JP2012220784A - Electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device which can be easily transported and stored in a state where a circuit board is unmounted therein.SOLUTION: A chassis 30 is formed with a pair of first engaging faces 321, 321 facing each other on a chassis second side face 32. A holder 40 is formed with a pair of second engaging faces 411, 411 on a first holder side face 41 at the circuit board side. The pair of second engaging faces 411 is slidable respectively on the first engaging faces 321. A third dimension H1 between the pair of first engaging faces 321 is smaller than a fourth dimension H2 between the pair of second engaging faces 411. With this, by engaging the first engaging faces 321 with the second engaging faces 411 before mounting the circuit board 34, a state (first state) in which the holder 40 is attached to the chassis 30 is obtained. In this state, the chassis 30 can be assembled with other parts, transported and stored.

Description

  The present invention relates to an electronic device having two assembled states when assembling a housing that accommodates a circuit board therein.

2. Description of the Related Art Conventionally, an electronic device that is temporarily fixed when a housing that accommodates a circuit board is assembled is known (see, for example, Patent Document 1).
As shown in FIG. 7, in the camera 100 which is an electronic device described in Patent Document 1, when the auto strobe substrate 101 is attached to the strobe substrate 102, first, an elastic body 105 is interposed between the strobe substrate 102 and the auto strobe substrate 101. Insert. Then, the locking claw 101A is locked in the locking hole of the strobe substrate 102, and the auto strobe substrate 101 is temporarily fixed. Thereby, the auto strobe substrate 101 is roughly positioned.

  Next, the front cover 103 is assembled with the auto strobe substrate 101 temporarily fixed. At this time, the positioning pin 103A is fitted into the positioning hole 101B, and the light receiving surface 104A of the light receiving element 104 is positioned so as to face the light receiving window 106. At the same time, the auto strobe substrate 101 is sandwiched between the front cover 103 and the strobe substrate 102 via the elastic body 105. As a result, the light receiving element 104 can measure the subject light from the light receiving window 106.

Therefore, a positioning pin 103A protruding toward the strobe substrate 102 is provided on the inner wall of the front cover 103, and a positioning hole 101B is formed in the auto strobe substrate 101. Then, by attaching the front cover 103, the positioning pins 103A are fitted into the positioning holes 101B of the auto strobe substrate 101, and the auto strobe substrate 101 is positioned. At the same time, the light receiving element 104 is positioned with respect to the light receiving window 106.
As a result, the light receiving element 104 can be easily positioned without using a jig or a tool, thereby reducing the number of work steps and improving the manufacturing efficiency.

Japanese Patent Laid-Open No. 2002-333661 (FIG. 3)

  By the way, in an electronic device in which a circuit board and an electronic component are connected by a flexible substrate, an assembling operation of other components may be performed in the middle of assembling, or loading and storage may be performed. In such a case, since the external force acts on the flexible substrate before the electronic component is assembled to the housing and before the circuit board is mounted, it is difficult to assemble, transport and store other components. There was a problem.

  The present invention has been made to solve the conventional problems, and an object thereof is to provide an electronic device that can easily assemble, transport, and store other components in a state before mounting a circuit board. To do.

The electronic device of the present invention is supported by a housing, a transparent panel provided in one opening of the housing, a chassis accommodated in the housing, and a first chassis side surface of the chassis on the transparent panel side. A liquid crystal module (display device), a circuit board supported by a circuit board holding surface protruding from the second chassis side surface opposite to the first chassis side surface in the chassis, and a holder stacked on the circuit board; A pair of flexible boards connected to the holder and routed to the side of the first chassis of the chassis, and provided on the side of the second chassis of the chassis and facing each other along the direction in which the holders are stacked Provided on the first holder side surface of the holder on the circuit board side of the holder, and in sliding contact with each of the first engagement surfaces. With a capacity of a pair of second engagement surface, the first dimension between the respective first engagement surfaces are those wherein less than or equal second dimension between the second engaging surface.
The transparent panel may specifically be a touch panel integrated with sensor glass. Further, the transparent panel and the liquid crystal module (display device) may be integrated.

  In the electronic device of the present invention, a third dimension from the first holder side surface to the tip of the second engagement surface is not less than a fourth dimension from the second chassis side surface to the circuit board holding surface. And it is below the 5th dimension which added the said 4th dimension and the thickness dimension of the said circuit board.

  In the electronic device of the present invention, each of the first engagement surfaces and each of the second engagement surfaces is provided at a corresponding position along the thickness direction of the casing. .

  In the electronic device of the present invention, the circuit board has a camera unit mounted on the opposite side of the casing to the transparent panel, and the holder is on the side opposite to the first holder side surface. A photolight mounted on a side surface of the second holder, a wall portion surrounding the camera unit and at least partially penetrating the circuit board, and the second engagement surface being an outer surface of the wall portion Is.

  Furthermore, the electronic device according to the present invention has an engagement pin that is protruded from the side surface of the first holder and press-fitted into the through hole of the circuit board, and the electronic device according to the present invention is provided on the side surface of the second chassis in the chassis. The engaging pin is provided with a recess that cannot be contacted.

  Furthermore, in the electronic device of the present invention, the flexible substrate is connected to the holder, the holder is stacked on the second chassis side surface opposite to the first chassis side surface of the chassis supporting the display device, and the flexible substrate is attached to the first substrate. A pair of first engagement surfaces that are routed to one chassis side surface, are provided on the second chassis side surface, and face each other along a direction in which the holders are stacked, and a second chassis side surface of the holder facing the second chassis side surface. A pair of second engagement surfaces provided on the side surface of one holder and slidably contacted with each first engagement surface are engaged with each other, and the chassis to which the holder is attached is opened in one opening of the housing. And a transparent panel is attached to the opening in the housing to be in the first state, and the engagement of the first engagement surfaces and the second engagement surfaces is released. Is moved away the holder from the chassis, from by supporting a circuit board to the circuit board holding surface projecting from the second side of the chassis, it is an second state by stacking the holder to the circuit board.

  In the present invention, a pair of first engaging surfaces facing each other are provided on the second chassis side surface of the chassis, and the first holder side surface of the holder on the circuit board side is slid on the first engaging surface. A pair of 2nd engaging surfaces which can be contacted are provided. And since the 1st dimension between a pair of 1st engagement surfaces is below the 2nd dimension between a pair of 2nd engagement surfaces, before mounting a circuit board, the 1st engagement surface and the 2nd By engaging the engagement surface, a state in which the holder is attached to the chassis (first state) is obtained, and in this state, an electronic device having an effect that other parts can be assembled, transported, and stored. Can provide.

(A) is the perspective view which looked at the portable terminal of embodiment which concerns on this invention from the front side, (B) is the perspective view which looked at the portable terminal from the back side, (C) is CC in (B) Cross section of position (A) is sectional drawing of the portable terminal seen from II direction in FIG.1 (C), (B) is an expanded sectional view of B part in (A). Explanatory drawing of dimensions, such as a 1st engagement surface and a 2nd engagement surface (A) thru | or (D) are the perspective view and sectional drawing which show the assembly procedure to the 1st state of a portable terminal (A) thru | or (D) is a perspective view and sectional drawing which show the assembly procedure after the 1st state of a portable terminal (A) is sectional drawing which shows the chassis and positioning in a 1st state, (B) is an expanded sectional view of B part in (A). Sectional view of a camera that is a conventional electronic device

Hereinafter, an electronic apparatus according to an embodiment of the present invention will be described with reference to the drawings.
As shown in FIG. 1, a portable terminal 10 as an electronic apparatus according to an embodiment of the present invention is, for example, an integrated type, and includes a rectangular box-shaped housing 20 having an opening (opening 201) on the front side.
The housing 20 includes a front cover housing (housing) 20A having an opening 201 and a back case housing 20B.

As shown in FIGS. 1 and 2, a liquid crystal module 22, which is a display device, is accommodated in a cover housing 20 </ b> A inside the opening 201. Further, a proximity sensor window 26 that houses the proximity sensor 27 is provided in the vicinity of the opening 201. A transparent panel 21 that covers the display surface of the liquid crystal module 22 and the proximity sensor 27 is provided over substantially the entire front surface 202 of the cover housing 20A to protect and protect against dust.
Further, a back side opening 204 is provided on the back side surface 203 of the case housing 20B, and the camera panel 23 is fitted therein. The back side opening 204 houses a photolight window 24 and a camera window 25.

As shown in FIG. 2, a chassis 30 is housed inside the cover housing 20A. The chassis 30 has a first chassis side surface 31 on the transparent panel 21 side, that is, the front side, and a second chassis side surface 32 opposite to the first chassis side surface 31.
The liquid crystal module 22 is attached to the first chassis side surface 31.
A circuit board holding surface 33 protrudes from the second chassis side surface 32 and a circuit board 34 is attached. The second chassis side surface 32 is provided with a pair of first engaging surfaces 321 and 321 and a concave portion 322 facing each other. Here, the distance between the pair of first engagement surfaces 321 and 321 is the first dimension W1 (see FIG. 3).

  The circuit board 34 is provided with a camera opening 37 (see FIG. 5B). The camera opening 37 faces the camera unit facing away from the transparent panel 21 (that is, the back side). 35 is mounted. The camera unit 35 protrudes from both the front and back surfaces of the circuit board 34. The circuit board 34 is provided with a pair of positioning through holes 36 (see FIG. 5B) in the vicinity of the camera unit 35.

A holder 40 is laminated on the back side of the circuit board 34 (upper side in FIG. 2). The holder 40 has a first holder side face 41 that is a side facing the circuit board 34 and a second holder side face 42 that is opposite to the first holder side face 41.
The holder 40 is provided with a rectangular opening 43 for the camera unit 35 mounted on the circuit board 34. Around the opening 43, a first vertical wall 431 as a rectangular frame-shaped wall portion protrudes from the first holder side surface 41, and the second holder side surface 42 protrudes outside the first vertical wall 431. The 2nd vertical wall 432 as a corresponding wall part is protrudingly provided. The first vertical wall 431 passes through the camera opening 37 provided in the circuit board 34.

The first vertical wall 431 is disposed at a position corresponding to the first engagement surface 321 provided on the second chassis side surface 32 of the chassis 30 along the thickness direction of the housing 20. Therefore, the outer side surface of the first vertical wall 431 becomes a pair of second engagement surfaces 411 and 411 that can slide on the first engagement surface 321.
Here, as shown in FIG. 3, the distance between the pair of second engagement surfaces 411 and 411 is the second dimension W2, and the first dimension W1 between the first engagement surfaces 321 and 321 is the second dimension W2. It is set to be the following (that is, W1 <W2).
The third dimension H1 from the first holder side surface 41 to the tip of the second engagement surface 411 is equal to or greater than the fourth dimension H2 from the second chassis side surface 32 to the circuit board holding surface 33. The third dimension H1 is equal to or smaller than the fifth dimension H3 obtained by adding the fourth dimension H2 and the thickness dimension T of the circuit board 34. That is, H1 <H3.

  As shown in FIGS. 2 and 3, the first holder side surface 41 is provided with an engaging pin 44 for positioning so as to protrude toward the circuit board 34. The engaging pins 44 are inserted into the through holes 36 of the circuit board 34 to regulate the relative positional relationship between the circuit board 34 and the holder 40. The engagement pin 44 penetrates the through hole 36 of the circuit board 34 and protrudes toward the chassis 30 side. However, since the tip is inserted into the recess 322 provided on the second chassis side surface 32 of the chassis 30, the engagement pin 44 is engaged. The pin 44 does not contact the chassis 30.

As shown in FIGS. 2 and 4, one end 501 of the flexible substrate 50 is attached to the second holder side surface 42 of the holder 40, and the other end 503 is routed around the first chassis side surface 31 of the chassis 30. Yes. The photolight 51 is attached to one end 501 of the back surface 502 of the flexible substrate 50, and the proximity sensor 27 is attached to the other end 503 of the back surface 502.
Therefore, the photolight 51 is arranged on the back side and is located inside the photolight window 24. The proximity sensor 27 is arranged on the front side and is located inside the proximity sensor window 26.

Next, an assembly procedure of the mobile terminal 10 will be described based on FIGS. 4 and 5. 4 and 5, for convenience of explanation, the front side is assumed to be the lower side and the back side is assumed to be the upper side.
As shown in FIG. 4A, the photolight 51 is mounted in advance on one end 501 of the back surface 502 of the flexible substrate 50 and the proximity sensor 27 is mounted on the other end 503 in advance.
Next, as shown in FIG. 4B, one end 501 of the flexible substrate 50 is connected to the holder 40 by a pin 53.

Next, as shown in FIGS. 4C and 6, the distal end portion of the second engagement surface 411 of the holder 40 is inserted into the first engagement surface 321 provided on the second chassis side surface 32 of the chassis 30. The holder 40 is stacked on the chassis 30 and attached. In this state, since the engaging pin 44 is accommodated in the recess 322 of the chassis 30 and is not in contact with the chassis 30, the holder 40 is not positioned.
Then, the flexible substrate 50 is routed around the first chassis side surface 31. The liquid crystal module 22 is attached to the first chassis side surface 31 of the chassis 30.

  Next, as shown in FIG. 4D, the chassis 30 to which the holder 40 is attached is stored in the cover housing 20A so that the opening 201 of the cover housing 20A and the liquid crystal module 22 face each other, and the cover is covered. The transparent panel 21 is attached to the opening 201 of the housing 20A. This state is referred to as a first state. The reason for attaching the transparent panel 21 later is to prevent dust and dust from entering the space between the liquid crystal module 22 and the transparent panel 21 and to perform it in another work place such as a clean room.

Next, as shown in FIG. 5A, the engagement of the first engagement surface 321 and the second engagement surface 411 is released, and the holder 40 is separated from the chassis 30 (see arrow A in FIG. 5A). ), The upper side (back side) of the chassis 30 is opened. At this time, the holder 40 is connected to the chassis 30 via the flexible substrate 50.
Then, as shown in FIG. 5B, the circuit board 34 on which the camera unit 35 is mounted is inserted from the second chassis side surface 32, and the circuit board 34 is attached to the circuit board holding surface 33 of the chassis 30.

Thereafter, as shown in FIG. 5C, the engaging pins 44 of the holder 40 are inserted into the through holes 36 of the circuit board 34, and the holder 40 is stacked on the circuit board 34. This state is referred to as a second state.
Finally, as shown in FIG. 5D, the case housing 20B is joined to the cover housing 20A, and the portable terminal 10 is assembled.

As described above, according to the mobile terminal 10 according to the embodiment of the present invention described above, the liquid crystal module 22 is supported on the first chassis side surface 31 on the transparent panel 21 side of the chassis 30 accommodated in the cover housing 20A. A circuit board holding surface 33 for supporting the circuit board 34 protrudes from the second chassis side face 32 opposite to the first chassis side face 31 in the chassis 30.
A holder 40 is stacked on the circuit board 34, and a flexible board 50 drawn around the first chassis side surface 31 of the chassis 30 is connected.

A pair of first engagement surfaces 321 facing each other are provided on the second chassis side surface 32 of the chassis 30, and a pair of second engagement is provided on the first holder side surface 41 on the circuit board 34 side of the holder 40. A surface 411 is provided. The pair of second engagement surfaces 411 can be slidably contacted with the first engagement surface 321, respectively, and the first dimension W1 between the pair of first engagement surfaces 321 is the first between the pair of second engagement surfaces 411. Two dimensions W2 or less.
Thereby, the state (first state) in which the holder 40 is attached to the chassis 30 is obtained by engaging the first engagement surface 321 and the second engagement surface 411 before mounting the circuit board 34. In this state, other parts can be assembled, transported, and stored.

The third dimension H1 from the first holder side surface 41 to the tip of the second engagement surface 411 is not less than the fourth dimension H2 from the second chassis side surface 32 to the circuit board holding surface 33, and the fourth dimension H2 The fifth dimension H3 or less is obtained by adding the thickness dimension T of the circuit board 34.
For this reason, in the state before mounting the circuit board 34 (first state), the first engagement surface 321 and the second engagement surface 411 are engaged, but the state after mounting the circuit board 34 (first state). In the second state, the first engagement surface 321 and the second engagement surface 411 are not engaged.

  Since the first engagement surface 321 and the second engagement surface 411 are respectively provided at corresponding positions along the thickness direction of the cover housing 20A, in the first state, the first engagement surface 321 is provided. And the second engagement surface 411 are engageable.

  Since the first vertical wall 431 and the second vertical wall 432 surrounding the camera unit 35 are provided so as to penetrate the circuit board 34, the first vertical wall 431 and the second vertical wall 432 out of the first vertical wall 431 and the second vertical wall 432 are provided. The outer surface of one vertical wall 431 is used as the second engagement surface 411 and is engaged with the first engagement surface 321 of the chassis 30 to obtain a state before the circuit board 34 is mounted (first state). Can do.

An engagement pin 44 is provided on the first holder side surface 41 of the holder 40 so as to be press-fitted and attached to the through hole 36 of the circuit board 34. The engagement pin 44 is provided on the second chassis side surface 32. The second chassis side surface 32 of the chassis 30 does not come into contact with the recessed portion 322.
For this reason, the 1st engagement surface 321 and the 2nd engagement surface 411 can be engaged, and the state (1st state) before mounting | wearing with the circuit board 34 can be formed.

  The flexible substrate 50 is connected to the holder 40, and the holder 40 is stacked on the second chassis side surface 32 opposite to the first chassis side surface 31 of the chassis 30 that supports the liquid crystal module 22. Pull around to 31. In this state, a pair of first engaging surfaces 321 provided on the second chassis side surface 32 and facing each other and a pair of second engaging surfaces 411 provided on the first holder side surface 41 of the holder 40 are engaged. Combine. Thereafter, the chassis 30 to which the holder 40 is attached is stored in the cover casing 20A so that the opening 201 of the cover casing 20A and the liquid crystal module 22 face each other, and the transparent panel 21 is placed in the opening 201 of the cover casing 20A. To be in the first state.

Therefore, the state (first state) in which the holder 40 is attached to the chassis 30 is obtained by engaging the first engagement surface 321 and the second engagement surface 411 before mounting the circuit board 34. In this state, other parts can be assembled, transported and stored.
Then, the engagement of the first engagement surface 321 and the second engagement surface 411 is released, the holder 40 is separated from the chassis 30, and the circuit board 34 is moved to the circuit board holding surface 33 protruding from the second chassis side surface 32. Install. Thereafter, the holder 40 is stacked on the circuit board 34 to obtain the second state.

Note that the electronic apparatus of the present invention is not limited to the above-described embodiment, and appropriate modifications and improvements can be made.
For example, in the embodiment described above, the transparent panel may specifically be a touch panel integrated with a sensor glass. Further, the transparent panel and the liquid crystal module (display device) may be integrated.

  As described above, in the electronic device according to the present invention, the pair of first engaging surfaces facing each other is provided on the second chassis side surface of the chassis, and the first holder side surface on the circuit board side of the holder is provided on the first holder side surface. In addition, a pair of second engagement surfaces that can slide in contact with the first engagement surface are provided. And since the 1st dimension between a pair of 1st engagement surfaces is below the 2nd dimension between a pair of 2nd engagement surfaces, before mounting a circuit board, the 1st engagement surface and the 2nd By engaging the engagement surface, a state in which the holder is attached to the chassis (first state) is obtained, and in this state, an electronic device having an effect that other parts can be assembled, transported, and stored. This is useful as an electronic device having two assembled states when assembling a housing that accommodates a circuit board therein.

10 Mobile devices (electronic devices)
20 housing 20A cover housing (housing)
20B case housing (housing)
201 opening (opening)
21 Transparent panel 22 Liquid crystal module (display device)
23 Camera panel 24 Photolight window 25 Camera window 26 Proximity sensor window 27 Proximity sensor 30 Chassis 31 First chassis side surface 32 Second chassis side surface 321 First engagement surface 322 Concavity 33 Circuit board holding surface 34 Circuit board 35 Camera Unit 36 Through-hole 37 Camera opening 40 Holder 41 First holder side surface 411 Second engagement surface 42 Second holder side surface 431 First vertical wall (wall portion)
432 Second vertical wall (wall)
44 Engagement pin 50 Flexible substrate 51 Photolite 53 Pin W1 First dimension
W2 2nd dimension H1 3rd dimension H2 4th dimension H3 5th dimension T Thickness dimension

Claims (6)

A housing,
A transparent panel provided in one opening of the housing;
A chassis housed in the housing;
A display device supported on the side of the first chassis on the transparent panel side of the chassis;
A circuit board supported by a circuit board holding surface protruding from the second chassis side surface opposite to the first chassis side surface in the chassis;
A holder stacked on the circuit board;
A flexible substrate coupled to the holder and routed to the side of the first chassis of the chassis;
A pair of first engagement surfaces provided on a side surface of the second chassis in the chassis, along a direction in which the holders are stacked and facing each other;
A pair of second engagement surfaces provided on the first holder side surface of the holder on the circuit board side and capable of sliding contact with the first engagement surfaces,
An electronic device in which a first dimension between the first engagement surfaces is equal to or less than a second dimension between the second engagement surfaces. The electronic device according to claim 1,
The third dimension from the side surface of the first holder to the tip of the second engagement surface is
An electronic device that is not less than a fourth dimension from the side surface of the second chassis to the circuit board holding surface and not more than a fifth dimension that is a sum of the fourth dimension and the thickness dimension of the circuit board. The electronic device according to claim 1 or 2,
The electronic device in which each of the first engagement surfaces and each of the second engagement surfaces are provided at corresponding positions along the thickness direction of the casing. The electronic device according to any one of claims 1 to 3,
The circuit board has a camera unit mounted toward the opposite side of the transparent panel in the housing,
The holder includes a photolight mounted on a second holder side surface opposite to the first holder side surface, and a wall portion that surrounds the camera unit and at least partially penetrates the circuit board;
The electronic device in which the second engagement surface is an outer surface of the wall portion. The electronic device according to any one of claims 1 to 4,
The holder has an engaging pin that protrudes from the side surface of the first holder and is press-fitted into the through hole of the circuit board.
An electronic device in which a concave portion on which a side surface of the second chassis in the chassis cannot contact the engagement pin is provided. Connect the flexible board to the holder,
The holder is stacked on the second chassis side surface opposite to the first chassis side surface of the chassis supporting the display device, and the flexible substrate is routed to the first chassis side surface, provided on the second chassis side surface, A pair of first engagement surfaces that face each other along the direction in which the holders are stacked, and a first holder side surface that faces the second chassis side surface of the holder, are slid on each first engagement surface. After engaging a pair of contactable second engaging surfaces, the chassis to which the holder is attached is housed in one opening in the housing, and a transparent panel is attached to the opening in the housing. 1 state,
Releasing the engagement of each first engagement surface and each second engagement surface to separate the holder from the chassis;
After supporting the circuit board on the circuit board holding surface protruding from the side surface of the second chassis,
An electronic apparatus in which the holder is stacked on the circuit board to be in a second state.

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