JP2012198108A - Ultrasonic sensor - Google Patents

Ultrasonic sensor Download PDF

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JP2012198108A
JP2012198108A JP2011062606A JP2011062606A JP2012198108A JP 2012198108 A JP2012198108 A JP 2012198108A JP 2011062606 A JP2011062606 A JP 2011062606A JP 2011062606 A JP2011062606 A JP 2011062606A JP 2012198108 A JP2012198108 A JP 2012198108A
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circuit board
housing
opening
circuit
ultrasonic sensor
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Koji Urase
浩司 浦瀬
Yasushi Nagano
康志 永野
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Panasonic Corp
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Panasonic Corp
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  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an ultrasonic sensor that is capable of ensuring waterproofness without increasing the number of components, suppressing an increase in weight and cost, and preventing occurrence of distortion in a circuit board.SOLUTION: An ultrasonic sensor comprises: a wave transmitting and receiving block 1 for housing a wave transmitting and receiving element for transmitting and receiving an ultrasonic wave; a circuit board 3 on which an electronic circuit for processing an ultrasonic signal transmitted and received via the wave transmitting and receiving element is mounted; a housing 4 in which an opening 41A is included and the wave transmitting and receiving block 1 is mounted; conduction means for electrically connecting the wave transmitting and receiving element and the electronic circuit on the circuit board 3 via an insertion opening 42 provided in the housing 4; and a sealing plate 6 for sealing the insertion opening 42. The opening 41A of the housing 4 is closed by the circuit board 3.

Description

本発明は、車両等に搭載されて障害物検知等に用いられる超音波センサに関する。   The present invention relates to an ultrasonic sensor that is mounted on a vehicle or the like and used for obstacle detection or the like.

従来から、図5に示すように、一面に開口を具備する中空状のハウジング101と、超音波の送受波が行われる送受波面がハウジング101の他面に露出する送受波素子(送受波ブロック)102とを備えた超音波センサが提供されている。この超音波センサは、ハウジング101内に収納されて送受波素子102を介して送受波される超音波信号を処理するための電子回路が実装される回路基板103と、送受波素子102と回路基板103とを電気的に接続する配線104とを備える。また、この超音波センサは、ハウジング101の開口を覆うように設けられる蓋部材105と、一端が回路基板103に溶接等により接続されて他端が図示しない給電端子に接続される端子106とを備える。   Conventionally, as shown in FIG. 5, a hollow housing 101 having an opening on one surface, and a transmission / reception element (transmission / reception block) in which a transmission / reception surface on which ultrasonic transmission / reception is performed is exposed on the other surface of the housing 101. 102 is provided. This ultrasonic sensor includes a circuit board 103 on which an electronic circuit for processing an ultrasonic signal received in the housing 101 and transmitted / received via the transmitting / receiving element 102 is mounted, and the transmitting / receiving element 102 and the circuit board. And a wiring 104 for electrically connecting the terminal 103 to the terminal 103. The ultrasonic sensor includes a lid member 105 provided so as to cover the opening of the housing 101, and a terminal 106 having one end connected to the circuit board 103 by welding or the like and the other end connected to a power supply terminal (not shown). Prepare.

そして、上記超音波センサが車両用として用いられる場合、当該超音波センサは、バンパーやフロントグリル等、水を被る可能性が高く且つ振動の激しい箇所に設置される。このため、従来多くの超音波センサでは、その回路基板103が収納されるハウジング101内に、疎水性及び弾力性を有するシリコンやウレタン等の充填材107が充填されている。このように充填材107をハウジング101内に充填することで、要求される高い防水性及び耐振性を確保する構成が一般的となっている(例えば、特許文献1参照)。   And when the said ultrasonic sensor is used for vehicles, the said ultrasonic sensor is installed in a location with high possibility of being covered with water, such as a bumper and a front grill, and intense vibration. For this reason, in many conventional ultrasonic sensors, the housing 101 in which the circuit board 103 is accommodated is filled with a filler 107 such as silicon or urethane having hydrophobicity and elasticity. Thus, the structure which ensures the high waterproof property and vibration resistance which are requested | required by filling the filler 107 in the housing 101 is common (for example, refer patent document 1).

特開2005−24351号公報JP 2005-24351 A

しかしながら、上記従来例では、充填材107をハウジング101内に充填することにより、その分重量及びコストが増加するのみならず、充填材107の存在によってハウジング101内に収納された回路基板103に歪みが生じる可能性がある。回路基板103に歪みが生じると、当該回路基板103上に実装された電子部品との間のはんだ付け部分に応力がかかり、亀裂が生じる虞がある。或いは、充填材107の充填の前後においてセンサの検知エリア特性が変化してしまうという虞もある。なお、回路基板103に歪みを生じさせる要因としては、例えば、充填材107の熱膨張及び収縮に伴う外部負荷がある。また、充填前後における検知エリア特性の変化としては、その検知エリアの狭小化等が挙げられる。   However, in the above-described conventional example, filling the filling material 107 in the housing 101 not only increases the weight and cost, but also causes distortion in the circuit board 103 accommodated in the housing 101 due to the presence of the filling material 107. May occur. When the circuit board 103 is distorted, a stress is applied to a soldering portion between the electronic component mounted on the circuit board 103 and a crack may occur. Alternatively, there is a possibility that the detection area characteristics of the sensor change before and after filling with the filler 107. In addition, as a factor which produces distortion to the circuit board 103, there exists an external load accompanying the thermal expansion and contraction of the filler 107, for example. In addition, examples of changes in the detection area characteristics before and after filling include narrowing of the detection area.

そこで、図6に示すように、ハウジング101内の回路基板103が収納される基板収納部101Aと、送受波素子102が収納される素子収納部101Bとを連通する連通孔101Cを封止板108で封止することが考えられる。この構成であれば、ハウジング101の開口を蓋部材105で閉塞することで基板収納部101Aが密閉されるので、充填材107を用いることなく防水性を確保することができる。   Therefore, as shown in FIG. 6, a sealing plate 108 is provided with a communication hole 101 </ b> C that communicates the substrate housing portion 101 </ b> A in which the circuit board 103 in the housing 101 is housed with the element housing portion 101 </ b> B in which the wave transmitting / receiving element 102 is housed. It is conceivable to seal with. According to this configuration, the opening of the housing 101 is closed with the lid member 105, so that the substrate storage portion 101 </ b> A is hermetically sealed, so that waterproofness can be ensured without using the filler 107.

しかしながら、前述の従来例や図6に示す上記構成の場合、ハウジング101の開口を閉塞するために蓋部材105を必要とするため、部品点数が増えるという問題があった。   However, in the case of the above-described conventional example and the above-described configuration shown in FIG. 6, the lid member 105 is required to close the opening of the housing 101, so that there is a problem that the number of parts increases.

本発明は、上記の点に鑑みて為されたもので、部品点数を増やすことなく防水性を確保することができ、また、重量及びコストの増加を抑制し、且つ回路基板の歪みの発生を防止することのできる超音波センサを提供することを目的とする。   The present invention has been made in view of the above points, and can ensure waterproofness without increasing the number of components, suppress an increase in weight and cost, and generate distortion of a circuit board. An object is to provide an ultrasonic sensor that can be prevented.

本発明の超音波センサは、超音波の送受波を行う送受波素子を収納する送受波ブロックと、前記送受波素子を介して送受波される超音波信号を処理するための電子回路が実装された回路基板と、開口を具備するとともに前記送受波ブロックが取り付けられるハウジングと、前記ハウジングに設けられた挿通口を通して前記送受波素子と前記回路基板の電子回路とを電気的に接続する導通手段と、前記挿通口を封止する封止手段とを備え、前記ハウジングの開口は、前記回路基板によって閉塞されることを特徴とする。   The ultrasonic sensor of the present invention is mounted with a transmission / reception block that houses a transmission / reception element that transmits / receives ultrasonic waves, and an electronic circuit for processing an ultrasonic signal transmitted / received via the transmission / reception element. A circuit board, a housing having an opening and to which the transmission / reception block is attached, and a conductive means for electrically connecting the transmission / reception element and an electronic circuit of the circuit board through an insertion opening provided in the housing. And a sealing means for sealing the insertion opening, wherein the opening of the housing is closed by the circuit board.

この超音波センサにおいて、前記回路基板は、前記ハウジングの内部に対向する面に前記電子回路が実装されることが好ましい。   In this ultrasonic sensor, it is preferable that the electronic circuit is mounted on a surface of the circuit board facing the inside of the housing.

この超音波センサにおいて、前記回路基板は、前記ハウジングの内側に配置され、前記回路基板と前記ハウジングの開口との間の空間には、封止材が充填されることが好ましい。   In this ultrasonic sensor, it is preferable that the circuit board is disposed inside the housing, and a space between the circuit board and the opening of the housing is filled with a sealing material.

この超音波センサにおいて、前記導通手段は前記送受波ブロックから突出する端子を含み、前記回路基板には、外部電源からの電力供給を受けるための外部接続端子の一端が接続され、前記端子及び前記外部接続端子は、前記回路基板に設けられた前記電子回路と電気的に接続されることが好ましい。   In this ultrasonic sensor, the conduction means includes a terminal protruding from the transmission / reception block, and one end of an external connection terminal for receiving power supply from an external power source is connected to the circuit board. The external connection terminal is preferably electrically connected to the electronic circuit provided on the circuit board.

この超音波センサにおいて、前記端子及び前記外部接続端子は、その一端部を前記回路基板に設けられた挿入孔に圧入して嵌め合わせることで前記電子回路と電気的に接続されることが好ましい。   In this ultrasonic sensor, it is preferable that the terminal and the external connection terminal are electrically connected to the electronic circuit by press-fitting one end thereof into an insertion hole provided in the circuit board.

この超音波センサにおいて、前記ハウジングには、その底部から前記ハウジングの開口に向けて突出する支持リブが設けられ、前記回路基板は、前記支持リブの端部と当接することが好ましい。   In this ultrasonic sensor, it is preferable that the housing is provided with a support rib that protrudes from the bottom of the housing toward the opening of the housing, and the circuit board is in contact with an end of the support rib.

本発明は、回路基板によってハウジングの開口を閉塞するので、部品点数を増やすことなく防水性を確保することができ、また、重量及びコストの増加を抑制し、且つ回路基板の歪みの発生を防止することができる。   According to the present invention, the opening of the housing is closed by the circuit board, so that waterproofness can be ensured without increasing the number of parts, the increase in weight and cost is suppressed, and the distortion of the circuit board is prevented. can do.

本発明に係る超音波センサの実施形態を示す断面図である。It is sectional drawing which shows embodiment of the ultrasonic sensor which concerns on this invention. 同上の他の構成を示す断面図である。It is sectional drawing which shows the other structure same as the above. 同上のピン端子及び外部接続端子の他の接合方法を示す図で、(a)は端子の挿入前の断面図で、(b)は端子の挿入後の断面図である。It is a figure which shows the other joining method of a pin terminal same as the above, and an external connection terminal, (a) is sectional drawing before insertion of a terminal, (b) is sectional drawing after insertion of a terminal. (a),(b)は同上の更に他の構成を示す断面図である。(A), (b) is sectional drawing which shows another structure same as the above. 従来の超音波センサを示す断面図である。It is sectional drawing which shows the conventional ultrasonic sensor. 従来の超音波センサの他の構成を示す断面図である。It is sectional drawing which shows the other structure of the conventional ultrasonic sensor.

以下、本発明に係る超音波センサの実施形態について図面を用いて説明する。なお、以下の説明では、図1における上下左右を上下左右方向と定めるものとする。本実施形態は、図1に示すように、超音波の送受波を行う送受波ブロック1と、送受波ブロック1の送受波面以外の外周面を覆うカバー2と、送受波ブロック1を介して送受波される超音波信号を処理するための電子回路が実装された回路基板3とを備える。また、本実施形態は、送受波ブロック1が収納される素子収納部40、及び開口41Aを具備して回路基板3に実装された電子回路の少なくとも一部が収納される回路収納部41が設けられるハウジング4を備える。このハウジング4には、素子収納部40と回路収納部41とを連通する挿通口42が形成される。更に、本実施形態は、一端が回路基板3に接続されて他端が図示しない外部端子に接続される外部接続端子5と、挿通口42を封止する封止板6(封止手段)とを備える。   Hereinafter, embodiments of an ultrasonic sensor according to the present invention will be described with reference to the drawings. In the following description, the vertical and horizontal directions in FIG. 1 are defined as the vertical and horizontal directions. In this embodiment, as shown in FIG. 1, a transmission / reception block 1 that transmits and receives ultrasonic waves, a cover 2 that covers an outer peripheral surface other than the transmission / reception surface of the transmission / reception block 1, and transmission / reception via the transmission / reception block 1. And a circuit board 3 on which an electronic circuit for processing a waved ultrasonic signal is mounted. In the present embodiment, an element storage unit 40 that stores the transmission / reception block 1 and a circuit storage unit 41 that includes an opening 41A and stores at least a part of an electronic circuit mounted on the circuit board 3 are provided. The housing 4 is provided. The housing 4 is formed with an insertion port 42 that allows the element storage portion 40 and the circuit storage portion 41 to communicate with each other. Further, in the present embodiment, an external connection terminal 5 having one end connected to the circuit board 3 and the other end connected to an external terminal (not shown), and a sealing plate 6 (sealing means) for sealing the insertion opening 42. Is provided.

送受波ブロック1は、図1に示すように、圧電素子から成る送受波素子(図示せず)と、内部に送受波素子を収納するケース10とから構成される。ケース10は、例えば黒色に着色されたポリブチレンテレフタレートから円筒状に形成され、その内底部に送受波素子が収納される。また、ケース10の下面は、超音波の送受波面として用いられる。   As shown in FIG. 1, the transmission / reception block 1 includes a transmission / reception element (not shown) made of a piezoelectric element, and a case 10 that houses the transmission / reception element therein. The case 10 is formed in a cylindrical shape from, for example, polybutylene terephthalate colored in black, and a wave transmitting / receiving element is housed in the inner bottom thereof. The lower surface of the case 10 is used as an ultrasonic wave transmitting / receiving surface.

また、送受波ブロック1は、一端が送受波素子と電気的に接続されるリード線(図示せず)と、一端がリード線の他端にはんだ付けされて他端がケース10外に突出する棒状のピン端子11とを備える。ピン端子11の他端は、回路基板3に設けられた挿入孔(図示せず)に挿入した状態ではんだ付けされることで、回路基板3に実装された電子回路と電気的に接続される。即ち、リード線とピン端子11とで、送受波素子と回路基板3の電子回路とを電気的に接続する導通手段を構成している。   The wave transmitting / receiving block 1 has a lead wire (not shown) whose one end is electrically connected to the wave transmitting / receiving element, one end soldered to the other end of the lead wire, and the other end protruding outside the case 10. And a rod-shaped pin terminal 11. The other end of the pin terminal 11 is electrically connected to an electronic circuit mounted on the circuit board 3 by being soldered in a state of being inserted into an insertion hole (not shown) provided in the circuit board 3. . That is, the lead wire and the pin terminal 11 constitute conduction means for electrically connecting the wave transmitting / receiving element and the electronic circuit of the circuit board 3.

カバー2は、図1に示すように、弾性材料から下面を開口した有底円筒状に形成され、送受波ブロック1を覆うようにケース10の外周に組み付けられる。カバー2の上面には、送受波ブロック1のピン端子11を通すための通孔20が設けられている。   As shown in FIG. 1, the cover 2 is formed in a bottomed cylindrical shape whose bottom surface is opened from an elastic material, and is assembled to the outer periphery of the case 10 so as to cover the wave transmitting / receiving block 1. On the upper surface of the cover 2, a through hole 20 for passing the pin terminal 11 of the transmission / reception block 1 is provided.

回路基板3は、図1に示すように、通孔20及び挿通口42を介したピン端子11が前述のようにはんだ付けによって接続される。また、回路基板3の下面には、電子回路を構成する電子部品30が実装される。勿論、電子部品30は図1において図示されているものだけではなく、大小様々な部品が回路基板3の下面に実装されている。回路基板3は、電子部品30が回路収納部41内に収納されるように回路収納部41の開口41Aの周縁に載置され、接着剤を用いた接着等の方法により接合される。このように回路基板3によって回路収納部41の開口41Aが閉塞されるので、回路収納部41の開口41Aを介して外部から回路収納部41内へ水が浸入するのを防止することができる。   As shown in FIG. 1, the circuit board 3 is connected to the pin terminals 11 through the through holes 20 and the insertion openings 42 by soldering as described above. An electronic component 30 that constitutes an electronic circuit is mounted on the lower surface of the circuit board 3. Of course, the electronic component 30 is not limited to that shown in FIG. The circuit board 3 is placed on the periphery of the opening 41A of the circuit housing 41 so that the electronic component 30 is housed in the circuit housing 41, and is joined by a method such as bonding using an adhesive. Thus, the circuit board 3 closes the opening 41 </ b> A of the circuit storage unit 41, so that it is possible to prevent water from entering the circuit storage unit 41 from the outside through the opening 41 </ b> A of the circuit storage unit 41.

ハウジング4は、図1に示すように、上面に開口41Aを具備する中空箱形の回路収納部41と、回路収納部41の内底部の隔壁43を挟んで回路収納部41に隣接する有底円筒状の素子収納部40とから構成される。なお、素子収納部40は、その下面に開口40Aを具備している。また、ハウジング4の隔壁43には、回路収納部41の下部と素子収納部40の上部とを連通させる挿通口42が設けられている。   As shown in FIG. 1, the housing 4 has a bottomed box adjacent to the circuit storage part 41 with a hollow box-shaped circuit storage part 41 having an opening 41 </ b> A on the upper surface and a partition wall 43 on the inner bottom of the circuit storage part 41. It is comprised from the cylindrical element accommodating part 40. FIG. Note that the element storage portion 40 has an opening 40A on the lower surface thereof. Further, the partition wall 43 of the housing 4 is provided with an insertion port 42 that allows the lower part of the circuit storage part 41 and the upper part of the element storage part 40 to communicate with each other.

素子収納部40には、図1に示すように、カバー2が組み付けられた送受波ブロック1が隔壁43に当接する位置まで挿入されて、送受波ブロック1の送受波面を開口40Aを介して外部に臨ませる状態で収納される。   As shown in FIG. 1, the transmission / reception block 1 to which the cover 2 is assembled is inserted into the element storage unit 40 until it comes into contact with the partition wall 43, and the transmission / reception surface of the transmission / reception block 1 is externally connected through the opening 40A. It is stored in a state where it can face.

回路収納部41の底面には、図1に示すように、1対の支持リブ41Bがそれぞれ上向きに突出する形で形成されている。支持リブ41Bは、回路収納部41の底面の左右両端部にそれぞれ設けられており、当該支持リブ41Bの上に回路基板3の左右両端部が載置される。即ち、回路基板3は1対の支持リブ41Bの上端部と当接する。   As shown in FIG. 1, a pair of support ribs 41 </ b> B are formed on the bottom surface of the circuit storage portion 41 so as to protrude upward. The support ribs 41B are provided at the left and right ends of the bottom surface of the circuit storage portion 41, and the left and right ends of the circuit board 3 are placed on the support ribs 41B. That is, the circuit board 3 contacts the upper end portions of the pair of support ribs 41B.

回路収納部41の底部において、素子収納部40と対向する位置には、図1に示すように凹部41Cが設けられており、この凹部41Cの底面に挿通口42の一端が開口している。   As shown in FIG. 1, a recess 41C is provided at the bottom of the circuit storage portion 41 at a position facing the element storage portion 40, and one end of the insertion port 42 is opened on the bottom surface of the recess 41C.

外部接続端子5は、図1に示すように、インサート成型によってハウジング4の外壁を貫通する形でハウジング4に一体に成型されている。外部接続端子5は、その一端がハウジング4の外面に突設される円筒状のコネクタ部44内に突出し、他端が回路収納部41内に突出する。ここで、外部接続端子5の一端は、図示しない外部端子に接続され、他端は、回路収納部41の底面から突出して回路基板3にはんだ付け等により電気的に接続される。   As shown in FIG. 1, the external connection terminal 5 is molded integrally with the housing 4 so as to penetrate the outer wall of the housing 4 by insert molding. One end of the external connection terminal 5 projects into a cylindrical connector portion 44 projecting from the outer surface of the housing 4, and the other end projects into the circuit housing portion 41. Here, one end of the external connection terminal 5 is connected to an external terminal (not shown), and the other end protrudes from the bottom surface of the circuit housing portion 41 and is electrically connected to the circuit board 3 by soldering or the like.

そして、回路基板3の電子回路が外部接続端子5を介して外部電源(図示せず)からの電力の供給を受けて送受波素子へ駆動パルス信号を出力し、駆動パルス信号を受信した送受波素子が超音波を外部に送波する。次に、送受波素子は、送波した超音波の障害物からの反射波を受波すると受波信号を回路基板3の電子回路に出力する。回路基板3の電子回路は、駆動パルス信号を出力してから受波信号が入力されるまでの時間から障害物までの距離を演算し、演算結果を含む信号を外部接続端子5を介して外部の制御回路(図示せず)等へ出力する。   Then, the electronic circuit of the circuit board 3 receives power supplied from an external power supply (not shown) via the external connection terminal 5 and outputs a drive pulse signal to the wave transmitting / receiving element, and receives the drive pulse signal. The element transmits ultrasonic waves to the outside. Next, when receiving the reflected wave from the obstacle of the transmitted ultrasonic wave, the wave transmitting / receiving element outputs a received wave signal to the electronic circuit of the circuit board 3. The electronic circuit of the circuit board 3 calculates the distance from the time from the output of the drive pulse signal to the input of the received signal to the obstacle, and the signal including the calculation result is externally connected via the external connection terminal 5. To a control circuit (not shown).

封止板6は、例えば透光性を有する白色のポリブチレンテレフタレートから矩形板状に形成され、図1に示すように、その中央部には下向きに窪んだ凹部60が形成されている。即ち、封止板6は、凹部60と、当該凹部60の周縁に形成される鍔部61とから構成される。この封止板6は、その凹部60を挿通口42に嵌め込んだ状態で回路収納部41の凹部41C内に設けられる。また、封止板6における凹部60の底面には通孔(図示せず)が形成され、当該通孔には、送受波ブロック1のピン端子11が通される。   The sealing plate 6 is formed in a rectangular plate shape from, for example, translucent white polybutylene terephthalate. As shown in FIG. 1, a concave portion 60 that is depressed downward is formed in the center portion thereof. That is, the sealing plate 6 includes a recess 60 and a flange 61 formed on the periphery of the recess 60. The sealing plate 6 is provided in the concave portion 41 </ b> C of the circuit housing portion 41 with the concave portion 60 fitted in the insertion opening 42. Further, a through hole (not shown) is formed in the bottom surface of the recess 60 in the sealing plate 6, and the pin terminal 11 of the wave transmitting / receiving block 1 is passed through the through hole.

封止板6は、その鍔部61が回路収納部41の凹部41Cの底面に超音波溶着又はレーザ溶着によって接合される。なお、溶着の方法としては上記の方法に限定される必要はなく、振動溶着等であってもよい。また、溶着を行う代わりに、接着剤を用いて接着してもよい。これにより、封止板6とハウジング4との隙間が閉塞される。   The sealing plate 6 has a flange 61 joined to the bottom surface of the recess 41 </ b> C of the circuit housing 41 by ultrasonic welding or laser welding. The welding method is not limited to the above method, and vibration welding or the like may be used. Moreover, you may adhere | attach using an adhesive agent instead of performing welding. Thereby, the gap between the sealing plate 6 and the housing 4 is closed.

更に、封止板6は、凹部60の底面が挿通口42及びカバー2の通孔20を通して送受波ブロック1のケース11の上面に当接し、当該上面と凹部60の底面とが超音波溶着や振動溶着、又は接着剤を用いた接着により接合される。これにより、封止板6と送受波ブロック1との隙間が閉塞される。このように、封止板6により挿通口42を封止することで、素子収納部40及び挿通口42を介して外部から回路収納部41内へ水が浸入するのを防止することができる。なお、本実施形態では、封止板6によって挿通口42を封止しているが、これに限定される必要は無く、例えば充填材を挿通口42に充填することで挿通口42を封止する構成であってもよい。   Further, the sealing plate 6 has the bottom surface of the recess 60 in contact with the top surface of the case 11 of the transmission / reception block 1 through the insertion hole 42 and the through hole 20 of the cover 2, and the top surface and the bottom surface of the recess 60 are ultrasonically welded. They are joined by vibration welding or adhesion using an adhesive. As a result, the gap between the sealing plate 6 and the transmission / reception block 1 is closed. Thus, by sealing the insertion opening 42 with the sealing plate 6, it is possible to prevent water from entering the circuit storage section 41 from the outside via the element storage section 40 and the insertion opening 42. In this embodiment, the insertion port 42 is sealed by the sealing plate 6, but it is not necessary to be limited to this. For example, the insertion port 42 is sealed by filling the insertion port 42 with a filler. It may be configured to.

上述のように、本実施形態では、回路基板3によってハウジング4の開口41Aを閉塞するので、ハウジング4に充填材を充填することなくハウジング4を密閉することができる。このため、回路基板3の周囲に回路基板3に応力をかける虞のある充填材が存在しないので、防水性を確保しつつ重量及びコストの増加を抑制し、且つ回路基板3の歪みの発生を防止することができる。また、ハウジング4の開口41Aを閉塞するための蓋部材を別途用意する必要がないので、部品点数を削減することができる。更に、回路基板3を蓋部材の代わりに用いることで、回路基板3の厚み寸法の分だけハウジング4の厚み寸法を小さくすることができ、したがってセンサの低背化を図ることができる。   As described above, in the present embodiment, the circuit board 3 closes the opening 41 </ b> A of the housing 4, so that the housing 4 can be sealed without filling the housing 4 with a filler. For this reason, since there is no filler around the circuit board 3 that may stress the circuit board 3, an increase in weight and cost is suppressed while ensuring waterproofness, and distortion of the circuit board 3 is prevented. Can be prevented. In addition, since it is not necessary to separately prepare a lid member for closing the opening 41A of the housing 4, the number of parts can be reduced. Furthermore, by using the circuit board 3 instead of the lid member, the thickness dimension of the housing 4 can be reduced by the thickness dimension of the circuit board 3, and thus the height of the sensor can be reduced.

また、本実施形態では、ハウジング4の開口41Aを回路基板3で閉塞する際に、接着剤を用いた接着等の溶着以外の方法で回路基板3と開口41Aの周縁とを接合している。このため、溶着に必要な設備が不要となるために設備投資等の初期投資をせずに済むので、償却費などの固定費の削減を図ることができる。   In this embodiment, when the opening 41 </ b> A of the housing 4 is closed with the circuit board 3, the circuit board 3 and the periphery of the opening 41 </ b> A are joined by a method other than welding such as adhesion using an adhesive. For this reason, since the equipment required for welding is not required, it is not necessary to make an initial investment such as capital investment, so that it is possible to reduce fixed costs such as depreciation costs.

なお、本実施形態では、図1に示すように、回路基板3の下面に支持リブ41Bの上端部が当接している。このため、熱や外部からの振動等によって回路基板3にかかる応力を低減することができる。また、本実施形態では、図1に示すように、回路基板3の片面(下面)のみに電子部品30を実装、即ち、電子回路を実装している。このため、回路基板3の上下両面に電子回路を実装する場合と比較して実装に必要な費用を削減することができる。   In the present embodiment, as shown in FIG. 1, the upper end portion of the support rib 41 </ b> B is in contact with the lower surface of the circuit board 3. For this reason, the stress applied to the circuit board 3 due to heat, vibration from the outside, or the like can be reduced. Moreover, in this embodiment, as shown in FIG. 1, the electronic component 30 is mounted only on one side (lower surface) of the circuit board 3, that is, the electronic circuit is mounted. For this reason, compared with the case where an electronic circuit is mounted on the upper and lower surfaces of the circuit board 3, the cost required for mounting can be reduced.

ところで、本実施形態では、回路基板3のみでハウジング4の開口41Aを閉塞しているが、図2に示すように、回路基板3の上側の空間に封止材7を充填して開口41Aを閉塞する構成であってもよい。この場合、1対の支持リブ41Bが開口41Aの周縁よりも下方に位置し、回路基板3の左右両端部が各支持リブ41Bの上面に載置される。そして、回路基板3と開口41Aとの間の空間を封止材7で充填する。なお、封止材7としては、例えば疎水性及び弾力性を有するシリコーンが用いられる。   By the way, in this embodiment, the opening 41A of the housing 4 is closed only by the circuit board 3, but the opening 41A is filled by filling the sealing material 7 in the space above the circuit board 3 as shown in FIG. It may be configured to close. In this case, the pair of support ribs 41B is positioned below the periphery of the opening 41A, and the left and right ends of the circuit board 3 are placed on the upper surface of each support rib 41B. Then, the space between the circuit board 3 and the opening 41 </ b> A is filled with the sealing material 7. For example, silicone having hydrophobicity and elasticity is used as the sealing material 7.

このように構成することで、ハウジング4の開口41Aをより確実に密閉することができるので、防水性を更に高めることができる。また、仮に回路基板3の上下両面に電子回路を実装したとしても、封止材7によって電子部品30やピン端子11及び外部接続端子5の接合箇所を保護することができる。   By comprising in this way, since opening 41A of the housing 4 can be sealed more reliably, waterproofness can further be improved. Even if electronic circuits are mounted on both the upper and lower surfaces of the circuit board 3, the joint portion of the electronic component 30, the pin terminal 11, and the external connection terminal 5 can be protected by the sealing material 7.

なお、本実施形態では、ピン端子11及び外部接続端子5の一端部を回路基板3にはんだ付けにより電気的に接続しているが、他の接続方法であってもよい。例えば、図3(a),(b)に示すように、ピン端子11及び外部接続端子5の一端部をバネ性を有する形状に形成し、回路基板3に設けられた挿入孔31に圧入して嵌め合わせることで、電子回路と電気的に接続する方法であってもよい。この場合、ピン端子11及び外部接続端子5を電子回路に接続する際にはんだ付けが不要となるため、施工性を向上させることができる。また、回路基板3上に予めコネクタ(図示せず)を実装しておき、ピン端子11及び外部接続端子5をコネクタに挿入することで、電子回路と電気的に接続する方法であってもよい。   In the present embodiment, one end of the pin terminal 11 and the external connection terminal 5 are electrically connected to the circuit board 3 by soldering, but other connection methods may be used. For example, as shown in FIGS. 3A and 3B, one end portions of the pin terminal 11 and the external connection terminal 5 are formed in a shape having a spring property and press-fitted into an insertion hole 31 provided in the circuit board 3. It may be a method of electrically connecting with an electronic circuit by fitting together. In this case, since soldering becomes unnecessary when connecting the pin terminal 11 and the external connection terminal 5 to an electronic circuit, workability can be improved. Alternatively, a method of electrically connecting the electronic circuit by mounting a connector (not shown) on the circuit board 3 in advance and inserting the pin terminal 11 and the external connection terminal 5 into the connector may be used. .

ところで、本実施形態の図1,2の構成では、素子収納部40に送受波ブロック1を収納しているが、図4(a),(b)に示すように、素子収納部40を除いたハウジング4に送受波ブロック1を取り付ける構成でもよい。この構成では、送受波ブロック1を組み付けたカバー2を、ハウジング4下面の挿通口42の周縁に取り付けている。   By the way, in the configuration of FIGS. 1 and 2 of the present embodiment, the transmission / reception block 1 is accommodated in the element accommodating portion 40. However, as shown in FIGS. 4A and 4B, the element accommodating portion 40 is excluded. Alternatively, the wave transmitting / receiving block 1 may be attached to the housing 4. In this configuration, the cover 2 assembled with the wave transmitting / receiving block 1 is attached to the periphery of the insertion opening 42 on the lower surface of the housing 4.

1 送受波ブロック
11 ピン端子(導通手段)
3 回路基板
31 挿入孔
4 ハウジング
41A 開口
41B 支持リブ
42 挿通口
5 外部接続端子
6 封止板(封止手段)
7 封止材
1 Transmission / reception block 11 Pin terminal (conduction means)
3 Circuit board 31 Insertion hole 4 Housing 41A Opening 41B Support rib 42 Insertion port 5 External connection terminal 6 Sealing plate (sealing means)
7 Sealing material

Claims (6)

超音波の送受波を行う送受波素子を収納する送受波ブロックと、前記送受波素子を介して送受波される超音波信号を処理するための電子回路が実装された回路基板と、開口を具備するとともに前記送受波ブロックが取り付けられるハウジングと、前記ハウジングに設けられた挿通口を通して前記送受波素子と前記回路基板の電子回路とを電気的に接続する導通手段と、前記挿通口を封止する封止手段とを備え、前記ハウジングの開口は、前記回路基板によって閉塞されることを特徴とする超音波センサ。   A transmission / reception block for accommodating a transmission / reception element for transmitting / receiving ultrasonic waves, a circuit board on which an electronic circuit for processing an ultrasonic signal transmitted / received via the transmission / reception element is mounted, and an opening In addition, a housing to which the transmission / reception block is attached, conduction means for electrically connecting the transmission / reception element and the electronic circuit of the circuit board through an insertion port provided in the housing, and the insertion port are sealed. An ultrasonic sensor, wherein the opening of the housing is closed by the circuit board. 前記回路基板は、前記ハウジングの内部に対向する面に前記電子回路が実装されることを特徴とする請求項1記載の超音波センサ。   The ultrasonic sensor according to claim 1, wherein the electronic circuit is mounted on a surface of the circuit board facing the inside of the housing. 前記回路基板は、前記ハウジングの内側に配置され、前記回路基板と前記ハウジングの開口との間の空間には、封止材が充填されることを特徴とする請求項1又は2記載の超音波センサ。   The ultrasonic circuit according to claim 1, wherein the circuit board is disposed inside the housing, and a space between the circuit board and the opening of the housing is filled with a sealing material. Sensor. 前記導通手段は前記送受波ブロックから突出する端子を含み、前記回路基板には、外部電源からの電力供給を受けるための外部接続端子の一端が接続され、前記端子及び前記外部接続端子は、前記回路基板に設けられた前記電子回路と電気的に接続されることを特徴とする請求項1乃至3の何れか1項に記載の超音波センサ。   The conducting means includes a terminal protruding from the wave receiving / receiving block, and one end of an external connection terminal for receiving power supply from an external power source is connected to the circuit board, and the terminal and the external connection terminal are The ultrasonic sensor according to claim 1, wherein the ultrasonic sensor is electrically connected to the electronic circuit provided on a circuit board. 前記端子及び前記外部接続端子は、その一端部を前記回路基板に設けられた挿入孔に圧入して嵌め合わせることで前記電子回路と電気的に接続されることを特徴とする請求項4記載の超音波センサ。   The terminal and the external connection terminal are electrically connected to the electronic circuit by press-fitting one end of the terminal and the external connection terminal into an insertion hole provided in the circuit board. Ultrasonic sensor. 前記ハウジングには、その底部から前記ハウジングの開口に向けて突出する支持リブが設けられ、前記回路基板は、前記支持リブの端部と当接することを特徴とする請求項1乃至5の何れか1項に記載の超音波センサ。   6. The housing according to claim 1, wherein the housing is provided with a support rib protruding from a bottom portion thereof toward the opening of the housing, and the circuit board is in contact with an end portion of the support rib. The ultrasonic sensor according to item 1.
JP2011062606A 2011-03-22 2011-03-22 Ultrasonic sensor Withdrawn JP2012198108A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013213476A1 (en) * 2013-07-10 2015-01-15 Robert Bosch Gmbh ultrasonic sensor
JP2015230201A (en) * 2014-06-04 2015-12-21 株式会社デンソー Ultrasonic sensor system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013213476A1 (en) * 2013-07-10 2015-01-15 Robert Bosch Gmbh ultrasonic sensor
JP2015230201A (en) * 2014-06-04 2015-12-21 株式会社デンソー Ultrasonic sensor system

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