JP2012212048A - Photo-curable thermosetting resin composition, dry film and cured product of the same, and printed wiring board using the same - Google Patents
Photo-curable thermosetting resin composition, dry film and cured product of the same, and printed wiring board using the same Download PDFInfo
- Publication number
- JP2012212048A JP2012212048A JP2011078109A JP2011078109A JP2012212048A JP 2012212048 A JP2012212048 A JP 2012212048A JP 2011078109 A JP2011078109 A JP 2011078109A JP 2011078109 A JP2011078109 A JP 2011078109A JP 2012212048 A JP2012212048 A JP 2012212048A
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- Prior art keywords
- resin composition
- compound
- group
- thermosetting resin
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 72
- 239000011342 resin composition Substances 0.000 title claims abstract description 69
- 229920005989 resin Polymers 0.000 claims abstract description 73
- 239000011347 resin Substances 0.000 claims abstract description 73
- 150000001875 compounds Chemical class 0.000 claims abstract description 71
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 62
- 229910000679 solder Inorganic materials 0.000 claims abstract description 39
- 238000000576 coating method Methods 0.000 claims abstract description 36
- 239000011248 coating agent Substances 0.000 claims abstract description 32
- 239000004593 Epoxy Substances 0.000 claims abstract description 31
- 241000196324 Embryophyta Species 0.000 claims abstract description 16
- 235000012424 soybean oil Nutrition 0.000 claims abstract description 4
- 239000003549 soybean oil Substances 0.000 claims abstract description 4
- 235000021388 linseed oil Nutrition 0.000 claims abstract description 3
- 239000000944 linseed oil Substances 0.000 claims abstract description 3
- 238000001035 drying Methods 0.000 claims description 24
- 239000003999 initiator Substances 0.000 claims description 20
- 239000003513 alkali Substances 0.000 claims description 11
- 238000000016 photochemical curing Methods 0.000 claims description 5
- 238000001723 curing Methods 0.000 claims description 2
- 238000013007 heat curing Methods 0.000 claims 1
- 238000003860 storage Methods 0.000 abstract description 14
- 238000007747 plating Methods 0.000 abstract description 13
- 238000009413 insulation Methods 0.000 abstract description 10
- 239000002253 acid Substances 0.000 abstract description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052737 gold Inorganic materials 0.000 abstract description 9
- 239000010931 gold Substances 0.000 abstract description 9
- 239000007788 liquid Substances 0.000 abstract description 3
- -1 glycidyl compound Chemical class 0.000 description 99
- 239000000049 pigment Substances 0.000 description 93
- 239000010408 film Substances 0.000 description 78
- 239000003822 epoxy resin Substances 0.000 description 39
- 229920000647 polyepoxide Polymers 0.000 description 39
- 239000000203 mixture Substances 0.000 description 35
- 239000000047 product Substances 0.000 description 25
- 239000000758 substrate Substances 0.000 description 25
- 239000000126 substance Substances 0.000 description 21
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 16
- 238000002156 mixing Methods 0.000 description 16
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 15
- 125000004432 carbon atom Chemical group C* 0.000 description 15
- 239000002981 blocking agent Substances 0.000 description 14
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 14
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 14
- 239000005056 polyisocyanate Substances 0.000 description 14
- 229920001228 polyisocyanate Polymers 0.000 description 14
- 125000000217 alkyl group Chemical group 0.000 description 13
- 239000012948 isocyanate Substances 0.000 description 13
- 239000007864 aqueous solution Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 239000003795 chemical substances by application Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- 229910000831 Steel Inorganic materials 0.000 description 9
- 238000011161 development Methods 0.000 description 9
- 230000018109 developmental process Effects 0.000 description 9
- 239000010959 steel Substances 0.000 description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 8
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 8
- 239000013039 cover film Substances 0.000 description 8
- 125000004122 cyclic group Chemical group 0.000 description 8
- 125000003700 epoxy group Chemical group 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical group S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 7
- 239000003963 antioxidant agent Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 7
- 229920005862 polyol Polymers 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 125000003545 alkoxy group Chemical group 0.000 description 6
- 150000004056 anthraquinones Chemical class 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 6
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 6
- 229910052753 mercury Inorganic materials 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 150000003077 polyols Chemical class 0.000 description 6
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 6
- 238000003786 synthesis reaction Methods 0.000 description 6
- 230000008719 thickening Effects 0.000 description 6
- 150000008065 acid anhydrides Chemical class 0.000 description 5
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 5
- 230000003078 antioxidant effect Effects 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 5
- VPKDCDLSJZCGKE-UHFFFAOYSA-N carbodiimide group Chemical group N=C=N VPKDCDLSJZCGKE-UHFFFAOYSA-N 0.000 description 5
- 239000003086 colorant Substances 0.000 description 5
- 238000013329 compounding Methods 0.000 description 5
- 238000004090 dissolution Methods 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 239000003112 inhibitor Substances 0.000 description 5
- NYGZLYXAPMMJTE-UHFFFAOYSA-M metanil yellow Chemical group [Na+].[O-]S(=O)(=O)C1=CC=CC(N=NC=2C=CC(NC=3C=CC=CC=3)=CC=2)=C1 NYGZLYXAPMMJTE-UHFFFAOYSA-M 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 239000003208 petroleum Substances 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical class C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- WQAQPCDUOCURKW-UHFFFAOYSA-N butanethiol Chemical compound CCCCS WQAQPCDUOCURKW-UHFFFAOYSA-N 0.000 description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 125000004663 dialkyl amino group Chemical group 0.000 description 4
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000031700 light absorption Effects 0.000 description 4
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- 150000002978 peroxides Chemical class 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 238000012719 thermal polymerization Methods 0.000 description 4
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 4
- 150000003553 thiiranes Chemical class 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 3
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- HEQOJEGTZCTHCF-UHFFFAOYSA-N 2-amino-1-phenylethanone Chemical compound NCC(=O)C1=CC=CC=C1 HEQOJEGTZCTHCF-UHFFFAOYSA-N 0.000 description 3
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 3
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Natural products CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- 239000005058 Isophorone diisocyanate Substances 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 3
- 150000008366 benzophenones Chemical class 0.000 description 3
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 3
- 230000001588 bifunctional effect Effects 0.000 description 3
- QDVNNDYBCWZVTI-UHFFFAOYSA-N bis[4-(ethylamino)phenyl]methanone Chemical compound C1=CC(NCC)=CC=C1C(=O)C1=CC=C(NCC)C=C1 QDVNNDYBCWZVTI-UHFFFAOYSA-N 0.000 description 3
- 238000003776 cleavage reaction Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 150000004292 cyclic ethers Chemical class 0.000 description 3
- 150000004294 cyclic thioethers Chemical group 0.000 description 3
- 210000001787 dendrite Anatomy 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethyl mercaptane Natural products CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 3
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 3
- 150000007974 melamines Chemical class 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- 150000002921 oxetanes Chemical class 0.000 description 3
- 125000003566 oxetanyl group Chemical group 0.000 description 3
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 3
- 229950000688 phenothiazine Drugs 0.000 description 3
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 3
- 239000002516 radical scavenger Substances 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical class OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- PMBXCGGQNSVESQ-UHFFFAOYSA-N 1-Hexanethiol Chemical compound CCCCCCS PMBXCGGQNSVESQ-UHFFFAOYSA-N 0.000 description 2
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 2
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 2
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 2
- HHOJVZAEHZGDRB-UHFFFAOYSA-N 2-(4,6-diamino-1,3,5-triazin-2-yl)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC1=NC(N)=NC(N)=N1 HHOJVZAEHZGDRB-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
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- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical class C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 2
- SUWCVSZZLFOSJL-UHFFFAOYSA-N 3-sulfanyloxolan-2-one Chemical compound SC1CCOC1=O SUWCVSZZLFOSJL-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- KXDAEFPNCMNJSK-UHFFFAOYSA-N Benzamide Chemical compound NC(=O)C1=CC=CC=C1 KXDAEFPNCMNJSK-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
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Abstract
Description
本発明は、希アルカリ水溶液により現像可能な光硬化性熱硬化性樹脂組成物、特に紫外線露光又はレーザー露光により光硬化するソルダーレジスト用組成物、そのドライフィルム及び硬化物、並びにそれらを用いて形成された硬化皮膜を有するプリント配線板に関する。 The present invention relates to a photocurable thermosetting resin composition that can be developed with a dilute alkaline aqueous solution, in particular, a solder resist composition that is photocured by ultraviolet exposure or laser exposure, a dry film and a cured product thereof, and a film formed using them. The present invention relates to a printed wiring board having a cured film.
最近の半導体部品の急速な進歩により、電子機器は小型軽量化、高性能化、多機能化される傾向にある。この傾向に追従して、プリント配線板においても、高密度化、部品の表面実装化が進みつつある。高密度プリント配線板の製造においては一般にフォトソルダーレジストが採用されており、ドライフィルム型フォトソルダーレジストや液状フォトソルダーレジストが開発されている。これらの中でも、環境問題への配慮から、現像液として希アルカリ水溶液を用いるアルカリ現像型の感光性組成物が主流になっており、従来、幾つかの組成系が提案されている(特許文献1参照)。 With recent rapid progress in semiconductor components, electronic devices tend to be smaller, lighter, higher performance, and multifunctional. Following this trend, printed wiring boards are also becoming increasingly dense and surface-mounted. In the production of high-density printed wiring boards, photo solder resist is generally employed, and dry film type photo solder resist and liquid photo solder resist have been developed. Among these, in consideration of environmental problems, an alkali developing type photosensitive composition using a dilute alkaline aqueous solution as a developing solution has become the mainstream, and several composition systems have been proposed (Patent Document 1). reference).
アルカリ現像型の感光性組成物はカルボキシル基を有する樹脂を組成物に含有することにより、アルカリ現像性を発現している。
しかしながら、カルボキシル基は親水性が大きく、ソルダーレジスト等の感光性絶縁材料にカルボキシル基を有する樹脂を用いた場合、絶縁信頼性の劣化が起こり易くなる。
そこで絶縁信頼性や、はんだ耐熱性の向上を目的として、グリシジル化合物に代表されるカルボキシル基と架橋可能な熱硬化性成分が用いられている。
The alkali-developable photosensitive composition exhibits alkali developability by containing a resin having a carboxyl group in the composition.
However, the carboxyl group is highly hydrophilic, and when a resin having a carboxyl group is used as a photosensitive insulating material such as a solder resist, the insulation reliability is likely to deteriorate.
Therefore, for the purpose of improving insulation reliability and solder heat resistance, a thermosetting component capable of crosslinking with a carboxyl group represented by a glycidyl compound is used.
カルボキシル基とグリシジル基は室温でも架橋反応が進行する為、ソルダーレジスト組成物はカルボキシル基含有化合物とグリシジル化合物を分けた「2液型」が一般的である。
しかしながら、2液型のソルダーレジストは混合後の可使時間(ポットライフ)が数時間〜1日程度と短く、塗布工程の直前で混合しなければならない。さらにこの混合工程に時間がかかるといった問題がある。
Since the carboxyl group and the glycidyl group undergo a crosslinking reaction even at room temperature, the solder resist composition is generally a “two-pack type” in which the carboxyl group-containing compound and the glycidyl compound are separated.
However, the two-pack type solder resist has a short pot life after mixing as short as several hours to one day, and must be mixed immediately before the coating process. Furthermore, there is a problem that this mixing process takes time.
このような2液型の持つ欠点を補う為、1液型の感光性樹脂組成物が種々検討されている。
例えば、グリシジル化合物の代わりにブロックイソシアネート化合物を用い、これとカルボキシル基含有樹脂、光重合開始剤、希釈剤、密着付与剤からなる感光性樹脂組成物が提案されている(特許文献2参照)。また、グリシジル化合物を熱破壊性の膜に内包し、室温ではカルボン酸化合物とグリシジル化合物の反応を潜在化するエポキシ樹脂内包マイクロカプセルを用いた感光性樹脂組成物等も提案されている(特許文献3参照)。
In order to compensate for the disadvantages of the two-component type, various one-component type photosensitive resin compositions have been studied.
For example, a photosensitive resin composition comprising a blocked isocyanate compound instead of a glycidyl compound and comprising a carboxyl group-containing resin, a photopolymerization initiator, a diluent, and an adhesion promoter has been proposed (see Patent Document 2). In addition, a photosensitive resin composition using an epoxy resin-encapsulated microcapsule that encapsulates a glycidyl compound in a thermally destructible film and latentizes the reaction between the carboxylic acid compound and the glycidyl compound at room temperature has been proposed (Patent Literature). 3).
しかしながら、上記特許文献に記載された光硬化性熱硬化性樹脂組成物では、硬化塗膜の耐熱性や絶縁信頼性が不十分であったり、高コスト化が懸念されるといった問題がある。 However, the photocurable thermosetting resin composition described in the above-mentioned patent document has problems that the heat resistance and insulation reliability of the cured coating film are insufficient or that the cost is increased.
そこで、本発明は、1液型樹脂組成物として、またそのドライフィルムとして室温での保存安定性が良好であり、かつ現像性、はんだ耐熱性、絶縁信頼性、金めっき耐性等に優れた光硬化性熱硬化性樹脂組成物を提供することを目的とする。
さらに本発明の目的は、このような光硬化性熱硬化性樹脂組成物を用いることによって得られる上記のような諸特性に優れたドライフィルム及び硬化物、並びに該ドライフィルムや硬化物によりソルダーレジスト等の硬化皮膜が形成されてなるプリント配線板を提供することにある。
Therefore, the present invention provides light having excellent storage stability at room temperature as a one-component resin composition and as a dry film, and having excellent developability, solder heat resistance, insulation reliability, gold plating resistance, and the like. An object is to provide a curable thermosetting resin composition.
Furthermore, the object of the present invention is to provide a dry film and a cured product excellent in various properties as described above obtained by using such a photocurable thermosetting resin composition, and a solder resist using the dry film and the cured product. An object of the present invention is to provide a printed wiring board on which a cured film such as the above is formed.
前記目的を達成するために、本発明によれば、カルボキシル基含有樹脂、光重合開始剤、及び植物由来エポキシ化合物を含有することを特徴とする常温保存が可能な光硬化性熱硬化性樹脂組成物が提供される。
好適な様態においては、前記カルボキシル基含有樹脂の酸価は30〜150mgKOH/gであることが好ましく、また光重合性基、特にエチレン性不飽和基を有していることが好ましい。また、前記植物由来エポキシ化合物としては、エポキシ化大豆油やエポキシ化アマニ油が汎用性の観点から好ましい。
In order to achieve the above object, according to the present invention, a photocurable thermosetting resin composition capable of being stored at room temperature, comprising a carboxyl group-containing resin, a photopolymerization initiator, and a plant-derived epoxy compound. Things are provided.
In a preferred embodiment, the acid value of the carboxyl group-containing resin is preferably 30 to 150 mgKOH / g, and preferably has a photopolymerizable group, particularly an ethylenically unsaturated group. Moreover, as said plant-derived epoxy compound, epoxidized soybean oil and epoxidized linseed oil are preferable from a versatility viewpoint.
また、本発明によれば、前記光硬化性熱硬化性樹脂組成物を、キャリアフィルム上に塗布・乾燥させて得られる光硬化性のドライフィルムや、前記光硬化性樹脂組成物又は該ドライフィルムを硬化させて得られる硬化物、特に銅上にて光硬化させて得られる硬化物や、パターン状に光硬化して得られる硬化物も提供される。
さらに本発明によれば、前記光硬化性熱硬化性樹脂組成物又はドライフィルムをパターン状に光硬化させた後、熱硬化して得られる硬化皮膜を有することを特徴とするプリント配線板も提供される。
Further, according to the present invention, a photocurable dry film obtained by applying and drying the photocurable thermosetting resin composition on a carrier film, the photocurable resin composition, or the dry film. There are also provided a cured product obtained by curing the resin, particularly a cured product obtained by photocuring on copper, and a cured product obtained by photocuring in a pattern.
Furthermore, according to the present invention, there is also provided a printed wiring board characterized by having a cured film obtained by photocuring the photocurable thermosetting resin composition or dry film in a pattern and then thermosetting. Is done.
本発明の光硬化性熱硬化性樹脂組成物によれば、1液型樹脂組成物として、またそのドライフィルムとして室温での保存安定性が良好であり、かつ現像性、はんだ耐熱性、絶縁信頼性、金めっき耐性等の諸特性に優れた硬化物を形成できる。
従って、本発明の光硬化性熱硬化性樹脂組成物は、プリント配線板やフレキシブルプリント配線板のソルダーレジスト等の硬化皮膜の形成に有利に適用できる。
According to the photocurable thermosetting resin composition of the present invention, the storage stability at room temperature is good as a one-component resin composition and as a dry film, and developability, solder heat resistance, and insulation reliability. Cured products having excellent properties such as properties and gold plating resistance.
Therefore, the photocurable thermosetting resin composition of the present invention can be advantageously applied to the formation of a cured film such as a solder resist of a printed wiring board or a flexible printed wiring board.
前記したように、本発明の光硬化性熱硬化性樹脂組成物の特徴は、カルボキシル基含有樹脂、光重合開始剤と組み合わせて植物由来エポキシ化合物を用いている点にある。
本発明者らの研究によれば、このような光硬化性熱硬化性樹脂組成物は、室温での保存安定性に優れ、1液型樹脂組成物として常温保存が可能であり、かつ現像性、はんだ耐熱性、絶縁信頼性、金めっき耐性等に優れた樹脂組成物を提供することが可能である。さらに熱硬化性成分として植物原料を用いている為、環境に配慮した樹脂組成物を提供することが可能である。
以下、本発明の光硬化性熱硬化性樹脂組成物の各構成成分について詳しく説明する。
As described above, the photocurable thermosetting resin composition of the present invention is characterized in that a plant-derived epoxy compound is used in combination with a carboxyl group-containing resin and a photopolymerization initiator.
According to the study by the present inventors, such a photocurable thermosetting resin composition is excellent in storage stability at room temperature, and can be stored at room temperature as a one-component resin composition, and developability. It is possible to provide a resin composition excellent in solder heat resistance, insulation reliability, gold plating resistance, and the like. Furthermore, since plant raw materials are used as the thermosetting component, it is possible to provide an environmentally friendly resin composition.
Hereinafter, each component of the photocurable thermosetting resin composition of the present invention will be described in detail.
前記カルボキシル基含有樹脂としては、架橋反応、密着性及びアルカリ現像性を付与する目的で分子中にカルボキシル基を有している従来公知の各種カルボキシル基含有樹脂を使用できる。特に、分子中にエチレン性不飽和二重結合を有するカルボキシル基含有感光性樹脂が、アルカリ現像を行う感光性の組成物として光硬化性や耐現像性の面からより好ましい。そして、その不飽和二重結合は、アクリル酸もしくはメタアクリル酸又はそれらの誘導体由来のものが好ましく、エチレン性不飽和基を有するカルボキシル基含有(メタ)アクリレートであることが好ましい。尚、エチレン性不飽和二重結合を有さないカルボキシル基含有樹脂のみを用いる場合、組成物を光硬化性とするためには、後述する分子中に複数のエチレン性不飽和基を有する感光性化合物(光重合性モノマー)を光硬化に必要な量で併用する必要がある。
カルボキシル基含有樹脂の具体例としては、以下に列挙するような化合物(オリゴマー及びポリマーのいずれでもよい)が好ましい。
As the carboxyl group-containing resin, conventionally known various carboxyl group-containing resins having a carboxyl group in the molecule for the purpose of imparting a crosslinking reaction, adhesion and alkali developability can be used. In particular, a carboxyl group-containing photosensitive resin having an ethylenically unsaturated double bond in the molecule is more preferable from the viewpoint of photocurability and development resistance as a photosensitive composition for performing alkali development. The unsaturated double bond is preferably derived from acrylic acid or methacrylic acid or a derivative thereof, and is preferably a carboxyl group-containing (meth) acrylate having an ethylenically unsaturated group. In addition, when using only the carboxyl group-containing resin having no ethylenically unsaturated double bond, in order to make the composition photocurable, the photosensitivity having a plurality of ethylenically unsaturated groups in the molecule described later. It is necessary to use a compound (photopolymerizable monomer) in an amount necessary for photocuring.
As specific examples of the carboxyl group-containing resin, the following compounds (any of oligomers and polymers) are preferable.
(1)(メタ)アクリル酸等の不飽和カルボン酸と、スチレン、α−メチルスチレン、低級アルキル(メタ)アクリレート、イソブチレン等の不飽和基含有化合物との共重合により得られるカルボキシル基含有樹脂に分子内に1つ以上のエチレン性不飽和基と1つのエポキシ基を有する化合物を反応させてなるカルボキシル基含有感光性樹脂。 (1) A carboxyl group-containing resin obtained by copolymerization of an unsaturated carboxylic acid such as (meth) acrylic acid and an unsaturated group-containing compound such as styrene, α-methylstyrene, lower alkyl (meth) acrylate, and isobutylene. A carboxyl group-containing photosensitive resin obtained by reacting a compound having one or more ethylenically unsaturated groups and one epoxy group in a molecule.
(2)脂肪族ジイソシアネート、分岐脂肪族ジイソシアネート、脂環式ジイソシアネート、芳香族ジイソシアネート等のジイソシアネートと、ジメチロールプロピオン酸、ジメチロールブタン酸等のカルボキシル基含有ジアルコール化合物及びポリカーボネート系ポリオール、ポリエーテル系ポリオール、ポリエステル系ポリオール、ポリオレフィン系ポリオール、アクリル系ポリオール、ビスフェノールA系アルキレンオキシド付加体ジオール、フェノール性ヒドロキシル基及びアルコール性ヒドロキシル基を有する化合物等のジオール化合物の重付加反応によるカルボキシル基含有ウレタン樹脂。 (2) Diisocyanates such as aliphatic diisocyanates, branched aliphatic diisocyanates, alicyclic diisocyanates, and aromatic diisocyanates; carboxyl group-containing dialcohol compounds such as dimethylolpropionic acid and dimethylolbutanoic acid, polycarbonate polyols, and polyethers A carboxyl group-containing urethane resin by a polyaddition reaction of a diol compound such as a polyol, a polyester-based polyol, a polyolefin-based polyol, an acrylic polyol, a bisphenol A-based alkylene oxide adduct diol, a compound having a phenolic hydroxyl group and an alcoholic hydroxyl group.
(3)ジイソシアネートと、ビスフェノールA型エポキシ樹脂、水添ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、ビキシレノール型エポキシ樹脂、ビフェノール型エポキシ樹脂等の2官能エポキシ樹脂の(メタ)アクリレートもしくはその部分酸無水物変性物、カルボキシル基含有ジアルコール化合物及びジオール化合物の重付加反応によるカルボキシル基含有感光性ウレタン樹脂。 (3) Diisocyanate and bifunctional epoxy resin such as bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bixylenol type epoxy resin, biphenol type epoxy resin ( A carboxyl group-containing photosensitive urethane resin obtained by a polyaddition reaction of (meth) acrylate or a partially acid anhydride-modified product thereof, a carboxyl group-containing dialcohol compound, and a diol compound.
(4)前記(2)又は(3)の樹脂の合成中に、ヒドロキシアルキル(メタ)アクリレート等の分子内に1つの水酸基と1つ以上の(メタ)アクリル基を有する化合物を加え、末端(メタ)アクリル化したカルボキシル基含有感光性ウレタン樹脂。 (4) During the synthesis of the resin of the above (2) or (3), a compound having one hydroxyl group and one or more (meth) acryl groups in the molecule such as hydroxyalkyl (meth) acrylate is added, and the terminal ( (Meth) acrylic carboxyl group-containing photosensitive urethane resin.
(5)前記(2)又は(3)の樹脂の合成中に、イソホロンジイソシアネートとペンタエリスリトールトリアクリレートの等モル反応物など、分子内に1つのイソシアネート基と1つ以上の(メタ)アクリル基を有する化合物を加え末端(メタ)アクリル化したカルボキシル基含有感光性ウレタン樹脂。 (5) During the synthesis of the resin of the above (2) or (3), one isocyanate group and one or more (meth) acryl groups are added in the molecule, such as an equimolar reaction product of isophorone diisocyanate and pentaerythritol triacrylate. A carboxyl group-containing photosensitive urethane resin obtained by adding a compound having a terminal (meth) acrylate.
(6)後述するような2官能又はそれ以上の多官能(固形)エポキシ樹脂に(メタ)アクリル酸を反応させ、側鎖に存在する水酸基に無水フタル酸、テトラヒドロ無水フタル酸、ヘキサヒドロ無水フタル酸等の2塩基酸無水物を付加させたカルボキシル基含有感光性樹脂。 (6) (Meth) acrylic acid is reacted with a bifunctional or higher polyfunctional (solid) epoxy resin as described later, and phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride are added to the hydroxyl group present in the side chain. A carboxyl group-containing photosensitive resin to which a dibasic acid anhydride such as
(7)後述するような2官能(固形)エポキシ樹脂の水酸基をさらにエピクロロヒドリンでエポキシ化した多官能エポキシ樹脂に(メタ)アクリル酸を反応させ、生じた水酸基に2塩基酸無水物を付加させたカルボキシル基含有感光性樹脂。 (7) A polyfunctional epoxy resin obtained by epoxidizing a hydroxyl group of a bifunctional (solid) epoxy resin as described later with epichlorohydrin is reacted with (meth) acrylic acid, and a dibasic acid anhydride is added to the resulting hydroxyl group. Added carboxyl group-containing photosensitive resin.
(8)ノボラックのごとき多官能フェノール化合物にエチレンオキサイドのごとき環状エーテル、プロピレンカーボネートのごとき環状カーボネートを付加させ、得られた水酸基を(メタ)アクリル酸で部分エステル化し、残りの水酸基に無水マレイン酸、テトラヒドロ無水フタル酸、無水トリメリット酸、無水ピロメリット酸等の多塩基酸無水物を反応させたカルボキシル基含有感光性樹脂。 (8) A cyclic ether such as ethylene oxide or a cyclic carbonate such as propylene carbonate is added to a polyfunctional phenolic compound such as novolak, and the resulting hydroxyl group is partially esterified with (meth) acrylic acid, and the remaining hydroxyl group is treated with maleic anhydride. Carboxyl group-containing photosensitive resin obtained by reacting polybasic acid anhydrides such as tetrahydrophthalic anhydride, trimellitic anhydride and pyromellitic anhydride.
(9)上記(1)〜(8)の樹脂にさらにグリシジル(メタ)アクリレート、α−メチルグリシジル(メタ)アクリレート等の分子中に1つのエポキシ基と1つ以上の(メタ)アクリロイル基を有する化合物を付加してなるカルボキシル基含有感光性樹脂。
なお、本明細書において、(メタ)アクリレートとは、アクリレート、メタクリレート及びそれらの混合物を総称する用語であり、他の類似の表現についても同様である。
(9) The resin of the above (1) to (8) further has one epoxy group and one or more (meth) acryloyl groups in the molecule such as glycidyl (meth) acrylate and α-methylglycidyl (meth) acrylate. A carboxyl group-containing photosensitive resin obtained by adding a compound.
In the present specification, (meth) acrylate is a term that collectively refers to acrylate, methacrylate, and mixtures thereof, and the same applies to other similar expressions.
これらの中でも(1)、(2)及びその(4)及び(5)の変性物、(8)に挙げられる樹脂は、エピクロロヒドリンを原料とするエポキシ化合物(樹脂)を使用することなくカルボン酸含有樹脂が合成することができるのでハロゲンフリーの観点から特に好ましい。尚、エポキシ化合物(樹脂)でもエピクロロヒドリンを使用しないエポキシ化合物(樹脂)を使用することでハロゲンフリーを達成することもできる。 Among these, the resins mentioned in (1), (2), modified products thereof (4) and (5), and (8) can be used without using an epoxy compound (resin) made of epichlorohydrin as a raw material. Since a carboxylic acid-containing resin can be synthesized, it is particularly preferable from the viewpoint of halogen-free. In addition, even if it is an epoxy compound (resin), halogen-free can also be achieved by using the epoxy compound (resin) which does not use epichlorohydrin.
また、本発明に用いられるカルボキシル基含有樹脂は、耐熱性の観点からは前述(6)、(7)、(8)に記載しているようなノボラックやビスフェノールA、ビスフェノールF等の母骨格が芳香族骨格を有する化合物から誘導された化合物にテトラヒドロフタル酸無水物に代表される2塩基酸無水物を付加させたカルボキシル基含有感光性樹脂の方が好ましいが、保存安定性の観点からは、(メタ)アクリル酸のような不飽和カルボン酸の重合により誘導されるカルボキシル基含有樹脂の方が良好であった。これは、不飽和カルボン酸より誘導されたポリカルボン酸樹脂のカルボキシル基は、前述の酸無水物から誘導されるカルボキシル基と比較してエポキシ基との反応性がマイルドな為、保存安定性が優れていたものと考えられる。 In addition, the carboxyl group-containing resin used in the present invention has a mother skeleton such as novolak, bisphenol A, bisphenol F and the like described in the above (6), (7), and (8) from the viewpoint of heat resistance. A carboxyl group-containing photosensitive resin obtained by adding a dibasic acid anhydride represented by tetrahydrophthalic acid anhydride to a compound derived from a compound having an aromatic skeleton is preferred, but from the viewpoint of storage stability, A carboxyl group-containing resin derived by polymerization of an unsaturated carboxylic acid such as (meth) acrylic acid was better. This is because the carboxyl group of the polycarboxylic acid resin derived from the unsaturated carboxylic acid is milder in reactivity with the epoxy group than the carboxyl group derived from the aforementioned acid anhydride, so that the storage stability is improved. It is thought that it was excellent.
上記のようなカルボキシル基含有樹脂は、バックボーン・ポリマーの側鎖に多数のカルボキシル基を有するため、希アルカリ水溶液による現像が可能になる。 Since the carboxyl group-containing resin as described above has many carboxyl groups in the side chain of the backbone polymer, development with a dilute alkaline aqueous solution becomes possible.
また、上記カルボキシル基含有樹脂の酸価は、30〜200mgKOH/gの範囲が適当であり、より好ましくは30〜150mgKOH/g、特に好ましくは45〜120mgKOH/gの範囲である。カルボキシル基含有樹脂の酸価が30mgKOH/g未満であるとアルカリ現像が困難となり、一方、200mgKOH/gを超えると現像液による露光部の溶解が進むために、必要以上にラインが痩せたり、場合によっては、露光部と未露光部の区別なく現像液で溶解剥離してしまい、正常なレジストパターンの描画が困難となるので好ましくない。 The acid value of the carboxyl group-containing resin is suitably in the range of 30 to 200 mgKOH / g, more preferably 30 to 150 mgKOH / g, and particularly preferably 45 to 120 mgKOH / g. When the acid value of the carboxyl group-containing resin is less than 30 mgKOH / g, alkali development becomes difficult. On the other hand, when the acid value exceeds 200 mgKOH / g, dissolution of the exposed area by the developer proceeds, so that the line becomes thinner than necessary. Depending on the case, the exposed portion and the unexposed portion are not distinguished from each other by dissolution and peeling with a developer, which makes it difficult to draw a normal resist pattern.
また、上記カルボキシル基含有樹脂の重量平均分子量は、樹脂骨格により異なるが、一般的に2,000〜150,000、さらには5,000〜100,000の範囲にあるものが好ましい。重量平均分子量が2,000未満であると、タックフリー性能が劣ることがあり、露光後の塗膜の耐湿性が悪く、現像時に膜減りが生じ、解像度が大きく劣ることがある。一方、重量平均分子量が150,000を超えると、現像性が著しく悪くなることがある為、好ましくない。 Moreover, although the weight average molecular weight of the said carboxyl group containing resin changes with resin frame | skeletons, what is generally in the range of 2,000-150,000, Furthermore, 5,000-100,000 is preferable. When the weight average molecular weight is less than 2,000, tack-free performance may be inferior, the moisture resistance of the coated film after exposure may be poor, film thickness may be reduced during development, and resolution may be greatly inferior. On the other hand, when the weight average molecular weight exceeds 150,000, developability may be remarkably deteriorated.
カルボキシル基含有樹脂は、前記列挙したものに限らず使用することができ、1種類でも2種以上を混合しても使用することができる。
また、このようなカルボキシル基含有樹脂の配合量は、組成物全体量の60wt%以下、好ましくは10〜50wt%の範囲が適当である。
The carboxyl group-containing resin is not limited to those listed above, and can be used alone or in combination of two or more.
The amount of such carboxyl group-containing resin is 60 wt% or less, preferably 10 to 50 wt% of the total amount of the composition.
本発明で用いる光重合開始剤としては、オキシムエステル基を有するオキシムエステル系光重合開始剤、α−アミノアセトフェノン系光重合開始剤、アシルホスフィンオキサイド系光重合開始剤からなる群から選択される少なくとも1種の光重合開始剤を使用することができる。 The photopolymerization initiator used in the present invention is at least selected from the group consisting of an oxime ester photopolymerization initiator having an oxime ester group, an α-aminoacetophenone photopolymerization initiator, and an acylphosphine oxide photopolymerization initiator. One type of photoinitiator can be used.
前記オキシムエステル系光重合開始剤としては、市販品として、BASFジャパン社製のCGI−325、イルガキュアー(登録商標)OXE01、イルガキュアー OXE02、ADEKA社製N−1919、NCI−831などが挙げられる。また、分子内に2個のオキシムエステル基を有する光重合開始剤も好適に用いることができ、具体的には、下記一般式で表されるカルバゾール構造を有するオキシムエステル化合物が挙げられる。
特に上記一般式中、X、Yが、それぞれ、メチル基又はエチル基であり、Zはメチル基又はフェニル基であり、nは0であり、Arは、結合か、フェニレン、ナフチレン、チオフェン又はチエニレンであることが好ましい。 In particular, in the above general formula, X and Y are each a methyl group or an ethyl group, Z is a methyl group or a phenyl group, n is 0, Ar is a bond, phenylene, naphthylene, thiophene or thienylene. It is preferable that
このようなオキシムエステル系光重合開始剤の配合量は、組成物全体量の0.02〜10wt%とすることが好ましい。0.02wt%未満であると、銅上での光硬化性が不足し、塗膜が剥離するとともに、耐薬品性などの塗膜特性が低下する。一方、10wt%を超えると、ソルダーレジスト塗膜表面での光吸収が激しくなり、深部硬化性が低下する傾向がある。 The blending amount of such an oxime ester photopolymerization initiator is preferably 0.02 to 10 wt% of the total amount of the composition. When it is less than 0.02 wt%, the photocurability on copper is insufficient, the coating film is peeled off, and the coating properties such as chemical resistance are deteriorated. On the other hand, when it exceeds 10 wt%, light absorption on the surface of the solder resist coating film becomes intense, and the deep curability tends to be lowered.
前記α−アミノアセトフェノン系光重合開始剤としては、具体的には2−メチル−1−[4−(メチルチオ)フェニル]−2−モルホリノプロパノン−1、2−ベンジル−2−ジメチルアミノ−1−(4−モルホリノフェニル)−ブタン−1−オン、2−(ジメチルアミノ)−2−[(4−メチルフェニル)メチル]−1−[4−(4−モルホリニル)フェニル]−1−ブタノン、N,N−ジメチルアミノアセトフェノンなどが挙げられる。市販品としては、BASFジャパン社製のイルガキュアー907、イルガキュアー369、イルガキュアー379などが挙げられる。 Specific examples of the α-aminoacetophenone photopolymerization initiator include 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropanone-1, 2-benzyl-2-dimethylamino-1. -(4-morpholinophenyl) -butan-1-one, 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] -1-butanone, N, N-dimethylaminoacetophenone and the like can be mentioned. Examples of commercially available products include Irgacure 907, Irgacure 369, and Irgacure 379 manufactured by BASF Japan.
前記アシルホスフィンオキサイド系光重合開始剤としては、具体的には2,4,6−トリメチルベンゾイルジフェニルホスフィンオキサイド、ビス(2,4,6−トリメチルベンゾイル)−フェニルホスフィンオキサイド、ビス(2,6−ジメトキシベンゾイル)−2,4,4−トリメチル−ペンチルホスフィンオキサイドなどが挙げられる。市販品としては、BASFジャパン社製のルシリンTPO、イルガキュアー819などが挙げられる。 Specific examples of the acylphosphine oxide photopolymerization initiator include 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, and bis (2,6- And dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide. Examples of commercially available products include Lucilin TPO and Irgacure 819 manufactured by BASF Japan.
これらα−アミノアセトフェノン系光重合開始剤、アシルホスフィンオキサイド系光重合開始剤の配合量は、組成物全体量の0.5〜15wt%とすることが好ましい。0.5wt%未満であると、同様に銅上での光硬化性が不足し、塗膜が剥離するとともに、耐薬品性などの塗膜特性が低下する。一方、15wt%を超えると、アウトガスの低減効果が得られず、さらにソルダーレジスト塗膜表面での光吸収が激しくなり、深部硬化性が低下する傾向がある。 The blending amount of these α-aminoacetophenone photopolymerization initiator and acylphosphine oxide photopolymerization initiator is preferably 0.5 to 15 wt% of the total amount of the composition. If it is less than 0.5 wt%, the photocurability on copper is similarly insufficient, the coating film is peeled off, and the coating properties such as chemical resistance are lowered. On the other hand, when it exceeds 15 wt%, the effect of reducing the outgas cannot be obtained, and the light absorption on the surface of the solder resist coating film becomes intense and the deep curability tends to be lowered.
その他、本発明の光硬化性熱硬化性樹脂組成物に好適に用いることができる光重合開始剤、光開始助剤及び増感剤としては、ベンゾイン化合物、アセトフェノン化合物、アントラキノン化合物、チオキサントン化合物、ケタール化合物、ベンゾフェノン化合物、3級アミン化合物、及びキサントン化合物などを挙げることができる。 Other photopolymerization initiators, photoinitiator assistants and sensitizers that can be suitably used in the photocurable thermosetting resin composition of the present invention include benzoin compounds, acetophenone compounds, anthraquinone compounds, thioxanthone compounds, ketals. Examples thereof include compounds, benzophenone compounds, tertiary amine compounds, and xanthone compounds.
前記ベンゾイン化合物としては、具体的には、例えばベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテルなどが挙げられる。 Specific examples of the benzoin compound include benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether.
前記アセトフェノン化合物としては、具体的には、例えばアセトフェノン、2,2−ジメトキシ−2−フェニルアセトフェノン、2,2−ジエトキシ−2−フェニルアセトフェノン、1,1−ジクロロアセトフェノンなどが挙げられる。 Specific examples of the acetophenone compound include acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, and the like.
前記アントラキノン化合物としては、具体的には、例えば2−メチルアントラキノン、2−エチルアントラキノン、2−t−ブチルアントラキノン、1−クロロアントラキノンなどが挙げられる。 Specific examples of the anthraquinone compound include 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone, 1-chloroanthraquinone, and the like.
前記チオキサントン化合物としては、具体的には、例えば2,4−ジメチルチオキサントン、2,4−ジエチルチオキサントン、2−クロロチオキサントン、2,4−ジイソプロピルチオキサントンなどが挙げられる。 Specific examples of the thioxanthone compound include 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone.
前記ケタール化合物としては、具体的には、例えばアセトフェノンジメチルケタール、ベンジルジメチルケタールなどが挙げられる。 Specific examples of the ketal compound include acetophenone dimethyl ketal and benzyl dimethyl ketal.
前記ベンゾフェノン化合物としては、具体的には、例えばベンゾフェノン、4−ベンゾイルジフェニルスルフィド、4−ベンゾイル−4’−メチルジフェニルスルフィド、4−ベンゾイル−4’−エチルジフェニルスルフィド、4−ベンゾイル−4’−プロピルジフェニルスルフィドなどが挙げられる。 Specific examples of the benzophenone compound include benzophenone, 4-benzoyldiphenyl sulfide, 4-benzoyl-4′-methyldiphenyl sulfide, 4-benzoyl-4′-ethyldiphenyl sulfide, and 4-benzoyl-4′-propyl. And diphenyl sulfide.
前記3級アミン化合物としては、具体的には、例えばエタノールアミン化合物、ジアルキルアミノベンゼン構造を有する化合物、例えば、市販品では、4,4’−ジメチルアミノベンゾフェノン(日本曹達(株)製ニッソキュアーMABP)、4,4’−ジエチルアミノベンゾフェノン(保土ヶ谷化学(株)製EAB)などのジアルキルアミノベンゾフェノン、7−(ジエチルアミノ)−4−メチル−2H−1−ベンゾピラン−2−オン(7−(ジエチルアミノ)−4−メチルクマリン)などのジアルキルアミノ基含有クマリン化合物、4−ジメチルアミノ安息香酸エチル(日本化薬(株)製カヤキュアー(登録商標)EPA)、2−ジメチルアミノ安息香酸エチル(インターナショナルバイオ−シンセエティックス社製Quantacure DMB)、4−ジメチルアミノ安息香酸(n−ブトキシ)エチル(インターナショナルバイオ−シンセエティックス社製Quantacure BEA)、p−ジメチルアミノ安息香酸イソアミルエチルエステル(日本化薬(株)製カヤキュアーDMBI)、4−ジメチルアミノ安息香酸2−エチルヘキシル(Van Dyk社製Esolol 507)、4,4’−ジエチルアミノベンゾフェノン(保土ヶ谷化学(株)製EAB)などが挙げられる。 Specific examples of the tertiary amine compound include an ethanolamine compound and a compound having a dialkylaminobenzene structure, such as 4,4′-dimethylaminobenzophenone (Nisso Cure MABP manufactured by Nippon Soda Co., Ltd.). Dialkylaminobenzophenone such as 4,4′-diethylaminobenzophenone (EAB manufactured by Hodogaya Chemical Co., Ltd.), 7- (diethylamino) -4-methyl-2H-1-benzopyran-2-one (7- (diethylamino) -4 Dimethylamino group-containing coumarin compounds such as -methylcoumarin), ethyl 4-dimethylaminobenzoate (Kayacure (registered trademark) EPA manufactured by Nippon Kayaku Co., Ltd.), ethyl 2-dimethylaminobenzoate (International Bio-Synthetics) Quantacur DMB), 4-dimethylaminobenzoic acid (n-butoxy) ethyl (Quantacure BEA manufactured by International Bio-Synthetics), p-dimethylaminobenzoic acid isoamylethyl ester (Kayacure DMBI manufactured by Nippon Kayaku Co., Ltd.), 4 -Dimethylaminobenzoic acid 2-ethylhexyl (Esolol 507 manufactured by Van Dyk), 4,4'-diethylaminobenzophenone (EAB manufactured by Hodogaya Chemical Co., Ltd.) and the like.
上記の光重合開始剤、光開始助剤及び増感剤のうち、チオキサントン化合物及び3級アミン化合物が好ましい。特に、チオキサントン化合物が含まれることが、深部硬化性の面から好ましい。中でも、2,4−ジメチルチオキサントン、2,4−ジエチルチオキサントン、2−クロロチオキサントン、2,4−ジイソプロピルチオキサントンなどのチオキサントン化合物を含むことが好ましい。 Of the above photopolymerization initiator, photoinitiator assistant and sensitizer, thioxanthone compounds and tertiary amine compounds are preferred. In particular, the inclusion of a thioxanthone compound is preferable from the viewpoint of deep curability. Among them, it is preferable to include a thioxanthone compound such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone.
このようなチオキサントン化合物の配合量としては、組成物全体量の15wt%以下であることが好ましい。チオキサントン化合物の配合量が15wt%を超えると、厚膜硬化性が低下するとともに、製品のコストアップに繋がる。より好ましくは10wt%以下である。 The amount of such a thioxanthone compound is preferably 15 wt% or less of the total amount of the composition. When the blending amount of the thioxanthone compound exceeds 15 wt%, the thick film curability is lowered and the cost of the product is increased. More preferably, it is 10 wt% or less.
また、3級アミン化合物としては、ジアルキルアミノベンゼン構造を有する化合物が好ましく、中でも、ジアルキルアミノベンゾフェノン化合物、最大吸収波長が350〜450nmにあるジアルキルアミノ基含有クマリン化合物及びケトクマリン類が特に好ましい。 As the tertiary amine compound, a compound having a dialkylaminobenzene structure is preferable, and among them, a dialkylaminobenzophenone compound, a dialkylamino group-containing coumarin compound having a maximum absorption wavelength of 350 to 450 nm, and ketocoumarins are particularly preferable.
前記ジアルキルアミノベンゾフェノン化合物としては、4,4’−ジエチルアミノベンゾフェノンが、毒性も低く好ましい。前記ジアルキルアミノ基含有クマリン化合物は、最大吸収波長が350〜410nmと紫外線領域にあるため、着色が少なく、無色透明な感光性組成物はもとより、着色顔料を用い、着色顔料自体の色を反映した着色ソルダーレジスト膜を提供することが可能となる。特に、7−(ジエチルアミノ)−4−メチル−2H−1−ベンゾピラン−2−オンが、波長400〜410nmのレーザー光に対して優れた増感効果を示すことから好ましい。 As the dialkylaminobenzophenone compound, 4,4'-diethylaminobenzophenone is preferable because of its low toxicity. The dialkylamino group-containing coumarin compound has a maximum absorption wavelength of 350 to 410 nm and is in the ultraviolet region, so it is less colored and uses not only a colorless and transparent photosensitive composition but also a colored pigment, which reflects the color of the colored pigment itself. A colored solder resist film can be provided. In particular, 7- (diethylamino) -4-methyl-2H-1-benzopyran-2-one is preferable because it exhibits an excellent sensitizing effect on laser light having a wavelength of 400 to 410 nm.
このような3級アミン化合物の配合量としては、組成物全体量の0.1〜15wt%とすることが好ましい。3級アミン化合物の配合量が0.1wt%未満であると、十分な増感効果を得ることができない傾向にある。15wt%を超えると、3級アミン化合物による乾燥ソルダーレジスト塗膜の表面での光吸収が激しくなり、深部硬化性が低下する傾向がある。 As a compounding quantity of such a tertiary amine compound, it is preferable to set it as 0.1-15 wt% of the whole composition amount. When the compounding amount of the tertiary amine compound is less than 0.1 wt%, a sufficient sensitizing effect tends not to be obtained. If it exceeds 15 wt%, light absorption on the surface of the dried solder resist coating film by the tertiary amine compound becomes intense, and the deep curability tends to be lowered.
これらの光重合開始剤、光開始助剤及び増感剤は、単独で又は2種類以上の混合物として使用することができる。
このような光重合開始剤、光開始助剤、及び増感剤の総量は、カルボキシル基含有樹脂100質量部に対して35質量部以下であることが好ましい。35質量部を超えると、これらの光吸収により深部硬化性が低下する傾向にある。
These photopolymerization initiators, photoinitiator assistants, and sensitizers can be used alone or as a mixture of two or more.
The total amount of such photopolymerization initiator, photoinitiator assistant, and sensitizer is preferably 35 parts by mass or less with respect to 100 parts by mass of the carboxyl group-containing resin. When it exceeds 35 parts by mass, the deep curability tends to decrease due to light absorption.
なお、これら光重合開始剤、光開始助剤、及び増感剤は、特定の波長を吸収するため、場合によっては感度が低くなり、紫外線吸収剤として働くことがある。しかしながら、これらは組成物の感度を向上させることだけの目的に用いられるものではない。必要に応じて特定の波長の光を吸収させて、表面の光反応性を高め、レジストのライン形状及び開口を垂直、テーパー状、逆テーパー状に変化させるとともに、ライン幅や開口径の加工精度を向上させることができる。 In addition, since these photopolymerization initiators, photoinitiator assistants, and sensitizers absorb a specific wavelength, in some cases, the sensitivity is lowered, and the photopolymerization initiator, the photoinitiator assistant, and the sensitizer may function as an ultraviolet absorber. However, they are not used only for the purpose of improving the sensitivity of the composition. Absorbs light of a specific wavelength as necessary to improve the photoreactivity of the surface, change the resist line shape and opening to vertical, tapered, reverse taper, and processing accuracy of line width and opening diameter Can be improved.
前記植物由来エポキシ化合物としては、植物油の不飽和基がエポキシ化されたものであれば特に限定されない。中でもエポキシ化大豆油、エポキシ化ヒマシ油が汎用性の観点から好ましい。市販品としてはアデカサイザーD−32、アデカサイザーD−55、アデカサイザーO−130P、アデカサイザーO−180A(いずれもADEKA社製)等が挙げられる。 The plant-derived epoxy compound is not particularly limited as long as the unsaturated group of the vegetable oil is epoxidized. Among these, epoxidized soybean oil and epoxidized castor oil are preferable from the viewpoint of versatility. Examples of commercially available products include Adeka Sizer D-32, Adeka Sizer D-55, Adeka Sizer O-130P, Adeka Sizer O-180A (all manufactured by ADEKA).
一般的なグリシジル化合物と活性プロトン化合物との反応は、グリシジル化合物のβ開裂とα開裂を伴いながら進行するが、そのほとんどがβ開裂である。これは、反応性と立体障害に起因するものであると考えられている。一方、植物由来エポキシ化合物のエポキシ基は、前述の通り二重結合から誘導されたエポキシ構造であり、その構造は内部エポキシ構造であり、一般的なグリシジル化合物と比較して反応性が低く、そのため優れた保存安定性が得られると考えられる。さらに、植物由来エポキシ化合物は、一般的なグリシジル化合物の合成に用いられるエピハロヒドリンを用いていないため、ハロゲンフリーの観点からも優れた結果が得られた。 The reaction between a general glycidyl compound and an active proton compound proceeds with β-cleavage and α-cleavage of the glycidyl compound, but most of them are β-cleavage. This is believed to be due to reactivity and steric hindrance. On the other hand, the epoxy group of the plant-derived epoxy compound is an epoxy structure derived from a double bond as described above, and the structure is an internal epoxy structure, which is less reactive than a general glycidyl compound. It is considered that excellent storage stability can be obtained. Furthermore, since the plant-derived epoxy compound does not use an epihalohydrin used for the synthesis of a general glycidyl compound, excellent results were obtained from a halogen-free viewpoint.
植物由来エポキシ化合物の配合量は、カルボキシル基含有樹脂100質量部に対し5〜100質量部の範囲が好ましく、より好ましくは10〜50質量部の範囲である。植物由来エポキシ化合物の配合量が5質量部より少ない場合、耐熱性等の諸特性の低下が懸念され、一方、100質量部を超える場合、植物由来エポキシ化合物が残存し、塗膜強度の低下が考えられるため好ましくない。 The blending amount of the plant-derived epoxy compound is preferably in the range of 5 to 100 parts by mass, more preferably in the range of 10 to 50 parts by mass with respect to 100 parts by mass of the carboxyl group-containing resin. When the blending amount of the plant-derived epoxy compound is less than 5 parts by mass, there is a concern about deterioration of various properties such as heat resistance. On the other hand, when it exceeds 100 parts by mass, the plant-derived epoxy compound remains and the coating strength decreases. Since it is considered, it is not preferable.
本発明の光硬化性熱硬化性樹脂組成物は、耐熱性を付与するために、前記植物由来エポキシ化合物に加えて他の熱硬化性成分を含有することができる。本発明に用いられる熱硬化性成分としては、メラミン樹脂、ベンゾグアナミン樹脂などのアミン樹脂、ブロックイソシアネート化合物、シクロカーボネート化合物、多官能エポキシ化合物、多官能オキセタン化合物、エピスルフィド樹脂、メラミン誘導体、ビスマレイミド、オキサジン化合物、オキサゾリン化合物、カルボジイミド化合物などの公知慣用の熱硬化性樹脂が使用できる。特に好ましいのは分子中に複数の環状エーテル基及び/又は環状チオエーテル基(以下、「環状(チオ)エーテル基」と略す)を有する熱硬化性成分である。 The photocurable thermosetting resin composition of the present invention can contain other thermosetting components in addition to the plant-derived epoxy compound in order to impart heat resistance. Examples of thermosetting components used in the present invention include amine resins such as melamine resins and benzoguanamine resins, blocked isocyanate compounds, cyclocarbonate compounds, polyfunctional epoxy compounds, polyfunctional oxetane compounds, episulfide resins, melamine derivatives, bismaleimides, and oxazines. Known and commonly used thermosetting resins such as compounds, oxazoline compounds and carbodiimide compounds can be used. Particularly preferred is a thermosetting component having a plurality of cyclic ether groups and / or cyclic thioether groups (hereinafter abbreviated as “cyclic (thio) ether groups”) in the molecule.
このような分子中に複数の環状(チオ)エーテル基を有する熱硬化性成分は、分子中に3、4又は5員環の環状エーテル基、又は環状チオエーテル基のいずれか一方又は2種類の基を複数有する化合物であり、例えば、分子内に複数のエポキシ基を有する化合物、すなわち多官能エポキシ化合物、分子内に複数のオキセタニル基を有する化合物、すなわち多官能オキセタン化合物、分子内に複数のチオエーテル基を有する化合物、すなわちエピスルフィド樹脂などが挙げられる。 Such a thermosetting component having a plurality of cyclic (thio) ether groups in the molecule includes either one of a three-, four- or five-membered cyclic ether group or a cyclic thioether group or two kinds of groups in the molecule. For example, a compound having a plurality of epoxy groups in the molecule, that is, a polyfunctional epoxy compound, a compound having a plurality of oxetanyl groups in the molecule, that is, a polyfunctional oxetane compound, a plurality of thioether groups in the molecule The compound which has this, ie, an episulfide resin etc. are mentioned.
前記多官能エポキシ化合物としては、三菱化学社製のjER(登録商標)828、jER834、jER1001、jER1004、ダイセル化学工業社製のEHPE3150、DIC社製のエピクロン(登録商標)840、エピクロン850、エピクロン1050、エピクロン2055、新日鐵化学社製のエポトート(登録商標)YD−011、YD−013、YD−127、YD−128、ダウケミカル社製のD.E.R.317、D.E.R.331、D.E.R.661、D.E.R.664、BASFジャパン社のアラルダイド6071、アラルダイド6084、アラルダイドGY250、アラルダイドGY260、住友化学工業社製のスミ−エポキシESA−011、ESA−014、ELA−115、ELA−128、旭化成工業社製のA.E.R.330、A.E.R.331、A.E.R.661、A.E.R.664等(何れも商品名)のビスフェノールA型エポキシ樹脂;三菱化学社製のjERYL903、DIC社製のエピクロン152、エピクロン165、新日鐵化学社製のエポトートYDB−400、YDB−500、ダウケミカル社製のD.E.R.542、BASFジャパン社製のアラルダイド8011、住友化学工業社製のスミ−エポキシESB−400、ESB−700、旭化成工業社製のA.E.R.711、A.E.R.714等(何れも商品名)のブロム化エポキシ樹脂;三菱化学社製のjER152、jER154、ダウケミカル社製のD.E.N.431、D.E.N.438、DIC社製のエピクロンN−730、エピクロンN−770、エピクロンN−865、新日鐵化学社製のエポトートYDCN−701、YDCN−704、BASFジャパン社製のアラルダイドECN1235、アラルダイドECN1273、アラルダイドECN1299、アラルダイドXPY307、日本化薬社製のEPPN(登録商標)−201、EOCN(登録商標)−1025、EOCN−1020、EOCN−104S、RE−306、NC−3000、住友化学工業社製のスミ−エポキシESCN−195X、ESCN−220、旭化成工業社製のA.E.R.ECN−235、ECN−299等(何れも商品名)のノボラック型エポキシ樹脂;DIC社製のエピクロン830、三菱化学社製jER807、新日鐵化学社製のエポトートYDF−170、YDF−175、YDF−2004、BASFジャパン社製のアラルダイドXPY306等(何れも商品名)のビスフェノールF型エポキシ樹脂;新日鐵化学社製のエポトートST−2004、ST−2007、ST−3000(商品名)等の水添ビスフェノールA型エポキシ樹脂;三菱化学社製のjER604、新日鐵化学社製のエポトートYH−434、BASFジャパン社製のアラルダイドMY720、住友化学工業社製のスミ−エポキシELM−120等(何れも商品名)のグリシジルアミン型エポキシ樹脂;BASFジャパン社製のアラルダイドCY−350(商品名)等のヒダントイン型エポキシ樹脂;ダイセル化学工業社製のセロキサイド(登録商標)2021、BASFジャパン社製のアラルダイドCY175、CY179等(何れも商品名)の脂環式エポキシ樹脂;三菱化学社製のYL−933、ダウケミカル社製のT.E.N.、EPPN−501、EPPN−502等(何れも商品名)のトリヒドロキシフェニルメタン型エポキシ樹脂;三菱化学社製のYL−6056、YX−4000、YL−6121(何れも商品名)等のビキシレノール型もしくはビフェノール型エポキシ樹脂又はそれらの混合物;日本化薬社製EBPS−200、ADEKA工業社製EPX−30、DIC社製のEXA−1514(商品名)等のビスフェノールS型エポキシ樹脂;三菱化学社製のjER157S(商品名)等のビスフェノールAノボラック型エポキシ樹脂;三菱化学社製のjERYL−931、BASFジャパン社製のアラルダイド163等(何れも商品名)のテトラフェニロールエタン型エポキシ樹脂;BASFジャパン社製のアラルダイドPT810(商品名)、日産化学工業社製のTEPIC(登録商標)等の複素環式エポキシ樹脂;日本油脂社製ブレンマー(登録商標)DGT等のジグリシジルフタレート樹脂;新日鐵化学社製ZX−1063等のテトラグリシジルキシレノイルエタン樹脂;新日鐵化学社製ESN−190、ESN−360、DIC社製HP−4032、EXA−4750、EXA−4700等のナフタレン基含有エポキシ樹脂;DIC社製HP−7200、HP−7200H等のジシクロペンタジエン骨格を有するエポキシ樹脂;日本油脂社製CP−50S、CP−50M等のグリシジルメタアクリレート共重合系エポキシ樹脂;さらにシクロヘキシルマレイミドとグリシジルメタアクリレートの共重合エポキシ樹脂;エポキシ変性のポリブタジエンゴム誘導体(例えばダイセル化学工業製PB−3600等)、CTBN変性エポキシ樹脂(例えば新日鐵化学社製のYR−102、YR−450等)等が挙げられるが、これらに限られるものではない。これらのエポキシ樹脂は、単独で又は2種以上を組み合わせて用いることができる。これらの中でも特にEHPE3150、PB−3600、セロキサイド2021(いずれもダイセル化学工業社製)等の過酢酸法によるエポキシド変性化合物はハロゲンイオンを不純物として含まないので好ましい。 Examples of the polyfunctional epoxy compound include jER (registered trademark) 828, jER834, jER1001, and jER1004 manufactured by Mitsubishi Chemical Corporation, EHPE3150 manufactured by Daicel Chemical Industries, Epicron (registered trademark) 840 manufactured by DIC, Epicron 850, and Epicron 1050. , Epicron 2055, Epototo (registered trademark) YD-011, YD-013, YD-127, YD-128 manufactured by Nippon Steel Chemical Co., Ltd., D.C. E. R. 317, D.E. E. R. 331, D.D. E. R. 661, D.E. E. R. 664, BASF Japan Araldide 6071, Araldide 6084, Araldide GY250, Araldide GY260, Sumitomo Chemical Co., Ltd. Sumi-epoxy ESA-011, ESA-014, ELA-115, ELA-128, Asahi Kasei Kogyo Co., Ltd. E. R. 330, A.I. E. R. 331, A.I. E. R. 661, A.I. E. R. 664 etc. (all trade names) bisphenol A type epoxy resin; jERYL903 manufactured by Mitsubishi Chemical Corporation, Epicron 152, Epicron 165 manufactured by DIC Corporation, Epototo YDB-400, YDB-500 manufactured by Nippon Steel Chemical Co., Ltd., Dow Chemical D. E. R. 542, Araldide 8011 manufactured by BASF Japan, Sumi-epoxy ESB-400 and ESB-700 manufactured by Sumitomo Chemical Co., Ltd. E. R. 711, A.I. E. R. Brominated epoxy resins such as 714 (both trade names); jER152 and jER154 manufactured by Mitsubishi Chemical Corporation, and D.C. E. N. 431, D.D. E. N. 438, Epicron N-730, Epicron N-770, Epicron N-865, Nippon Steel Chemical Co., Ltd. Epotot YDCN-701, YDCN-704, BASF Japan Araldide ECN1235, Araldide ECN1273, Araldide ECN1299 , Araldide XPY307, Nippon Kayaku Co., Ltd. EPPN (registered trademark) -201, EOCN (registered trademark) -1025, EOCN-1020, EOCN-104S, RE-306, NC-3000, Sumitomo Chemical Co., Ltd. Epoxy ESCN-195X, ESCN-220, A.A. E. R. ECN-235, ECN-299, etc. (both trade names) novolak epoxy resins; DIC Corporation Epicron 830, Mitsubishi Chemical Corporation jER807, Nippon Steel Chemical Co., Ltd. Epototo YDF-170, YDF-175, YDF -2004, bisphenol F type epoxy resin such as Araldide XPY306 manufactured by BASF Japan (all trade names); water such as Epototo ST-2004, ST-2007, ST-3000 (trade names) manufactured by Nippon Steel Chemical Co., Ltd. Bisphenol A type epoxy resin; jER604 manufactured by Mitsubishi Chemical Co., Ltd., Epototo YH-434 manufactured by Nippon Steel Chemical Co., Ltd., Araldide MY720 manufactured by BASF Japan, Sumi-Epoxy ELM-120 manufactured by Sumitomo Chemical Co., Ltd. Product name) glycidylamine type epoxy resin; Araf made by BASF Japan Hydantoin type epoxy resin such as Dydo CY-350 (trade name); Celoxide (registered trademark) 2021 manufactured by Daicel Chemical Industries, araldide CY175, CY179 manufactured by BASF Japan, etc. (all trade names) YL-933 manufactured by Mitsubishi Chemical Corporation, T.M. manufactured by Dow Chemical Co., Ltd. E. N. , EPPN-501, EPPN-502, etc. (all trade names) trihydroxyphenylmethane type epoxy resin; Mitsubishi Chemical Corporation YL-6056, YX-4000, YL-6121 (all trade names) Type or biphenol type epoxy resin or a mixture thereof; bisphenol S type epoxy resin such as EBPS-200 manufactured by Nippon Kayaku Co., Ltd., EPX-30 manufactured by ADEKA Industrial Co., Ltd., EXA-1514 manufactured by DIC Co., Ltd .; Bisphenol A novolac type epoxy resin such as jER157S (trade name) manufactured by Tetraphenylolethane type epoxy resin such as jERYL-931 manufactured by Mitsubishi Chemical Corporation, Araldide 163 manufactured by BASF Japan Co., Ltd. (all are trade names); BASF Japan Araldide PT810 (trade name) manufactured by Nissan, Nissan Heterocyclic epoxy resins such as TEPIC (registered trademark) manufactured by Kogyo Co .; diglycidyl phthalate resins such as Blemmer (registered trademark) DGT manufactured by Nippon Oil &Fats; Tetraglycidyl xylenoyl such as ZX-1063 manufactured by Nippon Steel Chemical Ethane resin; Naphthalene group-containing epoxy resin such as ESN-190, ESN-360, manufactured by Nippon Steel Chemical Co., Ltd., HP-4032, EXA-4750, EXA-4700 manufactured by DIC; HP-7200, HP-7200H manufactured by DIC, etc. Epoxy resin having dicyclopentadiene skeleton; CP-50S and CP-50M glycidyl methacrylate copolymer epoxy resin such as Nippon Oil &Fats; Copolymer epoxy resin of cyclohexylmaleimide and glycidyl methacrylate; Epoxy-modified polybutadiene rubber Derivatives (eg Daicel Chemical Ltd. PB-3600, etc.), CTBN modified epoxy resin (e.g., Nippon Steel Chemical Co. YR-102, YR-450, etc.) and others as mentioned, is not limited thereto. These epoxy resins can be used alone or in combination of two or more. Among these, epoxide-modified compounds by the peracetic acid method such as EHPE3150, PB-3600, and Celoxide 2021 (all manufactured by Daicel Chemical Industries, Ltd.) are preferable because they do not contain halogen ions as impurities.
前記多官能オキセタン化合物としては、ビス[(3−メチル−3−オキセタニルメトキシ)メチル]エーテル、ビス[(3−エチル−3−オキセタニルメトキシ)メチル]エーテル、1,4−ビス[(3−メチル−3−オキセタニルメトキシ)メチル]ベンゼン、1,4−ビス[(3−エチル−3−オキセタニルメトキシ)メチル]ベンゼン、(3−メチル−3−オキセタニル)メチルアクリレート、(3−エチル−3−オキセタニル)メチルアクリレート、(3−メチル−3−オキセタニル)メチルメタクリレート、(3−エチル−3−オキセタニル)メチルメタクリレートやそれらのオリゴマー又は共重合体等の多官能オキセタン類の他、オキセタンアルコールとノボラック樹脂、ポリ(p−ヒドロキシスチレン)、カルド型ビスフェノール類、カリックスアレーン類、カリックスレゾルシンアレーン類、又はシルセスキオキサンなどの水酸基を有する樹脂とのエーテル化物などが挙げられる。その他、オキセタン環を有する不飽和モノマーとアルキル(メタ)アクリレートとの共重合体なども挙げられる。 Examples of the polyfunctional oxetane compound include bis [(3-methyl-3-oxetanylmethoxy) methyl] ether, bis [(3-ethyl-3-oxetanylmethoxy) methyl] ether, 1,4-bis [(3-methyl -3-Oxetanylmethoxy) methyl] benzene, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, (3-methyl-3-oxetanyl) methyl acrylate, (3-ethyl-3-oxetanyl) In addition to polyfunctional oxetanes such as methyl acrylate, (3-methyl-3-oxetanyl) methyl methacrylate, (3-ethyl-3-oxetanyl) methyl methacrylate and oligomers or copolymers thereof, oxetane alcohol and novolak resin, Poly (p-hydroxystyrene), cardo-type bisphenol Le ethers, calixarenes, calix resorcin arenes, or the like ethers of a resin having a hydroxyl group such as silsesquioxane and the like. In addition, a copolymer of an unsaturated monomer having an oxetane ring and an alkyl (meth) acrylate is also included.
前記分子中に複数の環状チオエーテル基を有する化合物としては、例えば、三菱化学社製のビスフェノールA型エピスルフィド樹脂 YL7000などが挙げられる。また、同様の合成方法を用いて、ノボラック型エポキシ樹脂のエポキシ基の酸素原子を硫黄原子に置き換えたエピスルフィド樹脂なども用いることができる。 Examples of the compound having a plurality of cyclic thioether groups in the molecule include bisphenol A type episulfide resin YL7000 manufactured by Mitsubishi Chemical Corporation. Moreover, episulfide resin etc. which replaced the oxygen atom of the epoxy group of the novolak-type epoxy resin with the sulfur atom using the same synthesis method can be used.
前記分子中に複数の環状(チオ)エーテル基を有する熱硬化性成分を配合する場合の配合量は、組成物中のカルボキシル基1当量に対して、好ましくは0.1〜1.5当量、より好ましくは、0.2〜1.0当量となる範囲が適当である。分子中に複数の環状(チオ)エーテル基を有する熱硬化性成分の配合量が2.5当量を超える場合、低分子量の環状(チオ)エーテル基が乾燥塗膜に残存することにより、塗膜の強度などが低下し、また保存安定性も悪化するため好ましくない。 The amount of the thermosetting component having a plurality of cyclic (thio) ether groups in the molecule is preferably 0.1 to 1.5 equivalents relative to 1 equivalent of the carboxyl group in the composition, More preferably, a range of 0.2 to 1.0 equivalent is appropriate. When the blending amount of the thermosetting component having a plurality of cyclic (thio) ether groups in the molecule exceeds 2.5 equivalents, the low molecular weight cyclic (thio) ether group remains in the dry coating film, This is not preferable because the strength of the resin decreases and the storage stability also deteriorates.
また、他の熱硬化性成分として、1分子内に複数のイソシアネート基又はブロック化イソシアネート基を有する化合物を加えることができる。このような1分子内に複数のイソシアネート基又はブロック化イソシアネート基を有する化合物は、1分子内に複数のイソシアネート基を有する化合物、すなわちポリイソシアネート化合物、又は1分子内に複数のブロック化イソシアネート基を有する化合物、すなわちブロックイソシアネート化合物などが挙げられる。 Further, as another thermosetting component, a compound having a plurality of isocyanate groups or blocked isocyanate groups in one molecule can be added. Such a compound having a plurality of isocyanate groups or blocked isocyanate groups in one molecule is a compound having a plurality of isocyanate groups in one molecule, that is, a polyisocyanate compound, or a plurality of blocked isocyanate groups in one molecule. The compound which has, ie, a blocked isocyanate compound, etc. are mentioned.
前記ポリイソシアネート化合物としては、例えば、芳香族ポリイソシアネート、脂肪族ポリイソシアネート又は脂環式ポリイソシアネートが用いられる。芳香族ポリイソシアネートの具体例としては、4,4’−ジフェニルメタンジイソシアネート、2,4−トリレンジイソシアネート、2,6−トリレンジイソシアネート、ナフタレン−1,5−ジイソシアネート、o−キシリレンジイソシアネート、m−キシリレンジイソシアネート及び2,4−トリレンダイマーが挙げられる。脂肪族ポリイソシアネートの具体例としては、テトラメチレンジイソシアネート、ヘキサメチレンジイソシアネート、メチレンジイソシアネート、トリメチルヘキサメチレンジイソシアネート、4,4−メチレンビス(シクロヘキシルイソシアネート)及びイソホロンジイソシアネートが挙げられる。脂環式ポリイソシアネートの具体例としてはビシクロヘプタントリイソシアネートが挙げられる。並びに先に挙げられたイソシアネート化合物のアダクト体、ビューレット体及びイソシアヌレート体が挙げられる。 As said polyisocyanate compound, aromatic polyisocyanate, aliphatic polyisocyanate, or alicyclic polyisocyanate is used, for example. Specific examples of the aromatic polyisocyanate include 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene-1,5-diisocyanate, o-xylylene diisocyanate, m- Examples include xylylene diisocyanate and 2,4-tolylene dimer. Specific examples of the aliphatic polyisocyanate include tetramethylene diisocyanate, hexamethylene diisocyanate, methylene diisocyanate, trimethylhexamethylene diisocyanate, 4,4-methylenebis (cyclohexyl isocyanate), and isophorone diisocyanate. Specific examples of the alicyclic polyisocyanate include bicycloheptane triisocyanate. In addition, adduct bodies, burette bodies, and isocyanurate bodies of the isocyanate compounds listed above may be mentioned.
前記ブロックイソシアネート化合物に含まれるブロック化イソシアネート基は、イソシアネート基がブロック剤との反応により保護されて一時的に不活性化された基である。所定温度に加熱されたときにそのブロック剤が解離してイソシアネート基が生成する。 The blocked isocyanate group contained in the blocked isocyanate compound is a group in which the isocyanate group is protected by reaction with a blocking agent and temporarily deactivated. When heated to a predetermined temperature, the blocking agent is dissociated to produce isocyanate groups.
このようなブロックイソシアネート化合物としては、イソシアネート化合物とイソシアネートブロック剤との付加反応生成物が用いられる。ブロック剤と反応し得るイソシアネート化合物としては、イソシアヌレート型、ビウレット型、アダクト型等が挙げられる。このイソシアネート化合物としては、例えば、芳香族ポリイソシアネート、脂肪族ポリイソシアネート又は脂環式ポリイソシアネートが用いられる。芳香族ポリイソシアネート、脂肪族ポリイソシアネート、脂環式ポリイソシアネートの具体例としては、先に例示したような化合物が挙げられる。 As such a blocked isocyanate compound, an addition reaction product of an isocyanate compound and an isocyanate blocking agent is used. Examples of the isocyanate compound that can react with the blocking agent include isocyanurate type, biuret type, and adduct type. As this isocyanate compound, aromatic polyisocyanate, aliphatic polyisocyanate, or alicyclic polyisocyanate is used, for example. Specific examples of the aromatic polyisocyanate, aliphatic polyisocyanate, and alicyclic polyisocyanate include the compounds exemplified above.
前記イソシアネートブロック剤としては、例えば、フェノール、クレゾール、キシレノール、クロロフェノール及びエチルフェノール等のフェノール系ブロック剤;ε−カプロラクタム、δ−パレロラクタム、γ−ブチロラクタム及びβ−プロピオラクタム等のラクタム系ブロック剤;アセト酢酸エチル及びアセチルアセトンなどの活性メチレン系ブロック剤;メタノール、エタノール、プロパノール、ブタノール、アミルアルコール、エチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル、エチレングリコールモノブチルエーテル、ジエチレングリコールモノメチルエーテル、プロピレングリコールモノメチルエーテル、ベンジルエーテル、グリコール酸メチル、グリコール酸ブチル、ジアセトンアルコール、乳酸メチル及び乳酸エチル等のアルコール系ブロック剤;ホルムアルデヒドキシム、アセトアルドキシム、アセトキシム、メチルエチルケトキシム、ジアセチルモノオキシム、シクロヘキサンオキシム等のオキシム系ブロック剤;ブチルメルカプタン、ヘキシルメルカプタン、t−ブチルメルカプタン、チオフェノール、メチルチオフェノール、エチルチオフェノール等のメルカプタン系ブロック剤;酢酸アミド、ベンズアミド等の酸アミド系ブロック剤;コハク酸イミド及びマレイン酸イミド等のイミド系ブロック剤;キシリジン、アニリン、ブチルアミン、ジブチルアミン等のアミン系ブロック剤;イミダゾール、2−エチルイミダゾール等のイミダゾール系ブロック剤;メチレンイミン及びプロピレンイミン等のイミン系ブロック剤等が挙げられる。 Examples of the isocyanate blocking agent include phenolic blocking agents such as phenol, cresol, xylenol, chlorophenol and ethylphenol; lactam blocking agents such as ε-caprolactam, δ-palerolactam, γ-butyrolactam and β-propiolactam. Active methylene blocking agents such as ethyl acetoacetate and acetylacetone; methanol, ethanol, propanol, butanol, amyl alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, propylene glycol monomethyl ether, Benzyl ether, methyl glycolate, butyl glycolate, diacetone alcohol, milk Alcohol blocking agents such as methyl and ethyl lactate; oxime blocking agents such as formaldehyde oxime, acetaldoxime, acetoxime, methyl ethyl ketoxime, diacetyl monooxime, cyclohexane oxime; butyl mercaptan, hexyl mercaptan, t-butyl mercaptan, thiophenol, Mercaptan block agents such as methylthiophenol and ethylthiophenol; Acid amide block agents such as acetic acid amide and benzamide; Imide block agents such as succinimide and maleic imide; Amines such as xylidine, aniline, butylamine and dibutylamine Blocking agents; imidazole blocking agents such as imidazole and 2-ethylimidazole; imine blocking agents such as methyleneimine and propyleneimine I can get lost.
前記ブロックイソシアネート化合物は市販のものであってもよく、例えば、スミジュール(登録商標)BL−3175、BL−4165、BL−1100、BL−1265、デスモジュール(登録商標)TPLS−2957、TPLS−2062、TPLS−2078、TPLS−2117、デスモサーム2170、デスモサーム2265(以上、住友バイエルウレタン社製、商品名)、コロネート(登録商標)2512、コロネート2513、コロネート2520(以上、日本ポリウレタン工業社製、商品名)、B−830、B−815、B−846、B−870、B−874、B−882(三井武田ケミカル社製、商品名)、TPA−B80E、17B−60PX、E402−B80T(旭化成ケミカルズ社製、商品名)等が挙げられる。なお、スミジュールBL−3175、BL−4265はブロック剤としてメチルエチルオキシムを用いて得られるものである。 The blocked isocyanate compound may be commercially available, for example, Sumidur (registered trademark) BL-3175, BL-4165, BL-1100, BL-1265, Desmodur (registered trademark) TPLS-2957, TPLS- 2062, TPLS-2078, TPLS-2117, Desmotherm 2170, Desmotherm 2265 (above, Sumitomo Bayer Urethane Co., Ltd., trade name), Coronate (registered trademark) 2512, Coronate 2513, Coronate 2520 (above, Nihon Polyurethane Industry Co., Ltd., product Name), B-830, B-815, B-846, B-870, B-874, B-882 (trade name, manufactured by Mitsui Takeda Chemical Co., Ltd.), TPA-B80E, 17B-60PX, E402-B80T (Asahi Kasei) Chemicals, product name)Sumijoules BL-3175 and BL-4265 are obtained using methyl ethyl oxime as a blocking agent.
上記の1分子内に複数のイソシアネート基又はブロック化イソシアネート基を有する化合物は、1種を単独で又は2種以上を組み合わせて用いることができる。
このような1分子内に複数のイソシアネート基又はブロック化イソシアネート基を有する化合物を配合する場合の配合量は、組成物全体量の1wt%〜50wt%、より好ましくは2〜40wt%の割合が適当である。前記配合量が、1wt%未満の場合、十分な塗膜の強靭性が得られず、好ましくない。一方、50wt%を超えた場合、保存安定性が低下して、好ましくない。
The compounds having a plurality of isocyanate groups or blocked isocyanate groups in one molecule can be used singly or in combination of two or more.
In the case of blending such a compound having a plurality of isocyanate groups or blocked isocyanate groups in one molecule, the proportion of 1 wt% to 50 wt%, more preferably 2 to 40 wt% of the total amount of the composition is appropriate. It is. When the blending amount is less than 1 wt%, it is not preferable because sufficient toughness of the coating film cannot be obtained. On the other hand, when it exceeds 50 wt%, storage stability falls and it is not preferable.
さらに、他の熱硬化性成分としてメラミン誘導体、ベンゾグアナミン誘導体などが挙げられる。例えばメチロールメラミン化合物、メチロールベンゾグアナミン化合物、メチロールグリコールウリル化合物及びメチロール尿素化合物などがある。さらに、アルコキシメチル化メラミン化合物、アルコキシメチル化ベンゾグアナミン化合物、アルコキシメチル化グリコールウリル化合物及びアルコキシメチル化尿素化合物は、それぞれのメチロールメラミン化合物、メチロールベンゾグアナミン化合物、メチロールグリコールウリル化合物及びメチロール尿素化合物のメチロール基をアルコキシメチル基に変換することにより得られる。このアルコキシメチル基の種類については特に限定されるものではなく、例えばメトキシメチル基、エトキシメチル基、プロポキシメチル基、ブトキシメチル基等とすることができる。特に人体や環境に優しいホルマリン濃度が0.2%以下のメラミン誘導体が好ましい。 Furthermore, examples of other thermosetting components include melamine derivatives and benzoguanamine derivatives. Examples include methylol melamine compounds, methylol benzoguanamine compounds, methylol glycoluril compounds, and methylol urea compounds. Furthermore, the alkoxymethylated melamine compound, the alkoxymethylated benzoguanamine compound, the alkoxymethylated glycoluril compound and the alkoxymethylated urea compound have the methylol group of the respective methylolmelamine compound, methylolbenzoguanamine compound, methylolglycoluril compound and methylolurea compound. Obtained by conversion to an alkoxymethyl group. The type of the alkoxymethyl group is not particularly limited and can be, for example, a methoxymethyl group, an ethoxymethyl group, a propoxymethyl group, a butoxymethyl group, or the like. In particular, a melamine derivative having a formalin concentration which is friendly to the human body and the environment is preferably 0.2% or less.
これらの市販品としては、例えばサイメル(登録商標)300、同301、同303、同370、同325、同327、同701、同266、同267、同238、同1141、同272、同202、同1156、同1158、同1123、同1170、同1174、同UFR65、同300(以上、三井サイアナミッド(株)製)、ニカラック(登録商標)Mx−750、同Mx−032、同Mx−270、同Mx−280、同Mx−290、同Mx−706、同Mx−708、同Mx−40、同Mx−31、同Ms−11、同Mw−30、同Mw−30HM、同Mw−390、同Mw−100LM、同Mw−750LM、(以上、(株)三和ケミカル製)等を挙げることができる。上記熱硬化性成分は単独で又は2種以上を組み合わせて用いることができる。 Examples of these commercially available products include Cymel (registered trademark) 300, 301, 303, 370, 325, 327, 701, 266, 267, 238, 1141, 272, 202. 1156, 1158, 1123, 1170, 1170, 1174, UFR65, 300 (above, manufactured by Mitsui Cyanamid Co., Ltd.), Nicalak (registered trademark) Mx-750, Mx-032, Mx-270 Mx-280, Mx-290, Mx-706, Mx-708, Mx-40, Mx-31, Ms-11, Mw-30, Mw-30HM, Mw-390 , Mw-100LM, Mw-750LM, and the like (manufactured by Sanwa Chemical Co., Ltd.). The said thermosetting component can be used individually or in combination of 2 or more types.
また、他の熱硬化性成分としてカルボジイミド基を有する化合物を含有することができる。カルボジイミド基を有する化合物を含有することにより、硬化物中に残存する未反応の水酸基や未反応のカルボキシル基と架橋し、塗膜強度を向上させることができる。さらにはエステル結合の加水分解による塗膜劣化を抑制することができる。 Moreover, the compound which has a carbodiimide group can be contained as another thermosetting component. By containing the compound which has a carbodiimide group, it can bridge | crosslink with the unreacted hydroxyl group and unreacted carboxyl group which remain | survive in hardened | cured material, and a coating-film intensity | strength can be improved. Furthermore, coating film deterioration due to hydrolysis of ester bonds can be suppressed.
本発明で用いるカルボジイミド基を有する化合物は、市場より容易に入手することができる。具体的には、日清紡(株)製カルボジライトシリーズの、カルボジライトV−03、カルボジライトV−06、カルボジライト10M−SP、カルボジライト9010等が挙げられる。 The compound having a carbodiimide group used in the present invention can be easily obtained from the market. Specific examples include Carbodilite V-03, Carbodilite V-06, Carbodilite 10M-SP, Carbodilite 9010, etc., manufactured by Nisshinbo Co., Ltd. Carbodilite series.
カルボジイミド基を有する化合物の配合量は、組成物全体量の0.5〜40wt%、好ましくは1wt%〜30wt%の範囲が適当である。カルボジイミド基を有する化合物の配合量が上記範囲よりも多すぎると、塗膜の強度が低下するため好ましくない。一方0.5wt%未満の場合、加水分解耐性の効果が損なわれるので好ましくない。 The compounding amount of the compound having a carbodiimide group is 0.5 to 40 wt%, preferably 1 to 30 wt% of the total amount of the composition. When the compounding quantity of the compound which has a carbodiimide group is too much than the said range, since the intensity | strength of a coating film falls, it is unpreferable. On the other hand, when it is less than 0.5 wt%, the effect of hydrolysis resistance is impaired, which is not preferable.
上記分子中に複数の環状(チオ)エーテル基を有する熱硬化性成分を使用する場合、熱硬化触媒を含有することが好ましい。そのような熱硬化触媒としては、例えば、イミダゾール、2−メチルイミダゾール、2−エチルイミダゾール、2−エチル−4−メチルイミダゾール、2−フェニルイミダゾール、4−フェニルイミダゾール、1−シアノエチル−2−フェニルイミダゾール、1−(2−シアノエチル)−2−エチル−4−メチルイミダゾール等のイミダゾール誘導体;ジシアンジアミド、ベンジルジメチルアミン、4−(ジメチルアミノ)−N,N−ジメチルベンジルアミン、4−メトキシ−N,N−ジメチルベンジルアミン、4−メチル−N,N−ジメチルベンジルアミン等のアミン化合物、アジピン酸ジヒドラジド、セバシン酸ジヒドラジド等のヒドラジン化合物;トリフェニルホスフィン等のリン化合物などが挙げられる。また、市販されているものとしては、例えば四国化成工業社製の2MZ−A、2MZ−OK、2PHZ、2P4BHZ、2P4MHZ(いずれもイミダゾール系化合物の商品名)、サンアプロ社製のU−CAT(登録商標)3503N、U−CAT3502T(いずれもジメチルアミンのブロックイソシアネート化合物の商品名)、DBU、DBN、U−CATSA102、U−CAT5002(いずれも二環式アミジン化合物及びその塩)などが挙げられる。特に、これらに限られるものではなく、エポキシ樹脂やオキセタン化合物の熱硬化触媒、もしくはエポキシ基及び/又はオキセタニル基とカルボキシル基の反応を促進するものであればよく、単独で又は2種以上を混合して使用してもかまわない。また、グアナミン、アセトグアナミン、ベンゾグアナミン、メラミン、2,4−ジアミノ−6−メタクリロイルオキシエチル−S−トリアジン、2−ビニル−2,4−ジアミノ−S−トリアジン、2−ビニル−4,6−ジアミノ−S−トリアジン・イソシアヌル酸付加物、2,4−ジアミノ−6−メタクリロイルオキシエチル−S−トリアジン・イソシアヌル酸付加物等のS−トリアジン誘導体を用いることもでき、好ましくはこれら密着性付与剤としても機能する化合物を前記熱硬化触媒と併用する。 When using the thermosetting component which has a some cyclic | annular (thio) ether group in the said molecule | numerator, it is preferable to contain a thermosetting catalyst. Examples of such thermosetting catalysts include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole. Imidazole derivatives such as 1- (2-cyanoethyl) -2-ethyl-4-methylimidazole; dicyandiamide, benzyldimethylamine, 4- (dimethylamino) -N, N-dimethylbenzylamine, 4-methoxy-N, N -Amine compounds such as dimethylbenzylamine and 4-methyl-N, N-dimethylbenzylamine; hydrazine compounds such as adipic acid dihydrazide and sebacic acid dihydrazide; and phosphorus compounds such as triphenylphosphine. Examples of commercially available products include 2MZ-A, 2MZ-OK, 2PHZ, 2P4BHZ, 2P4MHZ (both trade names of imidazole compounds) manufactured by Shikoku Kasei Kogyo Co., Ltd., and U-CAT (registered by San Apro). Trademarks) 3503N, U-CAT3502T (all are trade names of blocked isocyanate compounds of dimethylamine), DBU, DBN, U-CATSA102, U-CAT5002 (all are bicyclic amidine compounds and salts thereof), and the like. In particular, it is not limited to these, as long as it is a thermosetting catalyst for epoxy resins or oxetane compounds, or a catalyst that promotes the reaction of epoxy groups and / or oxetanyl groups with carboxyl groups, either alone or in combination of two or more. Can be used. Also, guanamine, acetoguanamine, benzoguanamine, melamine, 2,4-diamino-6-methacryloyloxyethyl-S-triazine, 2-vinyl-2,4-diamino-S-triazine, 2-vinyl-4,6-diamino S-triazine derivatives such as -S-triazine and isocyanuric acid adducts and 2,4-diamino-6-methacryloyloxyethyl-S-triazine and isocyanuric acid adducts can also be used. A compound that also functions in combination with the thermosetting catalyst.
これら熱硬化触媒の配合量は、通常の量的割合で充分であり、例えば分子中に複数の環状(チオ)エーテル基を有する熱硬化性成分100質量部に対して、好ましくは0.1〜20質量部、より好ましくは0.5〜15.0質量部である。 The amount of these thermosetting catalysts to be blended is a normal quantitative ratio, and is preferably 0.1 to 100 parts by mass of the thermosetting component having a plurality of cyclic (thio) ether groups in the molecule. It is 20 mass parts, More preferably, it is 0.5-15.0 mass parts.
本発明の光硬化性熱硬化性樹脂組成物には層間の密着性、又は感光性樹脂層と基材との密着性を向上させるために密着促進剤を用いることができる。具体的に例を挙げると例えば、ベンズイミダゾール、ベンズオキサゾール、ベンズチアゾール、2−メルカプトベンズイミダゾール、2−メルカプトベンズオキサゾール、2−メルカプトベンズチアゾール、3−モルホリノメチル−1−フェニル−トリアゾール−2−チオン、5−アミノ−3−モルホリノメチル−チアゾール−2−チオン、2−メルカプト−5−メチルチオ−チアジアゾール、トリアゾール、テトラゾール、ベンゾトリアゾール、カルボキシベンゾトリアゾール、アミノ基含有ベンゾトリアゾール、ビニルトリアジン、シランカップリング剤などがある。 In the photocurable thermosetting resin composition of the present invention, an adhesion promoter can be used in order to improve the adhesion between layers or the adhesion between the photosensitive resin layer and the substrate. Specific examples include benzimidazole, benzoxazole, benzthiazole, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 2-mercaptobenzthiazole, 3-morpholinomethyl-1-phenyl-triazole-2-thione. , 5-amino-3-morpholinomethyl-thiazole-2-thione, 2-mercapto-5-methylthio-thiadiazole, triazole, tetrazole, benzotriazole, carboxybenzotriazole, amino group-containing benzotriazole, vinyltriazine, silane coupling agent and so on.
本発明の光硬化性熱硬化性樹脂組成物には、分子中に複数のエチレン性不飽和基を有する化合物を配合することができる。本発明の光硬化性樹脂組成物に用いられる分子中に複数のエチレン性不飽和基を有する化合物は、活性エネルギー線照射により、光硬化して、本発明の硬化性樹脂や前記カルボキシル基樹脂を、アルカリ水溶液に不溶化、又は不溶化を助けるものである。このような化合物としては、慣用公知のポリエステル(メタ)アクリレート、ポリエーテル(メタ)アクリレート、ウレタン(メタ)アクリレート、カーボネート(メタ)アクリレート、エポキシ(メタ)アクリレートが使用でき具体的には、2−ヒドロキシエチルアクリレート、2−ヒドロキシプロピルアクリレートなどのヒドロキシアルキルアクリレート類;エチレングリコール、メトキシテトラエチレングリコール、ポリエチレングリコール、プロピレングリコールなどのグリコールのジアクリレート類;N,N−ジメチルアクリルアミド、N−メチロールアクリルアミド、N,N−ジメチルアミノプロピルアクリルアミドなどのアクリルアミド類;N,N−ジメチルアミノエチルアクリレート、N,N−ジメチルアミノプロピルアクリレートなどのアミノアルキルアクリレート類;ヘキサンジオール、トリメチロールプロパン、ペンタエリスリトール、ジペンタエリスリトール、トリス−ヒドロキシエチルイソシアヌレートなどの多価アルコール又はこれらのエチレオキサイド付加物、プロピレンオキサイド付加物、もしくはε−カプロラクトン付加物などの多価アクリレート類;フェノキシアクリレート、ビスフェノールAジアクリレート、及びこれらのフェノール類のエチレンオキサイド付加物もしくはプロピレンオキサイド付加物などの多価アクリレート類;グリセリンジグリシジルエーテル、グリセリントリグリシジルエーテル、トリメチロールプロパントリグリシジルエーテル、トリグリシジルイソシアヌレートなどのグリシジルエーテルの多価アクリレート類;上記に限らず、ポリエーテルポリオール、ポリカーボネートジオール、水酸基末端ポリブタジエン、ポリエステルポリオールなどのポリオールを直接アクリレート化、もしくは、ジイソシアネートを介してウレタンアクリレート化したアクリレート類及びメラミンアクリレート、及び/又は上記アクリレートに対応する各メタクリレート類などが挙げられる。 The photocurable thermosetting resin composition of the present invention can contain a compound having a plurality of ethylenically unsaturated groups in the molecule. The compound having a plurality of ethylenically unsaturated groups in the molecule used in the photocurable resin composition of the present invention is photocured by irradiation with active energy rays, and the curable resin of the present invention or the carboxyl group resin is obtained. Insolubilizes or helps insolubilize in an aqueous alkali solution. As such a compound, conventionally known polyester (meth) acrylate, polyether (meth) acrylate, urethane (meth) acrylate, carbonate (meth) acrylate, and epoxy (meth) acrylate can be used. Hydroxyalkyl acrylates such as hydroxyethyl acrylate and 2-hydroxypropyl acrylate; Diacrylates of glycols such as ethylene glycol, methoxytetraethylene glycol, polyethylene glycol and propylene glycol; N, N-dimethylacrylamide, N-methylolacrylamide, N Acrylamides such as N, N-dimethylaminopropyl acrylamide; N, N-dimethylaminoethyl acrylate, N, N-dimethylaminopropyl acrylate Aminoalkyl acrylates such as alcohols; polyhydric alcohols such as hexanediol, trimethylolpropane, pentaerythritol, dipentaerythritol, tris-hydroxyethyl isocyanurate, or their ethylene oxide adducts, propylene oxide adducts, or ε-caprolactone Polyvalent acrylates such as adducts; polyvalent acrylates such as phenoxy acrylate, bisphenol A diacrylate, and ethylene oxide adducts or propylene oxide adducts of these phenols; glycerin diglycidyl ether, glycerin triglycidyl ether, tri Polyvalent acrylates of glycidyl ethers such as methylolpropane triglycidyl ether, triglycidyl isocyanurate; Not limited to the above, it corresponds to acrylates and melamine acrylates obtained by directly acrylated polyols such as polyether polyols, polycarbonate diols, hydroxyl-terminated polybutadienes, polyester polyols, or urethane acrylates via diisocyanates, and / or the above acrylates. Each methacrylate is mentioned.
さらに、クレゾールノボラック型エポキシ樹脂などの多官能エポキシ樹脂に、アクリル酸を反応させたエポキシアクリレート樹脂や、さらにそのエポキシアクリレート樹脂の水酸基に、ペンタエリスリトールトリアクリレートなどのヒドロキシアクリレートとイソホロンジイソシアネートなどのジイソシアネートのハーフウレタン化合物を反応させたエポキシウレタンアクリレート化合物などが、挙げられる。このようなエポキシアクリレート系樹脂は、指触乾燥性を低下させることなく、光硬化性を向上させることができる。 Further, an epoxy acrylate resin obtained by reacting acrylic acid with a polyfunctional epoxy resin such as a cresol novolac type epoxy resin, or a hydroxy acrylate such as pentaerythritol triacrylate and a diisocyanate such as isophorone diisocyanate on the hydroxyl group of the epoxy acrylate resin. Examples thereof include an epoxy urethane acrylate compound obtained by reacting a half urethane compound. Such an epoxy acrylate resin can improve photocurability without deteriorating the touch drying property.
このような分子中に複数のエチレン性不飽和基を有する化合物の配合量は、組成物の固形分中1〜70wt%、さらに好ましくは5〜60wt%であり、前記カルボキシル基含有感光性樹脂と併用するときは、カルボキシル基含有感光性樹脂100質量部に対して、5〜100質量部、より好ましくは、5〜70質量部の割合が適当である。前記配合量が、5質量部未満の場合、光硬化性が低下し、活性エネルギー線照射後のアルカリ現像により、パターン形成が困難となるので、好ましくない。一方、100質量部を超えた場合、アルカリ水溶液に対する溶解性が低下して、塗膜が脆くなるので、好ましくない。 The compounding quantity of the compound which has several ethylenically unsaturated groups in such a molecule | numerator is 1-70 wt% in the solid content of a composition, More preferably, it is 5-60 wt%, The said carboxyl group containing photosensitive resin and When using together, the ratio of 5-100 mass parts with respect to 100 mass parts of carboxyl group-containing photosensitive resin, More preferably, the ratio of 5-70 mass parts is suitable. When the blending amount is less than 5 parts by mass, photocurability is lowered, and pattern formation becomes difficult by alkali development after irradiation with active energy rays, which is not preferable. On the other hand, when the amount exceeds 100 parts by mass, the solubility in an alkaline aqueous solution is lowered, and the coating film becomes brittle.
本発明の硬化性樹脂組成物は、着色剤を配合することができる。着色剤としては、赤、青、緑、黄などの慣用公知の着色剤を使用することができ、顔料、染料、色素のいずれでもよい。具体的には以下のようなカラ−インデックス(C.I.;ザ ソサイエティ オブ ダイヤーズ アンド カラリスツ(The Society of Dyers and Colourists)発行)番号が付されているものが挙げられる。但し、環境負荷低減並びに人体への影響の観点からハロゲンを含有しないことが好ましい。 The curable resin composition of the present invention can contain a colorant. As the colorant, conventionally known colorants such as red, blue, green and yellow can be used, and any of pigments, dyes and dyes may be used. Specific examples include those to which the following color index numbers (CI; issued by The Society of Dyers and Colorists) are attached. However, it is preferable not to contain a halogen from the viewpoint of reducing the environmental burden and affecting the human body.
赤色着色剤:
赤色着色剤としてはモノアゾ系、ジズアゾ系、アゾレーキ系、ベンズイミダゾロン系、ペリレン系、ジケトピロロピロール系、縮合アゾ系、アントラキノン系、キナクリドン系などがあり、具体的には以下のようなものが挙げられる。
モノアゾ系:Pigment Red 1, 2, 3, 4, 5, 6, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 112, 114, 146, 147, 151, 170, 184, 187, 188, 193, 210, 245, 253, 258, 266, 267, 268, 269。
ジスアゾ系:Pigment Red 37, 38, 41。
モノアゾレーキ系:Pigment Red 48:1, 48:2, 48:3, 48:4, 49:1, 49:2, 50:1, 52:1, 52:2, 53:1, 53:2, 57:1, 58:4, 63:1, 63:2, 64:1,68。
ベンズイミダゾロン系:Pigment Red 171、Pigment Red 175、Pigment Red 176、Pigment Red 185、Pigment Red 208。
ぺリレン系:Solvent Red 135、Solvent Red 179、Pigment Red 123、Pigment Red 149、Pigment Red 166、Pigment Red 178、Pigment Red 179、Pigment Red 190、Pigment Red 194、Pigment Red 224。
ジケトピロロピロール系:Pigment Red 254、Pigment Red 255、Pigment Red 264、Pigment Red 270、Pigment Red 272。
縮合アゾ系:Pigment Red 220、Pigment Red 144、Pigment Red 166、Pigment Red 214、Pigment Red 220、Pigment Red 221、Pigment Red 242。
アンスラキノン系:Pigment Red 168、Pigment Red 177、Pigment Red 216、Solvent Red 149、Solvent Red 150、Solvent Red 52、Solvent Red 207。
キナクリドン系:Pigment Red 122、Pigment Red 202、Pigment Red 206、Pigment Red 207、Pigment Red 209。
Red colorant:
Examples of red colorants include monoazo, diazo, azo lake, benzimidazolone, perylene, diketopyrrolopyrrole, condensed azo, anthraquinone, and quinacridone. Is mentioned.
Monoazo: Pigment Red 1, 2, 3, 4, 5, 6, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 112, 114, 146, 147, 151 , 170, 184, 187, 188, 193, 210, 245, 253, 258, 266, 267, 268, 269.
Disazo: Pigment Red 37, 38, 41.
Monoazo lakes: Pigment Red 48: 1, 48: 2, 48: 3, 48: 4, 49: 1, 49: 2, 50: 1, 52: 1, 52: 2, 53: 1, 53: 2, 57 : 1, 58: 4, 63: 1, 63: 2, 64: 1,68.
Benzimidazolone series: Pigment Red 171, Pigment Red 175, Pigment Red 176, Pigment Red 185, Pigment Red 208.
Perylene series: Solvent Red 135, Solvent Red 179, Pigment Red 123, Pigment Red 149, Pigment Red 166, Pigment Red 178, Pigment Red 179, Pigment Red 190, Pigment Red 194, Pigment Red 224.
Diketopyrrolopyrrole series: Pigment Red 254, Pigment Red 255, Pigment Red 264, Pigment Red 270, Pigment Red 272.
Condensed azo series: Pigment Red 220, Pigment Red 144, Pigment Red 166, Pigment Red 214, Pigment Red 220, Pigment Red 221 and Pigment Red 242.
Anthraquinone series: Pigment Red 168, Pigment Red 177, Pigment Red 216, Solvent Red 149, Solvent Red 150, Solvent Red 52, Solvent Red 207.
Kinacridone series: Pigment Red 122, Pigment Red 202, Pigment Red 206, Pigment Red 207, Pigment Red 209.
青色着色剤:
青色着色剤としてはフタロシアニン系、アントラキノン系があり、顔料系はピグメント(Pigment)に分類されている化合物、具体的には、下記のようなものを挙げることができる:Pigment Blue 15、Pigment Blue 15:1、Pigment Blue 15:2、Pigment Blue 15:3、Pigment Blue 15:4、Pigment Blue 15:6、Pigment Blue 16、Pigment Blue 60。
染料系としては、Solvent Blue 35、Solvent Blue 63、Solvent Blue 68、Solvent Blue 70、Solvent Blue 83、Solvent Blue 87、Solvent Blue 94、Solvent Blue 97、Solvent Blue 122、Solvent Blue 136、Solvent Blue 67、Solvent Blue 70等を使用することができる。上記以外にも、金属置換もしくは無置換のフタロシアニン化合物も使用することができる。
Blue colorant:
Blue colorants include phthalocyanine-based and anthraquinone-based pigments, and pigment-based compounds such as Pigment Blue 15 and Pigment Blue 15 are listed below. : 1, Pigment Blue 15: 2, Pigment Blue 15: 3, Pigment Blue 15: 4, Pigment Blue 15: 6, Pigment Blue 16, and Pigment Blue 60.
The dye systems include Solvent Blue 35, Solvent Blue 63, Solvent Blue 68, Solvent Blue 70, Solvent Blue 83, Solvent Blue 87, Solvent Blue 94, Solvent Blue 97, Solvent Blue 122, Solvent Blue 136, Solvent Blue 67, Solvent Blue 70 etc. can be used. In addition to the above, a metal-substituted or unsubstituted phthalocyanine compound can also be used.
緑色着色剤:
緑色着色剤としては、同様にフタロシアニン系、アントラキノン系、ペリレン系があり、具体的にはPigment Green 7、Pigment Green 36、Solvent Green 3、Solvent Green 5、Solvent Green 20、Solvent Green 28等を使用することができる。上記以外にも、金属置換もしくは無置換のフタロシアニン化合物も使用することができる。
Green colorant:
Similarly, green colorants include phthalocyanine, anthraquinone, and perylene. Specifically, Pigment Green 7, Pigment Green 36, Solvent Green 3, Solvent Green 5, Solvent Green 20, Solvent Green 28, etc. are used. be able to. In addition to the above, a metal-substituted or unsubstituted phthalocyanine compound can also be used.
黄色着色剤:
黄色着色剤としてはモノアゾ系、ジスアゾ系、縮合アゾ系、ベンズイミダゾロン系、イソインドリノン系、アントラキノン系等があり、具体的には以下のものが挙げられる。
アントラキノン系:Solvent Yellow 163、Pigment Yellow 24、Pigment Yellow 108、Pigment Yellow 193、Pigment Yellow 147、Pigment Yellow 199、Pigment Yellow 202。
イソインドリノン系:Pigment Yellow 110、Pigment Yellow 109、Pigment Yellow 139、Pigment Yellow 179、Pigment Yellow 185。
縮合アゾ系:Pigment Yellow 93、Pigment Yellow 94、Pigment Yellow 95、Pigment Yellow 128、Pigment Yellow 155、Pigment Yellow 166、Pigment Yellow 180。
ベンズイミダゾロン系:Pigment Yellow 120、Pigment Yellow 151、Pigment Yellow 154、Pigment Yellow 156、Pigment Yellow 175、Pigment Yellow 181。
モノアゾ系:Pigment Yellow 1, 2, 3, 4, 5, 6, 9, 10, 12, 61, 62, 62:1, 65, 73, 74, 75, 97, 100, 104, 105, 111, 116, 167, 168, 169, 182, 183。
ジスアゾ系:Pigment Yellow 12, 13, 14, 16, 17, 55, 63, 81, 83, 87, 126, 127, 152, 170, 172, 174, 176, 188, 198。
Yellow colorant:
Examples of yellow colorants include monoazo, disazo, condensed azo, benzimidazolone, isoindolinone, anthraquinone, and the like.
Anthraquinone series: Solvent Yellow 163, Pigment Yellow 24, Pigment Yellow 108, Pigment Yellow 193, Pigment Yellow 147, Pigment Yellow 199, Pigment Yellow 202.
Isoindolinone type: Pigment Yellow 110, Pigment Yellow 109, Pigment Yellow 139, Pigment Yellow 179, Pigment Yellow 185.
Condensed azo series: Pigment Yellow 93, Pigment Yellow 94, Pigment Yellow 95, Pigment Yellow 128, Pigment Yellow 155, Pigment Yellow 166, Pigment Yellow 180.
Benzimidazolone series: Pigment Yellow 120, Pigment Yellow 151, Pigment Yellow 154, Pigment Yellow 156, Pigment Yellow 175, Pigment Yellow 181.
Monoazo: Pigment Yellow 1, 2, 3, 4, 5, 6, 9, 10, 12, 61, 62, 62: 1, 65, 73, 74, 75, 97, 100, 104, 105, 111, 116 , 167, 168, 169, 182, 183.
Disazo: Pigment Yellow 12, 13, 14, 16, 17, 55, 63, 81, 83, 87, 126, 127, 152, 170, 172, 174, 176, 188, 198.
その他、色調を調整する目的で紫、オレンジ、茶色、黒などの着色剤を加えてもよい。
具体的に例示すれば、Pigment Violet 19、23、29、32、36、38、42、Solvent Violet 13、36、C.I.ピグメントオレンジ1、C.I.ピグメントオレンジ5、C.I.ピグメントオレンジ13、C.I.ピグメントオレンジ14、C.I.ピグメントオレンジ16、C.I.ピグメントオレンジ17、C.I.ピグメントオレンジ24、C.I.ピグメントオレンジ34、C.I.ピグメントオレンジ36、C.I.ピグメントオレンジ38、C.I.ピグメントオレンジ40、C.I.ピグメントオレンジ43、C.I.ピグメントオレンジ46、C.I.ピグメントオレンジ49、C.I.ピグメントオレンジ51、C.I.ピグメントオレンジ61、C.I.ピグメントオレンジ63、C.I.ピグメントオレンジ64、C.I.ピグメントオレンジ71、C.I.ピグメントオレンジ73、C.I.ピグメントブラウン23、C.I.ピグメントブラウン25、C.I.ピグメントブラック1、C.I.ピグメントブラック7等がある。
In addition, a colorant such as purple, orange, brown, or black may be added for the purpose of adjusting the color tone.
Specifically, Pigment Violet 19, 23, 29, 32, 36, 38, 42, Solvent Violet 13, 36, CI Pigment Orange 1, CI Pigment Orange 5, CI Pigment Orange 13, CI Pigment Orange 14, CI CI Pigment Orange 16, CI Pigment Orange 17, CI Pigment Orange 24, CI Pigment Orange 34, CI Pigment Orange 36, CI Pigment Orange 38, CI Pigment Orange 40, CI Pigment Orange 43, CI Pigment Orange 46, CI Pigment Orange 49, CI CI Pigment Orange 51, CI Pigment Orange 61, CI Pigment Orange 63, CI Pigment Orange 64, CI Pigment Orange 71, CI Pigment Orange 73, CI Pigment Brown 23, CI Pigment Brown 25, CI Pigment Black 1, CI Pigment Black And the like.
前記したような着色剤の配合割合は、特に制限はないが、組成物の固形分中5wt%以下、さらに好ましくは0.1〜3wt%で十分である。 The mixing ratio of the colorant as described above is not particularly limited, but 5 wt% or less, more preferably 0.1 to 3 wt% is sufficient in the solid content of the composition.
本発明の光硬化性熱硬化性樹脂組成物には、感度を向上させるために連鎖移動剤として公知慣用のNフェニルグリシン類、フェノキシ酢酸類、チオフェノキシ酢酸類、メルカプトチアゾール等を用いることができる。連鎖移動剤の具体例を挙げると例えば、メルカプト琥珀酸、メルカプト酢酸、メルカプトプロピオン酸、メチオニン、システイン、チオサリチル酸及びその誘導体等のカルボキシル基を有する連鎖移動剤;メルカプトエタノール、メルカプトプロパノール、メルカプトブタノール、メルカプトプロパンジオール、メルカプトブタンジオール、ヒドロキシベンゼンチオール及びその誘導体等の水酸基を有する連鎖移動剤;1−ブタンチオール、ブチル−3−メルカプトプロピオネート、メチル−3−メルカプトプロピオネート、2,2−(エチレンジオキシ)ジエタンチオール、エタンチオール、4−メチルベンゼンチオール、ドデシルメルカプタン、プロパンチオール、ブタンチオール、ペンタンチオール、1−オクタンチオール、シクロペンタンチオール、シクロヘキサンチオール、チオグリセロール、4,4−チオビスベンゼンチオール等である。 In the photocurable thermosetting resin composition of the present invention, known and commonly used N-phenylglycines, phenoxyacetic acids, thiophenoxyacetic acids, mercaptothiazole and the like can be used as chain transfer agents in order to improve sensitivity. . Specific examples of chain transfer agents include, for example, chain transfer agents having a carboxyl group such as mercaptosuccinic acid, mercaptoacetic acid, mercaptopropionic acid, methionine, cysteine, thiosalicylic acid and derivatives thereof; mercaptoethanol, mercaptopropanol, mercaptobutanol, Chain transfer agents having a hydroxyl group such as mercaptopropanediol, mercaptobutanediol, hydroxybenzenethiol and derivatives thereof; 1-butanethiol, butyl-3-mercaptopropionate, methyl-3-mercaptopropionate, 2,2- (Ethylenedioxy) diethanethiol, ethanethiol, 4-methylbenzenethiol, dodecyl mercaptan, propanethiol, butanethiol, pentanethiol, 1-octanethiol, cyclope Tanchioru, cyclohexane thiol, thioglycerol, 4,4-thiobisbenzenethiol like.
さらに、連鎖移動剤として働くメルカプト基を有する複素環化合物として、例えば、メルカプト−4−ブチロラクトン(別名:2−メルカプト−4−ブタノリド)、2−メルカプト−4−メチル−4−ブチロラクトン、2−メルカプト−4−エチル−4−ブチロラクトン、2−メルカプト−4−ブチロチオラクトン、2−メルカプト−4−ブチロラクタム、N−メトキシ−2−メルカプト−4−ブチロラクタム、N−エトキシ−2−メルカプト−4−ブチロラクタム、N−メチル−2−メルカプト−4−ブチロラクタム、N−エチル−2−メルカプト−4−ブチロラクタム、N−(2−メトキシ)エチル−2−メルカプト−4−ブチロラクタム、N−(2−エトキシ)エチル−2−メルカプト−4−ブチロラクタム、2−メルカプト−5−バレロラクトン、2−メルカプト−5−バレロラクタム、N−メチル−2−メルカプト−5−バレロラクタム、N−エチル−2−メルカプト−5−バレロラクタム、N−(2−メトキシ)エチル−2−メルカプト−5−バレロラクタム、N−(2−エトキシ)エチル−2−メルカプト−5−バレロラクタム及び2−メルカプト−6−ヘキサノラクタム等が挙げられる。 Further, examples of the heterocyclic compound having a mercapto group acting as a chain transfer agent include mercapto-4-butyrolactone (also known as 2-mercapto-4-butanolide), 2-mercapto-4-methyl-4-butyrolactone, and 2-mercapto. -4-ethyl-4-butyrolactone, 2-mercapto-4-butyrothiolactone, 2-mercapto-4-butyrolactam, N-methoxy-2-mercapto-4-butyrolactam, N-ethoxy-2-mercapto-4- Butyrolactam, N-methyl-2-mercapto-4-butyrolactam, N-ethyl-2-mercapto-4-butyrolactam, N- (2-methoxy) ethyl-2-mercapto-4-butyrolactam, N- (2-ethoxy) Ethyl-2-mercapto-4-butyrolactam, 2-mercapto-5-va Lolactone, 2-mercapto-5-valerolactam, N-methyl-2-mercapto-5-valerolactam, N-ethyl-2-mercapto-5-valerolactam, N- (2-methoxy) ethyl-2-mercapto- Examples include 5-valerolactam, N- (2-ethoxy) ethyl-2-mercapto-5-valerolactam, and 2-mercapto-6-hexanolactam.
特に、光硬化性熱硬化性樹脂組成物の現像性を損なうことがない連鎖移動剤であるメルカプト基を有する複素環化合物としてメルカプトベンゾチアゾール、3−メルカプト−4−メチル−4H−1,2,4−トリアゾール、5−メチル−1,3,4−チアジアゾール−2−チオール、1−フェニル−5−メルカプト−1H−テトラゾールが好ましい。これらの連鎖移動剤は、単独で又は2種以上を組み合わせて用いることができる。 In particular, mercaptobenzothiazole, 3-mercapto-4-methyl-4H-1,2, a heterocyclic compound having a mercapto group which is a chain transfer agent that does not impair the developability of the photocurable thermosetting resin composition 4-Triazole, 5-methyl-1,3,4-thiadiazole-2-thiol and 1-phenyl-5-mercapto-1H-tetrazole are preferred. These chain transfer agents can be used alone or in combination of two or more.
本発明の光硬化性熱硬化性樹脂組成物は、絶縁信頼性を向上させる目的で、ハイドロタルサイト類を添加しても良い。ハイドロタルサイト類の市販品としては、協和化学工業(株)製;アルカマイザー、DHT−4A、キョーワード500、キョーワード1000、堺化学(株)製STABIACEシリーズのHT−1、HT−7、HT−Pなどが挙げられる。
特に好ましいものは合成ハイドロタルサイト類で、平均粒経が2μm以下、さらに好ましくは1μm以下のものが好ましい。また、これらのハイドロタルサイト類は、水和物のまま、又は焼成して無水物の状態でも使用することができる。
Hydrotalcite may be added to the photocurable thermosetting resin composition of the present invention for the purpose of improving the insulation reliability. Commercial products of hydrotalcites include: Kyowa Chemical Industry Co., Ltd .; Alkamizer, DHT-4A, Kyoward 500, Kyoward 1000, Sakai Chemical Co., Ltd. STABIACE series HT-1, HT-7, HT-P etc. are mentioned.
Particularly preferred are synthetic hydrotalcites having an average particle size of 2 μm or less, more preferably 1 μm or less. Further, these hydrotalcites can be used in the anhydrous state as they are in the form of hydrates or after baking.
ハイドロタルサイト類の配合量は、組成物全体量の0.1〜30wt%とすることが好ましい。好ましくは0.5〜30wt%、より好ましくは0.1〜25wt%の範囲が適当である。ハイドロタルサイト類の配合量が上記範囲よりも多すぎると、組成物の粘度とチキソ性が高くなり過ぎ、印刷性が低下したり、硬化物が脆くなる場合があるので好ましくない。一方、0.1wt%未満の場合、電極腐食耐性の効果が損なわれるので好ましくない。 The blending amount of hydrotalcites is preferably 0.1 to 30 wt% of the total amount of the composition. The range is preferably 0.5-30 wt%, more preferably 0.1-25 wt%. If the blending amount of hydrotalcites is more than the above range, the viscosity and thixotropy of the composition will be too high, the printability may be lowered, and the cured product may become brittle, which is not preferable. On the other hand, if it is less than 0.1 wt%, the effect of electrode corrosion resistance is impaired, which is not preferable.
高分子材料の多くは、一度酸化が始まると、次々と連鎖的に酸化劣化が起き、高分子素材の機能低下をもたらすことから、本発明の光硬化性熱硬化性樹脂組成物には酸化を防ぐために、(1)発生したラジカルを無効化するようなラジカル補足剤又は/及び(2)発生した過酸化物を無害な物質に分解し、新たなラジカルが発生しないようにする過酸化物分解剤などの酸化防止剤を添加することができる。 Many of the polymer materials once oxidize start to undergo oxidative degradation one after another, leading to a decrease in the function of the polymer material. Therefore, the photocurable thermosetting resin composition of the present invention is oxidized. To prevent this, (1) radical scavengers that invalidate the generated radicals and / or (2) peroxide decomposition that decomposes the generated peroxide into harmless substances and prevents the generation of new radicals. An antioxidant such as an agent can be added.
ラジカル補足剤として働く酸化防止剤としては、例えば、ヒドロキノン、4−t−ブチルカテコール、2−t−ブチルヒドロキノン、ヒドロキノンモノメチルエーテル、2,6−ジ−t−ブチル−p−クレゾール、2,2−メチレン−ビス(4−メチル−6−t−ブチルフェノール)、1,1,3−トリス(2−メチル−4−ヒドロキシ−5−t−ブチルフェニル)ブタン、1,3,5−トリメチル−2,4,6−トリス(3,5−ジ−t−ブチル−4−ヒドロキシベンジル)ベンゼン、1,3,5−トリス(3’,5’−ジ−t−ブチル−4−ヒドロキシベンジル)−S−トリアジン−2,4,6−(1H,3H,5H)トリオン等のフェノール系、メタキノン、ベンゾキノン等のキノン系化合物、ビス(2,2,6,6−テトラメチル−4−ピペリジル)−セバケート、フェノチアジン等のアミン系化合物等が挙げられる。 Examples of the antioxidant acting as a radical scavenger include hydroquinone, 4-t-butylcatechol, 2-t-butylhydroquinone, hydroquinone monomethyl ether, 2,6-di-t-butyl-p-cresol, 2,2 -Methylene-bis (4-methyl-6-tert-butylphenol), 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane, 1,3,5-trimethyl-2 , 4,6-tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene, 1,3,5-tris (3 ′, 5′-di-t-butyl-4-hydroxybenzyl)- Phenolic compounds such as S-triazine-2,4,6- (1H, 3H, 5H) trione, quinone compounds such as metaquinone and benzoquinone, bis (2,2,6,6-tetramethyl-4 -Piperidyl) -amine compounds such as sebacate and phenothiazine.
ラジカル補足剤は市販のものであってもよく、例えば、アデカスタブ(登録商標)AO−30、アデカスタブAO−330、アデカスタブAO−20、アデカスタブLA−77、アデカスタブLA−57、アデカスタブLA−67、アデカスタブLA−68、アデカスタブLA−87(いずれもADEKA社製)、IRGANOX(登録商標)1010、IRGANOX 1035、IRGANOX 1076、IRGANOX 1135、TINUVIN(登録商標)111FDL、TINUVIN 123、TINUVIN 144、TINUVIN 152、TINUVIN 292、TINUVIN 5100(いずれもBASFジャパン社製)等が挙げられる。 The radical scavenger may be commercially available, for example, ADK STAB (registered trademark) AO-30, ADK STAB AO-330, ADK STAB AO-20, ADK STAB LA-77, ADK STAB LA-57, ADK STAB LA-67, ADK STAB LA-68, Adekastab LA-87 (all manufactured by ADEKA), IRGANOX (registered trademark) 1010, IRGANOX 1035, IRGANOX 1076, IRGANOX 1135, TINUVIN (registered trademark) 111FDL, TINUVIN 123, TINUVIN 144, TINUVIN 152, TINUVIN 152 And TINUVIN 5100 (both manufactured by BASF Japan Ltd.).
過酸化物分解剤として働く酸化防止剤としては、例えば、トリフェニルフォスファイト等のリン系化合物、ペンタエリスリトールテトララウリルチオプロピオネート、ジラウリルチオジプロピオネート、ジステアリル3,3’−チオジプロピオネート等の硫黄系化合物等が挙げられる。
過酸化物分解剤は市販のものであってもよく、例えば、アデカスタブTPP(ADEKA社製)、マークAO−412S(アデカ・アーガス化学社製)、スミライザー(登録商標)TPS(住友化学社製)等が挙げられる。
上記のような酸化防止剤は、1種を単独で又は2種以上を組み合わせて用いることができる。
Examples of the antioxidant acting as a peroxide decomposer include phosphorus compounds such as triphenyl phosphite, pentaerythritol tetralauryl thiopropionate, dilauryl thiodipropionate, distearyl 3,3′-thiodipro Sulfur compounds such as pionate can be mentioned.
The peroxide decomposing agent may be a commercially available one. For example, Adeka Stub TPP (manufactured by ADEKA), Mark AO-412S (manufactured by Adeka Argus Chemical Co., Ltd.), Sumilyzer (registered trademark) TPS (manufactured by Sumitomo Chemical Co., Ltd.) Etc.
The above antioxidants can be used individually by 1 type or in combination of 2 or more types.
本発明の光硬化性熱硬化性樹脂組成物は、上記酸化防止剤の他に、紫外線吸収剤を使用することができる。
このような紫外線吸収剤としては、ベンゾフェノン誘導体、ベンゾエート誘導体、ベンゾトリアゾール誘導体、トリアジン誘導体、ベンゾチアゾール誘導体、シンナメート誘導体、アントラニレート誘導体、ジベンゾイルメタン誘導体等が挙げられる。
The photocurable thermosetting resin composition of the present invention can use an ultraviolet absorber in addition to the antioxidant.
Examples of such ultraviolet absorbers include benzophenone derivatives, benzoate derivatives, benzotriazole derivatives, triazine derivatives, benzothiazole derivatives, cinnamate derivatives, anthranilate derivatives, dibenzoylmethane derivatives, and the like.
ベンゾフェノン誘導体としては、例えば、2−ヒドロキシ−4−メトキシ−ベンゾフェノン2−ヒドロキシ−4−メトキシベンゾフェノン、2−ヒドロキシ−4−n−オクトキシベンゾフェノン、2,2’−ジヒドロキシ−4−メトキシベンゾフェノン及び2,4−ジヒドロキシベンゾフェノン等が挙げられる。 Examples of the benzophenone derivatives include 2-hydroxy-4-methoxy-benzophenone 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-n-octoxybenzophenone, 2,2′-dihydroxy-4-methoxybenzophenone and 2 , 4-dihydroxybenzophenone and the like.
ベンゾエート誘導体としては、例えば、2−エチルヘキシルサリチレート、フェニルサリチレート、p−t−ブチルフェニルサリチレート、2,4−ジ−t−ブチルフェニル−3,5−ジ−t−ブチル−4−ヒドロキシベンゾエート及びヘキサデシル−3,5−ジ−t−ブチル−4−ヒドロキシベンゾエート等が挙げられる。 Examples of the benzoate derivative include 2-ethylhexyl salicylate, phenyl salicylate, pt-butylphenyl salicylate, 2,4-di-t-butylphenyl-3,5-di-t-butyl- Examples include 4-hydroxybenzoate and hexadecyl-3,5-di-t-butyl-4-hydroxybenzoate.
ベンゾトリアゾール誘導体としては、例えば、2−(2’−ヒドロキシ−5’−t−ブチルフェニル)ベンゾトリアゾール、2−(2’−ヒドロキシ−5’−メチルフェニル)エンゾトリアゾール、2−(2’−ヒドロキシ−3’−t−ブチル−5’−メチルフェニル)−5−クロロベンゾトリアゾール、2−(2’−ヒドロキシ−3’,5’−ジ−t−ブチルフェニル)−5−クロロベンゾトリアゾール、2−(2’−ヒドロキシ−5’−メチルフェニル)ベンゾトリアゾール及び2−(2’−ヒドロキシ−3’,5’−ジ−t−アミルフェニル)ベンゾトリアゾール等が挙げられる。 Examples of the benzotriazole derivatives include 2- (2′-hydroxy-5′-t-butylphenyl) benzotriazole, 2- (2′-hydroxy-5′-methylphenyl) enzotriazole, 2- (2′- Hydroxy-3′-t-butyl-5′-methylphenyl) -5-chlorobenzotriazole, 2- (2′-hydroxy-3 ′, 5′-di-t-butylphenyl) -5-chlorobenzotriazole, Examples include 2- (2′-hydroxy-5′-methylphenyl) benzotriazole and 2- (2′-hydroxy-3 ′, 5′-di-t-amylphenyl) benzotriazole.
トリアジン誘導体としては、例えば、ヒドロキシフェニルトリアジン、ビスエチルヘキシルオキシフェノールメトキシフェニルトリアジン等が挙げられる。 Examples of the triazine derivative include hydroxyphenyl triazine, bisethylhexyloxyphenol methoxyphenyl triazine, and the like.
紫外線吸収剤としては、市販のものであってもよく、例えば、TINUVI PS、TINUVIN 99−2、TINUVIN 109、TINUVIN 384−2、TINUVIN 900、TINUVIN 928、TINUVIN 1130、TINUVIN 400、TINUVIN 405、TINUVIN 460、TINUVIN 479(いずれもBASFジャパン社製)等が挙げられる。 Ultraviolet absorbers may be commercially available, for example, TINUVI PS, TINUVIN 99-2, TINUVIN 109, TINUVIN 384-2, TINUVIN 900, TINUVIN 928, TINUVIN 1130, TINUVIN 400, TINUVIN 405, TINUVIN 460. , TINUVIN 479 (both manufactured by BASF Japan) and the like.
前記したような紫外線吸収剤は、1種を単独で又は2種以上を組み合わせて用いることができ、酸化防止剤と併用することで、本発明の光硬化性熱硬化性樹脂組成物より得られる成形物の安定化を図ることができる。 The ultraviolet absorbers as described above can be used singly or in combination of two or more, and can be obtained from the photocurable thermosetting resin composition of the present invention by using in combination with an antioxidant. Stabilization of the molded product can be achieved.
本発明の光硬化性熱硬化性樹脂組成物は、その塗膜の物理的強度等を上げるために、必要に応じて、フィラーを配合することができる。このようなフィラーとしては、公知慣用の無機又は有機フィラーが使用できるが、特に硫酸バリウム、球状シリカ、ノイブルグ珪土粒子、及びタルクが好ましく用いられる。さらに、白色の外観や難燃性を得るために酸化チタンや金属酸化物、水酸化アルミなどの金属水酸化物を体質顔料フィラーとしても使用することができる。フィラーの配合量は、好ましくは組成物全体量の75wt%以下、より好ましくは0.1〜60wt%の割合である。フィラーの配合量が、組成物全体量の75wt%を超えた場合、絶縁組成物の粘度が高くなり、塗布、成形性が低下したり、硬化物が脆くなるので好ましくない。 The photocurable thermosetting resin composition of the present invention can contain a filler as necessary in order to increase the physical strength of the coating film. As such a filler, publicly known and commonly used inorganic or organic fillers can be used. In particular, barium sulfate, spherical silica, Neuburg silica clay particles, and talc are preferably used. Furthermore, in order to obtain a white appearance and flame retardancy, metal hydroxides such as titanium oxide, metal oxide, and aluminum hydroxide can be used as extender pigment fillers. The blending amount of the filler is preferably 75 wt% or less, more preferably 0.1 to 60 wt% of the total amount of the composition. When the blending amount of the filler exceeds 75 wt% of the total amount of the composition, the viscosity of the insulating composition becomes high, the coating and moldability are lowered, and the cured product becomes brittle.
さらに、本発明の光硬化性熱硬化性樹脂組成物は、前記カルボキシル基含有感光性樹脂の合成のため、また組成物の調製のため、又は基板やキャリアフィルムに塗布するための粘度調整のため、有機溶剤を使用することができる。 Furthermore, the photocurable thermosetting resin composition of the present invention is used for the synthesis of the carboxyl group-containing photosensitive resin, for the preparation of the composition, or for the viscosity adjustment for application to a substrate or a carrier film. Organic solvents can be used.
このような有機溶剤としては、ケトン類、芳香族炭化水素類、グリコールエーテル類、グリコールエーテルアセテート類、エステル類、アルコール類、脂肪族炭化水素、石油系溶剤などを挙げることができる。より具体的には、メチルエチルケトン、シクロヘキサノン等のケトン類;トルエン、キシレン、テトラメチルベンゼン等の芳香族炭化水素類;セロソルブ、メチルセロソルブ、ブチルセロソルブ、カルビトール、メチルカルビトール、ブチルカルビトール、プロピレングリコールモノメチルエーテル、ジプロピレングリコールモノメチルエーテル、ジプロピレングリコールジエチルエーテル、トリエチレングリコールモノエチルエーテル等のグリコールエーテル類;酢酸エチル、酢酸ブチル、ジプロピレングリコールメチルエーテルアセテート、プロピレングリコールメチルエーテルアセテート、プロピレングリコールエチルエーテルアセテート、プロピレングリコールブチルエーテルアセテート、2-ヒドロキシイソ酪酸メチルなどのエステル類;エタノール、プロパノール、エチレングリコール、プロピレングリコール等のアルコール類;オクタン、デカン等の脂肪族炭化水素;石油エーテル、石油ナフサ、水添石油ナフサ、ソルベントナフサ等の石油系溶剤などである。このような有機溶剤は、単独で又は2種以上の混合物として用いられる。 Examples of such organic solvents include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, petroleum solvents, and the like. More specifically, ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene and tetramethylbenzene; cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl Glycol ethers such as ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, triethylene glycol monoethyl ether; ethyl acetate, butyl acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate , Such as propylene glycol butyl ether acetate, methyl 2-hydroxyisobutyrate Alcohols such as ethanol, propanol, ethylene glycol and propylene glycol; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha and solvent naphtha. Such organic solvents are used alone or as a mixture of two or more.
本発明の光硬化性熱硬化性樹脂組成物は、さらに必要に応じて、公知の熱重合禁止剤、微粉シリカ、有機ベントナイト、モンモリロナイト等の公知慣用の増粘剤、シリコーン系、フッ素系、高分子系等の消泡剤及び/又はレベリング剤、イミダゾール系、チアゾール系、トリアゾール系等のシランカップリング剤、酸化防止剤、防錆剤等のような公知の添加剤類を配合することができる。 The photo-curable thermosetting resin composition of the present invention may further comprise a known conventional thickener such as a known thermal polymerization inhibitor, fine silica, organic bentonite, and montmorillonite, silicone, fluorine, Known additives such as molecular antifoaming agents and / or leveling agents, imidazole, thiazole and triazole silane coupling agents, antioxidants, rust inhibitors and the like can be blended. .
熱重合禁止剤は、重合性化合物の熱的な重合又は経時的な重合を防止するために用いることができる。熱重合禁止剤としては、例えば、4−メトキシフェノール、ハイドロキノン、アルキル又はアリール置換ハイドロキノン、t−ブチルカテコール、ピロガロール、2−ヒドロキシベンゾフェノン、4−メトキシ−2−ヒドロキシベンゾフェノン、塩化第一銅、フェノチアジン、クロラニル、ナフチルアミン、β−ナフトール、2,6−ジ−t−ブチル−4−クレゾール、2,2’−メチレンビス(4−メチル−6−t−ブチルフェノール)、ピリジン、ニトロベンゼン、ジニトロベンゼン、ピクリン酸、4−トルイジン、メチレンブルー、銅と有機キレート剤反応物、サリチル酸メチル、及びフェノチアジン、ニトロソ化合物、ニトロソ化合物とAlとのキレート等が挙げられる。 The thermal polymerization inhibitor can be used for preventing thermal polymerization or polymerization with time of the polymerizable compound. Examples of the thermal polymerization inhibitor include 4-methoxyphenol, hydroquinone, alkyl or aryl-substituted hydroquinone, t-butylcatechol, pyrogallol, 2-hydroxybenzophenone, 4-methoxy-2-hydroxybenzophenone, cuprous chloride, phenothiazine, Chloranil, naphthylamine, β-naphthol, 2,6-di-tert-butyl-4-cresol, 2,2′-methylenebis (4-methyl-6-tert-butylphenol), pyridine, nitrobenzene, dinitrobenzene, picric acid, 4-Toluidine, methylene blue, copper and organic chelating agent reactant, methyl salicylate, phenothiazine, nitroso compound, chelate of nitroso compound and Al, and the like.
本発明の光硬化性熱硬化性樹脂組成物は、例えば前記有機溶剤で塗布方法に適した粘度に調整し、基材上に、ディップコート法、フローコート法、ロールコート法、バーコーター法、スクリーン印刷法、カーテンコート法等の方法により塗布し、約60〜100℃の温度で組成物中に含まれる有機溶剤を揮発乾燥(仮乾燥)させることにより、タックフリーの塗膜を形成できる。また、上記組成物をキャリアフィルム上に塗布し、乾燥させてフィルムとして巻き取ったものを基材上に張り合わせることにより、樹脂絶縁層を形成できる。その後接触式(又は非接触方式)により、パターンを形成したフォトマスクを通して選択的に活性エネルギー線により露光もしくはレーザーダイレクト露光機により直接パターン露光し、未露光部を希アルカリ水溶液(例えば0.3〜3wt%炭酸ソーダ水溶液)により現像してレジストパターンが形成される。さらに、例えば約140〜180℃の温度に加熱して熱硬化させることにより、前記カルボキシル基含有樹脂のカルボキシル基と、エポキシ化植物油のエポキシ基(あるいは含有している場合にはさらに他の熱硬化性成分の環状(チオ)エーテル基)が反応し、耐熱性、耐薬品性、耐吸湿性、密着性、電気特性などの諸特性に優れた硬化塗膜を形成することができる。 The photocurable thermosetting resin composition of the present invention is adjusted to a viscosity suitable for the coating method with, for example, the organic solvent, and on the substrate, a dip coating method, a flow coating method, a roll coating method, a bar coater method, A tack-free coating film can be formed by applying the organic solvent contained in the composition at a temperature of about 60 to 100 ° C. by volatile drying (temporary drying) at a temperature of about 60 to 100 ° C. Moreover, a resin insulation layer can be formed by apply | coating the said composition on a carrier film, and drying and winding up as a film together on a base material. Thereafter, by contact type (or non-contact type), exposure is selectively performed with an active energy ray through a photomask having a pattern formed thereon or direct pattern exposure is performed by a laser direct exposure machine, and an unexposed portion is diluted with a dilute alkaline aqueous solution (for example, 0.3 to A resist pattern is formed by development with a 3 wt% sodium carbonate aqueous solution. Furthermore, for example, by heating to a temperature of about 140 to 180 ° C. and thermosetting, the carboxyl group of the carboxyl group-containing resin and the epoxy group of the epoxidized vegetable oil (or other thermosetting if included) The cyclic (thio) ether group of the reactive component can react to form a cured coating film excellent in various properties such as heat resistance, chemical resistance, moisture absorption resistance, adhesion, and electrical characteristics.
上記基材としては、予め回路形成されたプリント配線板やフレキシブルプリント配線板の他、紙−フェノール樹脂、紙−エポキシ樹脂、ガラス布−エポキシ樹脂、ガラス−ポリイミド、ガラス布/不繊布−エポキシ樹脂、ガラス布/紙−エポキシ樹脂、合成繊維−エポキシ樹脂、フッ素樹脂・ポリエチレン・PPO・シアネートエステル等の複合材を用いた全てのグレード(FR−4等)の銅張積層板、ポリイミドフィルム、PETフィルム、ガラス基板、セラミック基板、ウエハ板等を用いることができる。 As the substrate, in addition to a printed circuit board and a flexible printed circuit board in which circuits are formed in advance, paper-phenol resin, paper-epoxy resin, glass cloth-epoxy resin, glass-polyimide, glass cloth / non-woven cloth-epoxy resin , Glass cloth / paper-epoxy resin, synthetic fiber-epoxy resin, copper-clad laminate of all grades (FR-4 etc.) using polyimide, polyethylene, PPO, cyanate ester, etc., polyimide film, PET A film, a glass substrate, a ceramic substrate, a wafer plate, or the like can be used.
本発明の光硬化性熱硬化性樹脂組成物を塗布した後に行う揮発乾燥は、熱風循環式乾燥炉、IR炉、ホットプレート、コンベクションオーブンなど(蒸気による空気加熱方式の熱源を備えたものを用いて乾燥機内の熱風を向流接触せしめる方法及びノズルより支持体に吹き付ける方式)を用いて行うことができる。 Volatile drying performed after applying the photocurable thermosetting resin composition of the present invention is performed using a hot air circulation drying furnace, an IR furnace, a hot plate, a convection oven, or the like (equipped with an air heating heat source using steam). And a method in which hot air in the dryer is brought into countercurrent contact and a method in which the hot air in the dryer is blown onto the support from the nozzle).
以上のように本発明の光硬化性熱硬化性樹脂組成物を塗布し、揮発乾燥した後、得られた塗膜に対し、露光(活性エネルギー線の照射)を行う。塗膜は、露光部(活性エネルギー線により照射された部分)が硬化する。 As mentioned above, after apply | coating the photocurable thermosetting resin composition of this invention and evaporating and drying, exposure (irradiation of an active energy ray) is performed with respect to the obtained coating film. In the coating film, the exposed portion (the portion irradiated by the active energy ray) is cured.
上記活性エネルギー線照射に用いられる露光機としては、直接描画装置(例えばコンピューターからのCADデータにより直接レーザーで画像を描くレーザーダイレクトイメージング装置)、メタルハライドランプを搭載した露光機、(超)高圧水銀ランプを搭載した露光機、水銀ショートアークランプを搭載した露光機、もしくは(超)高圧水銀ランプなどの紫外線ランプを使用した直接描画装置を用いることができる。活性エネルギー線としては、最大波長が350〜410nmの範囲にあるレーザー光を用いていればガスレーザー、固体レーザーどちらでもよい。また、その露光量は膜厚等によって異なるが、一般には5〜800mJ/cm2、好ましくは5〜500mJ/cm2の範囲内とすることができる。上記直接描画装置としては、例えば日本オルボテック社製、ペンタックス社製等のものを使用することができ、最大波長が350〜410nmのレーザー光を発振する装置であればいずれの装置を用いてもよい。 As the exposure apparatus used for the active energy ray irradiation, a direct drawing apparatus (for example, a laser direct imaging apparatus that directly draws an image with a laser using CAD data from a computer), an exposure apparatus equipped with a metal halide lamp, and an (ultra) high pressure mercury lamp. , An exposure machine equipped with a mercury short arc lamp, or a direct drawing apparatus using an ultraviolet lamp such as a (super) high pressure mercury lamp. As the active energy ray, either a gas laser or a solid laser may be used as long as laser light having a maximum wavelength in the range of 350 to 410 nm is used. Further, the exposure amount varies depending the thickness or the like, generally 5~800mJ / cm 2, preferably be in the range of 5~500mJ / cm 2. As the direct drawing device, for example, those manufactured by Nippon Orbotech, Pentax, etc. can be used, and any device may be used as long as it oscillates laser light having a maximum wavelength of 350 to 410 nm. .
前記現像方法としては、ディッピング法、シャワー法、スプレー法、ブラシ法等によることができ、現像液としては、水酸化カリウム、水酸化ナトリウム、炭酸ナトリウム、炭酸カリウム、リン酸ナトリウム、ケイ酸ナトリウム、アンモニア、アミン類などのアルカリ水溶液が使用できる。 The developing method can be a dipping method, a shower method, a spray method, a brush method or the like, and as a developer, potassium hydroxide, sodium hydroxide, sodium carbonate, potassium carbonate, sodium phosphate, sodium silicate, Alkaline aqueous solutions such as ammonia and amines can be used.
本発明の光硬化性熱硬化性樹脂組成物は、液状で直接基材に塗布する方法以外にも、予めポリエチレンテレフタレート等のフィルムにソルダーレジストを塗布・乾燥して形成したソルダーレジスト層を有するドライフィルムの形態で使用することもできる。本発明の光硬化性熱硬化性樹脂組成物をドライフィルムとして使用する場合を以下に示す。 The photo-curable thermosetting resin composition of the present invention is not a liquid and directly applied to a substrate, but also a dry resist layer formed by applying and drying a solder resist on a film of polyethylene terephthalate or the like in advance. It can also be used in the form of a film. The case where the photocurable thermosetting resin composition of this invention is used as a dry film is shown below.
ドライフィルムは、キャリアフィルムと、ソルダーレジスト層と、必要に応じて用いられる剥離可能なカバーフィルムとが、この順序に積層された構造を有するものである。ソルダーレジスト層は、例えばアルカリ現像性の光硬化性樹脂組成物をキャリアフィルム又はカバーフィルムに塗布・乾燥して得られる層である。キャリアフィルムにソルダーレジスト層を形成した後に、カバーフィルムをその上に積層するか、カバーフィルムにソルダーレジスト層を形成し、この積層体をキャリアフィルムに積層すればドライフィルムが得られる。 The dry film has a structure in which a carrier film, a solder resist layer, and a peelable cover film used as necessary are laminated in this order. The solder resist layer is a layer obtained by, for example, applying and drying an alkali-developable photocurable resin composition on a carrier film or a cover film. After forming a solder resist layer on the carrier film, a cover film is laminated thereon, or a solder resist layer is formed on the cover film, and this laminate is laminated on the carrier film to obtain a dry film.
キャリアフィルムとしては、2〜150μmの厚みのポリエステルフィルム等の熱可塑性フィルムが用いられる。
ソルダーレジスト層は、アルカリ現像性光硬化性樹脂組成物をブレードコーター、リップコーター、コンマコーター、フィルムコーター等でキャリアフィルム又はカバーフィルムに10〜150μmの厚さで均一に塗布し乾燥して形成される。
カバーフィルムとしては、ポリエチレンフィルム、ポリプロピレンフィルム等を使用することができるが、ソルダーレジスト層との接着力が、キャリアフィルムよりも小さいものが良い。
As the carrier film, a thermoplastic film such as a polyester film having a thickness of 2 to 150 μm is used.
The solder resist layer is formed by uniformly applying an alkali-developable photocurable resin composition to a carrier film or a cover film with a thickness of 10 to 150 μm using a blade coater, lip coater, comma coater, film coater, and the like, and then drying. The
As the cover film, a polyethylene film, a polypropylene film, or the like can be used, but a cover film having a smaller adhesive force than the solder resist layer is preferable.
ドライフィルムを用いてプリント配線板上に保護膜(永久保護膜)を作製するには、カバーフィルムを剥がし、ソルダーレジスト層と回路形成された基材を重ね、ラミネーター等を用いて張り合わせ、回路形成された基材上にソルダーレジスト層を形成する。形成されたソルダーレジスト層に対し、前記と同様に露光、現像、加熱硬化すれば、硬化塗膜を形成することができる。キャリアフィルムは、露光前又は露光後のいずれかに剥離すれば良い。 To produce a protective film (permanent protective film) on a printed wiring board using a dry film, peel off the cover film, layer the solder resist layer and the substrate on which the circuit is formed, and bond them together using a laminator, etc. A solder resist layer is formed on the formed substrate. If the formed solder resist layer is exposed, developed, and heat cured in the same manner as described above, a cured coating film can be formed. The carrier film may be peeled off either before exposure or after exposure.
以下に実施例及び比較例を示して本発明について具体的に説明するが、本発明が下記実施例に限定されるものではないことはもとよりである。尚、以下において「部」及び「%」とあるのは、特に断りのない限り全て質量基準である。 EXAMPLES Hereinafter, the present invention will be described in detail with reference to examples and comparative examples, but the present invention is not limited to the following examples. In the following description, “parts” and “%” are based on mass unless otherwise specified.
<カルボキシル基含有感光性樹脂合成例1>
ジエチレングリコールモノエチルエーテルアセテート600gにオルソクレゾールノボラック型エポキシ樹脂〔大日本インキ化学工業株式会社製、EPICLON N−695、軟化点95℃、エポキシ当量214、平均官能基数7.6〕1070g(グリシジル基数(芳香環総数):5.0モル)、アクリル酸360g(5.0モル)、及びハイドロキノン1.5gを仕込み、100℃に加熱攪拌し、均一溶解した。次いで、トリフェニルホスフィン4.3gを仕込み、110℃に加熱して2時間反応後、120℃に昇温してさらに12時間反応を行った。得られた反応液に芳香族系炭化水素(ソルベッソ150)415g、テトラヒドロ無水フタル酸456.0g(3.0モル)を仕込み、110℃で4時間反応を行い、冷却後、固形分酸価89mgKOH/g、固形分65%の樹脂溶液を得た。この樹脂溶液をA−1と称す。
<Carboxyl group-containing photosensitive resin synthesis example 1>
Orthocresol novolac type epoxy resin (Dainippon Ink & Chemicals, EPICLON N-695, softening point 95 ° C., epoxy equivalent 214, average functional group number 7.6) 1070 g (number of glycidyl groups (fragrance) Total number of rings): 5.0 mol), 360 g of acrylic acid (5.0 mol), and 1.5 g of hydroquinone were charged, and the mixture was heated and stirred at 100 ° C. to uniformly dissolve. Next, 4.3 g of triphenylphosphine was charged, heated to 110 ° C. and reacted for 2 hours, then heated to 120 ° C. and reacted for further 12 hours. To the obtained reaction solution, 415 g of aromatic hydrocarbon (Sorvesso 150) and 456.0 g (3.0 mol) of tetrahydrophthalic anhydride were added and reacted at 110 ° C. for 4 hours. After cooling, the solid content acid value 89 mgKOH / G, a resin solution having a solid content of 65% was obtained. This resin solution is referred to as A-1.
<カルボキシル基含有感光性樹脂合成例2>
温度計、攪拌機、滴下ロート、及び還流冷却器を備えたフラスコに、メチルメタクリレート、エチルメタクリレート、及びメタクリル酸をモル比で1:1:2となるように仕込み、溶媒としてジプロピレングリコールモノメチルエーテル、触媒としてAIBNを入れ、窒素雰囲気下、80℃で4時間攪拌し、樹脂溶液を得た。この樹脂溶液を冷却し、重合禁止剤としてメチルハイドロキノン、触媒としてテトラブチルホスホニウムブロミドを用い、グリシジルメタクリレートを、95〜105℃で16時間の条件で、上記樹脂のカルボキシル基に対し20モル%付加反応させ、冷却後、取り出した。このようにして得られたエチレン性不飽和結合及びカルボキシル基を併せ持つ感光性樹脂は、不揮発分65%、固形物の酸価120mgKOH/g、Mw約20,000であった。以下、この樹脂溶液をA−2と称す。
<Carboxyl group-containing photosensitive resin synthesis example 2>
A flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux condenser was charged with methyl methacrylate, ethyl methacrylate, and methacrylic acid in a molar ratio of 1: 1: 2, and dipropylene glycol monomethyl ether as a solvent, AIBN was added as a catalyst and stirred at 80 ° C. for 4 hours under a nitrogen atmosphere to obtain a resin solution. This resin solution is cooled, methylhydroquinone as a polymerization inhibitor, tetrabutylphosphonium bromide as a catalyst, and glycidyl methacrylate is added at 20% by mole to the carboxyl group of the resin at 95 to 105 ° C. for 16 hours. And cooled and then taken out. The thus obtained photosensitive resin having both an ethylenically unsaturated bond and a carboxyl group had a non-volatile content of 65%, a solid acid value of 120 mgKOH / g, and a Mw of about 20,000. Hereinafter, this resin solution is referred to as A-2.
実施例1〜4及び比較例1〜3
下記表1に示す種々の成分と共に表1に示す割合(質量部)にて配合し、攪拌機にて予備混合した後、3本ロールミルで混練し、ソルダーレジスト用感光性樹脂組成物を調製した。
Examples 1-4 and Comparative Examples 1-3
It mix | blended in the ratio (mass part) shown in Table 1 with the various components shown in the following Table 1, and after premixing with the stirrer, it knead | mixed with the 3 roll mill and prepared the photosensitive resin composition for soldering resists.
性能評価:
<20℃での保存安定性>
表1の実施例1〜4、比較例1〜3の樹脂組成物を20℃の暗所に3ヶ月保管し、3ヶ月後の増粘率を測定した。評価基準は以下の通りである。
○:増粘率0%〜100%。
△:増粘率100〜200%。
×:増粘率200%以上又はゲル化。
Performance evaluation:
<Storage stability at 20 ° C>
The resin compositions of Examples 1 to 4 and Comparative Examples 1 to 3 in Table 1 were stored in a dark place at 20 ° C. for 3 months, and the thickening rate after 3 months was measured. The evaluation criteria are as follows.
A: Thickening rate 0% to 100%.
(Triangle | delta): Thickening rate 100-200%.
X: Thickening rate 200% or more or gelation.
<50℃での保存安定性>
表1の実施例1〜4、比較例1〜3の樹脂組成物を50℃の暗所に保管し、径時での増粘率を測定した。増粘率が200%を越えたところで使用不可と判断し、使用不可に至るまでの時間を計測した。
<Storage stability at 50 ° C>
The resin compositions of Examples 1 to 4 and Comparative Examples 1 to 3 in Table 1 were stored in a dark place at 50 ° C., and the thickening rate at the time of diameter was measured. When the thickening ratio exceeded 200%, it was determined that the product could not be used, and the time until the product was not used was measured.
<最適露光量>
銅厚35μmの回路パターン基板をバフロール研磨後、水洗し、乾燥してから、前記実施例及び比較例の光硬化性熱硬化性樹脂組成物をスクリーン印刷法により全面に塗布し、80℃の熱風循環式乾燥炉で60分間乾燥させた。乾燥後、高圧水銀灯(ショートアークランプ)搭載の露光装置を用いてステップタブレット(Kodak No.2)を介して露光し、現像(30℃、0.2MPa、1wt%Na2CO3水溶液)を60秒で行った際に残存するステップタブレットのパターンが7段の時を最適露光量とした。
<Optimum exposure amount>
A circuit pattern substrate having a copper thickness of 35 μm was polished with buffalo, washed with water and dried, and then the photo-curable thermosetting resin compositions of the examples and comparative examples were applied to the entire surface by a screen printing method, and hot air at 80 ° C. It was dried for 60 minutes in a circulation drying oven. After drying, exposure is performed through a step tablet (Kodak No. 2) using an exposure apparatus equipped with a high-pressure mercury lamp (short arc lamp), and development (30 ° C., 0.2 MPa, 1 wt% Na 2 CO 3 aqueous solution) is performed at 60. When the pattern of the step tablet remaining when performing in seconds was 7 steps, the optimum exposure amount was set.
<現像性>
前記実施例及び比較例の光硬化性熱硬化性樹脂組成物を、銅ベタ基板上にスクリーン印刷法により乾燥後の膜厚が約25μmになるように塗布し、80℃の熱風循環式乾燥炉で30分間乾燥させた。乾燥後、1wt%Na2CO3水溶液によって現像を行い、乾燥塗膜が除去されるまでの時間をストップウォッチにより計測した。
<Developability>
The photocurable thermosetting resin compositions of the examples and comparative examples were applied to a solid copper substrate by a screen printing method so that the film thickness after drying was about 25 μm, and a hot air circulation drying oven at 80 ° C. For 30 minutes. After drying, development was performed with a 1 wt% Na 2 CO 3 aqueous solution, and the time until the dried coating film was removed was measured with a stopwatch.
<指触乾燥性>
前記実施例及び比較例の光硬化性熱硬化性樹脂組成物をそれぞれパターン形成された銅箔基板上にスクリーン印刷で全面塗布し、80℃の熱風循環式乾燥炉で30分間乾燥させ、室温まで放冷した。この基板にPETフィルムを押し当て、その後、ネガフィルムを剥がしたときのフィルムの張り付き状態を評価した。判定基準は以下のとおりである。
○:フィルムを剥がす時に、全く抵抗が無いが、塗膜に跡が少しついている。
△:フィルムを剥がす時に、僅かに抵抗があり、塗膜に跡が少しついている。
×:フィルムを剥がす時に、抵抗があり、塗膜にはっきり跡がついている。
<Dry touch dryness>
The photocurable thermosetting resin compositions of the examples and comparative examples were each coated on the patterned copper foil substrate by screen printing, dried in a hot air circulation drying oven at 80 ° C. for 30 minutes, and brought to room temperature. Allowed to cool. A PET film was pressed against this substrate, and then the sticking state of the film when the negative film was peeled off was evaluated. The judgment criteria are as follows.
○: When the film is peeled off, there is no resistance, but the coating film has a slight mark.
(Triangle | delta): When peeling a film, there exists resistance slightly and the coating film has a trace.
X: When the film is peeled off, there is resistance and the coating film is clearly marked.
<解像性>
前記実施例及び比較例の光硬化性熱硬化性樹脂組成物を、ライン/スペースが300/300μm、銅厚35μmの回路パターン基板をバフロール研磨後、水洗し、乾燥してからスクリーン印刷法により塗布し、80℃の熱風循環式乾燥炉で30分間乾燥させた。乾燥後、高圧水銀灯を搭載した露光装置を用いて露光した。露光パターンはスペース部に20/30/40/50/60/70/80/90/100μmのラインを描画させるネガを使用した。露光量は感光性樹脂組成物の最適露光量となるように活性エネルギー線を照射した。露光後、30℃の1wt%Na2CO3水溶液をスプレー圧0.2MPaの条件で60秒間現像を行い、150℃で60分の熱硬化をすることにより硬化塗膜を得た。得られたソルダーレジスト用感光性樹脂組成物の硬化塗膜の最小残存ラインを200倍に調整した光学顕微鏡を用いて求め、これを解像性とした。
<Resolution>
A circuit pattern substrate having a line / space of 300/300 μm and a copper thickness of 35 μm was applied to the photocurable thermosetting resin compositions of Examples and Comparative Examples by buffing, washing with water, drying and then applying by screen printing. And dried for 30 minutes in a hot air circulation drying oven at 80 ° C. After drying, exposure was performed using an exposure apparatus equipped with a high-pressure mercury lamp. For the exposure pattern, a negative was used to draw a 20/30/40/50/60/70/80/90/100 μm line in the space. The active energy ray was irradiated so that the exposure amount became the optimal exposure amount of the photosensitive resin composition. After the exposure, a 1 wt% Na 2 CO 3 aqueous solution at 30 ° C. was developed for 60 seconds under the condition of a spray pressure of 0.2 MPa, and heat cured at 150 ° C. for 60 minutes to obtain a cured coating film. It determined using the optical microscope which adjusted the minimum residual line of the cured coating film of the obtained photosensitive resin composition for solder resists 200 times, and made this resolution.
特性試験:
前記各実施例及び比較例の組成物を、パターン形成された銅箔基板上にスクリーン印刷で全面塗布し、80℃で30分乾燥し、室温まで放冷した。この基板に高圧水銀灯(ショートアークランプ)搭載の露光装置を用いて最適露光量でソルダーレジストパターンを露光し、30℃の1wt%Na2CO3水溶液をスプレー圧0.2MPaの条件で60秒間現像を行い、レジストパターンを得た。この基板を、UVコンベア炉にて積算露光量1000mJ/cm2の条件で紫外線照射した後、150℃で60分加熱して硬化した。得られたプリント基板(評価基板)に対して以下のように特性を評価した。
Characteristic test:
The compositions of Examples and Comparative Examples were applied on the entire surface of a patterned copper foil substrate by screen printing, dried at 80 ° C. for 30 minutes, and allowed to cool to room temperature. This substrate is exposed to a solder resist pattern at an optimal exposure amount using an exposure apparatus equipped with a high-pressure mercury lamp (short arc lamp), and developed with a 1 wt% Na 2 CO 3 aqueous solution at 30 ° C. for 60 seconds under a spray pressure of 0.2 MPa. And a resist pattern was obtained. This substrate was irradiated with ultraviolet rays under a condition of an integrated exposure amount of 1000 mJ / cm 2 in a UV conveyor furnace, and then cured by heating at 150 ° C. for 60 minutes. The characteristics of the obtained printed circuit board (evaluation board) were evaluated as follows.
<はんだ耐熱性>
ロジン系フラックスを塗布した評価基板を、予め260℃に設定した、はんだ槽に浸漬し、変性アルコールでフラックスを洗浄した後、目視によるレジスト層の膨れ・剥がれについて評価した。判定基準は以下のとおりである。
○:10秒間浸漬を3回以上繰り返しても剥がれが認められない。
△:10秒間浸漬を3回以上繰り返すと少し剥がれる。
×:10秒間浸漬を3回以内にレジスト層に膨れ、剥がれがある。
<Solder heat resistance>
The evaluation board | substrate which apply | coated the rosin type flux was immersed in the solder tank previously set to 260 degreeC, and after washing | cleaning the flux with denatured alcohol, the swelling / peeling of the resist layer by visual observation was evaluated. The judgment criteria are as follows.
○: No peeling is observed even if the immersion for 10 seconds is repeated 3 times or more.
(Triangle | delta): It peels for a while when immersion for 10 seconds is repeated 3 times or more.
X: The resist layer swells and peels off within 3 times for 10 seconds.
<無電解金めっき耐性>
市販品の無電解ニッケルめっき浴及び無電解金めっき浴を用いて、ニッケル0.5μm、金0.03μmの条件でめっきを行い、テープピーリングにより、レジスト層の剥がれの有無やめっきのしみ込みの有無を評価した後、テープピーリングによりレジスト層の剥がれの有無を評価した。判定基準は以下のとおりである。
○:染み込み、剥がれが見られない。
△:めっき後に少し染み込みが確認されるが、テープピール後は剥がれない。
×:めっき後にほんの僅かしみ込みが見られ、テープピール後に剥がれも見られる。
<Electroless gold plating resistance>
Using commercially available electroless nickel plating bath and electroless gold plating bath, plating is performed under the conditions of nickel 0.5 μm and gold 0.03 μm, and the tape peeling causes the presence or absence of resist layer peeling or plating penetration. After evaluating the presence or absence, the presence or absence of peeling of the resist layer was evaluated by tape peeling. The judgment criteria are as follows.
○: Infiltration and peeling are not seen.
Δ: Slight penetration is observed after plating, but does not peel off after tape peeling.
X: Slight penetration was observed after plating, and peeling was also observed after tape peeling.
<耐アルカリ性>
評価基板を10wt%NaOH水溶液に室温で30分間浸漬し、染み込みや塗膜の溶け出し、さらにテープビールによる剥がれを確認した。判定基準は以下のとおりである。
○:染み込み、溶け出し、剥がれなし。
△:染み込み、溶け出し、もしくは剥がれが少し確認される。
×:染み込み、溶け出し、もしくは剥がれが大きく確認される。
<Alkali resistance>
The evaluation substrate was immersed in a 10 wt% NaOH aqueous solution at room temperature for 30 minutes, and soaking, dissolution of the coating film, and peeling by tape beer were confirmed. The judgment criteria are as follows.
○: No soaking, melting or peeling.
Δ: Slight penetration, dissolution or peeling is confirmed.
X: Significant infiltration, dissolution or peeling.
<電極腐食耐性(絶縁信頼性)>
銅箔基板に代えてライン/スペース=100/100μmのクシ型電極パターンを用い、上記の条件で評価基板を作製し、このクシ型電極を85℃、85%R.H.の加温加湿条件下でDC30Vのバイアス電圧を印加し、500時間後のデンドライトの発生度合いを評価した。判定基準は以下のとおりである。
○:デンドライトの発生が少ない。
×:デンドライトの発生が多い。
<Electrode corrosion resistance (insulation reliability)>
A comb-type electrode pattern of line / space = 100/100 μm was used in place of the copper foil substrate, and an evaluation substrate was produced under the above conditions. H. A bias voltage of DC 30 V was applied under the above heating and humidification conditions, and the degree of dendrite generation after 500 hours was evaluated. The judgment criteria are as follows.
○: Dendrite generation is small.
X: Many dendrites are generated.
<ドライフィルム作製>
実施例1、2及び比較例1のソルダーレジスト用感光性樹脂組成物をそれぞれメチルエチルケトンで適宜希釈した後、アプリケーターを用いて、乾燥後の膜厚が30μmになるようにPETフィルム(東レ製 FB−50:16μm)に塗布し、40〜100℃で乾燥させドライフィルムを得た。
<Dry film production>
After appropriately diluting each of the photosensitive resin compositions for solder resists of Examples 1 and 2 and Comparative Example 1 with methyl ethyl ketone, using an applicator, a PET film (Toray FB-) was prepared so that the film thickness after drying was 30 μm. 50:16 μm) and dried at 40 to 100 ° C. to obtain a dry film.
<基板作製>
回路形成された基板をバフ研磨した後、上記方法にて作製したドライフィルムを真空ラミネーター(名機製作所製 MVLP−500)を用いて加圧度:0.8MPa、70℃、1分、真空度:133.3Paの条件で加熱ラミネートして、未露光のソルダーレジスト層を有する基板(未露光の基板)を得た。得られた基板を前記評価方法と同様にして、最適露光量、現像性、解像性、はんだ耐熱性、金めっき耐性、耐アルカリ性の各試験を行った。
評価結果を表2に示す。
<Board fabrication>
After the circuit-formed substrate is buffed, the dry film produced by the above method is pressurized using a vacuum laminator (MVLP-500 manufactured by Meiki Seisakusho): 0.8 MPa, 70 ° C., 1 minute, vacuum degree The substrate (unexposed substrate) having an unexposed solder resist layer was obtained by heat lamination under the condition of 133.3 Pa. Each of the obtained substrates was tested in the same manner as in the above evaluation method for optimum exposure, developability, resolution, solder heat resistance, gold plating resistance, and alkali resistance.
The evaluation results are shown in Table 2.
上記表2に示される結果から明らかなように、本発明の1液型樹脂組成物は保存安定性に優れ、かつはんだ耐熱性、金めっき耐性、耐アルカリ性、電極腐食性に優れ、ソルダーレジストとして有用である。これに対して、熱硬化性成分を用いなかった比較例1の場合、保存安定性には問題なかったが、諸特性において満足できるものではなかった。一方、熱硬化性成分として植物由来エポキシ化合物ではない汎用されているエポキシ樹脂を用いた比較例2、3の場合、諸特性には問題なかったが、保存安定性において著しく劣っていた。 As is clear from the results shown in Table 2 above, the one-component resin composition of the present invention is excellent in storage stability, excellent in solder heat resistance, gold plating resistance, alkali resistance, and electrode corrosion resistance, and as a solder resist. Useful. On the other hand, in the case of Comparative Example 1 in which no thermosetting component was used, there was no problem in storage stability, but the characteristics were not satisfactory. On the other hand, in Comparative Examples 2 and 3 using a general-purpose epoxy resin that is not a plant-derived epoxy compound as a thermosetting component, there were no problems in various characteristics, but the storage stability was remarkably inferior.
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