JP2012215737A - Manufacturing method of electronic device and display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic device and display device, with which damages of an electronic circuit or the like formed on a flexible substrate are prevented so as to improve the production yield.SOLUTION: An electronic circuit layer 14, a display layer 15, a protection film 16, and an optical film 17 are formed in this order on a substrate 13 having a supporter 11 laminated via a fixing layer 12. After forming a laminate 1A by peeling off the supporter 11 from the substrate 13, a plane on which a step 13A is formed by the electronic circuit layer 14 and the like, and an attraction stage 21 are fixed via a step absorbing layer 22. After sticking a support substrate 31 to a rear surface of the substrate 13 which is fixed to the attraction stage 21, the attraction stage 21 and the step absorbing layer 22 are removed, and thus the display device 1 is manufactured.

Description

  The present disclosure relates to an electronic device using a flexible substrate and a method for manufacturing a display device including the electronic device.

  In display devices typified by liquid crystal display devices, organic EL display devices, electrophoretic display devices, and the like, thinner and lighter display devices are required. In a device constituting a conventional display device, a glass substrate is often used. However, since the glass substrate is heavy and easily broken, a certain thickness is required, and there is a limit to reducing the thickness and weight.

  At present, a flexible substrate such as a plastic substrate has attracted attention as a substrate that exceeds the limits of thinning and weight reduction. However, in a flexible substrate laminated with a plurality of different members, a difference in heat shrinkage occurs between each layer in a heating step in the manufacturing process, and an internal stress is generated in the flexible substrate. When the flexible substrate having the internal stress is peeled off from the support, the flexible substrate is released from the internal stress and significant curling occurs. Further, the flexible substrate is also plastically deformed and curled by being pulled from the support and peeled off.

  Conventionally, for example, a method disclosed in Patent Document 1 has been used as a method of peeling a substrate provided with a device and provided on a transfer jig from the transfer jig. However, in the peeling method of Patent Document 1, there is no mention of curling that occurs when the flexible substrate and the support are peeled off, and the curling as described above occurs on the flexible substrate after the support is peeled off. For this reason, it has been impossible to automatically convey the flexible substrate to a subsequent process.

  On the other hand, in Patent Document 2, for example, the flexible substrate after peeling the support is adsorbed to the adsorption stage, and a support substrate with an adhesive is attached to the back side of the flexible substrate to A method for reducing curl is disclosed.

Japanese Patent Laid-Open No. 8-86993 JP 2009-21322 A

  However, in the method disclosed in Patent Document 2, the flexible substrate is bent at the periphery of the step such as the display body provided on the surface of the flexible substrate, and the electronic circuit on the flexible substrate may be damaged. was there.

  The present technology has been made in view of such problems, and an object of the present technology is to prevent damage to an electronic circuit or the like formed on a flexible substrate and improve the yield of an electronic device and a display device. It is to provide a manufacturing method.

  An electronic device manufacturing method according to an embodiment of the present technology includes a step of forming a functional layer for a device having a step on one surface of a flexible substrate, and a step of absorbing the one surface of the flexible substrate via a step absorption layer. And a fixing step.

  A method for manufacturing a display device according to the present technology includes a process according to the method for manufacturing an electronic device.

  In the manufacturing method of the electronic device and the display device according to the present technology, it is possible to fix the one surface of the flexible substrate on which the functional layer for the device is formed with the step through the step absorption layer when the surface is fixed to the suction stage. A step due to the electronic circuit layer provided on one surface of the flexible substrate is absorbed by the step absorption layer, and deformation of the flexible substrate when being fixed to the suction stage is reduced.

  According to the method of manufacturing an electronic device and a display device of the present technology, when fixing one surface of the flexible substrate having a step and a functional layer for a device to the suction stage, the step absorption layer is interposed. Therefore, a step due to the functional layer for a device provided on one surface of the flexible substrate is absorbed by the step absorption layer. Thereby, deformation of the flexible substrate when fixing to the suction stage is reduced, and damage to the functional layer for the device provided on one surface of the flexible substrate is prevented. That is, the yield can be improved.

It is sectional drawing showing the manufacturing process of the display apparatus which concerns on one embodiment of this indication. It is a schematic diagram for demonstrating the peeling method of a board | substrate. FIG. 2 is a cross-sectional view illustrating a process following FIG. 1. It is sectional drawing showing the through-hole formed in the level | step difference absorption layer. FIG. 10 is a characteristic diagram showing the relationship between the film thickness of the support substrate and the curl amount of the substrate. (A) is a perspective view showing the external appearance seen from the back side of the application example 1, (B) is a perspective view showing the external appearance seen from the front side. 12 is a perspective view illustrating an appearance of application example 2. FIG. (A) is a perspective view showing the external appearance seen from the front side of the application example 3, (B) is a perspective view showing the external appearance seen from the back side. 14 is a perspective view illustrating an appearance of application example 4. FIG. 14 is a perspective view illustrating an appearance of application example 5. FIG. (A) is a front view of the application example 6 in an open state, (B) is a side cross section thereof, (C) is a front view in a closed state, (D) is a left side view, and (E) is a right side view, (F) is a top view and (G) is a bottom view.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The description will be given in the following order.
1. 1. Embodiment A method for manufacturing a display device in which a substrate is fixed to a suction stage through a step absorption layer Application examples

1. Embodiment FIG. 1A illustrates a cross-sectional configuration of an initial process of a manufacturing process of a display device 1 according to an embodiment of the present disclosure. In this step, the flexible substrate 13 is fixed to the rigid support 11 with the fixing layer 12 interposed therebetween.

  The support 11 fixes a flexible substrate 13 to facilitate transportation in the manufacturing process and formation of an electronic circuit layer 14 (FIG. 1B) described later. The support 11 is made of a material excellent in mechanical strength and heat resistance. Specifically, it is preferable to use a material having a melting point of 500 ° C. or higher, such as quartz glass, heat resistant glass, metal, or ceramic. The thickness of the support 11 may be 0.4 mm to 2 mm from the viewpoint of mechanical strength and handleability. Further, the linear expansion coefficient of the support 11 is preferably 10 ppm / K or less from the relationship with the substrate 13.

  The fixing layer 12 fixes the flexible substrate 13 to the support 11, and the following adhesive or the like is applied to the contact surface between the support 11 and the substrate 13 by spin coating, die coating, gravure, or the like. It is formed by applying by the printing method. As the material of the fixed layer 12, a general-purpose pressure-sensitive adhesive and pressure-sensitive adhesive tape can be used. Specific examples include acrylic adhesives (adhesives), epoxy adhesives, siloxane adhesives, urethane adhesives, silane coupling agents, natural rubber adhesives, or synthetic rubber adhesives. . Moreover, when using an adhesive tape, for example, after attaching the adhesive tape to the support body 11 and forming the fixed layer 12, the board | substrate 13 is fixed with a laminator. In addition, since the fixed layer 12 is required to have sufficient heat resistance with respect to the heating temperature at the time of forming the device such as the electronic circuit layer 14, it is preferable that the thermal weight reduction at the peak temperature at the time of forming the device is less than 1%. More preferably, it is less than 0.1%.

  The support 11 is peeled off from the substrate 13 after the electronic circuit layer 14 and the like are formed on the substrate 13. For this reason, the fixing layer 12 is preferably one whose adhesive strength is lowered by thermal stimulation such as heating or cooling, physical stimulation such as an auxiliary peeling tape, or stimulation such as ionizing radiation. If the support 11 and the substrate 13 can be separated by applying such a stimulus, the support 11 can be used repeatedly without being damaged.

  The substrate 13 supports the electronic circuit layer 14 and the like. As a material for the substrate 13, it is preferable that the thermal contraction rate is 0.1% or less in order to suppress the substrate warpage due to the thermal contraction difference with the support 11. Moreover, the dimensional change and deformation | transformation of the board | substrate 13 can be suppressed by making a linear expansion coefficient into about 0-15 ppm / K from the relationship with the support body 11. FIG. Specifically, as such a material, for example, polyethylene terephthalate having a thickness of 5 to 200 μm, polyethylene naphthalate, polyethersulfone, polyetherimide, polyetheretherketone, polyphenylene sulfide, polysulfone, polyarylate, polyimide, polyamide, Plastic materials such as polycarbonate, cellulose triacetate, polyolefin, polystyrene, polyethylene, polypropylene, polymethyl methacrylate, aramid, polyvinyl chloride, polyvinylidene chloride, epoxy resin, phenol resin, urea resin, melamine resin, silicone resin or acrylic resin It is done.

  After fixing the board | substrate 13 to the support body 11 as mentioned above, it heat-processes at 120-250 degreeC and 10 to 60 minutes. By this heat treatment, thermal contraction of the substrate 13 is forcibly induced, and the behavior of the substrate 13 in the subsequent process is stabilized. Moreover, the adhesive force of the adhesive which comprises the fixed layer 12 is also stabilized.

  After the above heat treatment, as shown in FIG. 1B, functional layers for devices such as an electronic circuit layer 14, a display layer 15, a protective film 16, and an optical film 17 are laminated on the substrate 13 in this order. .

  Specifically, the electronic circuit layer 14 is provided with, for example, a thin film transistor (TFT) composed of a gate electrode, a gate insulating film, a semiconductor layer as a channel layer, and source / drain electrodes. These are formed through a film forming and etching process by a CVD (Chemical Vapor Deposition) method or the like. Here, the TFT may be either an inorganic TFT using an inorganic semiconductor layer or an organic TFT using an organic semiconductor layer. The TFT has a function as a switching element for selecting a pixel. Here, the electronic circuit layer 14 is not limited to the TFT, and other electronic devices such as a 3D display optical device, a touch panel, an optical functional layer such as a moth eye or a color filter, or a MEMS device may be formed.

  The display layer 15 has an electrophoretic layer between, for example, a pixel electrode and a common electrode. That is, the display device 1 is an electrophoretic display (so-called electronic paper display) that displays an image (for example, character information) using an electrophoretic phenomenon. A pixel electrode is provided for each pixel in the electronic circuit layer 14, and a common electrode is provided over one surface of a transparent substrate (not shown) included in the display layer 15.

The protective film 16 can be made of the same material as the substrate 13 and includes a barrier layer (not shown). Examples of the material of the barrier layer include silicon oxide (SiO ₂ ), silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), aluminum nitride (AlN), or aluminum oxynitride (AlO _x N _1-x ( However, X = 0.01-0.2)) can be mentioned. The protective film 16 protects the electronic circuit layer 14 and the display layer 15 and prevents moisture from entering.

  The optical film 17 is for preventing external light from being reflected on the display surface and improving visibility, and specifically has an antireflection function or an antiglare function. For example, when the optical film 17 has an antireflection function, the optical film 17 is a laminated body of a plurality of thin films having different refractive indexes, and the reflected light is reflected by using interference of reflected light generated at the interface between these thin films. Attenuates. For example, when the optical film 17 has an antiglare function, an uneven surface is formed on the surface of the optical film 17 by a coating material, and external light is irregularly reflected by the uneven surface. Instead of the optical film 17, a film that protects the display surface such as a hard coat from physical stimulation (external force) may be formed as a surface film. In the display device 1, an image is displayed on the optical film 17 side.

  After the display device 1 is formed on the support 11 as described above, the suction stage 18 is bonded to the back surface of the support 11 and the support 11 is peeled off from the substrate 13 as shown in FIG. . Thereby, the stacked body 1 </ b> A constituting the display device 1 is separated from the support 11. As a method of separating the support 11 and the substrate 13, for example, as shown in FIG. 2A, the picking tape A may be attached to the peeling start portion and peeled in the direction of the arrow. Further, as shown in FIG. 2 (B), the picking tape A may be attached to the peeling start portion, and peeling may be carried out while holding the support 11 and the substrate 13 with a roller. The fixed layer 12 may be attached to the support 11, but may be removed as necessary. Here, when the support 11 and the substrate 13 are peeled off, the suction stage 18 is attached to the back surface of the support 11. However, the suction stage 18 may not necessarily be provided.

  Subsequently, as shown in FIGS. 3A and 3B, in the present embodiment, the substrate 13 provided with the electronic circuit layer 14 and the like and the suction stage 21 are fixed via the step absorption layer 22. At this time, the substrate 13 is fixed so that the surface having the step portion 13 </ b> A formed by providing the electronic circuit layer 14 and the like is in contact with the step absorption layer 22.

  The suction stage 21 fixes the flexible substrate 13 and facilitates transportation in the manufacturing process. As a material of the suction stage, for example, a metal such as stainless steel or aluminum can be used. Further, these metals may be subjected to a surface treatment such as aluminum alumite processing. The suction stage 21 is provided with a suction path for sucking the substrate 13 through through holes 22A to 22F formed in the step absorption layer 22 described later.

  In the step absorption layer 22 in the present embodiment, the electronic circuit layer 14 is provided on the surface facing the adsorption stage 21, and the display layer 15 is fixed when the substrate 13 on which the step 13A is formed and the adsorption stage 21 are fixed. It absorbs the level difference due to the above. This prevents damage to the electronic circuit layer 14 and the display layer 15 due to deformation such as bending of the substrate 13 by the step portion 13A. As the material of the step absorption layer 22, a material having a certain degree of elasticity is used. Specifically, for example, urethane or polyolefin formed by foaming such as PORON (trademark), ASRS-40PA-1.0t (manufactured by Inoac Corporation), acrylic, styrene, silicon, polyethylene, polypropylene, polyethylene terephthalate, vinyl chloride, Examples thereof include foamed resins mainly composed of ethylene-vinyl acetate copolymer resin (EVA) or synthetic rubber such as nitrile rubber. The film thickness X1 of the step absorption layer 22 may be thicker than the thickness X2 of the step portion 13A formed on the substrate 13. For example, when the thickness X2 of the step portion 13A is 25 to 150 μm, the step absorption layer 22 By setting the film thickness X1 of the layer 22 to 1 mm, the step on the substrate 13 can be sufficiently absorbed and the back surface of the substrate 13 can be held flat. In addition, by making the material and film thickness of the step absorption layer 22 as described above, the adsorption stage provided with the step absorption layer 22 can be used regardless of the shape of the step portion 13A provided on the substrate 13, It can be reused. Further, the step absorption layer 22 is preferably subjected to antistatic treatment. This facilitates the bonding of the substrate 13 and the step absorption layer 22.

  The step absorption layer 22 may be provided with through holes 22A to 22F penetrating in the thickness direction. By providing the through holes 22 </ b> A to 22 </ b> F, the substrate 13 can be reliably fixed to the suction stage 21. The number of the through holes 22A to 22F may be provided as appropriate, and the shape is not particularly limited. For example, as shown in FIG. 4A, one through hole 22A may be provided outside the stepped portion 13A. Further, as shown in FIG. 4B, the through holes 22B may be provided uniformly over the entire contact region (S1 and S2) with the substrate 13 including the step region S1 and the step region S2. Further, as shown in FIG. 4C, the formation density of the through holes 22D in the non-step region S2 may be higher than the formation density of the through holes 22C in the step region S1. Furthermore, as shown in FIG. 4D, a through hole 22F having a diameter Y2 larger than the diameter Y1 of the through hole 22E provided on the inner side may be provided on the outer periphery of the contact areas S1 and S2 with the substrate 13. Good. It should be noted that it is desirable that the structure of the through hole is simple because it is easy to process. However, when the substrate 13 has a curl, the substrate 13 can be stably fixed to the suction stage 21 by improving the adsorptivity of the outer peripheral portion of the substrate 13 in particular. Therefore, it is preferable to optimize the number, diameter, and density of the through holes 22A to 22F according to the degree of curling of the substrate 13.

  Next, after fixing the substrate 13 to the suction stage 21, a support substrate 31 is attached to the back surface of the substrate 13 via a fixed layer 32 as shown in FIG.

  The support substrate 31 supports the substrate 13. As the material of the support substrate 13, the same material as the substrate 13 having a thickness larger than that of the substrate 13, for example, a thickness of 100 to 125 μm can be used. A metal substrate may be used.

  The fixed layer 32 fixes the substrate 13 and the support substrate 31, and the same material as the fixed layer 12 can be used.

  Although not shown here, an impact absorption layer made of gel or the like may be provided on the back surface of the support substrate 31.

  After the support substrate 31 is formed on the back surface of the substrate 13 as described above, the suction of the suction stage 21 is released as shown in FIG. 3D, and the substrate 13 with the support substrate 31 bonded to the back surface is taken out. Thus, the display device 1 is completed.

  5A schematically shows the curl of the flexible substrate, and FIG. 5B shows the measurement position of the curl amount of the flexible substrate. FIG. 5C shows an example of the relationship between the film thickness of the support substrate 31 and the curl amount of the flexible substrate. Note that the flexible substrate measured here is a substrate in which a TFT is provided as the electronic circuit layer 14 on the substrate 13 and an electrophoretic layer is provided between the pixel electrode and the common electrode as the display layer 15. A support substrate 31 is bonded to the back surface of the substrate 13.

  As can be seen from FIG. 5C, when the support substrate 31 is not bonded, there is a curl amount of 30 to 80 mm, but by increasing the thickness of the support substrate 31, the curl amount of the substrate 13 is reduced. can do. In particular, the curl amount can be made substantially zero by bonding the support substrate 31 having a thickness of 100 μm. Note that the amount of curl at each position is not fixed but changes depending on the support position at the time of measurement.

  As described above, in the method of manufacturing the display device 1 according to the present embodiment, when the substrate 13 having the step portion 13A formed by providing the electronic circuit layer 14, the display layer 15, and the like and the suction stage 21 are fixed. The step absorption layer 22 is interposed. Thereby, the step portion 13A provided on the substrate 13 is absorbed by the step absorption layer 22, and deformation such as bending of the substrate 13 and the electronic circuit layer 14 at the end portion of the step portion 13A when being fixed to the adsorption stage is reduced. Is done. For this reason, damage to the electronic circuit layer 14 and the display layer 15 provided on the substrate 13 is prevented. That is, the yield of the display device 1 can be improved.

  Moreover, since it becomes possible to hold | maintain the board | substrate 13 flat, mixing of the bubble between the board | substrate 13 at the time of bonding the support substrate 31 and a support substrate is reduced. Thereby, the alignment at the time of bonding a flexible printed circuit board (FPC) etc. in a later process becomes easy. Furthermore, it is possible to apply pressure uniformly when the flexible printed circuit board is pressure-bonded. That is, the reliability of the display device 1 is improved.

  The display device 1 can be mounted on the electronic devices shown in the following application examples 1 to 6, for example.

(Application example 1)
FIG. 6 shows an external configuration of the electronic book. The electronic book includes, for example, a display unit 110, a non-display unit 120, and an operation unit 130. Note that the operation unit 130 may be provided on the front surface of the non-display unit 120 (housing) as shown in (A), or may be provided on the upper surface as shown in (B). . Note that the display device may be mounted on a PDA or the like having a configuration similar to that of the electronic book illustrated in FIG.

(Application example 2)
FIG. 7 illustrates an external configuration of the television device. The television apparatus includes a video display screen unit 200 including a front panel 210 and a filter glass 220, for example.

(Application example 3)
FIG. 8 shows the external configuration of the digital still camera, and (A) and (B) show the front and rear surfaces, respectively. This digital still camera includes, for example, a light emitting unit 310 for flash, a display unit 320, a menu switch 330, and a shutter button 340.

(Application example 4)
FIG. 9 shows an external configuration of a notebook personal computer. The notebook personal computer includes, for example, a main body 410, a keyboard 420 for inputting characters and the like, and a display unit 430 that displays an image.

(Application example 5)
FIG. 10 shows an external configuration of the video camera. This video camera includes, for example, a main body 510, a subject photographing lens 520 provided on the front surface of the main body 510, a start / stop switch 530 at the time of photographing, and a display 540.

(Application example 6)
FIG. 11 shows an external configuration of the mobile phone. (A) and (B) have shown the front and side surface of the state which opened the mobile phone, respectively. (C)-(G) have shown the front, the left side, the right side, the upper surface, and the lower surface of the state which respectively closed the mobile telephone. In this mobile phone, for example, an upper housing 610 and a lower housing 620 are connected by a connecting portion (hinge portion) 630, and a display 640, a sub-display 650, a picture light 660, and a camera 670 are connected. And.

While the present invention has been described with reference to the embodiment, the present disclosure is not limited to the above embodiment, and various modifications can be made. For example, in the above embodiment, an electrophoretic display having an electrophoretic layer between the pixel electrode and the common electrode as the display layer 13 has been described, but liquid crystal, organic EL (Electro-Luminescence), inorganic EL, or the like It may be constituted by.

  In addition, the material and thickness of each layer described in the above embodiment, the film formation method, the film formation conditions, and the like are not limited, and may be other materials and thicknesses, or other film formation methods and film formation. It is good also as conditions.

  Furthermore, in the said embodiment, although the structure of the display apparatus 1 was mentioned concretely and demonstrated, it is not necessary to provide all the layers and you may further provide other layers. For example, the barrier layer described in the protective film 16 described above may be provided between the substrate 13 and the electronic circuit layer 14. By providing the barrier layer, deterioration of the electronic circuit layer 14 and the display layer 15 due to moisture or organic gas can be prevented. Furthermore, in order to perform color display and color display, a color filter layer or a plastic substrate having a color filter on the display layer 15 and an adhesive for fixing the plastic substrate to the display body 15 An agent may be provided. In addition, this adhesive may use the same material as the fixed layer 12.

In addition, this technique can also take the following structures.
(1) A step of forming a functional layer for a device having a step on one surface of the flexible substrate, and a step of fixing the one surface of the flexible substrate to the suction stage via the step absorption layer. A method for manufacturing an electronic device.
(2) The method according to (1), including a step of fixing a support substrate to the other surface of the flexible substrate after fixing the suction substrate to the suction stage via the step absorption layer. Electronic device manufacturing method.
(3) The manufacturing method of the electronic device according to (1) or (2), wherein the step absorption layer has one or more through holes penetrating in a thickness direction.
(4) The method for manufacturing an electronic device according to any one of (1) to (3), wherein the through hole is provided outside the electronic circuit layer.
(5) The manufacturing of the electronic device according to any one of (1) to (3), wherein the through holes are formed at equal intervals over the entire area in contact with the flexible substrate. Method.
(6) The manufacturing method of the electronic device according to any one of (1) to (3), wherein the through hole has a higher formation density on the outside than the inside of the electronic circuit layer.
(7) The method for manufacturing an electronic device according to any one of (1) to (3), wherein the through-hole has a larger diameter of the outer through-hole than the inside of the electronic circuit layer.
(8) The method for manufacturing an electronic device according to any one of (1) to (7), wherein the step absorption layer is subjected to an antistatic treatment.
(9) A step of fixing the flexible substrate to a support, a step of providing an electronic circuit layer on the upper surface of the fixed flexible substrate, and a step of peeling the support from the flexible substrate. The manufacturing method of the electronic device of any one of said (1) thru | or (8) containing.
(10) The method for manufacturing an electronic device according to any one of (1) to (9), wherein the flexible substrate and the support substrate are bonded together via a fixed layer.
(11) A display device comprising: a step of forming a display layer having a step on one surface of a flexible substrate; and a step of fixing the one surface of the flexible substrate to an adsorption stage via a step absorption layer. Manufacturing method

DESCRIPTION OF SYMBOLS 1 ... Display apparatus, 10 ... Laminated body, 11 ... Support body, 12 ... Fixed layer, 13 ... Substrate, 14 ... Electronic circuit layer, 15 ... Display layer, 16 ... Protective film, 17 ... Optical film, 18, 21 ... Adsorption Stage, 22 ... step absorption layer, 31 ... support substrate.

Claims (11)

Forming a functional layer for a device having a step on one surface of a flexible substrate;
Fixing one surface of the flexible substrate to an adsorption stage via a step absorption layer.   2. The electronic device according to claim 1, further comprising a step of attaching a support substrate to the other surface of the flexible substrate after fixing the suction substrate to the one surface of the flexible substrate via the step absorption layer. Production method.   The method for manufacturing an electronic device according to claim 1, wherein the step absorption layer has one or more through holes penetrating in the thickness direction.   The said through-hole is a manufacturing method of the electronic device of Claim 3 provided in the outer side of the said electronic circuit layer.   The method of manufacturing an electronic device according to claim 3, wherein the through holes are formed at equal intervals over the entire area in contact with the flexible substrate.   The method for manufacturing an electronic device according to claim 3, wherein the through hole has a higher formation density on the outer side than on the inner side of the electronic circuit layer.   The method for manufacturing an electronic device according to claim 3, wherein the through hole has a larger diameter of the outer through hole than the inner side of the electronic circuit layer.   The method for manufacturing an electronic device according to claim 1, wherein the step absorption layer is subjected to an antistatic treatment. Fixing the flexible substrate to a support;
Providing an electronic circuit layer on an upper surface of the fixed flexible substrate;
The manufacturing method of the electronic device of Claim 1 including the process of peeling the said support body from the said flexible substrate.   The method for manufacturing an electronic device according to claim 1, wherein the flexible substrate and the support substrate are bonded together via a fixed layer. Forming a display layer with a step on one surface of the flexible substrate;
Fixing one surface of the flexible substrate to a suction stage through a step absorption layer.

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