JP2012198757A - Heat detector - Google Patents

Heat detector Download PDF

Info

Publication number
JP2012198757A
JP2012198757A JP2011062316A JP2011062316A JP2012198757A JP 2012198757 A JP2012198757 A JP 2012198757A JP 2011062316 A JP2011062316 A JP 2011062316A JP 2011062316 A JP2011062316 A JP 2011062316A JP 2012198757 A JP2012198757 A JP 2012198757A
Authority
JP
Japan
Prior art keywords
circuit board
housing case
sensor
hole
temperature detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011062316A
Other languages
Japanese (ja)
Other versions
JP5738026B2 (en
Inventor
Toshiyuki Tomita
寿幸 冨田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nohmi Bosai Ltd
Original Assignee
Nohmi Bosai Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nohmi Bosai Ltd filed Critical Nohmi Bosai Ltd
Priority to JP2011062316A priority Critical patent/JP5738026B2/en
Publication of JP2012198757A publication Critical patent/JP2012198757A/en
Application granted granted Critical
Publication of JP5738026B2 publication Critical patent/JP5738026B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Fire-Detection Mechanisms (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a waterproof type heat detector which can be assembled without needing to seal, for example, a through-hole for insertion of a temperature detection element of a detector body and the like by an adhesive, etc. and without waiting for an adhesive drying time in a heat detector assembly process.SOLUTION: A heat detector 1 comprises: a circuit substrate 3 on which a temperature detection element 9 is erected; a circuit substrate housing case 7 of a bottomed frame body shape having an opening for housing the circuit substrate 3; and a detector body 13 having a through-hole 11 through which the temperature detection element 9 erected on the circuit substrate 3 can pass and a locking piece which serves as case fixing means for fixing the circuit substrate housing case 7. The circuit substrate 3 is housed in the circuit substrate housing case 7 such that the temperature detection element 9 projects from the opening 5 and the housing case is filled with a filler, with the temperature detection element 9 being made to insert into the through-hole 11. The circuit substrate housing case 7 is thus fixed to the detector body 13 by the locking piece.

Description

本発明は、サーミスタ等の温度検出素子により火災を検出する熱感知器に関し、特に防水型の熱感知器に関する。   The present invention relates to a heat sensor that detects a fire with a temperature detection element such as a thermistor, and more particularly to a waterproof heat sensor.

熱感知器は、円形の有底枠体からなる本体の内部に回路基板を設置し、検知部として例えば温度を検知するサーミスタを本体の底部から外方に突出させている。そして、サーミスタを保護するためのプロテクタなどがサーミスタを囲うように設置されている。
熱感知器は湿度の高い場所に設置される場合がある。このような場合、回路基板が湿度の影響を受けないようにする必要があり、そのための防水構造が提案されている。 In the heat detector, a circuit board is installed inside a main body composed of a circular bottomed frame, and a thermistor that detects, for example, temperature is projected outward from the bottom of the main body as a detection unit. A protector or the like for protecting the thermistor is installed so as to surround the thermistor.
The heat sensor may be installed in a humid place. In such a case, it is necessary to prevent the circuit board from being affected by humidity, and a waterproof structure has been proposed.

例えば、特許文献１には、「外部に引き出されるリード線が接続された回路基板を配設した回路収納部に充填物としてウレタン樹脂を充填し、更にウレタン樹脂の上面全面に防水性または耐酸・耐アルカリ性の樹脂をコーティングしたことを特徴とする火災感知器。」（特許文献１の請求項１参照）が提案されている。
特許文献１に記載された火災感知器における防水構造を以下詳細に説明する。
感知器本体は、その底部が区画されて回路収納部が形成され、この回路収納部に回路基板が配設され、回路基板にはサーミスタが下向きに接続されている。サーミスタは感知器本体の底部に設けられた貫通孔に挿通されて、感知器本体から突出している。突出したサーミスタを保護するために、感知器本体の底部の外面にはサーミスタを囲うようにプロテクタ（外カバー）が設置されている。
回路基板にはサーミスタによる検出温度が所定温度を超えたときに火災検出信号を送出する感知器回路が実装されている。この信号を送出するために、回路収納部に配置した回路基板から天井面側となる外部にリード線が引き出されている。
上記のように、外部に引き出されるリード線およびサーミスタを接続した回路基板が配設された回路収納部には、防水のために充填物としてウレタン樹脂を充填している。 For example, Patent Document 1 states that “a circuit housing portion in which a circuit board connected to an external lead wire is connected is filled with urethane resin as a filler, and the entire upper surface of the urethane resin is waterproof or acid-resistant. A fire detector characterized in that it is coated with an alkali-resistant resin "(see claim 1 of Patent Document 1) has been proposed.
The waterproof structure in the fire detector described in Patent Document 1 will be described in detail below.
The bottom of the sensor body is partitioned to form a circuit housing portion. A circuit board is disposed in the circuit housing portion, and a thermistor is connected downward to the circuit board. The thermistor is inserted through a through hole provided in the bottom of the sensor body and protrudes from the sensor body. In order to protect the protruding thermistor, a protector (outer cover) is installed on the outer surface of the bottom of the sensor body so as to surround the thermistor.
A sensor circuit for sending a fire detection signal when the temperature detected by the thermistor exceeds a predetermined temperature is mounted on the circuit board. In order to send out this signal, a lead wire is drawn out from the circuit board disposed in the circuit housing portion to the outside on the ceiling surface side.
As described above, the circuit housing portion in which the circuit board to which the lead wire and the thermistor drawn out are connected is disposed is filled with urethane resin as a filler for waterproofing.

特開２００１−３２５６７４号公報Japanese Patent Laid-Open No. 2001-325684

上記のように構成された防水型の熱感知器（火災感知器）においては、上述のように、本体部の底部の内面側に回路基板を設置する区画を形成し、その区画に回路基板を設置して、その後でその区画内に充填物を充填して回路基板を充填物で覆うことで防水構造を実現している。
このような防水構造を実現するための工程は、回路基板を設置した後で充填物を区画に充填することになる。この場合、充填物は充填時においては、粘性が小さいために、サーミスタが挿通された貫通孔とサーミスタとの隙間から充填物が漏れる。そのため、サーミスタを挿通した後で、例えば、接着材を隙間に充填して乾燥させて前記隙間を埋めるといった処置が必要となる。
しかしながら、そのような処置をするには手間と時間を要し、製造工程の流れを阻害することになる。 In the waterproof heat sensor (fire detector) configured as described above, as described above, a section for installing the circuit board is formed on the inner surface side of the bottom of the main body, and the circuit board is placed in the section. The waterproof structure is realized by installing and then filling the compartment with a filler and covering the circuit board with the filler.
The process for realizing such a waterproof structure is to fill the compartment with a filling material after the circuit board is installed. In this case, since the viscosity of the filling material is small at the time of filling, the filling material leaks from the gap between the through hole through which the thermistor is inserted and the thermistor. For this reason, after the thermistor is inserted, for example, it is necessary to fill the gap by filling the gap with an adhesive and drying it.
However, it takes time and effort to perform such a treatment, which obstructs the flow of the manufacturing process.

また、熱感知器が多湿な環境に設置されると、感知器本体内に水が溜まることがあるため、溜まった水を抜くために水抜き穴を設けるのが一般的である。
この点、従来の構造では、回路基板を設置する区画の外側（周囲）に水抜き穴を設けなければならないが、その場合、本体部の底部の中央には回路基板が設置される区画が存在するため、水抜き穴は当該区画を挟むように当該区画の両側に設けなければならない。 Further, when the heat sensor is installed in a humid environment, water may accumulate in the sensor main body, and therefore, a water drain hole is generally provided to drain the accumulated water.
In this regard, in the conventional structure, it is necessary to provide a drain hole on the outside (periphery) of the section where the circuit board is installed. In that case, there is a section where the circuit board is installed at the center of the bottom of the main body. Therefore, the drain holes must be provided on both sides of the section so as to sandwich the section.

また、サーミスタを保護するためのプロテクタは通常は着脱可能に設置されるため、本体部の底部の外面にプロテクタを設置するための係合部を設ける必要がある。その場合、係合部が貫通孔となると充填物の充填時に充填物が漏れるので、係合部を充填物が漏れないような特殊な形状にする必要がある。そのため、本体部を成型するための金型が複雑になり、本体部成型も手間がかかりコストアップとなる。   Moreover, since the protector for protecting the thermistor is normally installed so that attachment or detachment is possible, it is necessary to provide the engaging part for installing a protector in the outer surface of the bottom part of a main-body part. In that case, if the engaging portion becomes a through hole, the filling material leaks when the filling material is filled. Therefore, it is necessary to make the engaging portion have a special shape so that the filling material does not leak. For this reason, a mold for molding the main body becomes complicated, and the molding of the main body also takes time and increases the cost.

また、リード線が感知器本体の開口側、すなわち通常は天井面側に向かって充填物の表面から引き出されるため、このリード線を伝わって水滴が充填物の内部に侵入する可能性がある。特に、リード線は感知器の取り付け時において、捩じったり、引っ張ったりされるので、充填物との間に隙間や亀裂が生じやすくなり、水滴が充填物の中まで浸入する危険がある。
また、充填物を充填した後の表面には、型名や製造日等が表示された銘板シールを貼り付けるのが一般である。これは、充填物の表面には加工ができないので、シールを貼りつけるしか方法がないためである。しかし、シールを貼りつける工数が必要となり、作業工数が増えるという問題がある。 In addition, since the lead wire is pulled out from the surface of the filling toward the opening side of the sensor body, that is, usually to the ceiling surface side, there is a possibility that water droplets may enter the inside of the filling through the lead wire. In particular, since the lead wire is twisted or pulled when the sensor is attached, there is a risk that a gap or a crack is easily formed between the lead wire and the water droplets may penetrate into the fill material.
Moreover, it is common to stick the nameplate seal | sticker on which the model name, the manufacture date, etc. were displayed on the surface after filling with a filler. This is because the surface of the filling cannot be processed, and there is only a method of sticking a seal. However, there is a problem that the number of man-hours for attaching the seal is required and the number of man-hours increases.

以上のように、従来の火災感知器には種々の問題が残されていた。本発明は、上記のような課題を解決するためになされたものである。   As described above, various problems remain in the conventional fire detector. The present invention has been made to solve the above-described problems.

（１）本発明に係る熱感知器は、温度検出素子が立設された回路基板と、該回路基板を収容する開口部を有する有底枠体状の回路基板収容ケースと、前記回路基板に立設された温度検出素子が挿通可能な貫通孔と前記回路基板収容ケースを固定するためのケース固定手段を有する感知器本体とを備え、前記開口部から前記温度検出素子が突出するように前記回路基板を収容して充填物を充填した前記回路基板収容ケースを、前記貫通孔に前記温度素子を挿通させて、前記感知器本体に前記ケース固定手段で固定してなることを特徴とするものである。 (1) A heat detector according to the present invention includes a circuit board on which a temperature detection element is erected, a bottomed frame-like circuit board housing case having an opening for housing the circuit board, and the circuit board. A through hole through which the temperature detecting element that is erected can be inserted and a sensor body having a case fixing means for fixing the circuit board housing case, and the temperature detecting element protrudes from the opening. The circuit board housing case containing a circuit board and filled with a filling material is fixed to the sensor body by the case fixing means by inserting the temperature element into the through hole. It is.

（２）また、上記（１）に記載のものにおいて、前記回路基板は表示灯を有し、前記感知器本体は前記表示灯を突出させるか又は前記表示灯の光を感知器本体の外部から視認可能するための表示孔を備えたことを特徴とするものである。 (2) Further, in the above-described (1), the circuit board has an indicator lamp, and the sensor body projects the indicator lamp or the light of the indicator lamp is externally supplied from the sensor body. A display hole for enabling visual recognition is provided.

（３）また、上記（１）又は（２）に記載のものにおいて、前記回路基板は該回路基板に接続されたリード線が前記開口部側から引き出されるように前記回路基板収容ケースに設置されてなり、前記回路基板収容ケースは前記開口部が下向き又は横向きになるように前記感知器本体に固定されていることを特徴とするものである。 (3) Further, in the above (1) or (2), the circuit board is installed in the circuit board housing case so that the lead wire connected to the circuit board is drawn out from the opening side. The circuit board housing case is fixed to the sensor body so that the opening is directed downward or sideways.

（４）また、上記（１）乃至（３）のいずれかに記載のものにおいて、前記回路基板収容ケースにおける底部の外面側に、少なくとも機器名が刻印されていることを特徴とするものである。なお、機器名の他にロット番号、製造番号等を刻印してもよい。 (4) Further, in any of the above (1) to (3), at least a device name is engraved on the outer surface side of the bottom of the circuit board housing case. . In addition to the device name, a lot number, a manufacturing number, or the like may be engraved.

本発明においては、回路基板を収容する回路基板収容ケースを感知器本体とは別体にして、回路基板の防水のための充填物を予め回路基板収容ケースに充填できるようにしたので、熱感知器の組み立て工程において、感知器本体の例えば温度検出素子を挿入する貫通孔などを接着材などで塞ぐ必要がなく、接着材が硬化するための時間を待つ必要がなく、熱感知器の組み立てを円滑にすることができ生産性に優れる。   In the present invention, the circuit board housing case for housing the circuit board is separated from the main body of the sensor so that the circuit board housing case can be filled in advance with a filling material for waterproofing the circuit board. In the assembly process of the sensor, it is not necessary to close the through hole into which the temperature detection element is inserted in the sensor body with an adhesive or the like, and it is not necessary to wait for the adhesive to harden. Smooth and excellent productivity.

本発明の実施の形態に係る熱感知器の分解斜視図である。It is a disassembled perspective view of the heat sensor which concerns on embodiment of this invention. 本発明の実施の形態に係る回路基板収容ケースと回路基板を示す斜視図である。It is a perspective view which shows the circuit board storage case and circuit board which concern on embodiment of this invention. 本発明の実施の形態に係る回路基板収容ケースに回路基板を収容した状態を示す斜視図である。It is a perspective view which shows the state which accommodated the circuit board in the circuit board accommodation case which concerns on embodiment of this invention. 本発明の実施の形態に係る回路基板収容ケースに回路基板を収容して充填物を充填した状態を示す斜視図である。It is a perspective view which shows the state which accommodated the circuit board in the circuit board accommodation case which concerns on embodiment of this invention, and was filled with the filler. 本発明の実施の形態に係る回路基板収容ケースを感知器本体に設置するときの配置関係を説明する説明図である。It is explanatory drawing explaining the arrangement | positioning relationship when installing the circuit board accommodation case which concerns on embodiment of this invention in a sensor main body. 本発明の実施の形態に係る感知器本体の内部を説明する説明図である。It is explanatory drawing explaining the inside of the sensor main body which concerns on embodiment of this invention.

本実施の形態に係る熱感知器１は、温度検出素子９が立設された回路基板３と、回路基板３を収容する開口部５を有する有底枠体状の回路基板収容ケース７と、回路基板３に立設された温度検出素子９が挿通可能な貫通孔１１と回路基板収容ケース７を固定するためのケース固定手段としての係止片２７（図５、図６参照）を有する感知器本体１３とを備え、開口部５から温度検出素子９が突出するように回路基板３を収容した状態において充填物１５で充填された前記回路基板収容ケース７を、貫通孔１１に温度検出素子９を挿通させて、感知器本体１３にケース固定手段（係止片２７）で固定してなるものである。
以下、各部をより詳細に説明する。 The heat sensor 1 according to the present embodiment includes a circuit board 3 on which a temperature detection element 9 is erected, a circuit board housing case 7 having a bottomed frame shape having an opening 5 for housing the circuit board 3, and Sensing having a through hole 11 through which the temperature detecting element 9 erected on the circuit board 3 can be inserted and a locking piece 27 (see FIGS. 5 and 6) as case fixing means for fixing the circuit board housing case 7. The circuit board housing case 7 filled with the filler 15 in a state in which the circuit board 3 is housed so that the temperature detecting element 9 protrudes from the opening 5 is provided in the through hole 11 with the temperature detecting element. 9 is inserted and fixed to the sensor body 13 by case fixing means (locking pieces 27).
Hereinafter, each part will be described in more detail.

＜回路基板＞
回路基板３は、略矩形状に形成された基板本体１７と、基板本体１７に立設された温度検出素子９と、基板本体１７における温度検出素子９が立設された面と同じ面に設置された表示灯１９と、基板本体１７に接続されたリード線２１とを備えている（図１〜図３参照）。
ここで表示灯１９は砲弾型レンズのＬＥＤであっても良いし、基板３の表面に実装された表面実装のＬＥＤとその光を誘導するライトガイドとの組合せでも良いし、その他のものとすることもできる。 <Circuit board>
The circuit board 3 is installed on the same surface as the substrate body 17 formed in a substantially rectangular shape, the temperature detection element 9 standing on the substrate body 17, and the surface of the substrate body 17 on which the temperature detection element 9 is erected. And a lead wire 21 connected to the substrate body 17 (see FIGS. 1 to 3).
Here, the indicator lamp 19 may be a bullet-type lens LED, a combination of a surface-mounted LED mounted on the surface of the substrate 3 and a light guide for guiding the light, or the like. You can also.

＜回路基板収容ケース＞
回路基板収容ケース７は、略矩形の有底枠体状をしており、一つの面が開口部５となっている（図１〜図３参照）。回路基板収容ケース７の内側側面の底部近くにはフック２３が設けられており、基板本体１７を収容した際に基板本体１７の周縁部に係止して回路基板３を固定する。
また、回路基板収容ケース７の開口側の周壁部には係止部２５が設けられており、この係止部２５が感知器本体１３に設けられた係止片２７に係止することによって、回路基板収容ケース７が感知器本体１３に固定される。
また、回路基板収容ケース７における開口側の周端部における一辺には回路基板３に接続されたリード線２１が挿入される溝部２９が複数設けられている。
また、回路基板収容ケース７における底部の外面側（図５参照）、機器名、ロット番号、製造番号等が刻印されている。但し、刻印は図示していない。 <Circuit board housing case>
The circuit board housing case 7 has a substantially rectangular bottomed frame shape, and one surface serves as an opening 5 (see FIGS. 1 to 3). A hook 23 is provided near the bottom of the inner side surface of the circuit board housing case 7, and when the board body 17 is housed, the circuit board 3 is fixed by being locked to the peripheral edge of the board body 17.
Further, a locking portion 25 is provided on the peripheral wall portion on the opening side of the circuit board housing case 7, and the locking portion 25 is locked to a locking piece 27 provided on the sensor main body 13, whereby The circuit board housing case 7 is fixed to the sensor body 13.
Further, a plurality of groove portions 29 into which the lead wires 21 connected to the circuit board 3 are inserted are provided on one side of the peripheral end portion on the opening side of the circuit board housing case 7.
In addition, an outer surface side of the bottom of the circuit board housing case 7 (see FIG. 5), a device name, a lot number, a manufacturing number, and the like are engraved. However, the stamp is not shown.

＜感知器本体＞
感知器本体１３は、円形の有底枠体状をしており、中央部には回路基板３に立設された温度検出素子９が挿通可能な貫通孔１１が設けられている。貫通孔１１は感知器本体１３の内部に溜まる水を抜くための水抜き穴としても機能する。
また、感知器本体１３の内面側には、回路基板収容ケース７に設けられた係止部２５が係止する係止片２７が立設されている。この係止片２７が本発明の固定手段に相当する。 <Sensor body>
The sensor body 13 has a circular bottomed frame shape, and a through hole 11 into which the temperature detection element 9 standing on the circuit board 3 can be inserted is provided at the center. The through hole 11 also functions as a water drain hole for draining water accumulated in the sensor body 13.
Further, on the inner surface side of the sensor main body 13, a locking piece 27 that is locked by a locking portion 25 provided in the circuit board housing case 7 is erected. This locking piece 27 corresponds to the fixing means of the present invention.

また、感知器本体１３の外面側には、温度検出素子９を外的衝撃から保護するためのプロテクタ３３が取り付けられている。プロテクタ３３は、その周縁部に設けられた係止爪３５が感知器本体１３に形成された係止穴３７に係止することで、感知器本体１３に取り付けられる。このように本実施の形態では、プロテクタ３３を取り付けるための取付構造として、感知器本体１３側には単なる開口からなる係止穴３７を設けることで対応できる。これは、回路基板３を収容する回路基板収容ケース７を感知器本体１３とは別体にしたので、回路基板３の防水のための充填物１５を感知器本体１３側に充填する必要がないことによる。従来例のように感知器本体１３側に充填物１５を充填する場合には、充填時において充填物１５が漏れないようなプロテクタ３３の係止爪３５が係合する袋状の凹部を設ける等の複雑な構造にしなければならないことに比較して、単純な構造にできるので感知器本体１３を成型するための金型が複雑にならず、また感知器本体１３の成型が容易であるためコストの低減につながる。
また、係止穴３７は感知器本体１３内に溜まる水を抜くための水抜き穴としても機能するので、別途水抜き穴を設ける必要がなくなる。 A protector 33 for protecting the temperature detection element 9 from external impact is attached to the outer surface side of the sensor body 13. The protector 33 is attached to the sensor main body 13 by the locking claws 35 provided on the peripheral edge of the protector 33 being locked to the locking holes 37 formed in the sensor main body 13. Thus, in the present embodiment, the mounting structure for mounting the protector 33 can be dealt with by providing the locking hole 37 formed of a simple opening on the sensor body 13 side. This is because the circuit board housing case 7 for housing the circuit board 3 is separated from the sensor main body 13, so that it is not necessary to fill the sensor main body 13 with a filling 15 for waterproofing the circuit board 3. It depends. When the filler 15 is filled on the sensor body 13 side as in the conventional example, a bag-like recess for engaging the locking claw 35 of the protector 33 is provided so that the filler 15 does not leak during filling. Compared to the complicated structure, the mold for molding the sensor main body 13 is not complicated and the sensor main body 13 can be easily molded. Leading to a reduction in
Further, the locking hole 37 also functions as a drain hole for draining the water accumulated in the sensor body 13, so that it is not necessary to provide a separate drain hole.

また、感知器本体１３の下面側には、表示灯を外部から視認するための表示孔３９が設けられている。このような表示孔３９を設けた場合、従来例であれば、充填物の充填時に充填物が漏れないようにするため、表示孔３９を塞ぐための透光性カバーである窓部材が必要になるが、本実施の形態ではそのようなものが不要である。
また、感知器本体１３には、熱感知器１を天井や壁に取り付けるためのネジが挿通可能な取付穴４０が設けられている。 A display hole 39 for visually recognizing the indicator lamp from the outside is provided on the lower surface side of the sensor body 13. When such display holes 39 are provided, in the case of the conventional example, in order to prevent the filler from leaking when the filler is filled, a window member that is a light-transmitting cover for closing the display holes 39 is required. However, this is not necessary in the present embodiment.
The sensor body 13 is provided with an attachment hole 40 through which a screw for attaching the heat sensor 1 to the ceiling or wall can be inserted.

上記のように構成された本実施の形態の熱感知器１の組み立て方法を説明する。
図２に示すように、回路基板３を温度検出素子９が回路基板収容ケース７の開口部５から突出するように配置して、図３に示すように、回路基板３を回路基板収容ケース７の底部にフック２３で固定する。そして、回路基板３に接続されたリード線２１を回路基板収容ケース７の開口部５から引き出し、回路基板収容ケース７に形成された溝部２９に挿入する（図３参照）。
この状態で、回路基板収容ケース７内に回路基板３の防水のための充填物１５を充填する（図４参照）。充填物１５を充填した状態では、図４に示すように、温度検出素子９の端部と表示灯１９の端部が充填物１５から突出している。
充填物１５は、充填当初は粘度が低く時間とともに粘度が高くなるポリウレタン等である。 A method of assembling the heat sensor 1 of the present embodiment configured as described above will be described.
As shown in FIG. 2, the circuit board 3 is arranged so that the temperature detecting element 9 protrudes from the opening 5 of the circuit board housing case 7, and the circuit board 3 is placed in the circuit board housing case 7 as shown in FIG. It is fixed to the bottom of the hook with a hook 23. Then, the lead wire 21 connected to the circuit board 3 is pulled out from the opening 5 of the circuit board housing case 7 and inserted into the groove 29 formed in the circuit board housing case 7 (see FIG. 3).
In this state, the circuit board housing case 7 is filled with a filling 15 for waterproofing the circuit board 3 (see FIG. 4). In the state in which the filler 15 is filled, as shown in FIG. 4, the end of the temperature detection element 9 and the end of the indicator lamp 19 protrude from the filler 15.
The filling 15 is a polyurethane or the like whose viscosity is low at the beginning of filling and whose viscosity increases with time.

次に、充填物１５の粘度が高くなった後に、回路基板３が設置されると共に充填物１５が充填された回路基板収容ケース７を、その開口側が感知器本体１３の底面に対向するように配置し、温度検出素子９を感知器本体１３の貫通孔１１に挿通し、回路基板収容ケース７の係止部２５を感知器本体１３に設けられた係止片２７に係止させることで回路基板収容ケース７を感知器本体１３に固定する（図５参照）。なお、図５においては、係止部２５が係止片２７に係止する前の状態、つまり回路基板収容ケース７が感知器本体１３に対して固定状態よりも少し浮いた状態を示している。   Next, after the viscosity of the filling 15 is increased, the circuit board housing case 7 in which the circuit board 3 is installed and filled with the filling 15 is placed so that the opening side thereof faces the bottom surface of the sensor body 13. The temperature detecting element 9 is inserted into the through hole 11 of the sensor main body 13, and the locking portion 25 of the circuit board housing case 7 is locked to the locking piece 27 provided on the sensor main body 13. The substrate housing case 7 is fixed to the sensor body 13 (see FIG. 5). 5 shows a state before the locking portion 25 is locked to the locking piece 27, that is, a state where the circuit board housing case 7 is slightly lifted with respect to the sensor body 13 from the fixed state. .

上記のように組み立てられた熱感知器１は、温度検出素子９が下向きまたは横向きになるように天井面又は壁面に設置される。この設置状態では、回路基板収容ケース７の開口部５が下向き又は横向きになり、それ故にリード線２１が開口部５に充填された充填物１５の開口部５側である上面に対して反対方向又は横方向に向かって引き出されることになる。そのため、リード線２１を伝わる水滴が充填物１５の上面に到達し難くなっている。これにより、熱感知器１の設置時においてリード線２１を引っ張ったり、折り曲げたりして仮に充填物１５とリード線２１との間に亀裂や隙間が生じてもリード線２１を伝わる水滴が充填物１５の内部に浸入することはなく、防水状態が維持される。   The heat sensor 1 assembled as described above is installed on a ceiling surface or a wall surface so that the temperature detection element 9 faces downward or sideways. In this installed state, the opening 5 of the circuit board housing case 7 faces downward or sideways, and therefore, the lead wire 21 is opposite to the upper surface on the opening 5 side of the filling 15 filled in the opening 5. Or it will be pulled out in the lateral direction. Therefore, it is difficult for water droplets transmitted through the lead wire 21 to reach the upper surface of the filler 15. Accordingly, even when the lead wire 21 is pulled or bent when the heat sensor 1 is installed, even if a crack or a gap occurs between the filling material 15 and the lead wire 21, water droplets transmitted through the lead wire 21 are filled. The inside of 15 does not penetrate | invade and a waterproof state is maintained.

上記のように構成された本実施の形態の熱感知器１は、上述の構成の説明において示した効果に加えて以下のような種々の効果を奏する。
本実施の形態においては、回路基板３を収容する回路基板収容ケース７を感知器本体１３とは別体にして、回路基板３の防水のための充填物１５を予め回路基板収容ケース７に充填するようにしたので、熱感知器の組み立て工程において、感知器本体１３の例えば温度検出素子９を挿入する貫通孔１１などを接着材などで塞ぐ必要がなく、接着材が硬化するための時間を待つ必要がない。そのため、熱感知器１の組み立てを円滑にすることができる。 The heat sensor 1 of the present embodiment configured as described above has the following various effects in addition to the effects shown in the description of the above-described configuration.
In the present embodiment, the circuit board housing case 7 for housing the circuit board 3 is separated from the sensor main body 13 and the circuit board housing case 7 is previously filled with a filling 15 for waterproofing the circuit board 3. Thus, in the assembly process of the heat sensor, it is not necessary to close the through hole 11 into which the temperature detection element 9 is inserted in the sensor body 13 with an adhesive or the like, and the time required for the adhesive to harden is increased. There is no need to wait. Therefore, the assembly of the heat sensor 1 can be made smooth.

また、本実施の形態においては、充填物１５を感知器本体１３側に充填しないので、温度検出素子９を貫通孔１１に挿通した際に温度検出素子９と貫通孔１１との間に隙間が生じてもよく、逆にこの隙間が水抜き穴として機能するので、別途水抜き穴を設ける必要もなくなる。
また、本実施の形態においては、回路基板収容ケース７の底部の外面側に機器名、ロット番号、製造番号等を刻印することができるので、従来のように充填物１５の表面に機器名、ロット番号、製造番号等を記載したシールを貼るような作業が不要となる。 In the present embodiment, since the filling 15 is not filled on the sensor body 13 side, there is a gap between the temperature detection element 9 and the through hole 11 when the temperature detection element 9 is inserted into the through hole 11. On the contrary, since this gap functions as a drain hole, it is not necessary to provide a drain hole separately.
In the present embodiment, since the device name, lot number, manufacturing number, etc. can be engraved on the outer surface side of the bottom of the circuit board housing case 7, the device name on the surface of the filling 15 as in the prior art, There is no need to apply a sticker on which a lot number, a production number, etc. are written.

１ 熱感知器
３ 回路基板
５ 開口部
７ 回路基板収容ケース
９ 温度検出素子
１１ 貫通孔
１３ 感知器本体
１５ 充填物
１７ 基板本体
１９ 表示灯
２１ リード線
２３ フック
２５ 係止部
２７ 係止片
２９ 溝部
３３ プロテクタ
３５ 係止爪
３７ 係止穴 DESCRIPTION OF SYMBOLS 1 Heat detector 3 Circuit board 5 Opening part 7 Circuit board accommodation case 9 Temperature detection element 11 Through-hole 13 Sensor main body 15 Filling material 17 Substrate main body 19 Indicator lamp 21 Lead wire 23 Hook 25 Locking part 27 Locking piece 29 Groove part 33 Protector 35 Locking claw 37 Locking hole

Claims (4)

温度検出素子が立設された回路基板と、該回路基板を収容する開口部を有する有底枠体状の回路基板収容ケースと、前記回路基板に立設された温度検出素子が挿通可能な貫通孔と前記回路基板収容ケースを固定するためのケース固定手段を有する感知器本体とを備え、前記開口部から前記温度検出素子が突出するように前記回路基板を収容して充填物を充填した前記回路基板収容ケースを、前記貫通孔に前記温度素子を挿通させて、前記感知器本体に前記ケース固定手段で固定してなることを特徴とする熱感知器。   A circuit board on which a temperature detection element is erected, a bottomed frame-like circuit board housing case having an opening for accommodating the circuit board, and a penetration through which the temperature detection element erected on the circuit board can be inserted A sensor main body having a case fixing means for fixing the hole and the circuit board housing case, the circuit board is housed and filled with a filler so that the temperature detecting element protrudes from the opening. A thermal sensor, wherein a circuit board housing case is inserted into the through-hole and the temperature element is inserted into the sensor body and fixed to the sensor body by the case fixing means. 前記回路基板は表示灯を有し、前記感知器本体は前記表示灯を突出させるか又は前記表示灯の光を感知器本体の外部から視認可能するための表示孔を備えたことを特徴とする請求項１記載の熱感知器。   The circuit board includes an indicator lamp, and the sensor body includes a display hole for projecting the indicator lamp or making the light of the indicator lamp visible from the outside of the sensor body. The heat sensor according to claim 1. 前記回路基板は該回路基板に接続されたリード線が前記開口部側から引き出されるように前記回路基板収容ケースに設置されてなり、前記回路基板収容ケースは前記開口部が下向き又は横向きになるように前記感知器本体に固定されていることを特徴とする請求項１又は２記載の熱感知器。   The circuit board is installed in the circuit board housing case so that a lead wire connected to the circuit board is drawn out from the opening side, and the circuit board housing case has the opening portion facing downward or sideways. The heat sensor according to claim 1, wherein the heat sensor is fixed to the sensor body. 前記回路基板収容ケースにおける底部の外面側に、少なくとも機器名が刻印されていることを特徴とする請求項１乃至３のいずれか一項に記載の熱感知器。   4. The heat sensor according to claim 1, wherein at least a device name is stamped on an outer surface side of a bottom portion of the circuit board housing case. 5.
JP2011062316A 2011-03-22 2011-03-22 Heat sensor Active JP5738026B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011062316A JP5738026B2 (en) 2011-03-22 2011-03-22 Heat sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011062316A JP5738026B2 (en) 2011-03-22 2011-03-22 Heat sensor

Publications (2)

Publication Number Publication Date
JP2012198757A true JP2012198757A (en) 2012-10-18
JP5738026B2 JP5738026B2 (en) 2015-06-17

Family

ID=47180908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011062316A Active JP5738026B2 (en) 2011-03-22 2011-03-22 Heat sensor

Country Status (1)

Country Link
JP (1) JP5738026B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014170495A (en) * 2013-03-05 2014-09-18 Nohmi Bosai Ltd Sensor adapter
WO2019189128A1 (en) 2018-03-28 2019-10-03 ホーチキ株式会社 Fire detection device
CN111564359A (en) * 2020-05-14 2020-08-21 中国科学院高能物理研究所 Waterproof packaging device and packaging method
WO2022091347A1 (en) 2020-10-30 2022-05-05 ホーチキ株式会社 Disaster prevention device
WO2022091345A1 (en) 2020-10-30 2022-05-05 ホーチキ株式会社 Disaster prevention apparatus
WO2022091346A1 (en) 2020-10-30 2022-05-05 ホーチキ株式会社 Disaster prevention apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6446892U (en) * 1987-09-14 1989-03-23
JPH11238184A (en) * 1998-02-23 1999-08-31 Matsushita Electric Works Ltd Fire sensor
JP2002016369A (en) * 2000-06-27 2002-01-18 Matsushita Electric Works Ltd Printed board housing box
JP2004046384A (en) * 2002-07-10 2004-02-12 Nohmi Bosai Ltd Fire sensor
JP2006296581A (en) * 2005-04-18 2006-11-02 Samii Kk Board case for game machine and game machine equipped with the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6446892U (en) * 1987-09-14 1989-03-23
JPH11238184A (en) * 1998-02-23 1999-08-31 Matsushita Electric Works Ltd Fire sensor
JP2002016369A (en) * 2000-06-27 2002-01-18 Matsushita Electric Works Ltd Printed board housing box
JP2004046384A (en) * 2002-07-10 2004-02-12 Nohmi Bosai Ltd Fire sensor
JP2006296581A (en) * 2005-04-18 2006-11-02 Samii Kk Board case for game machine and game machine equipped with the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014170495A (en) * 2013-03-05 2014-09-18 Nohmi Bosai Ltd Sensor adapter
WO2019189128A1 (en) 2018-03-28 2019-10-03 ホーチキ株式会社 Fire detection device
US11975228B2 (en) 2018-03-28 2024-05-07 Hochiki Corporation Fire detection apparatus
CN111564359A (en) * 2020-05-14 2020-08-21 中国科学院高能物理研究所 Waterproof packaging device and packaging method
CN111564359B (en) * 2020-05-14 2021-11-26 中国科学院高能物理研究所 Waterproof packaging device and packaging method
WO2022091347A1 (en) 2020-10-30 2022-05-05 ホーチキ株式会社 Disaster prevention device
WO2022091345A1 (en) 2020-10-30 2022-05-05 ホーチキ株式会社 Disaster prevention apparatus
WO2022091346A1 (en) 2020-10-30 2022-05-05 ホーチキ株式会社 Disaster prevention apparatus

Also Published As

Publication number Publication date
JP5738026B2 (en) 2015-06-17

Similar Documents

Publication Publication Date Title
JP5738026B2 (en) Heat sensor
JP5940217B2 (en) Sealed LED light source module
EP3104365B1 (en) Display device
US8973437B2 (en) Condensate sensing device
JP4743158B2 (en) Waterproof ventilation case device
KR101439501B1 (en) Housing of an electronic water meter
JP2001255175A (en) Instrumental device
US9741214B2 (en) Indication apparatus
JP5912646B2 (en) Drip-proof structure of case, portable case for temperature measuring instrument, and drip-proof method of case
JP6349189B2 (en) Photoelectric sensor
EP2480059B1 (en) Improvements in or relating to the production of an electronic unit, such as a sensor unit for a motor vehicle safety device
KR101384786B1 (en) LED module
US7586749B2 (en) Protecting casing for transducer
JP2016031338A (en) Photoelectric sensor and method for manufacturing photoelectric sensor
KR200457580Y1 (en) Waterproof type LED lighting apparatus
JP6202262B2 (en) Air conditioner indoor unit
JP4416487B2 (en) Digital display and manufacturing method thereof
JP2010019590A (en) Diaphragm type gas meter
JP5021583B2 (en) Gas meter communication terminal device connection structure
JP5278745B2 (en) Instrument ventilation structure
JP5149214B2 (en) Gas meter
JP2024086000A (en) Sensor-based
JP2021181935A (en) Enclosure of watthour meter and assembling method for watthour meter
JP6214499B2 (en) Electronic water meter
JP2010060487A (en) Gas meter

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130711

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140121

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140122

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140318

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140805

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20141002

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150414

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150421

R150 Certificate of patent or registration of utility model

Ref document number: 5738026

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150