of the disks 800A and 800B. As shown in FIG. 17, the upper disk 800A is rotatably supported by bearings 520Aa and 520Ab, and the lower disk 800B is rotatably supported by bearings 520Ba and 520Bb. Therefore, the upper disk 800A can rotate separately from the lower disk 800B.

  A support plate 530 is arranged so as to surround the magnet / heat conducting unit arrangement plate 800. The support board 530 fixes servo motors 540A and 540B for separately rotating the upper and lower disks 800A and 800B. The servo motor 540A is fixed to a portion facing the upper disc 800A of the support plate 530, and the servo motor 540B is fixed to a portion facing the lower disc 800B of the support plate 530. Gears 550A and 550B are attached to the respective rotation shafts of the servo motors 540A and 540B. A ring gear 560A that meshes with the gear 550A is attached to the outer periphery of the upper disk 800A. A ring gear 560B that meshes with the gear 550B is attached to the outer periphery of the lower disc 800B. The servo motors 540A and 540B, the gears 550A and 550B, and the ring gears 560A and 560B constitute a drive unit.

  When the servo motor 540A rotates, the ring gear 560A meshing with the gear 550A rotates to rotate the upper disk 800A. When the servo motor 540B rotates, the ring gear 560B meshing with the gear 550B rotates to rotate the lower disk 800B. When the servo motors 540A and 540B are rotated in synchronization, the upper and lower disks 800A and 800B rotate together.

  In the present embodiment, the servo motors 540A and 540B are rotated in synchronization. Therefore, the magnet / heat conduction unit arrangement plate 800 is arranged so that the magnetic body arrangement plate 700 is sandwiched between the upper and lower disks 800A and 800B with the low temperature side heat exchange unit 40A as the center, and the low temperature side heat exchange unit 40A. It rotates with the high temperature side heat exchange part 40B.

  As shown in FIG. 16C, on one side of the upper disk 800A forming the magnet / heat conducting portion arrangement plate 800 (the lower side of the disk 800A shown in FIGS. 17 and 18), a plurality of permanent members are annularly and radially arranged. A magnet and a plurality of heat conducting members are arranged. The configuration of the heat conducting member arranged here is that shown in FIGS. That is, a nanostructure is formed on the surface facing the magnetic body.

  The permanent magnets are magnetic body blocks 100Aa, 100Ab, 100Ac, 100Ba, 100Bb, 100Bc,... Of the magnetic body units 200A, 200B, 200C,..., 200G,. The permanent magnets are arranged so as to face each other. Permanent magnets have magnets of adjacent magnetic body units 200A, 200B, 200C,..., 200G,..., 200L each time the magnet / heat conducting portion arrangement plate 800 rotates 30 ° and moves to the adjacent magnetic body unit. The body blocks 100Aa, 100Ab, 100Ac, 100Ba, 100Bb, 100Bc,... Reciprocate in the radial direction.

  For example, as shown in FIG. 15, FIG. 16B, FIG. 16C, and FIG. 18, the permanent magnet 20Aa at the corresponding position of the magnetic unit 200A in the upper disk 800A of the magnet / heat conducting unit arrangement plate 800 in the drawing, 20Ac and 20Ae are at positions facing the magnetic bodies 10Aa, 10Ac, and 10Ae of the magnetic body unit 200A of the magnetic body arrangement plate 700, respectively. Further, the permanent magnets 20Ba, 20Bc, and 20Be at the corresponding positions of the magnetic body unit 200B are respectively at positions facing the magnetic bodies 10Bb, 10Bd, and 10Bf of the magnetic body unit 200B. In this state, when the magnet / heat conducting unit arrangement plate 800 rotates 30 ° clockwise, the permanent magnets 20Aa, 20Ac, 20Ae at the corresponding positions of the magnetic body unit 200A become the magnetic bodies 10Ba, 10Bc, It is a position facing 10Be. In addition, the permanent magnets at the corresponding positions of the magnetic body unit 200L are positions facing the magnetic bodies 10Ab, 10Ad, and 10Af of the magnetic body unit 200A. That is, each time the magnet / heat conducting unit arrangement plate 800 rotates 30 ° clockwise, the permanent magnets reciprocate for each magnetic block in each magnetic unit 200A, 200B, 200C,..., 200G,. To do. The positional relationship between the permanent magnet and the magnetic body is the same as the positional relationship shown in FIG. 1A and the positional relationship shown in FIG. 1B repeated every time the magnet / heat conducting unit arrangement plate 800 rotates 30 °.

  Therefore, when the magnet / heat conducting portion arrangement plate 800 is moved in the direction in which the magnetic body units 200A, 200B, 200C,..., 200G,. To do.

  First, as shown in FIG. 15 and FIG. 18A, the permanent magnets 20Aa, 20Ac, and 20Ae are formed of magnetic bodies 10Aa, 10Ac, and 10Aa located at one end of each of the magnetic body blocks 100Aa, 100Ab, and 100Ac of one adjacent magnetic body unit 200A. Magnetism is simultaneously applied to 10Ae. As shown in FIGS. 15 and 18B, the permanent magnets 20Ba, 20Bc, and 20Be are magnetic bodies 10Bb and 10Bd that are positioned at the other ends of the respective magnetic body blocks 100Ba, 100Bb, and 100Bc of the other adjacent magnetic body unit 200B. 10Bf is simultaneously magnetized. Also in the other magnetic body units 200C-200L, the positional relationship between the permanent magnet and the magnetic body between two adjacent magnetic body units is the same as in the case of the magnetic body units 200A and 200B. The positional relationship between the permanent magnet and the magnetic body as described above between two adjacent magnetic body units is referred to as state 1.

  Next, when the magnet / heat conducting portion arrangement plate 800 is rotated 30 ° clockwise, the permanent magnets 20Aa, 20Ac, 20Ae are one ends of the magnetic body blocks 100Ba, 100Bb, 100Bc of the other adjacent magnetic body unit 200B. Magnetism is simultaneously applied to the magnetic bodies 10Ba, 10Bc, and 10Be located at the same position. This state is equivalent to the movement of the permanent magnets 20Ba, 20Bc, 20Be shown in FIG. 18B to the left magnetic body magnetic bodies 10Ba, 10Bc, 10Be. On the other hand, the permanent magnet present at the corresponding position of the magnetic body unit 200L is simultaneously magnetized to the magnetic bodies 10Ab, 10Ad, 10Af located at the other ends of the respective magnetic body blocks 100Aa, 100Ab, 100Ac of one adjacent magnetic body unit 200A. Is applied. This state is equivalent to the movement of the permanent magnets 20Aa, 20Ac, 20Ae shown in FIG. 18A to the right magnetic bodies 10Ab, 10Ad, 10Af. Also in the other magnetic body units 200C-200L, the positional relationship between the permanent magnet and the magnetic body between two adjacent magnetic body units changes in the same manner as in the case of the magnetic body units 200A and 200B. The positional relationship between the permanent magnet and the magnetic body as described above between two adjacent magnetic body units is referred to as state 2.

  As described above, every time the magnet / heat conducting unit arrangement plate 800 rotates 30 °, the above-described state 1 and state 2 are repeated in all the magnetic units 200A, 200B, 200C,..., 200G,. . That is, in each magnetic body unit 200A, 200B, 200C, ..., 200G, ..., 200L, the states of FIGS. 1A and 1B are repeated.

  Magnetic protrusions are formed on one side of the lower disk 800B that forms the magnet / heat conducting unit arrangement plate 800 (the upper side of the disk 800B shown in FIGS. 17 and 18). The magnetic protrusions are arranged in correspondence with the arrangement of the permanent magnets arranged on one side of the upper disk 800A. For example, as shown in FIGS. 17 and 18, a magnetic projection 20Ab is arranged corresponding to the permanent magnet 20Aa, a magnetic projection 20Ad is arranged corresponding to the permanent magnet 20Ac, and a magnetic projection 20Af is arranged corresponding to the permanent magnet 20Ae. ing. Further, a magnetic protrusion 20Bb is disposed corresponding to the permanent magnet 20Ba, a magnetic protrusion 20Bd is disposed corresponding to the permanent magnet 20Bc, and a magnetic protrusion 20Bf is disposed corresponding to the permanent magnet 20Be. Receiving the magnetic lines of force from each permanent magnet with magnetic protrusions that confront each other to minimize the magnetic resistance between the permanent magnets and the magnetic protrusions, and to allow the magnetic lines of force from the permanent magnet to pass through the magnetic material without leakage. Because.

  The heat conducting member arrangement plate 800 is composed of two magnetically connected flat plates that sandwich the magnetic material arrangement plate 700 with a gap. The permanent magnets disposed on the upper disk 800A and the magnetic protrusions disposed on the lower disk 800B form a magnetic circuit between the upper disk 800A and the lower disk 800B. This magnetic circuit constitutes a magnetic application unit. In the present embodiment, a permanent magnet is used as means for generating magnetism in the magnetic application unit. However, instead of using a permanent magnet, a superconducting magnet or an electromagnet can be used. When the magnetic circuit is composed of an electromagnet, the magnitude of the magnetism applied to the magnetic body can be changed within a certain range, so that the magnetism applying unit can have versatility. However, it is desirable to use a permanent magnet from the viewpoint of energy saving and practicality.

  In this embodiment, a permanent magnet is disposed on the upper disk 800A and a magnetic protrusion is disposed on the lower disk 800B. Conversely, a magnetic protrusion is disposed on the upper disk 800A. It is also possible to dispose a permanent magnet on the lower disk 800B. Moreover, in this embodiment, although both discs are rotated integrally, both discs may be provided separately as long as they are magnetically connected. Since the upper disc 800A and the lower disc 800B are magnetically connected and the permanent magnet and the magnetic projection are provided opposite to each other, the magnetic flux from the permanent magnet can be effectively utilized, and the permanent magnet can be downsized. Weight reduction is possible.

  As shown in FIG. 15, FIG. 16C, FIG. 17, and FIG. 18, a heat conducting member is attached to each outer peripheral side of all the permanent magnets included in the magnet / heat conducting section arrangement plate 800. The heat conducting member is a rotation direction of the magnet / heat conducting part arrangement plate 800 between the magnetic substance, between the magnetic substance and the low temperature side heat exchange part, and between the magnetic substance and the high temperature side heat exchange part. Is inserted and removed. When the heat conducting member is inserted between the magnetic bodies, heat is conducted between the magnetic bodies. Further, when the heat conducting member is inserted between the magnetic body and the low temperature side heat exchange part, heat is conducted between the magnetic body and the low temperature side heat exchange part. Further, when the heat conducting member is inserted between the magnetic body and the high temperature side heat exchange part, heat is conducted between the magnetic body and the high temperature side heat exchange part.

  As shown in FIG. 16C, the heat conducting member is formed of a magnetic material on one side of the upper disc 800A (the lower side of the disc 800A shown in FIGS. 17 and 18) forming the magnet / heat conducting unit arrangement plate 800. , 200G,..., 200L for each of the units 200A, 200B, 200C,. As shown in FIG. 16C, three heat transfer members 30Ab, 30Ad, and 30Af are provided on the outer peripheral side of the permanent magnets 20Aa, 20Ac, and 20Ae at the corresponding positions of the magnetic body unit 200A. Four heat transfer members 30Ba, 30Bc, 30Be, and 30Bg are provided at corresponding positions of the magnetic unit 200B. The heat transfer member 30Ba is provided at a position in contact with the low temperature side heat exchange part 40A. The heat transfer members 30Bc, 30Be, and 30Bg are provided on the outer peripheral side of the permanent magnets 20Ba, 20Bc, and 20Be.

  All the heat conducting members 30Ab, 30Ad, 30Af, 30Ba, 30Bc, 30Be, 30Bg,... Are made of a solid heat conducting material having thermal anisotropy as described above. Further, as shown in FIG. 14, the heat conducting members 30Ab,... Are in contact with the magnetic bodies 10Aa,..., The low temperature side heat exchanging portion 40A, and the high temperature side heat exchanging portion 40B to slide the carbon nanotube 34C. Arranged. Therefore, as shown in FIG. 21, even if the heat conducting member 30Ab is located between the magnetic bodies 10Aa-10Ab and between the magnetic bodies 10Ba-10Bb, the heat conducting member 30Ab is almost between the magnetic bodies 10Aa and 10Ab and between the magnetic bodies 10Ba and 10Bb. The heat is transferred. On the other hand, almost no heat is transferred between the magnetic bodies 10Aa and 10Ba and between the magnetic bodies 10Aa and 10Bb. This is because the thermal conductivity λv in the width direction of the heat conducting member 30 is overwhelmingly larger than the thermal conductivity λL in the longitudinal direction. Since the DLC film 15 is formed on the surface of the magnetic bodies 10Aa,... That is in contact with the heat conducting member 30, the wear resistance of the magnetic bodies 10Aa,.

  The thickness of the heat conducting member in the radial direction fits in the gap between the magnetic body, the magnetic body, between the magnetic body and the low temperature side heat exchange unit 40A, and between the magnetic body and the high temperature side heat exchange unit 40B. The size is slightly larger. For example, the radial thickness of the heat conducting members 30Ab, 30Ad, 30Af, 30Ba, 30Bc, 30Be, 30Bg,... 10Ba, magnetic bodies 10Bb-10Bc, 10Bd-10Be, magnetic body 10Bf and high temperature side heat exchange part 40B, while being inserted into the respective gaps, heat can be conducted between them. In addition, the shape of the heat conducting members 30Ab, 30Ad, 30Af, 30Ba, 30Bc, 30Be, 30Bg,... It is desirable that the shapes of the gaps between the bodies 10Bb-10Bc, 10Bd-10Be, the magnetic body 10Bf, and the high-temperature side heat exchange section 40B coincide with the shapes of the gaps.

  As described above, the magnetic refrigerator of the present embodiment is adjacent to the magnetic body arrangement plate 700 in which a plurality of magnetic bodies are arranged at intervals and the magnetic body located at one end of the magnetic body arrangement plate 700 at intervals. 40 A of low temperature side heat exchange parts and the magnetic body located in the other end of the magnetic body arrangement | positioning board 700 are provided, and it has the high temperature side heat exchange part 40B which adjoins at intervals. In addition, a magnetic application unit that applies magnetism to each magnetic body of the magnetic body arrangement plate 700, a plurality of magnetic bodies of the magnetic body arrangement board 700, a magnetic body positioned at one end of the magnetic body arrangement board 700, and a low temperature Between the side heat exchanging part 40A, there is a heat conducting member that conducts heat by inserting and removing between the magnetic substance located at the other end of the magnetic material arranging plate and the high temperature side heat exchanging part 40B. The heat conducting member has one of the structures shown in FIGS.

  When the magnet / heat conduction portion arrangement plate 800 having the above configuration rotates with respect to the magnetic body arrangement plate 700, the heat conduction members 30Ab,... Transmit heat as follows.

  First, when the positional relationship between the permanent magnet and the magnetic body is in the state 1 shown in FIGS. 15 and 19, the positional relationship between the heat conducting member and the magnetic body is shown in FIG. 18A at the corresponding position of the magnetic body unit 200A. It is like that.

  In the case of State 1, as shown in FIG. 18A, the permanent magnet 20Aa is located on the magnetic body 10Aa, the permanent magnet 20Ac is located on the magnetic body 10Ac, and the permanent magnet 20Ae is located on the magnetic body 10Ae. At this time, magnetism is applied to the magnetic bodies 10Aa, 10Ac, and 10Ae, and no magnetism is applied to the magnetic bodies 10Ab, 10Ad, and 10Af, and the magnetism is removed. At this time, the magnetic bodies 10Aa, 10Ac, and 10Ae generate heat. At the same time, the heat conduction member 30Ab is inserted between the magnetic bodies 10Aa and 10Ab, the heat conduction member 30Ad is inserted between the magnetic bodies 10Ac and 10Ad, and the heat conduction member 30Af is inserted between the magnetic bodies 10Ae and 10Af. Is done. For this reason, heat conduction is performed between adjacent magnetic bodies in each magnetic body block. That is, the heat generated by the magnetic bodies 10Aa, 10Ac, and 10Ae due to the magnetocaloric effect is transferred to the magnetic bodies 10Ab, 10Ad, and 10Af, respectively. At this time, heat conduction is not performed between the low temperature side heat exchange unit 40A and the magnetic body 10Aa and between the high temperature side heat exchange unit 40B and the magnetic body 10Af. Further, heat conduction between the magnetic blocks is not performed.

  Moreover, in the corresponding position of the magnetic body unit 200B, the positional relationship between the heat conducting member and the magnetic body is as shown in FIG. 18B.

  As shown in FIG. 18B, the permanent magnet 20Ba is positioned on the magnetic body 10Bb, the permanent magnet 20Bc is positioned on the magnetic body 10Bd, and the permanent magnet 20Be is positioned on the magnetic body 10Af. At this time, magnetism is applied to the magnetic bodies 10Bb, 10Bd, and 10Bf, and no magnetism is applied to the magnetic bodies 10Ba, 10Bc, and 10Be, and the magnetism is removed. At this time, the magnetic bodies 10Bb, 10Bd, and 10Bf generate heat. At the same time, the heat conduction member 30Ba is between the low temperature side heat exchange part 40A and the magnetic body 10Ba, the heat conduction member 30Bc is between the magnetic bodies 10Bb and 10Bc, and the heat conduction member 30Be is between the magnetic bodies 10Bd and 10Be. In the middle, the heat conducting member 30Bg is inserted between the magnetic body 10Bf and the high temperature side heat exchanging portion 40B. For this reason, heat conduction is performed between the adjacent magnetic bodies 10Bb-10Bc, 10Bd-10Be of the adjacent magnetic body blocks 100Ba, 100Bb, 100Bc. Further, heat is generated between the magnetic body 10Ba located at one end of the magnetic body unit 200B and the low temperature side heat exchanging portion 40A and between the magnetic body 10Bf located at the other end of the magnetic body unit 200B and the high temperature side heat exchanging portion 40B. Conduction takes place. That is, 10Ba, 10Bc, 10Be are absorbed by the magnetocaloric effect, and heat is generated by the magnetic bodies 10Bb, 10Bd, 10Bf. For this reason, heat moves from the low temperature side heat exchange part 40A to the magnetic body 10Ba, from the magnetic body 10Bb to the magnetic body 10Bc, from the magnetic body 10Bd to the magnetic body 10Be, and from the magnetic body 10Bf to the high temperature side heat exchange part 40B.

  As described above, the plurality of magnetism application units arranged on the magnet / heat conducting member arrangement plate 800 are moved relative to each other by the relative movement between the magnet / heat conducting member arrangement plate 800 and the magnetic body arrangement plate 700. The magnetocaloric effect is developed by moving close to and away from the plurality of magnetic bodies arranged in the plate. Further, the plurality of heat conducting members arranged on the magnet / heat conducting member arranging plate 800 are arranged on the magnetic body arranging plate 700 by relative movement between the magnet / heat conducting member arranging plate 800 and the magnetic body arranging plate 700. The heat generated by the magnetocaloric effect is inserted between the magnetic body and the magnetic body, between the low temperature side heat exchange section 40A and the magnetic body, and between the high temperature side heat exchange section 40B and the magnetic body. Conduct.

  State 1 described above is as shown in FIG. 19A. Heat is conducted between adjacent magnetic bodies in each magnetic body block at the corresponding position of the magnetic body unit 200A, and between adjacent magnetic bodies of the adjacent magnetic body blocks at the corresponding position of the magnetic body unit 200B. In addition, heat is conducted between the magnetic body positioned at one end of the magnetic body unit 200B and the low-temperature side heat exchange unit 40A and between the magnetic body positioned at the other end of the magnetic body unit 200B and the high-temperature side heat exchange unit 40B. .

  When the positional relationship between the permanent magnet and the magnetic body is in the state 1 shown in FIG. 19A, the positional relationship between the heat conducting member and the magnetic body is equivalent to that shown in FIG. 18A at the corresponding position of the magnetic body unit 200A. ing. At the same time, in the corresponding position of the magnetic body unit 200B, the positional relationship between the heat conducting member and the magnetic body is equivalent to that shown in FIG. 18B.

  Next, when the magnet / heat conducting portion arrangement plate 800 is rotated 30 ° clockwise and the positional relationship between the permanent magnet and the magnetic body is in the state 2 shown in FIG. 19, at the corresponding position of the magnetic body unit 200A, The positional relationship between the heat conducting member and the magnetic body is equivalent to that shown in FIG. 18B. At the same time, at the corresponding position of the magnetic unit 200B, the positional relationship between the heat conducting member and the magnetic body is equivalent to that shown in FIG. 18A. The positional relationship between the permanent magnet and the magnetic body in state 2 is obtained by reversing the positional relationship between the permanent magnet and the magnetic body in state 1 between adjacent magnetic units.

  State 2 is as shown in FIG. 19B. At the corresponding position of the magnetic body unit 200A, between the adjacent magnetic bodies of the adjacent magnetic body blocks, between the magnetic body located at one end of the magnetic body unit 200A and the low-temperature side heat exchange unit 40A, and between the magnetic body units 200A. Heat is conducted between the magnetic body located at the other end and the high temperature side heat exchanging section 40B, and heat is conducted between adjacent magnetic bodies in each magnetic body block at the corresponding position of the magnetic body unit 200B. .

  As described above, in the state 1, the heat conducting member of the magnet / heat conducting member arrangement plate 800 conducts heat between adjacent magnetic bodies in each magnetic block of one adjacent magnetic unit. , Between the adjacent magnetic bodies of the adjacent magnetic body blocks of the other magnetic body unit, between the magnetic body located at one end of the other magnetic body unit and the low-temperature side heat exchange section, and the other magnetic body Heat is conducted between the magnetic body located at the other end of the unit and the high temperature side heat exchange part. In state 2, heat is conducted between adjacent magnetic bodies in each magnetic block of the other adjacent magnetic unit, and adjacent magnetic blocks of the adjacent magnetic body block of one magnetic unit are adjacent to each other. And between the magnetic body located at one end of the one magnetic body unit and the low-temperature side heat exchanging portion and between the magnetic body located at the other end of the one magnetic body unit and the high-temperature side heat exchanging portion. Conduct heat to and from.

  When transitioning from state 1 to state 2, due to the thermal anisotropy of the heat conducting member, heat does not escape to the adjacent magnetic body unit, and heat is efficiently transferred within the magnetic body unit.

  The low temperature side heat exchange unit 40A and the high temperature side heat exchange unit 40B include a mechanism capable of exchanging heat with an external environment such as indoor air. For example, a mechanism may be adopted in which a refrigerant is supplied from the outside and heat exchange with the external environment can be performed via the refrigerant.

  The magnetic refrigerator 500 according to the present embodiment configured as described above performs magnetic refrigeration as follows.

  First, when the driving unit 900 is operated to rotate the magnet / heat conducting member arrangement plate 800 in the clockwise or counterclockwise direction, the state shown in FIG. 1A and FIG. That is, the state of FIG. 18A and FIG. 18B is repeated. That is, state 1 and state 2 are repeated. By repeating this, in each magnetic unit, heat is transferred from the low temperature side heat exchange section 40A to the high temperature side heat exchange section 40B. Finally, as shown in the graph of FIG. 2, the temperature of the low-temperature side heat exchange unit 40A can be lowered and the temperature of the high-temperature side heat exchange unit 40B can be increased. A temperature difference can be generated between the portion 40B and the portion 40B. The principle that the temperature difference between the low temperature side heat exchange unit 40A and the high temperature side heat exchange unit 40B is enlarged by the operation of repeating the above state 1 and state 2 is the same as the principle described with reference to FIG. Are the same.

  The magnetic refrigerator of this embodiment can be applied to an air conditioner that performs indoor air conditioning, a refrigerator, an air conditioner that performs air conditioning in a vehicle interior, a vehicle refrigeration apparatus, and the like.

  Furthermore, in the present embodiment, the magnetic body arrangement plate 700 and the magnet / heat conducting member arrangement board 800 are made into a disk shape and the both plates are rotated relatively. However, the magnetic body arrangement plate 700 and the magnet / heat conduction plate are illustrated. The member arrangement plate 800 may be a flat plate, and the two plates may be reciprocated relatively linearly.

  When the magnetic refrigerator is configured as described above, magnetic refrigeration can be performed only by relatively moving the magnetic body arrangement plate 700 and the magnet / heat conducting member arrangement plate 800 in the arrangement direction of the magnetic body unit. The structure of the magnetic refrigerator can be simplified, and downsizing, weight reduction, and cost reduction can be realized.

(Configuration and operation of a magnetic refrigerator according to another embodiment)
In the above embodiment, the magnetic body arrangement plate 700 and the magnet / heat conducting member arrangement plate 800 are made into a disk shape and the both plates are relatively rotated. The embodiment described next is a magnetic refrigerator that arranges magnetic bodies in a row, moves a heat conducting member between the magnetic bodies, inserts and removes them, and moves the heat of the magnetic unit. That is, it is a magnetic refrigerator using the principle of FIG.

  FIG. 22 is a schematic configuration diagram of a magnetic refrigerator according to another embodiment. The magnetic refrigerator according to this embodiment has a feature in the configuration of insertion / removal of the heat conducting member, and therefore this configuration will be mainly described in order to facilitate understanding of the invention.

  In the magnetic refrigerator according to this embodiment, as shown in the drawing, six magnetic bodies 10A, 10B, 10C, 10D, 10E, and 10F are arranged in a line. The low temperature side heat exchange part 40A is disposed adjacent to the magnetic body 10A. The high temperature side heat exchange part 40B is disposed adjacent to the magnetic body 10F.

  A heat conduction member 30A is provided between the low temperature side heat exchange part 40A and the magnetic body 10A, a heat conduction member 30C is provided between the magnetic bodies 10B and 10C, and a heat conduction member is provided between the magnetic bodies 10D and 10E. 3E is disposed between the magnetic body 10F and the high temperature side heat exchanging portion 40B so that the heat conducting member 30G can be inserted and removed. The heat conducting members 30A, 30C, 30E, and 30G are attached to the rod 50A. The rod 50A is attached to the linear motor 60A. The linear motor 60A reciprocates the rod 50A as shown. The heat conducting members 30A, 30C, 30E, and 30G are inserted and removed between the magnetic bodies and the like by the reciprocating movement of the rod 50A.

  The heat conducting member 30B is inserted between the magnetic bodies 10A and 10B, the heat conducting member 30D is inserted between the magnetic bodies 10C and 10D, and the heat conducting member 30F is inserted between the magnetic bodies 10E and 10F. Arrange freely. The heat conducting members 30B, 30D, and 30F are attached to the rod 50B. The rod 50A is attached to the linear motor 60B. The linear motor 60B reciprocates the rod 50B as shown. The heat conducting members 30B, 30D, and 30F are inserted and removed between the magnetic bodies by the reciprocating movement of the rod 50B.

  During the operation of the magnetic refrigerator, the linear motors 60A and 60B operate alternately. That is, as shown in the figure, the linear motor 60B does not operate when the linear motor 60A operates, and conversely, the linear motor 60A does not operate when the linear motor 60B operates. Therefore, the heat conducting members 30A, 30C, 30E, and 30G and the heat conducting members 30B, 30D, and 30F are alternately inserted and removed between the magnetic bodies and the like.

  The configuration of the heat conducting members 30A-30G is as shown in FIGS. Further, the magnetic bodies 10A to 10F are made of a positive magnetic body, and a DLC film 15 is formed on the sliding surface with the heat conducting member as shown in FIG. By configuring the heat conducting member and the magnetic body in this manner, heat transfer characteristics can be enhanced, and at the same time, wear resistance can be enhanced.

  By operating this magnetic refrigerator, heat can be transmitted from the low temperature side heat exchange section 40A toward the high temperature side heat exchange section 40B. The principle of heat transfer is as described in FIGS.

10Aa-10Af, 10Ba-10Bf, 10Ca-10Cf magnetic material,
20Aa-20Ae, 20Ba-20Be, 20Ca-20Ce permanent magnet,
20Ab-20Af magnetic protrusion,
30Ab-30Af, 30Ba-30Bg heat conduction member,
32 base material,
33 fibers,
34 nanostructures,
34A, 37 Thermal conductive material with high thermal conductivity,
34B, 36 Thermal conductive material with low thermal conductivity,
34C carbon nanotube,
40A low temperature side heat exchange section,
40B high temperature side heat exchange section,
500 magnetic refrigerator,
600 heat exchanger support plate,
700 Magnetic body arrangement plate,
800 Magnet / heat conducting member arrangement plate.

Claims (10)

A heat conducting member that conducts heat through a magnetic material that exhibits a magnetocaloric effect,
The heat conductivity of the base material constituting the heat conducting member is smaller than the heat conductivity in one direction in which the magnetic materials are arranged, and the heat conductivity in the direction intersecting with the one direction in which the magnetic materials are arranged is reduced. A heat conducting member having thermal anisotropy characterized by   The base material is formed by bundling a plurality of fibrous heat conductive materials in a direction crossing the alignment direction of the magnetic bodies, with a cross section of the heat conductive material facing the alignment direction of the magnetic bodies. The heat conducting member according to claim 1.   2. The heat conducting member according to claim 1, wherein the base material is formed by alternately arranging a plurality of heat conducting materials having different heat conductivities in a direction intersecting with an arrangement direction of the magnetic bodies.   In the base material, a plurality of heat conductive materials having different thermal conductivities are smaller in thermal conductivity in a direction intersecting with the magnetic material arranging direction than in the magnetic substance arranging direction. The heat conducting member according to claim 1, wherein the heat conducting member is formed so as to be oriented.   The heat conduction member according to claim 1, wherein a nanostructure is formed on at least a surface of the base material facing the magnetic body.   The heat conduction member according to claim 5, wherein the nanostructure is formed by arranging nanotubes.   The heat conduction member according to claim 6, wherein the nanostructure has a sponge structure in which fibrous nanotubes are entangled vertically and horizontally.   The heat conduction member according to claim 7, wherein the sponge structure includes a lubricant containing fine particles having a high heat conductivity. A magnetic body arrangement plate in which a plurality of magnetic bodies are arranged at intervals, and
A low temperature side heat exchange section adjacent to the magnetic body located at one end of the magnetic body arrangement plate with a gap;
A high temperature side heat exchanging section adjacent to the magnetic body located at the other end of the magnetic body arrangement plate with a gap;
A magnetic application unit for applying magnetism to each magnetic body of the magnetic body arrangement plate;
A magnetic body located between the plurality of magnetic bodies of the magnetic body placement plate, a magnetic body located at one end of the magnetic body placement plate and a low-temperature side heat exchange unit, and a magnetic body located at the other end of the magnetic body placement plate; A heat conducting member that is inserted into and removed from the high temperature side heat exchanging part to conduct heat, and
The said heat conduction member has the structure in any one of Claim 1 to 8, The magnetic refrigerator characterized by the above-mentioned.   10. The magnetic refrigerator according to claim 9, wherein the magnetic material disposed on the magnetic material arranging plate has a DLC film formed on at least a surface facing the heat conducting member.